Light-emitting substrate and bonding method therefor, flexible printed circuit and display device

Abstract

The present application relates to the technical field of display. Provided are a light-emitting substrate and a bonding method therefor, a flexible printed circuit and a display device. The light-emitting substrate comprises: a base substrate, which comprises a first surface and a second surface which are arranged opposite each other, and a side face, with the second surface comprising at least one first bonding region; and a plurality of connection traces arranged in a first direction, each of which comprises a first portion disposed on the first surface, a second portion disposed on the side face, and a third portion disposed on the second surface, wherein the orthographic projection of each third portion on the base substrate overlaps with a first bonding region; the plurality of third portions located in the same first bonding region are divided into at least two bonding sub-regions arranged in the first direction, a first blank region is provided between every two adjacent bonding sub-regions, and the width of the first blank region in the first direction is greater than a first spacing; and the third portions in the two bonding sub-regions located on two sides of each first blank region are parallel to each other, and the plurality of bonding sub-regions located in the same first bonding region are configured to be bonded and connected to the same flexible printed circuit.

Description

A light-emitting substrate and its bonding method, a flexible circuit board, and a display device. Technical Field

[0001] This application relates to the field of display technology, and in particular to a light-emitting substrate and its bonding method, a flexible circuit board, and a display device. Background Technology

[0002] Currently, in order to achieve a narrow bezel on the light-emitting substrate, the pads on the front of the panel can be routed to the back of the panel by routing traces on the top and bottom sides of the light-emitting substrate as well as side traces, thereby reducing or eliminating the bonding area on the front side and reducing the width of the panel bezel.

[0003] However, in some applications, the use of straight-pull leads results in an excessively wide bonding area on the back of the panel, which increases the number of circuit boards to be bonded and leads to higher costs. Summary of the Invention

[0004] This application provides a light-emitting substrate and its bonding method, a flexible circuit board, and a display device, which can solve the problems of a large number of circuit boards bonded to the light-emitting substrate and high cost.

[0005] In a first aspect, this application provides a light-emitting substrate, the light-emitting substrate comprising:

[0006] The substrate includes a first surface and a second surface disposed opposite to each other, and a side surface connecting the first surface and the second surface. The first surface includes a light-emitting region and an epitaxial region, and the second surface includes at least one first bonding region.

[0007] Multiple miniature light-emitting diodes are arranged in an array and located in the light-emitting area. The miniature light-emitting diodes are electrically connected to their corresponding driving lines.

[0008] A plurality of first electrodes are located in the epitaxial region, and the first electrodes are electrically connected to a driving trace extending from the light-emitting region to the epitaxial region;

[0009] Multiple connection traces are arranged along a first direction. The connection traces include a first part disposed on the first surface, a second part disposed on the side surface, and a third part disposed on the second surface. The first part is electrically connected to a first electrode, and the orthographic projection of the third part on the substrate overlaps with the first bonding area.

[0010] Multiple third parts located within the same first binding area are divided into at least two sub-binding areas arranged along the first direction. A first blank area is provided between two adjacent sub-binding areas. In the first direction, the width of the first blank area is greater than a first spacing, which is the spacing between two adjacent third parts located within the same sub-binding area.

[0011] The third part of the two sub-binding areas located on both sides of the first blank area and close to the first blank area are parallel to each other, and the multiple sub-binding areas located in the same first binding area are used to bind and connect with the same flexible circuit board.

[0012] Optionally, the two sub-binding areas located on either side of the first blank area include the same number of the third parts.

[0013] And / or, the widths of the two sub-binding areas located on either side of the first blank area are approximately equal along the first direction.

[0014] Optionally, the first binding area includes two sub-binding areas, which are symmetrically arranged about the first reference line axis, and the first blank area is symmetrically arranged about the first reference line axis, and the extension direction of the first reference line is perpendicular to the first direction.

[0015] Optionally, the third part extends along a third straight line, the extension direction of which is perpendicular to the first direction.

[0016] Optionally, the first part extends along a first straight line, and the second part extends along a second straight line, wherein the extension direction of the first straight line and the extension direction of the second straight line are both perpendicular to the first direction.

[0017] Optionally, a binding mark is provided on each of the two opposite sides of the first binding area along the first direction, and the binding mark is provided near the edge of the first binding area.

[0018] Optionally, the width of the first blank area along the first direction is less than the target distance, where the target distance is the minimum distance between the binding marks of two adjacent first binding areas along the first direction.

[0019] Secondly, this application provides a flexible circuit board, the flexible circuit board comprising:

[0020] A flexible substrate, and a first conductive layer located on one side of the flexible substrate;

[0021] The first conductive layer includes a plurality of first pins located in the second bonding region and arranged along the second direction. The plurality of first pins are divided into at least two pin regions arranged along the second direction. A second blanking region is provided between two adjacent pin regions. In the second direction, the width of the second blanking region is greater than the second spacing. The second spacing is the spacing between two adjacent first pins located in the same pin region.

[0022] Optionally, the two pin areas located on either side of the second blank area include the same number of the first pins.

[0023] And / or, the widths of the two pin areas located on either side of the second blank area are approximately equal along the second direction.

[0024] Optionally, the second bonding area includes two pin areas, which are symmetrically arranged about the second reference line axis, and the second blank area is symmetrically arranged about the second reference line axis, and the extension direction of the second reference line is perpendicular to the second direction.

[0025] Optionally, the flexible circuit board further includes a second conductive layer located on the side of the flexible substrate away from the first conductive layer;

[0026] The second conductive layer includes a plurality of second pins arranged along the second direction in the third bonding region;

[0027] The flexible circuit board is divided into a first part and a second part arranged perpendicular to the second direction, and the second bonding area is disposed in the first part; wherein, the width of the first part along the second direction is greater than the width of the second part along the second direction;

[0028] The second conductive layer further includes at least one pad; the pad and the third bonding area are disposed in the second portion, and the pad is located on the side of the third bonding area away from the second bonding area.

[0029] Optionally, the flexible circuit board further includes: a first cover layer located on the side of the second conductive layer away from the flexible substrate;

[0030] The first cover layer includes opening areas corresponding to the plurality of second pins, and the orthographic projection of the opening areas on the flexible substrate overlaps with the orthographic projection of the plurality of second pins on the flexible substrate.

[0031] The first cover layer also includes a window area corresponding to the pad, and the projection of the window area onto the flexible substrate overlaps with the projection of the pad onto the flexible substrate.

[0032] Optionally, the flexible circuit board further includes an adhesive area located on the side of the first cover layer away from the flexible substrate, the adhesive area being located in the second portion of the flexible circuit board;

[0033] At least one window area is provided on each side of the adhesive area along the second direction, and the orthographic projection of the window area on the flexible substrate does not overlap with the orthographic projection of the adhesive area on the flexible substrate.

[0034] Thirdly, this application provides a display device, the display device including a light-emitting substrate as described in the first aspect, and a flexible circuit board as described in the second aspect, wherein a plurality of sub-bonding areas located in the same first bonding area are bonded to a plurality of pin areas located in the same second bonding area, a first pin in the pin area is bonded to a third part in the sub-bonding area, and the orthographic projections of the first blank area and the second blank area on the substrate at least partially overlap.

[0035] Fourthly, this application provides a bonding method for a light-emitting substrate, comprising:

[0036] Provides a light-emitting substrate as described in the first aspect and a flexible circuit board as described in the second aspect;

[0037] One flexible circuit board is bonded to the first bonding area of ​​the light-emitting substrate by one or more pressure heads, so that multiple sub-bonding areas located in the same first bonding area are bonded one by one to multiple pin areas located in the same second bonding area, and the first pin in the pin area is bonded one by one to the third part in the sub-bonding area, and the orthogonal projections of the first blank area and the second blank area on the substrate at least partially overlap.

[0038] The light-emitting substrate and its bonding method, flexible circuit board, and display device provided in this application have at least the following advantages:

[0039] In this embodiment, the light-emitting substrate includes a substrate and multiple connection traces arranged along a first direction. The substrate includes a first surface and a second surface disposed opposite to each other, and a side surface connecting the first surface and the second surface. The first surface includes a light-emitting region and an epitaxial region, and the second surface includes at least one first bonding region. The connection traces include a first portion disposed on the first surface, a second portion disposed on the side surface, and a third portion disposed on the second surface. The orthographic projection of the third portion on the substrate overlaps with the first bonding region. Multiple third portions located in the same first bonding region are divided into at least two sub-bonding regions arranged along the first direction. A first blank area is provided between two adjacent sub-bonding regions. In the first direction, the width of the first blank area is greater than a first spacing, which is the spacing between two adjacent third portions located in the same sub-bonding region. Furthermore, the third portions of two sub-bonding regions located on both sides of and close to the first blank area are parallel to each other. Multiple sub-bonding regions located in the same first bonding region are used for bonding and connecting with the same flexible circuit board. In this way, the number of flexible circuit boards bonded to the light-emitting substrate can be reduced, thereby reducing costs.

[0040] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, specific embodiments of this application are given below. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 is a schematic diagram of the structure of a light-emitting substrate provided in an embodiment of this application;

[0043] Figure 2 is a schematic plan view of a light-emitting substrate provided in an embodiment of this application;

[0044] Figure 3 is a second planar schematic diagram of a light-emitting substrate provided in an embodiment of this application;

[0045] Figure 4 is one of the planar schematic diagrams of the light-emitting substrate in the related technology;

[0046] Figure 5 is a second planar schematic diagram of the light-emitting substrate in the related technology;

[0047] Figure 6 is a third planar schematic diagram of a light-emitting substrate provided in an embodiment of this application;

[0048] Figure 7 is a schematic diagram of one of the structures of a flexible circuit board provided in an embodiment of this application;

[0049] Figure 8 is a schematic diagram of an FPC bonded to a light-emitting substrate in a related technology;

[0050] Figure 9 is a schematic diagram of two FPCs bonded to a light-emitting substrate in a related technology;

[0051] Figure 10 is one of the planar schematic diagrams of a flexible circuit board provided in an embodiment of this application;

[0052] Figure 11 is a second schematic diagram of the structure of a flexible circuit board provided in an embodiment of this application;

[0053] Figure 12 is a partial enlarged view of a window area provided in an embodiment of this application;

[0054] Figure 13 is a second planar schematic diagram of a flexible circuit board provided in an embodiment of this application;

[0055] Figure 14 is a partially enlarged view of a test electrode provided in an embodiment of this application;

[0056] Figure 15 is a third planar schematic diagram of a flexible circuit board provided in an embodiment of this application. Specific Implementation

[0057] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0058] Display devices are evolving towards ultra-thin, ultra-narrow bezels, and even bezel-less designs. Currently, achieving a four-sided narrow bezel on narrow-bezel emitting substrates is extremely difficult, especially for Micro & Mini LED (MLED) display technology, which relies on splicing techniques to achieve large-size displays. Existing technology routes circuitry on the top and bottom surfaces of the emitting substrate (PANEL), then uses a silver paste side wiring scheme to route the front pads to the back of the glass. This eliminates the 1.0–2.0 mm bonding area, achieving a bezel-less design.

[0059] However, under current silver paste printing processes, the minimum linewidth / spacing of the silver paste is approximately 100 micrometers (μm). The linewidth / spacing cannot be further compressed, and silver paste printing cannot print oblique lines to achieve bonding area convergence, thus preventing the bonding area from narrowing. This results in the required size of the corresponding flexible printed circuit (FPC) for the light-emitting substrate being too large, and large-size FPC materials pose a challenge to the capabilities of existing bonding equipment. To cope with large-size FPC materials, new equipment needs to be introduced or existing equipment needs to be upgraded, thereby increasing product costs.

[0060] Figure 1 is a schematic diagram of the structure of a light-emitting substrate 10 provided in an embodiment of this application. As shown in Figure 1, the light-emitting substrate 10 includes:

[0061] The substrate 101 includes a first surface and a second surface disposed opposite to each other, and a side surface connecting the first surface and the second surface. The first surface includes a light-emitting region and an epitaxial region, and the second surface includes at least one first bonding region.

[0062] Multiple miniature light-emitting diodes are arranged in an array and located in the light-emitting area. The miniature light-emitting diodes are electrically connected to their corresponding driving traces.

[0063] Multiple first electrodes are located in the epitaxial region, and the first electrodes are electrically connected to a driving trace extending from the light-emitting region to the epitaxial region.

[0064] Multiple connection traces 102 are arranged along a first direction. Each connection trace 102 includes a first part disposed on a first surface, a second part disposed on a side surface, and a third part disposed on a second surface. The first part is electrically connected to a first electrode, and the orthographic projection of the third part on the substrate 101 overlaps with the first bonding area.

[0065] Multiple third parts located within the same first binding area are divided into at least two sub-binding areas arranged along a first direction. A first blank area is provided between two adjacent sub-binding areas. In the first direction, the width of the first blank area is greater than a first spacing, which is the spacing between two adjacent third parts located within the same sub-binding area.

[0066] The third part of the two sub-binding areas located on both sides of the first blank area and close to the first blank area are parallel to each other, and multiple sub-binding areas located in the same first binding area are used to bind and connect with the same FPC.

[0067] In some embodiments, the substrate 101 may be a glass substrate, with the first surface and the second surface being two opposite surfaces of the glass substrate. The first surface may be referred to as the front side of the substrate 101, and the second surface may be referred to as the back side of the substrate 101. The first surface and the second surface may be connected by a side surface, the plane of which is perpendicular to both the first and second surfaces. Alternatively, the first surface and the second surface may be connected by multiple interconnected side surfaces, which may include side surfaces perpendicular to both the first and second surfaces, or side surfaces forming an acute angle with either the first or second surface. This application does not impose any limitations on this aspect.

[0068] In some embodiments, the first surface includes a light-emitting region and an epitaxial region. The light-emitting region may include a pixel array consisting of multiple pixel arrays arranged in a grid. The epitaxial region is located at at least one edge of the substrate 101 and includes multiple first electrodes for electrical connection to multiple connection lines 102.

[0069] In some embodiments, the light-emitting substrate 10 can be applied to the MLED field. For example, the light-emitting substrate 10 can be a single-sided frameless glass substrate 10 for MLEDs. The light-emitting element in the pixel of the MLED light-emitting substrate is a micro light-emitting diode, such as a Micro LED or Mini LED. Multiple micro light-emitting diodes can be arranged in row and column directions respectively to form multiple pixel rows and multiple pixel columns. The micro light-emitting diodes and their corresponding driving lines include row and column driving lines, that is, the micro light-emitting diodes are electrically connected to the driving lines corresponding to their respective pixel rows and to the driving lines corresponding to their respective pixel columns. The driving lines extend from the light-emitting region to the epitaxial region and are then electrically connected to a first electrode of the epitaxial region.

[0070] The MLED light-emitting substrate provided in this embodiment is suitable for application scenarios where the total number of connecting traces 102 exceeds 375, and / or the total width of the bonding area formed by multiple connecting traces 102 exceeds 75mm, making the application of the light-emitting substrate 10 more flexible and the scenarios more extensive.

[0071] Figure 2 is a schematic planar view of a light-emitting substrate 10 provided in an embodiment of this application. Figure 2 shows a first surface of the substrate 101, on which a light-emitting region and an epitaxial region are disposed. The light-emitting region includes a pixel array and row and column driving lines of the pixel array, and the epitaxial region includes a plurality of first electrodes. As shown in Figure 2, the plurality of first electrodes in the epitaxial region are arranged side by side at intervals along a first direction. One end of the first electrode can be electrically connected to the row and column driving lines, and the other end of the first electrode can be electrically connected to the connecting line 102. For example, the first electrode can be a side line lead-out Pad. The lead-out Pad can transmit the driving signal provided by the connecting line 102 to the pixels in the pixel array through the row and column driving lines to drive the light-emitting substrate 10 to display an image. The length of the lead-out Pad ranges from 0.08 to 0.2 mm, and the width of the lead-out Pad is greater than 0.05 mm.

[0072] In some embodiments, multiple connection traces 102 of the light-emitting substrate 10 are used to lead multiple first electrodes on the first surface of the substrate 101 to the second surface of the substrate 101 so as to bond the FPC on the second surface. Therefore, the connection traces 102 include a first portion disposed on the first surface, a second portion disposed on the side surface, and a third portion disposed on the second surface, and the first portion, the second portion and the third portion are electrically connected to each other.

[0073] In some embodiments, multiple connection traces 102 are arranged along a first direction. Specifically, the first, second, and third portions of the connection traces 102 are arranged side-by-side and spaced apart along the first direction on the first surface, the side surface, and the second surface, respectively. The side-by-side and spaced-apart arrangement means that they are arranged parallel to each other and have a certain interval. The first portion of the connection trace 102 is electrically connected to the first electrode of the epitaxial region, and the orthographic projection of the first portion at least partially covers the orthographic projection of the first electrode in the orthographic projection of the substrate 101. The second portion of the connection trace 102 is disposed on the side surface of the substrate 101 and is used to connect the first and third portions. As shown in FIG1, the substrate 101 includes multiple side surfaces, and the second portion electrically connects the first and third portions of the connection trace 102 via these multiple side surfaces.

[0074] Figure 3 is a second planar schematic diagram of a light-emitting substrate 10 provided in an embodiment of this application. As shown in Figure 3, the first part of the connecting trace 102 on the first surface of the substrate 101 covers the first electrode in the epitaxial region, so that the connecting trace 102 is electrically connected to the first electrode.

[0075] In some embodiments, the third portion of the connecting trace 102 is used to electrically connect to the drive signal line. For example, the third portion of the connecting trace 102 is bound to the FPC and electrically connected to the drive signal line on the FPC, thereby electrically connecting to the drive circuit on the drive circuit board through the FPC to receive the drive signal sent by the drive circuit. The third portions of the connecting trace 102 are arranged side by side at intervals along the first direction on the second surface, and each third portion is parallel to the others.

[0076] In some embodiments, the connecting trace 102 can be made of a conductive metal material. The connecting trace 102 can be manufactured in three parts—the first, second, and third parts—in one step, or the first, second, and third parts can be manufactured in stages; this application does not impose any limitations. For example, conductive paste can be printed using a 3D printer, and the connecting trace 102 forms after the conductive paste solidifies. For example, the connecting trace 102 can be printed using silver paste (Ag Print), and the connecting trace 102 is a silver paste lead. The silver paste lead can be printed in one step, or the first, second, and third parts can be printed in stages. This is merely an example, and this application does not impose any limitations.

[0077] In some embodiments, the second surface includes at least one first bonding region, that is, at least one first bonding region is provided on the back side of the substrate 101, and the third portion of the connecting trace 102 on the second surface overlaps with the orthographic projection of the first bonding region on the substrate 101. For example, the distribution area of ​​the third portion of the connecting trace 102 on the second surface can be referred to as the first bonding region. In this embodiment, each first bonding region corresponds to one FPC, and multiple sub-bonding regions in each first bonding region are bonded to the same FPC.

[0078] In some embodiments, the first binding area is further divided along the first direction by a third portion of the connecting trace 102, forming sub-binding areas. Each first binding area includes at least two sub-binding areas, which are arranged along the first direction in the same direction as the third portion. A first blank area is provided between each pair of adjacent sub-binding areas, and no traces are distributed within the first blank area. The width of the first blank area along the first direction is greater than the distance between two adjacent third portions within the two sub-binding areas along the first direction. The widths of different first blank areas can be the same or different, and this embodiment does not limit this.

[0079] In this embodiment, the distance between two adjacent third parts located in the same sub-binding area is called the first distance. If the third parts of the connecting trace 102 are arranged at equal intervals, then the distance between any two adjacent third parts is equal. If the third parts are not arranged at equal intervals, then the width of the first blank area along the first direction is greater than the maximum distance between two adjacent third parts. For example, the distance corresponding to the third part is the pitch, which represents the distance between the center lines of two adjacent third parts, and the center lines are perpendicular to the first direction.

[0080] In this context, "equal spacing" means that the width between any two adjacent third parts along the first direction is equal, i.e., the spacing between the third parts is fixed. In practical applications, manufacturing the connecting traces 102 at a fixed spacing can improve manufacturing efficiency. For example, when printing silver paste, printing multiple silver paste leads at a fixed spacing can yield multiple connecting traces 102 in this embodiment.

[0081] For example, the minimum pitch of the silver paste lead is 200μm, and the silver paste lead can be printed at 200μm. The width of the first blank area is greater than 200μm, wherein the line width and line spacing of the silver paste lead are 100μm each. This is only an example for illustration, and the embodiments of this application do not limit this.

[0082] In some embodiments, the first blank area can be rectangular in shape. The distance between the nearest third parts on both sides of the first blank area along the first direction is used as the width of the first blank area along the first direction. The length of the first blank area is equal to the length of the third part. Specifically, if the lengths of the third parts of multiple connecting traces 102 are approximately equal, the length of the first blank area can be equal to the length of the third part. If the lengths of the third parts of multiple connecting traces 102 are not equal, the length of the first blank area can be equal to the length of the nearest third part. The phrase "the lengths of the third parts of multiple connecting traces 102 are approximately equal" means that the length of the third part does not exceed a predetermined deviation range, for example, the predetermined deviation range can be ±10% of the average length of the third part. As shown in Figure 1, a rectangular blank area between multiple sub-binding areas is a first blank area in this embodiment.

[0083] In this way, when making the connecting trace 102, the first blank area in this embodiment can be naturally formed by controlling the spacing of the third part of the connecting trace 102. In practical applications, the length, width and position of the first blank area can be adjusted by changing the lead length and lead spacing of the third part, which improves practicality.

[0084] In one specific implementation, no blank area corresponding to the first blank area is set between the multiple first electrodes, as shown in Figure 2. The multiple first electrodes can be arranged at equal intervals along the first direction. A first blank area is set between the sub-binding areas. Since there is no wiring in the first blank area, the first electrode at the corresponding position of the first blank area serves as a redundant electrode. The redundant electrode is not electrically connected to the first part of the connecting wiring 102. In this embodiment, according to the arrangement order of the multiple connecting wirings 102, the first part of each connecting wiring 102 can be electrically connected to a first electrode at the corresponding position; that is, the first part of the connecting wiring 102 is electrically connected to one of the multiple first electrodes other than the redundant electrode. This way, the manufacturing process of the first electrodes does not need to be changed, reducing the cost of the light-emitting substrate 10.

[0085] In another specific embodiment, a blank area corresponding to a first blank area is provided between multiple first electrodes. The width of the blank area along the first direction is approximately equal to the width of the first blank area, so that the first part of the connecting trace 102 is electrically connected to the first electrode at the corresponding position. Here, "the width of the blank area along the first direction is approximately equal to the width of the first blank area" means that the deviation between the width of the blank area along the first direction and the width of the first blank area does not exceed a predetermined deviation range, for example, the predetermined deviation range can be ±5% of the width of the first blank area. In practical applications, when manufacturing the first electrodes, blank areas can be naturally formed by controlling the spacing of the first electrodes. In practical applications, setting the width of the blank area to be approximately equal to the width of the first blank area can ensure the transmission quality of the driving signal and improve the display effect of the light-emitting substrate 10.

[0086] In some embodiments, the blank area between the plurality of first electrodes is correspondingly provided for the first blank area, and the orthographic projection of the blank area and the first blank area on the substrate 101 also corresponds. The projection relationship is such that the center lines of the orthographic projections of the blank area and the first blank area are approximately on the same straight line, and their widths along and along the first direction are approximately equal. In this way, the connecting trace 102 can lead the first electrode from the first surface of the substrate 101 to the second surface.

[0087] In some embodiments, a first blank area is provided between two adjacent sub-binding areas in the first binding area. The two sub-binding areas located on both sides of the first blank area and close to the first blank area are these two adjacent sub-binding areas. Each of the two adjacent sub-binding areas includes a certain number of third parts. In this embodiment, the third parts in the two adjacent sub-binding areas are parallel to each other. This is different from the binding area convergence achieved by diagonal routing in related technologies.

[0088] In some embodiments, the third portions of the first bonding region are divided into at least two sub-bonding regions, each of which is bonded to the same FPC corresponding to the first bonding region. Specifically, the third portion of each sub-bonding region within the same first bonding region is electrically connected to the corresponding first pin in the same FPC, thereby bonding the third portions of multiple sub-bonding regions to the same FPC. In this way, by electrically connecting the third portion of the connection trace 102 to the first pin of the FPC in the first bonding region, bonding between the light-emitting substrate 10 and the FPC can be achieved.

[0089] In this embodiment, the light-emitting substrate 10 includes a substrate 101 and multiple connection traces 102 arranged along a first direction. The substrate 101 includes a first surface and a second surface disposed opposite to each other, and a side surface connecting the first surface and the second surface. The first surface includes a light-emitting region and an epitaxial region, and the second surface includes at least one first bonding region. The connection traces 102 include a first portion disposed on the first surface, a second portion disposed on the side surface, and a third portion disposed on the second surface. The orthographic projection of the third portion on the substrate 101 overlaps with the first bonding region. Multiple third portions located in the same first bonding region are divided into at least two sub-bonding regions arranged along the first direction. A first blank area is provided between two adjacent sub-bonding regions. In the first direction, the width of the first blank area is greater than a first spacing, which is the spacing between two adjacent third portions located in the same sub-bonding region. Furthermore, the third portions of two sub-bonding regions located on both sides of the first blank area and close to the first blank area are parallel to each other. Multiple sub-bonding regions located in the same first bonding region are used for bonding and connecting with the same FPC. In this way, the number of FPCs bonded to the light-emitting substrate 10 can be reduced, thereby reducing costs.

[0090] Optionally, the two sub-binding areas located on either side of the first blank area include an equal number of third parts.

[0091] And / or, the widths of the two sub-binding areas located on either side of the first blank area are approximately equal along the first direction.

[0092] In some embodiments, the first binding area can be divided according to the number of third parts in the sub-binding area, or it can be divided according to the width of the sub-binding area along the first direction, so that the first blank area can be located in the middle of two adjacent sub-binding areas. Specifically, multiple third parts located in the same first binding area can be equally divided, so that the two sub-binding areas on both sides of the first blank area include the same number of third parts. Alternatively, they can be divided at equal intervals, so that the widths of the two sub-binding areas on both sides of the first blank area are equal along the first direction. The widths of the sub-binding areas can be approximately equal, specifically meaning that the width deviation between different sub-binding areas does not exceed a predetermined deviation range, for example, the predetermined deviation range can be ±5% of the average width of the sub-binding areas.

[0093] In some embodiments, the third parts in the first binding area can be arranged at equal intervals. Therefore, dividing according to the number of third parts yields the same result as dividing according to the width of the sub-binding area. That is, the number of third parts in the two sub-binding areas located on either side of the first blank area is equal, and the width of the two sub-binding areas along the first direction is also equal. As shown in Figure 1, the first binding area includes two sub-binding areas, the number of third parts in the two sub-binding areas is equal, and the width of the two sub-binding areas along the first direction is approximately equal. This is merely an example, and the embodiments of this application do not impose limitations.

[0094] Optionally, the first binding area includes two sub-binding areas, which are symmetrically arranged about the first reference line axis, and the first blank area is symmetrically arranged about the first reference line axis, and the extension direction of the first reference line is perpendicular to the first direction.

[0095] In some embodiments, multiple third parts located in the same first binding area are divided into two sub-binding areas arranged along a first direction. The number of third parts in the two sub-binding areas is exactly equal, the width of the two sub-binding areas along the first direction is exactly equal, and the third parts in the two sub-binding areas are arranged at equal intervals, so that the two sub-binding areas are symmetrical about a first reference line. The first reference line extends perpendicularly to the first direction; for example, the first reference line can be the center line of the first binding area perpendicular to the first direction. This is merely an example, and the embodiments of this application do not impose limitations.

[0096] In some embodiments, a first blank area is provided between the two sub-binding areas of the first binding area. The two sub-binding areas are located on opposite sides of the first blank area along the first direction, and the first blank area may be located in the middle of the first binding area. Since the two sub-binding areas are symmetrically arranged about the first reference line axis, the first blank area is also symmetrically arranged about the first reference line axis. The first reference line may also be the center line of the first blank area perpendicular to the first direction. Specifically, the center line of the first blank area may coincide with the center line of the first binding area, and this center line, perpendicular to the first direction, is the first reference line.

[0097] In some embodiments, the second surface includes only one first bonding region, as shown in FIG1. ​​The plurality of third portions within this first bonding region are divided into two sub-bonding regions arranged along a first direction, with a first blanking region between these two sub-bonding regions. Furthermore, both sub-bonding regions and the first blanking region are symmetrically arranged about a first reference line, which can be the centerline of the second surface of the substrate 101 perpendicular to the first direction. Thus, the light-emitting substrate 10 shown in FIG1 can be bonded to the same FPC.

[0098] Optionally, the third part extends along a third straight line, the direction of which the third straight line extends perpendicular to the first direction.

[0099] In some embodiments, due to limitations in printing processes and equipment, conductive paste can only be printed as straight leads; for example, silver paste cannot be printed as angled leads. In this embodiment, as shown in Figure 1, the third portion of the connecting trace 102 extends along a third straight line. This third straight line can be the center line of the third portion perpendicular to the first direction, meaning the extension direction of the third straight line is perpendicular to the first direction. Thus, when multiple connecting traces 102 have their third portions on the second surface arranged along the first direction and extending perpendicular to the first direction, the third portions in the first bonding area are also parallel to each other and extending perpendicular to the first direction.

[0100] Optionally, the first part extends along a first straight line, and the second part extends along a second straight line, with the extension directions of both the first and second straight lines perpendicular to the first direction.

[0101] In some embodiments, the extension direction of the connecting trace 102 can be uniform, that is, the extension directions of the first part, the second part, and the third part of the connecting trace 102 can be in the same direction, such as the extension direction being perpendicular to the first direction. In this embodiment, the first part extends along the first straight line, the second part extends along the second straight line, and the third part extends along the third straight line, and the extension directions of the first straight line, the second straight line, and the third straight line are all perpendicular to the first direction.

[0102] In some embodiments, the first straight line may be a center line perpendicular to the first direction, the second straight line may be a center line perpendicular to the first direction, and the third straight line may be a center line perpendicular to the first direction. In the orthographic projection onto the substrate 101, the orthographic projections of the first, second, and third straight lines may not coincide, or they may lie on the same straight line; this embodiment does not impose any limitations on this. In practical applications, the lead widths of the first, second, and third parts may be equal or unequal, and the lead positions may be directly opposite or staggered, as long as the first, second, and third parts are electrically connected to each other.

[0103] In related technologies, the length of a single pressure head in the bonding equipment for MLEDs is 75mm. As shown in Figure 4, if the distance between the leftmost and rightmost silver paste leads on the back side of the light-emitting substrate 10 is less than 75mm, one FPC can be used for bonding. If the distance between the leftmost and rightmost silver paste leads on the back side of the silver paste area is greater than 75mm, two FPCs are required for bonding, and two pre-pressing marks need to be set between two adjacent bonding areas, as shown in Figure 5. At the same time, the interval A between two adjacent bonding areas needs to be greater than 3.05mm, and the interval A can be calculated with reference to the following formula (1). A>b+c+2×d (1)

[0104] Where b represents the center-to-center distance between two adjacent pre-pressure marks, c represents the length of the pre-pressure mark, and d is the minimum distance between the silver paste lead and the pre-pressure mark. The field-of-view diameter φ of the bonding device's pre-pressure camera is 5mm, and the center-to-center distance b between two adjacent pre-pressure marks must be greater than 2.5mm. The minimum pre-pressure mark length c is 0.15mm, the minimum distance d between the silver line and the pre-pressure mark is 0.2mm, and the interval A is greater than 3.05mm. Because the silver paste leads are all straight-pulled, and due to the interval A requirement, the number of silver paste leads cannot meet the signal transmission requirements. If there are more than 375 silver paste leads, the bonding area length will be greater than 75mm, and the bonding area structure of a single conventional FPC cannot achieve the corresponding bonding; two or more FPCs are required. The pre-pressure camera can be a charge-coupled device (CCD) camera.

[0105] Optionally, a binding mark is provided on each of the two opposite sides of the first binding area along the first direction, and the binding mark is provided near the edge of the first binding area.

[0106] In some embodiments, the bonding mark is set on the outer edge of the first bonding area, and the sub-bonding areas within the first bonding area may not have bonding marks. Specifically, a bonding mark can be set on each of the two opposite sides of the first bonding area along a first direction. The bonding mark is used for positioning by the bonding equipment when bonding the light-emitting substrate 10 and the FPC. For example, the bonding mark can be a pre-pressure mark. Alternatively, only one bonding mark can be set on one side of the first bonding area. The bonding mark can be set near the outermost third part of the first bonding area. In practical applications, the minimum distance between the bonding mark and the third part only needs to meet the process requirements. For example, the minimum distance d between the silver paste lead and the pre-pressure mark is 0.2 mm.

[0107] In some embodiments, as shown in FIG1, the second surface includes only a first bonding area. A pre-pressure mark can be set on each of the two opposite sides of the first bonding area along the first direction, i.e., the left and right sides of the first bonding area in FIG1. ​​The pre-pressure mark is set near the outermost third part of the first bonding area. Where the connecting trace 102 is a silver paste lead, the distance between the pre-pressure mark and the third part along the first direction must be greater than or equal to 0.2mm. However, no pre-pressure mark is required in the first blank area between the two sub-bonding areas in the first bonding area of ​​FIG1.

[0108] Taking a first bonding area with a width of 150mm along the first direction as an example, two sub-bonding areas as shown in Figure 1 can be bonded to the same FPC by applying pressure with two 75mm pressure heads placed side by side. This eliminates the need to upgrade or modify existing bonding equipment, thus reducing costs.

[0109] Optionally, the width of the first blank area along the first direction is less than the target distance, where the target distance is the minimum distance between the binding marks of two adjacent first binding areas along the first direction.

[0110] In some embodiments, each of two adjacent first binding regions may be provided with a binding mark, with one mark on each of the two edges of each first binding region along the first direction. The minimum distance between the binding marks of two adjacent first binding regions along the first direction is called the target distance. For example, in the MLED field, the minimum distance between the pre-pressure marks of two binding regions is 3.05mm. In this embodiment, the target distance is 3.05mm, and the width of the first blank area along the first direction can be smaller than 3.05mm.

[0111] In some embodiments, the connection traces 102 are silver paste leads, and the minimum pitch of the silver paste leads is 200μm. In scenarios where the number of multiple connection traces 102 is greater than or equal to 375 and / or the overall width of multiple connection traces 102 along the first direction is greater than or equal to 75mm, the light-emitting substrate 10 adopts the solution of this embodiment. Furthermore, multiple sub-bonding areas located in the same first bonding area are used for bonding to the same FPC, and the gold finger area of ​​the FPC adopts a spacing structure corresponding to the first bonding area. Thus, even if the width of a single bonding area is greater than 75mm, two FPCs do not need to be bonded to each other, thereby reducing the number of FPCs and lowering costs.

[0112] In some embodiments, the minimum width of the first blank area along the first direction is limited by the minimum spacing between the two parallel pressure heads of the bonding device. For example, in the MLED field, the minimum spacing between the two parallel pressure heads is 1.5mm. Therefore, in this embodiment, the width B of the first blank area along the first direction can be greater than or equal to 1.5mm, as shown in Figure 6, and the width of the first blank area along the first direction is less than 3.05mm. The length of a single pressure head of the bonding device is 75mm, so the maximum bonding width that can be achieved by the two parallel pressure heads is 150mm. Therefore, in this embodiment, the width of the first bonding area along the first direction is less than or equal to 150mm, and this width includes the width of the first blank area along the first direction. In this way, the width of the first bonding area is not limited by the length of a single pressure head of the bonding device, and the width of the first bonding area can be increased from 75mm to 150mm, thereby improving the efficiency of the bonding process. The two sub-bonding areas shown in Figure 6 can be bonded to the same FPC without upgrading the existing bonding device, which can reduce the cost of the light-emitting substrate 10.

[0113] Figure 7 is a schematic diagram of the structure of a flexible circuit board 20 provided in an embodiment of this application. As shown in Figure 7, the flexible circuit board 20 includes:

[0114] Flexible substrate 201, and a first conductive layer 202 located on one side of flexible substrate 201;

[0115] The first conductive layer 202 includes a plurality of first pins located in the second bonding region and arranged along the second direction. The plurality of first pins are divided into at least two pin regions arranged along the second direction. A second blanking region is provided between two adjacent pin regions. In the second direction, the width of the second blanking region is greater than the second spacing. The second spacing is the spacing between two adjacent first pins located in the same pin region.

[0116] In some embodiments, the flexible circuit board 20 is used to electrically connect the driving circuit board and the light-emitting substrate, and can transmit the driving signals provided by the driving circuit board to the light-emitting substrate to drive the light-emitting substrate to display an image. The flexible circuit board 20 includes a flexible substrate 201 and a first conductive layer 202 stacked together. The flexible substrate 201 can be made of a flexible substrate, such as FR-4 (glass fiber reinforced epoxy resin), polyimide (PI), etc., and the first conductive layer 202 can be made of a conductive material, such as copper foil. This is only an example, and the embodiments of this application are not limited thereto.

[0117] In some embodiments, as shown in FIG7, a bonding area for the flexible circuit board 20 is formed on the surface of the first conductive layer 202 away from the flexible substrate 201. In this embodiment, this is referred to as the second bonding area, which is located near one edge of the flexible circuit board 20. The first conductive layer 202 includes a plurality of first pins arranged side by side at intervals along a second direction. The plurality of first pins are located in the second bonding area and are used to bond with the light-emitting substrate, such as to the first bonding area of ​​the light-emitting substrate 10 provided in this embodiment. The first pins can be gold fingers, or they can be made of other materials. This application embodiment does not limit this.

[0118] In some embodiments, the second bonding area is further divided along the second direction by dividing the first pins, and the divided first pins form different pin areas. Each second bonding area includes at least two pin areas, which are arranged along the second direction, and the arrangement direction of the pin areas is the same as that of the first pins. One or more second blank areas are provided between each pair of adjacent pin areas, and no first pins are distributed in the second blank areas. The width of the second blank area along the second direction is greater than the distance between two adjacent first pins in the two pin areas along the second direction. The widths of the different second blank areas can be the same or different, and this application embodiment does not limit this.

[0119] In some embodiments, the distance between two adjacent first pins located in the same pin area is referred to as the second pitch. If the first pins are arranged at equal intervals, the pitch between any two adjacent first pins is equal. If the first pins are not arranged at equal intervals, the width of the second blank area along the second direction is greater than the maximum pitch between two adjacent first pins. For example, the pitch corresponding to the first pin is the distance between the center lines of two adjacent first pins, and the center lines are perpendicular to the second direction.

[0120] In some embodiments, the pitch of the first pin can refer to the pitch of the silver paste leads. For example, the first pin can be fabricated to be 200μm, and the width of the second blank area is greater than 200μm. The width and spacing of the first pin are 100μm each. This is only an example and the embodiments of this application are not limited thereto.

[0121] In some embodiments, the second blank area can be rectangular. In other embodiments, the distance along the second direction between the two nearest first pins on both sides of the second blank area is used as the width of the second blank area along the second direction. The length of the second blank area is equal to the length of the first pin. If the lengths of the multiple first pins are approximately equal, the length of the second blank area can be equal to the length of the first pins. If the lengths of the multiple first pins are not equal, the length of the second blank area can be equal to the length of the closest first pin in the second blank area. As shown in Figure 7, a rectangular blank area between multiple first pins is a second blank area in this embodiment. The phrase "the lengths of the multiple first pins are approximately equal" means that the lengths of the first pins do not exceed a predetermined deviation range, for example, the predetermined deviation range can be ±10% of the average length of the first pins.

[0122] In this way, when manufacturing the first pin, the second blank area in this embodiment can be naturally formed by controlling the spacing of the first pin. In practical applications, the length, width and position of the second blank area can be adjusted by changing the length and spacing of the first pin, which improves practicality.

[0123] In this embodiment, the flexible circuit board 20 includes a flexible substrate 201 and a first conductive layer 202 located on one side of the flexible substrate 201. The first conductive layer 202 includes a plurality of first pins located in a second bonding region and arranged along a second direction. The plurality of first pins are divided into at least two pin regions arranged along the second direction, and a second blanking region is provided between two adjacent pin regions. In the second direction, the width of the second blanking region is greater than a second spacing, and the second spacing is the spacing between two adjacent first pins located in the same pin region. In this way, the flexible circuit board 20 can be bonded to multiple sub-bonding regions of the light-emitting substrate 10, which can reduce the total number of flexible circuit boards 20 bonded to the light-emitting substrate 10, thereby reducing costs.

[0124] Optionally, the two pin areas located on either side of the second blank area include the same number of first pins.

[0125] And / or, the widths of the two pin areas located on either side of the second blank area are approximately equal along the second direction.

[0126] In some embodiments, the second bonding area can be divided according to the number of first pins in the pin area, or it can be divided according to the width of the pin area along the second direction, so that the second blank area can be located in the middle of two adjacent pin areas. Specifically, multiple first pins can be equally divided, so that the two pin areas on both sides of the second blank area include the same number of first pins. Alternatively, multiple first pins can be equally spaced, so that the widths of the two pin areas on both sides of the second blank area are equal along the second direction. The widths of the pin areas can be approximately equal, specifically meaning that the width deviation between different sub-bonding areas does not exceed a predetermined deviation range, for example, the predetermined deviation range can be ±5% of the average width of the sub-bonding areas.

[0127] In some embodiments, the first pins in the second bonding area can be arranged at equal intervals. Therefore, dividing the area according to the number of first pins yields the same result as dividing it according to the width of the pin area; that is, the number of first pins in the two pin areas located on either side of the second blank area is equal, and the widths of the two pin areas along the second direction are also equal. As shown in Figure 7, the second bonding area includes two pin areas, with the number of first pins in both areas being equal, and the widths of the two pin areas along the second direction being approximately equal. This is merely an illustrative example, and the embodiments of this application do not impose limitations.

[0128] In some embodiments, the pin areas in the second bonding area of ​​the flexible circuit board 20 can be configured one-to-one with the sub-bonding areas in the first bonding area of ​​the light-emitting substrate 10 provided in this embodiment. That is, the number and width of the pin areas included in the second bonding area are equal to those of the sub-bonding areas included in the first bonding area, the first spacing and the second spacing are also equal, and the number and width of the first blank area and the second blank area are equal. In this way, multiple sub-bonding areas of the light-emitting substrate 10 provided in this embodiment located in the same first bonding area can be bonded and connected to the same flexible circuit board 20 provided in this embodiment.

[0129] Optionally, the second bonding area includes two pin areas, which are symmetrically arranged about the second reference line axis, and the second blank area is symmetrically arranged about the second reference line axis, and the extension direction of the second reference line is perpendicular to the second direction.

[0130] In some embodiments, the plurality of first pins in the second bonding region are divided into two pin regions arranged along the second direction. The number of first pins in the two pin regions is exactly equal, the width of the two pin regions along the second direction is exactly equal, and the first pins in the two pin regions are arranged at equal intervals, such that the two pin regions are symmetrical about the second reference line. The extension direction of the second reference line is perpendicular to the second direction; for example, the second reference line can be the center line of the second bonding region perpendicular to the second direction. This is merely an example, and the embodiments of this application do not impose limitations.

[0131] In some embodiments, a second blanking area is provided between the two pin areas of the second bonding area. The two pin areas are located on opposite sides of the second blanking area along the second direction. The second blanking area may be located in the middle of the second bonding area. Since the two pin areas are symmetrically arranged about the second reference line, the second blanking area is also symmetrically arranged about the second reference line. The second reference line can also be the center line of the second blanking area perpendicular to the second direction. Specifically, the center line of the second blanking area may coincide with the center line of the second bonding area, and this center line, perpendicular to the second direction, is the second reference line.

[0132] In related technologies, the length of a single pressure head in the bonding equipment for MLED is 75mm. For light-emitting substrates with a bonding area length of less than 75mm as shown in Figure 4, only one FPC can be bonded as shown in Figure 8. However, for light-emitting substrates with a bonding area length of more than 75mm as shown in Figure 5, two FPCs need to be bonded as shown in Figure 9, which increases the cost.

[0133] In some embodiments, the flexible circuit board 20 can be applied in the MLED field and can be bonded to a first bonding area of ​​the light-emitting substrate 10 provided in this embodiment. The light-emitting substrate 10 can adopt the structure shown in FIG6, while the flexible circuit board 20 can adopt the structure shown in FIG10. In this way, the two sub-bonding areas of the first bonding area in FIG6 can be bonded to the two pin areas of the second bonding area in FIG10 respectively, so that the light-emitting substrate 10 shown in FIG6 is bonded to the flexible circuit board 20 shown in FIG10, thereby reducing the number of flexible circuit boards 20 and reducing costs.

[0134] In some embodiments, the minimum width of the second blank area along the second direction is limited by the minimum spacing between the two side-by-side pressure heads of the bonding device. For example, in the MLED field, the minimum spacing between the two side-by-side pressure heads is 1.5 mm. Therefore, in this embodiment, the width C of the second blank area along the second direction can be greater than or equal to 1.5 mm, as shown in Figure 10. Furthermore, since the width of the first blank area of ​​the light-emitting substrate 10 along the first direction is less than 3.05 mm in this embodiment, the width of the second blank area of ​​the flexible circuit board 20 corresponding to the light-emitting substrate 10 along the second direction is also less than 3.05 mm.

[0135] In some embodiments, the length of a single pressure head in the MLED bonding device is 75mm, so the maximum bonding width achievable by two parallel pressure heads is 150mm. Therefore, in this embodiment, taking the flexible circuit board 20 shown in Figure 10 as an example, the width of the second bonding area along the second direction is less than or equal to 150mm, and 150mm includes the width of the second blank area along the second direction. This allows the width of the second bonding area on the flexible circuit board 20 to be increased from 75mm to 150mm. The light-emitting substrate 10 shown in Figure 6, with a first bonding area length of 150mm and only one first blank area, can be bonded to the flexible circuit board 20 shown in Figure 10. This eliminates the need to upgrade existing bonding equipment, reducing costs.

[0136] In Figure 10, another bonding area is provided on the other side edge of the flexible circuit board 20 opposite to the edge where the second bonding area is located. This bonding area can be a gold finger area. This bonding area is used to bond a driver circuit board, another flexible circuit board, or a chip on flex or chip on film (COF) package, etc.

[0137] Optionally, the flexible circuit board 20 further includes a second conductive layer 203 located on the side of the flexible substrate 201 away from the first conductive layer 202;

[0138] The second conductive layer 203 includes a plurality of second pins arranged along a second direction in the third bonding region;

[0139] The flexible circuit board 20 is divided into a first part and a second part arranged perpendicular to the second direction, and a second bonding area is disposed in the first part; wherein, the width of the first part along the second direction is greater than the width of the second part along the second direction;

[0140] The second conductive layer 203 further includes at least one pad; the pad and the third bonding region are disposed in the second portion, and the pad is located on the side of the third bonding region away from the second bonding region.

[0141] In some embodiments, as shown in FIG7, the flexible circuit board 20 can be divided into at least a first part and a second part according to its width. The arrangement direction of the first part and the second part is perpendicular to the second direction, and the width of the first part along the second direction is greater than the width of the second part along the second direction. The second bonding area of ​​the flexible circuit board 20 is located in the first part, and the second bonding area can be located near one edge of the flexible circuit board 20 in the first part, for example, near the upper edge of the first part in FIG7. In this embodiment, the second direction can be parallel to the first direction.

[0142] In some embodiments, as shown in FIG11, the flexible circuit board 20 further includes a second conductive layer 203 located on the side of the flexible substrate 201 away from the first conductive layer 202. The second conductive layer 203 may be made of a conductive material, and the second conductive layer 203 may be made of the same conductive material as the first conductive layer 202. This embodiment does not limit this. Another bonding area of ​​the flexible circuit board 20 is provided on the surface of the second conductive layer 203 on the side away from the flexible substrate 201, which is referred to as the third bonding area in this embodiment.

[0143] Figure 11 shows a cross-sectional view of a flexible circuit board 20 provided in this embodiment along the AA and BB directions. As shown in Figure 11, 1 is the first pin (gold finger) in the second bonding area. There is a second blank area in the middle of the second bonding area. The width of the second blank area is greater than the second pitch corresponding to the first pin. The second pitch can be the pitch corresponding to the arrayed gold fingers. 2 are components such as resistors and capacitors on the flexible circuit board 20. 3 is the second pin (gold finger) in the third bonding area, located in the middle of the flexible circuit board 20, which can be bonded to COF. 4 is the tear-off handle. 5 is double-sided adhesive. 6 is the pad opening area. The function of the pad is to be vertically opposite to the pad on another circuit board and connected by solder, which can conduct greater current. 7 is the cover layer.

[0144] In some embodiments, the second conductive layer 203 includes a plurality of second pins arranged side-by-side and spaced apart along a second direction. These second pins are located in a third bonding region and are used to bond a driver circuit board, another flexible circuit board, or a chip-on-film (COF) package, etc. The second pins can be gold fingers, or they can be made of other materials. Furthermore, the second pins can be made of the same conductive material as the first pins. This is merely illustrative, and the embodiments of this application do not impose limitations.

[0145] In some embodiments, the second conductive layer 203 further includes at least one pad. The pad is provided to be electrically connected to pads on another circuit board or COF via solder, allowing for the conduction of a larger current and making it suitable for a wider range of applications. The number of pads can be determined according to actual application requirements, and this application embodiment does not limit this.

[0146] In some embodiments, as shown in FIG11, the portion of the flexible circuit board 20 containing the pads and the third bonding area can be collectively referred to as the second portion, and the width of the second portion is smaller than the width of the first portion containing the second bonding area. The pads and the third bonding area are disposed in the second portion, and the pads are located on the side of the third bonding area away from the second bonding area, as shown in FIG11. The third bonding area is disposed in the middle region between the second bonding area and the pads. The third bonding area can be disposed near the upper edge of the second portion, while the pads are located at the lower edge of the second portion.

[0147] In some embodiments, as shown in FIG11, the flexible circuit board 20 can be divided into three parts arranged perpendicular to the second direction, with the second bonding area, the third bonding area, and the pads located in different parts. The second bonding area is still located in the first part, the part containing the third bonding area can be referred to as the second part, and the part containing the pads can be referred to as the third part. As shown in FIG11, the width of the first part along the second direction is greater than the width of the second part along the second direction, and the width of the first part along the second direction is greater than the width of the third part along the second direction. The widths of the second and third parts are not limited in this embodiment. In FIG11, the width of the third part containing the pads is greater than the width of the second part containing the third bonding area; the increased size of the third part is for accommodating components.

[0148] Optionally, the flexible circuit board 20 further includes a first cover layer located on the side of the second conductive layer 203 away from the flexible substrate 201;

[0149] The first cover layer includes multiple opening areas corresponding to the second pins, and the orthographic projection of the opening areas on the flexible substrate 201 overlaps with the orthographic projection of the multiple second pins on the flexible substrate 201.

[0150] The first cover layer also includes a window area corresponding to the pad, and the orthographic projection of the window area on the flexible substrate 201 overlaps with the orthographic projection of the pad on the flexible substrate 201.

[0151] In some embodiments, as shown in FIG11, the flexible circuit board 20 further includes a first cover layer located on the side of the second conductive layer 203 away from the flexible substrate 201. The first cover layer covers the surface of the second conductive layer 203 and can provide protection for the second conductive layer 203, preventing it from being subjected to mechanical damage and chemical corrosion. Furthermore, as shown in FIG11, the flexible circuit board 20 may also include a second cover layer located on the side of the first conductive layer 202 away from the flexible substrate 201. The second cover layer covers the surface of the first conductive layer 202 and can provide protection for the first conductive layer 202. The first and second cover layers can be made of insulating materials, and can be collectively referred to as cover layer (7). The first and second cover layers can be made of the same material as the flexible substrate; this embodiment does not impose any limitations on this.

[0152] In some embodiments, the first cover layer includes multiple opening areas corresponding to the second pins in the third bonding area and window areas corresponding to the pads. The multiple opening areas corresponding to the second pins on the first cover layer are provided to expose the second pins in the third bonding area so that the second pins can be bonded to other structures. Therefore, the orthographic projection of the opening areas on the flexible substrate 201 overlaps with the orthographic projection of the multiple second pins on the flexible substrate 201. The position, shape, and size of the orthographic projection of the opening areas and the orthographic projection of the third bonding area can be approximately the same, or the orthographic projection of the opening areas can be located within the orthographic projection of the third bonding area, so that at least part of the second pins in the third bonding area are exposed. This is merely an illustrative example, and the embodiments of this application do not impose limitations.

[0153] In some embodiments, the window area corresponding to the pad on the first cover layer is provided to expose the pad in the second conductive layer 203 so that the pad can be electrically connected to other structures. Therefore, the orthographic projection of the window area on the flexible substrate 201 overlaps with the orthographic projection of the pad on the flexible substrate 201. The position, shape, and size of the orthographic projection of the window area and the orthographic projection of the pad can be approximately the same, or the orthographic projection of the window area can be located within the orthographic projection of the pad, so that the pad is at least partially exposed. This is merely an example, and the embodiments of this application do not impose limitations.

[0154] Optionally, the flexible circuit board 20 also includes an adhesive area located on the side of the first cover layer away from the flexible substrate 201, the adhesive area being located in the second part of the flexible circuit board 20;

[0155] At least one window area is provided on each side of the adhesive area along the second direction, and the orthographic projection of the window area on the flexible substrate 201 does not overlap with the orthographic projection of the adhesive area on the flexible substrate 201.

[0156] In some embodiments, as shown in FIG11, the flexible circuit board 20 further includes an adhesive area located on the side of the first cover layer away from the flexible substrate 201, and double-sided adhesive (5) may be disposed in the adhesive area. The flexible circuit board 20 may also include a tear handle (4) located on the side of the double-sided adhesive away from the flexible substrate 201, and the double-sided adhesive may connect the adhesive area and the tear handle.

[0157] In some embodiments, the pads can be positioned close to the adhesive area, and the pads and adhesive area can be jointly positioned in the second part of the flexible circuit board 20 as shown in FIG. 7, or, as shown in FIG. 11, the pads and adhesive area can be jointly positioned in the third part of the flexible circuit board 20. The opening area (6) corresponding to the pads can be positioned on opposite sides of the adhesive area along the second direction, that is, at least one opening area is respectively provided on both sides of the adhesive area along the second direction. One or more opening areas can be provided on one side of the adhesive area, and this application does not limit this. In this way, the adhesive area and the tear-off handle of the flexible circuit board 20 can be retained, and a large current can be passed through the pads on both sides of the adhesive area, making the application scenarios more extensive.

[0158] As shown in Figure 11, the orthographic projection of the opening area of ​​the pad on the flexible substrate 201 does not overlap with the orthographic projection of the adhesive area on the flexible substrate 201. The shape of the opening area of ​​the pad can be a regular shape such as square or circle, or it can be an irregular shape; this embodiment does not impose any limitations on this. Figure 12 is a partially enlarged view of an opening area provided in this embodiment. As shown in Figure 12, two opening areas are provided on the left side of the adhesive area. The opening areas are square in shape, arranged vertically with a distance of 1.2 mm between them. The width of each opening area along the first direction is 2.7 mm, and its length is 1.5 mm. The distance between the lower opening area and the left and lower edges of the flexible circuit board 20 is 1 mm.

[0159] In some embodiments, resistance test electrodes and signal test electrodes (Pads) can also be disposed near the bonding area of ​​the flexible circuit board 20, as shown in Figure 13, labeled TP1-TP16. The test Pads can be circular in shape, with a diameter greater than 1 mm and a spacing greater than 1 mm. TP1 and TP2, TP3 and TP4, TP5 and TP6, TP7 and TP8, TP13 and TP14, and TP15 and TP16 can be paired to test the bonding resistance. TP9, TP10, TP11, and TP12 are signal test Pads. As shown in Figure 13, when a bonding area is disposed on the opposite edge of the edge containing the second bonding area, the test resistance Pads TP13 and TP14, and TP15 and TP16 are disposed near the bonding area on the lower edge.

[0160] Figure 14 shows a partial enlarged view of the test pads TP1, TP2 and TP12 located in the upper left corner of the flexible circuit board 20. As shown in Figure 14, the traces led out from the test pads are electrically connected to the first pin in the second bonding area.

[0161] As shown in Figure 15, when the flexible circuit board 20 includes a third bonding area, and the third bonding area is located in the middle region between the second bonding area and the pads, the test resistors TP13 and TP14, and TP15 and TP16 are positioned close to the third bonding area, allowing for resistance testing of the third bonding area. Figure 15 also shows that the total width of the flexible circuit board 20 along the second direction is 11.31±0.15mm, the distance between the third bonding area and the upper edge of the flexible circuit board 20 is 23.9mm, the distance between the third bonding area and the lower edge is 32.4mm, the width of the third bonding area along the second direction is 39.48±0.04mm, and the distance between the third bonding area and the two side edges of the flexible circuit board 20 along the second direction is 1.58±0.15mm. The length of the second pin is 2.7mm, and the second pitch, i.e., the second pin pitch, is 0.11±0.03mm.

[0162] This application also provides a display device, which includes a light-emitting substrate 10 and a flexible circuit board 20 as described in the previous embodiment. Multiple sub-binding areas located in the same first binding area are bound to multiple pin areas located in the same second binding area. The first pin in the pin area is bound to the third part in the sub-binding area. The orthographic projections of the first blank area and the second blank area on the substrate 101 at least partially overlap.

[0163] In some embodiments, the display device can be a display module, which includes the light-emitting substrate 10 and the flexible circuit board 20 provided in this embodiment. The pin area in the second bonding area of ​​the flexible circuit board 20 can be configured one-to-one with the sub-bonding area in the first bonding area of ​​the light-emitting substrate 10 provided in this embodiment. In this way, multiple sub-bonding areas located in the same first bonding area can be bonded to multiple pin areas located in the same second bonding area, so that multiple sub-bonding areas of the light-emitting substrate 10 located in the same first bonding area can be bonded to the same flexible circuit board 20 provided in this embodiment.

[0164] Specifically, the number and width of the pin areas included in the second bonding area are equal to those of the sub-bonding areas included in the first bonding area, and the first and second spacings are also equal. The first pins in the pin area are bonded to the third parts in the sub-bonding areas one by one. The number and width of the first blank area and the second blank area are equal, and the first blank area and the second blank area also correspond one-to-one. When the flexible circuit board 20 is bonded to the light-emitting substrate 10, the orthographic projections of the first blank area in the first bonding area and the second blank area in the second bonding area on the substrate 101 at least partially overlap.

[0165] For example, the display device includes a light-emitting substrate 10 as shown in FIG6 and a flexible circuit board 20 as shown in FIG10. The two sub-bonding areas of the first bonding area in FIG6 can be bonded to the two pin areas of the second bonding area in FIG10 respectively. Compared with the related art where two FPCs are bonded as shown in FIG9, the display device of this embodiment reduces the number of flexible circuit boards 20 bonded to the light-emitting substrate 10, thus reducing the cost of the display device.

[0166] This application embodiment also provides a bonding method for a light-emitting substrate 10, including:

[0167] Step S1: Provide the light-emitting substrate 10 and the flexible circuit board 20;

[0168] Step S2: A flexible circuit board 20 is bonded to the first bonding area of ​​the light-emitting substrate 10 by one or more pressure heads, so that multiple sub-bonding areas located in the same first bonding area are bonded to multiple pin areas located in the same second bonding area, the first pin in the pin area is bonded to the third part in the sub-bonding area, and the orthogonal projections of the first blank area and the second blank area on the substrate 101 at least partially overlap.

[0169] In some embodiments, when bonding the light-emitting substrate 10 and the flexible circuit board 20 provided in this embodiment using a bonding device, one first bonding area can correspond to one pressure head. One flexible circuit board 20 is bonded to the first bonding area of ​​the light-emitting substrate 10 by one pressure head, so that multiple sub-bonding areas of the same first bonding area are bonded one by one to multiple pin areas located in the same second bonding area.

[0170] Alternatively, one first binding area can correspond to multiple pressure heads, and the multiple pressure heads can be arranged side by side. By using the side-by-side pressure heads, a flexible circuit board 20 is bound to the first binding area of ​​the light-emitting substrate 10, so that multiple sub-binding areas of the same first binding area are bound one by one to multiple pin areas located in the same second binding area. This application embodiment does not limit this.

[0171] For example, in the field of MLED, when bonding the light-emitting substrate 10 of Figure 6 to the flexible circuit board 20 shown in Figure 10, the length of a single pressure head of the bonding device is 75mm, while the length of the first bonding area in Figure 6 is 150mm, and the length of the second bonding area in Figure 10 is also 150mm. Therefore, in this embodiment, two 75mm pressure heads arranged side by side can be used, and the total length of the side-by-side pressure heads reaches 150mm.

[0172] In this embodiment, binding marks are also provided on both sides of the first binding area. The binding marks can be pre-pressure marks. The pre-pressure CCD of the binding device and the two pre-pressure marks can be used to align the first binding area of ​​the light-emitting substrate 10 with the second binding area of ​​the flexible circuit board 20, so that the first pin in the pin area is bound to the third part in the sub-binding area one by one. The orthogonal projections of the first blank area and the second blank area on the substrate 101 at least partially overlap, thereby binding a flexible circuit board 20 to a first binding area of ​​the light-emitting substrate 10.

[0173] The minimum distance between the two parallel pressure heads is 1.5mm. Since the width of the first blank area in the light-emitting substrate 10 provided in this embodiment is greater than 1.5mm, the bonding of the light-emitting substrate 10 and the flexible circuit board 20 can be completed by using two parallel 75mm pressure heads, without the need to upgrade or modify the existing bonding equipment, which can reduce costs.

[0174] The terms "an embodiment," "embodiment," or "one or more embodiments" as used herein mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of this application. Furthermore, please note that the examples of the phrase "in one embodiment" do not necessarily all refer to the same embodiment.

[0175] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of this application may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0176] In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. This application can be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In a unit claim enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

[0177] As used in this application, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0178] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A light-emitting substrate, wherein, The light-emitting substrate includes: The substrate includes a first surface and a second surface disposed opposite to each other, and a side surface connecting the first surface and the second surface. The first surface includes a light-emitting region and an epitaxial region, and the second surface includes at least one first bonding region. Multiple miniature light-emitting diodes are arranged in an array and located in the light-emitting area. The miniature light-emitting diodes are electrically connected to their corresponding driving lines. A plurality of first electrodes are located in the epitaxial region, and the first electrodes are electrically connected to a driving trace extending from the light-emitting region to the epitaxial region; Multiple connection traces are arranged along a first direction. The connection traces include a first part disposed on the first surface, a second part disposed on the side surface, and a third part disposed on the second surface. The first part is electrically connected to a first electrode, and the orthographic projection of the third part on the substrate overlaps with the first bonding area. Multiple third parts located within the same first binding area are divided into at least two sub-binding areas arranged along the first direction. A first blank area is provided between two adjacent sub-binding areas. In the first direction, the width of the first blank area is greater than a first spacing, which is the spacing between two adjacent third parts located within the same sub-binding area. The third part of the two sub-binding areas located on both sides of the first blank area and close to the first blank area are parallel to each other, and the multiple sub-binding areas located in the same first binding area are used to bind and connect with the same flexible circuit board.

2. The light-emitting substrate according to claim 1, wherein, The two sub-binding areas located on either side of the first blank area include the same number of the third parts. And / or, the widths of the two sub-binding areas located on either side of the first blank area are approximately equal along the first direction.

3. The light-emitting substrate according to claim 1, wherein, The first binding area includes two sub-binding areas, which are symmetrically arranged about the first reference line axis, and the first blank area is symmetrically arranged about the first reference line axis, and the extension direction of the first reference line is perpendicular to the first direction.

4. The light-emitting substrate according to claim 1, wherein, The third part extends along a third straight line, and the direction of extension of the third straight line is perpendicular to the first direction.

5. The light-emitting substrate according to claim 1, wherein, The first part extends along a first straight line, and the second part extends along a second straight line. The extension directions of the first straight line and the second straight line are both perpendicular to the first direction.

6. The light-emitting substrate according to any one of claims 1-5, wherein, A binding mark is provided on each of the two opposite sides of the first binding area along the first direction, and the binding mark is provided close to the edge of the first binding area.

7. The light-emitting substrate according to claim 6, wherein, The width of the first blank area along the first direction is less than the target distance, which is the minimum distance between the binding marks of two adjacent first binding areas along the first direction.

8. A flexible circuit board, wherein, The flexible circuit board includes: A flexible substrate, and a first conductive layer located on one side of the flexible substrate; The first conductive layer includes a plurality of first pins located in the second bonding region and arranged along the second direction. The plurality of first pins are divided into at least two pin regions arranged along the second direction. A second blanking region is provided between two adjacent pin regions. In the second direction, the width of the second blanking region is greater than the second spacing. The second spacing is the spacing between two adjacent first pins located in the same pin region.

9. The flexible circuit board according to claim 8, wherein, The two pin areas located on either side of the second blank area include the same number of the first pins. And / or, the widths of the two pin areas located on either side of the second blank area are approximately equal along the second direction.

10. The flexible circuit board according to claim 8, wherein, The second binding area includes two pin areas, which are symmetrically arranged about the second reference line axis, and the second blank area is symmetrically arranged about the second reference line axis, and the extension direction of the second reference line is perpendicular to the second direction.

11. The flexible circuit board according to any one of claims 8-10, wherein, The flexible circuit board further includes a second conductive layer located on the side of the flexible substrate away from the first conductive layer; The second conductive layer includes a plurality of second pins arranged along the second direction in the third bonding region; The flexible circuit board is divided into a first part and a second part arranged perpendicular to the second direction, and the second bonding area is disposed in the first part; wherein, the width of the first part along the second direction is greater than the width of the second part along the second direction; The second conductive layer further includes at least one pad; the pad and the third bonding area are disposed in the second portion, and the pad is located on the side of the third bonding area away from the second bonding area.

12. The flexible circuit board according to claim 11, wherein, The flexible circuit board further includes: a first cover layer located on the side of the second conductive layer away from the flexible substrate; The first cover layer includes opening areas corresponding to the plurality of second pins, and the orthographic projection of the opening areas on the flexible substrate overlaps with the orthographic projection of the plurality of second pins on the flexible substrate. The first cover layer also includes a window area corresponding to the pad, and the projection of the window area onto the flexible substrate overlaps with the projection of the pad onto the flexible substrate.

13. The flexible circuit board according to claim 12, wherein, The flexible circuit board further includes an adhesive area located on the side of the first cover layer away from the flexible substrate, the adhesive area being located in the second portion of the flexible circuit board; At least one window area is provided on each side of the adhesive area along the second direction, and the orthographic projection of the window area on the flexible substrate does not overlap with the orthographic projection of the adhesive area on the flexible substrate.

14. A display device, wherein, The display device includes a light-emitting substrate as described in any one of claims 1-7 and a flexible circuit board as described in any one of claims 8-13, wherein a plurality of sub-bonding areas located in the same first bonding area are bonded one by one to a plurality of pin areas located in the same second bonding area, wherein a first pin in the pin area is bonded one by one to a third part in the sub-bonding area, and the orthographic projections of the first blank area and the second blank area on the substrate at least partially overlap.

15. A bonding method for a light-emitting substrate, wherein, include: Provides a light-emitting substrate as described in any one of claims 1-7 and a flexible circuit board as described in any one of claims 8-13; One flexible circuit board is bonded to the first bonding area of ​​the light-emitting substrate by one or more pressure heads, so that multiple sub-bonding areas located in the same first bonding area are bonded one by one to multiple pin areas located in the same second bonding area, and the first pin in the pin area is bonded one by one to the third part in the sub-bonding area, and the orthogonal projections of the first blank area and the second blank area on the substrate at least partially overlap.

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