Server device

Abstract

Provided in the embodiments of the present disclosure is a server device. The server device comprises a chassis, a hard disk backplane, a heat dissipation assembly, a plurality of partition plates, and a plurality of groups of hard disks. The hard disk backplane is disposed in the chassis at the bottom of the chassis. The hard disk backplane is coupled to the chassis, and the hard disk backplane comprises a plurality of data interfaces. The plurality of partition plates are disposed in the chassis and spaced apart from each other, and installation regions for insertion of hard disks are defined between adjacent partition plates of the plurality of partition plates. The plurality of groups of hard disks are respectively disposed in corresponding installation regions between the plurality of partition plates, and are respectively detachably coupled to corresponding data interfaces. The heat dissipation assembly is disposed on one side of the plurality of partition plates. The heat dissipation assembly is coupled to the chassis and can exchange heat with the plurality of groups of hard disks.

Description

server equipment

[0001] This application claims priority to Chinese Patent Application No. 202510361996.7, filed on March 25, 2025, entitled "Server Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] The embodiments disclosed herein generally relate to the field of computer system architecture, and more particularly to a server device. Background Technology

[0003] Hard drive servers are widely used in data centers, cloud computing platforms, and video surveillance systems. They can store massive amounts of information, ensuring high availability and fast access. However, hard drives generate heat during operation, and poor heat dissipation can lead to excessively high temperatures, directly impacting hard drive performance and shortening their lifespan. In some conventional hard drive servers, the hard drive frame can be used as a cooling plate water channel, combined with the guide rails on both sides of the hard drive bracket to form a cooling system. The cooling plate system consists of two parts, one vertically and one horizontally, with multiple assembly and connection points increasing the risk of liquid leakage. Secondly, because the cooling plate also functions as the hard drive mounting path, its structure becomes more complex, increasing manufacturing difficulty and cost. Furthermore, thicker partitions reduce the density of hard drive deployment, affecting the server's space utilization. Summary of the Invention

[0004] This disclosure provides a server device. The server device includes: a chassis; a hard disk backplane disposed at the bottom of the chassis and coupled to the chassis, and the hard disk backplane includes a plurality of data interfaces; a plurality of partitions disposed within the chassis and spaced apart from each other, and adjacent partitions defining installation areas for hard disk insertion; a plurality of hard disks, each of which is disposed in a corresponding installation area between the partitions and detachably coupled to a corresponding data interface; and a heat dissipation assembly disposed on one side of the partitions and coupled to the chassis for heat exchange with the plurality of hard disks.

[0005] It should be understood that the content described in this section is not intended to limit the key or essential features of the embodiments of this disclosure, nor is it intended to restrict the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0006] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. In the drawings, the same or similar reference numerals denote the same or similar elements, wherein:

[0007] Figure 1 shows a perspective view of a server device according to an embodiment of the present disclosure, wherein the top casing of the chassis is not shown;

[0008] Figure 2 shows a top view of a server device according to an embodiment of the present disclosure;

[0009] Figure 3 shows a cross-sectional view at point AA in Figure 2;

[0010] Figure 4 shows a perspective view of the cold plate and hard disk backplane according to an embodiment of the present disclosure;

[0011] Figure 5 shows a cross-sectional view of a hard disk according to an embodiment of the present disclosure;

[0012] Figure 6 shows a perspective view of the hard disk according to an embodiment of the present disclosure; and

[0013] Figure 7 shows a perspective view of the partition according to an embodiment of the present disclosure.

[0014] Explanation of reference numerals in the attached diagram: 10, Chassis; 20, Hard drive backplate; 21, Data interface; 30, Partition; 303, Mounting area; 31, Limiting hole; 32, Ventilation hole; 40, Hard drive; 41, Hard drive body; 42, Hot-swappable assembly; 421, Connector; 4211, First end; 4212, Second end; 422, Button; 423, Elastic element; 43, Heat sink; 431, Base plate; 432, Side plate; 433, First thermal pad; 434, Second thermal pad; 500, Heat dissipation assembly; 50, Cold plate; 51, Through hole; 52, Water inlet; 53, Water outlet. Detailed Implementation

[0015] Embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.

[0016] The term "comprising" and its variations as used herein signify open inclusion, i.e., "including but not limited to". Unless otherwise stated, the term "or" means "and / or". The term "based on" means "at least partially based on". The terms "one example embodiment" and "one embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one additional embodiment". The terms "first", "second", etc., may refer to different or the same objects.

[0017] As mentioned above, in some conventional hard drive servers, the hard drive frame can be used as the cooling plate water channel, combined with the guide rails on both sides of the hard drive bracket to form a heat dissipation system. The cooling plate system consists of two parts, one vertically arranged and one horizontally arranged, and the multiple assembly and connection points increase the risk of liquid leakage. Secondly, since the cold plate also functions as the hard drive slide, its structure becomes more complex, increasing the manufacturing difficulty and cost. In addition, the thicker partition reduces the density of hard drive deployment, affecting the server's space utilization.

[0018] This disclosure provides an embodiment of a server device. The server device includes a chassis, a hard drive backplane, a heat dissipation assembly, multiple partitions, and multiple hard drives. The hard drive backplane is disposed at the bottom of the chassis. The hard drive backplane is coupled to the chassis and includes multiple data interfaces. Multiple partitions are disposed within the chassis and spaced apart from each other, with adjacent partitions defining mounting areas for hard drive insertion. Multiple hard drives are respectively disposed within corresponding mounting areas between the partitions and are detachably coupled to corresponding data interfaces. A heat dissipation assembly is disposed on one side of the partitions. The heat dissipation assembly is coupled to the chassis and can exchange heat with the multiple hard drives. With this arrangement, multiple partitions can secure multiple hard drives within the chassis without occupying excessive space, thus improving hard drive density. Furthermore, the heat dissipation assembly's location on one side of the chassis simplifies its structure, reduces assembly connection points, and thereby reduces the risk of liquid leakage and manufacturing difficulty. The principles of this disclosure will now be described in detail with reference to Figures 1 to 7.

[0019] As shown in Figures 1 to 3, the server equipment includes a chassis 10, a hard disk backplane 20, a heat dissipation assembly 500, multiple partitions 30, and multiple hard disks 40.

[0020] The chassis 10 serves as the frame structure of the server equipment, and its interior forms a receiving cavity. Various electronic components can be placed inside the receiving cavity, and multiple support structures and electronic components can be fixed therein.

[0021] As shown in Figure 3, the hard drive backplane 20 is disposed inside the chassis 10 and located at the bottom of the chassis 10. The hard drive backplane 20 is coupled to the chassis 10. Multiple data interfaces 21 are provided on the top surface of the hard drive backplane 20. Each data interface 21 can be detachably connected to one hard drive 40, allowing the hard drive backplane 20 to be connected to multiple hard drives 40 simultaneously. It should be understood that the type of data interface 21 (e.g., SATA, SAS, NVMe, etc.) can be determined based on specific application scenarios, performance requirements, budget constraints, and compatibility with other hardware components. In this way, users can choose the type of data interface 21 most suitable for their needs, thereby improving the applicability of the server equipment.

[0022] As shown in Figures 1 and 2, multiple partitions 30 are spaced apart from each other and disposed within the chassis 10. Adjacent partitions 30 define mounting areas 303 for inserting hard drives 40. For example, nine mounting areas 303 can be defined between ten partitions 30. Here, these partitions 30 serve to support the hard drives 40. In some embodiments, these partitions 30 can be made of sheet metal or rigid plastic, ensuring structural strength while reducing weight. The spacing between adjacent partitions 30 is adapted to the size of the hard drives 40, allowing the hard drives 40 to be inserted between adjacent partitions 30. Furthermore, no water channel system is required within the partitions 30, and the thickness of the partitions 30 is less than the thickness of the cold plate 50, reducing the space occupied by the partitions 30 within the chassis 10, thereby increasing the number and density of hard drives 40.

[0023] In some embodiments, the partition 30 is provided with a special limiting structure, each limiting structure corresponding to a hard disk 40, so that the connection between the hard disk 40 and the partition 30 is both stable and easy to disassemble.

[0024] As shown in Figure 2, multiple sets of hard disks 40 are respectively placed in the corresponding installation areas 303 between the partitions 30, and each hard disk 40 can be independently connected to the corresponding data interface 21.

[0025] In some embodiments, each group of hard disks 40 may include multiple hard disks 40. In other embodiments, each group of hard disks 40 may be a single hard disk 40, located between two adjacent partitions 30. In this way, users can adjust the configuration of the hard disks 40 according to their actual needs, thereby obtaining higher storage capacity and stronger data processing capabilities.

[0026] As shown in Figure 1, the heat dissipation component 500 is disposed on one side of multiple partitions 30, for example, at the bottom or one end of the chassis 10. The heat dissipation component 500 can exchange heat with multiple hard drives 40, thereby maintaining the normal operating temperature of the system. The heat dissipation component 500 can be a liquid cooling system or an air cooling system, depending on the requirements of the application environment.

[0027] Using this arrangement, multiple partitions 30 within the chassis 10 can hold multiple hard drives 40 while minimizing the space occupied by the partitions 30, thereby increasing the number and density of hard drives 40. Furthermore, the heat dissipation assembly 500 is located on one side of the chassis 10, reducing assembly connection points, lowering the risk of liquid leakage, and reducing manufacturing complexity.

[0028] In some embodiments, as shown in Figures 3 and 4, the heat dissipation assembly 500 includes a cold plate 50. The cold plate 50 is disposed on the side of the hard drive backplane 20 facing the plurality of partitions 30 and coupled to the plurality of partitions 30. The cold plate 50 includes a plurality of through holes 51 penetrating its top and bottom surfaces. The plurality of through holes 51 correspond to a plurality of data interfaces 21, allowing the plurality of data interfaces 21 to pass through the plurality of through holes 51 respectively. In this way, the cold plate 50 is disposed between the hard drive backplane 20 and the plurality of hard drives 40, and the cold plate 50 is in direct contact with the hard drive backplane 20 and the plurality of hard drives 40, allowing the cold plate 50 to dissipate the heat generated by the hard drives 40 and the hard drive backplane 20 during operation. In addition, the cold plate 50 being disposed on one side of the plurality of hard drives 40 reduces the number of connection points between the water cooling system, thereby reducing the risk of liquid leakage.

[0029] In some embodiments, as shown in Figures 5 and 6, each hard disk 40 includes a hard disk body 41 and a heat sink 43. The heat sink 43 is coupled to the hard disk body 41 and connected to a cold plate 50. Compared to traditional air cooling methods, the heat sink 43 can quickly conduct the heat generated by the hard disk body 41 during operation to the cold plate 50, thereby improving heat transfer efficiency. In this way, the speed at which heat is transferred from the hard disk body 41 to the cold plate 50 can be accelerated, which helps maintain the hard disk 40 operating at a suitable operating temperature, thereby potentially improving the operating efficiency and stability of the hard disk 40.

[0030] In some embodiments, as shown in Figures 3 and 5, the heat sink 43 includes a base plate 431 and a side plate 432. The base plate 431 is disposed on the side of the hard drive body 41 facing the cold plate 50 and directly abuts against the hard drive body 41 and the cold plate 50. An efficient heat conduction path can be formed between the hard drive body 41, the base plate 431, and the cold plate 50. In this way, the heat generated by the hard drive body 41 can be directly transferred to the cold plate 50, thereby improving the speed and efficiency of heat transfer. In addition, the side plate 432 is mounted on the side of the hard drive body 41 and coupled to the base plate 431. The side plate 432 can absorb heat from the side of the hard drive body 41, then conduct this heat to the base plate 431, and finally transfer this heat to the cold plate 50.

[0031] In some embodiments, as shown in Figures 3 and 5, the heat sink 43 may include only one side plate 432. This side plate 432 is located on one side of the hard drive body 41, increasing the heat exchange area of ​​the hard drive body 41. In other embodiments, the heat sink 43 may include multiple side plates 432. These multiple side plates 432 are respectively arranged on multiple sides of the hard drive body 41. For example, the heat sink 43 may include four side plates 432. The four side plates 432 may be respectively disposed on the four sides of the hard drive body 41, absorbing heat from the hard drive body 41 from various directions, thereby increasing the heat exchange efficiency of the heat sink 43.

[0032] In some embodiments, as shown in Figures 3 and 5, the side plate 432 is a structure formed by bending from the edge of the base plate 431. In this way, the monolithic structure reduces the contact gap between the side plate 432 and the base plate 431, thereby improving heat transfer efficiency. Specifically, since there are no additional connection points or seams between the base plate 431 and the side plate 432, the heat conduction path is continuous, and the heat generated by the hard drive body 41 can be quickly transferred to the cold plate 50 through the base plate 431 and the side plate 432, thus improving overall heat dissipation efficiency. Furthermore, the monolithic structure reduces potential failure points, such as loose connections or material aging problems that may occur during long-term use, ensuring stable heat dissipation performance.

[0033] In other embodiments, the side plate 432 and the base plate 431 can be independent components. The side plate 432 and the base plate 431 can be detachably connected together, for example, by means of threaded connection or riveting. In some embodiments, when high thermal conductivity is required, base plates 431 and side plates 432 made of different materials can also be combined.

[0034] In some embodiments, as shown in FIG5, each hard drive 40 further includes a first thermal pad 433. The first thermal pad 433 is disposed between the side plate 432 and the hard drive body 41, and abuts against the side plate 432 and the hard drive body 41. The first thermal pad 433 can transfer the heat generated by the hard drive body 41 during operation to the side plate 432. In this way, the heat generated by the hard drive body 41 during operation can be conducted to the side plate 432 via the first thermal pad 433, and then further transferred to the base plate 431 and the cold plate 50, thereby achieving efficient heat dissipation.

[0035] In some embodiments, the first thermal pad 433 can be a flexible thermal pad. A flexible thermal pad not only has good thermal conductivity but can also adapt to irregular surfaces, reducing contact thermal resistance and thus improving overall heat dissipation efficiency. Even when there are dimensional differences or unevenness between the hard drive body 41 and the side plate 432, the first thermal pad 433 can still ensure efficient heat transfer.

[0036] In some embodiments, as shown in FIG3, the server device further includes a plurality of second thermal pads 434. The plurality of second thermal pads 434 are respectively disposed between the heat sinks 43 and the cold plates 50 of the plurality of hard drives 40. In this way, the second thermal pads 434 can fill the gaps between the heat sinks 43 and the cold plates 50, reducing contact thermal resistance and allowing heat to be conducted from the heat sinks 43 to the cold plates 50. In some embodiments, the second thermal pads 434 can also be flexible thermal pads. The second thermal pads 434 have good thermal conductivity and can adapt to irregular surfaces. Even with slight misalignment between components, efficient heat transfer can still be achieved, maintaining the hard drives 40 within a suitable operating temperature range, thereby improving the overall stability and reliability of the system.

[0037] In some embodiments, as shown in FIG4, the cold plate 50 includes an inlet 52, an outlet, and a flow channel. The flow channel is disposed within the cold plate 50 and communicates with the inlet 52 and the return outlet 53, forming a complete cooling medium circulation path. In this way, the cold plate 50 can be connected to an external heat exchange module through the inlet 52 to receive low-temperature cooling medium supplied from the outside. When the low-temperature cooling medium flows in the flow channel, it absorbs heat emitted by the hard disk 40 and other heat-generating elements, causing its own temperature to rise. The heated cooling medium then flows out of the cold plate 50 through the outlet and returns to the external heat exchange module for further cooling. In the external heat exchange module, the high-temperature cooling medium releases the absorbed heat, returns to a low-temperature state, and then re-enters the cold plate 50 through the inlet 52 to continue participating in the next round of heat exchange.

[0038] In some embodiments, as shown in FIG4, the number of inlets 52 and outlets 53 of the cold plate 50 can each be one. With this arrangement, the cooling medium can enter the interior of the cold plate 50 from a single inlet 52, flow along a pre-defined flow channel, and finally exit through a single outlet, completing one heat exchange cycle. This method is simple in structure, easy to maintain and install, and suitable for applications with relatively low cooling requirements or limited space.

[0039] In other embodiments, to improve cooling efficiency and uniformity, there can be multiple inlets 52 and outlets, thereby forming multiple independent or interconnected cooling medium circulation paths within the cold plate 50. By setting multiple flow channels, the cooling medium can be distributed more evenly within the cold plate 50, thereby efficiently cooling the hard disk 40.

[0040] In some embodiments, the multiple flow channels can operate independently to cool different areas.

[0041] In other embodiments, the multiple channels may also be interconnected to ensure a more balanced flow of the cooling medium throughout the cold plate 50.

[0042] In some embodiments, the heat dissipation assembly 500 includes an air-cooling module. The air-cooling module is disposed at one end of the chassis 10. In this way, the server equipment can drive airflow through the air-cooling module to remove the heat generated by the hard drives 40 during operation. Here, the air-cooling module does not occupy space within the chassis 10, thereby increasing the number and density of hard drives 40.

[0043] In some embodiments, as shown in Figures 3 and 7, each partition 30 is provided with ventilation holes 32. When the air-cooled module is running, airflow can flow along these ventilation holes 32, directly passing through the hard drive 40 mounting area 303 between the partitions 30. The air can contact the surface of the hard drive 40 and carry away the heat generated by the hard drive 40 during operation. In this way, the heat dissipation efficiency of the hard drive 40 can be improved.

[0044] In some embodiments, as shown in Figures 5 and 6, each hard disk 40 further includes a hot-swappable assembly 42. The hot-swappable assembly 42 is located on the side of the hard disk body 41 away from the hard disk backplane 20. The hot-swappable assembly 42 is coupled to the hard disk body 41 and detachably coupled to a corresponding partition 30. In this way, when it is necessary to increase storage capacity or replace a faulty hard disk 40, the user can operate directly without shutting down the server, reducing system downtime and improving work efficiency. Furthermore, inserting or removing the hard disk 40 will not interfere with data transmission or damage hardware. Even under high-load operating conditions, system continuity and reliability are guaranteed.

[0045] In some embodiments, as shown in Figures 6 and 7, each partition 30 is provided with a plurality of limiting holes 31. These limiting holes 31 can work in conjunction with the hot-swap assembly 42 to ensure the secure installation and convenient removal of the hard drive 40. The hot-swap assembly 42 includes a connector 421 and a button 422. The connector 421 is rotatably coupled to the hard drive body 41 and can switch between an unlocked position and a locked position to fix or release the hard drive 40.

[0046] As shown in Figure 6, the connector 421 has a first end 4211 and a second end 4212. The first end 4211 of the connector 421 can be inserted into the limiting hole 31 on the partition 30, and the second end 4212 of the connector 421 can be connected to the button 422. The button 422 itself is also coupled to the hard disk body 41, and serves to control the state of the connector 421.

[0047] When connector 421 is in the locked position, the first end 4211 of connector 421 inserts into the corresponding limiting hole 31, while the second end 4212 is tightly coupled to button 422, thus fixing the hard drive body 41 to the partition 30. Here, the hot-swap assembly 42 also ensures a stable connection between the hard drive body 41 and the hard drive backplane 20, avoiding data transmission problems caused by poor contact. Furthermore, through the combined use of the limiting hole 31 and connector 421, the hard drive 40 can remain stable during operation, reducing the potential risk of damage caused by vibration or other external factors.

[0048] When hard drive 40 needs replacement or maintenance, the user can switch connector 421 from the locked position to the unlocked position by operating button 422. In this state, the first end 4211 of connector 421 will be pulled out from the limiting hole 31, and the second end 4212 will separate from button 422, thereby releasing the fixed connection between partition 30 and hard drive body 41. At this time, the user can remove hard drive 40 from between partitions 30 without shutting down server equipment or interrupting system operation, improving the efficiency and convenience of maintenance work.

[0049] In some embodiments, as shown in FIG6, the hot-swap assembly 42 further includes an elastic element 423. The elastic element 423 is coupled to the hard disk body 41 and the connector 421, and the elastic element 423 is adapted to apply a force to the connector 421 to move the connector 421 to an unlocked position.

[0050] When the user needs to remove the hard drive 40, the locking state can be released simply by operating button 422. The elastic element 423 assists in pushing the connector 421 from the locked position to the unlocked position, allowing the first end 4211 to smoothly exit from the limiting hole 31 of the partition 30. In this way, the elastic element 423 reduces the force and complexity required for manual unlocking, making it convenient to install and remove the hard drive 40 even in compact or hard-to-reach spaces. Furthermore, without external intervention, the connector 421 can automatically return to the unlocked state, improving the efficiency of maintenance work.

[0051] Embodiments of this disclosure are also embodied in the following examples.

[0052] Example 1. A server device, comprising:

[0053] Chassis;

[0054] A hard drive backplane is disposed at the bottom of the chassis and coupled to the chassis, and the hard drive backplane includes multiple data interfaces;

[0055] Multiple partitions are disposed within the chassis and spaced apart from each other, and adjacent partitions define an installation area for hard drive insertion.

[0056] Multiple hard drives, each set of hard drives being disposed in a corresponding mounting area between the multiple partitions, and each being detachably coupled to a corresponding data interface; and

[0057] A heat dissipation component is disposed on one side of the plurality of partitions and coupled to the chassis to exchange heat with the plurality of hard drives.

[0058] Example 2. The server device according to Example 1, wherein the heat dissipation component includes:

[0059] A cold plate is disposed on the side of the hard disk backplate facing the plurality of partitions and coupled to the plurality of partitions. The cold plate includes a plurality of through holes penetrating the top and bottom surfaces of the cold plate. The plurality of through holes correspond to the plurality of data interfaces respectively, so that the plurality of data interfaces pass through the plurality of through holes respectively.

[0060] Example 3. The server device according to Example 2, wherein each of the hard disks includes:

[0061] The hard drive itself; and

[0062] The heat sink is coupled to the hard drive body and to the cold plate.

[0063] Example 4. The server device according to Example 3, wherein the heat sink comprises:

[0064] A base plate is disposed on the side of the hard disk body facing the cold plate, and abuts against the hard disk body and the cold plate; and

[0065] A side plate is disposed on the side of the hard disk body and coupled to the bottom plate.

[0066] Example 5. The server device according to Example 4, wherein the side panel is a structure formed by bending from the edge of the base plate.

[0067] Example 6. The server device according to Example 4, wherein each of the hard disks further includes:

[0068] A first thermal pad is disposed between the side panel and the hard drive body to transfer heat from the hard drive body to the side panel via the first thermal pad.

[0069] Example 7. The server device according to Example 4 further includes:

[0070] Multiple second thermal pads are respectively disposed between the heat sink and the cold plate of the multiple sets of hard drives.

[0071] Example 8. The server device according to any one of Examples 2 to 7, wherein the cold plate comprises:

[0072] At least one water inlet;

[0073] At least one return water inlet; and

[0074] The flow channel is disposed within the cold plate and is connected to the at least one water inlet and the at least one water return outlet.

[0075] Example 9. The server device according to Example 1, wherein the heat dissipation component includes:

[0076] The air-cooled module is located at one end of the chassis.

[0077] Example 10. The server device according to Example 9, wherein each of the partitions is provided with ventilation holes.

[0078] Example 11. The server device according to any one of Examples 3 to 7 and 9 to 10, wherein each of the hard disks further includes:

[0079] A hot-swappable assembly is disposed on the side of the hard disk body away from the hard disk backplane and coupled to the hard disk body, and the hot-swappable assembly is detachably coupled to the corresponding partition.

[0080] Example 12. The server device according to Example 11, wherein each of the partitions is provided with a plurality of limiting holes, and the hot-swappable assembly includes:

[0081] A connector, rotatably coupled to the hard disk body and adapted to switch between an unlocked position and a locked position, the connector including a first end and a second end opposite to each other; and

[0082] The button is coupled to the hard drive body;

[0083] When the connector is in the locked position, the first end is inserted into the corresponding limiting hole, and the second end is coupled to the button. When the connector is in the unlocked position, the first end is separated from the corresponding limiting hole, and the second end is separated from the button.

[0084] Example 13. The server device according to Example 12, wherein the hot-swappable component further includes:

[0085] An elastic element, coupled to the hard disk body and the connector, and adapted to apply a force to the connector to move the connector toward the unlocked position.

[0086] The various embodiments of this disclosure have been described above. These descriptions are exemplary and not exhaustive, and are not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or technological improvements to the embodiments in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A server device, comprising: Chassis (10); A hard disk backplane (20) is disposed inside the chassis (10) at the bottom of the chassis (10) and coupled to the chassis (10), and the hard disk backplane (20) includes a plurality of data interfaces (21); Multiple partitions (30) are disposed within the chassis (10) and spaced apart from each other, and adjacent partitions (30) define an installation area (303) for inserting a hard disk (40); Multiple hard disks (40) are respectively disposed in the corresponding mounting areas (303) between the multiple partitions (30) and are detachably coupled to the corresponding data interface (21); as well as A heat dissipation assembly (500) is disposed on one side of the plurality of partitions (30) and coupled to the chassis (10) to exchange heat with the plurality of hard drives (40).

2. The server device according to claim 1, wherein the heat dissipation component (500) comprises: A cold plate (50) is disposed on the side of the hard disk backplate (20) facing the plurality of partitions (30) and coupled to the plurality of partitions (30). The cold plate (50) includes a plurality of through holes (51) penetrating the top and bottom surfaces of the cold plate (50). The plurality of through holes (51) correspond to the plurality of data interfaces (21) respectively, so that the plurality of data interfaces (21) pass through the plurality of through holes (51).

3. The server device according to claim 2, wherein each of the hard disks (40) comprises: Hard disk unit (40); as well as The heat sink (43) is coupled to the hard disk body (40) and to the cold plate (50).

4. The server device according to claim 3, wherein the heat sink (43) comprises: A base plate (431) is disposed on the side of the hard disk body (40) facing the cold plate (50) and abuts against the hard disk body (40) and the cold plate (50); and A side plate (432) is disposed on the side of the hard disk body (40) and coupled to the bottom plate (431).

5. The server device according to claim 4, wherein the side plate (432) is a structure formed by bending from the edge of the base plate (431).

6. The server device of claim 4, wherein each of the hard disks (40) further comprises: A first thermal pad (433) is disposed between the side plate (432) and the hard disk body (40) to transfer heat from the hard disk body (40) to the side plate (432) via the first thermal pad (433).

7. The server device according to claim 4, further comprising: Multiple second thermal pads (434) are respectively disposed between the heat sink (43) and the cold plate (50) of the multiple sets of hard disks (40).

8. The server device according to any one of claims 2 to 7, wherein the cold plate (50) comprises: At least one inlet (52); At least one return outlet (53); as well as The flow channel is disposed within the cold plate (50) and communicates with at least one inlet (52) and at least one outlet (53).

9. The server device according to claim 1, wherein the heat dissipation component (500) comprises: An air-cooled module is located at one end of the chassis (10).

10. The server device according to claim 9, wherein each of the partitions (30) is provided with a ventilation hole (32).

11. The server device according to any one of claims 3 to 7 and 9 to 10, wherein each of the hard disks (40) further comprises: A hot-swappable assembly (42) is disposed on the side of the hard disk body (40) away from the hard disk backplane (20) and coupled to the hard disk body (40), and the hot-swappable assembly (42) is detachably coupled to the corresponding partition (30).

12. The server device according to claim 11, wherein each of the partitions (30) is provided with a plurality of limiting holes (31), and the hot-swappable assembly (42) comprises: A connector (421), rotatably coupled to the hard disk body (40) and adapted to switch between an unlocked position and a locked position, the connector (421) including a first end (4211) and a second end (4212) opposite to each other; and Button (422) is coupled to the hard disk body (40); When the connector (421) is in the locked position, the first end (4211) is inserted into the corresponding limiting hole (31), and the second end (4212) is coupled to the button (422). When the connector (421) is in the unlocked position, the first end (4211) is separated from the corresponding limiting hole (31), and the second end (4212) is separated from the button (422).

13. The server device of claim 12, wherein the hot-swappable assembly (42) further comprises: An elastic element (423) is coupled to the hard disk body (40) and the connector (421) and is adapted to apply a force to the connector (421) to move the connector (421) toward the unlocked position.

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