Resin composition for molding, electronic component device, and method for producing electronic component device

Abstract

A resin composition for molding contains a curable resin and an inorganic filler having a top cut diameter of 25 μm or less. The content of the inorganic filler is less than 74 vol% with respect to the whole resin composition for molding.

Description

Molding resin composition, electronic component device, and method for manufacturing an electronic component device.

[0001] This disclosure relates to a resin composition for molding, an electronic component device, and a method for manufacturing an electronic component device.

[0002] Molding resin compositions containing curable resins are widely used as encapsulating materials to protect electronic components in electronic component devices such as semiconductor packages (see, for example, Patent Document 1). In recent years, a technology called wafer-level packaging has attracted attention as a manufacturing technology for electronic component devices. In wafer-level packaging, instead of cutting the wafer to the size of individual electronic component devices and then packaging them, the wafer is packaged in its wafer state and then cut. Specifically, for example, multiple electronic components arranged on a support member such as a wafer are sealed with an encapsulating material, and the resulting sealed structure is mechanically cut into individual pieces using a dicing saw or the like to obtain multiple electronic component devices.

[0003] Japanese Patent Publication No. 2023-093108

[0004] In the process of separating encapsulated structures into individual pieces, a laser-based method can be considered as a way to obtain complex shapes and high dimensional accuracy that are difficult to achieve with mechanical processing. Specifically, a laser beam is irradiated onto the cured material of the molding resin composition, and a portion of the cured material is removed by the energy of the laser beam, forming an incision and cutting the encapsulated structure into individual pieces. However, depending on the composition of the molding resin composition, it may be difficult to form deep incisions in the cured material. Therefore, there is a need for a molding resin composition that yields a cured material with excellent laser processability.

[0005] One aspect of this disclosure has been made in view of the above-mentioned conventional circumstances and aims to provide a molding resin composition that yields a cured product with excellent laser processability, as well as an electronic component device using the same and a method for manufacturing an electronic component device.

[0006] The specific means for achieving the above objectives are as follows: <1> A molding resin composition comprising a curable resin and an inorganic filler having a top cut diameter of 25 μm or less, wherein the content of the inorganic filler is less than 74 volume percent of the entire molding resin composition. <2> The molding resin composition according to <1>, wherein the curable resin contains an epoxy resin and the molding resin composition further contains a curing agent. <3> The molding resin composition according to <1> or <2>, wherein the molding resin composition is solid at 25°C. <4> An electronic component device comprising a support member, an electronic component disposed on the support member, and a cured product of any one of <1> to <3> that seals the electronic component. <5> A method for manufacturing an electronic component device, comprising the steps of: arranging a plurality of electronic components on a support member; encapsulating the plurality of electronic components collectively with a molding resin composition described in any one of <1> to <3> to obtain a encapsulated structure containing a cured product of the molding resin composition; and irradiating the cured product of the molding resin composition with laser light to separate the encapsulated structure into individual pieces for each encapsulated element, thereby obtaining a plurality of electronic component devices.

[0007] According to one aspect of this disclosure, a molding resin composition that yields a cured product with excellent laser processability, and an electronic component device and a method for manufacturing an electronic component device using the same can be provided.

[0008] The following describes in detail the forms for implementing this disclosure. However, this disclosure is not limited to the following embodiments. In the following embodiments, the components (including elemental steps, etc.) are not essential unless otherwise specified. The same applies to numerical values ​​and their ranges, and do not limit this disclosure.

[0009] In this disclosure, numerical ranges indicated using "~" include the numbers before and after "~" as the minimum and maximum values, respectively. In numerical ranges described in stages in this disclosure, the upper or lower limit of one numerical range may be replaced by the upper or lower limit of another numerical range described in stages. Also, in numerical ranges described in this disclosure, the upper or lower limit of that numerical range may be replaced by the values ​​shown in the examples. In this disclosure, each component may contain multiple types of the corresponding substance. If multiple types of the substance corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple types of substances present in the composition, unless otherwise specified. In this disclosure, each particle corresponding to each component may contain multiple types of particles. If multiple types of particles corresponding to each component are present in the composition, the particle size of each component means the value for the mixture of the multiple types of particles present in the composition, unless otherwise specified.

[0010] <Molding Resin Composition> The molding resin composition of this disclosure comprises a curable resin and an inorganic filler having a top cut diameter of 25 μm or less, wherein the content of the inorganic filler is less than 74 volume percent of the entire molding resin composition. Hereinafter, the content relative to the entire molding resin composition may be simply referred to as "content". The inventors have found that when both the top cut diameter and the content of the inorganic filler are within the above range, a cured product with superior laser processability and that easily forms deep and smooth cuts with laser light can be obtained compared to when either one is within the above range.

[0011] The following describes each component constituting the molding resin composition of this disclosure.

[0012] (Curable Resin) The molding resin composition in this disclosure includes a curable resin. The curable resin may be either a thermosetting resin or a photocurable resin, and from the viewpoint of mass production, a thermosetting resin is preferred. Examples of thermosetting resins include epoxy resins, phenolic resins, melamine resins, urea resins, unsaturated polyester resins, alkyd resins, urethane resins, polyimide resins such as bismaleimide resins, polyamide resins, polyamideimide resins, silicone resins, and acrylic resins. From the viewpoint of moldability and electrical properties, the thermosetting resin is preferably at least one selected from the group consisting of epoxy resins and polyimide resins, more preferably at least one selected from the group consisting of epoxy resins and bismaleimide resins, and even more preferably an epoxy resin. The molding resin composition may contain only one type of curable resin or two or more types. Hereinafter, epoxy resin will be described as an example of a curable resin.

[0013] -Epoxy Resin- The molding resin composition preferably contains an epoxy resin as the curable resin. When the molding resin composition contains an epoxy resin as the curable resin, the content of the epoxy resin relative to the total curable resin is preferably 80% by mass or more, more preferably 90% by mass or more, and even more preferably 95% by mass or more. The content of the epoxy resin relative to the total curable resin may be 100% by mass. The type of epoxy resin is not particularly limited as long as it has epoxy groups in its molecule.

[0014] Specifically, the epoxy resins include: novolac-type epoxy resins (phenol novolac-type epoxy resins, orthocresol novolac-type epoxy resins, etc.) obtained by condensing or co-condensing a novolac resin obtained by condensing or co-condensing a novolac resin obtained by phenol compounds selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene, with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, or propionaldehyde, under an acidic catalyst; triphenylmethane-type epoxy resins obtained by condensing or co-condensing a triphenylmethane-type phenol resin obtained by condensing or co-condensing the above phenol compound with an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde, under an acidic catalyst; and novolac resins obtained by co-condensing the above phenol compound and naphthol compound with an aldehyde compound under an acidic catalyst. Copolymer epoxy resins are resins that have been epoxidized; diphenylmethane type epoxy resins are diglycidyl ethers of bisphenol A, bisphenol F, etc.; biphenyl type epoxy resins are diglycidyl ethers of alkyl-substituted or unsubstituted biphenols; stilbene type epoxy resins are diglycidyl ethers of stilbene-based phenol compounds; sulfur atom-containing epoxy resins are diglycidyl ethers of bisphenol S, etc.; epoxy resins are glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; glycidyl ester type epoxy resins are glycidyl esters of polycarboxylic acid compounds such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; glycidylamine type epoxy resins are resins in which active hydrogen bonded to nitrogen atoms such as aniline, diaminodiphenylmethane, and isocyanuric acid is replaced with a glycidyl group; dicyclopentadiene type epoxy resins are formed by epoxidizing a co-condensation resin of dicyclopentadiene and a phenol compound;Alicyclic epoxy resins such as vinylcyclohexene diepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, and 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane, which have epoxidized olefin bonds within the molecule; paraxylylene-modified epoxy resins, which are glycidyl ethers of paraxylylene-modified phenol resins; metaxylylene-modified epoxy resins, which are glycidyl ethers of metaxylylene-modified phenol resins; terpene-modified epoxy resins, which are glycidyl ethers of terpene-modified phenol resins; and dicyclopentadiene-modified phenol resins, which are glycidyl ethers of dicyclopentadiene-modified phenol resins. Examples of epoxy resins include: pentadiene-modified epoxy resins; cyclopentadiene-modified epoxy resins, which are glycidyl ethers of cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified epoxy resins, which are glycidyl ethers of polycyclic aromatic ring-modified phenolic resins; naphthalene-type epoxy resins, which are glycidyl ethers of naphthalene ring-containing phenolic resins; halogenated phenol novolac-type epoxy resins; hydroquinone-type epoxy resins; trimethylolpropane-type epoxy resins; linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracids such as peracetic acid; and aralkyl-type epoxy resins, which are epoxidized aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins. Furthermore, epoxides of acrylic resins can also be cited as epoxy resins. These epoxy resins may be used individually or in combination of two or more types.

[0015] The epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of balancing various properties such as moldability, reflow resistance, and electrical reliability, the epoxy equivalent of the epoxy resin is preferably 100 g / eq to 1000 g / eq, and more preferably 150 g / eq to 500 g / eq. The epoxy equivalent of the epoxy resin shall be the value measured by the method in accordance with JIS K 7236:2009.

[0016] When the epoxy resin is solid, the softening point or melting point of the epoxy resin is not particularly limited. From the viewpoint of moldability and reflow resistance, the softening point or melting point of the epoxy resin is preferably 40°C to 180°C, and from the viewpoint of ease of handling during the preparation of the resin composition for molding, it is more preferably 50°C to 130°C. The melting point or softening point of the epoxy resin shall be the value measured by differential scanning calorimetry (DSC) or by a method (ring-sphere method) in accordance with JIS K 7234:1986.

[0017] When the molding resin composition contains epoxy resin as a curable resin, the mass percentage of epoxy resin in the total amount of the molding resin composition is preferably 0.5% to 30% by mass, more preferably 2% to 20% by mass, and even more preferably 3.5% to 13% by mass, from the viewpoint of strength, fluidity, heat resistance, moldability, etc.

[0018] (Curing agent) When the curable resin contains an epoxy resin, the molding resin composition of this disclosure preferably contains a curing agent.

[0019] The type of curing agent is not particularly limited and can be selected from those commonly used as curing agents for epoxy resins. The curing agent may be used alone or in combination of two or more types. Examples of curing agents include phenol curing agents, amine curing agents, acid anhydride curing agents, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, and blocked isocyanate curing agents, as well as activated ester compounds. Among these, from the viewpoint of heat resistance, phenol-based curing agents or amine-based curing agents are preferred as curing agents, and from the viewpoint of reducing dielectric loss tangent, activated ester compounds are preferred as cured products. For example, the cured product may contain a phenol-based curing agent or an amine-based curing agent and an activated ester compound.

[0020] Examples of phenolic curing agents include phenolic resins and polyhydric phenolic compounds having two or more phenolic hydroxyl groups in one molecule. Specifically, these include polyhydric phenolic compounds such as resorcinol, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenols; novolac-type phenolic resins obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of phenolic compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, aminophenol, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene with an aldehyde compound such as formaldehyde, acetaldehyde, or propionaldehyde under an acidic catalyst; and phenolic compounds synthesized from the above phenolic compounds with dimethoxyp-xylene, bis(methoxymethyl)biphenyl, etc. Examples include aralkyl-type phenolic resins such as aralkyl resins and naphthol aralkyl resins; paraxylylene-modified phenolic resins; metaxylylene-modified phenolic resins; melamine-modified phenolic resins; terpene-modified phenolic resins; dicyclopentadiene-type phenolic resins and dicyclopentadiene-type naphthol resins synthesized by copolymerization of the above phenolic compounds with dicyclopentadiene; cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified phenolic resins; biphenyl-type phenolic resins; triphenylmethane-type phenolic resins obtained by condensation or co-condensation of the above phenolic compounds with aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde under an acidic catalyst; and phenolic resins obtained by copolymerizing two or more of these. These phenolic curing agents may be used individually or in combination of two or more types.

[0021] Examples of amine-based curing agents include aliphatic amine compounds such as diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, and 4,4'-diamino-dicyclohexylmethane; aromatic amine compounds such as diethyltoluenediamine, 3,3'-diethyl-4,4'-diaminodiphenylmethane, dimethylthiotoluenediamine, and 2-methylaniline; imidazole compounds such as imidazole, 2-methylimidazole, 2-ethylimidazole, and 2-isopropylimidazole; and imidazoline compounds such as imidazoline, 2-methylimidazole, and 2-ethylimidazole. These amine-based curing agents may be used individually or in combination of two or more types.

[0022] The phenolic resin content is preferably 5% to 50% by mass, more preferably 10% to 40% by mass, and even more preferably 15% to 30% by mass, based on the total amount of epoxy resin.

[0023] When the phenol curing agent contains a melamine-modified phenol resin, the content of the melamine-modified phenol resin is preferably 1% to 20% by mass, more preferably 2% to 15% by mass, and even more preferably 3% to 10% by mass, relative to the total amount of epoxy resin. When the content of the melamine-modified phenol resin is 1% by mass or more relative to the total amount of epoxy resin, the adhesion (especially at high temperatures) to adherends such as electronic components and support members on which such electronic components are mounted tends to improve in the cured product of the molding resin composition. When the content of the melamine-modified phenol resin is 20% by mass or less relative to the total amount of epoxy resin, rapid gelation tends to be suppressed and fluidity can be ensured.

[0024] The reactive group equivalent (e.g., hydroxyl group equivalent) of the phenol curing agent or the active hydrogen equivalent of the amine curing agent is not particularly limited. From the viewpoint of balancing various properties such as moldability, heat resistance, and electrical reliability, it is preferably 10 g / eq to 1000 g / eq, and more preferably 30 g / eq to 500 g / eq. In the case of the phenol curing agent, the hydroxyl group equivalent refers to the value calculated based on the hydroxyl value measured in accordance with JIS K0070:1992. In the case of the amine curing agent, the active hydrogen equivalent refers to the value calculated based on the amine value measured in accordance with JIS K7237:1995.

[0025] When an active ester compound is used as a curing agent, the dielectric loss tangent of the cured product can be kept lower compared to when only a phenol curing agent or amine curing agent is used. The reason for this is presumed to be as follows: In the reaction between epoxy resin and a phenol curing agent or amine curing agent, secondary hydroxyl groups are generated. In contrast, in the reaction between epoxy resin and an active ester compound, ester groups are generated instead of secondary hydroxyl groups. Ester groups have lower polarity than secondary hydroxyl groups. Therefore, a molding resin composition containing an active ester compound as a curing agent can keep the dielectric loss tangent of the cured product lower compared to a molding resin composition containing only a curing agent that generates secondary hydroxyl groups. Furthermore, polar groups in the cured product increase the water absorption of the cured product, and by using an active ester compound as a curing agent, the concentration of polar groups in the cured product can be suppressed, thereby suppressing the water absorption of the cured product. And by suppressing the water absorption of the cured product, that is, by suppressing the polar molecule H ２ By suppressing the O content, the dielectric loss tangent of the cured product can be further reduced.

[0026] The type of active ester compound is not particularly limited as long as it is a compound that has one or more ester groups in its molecule that react with an epoxy group. Examples of active ester compounds include phenol ester compounds, thiophenol ester compounds, N-hydroxyamine ester compounds, and esterified heterocyclic hydroxy compounds.

[0027] Examples of active ester compounds include ester compounds obtained from at least one aliphatic carboxylic acid and an aromatic carboxylic acid, and at least one aliphatic hydroxy compound and an aromatic hydroxy compound. Ester compounds in which an aliphatic compound is the polycondensation component tend to have excellent compatibility with epoxy resins due to the presence of an aliphatic chain. Ester compounds in which an aromatic compound is the polycondensation component tend to have excellent heat resistance due to the presence of an aromatic ring.

[0028] Specific examples of active ester compounds include aromatic esters obtained by the condensation reaction of aromatic carboxylic acids and phenolic hydroxyl groups. In particular, aromatic esters obtained by the condensation reaction of aromatic carboxylic acids and phenolic hydroxyl groups using a mixture of an aromatic carboxylic acid component in which 2 to 4 hydrogen atoms of the aromatic ring are substituted with carboxyl groups, a monovalent phenol in which 1 hydrogen atom of the aforementioned aromatic ring is substituted with a hydroxyl group, and a polyvalent phenol in which 2 to 4 hydrogen atoms of the aforementioned aromatic ring are substituted with hydroxyl groups as raw materials are preferred. That is, aromatic esters having structural units derived from the above aromatic carboxylic acid component, structural units derived from the above monovalent phenol, and structural units derived from the above polyvalent phenol are preferred.

[0029] Specific examples of active ester compounds include active ester resins having a structure obtained by reacting a phenol resin having a molecular structure in which a phenol compound is bonded via an aliphatic cyclic hydrocarbon group, as described in Japanese Patent Publication No. 2012-246367, with an aromatic dicarboxylic acid or its halide and an aromatic monohydroxy compound. The compound represented by the following structural formula (1) is preferred as the active ester resin.

[0030]

[0031] In structural formula (1), R １is an alkyl group having 1 to 4 carbon atoms, X is an unsubstituted benzene ring, an unsubstituted naphthalene ring, a benzene ring or naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms, or a biphenyl group, Y is a benzene ring, a naphthalene ring, or a benzene ring or naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms, k is 0 or 1, and n represents the average number of repetitions and is 0.25 to 1.5.

[0032] Specific examples of the compound represented by Structural Formula (1) include the following exemplified compounds (1-1) to (1-10). t-Bu in the structural formula is a tert-butyl group.

[0033]

[0034]

[0035] Other specific examples of active ester compounds include the compound represented by the following Structural Formula (2) and the compound represented by the following Structural Formula (3) described in Japanese Unexamined Patent Application Publication No. 2014-114352.

[0036]

[0037] In Structural Formula (2), R １ and R ２ are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms, Z is an ester-forming structural site (z1) selected from the group consisting of an unsubstituted benzoyl group, an unsubstituted naphthoyl group, a benzoyl group or naphthoyl group substituted with an alkyl group having 1 to 4 carbon atoms, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atom (z2), and at least one of Z is the ester-forming structural site (z1).

[0038] In Structural Formula (3), R １ and R ２Each of these is independently a hydrogen atom, a C1-C4 alkyl group, or a C1-C4 alkoxy group, and Z is an ester-forming structural site (z1) selected from the group consisting of an unsubstituted benzoyl group, an unsubstituted naphthoyl group, a benzoyl or naphthoyl group substituted with a C1-C4 alkyl group, and a C2-C6 acyl group, or a hydrogen atom (z2), and at least one of Z is an ester-forming structural site (z1).

[0039] Specific examples of compounds represented by structural formula (2) include, for example, the following exemplary compounds (2-1) to (2-6).

[0040]

[0041] Specific examples of compounds represented by structural formula (3) include, for example, the following example compounds (3-1) to (3-6).

[0042]

[0043] Commercially available active ester compounds may be used. Examples of commercially available active ester compounds include: "EXB9451", "EXB9460", "EXB9460S", and "HPC-8000-65T" (manufactured by DIC Corporation) as active ester compounds containing a dicyclopentadiene-type diphenol structure; "EXB9416-70BK", "EXB-8", and "EXB-9425" (manufactured by DIC Corporation) as active ester compounds containing an aromatic structure; "DC808" (manufactured by Mitsubishi Chemical Corporation) as an active ester compound containing an acetylated phenol novolac; and "YLH1026" (manufactured by Mitsubishi Chemical Corporation) as an active ester compound containing a benzoylated phenol novolac.

[0044] The ester equivalent (molecular weight / number of ester groups) of the active ester compound is not particularly limited. From the viewpoint of balancing various properties such as moldability, reflow resistance, and electrical reliability, 150 g / eq to 400 g / eq is preferred, 170 g / eq to 300 g / eq is more preferred, and 200 g / eq to 250 g / eq is even more preferred. The ester equivalent of the active ester compound shall be the value measured by the method in accordance with JIS K 0070:1992.

[0045] The equivalent ratio of epoxy resin to curing agent (number of moles of epoxy groups in the resin / total number of moles of reactive groups, active hydrogen, and ester groups in the curing agent) is not particularly limited, but from the viewpoint of minimizing the amount of unreacted components, it is preferably 0.7 to 1.6, more preferably 0.8 to 1.4, and even more preferably 0.9 to 1.2.

[0046] The softening point or melting point of the curing agent is not particularly limited. From the viewpoint of moldability and reflow resistance, the softening point or melting point of the curing agent is preferably 40°C to 180°C, and from the viewpoint of handling during the manufacture of the molding resin composition, it is more preferably 50°C to 130°C. The melting point or softening point of the curing agent is a value measured in the same manner as the melting point or softening point of the epoxy resin.

[0047] The curing agent preferably comprises at least one other curing agent selected from the group consisting of phenol curing agents, amine curing agents, acid anhydride curing agents, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, and blocked isocyanate curing agents, and an active ester compound, and more preferably comprises an active ester compound and a phenolic curing agent. From the viewpoint of keeping the dielectric loss tangent of the cured product low, the mass ratio of the active ester compound to the total amount of the active ester compound and the phenolic curing agent is preferably 40% by mass or more, and more preferably 60% by mass or more. The mass ratio of the active ester compound to the total amount of the active ester compound and the phenolic curing agent may be 80% by mass or less, or 70% by mass or less.

[0048] When a molding resin composition contains an epoxy resin and a curing agent, the content of curable resins other than the epoxy resin may be less than 5% by mass, 4% by mass or less, or 3% by mass or less, based on the total amount of the molding resin composition.

[0049] (Curing accelerator) The molding resin composition may contain a curing accelerator. The type of curing accelerator is not particularly limited and can be selected according to the type of epoxy resin, the desired properties of the molding resin composition, etc.

[0050] Specifically, diazabicycloalkenes such as 1,5-diazabicyclo[4.3.0]nonene-5 (DBN) and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), cyclic amidine compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 2-heptadecylimidazole; derivatives of the cyclic amidine compounds; phenol novolac salts of the cyclic amidine compounds or their derivatives; quinone compounds such as maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, and phenyl-1,4-benzoquinone, and diazoph Compounds having intramolecular polarization obtained by adding compounds with π bonds, such as phenylmethane; cyclic amidinium compounds such as tetraphenylborate salt of DBU, tetraphenylborate salt of DBN, tetraphenylborate salt of 2-ethyl-4-methylimidazole, and tetraphenylborate salt of N-methylmorpholine; tertiary amine compounds such as pyridine, triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; derivatives of the above tertiary amine compounds; ammonium salt compounds such as tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, and tetrapropylammonium hydroxide;Organic phosphines such as primary phosphines like ethylphosphine and phenylphosphine, secondary phosphines like dimethylphosphine and diphenylphosphine, triphenylphosphine, diphenyl(p-tolyl)phosphine, tris(alkylphenyl)phosphine, tris(alkoxyphenyl)phosphine, tris(alkylalkoxyphenyl)phosphine, tris(dialkylphenyl)phosphine, tris(trialkylphenyl)phosphine, tris(tetraalkylphenyl)phosphine, tris(dialkoxyphenyl)phosphine, tris(trialkoxyphenyl)phosphine, tris(tetraalkoxyphenyl)phosphine, trialkylphosphine, dialkylarylphosphine, alkyldiarylphosphine, trinaphthylphosphine, tris(benzyl)phosphine, and other tertiary phosphines; phosphine compounds such as complexes of the aforementioned organic phosphines with organoborons; and the aforementioned organic phosphines or phosphine compounds with maleic anhydride, 1,4-benzoquinone, 2,5-tholquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone Compounds having intramolecular polarization obtained by adding compounds having π bonds, such as quinone compounds like 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, anthraquinone, and diazophenylmethane; and the organophosphine or the phosphine compound with 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, and 4-iodide pheno Compounds having intramolecular polarization obtained by reacting halogenated phenol compounds such as 3-iodidephenol, 2-iodidephenol, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo-3,5-dimethylphenol, 4-bromo-2,6-di-t-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, and 4-bromo-4'-hydroxybiphenyl, followed by a dehalogenation step;Examples of tetrasubstituted phosphonium compounds include tetrasubstituted phosphoniums such as tetraphenylphosphonium, tetraphenylborate salts of tetrasubstituted phosphoniums such as tetraphenylphosphonium tetra-p-tolylborate, and salts of tetrasubstituted phosphoniums with phenolic compounds; phosphobetaine compounds; and adducts of phosphonium compounds with silane compounds. Examples of curing accelerators capable of low-temperature curing include adducts of tributylphosphine and 1,4-benzoquinone, dimethylaminopyridine, 2-ethyl-4-methylimidazole, 2-methylimidazole, and 1-benzyl-2-methylimidazole. The curing accelerator may be used alone or in combination of two or more types.

[0051] When the molding resin composition contains a curing accelerator, the content of the curing accelerator is preferably 0.1% to 8% by mass relative to the total amount of epoxy resin and curing agent.

[0052] (Inorganic Filler) The molding resin composition of this disclosure contains an inorganic filler. The inorganic filler may be any inorganic particles with a top cut diameter of 25 μm or less, and is not particularly limited. The material of the inorganic filler is not particularly limited as long as it is commonly used in molding resin compositions. Specific examples of the material of the inorganic filler include silica such as spherical silica and crystalline silica, glass, alumina, calcium carbonate, barium titanate, calcium titanate, strontium titanate, potassium titanate, magnesium titanate, lead titanate, aluminum titanate, lithium titanate, zinc zirconate titanate, titania, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, fossterite, steatite, spinel, mullite, talc, clay, mica, and other inorganic materials. An inorganic filler having a flame-retardant effect may also be used. Examples of inorganic fillers with flame-retardant properties include particles of aluminum hydroxide, magnesium hydroxide, composite metal hydroxides such as magnesium-zinc hydroxides, and zinc borate. Inorganic fillers may be used individually or in combination of two or more types.

[0053] From the viewpoint of reliability when used in electronic component devices such as semiconductor packages, the inorganic filler preferably contains at least one selected from the group consisting of silica particles, alumina particles, and inorganic particles containing the element of titanium, and more preferably contains at least one selected from the group consisting of silica particles, alumina particles, titania particles, calcium titanate particles, and strontium titanate particles. Hereinafter, inorganic particles containing the element of titanium will also be referred to as "titanium-containing particles". From the viewpoint of fluidity, the inorganic filler preferably contains two or more types of inorganic fillers, more preferably contains titanium-containing particles and inorganic fillers other than titanium-containing particles, and even more preferably contains at least one selected from the group consisting of titania particles, calcium titanate particles, and strontium titanate particles, and at least one selected from the group consisting of silica particles and alumina particles. When the inorganic filler contains titanium-containing particles and inorganic fillers other than titanium-containing particles, the content of titanium-containing particles is preferably 5% to 100% by mass, more preferably 10% to 80% by mass, and even more preferably 10% to 60% by mass, relative to the total inorganic filler, from the viewpoint of suppressing a decrease in dispersibility.

[0054] The titanium-containing particle content relative to the total inorganic filler can be determined by the following method. A thin section sample of the cured resin composition for molding is imaged using a scanning electron microscope (SEM). An arbitrary area S is identified in the SEM image, and the total area A of the inorganic filler contained in area S is determined. Next, using an SEM-EDX (energy-dispersive X-ray spectrometer), the elements of the inorganic filler are identified, and the total area B of the titanium-containing particles contained within the total area A of the inorganic filler is determined. The value obtained by dividing the total area B of the titanium-containing particles by the total area A of the inorganic filler is converted to a percentage (%). The obtained value is taken as the volume-based titanium-containing particle content (volume %) relative to the total inorganic filler. The mass-based titanium-containing particle content (mass %) is determined from the above volume-based titanium-containing particle content (volume %) and the density of each inorganic filler contained in the resin composition for molding. Area S should be a sufficiently large area relative to the size of the inorganic filler. For example, it should be large enough to contain 100 or more inorganic fillers. The area S may be the sum of multiple cross-sections.

[0055] -Top cut diameter and content of inorganic filler- The top cut diameter of the inorganic filler is 25 μm or less, preferably 20 μm or less, more preferably 15 μm or less, and even more preferably 10 μm or less, from the viewpoint of improving the laser processability of the cured product. The top cut diameter of the inorganic filler may be 1 μm or more, from the viewpoint of suppressing the increase in viscosity of the thermosetting resin composition. In this disclosure, the top cut diameter of the inorganic filler refers to the particle size value (D90) when the cumulative volume distribution curve is drawn from the small diameter side using a laser diffraction scattering particle size distribution analyzer, and the cumulative volume value is 90 volume%. When the molding resin composition contains two or more types of inorganic fillers, the top cut diameter of the inorganic filler is the top cut diameter of the total of the two or more types of inorganic fillers.

[0056] The inorganic filler content (volume %) is less than 74 volume percent of the total molding resin composition. From the viewpoint of improving the laser processability of the cured product, it is preferably 72 volume percent or less, more preferably 70 volume percent or less, even more preferably 68 volume percent or less, particularly preferably 66 volume percent or less, extremely preferably 64 volume percent or less, and most preferably 60 volume percent or less. From the viewpoint of further improving the properties of the cured product such as the coefficient of thermal expansion, thermal conductivity, and elastic modulus of the cured product, the inorganic filler content (volume %) is preferably 30 volume percent or more, more preferably 35 volume percent or more, and even more preferably 40 volume percent or more, based on the total molding resin composition. The inorganic filler content (volume %) is preferably 30% to less than 74% by volume, more preferably 30% to 72% by volume, even more preferably 30% to 70% by volume, particularly preferably 35% to 68% by volume, particularly more preferably 40% to 66% by volume, extremely preferably 40% to 64% by volume, and most preferably 40% to 60% by volume, relative to the entire molding resin composition.

[0057] From the viewpoint of improving the laser processability of the cured product, the inorganic filler content (mass%) is preferably 95% by mass or less, more preferably 92% by mass or less, even more preferably 90% by mass or less, and most preferably 85% by mass or less, relative to the entire molding resin composition. From the viewpoint of further improving the properties of the cured product such as the coefficient of thermal expansion, thermal conductivity, and elastic modulus of the cured product, the inorganic filler content (mass%) is preferably 60% by mass or more, more preferably 70% by mass or more, and even more preferably 75% by mass or more, relative to the entire molding resin composition. The inorganic filler content (mass%) is preferably 60% by mass to 95% by mass, more preferably 60% by mass to 92% by mass, even more preferably 70% by mass to 90% by mass, and particularly preferably 75% by mass to 85% by mass, relative to the entire molding resin composition.

[0058] In measuring the inorganic filler content in a molding resin composition, first, the total mass of the molding resin composition is measured, then it is baked at 400°C for 2 hours, and then at 700°C for 3 hours to evaporate the resin components, and the mass of the remaining inorganic filler is measured. The ratio of the mass of the inorganic filler to the total mass of the molding resin composition is obtained and is defined as the inorganic filler content (mass%). In addition, the volume is calculated from the obtained masses and their respective specific gravities, and the ratio of the volume of the inorganic filler to the total volume of the cured product is obtained and is defined as the inorganic filler content (volume%).

[0059] The inorganic filler contained in the molding resin composition has a top cut diameter of 25 μm or less and a content of less than 74 volume%, preferably a top cut diameter of 25 μm or less and a content of 72 volume% or less, more preferably a top cut diameter of 25 μm or less and a content of 70 volume% or less, even more preferably a top cut diameter of 20 μm or less and a content of 68 volume% or less, even more preferably a top cut diameter of 15 μm or less and a content of 66 volume% or less, particularly preferably a top cut diameter of 10 μm or less and a content of 64 volume% or less, and most particularly preferably a top cut diameter of 10 μm or less and a content of 60 volume% or less.

[0060] -Shape of the inorganic filler- The shape of the inorganic filler is not particularly limited and may include spherical, elliptical, or irregular shapes. The inorganic filler may also be crushed. The inorganic filler may also be surface-treated. The state of the inorganic filler may include powder, beads made by shaping powder, fibers, etc.

[0061] The average particle size of the inorganic filler is not particularly limited, as long as the top cut diameter is within the aforementioned range. Examples of volume-average particle size of the inorganic filler include 10 μm or less, preferably 0.1 μm to 10 μm, more preferably 0.2 μm to 7 μm, even more preferably 0.3 μm to 5 μm, and particularly preferably 0.3 μm to 4 μm. A volume-average particle size of 10 μm or less tends to improve the ability to fill narrow gaps. Furthermore, a volume-average particle size of 0.1 μm or more tends to suppress the increase in viscosity of the molding resin composition.

[0062] The volume-average particle size of inorganic fillers can be measured as the volume-average particle size (D50) using a laser diffraction scattering particle size distribution analyzer.

[0063] (Various Additives) In addition to the components described above, the molding resin composition may contain various additives such as coupling agents, ion exchangers, mold release agents, flame retardants, colorants, and stress relaxants, as exemplified below. The molding resin composition may also contain various additives known in the art, as needed, in addition to the additives exemplified below. The molding resin composition may contain a solvent, and it is preferable that it is substantially solvent-free from the viewpoint of eliminating the need for a solvent removal step. Here, substantially solvent-free means that the solvent content relative to the entire molding resin composition is less than 1% by mass.

[0064] -Coupling Agent- The molding resin composition may contain a coupling agent from the viewpoint of improving the adhesion between the curable resin and curing agent and the inorganic filler. Examples of known coupling agents include silane compounds, titanium compounds, aluminum chelate compounds, and aluminum / zirconium compounds.

[0065] Examples of silane compounds include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-(2-aminoethyl)aminopropyltrimethoxysilane, 3-(2-aminoethyl)aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-ureidopropyltriethoxysilane, octenyltrimethoxysilane, glycidoxyoctyltrimethoxysilane, and methacryloxyoctyltrimethoxysilane.

[0066] Examples of titanium-based compounds include isopropyl triisostearoyl titanate, isopropyl tris(dioctyl pyrophosphate) titanate, isopropyl tri(N-aminoethyl-aminoethyl) titanate, tetraoctyl bis(ditridecyl phosphite) titanate, tetra(2,2-diallyloxymethyl-1-butyl)bis(ditridecyl phosphite) titanate, bis(dioctyl pyrophosphate) oxyacetate titanate, bis(dioctyl pyrophosphate) ethylene titanate, isopropyl trioctanoyl titanate, isopropyl dimethacrylate isostearoyl titanate, isopropyl toridodecylbenzenesulfonyl titanate, isopropyl isostearoyl diacrylic titanate, isopropyl tri(dioctyl phosphate) titanate, isopropyl tricumylphenyl titanate, and tetraisopropyl bis(dioctyl phosphite) titanate.

[0067] When the molding resin composition contains a coupling agent, the amount of the coupling agent is preferably 0.05 to 20 parts by mass, and more preferably 0.1 to 15 parts by mass, per 100 parts by mass of the inorganic filler. When the amount of the coupling agent is 0.05 parts by mass or more per 100 parts by mass of the inorganic filler, the adhesion to metal members tends to improve. When the amount of the coupling agent is 20 parts by mass or less per 100 parts by mass of the inorganic filler, the moldability tends to improve.

[0068] -Ion Exchanger- The molding resin composition may contain an ion exchanger. In particular, when the molding resin composition is used as a encapsulating molding material, it is preferable that the molding resin composition contains an ion exchanger from the viewpoint of improving the moisture resistance and high-temperature storage characteristics of the electronic component device equipped with the encapsulated element. The ion exchanger is not particularly limited, and conventionally known ones can be used. Specifically, examples include hydrotalcite compounds and hydrated oxides of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium, and bismuth. The ion exchanger may be used alone or in combination of two or more. Among these, hydrotalcite represented by the following general formula (A) is preferred.

[0069] Mg （１－Ｘ） Al Ｘ (OH) ２ (CO ３ ) Ｘ／２ ・mH ２ O ...... (A) (0 < X ≦ 0.5, m is a positive number)

[0070] When the molding resin composition contains an ion exchanger, the content thereof is not particularly limited as long as it is an amount sufficient to capture ions such as halogen ions. For example, it is preferably 0.1 parts by mass to 30 parts by mass, more preferably 1 part by mass to 10 parts by mass, relative to 100 parts by mass of the resin component. Here, the "resin component" includes the aforementioned curable resin and the optionally used curing agent.

[0071] -Release Agent- The molding resin composition may contain a release agent from the viewpoint of obtaining good releasability from the mold during molding. The release agent is not particularly limited, and any conventionally known release agent can be used. Specific examples include carnauba wax, higher fatty acids such as montanic acid and stearic acid, higher fatty acid metal salts, ester-based waxes such as montanic acid esters, and polyolefin-based waxes such as oxidized polyethylene and non-oxidized polyethylene. The release agent may be used alone in one kind or in combination of two or more kinds.

[0072] When the molding resin composition contains a release agent, the amount thereof is preferably 0.01 parts by mass to 10 parts by mass, more preferably 0.1 parts by mass to 5 parts by mass, relative to 100 parts by mass of the resin component. When the amount of the release agent is 0.01 parts by mass or more relative to 100 parts by mass of the resin component, sufficient releasability tends to be obtained. When the amount is 10 parts by mass or less, better adhesiveness and curability tend to be obtained.

[0073] -Flame Retardant- The molding resin composition may contain a flame retardant. The flame retardant is not particularly limited, and any conventionally known flame retardant can be used. Specific examples include organic or inorganic compounds containing a halogen atom, antimony atom, nitrogen atom or phosphorus atom, and metal hydroxides. The flame retardant may be used alone in one kind or in combination of two or more kinds.

[0074] If the molding resin composition contains a flame retardant, the amount is not particularly limited as long as it is sufficient to obtain the desired flame retardant effect. For example, it is preferably 1 to 30 parts by mass, and more preferably 2 to 20 parts by mass, per 100 parts by mass of the resin component.

[0075] -Colorants- The molding resin composition may further contain colorants. Examples of known colorants include carbon black, organic dyes, organic pigments, titanium dioxide, red lead, and red iron oxide. The amount of colorant can be appropriately selected depending on the purpose. One colorant may be used alone, or two or more colorants may be used in combination.

[0076] When the molding resin composition contains carbon black as a coloring agent, the carbon black content in the molding resin composition may be 0.1% to 1.0% by mass, or 0.2% to 0.8% by mass.

[0077] (Stress Relief Agents) The molding resin composition may contain stress relief agents such as silicone oil, silicone resin, and silicone rubber particles. By including stress relief agents, it is possible to reduce package warping deformation and package cracking when the thermosetting resin composition is used as a sealing material. Examples of stress relief agents include commonly used and known stress relief agents (flexible agents). Specifically, examples include thermoplastic elastomers such as silicone-based, styrene-based, olefin-based, urethane-based, polyester-based, polyether-based, polyamide-based, and polybutadiene-based; rubber particles such as NR (natural rubber), NBR (acrylonitrile-butadiene rubber), acrylic rubber, urethane rubber, and silicone powder; and rubber particles having a core-shell structure such as methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, and methyl methacrylate-butyl acrylate copolymer. One type of stress relief agent may be used alone, or two or more types may be used in combination.

[0078] The content of the stress-relieving agent is preferably 20% by mass or less, more preferably 10% by mass or less, even more preferably 7% by mass or less, and particularly preferably 5% by mass or less, based on the total content of the molding resin composition. The lower limit of the content of the silicone-based stress-relieving agent is not particularly limited and may be 0% by mass or 0.1% by mass.

[0079] (Method for preparing molding resin composition) The method for preparing a molding resin composition is not particularly limited. When the molding resin composition is solid, a general method is to thoroughly mix predetermined amounts of components using a mixer or the like, then melt-knead using a mixing roll, extruder or the like, cool, and pulverize. More specifically, for example, a method is to uniformly stir and mix predetermined amounts of the above-mentioned components, knead using a kneader, roll, extruder, twin-screw extruder or the like that has been preheated to 70°C to 140°C, then cool and pulverize. When the molding resin composition is liquid, a general method is to weigh predetermined amounts of components, disperse and knead using a three-roll machine, pulverizer, planetary mixer, hard mixer, homomixer or the like. Furthermore, a method using a masterbatch in which each component has been pre-dispersed and pre-heated is preferred in terms of uniform dispersibility and fluidity.

[0080] From the viewpoint of ease of handling, the molding resin composition is preferably solid at 25°C. When the molding resin composition is solid, its shape is not particularly limited and can be powder, granular, tablet, pellet, sheet, etc. When the molding resin composition is in tablet or pellet form, the dimensions and mass should be such that they are suitable for the molding conditions of the package, from the viewpoint of ease of handling. When the molding resin composition is liquid, the viscosity at 25°C is preferably less than 1000 Pa·s, more preferably 800 Pa·s or less, and even more preferably 500 Pa·s or less. In this disclosure, the viscosity at 25°C refers to the value measured using a rotary shear viscometer equipped with a cone plate (diameter 48 mm, cone angle 1°) at a shear rate of 10 revolutions / minute.

[0081] <Electronic Component Device> An electronic component device according to one embodiment of the present disclosure comprises a support member, an electronic component disposed on the support member, and a cured product of the aforementioned molding resin composition that seals the electronic component. Examples of electronic component devices include those obtained by mounting electronic components (active elements such as semiconductor chips, transistors, diodes, and thyristors, passive elements such as capacitors, resistors, and coils, and antennas, etc.) on a support member such as a lead frame, a wired tape carrier, a wiring board, glass, a silicon wafer, or an organic substrate, and then sealing the resulting electronic component region with a molding resin composition (for example, a high-frequency device).

[0082] The type of support member is not particularly limited, and support members commonly used in the manufacture of electronic component devices can be used. The electronic component may include an antenna, or it may include elements other than an antenna. The antenna is not limited to anything that performs the function of an antenna, and may be an antenna element or wiring.

[0083] Furthermore, in the electronic component device of this embodiment, other electronic components may be arranged on the side of the support member opposite to the side on which the above-mentioned electronic components are arranged, if necessary. The other electronic components may be sealed with the aforementioned molding resin composition, or with another resin composition, or may not be sealed at all.

[0084] (Method for Manufacturing an Electronic Component Device) The method for manufacturing an electronic component device according to this embodiment includes the steps of arranging an electronic component on a support member and sealing the electronic component with the molding resin composition described above. The method for carrying out each of the above steps is not particularly limited and can be carried out by general methods. Furthermore, the types of support members and electronic components used in the manufacture of the electronic component device are not particularly limited and can be support members and electronic components that are commonly used in the manufacture of electronic component devices.

[0085] Methods for encapsulating electronic components using the aforementioned molding resin composition include low-pressure transfer molding, injection molding, and compression molding. Among these, low-pressure transfer molding is the most common.

[0086] The method for manufacturing an electronic component device according to this embodiment may include the steps of: arranging a plurality of electronic components on a support member; encapsulating the plurality of electronic components collectively with the aforementioned molding resin composition to obtain a sealed structure containing a cured product of the molding resin composition; and irradiating the cured product of the molding resin composition with laser light to separate the sealed structure into individual pieces for each sealed element, thereby obtaining a plurality of electronic component devices. By using a laser in the step of separating the sealed structure into individual pieces, complex shapes and high dimensional accuracy, which are difficult to achieve with machining, can be obtained. Furthermore, the occurrence of chipping and cracking, which are prone to occur in machining, can be suppressed. In addition, dry processing without the use of water becomes possible. The step of separating the sealed structure into individual pieces using a laser includes at least the step of irradiating the cured product of the molding resin composition with laser light to shave off a part of the cured product and form a cut. In the step of separating the sealed structure into individual pieces, the sealed structure may be cut using only laser light, or it may be cut by combining other methods (mechanical cutting with a dicing saw, division by external stress such as braking, etc.) after forming a cut with laser light.

[0087] The laser used in the process of separating the encapsulated structure into individual pieces may be an ultraviolet laser (hereinafter also referred to as "UV laser") that generates ultraviolet light, or a visible light laser (such as a green laser) that generates visible light, with UV lasers being preferred. Examples of lasers include gas lasers such as carbon dioxide lasers, nitrogen lasers, Ar lasers, He / Ne lasers, He / Cd lasers, and Kr lasers; liquid (dye) lasers; solid-state lasers such as ruby ​​lasers and Nd / YAG lasers; semiconductor lasers such as GaAs / GaAlAs and InGaAs lasers; KrF lasers, XeCl lasers, XeF lasers, and Ar lasers. ２ Examples include excimer lasers. Solid-state lasers are preferred, and LD-pumped solid-state lasers are more preferred.

[0088] The above embodiments will be described in detail below with reference to examples, but the scope of the above embodiments is not limited to these examples.

[0089] <Preparation of Molding Resin Compositions> The molding resin compositions for the examples and comparative examples were prepared by mixing the components shown below in the proportions (parts by mass) shown in Tables 1 to 3. The obtained molding resin compositions were solid at room temperature and pressure. In Tables 1 to 3, blank spaces indicate that the component was not present.

[0090] • Epoxy resin 1: Biphenyl aralkyl type epoxy resin, epoxy equivalent 274 g / eq • Epoxy resin 2: Biphenyl type epoxy resin, epoxy equivalent 192 g / eq

[0091] • Curing agent 1: Active ester compound, manufactured by DIC Corporation, product name "EXB-8" • Curing agent 2: Melamine-modified phenol resin, reactive group equivalent 120 g / eq • Curing agent 3: Biphenyl aralkyl type phenol resin, hydroxyl group equivalent 199 g / eq

[0092] • Curing accelerator: Triphenylphosphine / 1,4-benzoquinone adduct • Coupling agent: N-phenyl-3-aminopropyltrimethoxysilane • Release agent: Montanate ester wax • Coloring agent: Carbon black, manufactured by Mitsubishi Chemical Corporation, product name "MA100" • Stress reliever: Silicone resin

[0093] • Inorganic filler 1: Alumina particles, top cut diameter: 54 μm, volume average particle size: 19.5 μm, specific surface area: approximately 1.6 m² ２ / g • Inorganic filler 2: Alumina particles, top cut diameter: 25 μm, volume average particle size: 7.0 μm, specific surface area: approximately 2.3 m² ２ / g • Inorganic filler 3: Alumina particles, top cut diameter: 20 μm, volume average particle size: 4.6 μm, specific surface area: approximately 0.7 m² ２ / g • Inorganic filler 4: Alumina particles, top cut diameter: 15 μm, volume average particle size: 4.5 μm, specific surface area: approximately 0.7 m² ２ / g • Inorganic filler 5: Alumina particles, top cut diameter: 10 μm, volume average particle size: 3.6 μm, specific surface area: approximately 0.8 m² ２ / g • Inorganic filler 6: Calcium titanate particles, top cut diameter: 20 μm or less, volume average particle size: 3.0 μm, specific surface area: approximately 1.9 m² ２ / g • Inorganic filler 7: Titania particles, top cut diameter: 10 μm or less, volume average particle size: 0.6 μm, specific surface area: approximately 40 m² ２ / g • Inorganic filler 8: Calcium titanate particles, top cut diameter: 10 μm or less, volume average particle size: 0.25 μm, specific surface area: approximately 14.0 m² ２ / g • Inorganic filler 9: Alumina particles, top cut diameter: 10 μm or less, volume average particle size: 0.3 μm, specific surface area: approximately 6.0 m² ２ / g

[0094] The volume-average particle size and top-cut diameter of each inorganic filler mentioned above were obtained by the following measurements. Specifically, first, the inorganic filler was added to a dispersion medium (water) in a range of 0.01% to 0.1% by mass and dispersed in a bath-type ultrasonic cleaner for 5 minutes. 5 ml of the resulting dispersion was injected into a cell, and the particle size distribution was measured at 25°C using a laser diffraction / scattering particle size distribution analyzer (Horiba, Ltd., LA920). The particle size at 50% of the cumulative value (volume basis) in the obtained particle size distribution was defined as the volume-average particle size, and the particle size at 90% of the cumulative value (volume basis) was defined as the top-cut diameter.

[0095] Furthermore, the specific surface area of ​​each of the inorganic fillers mentioned above was obtained by measurement in accordance with JIS Z 8830:2013 using the known BET method (nitrogen gas adsorption method). Specifically, as a pretreatment, a measurement cell containing 0.05 g of the sample was reduced to 10 Pa or less using a vacuum pump, then heated to 110°C and held for more than 3 hours, after which it was allowed to cool naturally to 25°C while maintaining the reduced pressure. After this pretreatment, the measurement was performed using QUANTACHOME's AUTOSORB-1 (product name) as the evaluation device, with the evaluation temperature set to 77 K and the evaluation pressure range set to less than 1 in relative pressure (equilibrium pressure relative to saturated vapor pressure).

[0096] The top cut diameter, content (volume %), and content (mass %) of the inorganic filler in the obtained molding resin composition were determined by the method described above. The results are shown in Tables 1 to 3 (indicated by "Top cut diameter (μm)", "Inorganic filler content (volume %)", and "Inorganic filler content (mass %)").

[0097] <Evaluation of Molding Resin Compositions> (Flowability: Spiral Flow) Using a spiral flow measurement mold conforming to EMMI-1-66, the molding resin composition was molded under the conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds, and the flow distance (cm) was determined. The results are shown in Tables 1 to 3 ("Flow Distance (cm)" in the table).

[0098] (Laser Processing Evaluation) The molding resin composition was placed in a vacuum hand press machine and molded under the conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 300 seconds. Post-curing was carried out at 175°C for 5 hours to obtain a disc-shaped cured product (Φ50 mm, thickness 1 mm). Laser processing evaluation was performed using this cured product as a test piece.

[0099] -Laser Processing Evaluation 1- Grooves were machined into a cured resin composition for molding using a UV laser (DISCO, DFL7160, wavelength 355 nm) under the conditions of output 2 W, frequency 100 kHz, and processing speed 10 mm / sec. The visible groove depth (μm) was determined using a digital microscope (KEYENCE Corporation, VHX-7000). The average value of the groove depth measured at three points in the grooved area was defined as the "groove depth (μm)" above. The results are shown in Tables 1 to 3 ("Groove Depth 1 (μm)" in the table).

[0100] -Laser Processing Evaluation 2- Grooving was performed on a cured resin composition for molding using a green laser (Gravotech, Energy HYBRID H2O, wavelength 532 nm) under the conditions of output 5 W, frequency 100 kHz, processing speed 100 mm / sec, and power 100% to form a 1 cm × 1 cm groove. The surface roughness (μm) of the grooved surface was measured using a laser confocal microscope (OLYMPUS OLS5100). Specifically, the surface roughness of the grooved area was measured in accordance with JIS B0681 (ISO 25178). With an objective lens magnification of 20x, a 260 μm (X axis) × 260 μm (Y axis) image was calculated using the analysis application of the same device. The arithmetic mean height Sa calculated under the conditions of a 0.8 μm S filter and Gaussian filtering was defined as the "surface roughness (μm)" above. The results are shown in Tables 1 to 3 ("Surface roughness 2 (μm)" in the table).

[0101]

[0102]

[0103]

[0104] As shown in Tables 1 to 3, in all of the example molding resin compositions in which the top cut diameter of the inorganic filler was 25 μm or less and the content was less than 74 volume%, the groove depth 1 was 50.0 μm or more and the surface roughness 2 was 4.0 μm or less in the laser processing evaluation. In contrast, in the comparative example molding resin compositions in which at least one of the top cut diameter and content was outside the above range, at least one of the groove depth 1 and surface roughness 2 was outside the above range. In other words, from the results shown in Tables 1 to 3, it can be seen that the example molding resin compositions achieve both a deeper groove depth and lower surface roughness in the laser processing evaluation compared to the comparative example molding resin compositions. From this, it can be seen that a cured product with excellent laser processability can be obtained.

[0105] The disclosure of Japanese Patent Application No. 2025-045735, filed on 19 March 2025, is incorporated herein by reference in its entirety. All documents, patent applications, and technical standards described herein are incorporated herein to the same extent as if each individual document, patent application, and technical standard were specifically and individually noted to be incorporated by reference.

Claims

1. A molding resin composition comprising a curable resin and an inorganic filler having a top cut diameter of 25 μm or less, wherein the content of the inorganic filler is less than 74 volume percent of the entire molding resin composition.

2. The molding resin composition according to claim 1, wherein the curable resin contains an epoxy resin, and the molding resin composition further contains a curing agent.

3. The molding resin composition according to claim 1, wherein the molding resin composition is solid at 25°C.

4. An electronic component device comprising: a support member; an electronic component disposed on the support member; and a cured product of a molding resin composition according to any one of claims 1 to 3 that seals the electronic component.

5. A method for manufacturing an electronic component device, comprising: arranging a plurality of electronic components on a support member; encapsulating the plurality of electronic components collectively with a molding resin composition according to any one of claims 1 to 3 to obtain a encapsulated structure including a cured product of the molding resin composition; and irradiating the cured product of the molding resin composition with laser light to separate the encapsulated structure into individual pieces for each encapsulated element to obtain a plurality of electronic component devices.

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