Electronic apparatus comprising coil assembly

Abstract

Provided is an electronic apparatus. The electronic apparatus comprises: a housing including a rear-surface plate forming the rear surface of the electronic apparatus facing a first direction; and a coil assembly disposed adjacent to the rear-surface plate in a second direction, opposite to the first direction, and configured to transmit or receive power, wherein the coil assembly includes a first coil configured to transmit power to an external electronic apparatus and formed in a ring shape when viewed from the second direction, a second coil configured to receive power from a wireless power transmission device in the outside of the electronic apparatus, and formed in a ring shape surrounding the outer circumference of the first coil when viewed from the second direction, and a third coil configured to transmit power to the external electronic apparatus or receive power from the wireless power transmission device, and formed in a ring shape surrounding the outer circumference of the second coil when viewed from the second direction, the first coil and the second coil are electrically connected in parallel, and the third coil is electrically connected in series to the first coil and the second coil.

Description

Electronic device including a coil assembly

[0001] The present disclosure relates to an electronic device. More specifically, the present disclosure relates to an electronic device comprising a coil assembly.

[0002] With the advancement of electronic, information, and communication technologies, various functions are being integrated into a single electronic device. For example, an electronic device (e.g., a smartphone) includes communication functions as well as features such as audio playback, imaging, electronic notebooks, and charging capabilities; further diverse functions can be implemented on the smartphone through the additional installation of applications. In addition to executing installed applications or stored functions, the electronic device can connect to a server or other electronic device via wired or wireless means to receive various information in real time. Furthermore, it may also include wireless charging technology.

[0003] Wireless charging technology is a technology that uses wireless power transmission and reception, which allows charging the battery of an electronic device (e.g., a mobile phone) without connecting a separate charging connector, or charging an external electronic device (e.g., a smart watch) through an electronic device (e.g., a mobile phone).

[0004] A wireless power transmitting device can transmit power to a wireless power receiving device by using one or more of the following: an inductive coupling method based on the electromagnetic induction phenomenon generated by a wireless power signal, and an electromagnetic resonance coupling method based on the electromagnetic resonance phenomenon generated by a wireless power signal of a specific frequency.

[0005] An electronic device that supports wireless charging power reception can receive power from an external device through an antenna and charge a battery using the input power. An electronic device that supports wireless charging power transmission can supply wireless power to another electronic device using power from a battery or power input from a connected wired charger. For example, a wireless charging power transmission device can generate specified power using power from an external device (e.g., a power adapter (TA adapter)) or a battery, and supply the generated power to the other electronic device (e.g., a smartphone, a smartwatch, or wireless earphones (e.g., true wireless stereo)) through the coil.

[0006] The information for which it has been described is provided merely as background information to aid in understanding the present disclosure. None of the foregoing is intended to determine or expressly assert whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0007] Various aspects of the present disclosure are intended to address at least the problems and / or disadvantages mentioned above and to provide at least some of the advantages described below. Accordingly, one aspect of the present disclosure is to provide an electronic device comprising a coil assembly.

[0008] Additional aspects may be described in part of the following description, may be self-evidently understood from the description, or may be acquired through the implementation of various embodiments.

[0009] According to one aspect of the present disclosure, an electronic device is provided. The electronic device may provide an electronic device comprising: a housing including a rear plate forming a rear surface facing a first direction of the electronic device; a coil assembly arranged adjacent to the rear plate in a second direction opposite to the first direction and configured to transmit or receive power, wherein the coil assembly comprises a first coil configured to transmit power to an external electronic device and configured to have a ring shape when viewed from the second direction; a second coil configured to receive power from a wireless power transmitting device and configured to have a ring shape surrounding the outer surface of the first coil when viewed from the second direction; and a third coil configured to transmit power to the external electronic device or receive power from the wireless power transmitting device and configured to have a ring shape surrounding the outer surface of the second coil when viewed from the second direction, wherein the first coil and the second coil are electrically connected in parallel, and the third coil is electrically connected in series with the first coil and the second coil.

[0010] According to another aspect of the present disclosure, an electronic device is provided. The electronic device may provide an electronic device comprising: a housing including a rear plate forming a rear surface facing a first direction of the electronic device; a coil assembly arranged adjacent to the rear plate in a second direction opposite to the first direction and configured to transmit or receive power, wherein the coil assembly comprises: a first coil configured to transmit power to an external electronic device and configured to have a ring shape when viewed from the second direction; a second coil configured to receive power from a wireless power transmission device and configured to have a ring shape with an outer diameter larger than that of the first coil when viewed from the second direction; and a third coil configured to transmit power to the external electronic device or receive power from the wireless power transmission device and configured to have a ring shape surrounding the outer surface of the second coil (372) when viewed from the second direction, wherein the first coil and the second coil are electrically connected in parallel, and the third coil is electrically connected in series with the first coil and the second coil.

[0011] Other aspects, advantages, and key features of the present disclosure will be more clearly understood by those skilled in the art through the following detailed description, together with reference to the accompanying drawings.

[0012] The aspects, features, and advantages described above regarding one embodiment of the present disclosure may become more apparent from the following description with reference to the accompanying drawings.

[0013] FIG. 1 is a block diagram showing an electronic device in a network environment according to one embodiment of the present disclosure.

[0014] FIG. 2 is a front perspective view of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 3 is a rear perspective view of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 4 is an exploded perspective view of an electronic device showing the front of the electronic device according to one embodiment of the present disclosure.

[0017] FIG. 5 is an exploded perspective view of an electronic device showing the rear surface of the electronic device according to one embodiment of the present disclosure.

[0018] FIG. 6 is a drawing showing an electronic device, a wireless power transmission device, and an external electronic device according to one embodiment of the present disclosure.

[0019] FIG. 7 is a drawing showing a coil assembly according to one embodiment of the present disclosure and an equivalent circuit diagram thereof.

[0020] FIG. 8 is a cross-sectional view and a plan view of a coil assembly according to one embodiment of the present disclosure.

[0021] FIG. 9 is a cross-sectional view and a plan view of a coil assembly according to one embodiment of the present disclosure.

[0022] FIG. 10 is a cross-sectional view of a coil assembly and a shielding member according to one embodiment of the present disclosure.

[0023] FIG. 11 is a graph showing inductance according to the thickness of a shielding member according to one embodiment of the present disclosure.

[0024] FIG. 12 is a cross-sectional view of a shielding member according to one embodiment of the present disclosure.

[0025] FIG. 13 is a cross-sectional view of a coil assembly and a shielding member according to one embodiment of the present disclosure.

[0026] FIG. 14a is a cross-sectional view and an equivalent circuit diagram of a coil assembly according to one embodiment of the present disclosure.

[0027] FIG. 14b is a cross-sectional view and an equivalent circuit diagram of a coil assembly according to one embodiment of the present disclosure.

[0028] FIG. 14c is a cross-sectional view and an equivalent circuit diagram of a coil assembly according to one embodiment of the present disclosure.

[0029] FIG. 14d is a cross-sectional view and an equivalent circuit diagram of a coil assembly according to one embodiment of the present disclosure.

[0030] FIG. 15 is a plan view and an equivalent circuit diagram of a coil assembly according to one embodiment of the present disclosure. And,

[0031] FIG. 16 is a drawing showing a part of a coil assembly and an external coil according to one embodiment of the present disclosure.

[0032] Throughout the attached drawings, it will be understood that similar parts, configurations, and structures are referred to by similar reference numbers.

[0033] The technical problems intended to be solved by this document are not limited to those mentioned above, and other unmentioned technical problems will also be clearly understood by those skilled in the art to which this disclosure pertains from the following description. The following description regarding the attached drawings is intended to aid in understanding various embodiments of this disclosure as defined by the claims and their equivalents. The following description may include various specific details to aid understanding, but these are merely illustrative. Accordingly, those skilled in the art will understand that various changes and modifications are possible to the various embodiments disclosed in this disclosure without departing from the technical spirit and scope of this disclosure. Furthermore, for the sake of clarity and brevity, descriptions of known functions and configurations may be omitted.

[0034] The terms and words used in the following description and claims are not limited to their literal meanings but are used to enable a clear and consistent understanding of the embodiments of the present disclosure. Accordingly, a person skilled in the art will clearly understand that the description of the various embodiments of the present disclosure described below is for illustrative purposes only and is not intended to limit the present disclosure as defined by the appended claims and their equivalents.

[0035] In addition, unless clearly otherwise specified in the context, singular expressions such as “a,” “an,” and “the” should be understood to include a plural meaning. Thus, for example, “component surface” should be understood to include one or more such surfaces.

[0036] The wireless charging system of an electronic device adopts a parallel coil structure that performs two functions. The wireless charging system of an electronic device can function as a Radio Receiver (RX) that charges the electronic device by receiving power from a wireless power transmitter, and can function as a Radio Transmitter (TX) that charges an external electronic device (e.g., a smartwatch or wireless earphones) by transmitting power to it using the electronic device as a charger.

[0037] The Rx coil of the electronic device is composed of a WPC (Wireless Power Consortium) coil with an outer diameter of approximately 40 to 45 mm according to international standards, and the Rx coil of the electronic device can receive power from a wireless power transmission device to charge the electronic device.

[0038] In addition, external electronic devices (e.g., smartwatches or wireless earphones) do not use large-sized coils like the WPC coil mentioned above, but generally use small coils with an outer diameter of 30 mm or less.

[0039] Since the electronic device and the external electronic device utilize coils of different sizes, when the electronic device is used as a charger to charge the external electronic device, a problem may arise where the coupling coefficient (k) between the two coils decreases due to the size difference between the Rx coil inside the electronic device and the Tx coil inside the external electronic device, resulting in reduced charging efficiency.

[0040] To solve this problem, the charging coil of the electronic device can be configured to operate as a single coil by connecting a WPC coil for receiving power from a wireless power transmission device and a Share coil for transmitting power to an external electronic device in parallel.

[0041] In order to improve charging efficiency in such parallel coil structures, physical and electrical design methods are required to increase the coil inductance and lower the resistance.

[0042] One embodiment of the present disclosure may provide an electronic device that provides an improved usage environment, which is intended to at least resolve the problems and / or disadvantages described above and at least provide the advantages described below.

[0043] One embodiment of the present disclosure can increase the charging efficiency of the WPC coil and the Share coil by connecting an additional coil, capable of receiving power from a wireless power transmission device and transmitting power to an external electronic device, in series with the WPC coil and the Share coil.

[0044] It should be understood that the blocks of each flowchart and combinations of flowcharts may be executed by one or more computer programs containing instructions. The entirety of the one or more computer programs may be stored in a single memory device, or the one or more computer programs may be divided so that parts thereof are stored in multiple different memory devices.

[0045] Any function or operation described in the present disclosure may be processed by a single processor or a combination of multiple processors. The single processor or combination of multiple processors is a circuit that performs processing and may include an application processor (AP, e.g., a central processing unit (CPU)), a communication processor (CP, e.g., a modem), a graphics processing unit (GPU), a neural network processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a Wi-Fi chip, a Bluetooth® chip, a Global Positioning System (GPS) chip, a Near Field Communication (NFC) chip, connectivity chips, a sensor controller, a touch controller, a fingerprint sensor controller, a display driver integrated circuit (IC), an audio codec (CODEC) chip, a Universal Serial Bus (USB) controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system-on-chip (SoC), and other ICs.

[0046] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to one embodiment of the present disclosure.

[0047] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0048] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0049] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0050] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0051] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0052] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0053] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0054] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0055] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0056] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0057] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0058] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0059] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0060] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0061] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0062] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0063] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G (fifth generation) network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0064] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G (4th generation) networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or User plane (U-plane) latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0065] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0066] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0067] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0068] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0069] An electronic device according to one embodiment disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiment of this document is not limited to the aforementioned devices.

[0070] The embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In this document, phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” may each include any one of the items listed together with the corresponding phrase, or any possible combination thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0071] As used in one embodiment of this document, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0072] One embodiment of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0073] According to one embodiment, the method according to one embodiment disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0074] According to one embodiment, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to one embodiment, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to one embodiment, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0075] FIG. 2 is a front perspective view of an electronic device (101) according to one embodiment of the present disclosure. FIG. 3 is a rear perspective view of an electronic device (101) according to one embodiment of the present disclosure.

[0076] Referring to FIGS. 2 and FIGS. 3, the illustrated embodiments can be combined with the embodiments of FIGS. 4 to 13, FIGS. 14a to 14d, 15 and 16.

[0077] The components described with reference to FIGS. 2 and 3 may be all or partly identical to the components described with reference to FIGS. 4 through 13, FIGS. 14a through 14d, 15, and 16.

[0078] In the following detailed description, the length direction, width direction, and / or thickness direction (or height direction) of the electronic device may be mentioned, and the length direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, regarding the direction in which the component is oriented, 'negative / positive (- / +)' may be mentioned together with the Cartesian coordinate system illustrated in the drawings.

[0079] For example, the front of the electronic device and / or housing may be defined as the 'face facing the +Z direction,' and the rear or back surface may be defined as the 'face facing the -Z direction.' In one embodiment, the side of the electronic device and / or housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. In one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction.'

[0080] In the following description of the electronic device (101), ‘first direction’ may mean the -Z axis direction (or a direction parallel to the -Z axis), and ‘second direction’ may mean the +Z axis direction (or a direction parallel to the +Z axis).

[0081] In the following description of the electronic device (101), the statement that a component is 'disposed on' another component may mean that the component is placed in the -Z direction with respect to the other component. This is based on the orthogonal coordinate system described in the drawings for the sake of brevity of the description, and it should be noted that such directions or descriptions of components do not limit the embodiment(s) of the present disclosure. For example, the orthogonal coordinate system may be defined differently from the present disclosure depending on the design specifications of the electronic device or the user's usage habits.

[0082] Referring to FIGS. 2 and FIGS. 3, the electronic device (101) may include a housing (201) comprising a front (201A), a rear (201B), and a side (201C) surrounding the space between the front (201A) and the rear (201B). The housing (201) may refer to a structure forming part of the front (201A) of FIG. 2, the rear (201B) and the side (201C) of FIG. 3. At least a portion of the front (201A) may be formed by a substantially transparent front plate (202) (e.g., a glass plate including various coating layers, or a polymer plate). The rear (201B) may be formed by a rear plate (211). The rear plate (211) may be formed by a material such as glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. The above side (201C) may be formed by a side bezel structure (or "side member") (212) comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the front plate (202) and the side bezel structure (212) may be formed as one body and may comprise the same material. According to other embodiments, the rear plate (211) and the side bezel structure (212) may be formed as one body and may comprise the same material (e.g., glass, a metallic material such as aluminum, or ceramic). The front (201A) and / or the front plate (202) may be interpreted as part of a display (210) (e.g., the display module (160) of FIG. 1). The housing (201) may include the front plate (202) and the rear plate (211).

[0083] The electronic device (101) may include at least one of a display (210), an audio module (203, 204, 205) (e.g., the audio module (170) of FIG. 1), a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (206, 207) (e.g., the camera module (180) of FIG. 1), a key input device (216, 217) (e.g., the input module (150) of FIG. 1), and a connector hole (213, 214) (e.g., the connection terminal (178) of FIG. 1). According to one embodiment of the present disclosure, at least one of the components (e.g., the connector hole (214)) may be omitted or other components may be added.

[0084] The display (210) may be visible, for example, through a significant portion of the front plate (202). At least a portion of the display (210) may be exposed through the front plate (202) forming the front (201A). According to one embodiment of the present disclosure, the display (210) may be a flexible display or a foldable display.

[0085] The surface of the housing (201) (or the front plate (202)) may include a screen display area formed as the display (210) is visually exposed. For example, the screen display area may include a front (201A).

[0086] The electronic device (101) includes a recess or opening (not shown) formed in a part of the screen display area (e.g., front (201A)) of the display (210), and may include at least one of an audio module (205), a sensor module (not shown), a light-emitting element (not shown), and a camera module (206) aligned with the recess or opening. On the back surface of the screen display area of ​​the display (210), at least one of an audio module (205), a sensor module (not shown), a camera module (206), a fingerprint sensor (not shown), and a light-emitting element (not shown) may be included.

[0087] The display (210) may be combined with or placed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field type pen input device (215) (e.g., a stylus pen).

[0088] At least a portion of the above key input device (216, 217) may be placed in the side bezel structure (212).

[0089] The audio module (203, 204, 205) may include, for example, a microphone hole (203) and a speaker hole (204, 205). A microphone for acquiring external sound may be placed inside the microphone hole (203), and a plurality of microphones may be placed to detect the direction of sound. The speaker hole (204, 205) may include an external speaker hole (204) and a receiver hole (205) for communication. The speaker hole (204, 205) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (204, 205) (e.g., a piezo speaker). The audio module (203, 204, 205) is not limited to the above structure and may be designed in various ways, such as by mounting only some audio modules or adding new audio modules, depending on the structure of the electronic device (101).

[0090] A sensor module (not shown) may generate an electrical signal or data value corresponding to, for example, an internal operating state of the electronic device (101) or an external environmental state. The sensor module (not shown) may include, for example, a first sensor module (not shown) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on the front (201A) of the housing (201), and / or a third sensor module (not shown) (e.g., HRM (heart rate monitor) sensor) and / or a fourth sensor module (not shown) (e.g., fingerprint sensor) disposed on the rear (201B) of the housing (201). The fingerprint sensor may be disposed on the rear (201B) as well as on the front (201A) (e.g., display (210)) of the housing (201). The electronic device (101) may further include additional sensor modules such as at least one of a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor (not shown). The sensor modules (not shown) are not limited to the above structure and can be designed in various ways depending on the structure of the electronic device (101), such as by mounting only some sensor modules or adding new sensor modules.

[0091] The camera module (206, 207) may include, for example, a front camera module (206) positioned on the front (201A) of the electronic device (101), a rear camera module (207) positioned on the rear (201B), a flash (208), and / or an IR sensor (209). The camera module (206, 207) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (208) may include, for example, a light-emitting diode or a xenon lamp. The camera module (206, 207) is not limited to the above structure and may be designed in various ways, such as by mounting only some camera modules or adding new camera modules, depending on the structure of the electronic device (101).

[0092] The electronic device (101) may include a plurality of camera modules (e.g., dual cameras, or triple cameras) each having different attributes (e.g., angle of view) or functions. For example, the rear camera module (207) may include a plurality of camera modules including lenses having different angles of view. The plurality of camera modules may include at least one of a wide-angle camera, an ultra-wide-angle camera, a telephoto camera, or an IR (infrared) camera (e.g., a TOF (time of flight) camera, a structured light camera). Additionally, for example, the plurality of camera modules may include an optical zoom camera with adjustable magnification. The electronic device (101) may be configured to operate a designated camera module or another camera module for the plurality of camera modules based on a user's selection or under a predetermined environment. An IR camera may operate as at least part of a sensor module. For example, a TOF camera may operate as at least part of a sensor module (not shown) for detecting the distance to a subject. The above front camera module (206) can be implemented as an under display camera (UDC) module.

[0093] Key input devices (216, 217) (e.g., volume keys) may be placed on the side (201C) of the housing (201). The electronic device (101) may not include some or all of the aforementioned key input devices (216, 217), and the key input devices (216, 217) that are not included may be implemented in other forms, such as soft keys, on the display (210). According to one embodiment of the present disclosure, the key input devices (216, 217) may include a sensor module (not shown) placed on the rear (210B) of the housing (201).

[0094] A light-emitting element (not shown) may be disposed, for example, on the front (201A) of the housing (201). The light-emitting element (not shown) may, for example, provide state information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (not shown) may, for example, provide a light source that is linked to the operation of the front camera module (206). The light-emitting element (not shown) may include, for example, an LED (light emitting diode), an IR (infrared) LED and / or a xenon lamp.

[0095] The connector holes (213, 214) may include, for example, a first connector hole (213) capable of accommodating a connector for transmitting and receiving power and / or data with an external electronic device (e.g., a USB connector) or a connector for transmitting and receiving audio signals with an external electronic device (e.g., an earphone jack), and / or a second connector hole (214) capable of accommodating a storage device (e.g., a subscriber identification module (SIM) card, a secure digital (SD) memory card). The first connector hole (213) and / or the second connector hole (214) may be omitted. The connector holes (213, 214) are not limited to the above structure and may be designed in various ways, such as by installing only some connector holes or adding new connector holes, depending on the structure of the electronic device (101).

[0096] A pen input device (215) (e.g., a stylus pen) can be guided into the interior of the housing (201) through a hole formed on the side of the housing (201) and inserted or removed, and may include a button to facilitate removal. The pen input device (215) may have a separate resonant circuit built in and may be coupled with an electromagnetic induction panel (e.g., a digitizer) included in the electronic device (101). The pen input device (215) may be implemented using an electro-magnetic resonance (EMR) method, an active electrical stylus (AES) method, and an electric coupled resonance (ECR) method.

[0097] A camera module (206, 207) and / or a sensor module (not shown) may be positioned within the internal space of the electronic device (101) so as to be in contact with the external environment through a designated area of ​​the display (210) and the front plate (202). For example, the designated area may be an area of ​​the display (210) where no pixels are placed. As another example, the designated area may be an area of ​​the display (210) where pixels are placed. When viewed from above the display (210), at least a portion of the designated area may overlap with the camera module (206, 207) and / or the sensor module. As another example, some sensor modules may be positioned within the internal space of the electronic device to perform their functions without being visually exposed through the front plate (202).

[0098] The electronic device (101) disclosed in FIGS. 2 and 3 has a bar-type or plate-type appearance, but is not limited thereto. For example, the illustrated electronic device may be part of a rollable electronic device or a foldable electronic device. "Rollable electronic device" may mean an electronic device in which the display can be bent and deformed so that at least a portion can be wound or rolled and stored inside a housing (e.g., housing (201) in FIG. 2). Depending on the user's needs, the rollable electronic device may be used to expand the screen display area by unfolding the display or by exposing a larger area of ​​the display to the outside. "Foldable electronic device" may mean an electronic device in which two different areas of the display can be folded to face each other or in opposite directions. Generally, in a portable state, the display of a foldable electronic device is folded so that two different regions face each other or in opposite directions, and in an actual usage state, the user can unfold the display so that the two different regions form a substantially flat shape. In one embodiment, the electronic device (101) according to one embodiment of the present disclosure may be interpreted to include not only portable electronic devices such as smartphones, but also various other electronic devices such as laptop computers or home appliances.

[0099] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure. FIG. 5 is an exploded perspective view showing the rear of an electronic device according to one embodiment of the present disclosure.

[0100] The embodiments of FIGS. 4 and 5 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 13, FIGS. 14a to 14d, FIGS. 15 and 16.

[0101] The components described with reference to FIGS. 4 and 5 may be partially or entirely identical to the components described with reference to FIGS. 1 through 3. The components described with reference to FIGS. 4 and 5 may be partially or entirely identical to the components described with reference to FIGS. 6 through 13, FIGS. 14a through 14d, FIGS. 15, and FIGS. 16.

[0102] Referring to FIGS. 4 and FIGS. 5, an electronic device (101) (e.g., the electronic device (101) of FIG. 2 or FIG. 3) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 2), a display (330) (e.g., the display (210) of FIG. 1), at least one printed circuit board (or board assembly) (340a, 340b), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., the rear plate (211) of FIG. 3). When including a plurality of printed circuit boards (340a, 340b), the electronic device (101) may electrically connect different printed circuit boards by including at least one flexible printed circuit board (340c). For example, the printed circuit boards (340a, 340b) may include a first circuit board (340a) positioned above (e.g., in the +Y-axis direction) and a second circuit board (340b) positioned below (e.g., in the -Y-axis direction) the battery (350), and a flexible printed circuit board (340c) may electrically connect the first circuit board (340a) and the second circuit board (340b).

[0103] According to one embodiment, at least one of the components (e.g., the first support member (311), or the second support member (360)) may be omitted, or other components may be added. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 or FIG. 2, and redundant descriptions are omitted below.

[0104] The first support member (311) may be provided in a flat shape for at least a portion. The first support member (311) may be disposed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed from a metal material and / or a non-metal (e.g., polymer) material. When the first support member (311) is formed at least partially from a metal material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) attached to one side and a printed circuit board (340a, 340b) attached to the other side. A processor, memory, and / or interface may be mounted on the printed circuit board (340a, 340b). The processor may include one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0105] The housing (301) may include a first support member (311) and a side structure (310). The housing (301) may be understood as a structure for receiving, protecting, or placing a printed circuit board (340a, 340b) or a battery (350). The housing (301) may be understood as including a structure that a user can visually or tactilely perceive on the exterior of the electronic device (101), for example, a side structure (310), a front plate (320), and / or a rear plate (380). For example, the housing (301) may include structures that form the exterior of the electronic device (101) (e.g., a side structure (310), a front plate (320), a rear plate (380)). The housing (301) may be the same as the housing (201) described with reference to FIGS. 2 and FIGS. 3. The phrase “front or rear of the housing (301)” may refer to the first surface (210A) of FIG. 1 or the second surface (210B) of FIG. 2. The first support member (311) is positioned between the front plate (320) (e.g., the first surface (210A) of FIG. 2) and the rear plate (380) (e.g., the second surface (210B) of FIG. 3) and can function as a structure for positioning electrical / electronic components such as printed circuit boards (340a, 340b) or a camera assembly (307).

[0106] Memory may include volatile memory or non-volatile memory.

[0107] The interface may include an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (101) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0108] The second support member (360) may include an upper support member (360a) or a lower support member (360b). The upper support member (360a) may be arranged to surround a printed circuit board (340a, 340b) (e.g., the first circuit board (340a)) together with a part of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (340a) in between. The lower support member (360b) of the second support member (360) may be arranged to face the first support member (311) with the second circuit board (340b) in between. Circuit devices (e.g., processors, communication modules, or memory) implemented in the form of integrated circuit chips or various electrical / electronic components may be placed on printed circuit boards (340a, 340b), and printed circuit boards (340a, 340b) may be provided with an electromagnetic shielding environment from the second support member (360). The lower support member (360b) may be utilized as a structure for placing electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector). Electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board not illustrated. For example, the lower support member (360b) may be placed to wrap around an additional printed circuit board (e.g., a second flexible printed circuit board (340b)) together with another part of the first support member (311). An additional printed circuit board not shown or a speaker module or interface placed on a lower support member (360b) may be placed correspondingly to the audio module (203, 204, 205) or connector hole (213, 214) of FIG. 2.

[0109] The support member (360) may be provided in a flat shape for at least a portion. The support member (360) may be disposed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The support member (360) may be formed of, for example, a metal material and / or a non-metal (e.g., a polymer) material.

[0110] The battery (350) is a device for supplying power to at least one component of the electronic device (101) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially in the same plane as the printed circuit board (340a, 340b). The battery (350) may be disposed integrally inside the electronic device (101) or may be disposed detachably from the electronic device (101).

[0111] Although not illustrated, the antenna may include a conductive pattern implemented on the surface of the second support member (360) through, for example, a laser direct structuring method. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the antenna in the form of a thin film may be placed between the back plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In one embodiment of the present disclosure, other antenna structures may be formed by a part or combination thereof of the side structure (310) and / or the first support member (311).

[0112] The camera assembly (307) may include at least one camera module. Inside the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or a camera window. The camera assembly (307) may be placed on a first support member (311) at a location adjacent to a printed circuit board (340a, 340b). The camera module(s) of the camera assembly (307) may be generally aligned with any one of the camera windows and may be wrapped at least partially in a second support member (360) (e.g., an upper support member (360a)).

[0113] The electronic device (101) may include a camera hole. A plurality of camera holes (312, 313, 319) may be spaced apart from each other. The camera assembly (307) may receive light that has passed through the camera hole.

[0114] According to one embodiment, the first support member (311) may include a receiving portion (3111). A battery (350) may be placed within the receiving portion (3111). The battery (350) may include a terrace (353). The terrace (353) may protrude toward a printed circuit board (340). The battery (350) may include a battery connecting member (3501) connecting the terrace (353) and the printed circuit board (340).

[0115] The electronic device (101) may include a port insertion opening (308). The port insertion opening (308) may be opened in a part of the housing (301). The port insertion opening (308) may be in communication with the external space of the housing (301). The electronic device (101) may be connected to an external device (e.g., a USB port, a charging cable), and said external device may be inserted into the port insertion opening (308).

[0116] The electronic device (101) may include an antenna (309). The antenna (309) may be positioned adjacent to the port insertion opening (308).

[0117] The electronic device (101) may further include a coil assembly (370). The coil assembly (370) can charge the electronic device (101) by receiving power from a wireless power transmission device, or charge the external electronic device by transmitting power from the electronic device (101) to an external electronic device.

[0118] The coil assembly (370) can transmit power according to an inductive method. When the coil assembly (370) is inductive, the coil assembly (370) may include at least one of a power source, a DC-DC conversion circuit (e.g., a DC / DC converter), a DC-AC conversion circuit (e.g., an inverter), an amplifier circuit, an impedance matching circuit, at least one capacitor, at least one coil, or a communication modulation circuit. For example, at least one capacitor may form a resonant circuit together with at least one coil. For example, the coil refers to an antenna for transmitting and / or receiving wireless power, and is not limited to an antenna formed in the shape of a coil.

[0119] The coil assembly (370) can be implemented in a manner defined in the Qi standard of the Wireless Power Consortium (WPC). The coil assembly (370) may include a coil capable of generating an induced magnetic field when current flows according to an induction method. The process of the coil assembly (370) generating an induced magnetic field can be described as the coil assembly (370) wirelessly transmitting power. Additionally, an induced electromotive force (or current, voltage, and / or power) may be generated in the coil of the coil assembly (370) by the surrounding magnetic field. The process of the induced electromotive force being generated through the coil can be described as the coil assembly (370) wirelessly receiving power.

[0120] According to one embodiment of the present disclosure, the coil assembly (370) may be positioned adjacent to the rear plate (380) in a second direction. According to another embodiment, the coil assembly (370) may be positioned on the front of the rear plate (380) (e.g., in the +Z-axis direction). As the coil assembly (370) is positioned adjacent to the rear plate (380), charging efficiency may be increased as it is positioned adjacent to the external electronic device and / or the wireless power transmission device when transmitting power to the external electronic device and / or receiving power from the wireless power transmission device.

[0121] FIG. 6 is a drawing showing an electronic device and an external electronic device according to one embodiment of the present disclosure. FIG. 7 is a drawing showing a coil assembly and an equivalent circuit diagram according to one embodiment of the present disclosure.

[0122] Referring to FIGS. 6 and 7, the embodiments of FIGS. 6 and 7 can be combined with the embodiments of FIGS. 1 to 5 or FIGS. 8 to 13, FIGS. 14a to 14d, FIGS. 15 and 16.

[0123] The components described with reference to FIGS. 6 and 7 may be, in part or in whole, identical to the components described with reference to FIGS. 1 through 5. The components described with reference to FIGS. 6 and 7 may be, in part or in whole, identical to the components described with reference to FIGS. 8 through 13, FIGS. 14a through 14d, FIG. 15, and FIG. 16.

[0124] Referring to FIG. 6, the electronic device (101) can charge the external electronic device (200). However, the size of the aforementioned coil assembly (e.g., the coil assembly (370) of FIG. 5) inside the electronic device (101) and the size of the external coil (L) placed in the external electronic device (200) may differ from each other.

[0125] For example, the external electronic device (200) may use a relatively small wireless charging coil (e.g., the external coil (L) in FIG. 7) due to the size and internal structural constraints of the product. Generally, the wireless charging coil inside the coil assembly of the electronic device (101) (e.g., the coil assembly (370) in FIG. 5) has an outer diameter of about 40 to 45 mm according to international standards, but since the internal space of the external electronic device (200) is limited, a small external coil (L) with an outer diameter of 30 mm or less is applied.

[0126] Additionally, lightweighting may be essential for the external electronic device (200), and accordingly, the wireless charging coil also needs to be designed to be light and thin. If a large coil is used, it may result in constraints on the placement of the battery and internal components, leading to an increase in the thickness and weight of the product. Therefore, it may be required to use a small external coil (L) to enable efficient power transmission even within a limited internal space.

[0127] In addition, by using a small external coil (L), alignment issues on the wireless power supply device can be minimized. The external electronic device (200) can be placed at various angles on the wireless power transmission device, and if an excessively large coil is used, misalignment with the charging area may occur, potentially reducing charging efficiency. Accordingly, it is desirable to use an external coil (L) of an appropriate size to facilitate charging alignment.

[0128] In addition, since the external electronic device (200) requires relatively low power, it may be inefficient to charge it using a large external coil (L). Generally, the external electronic device (200) can be charged with a power value smaller than the power used for wireless charging of the electronic device (101). Therefore, the external electronic device (200) can utilize a small external coil (L) when considering power consumption and charging efficiency.

[0129] Due to the difference in size between the internal coil of the electronic device (101) and the external coil (L) of the external electronic device (200), when the electronic device (101) is used as a charger to charge the external electronic device (200), the coupling coefficient (k) between the two coils is lowered, which may result in a problem of reduced efficiency. To solve this problem, the coil assembly (370) of the electronic device (101) may be configured to operate as a single coil by connecting a first coil (371) and a second coil (372) of different sizes in parallel.

[0130] Referring to FIG. 7, the first coil (371) and the second coil (372) may be configured to receive power supplied from a single power supply unit (P) in parallel. The amount of power supplied to the first coil (371) and the second coil (372) may be changed according to the user's usage environment and usage method, etc.

[0131] In the present and subsequent embodiments, the outer diameter of the first coil (371) when viewed from the second direction is 30 mm or less, and the outer diameter of the second coil (372a) is 40 mm or more and 45 mm or less, but this is not limited thereto, and the outer diameters of the first coil (371) and the second coil (372) may be changed in the future depending on the design of the electronic device and external electronic device.

[0132] Referring to FIG. 7, the electronic device (101) may utilize a first coil (371) to transmit power to an external electronic device (200). The first coil (371) may be referred to as a 'Tx coil (Transmitting Coil)' or a 'share coil'.

[0133] The first coil (371) serves to transmit power to an external electronic device (200) when the electronic device (101) is used as a charger. When current flows through the first coil (371), a magnetic field is formed due to the current to wirelessly transmit power to the external electronic device (200), and the coil can be designed with a structure having a high coupling coefficient (k) for efficient power transmission.

[0134] Referring to FIG. 7, the electronic device (101) may utilize a second coil (372) to receive power from a wireless power transmission device. The second coil (372) may be referred to as an 'Rx coil (Receiving coil)' or a 'WPC coil (Wireless Power Consortium Coil)'.

[0135] In the electronic device (101), the second coil (372) can perform the function of charging an internal battery by receiving power through a magnetic field from an external coil (L) placed in a wireless power transmission device. The design of the second coil (372) is configured to have a high inductance for efficient power reception and can be positioned considering the coupling coefficient with the external coil (L) placed in the external electronic device (200). The second coil (372) can have an outer diameter of 40 to 45 mm and is configured to enable stable power reception when the electronic device (101), such as a smartphone, is wirelessly charged.

[0136] The first coil (371) can be connected in parallel with the second coil (372) to function as a single coil. The first coil (371) can be designed to increase the coupling coefficient with an external electronic device (200) having a small outer diameter. This allows the electronic device (101) to charge the external electronic device (200), such as a smart watch or wireless earphones, more efficiently.

[0137] FIG. 8 is a cross-sectional view and a plan view of a coil assembly according to one embodiment of the present disclosure. FIG. 9 is a cross-sectional view and a plan view of a coil assembly according to one embodiment of the present disclosure.

[0138] Referring to FIGS. 8 and 9, the illustrated embodiments may be combined with the embodiments of FIGS. 1 to 7 or FIGS. 10 to 13, FIGS. 14a to 14d, FIGS. 15 and 16.

[0139] The components described with reference to FIGS. 8 and 9 may be, in part or in whole, identical to the components described with reference to FIGS. 1 through 7. The components described with reference to FIGS. 7 through 9 may be, in part or in whole, identical to the components described with reference to FIGS. 10 through 13, FIGS. 14a through 14d, FIG. 15, and FIG. 16.

[0140] According to FIGS. 8 and 9, the coil assembly (370) may include various parallel coil structures. FIGS. 8 and 9 illustrate a configuration structure when a first coil (371) and a second coil (372) are connected in parallel to improve efficiency.

[0141] Referring to FIG. 8, a first coil (371a) and a second coil (372a) may be positioned in a first direction (e.g., -Z-axis direction) and a second direction (e.g., +Z-axis direction) with respect to a support member (390), and the coil positioned in the first direction (e.g., -Z-axis direction) and the coil positioned in the second direction (e.g., +Z-axis direction) may each be connected to different printed circuit boards to receive power.

[0142] At this time, since the coils inside the coil assembly (370) are physically separated by the support member (390) and connected to different printed circuit boards, the first coil (371a) and the second coil (372a) can be connected in parallel to the aforementioned power supply device (e.g., the power supply device of FIG. 7).

[0143] In addition, as will be described later, when viewed from a second direction (e.g., +Z-axis direction), holes (e.g., first hole (H1), second hole (H2)) may be additionally arranged in the support member (390) so that the coil arranged in the first direction (e.g., -Z-axis direction) and the coil arranged in the second direction (e.g., +Z-axis direction) can be connected to operate as a single coil.

[0144] Referring to FIG. 8, when the first coil (371a) and the second coil (372a) are placed in both the first direction (e.g., -Z-axis direction) and the second direction (e.g., +Z-axis direction) of the support member (390) and connected in parallel, the first coil (371a) may be configured in a ring shape when viewed from the second direction, and the second coil (372a) may be configured in a ring shape surrounding the outer surface of the first coil (371a) when viewed from the second direction.

[0145] A support member (390) may be further disposed in the coil assembly (370). The support member (390) may be referred to as a 'material'.

[0146] The support member (390) may be configured to support and position the coil assembly (370). Specifically, the support member (390) may be configured to allow the coils of the coil assembly (370) to be stably positioned and connected.

[0147] The support member (390) provides a physical structure and can form a base for interconnecting the coils so that the coils can be placed in a first direction (e.g., -Z-axis direction) and / or a second direction (e.g., +Z-axis direction) of the support member (390). Through this, the coils can be connected to different printed circuit boards and can be connected to the aforementioned power supply (e.g., power supply (P) of FIG. 7). The support member (390) can be configured to fix the coils in a precise position and may be a configuration related to placement, separation, etc. between the coils for efficient power transmission.

[0148] The support member (390) may be a planar shape perpendicular to the second direction (e.g., +Z-axis direction), overlaps with the coil assembly (370) when viewed from the second direction (e.g., +Z-axis direction), and is positioned between parts of the coil assembly (370) to support the coil assembly (370) in the first direction (e.g., -Z-axis direction) and / or the second direction (e.g., +Z-axis direction).

[0149] The first coil (371) may include a first-1 coil (3711) and a first-2 coil (3712). The first coil (371) may be configured to form the inner surface of the coil assembly (370).

[0150] Referring to FIG. 8, the first-1 coil (3711a) is configured to form the inner surface of the first coil (371a) and may be positioned in the first direction (e.g., -Z-axis direction) and the second direction (e.g., +Z-axis direction) of the support member (390). The first-1 coil (3711a) may be configured to form the inner surface of the coil assembly (370).

[0151] Additionally, the first-second coil (3712a) is positioned in the second direction (e.g., +Z-axis direction) of the support member (390), and can be positioned to surround the outer surface of the portion of the first-first coil (3711a) positioned in the second direction (e.g., +Z-axis direction) when viewed from the second direction (e.g., +Z-axis direction).

[0152] In the present and subsequent embodiments, the first-second coil (3712a) is described as being positioned in the second direction (e.g., +Z-axis direction) of the support member (390), but is not limited thereto. For example, the first-second coil (3712a) may be positioned in the first direction (e.g., -Z-axis direction) of the support member (390) such that when viewed from the second direction (e.g., +Z-axis direction), the first-second coil (3712a) overlaps with the second-second coil (3722a) described later, and the first-second coil (3712a) and the second-second coil (3722a) are positioned in different directions relative to the support member (390) and are physically separated so that the first coil (371a) and the second coil (372a) are electrically connected in parallel.

[0153] A first hole (H1) substantially parallel to the second direction may be formed at a position corresponding to the first coil (3711a) of the support member (390). This prevents the first coil (371a) from being electrically isolated by the support member (390).

[0154] Specifically, by forming a first hole (H1) in the support member (390), the portion positioned in the first direction (e.g., -Z-axis direction) and the portion positioned in the second direction (e.g., +Z-axis direction) of the first-1 coil (3711a) can be connected to operate as one coil.

[0155] According to one embodiment, the second coil (372) may include a second-1 coil (3721) and a second-2 coil (3722).

[0156] Referring to FIG. 8, the second coil (372a) may include a second-1 coil (3721a) and a second-2 coil (3722a). The second coil (372a) may be configured to form the outer surface of the coil assembly (370).

[0157] The second-1 coil (3721a) is configured to form the outer surface of the second coil (372a) and may be positioned in the first direction (e.g., -Z-axis direction) and the second direction (e.g., +Z-axis direction) of the support member (390). According to one embodiment, the second-1 coil (3721a) may be configured to form the outer surface of the coil assembly (370).

[0158] Additionally, the 2-2 coil (3722a) is positioned in the first direction (e.g., -Z-axis direction) of the support member (390), and can be positioned so that when viewed from the second direction (e.g., +Z-axis direction), its outer surface is surrounded by the portion of the 2-1 coil (3721a) positioned in the first direction (e.g., -Z-axis direction).

[0159] In the present and subsequent embodiments, the second-2 coil (3722) is described as being positioned in the first direction (e.g., -Z-axis direction) of the support member (390), but is not limited thereto. For example, as described above, the second-2 coil (3722) may be positioned in the second direction (e.g., +Z-axis direction) of the support member (390) such that when viewed from the second direction (e.g., +Z-axis direction), it overlaps with the first-2 coil (3712) and the second-2 coil (3722) and are positioned in different directions relative to the support member (390), thereby physically separating them so that the first coil (371) and the second coil (372) are electrically connected in parallel.

[0160] A second hole (H2) substantially parallel to the second direction may be formed at a position corresponding to the second-1 coil (3721a) of the support member (390). This prevents the second coil (372a) from being electrically isolated by the support member (390).

[0161] Specifically, by forming a second hole (H2) in the support member (390), the portion positioned in the first direction (e.g., -Z-axis direction) and the portion positioned in the second direction (e.g., +Z-axis direction) of the second-1 coil (3721a) can be connected to operate as one coil.

[0162] When the first coil (371b) and the second coil (372b) are placed in the first direction (e.g., -Z-axis direction) and the second direction (e.g., +Z-axis direction) of the support member (390), it may be more advantageous in terms of space utilization than when they are placed in only one direction.

[0163] Referring to FIG. 9, a first coil (371b) and a second coil (372b) may be arranged in a first direction (e.g., -Z-axis direction) with respect to a support member (390), and the first coil (371b) and the second coil (372b) may be electrically connected in parallel as at least a part of the first coil (371b) configured to transmit power and at least a part of the second coil (372b) configured to receive power are arranged alternately.

[0164] As the first coil (371b) and the second coil (372b) are positioned in a first direction (e.g., -Z-axis direction) relative to the support member (390), power can be transmitted and / or received more efficiently.

[0165] In this city and the following embodiments, the first coil (371b) and the second coil (372b) are described as being positioned in a first direction (e.g., -Z axis direction), but are not limited thereto and may be positioned in a second direction (e.g., +Z axis direction).

[0166] Referring to FIG. 9, the first coil (371b) may include a first-1 coil (3711b) arranged to form the inner surface of the coil assembly (370) and the first coil (371b), and a first-2 coil (3712b) arranged to surround the outer surface of the first-1 coil (3711b).

[0167] Additionally, the second coil (372b) may include a second-1 coil (3721b) arranged to form the outer surface of the coil assembly (370) and the second coil (372b), and a second-2 coil (3722b) arranged so that its outer surface is surrounded by the second-1 coil (3721b).

[0168] In addition, the first-2 coil (3712) and the second-2 coil (3722) may be arranged alternately when viewed from the second direction (e.g., the +Z axis direction).

[0169] FIG. 10 is a cross-sectional view of a coil assembly and a shielding member according to one embodiment of the present disclosure. FIG. 11 is a graph showing inductance according to the thickness of a shielding member according to one embodiment of the present disclosure. FIG. 12 is a cross-sectional view of a shielding member according to one embodiment of the present disclosure.

[0170] Referring to FIGS. 10 to 12, the illustrated embodiments may be combined with the embodiments of FIGS. 1 to 9 or FIGS. 13, FIGS. 14a to 14d, FIGS. 15 and 16.

[0171] The components described with reference to FIGS. 10 to 12 may be partially or entirely identical to the components described with reference to FIGS. 1 to 9. The components described with reference to FIGS. 10 to 12 may be partially or entirely identical to the components described with reference to FIGS. 13, FIGS. 14a to 14d, FIGS. 15, and FIGS. 16.

[0172] Referring to FIG. 10, the shielding member (374) is placed between the coil assembly (370) and an electronic component (e.g., a processor) to prevent electromagnetic interference that may occur in the electronic component due to the magnetic field generated from the coil assembly (370) and to improve the power transmission and reception efficiency of the coil assembly (370).

[0173] The shielding member (374) may be positioned in a first direction (e.g., -Z-axis direction) of the coil assembly (370). Additionally, the shielding member (374) may be positioned in a second direction (e.g., +Z-axis direction) of the electronic component (e.g., processor). This reduces the effect of the magnetic field generated by the coil assembly (370) on the electronic component (e.g., processor). Furthermore, it minimizes signal interference that may occur in the electronic component (e.g., processor), thereby maintaining the overall performance of the electronic device (101).

[0174] Additionally, the shielding member (374) can reduce magnetic field loss of the coil assembly (370) and increase power transmission and reception efficiency. In a wireless power transmission and reception system, the magnetic field can be affected by the surrounding environment, and efficiency may decrease if unnecessary magnetic loss occurs. By placing the shielding member (374) between the coil assembly (370) and an electronic component (e.g., a processor), the magnetic field generated by the coil assembly (370) does not spread in unnecessary directions, and power can be transmitted and received more effectively to the other coil. As a result, losses during the power transmission process are reduced, and wireless charging performance can be improved.

[0175] The shielding member (374) can also increase the stability of an electronic component (e.g., a processor). A strong magnetic field generated in the coil assembly (370) can affect the operation of an electronic component (e.g., a processor), and the shielding member (374) blocks this magnetic interference to protect the electronic component (e.g., a processor) from operating normally and can increase the reliability of the entire electronic device (101).

[0176] Permeability is a physical property that indicates the ease with which a magnetic field passes through the interior of a material; materials with high permeability concentrate magnetic fields more effectively, thereby improving electromagnetic performance.

[0177] Inductance is an electrical characteristic that indicates the degree to which a coil resists changes in current, and is determined by the number of turns, shape, size, and characteristics of the shielding member (374) of the coil. As inductance increases, the coil can store more magnetic energy, thereby improving the performance of wireless power transmission, but if it is too high, the resonant frequency may change, so design optimization is required.

[0178] The shielding member (374) may be composed of a material having high permeability. When the shielding member (374) is placed in the first direction (e.g., the Z-axis direction) of the coil assembly (370), the inductance (L) of the coil placed inside the coil assembly (370) can be increased. The higher the permeability of the shielding member (374) and the thicker the thickness, the greater the inductance (L), thereby improving wireless power transmission and reception performance.

[0179] However, in order to thin the electronic device (101), it is necessary to reduce the thickness of the shielding member (374) during the process of thinning the coil assembly (370), and accordingly, the inductance (L) value may also decrease. Since charging efficiency may decrease if the inductance decreases below a certain value, a design is required to compensate for the reduced inductance when the shielding member (374) is thinned.

[0180] Referring to FIG. 12, the shielding member (374) may include a shielding layer (3741), an adhesive layer (3742), and a protective layer (3743).

[0181] The shielding layer (3741) is formed from a nanocrystalline material and can have high permeability. This increases the inductance of the coil assembly (370) and can block magnetic fields leaking to electronic components (e.g., processors). For example, nanocrystalline materials provide excellent magnetic shielding performance even at very thin thicknesses, which can contribute to the thinning of the electronic device (101) while maintaining the efficiency of wireless power transmission. Additionally, the shielding layer can be formed with a thickness of up to 18 μm.

[0182] The adhesive layer (3742) may be placed between different shielding layers (3741) or between the shielding layer (3741) and the protective layer (3743) to connect the different shielding layers (3741) or the shielding layer (3741) and the protective layer (3743).

[0183] In addition, the protective layer (3743) can protect the outer surface of the shielding member (374) and can improve durability by protecting the shielding layer (3741) from the external environment (moisture, dust, mechanical shock, etc.).

[0184] Referring to Fig. 11, it can be seen that as the thickness of the shielding member decreases, the inductance also decreases.

[0185] For example, if a nanocrystalline material with a permeability of 1500 is applied as a shielding layer (3741), a shielding member (374) can be formed by stacking multiple shielding layers (3741). Referring to FIG. 12, since the thickness of the shielding layer (3741) composed of nanocrystalline material is limited to a maximum of 18 μm, a plurality of shielding layers (3741) can be stacked to secure a desired inductance value and / or shielding performance.

[0186] Referring to FIG. 12, when a shielding member (374) is formed by stacking four shielding layers (3741), a shielding member (374) is formed with a thickness of 72 μm of shielding layer (3741), and referring to FIG. 11, the inductance (L) is about 13 μH.

[0187] In addition, when two shielding layers (3741) are stacked to form a shielding member (374) in order to reduce the thickness of the shielding member (374), a shielding member (374) with a thickness of 36 μm is formed, and the inductance (L) is reduced by about 1 μH to 12 μH.

[0188] In the present and subsequent embodiments, an adhesive layer (3742) is formed between the shielding layers (3741) to bond the shielding layers (3741), but this is not limited thereto.

[0189] In addition, in this city and the following embodiments, an example is described in which two shielding layers (3741) are stacked, but the thickness and number of shielding layers (3741) may be changed depending on the design specifications of the electronic device.

[0190] As described above, if the inductance (L) is reduced due to the thinning of the shielding member (374), additional design may be required during the coil design process to compensate for the reduced inductance. For example, it may be necessary to secure the inductance by adjusting the number of turns of the coil assembly (370) or by optimizing the coil arrangement.

[0191] FIG. 13 is a cross-sectional view of a coil assembly and a shielding member according to one embodiment of the present disclosure.

[0192] Referring to FIG. 13, the illustrated embodiment may be combined with the embodiments of FIGS. 1 to 12 or FIGS. 14a to 14d, FIGS. 15 and FIG. 16.

[0193] The components described with reference to FIG. 13 may be, in part or in whole, identical to the components described with reference to FIG. 1 to 12. The components described with reference to FIG. 13 may be, in part or in whole, identical to the components described with reference to FIG. 14a to 14d, FIG. 15, and FIG. 16.

[0194] The number of turns refers to the number of times a coil is wound and can be a design factor that directly affects electromagnetic induction and inductance (L).

[0195] As the number of turns in the coil assembly (370) increases, the magnetic field is formed more strongly, and accordingly, the inductance increases, which can improve wireless power transmission and reception performance.

[0196] However, increasing the number of turns within the same area can narrow the coil's line width (e.g., thickness in the direction perpendicular to the first direction) and increase the resistance (R), which may increase power loss. Therefore, it may be necessary to design a coil that minimizes the increase in resistance while increasing the inductance through the coil arrangement within the coil assembly without changing the number of turns.

[0197] FIG. 14a is a cross-sectional view and an equivalent circuit diagram of a coil assembly according to one embodiment of the present disclosure. FIG. 14b is a cross-sectional view and an equivalent circuit diagram of a coil assembly according to one embodiment of the present disclosure. FIG. 14c is a cross-sectional view and an equivalent circuit diagram of a coil assembly according to one embodiment of the present disclosure. FIG. 14d is a cross-sectional view and an equivalent circuit diagram of a coil assembly according to one embodiment of the present disclosure.

[0198] Referring to FIGS. 14a through 14d, the illustrated embodiments may be combined with the embodiments of FIGS. 1 through 13 or FIGS. 15 and 16.

[0199] The components described with reference to FIGS. 14a through 14d may be, in part or in whole, identical to the components described with reference to FIGS. 1 through 13. The components described with reference to FIGS. 14a through 14d may be, in part or in whole, identical to the components described with reference to FIGS. 15 and 16.

[0200] FIG. 14a is a cross-sectional view and equivalent circuit diagram of a coil assembly according to the embodiment of FIG. 8 described above. FIG. 14b is a cross-sectional view and equivalent circuit diagram of a coil assembly in which the number of turns of the coil is increased in the coil assembly according to the embodiment of FIG. 8.

[0201] As described above, the embodiment illustrated in FIG. 14b may be an embodiment in which the number of turns of the first-1 coil (3711) and the second-1 coil (3721) is increased and the line width of the first-1 coil (3711) and the second-1 coil (3721) is reduced in order to increase the number of turns of the coil within the same area.

[0202] The embodiment illustrated in FIG. 14a may have the first-1 coil (3711) and the second-1 coil (3721) composed of two turns, and the embodiment according to FIG. 14b may have the first-1 coil (3711) and the second-1 coil (3721) composed of three turns.

[0203] As a result, the embodiment shown in FIG. 14b can form a higher inductance than the embodiment according to FIG. 14a, but can form a smaller power transmission and reception efficiency as the resistance value increases.

[0204] The embodiment illustrated in FIG. 14c may mean an embodiment in which the turn positioned at the outermost edge of the 2-1 coil (3721a) of the embodiment according to FIG. 8 is replaced with a third coil (373a) capable of transmitting power to an external electronic device or receiving power from a wireless power transmission device. Additionally, the embodiment according to FIG. 14d may mean an embodiment in which the turn positioned at the outermost edge of the 2-1 coil (3721b) of the embodiment according to FIG. 9 is replaced with a third coil (373b) capable of transmitting power to an external electronic device or receiving power from a wireless power transmission device.

[0205] The third coil (373a, 373b) may be configured in a ring shape that surrounds the outer surface of the second coil (372a, 372b) when viewed from the second direction (e.g., +Z-axis direction), and may be configured to form the outer surface of the coil assembly (370a). Additionally, the third coil (373a, 373b) may be electrically connected in series with the first coil (371) and the second coil (372).

[0206] Referring to FIG. 14c, the third coil (373a) can be placed in the first direction (e.g., -Z-axis direction) and the second direction (e.g., +Z-axis direction) of the support member.

[0207] A third hole (H3) substantially parallel to the second direction may be formed at a position corresponding to the third coil (373a) of the support member (390). This prevents the third coil (373a) from being electrically isolated by the support member (390).

[0208] Specifically, by forming a third hole (H3) in the support member (390), the portion of the third coil (373) positioned in the first direction (e.g., -Z-axis direction) and the portion positioned in the second direction (e.g., +Z-axis direction) can be connected to operate as a single coil.

[0209] Referring to FIG. 14d, the third coil (373b) can be positioned in the same direction as the first coil (371b) and the second coil (372b) with respect to the support member (390).

[0210] The embodiments illustrated in FIGS. 14c and 14d are embodiments with the same area and number of turns as the conventional embodiments according to FIGS. 8 and 9, but by changing the circuit configuration, each coil can be connected in series and in parallel.

[0211] FIG. 15 is a plan view and an equivalent circuit diagram of a coil assembly according to one embodiment of the present disclosure. FIG. 16 is a drawing showing a part of a coil assembly and an external coil according to one embodiment of the present disclosure.

[0212] Referring to FIGS. 15 and 16, the illustrated embodiments can be combined with the embodiments of FIGS. 1 to 13 and FIGS. 14a to 14d.

[0213] The components described with reference to FIGS. 15 and 16 may be, in part or in whole, identical to the components described with reference to FIGS. 1 to 13 and FIGS. 14a to 14d.

[0214] FIG. 15 is a drawing specifically showing a perspective view and an equivalent circuit diagram of an embodiment according to FIG. 14c.

[0215] Referring to FIG. 15, as the current increases, the magnetic field of the coil becomes stronger, and this can affect the inductance (L). As a result, since the current flowing through the third coil (373) is higher than the current flowing through the first coil (371) and the second coil (372), the third coil (373) can have a significant effect on the inductance value of the coil assembly (370).

[0216] In addition, as the outer diameter of the coil increases, the area affected by the magnetic field increases, and the inductance (L) also tends to increase. This is because inductance is proportional to the square of the radius (R²) of the coil, and when the outer diameter of the coil is increased while maintaining the same number of turns, the path of the magnetic field becomes longer and can contain more magnetic flux.

[0217] As a result, as the current flowing through the third coil (373), which has the largest outer diameter, increases, the total inductance value can increase without increasing the number of turns. In addition, because the outer diameter of the third coil (373) is wide, the cross-sectional area of ​​the wire increases, so the increase in resistance due to the increase in inductance can also be small.

[0218] In the present disclosure and the embodiments below, the current of the embodiment according to FIG. 14c is described as being equally distributed to the first coil (371) and the second coil (372) connected in parallel, but is not limited thereto. For example, the current may be unevenly distributed to the first coil (371) and the second coil (372).

[0219] The following mathematical formulas 1 to 5 are formulas that express the charging efficiency during power transmission and reception through the inductance value (L) and resistance value (R).

[0220]

[0221]

[0222]

[0223]

[0224]

[0225] Table 1 below is a table comparing the power transmission and reception efficiency of the coil assembly (370) and the external coil (L) according to the embodiments of FIG. 14a to 14c when the permeability of the aforementioned shielding member (e.g., shielding member (374) of FIG. 10) is 1500 and the thickness of the aforementioned shielding member (e.g., shielding member (374) of FIG. 10) is 36 μm, calculated according to the above Equation 3.

[0226] Specifically, the efficiency was compared through the first external coil (L1) and the second external coil (L2), where the first external coil (L1) refers to a share Tx coil with an outer diameter of 25 mm, and the second external coil refers to a WPC Tx coil with an outer diameter of 40 mm.

[0227] In addition, the outer diameter of the first coil (371) is 29.1 mm and the inner diameter is 13.5 mm, and the outer diameter of the second coil (372) is 44 mm in FIG. 14a and FIG. 14b and 42.5 mm in FIG. 14c, and the inner diameter is 24.5 mm.

[0228] Mating coil Example L(uH)R(ohm)k Efficiency (%) L1 degree 14a 9.44 0.53 0.5967 1.6 degree 14b 10.78 0.57 0.5967 0.3 degree 14c 10.46 0.55 0.5727 1.3 L2 degree 14a 12.96 1.01 0.7538 2.1 degree 14b 14.91 1.07 0.7538 1.7 degree 14c 14.45 1.04 0.7678 2.1

[0229] In the case of the first external coil (L1), the embodiment shown in FIG. 14c has a larger current flowing through the third coil (373) and a larger difference in outer diameter between the first external coil (L1) and the third coil (373), so the k value is smaller and the charging efficiency is reduced compared to the embodiment according to FIG. 14a, but the inductance value is increased compared to the embodiment according to FIG. 14a and can have higher efficiency than the embodiment according to FIG. 14b, which simply increases the number of turns.

[0230] In the case of the second external coil (L2), compared to the embodiment shown in FIG. 14a, the inductance in FIG. 14c increased by approximately 1.5 uH, the resistance by 0.03 ohm, and k by 0.014. In the case of the embodiment shown in FIG. 14c, compared to the embodiment shown in FIG. 14a, the resistance increased, but the inductance and k also increased, so it can be seen that the efficiency is maintained at the same level as the existing parallel structure. However, in the embodiment shown in FIG. 14b, the efficiency decreased because the resistance increased significantly and there was no increase in k.

[0231] Referring to the embodiment illustrated in FIG. 14c, the coil assembly (370) can form a high inductance by connecting the third coil (373) in series with the first coil (371) and the second coil (372), which are connected in parallel. This can improve the power transmission efficiency of the coil assembly.

[0232] The present disclosure relates to an electronic device. According to one embodiment of the present disclosure, an electronic device (101) comprises a housing (301) including a rear plate (380) forming a rear surface facing a first direction of the electronic device, and a coil assembly (370) disposed adjacent to the rear plate (380) in a second direction opposite to the first direction and configured to transmit or receive power, wherein the coil assembly (370) comprises a first coil (371a) configured to transmit power to an external electronic device and configured to have a ring shape when viewed from the second direction, a second coil (372a) configured to receive power from a wireless power transmission device and configured to have a ring shape surrounding the outer surface of the first coil (371a) when viewed from the second direction, and a third coil configured to transmit power to an external electronic device or receive power from a wireless power transmission device and configured to have a ring shape surrounding the outer surface of the second coil (372a) when viewed from the second direction. An electronic device may be provided that includes a coil (373a), wherein the first coil (371a) and the second coil (372a) are electrically connected in parallel, and the third coil (373a) is electrically connected in series with the first coil (371a) and the second coil (372a).

[0233] According to one embodiment, the electronic device may be configured such that, when viewed from the second direction, at least a portion of the first coil (371a) overlaps with at least a portion of the second coil (372a).

[0234] According to one embodiment, the electronic device may further include a support member (390) having a planar shape perpendicular to the second direction, which overlaps with the coil assembly (370) when viewed from the second direction, and is configured to support the coil assembly (370) by being positioned between parts of the coil assembly (370).

[0235] According to one embodiment, the first coil (371a) is configured to form the inner surface of the first coil (371a) and may be an electronic device comprising a first-1 coil (3711a) disposed in the first direction and the second direction of the support member (390) and a first-2 coil (3712a) disposed in the first direction or the second direction of the support member (390) and disposed to surround the outer surface of at least a portion of the first-1 coil (3711a) when viewed from the second direction, and a first hole (H1) formed at a position corresponding to the first-1 coil (3711a) of the support member (390) and substantially parallel to the second direction.

[0236] According to one embodiment, the second coil (372a) is configured to form the outer surface of the second coil (372a) and may be an electronic device comprising a second-1 coil (3721a) disposed in the first direction and the second direction of the support member (390) and a second-2 coil (3722a) disposed in the first direction or the second direction of the support member (390) such that when viewed from the second direction, the outer surface is surrounded by the second-1 coil (3721a), and a second hole (H2) formed substantially parallel to the second direction at a position corresponding to the second-1 coil (3721a) of the support member (390).

[0237] According to one embodiment, the electronic device may have a third hole (H3) formed at a position corresponding to the third coil (373a) of the support member (390) and substantially parallel to the second direction.

[0238] According to one embodiment, the first-2 coil (3712a) may be an electronic device configured to be positioned in the first direction of the support member (390) and the second-2 coil (3722a) may be positioned in the second direction of the support member (390).

[0239] According to one embodiment, the first-2 coil (3712a) may be an electronic device configured to be positioned in the second direction of the support member (390) and the second-2 coil (3722a) may be positioned in the first direction of the support member (390).

[0240] According to one embodiment, the first-2 coil (3712a) may be an electronic device configured to overlap with the second-2 coil (3722a) when viewed from the second direction.

[0241] According to one embodiment, the third coil (373a) may be an electronic device configured to form the outer surface of the coil assembly (370) and positioned in the first direction and the second direction of the support member (390).

[0242] According to one embodiment, the electronic device may further include a shielding member (374) disposed in a first direction of the coil assembly (370).

[0243] According to one embodiment, the shielding member (374) may be an electronic device comprising alternately arranged shielding layers (3741) and adhesive layers (3742).

[0244] According to one embodiment, the shielding member (374) may be an electronic device composed of two or fewer shielding layers (3741).

[0245] According to one embodiment, the electronic device may be such that when viewed from the second direction, the outer diameter of the first coil (371a) is 30 mm or less.

[0246] According to one embodiment, the electronic device may be such that, when viewed from the second direction, the outer diameter of the second coil (372a) is 40 mm or more and 45 mm or less.

[0247] According to one embodiment, the ring-shaped first coil (371a), second coil (372a) and third coil (373a) may be an electronic device arranged to form concentric circles when viewed from a second direction.

[0248] According to one embodiment, the first coil (371a) and the second coil (372a) are electrically connected in parallel, and the third coil (373a) is electrically connected in series with the first coil (371a) and the second coil (372a), and the device may be an electronic device.

[0249] The present disclosure relates to an electronic device. According to one embodiment of the present disclosure, an electronic device (101) comprises a housing (301) including a rear plate (380) forming a rear surface facing a first direction of the electronic device, and a coil assembly (370) disposed adjacent to the rear plate (380) in a second direction opposite to the first direction and configured to transmit or receive power, wherein the coil assembly (370) comprises a first coil (371a; 371b) configured to transmit power to an external electronic device and configured to have a ring shape when viewed from the second direction, a second coil (372a; 372b) configured to receive power from a wireless power transmission device and configured to have a ring shape with an outer diameter larger than that of the first coil (371a; 371b) when viewed from the second direction, and a second coil (372a; An electronic device may be provided that includes a third coil (373a; 373b) configured in a ring shape surrounding the outer surface of the first coil (371a; 371b) and the second coil (372a; 372b) are electrically connected in parallel, and the third coil (373a; 373b) is electrically connected in series with the first coil (371a; 371b) and the second coil (372a; 372b).

[0250] According to one embodiment, the electronic device may further include a support member (390) having a planar shape perpendicular to the second direction, which overlaps with the coil assembly (370) when viewed from the second direction and supports the coil assembly (370).

[0251] According to one embodiment, the support member (390) may be an electronic device disposed between parts of the coil assembly (370), and the second coil (372a) is configured in a ring shape that surrounds the outer surface of the first coil (371a) when viewed from the second direction, and at least part of the first coil (371a) is configured to overlap with at least part of the second coil (372a) when viewed from the second direction, and the support member (390) may be disposed between the first-second coil (3712a), which is at least part of the first coil (371a), and the second-second coil (3722a), which is at least part of the second coil (372a).

[0252] According to one embodiment, the support member (390) is disposed in a second direction of the coil assembly (370), and the first coil (371b) includes a first-1 coil (3711b) disposed to form the inner surface of the first coil (371b) and a first-2 coil (3712b) disposed to surround the outer surface of the first-1 coil (3711b), and the second coil (372b) includes a second-1 coil (3721b) disposed to form the outer surface of the second coil (372b) and a second-2 coil (3722b) disposed so that its outer surface is surrounded by the second-1 coil (3721b), and the first-2 coil (3712b) and the second-2 coil (3722b) alternately when viewed from the second direction It can be an electronic device that is deployed.

[0253] According to one embodiment, the electronic device may further include a shielding member (374) disposed in a first direction of the coil assembly (370).

[0254] According to one embodiment, the electronic device according to the present disclosure can achieve efficient power transmission and reception in the coil assembly (370) within the electronic device (101) by providing a coil assembly (370) that utilizes both a series and a parallel structure.

[0255] According to one embodiment, the coil assembly (370) according to the present disclosure can form a high inductance by connecting the third coil (373), which is the outermost coil, in series with the first coil (371) and the second coil (372), which are connected in parallel. This can improve the power transmission efficiency of the coil assembly.

[0256] According to one embodiment, the coil assembly (370) can compensate for the reduction in inductance caused by the thinning of the shielding member (374) by increasing the contribution of the total inductance by increasing the current flowing through the third coil (373), which is the outermost coil. That is, the size of the system can be reduced while maintaining efficient power transmission.

[0257] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0258] Although the present disclosure has been described with reference to various embodiments, it will be apparent to those skilled in the art that various modifications in form and detail are possible without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. In an electronic device (101), A housing (301) comprising a rear plate (380) forming a rear surface facing a first direction of the electronic device; and It includes a coil assembly (370) configured to transmit or receive power, positioned adjacent to the rear plate (380) and in a second direction opposite to the first direction; The above coil assembly (370) is, A first coil (371a) configured to transmit power to an external electronic device (200) and configured to have a ring shape when viewed from the second direction; A second coil (372a) configured to receive power from a wireless power transmission device outside the electronic device (101) and configured in a ring shape surrounding the outer surface of the first coil (371a) when viewed from the second direction; and It includes a third coil (373a) configured to transmit power to the external electronic device (200) or receive power from the wireless power transmission device, and configured to have a ring shape surrounding the outer surface of the second coil (372a) when viewed from the second direction; An electronic device in which the first coil (371a) and the second coil (372a) are electrically connected in parallel, and the third coil (373a) is electrically connected in series with the first coil (371a) and the second coil (372a).

2. In Paragraph 1, An electronic device configured such that, when viewed from the second direction, at least a portion of the first coil (371a) overlaps with at least a portion of the second coil (372a).

3. In Paragraph 1 or 2, An electronic device further comprising a support member (390) having a planar shape perpendicular to a second direction, which overlaps with the coil assembly (370) when viewed from the second direction, and configured to support the coil assembly (370) by being positioned between a part of the coil assembly (370).

4. In any one of paragraphs 1 to 3, The first coil (371a) above is, A first-1 coil (3711a) configured to form the inner surface of the first coil (371a) and disposed in the first direction and the second direction of the support member (390); and It includes a first-second coil (3712a) disposed in the first direction or the second direction of the support member (390) and arranged to surround the outer surface of at least a portion of the first-first coil (3711a) when viewed from the second direction; An electronic device having a first hole (H1) formed substantially parallel to the second direction at a position corresponding to the first-1 coil (3711a) of the support member (390).

5. In any one of paragraphs 1 to 4, The second coil (372a) above is, A 2-1 coil (3721a) configured to form the outer surface of the second coil (372a) and disposed in the first direction and the second direction of the support member (390); and It includes a second-second coil (3722a) positioned in the first direction or the second direction of the support member (390), and positioned so that when viewed from the second direction, the outer surface is surrounded by the second-first coil (3721a); An electronic device having a second hole (H2) formed substantially parallel to the second direction at a position corresponding to the second-1 coil (3721a) of the support member (390).

6. In any one of paragraphs 1 to 5, An electronic device having a third hole (H3) formed at a position corresponding to the third coil (373a) of the support member (390) and substantially parallel to the second direction.

7. In any one of paragraphs 1 through 6, An electronic device configured such that the first-2 coil (3712a) is positioned in the first direction of the support member (390) and the second-2 coil (3722a) is positioned in the second direction of the support member (390).

8. In any one of paragraphs 1 through 6, An electronic device configured such that the first-2 coil (3712a) is positioned in the second direction of the support member (390), and the second-2 coil (3722a) is positioned in the first direction of the support member (390).

9. In any one of paragraphs 1 through 8, An electronic device configured such that the first-2 coil (3712a) overlaps with the second-2 coil (3722a) when viewed from the second direction.

10. In any one of paragraphs 1 through 9, The third coil (373a) is configured to form the outer surface of the coil assembly (370) and is positioned in the first direction and the second direction of the support member (390), an electronic device.

11. In any one of paragraphs 1 through 10, An electronic device further comprising a shielding member (374) disposed in a first direction of the coil assembly (370).

12. In any one of paragraphs 1 to 11, The above shielding member (374) is an electronic device comprising alternately arranged shielding layers (3741) and adhesive layers (3742).

13. In any one of paragraphs 1 through 12, An electronic device in which, when viewed from the second direction, the outer diameter of the first coil (371a) is 30 mm or less.

14. In any one of paragraphs 1 through 13, An electronic device in which, when viewed from the second direction, the outer diameter of the second coil (372a) is 40 mm or more and 45 mm or less.

15. In any one of paragraphs 1 through 14, An electronic device in which the ring-shaped first coil (371a), second coil (372a) and third coil (373a) are arranged to form concentric circles when viewed from a second direction.

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