Camera device and optical apparatus

Abstract

The present embodiment relates to a camera device comprising: a first carrier comprising a first side surface and a second side surface disposed opposite to each other, and a third side surface and a fourth side surface disposed opposite to each other; a first magnet disposed on the first side surface of the first carrier; a second magnet and a third magnet disposed on the second side surface of the first carrier; a first coil interacting with the first magnet; a second coil interacting with the second magnet; and a third coil interacting with the third magnet, wherein the second magnet and the third magnet are spaced apart from each other, and the first magnet comprises a first portion that does not overlap the second magnet and the third magnet by being disposed at a position corresponding to the space between the second magnet and the third magnet in the direction in which the second side surface faces the first side surface.

Description

Camera devices and optical instruments

[0001] This embodiment relates to a camera device and an optical device.

[0002] A camera device is a device that captures a subject as a photo or video, and is installed in optical devices such as smartphones, drones, vehicles, etc.

[0003] The camera device is equipped with an autofocus function that automatically adjusts the focus based on the distance to the subject. In addition, it features image stabilization to compensate for user hand shake.

[0004] In conventional camera devices, a method of moving the lens relative to the image sensor is widely used to perform autofocus and image stabilization functions. Meanwhile, depending on the method of supporting the movement of the lens, they are classified into elastic member types and ball types.

[0005] However, in the case of the elastic member type, as the image sensor becomes higher in pixel count, the diameter of the lens increases, and consequently, the weight of the lens increases, leading to a problem where the elastic member supporting the movement of the lens deforms.

[0006] In addition, in the case of the ball type, since the x-axis movement guide and the y-axis movement guide for hand shake correction are formed as two layers, the thickness of the camera device in the z-axis direction, which is the optical axis, becomes thicker, and there is a problem that the thickness of the camera device protruding from the smartphone becomes thicker.

[0007] (Patent Document 1) KR 10-2015-0118005 A

[0008] The present embodiment aims to provide a camera device in which the lens remains fixed and the image sensor moves during autofocus and image stabilization operation.

[0009] A camera device according to the present embodiment comprises: a first carrier including a first side and a second side positioned opposite each other, and a third side and a fourth side positioned opposite each other; a first magnet positioned on the first side of the first carrier; a second magnet and a third magnet positioned on the second side of the first carrier; a first coil interacting with the first magnet; a second coil interacting with the second magnet; and a third coil interacting with the third magnet, wherein the second magnet and the third magnet are spaced apart from each other, and the first magnet may include a first portion that is positioned at a location corresponding to the space between the second magnet and the third magnet in a direction in which the second side faces the first side, and does not overlap with the second magnet and the third magnet.

[0010] The first magnet includes a second portion that overlaps with the second magnet in a direction in which the second side faces the first side, and a third portion that overlaps with the third magnet in a direction in which the second side faces the first side, and the first portion of the first magnet may be positioned between the second portion and the third portion.

[0011] In the direction in which the third side faces the fourth side, the length of the first magnet may be longer than the length of the second magnet.

[0012] In the direction where the third side faces the fourth side, the distance between the second magnet and the third magnet may be longer than the length of the second magnet.

[0013] In the direction in which the third side faces the fourth side, the distance between the second magnet and the third magnet may be 0.82 to 0.92 of the length of the first magnet.

[0014] The camera device may include a first sensor for detecting the first magnet; a second sensor for detecting the second magnet; and a third sensor for detecting the third magnet.

[0015] In a direction in which the second side faces the first side, the second sensor and the third sensor, respectively, can overlap with the first magnet.

[0016] The first coil, the second coil, and the third coil are electrically separated from each other and receive current separately, and when the strength of the current applied to the second coil and the third coil is controlled differently, the first carrier can rotate.

[0017] The current applied to the second coil and the third coil can be controlled so that a force is generated in opposite directions between the second coil and the second magnet and between the third coil and the third magnet.

[0018] The first magnet and the first coil, the second magnet and the second coil, and the third magnet and the third coil can move the first carrier in a first direction perpendicular to the optical axis.

[0019] The camera device comprises a fourth magnet disposed on the third side of the first carrier; and a fourth coil interacting with the fourth magnet, wherein the fourth magnet and the fourth coil can move the first carrier in a second direction perpendicular to the optical axis and the first direction, respectively.

[0020] The camera device comprises a second carrier; and a first ball disposed between the first carrier and the second carrier, wherein each of the first carrier and the second carrier includes a groove in which the first ball is disposed, and the groove of the first carrier may be disposed in the first direction, and the groove of the second carrier may be disposed in the second direction.

[0021] The camera device comprises a fifth magnet disposed on the second carrier; and a fifth coil interacting with the fifth magnet, wherein the fifth magnet is disposed on the second carrier at a position corresponding to the fourth side of the first carrier, and the fifth magnet and the fifth coil can move the first carrier and the second carrier in the direction of the optical axis.

[0022] The camera device comprises an image sensor that moves together with the first carrier; and a lens disposed on the image sensor, wherein the lens can be maintained in a fixed state even when the image sensor moves.

[0023] An optical device according to the present embodiment may include a main body; a camera device disposed on the main body; and a display disposed on the main body and outputting one or more of a video and an image captured by the camera device.

[0024] Through this embodiment, the lens can be maintained in a fixed state when autofocus and image stabilization are driven. Therefore, since there are no restrictions on increasing the diameter and weight of the lens, high-resolution shooting can be provided.

[0025] In addition, in this embodiment, the x-axis direction movement guide and the y-axis direction movement guide for hand shake correction can be formed as a single layer. Accordingly, the height of the camera device in the optical axis direction is minimized, so the thickness of the camera device protruding from the smartphone can be minimized.

[0026] Furthermore, by making the image stabilization guide a single-layer structure, crosstalk can be corrected to provide a more precise image stabilization function.

[0027] FIG. 1 is a perspective view of a camera device according to the present embodiment.

[0028] Figure 2 is a cross-sectional view taken from AA of Figure 1.

[0029] Figure 3 is a cross-sectional view taken from BB of Figure 1.

[0030] FIG. 4 is a cross-sectional view of a camera device according to the present embodiment, cut perpendicular to the optical axis and viewed from above.

[0031] FIG. 5 is an exploded view of a camera device according to the present embodiment.

[0032] FIG. 6 is a perspective view of a camera device according to the present embodiment with the cover omitted.

[0033] FIG. 7 is a perspective view of FIG. 6 with the lens and lens holder omitted.

[0034] FIG. 8 is a perspective view with the AF carrier and OIS carrier omitted from FIG. 7.

[0035] FIG. 9 is a perspective view of a part of the configuration of the camera device in the state of FIG. 8, viewed from a different direction.

[0036] FIG. 10 is a perspective view of FIG. 9 with the base substrate and connecting substrate omitted.

[0037] FIG. 11 is a perspective view illustrating the driving unit and related configuration of a camera device according to the present embodiment.

[0038] FIG. 12 is a conceptual diagram illustrating the direction and strength of a force generated according to a current applied to three coils capable of generating a force in the same or opposite direction. (a) is a case where a force in the same direction is generated in the first and second coils and a force in the opposite direction is generated in the third coil; (b) is a case where a force in the same direction is generated in the first to third coils but the strengths are different; and (c) is a case where a force in the same direction is generated only in the first and second coils and no force is generated in the third coil.

[0039] Figure 13 is a diagram to explain the terms used in mathematical formulas 1 and 2.

[0040] FIG. 14 is a perspective view illustrating the arrangement structure of the driving unit and the substrate according to the present embodiment.

[0041] FIG. 15 is a perspective view of a part of the configuration of the camera device in the state of FIG. 14, viewed from a different direction.

[0042] FIG. 16 is a bottom perspective view of a part of the configuration of the camera device in the state of FIG. 14, viewed from a different direction.

[0043] FIG. 17 is a plan view of a camera device according to the present embodiment with the configuration of a cover, lens, lens holder, etc. omitted.

[0044] FIG. 18 is a plan view of FIG. 17 with the OIS carrier omitted.

[0045] FIG. 19 is a partial perspective view showing the OIS carrier in FIG. 17.

[0046] FIG. 20 is a drawing illustrating the arrangement structure of an OIS guide ball of a camera device according to the present embodiment, where (a) is a plan view showing the OIS guide ball arranged on an AF carrier and (b) is a perspective view showing the OIS guide ball arranged on an OIS carrier.

[0047] FIG. 21 is a conceptual diagram illustrating the guide structure of the OIS guide ball of a camera device according to the present embodiment.

[0048] FIG. 22 is a plan view of a camera device according to a modified example with the configuration of a cover and lens holder, etc. omitted.

[0049] FIG. 23 is a perspective view of the camera device in the state of FIG. 22 viewed from a different direction.

[0050] FIG. 24 is a perspective view illustrating the driving unit and related configuration of a camera device according to a modified example.

[0051] FIG. 25 is a perspective view and a partially enlarged view illustrating a gap-forming structure between a base substrate and a connecting substrate of a camera device according to a modified example.

[0052] FIG. 26 is a cross-sectional view illustrating the AF drive of a camera device according to the present embodiment.

[0053] FIG. 27 is a cross-sectional view illustrating the OIS driving of a camera device according to the present embodiment.

[0054] FIG. 28 is a perspective view of an optical device according to the present embodiment.

[0055] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0056] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0057] In addition, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a meaning that is generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms that are commonly used, such as terms defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0058] Furthermore, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention.

[0059] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as "at least one of A and B and C (or more than one)," it may include one or more of all combinations that can be formed from A, B, and C.

[0060] In addition, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the embodiments of the present invention. These terms are used merely to distinguish the components from other components and are not intended to limit the essence, order, or sequence of the components.

[0061] And, where it is stated that a component is 'connected', 'combined', or 'connected' to another component, this may include not only cases where the component is directly 'connected', 'combined', or 'connected' to the other component, but also cases where it is 'connected', 'combined', or 'connected' due to another component located between the component and the other component.

[0062] Furthermore, when described as being formed or placed "above" or "below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above" or "below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0063] The 'Optical Axis (OA in FIG. 26) direction' used below is defined as the optical axis direction of the lens and / or image sensor of the camera device.

[0064] As used below, the 'vertical direction' may be a direction parallel to or the same as the optical axis direction. The vertical direction may correspond to the 'z-axis direction'. As used below, the 'horizontal direction' may be a direction perpendicular to the vertical direction. That is, the horizontal direction may be a direction perpendicular to the optical axis. Therefore, the horizontal direction may include the 'x-axis direction' and the 'y-axis direction'.

[0065] In the following, one of the 'x-axis direction' and the 'y-axis direction' may be referred to as the 'first direction' and the other as the 'second direction'. Alternatively, in the following, one of the 'x-axis direction' and the 'y-axis direction' may be referred to as the 'first axis direction' and the other as the 'second axis direction'.

[0066] As used below, the 'Auto Focus (AF) function' is defined as a function that automatically focuses on a subject by adjusting the distance between the lens and the image sensor through moving the lens or image sensor along the optical axis according to the distance to the subject, so that a sharp image of the subject can be obtained on the image sensor. Additionally, 'Closed-loop Auto Focus (CLAF) control' is defined as real-time feedback control of the position of the lens or image sensor by detecting the distance between the image sensor and the lens to improve the accuracy of focus adjustment.

[0067] The 'optical image stabilization (OIS) function' used below is defined as a function that moves or tilts one or more of the lens and image sensor in a direction perpendicular to the optical axis or rolls them around the optical axis to offset hand shake in order to prevent the image or video from shaking due to the user's hand shake. Additionally, 'closed-loop auto focus (CLAF) control' is defined as detecting the position of one or more of the lens and image sensor and providing real-time feedback control of the position of one or more of the lens and image sensor to improve the accuracy of image stabilization.

[0068] In the following description, one of the "AF carrier (210)" and the "OIS carrier (310)" may be referred to as the "first carrier" and the other as the "second carrier." Additionally, in the following description, each of the "AF carrier (210)" and the "OIS carrier (310)" may be referred to as a "carrier." Furthermore, in the following description, the "AF carrier (210)" may be referred to as a "bobbin" and the "OIS carrier (310)" may be referred to as a "housing."

[0069] In the following description, one of "AF magnet (410)", "OIS-x magnet (510)", and "OIS-y magnet (610)" may be referred to as "first magnet", another as "second magnet", and the other as "third magnet". Additionally, in the following description, "AF magnet (410)", "OIS-x magnet (510)", and "OIS-y magnet (610)" may each be referred to as "magnet".

[0070] In the following, one of “AF magnet (410)”, “first OIS-x magnet (511)”, “second OIS-x magnet (512)”, “third OIS-x magnet (513)”, and “OIS-y magnet (610)” may be referred to as “first magnet”, another as “second magnet”, another as “third magnet”, another as “fourth magnet”, and another as “fifth magnet”.

[0071] In the following description, one of the "AF coil (420)", "OIS-x coil (520)", and "OIS-y coil (620)" may be referred to as the "first coil", another as the "second coil", and the other as the "third coil". Additionally, in the following description, each of the "AF coil (420)", "OIS-x coil (520)", and "OIS-y coil (620)" may be referred to as a "coil".

[0072] In the following, one of “AF coil (420)”, “1st OIS-x coil (521)”, “2nd OIS-x coil (522)”, “3rd OIS-x coil (523)”, and “OIS-y coil (620)” may be referred to as “1st coil”, another as “2nd coil”, another as “3rd coil”, another as “4th coil”, and another as “5th coil”.

[0073] In the following description, one of the "AF sensor (430)", "OIS-x sensor (530)", and "OIS-y sensor (630)" may be referred to as the "first sensor", another as the "second sensor", and the other as the "third sensor". Additionally, in the following description, each of the "AF sensor (430)", "OIS-x sensor (530)", and "OIS-y sensor (630)" may be referred to as a "sensor".

[0074] In the following, one of the “AF sensor (430),” “first OIS-x sensor (531),” “second OIS-x sensor (532),” “third OIS-x sensor (533),” and “OIS-y sensor (630)” may be referred to as the “first sensor,” another as the “second sensor,” another as the “third sensor,” another as the “fourth sensor,” and another as the “fifth sensor.”

[0075] In the following, one of the “AF guide ball (810)” and the “OIS guide ball (820)” may be referred to as the “first ball” and the other as the “second ball.” Additionally, in the following, each of the “AF guide ball (810)” and the “OIS guide ball (820)” may be referred to as a “ball.”

[0076] In the following, one of the "AF manpower yoke (830)" and the "OIS manpower yoke (840)" may be referred to as the "first yoke" and the other as the "second yoke." Additionally, in the following, each of the "AF manpower yoke (830)" and the "OIS manpower yoke (840)" may be referred to as a "yoke."

[0077] In the following, one of the "base substrate (120)", "image sensor substrate (330)", and "connection substrate (700)" may be referred to as the "first substrate", another as the "second substrate", and the other as the "third substrate".

[0078] In the following, each of the "OIS guide ball rail (211)" and the "OIS guide ball rail (311)" may include a groove, and in this case, one of the "OIS guide ball rail (211)" and the "OIS guide ball rail (311)" may be called the "first groove" and the other the "second groove".

[0079]

[0080] The configuration of the camera device according to the present embodiment will be described below with reference to the drawings.

[0081] FIG. 1 is a perspective view of a camera device according to the present embodiment. FIG. 2 is a cross-sectional view taken from AA in FIG. 1. FIG. 3 is a cross-sectional view taken from BB in FIG. 1. FIG. 4 is a cross-sectional view taken from above, cut perpendicular to the optical axis, of the camera device according to the present embodiment. FIG. 5 is an exploded perspective view of the camera device according to the present embodiment. FIG. 6 is a perspective view of the camera device according to the present embodiment with the cover omitted. FIG. 7 is a perspective view of FIG. 6 with the lens and lens holder omitted. FIG. 8 is a perspective view of FIG. 7 with the AF carrier and OIS carrier omitted. FIG. 9 is a perspective view of a part of the configuration of the camera device in FIG. 8 viewed from a different direction. FIG. 10 is a perspective view of FIG. 9 with the base substrate and connecting substrate omitted. FIG. 11 is a perspective view illustrating the driving unit and related configuration of the camera device according to the present embodiment. FIG. 14 is a perspective view illustrating the arrangement structure of the driving unit and the substrate according to the present embodiment. FIG. 15 is a perspective view of a part of the configuration of the camera device in the state of FIG. 14 viewed from a different direction. FIG. 16 is a bottom perspective view of a part of the configuration of the camera device in the state of FIG. 14 viewed from a different direction. FIG. 17 is a plan view of the camera device according to the present embodiment with configurations such as a cover, lens, and lens holder omitted. FIG. 18 is a plan view of FIG. 17 with the OIS carrier omitted. FIG. 19 is a partial perspective view showing the OIS carrier in FIG. 17. FIG. 20 is a drawing illustrating the arrangement structure of the OIS guide ball of the camera device according to the present embodiment, where (a) is a plan view showing the OIS guide ball arranged on the AF carrier, and (b) is a perspective view showing the OIS guide ball arranged on the OIS carrier. FIG. 21 is a conceptual diagram illustrating the guide structure of the OIS guide ball of the camera device according to the present embodiment.

[0082] The camera device (10) may include a fixed part (100). The fixed part (100) may be a fixed part during AF operation. The fixed part (100) may be a fixed part during OIS operation.

[0083] The camera device (10) may include a base (110). The fixed part (100) may include a base (110). The base (110) may form the lower exterior of the camera device (10). The base (110) may be placed on a printed circuit board (160). The base (110) may be placed on the printed circuit board (160). The base (110) may be placed within the printed circuit board (160). The base (110) may be placed directly on the printed circuit board (160). The base (110) may be in contact with the printed circuit board (160). The base (110) may be fixed to the printed circuit board (160). The base (110) may be coupled to the printed circuit board (160). The base (110) may be bonded to the printed circuit board (160). The base (110) may be bonded to the printed circuit board (160) with an adhesive. The base (110) can be integrated with the printed circuit board (160). The base (110) can be placed inside the cover (140).

[0084] The base (110) may include an AF guide ball rail (111). An AF guide ball (810) may be placed on the AF guide ball rail (111). The AF guide ball rail (111) may extend in the direction of the optical axis. The AF guide ball rail (111) may be positioned in the direction of the optical axis. The AF guide ball rail (111) may guide the AF guide ball (810) to move in the direction of the optical axis. The AF guide ball rail (111) may include grooves. The AF guide ball rail (111) may include a plurality of grooves. The AF guide ball rail (111) may include two grooves. Four balls may be placed in each of the two grooves of the AF guide ball rail (111).

[0085] The base (110) may include a reinforcing member. The reinforcing member may be a metal plate. The reinforcing member may be an insert member. The reinforcing member may be integrally formed in the base (110) through insert injection. The reinforcing member can reinforce the strength of the base (110). Through this, the thickness of the base (110) can be formed thinly.

[0086] The base (110) may include a cushioning member. The cushioning member may be placed on a reinforcing member. The cushioning member may be combined with the reinforcing member. The cushioning member may have elasticity. The cushioning member may be formed as a shock-reducing member. When the AF carrier (210) moves downward, the AF carrier (210) may come into contact with the cushioning member. That is, the cushioning member may function as a lower stopper of the AF carrier (210). The cushioning member may limit the lower stroke length of the AF carrier (210). The cushioning member may be formed of an elastomer material.

[0087] The base (110) may include a protrusion (113). The protrusion (113) may be formed on the side wall of the base (110). The protrusion (113) may be formed in a shape that protrudes outward from the side wall of the base (110). A gap may be formed between the base substrate (120) and the connection portion (730) of the connection substrate (700) by the protrusion (113). That is, the protrusion (113) may provide a stroke space to allow the connection substrate (700) to move. Accordingly, the protrusion (113) may protrude significantly more than the OIS driving distance.

[0088] The camera device (10) may include a base substrate (120). The fixing part (100) may include a base substrate (120). The base substrate (120) may be placed on a base (110). The base substrate (120) may be placed on the base (110). The base substrate (120) may be placed within the base (110). The base substrate (120) may be placed directly on the base (110). The base substrate (120) may be in contact with the base (110). The base substrate (120) may be fixed to the base (110). The base substrate (120) may be coupled to the base (110). The base substrate (120) may be bonded to the base (110) with an adhesive. The base substrate (120) may be integrated with the base (110).

[0089] The base substrate (120) can be combined with the printed circuit board (160). The base substrate (120) can be electrically connected to the printed circuit board (160). The terminals of the base substrate (120) can be combined with the terminals of the printed circuit board (160). The terminals of the base substrate (120) can be soldered with the terminals of the printed circuit board (160).

[0090] An AF coil (420) and an OIS coil (520, 620) may be fixed to the base substrate (120). The base substrate (120) may include a terminal portion. The terminal portion of the base substrate (120) may be coupled with a printed circuit board (160). A rigid PCB may be added to the terminal portion of the base substrate (120) as a fixed portion unrelated to elastic force. The base substrate (120) may be formed as a four-sided structure or an open "□"-shaped structure. The height of the base substrate (120) in the optical axis direction may be at least twice the height of the connecting substrate (700) in the optical axis direction. The thickness of the base substrate (120) may be at least 1.5 times the thickness of the connecting substrate (700).

[0091] The camera device (10) may include a lens holder (130). The fixing part (100) may include a lens holder (130). The lens holder (130) may be placed on a cover (140). The lens holder (130) may be placed on the cover (140). The lens holder (130) may be placed inside the cover (140). The lens holder (130) may be placed directly on the cover (140). The lens holder (130) may be in contact with the cover (140). The lens holder (130) may be fixed to the cover (140). The lens holder (130) may be coupled with the cover (140). The lens holder (130) may be bonded to the cover (140) with adhesive. The lens holder (130) may be integrated with the cover (140). The lens holder (130) can be placed on the top plate (141) of the cover (140). The lens holder (130) can be placed on the base (110).

[0092] The cover (140), which is a shield can, and the lens holder (130) may have the same body through an insert. Alternatively, they may be bonded in contact as separate parts.

[0093] The camera device (10) may include a cover (140). The fixed part (100) may include a cover (140). The cover (140) may be placed on the base (110). The cover (140) may be placed on the base (110). The cover (140) may be placed directly on the base (110). The cover (140) may be in contact with the base (110). The cover (140) may be fixed to the base (110). The cover (140) may be coupled to the base (110). The cover (140) may be bonded to the base (110) with an adhesive. The cover (140) may be integrated with the base (110).

[0094] The cover (140) may be a shield can. The cover (140) may be a yoke. The cover (140) may be formed of metal. The cover (140) may be grounded. The cover (140) may include a ground terminal.

[0095] The cover (140) may include a top plate (141). The top plate (141) may include a hollow through which light passes. The cover (140) may include a side plate (142). The side plate (142) may extend from the top plate (141). The side plate (142) may be folded from the top plate (141). The side plate (142) may be folded downward from the edge of the top plate (141) and extended. The side plate (142) may include a plurality of side plates. The side plate (142) may include four side plates. The side plate (142) may include a first side plate and a second side plate positioned opposite each other, and a third side plate and a fourth side plate positioned opposite each other.

[0096] The camera device (10) may include a lens module. The lens module may include a barrel and a lens (150). The lens (150) may be placed within the barrel. The lens (150) may be coupled with the barrel.

[0097] The camera device (10) may include a lens (150). The fixed part (100) may include a lens (150). The lens (150) may be placed in a lens holder (130). The lens (150) may be placed on the lens holder (130). The lens (150) may be placed inside the lens holder (130). The lens (150) may be placed directly in the lens holder (130). The lens (150) may be in contact with the lens holder (130). The lens (150) may be fixed to the lens holder (130). The lens (150) may be coupled to the lens holder (130). The lens (150) may be bonded to the lens holder (130). The lens (150) may be bonded to the lens holder (130) with adhesive. The lens (150) may be integrated with the lens holder (130). The lens (150) may be fixed to the fixed part (100). The lens (150) can be fixed to the cover (140). The lens (150) can be fixed to the top plate (141) of the cover (140). The lens (150) can be fixed to the base (110). The lens (150) can be assembled without screw threads to enable active alignment.

[0098] The lens (150) can be positioned at a location corresponding to the image sensor (320). The lens (150) can be positioned on the image sensor (320). The lens (150) can overlap with the image sensor (320) in the direction of the optical axis. Light passing through the lens (150) can be incident on the image sensor (320). The lens (150) can remain in a fixed state even when the image sensor (320) moves in the direction of the optical axis.

[0099] The camera device (10) may include a printed circuit board (160). The fixed part (100) may include a printed circuit board (160). The printed circuit board (160) may be a printed circuit board (PCB). The printed circuit board (160) may be electrically connected to an external component. The printed circuit board (160) may supply power to the driving part (400, 500, 600). The printed circuit board (160) may supply power to the coil (420, 520, 620) and the sensor (430, 530, 630).

[0100] The camera device (10) may include an AF moving part (200). The AF moving part (200) may move during AF driving. The AF moving part (200) may move in the direction of the optical axis. The AF moving part (200) may move relative to the fixed part (100).

[0101] The camera device (10) may include an AF carrier (210). The AF moving part (200) may include an AF carrier (210). The AF carrier (210) may be placed on a base (110). The AF carrier (210) may be placed on the base (110). The AF carrier (210) may be placed within the base (110). The AF carrier (210) may be movably placed on the base (110). The AF carrier (210) may be movable relative to the base (110). The AF carrier (210) may be placed between the base (110) and the OIS carrier (310). The AF carrier (210) may be placed between the fixed part (100) and the OIS carrier (310).

[0102] The AF carrier (210) may be a housing. In this embodiment, only the structure in which the AF carrier (210) performs AF driving has been described, but in a modified example, AF driving may be omitted and only OIS driving may be performed. In this case, the AF carrier (210) may be fixed without moving. When AF driving is omitted, the connection board (700) may connect the housing and the image sensor (320).

[0103] The AF carrier (210) may include a body (210a) and a top plate (210b) coupled to the body (210a). The top plate (210b) may be coupled to the upper part of the body (210a). The body (210a) and the top plate (210b) may be formed as separate components and coupled. As a variation, the body (210a) and the top plate (210b) may be formed integrally. An OIS carrier (310) may be disposed between the body (210a) and the top plate (210b).

[0104] The AF carrier (210) may include an OIS guide ball rail (211). An OIS guide ball (820) may be disposed on the OIS guide ball rail (211). The OIS guide ball rail (211) may be formed on the AF carrier (210). The OIS guide ball rail (211) may be formed on the upper surface of the AF carrier (210). The OIS guide ball rail (211) may include a groove.

[0105] The OIS guide ball rail (211) may include a plurality of rails. The OIS guide ball rail (211) may include four rails. The OIS guide ball rail (211) may include first to fourth rails (211-1, 211-2, 211-3, 211-4). The OIS guide ball rail (211) may include a plurality of grooves.

[0106] Each of the first to third rails (211-1, 211-2, 211-3) may be arranged in the y-axis direction. Each of the first to third rails (211-1, 211-2, 211-3) may be extended in the y-axis direction. Each of the first to third rails (211-1, 211-2, 211-3) may be formed in the y-axis direction. Each of the first to third rails (211-1, 211-2, 211-3) may guide the OIS guide ball (820) in the y-axis direction. Each of the first to third rails (211-1, 211-2, 211-3) may move the OIS guide ball (820) in the y-axis direction.

[0107] As a variation, each of the first to third rails (211-1, 211-2, 211-3) may be arranged in the x-axis direction.

[0108] The fourth rail (211-4) may be formed in a shape different from the first to third rails (211-1, 211-2, 211-3). The fourth ball may move in all directions perpendicular to the optical axis on the fourth rail (211-4).

[0109] The AF carrier (210) may include an AF guide ball rail (212). An AF guide ball (810) may be placed on the AF guide ball rail (212). The AF guide ball rail (212) may extend in the direction of the optical axis. The AF guide ball rail (212) may be positioned in the direction of the optical axis. The AF guide ball rail (212) may guide the AF guide ball (810) to move in the direction of the optical axis. The AF guide ball rail (212) may include grooves. The AF guide ball rail (212) may include a plurality of grooves. The AF guide ball rail (212) may include two grooves. Four balls may be placed in each of the two grooves of the AF guide ball rail (212).

[0110] The camera device (10) may include a cushioning member. The AF moving part (200) may include a cushioning member. The cushioning member may be placed on the top plate (210b) of the AF carrier (210). The cushioning member may be coupled to the top plate (210b) of the AF carrier (210). The cushioning member may have elasticity. The cushioning member may be formed as a shock-absorbing member. When the AF carrier (210) moves upward, the AF carrier (210) may come into contact with the cushioning member. That is, the cushioning member may function as an upper stopper of the AF carrier (210). The cushioning member may limit the upper stroke length of the AF carrier (210). The cushioning member may be formed of an elastomer material.

[0111] The camera device (10) may include an OIS moving part (300). The OIS moving part (300) may move when OIS is driven. The OIS moving part (300) may move in a direction perpendicular to the optical axis. The OIS moving part (300) may move relative to the fixed part (100). The OIS moving part (300) may move relative to the AF moving part (200). The OIS moving part (300) may move together with the image sensor (320).

[0112] The camera device (10) may include an OIS carrier (310). The OIS moving part (300) may include an OIS carrier (310). The OIS carrier (310) may be placed on the AF carrier (210). The OIS carrier (310) may be placed on the AF carrier (210). The OIS carrier (310) may be placed inside the AF carrier (210). The OIS carrier (310) may be placed on the base (110). The OIS carrier (310) may be placed on the base (110). The OIS carrier (310) may be placed inside the base (110). The OIS carrier (310) may be placed inside the cover (140). The OIS carrier (310) may be movably placed on the AF carrier (210). The OIS carrier (310) can be movably positioned on the base (110). The OIS carrier (310) can move in a direction perpendicular to the optical axis relative to the AF carrier (210). The OIS carrier (310) can move in a direction perpendicular to the optical axis relative to the base (110). The OIS carrier (310) can be positioned within the fixed part (100). The OIS carrier (310) can be directly coupled to the image sensor substrate (330).

[0113] The OIS carrier (310) may include a plurality of sides. The OIS carrier (310) may include four sides. The OIS carrier (310) may include first to fourth sides. The OIS carrier (310) may include a first side and a second side positioned opposite each other, and a third side and a fourth side positioned opposite each other.

[0114] The OIS carrier (310) may include an OIS guide ball rail (311). An OIS guide ball (820) may be disposed on the OIS guide ball rail (311). The OIS guide ball rail (311) may be formed on the OIS carrier (310). The OIS guide ball rail (311) may be formed on the lower surface of the OIS carrier (310). The OIS guide ball rail (311) may include a groove.

[0115] The OIS guide ball rail (211) may include a groove arranged in the y-axis direction (see A in FIG. 20). At this time, the OIS guide ball rail (311) may include a groove arranged in the x-axis direction (see B in FIG. 20). Alternatively, the OIS guide ball rail (211) may include a groove arranged in the x-axis direction. At this time, the OIS guide ball rail (311) may include a groove arranged in the y-axis direction. That is, the OIS guide ball rail (211) and the OIS guide ball rail (311) may include grooves arranged in directions orthogonal to each other.

[0116] The OIS guide ball rail (311) may include a plurality of rails. The OIS guide ball rail (311) may include four rails. The OIS guide ball rail (311) may include first to fourth rails (311-1, 311-2, 311-3, 311-4). The OIS guide ball rail (311) may include a plurality of grooves.

[0117] The first rail (311-1) may overlap with the first rail (211-1) in the direction of the optical axis. A first ball may be placed between the first rail (311-1) and the first rail (211-1). The second rail (311-2) may overlap with the second rail (211-2) in the direction of the optical axis. A second ball may be placed between the second rail (311-2) and the second rail (211-2). The third rail (311-3) may overlap with the third rail (211-3) in the direction of the optical axis. A third ball may be placed between the third rail (311-3) and the third rail (211-3). The fourth rail (311-4) may overlap with the fourth rail (211-4) in the direction of the optical axis. A fourth ball may be placed between the fourth rail (311-4) and the fourth rail (211-4). In FIG. 20, the OIS carrier (310) may be superimposed on the AF carrier (210) in the direction a of FIG. 21.

[0118] Each of the first to third rails (311-1, 311-2, 311-3) may be arranged in the x-axis direction. Each of the first to third rails (311-1, 311-2, 311-3) may be extended in the x-axis direction. Each of the first to third rails (311-1, 311-2, 311-3) may be formed in the x-axis direction. Each of the first to third rails (311-1, 311-2, 311-3) may guide the OIS guide ball (820) in the x-axis direction. Each of the first to third rails (311-1, 311-2, 311-3) may move the OIS guide ball (820) in the x-axis direction.

[0119] As a variation, each of the first to third rails (311-1, 311-2, 311-3) may be arranged in the y-axis direction. However, even in this case, as shown in FIG. 21, the first to third rails (211-1, 211-2, 211-3) may be arranged in a direction different from the first to third rails (311-1, 311-2, 311-3). The arrangement direction of the first to third rails (211-1, 211-2, 211-3) and the arrangement direction of the first to third rails (311-1, 311-2, 311-3) may be orthogonal to each other (see A and B in FIG. 20). The arrangement direction of the first to third rails (211-1, 211-2, 211-3) and the arrangement direction of the first to third rails (311-1, 311-2, 311-3) can be arranged at 70 to 110 degrees.

[0120] In this embodiment, through the cross structure of mutually facing rails, one side can roll and the other side can slip when the ball moves. The friction coefficient of slipping relative to rolling can be at least three times. For example, the friction coefficient of slipping can be 0.1 to 0.2. The rails can be formed in a circular, hexagonal, or square shape. The length of the rails can be equal to or greater than the length of the ball.

[0121] The fourth rail (311-4) may be formed in a shape different from the first to third rails (311-1, 311-2, 311-3). The fourth ball may move in all directions perpendicular to the optical axis on the fourth rail (311-4).

[0122] As a variation, the fourth rail (211-4) may also be formed in the same shape as the first to third rails (211-1, 211-2, 211-3). The fourth rail (311-4) may also be formed in the same shape as the first to third rails (311-1, 311-2, 311-3).

[0123] The OIS carrier (310) may include a groove (312). The groove (312) of the OIS carrier (310) may be formed by recessing the lower surface of the OIS carrier (310). The groove (312) of the OIS carrier (310) may be formed concavely on the lower surface of the OIS carrier (310). At least a portion of the sensor base (340) may be disposed in the groove (312). A filter (350) may be disposed in the groove (312).

[0124] The camera device (10) may include an image sensor (320). The OIS moving unit (300) may include the image sensor (320). The image sensor (320) may move together with the OIS carrier (310). The image sensor (320) may be configured such that an image is formed when light passing through the lens (150) and the filter (350) is incident. The image sensor (320) may be placed on an image sensor substrate (330). The image sensor (320) may be placed on the image sensor substrate (330). The image sensor (320) may be mounted on the image sensor substrate (330). The image sensor (320) may be electrically connected to the image sensor substrate (330). For example, the image sensor (320) may be coupled to the image sensor substrate (330) by Surface Mounting Technology (SMT). As another example, the image sensor (320) may be coupled to the image sensor substrate (330) by flip chip technology. The image sensor (320) may be positioned so that its optical axis aligns with that of the lens (150). That is, the optical axis of the image sensor (320) and the optical axis of the lens (150) may be aligned. The image sensor (320) may convert light incident on the effective image area of ​​the image sensor (320) into an electrical signal. The image sensor (320) may be any one of a CCD (charge coupled device), a MOS (metal oxide semiconductor), a CPD, and a CID.

[0125] When current is applied to the AF coil (420), the image sensor (320) can move in the direction of the optical axis relative to the lens (150). When current is applied to the OIS coils (520, 620), the image sensor (320) can move in a direction perpendicular to the optical axis relative to the lens (150). When current is applied to the OIS-x coil (520), the image sensor (320) can move in the direction of the x-axis relative to the lens (150). When current is applied to the OIS-y coil (620), the image sensor (320) can move in the direction of the y-axis relative to the lens (150).

[0126] The camera device (10) may include an image sensor substrate (330). The OIS moving unit (300) may include an image sensor substrate (330). The image sensor substrate (330) may be placed on an AF carrier (210). The image sensor substrate (330) may be placed on an OIS carrier (310). The image sensor substrate (330) may move together with the OIS carrier (310). The image sensor substrate (330) may be placed on a base (110). The image sensor substrate (330) may be placed within the base (110). The image sensor substrate (330) may be coupled with a connection substrate (700). The image sensor substrate (330) may be placed between the base (110) and the OIS carrier (310).

[0127] The camera device (10) may include a sensor base (340). The OIS moving part (300) may include a sensor base (340). The sensor base (340) may be placed on an image sensor substrate (330). The sensor base (340) may be placed on the image sensor substrate (330). The sensor base (340) may be placed within the image sensor substrate (330). The sensor base (340) may be placed directly on the image sensor substrate (330). The sensor base (340) may be in contact with the image sensor substrate (330). The sensor base (340) may be fixed to the image sensor substrate (330). The sensor base (340) may be coupled to the image sensor substrate (330). The sensor base (340) may be bonded to the image sensor substrate (330). The sensor base (340) may be bonded to the image sensor substrate (330) with an adhesive. The sensor base (340) may be integrated with the image sensor substrate (330). The sensor base (340) can be positioned between the image sensor substrate (330) and the AF carrier (210). The sensor base (340) can be positioned on the AF carrier (210). The sensor base (340) can be positioned on the OIS carrier (310). The sensor base (340) can move together with the OIS carrier (310).

[0128] The camera device (10) may include a filter (350). The OIS moving part (300) may include a filter (350). The filter (350) may be placed on the sensor base (340). The filter (350) may be placed on the sensor base (340). The filter (350) may be placed within the sensor base (340). The filter (350) may be placed directly on the sensor base (340). The filter (350) may be in contact with the sensor base (340). The filter (350) may be fixed to the sensor base (340). The filter (350) may be coupled to the sensor base (340). The filter (350) may be bonded to the sensor base (340). The filter (350) may be bonded to the sensor base (340) with an adhesive. The filter (350) may be integrated with the sensor base (340). The filter (350) can be placed between the image sensor (320) and the lens (150).

[0129] The filter (350) can serve to block light of a specific frequency band from passing through the lens (150) from entering the image sensor (320). The filter (350) can be positioned parallel to the xy plane. The filter (350) may include an infrared filter. The infrared filter can block light in the infrared region from entering the image sensor (60). The filter (350) may include an infrared absorption filter. The filter (350) may include an infrared reflection filter.

[0130] The camera device (10) may include a driving unit. The driving unit can move the moving unit (200, 300) relative to the fixed unit (100).

[0131] The camera device (10) may include an AF drive unit (400). The AF drive unit (400) may move the AF moving unit (200) in the direction of the optical axis relative to the fixed unit (100). The AF drive unit (400) may perform AF drive by moving the AF moving unit (200). The AF drive unit (400) may include an AF magnet (410) and an AF coil (420) that move the AF carrier (210) and the OIS carrier (310) in the direction of the optical axis. The AF magnet (410) and the AF coil (420) may move the AF carrier (210), the OIS carrier (310), and the image sensor (320) in the direction of the optical axis.

[0132] The camera device (10) may include an AF magnet (410). The AF drive unit (400) may include an AF magnet (410). The AF magnet (410) may be placed on the AF carrier (210). The AF magnet (410) may be placed on the AF carrier (210). The AF magnet (410) may be placed inside the AF carrier (210). The AF magnet (410) may be placed directly on the AF carrier (210). The AF magnet (410) may be in contact with the AF carrier (210). The AF magnet (410) may be fixed to the AF carrier (210). The AF magnet (410) may be coupled to the AF carrier (210). The AF magnet (410) may be attached to the AF carrier (210). The AF magnet (410) may be attached to the AF carrier (210) with an adhesive. The AF magnet (410) can move as an integral with the AF carrier (210). The AF magnet (410) may be a 4-pole magnetized magnet. The AF magnet (410) may be a 4-pole magnet.

[0133] The AF magnet (410) may be positioned on the AF carrier (210) at a location corresponding to the fourth side of the OIS carrier (310). The AF magnet (410) may be positioned on the AF carrier (210) opposite the OIS-y magnet (610). However, the OIS-y magnet (610) may be positioned on the OIS carrier (310).

[0134] The AF magnet (410) can move. The AF magnet (410) can move relative to the AF coil (420). The AF magnet (410) can move in the direction of the optical axis. The AF magnet (410) can move in the direction of the optical axis relative to the AF coil (420). The AF coil (420) can move the AF magnet (410). The AF coil (420) can be relatively fixed. The AF magnet (410) can move together with the AF carrier (210) in the direction of the optical axis.

[0135] The camera device (10) may include an AF coil (420). The AF drive unit (400) may include an AF coil (420). The AF coil (420) may be placed on a base substrate (120). The AF coil (420) may be placed on the base substrate (120). The AF coil (420) may be placed within the base substrate (120). The AF coil (420) may be placed directly on the base substrate (120). The AF coil (420) may be in contact with the base substrate (120). The AF coil (420) may be fixed to the base substrate (120). The AF coil (420) may be coupled to the base substrate (120). The AF coil (420) may be mounted on the base substrate (120). The AF coil (420) may be soldered to the base substrate (120). The AF coil (420) can be welded to the base substrate (120). The AF coil (420) can be bonded to the base substrate (120) with adhesive. The AF coil (420) can be integrated with the base substrate (120). The AF coil (420) can be placed on the fixed part (100). The AF coil (420) can be placed on the base (110). The AF coil (420) can be placed on the side plate (142) of the cover (140).

[0136] The AF coil (420) can be positioned opposite the AF magnet (410). The AF coil (420) can face the AF magnet (410). The AF coil (420) can correspond to the AF magnet (410). The AF coil (420) can be positioned at a location corresponding to the AF magnet (410). The AF coil (420) can interact with the AF magnet (410). The AF coil (420) can have electromagnetic interaction with the AF magnet (410). When current is applied to the AF coil (420), an electromagnetic field is formed around the AF coil (420), and the electromagnetic field of the AF coil (420) and the magnetic field of the AF magnet (410) can interact. The AF coil (420) can be superimposed with the AF magnet (410) in a direction perpendicular to the optical axis. For example, the AF coil (420) can be superimposed with the AF magnet (410) in the y-axis direction. As a variation, the AF coil (420) can be superimposed with the AF magnet (410) in the x-axis direction.

[0137] The camera device (10) may include an AF sensor (430). The AF drive unit (400) may include an AF sensor (430). The AF sensor (430) may be placed on a base substrate (120). The AF sensor (430) may be placed on the base substrate (120). The AF sensor (430) may be placed within the base substrate (120). The AF sensor (430) may be placed directly on the base substrate (120). The AF sensor (430) may be in contact with the base substrate (120). The AF sensor (430) may be fixed to the base substrate (120). The AF sensor (430) may be coupled to the base substrate (120). The AF sensor (430) may be mounted on the base substrate (120). The AF sensor (430) may be soldered to the base substrate (120). The AF sensor (430) can be welded to the base substrate (120). The AF sensor (430) can be bonded to the base substrate (120) with an adhesive. The AF sensor (430) can be integrated with the base substrate (120). The AF sensor (430) can be placed in the fixed part (100). The AF sensor (430) can be placed in the base (110). The AF sensor (430) can be placed on the side plate (142) of the cover (140). The AF sensor (430) can be placed within the AF coil (420).

[0138] The AF sensor (430) can detect the AF magnet (410). The AF sensor (430) can detect the magnetic field of the AF magnet (410). The AF sensor (430) may be a Hall sensor. The AF sensor (430) can detect the movement of the AF magnet (410). The AF sensor (430) can detect the position of the AF magnet (410). The AF sensor (430) may face the AF magnet (410). The AF sensor (430) may face the AF magnet (410). The AF sensor (430) may correspond to the AF magnet (410). The AF sensor (430) may be placed at a position corresponding to the AF magnet (410). The AF sensor (430) may measure the position or movement by detecting the magnetic field of the AF magnet (410). The AF magnet (410) can provide a signal for autofocus (AF) control according to its relative position with respect to the AF sensor (430). The AF magnet (410) can be superimposed on the AF sensor (430) in a direction perpendicular to the optical axis. For example, the AF magnet (410) can be superimposed on the AF sensor (430) in the y-axis direction. As a variation, the AF sensor (430) can be superimposed on the AF magnet (410) in the x-axis direction.

[0139] The camera device (10) may include an OIS driving unit. The OIS driving unit can move the OIS moving unit (300) in a direction perpendicular to the optical axis with respect to the fixed unit (100) and the AF moving unit (200). The OIS driving unit can perform OIS driving by moving the OIS moving unit (300). The OIS driving unit may include an OIS magnet and an OIS coil that move the OIS carrier (310) in a direction perpendicular to the optical axis.

[0140] The camera device (10) may include an OIS-x drive unit (500). The OIS-x drive unit (500) can move the OIS moving unit (300) in the x-axis direction to the fixed unit (100) and the AF moving unit (200). The OIS-x drive unit (500) can perform OIS-x axis driving by moving the OIS moving unit (300). The OIS-x magnet (510) and the OIS-x coil (520) can move the OIS carrier (310).

[0141] The camera device (10) may include an OIS-x magnet (510). The OIS-x drive unit (500) may include an OIS-x magnet (510). The OIS-x magnet (510) may be placed on an OIS carrier (310). The OIS-x magnet (510) may be placed on the OIS carrier (310). The OIS-x magnet (510) may be placed inside the OIS carrier (310). The OIS-x magnet (510) may be placed directly on the OIS carrier (310). The OIS-x magnet (510) may be in contact with the OIS carrier (310). The OIS-x magnet (510) may be fixed to the OIS carrier (310). The OIS-x magnet (510) can be coupled to the OIS carrier (310). The OIS-x magnet (510) can be bonded to the OIS carrier (310) with adhesive. The OIS-x magnet (510) can be integrated with the OIS carrier (310). The OIS-x magnet (510) can be a two-pole magnetized magnet. The OIS-x magnet (510) can be a two-pole magnet.

[0142] The OIS-x magnet (510) can move. The OIS-x magnet (510) can move relative to the OIS-x coil (520). The OIS-x magnet (510) can move in the x-axis direction. The OIS-x magnet (510) can move in the x-axis direction relative to the OIS-x coil (520). The OIS-x coil (520) can move the OIS-x magnet (510). The OIS-x coil (520) can be relatively fixed. The OIS-x magnet (510) can move in the x-axis direction together with the OIS carrier (310).

[0143] The camera device (10) may include an OIS-x coil (520). The OIS-x driving unit (500) may include an OIS-x coil (520). The OIS-x coil (520) may be placed on a base substrate (120). The OIS-x coil (520) may be placed on the base substrate (120). The OIS-x coil (520) may be placed within the base substrate (120). The OIS-x coil (520) may be placed directly on the base substrate (120). The OIS-x coil (520) may be in contact with the base substrate (120). The OIS-x coil (520) may be fixed to the base substrate (120). The OIS-x coil (520) may be coupled to the base substrate (120). The OIS-x coil (520) can be mounted on the base substrate (120). The OIS-x coil (520) can be soldered to the base substrate (120). The OIS-x coil (520) can be welded to the base substrate (120). The OIS-x coil (520) can be bonded to the base substrate (120) with adhesive. The OIS-x coil (520) can be integrated with the base substrate (120). The OIS-x coil (520) can be placed on the fixed part (100). The OIS-x coil (520) can be placed on the base (110). The OIS-x coil (520) can be placed on the side plate (142) of the cover (140).

[0144] The OIS-x coil (520) can be positioned opposite the OIS-x magnet (510). The OIS-x coil (520) can face the OIS-x magnet (510). The OIS-x coil (520) can correspond to the OIS-x magnet (510). The OIS-x coil (520) can be positioned at a location corresponding to the OIS-x magnet (510). The OIS-x coil (520) can interact with the OIS-x magnet (510). The OIS-x coil (520) can have an electromagnetic interaction with the OIS-x magnet (510). When current is applied to the OIS-x coil (520), an electromagnetic field is formed around the OIS-x coil (520), and the electromagnetic field of the OIS-x coil (520) and the magnetic field of the OIS-x magnet (510) can interact. The OIS-x coil (520) can be superimposed with the OIS-x magnet (510) in a direction perpendicular to the optical axis. For example, the OIS-x coil (520) can be superimposed with the OIS-x magnet (510) in the x-axis direction.

[0145] The camera device (10) may include an OIS-x sensor (530). The OIS-x driving unit (500) may include an OIS-x sensor (530). The OIS-x sensor (530) may be placed on a base substrate (120). The OIS-x sensor (530) may be placed on the base substrate (120). The OIS-x sensor (530) may be placed within the base substrate (120). The OIS-x sensor (530) may be placed directly on the base substrate (120). The OIS-x sensor (530) may be in contact with the base substrate (120). The OIS-x sensor (530) may be fixed to the base substrate (120). The OIS-x sensor (530) may be coupled to the base substrate (120). The OIS-x sensor (530) may be mounted on the base substrate (120). The OIS-x sensor (530) can be soldered to the base substrate (120). The OIS-x sensor (530) can be welded to the base substrate (120). The OIS-x sensor (530) can be bonded to the base substrate (120) with adhesive. The OIS-x sensor (530) can be integrated with the base substrate (120). The OIS-x sensor (530) can be placed in the fixed part (100). The OIS-x sensor (530) can be placed in the base (110). The OIS-x sensor (530) can be placed on the side plate (142) of the cover (140). The OIS-x sensor (530) can be placed within the OIS-x coil (520).

[0146] The OIS-x sensor (530) can detect the OIS-x magnet (510). The OIS-x sensor (530) can detect the magnetic field of the OIS-x magnet (510). The OIS-x sensor (530) may be a Hall sensor. The OIS-x sensor (530) can detect the movement of the OIS-x magnet (510). The OIS-x sensor (530) can detect the position of the OIS-x magnet (510). The OIS-x sensor (530) can face the OIS-x magnet (510). The OIS-x sensor (530) can face the OIS-x magnet (510). The OIS-x sensor (530) can correspond to the OIS-x magnet (510). The OIS-x sensor (530) can be positioned at a location corresponding to the OIS-x magnet (510). The OIS-x sensor (530) can detect the magnetic field of the OIS-x magnet (510) to measure position or movement. The OIS-x magnet (510) can provide a signal for optical image stabilization (OIS) depending on its relative position to the OIS-x sensor (530). The OIS-x magnet (510) can be superimposed on the OIS-x sensor (530) in a direction perpendicular to the optical axis. For example, the OIS-x magnet (510) can be superimposed on the OIS-x sensor (530) in the x-axis direction.

[0147] The OIS-x magnet (510) may include a plurality of OIS-x magnets. The OIS-x magnet (510) may include three magnets. The OIS-x magnet (510) may include first to third OIS-x magnets (511, 512, 513). The first to third OIS-x magnets (511, 512, 513) may be spaced apart from each other.

[0148] The OIS-x magnet (510) may include a first OIS-x magnet (511). The first OIS-x magnet (511) may be placed on a first side of the OIS carrier (310). The first OIS-x magnet (511) may be placed on a first side of the OIS carrier (310). The first OIS-x magnet (511) may be fixed to a first side of the OIS carrier (310). The first OIS-x magnet (511) may be coupled to a first side of the OIS carrier (310). The first OIS-x magnet (511) may be bonded to a first side of the OIS carrier (310) with an adhesive.

[0149] The first OIS-x magnet (511) may include a first portion (511a) that is positioned in a location corresponding to the space between the second OIS-x magnet (512) and the third OIS-x magnet (513) in a direction in which the second side of the OIS carrier (310) faces the first side, and does not overlap with the second OIS-x magnet (512) and the third OIS-x magnet (513). At this time, the direction in which the second side of the OIS carrier (310) faces the first side may be the x-axis direction.

[0150] The first OIS-x magnet (511) may include a second portion (511b) that overlaps with the second OIS-x magnet (512) in a direction in which the second side of the OIS carrier (310) faces the first side. The first OIS-x magnet (511) may include a third portion (511c) that overlaps with the third OIS-x magnet (513) in a direction in which the second side of the OIS carrier (310) faces the first side. The first portion (511a) of the first OIS-x magnet (511) may be positioned between the second portion (511b) and the third portion (511c) (see FIG. 4).

[0151] In the direction in which the third side of the OIS carrier (310) faces the fourth side, the length of the first OIS-x magnet (511) may be longer than the length of the second OIS-x magnet (512). At this time, the direction in which the third side of the OIS carrier (310) faces the fourth side may be the y-axis direction. In the direction in which the third side of the OIS carrier (310) faces the fourth side, the length of the first OIS-x magnet (511) may be longer than the length of the third OIS-x magnet (513). In the direction in which the third side of the OIS carrier (310) faces the fourth side, the length of the second OIS-x magnet (512) may be equal to the length of the third OIS-x magnet (513).

[0152] The distance between the second OIS-x magnet (512) and the third OIS-x magnet (513) may be longer than the length of the second OIS-x magnet (512) in the direction in which the third side of the OIS carrier (310) faces the fourth side. The distance between the second OIS-x magnet (512) and the third OIS-x magnet (513) may be longer than the length of the third OIS-x magnet (513) in the direction in which the third side of the OIS carrier (310) faces the fourth side.

[0153] The distance between the second OIS-x magnet (512) and the third OIS-x magnet (513) in the direction in which the third side of the OIS carrier (310) faces the fourth side may be shorter than the length of the first OIS-x magnet (511). The distance between the second OIS-x magnet (512) and the third OIS-x magnet (513) in the direction in which the third side of the OIS carrier (310) faces the fourth side may be 0.82 to 0.92 of the length of the first OIS-x magnet (511). The distance between the second OIS-x magnet (512) and the third OIS-x magnet (513) in the direction where the third side of the OIS carrier (310) faces the fourth side may be 0.79 to 0.95 of the length of the first OIS-x magnet (511).

[0154] The OIS-x magnet (510) may include a second OIS-x magnet (512). The second OIS-x magnet (512) may be placed on a second side of the OIS carrier (310). The second OIS-x magnet (512) may be placed on a second side of the OIS carrier (310). The second OIS-x magnet (512) may be fixed to a second side of the OIS carrier (310). The second OIS-x magnet (512) may be coupled to a second side of the OIS carrier (310). The second OIS-x magnet (512) may be bonded to a second side of the OIS carrier (310) with an adhesive. The second OIS-x magnet (512) can be placed on the OIS carrier (310) on the opposite side of the first OIS-x magnet (511).

[0155] The OIS-x magnet (510) may include a third OIS-x magnet (513). The third OIS-x magnet (513) may be placed on the second side of the OIS carrier (310). The third OIS-x magnet (513) may be placed on the second side of the OIS carrier (310). The third OIS-x magnet (513) may be fixed to the second side of the OIS carrier (310). The third OIS-x magnet (513) may be coupled to the second side of the OIS carrier (310). The third OIS-x magnet (513) may be bonded to the second side of the OIS carrier (310) with an adhesive. The third OIS-x magnet (513) can be placed on the OIS carrier (310) on the opposite side of the first OIS-x magnet (511).

[0156] The second OIS-x magnet (512) and the third OIS-x magnet (513) may be spaced apart from each other. The second OIS-x magnet (512) and the third OIS-x magnet (513) may be spaced apart from each other in the y-axis direction.

[0157] The OIS-x coil (520) may include a plurality of OIS-x coils. The OIS-x coil (520) may include three coils. The OIS-x coil (520) may include first to third OIS-x coils (521, 522, 523). The first to third OIS-x coils (521, 522, 523) may be spaced apart from each other. The first to third OIS-x coils (521, 522, 523) may be electrically isolated from each other. The first to third OIS-x coils (521, 522, 523) may receive power or current individually. The first to third OIS-x coils (521, 522, 523) may be controlled individually.

[0158] The OIS-x coil (520) may include a first OIS-x coil (521). The first OIS-x coil (521) may interact with the first OIS-x magnet (511). The first OIS-x coil (521) may have an electromagnetic interaction with the first OIS-x magnet (511). The first OIS-x coil (521) may face the first OIS-x magnet (511). The first OIS-x coil (521) may face the first OIS-x magnet (511). The first OIS-x coil (521) may correspond to the first OIS-x magnet (511). The first OIS-x coil (521) may be placed at a position corresponding to the first OIS-x magnet (511). The first OIS-x coil (521) can be overlapped with the first OIS-x magnet (511) in the x-axis direction.

[0159] The OIS-x coil (520) may include a second OIS-x coil (522). The second OIS-x coil (522) may interact with the second OIS-x magnet (512). The second OIS-x coil (522) may have electromagnetic interaction with the second OIS-x magnet (512). The second OIS-x coil (522) may face the second OIS-x magnet (512). The second OIS-x coil (522) may face the second OIS-x magnet (512). The second OIS-x coil (522) may correspond to the second OIS-x magnet (512). The second OIS-x coil (522) may be placed at a position corresponding to the second OIS-x magnet (512). The second OIS-x coil (522) can be overlapped with the second OIS-x magnet (512) in the x-axis direction.

[0160] The OIS-x coil (520) may include a third OIS-x coil (523). The third OIS-x coil (523) may interact with the third OIS-x magnet (513). The third OIS-x coil (523) may have electromagnetic interaction with the third OIS-x magnet (513). The third OIS-x coil (523) may face the third OIS-x magnet (513). The third OIS-x coil (523) may face the third OIS-x magnet (513). The third OIS-x coil (523) may correspond to the third OIS-x magnet (513). The third OIS-x coil (523) may be placed at a position corresponding to the third OIS-x magnet (513). The third OIS-x coil (523) can be overlapped with the third OIS-x magnet (513) in the x-axis direction.

[0161] The first OIS-x coil (521), the second OIS-x coil (522), and the third OIS-x coil (523) are electrically separated from each other and can receive current separately. The OIS carrier (310) can rotate when the current applied to the second OIS-x coil (522) and the third OIS-x coil (523) is controlled differently. The OIS carrier (310) can rotate when the current applied to the first OIS-x coil (521) and the third OIS-x coil (523) is controlled differently. The OIS carrier (310) can rotate when the current applied to the first OIS-x coil (521) and the second OIS-x coil (522) is controlled differently. As a variation, any two or more of the first OIS-x coil (521), the second OIS-x coil (522), and the third OIS-x coil (523) can be controlled together.

[0162] The current applied to the second OIS-x coil (522) and the third OIS-x coil (523) can be controlled so that forces are generated in opposite directions between the second OIS-x coil (522) and the second OIS-x magnet (512), and between the third OIS-x coil (523) and the third OIS-x magnet (513) (see FIG. 12 (a)). Additionally, the current applied to the second OIS-x coil (522) and the third OIS-x coil (523) can be controlled so that forces of the same direction but different strengths are generated between the second OIS-x coil (522) and the second OIS-x magnet (512), and between the third OIS-x coil (523) and the third OIS-x magnet (513) (see FIG. 12 (b)). In addition, current may be applied to only one of the second OIS-x coil (522), the third OIS-x coil (523), and the third OIS-x magnet (513) (see (c) of FIG. 12).

[0163] The first OIS-x magnet (511) and the first OIS-x coil (521) can move the OIS carrier (310) in the x-axis direction. The second OIS-x magnet (512) and the second OIS-x coil (522) can move the OIS carrier (310) in the x-axis direction. The third OIS-x magnet (513) and the third OIS-x coil (523) can move the OIS carrier (310) in the x-axis direction.

[0164] The first OIS-x magnet (511) and the first OIS-x coil (521), the second OIS-x magnet (512) and the second OIS-x coil (522), and the third OIS-x magnet (513) and the third OIS-x coil (523) can move the OIS carrier (310) in a first direction perpendicular to the optical axis. At this time, the first direction may be the x-axis direction. The first OIS-x magnet (511) and the first OIS-x coil (521), the second OIS-x magnet (512) and the second OIS-x coil (522), and the third OIS-x magnet (513) and the third OIS-x coil (523) can rotate the OIS carrier (310) around the optical axis.

[0165] The OIS-x sensor (530) may include a plurality of OIS-x sensors. The OIS-x sensor (530) may include a plurality of sensors. The OIS-x sensor (530) may include three sensors. The OIS-x sensor (530) may include first to third OIS-x sensors (531, 532, 533). The first to third OIS-x sensors (531, 532, 533) may be spaced apart from each other. The first to third OIS-x sensors (531, 532, 533) may be separated from each other. The first to third OIS-x sensors (531, 532, 533) may be electrically separated. The first to third OIS-x sensors (531, 532, 533) may be operated individually.

[0166] The OIS-x sensor (530) may include a first OIS-x sensor (531). The first OIS-x sensor (531) may detect the first OIS-x magnet (511). The first OIS-x sensor (531) may detect the magnetic field of the first OIS-x magnet (511). The first OIS-x sensor (531) may face the first OIS-x magnet (511). The first OIS-x sensor (531) may face the first OIS-x magnet (511). The first OIS-x sensor (531) may be positioned at a location corresponding to the first OIS-x magnet (511).

[0167] The OIS-x sensor (530) may include a second OIS-x sensor (532). The second OIS-x sensor (532) may detect the second OIS-x magnet (512). The second OIS-x sensor (532) may detect the magnetic field of the second OIS-x magnet (512). The second OIS-x sensor (532) may face the second OIS-x magnet (512). The second OIS-x sensor (532) may face the second OIS-x magnet (512). The second OIS-x sensor (532) may be positioned at a location corresponding to the second OIS-x magnet (512).

[0168] The OIS-x sensor (530) may include a third OIS-x sensor (533). The third OIS-x sensor (533) may detect the third OIS-x magnet (513). The third OIS-x sensor (533) may detect the magnetic field of the third OIS-x magnet (513). The third OIS-x sensor (533) may face the third OIS-x magnet (513). The third OIS-x sensor (533) may face the third OIS-x magnet (513). The third OIS-x sensor (533) may be positioned at a location corresponding to the third OIS-x magnet (513).

[0169] The second OIS-x sensor (532) can be overlapped with the first OIS-x magnet (511) in the direction in which the second side of the OIS carrier (310) faces the first side. The third OIS-x sensor (533) can be overlapped with the first OIS-x magnet (511) in the direction in which the second side of the OIS carrier (310) faces the first side.

[0170] FIG. 12 is a conceptual diagram illustrating the direction and strength of forces generated according to the current applied to three coils capable of generating forces in the same or opposite directions. (a) is a case where forces in the same direction are generated in the first and second coils and forces in the opposite direction are generated in the third coil; (b) is a case where forces in the same direction are generated in the first to third coils but with different strengths; and (c) is a case where forces in the same direction are generated only in the first and second coils and no force is generated in the third coil. FIG. 13 is a diagram for explaining the terms used in mathematical equations 1 and 2.

[0171] In this embodiment, as shown in FIG. 12 (a), (b), and (c), when different electromagnetic forces (f1, f2, f3) are generated in three coils (Coil 1, Coil 2, Coil 3) facing the same direction, the moving part can rotate. At this time, the three coils (Coil 1, Coil 2, Coil 3) may be the first to third OIS-x coils (521, 522, 523).

[0172] More specifically, FIG. 12(a) is a case where forces (f1, f2) in the same direction are generated in the first coil (Coil 1) and the second coil (Coil 2), and forces (f3) in the opposite direction are generated in the third coil (Coil 3). FIG. 12(b) is a case where forces (f1, f2, f3) in the same direction are generated in the first to third coils (Coil 1, Coil 2, Coil 3), but the magnitudes are different. FIG. 12(c) is a case where forces (f1, f2) in the same direction are generated only in the first and second coils (Coil 1, Coil 2), and no force is generated in the third coil (Coil 3). In the cases of FIG. 12(a), (b), and (c), the moving part can be driven by rolling. Rolling drive can add rolling correction to the hand shake correction function, or compensate for unintended rolling to eliminate crosstalk. Figures 12 (a), (b), and (c) are examples, and the moving part can be rotated through other situations as well.

[0173] In this embodiment, when rotation of the moving part occurs, the rotation angle of the moving part can be calculated by utilizing the output data of the Hall sensor. More specifically, the rotation angle of the OIS carrier (310) can be calculated by utilizing the output data of the second OIS-x sensor (532) and the third OIS-x sensor (533). The rotation angle of the OIS carrier (310) can be calculated by applying trigonometric functions to the two output values ​​of the second OIS-x sensor (532) and the third OIS-x sensor (533). The calculation of the rotation angle of the OIS carrier (310) can be based on the following mathematical formulas 1 and 2. Each of the second OIS-x sensor (532) and the third OIS-x sensor (533) may be equipped as a Hall sensor, and in this case, the second OIS-x sensor (532) and the third OIS-x sensor (533) may be collectively referred to as Hall sensors.

[0174] [Mathematical Formula 1]

[0175]

[0176] [Mathematical Formula 2]

[0177]

[0178] In mathematical formulas 1 and 2, C is the roll direction Hall output. Furthermore, as illustrated in FIG. 13, θ1 is the rotation angle and the unit is degrees. θ0 is the initial angle of the Hall sensor and the unit is degrees. r is the distance from the center of rotation to the Hall sensor and the unit is mm. HX1 is the Hall sensitivity of the second OIS-x sensor (532) for X-axis direction shift movement and the unit is mV / mm. HX2 is the Hall sensitivity of the third OIS-x sensor (533) for X-axis direction shift movement and the unit is mV / mm. A is the value obtained by multiplying the Hall output of the second OIS-x sensor (532) by HX2. B is the value obtained by multiplying the Hall output of the third OIS-x sensor (533) by HX1.

[0179] As shown in FIG. 13, a virtual plane can be implemented based on the x-axis displacement, y-axis displacement, and Hall output.

[0180] In the above description, a method for calculating the rotation angle of the moving part using the second and third OIS-x sensors (532, 533), i.e., two sensors, was described, but it is also possible to calculate it using the first to third OIS-x sensors (531, 532, 533).

[0181] In the above description, a structure in which the OIS-x drive unit (500) is divided into three parts for crosstalk control has been explained, but as a variation, the OIS-x drive unit (500) can be formed as one set and the OIS-y drive unit (600) can be divided into three parts.

[0182] The camera device (10) may include an OIS-y driving unit (600). The OIS-y driving unit (600) can move the OIS moving unit (300) in the y-axis direction to the fixed unit (100) and the AF moving unit (200). The OIS-y driving unit (600) can perform OIS-y axis driving by moving the OIS moving unit (300). The OIS-y magnet (610) and the OIS-y coil (620) can move the OIS carrier (310). The OIS-y magnet (610) and the OIS-y coil (620) can move the OIS carrier (310) in the y-axis direction.

[0183] The camera device (10) may include an OIS-y magnet (610). The OIS-y drive unit (600) may include an OIS-y magnet (610). The OIS-y magnet (610) may be placed on an OIS carrier (310). The OIS-y magnet (610) may be placed on the OIS carrier (310). The OIS-y magnet (610) may be placed inside the OIS carrier (310). The OIS-y magnet (610) may be placed directly on the OIS carrier (310). The OIS-y magnet (610) may be in contact with the OIS carrier (310). The OIS-y magnet (610) may be fixed to the OIS carrier (310). The OIS-y magnet (610) can be coupled to the OIS carrier (310). The OIS-y magnet (610) can be bonded to the OIS carrier (310) with adhesive. The OIS-y magnet (610) can be integrated with the OIS carrier (310). The OIS-y magnet (610) can be a two-pole magnetized magnet. The OIS-y magnet (610) can be a two-pole magnet.

[0184] The OIS-y magnet (610) can be placed on the third side of the OIS carrier (310). The OIS-y magnet (610) can be placed on the opposite side of the AF magnet (410) on the OIS carrier (310).

[0185] The OIS-y magnet (610) can move. The OIS-y magnet (610) can move relative to the OIS-y coil (620). The OIS-y magnet (610) can move in the y-axis direction. The OIS-y magnet (610) can move in the y-axis direction relative to the OIS-y coil (620). The OIS-y coil (620) can move the OIS-y magnet (610). The OIS-y coil (620) can be relatively fixed. The OIS-y magnet (610) can move along the y-axis direction with the OIS carrier (310).

[0186] The camera device (10) may include an OIS-y coil (620). The OIS-y driving unit (600) may include an OIS-y coil (620). The OIS-y coil (620) may be placed on a base substrate (120). The OIS-y coil (620) may be placed on the base substrate (120). The OIS-y coil (620) may be placed within the base substrate (120). The OIS-y coil (620) may be placed directly on the base substrate (120). The OIS-y coil (620) may be in contact with the base substrate (120). The OIS-y coil (620) may be fixed to the base substrate (120). The OIS-y coil (620) may be coupled to the base substrate (120). The OIS-y coil (620) can be mounted on the base substrate (120). The OIS-y coil (620) can be soldered to the base substrate (120). The OIS-y coil (620) can be welded to the base substrate (120). The OIS-y coil (620) can be bonded to the base substrate (120) with adhesive. The OIS-y coil (620) can be integrated with the base substrate (120). The OIS-y coil (620) can be placed on the fixed part (100). The OIS-y coil (620) can be placed on the base (110). The OIS-y coil (620) can be placed on the side plate (142) of the cover (140).

[0187] The OIS-y coil (620) can be positioned opposite the OIS-y magnet (610). The OIS-y coil (620) can face the OIS-y magnet (610). The OIS-y coil (620) can correspond to the OIS-y magnet (610). The OIS-y coil (620) can be positioned at a location corresponding to the OIS-y magnet (610). The OIS-y coil (620) can interact with the OIS-y magnet (610). The OIS-y coil (620) can have an electromagnetic interaction with the OIS-y magnet (610). When current is applied to the OIS-y coil (620), an electromagnetic field is formed around the OIS-y coil (620), and the electromagnetic field of the OIS-y coil (620) and the magnetic field of the OIS-y magnet (610) can interact. The OIS-y coil (620) can be superimposed with the OIS-y magnet (610) in a direction perpendicular to the optical axis. For example, the OIS-y coil (620) can be superimposed with the OIS-y magnet (610) in the y-axis direction.

[0188] The camera device (10) may include an OIS-y sensor (630). The OIS-y driving unit (600) may include an OIS-y sensor (630). The OIS-y sensor (630) may be placed on a base substrate (120). The OIS-y sensor (630) may be placed on the base substrate (120). The OIS-y sensor (630) may be placed within the base substrate (120). The OIS-y sensor (630) may be placed directly on the base substrate (120). The OIS-y sensor (630) may be in contact with the base substrate (120). The OIS-y sensor (630) may be fixed to the base substrate (120). The OIS-y sensor (630) may be coupled to the base substrate (120). The OIS-y sensor (630) may be mounted on the base substrate (120). The OIS-y sensor (630) can be soldered to the base substrate (120). The OIS-y sensor (630) can be welded to the base substrate (120). The OIS-y sensor (630) can be bonded to the base substrate (120) with adhesive. The OIS-y sensor (630) can be integrated with the base substrate (120). The OIS-y sensor (630) can be placed in the fixed part (100). The OIS-y sensor (630) can be placed in the base (110). The OIS-y sensor (630) can be placed on the side plate (142) of the cover (140). The OIS-y sensor (630) can be placed within the OIS-y coil (620).

[0189] The OIS-y sensor (630) can detect the OIS-y magnet (610). The OIS-y sensor (630) can detect the magnetic field of the OIS-y magnet (610). The OIS-y sensor (630) may be a Hall sensor. The OIS-y sensor (630) can detect the movement of the OIS-y magnet (610). The OIS-y sensor (630) can detect the position of the OIS-y magnet (610). The OIS-y sensor (630) can face the OIS-y magnet (610). The OIS-y sensor (630) can face the OIS-y magnet (610). The OIS-y sensor (630) can correspond to the OIS-y magnet (610). The OIS-y sensor (630) can be positioned at a location corresponding to the OIS-y magnet (610). The OIS-y sensor (630) can detect the magnetic field of the OIS-y magnet (610) to measure position or movement. The OIS-y magnet (610) can provide a signal for optical image stabilization (OIS) depending on its relative position to the OIS-y sensor (630). The OIS-y magnet (610) can be superimposed on the OIS-y sensor (630) in a direction perpendicular to the optical axis. For example, the OIS-y magnet (610) can be superimposed on the OIS-y sensor (630) in the y-axis direction.

[0190] The camera device (10) may include a connection board (700). The connection board (700) may connect the base (110) and the image sensor (320). The connection board (700) may be coupled to the base (110) and the image sensor (320). The connection board (700) may be coupled to the base (110). The connection board (700) may be coupled to the image sensor (320). The connection board (700) may connect the base (110) and the OIS carrier (310). The connection board (700) may be coupled to the base (110) and the OIS carrier (310). The connection board (700) may be coupled to the base (110). The connection board (700) may be coupled to the OIS carrier (310). The connection board (700) may include a flexible printed circuit board (FPCB). The connecting board (700) may include a flexible substrate. The connecting board (700) may have flexibility. The connecting board (700) may connect the fixed part (100) and the image sensor (320). The connecting board (700) may electrically connect the fixed part (100) and the image sensor (320). The connecting board (700) may connect the base board (120) and the image sensor (320). The connecting board (700) may electrically connect the image sensor (320) and the base board (120).

[0191] The connecting board (700) can supply power to the image sensor (320). The connecting board (700) can movably support the image sensor (320). Since the connecting board (700) must act as an elastic body, it may be formed with a two-layer structure of 0.2 mm or less. However, the first connecting part (710) may be provided with four or more layers, including a rigid part having rigidity.

[0192] The connecting substrate (700) can be formed in a three-sided structure or a "U" shape. Through this, tilt and driving movements can be symmetrical during OIS driving. The connecting substrate (700) can be formed in an L shape in the z-axis direction, that is, in the optical axis direction, to secure sufficient stroke in the z-axis direction and to facilitate spring force adjustment.

[0193] The connecting substrate (700) may include a first coupling portion (710). The first coupling portion (710) may be coupled to the base substrate (120). The first coupling portion (710) may be coupled to a first portion of the base substrate (120).

[0194] The connecting board (700) may include a second coupling portion (720). The second coupling portion (720) may move together with the image sensor (320). The second coupling portion (720) may be coupled to the image sensor board (330). The second coupling portion (720) may be placed on the image sensor board (330). The second coupling portion (720) may be fixed to the image sensor board (330). The second coupling portion (720) may be placed on the lower surface of the image sensor board (330). The second coupling portion (720) may be electrically connected to the image sensor board (330).

[0195] The connecting board (700) may include a connecting portion (730). The connecting portion (730) may connect the first connecting portion (710) and the second connecting portion (720). The connecting portion (730) of the connecting board (700) may have flexibility and may be formed of two or fewer layers. The two layers may include an insulating layer and a metal layer. An EMI shielding film may be disposed on the connecting portion (730). An EMI shielding film may be attached to one side of the connecting board (700) for high-frequency noise suppression and impedance matching.

[0196] The connecting portion (700) may be positioned to form a gap between itself and the image sensor substrate (330) in the direction of the optical axis. Through this, the stroke space of the image sensor substrate (330) in the direction of the optical axis can be secured. The connecting portion (700) may be positioned to form a gap between itself and the base substrate (120) in the direction of the x-axis. The connecting portion (700) may be positioned to form a gap between itself and the base substrate (120) in the direction of the y-axis. Through this, the stroke space of the connecting substrate (700) can be secured during OIS operation.

[0197] The connecting part (730) can move at least a portion of it together with the image sensor (320) when the image sensor (320) moves. The connecting part (730) can elastically support the movement of the image sensor (320).

[0198] The connecting board (700) may include a bend portion (740). The connecting part (730) may include a bend portion (740). The bend portion (740) may be formed in a bent shape. There may be two or more bend portions (740) of the connecting board (700). The bend portion (740) of the connecting board (700) may be formed in multiple numbers. The bend portion (740) may be a bending part.

[0199] The camera device (10) may include a reinforcing member (750). The connecting substrate (700) may include a reinforcing member (750). The reinforcing member (750) may be formed of metal. The reinforcing member (750) may be placed in the bend portion (740). The reinforcing member (750) may be placed in the bend portion (740) so that the shape of the bend portion (740) is maintained. The reinforcing member (750) may be formed of metal. The reinforcing member (750) may be formed of steel. Alternatively, the reinforcing member may be formed of a PI series.

[0200] The camera device (10) may include an AF guide ball (810). The AF guide ball (810) may be positioned between the base (110) and the AF carrier (210). The AF guide ball (810) may be in contact with the base (110) and the AF carrier (210). The AF guide ball (810) may be positioned to connect the base (110) and the AF carrier (210). The AF guide ball (810) may be positioned on the base (110). The AF guide ball (810) may be positioned on the AF carrier (210). The AF guide ball (810) may guide the AF carrier (210) to move in the direction of the optical axis relative to the base (110).

[0201] The AF guide ball (810) may include multiple balls. The AF guide ball (810) may include two sets of balls. The AF guide ball (810) may include two sets of balls, with four balls per set. Of the four balls in one set, two balls may have a large diameter and the other two balls may have a small diameter.

[0202] The camera device (10) may include an OIS guide ball (820). The OIS guide ball (820) may be positioned between the AF carrier (210) and the OIS carrier (310). The OIS guide ball (820) may connect the AF carrier (210) and the OIS carrier (310). The OIS guide ball (820) may be positioned on the AF carrier (210). The OIS guide ball (820) may be positioned directly on the AF carrier (210). The OIS guide ball (820) may be in contact with the AF carrier (210). The OIS guide ball (820) may be positioned on the OIS carrier (310). The OIS guide ball (820) may be positioned directly on the OIS carrier (310). The OIS guide ball (820) may be in contact with the OIS carrier (310). The OIS guide ball (820) can guide the movement of the OIS carrier (310) relative to the AF carrier (210).

[0203] The OIS guide ball (820) can move along the y-axis direction relative to the AF carrier (210). The OIS carrier (310) can move along the x-axis direction relative to the OIS guide ball (820).

[0204] The OIS guide ball (820) may include a plurality of balls. The OIS guide ball (820) may include four balls. The OIS guide ball (820) may include first to fourth balls.

[0205] The first ball can be placed on the first rail (211-1) and the first rail (311-1). The first ball can be placed between the first rail (211-1) and the first rail (311-1). The first ball can be in contact with the first rail (211-1) and the first rail (311-1). The first ball can connect the first rail (211-1) and the first rail (311-1).

[0206] The second ball can be placed on the second rail (211-2) and the second rail (311-2). The second ball can be placed between the second rail (211-2) and the second rail (311-2). The second ball can be in contact with the second rail (211-2) and the second rail (311-2). The second ball can connect the second rail (211-2) and the second rail (311-2).

[0207] The third ball can be placed on the third rail (211-3) and the third rail (311-3). The third ball can be placed between the third rail (211-3) and the third rail (311-3). The third ball can be in contact with the third rail (211-3) and the third rail (311-3). The third ball can connect the third rail (211-3) and the third rail (311-3).

[0208] The fourth ball can be placed on the fourth rail (211-4) and the fourth rail (311-4). The fourth ball can be placed between the fourth rail (211-4) and the fourth rail (311-4). The fourth ball can be in contact with the fourth rail (211-4) and the fourth rail (311-4). The fourth ball can connect the fourth rail (211-4) and the fourth rail (311-4).

[0209] The fourth ball can move in all directions perpendicular to the optical axis.

[0210] The camera device (10) may include an OIS attractive yoke (830). The OIS attractive yoke (830) may be placed on an AF carrier (210). The OIS attractive yoke (830) may overlap with an OIS magnet. The OIS attractive yoke (830) may overlap with the OIS magnet in the optical axis direction. The OIS attractive yoke (830) may overlap with the OIS-x magnet (510) in the optical axis direction. The OIS attractive yoke (830) may overlap with the OIS-y magnet (610) in the optical axis direction. The OIS attractive yoke (830) may include a first yoke that exerts an attractive force with the OIS-x magnet (510) and a second yoke that exerts an attractive force with the OIS-y magnet (610).

[0211] The OIS force yoke (830) can generate a force with the OIS magnet. The OIS guide ball (820) can be pressed between the AF carrier (210) and the OIS carrier (310) by the force between the OIS force yoke (830) and the OIS magnet (510, 610). That is, the OIS guide ball (820) can be maintained in a state of close contact with the AF carrier (210) and the OIS carrier (310) by the force between the OIS force yoke (830) and the OIS magnet (510, 610).

[0212] The camera device (10) may include an AF force yoke (840). The AF force yoke (840) may be placed on a base substrate (120). The AF force yoke (840) may engage with the AF magnet (410). The AF force yoke (840) may be placed at a position corresponding to the AF magnet (410). The AF guide ball (810) may be pressed between the base (110) and the AF carrier (210) by the force between the AF force yoke (840) and the AF magnet (410). That is, the AF guide ball (810) may be maintained in a state of close contact with the base (110) and the AF carrier (210) by the force between the AF force yoke (840) and the AF magnet (410).

[0213] The camera device (10) may include a driver IC (910). The driver IC (910) may be a control unit. The driver IC (910) may supply current to the AF coil (420). The driver IC (910) may supply current to the OIS-x coil (520). The driver IC (910) may supply current to the OIS-y coil (620). The driver IC (910) may be electrically connected to the AF sensor (430). The driver IC (910) may be electrically connected to the OIS-x sensor (530). The driver IC (910) may be electrically connected to the OIS-y sensor (630). The driver IC (910) may be placed on a base substrate (120).

[0214] Each resonant frequency of OIS-x, OIS-y, and AF of the camera device (10) according to the present embodiment can be configured to be 50Hz or higher through a combination of ball grease, a connecting substrate (700), a magnet, and a yoke.

[0215]

[0216] The configuration of a camera device according to a modified example is described below with reference to the drawings.

[0217] FIG. 22 is a plan view of a camera device according to a modified example in which the components such as a cover and a lens holder are omitted. FIG. 23 is a perspective view of the camera device in the state of FIG. 22 viewed from a different direction. FIG. 24 is a perspective view illustrating the driving unit and related components of the camera device according to a modified example. FIG. 25 is a perspective view and a partially enlarged view illustrating the gap formation structure between the base substrate and the connecting substrate of the camera device according to a modified example.

[0218] The configuration of a camera device according to a modified example is described below, focusing on the differences from the present embodiment. Therefore, for configurations of the camera device according to the modified example that are not described, the description in the present embodiment may be applied by analogy.

[0219] A camera device according to a modified example may include an OIS-x driving unit.

[0220] The camera device may include an OIS-x magnet (510a). The OIS-x magnet (510a) may include a first OIS-x magnet (511a) and a second OIS-x magnet (511b). The first OIS-x magnet (511a) and the second OIS-x magnet (511b) may be spaced apart from each other.

[0221] The first OIS-x magnet (511a) may be placed on the first side of the OIS carrier (310). The first OIS-x magnet (511a) may be placed on the first side of the OIS carrier (310). The first OIS-x magnet (511a) may be fixed to the first side of the OIS carrier (310). The first OIS-x magnet (511a) may be coupled to the first side of the OIS carrier (310). The first OIS-x magnet (511a) may be adhered to the first side of the OIS carrier (310) with an adhesive.

[0222] The second OIS-x magnet (512a) may be placed on the first side of the OIS carrier (310). The second OIS-x magnet (512a) may be placed on the first side of the OIS carrier (310). The second OIS-x magnet (512a) may be fixed to the first side of the OIS carrier (310). The second OIS-x magnet (512a) may be coupled to the first side of the OIS carrier (310). The second OIS-x magnet (512a) may be adhered to the first side of the OIS carrier (310) with an adhesive.

[0223] Compared to the present embodiment, it can be understood that the first OIS-x magnet (511) has been omitted.

[0224] The camera device may include an OIS-x coil (520a). The OIS-x coil (520a) may include a first OIS-x coil (521a) and a second OIS-x coil (522a). The first OIS-x coil (521a) and the second OIS-x coil (522a) may be spaced apart from each other. The first OIS-x coil (521a) and the second OIS-x coil (522a) may be electrically isolated from each other. The first OIS-x coil (521a) and the second OIS-x coil (522a) may be powered individually. The first OIS-x coil (521a) and the second OIS-x coil (522a) may be controlled individually.

[0225] The first OIS-x coil (521a) can interact with the first OIS-x magnet (511a). The first OIS-x coil (521a) can have electromagnetic interaction with the first OIS-x magnet (511a). The first OIS-x coil (521a) can face the first OIS-x magnet (511a). The first OIS-x coil (521a) can face the first OIS-x magnet (511a). The first OIS-x coil (521a) can correspond to the first OIS-x magnet (511a). The first OIS-x coil (521a) can be placed at a position corresponding to the first OIS-x magnet (511a). The first OIS-x coil (521a) can be overlapped with the first OIS-x magnet (511a) in the x-axis direction.

[0226] The second OIS-x coil (522a) can interact with the second OIS-x magnet (512a). The second OIS-x coil (522a) can have electromagnetic interaction with the second OIS-x magnet (512a). The second OIS-x coil (522a) can face the second OIS-x magnet (512a). The second OIS-x coil (522a) can face the second OIS-x magnet (512a). The second OIS-x coil (522a) can correspond to the second OIS-x magnet (512a). The second OIS-x coil (522a) can be placed at a position corresponding to the second OIS-x magnet (512a). The second OIS-x coil (522a) can be overlapped with the second OIS-x magnet (512a) in the x-axis direction.

[0227] Compared to the present embodiment, it can be understood that the first OIS-x coil (521) has been omitted.

[0228] The camera device may include an OIS-x sensor (530a). The OIS-x sensor (530a) may include a first OIS-x sensor (531a) and a second OIS-x sensor (532a). The first OIS-x sensor (531a) and the second OIS-x sensor (532a) may be spaced apart from each other. The first OIS-x sensor (531a) and the second OIS-x sensor (532a) may be separated from each other. The first OIS-x sensor (531a) and the second OIS-x sensor (532a) may be electrically separated from each other. The first OIS-x sensor (531a) and the second OIS-x sensor (532a) may be operated individually.

[0229] The first OIS-x sensor (531a) can detect the first OIS-x magnet (511a). The first OIS-x sensor (531a) can detect the magnetic field of the first OIS-x magnet (511a). The first OIS-x sensor (531a) can be positioned opposite the first OIS-x magnet (511a). The first OIS-x sensor (531a) can face the first OIS-x magnet (511a). The first OIS-x sensor (531a) can be positioned at a location corresponding to the first OIS-x magnet (511a).

[0230] The second OIS-x sensor (532a) can detect the second OIS-x magnet (512a). The second OIS-x sensor (532a) can detect the magnetic field of the second OIS-x magnet (512a). The second OIS-x sensor (532a) can be positioned opposite the second OIS-x magnet (512a). The second OIS-x sensor (532a) can face the second OIS-x magnet (512a). The second OIS-x sensor (532a) can be positioned at a location corresponding to the second OIS-x magnet (512a).

[0231] Compared to the present embodiment, it can be understood that the first OIS-x sensor (531) has been omitted.

[0232] In a modified example, the rotation of the OIS carrier (310) can be detected through the first OIS-x sensor (531a) and the second OIS-x sensor (532a). That is, crosstalk can be detected through the first OIS-x sensor (531a) and the second OIS-x sensor (532a). Subsequently, crosstalk can be compensated by individually controlling the current or voltage applied to the first OIS-x coil (521a) and the second OIS-x coil (522a). Furthermore, the OIS carrier (310) can be OIS compensated in the roll direction by controlling the current or voltage applied to the first OIS-x coil (521a) and the second OIS-x coil (522a).

[0233] A camera device according to a modified example may include a base substrate (120). Compared to the present embodiment, the protrusion (113) of the base (110) may be omitted. A protrusion (121) of the base substrate (120) may be formed in the portion where the protrusion (113) of the base (110) is omitted. The base substrate (120) may include a bent portion (122) in the portion extending from the protrusion (121). A gap may be formed between the base substrate (120) and the connecting portion (730) of the connecting substrate (700) by the protrusion (121) and the bent portion (122) of the base substrate (120).

[0234]

[0235] Hereinafter, the auto focus (AF) operation of the camera device according to the present embodiment will be explained with reference to the drawings.

[0236] FIG. 26 is a cross-sectional view illustrating the AF drive of a camera device according to the present embodiment.

[0237] When current is applied to the AF coil (420), the AF magnet (410) can move in the direction of the optical axis due to the electromagnetic interaction between the AF coil (420) and the AF magnet (410) (see B in FIG. 26). At this time, the AF carrier (210), the OIS carrier (310), and the image sensor (320) can move in the direction of the optical axis together with the AF magnet (410) (see A in FIG. 26). Accordingly, the distance between the lens (150) and the image sensor (320) changes, and the focus of the image coupled to the image sensor (320) can be adjusted.

[0238] When a forward current is applied to the AF coil (420), the AF magnet (410) can move upward in the optical axis direction due to the electromagnetic interaction between the AF coil (420) and the AF magnet (410). At this time, the AF carrier (210), the OIS carrier (310), and the image sensor (320) can move upward in the optical axis direction together with the AF magnet (410). Accordingly, the distance between the lens (150) and the image sensor (320) is reduced, so that infinite focus, which is necessary when the subject is far away from the camera device (10), can be performed.

[0239] When a reverse current is applied to the AF coil (420), the AF magnet (410) can move downward in the optical axis direction due to the electromagnetic interaction between the AF coil (420) and the AF magnet (410). At this time, the AF carrier (210), the OIS carrier (310), and the image sensor (320) can move downward in the optical axis direction together with the AF magnet (410). Accordingly, the distance between the lens (150) and the image sensor (320) is increased, so that macro focus required when the subject is close to the camera device (10) can be performed.

[0240] Meanwhile, during the movement of the AF magnet (410), the AF sensor (430) can detect the strength of the magnetic field of the AF magnet (410) to detect the amount of movement or position of the AF magnet (410) in the optical axis direction. Autofocus feedback control can be performed to control the distance between the lens (150) and the image sensor (320) in real time using the amount of movement or position of the AF magnet (410) in the optical axis direction detected by the AF sensor (430).

[0241]

[0242] Hereinafter, the operation of optical image stabilization (OIS) of a camera device according to the present embodiment will be explained with reference to the drawings.

[0243] FIG. 27 is a cross-sectional view illustrating the OIS driving of a camera device according to the present embodiment.

[0244] When power is applied to the OIS coils (520, 620) of the camera device (10) according to the present embodiment, an electromagnetic field is formed around the OIS coils (520, 620), allowing the OIS coils (520, 620) to have electromagnetic interaction with the OIS magnets (510, 610). Through this, the OIS magnets (510, 610) can move in a direction perpendicular to the optical axis. At this time, the OIS carrier (310) and the image sensor (320) can move together with the OIS magnets (510, 610) in a direction perpendicular to the optical axis (see A in FIG. 27). In this embodiment, the OIS coil (520, 620) and OIS magnet (510, 610) move the image sensor (320) to compensate for shaking of the camera device (10) detected by the gyro sensor, thereby enabling a hand shake correction function.

[0245] When current is applied to the OIS-x coil (520), the OIS-x magnet (510) can move in the x-axis direction perpendicular to the optical axis due to the electromagnetic interaction between the OIS-x coil (520) and the OIS-x magnet (510) (see B1, B2, B3 in FIG. 27). At this time, the OIS carrier (310) and the image sensor (320) can move in the x-axis direction together with the OIS-x magnet (510) (see A in FIG. 27). More specifically, when a forward current is applied to the OIS-x coil (520), the OIS-x magnet (510), the OIS carrier (310), and the image sensor (320) can move in one direction along the x-axis. Additionally, when a reverse current is applied to the OIS-x coil (520), the OIS-x magnet (510), OIS carrier (310), and image sensor (320) can move in the other direction on the x-axis.

[0246] More specifically, when power is applied to the first OIS-x coil (521), an electromagnetic field is formed around the first OIS-x coil (521), allowing the first OIS-x coil (521) to have electromagnetic interaction with the first OIS-x magnet (511). Through this, the first OIS-x magnet (511) can move in the x-axis direction perpendicular to the optical axis direction (see B1 in FIG. 27). Additionally, when power is applied to the second OIS-x coil (522), an electromagnetic field is formed around the second OIS-x coil (522), allowing the second OIS-x coil (522) to have electromagnetic interaction with the second OIS-x magnet (512). Through this, the second OIS-x magnet (512) can move in the x-axis direction perpendicular to the optical axis direction (see B2 in FIG. 27). Additionally, when power is applied to the third OIS-x coil (523), an electromagnetic field is formed around the third OIS-x coil (523), allowing the third OIS-x coil (523) to have electromagnetic interaction with the third OIS-x magnet (513). Through this, the third OIS-x magnet (513) can move in the x-axis direction perpendicular to the optical axis direction (see B3 in FIG. 27).

[0247] Furthermore, in this embodiment, when crosstalk occurs during OIS driving, the crosstalk can be compensated by adjusting the intensity of the current applied to the first OIS-x coil (521), the second OIS-x coil (522), and the third OIS-x coil (523). More specifically, when driving current is applied to move the image sensor (320) in the x-axis direction or the y-axis direction, but the image sensor (320) rotates, at least two of the first OIS-x sensor (531), the second OIS-x sensor (532), and the third OIS-x sensor (533) can detect the rotation of the image sensor (320). When rotation of the image sensor (320) is detected by the first OIS-x sensor (531), the second OIS-x sensor (532), and the third OIS-x sensor (533), the intensity of the current applied to the first OIS-x coil (521), the second OIS-x coil (522), and the third OIS-x coil (523) can be controlled to rotate the image sensor (320) in the opposite direction. That is, the rotation of the image sensor (320) can be compensated for and canceled out. Through this, more precise hand shake correction driving can be performed.

[0248] In addition, beyond crosstalk compensation, the image sensor (320) may be rotated to perform additional shake correction driving in the roll direction, that is, in the rotation direction centered on the optical axis. The image sensor (320) can be driven in a rolling manner by controlling the intensity of the current applied to the first OIS-x coil (521), the second OIS-x coil (522), and the third OIS-x coil (523) differently.

[0249] The OIS-x sensor (530) can detect the amount of movement or position of the OIS-x magnet (510) by detecting the strength of the magnetic field of the OIS-x magnet (510). Using the amount of movement or position of the OIS-x magnet (510) detected by the OIS-x sensor (530), x-axis direction shake correction feedback control can be performed to control the relative position of the image sensor (320) with respect to the lens (150) in real time.

[0250] When current is applied to the OIS-y coil (620), the OIS-y magnet (610) can move in the y-axis direction perpendicular to the optical axis due to the electromagnetic interaction between the OIS-y coil (620) and the OIS-y magnet (610) (see C in FIG. 27). At this time, the OIS carrier (310) and the image sensor (320) can move in the y-axis direction together with the OIS-y magnet (610) (see A in FIG. 27). More specifically, when a forward current is applied to the OIS-y coil (620), the OIS-y magnet (610), the OIS carrier (310), and the image sensor (320) can move in one direction along the y-axis. Additionally, when a reverse current is applied to the OIS-y coil (620), the OIS-y magnet (610), OIS carrier (310), and image sensor (320) can move in the other direction on the y-axis.

[0251] The OIS-y sensor (630) can detect the magnetic field strength of the OIS-y magnet (610) to detect the amount of movement or position of the OIS-y magnet (610). Using the amount of movement or position of the OIS-y magnet (610) detected by the OIS-y sensor (630), y-axis direction shake correction feedback control can be performed to control the relative position of the image sensor (320) with respect to the lens (150) in real time.

[0252]

[0253] Hereinafter, an optical device according to the present embodiment will be described with reference to the drawings.

[0254] FIG. 28 is a perspective view of an optical device according to the present embodiment.

[0255] The optical device (1) may include one or more of a mobile phone, mobile phone, portable terminal, mobile terminal, smartphone, smart pad, portable smart device, digital camera, laptop computer, digital broadcasting terminal, PDA (Personal Digital Assistants), PMP (Portable Multimedia Player), and navigation. The optical device (1) may be placed in a vehicle. The optical device (1) may be placed in a robot. The optical device (1) may include any device for capturing images or photographs.

[0256] The optical device (1) may include a main body (20). The optical device (1) may include a camera device (10). The camera device (10) may be placed on the main body (20). The camera device (10) may photograph a subject. The optical device (1) may include a display. The display may be placed on the main body (20). The display may output one or more of the images and video captured by the camera device (10). The display may be placed on a first surface of the main body (20). The camera device (10) may be placed on one or more of the first surface of the main body (20) and the second surface opposite the first surface. As shown in FIG. 28, the camera device (10) may have a triple camera arranged vertically. As a variation, the camera device may have a triple camera arranged horizontally.

[0257]

[0258] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without changing its technical concept or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive.

Claims

1. A first carrier comprising a first side and a second side positioned opposite each other, and a third side and a fourth side positioned opposite each other; A first magnet disposed on the first side of the first carrier; A second magnet and a third magnet disposed on the second side of the first carrier; A first coil interacting with the first magnet above; A second coil interacting with the second magnet; and It includes a third coil that interacts with the third magnet, and The second magnet and the third magnet are spaced apart from each other, A camera device comprising a first magnet that is positioned in a location corresponding to the space between the second magnet and the third magnet in a direction in which the second side faces the first side, and includes a first portion that does not overlap with the second magnet and the third magnet.

2. In Paragraph 1, The first magnet includes a second portion that overlaps with the second magnet in a direction in which the second side faces the first side, and a third portion that overlaps with the third magnet in a direction in which the second side faces the first side. The first part of the first magnet is a camera device positioned between the second part and the third part.

3. In Paragraph 1, A camera device in which the length of the first magnet is longer than the length of the second magnet, with the third side facing the fourth side.

4. In Paragraph 1, A camera device in which the third side faces the fourth side, and the distance between the second magnet and the third magnet is longer than the length of the second magnet.

5. In Paragraph 1, A camera device in which the third side faces the fourth side, and the distance between the second magnet and the third magnet is 0.82 to 0.92 of the length of the first magnet.

6. In Paragraph 1, A first sensor for detecting the first magnet; A second sensor for detecting the second magnet; and A camera device including a third sensor that detects the third magnet.

7. In Paragraph 6, A camera device in which the second side faces the first side, and the second sensor and the third sensor each overlap with the first magnet.

8. In Paragraph 1, The first coil, the second coil, and the third coil are electrically separated from each other and receive current separately, and When the current applied to the second coil and the third coil is controlled differently, the first carrier is a rotating camera device.

9. In Paragraph 1, A camera device in which the current applied to the second coil and the third coil is controlled so that a force is generated in opposite directions between the second coil and the second magnet and between the third coil and the third magnet.

10. In Paragraph 1, The first magnet and the first coil, the second magnet and the second coil, and the third magnet and the third coil are a camera device that moves the first carrier in a first direction perpendicular to the optical axis.

Images