Apparatus and method for manufacturing vertically conductive sheet for module testing

Abstract

According to the present invention, disclosed is an apparatus for manufacturing a vertically conductive sheet for module testing, the apparatus comprising: an etching unit that forms a plurality of conductive portions of the vertically conductive sheet while forming, in each of designated portions of a conductive layer made of an electrically conductive material corresponding to a first solution, a plurality of insulator holes that at least partially penetrate the conductive layer in a vertical direction; an insulation injection unit that forms a plurality of insulating portions of the vertically conductive sheet by forming an insulator layer in each of the plurality of insulator holes using a second solution containing an electrically insulating material; and a curing unit that cures the insulator layer formed by the insulation injection unit in spaces between the plurality of conductive portions.

Description

Manufacturing apparatus and method for upper and lower conductive sheets for module testing

[0001] The present invention relates to an apparatus and method for manufacturing an upper and lower conductive sheet for module testing, and more specifically, to an apparatus and method for manufacturing an upper and lower conductive sheet for module testing in which a plurality of conductive parts are vertically arranged inside an insulating part and positioned between a memory module and a test equipment to electrically connect the terminals of the memory module and the terminals of the test equipment.

[0002] Generally, memory modules (semiconductor packages) undergo a post-manufacturing test process to check for defects that may occur during the packaging process. Fig. 39 illustrates the configuration of a general memory module test equipment (200). Referring to the drawing, the conventional memory module test equipment (200) is equipped with a test board (30) for inputting a test signal to a memory module (10) to be tested, and a test socket (60) for mounting the memory module (10) on the test board (30).

[0003] In addition, an upper and lower conductive sheet (40) is disposed in the test socket (60) to electrically connect the terminal (11) of the memory module (10) and the terminal of the test equipment (200) (for example, the terminal of the test socket (60) or the terminal of the test board (30)), so that a test signal output from the test board (30) can be input to the memory module (10).

[0004] Regarding conventional upper and lower conductive sheets for testing, prior art 1 'Korean Patent Publication No. 10-1026992 (March 29, 2011), test socket for memory module', prior art 2 'Korean Utility Model Publication No. 20-0311804 (April 16, 2003), socket device for chip inspection', and prior art 3 'Korean Patent Publication No. 10-2502104 (February 16, 2023), connector for electrical connection' have been disclosed.

[0005] However, the upper and lower conductive sheets of prior art 1 and 2 are provided with clips formed inside into which terminals of memory modules are inserted, and the lower part of each clip is formed to protrude so as to be connected to terminals of test equipment.

[0006] In addition, the upper and lower conductive sheet of prior art 3 has a plurality of conductive parts arranged upright inside an insulating part made of an insulating material. In the case of the conductive parts, a magnetic field is applied to a liquid conductive elastic insulating material containing conductive particles to align the conductive particles in the upper and lower directions, and the structure is manufactured by curing in this state.

[0007] However, in the case of the upper and lower conductive sheets disclosed in prior art 1 and 2, the structure is complex because a number of clips corresponding to or greater than the number of terminals of the memory module must be provided internally, which inevitably increases the manufacturing cost and causes damage to the terminals as the terminals of the memory module are directly connected to the clips. In the case of the upper and lower conductive sheet disclosed in prior art 3, there is a problem that manufacturing equipment costs become excessively high because equipment for applying a magnetic field to conductive particles is essential.

[0008] In addition, prior art 1, 2, and 3 all had a common limitation in miniaturizing the clips or conductive parts corresponding to each terminal of the memory module, which restricted the manufacturing of upper and lower conductive sheets compatible with the fine pitch structure of ultra-small memory modules.

[0009] Furthermore, in all of the prior art 1, 2, and 3, when the terminals of the memory module each protrude at different lengths, there was a problem in that it was difficult to make contact with the terminals of the upper and lower conductive sheets due to structural differences resulting from the different lengths.

[0010] The present invention was created to solve the aforementioned problems, and the objective of the present invention is to provide an apparatus and method for manufacturing an upper and lower conductive sheet for module testing that prevents deformation or damage to terminals during memory module testing, facilitates easy manufacturing to significantly reduce manufacturing costs and unit costs of manufacturing equipment, enables mass production, and allows for the manufacture of an upper and lower conductive sheet compatible with the fine pitch structure of ultra-small memory modules.

[0011] In addition, the objective of the present invention is to provide an apparatus and method for manufacturing an upper and lower conductive sheet for module testing, which can bring the terminals of the upper and lower conductive sheets into contact according to the protruding structure of the counterpart terminal (e.g., terminal of the memory module) during the inspection of the memory module.

[0012] According to one embodiment, a module test upper / lower conductive sheet manufacturing device for manufacturing an upper / lower conductive sheet (10) in which a plurality of conductive parts (12) are vertically arranged inside an insulating part (11) and are positioned between a counterpart module (20) and a test equipment (30) to electrically connect a terminal (21) of a counterpart module (20) and a terminal (31) of a test equipment (30) comprises: an etching part (115) that forms a plurality of conductive parts (12) of the upper / lower conductive sheet (10) while forming a plurality of insulating holes (132) that are at least partially penetrated in the upper / lower direction at each designated part of a conductor layer (131) made of an electrically conductive material corresponding to a first solution; and an insulating injection part (125) that forms a plurality of insulating parts (11) of the upper / lower conductive sheet (10) while forming an insulating layer (111) using a second solution containing an electrically insulating material at each of the plurality of insulating holes (132). It may include a curing section (180) that cures the insulating layer (111) formed by the insulating injection section (125) between the plurality of conductive sections (12).

[0013] According to one embodiment, the insulation injection unit (125) can form the insulation layer (111) by diffusing the second solution into each of the plurality of insulation holes (132) using an underfill injection process.

[0014] According to one embodiment, the insulating injection unit (125) can form the insulating layer (111) by diffusing the second solution into each of the plurality of insulating holes (132) using at least one of a screen printing method, an injection method, and a dispensing method.

[0015] According to one embodiment, a base material (50) may be disposed on the lower part of the conductor layer (131).

[0016] According to one embodiment, after the plurality of insulating holes (132) are formed in each designated portion of the conductor layer (131), when the base material (50) is removed, a first guard member (53) may be disposed on the upper portion of the conductor layer (131) where the plurality of insulating holes (132) are formed, and a second guard member (54) may be disposed on the lower portion of the conductor layer (131) where the plurality of insulating holes (132) are formed.

[0017] According to one embodiment, the first guard member (53) may have an injection port (53a) formed through it in the vertical direction to correspond to one of the plurality of insulating holes (132), and the second guard member (54) may have an exhaust port (54a) formed through it in the vertical direction to correspond to another of the plurality of insulating holes (132).

[0018] According to one embodiment, the second solution can be introduced into the interior of one of the insulating holes through the injection port (53a), and then spread toward the discharge port (54a) while filling the remaining insulating holes among the plurality of insulating holes (132).

[0019] According to one embodiment, after the plurality of insulating holes (132) are formed in each designated portion of the conductor layer (131), when the base material (50) is removed, a conductive film (55) may be disposed on the lower portion of the conductor layer (131) in which the plurality of insulating holes (132) are formed.

[0020] According to one embodiment, a conductive pattern (131a) may be formed on the conductive film (55) to correspond to the position of each of the plurality of conductive parts (12).

[0021] According to one embodiment, a method for manufacturing an upper and lower conductive sheet for module testing, wherein a plurality of conductive parts (12) are vertically arranged inside an insulating part (11) and positioned between a counterpart module (20) and a test equipment (30) to electrically connect a terminal (21) of the counterpart module (20) and a terminal (31) of the test equipment (30), comprises: an etching step (S310) of forming a plurality of conductive parts (12) of the upper and lower conductive sheet (10) while forming a plurality of insulating holes (132) that are at least partially penetrated in the upper and lower direction at each designated part of a conductor layer (131) made of an electrically conductive material corresponding to a first solution; and an insulation injection step (S320) of forming a plurality of insulating parts (11) of the upper and lower conductive sheet (10) while forming an insulating layer (111) using a second solution containing an electrically insulating material at each of the plurality of insulating holes (132). and may include a curing step (S330) of curing the insulating layer (111) between the plurality of conductive parts (12).

[0022] According to one embodiment, in the insulation injection step (S320), the insulation layer (111) can be formed by diffusing the second solution into each of the plurality of insulation holes (132) using an underfill injection process.

[0023] According to one embodiment, in the insulation injection step (S320), the insulation layer (111) can be formed by diffusing the second solution into each of the plurality of insulation holes (132) using at least one of a screen printing method, an injection method, or a dispensing method.

[0024] According to one embodiment, in the etching step (S310), a base substrate (50) can be placed on the lower part of the conductor layer (131).

[0025] According to one embodiment, in the insulation injection step (S320), after the plurality of insulating holes (132) are formed in each designated portion of the conductor layer (131) and the base material (50) is removed, a first guard member (53) may be placed on the upper portion of the conductor layer (131) in which the plurality of insulating holes (132) are formed, and a second guard member (54) may be placed on the lower portion of the conductor layer (131) in which the plurality of insulating holes (132) are formed.

[0026] According to one embodiment, the first guard member (53) may have an injection port (53a) formed through it in the vertical direction to correspond to one of the plurality of insulating holes (132), and the second guard member (54) may have an exhaust port (54a) formed through it in the vertical direction to correspond to another of the plurality of insulating holes (132).

[0027] According to one embodiment, the second solution can be introduced into the interior of one of the insulating holes through the injection port (53a), and then spread toward the discharge port (54a) while filling the remaining insulating holes among the plurality of insulating holes (132).

[0028] According to one embodiment, in the insulation injection step (S320), after the plurality of insulating holes (132) are formed in each designated portion of the conductor layer (131), and the base material (50) is removed, a conductive film (55) can be placed on the lower portion of the conductor layer (131) in which the plurality of insulating holes (132) are formed.

[0029] According to one embodiment, a conductive pattern (131a) may be formed on the conductive film (55) to correspond to the position of each of the plurality of conductive parts (12).

[0030] According to the upper and lower conductive sheet manufacturing apparatus and manufacturing method for module testing according to the present invention,

[0031] First, the first screen printing unit (110) forms an insulating layer (111) having a plurality of conductive holes (112, 112b) formed on the upper part of the base substrate (50) by applying a first solution made of an electrically insulating material in a screen printing manner, thereby forming an insulating portion (11) of the upper and lower conductive sheet (10); the first curing unit (120) cures each insulating layer (111) formed by the first screen printing unit (110); the second screen printing unit (130) forms a conductive portion (12) of the upper and lower conductive sheet (10) by applying a second solution containing an electrically conductive material in a screen printing manner, thereby forming a conductive layer (131) at the internal position of each conductive hole (112, 112b); and the second curing unit (140) cures each conductive layer (131) formed by the second screen printing unit (130). By curing, no deformation or damage occurs to the terminal (21) during inspection of the memory module (20), and manufacturing is easy, which can significantly reduce manufacturing costs and manufacturing equipment unit costs, and enables mass production. In addition, in the case of the silk screen printing method, a fine-sized conductive part (12) can be formed inside the insulating part (11) with a tolerance of 5 / 1,000 mm (5 microns), so that an upper and lower conductive sheet that conforms to the fine pitch structure of a micro memory module can be manufactured.

[0032] Secondly, the first solution and the second solution are UV-curing liquid solutions in which the curing time is shortened by UV light, and the first curing unit (120) cures each insulating layer (111) formed by the first screen printing unit (110) by irradiating UV light, and the second curing unit (140) cures each conductive layer (131) formed by the third screen printing unit (150) by irradiating UV light, thereby significantly reducing the curing time compared to natural drying and further reducing the curing time compared to heat drying, and significantly reducing the defect rate due to thermal deformation.

[0033] Third, the third screen printing unit (150) forms a third member layer (151) on the upper surface of the base substrate (50) by applying a third solution made of an electrically insulating material in a screen printing manner, and forms a separation support part (13) on the bottom surface of the upper and lower conductive sheet (10); the third curing unit (160) cures the third member layer (151) formed by the third screen printing unit (150); the first screen printing unit (110) forms an insulator layer (111) by applying a first solution to the upper surface of the third member layer (151) formed by the third screen printing unit (150); and the second screen printing unit (130) forms a conductor layer (131) by applying a second solution to the upper surface of the third member layer (151) formed by the third screen printing unit (150), thereby manufacturing As the lower part of the upper and lower conductive sheet (10) hardens and adheres to the base material (50), it is possible to prevent damage or deformation to the upper and lower conductive sheet (10) during the process of separating it from the base material (50).

[0034] Fourth, the third solution is made of a material that has a relatively weaker strength than the insulating part (11) and the conductive part (12) when the separation support part (13) formed as it hardens is made of a material that has a relatively weaker strength than the upper and lower conductive sheet (10). When external pressure is applied to the upper and lower conductive sheet (10), the separation support part (13) with a relatively weaker strength breaks and can be separated from the base material (50), allowing the upper and lower conductive sheet (10) to be easily separated from the base material (50) and preventing damage or deformation to the upper and lower conductive sheet (10) during the separation process.

[0035] Fifth, the above third solution is made of a material that dissolves when the separation support part (13) formed during hardening is immersed in water or a specific solution. Since the separation support part (13) is dissolved and removed simply by immersing the base material (50) on which each upper and lower conductive sheet (10) is formed in water or a specific solution, there is no need to apply pressure to separate the upper and lower conductive sheets (10) from the base material (50), and accordingly, damage or deformation to the upper and lower conductive sheets (10) during the separation process can be fundamentally prevented.

[0036] Sixth, the third screen printing unit (150) forms a third member layer (151) on the upper side of the base substrate (50) by applying a third solution made of an electrically insulating material in a screen printing manner, thereby forming a separation edge portion (14) of the upper and lower conductive sheets (10). The third curing unit (160) cures the third member layer (151) formed by the third screen printing unit (150). This allows each upper and lower conductive sheet (10) to be arranged in a close-contact state when multiple upper and lower conductive sheets (10) are to be formed simultaneously on a single base substrate (50), thereby significantly increasing the quantity of upper and lower conductive sheets (10) manufactured simultaneously. Additionally, each upper and lower conductive sheet (10) can be separated by removing the separation edge portion (14), thus providing the advantage of an easy separation process.

[0037] Seventh, if the separation edge portion (14) formed as the third solution hardens is made of a material that is relatively weaker in strength than the insulating portion (11), applying external pressure to the upper and lower conductive sheets (10) causes the separation edge portion (14) that is relatively weaker in strength to break, allowing each upper and lower conductive sheet (10) to be easily separated, and preventing damage or deformation to the upper and lower conductive sheets (10) during the separation process. Additionally, if the third solution is made of a material that dissolves when the hardened separation edge portion (14) is immersed in water or a specific solution, the separation edge portion (14) dissolves and is removed simply by immersing the base material (50) on which each upper and lower conductive sheet (10) is formed in water or a specific solution. Therefore, there is no need to apply pressure to separate each upper and lower conductive sheet (10), and thus, damage or deformation to the upper and lower conductive sheets (10) during the separation process can be fundamentally prevented.

[0038] In addition to this, various effects that can be identified directly or indirectly through this document may be provided.

[0039] FIG. 1 is a side cross-sectional view showing a configuration in which upper and lower conductive sheets according to a preferred embodiment of the present invention are placed between a memory module and a test equipment.

[0040] FIG. 2 is a schematic diagram showing the configuration of an upper and lower conductive sheet manufacturing device for module testing according to various embodiments of the present invention.

[0041] FIG. 3 is a schematic diagram showing the configuration of an upper and lower conductive sheet manufacturing device for module testing according to various embodiments of the present invention.

[0042] FIG. 4 is a perspective view illustrating the screen printing method of each screen printing unit according to a preferred embodiment of the present invention.

[0043] FIG. 5 is a side view showing a state in which an insulating layer is formed on a base substrate according to various embodiments of the present invention.

[0044] FIG. 6 is a side view showing a state in which a conductive layer is formed on a base substrate according to various embodiments of the present invention.

[0045] FIG. 7 is a side view showing a state in which a conductive layer is formed on a base substrate according to various embodiments of the present invention.

[0046] FIG. 8 is a side view showing a state in which a conductive layer is formed on a base substrate according to various embodiments of the present invention.

[0047] FIG. 9 is a side view showing a state in which a conductive layer is formed on a base substrate according to various embodiments of the present invention.

[0048] FIG. 10 is a side view showing the state in which an insulator layer is stacked upward according to various embodiments of the present invention.

[0049] FIG. 11 is a side view showing the arrangement of a guard member according to various embodiments of the present invention.

[0050] FIG. 12 is a side view showing the arrangement of a guard member and a conductive film according to various embodiments of the present invention.

[0051] FIG. 13 is a side view showing the state in which conductive layers are stacked according to various embodiments of the present invention.

[0052] FIG. 14 is a side view showing the state in which an insulating layer is formed according to various embodiments of the present invention.

[0053] FIG. 15 is a side view showing the state in which an insulating layer is formed according to various embodiments of the present invention.

[0054] FIG. 16 is a side view showing the state in which an insulating layer is formed according to various embodiments of the present invention.

[0055] FIG. 17 is a side view showing the state in which an insulator layer and a conductor layer are stacked upward according to various embodiments of the present invention.

[0056] FIG. 18 is a side view showing a state in which a guard member is separated after an insulator layer is formed upward according to various embodiments of the present invention.

[0057] FIG. 19 is a side view showing a state in which a guard member is separated after an insulator layer is formed upward according to various embodiments of the present invention.

[0058] FIG. 20 is a side view showing the state in which an insulating part and a conductive part are formed according to various embodiments of the present invention.

[0059] FIG. 21 is a side view showing the state in which an insulating part and a conductive part are formed according to various embodiments of the present invention.

[0060] FIG. 22 is a side view showing the state in which an insulating part and a conductive part are formed according to various embodiments of the present invention.

[0061] FIG. 23 is a side view showing the upper and lower conductive sheets separated from the base substrate according to a preferred embodiment of the present invention.

[0062] FIG. 24 is a schematic diagram showing a configuration in which a third screen printing unit and a third curing unit are further provided in an upper and lower conductive sheet manufacturing device for module testing according to a preferred embodiment of the present invention.

[0063] FIG. 25 is a side view showing a state in which a third member layer is laminated onto a base substrate according to a preferred embodiment of the present invention to form a support for separation.

[0064] FIG. 26 is a side view showing a state in which an insulating layer is formed on the upper part of a third member layer according to a preferred embodiment of the present invention.

[0065] FIG. 27 is a side view showing a state in which a conductive layer is formed on the upper part of a third member layer according to a preferred embodiment of the present invention.

[0066] FIG. 28 is a side view showing the state in which an insulating layer and a conductive layer are stacked upward according to a preferred embodiment of the present invention to form an insulating portion and a conductive portion.

[0067] FIG. 29 is a side view showing the state in which the upper and lower conductive sheets are separated from the base material through a separating support member according to a preferred embodiment of the present invention.

[0068] FIG. 30 is a plan view showing a state in which a plurality of upper and lower conductive sheets are in close contact and manufactured simultaneously according to a preferred embodiment of the present invention.

[0069] FIG. 31 is a plan view showing the state in which each upper and lower conductive sheet is separated from each other as the separation edge portion is removed according to a preferred embodiment of the present invention.

[0070] FIG. 32 is a side view showing a state in which a third member layer is laminated onto a base substrate according to a preferred embodiment of the present invention to form a border portion.

[0071] FIG. 33 is a side view showing a state in which an insulating layer is formed on a base substrate according to a preferred embodiment of the present invention.

[0072] FIG. 34 is a side view showing a state in which a conductive layer is formed on a base substrate according to a preferred embodiment of the present invention.

[0073] FIG. 35 is a side view showing a state in which an insulating layer, a conductive layer, and a third member layer are laminated according to a preferred embodiment of the present invention, thereby forming an insulating portion, a conductive portion, and a border portion, respectively.

[0074] FIG. 36 is a side view showing the state in which each upper and lower conductive sheet is separated from each other as the rim portion is removed according to a preferred embodiment of the present invention.

[0075] FIG. 37 is a flowchart showing each step of a method for manufacturing an upper and lower conductive sheet for module testing according to various embodiments of the present invention.

[0076] FIG. 38 is a flowchart showing each step of a method for manufacturing an upper and lower conductive sheet for module testing according to various embodiments of the present invention.

[0077] In relation to the description of the drawing, the same reference number may be assigned to identical or corresponding components.

[0078]

[0079] Preferred embodiments according to the present invention will be described in detail below with reference to the attached drawings. Prior to this, terms and words used in this specification and claims should not be interpreted as being limited to their ordinary or dictionary meanings. Instead, based on the principle that the inventor may appropriately define the concepts of terms to best describe his invention, they should be interpreted in a meaning and concept consistent with the technical spirit of the present invention.

[0080] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings are merely the most preferred embodiments of the present invention and do not represent all of the technical ideas of the present invention; thus, it should be understood that various equivalents and modifications that can replace them may exist at the time of filing this application.

[0081] First, the configuration and function of the upper and lower conductive sheet manufacturing device for module testing according to a preferred embodiment of the present invention will be described. The upper and lower conductive sheet manufacturing device for module testing according to a preferred embodiment of the present invention may be a manufacturing device for manufacturing an upper and lower conductive sheet (10) in which a plurality of conductive parts (12) are arranged upright inside an insulating part (11) as shown in FIG. 1 and are positioned between a memory module (20) and a test equipment (30) to electrically connect a terminal (21) of the memory module (20) and a terminal (31) of the test equipment (30).

[0082] FIG. 2 is a schematic diagram showing the configuration of an upper and lower conductive sheet manufacturing device for module testing according to various embodiments of the present invention.

[0083] According to one embodiment, the upper and lower conductive sheet manufacturing device for module testing may include a first screen printing unit (110), a first curing unit (120), a second screen printing unit (130), and a second curing unit (140). Here, the terminal (31) of the test equipment (30) may be a terminal of a test socket or a terminal of a test board on which the test socket is mounted.

[0084] First, the first screen printing unit (110) is a device for forming an insulating layer (111) for manufacturing an insulating part (11) of an upper and lower conductive sheet (10). By applying a first solution made of an electrically insulating material in a screen printing manner, an insulating layer (111) having a plurality of conductive holes (112a, 112b) is formed and laminated on the upper surface of a base substrate (50) with a predetermined thickness (e.g., 5 μm to 10 μm), thereby forming the insulating part (11) of the upper and lower conductive sheet (10). Here, the first solution may be polyethylene, silicone, acrylic, or polyurethane, and in addition, various materials capable of maintaining an insulating state upon curing in the technical field to which the present invention belongs may be used.

[0085] Additionally, the second screen printing unit (130) and the third screen printing unit (150), which are described later and include the first screen printing unit (110), form each layer (111, 131, 151) by a screen printing method. As shown in FIG. 4, each screen printing unit (110, 130, 150) may include a printing mesh (171) made of mesh so that each solution can penetrate, which is positioned at the upper position of the base substrate (50); a mask (172) which is positioned on the printing mesh (171) and has a mask hole (173) formed vertically open at a position corresponding to each layer (111, 131, 151); and a squeegee (174) which applies pressure so that each solution injected onto the mask (172) is applied thinly and evenly.

[0086] For example, when a mask (172) with a shape corresponding to the insulating layer (111) to be formed is placed on the upper surface of the base substrate (50) together with a printing mesh (171), a first solution is injected at one side and the injected first solution is pressed at the other side using a squeegee (174), the first solution that has penetrated the printing mesh (171) can be applied through the mask hole (173) to a set position on the base substrate (50), that is, a position where the insulating layer (111) is to be placed, and when the mask (172) and the printing mesh (171) are removed from the base substrate (50), an insulating layer (111) with a plurality of conductive holes (112a, 112b) formed can be formed on the upper surface of the base substrate (50) as shown in FIG. 5.

[0087] The first curing unit (120) above cures each insulating layer (111) formed by the first screen printing unit (110). Here, as shown in FIG. 2, the base substrate (50) can be moved from the location where the first screen printing unit (110) is placed to the location where the first curing unit (120) is placed while being transported by a transport means (190) such as a conveyor. Alternatively, the base substrate (50) may be fixedly placed and the first screen printing unit (110) and the first curing unit (120) may sequentially move to the location where the base substrate (50) is placed.

[0088] Additionally, the first curing unit (120) may apply heat or hot air to dry the insulating layer (111) faster than natural drying, and if the first solution is a UV-curing liquid solution in which the curing time is shortened by UV light, it is preferable for the first curing unit (120) to cure each insulating layer (111) formed by the first screen printing unit (110) by irradiating UV light.

[0089] The second screen printing unit (130) is a device for forming a conductive layer (131) for manufacturing a conductive portion (12) of an upper and lower conductive sheet (10). As shown in FIG. 7, a second solution containing an electrically conductive material is applied by a screen printing method to form a conductive layer (131) at an internal position of each conductive hole (112a, 112b) with a predetermined thickness (e.g., 5 μm to 10 μm), thereby forming the conductive portion (12) of the upper and lower conductive sheet (10). Here, the second solution may be formed in a form in which an electrically conductive powder (powder) is contained in a base resin, and various conductive powders such as copper powder, silver powder, silver-coated copper powder, nickel-coated copper powder, silver-coated nickel powder, and metal-coated polymer powder may be used as the powder component, and it is preferable that the concentration of the electrically conductive powder be such that electricity can be conducted through the upper and lower portions exposed above and below the insulating portion (11) when the base resin is cured, that is, when the laminated conductive layer (131) is cured and formed into a conductive portion (12).

[0090] In addition, it is preferable that the thickness of the conductive layer (131) formed by the second screen printing unit (130) corresponds to the thickness of the insulating layer (111) formed by the first screen printing unit (110).

[0091] In addition, the second screen printing unit (130) can be used in the same way as the printing method of the first screen printing unit (110) described above, by placing a mask (172) corresponding to the conductive layer (131) together with a printing mesh (171) on the upper surface of the base substrate (50), injecting a second solution at one side, and laterally pressurizing the injected second solution at the other side with a squeegee (174), so that the second solution penetrating the printing mesh (171) can be applied through the mask hole (173) to a set position on the base substrate (50), that is, a position where the conductive layer (131) is to be placed, and by removing the mask (172) and the printing mesh (171) from the base substrate (50), the conductive layer (131) can be formed on the upper surface of the base substrate (50) as shown in FIG. 7.

[0092] The second curing unit (140) above cures each conductive layer (131) formed by the second screen printing unit (130). Here, as shown in FIG. 2, the base substrate (50) on which the conductive layer (131) is formed can be moved from the location where the second screen printing unit (130) is placed to the location where the second curing unit (140) is placed while being transported by a transport means (190) such as a conveyor, or alternatively, the base substrate (50) may be fixedly placed and the second screen printing unit (130) and the second curing unit (140) may sequentially move to the location where the base substrate (50) is placed.

[0093] Additionally, the second curing unit (140) may apply heat or hot air to dry the conductive layer (131) faster than natural drying, and if the second solution is a UV-curing liquid solution in which the curing time is shortened by UV light, it is preferable for the second curing unit (140) to cure each conductive layer (131) formed by the second screen printing unit (130) by irradiating UV light.

[0094] FIG. 3 is a schematic diagram showing the configuration of an upper and lower conductive sheet manufacturing device for module testing according to various embodiments of the present invention.

[0095] According to one embodiment, the upper and lower conductive sheet manufacturing device for module testing may include an etching section (115), an insulation injection section (125), and a curing section (180).

[0096] According to one embodiment, the etching unit (115) is a device for forming insulating holes (132) in the conductive layer (131) of the upper and lower conductive sheet (10), and forms a plurality of conductive parts (12) of the upper and lower conductive sheet (10) by forming a plurality of insulating holes (132) that are at least partially penetrated in the upper and lower directions at designated parts of the conductive layer (131) made of an electrically conductive material corresponding to the first solution. Here, the method of forming the plurality of insulating holes (132) may include, for example, etching treatment using a laser. The first solution above may be formed in a form in which an electrically conductive powder (powder) is contained in a base resin, and various conductive powders such as copper powder, silver powder, silver-coated copper powder, nickel-coated copper powder, silver-coated nickel powder, and metal-coated polymer powder may be used as the powder component. It is preferable that the concentration of the electrically conductive powder be such that electricity can be conducted through the upper and lower portions exposed above and below the insulating portion (11) when the base resin is cured, that is, when the conductive layer (131) is cured and formed into a conductive portion (12).

[0097] According to one embodiment, the insulation injection unit (125) is a device for forming an insulating layer (111) for manufacturing an insulating part (11) of an upper and lower conductive sheet (10). By using an underfill injection process, a second solution containing an electrically insulating material is diffused into each of the plurality of insulating holes (132) of the conductive layer (131), thereby forming an insulating layer (111) and forming an insulating part (11) of the upper and lower conductive sheet (10). Accordingly, in the upper and lower conductive sheet (10), the insulating part (11) is cured together with the conductive part (12) to form an integrated structure with the conductive part (12), but can be electrically separated from the conductive part (12). The second solution may be polyethylene, silicone, acrylic, or polyurethane, and various other materials that maintain an insulating state upon curing may be used in the technical field to which the present invention belongs.

[0098] According to one embodiment, the curing section (180) cures the insulating layer (111) formed by the insulating injection section (125) between the plurality of conductive sections (12). Here, as shown in FIG. 3, the base material (50) can be moved by a conveying means (190), such as a conveyor, from the location where the etching section (115) is located, through the location where the insulating injection section (125) is located, to the location where the curing section (180) is located. Alternatively, the base material (50) may be fixedly positioned, and the insulating injection section (125) and the curing section (180) may be moved sequentially to the location where the base material (50) is located.

[0099] Additionally, the curing unit (180) may apply heat or hot air to dry the insulating layer (111) faster than natural drying, and if the first solution and / or the second solution is a UV-curing liquid solution in which the curing time is shortened by UV light, it is preferable for the curing unit (180) to cure by irradiating UV light toward the insulating layer (111) formed by the insulating injection unit (125).

[0100] According to one embodiment, each of the first screen printing unit (110), the etching unit (115), the first curing unit (120), the insulation injection unit (125), the second screen printing unit (130), the second curing unit (140), and the curing unit (180) may be operated under the control of a control unit (not shown). For example, the control unit may form an insulator layer (111) using the first screen printing unit (110) and the first curing unit (120), and form a conductor layer (131) using the second screen printing unit (130) and the second curing unit (140). The control unit can control the stacking operation of the insulator layer (111) using the first screen printing unit (110) and the first curing unit (120), and the stacking operation of the conductor layer (131) using the second screen printing unit (130) and the second curing unit (140), respectively, to be repeated alternately.

[0101] According to one embodiment, the control unit receives commands or instructions from memory and controls each component according to the received commands or instructions to perform various functions. The control unit may be implemented as a central processing unit (CPU), a micro control unit (MCU), a micro processor unit (MPU), etc.

[0102] In addition, the drawing illustrates that in the manufacturing process, an insulating layer (111) is first formed on the base substrate (50) through the first screen printing unit (110) and a conductive layer (131) is formed on the base substrate (50) on which the insulating layer (111) is formed through the second screen printing unit (130) positioned at the rear end, but this is not limited thereto. The first screen printing unit (110) may be positioned at the front end of the manufacturing process to first form a conductive layer (131) on the base substrate (50), and the second screen printing unit (130) may be positioned at the rear end to form an insulating layer (111) on the base substrate (50) on which the conductive layer (131) is formed.

[0103] However, in the manufacturing process, the first curing section (120) is positioned immediately after the first screen printing section (110) and the second curing section (140) is positioned immediately after the second screen printing section (130), so that the next layer is formed on the base material (50) while the layer formed first on the base material (50) is cured.

[0104] Then, when an insulating layer (111) and a conductive layer (131) are formed on the base substrate (50) through the first screen printing unit (110) and the second screen printing unit (130), as shown in FIG. 10, the insulating layer (111) is laminated on the upper surface of the insulating layer (111) formed on the base substrate (50) using the first screen printing unit (110) through the screen printing method described above, and as shown in FIG. 13, the conductive layer (131) is laminated on the upper surface of the conductive layer (131) formed on the base substrate (50) using the second screen printing unit (130).

[0105] In addition, the screen printing method described above is repeated by using the first screen printing unit (110) and the second screen printing unit (130) to form an insulating portion (11) of the upper and lower conductive sheet (10) by stacking a plurality of insulating layers (111) upward to a set height (e.g., 0.5 to 1.0 mm) as shown in FIGS. 17 to 22, and to form a conductive portion (12) of the upper and lower conductive sheet (10) by stacking a plurality of conductive layers (131) upward. Accordingly, as shown in FIG. 22, an upper and lower conductive sheet (10) may be manufactured in a form where a portion of the base substrate (50) is etched, or as shown in FIG. 23, the upper and lower conductive sheet (10) may be separated from the base substrate (50) and used as an upper and lower conductive sheet for connecting each terminal (21, 31) vertically between the memory module (20) and the test equipment (30).

[0106] Through the combined configuration of the first screen printing unit (110), the first curing unit (120), the second screen printing unit (130), and the second curing unit (140) as described above, no deformation or damage occurs to the terminal (21) during inspection of the memory module (20), and manufacturing is easy, which can significantly reduce manufacturing costs and manufacturing equipment unit costs, and enables mass production. In addition, in the case of the silk screen printing method, a fine-sized conductive part (12) can be formed inside the insulating part (11) with an allowable error of 5 / 1,000 mm (5 microns), so that an upper and lower conductive sheet that conforms to the fine pitch structure of a micro-sized memory module can be manufactured.

[0107] In addition, the first solution and the second solution are UV-curing liquid solutions in which the curing time is shortened by UV light, and the first curing unit (120) cures each insulating layer (111) formed by the first screen printing unit (110) by irradiating UV light, and the second curing unit (140) cures each conductive layer (131) formed by the third screen printing unit (150) by irradiating UV light, thereby significantly reducing the curing time compared to natural drying and further reducing the curing time compared to heat drying, and significantly reducing the defect rate due to thermal deformation.

[0108] Hereinafter, the shapes of the insulating part (11) and the conductive part (12) of the upper and lower conductive sheet (10) for testing a memory module according to various embodiments of the present invention will be described in detail with reference to each of FIGS. 5 to 22.

[0109] Referring to FIG. 5, a plurality of insulating layers (111) may be laminated on the upper surface (51) of the base substrate (50). For example, a plurality of first conductive holes (112a) may be formed on the upper surface (51) of the base substrate (50), and a plurality of insulating layers (111) may be laminated on the remaining area excluding the area where the first conductive holes (112a) are formed.

[0110] Referring to FIG. 6, a conductive layer (131) may be disposed on the upper surface (51) of the base substrate (50). For example, a conductive layer (131) having a specified length may be formed with a constant thickness on the upper surface (51) of the base substrate (50).

[0111] Referring to FIG. 7, according to the structure of the first conductor hole (112a), one insulating layer (111) and two conductive layers (112) may be laminated on the upper surface (51) of the base material (50).

[0112] Referring to FIG. 8, a plurality of insulating holes (132) penetrating in the vertical direction may be formed in each designated portion of a single conductive layer (131). For example, a plurality of insulating holes (132) may be formed at designated intervals in a single conductive layer (131).

[0113] Referring to FIG. 9, a plurality of insulating holes (132) partially penetrating in the up and down direction may be formed in each designated portion of a single conductive layer (131). For example, a plurality of insulating holes (132) penetrating in the form of a minimum slit to separate a plurality of conductive portions (12) at designated intervals may be formed in a single conductive layer (131).

[0114] Referring to FIG. 10, in the stacked state shown in FIG. 7, as one more insulating layer (111) is stacked, a second conductive hole (112b) may be formed between the one more stacked insulating layer (111).

[0115] Referring to FIG. 11, in the stacked state illustrated in FIG. 8 (or 9), as the base member (50) is removed, a first guard member (53) may be disposed on the upper side of a conductive layer (131) having a plurality of insulating holes (132) formed therein, and a second guard member (54) may be disposed on the lower side of a conductive layer (131) having a plurality of insulating holes (132) formed therein.

[0116] Referring to FIG. 12, in the stacked state illustrated in FIG. 8 (or FIG. 9), as the base member (50) is removed, a first guard member (53) may be disposed on the upper side of a conductive layer (131) having a plurality of insulating holes (132) formed therein, and a conductive film (55) may be disposed on the lower side of a conductive layer (131) having a plurality of insulating holes (132). Here, the first guard member (53) may support the conductive layer (131) when the base member (50) is removed. Accordingly, the conductive film (55) may be stably disposed on the lower side of the conductive layer (131). In one embodiment, the conductive film (55) may be an anisotropic conductive film (ACF) using conductive ink. For example, the conductive film (55) may be a conductive film having electrical conductivity only in a specific direction (e.g., the Z-axis direction). The material of the conductive film (55) may include metal nanoparticles (e.g., silver, copper, gold, etc.) and insulating polymers (e.g., epoxy, acrylic, etc.). The metal nanoparticles are responsible for electrical conduction in the conductive pattern (e.g., the conductive pattern (131a) of FIG. 16), and the insulating polymer is responsible for maintaining the physical structure and electrical short circuit in the insulating pattern (e.g., the insulating pattern (111a) of FIG. 16).

[0117] Referring to FIG. 13, according to the structure of the second conductor hole (112b), two insulating layers (111) and three conductive layers (112) may be stacked on the upper surface (51) of the base material (50).

[0118] Referring to FIGS. 14 and 15, an insulating layer (111) can be laminated in each of the plurality of insulating holes (132) formed on the conductor layer (131) using an underfill injection process. For example, after a second solution is introduced into one of the plurality of insulating holes (132) through the injection port (53a) of the first guard member (53), the second solution can be diffused into another insulating hole among the plurality of insulating holes (132). From the introduction to the diffusion, the second solution can fill the remaining insulating holes among the plurality of insulating holes (132) and diffuse toward the discharge port (54a) of the second guard member (54). In one embodiment, the injection port (53a) can penetrate the first guard member (53) in the vertical direction so as to correspond to one of the plurality of insulating holes (132). In one embodiment, the outlet (54a) may penetrate the second guard member (54) in the vertical direction so as to correspond to another insulator hole among the plurality of insulator holes (132). For the diffusion of the second solution, it is preferable that the inlet (53a) and the outlet (54a) be located diagonally opposite each other when viewed from above.

[0119] Referring to FIG. 16, an insulating layer (111) can be formed in each of a plurality of insulating holes (132) formed on a conductive layer (131) using at least one of a screen printing method, an injection method, and a dispensing method. For example, after the first guard member (53) placed on the upper part of the conductive layer (131) is removed, an insulating layer (111) having a predetermined thickness (e.g., 5 μm to 10 μm) can be formed by injecting a second solution into each of the plurality of insulating holes (132) using a dispensing method. Here, it is preferable that the second solution be injected into each of the plurality of insulating holes (132) within a specified time before the insulating layer (111) hardens.

[0120] Referring to FIG. 16, a conductive film (55) having an insulating pattern (111a) and a conductive pattern (131a) may be disposed on the lower portion of a conductive layer (131). The insulating pattern (111a) may have a designated pattern (e.g., a grid pattern) corresponding to the location of each of a plurality of insulating holes (132). The conductive pattern (131a) may have a designated pattern (e.g., a grid pattern) corresponding to the location of each of a plurality of conductive parts (e.g., the conductive part (12) of FIG. 18). The grid pattern of the conductive pattern (131a) is surrounded by the grid pattern of the insulating pattern (111a), and may provide physically separated conductivity for each of the plurality of conductive parts (12). Accordingly, each of the plurality of conductive parts (12) can be electrically connected to the terminal (31) of the test equipment (30) (or the terminal (21) of the memory module (20)) through the conductive pattern (131a).

[0121] Referring to FIG. 17, based on the structure of the first conductive hole (112a) and the second conductive hole (112b), a plurality of insulating parts (11) and a plurality of conductive parts (12) can each be laminated on the upper surface (51) of the base substrate (50). Here, the second conductive hole (112b) can be continuously formed according to the lamination of the plurality of insulating layers (111).

[0122] Referring to FIGS. 18 and 19, based on the fact that an insulating layer (111) is filled through injection and diffusion into each of the plurality of insulating holes (132) formed in the conductive layer (131), a plurality of insulating parts (11) can be formed between the plurality of conductive parts (12) with a height corresponding to the height of the plurality of conductive parts (12). Here, between the plurality of insulating parts (11), a plurality of conductive parts (12) can protrude upward from the plurality of insulating parts (11). The shape of the protruding parts may have a curvature specified to correspond to the shape of the terminal (21) of the memory module (20).

[0123] Referring to FIG. 20, a portion of the base substrate (50) may be etched. For example, in the base substrate (50), an area including both the area corresponding to three conductive portions (12) and the area corresponding to two insulating portions (11) placed between the three conductive portions (12) may be etched once by a first thickness (T1) to correspond to the protruding structure (22) of the memory module (20). In one embodiment, an opening (51) may be formed in the base substrate (50) according to the etching process. The opening (51) may have a first width (W1). In one embodiment, the conductive portion (12) may be exposed through the opening (51) in the direction where the terminal (21) is located. In one embodiment, the protruding structure (22) including the terminal (21) may have a second width (W2) corresponding to a first width (W1). Additionally, the protruding structure (22) may have a second thickness (T2) corresponding to a first thickness (T1). In one embodiment, when the protruding structure (22) comes into contact with the insulating part (11) and the conductive part (12) through the opening (51) of the base material (50), shaking may be minimized by the shape of the base material (50) located around the opening (51).

[0124] Referring to FIG. 21, a portion of the base substrate (50) may be etched. For example, in the base substrate (50), an area including both the area corresponding to three conductive portions (12) and the area corresponding to two insulating portions (11) placed between the three conductive portions (12) may be etched once by a first thickness (T1) and then etched once more by a thickness smaller than the first thickness (T1) so as to correspond to the protruding structure (22) of the memory module (20). In one embodiment, an opening (51) may be formed in the base substrate (50) according to the etching process. The opening (51) may have a first width (W1) and a third width (W3). The first width (W1) may be the width of the area etched by the first thickness (T1). The third width (W3) may be the width of an area that is etched one more time with a thickness smaller than the first thickness (T1) relative to the area etched by the first thickness (T1). In one embodiment, the conductive portion (12) may be exposed through the opening (51) in the direction where the terminal (21) is located. In one embodiment, the protruding structure (22) including the terminal (21) may have a second width (W2) corresponding to the first width (W1) and a fourth width (W4) corresponding to the third width (W3), respectively. Additionally, the protruding structure (22) may have a second thickness (T2) corresponding to the first thickness (T1). In one embodiment, when the protruding structure (22) comes into contact with the insulating part (11) and the conductive part (12) through the opening (51) of the base material (50), shaking can be minimized by the stepped shape of the base material (50) located around the opening (51).

[0125] Referring to FIG. 22, a portion of the base substrate (50) may be etched. For example, in the base substrate (50), each of the regions corresponding to the three conductive portions (12) may be etched once by a first thickness (T1) so as to correspond to the protruding structure (22) of the memory module (20). In one embodiment, according to the etching process, a plurality (e.g., three) of openings (51) may be formed in the base substrate (50). The openings (51) may have a fifth width (W5). In one embodiment, each of the conductive portions (12) may be exposed in the direction where the terminal (21) is located through each of the plurality of openings (51). In one embodiment, each of the protruding structure (22) including the plurality (e.g., three) of terminals (21) may have a sixth width (W6) corresponding to the fifth width (W5). In one embodiment, when each of the protruding structures (22) comes into contact with the insulating part (11) and the conductive part (12) through the opening (51) of the base material (50), shaking can be minimized by the shape of the base material (50) located around the opening (51).

[0126] According to various embodiments, the base material (50) may include at least one of natural resin, synthetic resin, stainless steel (e.g., stainless steel corresponding to SUS or STS depending on the steel grade), or metal.

[0127] According to various embodiments, the memory module (20) having the above-described protruding structure (22) may be, for example, a display module or camera module having a plurality of connector pins formed on a flexible printed circuit board (FPCB).

[0128] As described above, the upper and lower conductive sheet manufacturing device for module testing according to various embodiments of the present invention can manufacture upper and lower conductive sheets (10) for module testing of different shapes based on a structure formed on the upper surface (51) of a base substrate (50). In various embodiments, the shape of the protruding parts may have a curvature designated to correspond to the shape of the terminal (21) of the memory module (20). In various embodiments, an elastic material may be disposed inside the insulating part (11) and / or the conductive part (12).

[0129] Meanwhile, as illustrated in FIG. 24, the upper and lower conductive sheet manufacturing device for module testing according to a preferred embodiment of the present invention can easily separate the upper and lower conductive sheet (10) manufactured by forming a separation support part (13) on the bottom surface of the upper and lower conductive sheet (10) using a third screen printing part (150) and a third curing part (160).

[0130] To this end, as illustrated in FIG. 25, the third screen printing unit (150) forms a third member layer (151) by applying a third solution made of an electrically insulating material in a screen printing manner, thereby forming a laminated layer with a predetermined thickness (e.g., 5 μm to 10 μm) on the upper surface of the base substrate (50), and forms a separation support unit (13) on the bottom surface of the upper and lower conductive sheet (10).

[0131] Here, the thickness of the third member layer (151) formed by the third screen printing unit (150) can be appropriately adjusted according to the process or method of separating the manufactured upper and lower conductive sheet (10) from the base substrate (50).

[0132] In addition, the third screen printing unit (150) can be used in the same way as the printing method of the first screen printing unit (110) and the second screen printing unit (130) described above, by placing a mask (172) corresponding to the third member layer (151) together with a printing mesh (171) on the upper surface of the base substrate (50), injecting the third solution at one side, and laterally pressurizing the injected third solution at the other side with a squeegee (174), so that the third solution penetrating the printing mesh (171) can be applied through the mask hole (173) to a set position on the base substrate (50), that is, a position where the third member layer (151) is to be placed, and by removing the mask (172) and the printing mesh (171) from the base substrate (50), the third member layer (151) can be formed on the upper surface of the base substrate (50) as shown in FIG. 25.

[0133] In addition, the third curing unit (160) cures the third member layer (151) formed by the third screen printing unit (150), and as shown in FIG. 26, the first screen printing unit (110) applies a first solution to the upper surface of the third member layer (151) formed by the third screen printing unit (150) to form an insulating layer (111), and as shown in FIG. 27, the second screen printing unit (130) applies a second solution to the upper surface of the third member layer (151) formed by the third screen printing unit (150) to form a conductive layer (131).

[0134] Accordingly, as shown in FIG. 28, the third member layer (151) is formed laminated on the upper surface of the base substrate (50) and a separation support portion (13) can be formed on the bottom surface of the upper and lower conductive sheet (10). By separating the separation support portion (13), the upper and lower conductive sheet (10) can be easily separated from the base substrate (50) as shown in FIG. 29. This prevents damage or deformation to the upper and lower conductive sheet (10) during the process of separating it from the base substrate (50) as the bottom portion of the manufactured upper and lower conductive sheet (10) hardens and adheres to the base substrate (50).

[0135] In addition, the third solution is made of a material that has a relatively weaker strength than the insulating part (11) and the conductive part (12) when the separation support part (13) formed as it hardens is made of a material that has a relatively weaker strength than the upper and lower conductive sheet (10). When external pressure is applied to the upper and lower conductive sheet (10), the separation support part (13) with a relatively weaker strength breaks and can be separated from the base material (50), allowing the upper and lower conductive sheet (10) to be easily separated from the base material (50) and preventing damage or deformation to the upper and lower conductive sheet (10) during the separation process.

[0136] In addition, the third solution may be made of a material that dissolves when the separation support part (13), formed as it hardens, is immersed in water or a specific solution. For example, if the third solution contains polyethylene or silicone components, when the upper and lower conductive sheet (10) and the base substrate (50), on which the separation support part (13) is formed at the bottom, are immersed in acetone, the polyethylene or silicone components contained in the separation support part (13) dissolve in the acetone, allowing the upper and lower conductive sheet (10) to be easily separated from the base substrate (50).

[0137] Polyethylene and silicon are exemplified as components contained in the third solution above, and acetone is exemplified as a solvent component for dissolving them, but it is not limited thereto, and various solvents capable of dissolving a specific solute (separation support part (13)) in the field of chemical technology may be used.

[0138] In this way, since the separation support part (13) is dissolved and removed simply by immersing the base material (50) on which each upper and lower conductive sheet (10) is formed in water or a specific solution (solvent), there is no need to apply pressure to separate the upper and lower conductive sheets (10) from the base material (50), and accordingly, damage or deformation to the upper and lower conductive sheets (10) during the separation process can be fundamentally prevented.

[0139] Meanwhile, considering the productivity and manufacturing cost of the upper and lower conductive sheets, it is desirable to increase the number of upper and lower conductive sheets (10) that can be manufactured simultaneously. In a preferred embodiment of the present invention, the upper and lower conductive sheet manufacturing device for module testing can manufacture multiple upper and lower conductive sheets (10) simultaneously as shown in FIG. 30 by using at least some components of the first screen printing unit (110), the first curing unit (120), the second screen printing unit (130), and the second curing unit (140). Additionally, by using the third screen printing unit (150) and the third curing unit (160) to form a separation edge (14) around the side perimeter of the upper and lower conductive sheets (10), each upper and lower conductive sheet (10) manufactured simultaneously in multiple numbers can be easily separated as shown in FIG. 31.

[0140] To this end, as shown in FIG. 32, the third screen printing unit (150) applies a third solution made of an electrically insulating material by a screen printing method (or a dispensing method) to form a third member layer (151) laminated on the upper part of the base substrate (50) around the lateral perimeter of the upper and lower conductive sheet (10), thereby forming a separation edge portion (14, see FIG. 35) of the upper and lower conductive sheet (10).

[0141] The third curing unit (160) cures the third member layer (151) formed by the third screen printing unit (150).

[0142] Additionally, as shown in FIG. 33, the first screen printing unit (110) is formed so that an insulating layer (111) is placed in an internal position of the third member layer (151), and as shown in FIG. 34, the second screen printing unit (130) is formed so that a conductive layer (131) is placed in an internal position of the conductive holes (112a, 112b) of the insulating layer (111). The first curing unit (120) and the second curing unit (140) each cure the respective layers (111, 131).

[0143] By repeating the process of sequentially forming the third member layer (151), the insulator layer (111), and the conductor layer (131) multiple times, as shown in FIG. 35, a plurality of upper and lower conductive sheets (10) can be simultaneously manufactured in which a plurality of conductive parts (12) are vertically arranged inside the insulating part (11) and a separating edge part (14) is vertically arranged around the lateral perimeter of the insulating part (11) and the conductive part (12).

[0144] Therefore, when multiple upper and lower conductive sheets (10) are to be formed simultaneously on a single base material (50), each upper and lower conductive sheet (10) can be arranged in a state of close contact, thereby greatly increasing the quantity of upper and lower conductive sheets (10) manufactured simultaneously, and each upper and lower conductive sheet (10) can be separated by removing the separation edge portion (14) as shown in FIG. 36, thus making the separation process easier.

[0145] In addition, when the separation rim portion (14) formed as the third solution hardens is made of a material that is relatively weaker in strength than the insulating portion (11), when external pressure is applied to the upper and lower conductive sheets (10), the separation rim portion (14) that is relatively weaker in strength breaks, allowing each upper and lower conductive sheet (10) to be easily separated, and preventing damage or deformation to the upper and lower conductive sheets (10) during the separation process.

[0146] In addition, if the third solution is made of a material that dissolves when the hardened separation edge portion (14) is immersed in water or a specific solution, the separation edge portion (14) is dissolved and removed as shown in FIG. 36 simply by immersing the base substrate (50) on which each upper and lower conductive sheet (10) is formed in water or a specific solution, so there is no need to apply pressure to separate each upper and lower conductive sheet (10), and accordingly, damage or deformation to the upper and lower conductive sheets (10) during the separation process can be fundamentally prevented.

[0147] FIG. 37 is a flowchart showing each step of a method for manufacturing an upper and lower conductive sheet for module testing according to various embodiments of the present invention.

[0148] The above method for manufacturing an upper and lower conductive sheet for module testing is a method for manufacturing an upper and lower conductive sheet (10) in which a plurality of conductive parts (12) are arranged upright inside an insulating part (11) and are arranged between a memory module (20) and a test equipment (30) to electrically connect a terminal (21) of the memory module (20) and a terminal (31) of the test equipment (30), and as shown in FIG. 37, it includes a first screen printing step (S210), a first curing step (S220), a second screen printing step (S230), and a second curing step (S240).

[0149] First, the first screen printing step (S210) forms an insulating layer (111) having a plurality of conductive holes (112a, 112b) formed on the upper part of the base substrate (50) by applying a first solution made of an electrically insulating material using the first screen printing unit (110) described above in a screen printing manner, as shown in FIG. 5.

[0150] The first curing step (S220) above uses the first curing unit (120) described above to cure the insulator layer (111) formed through the first screen printing step (S210) by irradiating it with UV light.

[0151] The second screen printing step (S230) described above forms a conductive layer (131) at the internal position of each conductive hole (112a, 112b) on the base substrate (50) as shown in FIG. 7 by applying a second solution containing an electrically conductive material in a screen printing manner using the second screen printing unit (130) described above.

[0152] The second curing step (S240) above uses the second curing unit (140) described above to cure the conductive layer (131) formed through the second screen printing step (S230) by irradiating it with UV light.

[0153] In addition, as illustrated in FIGS. 10, 13 and 17, the first screen printing step (S210), the first curing step (S220), the second screen printing step (S230), and the second curing step (S240) are sequentially repeated so that each insulating layer (111) is stacked to form the insulating portion (11) of the upper and lower conductive sheet (10), and the conductive layer (131) is stacked to form the conductive portion (12) of the upper and lower conductive sheet (10).

[0154] Here, the drawing illustrates that the first screen printing step (S210) and the first curing step (S220) are performed first, followed by the second screen printing step (S230) and the second curing step (S240), but this is not limited thereto, and the second curing step (S240) and the second curing step (S240) may be performed first, followed by the first screen printing step (S210) and the first curing step (S220).

[0155] In addition, the method for manufacturing an upper and lower conductive sheet for module testing according to a preferred embodiment of the present invention can easily separate the upper and lower conductive sheet (10) from the base substrate (50) through a third screen printing step (S250) and a third curing step (S260).

[0156] To this end, the third screen printing step (S250) applies a third solution made of an electrically insulating material by a screen printing method to form a third member layer (151) laminated on the upper surface of the base substrate (50), and forms a separation support part (13) on the bottom surface of the upper and lower conductive sheet (10), and the third curing step (S260) cures the third member layer (151) formed through the third screen printing step (S250) by irradiating it with UV light.

[0157] Additionally, the first screen printing step (S210) forms each insulating layer (111) by applying a first solution to the upper surface of the third member layer (151) formed through the third screen printing step (S250) and stacking each insulating layer (111) upward, and the second screen printing step (S230) forms each conductive layer (131) by applying a second solution to the upper surface of the third member layer (151) formed through the third screen printing step (S250).

[0158] Here, the third solution may be made of a material in which the separating support part (13) formed as it hardens is relatively weaker than the insulating part (11) and the conductive part (12), or may be made of a material in which the separating support part (13) formed as it hardens dissolves when immersed in water or a specific solution.

[0159] In addition, the method for manufacturing upper and lower conductive sheets for module testing according to a preferred embodiment of the present invention can enable the upper and lower conductive sheets (10) manufactured together through a third screen printing step (S250) and a third curing step (S260) to be easily separated from each other.

[0160] To this end, the third screen printing step (S250) forms a separation edge portion (14) of the upper and lower conductive sheet (10) by applying a third solution made of an electrically insulating material in a screen printing manner, thereby forming a third member layer (151) laminated at the lateral perimeter position of the upper and lower conductive sheet (10) on the upper part of the base substrate (50), and the third curing step (S260) cures the third member layer (151) formed through the third screen printing step (S250) by irradiating it with UV light.

[0161] Here, the third solution may be made of a material in which the separating edge portion (14) formed as it hardens is relatively weaker than the insulating portion (11), or may be made of a material that dissolves when the hardened separating edge portion (14) is immersed in water or a specific solution.

[0162] FIG. 38 is a flowchart showing each step of a method for manufacturing an upper and lower conductive sheet for module testing according to various embodiments of the present invention.

[0163] The above method for manufacturing an upper and lower conductive sheet for module testing is a method for manufacturing an upper and lower conductive sheet (10) in which a plurality of insulating parts (11) are arranged upright through a plurality of insulating holes (132) formed between a plurality of conductive parts (12) and are arranged between a memory module (20) and a test equipment (30) to electrically connect a terminal (21) of the memory module (20) and a terminal (31) of the test equipment (30), and includes an etching step (S310), an insulating injection step (S320), and a curing step (S330) as shown in FIG. 38.

[0164] Referring to the etching step (S310), the etching portion (115) can form a plurality of conductive portions (12) of the upper and lower conductive sheet (10) by forming a plurality of insulating holes (132) that are partially penetrated in the upper and lower directions at each designated portion of the conductor layer (131) made of an electrically conductive material corresponding to the first solution.

[0165] In the above etching step (S310), a base substrate (50) can be placed on the lower part of the conductor layer (131).

[0166] Referring to the insulation injection step (S320), the insulation injection section (125) can form multiple insulation sections (11) of the upper and lower conductive sheet (10) by using an underfill injection process to diffuse a second solution containing an electrically insulating material into each of the multiple insulation holes (132), thereby forming multiple insulation layers (111) in a stacked manner.

[0167] In the above insulation injection step (S320), after a plurality of insulating holes (132) are formed in each designated part of the conductor layer (131) and the base material (50) is removed, a first guard member (53) can be placed on the upper part of the conductor layer (131) in which a plurality of insulating holes (132) are formed, and a second guard member (54) can be placed on the lower part of the conductor layer (131) in which a plurality of insulating holes (132) are formed.

[0168] Referring to the curing step (S330), the curing section (180) can cure the insulating layer (111) formed by the insulating injection section (125) between the plurality of conductive sections (12).

[0169] According to one embodiment, a module test upper / lower conductive sheet manufacturing device for manufacturing an upper / lower conductive sheet (10) in which a plurality of conductive parts (12) are vertically arranged inside an insulating part (11) and are positioned between a counterpart module (20) and a test equipment (30) to electrically connect a terminal (21) of the counterpart module (20) and a terminal (31) of the test equipment (30) comprises: an etching part (115) that forms a plurality of conductive parts (12) of the upper / lower conductive sheet (10) while forming a plurality of insulating holes (132) that are at least partially penetrated in the upper / lower direction at each designated part of a conductor layer (131) made of an electrically conductive material corresponding to a first solution; and an insulating injection part (125) that forms a plurality of insulating parts (11) of the upper / lower conductive sheet (10) while forming an insulating layer (111) using a second solution containing an electrically insulating material at each of the plurality of insulating holes (132). It may include a curing section (180) that cures the insulating layer (111) formed by the insulating injection section (125) between the plurality of conductive sections (12).

[0170] According to one embodiment, the insulation injection unit (125) can form the insulating layer (111) by diffusing the second solution into each of the plurality of insulating holes (132) using an underfill injection process.

[0171] According to one embodiment, the insulating injection unit (125) can form a stacked insulating layer (111) by diffusing the second solution into each of the plurality of insulating holes (132) using at least one of a screen printing method, an injection method, and a dispensing method.

[0172] According to one embodiment, a base material (50) may be disposed on the lower part of the conductor layer (131).

[0173] According to one embodiment, after the plurality of insulating holes (132) are formed in each designated portion of the conductor layer (131), when the base material (50) is removed, a first guard member (53) may be disposed on the upper portion of the conductor layer (131) where the plurality of insulating holes (132) are formed, and a second guard member (54) may be disposed on the lower portion of the conductor layer (131) where the plurality of insulating holes (132) are formed.

[0174] According to one embodiment, the first guard member (53) may have an injection port (53a) formed through it in the vertical direction to correspond to one of the plurality of insulating holes (132), and the second guard member (54) may have an exhaust port (54a) formed through it in the vertical direction to correspond to another of the plurality of insulating holes (132).

[0175] According to one embodiment, the second solution can be introduced into the interior of one of the insulating holes through the injection port (53a), and then spread toward the discharge port (54a) while filling the remaining insulating holes among the plurality of insulating holes (132).

[0176] According to one embodiment, after the plurality of insulating holes (132) are formed in each designated portion of the conductor layer (131), when the base material (50) is removed, a conductive film (55) may be disposed on the lower portion of the conductor layer (131) in which the plurality of insulating holes (132) are formed.

[0177] According to one embodiment, a conductive pattern (131a) may be formed on the conductive film (55) to correspond to the position of each of the plurality of conductive parts (12).

[0178] According to one embodiment, a method for manufacturing an upper and lower conductive sheet for module testing, wherein a plurality of conductive parts (12) are vertically arranged inside an insulating part (11) and positioned between a counterpart module (20) and a test equipment (30) to electrically connect a terminal (21) of the counterpart module (20) and a terminal (31) of the test equipment (30), comprises: an etching step (S310) of forming a plurality of conductive parts (12) of the upper and lower conductive sheet (10) while forming a plurality of insulating holes (132) that are at least partially penetrated in the upper and lower direction at each designated part of a conductor layer (131) made of an electrically conductive material corresponding to a first solution; and an insulation injection step (S320) of forming a plurality of insulating parts (11) of the upper and lower conductive sheet (10) while forming an insulating layer (111) using a second solution containing an electrically insulating material at each of the plurality of insulating holes (132). and may include a curing step (S330) of curing the insulating layer (111) between the plurality of conductive parts (12).

[0179] According to one embodiment, in the insulation injection step (S320), the insulation layer (111) can be formed by diffusing the second solution into each of the plurality of insulation holes (132) using an underfill injection process.

[0180] According to one embodiment, in the insulation injection step (S320), the insulation layer (111) can be formed by diffusing the second solution into each of the plurality of insulation holes (132) using at least one of a screen printing method, an injection method, or a dispensing method.

[0181] According to one embodiment, in the etching step (S310), a base substrate (50) can be placed on the lower part of the conductor layer (131).

[0182] According to one embodiment, in the insulation injection step (S320), after the plurality of insulating holes (132) are formed in each designated portion of the conductor layer (131) and the base material (50) is removed, a first guard member (53) may be placed on the upper portion of the conductor layer (131) in which the plurality of insulating holes (132) are formed, and a second guard member (54) may be placed on the lower portion of the conductor layer (131) in which the plurality of insulating holes (132) are formed.

[0183] According to one embodiment, the first guard member (53) may have an injection port (53a) formed through it in the vertical direction to correspond to one of the plurality of insulating holes (132), and the second guard member (54) may have an exhaust port (54a) formed through it in the vertical direction to correspond to another of the plurality of insulating holes (132).

[0184] According to one embodiment, the second solution can be introduced into the interior of one of the insulating holes through the injection port (53a), and then spread toward the discharge port (54a) while filling the remaining insulating holes among the plurality of insulating holes (132).

[0185] According to one embodiment, in the insulation injection step (S320), after the plurality of insulating holes (132) are formed in each designated portion of the conductor layer (131), and the base material (50) is removed, a conductive film (55) can be placed on the lower portion of the conductor layer (131) in which the plurality of insulating holes (132) are formed.

[0186] According to one embodiment, a conductive pattern (131a) may be formed on the conductive film (55) to correspond to the position of each of the plurality of conductive parts (12).

[0187] As described above, although the present invention has been explained by limited embodiments and drawings, the present invention is not limited thereto, and it is obvious that various modifications and variations are possible within the scope of the technical spirit of the present invention and the equivalent scope of the claims described below by those skilled in the art to which the present invention belongs.

Claims

1. A device for manufacturing an upper and lower conductive sheet for module testing, wherein a plurality of conductive parts (12) are vertically arranged inside an insulating part (11) and are positioned between a counterpart module (20) and a test equipment (30) to electrically connect a terminal (21) of a counterpart module (20) and a terminal (31) of a test equipment (30). An etching section (115) that forms a plurality of conductive sections (12) of an upper and lower conductive sheet (10) while forming a plurality of insulating holes (132) that are at least partially penetrated in the upper and lower directions at each designated portion of a conductor layer (131) made of an electrically conductive material corresponding to the first solution; An insulating injection unit (125) that forms a plurality of insulating parts (11) of an upper and lower conductive sheet (10) while forming an insulating layer (111) using a second solution containing an electrically insulating material for each of the plurality of insulating holes (132); and A manufacturing apparatus for upper and lower conductive sheets for module testing, comprising a curing section (180) that cures the insulating layer (111) formed by the insulating injection section (125) between the plurality of conductive sections (12).

2. In Claim 1, The above insulation injection part (125) is, A device for manufacturing upper and lower conductive sheets for module testing, which forms the insulating layer (111) by injecting the second solution into each of the plurality of insulating holes (132) using an underfill injection process.

3. In Claim 1, The above insulation injection part (125) is, A manufacturing apparatus for upper and lower conductive sheets for module testing, which forms the insulating layer (111) by injecting the second solution into each of the plurality of insulating holes (132) using at least one of a screen printing method, an injection method, and a dispensing method.

4. In Claim 1, A manufacturing device for upper and lower conductive sheets for module testing, wherein a base material (50) is disposed on the lower part of the above-mentioned conductor layer (131).

5. In Claim 4, A manufacturing device for upper and lower conductive sheets for module testing, wherein after the plurality of insulating holes (132) are formed in each designated portion of the conductor layer (131), a first guard member (53) is disposed on the upper portion of the conductor layer (131) where the plurality of insulating holes (132) are formed, and as the base material (50) is removed, a second guard member (54) is disposed on the lower portion of the conductor layer (131) where the plurality of insulating holes (132) are formed.

6. In Claim 5, In the first guard member (53), an injection port (53a) is formed that penetrates in the vertical direction to correspond to one of the plurality of insulating holes (132), and A device for manufacturing upper and lower conductive sheets for module testing, wherein the second guard member (54) has an outlet (54a) formed through it in the upper and lower direction to correspond to one of the other insulating holes (132) among the plurality of insulating holes.

7. In Claim 6, A manufacturing device for upper and lower conductive sheets for module testing, wherein the second solution is introduced into the interior of one of the insulating holes through the injection port (53a), fills the remaining insulating holes among the plurality of insulating holes (132), and diffuses toward the discharge port (54a).

8. In Claim 4, A manufacturing apparatus for upper and lower conductive sheets for module testing, wherein after the plurality of insulating holes (132) are formed in each designated portion of the conductor layer (131), when the base material (50) is removed, a conductive film (55) is disposed on the lower portion of the conductor layer (131) in which the plurality of insulating holes (132) are formed.

9. A method for manufacturing an upper and lower conductive sheet for module testing, wherein a plurality of conductive parts (12) are vertically arranged inside an insulating part (11) and are positioned between a counterpart module (20) and a test equipment (30) to electrically connect a terminal (21) of the counterpart module (20) and a terminal (31) of the test equipment (30). An etching step (S310) for forming a plurality of conductive parts (12) of an upper and lower conductive sheet (10) while forming a plurality of insulating holes (132) that are at least partially penetrated in the upper and lower directions at each designated portion of a conductor layer (131) made of an electrically conductive material corresponding to the first solution; An insulation injection step (S320) of forming a plurality of insulating parts (11) of an upper and lower conductive sheet (10) while forming an insulating layer (111) using a second solution containing an electrically insulating material for each of the plurality of insulating holes (132); and A method for manufacturing an upper and lower conductive sheet for module testing, comprising a curing step (S330) of curing the insulating layer (111) between the plurality of conductive parts (12).

10. In Claim 9, In the above insulation injection step (S320), A method for manufacturing an upper and lower conductive sheet for module testing, wherein the second solution is injected into each of the plurality of insulating holes (132) using an underfill injection process to form the insulating layer (111).

11. In Claim 9, In the above insulation injection step (S320), A method for manufacturing an upper and lower conductive sheet for module testing, wherein the second solution is injected into each of the plurality of insulating holes (132) in at least one of a screen printing method, an injection method, or a dispensing method to form the insulating layer (111).

12. In Claim 9, In the above etching step (S310), A method for manufacturing an upper and lower conductive sheet for module testing, wherein a base material (50) is placed on the lower part of the above-mentioned conductor layer (131).

13. In Claim 12, In the above insulation injection step (S320), A method for manufacturing an upper and lower conductive sheet for module testing, wherein after the plurality of insulating holes (132) are formed in each designated portion of the conductor layer (131), a first guard member (53) is placed on the upper portion of the conductor layer (131) in which the plurality of insulating holes (132) are formed, and a second guard member (54) is placed on the lower portion of the conductor layer (131) in which the plurality of insulating holes (132) are formed by removing the base material (50).

14. In Claim 13, In the first guard member (53), an injection port (53a) is formed that penetrates in the vertical direction to correspond to one of the plurality of insulating holes (132), and A method for manufacturing an upper and lower conductive sheet for module testing, wherein the second guard member (54) has an outlet (54a) formed through it in the upper and lower direction to correspond to one of the other insulating holes (132) among the plurality of insulating holes.

15. In Claim 14, A method for manufacturing an upper and lower conductive sheet for module testing, wherein the second solution is introduced into the interior of one of the insulating holes through the injection port (53a), fills the remaining insulating holes among the plurality of insulating holes (132), and diffuses toward the discharge port (54a).

16. In Claim 12, In the above insulation injection step (S320), A method for manufacturing an upper and lower conductive sheet for module testing, wherein after the plurality of insulating holes (132) are formed in each designated portion of the conductor layer (131), the base material (50) is removed, and a conductive film (55) is placed on the lower portion of the conductor layer (131) in which the plurality of insulating holes (132) are formed.

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