Thermal management system, vehicle, control method for thermal management system, and storage medium

WO2026199180A1PCT designated stage Publication Date: 2026-10-01YINWANG INTELLIGENT TECHNOLOGIES CO LTD
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Patent Information

Application Number
PCT/CN2025/084797
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-25
Publication Date
2026-10-01

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Abstract

A thermal management system, a vehicle, a control method for a thermal management system, and a storage medium. A communication mechanism (500) of the thermal management system comprises a first three-way connector (510) and a second three-way connector (520), wherein a first inlet (511) is in communication with a second liquid output end (320), a first outlet (512) is in communication with a first liquid inlet (210), a first liquid outlet (220) is in communication with a first liquid intake end (110), a second outlet (513) is in communication with a second liquid inlet (410), a second inlet (521) is in communication with a first liquid output end (120), a third inlet (522) is in communication with a second liquid outlet (420), and a third outlet (523) is in communication with a second liquid intake end (310); or, the communication mechanism (500) comprises a four-way connector (530), wherein a fourth inlet (531) is in communication with the second liquid output end (320), a fourth outlet (533) is in communication with the first liquid inlet (210), a fifth inlet (532) is in communication with the first liquid output end (120), a fifth outlet (534) is in communication with the second liquid inlet (410), and the second liquid outlet (420) is in communication with the second liquid intake end (310). The thermal management system can perform independent temperature control management on at least one heating element, and can reduce the operating energy consumption of the thermal management system, thereby improving the use flexibility and practicability of the thermal management system.
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Description

Thermal management system, vehicle, control method and storage medium of thermal management system Technical Field

[0001] This application relates to the field of thermal management technology, and in particular to a thermal management system, a vehicle, a control method for the thermal management system, and a storage medium. Background Technology

[0002] Thermal management systems are an important component of new energy vehicles. They are used to support the heat dissipation of various heat-generating components in the vehicle to maintain their normal operation.

[0003] The thermal management system includes multiple heat-generating components, such as the vehicle's battery, electric drive structure, headlights, lidar, intelligent driving domain controller, and vehicle infotainment system. The heat dissipation of these components requires temperature control management through the thermal management system.

[0004] However, the thermal management systems mentioned above have poor flexibility and practicality, consume a lot of energy during operation, and lead to increased energy consumption in vehicles. Summary of the Invention

[0005] This application provides a thermal management system, a vehicle, a control method for the thermal management system, and a storage medium, which can individually control the temperature of at least one heat-generating component, reduce the operating energy consumption of the thermal management system, improve the flexibility and practicality of the thermal management system, and reduce the energy consumption of the vehicle.

[0006] A first aspect of this application provides a thermal management system, including a first cooling circuit and a second cooling circuit for coolant flow: the first cooling circuit includes a first heat dissipation structure and a first water pump, the first heat dissipation structure is used to dissipate heat for a first heat-generating component, the first heat dissipation structure has a first flow channel for coolant flow and a first inlet end and a first outlet end communicating with the first flow channel; the second cooling circuit includes a second heat dissipation structure and a second water pump, the second heat dissipation structure is used to dissipate heat for a second heat-generating component, the second heat dissipation structure has a second flow channel for coolant flow and a second inlet end and a second outlet end communicating with the second flow channel; the first water pump includes a first inlet port and a first outlet port, the first outlet port being connected to the first inlet port... The second water pump includes a second inlet and a second outlet; a connecting mechanism includes a first tee connector and a second tee connector; the first tee connector includes a first inlet, a first outlet and a second outlet that are interconnected, the first inlet connecting to the second outlet of the second heat dissipation structure, the first outlet connecting to the first inlet of the first water pump, and the second outlet connecting to the second inlet of the second water pump; the second tee connector includes a second inlet, a third inlet and a third outlet that are interconnected, the second inlet connecting to the first outlet of the first heat dissipation structure, the third inlet connecting to the second outlet of the second water pump, and the third outlet connecting to the second inlet of the second heat dissipation structure.

[0007] Alternatively, the communication mechanism may include a four-way connector;

[0008] The four-way connector includes a fourth inlet, a fifth inlet, a fourth outlet, and a fifth outlet that are interconnected; the fourth inlet is connected to the second liquid outlet of the second heat dissipation structure, the fourth outlet is connected to the first liquid inlet of the first water pump, the fifth inlet is connected to the first liquid outlet of the first heat dissipation structure, the fifth outlet is connected to the second liquid inlet of the second water pump, and the second liquid outlet of the second water pump is connected to the second liquid inlet of the second heat dissipation structure.

[0009] This application provides a thermal management system. The thermal management system connects a first heat dissipation structure and a first water pump through a first cooling circuit, forming a circuit for coolant circulation. The first water pump pumps coolant to the first heat dissipation structure. The first water pump independently controls the flow rate of coolant through the first heat dissipation structure, enabling independent driving of coolant in the first cooling circuit without activating other cooling circuits in the thermal management system. This allows for independent thermal management of the first heat-generating component, improving the flexibility of the thermal management system and reducing the energy consumption of the entire thermal management system when thermally managing the first heat-generating component, thereby helping to reduce vehicle energy consumption.

[0010] When the connecting mechanism includes a first tee connector and a second tee connector, the first cooling circuit can be connected to the second cooling circuit through the first tee connector and the second tee connector. Specifically, the second liquid outlet is connected to the first inlet, the first outlet is connected to the first liquid inlet, the first liquid outlet is connected to the first liquid inlet, the first liquid outlet can be connected to the second inlet, and the third outlet can be connected to the second liquid inlet.

[0011] In this way, the first cooling circuit can share the coolant in the second cooling circuit, and the coolant flowing out of the first heat dissipation structure can pass through the second heat dissipation structure again when the second water pump is not working. The second heat dissipation structure can help absorb the heat in the coolant to reduce the temperature of the coolant, and can make the coolant delivered to the first heat dissipation structure absorb more heat, thereby improving the heat exchange between the first heat dissipation structure and the coolant, and improving the heat dissipation effect of the first heat dissipation structure on the first heat-generating component.

[0012] Since the second heat dissipation structure can be used to assist the heat dissipation of the first heat-generating component without starting the second water pump, it can not only improve the heat dissipation effect of the first heat-generating component, but also reduce the energy consumption of the thermal management system and the energy consumption of the vehicle.

[0013] Furthermore, the second outlet is connected to the second inlet, and the second outlet is connected to the third inlet, thereby enabling the second heat dissipation structure and the second water pump to be connected through the first tee connector and the second tee connector. This allows the second water pump to regulate the flow rate of the coolant in the second flow channel of the second heat dissipation structure. When both the first and second water pumps are working, in addition to dissipating heat from the second heat-generating component, the flow rate of the coolant flowing through the first and second heat dissipation structures can be further increased to further improve the heat dissipation effect on the first heat-generating component. This also enhances the flexibility and practicality of the thermal management system.

[0014] In addition, when the connecting mechanism includes a four-way connector, the first cooling circuit and the second cooling circuit can be connected through the four-way connector. Specifically, the second liquid outlet is connected to the fourth inlet, the fourth outlet is connected to the first liquid inlet, the first liquid outlet is connected to the first liquid inlet, the first liquid outlet is connected to the fifth inlet, the fifth inlet is connected to the second liquid inlet, and the second liquid outlet is connected to the second liquid inlet.

[0015] The first and second cooling circuits can both operate independently via a four-way connector. For example, if the heat generated by the first heating element is low, the second cooling circuit can be shut down, and the first cooling circuit can operate independently via the four-way connector to perform thermal management for the first heating element. This ensures that thermal management of the first heating element is performed without requiring additional cooling circuits in the thermal management system to participate in the thermal management of the first heating element, thereby reducing the energy consumption of the thermal management system when performing thermal management of the first heating element and also reducing the energy consumption of the vehicle.

[0016] By using a four-way connector, the second cooling circuit can also work in conjunction with the first cooling circuit to dissipate heat from the first heat-generating component. Specifically, the first and second water pumps operate simultaneously, and the coolant circulates between the first and second cooling circuits. The second water pump delivers the coolant from the second cooling circuit to the four-way connector via the second heat dissipation structure, and then further delivers it to the first water pump. This allows the second cooling circuit to work in conjunction with the first cooling circuit to dissipate heat from the first heat-generating component, improving the flexibility and practicality of the thermal management system.

[0017] Furthermore, by connecting the first cooling circuit and the second cooling circuit, and when both the first cooling circuit and the second cooling circuit are activated, since the second heat dissipation structure can be used to dissipate heat for the second heat-generating component, the coolant after heat exchange with the second heat-generating component is transported back to the first cooling circuit through the four-way connector and used to dissipate heat for the first heat-generating component. This fully utilizes the coolant to dissipate heat for the first heat-generating component in the first cooling circuit and the second heat-generating component in the second cooling circuit, thus improving the practicality of the thermal management system.

[0018] This application also provides a thermal management system, including:

[0019] The first heat dissipation structure has a first flow channel for coolant to flow through and a first inlet end and a first outlet end connecting the first flow channel. The first heat dissipation structure is used to dissipate heat for the first heat-generating component.

[0020] The first water pump includes a first inlet and a first outlet, wherein the first outlet is connected to the first inlet.

[0021] Connecting mechanism;

[0022] The connecting mechanism includes a first tee connector and a second tee connector;

[0023] The first three-way connector includes a first inlet, a first outlet, and a second outlet that are interconnected. The first inlet is used to connect to the second liquid outlet of the second heat dissipation structure, the first outlet is connected to the first liquid inlet of the first water pump, and the second outlet is used to connect to the second liquid inlet of the second water pump.

[0024] The second three-way connector includes a second inlet, a third inlet, and a third outlet that are interconnected. The second inlet is connected to the first liquid outlet of the first heat dissipation structure, and the third inlet is used to connect to the second liquid outlet of the second water pump. The third outlet is used to connect to the second liquid inlet of the second heat dissipation structure.

[0025] The second heat dissipation structure is used to dissipate heat for the second heat-generating component, and the second water pump is used to drive the coolant to flow from the second inlet end of the second heat dissipation structure to the second outlet end.

[0026] Alternatively, the communication mechanism may include a four-way connector;

[0027] The four-way connector includes a fourth inlet, a fifth inlet, a fourth outlet, and a fifth outlet that are interconnected.

[0028] The fourth inlet is used to communicate with the second liquid outlet of the second heat dissipation structure, the fourth outlet is used to communicate with the first liquid inlet of the first water pump, the fifth inlet is used to communicate with the first liquid outlet of the first heat dissipation structure, and the fifth outlet is used to communicate with the second liquid inlet of the second water pump.

[0029] The second outlet of the second water pump is used to connect with the second inlet of the second heat dissipation structure.

[0030] In one possible implementation, the connecting mechanism includes the first tee connector and the second tee connector;

[0031] The thermal management system further includes a check valve structure, which is used to prevent coolant flowing out of the first outlet from flowing back into the first flow channel.

[0032] In this way, by setting a check structure, the coolant flowing out of the first outlet end is prevented from flowing back into the first flow channel, thereby avoiding the coolant backflow affecting the heat dissipation effect of the first heat dissipation structure on the first heat-generating component.

[0033] In one possible implementation, the check valve is disposed within the second tee connector, and the check valve is used to prevent coolant from flowing from the second inlet to the first outlet.

[0034] In this way, by placing the check valve structure inside the second tee connector, the check valve structure and the second tee connector can be integrated into a single design, simplifying the layout of the first cooling circuit and reducing the risk of leakage.

[0035] In one possible implementation, the connecting mechanism is the four-way connector;

[0036] The four-way connector has a liquid storage chamber inside, which is connected to the fourth inlet, the fifth inlet, the fourth outlet and the fifth outlet. The liquid storage chamber is used to store coolant.

[0037] In this way, by setting a liquid storage chamber inside the four-way connector, it is possible to store some coolant inside the four-way connector, thereby ensuring that there is enough coolant in the first cooling circuit for the heat dissipation of the first heat dissipation structure.

[0038] Furthermore, the liquid storage chamber inside the four-way connector can reduce pressure fluctuations in the first flow channel by absorbing the volume changes of the coolant due to thermal expansion and contraction. At the same time, the liquid storage chamber can also serve as a gas-liquid separation zone, reducing the interference of air bubbles on the flow of coolant in the first cooling circuit.

[0039] In one possible implementation, a third heat dissipation structure is also included, which is used to dissipate heat for the third heat-generating component;

[0040] The third heat dissipation structure includes a third flow channel and a third liquid inlet and a third liquid outlet connected to the third flow channel.

[0041] The outlet of the first water pump is connected to the third inlet, and the third outlet is connected to the first inlet of the first heat dissipation structure, so that the first heat dissipation structure and the third heat dissipation structure are connected in series.

[0042] In this way, by using the third heat dissipation structure in series with the first heat dissipation structure, the coolant in the first cooling circuit can be fully utilized to dissipate heat for both the first and third heat-generating components. It can also utilize the residual coolant to dissipate heat for the first heat dissipation structure, thereby improving the utilization rate of the coolant, reducing the need for an independent water pump, reducing the energy consumption of the thermal management system, and improving the practicality of the thermal management system.

[0043] In one possible implementation, the third heat dissipation structure is located between the first heat dissipation structure and the connecting mechanism along a first direction, where the first direction is the height direction.

[0044] In one possible implementation, along the first direction, the third liquid inlet of the third heat dissipation structure is lower than the third liquid outlet, and the third liquid outlet is lower than the first liquid inlet of the first heat dissipation structure.

[0045] In this way, by making the third liquid inlet end of the third heat dissipation structure lower than the third liquid outlet end, and the third liquid outlet end lower than the first liquid inlet end of the first heat dissipation structure, the problem of air trapping in the first or third flow channel when the coolant flows through the third and first heat dissipation structures can be avoided. This can prevent air bubbles from being generated in the first and second flow channels due to air trapping, and thus prevent air bubbles from hindering the flow of coolant and affecting the heat dissipation effect on the first and third heat-generating components.

[0046] In one possible implementation, the heating power of the third heating element is less than or equal to a first preset value.

[0047] In this way, by making the heating power of the third heating element less than the first preset value, it can be ensured that the third heating element connected in series will not affect the heat dissipation efficiency of the first heating element due to overload, thereby further improving the layout rationality and practicality of the thermal management system.

[0048] In one possible implementation, the first cooling circuit further includes a fourth heat dissipation structure, which is used to dissipate heat for the fourth heat-generating component.

[0049] The fourth heat dissipation structure includes a fourth flow channel, and a fourth liquid inlet and a fourth liquid outlet connected to the fourth flow channel.

[0050] The fourth liquid inlet is connected to the first water pump, and the fourth liquid outlet is connected to the second liquid inlet of the second heat dissipation structure through the connecting mechanism, so that the fourth heat dissipation structure and the first heat dissipation structure are arranged in parallel.

[0051] In this way, by setting a fourth heat dissipation structure in parallel with the first heat dissipation structure in the first cooling circuit, the flow rate of coolant flowing through the first heat dissipation structure and the fourth heat dissipation structure can be independently controlled, so as to avoid one of the first heat-generating components or the fourth heat-generating component taking away the cooling resources of the other heat-generating component when the heat generation of one of them is too large.

[0052] In one possible implementation, the connecting mechanism includes the first tee connector and the second tee connector, and the thermal management system further includes a control mechanism;

[0053] The control mechanism is electrically connected to the first water pump, and the control mechanism controls the first water pump to adjust the flow rate of the coolant in the first flow channel according to the temperature of the coolant in the first flow channel.

[0054] In this way, the thermal management system, through the setting of a control mechanism, can detect the temperature of the coolant in the first flow channel and control the first water pump to adjust the flow rate of the coolant in the first flow channel based on the detected coolant temperature. This achieves automated adjustment of the coolant flow rate in the first cooling circuit and improves the flexibility of thermal management of the first heat-generating component in the first cooling circuit, thereby enhancing the usability of the thermal management system.

[0055] In one possible implementation, the control mechanism is specifically used for:

[0056] During the operation of the first heating element, the temperature of the coolant in the first flow channel is obtained, and...

[0057] When the temperature of the coolant in the first flow channel is lower than a first temperature threshold, the speed of the first water pump is controlled to reduce the flow rate of the coolant in the first flow channel; and / or,

[0058] When the temperature of the coolant in the first flow channel is greater than or equal to the first temperature threshold and less than the second temperature threshold, the rotational speed of the first water pump is maintained; and / or,

[0059] When the temperature of the coolant in the first flow channel is greater than the second temperature threshold, the speed of the first water pump is controlled to increase the flow rate of the coolant in the first flow channel.

[0060] This reduces the energy consumption of the first water pump, which in turn reduces the energy consumption of the thermal management system.

[0061] Furthermore, by controlling the speed of the first water pump when the temperature of the coolant in the first flow channel is lower than the first temperature threshold, the flow rate of the coolant in the first flow channel is reduced, which can prevent condensation from forming near the first heating element due to the low temperature, thereby preventing corrosion or water ingress damage to the first heating element.

[0062] In one possible implementation, the communication mechanism includes the four-way connector, and the thermal management system further includes a control mechanism;

[0063] The control mechanism is electrically connected to both the first water pump and the second water pump;

[0064] The control mechanism is used to control the first water pump to adjust the flow rate of the coolant in the first flow channel according to the temperature of the coolant in the first flow channel.

[0065] The control mechanism is also used to control the second water pump to drive the coolant flowing out of the fifth outlet of the four-way connector to flow through the second heat dissipation structure and the four-way connector according to the temperature of the coolant in the first flow channel, and then be delivered to the first heat dissipation structure again by the first water pump.

[0066] In this way, by setting up a control mechanism, the first water pump can be dynamically adjusted. For example, when only the coolant in the first cooling circuit is flowing, the speed of the first water pump can be adjusted to adjust the flow rate of the coolant in the first cooling circuit. With the first heat dissipation structure unchanged, the flow rate of the coolant flowing through the first flow channel can be adjusted to ensure that the heat dissipation effect of the first heat-generating component is guaranteed while avoiding energy waste of the first water pump.

[0067] The control mechanism can control the second water pump in addition to the first water pump, thereby increasing the control range of the control mechanism. It can also connect the coolant of the second cooling circuit to the first cooling circuit, enabling the second heat dissipation structure to assist in the cooling of the coolant, further reducing the temperature of the coolant flowing out of the first heat dissipation structure, and further increasing the heat exchange between the coolant and the first heat dissipation structure, thus improving the heat dissipation effect on the first heat-generating component.

[0068] In one possible implementation, the control mechanism is specifically used for:

[0069] During the operation of the first heating element, the temperature of the coolant in the first flow channel is obtained, and...

[0070] When the temperature of the coolant in the first flow channel is lower than a first temperature threshold, the speed of the first water pump is controlled to reduce the flow rate of the coolant in the first flow channel; and / or,

[0071] When the temperature of the coolant in the first flow channel is greater than or equal to the first temperature threshold and less than the second temperature threshold, the rotational speed of the first water pump is maintained; and / or,

[0072] When the temperature of the coolant in the first flow channel is greater than the second temperature threshold, the speed of the first water pump is controlled to increase the flow rate of the coolant in the first flow channel.

[0073] In this way, by controlling the speed of the first water pump when the temperature of the coolant in the first flow channel is lower than the first temperature threshold, the flow rate of the coolant in the first flow channel is reduced, which can prevent condensation from occurring near the first heating element due to the low temperature.

[0074] The control mechanism can also be specifically used to acquire the temperature of the coolant in the first flow channel during the operation of the first heating element, and maintain the speed of the first water pump when the temperature of the coolant in the first flow channel is greater than or equal to a first temperature threshold and less than a second temperature threshold. This ensures the heat dissipation effect of the first cooling circuit on the first heating element while preventing the energy consumption of the first water pump from increasing due to excessive speed.

[0075] The control mechanism is specifically used to obtain the temperature of the coolant in the first flow channel during the operation of the first heating element, and control the speed of the first water pump when the temperature of the coolant in the first flow channel is greater than the second temperature threshold, so as to increase the flow rate of the coolant in the first flow channel, thereby ensuring that the first heat dissipation structure can dissipate heat from the first heating element in a timely manner, thereby preventing the first heating element from being damaged due to overheating.

[0076] In this way, by using the control mechanism to adjust the first water pump in stages, the first heating element can be cooled on demand, avoiding energy waste of the first water pump and achieving the effect of reducing the energy consumption of the thermal management system.

[0077] In one possible implementation, when the temperature of the coolant in the first flow channel is greater than the second temperature threshold, controlling the rotational speed of the first water pump to increase the flow rate of the coolant in the first flow channel includes:

[0078] When the temperature of the coolant in the first flow channel is greater than or equal to the second temperature threshold and less than the third temperature threshold, the speed of the first water pump is controlled to increase the flow rate of the coolant in the first flow channel.

[0079] The control mechanism is further configured to, when the temperature of the coolant in the first flow channel is greater than the third temperature threshold and there is flow in the second flow channel, control the rotational speed of the second water pump, thereby increasing the flow rate of the coolant in the second flow channel; and / or,

[0080] If the temperature of the coolant in the second flow channel is greater than the third temperature threshold and there is no flow in the second flow channel, the second water pump is controlled to start.

[0081] In this way, the first cooling circuit and the second cooling circuit can work together, and by adjusting the flow rate of the coolant flowing through the second channel in the second cooling circuit, the flow rate of the coolant flowing through the first channel can be further increased, thereby further improving the heat dissipation effect on the first heat-generating component and preventing thermal runaway of the first heat-generating component.

[0082] In one possible implementation, the thermal management system further includes a fifth heat dissipation structure disposed on the four-way connector near the liquid storage chamber.

[0083] In this way, by setting a fifth heat dissipation structure on the four-way connector, the heat dissipation effect of the coolant can be further improved, and the temperature of the coolant after heat exchange can be further reduced, which helps to improve the heat dissipation effect of the first heat-generating component.

[0084] In one possible implementation, the fifth heat dissipation structure is a heat dissipation tooth.

[0085] In this way, by setting the fifth heat dissipation structure as heat dissipation teeth, the surface area of ​​the four-way connector can be increased, the natural heat dissipation capacity can be improved, the heat dissipation teeth can dissipate heat from the four-way connector through natural convection, and can also enhance the passive cooling capacity of the coolant.

[0086] In one possible implementation, the thermal management system further includes a gas-liquid separator for separating the coolant flowing from the communication mechanism to the first water pump into gas and liquid components.

[0087] In this way, by setting up a gas-liquid separator, the thermal management system can reduce air bubbles in the coolant flowing to the first water pump through the connecting mechanism, thereby reducing the impact of air bubbles on the first water pump and reducing the gas in the coolant flowing to the first flow channel, thus avoiding the formation of air bubbles in the first flow channel, which would affect the flow of coolant and the heat dissipation effect of the first heat dissipation structure.

[0088] In one possible implementation, the gas-liquid separator is disposed between the first water pump and the communication mechanism;

[0089] Alternatively, the gas-liquid separator may be disposed within the communication mechanism.

[0090] In this way, by placing the gas-liquid separator inside the connecting mechanism, the gas-liquid separator and the connecting mechanism can be integrated, simplifying the pipeline layout of the first cooling circuit and improving the assembly efficiency of the first cooling circuit.

[0091] In one possible implementation, the first heat-generating element is an optomechanical system, and the first heat dissipation structure is a first cold plate.

[0092] In this way, by setting the first heat dissipation structure as the first cold plate, the heat dissipation effect of the optical engine can be significantly improved compared to using an air-cooled structure. Furthermore, the noise of the cold plate is relatively lower than that of the air-cooled structure, which helps improve the user experience and reduces the impact of noise on users. Additionally, since air-cooled fans are prone to accumulating dust and other debris and are difficult to clean, the first cold plate is much easier to clean than air-cooled structures, making it less prone to dust and other debris buildup.

[0093] In one possible implementation, the second heat-generating element is a battery, and the second heat dissipation structure is a second cold plate.

[0094] With both the battery and the optical engine operating, the second cold plate can dissipate heat from the battery. Furthermore, the coolant within the second cold plate, after cooling the battery, can also be supplied to the first cooling circuit to dissipate heat from the optical engine. This improves the utilization rate of the coolant and enhances the practicality of the thermal management system.

[0095] In one possible implementation, the second heating element is a motor, and the second heat dissipation structure is a front-end heat sink.

[0096] In this way, by setting the second heating element as a motor and the second heat dissipation mechanism as a front heat sink, when both the motor and the optical engine are working, it is possible to deliver the coolant after cooling the motor to the optical engine in the first cooling circuit, so that the coolant after cooling the motor can be further used for cooling the optical engine.

[0097] In one possible implementation, the third heat dissipation structure is a third cold plate.

[0098] In this way, by setting the third heat dissipation structure as the third cold plate, the heat exchange effect between the third heat dissipation structure and the third heat-generating component can be improved, so that the third heat dissipation structure can transfer the heat dissipated by the third heat-generating component to the cooling medium in the third flow channel.

[0099] In one possible implementation, the thermal management system further includes a thermoelectric cooler, the cooling surface of which is connected to the first heating element, and the heat dissipation surface of which is connected to the first heat dissipation structure. The thermoelectric cooler is used to absorb heat from the first heating element and transfer it to the first heat dissipation structure.

[0100] In one possible implementation, the thermal management system further includes a first thermal conductive element, which is used to connect the first heating element to the first heat dissipation structure and to transfer heat from the first heating element to the first heat dissipation structure.

[0101] In this way, by placing the thermoelectric cooler between the first heating element and the first heat dissipation structure, the thermoelectric cooler can actively absorb heat from hot spots with high local heat generation on the first heating element (such as optomechanical chips) and transfer the absorbed heat to the first heat dissipation structure, thereby improving the heat dissipation effect on the first heating element.

[0102] In one possible implementation, the first thermal conductive element includes silicone grease, thermal gel, or thermal pad.

[0103] In this way, by setting the first thermal conductive element as silicone grease, thermal gel or thermal pad, the structure of the first thermal conductive element can be simplified, making it easier to install the first thermal conductive element between the first heat-generating element and the first heat dissipation structure. Moreover, the cost of silicone grease, thermal gel and thermal pad is relatively low, which can reduce the manufacturing cost of the first thermal conductive element, and thus reduce the manufacturing cost of the thermal management system.

[0104] In one possible implementation, the thermal management system further includes a second heat-conducting element, one end of which is connected to the first heat dissipation structure, and the other end of which is connected to the side of the first heat-generating element away from the first heat dissipation structure. The second heat-conducting element is used to transfer heat from the side of the first heat-generating element away from the first heat dissipation structure to the first heat dissipation structure.

[0105] In this way, the thermal management system includes a second heat-conducting element, with one end of the second heat-conducting element connected to the first heat dissipation structure and the other end of the second heat-conducting element connected to the side of the first heating element that is far from the first heat dissipation structure. This enables the heat dissipated from the side of the first heating element that is far from the first heat dissipation structure to be transferred to the first heat dissipation structure through the second heat-conducting element. This improves the heat transfer efficiency between the side of the first heating element that is far from the first heat dissipation structure and the first heat dissipation structure, thereby making the heat dissipation on the first heating element more uniform and improving the heat dissipation efficiency of the first heating element.

[0106] In one possible implementation, the second heat-conducting element is a heat pipe or a copper strip.

[0107] In this way, by setting the second heat-conducting element as a heat pipe, which is a double-sided heat-conducting element with extremely high thermal conductivity, it can transfer a large amount of heat in a short time, which helps to shorten the heat transfer time between the end of the first heat-generating element that is far away from the first heat dissipation structure and the first heat dissipation structure, and improves the heat transfer efficiency.

[0108] In one possible implementation, the first heat dissipation structure is located above the connecting mechanism in a first direction, where the first direction is the height direction.

[0109] Because a first water pump is installed in the first cooling circuit, coolant can be delivered to the first heat dissipation structure above the first heat-generating element of the connecting mechanism, and heat dissipation can be provided for the first heat-generating element, thereby improving the practicality of the thermal management system.

[0110] In one possible implementation, along the first direction, the first outlet end is higher than the first inlet end.

[0111] In this way, by making the first outlet end higher than the first inlet end, the first water pump can make the coolant flow from bottom to top along the first direction through the first inlet end, the first flow channel and the first outlet end. The coolant can flow out of the first heat dissipation structure from the first outlet end located at the upper position. By utilizing the rising characteristics of air bubbles, the air can be naturally vented, thereby avoiding the air in the first flow channel from being unable to be discharged and affecting the flow of coolant in the first flow channel. This can also avoid adverse effects on the heat dissipation of the first heat-generating component and improve the practicality of the first cooling circuit and thermal management system.

[0112] This application also provides a vehicle, which includes a vehicle body and a thermal management system as described above.

[0113] In this way, by using the aforementioned thermal management system, the vehicle can achieve more flexible thermal management of heat-generating components, reduce energy consumption during the thermal management process, lower vehicle power consumption, and improve vehicle practicality.

[0114] In one possible implementation, the vehicle body has a passenger compartment, and the vehicle further includes a first heating element disposed on the top of the passenger compartment;

[0115] The first heat dissipation structure of the thermal management system is used to dissipate heat for the first heat-generating component.

[0116] In this way, since the first cooling circuit of the thermal management system has a first water pump, it is possible to deliver coolant to the first heat dissipation structure on the first heat-generating component, which is located relatively high, so as to dissipate heat from the first heat-generating component. This avoids the situation where the coolant cannot be delivered to the first heat-generating component because the first heat-generating component is located relatively high, thereby improving the practicality of the thermal management system and thus improving the practicality of the vehicle.

[0117] In one possible implementation, the thermal management system includes a first water pump disposed on the underside of the vehicle body facing away from the passenger compartment.

[0118] In this way, by placing the first water pump on the outside of the vehicle body floor facing away from the passenger compartment, the first water pump can avoid occupying the interior space of the passenger compartment, thereby improving the space utilization rate of the passenger compartment, improving the driving and riding experience of the driver and passengers, and enhancing the practicality of the vehicle.

[0119] In one possible implementation, the first heating element is an optical engine, which includes a housing, a main structure, and a circuit board;

[0120] Both the main structure and the circuit board are housed within the housing, and the main structure and the circuit board are arranged along the second direction;

[0121] The thermal management system includes a first heat dissipation structure disposed within the housing along the second direction, on the side of the main structure facing away from the circuit board.

[0122] In this way, by using the first heat dissipation structure to dissipate heat from the optical engine, compared with using air cooling methods such as fans, the heat dissipation efficiency of the optical engine can be improved, and the noise during the heat dissipation process can be reduced.

[0123] Furthermore, by placing the main structure and circuit board of the optical engine inside the housing, damage to the main structure due to collisions with external objects can be avoided, thus extending the service life of the optical engine.

[0124] This application embodiment also provides a control method for a thermal management system, which is applied to the thermal management system described above, the method comprising:

[0125] A control mechanism is provided, which is electrically connected to the first water pump, and the communication mechanism in the thermal management system includes a first tee connector and a second tee connector;

[0126] The control mechanism acquires the temperature of the coolant in the first flow channel of the first heat dissipation structure;

[0127] Based on the temperature of the coolant in the first flow channel, the control mechanism controls the first water pump to adjust the flow rate of the coolant in the first flow channel.

[0128] In this way, by using the above control method on the thermal management system, the temperature of the coolant in the first flow channel can be detected, and the flow rate of the coolant in the first flow channel of the first water pump can be controlled according to the detected coolant temperature. This allows the first cooling circuit to adjust accordingly based on the heat generated by the first heating element, achieving automated adjustment of the coolant flow rate in the first cooling circuit. Furthermore, it improves the flexibility of the first cooling circuit in thermal management of the first heating element, thus enhancing the overall flexibility of the thermal management system.

[0129] In one possible implementation, the step of controlling the first water pump to adjust the flow rate of the coolant in the first flow channel based on the obtained temperature of the coolant in the first flow channel further includes:

[0130] During the operation of the first heating element, the temperature of the coolant in the first flow channel is obtained, and...

[0131] When the temperature of the coolant in the first flow channel is lower than a first temperature threshold, the speed of the first water pump is controlled to reduce the flow rate of the coolant in the first flow channel; and / or,

[0132] When the temperature of the coolant in the first flow channel is greater than or equal to the first temperature threshold and less than the second temperature threshold, the rotational speed of the first water pump is maintained; and / or,

[0133] When the temperature of the coolant in the first flow channel is greater than the second temperature threshold, the speed of the first water pump is controlled to increase the flow rate of the coolant in the first flow channel.

[0134] When the temperature of the coolant in the first flow channel is lower than the first temperature threshold, the flow rate of the coolant in the first flow channel can be reduced by controlling the speed of the first water pump. This can prevent condensation from forming near the first heating element due to the low temperature, which could lead to corrosion or water ingress damage to the first heating element.

[0135] When the temperature of the coolant in the first flow channel is greater than or equal to the first temperature threshold and less than the second temperature threshold, the speed of the first water pump is maintained. This ensures the heat dissipation effect of the first cooling circuit on the first heat-generating component while preventing the energy consumption of the first water pump from increasing due to excessive speed.

[0136] When the temperature of the coolant in the first flow channel is greater than the second temperature threshold, the speed of the first water pump is controlled to increase the flow rate of the coolant in the first flow channel, thereby ensuring that the first heat dissipation structure can dissipate heat from the first heat-generating component in a timely manner, thus preventing the first heat-generating component from being damaged due to overheating.

[0137] This application embodiment also provides a control method for a thermal management system, which is applied to the thermal management system described above, the method comprising:

[0138] A control mechanism is provided, which is electrically connected to both the first and second water pumps, and the communication mechanism in the thermal management system includes a four-way connector;

[0139] The control mechanism acquires the temperature of the coolant in the first flow channel;

[0140] Based on the temperature of the coolant in the first flow channel, the control mechanism controls the first water pump to adjust the flow rate of the coolant in the first flow channel.

[0141] In this way, by setting up a control mechanism, the first water pump can be dynamically adjusted. For example, when only the coolant in the first cooling circuit is flowing, the flow rate of the coolant in the first cooling circuit can be adjusted by adjusting the speed of the first water pump. With the structure of the first heat dissipation structure itself unchanged, the flow rate of the coolant flowing through the first flow channel can be adjusted to ensure that the heat dissipation effect of the first heat-generating component is guaranteed while avoiding energy waste of the first water pump.

[0142] The control mechanism can also be used to control the coolant flowing out of the fifth outlet of the second water pump through the second heat dissipation structure according to the temperature of the coolant in the first flow channel, and then be delivered to the first heat dissipation structure again by the first water pump.

[0143] In this way, the control mechanism can control the second water pump in addition to the first water pump, thereby increasing the control range of the control mechanism. It can also connect the coolant of the second cooling circuit to the first cooling circuit, allowing the second heat dissipation structure to assist in the cooling of the coolant, further reducing the temperature of the coolant flowing out of the first heat dissipation structure, and further increasing the heat exchange between the coolant and the first heat dissipation structure, thus improving the heat dissipation effect on the first heat-generating component.

[0144] In one possible implementation, the step of controlling the first water pump to adjust the flow rate of the coolant in the first flow channel based on the obtained temperature of the coolant in the first flow channel further includes:

[0145] During the operation of the first heating element, the temperature of the coolant in the first flow channel is obtained, and...

[0146] When the temperature of the coolant in the first flow channel is lower than a first temperature threshold, the speed of the first water pump is controlled to reduce the flow rate of the coolant in the first flow channel; and / or,

[0147] When the temperature of the coolant in the first flow channel is greater than or equal to the first temperature threshold and less than the second temperature threshold, the rotational speed of the first water pump is maintained; and / or,

[0148] When the temperature of the coolant in the first flow channel is greater than the second temperature threshold, the speed of the first water pump is controlled to increase the flow rate of the coolant in the first flow channel.

[0149] By controlling the speed of the first water pump when the temperature of the coolant in the first flow channel is lower than the first temperature threshold, the flow rate of the coolant in the first flow channel is reduced, which can prevent condensation from forming near the first heating element due to the low temperature, thereby preventing corrosion or water damage to the first heating element.

[0150] When the temperature of the coolant in the first flow channel is greater than or equal to the first temperature threshold and less than the second temperature threshold, the speed of the first water pump is maintained. This ensures the heat dissipation effect of the first cooling circuit on the first heat-generating component while avoiding an increase in the energy consumption of the first water pump due to excessive speed.

[0151] When the temperature of the coolant in the first flow channel is greater than the second temperature threshold, the speed of the first water pump is controlled to increase the flow rate of the coolant in the first flow channel, thereby ensuring that the first heat dissipation structure can dissipate heat from the first heat-generating component in a timely manner, thus preventing the first heat-generating component from being damaged due to overheating.

[0152] In this way, by using the control mechanism to adjust the first water pump in stages, the first heating element can be cooled on demand, avoiding energy waste of the first water pump and realizing the energy-saving performance of the thermal management system.

[0153] In one possible implementation, the method further includes controlling the rotational speed of the first water pump to increase the flow rate of the coolant in the first flow channel when the temperature of the coolant in the first flow channel is greater than the second temperature threshold, including:

[0154] When the temperature of the coolant in the first flow channel is greater than or equal to the second temperature threshold and less than the third temperature threshold, the speed of the first water pump is controlled to increase the flow rate of the coolant in the first flow channel.

[0155] The control mechanism is further configured to control the rotation speed of the second water pump when the temperature of the coolant in the first flow channel is greater than the third temperature threshold and there is flow in the second flow channel of the second heat dissipation structure, so as to increase the flow rate of the coolant in the second flow channel.

[0156] And / or,

[0157] If the temperature of the coolant in the first flow channel is greater than the third temperature threshold and there is no flow in the second flow channel, the second water pump is controlled to start.

[0158] In this way, the first cooling circuit and the second cooling circuit can work together, and by adjusting the flow rate of the coolant flowing through the second channel in the second cooling circuit, the flow rate of the coolant flowing through the first channel can be further increased, thereby further improving the heat dissipation effect on the first heat-generating component and preventing thermal runaway of the first heat-generating component.

[0159] This application also provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement the method described above.

[0160] This application also provides a computer program product, which includes a computer program that, when executed by a processor, implements the methods described above. Attached Figure Description

[0161] Figure 1 is a schematic diagram of a first thermal management system provided in an embodiment of this application;

[0162] Figure 2 is a schematic diagram of a second thermal management system provided in an embodiment of this application;

[0163] Figure 3 is a schematic diagram of a third thermal management system provided in an embodiment of this application;

[0164] Figure 4 is a schematic diagram of the fourth thermal management system provided in the embodiments of this application;

[0165] Figure 5 is a schematic diagram of the fifth thermal management system provided in the embodiments of this application;

[0166] Figure 6 is a schematic diagram of the sixth thermal management system provided in the embodiments of this application;

[0167] Figure 7 is a schematic diagram of the seventh thermal management system provided in the embodiments of this application;

[0168] Figure 8 is a schematic diagram of the eighth thermal management system provided in the embodiments of this application;

[0169] Figure 9 is a schematic diagram of a first heat-generating element provided with a first heat dissipation structure according to an embodiment of this application;

[0170] Figure 10 is a flowchart of a control method for a first thermal management system provided in an embodiment of this application;

[0171] Figure 11 is a flowchart of a control method for a second thermal management system provided in an embodiment of this application;

[0172] Figure 12 is a flowchart of a control method for a third thermal management system provided in an embodiment of this application;

[0173] Figure 13 is a flowchart of a control method for a fourth thermal management system provided in an embodiment of this application;

[0174] Figure 14 is a flowchart of the control method of the fifth thermal management system provided in the embodiments of this application.

[0175] Explanation of reference numerals in the attached drawings: 1-First cooling circuit; 2-Second cooling circuit; 3-First heating element; 4-Check valve structure; 5-Liquid storage chamber; 6-Control mechanism; 7-Fifth heat dissipation structure; 8-Gas-liquid separator; 9-Thermoelectric cooling element; 10-First heat conduction element; 11-Second heat conduction element; 12-Third heat conduction element; 31-Housing shell; 32-Main structure; 33-Circuit board; 100-First heat dissipation structure; 110-First liquid inlet; 120-First liquid outlet; 200-First water pump; 210-First liquid inlet; 220-First liquid outlet; 300-Second heat dissipation structure; 310-Second liquid inlet; 320-Second liquid outlet; 400-Second water pump; 410-Second liquid inlet; 420-Second liquid outlet; 500-Connecting mechanism; 510 - First tee connector; 520 - Second tee connector; 530 - Four-way connector; 511 - First inlet; 512 - First outlet; 513 - Second outlet; 521 - Second inlet; 522 - Third inlet; 523 - Third outlet; 531 - Fourth inlet; 532 - Fifth inlet; 533 - Fourth outlet; 534 - Fifth outlet; 600 - Third heat dissipation structure; 610 - Third liquid inlet; 620 - Third liquid outlet; 700 - Fourth heat dissipation structure; 710 - Fourth liquid inlet; 720 - Fourth liquid outlet. Detailed Implementation

[0176] As described in the background section above, the thermal management system in the related technology has poor flexibility in use, high energy consumption during operation, which affects the practicality of the thermal management system and leads to increased energy consumption of the vehicle.

[0177] The reason for this problem is that the thermal management system cannot manage the heat of a single heat-generating component individually. It requires activating the entire thermal management system to dissipate heat from a single component, resulting in high energy consumption and poor flexibility. Vehicles can contain multiple heat-generating components, such as batteries that power the vehicle, electric drive structures, optical engines for projectors, headlights, lidar, intelligent driving domain controllers, and vehicle infotainment systems.

[0178] The thermal management system can manage the heat of multiple heat-generating components to prevent them from overheating and being damaged. In specific implementations, when the thermal management system needs to manage the heat of the optomechanical system, the optomechanical cooling circuit needs to be connected to the battery cooling circuit, and the battery cooling circuit must be operational in order for the coolant in the battery cooling circuit to provide thermal management for the optomechanical system.

[0179] As can be seen from the above, when the user only needs to perform thermal management on the optical engine and not on the battery, the battery cooling circuit still needs to be involved. On the one hand, this will result in poor flexibility and practicality of the thermal management system. On the other hand, it will increase the energy consumption of the thermal management system when it only needs to perform thermal management on the optical engine, thereby increasing the overall energy consumption of the thermal management system and consequently increasing the energy consumption of the vehicle equipped with the thermal management system.

[0180] To address the aforementioned technical problems, this application provides a thermal management system, a vehicle, a control method for the thermal management system, and a storage medium. The thermal management system connects a first heat dissipation structure and a first water pump through a first cooling circuit, forming a circuit for coolant circulation. The first water pump pumps coolant to the first heat dissipation structure. The first water pump independently controls the flow rate of coolant through the first heat dissipation structure, enabling independent driving of the coolant in the first cooling circuit without activating other cooling circuits in the thermal management system. This allows for independent thermal management of the first heat-generating component, improving the flexibility of the thermal management system and reducing the energy consumption of the entire thermal management system when thermally managing the first heat-generating component, thereby helping to reduce vehicle energy consumption.

[0181] When the connecting mechanism includes a first tee connector and a second tee connector, the first cooling circuit can be connected to the second cooling circuit through the first tee connector and the second tee connector. Specifically, the second liquid outlet is connected to the first inlet, the first outlet is connected to the first liquid inlet, the first liquid outlet is connected to the first liquid inlet, the first liquid outlet can be connected to the second inlet, and the third outlet can be connected to the second liquid inlet.

[0182] In this way, the first cooling circuit can share the coolant in the second cooling circuit, and the coolant flowing out of the first heat dissipation structure can pass through the second heat dissipation structure again when the second water pump is not working. The second heat dissipation structure can help absorb the heat in the coolant to reduce the temperature of the coolant, and can make the coolant delivered to the first heat dissipation structure absorb more heat, thereby improving the heat exchange between the first heat dissipation structure and the coolant, and improving the heat dissipation effect of the first heat dissipation structure on the first heat-generating component.

[0183] Since the second heat dissipation structure can be used to assist the heat dissipation of the first heat-generating component without starting the second water pump, it can not only improve the heat dissipation effect of the first heat-generating component, but also reduce the energy consumption of the thermal management system and the energy consumption of the vehicle.

[0184] Furthermore, the second outlet connects to the second inlet, and the second outlet connects to the third inlet, thereby enabling the second heat dissipation structure and the second water pump to be connected via the first and second T-joints. This allows the second water pump to regulate the flow rate of the coolant in the second flow channel of the second heat dissipation structure. With both the first and second water pumps operating, in addition to dissipating heat from the second heat-generating component, the flow rate of the coolant flowing through the first and second heat dissipation structures can be further increased, thereby further improving the heat dissipation effect on the first heat-generating component and enhancing the flexibility and practicality of the thermal management system.

[0185] In addition, when the connecting mechanism includes a four-way connector, the first cooling circuit and the second cooling circuit can be connected through the four-way connector. Specifically, the second liquid outlet is connected to the fourth inlet, the fourth outlet is connected to the first liquid inlet, the first liquid outlet is connected to the first liquid inlet, the first liquid outlet is connected to the fifth inlet, the fifth inlet is connected to the second liquid inlet, and the second liquid outlet is connected to the second liquid inlet.

[0186] The first and second cooling circuits can both operate independently via a four-way connector. For example, if the heat generated by the first heating element is low, the second cooling circuit can be shut down, and the first cooling circuit can operate independently via the four-way connector to perform thermal management for the first heating element. This ensures that thermal management of the first heating element is performed without requiring additional cooling circuits in the thermal management system to participate in the thermal management of the first heating element, thereby reducing the energy consumption of the thermal management system when performing thermal management of the first heating element and also reducing the energy consumption of the vehicle.

[0187] By using a four-way connector, the second cooling circuit can also work in conjunction with the first cooling circuit to dissipate heat from the first heat-generating component. Specifically, the first and second water pumps operate simultaneously, and the coolant circulates between the first and second cooling circuits. The second water pump delivers the coolant from the second cooling circuit to the four-way connector via the second heat dissipation structure, and then further delivers it to the first water pump. This allows the second cooling circuit to work in conjunction with the first cooling circuit to dissipate heat from the first heat-generating component, improving the flexibility and practicality of the thermal management system.

[0188] Furthermore, by connecting the first cooling circuit and the second cooling circuit, and when both the first cooling circuit and the second cooling circuit are activated, since the second heat dissipation structure can be used to dissipate heat for the second heat-generating component, the coolant after heat exchange with the second heat-generating component is transported back to the first cooling circuit through the four-way connector and used to dissipate heat for the first heat-generating component. This fully utilizes the coolant to dissipate heat for the first heat-generating component in the first cooling circuit and the second heat-generating component in the second cooling circuit, thus improving the practicality of the thermal management system.

[0189] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0190] Referring to Figure 1, an embodiment of this application provides a thermal management system, which may include a first cooling circuit 1 and a second cooling circuit 2 for the flow of coolant.

[0191] The first cooling circuit 1 may include a first heat dissipation structure 100 and a first water pump 200. The first heat dissipation structure 100 is used to dissipate heat for the first heat-generating component 3. The first heat dissipation structure 100 has a first flow channel for coolant to flow through and a first inlet end 110 and a first outlet end 120 communicating with the first flow channel. The communication between the first inlet end 110 and the first outlet end 120 and the first flow channel can be understood as the coolant being able to flow into the first flow channel through the first inlet end 110 and flow out of the first flow channel through the first outlet end 120.

[0192] The thermal management system connects the first heat dissipation structure 100 and the first water pump 200 through the first cooling circuit 1, forming a circuit for coolant circulation. The first water pump 200 pumps coolant to the first heat dissipation structure 100. The first water pump 200 independently controls the flow rate of coolant through the first heat dissipation structure 100, so that the coolant in the first cooling circuit 1 can be driven independently by the first water pump 200 without activating other cooling circuits in the thermal management system. This enables independent thermal management of the first heat-generating component 3, improves the flexibility of the thermal management system, and reduces the energy consumption of the entire thermal management system when thermally managing the first heat-generating component 3, thereby helping to reduce the vehicle's energy consumption.

[0193] The second cooling circuit 2 may include a second heat dissipation structure 300 and a second water pump 400. The second heat dissipation structure 300 is used to dissipate heat for the second heat-generating component. The second heat dissipation structure 300 has a second flow channel for coolant to flow through and a second inlet end 310 and a second outlet end 320 communicating with the second flow channel. The communication between the second inlet end 310 and the second outlet end 320 and the second flow channel can be understood as the coolant being able to flow into the second flow channel through the second inlet end 310 and flow out of the second flow channel through the second outlet end 320.

[0194] The first water pump 200 may include a first inlet 210 and a first outlet 220, with the first outlet 220 connected to the first inlet 110. The connection between the first outlet 220 and the first inlet 110 can be understood as a direct connection and conduction between the first outlet 220 and the first inlet 110, or a connection through a piping structure, or an indirect connection through other structures. The second water pump 400 may include a second inlet 410 and a second outlet 420.

[0195] It is understandable that the ports between each structure can be directly connected through pipes, or that additional structures can be set on the pipes between two adjacent structures so that the two adjacent structures can be indirectly connected through the additional structures set on the pipes.

[0196] The first cooling circuit 1 and the second cooling circuit 2 can be connected through the connecting mechanism 500.

[0197] Referring to Figure 1, in one possible implementation, the connecting mechanism 500 may include a first tee connector 510 and a second tee connector 520. The first tee connector 510 may include a first inlet 511, a first outlet 512, and a second outlet 513 that are interconnected. The first inlet 511 is connected to the second liquid outlet 320 of the second heat dissipation structure 300, the first outlet 512 is connected to the first liquid inlet 210 of the first water pump 200, and the second outlet 513 is connected to the second liquid inlet 410 of the second water pump 400.

[0198] The second three-way connector 520 may include a second inlet 521, a third inlet 522 and a third outlet 523 that are interconnected. The second inlet 521 is connected to the first liquid outlet 120 of the first heat dissipation structure 100, the third inlet 522 is connected to the second liquid outlet 420 of the second water pump 400, and the third outlet 523 is connected to the second liquid inlet 310 of the second heat dissipation structure 300.

[0199] In some embodiments, the temperature of the coolant flowing out from the second outlet 320 of the second heat dissipation structure 300 can be less than or equal to 45°C, so that the coolant flowing out from the second outlet 320 can continue to be used to dissipate heat for the first heat-generating element 3 in the first cooling circuit 1.

[0200] In this way, the first cooling circuit 1 can share the coolant in the second cooling circuit 2, and when the second water pump 400 is not working, the coolant flowing out of the first heat dissipation structure 100 can pass through the second heat dissipation structure 300 again. The second heat dissipation structure 300 can help absorb the heat in the coolant to reduce the temperature of the coolant, and can make the coolant delivered to the first heat dissipation structure 100 absorb more heat, thereby improving the heat exchange between the first heat dissipation structure 100 and the coolant, and improving the heat dissipation effect of the first heat dissipation structure 100 on the first heat-generating component 3.

[0201] Since the second heat dissipation structure 300 can be used to assist the heat dissipation of the first heat-generating component 3 without starting the second water pump 400, it can not only improve the heat dissipation effect of the first heat-generating component 3, but also reduce the energy consumption of the thermal management system and reduce the energy consumption of the vehicle.

[0202] Furthermore, the second outlet 513 is connected to the second inlet 410, and the second outlet 420 is connected to the third inlet 522, thereby enabling the second heat dissipation structure 300 and the second water pump 400 to be connected through the first three-way connector 510 and the second three-way connector 520. This allows the second water pump 400 to regulate the flow rate of the coolant in the second flow channel of the second heat dissipation structure 300. When both the first water pump 200 and the second water pump 400 are working, heat dissipation can be achieved for the second heat-generating component, and the flow rate of the coolant flowing through the first heat dissipation structure 100 and the second heat dissipation structure 300 can be further increased to further improve the heat dissipation effect on the first heat-generating component 3. This also improves the flexibility and practicality of the thermal management system.

[0203] Referring to Figure 1, in some embodiments, if the connecting mechanism 500 may include a first tee connector 510 and a second tee connector 520, the thermal management system may also include a check structure 4. The check structure 4 is used to prevent the coolant flowing out of the first outlet end 120 from flowing back into the first flow channel, thereby avoiding the coolant backflow affecting the heat dissipation effect of the first heat dissipation structure 100 on the first heat-generating element 3.

[0204] In some embodiments, the check structure 4 can be a one-way check valve. If the second inlet 521 of the second tee connector 520 is connected to the first outlet 120 of the first heat dissipation structure 100 through a pipeline, the check structure 4 can be installed on the pipeline.

[0205] Referring to Figure 1, in some other embodiments, a check valve 4 is disposed within the second tee connector 520, and the check valve 4 is used to prevent coolant from flowing from the second inlet 521 to the first outlet 120.

[0206] In this way, by setting the water-stopping structure inside the second tee connector 520, the check valve structure 4 and the second tee connector 520 can be integrated, simplifying the layout of the first cooling circuit 1 and reducing the risk of leakage.

[0207] Referring to Figure 1, in some embodiments, the connecting mechanism 500 may include a first tee connector 510 and a second tee connector 520, and the thermal management system may further include a control mechanism 6. The control mechanism 6 is electrically connected to the first water pump 200, and the control mechanism can also be disposed on the first heat dissipation structure 100. The control mechanism 6 can control the first water pump 200 to adjust the flow rate of the coolant in the first flow channel according to the temperature of the coolant in the first flow channel. With the structure of the first heat dissipation structure 100 remaining unchanged, the first water pump 200 can increase the flow rate of the coolant in the first flow channel by increasing the flow velocity of the coolant.

[0208] In this way, the thermal management system, through the control mechanism 6, can detect the temperature of the coolant in the first flow channel and control the first water pump 200 to adjust the flow rate of the coolant in the first flow channel based on the detected coolant temperature. This achieves automated adjustment of the coolant flow rate in the first cooling circuit 1 and improves the thermal management flexibility of the first cooling circuit 1 for the first heat-generating component 3, thereby enhancing the usability of the thermal management system.

[0209] In practical implementation, if the heat generated by the first heating element 3 is low, the control mechanism 6 can control the first water pump 200 to reduce the flow rate of the coolant, thereby reducing the speed at which the coolant flows through the first flow channel, and thus reducing the flow rate of the coolant in the first flow channel, and reducing the heat exchange between the coolant and the first heat dissipation structure 100, thereby reducing the heat dissipation effect on the first heating element 3. Conversely, if the heat generated by the first heating element 3 is too high, the control mechanism 6 can control the first water pump 200 to increase the flow rate of the coolant in the first cooling circuit 1, thereby increasing the flow rate of the coolant flowing through the first flow channel, thereby increasing the heat exchange between the coolant and the first heat dissipation structure 100, and improving the heat dissipation effect on the heating element.

[0210] Referring to Figure 1, in some embodiments, the control mechanism 6 is specifically used to obtain the temperature of the coolant in the first flow channel during the operation of the first heating element 3, and to control the rotation speed of the first water pump 200 when the temperature of the coolant in the first flow channel is less than a first temperature threshold, so as to reduce the flow rate of the coolant in the first flow channel, thereby reducing the energy consumption of the first water pump 200 and thus reducing the energy consumption of the thermal management system.

[0211] Furthermore, by controlling the speed of the first water pump 200 when the temperature of the coolant in the first flow channel is lower than the first temperature threshold, the flow rate of the coolant in the first flow channel is reduced, which can prevent condensation from forming near the first heating element 3 due to the low temperature, thereby preventing corrosion or water ingress damage to the first heating element 3.

[0212] In some embodiments, the first temperature threshold may be 20°C.

[0213] In some embodiments, the control mechanism 6 can also be specifically used to obtain the temperature of the coolant in the first flow channel during the operation of the first heating element 3, and maintain the rotation speed of the first water pump 200 when the temperature of the coolant in the first flow channel is greater than or equal to the first temperature threshold and less than the second temperature threshold, so as to ensure the heat dissipation effect of the first cooling circuit 1 on the first heating element 3, and avoid the increase in energy consumption of the first water pump 200 due to excessive rotation speed.

[0214] In some embodiments, the second temperature threshold may be 40°C.

[0215] In some embodiments, the control mechanism 6 can also be specifically used to obtain the temperature of the coolant in the first flow channel during the operation of the first heating element 3. When the temperature of the coolant in the first flow channel is greater than the second temperature threshold, the control mechanism 6 can control the rotation speed of the first water pump 200 to increase the flow rate of the coolant in the first flow channel, thereby ensuring that the first heat dissipation structure 100 can dissipate heat from the first heating element 3 in a timely manner, thereby preventing the first heating element 3 from being damaged due to overheating.

[0216] Referring to Figure 2, in some embodiments, if the connecting mechanism 500 may include a first three-way connector 510 and a second three-way connector 520, the second three-way connector 520 may also have another configuration, for example, the first three-way connector 510 and the second three-way connector 520 may be directly connected. In a specific implementation, in the second cooling circuit 2, the second three-way connector 520 may be located between the first three-way connector 510 and the second water pump 400. The second inlet 521 of the second three-way connector 520 may be connected to the first liquid outlet 120 of the first heat dissipation structure 100, the third inlet 522 of the second three-way connector 520 may be connected to the second outlet 513 of the first three-way connector 510, the third outlet 523 of the second three-way connector 520 may be connected to the second liquid inlet 410 of the second water pump 400, and the second liquid outlet 420 of the second water pump 400 may be connected to the second liquid inlet 310 of the second heat dissipation structure 300.

[0217] In this way, the coolant flowing out of the first outlet 120 of the first heat dissipation structure 100 can flow to the second water pump 400 through the second three-way connector 520, and further flow to the second heat dissipation structure 300 through the second water pump 400. It should be noted that since the second water pump 400 can also allow coolant to flow through it even when it is not running, the coolant flowing out of the first outlet 120 of the first heat dissipation structure 100 can also flow to the second heat dissipation structure 300 through the second water pump 400 when the second water pump 400 is not running. Thus, the second heat dissipation structure 300 in the second cooling circuit 2 can dissipate heat for the coolant, reduce the temperature of the coolant, and improve the heat exchange capacity of the coolant.

[0218] In some embodiments, if the first tee connector 510 and the second tee connector 520 are directly connected, and the thermal management system has a check structure 4, the check structure 4 can be disposed between the first tee connector 510 and the second tee connector 520. The check structure 4 can prevent the coolant flowing into the second tee connector 520 through the second inlet 521 from flowing to the first tee connector 510 through the third inlet 522, and can further prevent the coolant flowing into the first tee connector 510 through the second tee connector 520 from flowing to the first water pump 200 through the first outlet 512. This allows all the coolant flowing out of the first outlet 120 to flow through the second heat dissipation structure 300 and be cooled down by the second heat dissipation structure 300, thereby improving the cooling effect of the coolant.

[0219] In some embodiments, if the thermal management system has a control mechanism 6, the control mechanism 6 can control not only the first water pump 200 but also the second water pump 400. The control mechanism 6 can be used to adjust the flow rate of the coolant in the first flow channel by controlling the first water pump 200 according to the temperature of the coolant in the first flow channel. With the structure of the first heat dissipation structure 100 itself remaining unchanged, the first water pump 200 and the second water pump 400 can increase the flow rate of the coolant flowing through the first heat dissipation structure 100 and the second heat dissipation mechanism by increasing the flow rate of the coolant.

[0220] In this way, by setting the control mechanism 6, the first water pump 200 can be dynamically adjusted. For example, when only the coolant in the first cooling circuit 1 is flowing, the flow rate of the coolant in the first cooling circuit 1 can be adjusted by adjusting the speed of the first water pump 200. With the first heat dissipation structure 100 unchanged, the flow rate of the coolant flowing through the first flow channel can be adjusted to ensure that the heat dissipation effect of the first heat-generating component 3 is guaranteed while avoiding energy waste of the first water pump 200.

[0221] The control mechanism 6 is also used to control the coolant flowing out of the third outlet of the second three-way connector 520 driven by the second water pump 400 to flow through the second heat dissipation structure 300 according to the temperature of the coolant in the first flow channel, and then be delivered to the first heat dissipation structure 100 again by the first water pump 200.

[0222] In this way, the control mechanism 6 can further control the second water pump 400 on the basis of controlling the first water pump 200, which can improve the control range of the control mechanism 6, and make the coolant in the first cooling circuit 1 flow through the second cooling circuit 2, so that the second heat dissipation structure 300 can assist in the heat dissipation of the coolant, further reduce the temperature of the coolant flowing out of the first heat dissipation structure 100, and further improve the heat exchange between the coolant and the first heat dissipation structure 100, thereby improving the heat dissipation effect on the first heat-generating component 3.

[0223] Referring to Figure 3, in another possible implementation, the connecting mechanism 500 may include a four-way connector 530. The four-way connector 530 may include a fourth inlet 531, a fifth inlet 532, a fourth outlet 533, and a fifth outlet 534 that are interconnected.

[0224] The fourth inlet 531 is connected to the second liquid outlet 320 of the second heat dissipation structure 300, the fourth outlet 533 is connected to the first liquid inlet 210 of the first water pump 200, the fifth inlet 532 is connected to the first liquid outlet 120 of the first heat dissipation structure 100, the fifth outlet 534 is connected to the second liquid inlet 410 of the second water pump 400, and the second liquid outlet 420 of the second water pump 400 is connected to the second liquid inlet 310 of the second heat dissipation structure 300.

[0225] In this way, both the first cooling circuit 1 and the second cooling circuit 2 can be operated independently through the four-way connector 530. For example, when the heat output of the first heating element 3 is low, the second cooling circuit 2 can be shut down, and the first cooling circuit 1 can be operated independently through the four-way connector 530 to perform thermal management for the first heating element 3. This ensures that thermal management of the first heating element 3 is performed without requiring additional cooling circuits in the thermal management system to participate in the thermal management of the first heating element 3, thereby reducing the energy consumption of the thermal management system when performing thermal management of the first heating element 3 and reducing the energy consumption of the vehicle.

[0226] By using the four-way connector 530, the second cooling circuit 2 can also work in conjunction with the first cooling circuit 1 to dissipate heat from the first heat-generating component 3. Specifically, the first water pump 200 and the second water pump 400 operate simultaneously, and the coolant can circulate in the first cooling circuit 1 and the second cooling circuit 2. The second water pump 400 can transport the coolant in the second cooling circuit 2 to the four-way connector 530 via the second heat dissipation structure 300, and further transport it to the first water pump 200 via the four-way connector 530. This enables the second cooling circuit 2 to work in conjunction with the first cooling circuit 1 to dissipate heat from the first heat-generating component 3, thereby improving the flexibility and practicality of the thermal management system.

[0227] Furthermore, by connecting the first cooling circuit 1 and the second cooling circuit 2, and with both the first cooling circuit 1 and the second cooling circuit 2 activated, since the second heat dissipation structure 300 can be used to dissipate heat for the second heat-generating component, the coolant after heat exchange with the second heat-generating component is again delivered to the first cooling circuit 1 through the four-way connector 530 and used to dissipate heat for the first heat-generating component 3. This fully utilizes the coolant to dissipate heat for the first heat-generating component 3 in the first cooling circuit 1 and the second heat-generating component in the second cooling circuit 2, thus improving the practicality of the thermal management system.

[0228] In some embodiments, the first heat-generating element 3 may be an optomechanical device, a roof-mounted lidar, a remote control unit, a car headlight, a vehicle infotainment system, an intelligent driving domain controller, a power amplifier, or a mobile data center. The first heat dissipation structure 100 may be a heat dissipation structure with a flow channel for liquid flow, such as a cold plate, a radiator, or a heat exchanger.

[0229] Referring to Figure 3, in some embodiments, the first heating element 3 can be an optomechanical device, and the first heat dissipation structure 100 can be a first cold plate.

[0230] In this way, by setting the first heat dissipation structure 100 as the first cold plate, the heat dissipation effect of the optical engine can be significantly improved compared to using an air-cooled heat dissipation structure. Furthermore, the noise of the cold plate is relatively lower than that of the air-cooled structure, which helps improve the user experience and reduces the impact of noise on users. Additionally, since air-cooled fans are prone to accumulating dust and other debris and are difficult to clean, the first cold plate is much easier to clean than air-cooled structures, making it less prone to dust and other debris accumulation.

[0231] Referring to Figure 3, in some embodiments, the second heating element can be a battery, and the second heat dissipation structure 300 can be a second cold plate. When both the battery and the optical engine are operating, the second cold plate can dissipate heat for the battery, and the coolant within the second cold plate, after dissipating heat for the battery, can also be transported to the first cooling circuit 1 and used to dissipate heat for the optical engine. This improves the utilization rate of the coolant and enhances the practicality of the thermal management system.

[0232] Referring to Figure 3, in some embodiments, the second heat-generating element can be a motor, and the second heat dissipation structure 300 can be a front-end heat sink. The front-end heat sink can be used to dissipate heat from the motor.

[0233] In this way, by setting the second heating element as a motor and the second heat dissipation mechanism as a front heat sink, when both the motor and the optical engine are working, it is possible to deliver the coolant after cooling the motor to the optical engine in the first cooling circuit 1, so that the coolant after cooling the motor can be further used for cooling the optical engine.

[0234] Referring to Figure 3, in some embodiments, the first heat dissipation structure 100 is located above the connecting mechanism 500 in a first direction (the Y direction in Figure 3), where the first direction is the height direction. The first direction can be the height direction; when the thermal management system is installed within the vehicle body, the first direction can be the height direction of the vehicle body.

[0235] Since the first water pump 200 is provided in the first cooling circuit 1, it is possible to deliver coolant to the first heat dissipation structure 100 on the first heat-generating element 3 above the connecting mechanism 500 and dissipate heat for the first heat-generating element 3, thereby improving the practicality of the thermal management system.

[0236] Referring to FIG3, in some embodiments, in the first direction (Y direction in FIG3), if the first heat dissipation structure 100 is located above the connecting mechanism 500, then along the first direction, the first liquid outlet 120 is higher than the first liquid inlet 110.

[0237] In this way, by making the first outlet end 120 higher than the first inlet end 110, the first water pump 200 can make the coolant flow from bottom to top along the first direction through the first inlet end 110, the first flow channel and the first outlet end 120. The coolant can flow out of the first heat dissipation structure 100 from the first outlet end 120 located at the opposite top. By utilizing the characteristic of air bubbles rising, the air can be naturally vented, thereby avoiding the air in the first flow channel from being unable to be discharged and affecting the flow of coolant in the first flow channel. This can avoid adverse effects on the heat dissipation of the first heat-generating element 3 and improve the practicality of the first cooling circuit 1 and the thermal management system.

[0238] Referring to Figure 4, in some embodiments, the thermal management system may further include a third heat dissipation structure 600, which is used to dissipate heat for a third heat-generating component. The third heat dissipation structure 600 may include a third flow channel and a third liquid inlet 610 and a third liquid outlet 620 connected to the third flow channel. The liquid outlet of the first water pump 200 is connected to the third liquid inlet 610, and the third liquid outlet 620 is connected to the first liquid inlet 110 of the first heat dissipation structure 100, so that the first heat dissipation structure 100 and the third heat dissipation structure 600 are connected in series.

[0239] In this way, by using the third heat dissipation structure 600 connected in series with the first heat dissipation structure 100, the coolant in the first cooling circuit 1 can be fully utilized to dissipate heat for both the first heat-generating component 3 and the third heat-generating component. It can also utilize the residual coolant to dissipate heat for the first heat dissipation structure 100, thereby improving the utilization rate of the coolant, reducing the need for an independent water pump, reducing the energy consumption of the thermal management system, and improving the practicality of the thermal management system.

[0240] In some embodiments, the first heat dissipation structure 100 and the third heat dissipation structure 600 are connected in series, regardless of the specific structure of the connecting mechanism 500.

[0241] Referring to Figure 4, in some embodiments, the heating power of the third heating element is less than or equal to a first preset value. The first preset value may be less than or equal to 1 kW.

[0242] In some embodiments, the third heating element can be an optomechanical system, a roof-mounted lidar, a remote control unit, a car headlight, a vehicle infotainment system, an intelligent driving domain controller, a power amplifier, or a mobile data center. The first heating element 3 and the third heating element can have the same structure, or they can have different structures. For example, the first heating element 3 can be an optomechanical system, and the third heating element can be a car headlight.

[0243] In this way, by making the heating power of the third heating element less than the first preset value, it can be ensured that the third heating element connected in series will not affect the heat dissipation efficiency of the first heating element 3 due to overload, thereby further improving the layout rationality and practicality of the thermal management system.

[0244] Referring to Figure 4, in some embodiments, the third heat dissipation structure 600 is a third cold plate.

[0245] In this way, by setting the third heat dissipation structure 600 as the third cold plate, the heat exchange effect between the third heat dissipation structure 600 and the third heat-generating element can be improved, so that the third heat dissipation structure 600 can transfer the heat dissipated by the third heat-generating element to the cooling medium in the third flow channel.

[0246] Referring to Figure 4, in some embodiments, the third heat dissipation structure 600 is located between the first heat dissipation structure 100 and the connecting mechanism 500 along a first direction, the first direction being the height direction.

[0247] Referring to Figure 4, in some embodiments, along the first direction, the third liquid inlet 610 of the third heat dissipation structure 600 is lower than the third liquid outlet 620, and the third liquid outlet 620 is lower than the first liquid inlet 110 of the first heat dissipation structure 100.

[0248] In this way, by making the third liquid inlet 610 of the third heat dissipation structure 600 lower than the third liquid outlet 620, and the third liquid outlet 620 lower than the first liquid inlet 110 of the first heat dissipation structure 100, the problem of air trapping in the first or third flow channel when the coolant flows through the third heat dissipation structure 600 and the first heat dissipation structure 100 can be avoided. This can prevent air bubbles from being generated in the first and second flow channels due to air trapping, and thus prevent air bubbles from hindering the flow of coolant and affecting the heat dissipation effect on the first and third heat-generating components 3 and 3.

[0249] Referring to Figure 5, in some embodiments, the first cooling circuit 1 may further include a fourth heat dissipation structure 700, which is used to dissipate heat for a fourth heat-generating component. The fourth heat dissipation structure 700 may include a fourth flow channel, and a fourth liquid inlet 710 and a fourth liquid outlet 720 communicating with the fourth flow channel. The fourth liquid inlet 710 is connected to the first water pump 200, and the fourth liquid outlet 720 is connected to the second liquid inlet 310 of the second heat dissipation structure 300 through a connecting mechanism 500, so that the fourth heat dissipation structure 700 and the first heat dissipation structure 100 are arranged in parallel.

[0250] In this way, by setting a fourth heat dissipation structure 700 in parallel with the first heat dissipation structure 100 in the first cooling circuit 1, the flow rate of the coolant flowing through the first heat dissipation structure 100 and the fourth heat dissipation structure 700 can be independently controlled, so as to avoid one of the first heat-generating components 3 or the fourth heat-generating component taking away the cooling resources of the other heat-generating component when the heat generation of one of them is too large.

[0251] In some embodiments, the fourth heat-generating component may be an optomechanical system, a roof-mounted lidar, a remote control unit, automotive headlights, a vehicle infotainment system, an intelligent driving domain controller, a power amplifier, or a mobile data center. The fourth heat dissipation structure 700 may be a fourth cold plate, with a fourth flow channel inside for coolant to flow.

[0252] Referring to Figure 6, in some embodiments, the connecting mechanism 500 is a four-way connector 530, which has a liquid storage chamber 5 inside. The liquid storage chamber 5 is connected to the fourth inlet 531, the fifth inlet 532, the fourth outlet 533 and the fifth outlet 534. The liquid storage chamber 5 is used to store coolant.

[0253] In this way, by setting a liquid storage chamber 5 inside the four-way connector 530, a portion of the coolant can be stored inside the four-way connector 530, thereby ensuring that there is enough coolant in the first cooling circuit 1 for the heat dissipation of the first heat dissipation structure 100.

[0254] Furthermore, the liquid storage chamber 5 inside the four-way connector 530 can reduce pressure fluctuations in the first flow channel by absorbing the volume changes of the coolant due to thermal expansion and contraction. At the same time, the liquid storage chamber 5 can also serve as a gas-liquid separation zone, reducing the interference of air bubbles on the flow of coolant in the first cooling circuit 1.

[0255] Referring to Figure 6, in some embodiments, the thermal management system may further include a fifth heat dissipation structure 7, which is disposed on the four-way connector 530 near the liquid storage chamber 5.

[0256] In this way, by setting the fifth heat dissipation structure 7 on the four-way connector 530, the heat dissipation effect of the coolant can be further improved, and the temperature of the coolant after heat exchange can be further reduced, which helps to improve the heat dissipation effect of the first heat-generating component 3.

[0257] In some embodiments, if the four-way connector 530 has a liquid storage cavity 5, the fifth heat dissipation structure 7 can be disposed on the four-way connector 530 in the area corresponding to the liquid storage cavity 5, so as to dissipate heat for the coolant in the liquid storage cavity 5 through the fifth heat dissipation structure 7.

[0258] Referring to Figure 6, in some embodiments, the fifth heat dissipation structure 7 can be a heat dissipation tooth.

[0259] In this way, by setting the fifth heat dissipation structure 7 as heat dissipation teeth, the surface area of ​​the four-way connector 530 can be increased, the natural heat dissipation capacity can be improved, the heat dissipation teeth can dissipate heat from the four-way connector 530 through natural convection, and can enhance the passive cooling capacity of the coolant.

[0260] Referring to Figure 6, in some embodiments, the thermal management system may further include a gas-liquid separator 8 for separating the coolant flowing from the communication mechanism 500 to the first water pump 200 into gas and liquid components.

[0261] In some embodiments, the gas-liquid separator 8 may be disposed within the communication mechanism 500, or the gas-liquid separator 8 may be disposed between the communication mechanism 500 and the first water pump 200.

[0262] In this way, by setting the gas-liquid separator 8, the thermal management system can reduce the air bubbles in the coolant flowing from the connecting mechanism 500 to the first water pump 200, thereby reducing the impact of air bubbles on the first water pump 200 and reducing the gas in the coolant flowing to the first flow channel, thus avoiding the formation of air bubbles in the first flow channel, which would affect the flow of coolant and the heat dissipation effect of the first heat dissipation structure 100.

[0263] Referring to Figure 6, in some embodiments, the gas-liquid separator 8 can be disposed between the first water pump 200 and the connecting mechanism 500.

[0264] In other embodiments, the gas-liquid separator 8 can be disposed within the connecting mechanism 500. In this way, by disposing of the gas-liquid separator 8 within the connecting mechanism 500, the gas-liquid separator 8 and the connecting mechanism 500 can be integrated, simplifying the piping layout of the first cooling circuit 1 and improving the assembly efficiency of the first cooling circuit 1.

[0265] Referring to Figure 7, in some embodiments, the connecting mechanism 500 may include a four-way connector 530, and the thermal management system may further include a control mechanism 6. The control mechanism 6 is electrically connected to both the first water pump 200 and the second water pump 400. The control mechanism 6 may also be disposed in the first heat dissipation structure 100. The control mechanism 6 can be used to control the first water pump 200 to adjust the flow rate of the coolant in the first flow channel according to the temperature of the coolant in the first flow channel. With the structure of the first heat dissipation structure 100 itself remaining unchanged, the first water pump 200 and the second water pump 400 can increase the flow rate of the coolant flowing through the first heat dissipation structure 100 and the second heat dissipation mechanism by increasing the flow rate of the coolant.

[0266] In this way, by setting the control mechanism 6, the first water pump 200 can be dynamically adjusted. For example, when only the coolant in the first cooling circuit 1 is flowing, the flow rate of the coolant in the first cooling circuit 1 can be adjusted by adjusting the speed of the first water pump 200. With the first heat dissipation structure 100 unchanged, the flow rate of the coolant flowing through the first flow channel can be adjusted to ensure that the heat dissipation effect of the first heat-generating component 3 is guaranteed while avoiding energy waste of the first water pump 200.

[0267] The control mechanism 6 is also used to control the second water pump 400 to drive the coolant flowing out of the fifth outlet 534 of the four-way connector 530 to flow through the second heat dissipation structure 300 and the four-way connector 530 according to the temperature of the coolant in the first flow channel, and then be delivered to the first heat dissipation structure 100 again by the first water pump 200.

[0268] In this way, the control mechanism 6 can control the second water pump 400 on the basis of controlling the first water pump 200, which can improve the control range of the control mechanism 6, and enable the coolant of the second cooling circuit 2 to be connected to the first cooling circuit 1, so that the second heat dissipation structure 300 can assist in the heat dissipation of the coolant, further reduce the temperature of the coolant flowing out of the first heat dissipation structure 100, and further improve the heat exchange between the coolant and the first heat dissipation structure 100, thereby improving the heat dissipation effect on the first heat-generating component 3.

[0269] Referring to Figure 7, in some embodiments, the control mechanism 6 is specifically used to obtain the temperature of the coolant in the first flow channel during the operation of the first heating element 3, and to control the rotation speed of the first water pump 200 when the temperature of the coolant in the first flow channel is less than a first temperature threshold, so as to reduce the flow rate of the coolant in the first flow channel, thereby reducing the energy consumption of the first water pump 200 and thus reducing the energy consumption of the thermal management system.

[0270] Furthermore, by controlling the rotation speed of the first water pump 200 when the temperature of the coolant in the first flow channel is lower than the first temperature threshold, the flow rate of the coolant in the first flow channel is reduced, which can prevent condensation from occurring near the first heating element 3 due to the low temperature.

[0271] In some embodiments, the first temperature threshold may be 20°C.

[0272] In some embodiments, the control mechanism 6 can also be specifically used to obtain the temperature of the coolant in the first flow channel during the operation of the first heating element 3, and maintain the rotation speed of the first water pump 200 when the temperature of the coolant in the first flow channel is greater than or equal to the first temperature threshold and less than the second temperature threshold, so as to ensure the heat dissipation effect of the first cooling circuit 1 on the first heating element 3, and avoid the energy consumption of the first water pump 200 from being too high.

[0273] In some embodiments, the second temperature threshold may be 40°C.

[0274] In some embodiments, the control mechanism 6 is specifically used to obtain the temperature of the coolant in the first flow channel during the operation of the first heating element 3, and control the rotation speed of the first water pump 200 when the temperature of the coolant in the first flow channel is greater than the second temperature threshold, so as to increase the flow rate of the coolant in the first flow channel, thereby ensuring that the first heat dissipation structure 100 can dissipate heat from the first heating element 3 in a timely manner, thereby preventing the first heating element 3 from being damaged due to overheating.

[0275] In this way, by using the control mechanism 6 to adjust the first water pump 200 in different levels, the first heating element 3 can be cooled on demand, avoiding energy waste of the first water pump 200 and achieving the effect of reducing the energy consumption of the thermal management system.

[0276] Referring to Figure 8, in some embodiments, when the temperature of the coolant in the first flow channel is greater than a second temperature threshold, controlling the rotation speed of the first water pump 200 to increase the flow rate of the coolant in the first flow channel may include controlling the rotation speed of the first water pump 200 to increase the flow rate of the coolant in the first flow channel when the temperature of the coolant in the first flow channel is greater than or equal to the second temperature threshold and less than a third temperature threshold.

[0277] The control mechanism 6 is also used to control the speed of the second water pump 400 when the temperature of the coolant in the first flow channel is greater than the third temperature threshold and there is flow in the second flow channel, so as to increase the flow rate of the coolant in the second flow channel.

[0278] In some embodiments, the second temperature threshold may be 45°C.

[0279] Understandably, when both the second heat dissipation structure 300 and the first heat dissipation structure 100 require heat dissipation, the second water pump 400 starts and operates. The second water pump 400 drives the coolant flow in the second cooling circuit 2, ensuring flow in the second channel of the second heat dissipation structure 300. In this situation, both the first water pump 200 and the second water pump 400 are operating. The coolant in the first cooling circuit 1 and the second cooling circuit 2 can be converged and dispersed through the four-way connector 530, allowing the coolant flowing from the second outlet 320 of the second heat dissipation structure 300 to flow to the first water pump 200 via the four-way connector 530.

[0280] Alternatively, if the temperature of the coolant in the second flow channel is greater than the third temperature threshold and there is no flow in the second flow channel, control the second water pump 400 to start.

[0281] Understandably, when the second heat dissipation structure 300 does not require heat dissipation, and the first heat dissipation structure 100 requires heat dissipation, the second water pump 400 can be in a non-operating state, and the first water pump 200 can be in an operating state. However, when the adjustment of the first water pump 200 cannot meet the heat dissipation requirements of the first heat-generating component 3, the control mechanism 6 can request to control the second water pump 400 to operate, so that the coolant flowing out of the first heat dissipation structure 100 can flow through the second water pump 400 through the second heat dissipation structure 300, so as to cool the coolant through the second heat dissipation structure 300, thereby reducing the temperature of the coolant and improving the heat exchange capacity of the coolant, and further improving the cooling effect on the first heat-generating component 3.

[0282] In this way, the synergistic effect of the first cooling circuit 1 and the second cooling circuit 2 can be achieved. By adjusting the flow rate of the coolant flowing through the second channel in the second cooling circuit 2, the flow rate of the coolant flowing through the first channel can be further increased, and the heat dissipation effect on the first heat-generating element 3 can be further improved, thus preventing the first heat-generating element 3 from thermal runaway.

[0283] Referring to Figure 9, in some embodiments, the first heating element 3 is an optomechanical device, which may include a housing 31, a main structure 32, and a circuit board 33. Both the main structure 32 and the circuit board 33 are disposed within the housing 31 and are arranged along a second direction (X direction in Figure 9). The thermal management system may include a first heat dissipation structure 100, which is disposed within the housing 31 and located along the second direction on the side of the main structure 32 facing away from the circuit board 33. The first heat dissipation structure 100 may be a first cold plate with a first flow channel.

[0284] In this way, by using the first heat dissipation structure 100 to dissipate heat for the optical engine, compared with using air cooling methods such as fans to dissipate heat for the optical engine, the heat dissipation efficiency of the optical engine can be improved and the noise during the heat dissipation process can be reduced.

[0285] Furthermore, by placing the main structure 32 and circuit board 33 of the optical engine inside the housing 31, damage to the main structure 32 due to collisions with external objects can be avoided, thereby improving the service life of the optical engine.

[0286] In some embodiments, the thermal management system may further include a third heat-conducting element 12, one end of the second heat-conducting element 11 is thermally connected to the circuit board 33, and the other end is thermally connected to the first heat dissipation structure 100, so as to dissipate heat from the circuit board 33 through the first heat dissipation structure 100 and improve the heat dissipation efficiency of the optical engine.

[0287] Referring to Figure 9, in some embodiments, the thermal management system may further include a thermoelectric cooler 9. The cooling surface of the thermoelectric cooler 9 is connected to the first heating element 3, and the heat dissipation surface of the thermoelectric cooler 9 is connected to the first heat dissipation structure 100. The thermoelectric cooler 9 is used to absorb heat from the first heating element 3 and transfer it to the first heat dissipation structure 100. It is understood that the cooling surface of the thermoelectric cooler 9 can be used for thermally conductive connection with the first heating element 3.

[0288] In this way, by placing the thermoelectric cooler 9 between the first heating element 3 and the first heat dissipation structure 100, the thermoelectric cooler 9 can actively absorb heat from local hot spots with high heat output (such as optomechanical chips) on the first heating element 3 and transfer the absorbed heat to the first heat dissipation structure 100, thereby improving the heat dissipation effect on the first heating element 3.

[0289] Referring to Figure 9, in some embodiments, the thermal management system may further include a first heat-conducting element 10, which is used to connect the first heating element 3 to the first heat dissipation structure 100 and to transfer the heat on the first heating element 3 to the first heat dissipation structure 100.

[0290] In this way, by providing a first heat-conducting element 10 between the first heating element 3 and the first heat dissipation structure 100, the first heat-conducting element 10 can fill the gap between the first heating element 3 and the first heat dissipation structure 100, so that the first heating element 3 can transfer heat to the first heat dissipation structure 100 through the first heat-conducting element 10, thereby improving the heat transfer efficiency between the first heating element 3 and the first heat-conducting element 10, and thus improving the heat dissipation efficiency of the first heating element 3.

[0291] Referring to Figure 9, in some embodiments, the first thermal conductive element 10 may include silicone grease, thermal gel, or thermal pad.

[0292] In this way, by setting the first thermal conductive element 10 as silicone grease, thermal conductive gel or thermal conductive pad, the structure of the first thermal conductive element 10 can be simplified, making it easier for the first thermal conductive element 10 to be installed between the first heating element 3 and the first heat dissipation structure 100. Moreover, the cost of silicone grease, thermal conductive gel and thermal conductive pad is relatively low, which can reduce the manufacturing cost of the first thermal conductive element 10, and thus reduce the manufacturing cost of the thermal management system.

[0293] Referring to Figure 9, in some embodiments, the thermal management system may further include a second heat-conducting element 11, one end of which is connected to the first heat dissipation structure 100, and the other end of which is connected to the side of the first heating element 3 away from the first heat dissipation structure 100. The second heat-conducting element 11 is used to transfer the heat on the side of the first heating element 3 away from the first heat dissipation structure 100 to the first heat dissipation structure 100.

[0294] In this way, the thermal management system includes a second heat-conducting element 11, with one end of the second heat-conducting element 11 connected to the first heat dissipation structure 100 and the other end of the second heat-conducting element 11 connected to the side of the first heating element 3 that is far from the first heat dissipation structure 100. This enables the heat dissipated from the side of the first heating element 3 that is far from the first heat dissipation structure 100 to be transferred to the first heat dissipation structure 100 through the second heat-conducting element 11. This improves the heat transfer efficiency between the side of the first heating element 3 that is far from the first heat dissipation structure 100 and the first heat dissipation structure 100, thereby making the heat dissipation on the first heating element 3 more uniform and improving the heat dissipation efficiency of the first heating element 3.

[0295] Referring to Figure 9, in some embodiments, the second heat-conducting element 11 is a heat pipe or a copper strip.

[0296] In this way, by setting the second heat-conducting element 11 as a heat pipe, which is a double-sided heat-conducting element with extremely high thermal conductivity, it can transfer a large amount of heat in a short time, which helps to shorten the heat transfer time between the end of the first heating element 3 that is away from the first heat dissipation structure 100 and the first heat dissipation structure 100, and improve the heat transfer efficiency.

[0297] This application also provides a vehicle, which may include a vehicle body and the aforementioned thermal management system.

[0298] In this way, by using the aforementioned thermal management system, the vehicle can achieve more flexible thermal management of heat-generating components, reduce energy consumption during the thermal management process, lower vehicle power consumption, and improve vehicle practicality.

[0299] In some embodiments, the vehicle may be a new energy vehicle, such as a pure electric vehicle (PEV / BEV), a range-extended electric vehicle (REEV), a hybrid electric vehicle (HEV), or a fuel cell electric vehicle. The vehicle may also be any vehicle equipped with a battery.

[0300] Referring to Figures 8 and 9, in some embodiments, the vehicle body has a passenger compartment, and the vehicle may also include a first heating element 3, which is disposed on the top of the passenger compartment, and the first heat dissipation structure 100 of the thermal management system is used to dissipate heat for the first heating element 3.

[0301] Thus, since the first cooling circuit 1 of the thermal management system has a first water pump 200, it is possible to deliver coolant to the first heat dissipation structure 100 on the first heat-generating component 3, which is located relatively high, so as to dissipate heat from the first heat-generating component 3. This avoids the situation where the coolant cannot be delivered to the first heat-generating component 3 because the first heat-generating component 3 is located relatively high, thereby improving the practicality of the thermal management system and thus improving the practicality of the vehicle.

[0302] Referring to Figures 8 and 9, in some embodiments, the thermal management system may include a first water pump 200 disposed on the underside of the vehicle body facing away from the passenger compartment.

[0303] In this way, by placing the first water pump 200 on the outside of the vehicle body floor facing away from the passenger compartment, the first water pump 200 can avoid occupying the interior space of the passenger compartment, thereby improving the space utilization rate of the passenger compartment, so as to improve the driving and riding experience of the driver and passengers and improve the practicality of the vehicle.

[0304] Referring to Figures 1 and 10, embodiments of this application also provide a control method for a thermal management system. The control method is applied to the aforementioned thermal management system and may include:

[0305] S100, a control mechanism 6 is provided, which is electrically connected to the first water pump 200, and the communication mechanism 500 in the thermal management system may include a first tee connector 510 and a second tee connector 520.

[0306] S200, the control mechanism 6 obtains the temperature of the coolant in the first flow channel of the first heat dissipation structure 100;

[0307] S300, based on the temperature of the coolant in the first flow channel, the control mechanism 6 controls the first water pump 200 to adjust the flow rate of the coolant in the first flow channel.

[0308] In this way, by using the above control method on the thermal management system, the temperature of the coolant in the first flow channel can be detected, and the flow rate of the coolant in the first flow channel of the first water pump 200 can be controlled according to the detected coolant temperature. This allows the first cooling circuit 1 to adjust accordingly based on the heat generated by the first heating element 3, achieving automated adjustment of the coolant flow rate in the first cooling circuit 1, and improving the thermal management flexibility of the first cooling circuit 1 towards the first heating element 3, thus enhancing the overall flexibility of the thermal management system.

[0309] Referring to Figures 1, 10, and 11, in some embodiments, the control mechanism 6 controls the first water pump 200 to adjust the flow rate of the coolant in the first flow channel based on the obtained temperature of the coolant in the first flow channel, and may further include:

[0310] S310, during the operation of the first heating element 3, the temperature of the coolant in the first flow channel is obtained, and...

[0311] S320, when the temperature of the coolant in the first flow channel is lower than the first temperature threshold, the speed of the first water pump 200 is controlled to reduce the flow rate of the coolant in the first flow channel, thereby reducing the energy consumption of the first water pump 200 and thus reducing the energy consumption of the thermal management system.

[0312] Furthermore, when the temperature of the coolant in the first flow channel is lower than the first temperature threshold, the flow rate of the coolant in the first flow channel can be reduced by controlling the rotation speed of the first water pump 200. This can prevent condensation from forming near the first heating element 3 due to the low temperature, which could lead to corrosion or water ingress damage to the first heating element 3.

[0313] S330, when the temperature of the coolant in the first flow channel is greater than or equal to the first temperature threshold and less than the second temperature threshold, the rotation speed of the first water pump 200 is maintained, so as to ensure the heat dissipation effect of the first cooling circuit 1 on the first heat-generating component 3, and avoid the energy consumption of the first water pump 200 being increased due to excessive rotation speed.

[0314] S340, when the temperature of the coolant in the first flow channel is greater than the second temperature threshold, the speed of the first water pump 200 is controlled to increase the flow rate of the coolant in the first flow channel, thereby ensuring that the first heat dissipation structure 100 can dissipate heat from the first heat-generating component 3 in a timely manner, thus preventing the first heat-generating component 3 from being damaged due to overheating.

[0315] Referring to Figures 3 and 12, embodiments of this application also provide a control method for a thermal management system. The control method is applied to the aforementioned thermal management system and may include:

[0316] S100a, a control mechanism 6 is provided, which is electrically connected to both the first water pump 200 and the second water pump 400, and the communication mechanism 500 in the thermal management system may include a four-way connector 530.

[0317] S200a, the control mechanism 6 obtains the temperature of the coolant in the first flow channel;

[0318] S300a, based on the temperature of the coolant in the first flow channel, the control mechanism 6 controls the first water pump 200 to adjust the flow rate of the coolant in the first flow channel.

[0319] In this way, by setting up the control mechanism 6, the first water pump 200 can be dynamically adjusted. For example, when only the coolant in the first cooling circuit 1 is flowing, the flow rate of the coolant in the first cooling circuit 1 can be adjusted by adjusting the speed of the first water pump 200. With the structure of the first heat dissipation structure 100 itself unchanged, the flow rate of the coolant flowing through the first flow channel can be adjusted to ensure that the heat dissipation effect of the first heat-generating element 3 is guaranteed while avoiding energy waste of the first water pump 200.

[0320] The control mechanism 6 can also be used to control the second water pump 400 to drive the coolant flowing out of the fifth outlet 534 of the four-way connector 530 to flow through the second heat dissipation structure 300 according to the temperature of the coolant in the first flow channel, and then be delivered to the first heat dissipation structure 100 again by the first water pump 200.

[0321] In this way, the control mechanism 6 can control the second water pump 400 on the basis of controlling the first water pump 200, which can improve the control range of the control mechanism 6, and enable the coolant of the second cooling circuit 2 to be connected to the first cooling circuit 1, so that the second heat dissipation structure 300 can assist in the heat dissipation of the coolant, further reduce the temperature of the coolant flowing out of the first heat dissipation structure 100, and further improve the heat exchange between the coolant and the first heat dissipation structure 100, thereby improving the heat dissipation effect on the first heat-generating component 3.

[0322] Referring to Figures 3, 12, and 13, in some embodiments, the control mechanism 6 controls the first water pump 200 to adjust the flow rate of the coolant in the first flow channel based on the obtained temperature of the coolant in the first flow channel, and may further include:

[0323] S310a, during the operation of the first heating element 3, the temperature of the coolant in the first flow channel is obtained, and...

[0324] S320a, when the temperature of the coolant in the first flow channel is lower than the first temperature threshold, the speed of the first water pump 200 is controlled to reduce the flow rate of the coolant in the first flow channel, thereby reducing the energy consumption of the first water pump 200 and thus reducing the energy consumption of the thermal management system.

[0325] Furthermore, by controlling the speed of the first water pump 200 when the temperature of the coolant in the first flow channel is lower than the first temperature threshold, the flow rate of the coolant in the first flow channel is reduced, which can prevent condensation from forming near the first heating element 3 due to the low temperature, thereby preventing corrosion or water ingress damage to the first heating element 3.

[0326] S330a, when the temperature of the coolant in the first flow channel is greater than or equal to the first temperature threshold and less than the second temperature threshold, the rotation speed of the first water pump 200 is maintained, so as to ensure the heat dissipation effect of the first cooling circuit 1 on the first heat-generating component 3, and avoid the increase in energy consumption of the first water pump 200 due to excessive rotation speed.

[0327] S340a, when the temperature of the coolant in the first flow channel is greater than the second temperature threshold, the speed of the first water pump 200 is controlled to increase the flow rate of the coolant in the first flow channel, thereby ensuring that the first heat dissipation structure 100 can dissipate heat from the first heat-generating component 3 in a timely manner, thereby preventing the first heat-generating component 3 from being damaged due to overheating.

[0328] In this way, by using the control mechanism 6 to adjust the first water pump 200 in different levels, the first heating element 3 can be cooled on demand, avoiding energy waste of the first water pump 200 and realizing the energy-saving performance of the thermal management system.

[0329] Referring to Figures 3, 12 to 14, in some embodiments, the method may further include controlling the rotational speed of the first water pump 200 to increase the flow rate of the coolant in the first channel when the temperature of the coolant in the first flow channel is greater than a second temperature threshold. This may include:

[0330] S341a, when the temperature of the coolant in the first flow channel is greater than or equal to the second temperature threshold and less than the third temperature threshold, the rotation speed of the first water pump 200 is controlled to increase the flow rate of the coolant in the first flow channel.

[0331] S342a, the control mechanism 6 is also used to control the speed of the second water pump 400 when the temperature of the coolant in the first flow channel is greater than the third temperature threshold and there is flow in the second flow channel of the second heat dissipation structure 300, so as to increase the flow rate of the coolant in the second flow channel.

[0332] And / or,

[0333] S343a, when the temperature of the coolant in the first flow channel is greater than the third temperature threshold and there is no flow in the second flow channel, the second water pump 400 is controlled to start.

[0334] Understandably, when both the second heat dissipation structure 300 and the first heat dissipation structure 100 require heat dissipation, the second water pump 400 starts and operates. The second water pump 400 drives the coolant flow in the second cooling circuit 2, ensuring flow in the second channel of the second heat dissipation structure 300. In this situation, both the first water pump 200 and the second water pump 400 are operating. The coolant in the first cooling circuit 1 and the second cooling circuit 2 can be converged and dispersed through the four-way connector 530, allowing the coolant flowing from the second outlet 320 of the second heat dissipation structure 300 in the second cooling circuit 2 to flow through the four-way connector 530 to the first water pump 200.

[0335] Alternatively, if the temperature of the coolant in the second flow channel is greater than the third temperature threshold and there is no flow in the second flow channel, control the second water pump 400 to start.

[0336] Understandably, when the second heat dissipation structure 300 does not require heat dissipation, and the first heat dissipation structure 100 requires heat dissipation, the second water pump 400 can be in a non-operating state, and the first water pump 200 can be in an operating state. However, when the adjustment of the first water pump 200 cannot meet the heat dissipation requirements of the first heat-generating component 3, the control mechanism 6 can request to control the second water pump 400 to operate, so that the coolant flowing out of the first heat dissipation structure 100 can flow through the second water pump 400 through the second heat dissipation structure 300, so as to cool the coolant through the second heat dissipation structure 300, thereby improving the heat exchange capacity of the coolant and further improving the cooling effect on the first heat-generating component 3.

[0337] In this way, the synergistic effect of the first cooling circuit 1 and the second cooling circuit 2 can be achieved. By adjusting the flow rate of the coolant flowing through the second channel in the second cooling circuit 2, the flow rate of the coolant flowing through the first channel can be further increased, thereby further improving the heat dissipation effect on the first heat-generating element 3 and preventing thermal runaway of the first heat-generating element 3.

[0338] This application also provides a computer-readable storage medium storing computer-executable instructions, which are executed by a processor to implement the above-described method.

[0339] This application also provides a computer program product, which may include a computer program that, when executed by a processor, implements the above-described method.

[0340] The aforementioned readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk. The readable storage medium can be any available medium accessible to a general-purpose or special-purpose computer.

[0341] An exemplary readable storage medium is coupled to a processor, enabling the processor to read information from and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can reside in an Application Specific Integrated Circuit (ASIC). Alternatively, the processor and the readable storage medium can exist as discrete components in the device.

[0342] The division of units is merely a logical functional division; in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0343] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0344] In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0345] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0346] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0347] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0348] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0349] It should be readily understood that the terms “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on top of something” but also “on top of something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0350] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0351] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A thermal management system, characterized by, It includes a first cooling circuit and a second cooling circuit for the flow of coolant; The first cooling circuit includes a first heat dissipation structure and a first water pump. The first heat dissipation structure is used to dissipate heat for the first heat-generating component. The first heat dissipation structure has a first flow channel for coolant to flow and a first inlet end and a first outlet end communicating with the first flow channel. The second cooling circuit includes a second heat dissipation structure and a second water pump. The second heat dissipation structure is used to dissipate heat for the second heat-generating component. The second heat dissipation structure has a second flow channel for coolant to flow through and a second inlet end and a second outlet end connected to the second flow channel. The first water pump includes a first inlet and a first outlet, the first outlet being connected to the first inlet; the second water pump includes a second inlet and a second outlet. Connecting mechanism; The connecting mechanism includes a first tee connector and a second tee connector; The first three-way connector includes a first inlet, a first outlet, and a second outlet that are interconnected. The first inlet is connected to the second liquid outlet of the second heat dissipation structure, the first outlet is connected to the first liquid inlet of the first water pump, and the second outlet is connected to the second liquid inlet of the second water pump. The second three-way connector includes a second inlet, a third inlet, and a third outlet that are interconnected. The second inlet is connected to the first liquid outlet of the first heat dissipation structure, the third inlet is connected to the second liquid outlet of the second water pump, and the third outlet is connected to the second liquid inlet of the second heat dissipation structure. Alternatively, the communication mechanism may include a four-way connector; The four-way connector includes a fourth inlet, a fifth inlet, a fourth outlet, and a fifth outlet that are interconnected. The fourth inlet is connected to the second liquid outlet of the second heat dissipation structure, the fourth outlet is connected to the first liquid inlet of the first water pump, the fifth inlet is connected to the first liquid outlet of the first heat dissipation structure, the fifth outlet is connected to the second liquid inlet of the second water pump, and the second liquid outlet of the second water pump is connected to the second liquid inlet of the second heat dissipation structure.

2. A thermal management system, characterized by, include: The first heat dissipation structure has a first flow channel for coolant to flow through and a first inlet end and a first outlet end connecting the first flow channel. The first heat dissipation structure is used to dissipate heat for the first heat-generating component. The first water pump includes a first inlet and a first outlet, wherein the first outlet is connected to the first inlet. Connecting mechanism; The connecting mechanism includes a first tee connector and a second tee connector; The first three-way connector includes a first inlet, a first outlet, and a second outlet that are interconnected. The first inlet is used to connect to the second liquid outlet of the second heat dissipation structure, the first outlet is connected to the first liquid inlet of the first water pump, and the second outlet is used to connect to the second liquid inlet of the second water pump. The second three-way connector includes a second inlet, a third inlet, and a third outlet that are interconnected. The second inlet is connected to the first liquid outlet of the first heat dissipation structure, and the third inlet is used to connect to the second liquid outlet of the second water pump. The third outlet is used to connect to the second liquid inlet of the second heat dissipation structure. The second heat dissipation structure is used to dissipate heat for the second heat-generating component, and the second water pump is used to drive the coolant to flow from the second inlet end of the second heat dissipation structure to the second outlet end. Alternatively, the communication mechanism may include a four-way connector; The four-way connector includes a fourth inlet, a fifth inlet, a fourth outlet, and a fifth outlet that are interconnected. The fourth inlet is used to communicate with the second liquid outlet of the second heat dissipation structure, the fourth outlet is used to communicate with the first liquid inlet of the first water pump, the fifth inlet is used to communicate with the first liquid outlet of the first heat dissipation structure, and the fifth outlet is used to communicate with the second liquid inlet of the second water pump. The second outlet of the second water pump is used to connect with the second inlet of the second heat dissipation structure.

3. The thermal management system of claim 1 or 2, wherein, The connecting mechanism includes the first tee connector and the second tee connector; The thermal management system further includes a check valve structure, which is used to prevent coolant flowing out of the first outlet from flowing back into the first flow channel.

4. The thermal management system of claim 3, wherein, The check valve is installed inside the second three-way connector and is used to prevent coolant from flowing from the second inlet to the first outlet.

5. The thermal management system of claim 1 or 2, wherein, The connecting mechanism is the four-way connector; The four-way connector has a liquid storage chamber inside, which is connected to the fourth inlet, the fifth inlet, the fourth outlet and the fifth outlet. The liquid storage chamber is used to store coolant.

6. The thermal management system of claim 1 or 2, wherein, It also includes a third heat dissipation structure, which is used to dissipate heat for the third heat-generating component; The third heat dissipation structure includes a third flow channel and a third liquid inlet and a third liquid outlet connected to the third flow channel. The outlet of the first water pump is connected to the third inlet, and the third outlet is connected to the first inlet of the first heat dissipation structure, so that the first heat dissipation structure and the third heat dissipation structure are connected in series.

7. The thermal management system of claim 6, wherein, Along a first direction, the third heat dissipation structure is located between the first heat dissipation structure and the connecting mechanism, where the first direction is the height direction.

8. The thermal management system of claim 7, wherein, Along the first direction, the third liquid inlet of the third heat dissipation structure is lower than the third liquid outlet, and the third liquid outlet is lower than the first liquid inlet of the first heat dissipation structure.

9. The thermal management system of claim 6, wherein, The heating power of the third heating element is less than or equal to the first preset value.

10. The thermal management system of claim 1 or 2, wherein, The first cooling circuit further includes a fourth heat dissipation structure, which is used to dissipate heat for the fourth heat-generating component; The fourth heat dissipation structure includes a fourth flow channel, and a fourth liquid inlet and a fourth liquid outlet connected to the fourth flow channel. The fourth liquid inlet is connected to the first water pump, and the fourth liquid outlet is connected to the second liquid inlet of the second heat dissipation structure through the connecting mechanism, so that the fourth heat dissipation structure and the first heat dissipation structure are arranged in parallel.

11. The thermal management system of claim 1 or 2, wherein, The connecting mechanism includes the first tee connector and the second tee connector, and the thermal management system further includes a control mechanism; The control mechanism is electrically connected to the first water pump, and the control mechanism controls the first water pump to adjust the flow rate of the coolant in the first flow channel according to the temperature of the coolant in the first flow channel.

12. The thermal management system of claim 11, wherein, The control mechanism is specifically used for: During the operation of the first heating element, the temperature of the coolant in the first flow channel is obtained, and... When the temperature of the coolant in the first flow channel is lower than a first temperature threshold, the speed of the first water pump is controlled to reduce the flow rate of the coolant in the first flow channel; and / or, When the temperature of the coolant in the first flow channel is greater than or equal to the first temperature threshold and less than the second temperature threshold, the speed of the first water pump is maintained. And / or, When the temperature of the coolant in the first flow channel is greater than the second temperature threshold, the speed of the first water pump is controlled to increase the flow rate of the coolant in the first flow channel.

13. The thermal management system of claim 1 or 2, wherein, The communication mechanism includes the four-way connector, and the thermal management system further includes a control mechanism; The control mechanism is electrically connected to both the first water pump and the second water pump; The control mechanism is used to control the first water pump to adjust the flow rate of the coolant in the first flow channel according to the temperature of the coolant in the first flow channel. The control mechanism is also used to control the second water pump to drive the coolant flowing out of the fifth outlet of the four-way connector to flow through the second heat dissipation structure and the four-way connector according to the temperature of the coolant in the first flow channel, and then be delivered to the first heat dissipation structure again by the first water pump.

14. The thermal management system of claim 13, wherein, The control mechanism is specifically used for: During the operation of the first heating element, the temperature of the coolant in the first flow channel is obtained, and... When the temperature of the coolant in the first flow channel is lower than a first temperature threshold, the speed of the first water pump is controlled to reduce the flow rate of the coolant in the first flow channel; and / or, When the temperature of the coolant in the first flow channel is greater than or equal to the first temperature threshold and less than the second temperature threshold, the speed of the first water pump is maintained. And / or, When the temperature of the coolant in the first flow channel is greater than the second temperature threshold, the speed of the first water pump is controlled to increase the flow rate of the coolant in the first flow channel.

15. The thermal management system according to claim 14, characterized in that, When the temperature of the coolant in the first flow channel is greater than the second temperature threshold, controlling the speed of the first water pump to increase the flow rate of the coolant in the first flow channel includes: When the temperature of the coolant in the first flow channel is greater than or equal to the second temperature threshold and less than the third temperature threshold, the speed of the first water pump is controlled to increase the flow rate of the coolant in the first flow channel. The control mechanism is further configured to, when the temperature of the coolant in the first flow channel is greater than the third temperature threshold and there is flow in the second flow channel, control the rotational speed of the second water pump, thereby increasing the flow rate of the coolant in the second flow channel; and / or, If the temperature of the coolant in the second flow channel is greater than the third temperature threshold and there is no flow in the second flow channel, the second water pump is controlled to start.

16. The thermal management system of claim 5, wherein, The thermal management system further includes a fifth heat dissipation structure, which is disposed on the four-way connector near the liquid storage chamber.

17. The thermal management system of claim 16, wherein, The fifth heat dissipation structure is a heat dissipation tooth.

18. The thermal management system of claim 1, wherein, The thermal management system further includes a gas-liquid separator, which is used to separate the coolant flowing from the communication mechanism to the first water pump into gas and liquid components.

19. The thermal management system of claim 18, wherein, The gas-liquid separator is disposed between the first water pump and the communication mechanism; Alternatively, the gas-liquid separator may be disposed within the communication mechanism.

20. The thermal management system according to claim 1 or 2, characterized in that, The first heat-generating component is an optical engine, and the first heat dissipation structure is a first cold plate.

21. The thermal management system according to claim 1 or 2, characterized in that, The second heating element is a battery, and the second heat dissipation structure is a second cold plate.

22. The thermal management system according to claim 1 or 2, characterized in that, The second heating element is a motor, and the second heat dissipation structure is a front-end heat sink.

23. The thermal management system according to claim 6, characterized in that, The third heat dissipation structure is the third cold plate.

24. The thermal management system according to claim 1 or 2, characterized in that, The thermal management system further includes a thermoelectric cooling element, the cooling surface of which is connected to the first heating element, and the heat dissipation surface of which is connected to the first heat dissipation structure. The thermoelectric cooling element is used to absorb heat from the first heating element and transfer it to the first heat dissipation structure.

25. The thermal management system according to claim 1 or 2, characterized in that, The thermal management system further includes a first heat-conducting component, which is used to connect the first heating element to the first heat dissipation structure and to transfer the heat on the first heating element to the first heat dissipation structure.

26. The thermal management system according to claim 25, characterized in that, The first thermal conductive component includes silicone grease, thermal gel, or thermal pad.

27. The thermal management system according to claim 1 or 2, characterized in that, The thermal management system further includes a second heat-conducting component, one end of which is connected to the first heat dissipation structure, and the other end of which is connected to the side of the first heating element away from the first heat dissipation structure. The second heat-conducting component is used to transfer heat from the side of the first heating element away from the first heat dissipation structure to the first heat dissipation structure.

28. The thermal management system according to claim 27, characterized in that, The second heat-conducting component is a heat pipe or a copper strip.

29. The thermal management system according to claim 1 or 2, characterized in that, In a first direction, the first heat dissipation structure is located above the connecting mechanism, and the first direction is the height direction.

30. The thermal management system according to claim 29, characterized in that, Along the first direction, the first liquid outlet is higher than the first liquid inlet.

31. A vehicle, characterized in that, It includes a vehicle body and a thermal management system as described in any one of claims 1 to 30.

32. The vehicle according to claim 31, characterized in that, The vehicle body has a passenger compartment, and the vehicle also includes a first heating element, which is disposed on the top of the passenger compartment; The first heat dissipation structure of the thermal management system is used to dissipate heat for the first heat-generating component.

33. The vehicle according to claim 32, characterized in that, The thermal management system includes a first water pump, which is disposed on the underside of the vehicle body facing away from the passenger compartment.

34. The vehicle according to claim 32, characterized in that, The first heating element is an optical engine, which includes a housing, a main structure, and a circuit board; Both the main structure and the circuit board are housed within the housing, and the main structure and the circuit board are arranged along the second direction; The thermal management system includes a first heat dissipation structure disposed within the housing along the second direction, on the side of the main structure facing away from the circuit board.

35. A control method for a thermal management system, characterized in that, The method, applied to a thermal management system as described in any one of claims 1-30, comprises: A control mechanism is provided, which is electrically connected to the first water pump, and the communication mechanism in the thermal management system includes a first tee connector and a second tee connector; The control mechanism acquires the temperature of the coolant in the first flow channel of the first heat dissipation structure; Based on the temperature of the coolant in the first flow channel, the control mechanism controls the first water pump to adjust the flow rate of the coolant in the first flow channel.

36. The control method according to claim 35, characterized in that, The step of controlling the first water pump to adjust the flow rate of the coolant in the first flow channel based on the obtained temperature of the coolant in the first flow channel further includes: During the operation of the first heating element, the temperature of the coolant in the first flow channel is obtained, and... When the temperature of the coolant in the first flow channel is lower than a first temperature threshold, the speed of the first water pump is controlled to reduce the flow rate of the coolant in the first flow channel; and / or, When the temperature of the coolant in the first flow channel is greater than or equal to the first temperature threshold and less than the second temperature threshold, the rotational speed of the first water pump is maintained; and / or, When the temperature of the coolant in the first flow channel is greater than the second temperature threshold, the speed of the first water pump is controlled to increase the flow rate of the coolant in the first flow channel.

37. A control method for a thermal management system, characterized in that, The method, applied to a thermal management system as described in any one of claims 1-30, comprises: A control mechanism is provided, which is electrically connected to both the first and second water pumps, and the communication mechanism in the thermal management system includes a four-way connector; The control mechanism acquires the temperature of the coolant in the first flow channel; Based on the temperature of the coolant in the first flow channel, the control mechanism controls the first water pump to adjust the flow rate of the coolant in the first flow channel.

38. The control method according to claim 37, wherein The step of controlling the first water pump to adjust the flow rate of the coolant in the first flow channel based on the obtained temperature of the coolant in the first flow channel further includes: During the operation of the first heating element, the temperature of the coolant in the first flow channel is obtained, and... When the temperature of the coolant in the first flow channel is lower than a first temperature threshold, the speed of the first water pump is controlled to reduce the flow rate of the coolant in the first flow channel; and / or, When the temperature of the coolant in the first flow channel is greater than or equal to the first temperature threshold and less than the second temperature threshold, the rotational speed of the first water pump is maintained; and / or, When the temperature of the coolant in the first flow channel is greater than the second temperature threshold, the speed of the first water pump is controlled to increase the flow rate of the coolant in the first flow channel.

39. The control method according to claim 38, wherein It also includes, when the temperature of the coolant in the first flow channel is greater than the second temperature threshold, controlling the speed of the first water pump to increase the flow rate of the coolant in the first flow channel, including: When the temperature of the coolant in the first flow channel is greater than or equal to the second temperature threshold and less than the third temperature threshold, the speed of the first water pump is controlled to increase the flow rate of the coolant in the first flow channel. The control mechanism is further configured to control the rotation speed of the second water pump when the temperature of the coolant in the first flow channel is greater than the third temperature threshold and there is flow in the second flow channel of the second heat dissipation structure, so as to increase the flow rate of the coolant in the second flow channel. And / or, If the temperature of the coolant in the first flow channel is greater than the third temperature threshold and there is no flow in the second flow channel, the second water pump is controlled to start.

40. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement the method as described in any one of claims 36-39.

41. A computer program product, characterised in that, Includes a computer program that, when executed by a processor, implements the method described in any one of claims 35-39.