Reflow soldering process inspection apparatus

Abstract

A reflow soldering process inspection apparatus, comprising: a mounting frame (1), provided with a receiving assembly (13) for receiving a circuit board, a first mounting assembly (11), and a second mounting assembly (12), wherein the receiving assembly (13) is used for receiving a circuit board, and the mounting frame (1) is adapted to a track in a reflow soldering oven so as to enable the reflow soldering process inspection apparatus to be conveyed along the track; and an inspection assembly (2), comprising an acquisition module (25) and a reflective mirror (22), wherein the acquisition module (25) is mounted on the first mounting assembly (11), the reflective mirror (22) is mounted on the second mounting assembly (12), the acquisition module (25) is used for acquiring images of the circuit board on the receiving assembly (13), and the reflective mirror (22) is used for changing the optical path along which the acquisition module (25) performs image acquisition. The inspection apparatus is capable of monitoring the connection process between solder joints and components during circuit board soldering, and identifying the causes of poor soldering by means of images.

Description

A reflow soldering process detection device Technical Field

[0001] This invention belongs to the technical field of welding inspection equipment, and particularly relates to a reflow soldering process inspection device. Background Technology

[0002] Circuit boards (PCBs), serving as carriers and connecting media for electronic components, have wide applications across various fields. Some major application areas include: consumer electronics, computers and servers, communication equipment, industrial control, automotive electronics, medical devices, aerospace, and military and defense. The crucial role of PCBs in modern technology and industry provides fundamental support and connectivity for various electronic devices, driving technological development and innovation.

[0003] Circuit boards are used to connect various components with different functions to achieve different effects. During the soldering process between the circuit board and each component, the soldering quality is one of the important factors affecting the qualification of the circuit board.

[0004] In the prior art, during the process of connecting circuit boards to components using reflow soldering technology, the circuit boards need to be transported to the reflow oven to be connected to the components at high temperatures. The connection status between the circuit boards and components can only be detected after the circuit boards are transported out of the reflow oven after the soldering is completed. However, at this time, if there are soldering defects on the circuit boards, the cause of the soldering defects cannot be directly observed from the circuit boards. Summary of the Invention

[0005] The purpose of this invention is to provide a reflow soldering process detection device, which aims to solve the problem that because the circuit board needs to be transported to the reflow soldering oven to be connected to components at a high temperature, the connection status between the circuit board and the components can only be detected after the circuit board is transported out of the reflow soldering oven after the soldering is completed. However, at this time, if there is a soldering defect on the circuit board, the cause of the soldering defect cannot be directly observed from the circuit board.

[0006] This invention is implemented as follows: a reflow soldering process detection device, the reflow soldering process detection device comprising:

[0007] The mounting frame is provided with a placement component, a first mounting component, and a second mounting component. The placement component is used to place the circuit board. The mounting frame is adapted to the track in the reflow oven so that the reflow process detection device can be transported along the track.

[0008] The detection component includes an acquisition module and a reflector. The acquisition module is mounted on a first mounting component, and the reflector is mounted on a second mounting component. The acquisition module is used to acquire images of the circuit board on the mounting component, and the reflector is used to change the optical path of the acquisition module for image acquisition.

[0009] This invention provides a reflow soldering process detection device. The device includes a mounting frame with a placement component for placing circuit boards. The mounting frame is adaptable to a track in the reflow oven, allowing the detection device to be transported along the track. The mounting frame has a first mounting component for mounting a data acquisition module and a second mounting component for mounting a reflector. During the reflow soldering process, the reflector alters the optical path of the data acquisition module to capture images of the solder joints on the circuit board, allowing monitoring of the connection process between the solder joints and components. This enables the identification of the cause of soldering defects through image analysis. Attached Figure Description

[0010] Figure 1 is a three-dimensional structural diagram of a reflow soldering process detection device provided in an embodiment of the present invention;

[0011] Figure 2 is a schematic diagram of the position and structure of the heat insulation component in a reflow soldering process detection device provided in an embodiment of the present invention;

[0012] Figure 3 is a schematic diagram of the internal structure of the detection component in a reflow soldering process detection device provided in an embodiment of the present invention;

[0013] Figure 4 is a cross-sectional view of the acquisition module in a reflow soldering process detection device provided in an embodiment of the present invention;

[0014] Figure 5 is a schematic diagram of the structure of the second mounting component and the placement component of the mounting bracket in a reflow soldering process detection device provided in an embodiment of the present invention.

[0015] Figure 6 is a schematic diagram of the structure of the first mounting component in a reflow soldering process detection device provided in an embodiment of the present invention;

[0016] Figure 7 is a schematic diagram of the positioning plate in a reflow soldering process detection device provided in an embodiment of the present invention.

[0017] In the attached diagram: 1. Mounting bracket; 11. First mounting component; 111. Mounting support; 1111. Second mounting slot; 112. Support plate; 12. Second mounting component; 121. Connecting bracket; 122. Connecting rod; 13. Placement component; 131. Positioning plate; 1311. First step; 1312. Second step; 1313. Third mounting slot; 1314. Mounting hole; 14. First guide rail; 15. Second guide rail; 16. First mounting slot; 2. Detection component; 21. Mounting shell; 22. Reflector; 221. Adjustment component; 23. Antenna; 24. Thermal insulation component; 25. Acquisition module; 26. Illumination lamp. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0019] The specific implementation of the present invention will be described in detail below with reference to specific embodiments.

[0020] Figures 1-2 show a structural diagram of a reflow soldering process detection device provided in an embodiment of the present invention, including: a mounting frame 1, wherein the mounting frame 1 is provided with a placement component 13, a first mounting component 11 and a second mounting component 12, the placement component 13 is used to place a circuit board, and the mounting frame 1 is adapted to the track in the reflow soldering oven so that the reflow soldering process detection device can be transported along the track.

[0021] The detection component 2 includes an acquisition module 25 and a reflector 22. The acquisition module 25 is mounted on a first mounting component 11, and the reflector 22 is mounted on a second mounting component 12. The acquisition module 25 is used to acquire images of the circuit board on the placement component 13, and the reflector 22 is used to change the optical path of the acquisition module 25 for image acquisition.

[0022] In this embodiment of the invention, preferably, the reflow soldering process detection device is applicable to the process of connecting circuit boards and components via reflow soldering. It acquires images of the solder joints between the circuit board and components, and performs non-contact detection while the solder joints are molten. The circuit board melts the solder at the solder joints in the reflow oven, and the detection component 2 magnifies and acquires images of the solder joints to monitor the connection status during the soldering process. This allows for the determination of the cause of soldering defects based on the acquired images. For example, if a cold solder joint appears on the circuit board, the acquired images can be used to analyze whether the cold solder joint is due to improper cleaning of the circuit board or the component leads. The reflow soldering process detection device mainly consists of a mounting bracket 1 and a detection component 2. The detection component 2 includes... The acquisition module 25 and the reflector 22 are mounted on the first mounting component 11 of the mounting frame 1, and the reflector 22 is mounted on the second mounting component 12. The placement component 13 mounted on the mounting frame 1 is used to place the circuit board and is located directly below the reflector 22. The reflector 22 is used to change the optical path of the acquisition module 25 for image acquisition, so that the acquisition module 25 can acquire the circuit board on the placement component 13. The mounting frame 1 is adapted to the track in the reflow oven so that the circuit board and the detection component 2 can be transported to the reflow oven and connected to the components via the track in the reflow oven. At the same time, the detection component 2 acquires the image on the solder joint of the circuit board. If the circuit board has poor soldering during the soldering process, the cause of the poor soldering can be found through the acquired image.

[0023] In one embodiment of the present invention, a mounting frame 1 is provided, and a placement component 13 for placing circuit boards is provided on the mounting frame 1. The mounting frame 1 can be adapted to the track in the reflow oven so that the reflow soldering process detection device can be transported along the track. A first mounting component 11 for mounting the acquisition module 25 and a second mounting component 12 for mounting the reflector 22 are provided on the mounting frame 1. During the process of connecting the circuit board to components using reflow soldering technology, the reflector 22 is used to change the optical path of the acquisition module 25 to acquire images, so that the images of the circuit board solder joints on the placement component 13 of the acquisition module 25 are displayed. The connection process between the solder joints and components during the circuit board soldering process can be monitored, thereby finding the cause of soldering defects through the images.

[0024] As shown in Figures 1-4, in a preferred embodiment of the present invention, the detection component 2 further includes a mounting shell 21, a heat insulation component 24, and a lighting lamp 26. The mounting shell 21 is used for mounting the acquisition module 25, the heat insulation component 24, and the lighting lamp 26. The mounting shell 21 is slidably connected to the first mounting component 11. One side of the mounting shell 21 is provided with a first positioning hole and a second positioning hole. The first positioning hole is used to position the acquisition module 25, and the second positioning hole is used to position the lighting lamp 26. The other side of the mounting shell 21 is used to mount an antenna 23, which is connected to the acquisition module 25.

[0025] In this embodiment of the invention, preferably, the detection component 2 may further include a mounting shell 21, a heat insulation component 24, and a lighting lamp 26. The square mounting shell 21 with a certain internal cavity can be used to mount the acquisition module 25, the heat insulation component 24, and the lighting lamp 26. The mounting shell 21 is slidably connected to the first mounting component 11 on the mounting bracket 1 so that the acquisition module 25 can be moved to the position where the desired image is to be acquired. The side of the mounting shell 21 with the first positioning hole and the second positioning hole faces the circuit board on the placement component 13 so that the acquisition module 25 can obtain a bright acquisition environment provided by the lighting lamp 26, making the circuit board image acquired by the acquisition module 25 clear and easy to judge. The soldering condition of the circuit board is checked. On the opposite side, an antenna 23 is installed. The antenna 23 is connected to the acquisition module 25 so that the antenna 23 can transmit the image information acquired by the acquisition module 25 to an external device. When the acquisition module 25 has a certain storage function module, the acquired image information can be transmitted to the external device through the external interface connected to the antenna 23. When the acquisition module 25 does not have a storage function module, the image information acquired by the acquisition module 25 can be transmitted to the external device in real time through the antenna 23 via wired or wireless connection so that the staff can check and judge the soldering condition of the circuit board components.

[0026] As shown in Figures 1-4, in a preferred embodiment of the present invention, the heat insulation component 24 is installed in the internal cavity of the mounting housing 21. The heat insulation component 24 is used to isolate the heat in the reflow oven and protect the acquisition module 25 and the lighting lamp 26. The lighting lamp 26 is directed toward the circuit board and the reflector 22 so that the reflector 22 reflects the light emitted by the lighting lamp 26 onto the solder joints of the components on the circuit board, which facilitates the acquisition module 25 to detect the circuit board.

[0027] In this embodiment of the invention, preferably, the heat insulation component 24 installed inside the mounting shell 21 can be provided with internal and external support and heat-insulating material so as to protect the detection component 2 so that it can continue to detect during the melting of the circuit board solder and avoid damage to the detection component 2 due to high temperature, which would affect the detection effect. The lighting lamp 26 installed on the third positioning hole of the mounting shell 21 can be used to illuminate the detection process, so that the solder joint detected by the acquisition module 25 can be clearer and avoid the detection effect being affected by insufficient light.

[0028] As shown in Figures 1-5, in a preferred embodiment of the present invention, the mounting frame 1 is a rectangular frame. A set of parallel guide rails are provided on the two opposite inner walls of the mounting frame 1. The set of guide rails are a first guide rail 14 and a second guide rail 15. The first guide rail 14 is used for mounting the first mounting component 11 and the second mounting component 12, and the second guide rail 15 is used for mounting the component 13. A first mounting groove 16 is provided on the two opposite outer walls of the mounting frame 1. The first mounting groove 16 is used to connect with the track in the reflow oven.

[0029] In this embodiment of the invention, preferably, the mounting bracket 1 body can be an annular rectangular frame with a certain thickness. A first guide rail 14 and a second guide rail 15 are arranged on two opposite inner wall surfaces of the mounting bracket 1 body, and the length direction of the guide rail is the same as the length direction of the side of the mounting bracket 1 body. Utilizing the positional relationship between the first guide rail 14 and the second guide rail 15, the circuit board mounted on the second guide rail 15 is located below the reflector 22 and the acquisition module 25. The first mounting component 11 and the second mounting component 12 mounted on the first guide rail 14 can divide the large rectangle inside the mounting bracket 1 body into two parallel small rectangles. A first mounting groove 16 for connecting to the track in the reflow oven can be provided on the outer side of the mounting bracket 1 body, so that when the circuit board is connected to the component in the reflow oven, the acquisition module 25 on the mounting bracket 1 can acquire the image of the circuit board on the placement component 13.

[0030] As shown in Figure 6, in a preferred embodiment of the present invention, the first mounting assembly 11 includes a mounting bracket 111 and a support plate 112. The mounting bracket 111 has a second mounting groove 1111 on its side. The second mounting groove 1111 is adapted to the first guide rail 14 to facilitate mounting the second mounting frame 1 on the first mounting frame 1. The inner wall of the mounting bracket 111 has a set of third mounting grooves 1313. The third mounting grooves 1313 are used to slide with the support plate 112. The support plate 112 is used to support the acquisition module 25. The length direction of the third mounting grooves 1313 is perpendicular to the length direction of the first guide rail 14.

[0031] In this embodiment of the invention, preferably, the first mounting component 11 consists of a mounting bracket 111 and a support plate 112. The mounting bracket 111 can be a rectangular frame whose length and width are both smaller than the body of the mounting bracket 1, or it can be a group of parallel strip-shaped brackets whose length is smaller than the length of the first guide rail 14. The side of the mounting bracket 111 connected to the first guide rail 14 is provided with a second mounting groove 1111 so that the first guide rail 14 can be embedded in the second mounting groove 1111. The support plate 112 can be a rectangular plate movably mounted on the rectangular frame, or it can be an I-shaped plate mounted at both ends of the parallel strip-shaped brackets and whose middle part can move. The upper surface of the support plate 112 is used for mounting the mounting shell 21. The moving direction of the support plate 112 is the moving direction of the mounting shell 21 and the acquisition module 25 so that the acquisition module 25 installed inside the mounting shell 21 can acquire an image of the circuit board on the complete placement component 13.

[0032] As shown in Figures 1-5, in a preferred embodiment of the present invention, the second mounting assembly 12 includes a connecting bracket 121 and a connecting rod 122. The connecting bracket 121 is provided with a set of two inner wall surfaces opposite to the mounting frame 1 and is slidably connected to them. The connecting bracket 121 is used to mount the connecting rod 122 so as to drive the connecting rod 122 and the reflector 22 to move. The connecting rod 122 and the reflector 22 are slidably connected so as to allow the reflector 22 to move along the length direction of the connecting rod 122. The length direction of the connecting rod 122 and the moving direction of the connecting bracket 121 are perpendicular to each other.

[0033] In a preferred embodiment of the invention, the second mounting assembly 12 consists of a connecting bracket 121 and a connecting rod 122. The connecting bracket 121 is provided with a set of first guide rails 14 respectively mounted on the inner wall of the mounting frame 1 body. The connecting rod 122 is connected to two opposite surfaces of the two connecting brackets 121. The connecting rod 122 is slidably connected to the reflector 22, so that the reflector 22 can move along the length direction of the connecting rod 122 and is parallel to the movement direction of the acquisition module 25 on the support plate 112. The connecting bracket 121 can move along the length direction of the first guide rail 14, so that the reflector 22 can move horizontally along two mutually perpendicular straight lines so that the acquisition module 25 can acquire the image of the circuit board on the assembly 13 placed directly below the reflector 22.

[0034] As shown in Figure 5, in a preferred embodiment of the present invention, the reflector 22 is provided with a back shell connected to the connecting rod 122. The two opposite sides of the back shell are used to install the connecting rod 122, and the back shell is rotatably connected to the connecting rod 122.

[0035] In this embodiment of the invention, preferably, the back shell of the reflector 22 can be a platform-shaped shell, and the mirror surface of the reflector 22 is installed at the rectangular opening of the platform-shaped shell. Through holes are provided on its two opposite sides so that the connecting rod 122 can pass through. The connecting rod 122 and the back shell can be rotatably connected so as to adjust the angle between the mirror surface of the reflector 22 and the circuit board on the placement assembly 13 so as to allow the acquisition module 25 to acquire the image of the circuit board.

[0036] As shown in Figure 5, in a preferred embodiment of the present invention, the reflector 22 is further provided with an adjustment member 221. The adjustment member 221 is used to adjust the angle between the mirror surface of the reflector 22 and the circuit board to adjust the detection angle of the acquisition module 25. The adjustment member 221 is installed on the back of the back cover to facilitate the adjustment of the angle between the mirror surface of the reflector 22 and the circuit board.

[0037] In a preferred embodiment of the invention, the reflector 22 may also be provided with an adjustment member 221 mounted on the back cover. The angle between the reflector 22 mirror and the circuit board is adjusted by adjusting the angle of rotation between the back cover and the connecting rod 122 using the adjustment member 221. The adjustment member 221 can be inserted into the back of the back cover. The adjustment member 221 can achieve the adjustment function by changing the connection position with the connecting rod 122 so that the back cover can rotate.

[0038] As shown in Figure 5, in a preferred embodiment of the present invention, the placement component 13 is mounted on the mounting bracket 111. The placement component 13 includes a set of positioning plates 131. The set of positioning plates 131 are slidably connected to the mounting bracket 111 to adjust the spacing between the set of positioning plates 131 so as to position circuit boards of different specifications. The set of positioning plates 131 are parallel to each other.

[0039] In this embodiment of the invention, preferably, the placement component 13 for placing the circuit board consists of a set of positioning plates 131. The set of positioning plates 131 are parallel to each other and are slidably connected to the second guide rail 15 of the mounting bracket 1 body, so that the spacing between the set of positioning plates 131 can be adjusted to facilitate the positioning of circuit boards of different sizes.

[0040] As shown in Figure 7, in a preferred embodiment of the present invention, the positioning plate 131 is stepped, and the positioning plate 131 has first mounting grooves 16 at both ends. The first mounting grooves 16 are slidably connected to the inner wall of the mounting bracket 1. The first step 1311 of the positioning plate 131 is used to place the circuit board, and the second step 1312 of the positioning plate 131 is provided with mounting holes 1314. The mounting holes 1314 are connected to the mounting bracket 111 through mounting parts.

[0041] In this embodiment of the invention, preferably, the positioning plate 131 can be a two-step plate with a certain length and thickness. The positioning plate 131 is provided with two steps. The first step 1311 is used to place the circuit board and position one side of the circuit board. The two positioning plates 131 simultaneously position the two sides of the circuit board. The two sides of the positioning plate 131 are respectively connected to the second guide rail 15 of the mounting frame 1 body. The second step 1312 can also be connected to the mounting frame 1 body through the mounting component so that the sliding positioning plate 131 can be adjusted to a distance that matches the circuit board, and then the position of the positioning plate 131 can be fixed by the mounting component.

[0042] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A reflow soldering process detection device, characterized in that, The reflow soldering process detection device includes: The mounting frame is provided with a placement component, a first mounting component, and a second mounting component. The placement component is used to place the circuit board. The mounting frame is adapted to the track in the reflow oven so that the reflow process detection device can be transported along the track. The detection component includes an acquisition module and a reflector. The acquisition module is mounted on a first mounting component, and the reflector is mounted on a second mounting component. The acquisition module is used to acquire images of the circuit board on the mounting component, and the reflector is used to change the optical path of the acquisition module for image acquisition.

2. The reflow soldering process detection device according to claim 1, characterized in that, The detection assembly also includes a mounting shell, a heat insulation component, and a lighting lamp. The mounting shell is used to install the acquisition module, the heat insulation component, and the lighting lamp. The mounting shell is slidably connected to the first mounting component. One side of the mounting shell is provided with a first positioning hole and a second positioning hole. The first positioning hole is used to position the acquisition module, and the second positioning hole is used to position the lighting lamp. The other side of the mounting shell is used to install an antenna, which is connected to the acquisition module.

3. The reflow soldering process detection device according to claim 2, characterized in that, The heat insulation component is installed inside the mounting housing. The heat insulation component is used to isolate the heat in the reflow oven and protect the acquisition module and the lighting lamp. The lighting lamp is directed towards the circuit board and the reflector so that the reflector reflects the light emitted by the lighting lamp onto the solder joints of the components on the circuit board, which facilitates the acquisition module to detect the circuit board.

4. The reflow soldering process detection device according to claim 1, characterized in that, The mounting frame is a rectangular frame. A set of parallel guide rails are provided on the two opposite inner walls of the mounting frame. The set of guide rails are a first guide rail and a second guide rail. The first guide rail is used for the installation of the first mounting component and the second mounting component. The second guide rail is used for the installation of the component. A first mounting groove is provided on the two opposite outer walls of the mounting frame. The first mounting groove is used to connect with the track in the reflow oven.

5. The reflow soldering process detection device according to claim 4, characterized in that, The first mounting component includes a mounting bracket and a support plate. The mounting bracket has a second mounting groove on its side, which is adapted to the first guide rail to facilitate mounting the second mounting frame on the first mounting bracket. The inner wall of the mounting bracket has a set of third mounting grooves, which are used to slide with the support plate. The support plate is used to support the acquisition module. The length direction of the third mounting groove is perpendicular to the length direction of the first guide rail.

6. The reflow soldering process detection device according to claim 1, characterized in that, The second mounting assembly includes a connecting bracket and a connecting rod. The connecting bracket is provided in a set and is slidably connected to two inner wall surfaces opposite to the mounting frame. The connecting bracket is used to mount the connecting rod so as to drive the connecting rod and the reflector to move. The connecting rod and the reflector are slidably connected so as to allow the reflector to move along the length direction of the connecting rod. The length direction of the connecting rod and the moving direction of the connecting bracket are perpendicular to each other.

7. The mounting device for the reflow soldering process detection apparatus according to claim 6, characterized in that, The reflector is provided with a back shell that is connected to the connecting rod. The two opposite sides of the back shell are used to install the connecting rod, and the back shell is rotatably connected to the connecting rod.

8. The mounting device for the reflow soldering process detection device according to claim 7, characterized in that, The reflector is also equipped with an adjustment component, which is used to adjust the angle between the reflector surface and the circuit board to adjust the detection angle of the acquisition module. The adjustment component is installed on the back of the back cover to facilitate the adjustment of the angle between the reflector surface and the circuit board.

9. The reflow soldering process detection device according to claim 1, characterized in that, The placement component is mounted on the mounting bracket. The placement component includes a set of positioning plates. The set of positioning plates are slidably connected to the mounting bracket to adjust the spacing between the positioning plates so as to position circuit boards of different specifications. The set of positioning plates are parallel to each other.

10. The reflow soldering process detection device according to claim 9, characterized in that, The positioning plate is stepped, and first mounting grooves are provided at both ends of the positioning plate. The first mounting grooves are slidably connected to the inner wall of the mounting frame. The first step of the positioning plate is used to place the circuit board, and the second step of the positioning plate is provided with mounting holes. The mounting holes are connected to the mounting bracket through mounting parts. Type claim 1 here. 11.

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