Mounting device, control method for mounting device, and control program for mounting device

Abstract

This mounting device comprises: a mounting tool that has a suction part for suctioning a holding surface of a mounting object to be mounted, and mounts a mounting surface of the mounting object suctioned by the suction part on a target object placed on a stage; a delivery device that is supplied with the mounting object and causes the holding surface to face the mounting tool; an imaging unit that images the holding surface and a work area parallel to a reference plane; and a control unit that calculates height information about the mounting object on the basis of an image obtained by causing the imaging unit to image the mounting object supported by the delivery device, lowers the mounting tool toward the mounting object on the basis of the height information such that the suction part is positioned at a separation distance set in a height direction with respect to the mounting object, and operates the suction part to cause the suction part to suction the mounting object from the delivery device. This mounting device makes it possible to appropriately deliver a semiconductor chip supported by the delivery device to the mounting tool.

Description

Mounting device, method for controlling the mounting device, and control program for the mounting device

[0001] The present invention relates to a mounting device, a method for controlling a mounting device, and a control program for a mounting device.

[0002] Flip-chip bonding is a commonly used method for mounting semiconductor chips onto circuit boards. In this method, a semiconductor chip picked up by a transfer device and reversed in orientation is picked up by a mounting tool, and the bonding surface of the semiconductor chip is placed on the circuit board with the mounting tool facing the board and bonded. A flip-chip bonder is used as a device for mounting semiconductor chips onto circuit boards using such a flip-chip bonding method (see, for example, Patent Document 1).

[0003] Japanese Patent Publication No. 2015-60924

[0004] When transferring a semiconductor chip from a transfer device to a mounting tool, if the distance between the semiconductor chip supported by the transfer device and the tip of the mounting tool is uncertain, the tip of the mounting tool may press against the semiconductor chip, or a large gap may form between the tip of the mounting tool and the semiconductor chip, resulting in damage to the semiconductor chip or an unstable transfer.

[0005] This invention was made to solve these problems and provides a mounting device, etc., that can appropriately transfer a semiconductor chip supported by a transfer device to a mounting tool.

[0006] A mounting apparatus in a first aspect of the present invention comprises a mounting tool having a suction part that adsorbs the holding surface of a mounting object to be mounted, and mounting the mounting surface of the mounting object that the suction part adsorbs onto the mounting object placed on a stage; a transfer device that receives the mounting object and positions its holding surface toward the mounting tool; an imaging unit that images a work area and a holding surface parallel to a reference plane; and a control unit that calculates height information of the mounting object based on an image of the mounting object supported by the transfer device and captured by the imaging unit, lowers the mounting tool toward the mounting object based on the height information so that the suction part is positioned at a set separation distance in the height direction relative to the mounting object, and operates the suction part to adsorb the mounting object from the transfer device to the suction part.

[0007] Furthermore, a control method for a mounting apparatus in a second aspect of the present invention is a control method for transferring a mounting object from a transfer device to a mounting tool in a mounting apparatus comprising: a mounting tool having a suction part that adsorbs the holding surface of a mounting object to be mounted, and mounting the mounting surface of the mounting object that the suction part adsorbs onto a mounting object placed on a stage; a transfer device that receives the mounting object and faces its holding surface toward the mounting tool; and an imaging unit that images a work area parallel to a reference plane and the holding surface, the method comprising: a calculation step of calculating height information of the mounting object based on an image of the mounting object supported by the transfer device and captured by the imaging unit; a descent step of lowering the mounting tool toward the mounting object based on the height information so that the suction part is positioned at a set separation distance in the height direction relative to the mounting object; and an adsorption step of activating the suction part to adsorb the mounting object from the transfer device to the suction part.

[0008] Furthermore, the control program for the mounting apparatus in the third aspect of the present invention is a control program for transferring a mounting object from the transfer device to the mounting tool in a mounting apparatus comprising: a mounting tool having a suction part that adsorbs the holding surface of a mounting object to be mounted, and mounting the mounting surface of the mounting object that the suction part adsorbs onto a mounting object placed on a stage; a transfer device that receives the mounting object and faces its holding surface toward the mounting tool; and an imaging unit that images a work area parallel to a reference plane and the holding surface, wherein the control program causes the computer to execute a calculation step of calculating height information of the mounting object based on an image of the mounting object supported by the transfer device captured by the imaging unit; a descent step of lowering the mounting tool toward the mounting object based on the height information so that the suction part is positioned at a distance set in the height direction relative to the mounting object; and an adsorption step of activating the suction part to adsorb the mounting object from the transfer device to the suction part.

[0009] The present invention provides a mounting apparatus that can appropriately transfer a semiconductor chip supported by a transfer device to a mounting tool.

[0010] This is an overall configuration diagram of the bonding apparatus according to this embodiment. This is a system configuration diagram of the bonding apparatus. This is an explanatory diagram for explaining the shineproof optical system. This is a diagram showing the semiconductor chip held by the handler being imaged by the first imaging unit and the second imaging unit. This is an explanatory diagram for explaining the procedure up to calculating the height information of the semiconductor chip using the first and second images. This is a diagram showing the bonding tool being lowered so that the collet adsorption part is positioned at a set height. This is a diagram showing the semiconductor chip moving from the handler adsorption part to the collet adsorption part. This is a diagram showing the target position for placing the semiconductor chip being imaged by the first imaging unit and the second imaging unit. This is a diagram showing the bonding tool placing the semiconductor chip at the target position and performing bonding.

[0011] The present invention will be described below through embodiments of the invention, but the invention claimed is not limited to the following embodiments. Furthermore, not all of the configurations described in the embodiments are necessarily essential as means to solve the problem. In each figure, if there are multiple structures having the same or similar configuration, in order to avoid complexity, some parts may be labeled with reference numerals, while others may not be labeled with the same reference numerals.

[0012] Figure 1 is an overall configuration diagram of the bonding apparatus 100 as a mounting apparatus according to this embodiment. The bonding apparatus 100 mainly comprises a head unit 110 as a flip-chip bonder, a handler 150 as a transfer device that inverts the semiconductor chip 310 as a mounting body and transfers it to the head unit 110, a chip supply device 160 that supplies the semiconductor chip 310 to the handler 150, and a stage 190 that supports the substrate 330.

[0013] The head unit 110 mainly comprises a main body unit 112, a bonding tool 120, a first imaging unit 130, and a second imaging unit 140. The main body unit 112 supports the bonding tool 120, the first imaging unit 130, and the second imaging unit 140, and is movable in the planar and vertical directions by a head drive motor 111. In this embodiment, the planar direction is the horizontal direction defined by the X-axis and Y-axis directions, as shown in the figure, and the vertical direction (height direction) is the Z-axis direction which is perpendicular to the X-axis and Y-axis directions.

[0014] The bonding tool 120 is an example of a mounting tool that adsorbs a semiconductor chip 310 to be mounted and mounts it onto a substrate 330. The bonding tool 120 is movable in the height direction relative to the head portion 110 by a tool drive motor 121. The bonding tool 120 has a collet 122 for adsorbing the semiconductor chip 310 and a heater 124 for heating the semiconductor chip 310 that the collet 122 adsorbs.

[0015] The tip of the collet 122, which is the lower end of the bonding tool 120, is provided with a collet adsorption portion 126 that contacts and adsorbs the semiconductor chip 310. The collet adsorption portion 126 is connected to a suction pump (not shown) via a suction tube 128 connected to a suction tube 128 that penetrates the bonding tool 120 in the Z-axis direction. The bonding tool 120 places the semiconductor chip 310, which has been adsorbed by the collet adsorption portion 126, at a target position set on the mounting surface of the substrate 330 placed on the stage 190, and then bonds it by applying pressure with the collet 122 and heating it with the heater 124.

[0016] The first imaging unit 130 and the second imaging unit 140 are imaging units that capture an overhead view of the semiconductor chip 310 and substrate 330 supported by the handler 150. The first imaging unit 130 includes a first optical system 131 and a first image sensor 132, and is obliquely mounted on the head unit 110 with its optical axis directed downwards from the bonding tool 120. The first optical system 131 and the first image sensor 132 are arranged to satisfy the shineproof condition such that the plane parallel to the stage surface of the stage 190 becomes the focal plane 110a.

[0017] The second imaging unit 140 comprises a second optical system 141 and a second image sensor 142, and is obliquely mounted on the head portion 110 with its optical axis directed downward from the bonding tool 120, on the opposite side from the first imaging unit 130 with respect to the bonding tool 120. The second optical system 141 and the second image sensor 142 are arranged to satisfy the shineproof condition such that the plane parallel to the stage surface of the stage 190 becomes the focal plane 110a. In the following description, the first imaging unit 130 and the second imaging unit 140 may be collectively referred to simply as the "imaging unit".

[0018] The handler 150 mainly comprises a guide rail 151, a main body 152, a flip head 153, and an arm 154. The guide rail 151 supports the main body 152 so as to be movable in the X-axis direction. The main body 152, supported by the guide rail 151, rotatably supports the arm 154. The main body 152 is equipped with a handler drive motor 159, which, when driven according to the control of a control unit described later, moves the main body 152 along the guide rail 151 and rotates the arm 154. The arm 154 is positioned at an angle to the main body 152 and rotates within a range of 180 degrees between a first state facing downwards relative to the main body 152 and a second state facing upwards, when driven by the handler drive motor 159.

[0019] The flip head 153 includes a handler suction unit 156 for adsorbing a semiconductor chip 310. The flip head 153 is fixed to and supported by the arm 154 such that the handler suction unit 156 faces downward when the arm 154 is in a first state, and faces upward when the arm 154 is in a second state. The handler suction unit 156 is connected to a suction pump (not shown) via a suction tube 158 connected to the suction tube 157, which penetrates the flip head 153 laterally.

[0020] The chip supply device 160 includes a stand 161 on which the diced semiconductor chips 310 are placed. The semiconductor chips 310 are arranged and placed on the stand 161 in a position where the handler suction portion 156 of the handler 150 can make contact, with the holding surface intended to contact the handler suction portion 156 facing upward, that is, downward toward the mounting surface facing the substrate 330. If the semiconductor chips 310 are arranged two-dimensionally on the stand 161, the chip supply device 160 may be configured so that the stand 161 is movable in the Y-axis direction, or the handler 150 may be configured so that the main body 152 is movable in the Y-axis direction in addition to the X-axis direction.

[0021] Figure 1 specifically shows the arm 154 in the first state, with the handler suction part 156 of the flip head 153 facing the semiconductor chip 310 to be picked up, which is placed on the base 161, and the handler suction part 156 picking up the semiconductor chip 310. As will be described in more detail later, at this stage the surface of the semiconductor chip 310 that the handler suction part 156 picks up is the mounting surface, and the opposite surface that is in contact with the base 161 is the holding surface that will later be held by the bonding tool 120.

[0022] The stage 190 includes a stand 191 for fixing the substrate 330. The surface of the stand 191 is treated as the stage surface of the stage 190, and in this embodiment, as the reference plane of the bonding apparatus 100. For example, the focal planes 110a of the first imaging unit 130 and the second imaging unit 140 are adjusted to be parallel to the stage surface of the stage 190, as described above. The stand 191 may also be configured to be movable in the X-axis and Y-axis directions, and may be configured to include a tilt adjustment mechanism so that even if the placed substrate 330 is inclined, it remains parallel to the reference plane.

[0023] Figure 2 is a system configuration diagram of the bonding apparatus 100. The control system of the bonding apparatus 100 mainly consists of a control unit 210, a storage unit 220, an input / output device 230, a first imaging unit 130, a second imaging unit 140, a head drive motor 111, a tool drive motor 121, a head suction mechanism 125, a handler suction mechanism 155, and a handler drive motor 159.

[0024] The control unit 210 is a processor (CPU: Central Processing Unit) that controls the bonding apparatus 100 and executes programs. The processor may be configured to work in conjunction with an arithmetic processing chip such as an ASIC (Application Specific Integrated Circuit) or a GPU (Graphics Processing Unit). The control unit 210 reads various control programs stored in the memory unit 220, including a handover program that transfers the semiconductor chip 310 from the handler 150 to the bonding tool 120, and executes a series of processes related to the bonding process.

[0025] The storage unit 220 is a non-volatile storage medium, such as an HDD (Hard Disk Drive). In addition to the control program related to bonding processing, the storage unit 220 can store various parameter values, functions, lookup tables, etc., used for control and calculations. The input / output device 230 includes, for example, a keyboard, mouse, and display monitor, and is a device that accepts menu operations by the user and presents information to the user. For example, the control unit 210 may display the acquired image on the display monitor, which is one of the input / output devices 230.

[0026] The first imaging unit 130 receives an imaging request signal from the control unit 210, performs imaging, and transmits the first image output by the first image sensor 132 to the control unit 210 as an image signal. The second imaging unit 140 receives an imaging request signal from the control unit 210, performs imaging, and transmits the second image output by the second image sensor 142 to the control unit 210 as an image signal.

[0027] The head drive motor 111 receives a drive signal from the control unit 210 and moves the head unit 110 in the horizontal direction (X-axis direction, Y-axis direction) and the height direction (Z-axis direction). The tool drive motor 121 receives a drive signal from the control unit 210 and moves the bonding tool 120 in the height direction. The tool drive motor 121 may also be configured to receive a drive signal from the control unit 210 and rotate the bonding tool 120 around the Z-axis.

[0028] The head suction mechanism 125 is constituted by a head suction portion 126, a suction pipe 127, a suction tube 128 and the suction pump described above. When the suction pump is activated in response to a suction signal received from the control unit 210, the head suction mechanism 125 causes the suction pipe 127 and the suction tube 128 to become negative pressure, so that the collet suction portion 126 sucks the semiconductor chip 310 and maintains this suction state.

[0029] The handler suction mechanism 155 is constituted by a handler suction portion 156, a suction pipe 157, a suction tube 158 and the suction pump described above. When the suction pump is activated in response to a suction signal received from the control unit 210, the handler suction mechanism 155 causes the suction pipe 157 and the suction tube 158 to become negative pressure, so that the handler suction portion 156 sucks the semiconductor chip 310 and maintains this suction state. The handler drive motor 159 receives a drive signal from the control unit 210 to move the main body 152 in the X-axis direction and rotate the arm 154.

[0030] FIG. 3 is an explanatory diagram for explaining the Scheimpflug optical system employed in the first imaging unit 130. A similar Scheimpflug optical system is also employed in the second imaging unit 140, and the Scheimpflug optical system of the first imaging unit 130 will be described here as a representative.

[0031] In FIG. 3, the plane S １ is a focal plane 110a parallel to the stage surface of the stage 190. The virtual plane S ２ is a plane including the main plane of the first optical system 131 configured with an object-side lens group 131a and an image-side lens group 131b. The plane S ３ is a plane including the light-receiving surface of the first image sensor 132. In the present embodiment, the Scheimpflug optical system includes the first optical system 131 and the first image sensor 132 which are arranged to satisfy the Scheimpflug condition. The arrangement satisfying the Scheimpflug condition refers to an arrangement where the plane S １ , the virtual plane S ２ , the virtual plane S ３ intersect each other on a common straight line P.

[0032] The aperture stop 133 is disposed between the object-side lens group 131a and the image-side lens group 131b, and limits the light flux passing therethrough. The depth of field D Ｐ can be adjusted by the diameter of the aperture stop 133. Therefore, if the planned mounting surface of the substrate 330 is located within this depth of field, the first imaging unit 130 can capture images of the die pad and reference marks provided on the substrate 330 in a focused state. Further, if the surface (holding surface) of the semiconductor chip 310 supported by the flip head 153 is located within this depth of field, the first imaging unit 130 can capture images of the reference marks provided on the holding surface of the semiconductor chip 310 in a focused state. In this sense, position control for aligning the focal plane 110a with the planned mounting surface of the substrate 330 or the holding surface of the semiconductor chip 310 is allowed to have deviations within the range of the depth of field D Ｐ .

[0033] The second imaging unit 140 has the same configuration as the first imaging unit 130, and is disposed symmetrically on the head unit 110 with respect to the YZ plane including the central axis of the bonding tool 120. Therefore, similarly to the first imaging unit 130, the second imaging unit 140 can also capture images of the planned mounting surface of the substrate 330 and the holding surface of the semiconductor chip 310 in a focused state. It is preferable that the focal plane of the first imaging unit 130 and the focal plane of the second imaging unit 140 coincide at the focal plane 110a. However, even if a deviation occurs, as long as a part of the respective depths of field overlap, both the planned mounting surface of the substrate 330 and the holding surface of the semiconductor chip 310 can be captured in a focused state.

[0034] When the first imaging unit 130 and the second imaging unit 140 employing such a Scheimpflug optical system are obliquely disposed on the head unit 110, the control unit 210 can observe an object located directly below the bonding tool 120 from an oblique direction. That is, the control unit 210 can calculate positional information in the planar direction and height information in the height direction of the object.

[0035] Figure 4 shows how the semiconductor chip 310 held by the handler 150 is imaged by the first imaging unit 130 and the second imaging unit 140. Specifically, with respect to the handler 150, starting from the state shown in Figure 1 where the semiconductor chip 310 placed on the stand 161 is held by the handler suction part 156 of the flip head 153, the handler drive motor 159 is driven to rotate the arm 154 by 180 degrees, thereby inverting the flip head 153 to face upwards, and moving the main body 152 to a predetermined position along the guide rail 151. Furthermore, with respect to the head 110, it is moved in the planar direction so that the bonding tool 120 is positioned directly above the semiconductor chip 310 supported by the inverted flip head 153, and the height of the main body 112 is adjusted so that the focal planes 110a of the first imaging unit 130 and the second imaging unit 140 coincide with the holding surface 310a of the semiconductor chip 310. At this time, the bonding tool 120 is retracted upward so as not to interfere with the imaging of the semiconductor chip 310 by the first imaging unit 130 and the second imaging unit 140.

[0036] Once the elements are arranged in this state, the control unit 210 sends an imaging request signal to the first imaging unit 130 to perform imaging and acquire a first image, and also sends an imaging request signal to the second imaging unit 140 to perform imaging and acquire a second image. The control unit 210 uses the first and second images to calculate the height information of the semiconductor chip.

[0037] Figure 5 is an explanatory diagram illustrating the procedure for calculating the height information of the semiconductor chip 310 using the first and second images. Here, we will explain the case where the semiconductor chip 310 supported by the flip head 153 is imaged in the state shown in Figure 4.

[0038] A reference mark 311 is provided at a predetermined position on the holding surface 310a of the semiconductor chip 310. The first imaging unit 130 captures an image in an oblique direction from the side where the reference mark 311 is provided on the holding surface 310a of the rectangular semiconductor chip 310. In the first image, which is an output image of the first imaging unit 130, the outline of the semiconductor chip 310 is captured as a trapezoid spreading toward the reference mark 311 side. The second imaging unit 140 is installed at a position symmetrical to the first imaging unit 130 as described above, and thus captures an image in an oblique direction from the side opposite to the reference mark 311. Therefore, in the second image, which is an output image of the second imaging unit 140, the outline of the semiconductor chip 310 is captured as a trapezoid narrowing toward the reference mark 311 side.

[0039] The control unit 210 obtains image coordinates (x １ｋ , y １ｋ ) of the pad reference mark 311 from the first image, and also obtains image coordinates (x ２ｋ , y ２ｋ ) of the pad reference mark 311 from the second image. Then, for example, by referring to a conversion table that converts respective image coordinates in two images into three-dimensional coordinates in an actual three-dimensional space, reference coordinates (X ｋ , Y ｋ , Z ｋ ), which are three-dimensional coordinates of the reference mark 311, are calculated from these image coordinates. Note that the conversion table can be generated, for example, by sequentially capturing images of grid dots whose three-dimensional coordinates in actual three-dimensional space are known while changing the height to acquire the first image and the second image, and associating the image coordinates of these dots in both images with the three-dimensional coordinates. The three-dimensional coordinates converted in this case are based on a coordinate system with the reference position of the head unit 110 as the origin.

[0040] The calculated reference coordinates (X ｋ , Y ｋ , Z ｋ ) satisfy Z = Z ｋThis represents the height of the semiconductor chip 310 supported by the flip head 153. Therefore, in the process of transferring the semiconductor chip 310 supported by the flip head 153 to the bonding tool 120, the control unit 210 can accurately determine to what height the collet suction part 126 located at the tip of the bonding tool 120 should be lowered.

[0041] Figure 6 shows the bonding tool 120 being lowered so that the collet suction section 126 is positioned at a set height. The control unit 210 drives the tool drive motor 121 to lower the bonding tool 120 from the state shown in Figure 4.

[0042] Specifically, the control unit 210 calculates the height information of the holding surface 310a of the semiconductor chip 310 (Z = Z ｋ Using this, the collet suction portion 126 is at a distance D from the holding surface 310a. ０ A distance of Z = Z ｋ -D ０ The bonding tool 120 is lowered so that it is positioned at ).

[0043] Here, distance D ０ This is a predetermined separation distance in the height direction. The reason for setting this separation distance is to prevent the heat from the collet 122, which becomes highly heated when the semiconductor chip 310 is transferred, from being transferred to the flip head 153, and also to prevent damage caused by pressure when the collet adsorption part 126 directly contacts the semiconductor chip 310. As in this embodiment, if the height information of the holding surface 310a of the semiconductor chip 310 can be calculated accurately just before the bonding tool 120 is lowered, the distance D between the holding surface 310a and the collet adsorption part 126 as a gap can be calculated. ０ This can be achieved accurately and reliably.

[0044] Figure 7 shows the movement of the semiconductor chip 310 from the handler suction part 156 of the flip head 153 to the collet suction part 126 of the bonding tool 120. From the state shown in Figure 6, the control unit 210 turns off the handler suction mechanism 155 to release the negative pressure in the suction tube 157, and turns on the head suction mechanism 125 to create negative pressure in the suction tube 127. As a result, the suction force of the handler suction part 156 is lost and the suction force of the collet suction part 126 is generated, so the semiconductor chip 310, which was held by the handler suction part 156, temporarily becomes levitated and moves, and its holding surface 310a is attracted to the collet suction part 126. In other words, the semiconductor chip 310 is transferred from the handler 150 to the head unit 110.

[0045] Thus, when transferring the semiconductor chip 310 by creating a gap between the holding surface 310a of the semiconductor chip 310 and the collet adsorption part 126, if the height of the holding surface 310a, as determined by the control unit 210, is inaccurate, variations will occur in the gap distance. Distance D is a suitable value for the gap distance. ０ If the gap is larger than this, the impact force when the chip contacts the collet adsorption part 126 after floating increases, which may damage the semiconductor chip 310. Conversely, the gap distance D is a suitable value. ０ If it is smaller than this, there is a risk that the collet suction part 126 will directly press against the semiconductor chip 310, which may damage the semiconductor chip 310. According to this embodiment, the height information of the holding surface 310a of the semiconductor chip 310 held by the flip head 153 is measured immediately before handover, and as described above, the distance D ０ This can be achieved accurately and stably, so there is no risk of damaging the semiconductor chip 310. ０ This is determined, for example, based on the results of prior tests. It may also be changed depending on the type of semiconductor chip 310 to be delivered and the condition of the surrounding environment. Depending on the type of semiconductor chip 310, D ０ You can also set it to =0.

[0046] Furthermore, if two or more reference marks 311 with known relative positions are provided on the holding surface 310a, the control unit 210 can calculate the three-dimensional coordinates of each reference mark 311 and, from their horizontal position information (X coordinate, Y coordinate), determine the parallel and rotational deviations of the semiconductor chip 310 held by the flip head 153 relative to the reference orientation. In that case, by moving the main body 112 in the planar direction or rotating the bonding tool 120 according to the parallel and rotational deviations, the semiconductor chip 310 can be attached to the collet suction unit 126 in the target correct position and orientation.

[0047] Furthermore, prior to the handover process, the height information of the collet suction unit 126 may be calculated by imaging the collet suction unit 126 with the first imaging unit 130 and the second imaging unit 140. If the height information of the collet suction unit 126 is updated before the handover process, the gap distance D can be calculated with greater accuracy. ０ This can be achieved.

[0048] Furthermore, in this embodiment, as described above, the height information of the holding surface 310a is calculated by imaging the reference mark 311 provided on the holding surface 310a and calculating its three-dimensional coordinates. However, the target for calculating the three-dimensional coordinates using the image may be any location other than the reference mark 311, as long as the relative distance (relative height) to the holding surface 310a is known.

[0049] Next, we will briefly explain the processes following the semiconductor chip 310 delivery process. Figure 8 shows how the target position for placing the semiconductor chip 310 is imaged by the first imaging unit 130 and the second imaging unit 140.

[0050] Once the transfer of the semiconductor chip 310 is complete, the head unit 110 raises the bonding tool 120 to a position where the adsorbed semiconductor chip 310 is out of the field of view of the imaging unit. Then, by driving the head drive motor 111, the head unit 110 is moved so that the bonding tool 120 is directly above the target position where the semiconductor chip 310 will be placed, and the focal plane 110a of the imaging unit aligns with the planned placement surface 330a of the substrate 330. Note that the raising of the bonding tool 120 and the movement of the head unit 110 may be performed in parallel.

[0051] In the state shown in Figure 8, the first imaging unit 130 and the second imaging unit 140 can each capture the same target position within their field of view and acquire an image in focus. The control unit 210 calculates the three-dimensional coordinates of the target position using the first image output by the first imaging unit 130 and the second image output by the second imaging unit 140.

[0052] In parallel with this operation in the head unit 110, the handler 150 performs the operation of picking up the semiconductor chip 310 to be mounted from the chip supply device 160. Specifically, by driving the handler drive motor 159, the main body 152 is moved along the guide rail 151, the arm 154 is reversed, and the flip head 153 is directed toward the semiconductor chip 310 to be picked up which is placed on the stand 161.

[0053] Figure 9 shows how the bonding tool 120 places the semiconductor chip 310 at the target position and performs bonding. After calculating the three-dimensional coordinates of the target position, the control unit 210 finely adjusts the position of the head unit 110 in the XY direction by driving the head drive motor 111 so that the semiconductor chip 310 can be placed at the target position, and finely adjusts the amount of rotation of the bonding tool 120 around the Z axis by driving the tool drive motor 121. Then, the bonding tool 120 is lowered and the semiconductor chip 310 with the mounting surface facing downward is placed at the target position on the substrate 330. After that, the semiconductor chip 310 is pressed with the collet 122 and heated with the heater 124 to adhere it to the substrate 330.

[0054] The configuration of the bonding apparatus 100 according to this embodiment and a series of processing steps have been described above, but the specific configurations of the head unit 110, the handler 150, etc. are not limited to those described above. Various configurations can be adopted as long as they realize the same functions as those described in each configuration. In addition, in the above embodiment, the case in which the semiconductor chip 310 is stacked at the target position on the substrate 330 has been described, but the picked-up semiconductor chip 310 may be stacked on other semiconductor chips 310 that are already mounted on the substrate 330. In this case, the already mounted semiconductor chip 310 becomes the object to be mounted.

[0055] Furthermore, in the bonding apparatus 100 according to this embodiment, the height of the semiconductor chip 310 from a reference plane is detected by a first imaging unit 130 and a second imaging unit 140 that satisfy the Schein loop condition. However, the bonding apparatus 100 is not limited to imaging units that satisfy the Schein loop condition; for example, the height of the semiconductor chip 310 may be detected by optical sensors such as a laser displacement meter capable of three-dimensional measurement, magnetic sensors, ultrasonic sensors, etc.

[0056] 100...Bonding device, 110...Head unit, 110a...Focal plane, 111...Head drive motor, 112...Main body, 120...Bonding tool, 121...Tool drive motor, 122...Collet, 124...Heater, 125...Head suction mechanism, 126...Collet suction unit, 127...Suction tube, 128...Suction tube, 130...First imaging unit, 131...First optical system, 131a...Object-side lens group, 131b...Image-side lens group, 132...First image sensor, 133...Aperture, 140...Second imaging unit, 141...Second optical system, 142...Second image sensor, 150...Handler, 151...Guide rail, 152...Main body, 153...Flip head, 154...Arm, 155...Handler suction mechanism, 156...Handler suction part, 157...Suction tube, 158...Suction tube, 159...Handler drive motor, 160...Chip supply device, 161...Stand, 190...Stage, 191...Stand, 210...Control unit, 220...Storage unit, 230...Input / output device, 310...Semiconductor chip, 310a...Holding surface, 311...Reference mark, 330...Substrate, 330a...Planned mounting surface

Claims

1. A mounting apparatus comprising: a mounting tool having a suction part that adsorbs the holding surface of a mounting object to be mounted, and mounting the mounting surface of the mounting object that the suction part adsorbs onto a mounting object placed on a stage; a transfer device that receives the mounting object and positions the holding surface facing the mounting tool; an imaging unit that images a work area parallel to a reference plane and the holding surface; and a control unit that calculates height information of the mounting object based on an image of the mounting object supported by the transfer device and captured by the imaging unit, lowers the mounting tool toward the mounting object based on the height information so that the suction part is positioned at a distance set in the height direction relative to the mounting object, and operates the suction part to adsorb the mounting object from the transfer device to the suction part.

2. The mounting apparatus according to claim 1, wherein the imaging unit comprises a first imaging unit and a second imaging unit that capture an overhead view of a work area parallel to the reference plane, the optical systems and image sensors of which are arranged to satisfy the Scheinproof condition such that a plane parallel to the reference plane becomes the focal plane, and the control unit calculates the height information of the mounting object based on the first image and the second image captured by the first imaging unit and the second imaging unit.

3. The mounting apparatus according to claim 1, wherein, in the process in which the control unit operates the suction unit to adsorb the mounting object from the transfer device to the suction unit, the mounting object is temporarily in a floating state.

4. The mounting apparatus according to claim 1, wherein the control unit calculates the horizontal position information of the mounting body at the same time as calculating the height information, and adjusts the horizontal position of the mounting tool based on the horizontal position information in conjunction with the operation of lowering the mounting tool.

5. A control method for transferring a mounting object from the transfer device to the mounting tool in a mounting apparatus comprising: a mounting tool having a suction part for adsorbing the holding surface of a mounting object to be mounted, and mounting the mounting surface of the mounting object, which is adsorbed by the suction part, to a mounting object placed on a stage; a transfer device from which the mounting object is supplied and with its holding surface facing the mounting tool; and an imaging unit for imaging a work area parallel to a reference plane and the holding surface, the control method for transferring a mounting object from the transfer device to the mounting tool, comprising: a calculation step of calculating height information of the mounting object based on an image of the mounting object supported by the transfer device and captured by the imaging unit; a descent step of lowering the mounting tool toward the mounting object based on the height information so that the suction part is positioned at a distance set in the height direction relative to the mounting object; and an adsorption step of activating the suction part to adsorb the mounting object from the transfer device to the suction part.

6. A control program for transferring a mounting object from the transfer device to the mounting tool, comprising: a mounting tool having a suction part for adsorbing the holding surface of a mounting object to be mounted, and mounting the mounting surface of the mounting object, which is adsorbed by the suction part, onto a mounting object placed on a stage; a transfer device from which the mounting object is supplied and with its holding surface facing the mounting tool; and an imaging unit for imaging a work area parallel to a reference plane and the holding surface, wherein the program causes a computer to execute the following steps: a calculation step of calculating height information of the mounting object based on an image of the mounting object supported by the transfer device and captured by the imaging unit; a descent step of lowering the mounting tool toward the mounting object based on the height information so that the suction part is positioned at a distance set in the height direction relative to the mounting object; and an adsorption step of activating the suction part to adsorb the mounting object from the transfer device to the suction part.

Images