Server assembly and data center

WO2026199885A1PCT designated stage Publication Date: 2026-10-01DOUYIN VISION CO LTD
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Patent Information

Application Number
PCT/CN2025/127036
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-24
Filing Date
2025-10-11
Publication Date
2026-10-01

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    Figure CN2025127036_01102026_PF_FP_ABST
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Abstract

The present disclosure relates to a server assembly and a data center. The server assembly comprises a cabinet, server nodes, a liquid inlet pipe, a liquid outlet pipe, and a negative-pressure liquid cooling distribution unit. The cabinet is provided with an immersion chamber for accommodating a cooling medium. The server nodes are disposed in the immersion chamber, and at least part of the server nodes are immersed in the cooling medium, so that the cooling medium can absorb heat from the server nodes. A liquid outlet end of the negative-pressure liquid cooling distribution unit is in communication with the immersion chamber via the liquid inlet pipe, and the immersion chamber is in communication with a liquid return end of the negative-pressure liquid cooling distribution unit via the liquid outlet pipe. The negative-pressure liquid cooling distribution unit is configured such that an absolute pressure within the liquid outlet pipe is lower than the atmospheric pressure, and an absolute pressure within the liquid inlet pipe is higher than the absolute pressure within the liquid outlet pipe.
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Description

Server assemblies and data centers

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202510355137.7, filed on March 24, 2025, entitled "Server Assembly and Data Center", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to the field of servers, and more specifically, to a server assembly and a data center. Background Technology

[0004] A server is a high-performance computer that provides various services and resources to clients (such as personal computers and mobile devices) in a computer network. With the rapid development of information technology, the computing density and power of servers are becoming increasingly stronger, thus placing higher demands on their heat dissipation. In an immersion liquid cooling system, the server is typically placed entirely within a sealed container, which is then filled with a cooling medium. The server is horizontally immersed in the cooling medium to achieve cooling. Summary of the Invention

[0005] This content section is provided to briefly introduce the concepts, which will be described in detail in the subsequent detailed description section. This content section is not intended to identify key or essential features of the claimed technical solution, nor is it intended to limit the scope of the claimed technical solution.

[0006] In one aspect, this disclosure provides a server assembly, including a cabinet, server nodes, inlet pipes, outlet pipes, and a negative pressure liquid cooling distribution unit;

[0007] The cabinet has an immersion chamber for containing a cooling medium, and the server nodes are disposed in the immersion chamber and at least partially immersed in the cooling medium so that the cooling medium can absorb the heat of the server nodes.

[0008] The liquid outlet of the negative pressure liquid cooling distribution unit is connected to the immersion chamber through the liquid inlet pipe, and the immersion chamber is connected to the liquid return end of the negative pressure liquid cooling distribution unit through the liquid outlet pipe. The negative pressure liquid cooling distribution unit is configured such that the absolute pressure in the liquid outlet pipe is less than the atmospheric pressure, and the absolute pressure in the liquid inlet pipe is greater than the absolute pressure in the liquid outlet pipe.

[0009] Secondly, this disclosure provides a data center including the server assembly described above.

[0010] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0011] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and the originals and elements are not necessarily drawn to scale. In the drawings:

[0012] Figure 1 is a schematic diagram of the server assembly provided in the first exemplary embodiment of this disclosure, wherein the negative pressure liquid cooling distribution unit is not shown, and the arrows indicate the flow direction of the cooling medium.

[0013] Figure 2 is a schematic diagram of the server assembly provided in the second exemplary embodiment of this disclosure, wherein the negative pressure liquid cooling distribution unit is not shown, and the arrow indicates the flow direction of the cooling medium.

[0014] Figure 3 is a schematic diagram of the server assembly provided in the third exemplary embodiment of this disclosure, wherein the negative pressure liquid cooling distribution unit is not shown, and the arrows indicate the flow direction of the cooling medium.

[0015] Figure 4 is a schematic diagram of the structure of the insertion shell, inlet pipe, outlet pipe and drainage pipe of the server assembly provided in an exemplary embodiment of the present disclosure.

[0016] Figure 5 is a schematic diagram of the structure of the insertion shell, liquid outlet pipe, air return pipe, and drainage pipe of the server assembly provided in an exemplary embodiment of this disclosure.

[0017] Figure 6 is a schematic diagram of the structure of a server assembly provided in an exemplary embodiment of this disclosure, where the arrows indicate the flow direction of the cooling medium.

[0018] Figure 7 is a schematic diagram of the server assembly provided in the third exemplary embodiment of this disclosure, with arrows indicating the flow direction of the cooling medium.

[0019] Figure 8 is a schematic diagram of the server assembly provided in the fourth exemplary embodiment of this disclosure, with arrows indicating the flow direction of the cooling medium.

[0020] Figure 9 is a schematic diagram of the structure of the negative pressure liquid cooling distribution unit of the server assembly provided in the first exemplary embodiment of this disclosure, wherein the arrow indicates the flow direction of the cooling medium.

[0021] Figure 10 is a schematic diagram of the negative pressure liquid cooling distribution unit of the server assembly provided in the second exemplary embodiment of this disclosure, wherein the arrows indicate the flow direction of the cooling medium.

[0022] Explanation of reference numerals in the attached drawings: 10-Negative pressure liquid cooling distribution unit; 11-First liquid tank; 12-Second liquid tank; 13-Circulation pump; 14-First vent valve; 15-Second vent valve; 16-Heat exchanger; 17-First switching valve; 18-Second switching valve; 20-Negative pressure generating device; 21-Vacuum pump; 22-First extraction pipe; 23-Second extraction pipe; 24-Third switching valve; 25-Fourth switching valve; 26-First vacuum pump; 27-Second vacuum pump; 200-Server assembly; 40-Rack; 41-Immersion chamber; 42-Liquid inlet; 44-Cabinet; 441-First receiving tank; 45-Insertion shell; 451-Shell body; 452-Sealing plate; 453-Sealing ring; 454-Wire hole; 46-Second receiving tank; 47-Drain hole; 50-Server node; 51-Device to be cooled; 52-Drainage pipe; 53-Flow guide shroud; 54-Outer shell; 60-Liquid inlet pipe; 61-Liquid distribution section; 62-Mating interface; 70-Liquid outlet pipe; 90-Gas return pipe; 110-Liquid distribution pipe; 120-Manifold. Detailed Implementation

[0023] Embodiments of this disclosure will now be described in more detail with reference to the accompanying drawings. While some embodiments of this disclosure are shown in the drawings, it should be understood that this disclosure can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this disclosure. It should be understood that the accompanying drawings and embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of protection of this disclosure.

[0024] The term "comprising" and its variations as used herein are open-ended inclusions, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment". Definitions of other terms will be given in the following description.

[0025] It should be noted that the concepts of "first" and "second" mentioned in this disclosure are used only to distinguish different devices, modules or units, and are not used to limit the order of functions performed by these devices, modules or units or their interdependencies.

[0026] It should be noted that the terms "a" and "a plurality of" used in this disclosure are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0027] In this disclosure, it should be understood that directional terms such as "upper" and "lower" are defined according to the orientation of the accompanying drawings and are used only for the convenience of describing this disclosure and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or a specific orientational construction and operation, and therefore should not be construed as a limitation of this disclosure. Directional terms such as "upper and lower direction" can be referred to in Figures 1 to 3 and Figures 6 to 8. The terms "inner" and "outer" refer to the inner and outer contours of the corresponding structures. Furthermore, it should be noted that the terms such as "first" and "second" are used to distinguish one element from another and do not have sequential or importance implications. Additionally, in the description with reference to the accompanying drawings, the same reference numerals in different drawings denote the same element.

[0028] In the description of this disclosure, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "connect," "link," and "install" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0029] In immersion liquid cooling systems, the entire server is typically placed in a sealed container filled with cooling medium, immersing it horizontally for cooling. Because the sealed container must accommodate the entire server, it is relatively large, leading to poor compatibility with data center design and layout, and making it inconvenient for deployment within data centers. Furthermore, since the entire server is submerged in the sealed container, the large volume of cooling medium, combined with the server's size, results in high flow resistance and slow flow rate of the cooling medium. Slower flow rates lead to lower heat transfer efficiency, resulting in inadequate server cooling. Additionally, to prevent leakage of cooling medium from the sealed container and related piping, immersion liquid cooling systems require high airtightness, increasing costs.

[0030] Therefore, embodiments of this disclosure provide a server assembly, including a cabinet, server nodes, liquid inlet pipes, liquid outlet pipes, and a negative pressure liquid cooling distribution unit;

[0031] The cabinet has an immersion chamber for containing a cooling medium, and the server nodes are disposed in the immersion chamber and at least partially immersed in the cooling medium so that the cooling medium can absorb the heat of the server nodes.

[0032] The liquid outlet of the negative pressure liquid cooling distribution unit is connected to the immersion chamber through the liquid inlet pipe, and the immersion chamber is connected to the liquid return end of the negative pressure liquid cooling distribution unit through the liquid outlet pipe. The negative pressure liquid cooling distribution unit is configured such that the absolute pressure in the liquid outlet pipe is less than the atmospheric pressure, and the absolute pressure in the liquid inlet pipe is greater than the absolute pressure in the liquid outlet pipe.

[0033] Through the above technical solution, in the server assembly provided in this disclosure, the immersion cavity is used to immerse the server node. Compared with the related technology solution of immersing the entire server, on the one hand, the cooling medium can directly exchange heat with the server node inside the server, resulting in better heat dissipation; on the other hand, since the volume of the server node is much smaller than the overall volume of the server, the volume of the cooling medium in the immersion cavity is smaller, the flow resistance is smaller, and the flow rate of the cooling medium is higher. The higher flow rate of the cooling medium has higher heat transfer efficiency, which is beneficial to improving the heat dissipation effect of the server.

[0034] Furthermore, since the immersion chamber is located inside the rack, the installation of the immersion chamber can be done without changing the size or shape of the rack, or with minimal changes, which facilitates the rack's placement in the data center and makes the server assembly provided in this disclosure highly compatible.

[0035] Furthermore, the negative pressure liquid cooling distribution unit not only provides the driving force for the flow of cooling medium, but also ensures that the absolute pressure in the outlet pipe is less than atmospheric pressure, placing the outlet pipe under negative pressure. This continuously draws in cooling medium, so even if a leak occurs in the immersion chamber, the negative pressure in the outlet pipe will cause air to enter the immersion chamber from the leak point, preventing the cooling medium from flowing out. The air entering the immersion chamber will then flow out of the outlet pipe along with the cooling medium. By using a negative pressure liquid cooling distribution unit to supply cooling medium to the immersion chamber, the sealing requirements for the immersion chamber can be reduced, thereby helping to lower the overall manufacturing cost of the server assembly. Moreover, the reduced risk of cooling medium leakage also contributes to the higher reliability of the server assembly.

[0036] Furthermore, since the negative pressure liquid cooling distribution unit can ensure that the absolute pressure in the outlet pipe is less than the atmospheric pressure, when the server node needs to be inspected and maintained, the inlet pipe can be closed, and the cooling medium in the immersion chamber can flow back to the negative pressure liquid cooling distribution unit under the suction of the negative pressure outlet pipe, so as to automatically empty and recover the cooling medium in the server node and the immersion chamber, thereby reducing the waste of cooling medium during the inspection and maintenance of the server node.

[0037] As shown in Figures 1 to 10, according to a first aspect of this disclosure, a server assembly 200 is provided, including a cabinet 40, server nodes 50, a liquid inlet pipe 60, a liquid outlet pipe 70, and a negative pressure liquid cooling distribution unit 10. The cabinet 40 has an immersion chamber 41 for containing a cooling medium, and the server nodes 50 are disposed within the immersion chamber 41 with at least a portion of the server nodes 50 immersed in the cooling medium, so that the cooling medium can absorb heat from the server nodes 50. The outlet end of the negative pressure liquid cooling distribution unit 10 is connected to the immersion chamber 41 through the inlet pipe 60. The immersion chamber 41 is connected to the return end of the negative pressure liquid cooling distribution unit 10 through the outlet pipe 70. The negative pressure liquid cooling distribution unit 10 is configured such that the absolute pressure in the outlet pipe 70 is less than the atmospheric pressure, and the absolute pressure in the inlet pipe 60 is greater than the absolute pressure in the outlet pipe 70, so that there is a pressure difference between the inlet pipe 60 and the outlet pipe 70. The negative pressure outlet pipe 70 draws in the cooling medium, so that the cooling medium can flow from the negative pressure liquid cooling distribution unit 10 through the inlet pipe 60 into the immersion chamber 41 under the action of the pressure difference, and return from the immersion chamber 41 to the negative pressure liquid cooling distribution unit 10 through the outlet pipe 70. The cooling medium circulates between the negative pressure liquid cooling distribution unit 10 and the immersion chamber 41 by relying on the pressure difference.

[0038] Through the above technical solution, in the server assembly 200 provided in this disclosure, the immersion cavity 41 is used to immerse the server node 50. Compared with the related technology solution of immersing the entire server, on the one hand, the cooling medium can directly exchange heat with the server node 50 inside the server, resulting in better heat dissipation; on the other hand, since the volume of the server node 50 is much smaller than the overall volume of the server, the volume of the cooling medium in the immersion cavity 41 is smaller, the flow resistance is smaller, and the flow rate of the cooling medium is higher. The higher flow rate of the cooling medium has higher heat transfer efficiency, which is beneficial to improving the heat dissipation effect of the server.

[0039] Furthermore, since the immersion chamber 41 is located inside the rack 40, the immersion chamber 41 can be installed without changing the size or shape of the rack 40 or with minimal changes to the size or shape of the rack 40, which makes it easier for the rack 40 to be deployed in the data center, thus making the server assembly 200 provided in this disclosure highly compatible.

[0040] Furthermore, the negative pressure liquid cooling distribution unit 10 not only provides the driving force for the flow of cooling medium, but also ensures that the absolute pressure inside the outlet pipe 70 is less than atmospheric pressure, keeping the outlet pipe 70 under negative pressure and continuously drawing in cooling medium. Thus, even if the immersion chamber 41 leaks, the negative pressure in the outlet pipe 70 will cause air to enter the immersion chamber 41 from the leak location, preventing the cooling medium from flowing out. The air entering the immersion chamber 41 will then flow out of the outlet pipe 70 along with the cooling medium. By using the negative pressure liquid cooling distribution unit 10 to provide cooling medium to the immersion chamber 41, the sealing requirements for the immersion chamber 41 can be reduced, thereby helping to lower the overall manufacturing cost of the server assembly 200. Moreover, the reduced risk of cooling medium leakage also contributes to the higher reliability of the server assembly 200.

[0041] Furthermore, since the negative pressure liquid cooling distribution unit 10 can make the absolute pressure in the outlet pipe 70 less than the atmospheric pressure, when the server node 50 needs to be inspected and maintained, the inlet pipe 60 can be closed, and the cooling medium in the immersion chamber 41 can flow back to the negative pressure liquid cooling distribution unit 10 under the suction of the negative pressure outlet pipe 70, so as to automatically empty and recycle the cooling medium in the server node 50 and the immersion chamber 41, thereby reducing the waste of cooling medium during the inspection and maintenance of the server node 50.

[0042] It should be noted that the cooling medium mentioned above can be any cooling medium suitable for heat dissipation of server node 50, as long as the cooling medium has a high specific heat capacity and thermal conductivity and can meet the heat dissipation requirements of server node 50. This disclosure does not limit it in this regard.

[0043] For example, the cooling medium can be a water-glycol solution, mineral oil, fluorocarbons, etc., and this disclosure does not limit it. It is understood that for highly volatile substances (such as fluorocarbons mentioned above), since the negative pressure liquid cooling distribution unit 10 and the pipeline connecting the negative pressure liquid cooling distribution unit 10 and the immersion chamber 41 can be at least partially under negative pressure, even if the cooling medium evaporates, it is not easy to diffuse into the external environment, effectively avoiding liquid dissipation caused by the evaporation of the cooling medium.

[0044] In this disclosure, the inlet pipe 60 and the outlet pipe 70 can be connected to any position in the immersion chamber 41, as long as the inlet pipe 60 and the outlet pipe 70 can realize the inflow and outflow of the cooling medium. As one embodiment of this disclosure, as shown in Figures 1 to 4 and Figures 6 to 8, the inlet pipe 60 is connected to the top of the immersion chamber 41, and the outlet pipe 70 is connected to the bottom of the immersion chamber 41. Since the inlet pipe 60 and the outlet pipe 70 are respectively located at the top and bottom of the immersion chamber 41, when the cooling medium flows into the immersion chamber 41 through the inlet pipe 60 and flows out through the outlet pipe 70, due to the height difference between the inlet pipe 60 and the outlet pipe 70, the flow rate of the cooling medium can gradually increase under the influence of gravity. Thus, on the one hand, the cooling medium with a higher flow rate can improve the heat dissipation effect on the server node 50; on the other hand, by reasonably designing the height difference between the inlet pipe 60 and the outlet pipe 70, it is also beneficial to reduce the load on the negative pressure liquid cooling distribution unit 10, thereby reducing the energy consumption of the entire server assembly 200.

[0045] For example, by reasonably designing the height difference between the inlet pipe 60 and the outlet pipe 70, the pressure difference between the first liquid tank 11 and the second liquid tank 12 in the negative pressure liquid cooling distribution unit 10 mentioned below can be reduced while meeting the heat dissipation requirements of the server node 50. This reduces the operating time of the vacuum pump 21 or the power of the vacuum pump 21, thereby reducing the energy consumption and cost.

[0046] To facilitate the connection between the inlet pipe 60 and the immersion chamber 41, optionally, as shown in FIG5, the immersion chamber 41 is provided with an inlet hole 42 and an outlet hole 47, with the inlet pipe 60 connected to the inlet hole 42 and the outlet pipe 70 connected to the outlet hole 47. It is understood that, in the embodiment where the immersion chamber 41 is provided with an inlet hole 42 and an outlet hole 47, the inlet hole 42 can be located at the top of the immersion chamber 41, and the outlet hole 47 can be located at the bottom of the immersion chamber 41.

[0047] To facilitate control of the flow of cooling medium within the immersion chamber 41, a first switching valve 17 may be installed on the inlet pipe 60, and a second switching valve 18 may be installed on the outlet pipe 70. The first switching valve 17 and the second switching valve 18 can open or close the inlet pipe 60 and the outlet pipe 70, thereby controlling the on / off state of the inlet pipe 60 and the outlet pipe 70.

[0048] Furthermore, since the absolute pressure inside the outlet pipe 70 is less than atmospheric pressure, when the server node 50 needs to be inspected and maintained, the first switch valve 17 can be closed to cut off the input of the cooling medium. This allows the cooling medium in the immersion chamber 41 to be automatically discharged from the immersion chamber 41 under the suction of the negative pressure outlet pipe 70. After the cooling medium is discharged from the immersion chamber 41, the second switch valve 18 can be closed, and the server node 50 can be inspected and maintained.

[0049] Optionally, as shown in Figure 5, the server assembly 200 further includes a return air pipe 90, which is located in the immersion chamber 41 and extends along the vertical direction of the immersion chamber 41. The upper end of the return air pipe 90 is connected to the immersion chamber 41, and the lower end of the return air pipe 90 is connected to the negative pressure liquid cooling distribution unit 10. For example, the lower end of the return air pipe 90 can be connected to the first liquid tank 11 in the negative pressure liquid cooling distribution unit 10 mentioned below. The negative pressure liquid cooling distribution unit 10 is configured to make the absolute pressure in the return air pipe 90 less than the atmospheric pressure.

[0050] Since the return air pipe 90 is located inside the immersion chamber 41 and extends vertically along the immersion chamber 41, and its lower end is connected to the negative pressure liquid cooling distribution unit 10, the upper end of the return air pipe 90 can be positioned at a certain height within the immersion chamber through proper design. If, during operation, the height of the cooling medium in the immersion chamber 41 is higher than the height of the upper end of the return air pipe 90, the cooling medium in the immersion chamber 41 can be discharged simultaneously through the return air pipe 90 and the liquid outlet pipe 70 under negative pressure, and flow back to the negative pressure liquid cooling distribution unit 10. Conversely, when the height of the cooling medium in the immersion chamber 41 is lower than the height of the upper end of the return air pipe 90, the cooling medium in the immersion chamber 41 can only be discharged through the liquid outlet pipe 70. In this case, the return air pipe 90, under the action of the negative pressure liquid cooling distribution unit 10, can draw in air above the surface of the cooling medium in the immersion chamber 41, thereby maintaining a constant pressure balance within the immersion chamber 41 and ensuring a stable liquid level of the cooling medium within the immersion chamber 41.

[0051] Optionally, the diameter of the return pipe 90 can be smaller than the diameter of the outlet pipe 70, so that when the height of the cooling medium in the immersion chamber 41 is higher than the height of the upper end of the return pipe 90, the cooling medium is mainly discharged from the outlet pipe 70.

[0052] It should be noted that this disclosure does not limit the specific connection method between the return air pipe 90 and the negative pressure liquid cooling distribution unit 10, as long as the return air pipe 90 can be connected to the negative pressure liquid cooling distribution unit 10. As one embodiment of this disclosure, as shown in FIG5, the above-mentioned return air pipe 90 is connected to the negative pressure liquid cooling distribution unit through the drain hole 47 provided on the immersion chamber 41.

[0053] In another embodiment of this disclosure, a vent hole may be provided on the wall of the immersion chamber 41, and a vent pipe 90 is connected to the vent hole, which is connected to the negative pressure liquid cooling distribution unit 10. The vent hole may be at the same height as the drain hole 47 or at a different height; this disclosure does not limit this.

[0054] In the embodiment where the return air pipe 90 is connected to the negative pressure liquid cooling distribution unit via the drain hole 47 provided on the immersion chamber 41, this disclosure does not limit the specific connection method between the return air pipe 90, the outlet pipe 70, and the drain hole 47. As one embodiment of this disclosure, as shown in FIG5, one end of the outlet pipe 70 passes through the drain hole 47 to extend into the immersion chamber 41, and the lower end of the return air pipe 90 is connected to the portion of the outlet pipe 70 located in the immersion chamber 41.

[0055] Optionally, as shown in Figures 1 to 4 and Figures 6 to 7, there can be multiple immersion chambers 41. These multiple immersion chambers 41 are arranged at intervals along the vertical direction of the cabinet 40. Each immersion chamber 41 is equipped with an inlet pipe 60 and an outlet pipe 70. There are multiple server nodes 50, and each server node 50 is housed within a corresponding immersion chamber 41. The multiple immersion chambers 41 can dissipate heat from the multiple server nodes 50 respectively, thereby meeting the heat dissipation requirements of the multiple server nodes 50.

[0056] Furthermore, since multiple immersion chambers 41 are arranged at intervals along the vertical direction of the cabinet 40, by rationally designing the structure of multiple immersion chambers 41 and the cabinet 40, the overall space occupied by the cabinet 40 in the horizontal direction can be reduced, which is beneficial to improving the compatibility of the cabinet 40 and making it easier to be deployed in the data center.

[0057] Furthermore, since each immersion chamber 41 is equipped with an inlet pipe 60 and an outlet pipe 70, in other words, the multiple immersion chambers 41 are relatively independent. Thus, if it is necessary to inspect and maintain one of the server nodes 50 during use, the inlet pipe 60 and outlet pipe 70 of the immersion chamber 41 corresponding to the server node 50 to be inspected can be disconnected, thereby enabling the inspection and maintenance of that server node 50 without affecting the normal heat dissipation of other server nodes 50.

[0058] To facilitate the connection of multiple inlet pipes 60 and multiple outlet pipes 70 to the negative pressure liquid cooling distribution unit 10, optionally, as shown in Figures 1 to 4 and Figures 6 to 7, the server assembly 200 further includes a distribution pipe 110 and a manifold 120. Both the distribution pipe 110 and the manifold 120 extend vertically. The upper or lower end of the distribution pipe 110 is connected to the outlet end of the negative pressure liquid cooling distribution unit 10. One end of each of the multiple inlet pipes 60 is connected to the distribution pipe 110, the upper or lower end of the manifold 120 is connected to the inlet end of the negative pressure liquid cooling distribution unit 10, and one end of each of the multiple outlet pipes 70 is connected to the manifold 120. The distribution pipe 110 and the manifold 120 enable the connection between the multiple inlet pipes 60 and multiple outlet pipes 70 and the negative pressure liquid cooling distribution unit 10, thereby enabling the cooling medium to circulate within the multiple immersion chambers 41.

[0059] To further prevent localized heat buildup in the server node 50, optionally, as shown in Figures 1 to 3, 5, and 6 to 7, the server node 50 includes a housing 54 and multiple electrical components disposed within the housing 54. These components include at least one heat-dissipating device 51. The inlet pipe 60 has a distribution section 61 disposed within the immersion chamber 41 and located above the server node 50, communicating with the immersion chamber 41. The server node 50 also includes a drain pipe 52 corresponding to the heat-dissipating device 51. The first end of the drain pipe 52 communicates with the distribution section 61, and the second end of the drain pipe 52 passes through the housing 54 and extends towards the heat-dissipating device 51 to guide the cooling medium to the heat-dissipating device 51. The housing 54 has a discharge hole communicating with the immersion chamber 41. The drain pipe 52 guides the cooling medium to the location of the heat-dissipating device 51, allowing heat exchange between the cooling medium and the heat-dissipating device 51, improving the heat dissipation effect of the heat-dissipating device 51, and preventing localized heat buildup within the server node 50. The cooling medium that has exchanged heat with the heat-dissipating device 51 can be discharged from the outer casing 54 through the discharge hole and enter the immersion chamber 41.

[0060] It should be noted that this disclosure does not limit the specific type of the heat dissipation device 51. The heat dissipation device 51 can be any device in the server node 50 that has heat dissipation requirements. For example, the heat dissipation device 51 can be the CPU (processor), RAM (memory), and SSD (high-speed storage device) in the server. This disclosure does not limit this.

[0061] The drain pipe 52 can guide the cooling medium to the device to be cooled 51, so that the cooling medium flows directly through and washes the device to be cooled 51. Alternatively, the cooling medium can be guided to the cooling structure that is in thermal contact with the device to be cooled 51, so that the cooling medium exchanges heat with the device to be cooled 51 when it flows through the cooling structure. This disclosure does not limit this.

[0062] As a first embodiment of this disclosure, as shown in Figures 1 to 4 and Figures 6 to 8, the second end of the aforementioned drain pipe 52 faces the device 51 to be cooled, so that the cooling medium flowing out of the drain pipe 52 can flow through the device 51 to be cooled. In this way, the cooling medium flowing through the drain pipe 52 can directly flush the device 51 to be cooled.

[0063] As a second embodiment of this disclosure, as shown in FIG5, the server node 50 may further include a flow guide shroud 53. The flow guide shroud 53 covers the device to be cooled 51. One side of the flow guide shroud 53 is provided with a liquid inlet, and the other side of the flow guide shroud 53 is formed as an open end. The second end of the drain pipe 52 is connected to the liquid inlet, and the liquid inlet communicates with the interior of the flow guide shroud 53. The cooling medium can enter the flow guide shroud 53 and flow through the device to be cooled 51, directly scouring the device to be cooled 51. Since the flow guide shroud 53 has an open end, after the cooling medium flows through the device to be cooled 51, it can directly flow out of the flow guide shroud 53 from the open end, enter the interior of the outer casing 54, and then flow out of the outer casing 54 through the discharge hole into the immersion chamber 41. Since the flow guide shroud 53 covers the device to be cooled 51, the flow guide shroud 53 can restrict and guide the flow of the cooling medium, preventing the cooling medium from spreading everywhere when flowing through the device to be cooled 51, thus reducing the heat dissipation effect.

[0064] As a third embodiment of this disclosure, as shown in FIG5, the server node 50 may further include a cold plate, which covers the device 51 to be cooled and makes thermally conductive contact with it. One side of the cold plate has a liquid inlet, and the other side is an open end. Multiple channels for the cooling medium to flow through are provided within the cold plate. One end of each channel is connected to the liquid inlet, and the other end is connected to the open end. Since the other side of the cold plate is an open end, the cooling medium can directly flow out of the cold plate from this open end after passing through the channels, eliminating the need for a liquid outlet, liquid outlet connector, or other structures, thus reducing costs. The cooling medium flowing through the channels can exchange heat with the device 51 to be cooled, thereby cooling the device 51.

[0065] It should be noted that the cooling medium flowing out of the drain pipe can directly flush one heat dissipation device 51 or flush multiple heat dissipation devices 51 at the same time; the flow guide shroud 53 can cover only one heat dissipation device 51 or cover multiple heat dissipation devices 51 at the same time; the cold plate can make thermal contact with only one heat dissipation device 51 or make thermal contact with multiple heat dissipation devices 51 at the same time, and this disclosure does not limit this.

[0066] To facilitate the connection between the dispensing section 61 and the drainage tube 52, optionally, as shown in Figures 1 to 4, 6, and 7, the dispensing section 61 is provided with a docking interface 62, which is adapted to be sleeved onto the first end of the drainage tube 52. In this way, the connection between the drainage tube 52 and the dispensing section 61 can be achieved simply by sleeved onto the docking interface 62, making the assembly and disassembly of the drainage tube 52 on the dispensing section 61 relatively simple.

[0067] It is understandable that multiple docking interfaces 62 can be provided. Depending on the number of devices 51 to be cooled, all of the multiple docking interfaces 62 can be connected to the drainage pipe 52, or they can be partially connected to the drainage pipe 52. In the case where multiple docking interfaces 62 are partially connected to the drainage pipe 52, the cooling medium flowing out of the docking interface 62 that is not connected to the drainage pipe 52 can enter the immersion chamber 41.

[0068] Furthermore, since the liquid distribution section 61 connected to the drainage pipe 52 is located within the immersion chamber 41, even if there is a gap between the drainage pipe 52 and the docking interface 62 during use, the cooling medium can still flow into the immersion chamber 41 to dissipate heat from the server node 50 without leaking into the external environment. Moreover, the drainage pipe 52 and the docking interface 62 can have lower sealing requirements; the connection structure between the drainage pipe 52 and the docking interface 62 with lower sealing requirements is simpler and less expensive.

[0069] In this disclosure, the immersion cavity 41 can be disposed within the rack 40 in any suitable manner. As one embodiment of this disclosure, as shown in Figures 1 to 8, the rack 40 may include a rack body 44 and an insertion shell 45. The rack body 44 is provided with a first receiving groove 441, and the insertion shell 45 can be inserted into or removed from the first receiving groove 441 through the opening of the first receiving groove 441. The interior of the insertion shell 45 is the immersion cavity 41. In other words, the insertion shell 45 with the immersion cavity 41 is detachably disposed on the rack body 44 of the rack 40. Thus, on the one hand, by reasonably designing the structure and size of the insertion shell 45, it is possible to adapt the insertion shell 45 to the existing rack 40 (for example, the insertion shell 45 can be inserted into the server node accommodating space in the existing rack 40), thereby eliminating the need to manufacture a separate rack 40 and reducing costs. On the other hand, if either the insertion shell 45 or the rack body 44 is damaged, it is not necessary to replace the entire rack 40 at the same time; only the damaged part needs to be replaced, which helps to reduce maintenance costs.

[0070] As another embodiment of this disclosure, an immersion chamber 41 can be directly provided inside the cabinet 40, and the immersion chamber 41 directly opened in the cabinet 40 has good consistency with the cabinet 40.

[0071] To facilitate the insertion and removal of the server node 50 from the insertion housing 45, as shown in Figure 5, the server node 50 may optionally include a housing body 451 and a sealing plate 452. The housing body 451 has an opening through which the server node 50 can pass, and the sealing plate 452 can cover or expose the opening. Thus, the server node 50 can be inserted into or removed from the insertion housing 45 through the opening, facilitating the inspection and maintenance of the server node 50.

[0072] To prevent cooling medium leakage, optionally, as shown in Figure 5, a sealing ring 453 is provided between the sealing plate 452 and the shell body 451. The sealing ring 453 can seal the gap between the sealing plate 452 and the shell body 451, thereby effectively preventing the cooling medium from leaking from the gap between the sealing plate 452 and the shell body 451. It should be noted that, since the negative pressure liquid cooling distribution unit 10 can make the absolute pressure in the outlet pipe 70 less than the atmospheric pressure, the negative pressure outlet pipe 70 continuously draws the cooling medium in the immersion chamber 41, and the cooling medium is not easy to leak into the external environment. Therefore, the sealing requirement between the sealing plate 452 and the shell body 451 is low. Even if there is a small gap between the sealing ring 453 and the shell body 451 or the sealing plate 452, it will not cause cooling medium leakage.

[0073] To facilitate connection of server node 50 to external power supply equipment or other devices (such as network adapters), optionally, as shown in Figure 5, the insertion shell 45 is also provided with a cable passage hole 454. The cable passage hole 454 is used for the cable harness of server node 50 to pass through, and a sealing plug is provided at the cable passage hole 454 to seal the gap between the cable passage hole 454 and the cable harness. In this way, server node 50 can be connected to external power supply or other devices through the cable passage hole 454, thereby enabling power supply and data transmission of server node 50.

[0074] In addition, since the sealing plug can seal the gap between the wire hole 454 and the wire harness, the sealing effect between the wire hole 454 and the wire harness is good, which can effectively prevent the cooling medium from leaking from the gap between the wire hole 454 and the wire harness.

[0075] The through hole 454 can be located at any suitable position in the immersion chamber 41. The through hole 454 can be located above the liquid surface of the cooling medium in the immersion chamber 41 (for example, as shown in Figure 5, the through hole 454 is located at the top of the immersion chamber 41), or it can be located below the liquid surface of the cooling medium in the immersion chamber 41 (for example, the through hole 454 is located at the bottom of the immersion chamber 41). For devices that are easily affected by the cooling medium, the through hole 454 can be located above the liquid surface of the cooling medium in the immersion chamber 41; for devices that are not easily affected by the cooling medium, the through hole 454 can be located below the liquid surface of the cooling medium in the immersion chamber 41.

[0076] In this disclosure, the negative pressure liquid cooling distribution unit 10 can be set in any suitable location. For example, the negative pressure liquid cooling distribution unit 10 can be set inside the cabinet 40 or outside the cabinet 40. This disclosure does not limit this.

[0077] As one embodiment of this disclosure, as shown in Figures 6 and 7, the rack 40 is provided with a second receiving slot 46, through which the negative pressure liquid cooling distribution unit 10 can be inserted into or removed from the receiving slot 46. In other words, the negative pressure liquid cooling distribution unit 10 is disposed inside the rack 40. The negative pressure liquid cooling distribution unit 10 disposed inside the rack 40 can improve the compactness of the entire server assembly 200, thereby facilitating the layout of the server assembly 200 in the data center.

[0078] The negative pressure liquid cooling distribution unit 10 can be located at the top of the rack 40, for example above multiple server nodes 50, or at the bottom of the rack 40, for example below multiple server nodes 50, or between multiple server nodes 50. This disclosure does not limit this.

[0079] As another embodiment of this disclosure, as shown in FIG8, there are multiple cabinets 40, and the negative pressure liquid cooling distribution unit 10 is disposed outside the cabinets 40. The liquid inlet pipe 60 and liquid outlet pipe 70 corresponding to each cabinet 40 are connected to the negative pressure liquid cooling distribution unit 10. Only one negative pressure liquid cooling distribution unit 10 is needed to realize the circulation of cooling medium in the immersion chambers 41 of multiple cabinets 40. In this way, on the one hand, the structure of the entire server assembly 200 can be simplified, and on the other hand, the cost of the server assembly 200 can be reduced.

[0080] This disclosure does not limit the specific type of the negative pressure liquid cooling distribution unit 10 (i.e., negative pressure CDU). For example, the negative pressure liquid cooling distribution unit 10 can be a cavity-type negative pressure liquid cooling distribution unit.

[0081] In one embodiment provided in this disclosure, the negative pressure liquid cooling distribution unit 10 is a cavity-type non-circular negative pressure liquid cooling distribution unit. Specifically, as shown in Figures 9 and 10, the negative pressure liquid cooling distribution unit 10 may include a first liquid tank 11, a second liquid tank 12, a negative pressure generating device 20, and a circulating pump 13. The outlet of the second liquid tank 12 is the outlet of the negative pressure liquid cooling distribution unit 10, and the inlet of the first liquid tank 11 is the return end of the negative pressure liquid cooling distribution unit 10. The negative pressure generating device 20 is connected to the first liquid tank 11 and the second liquid tank 12. The negative pressure generating device 20 is configured to make the absolute pressure in the first liquid tank 11 and the absolute pressure in the second liquid tank 12 less than atmospheric pressure. The negative pressure liquid cooling distribution unit 10 has a first state. In the first state, the first... The absolute pressure of liquid tank 11 and the absolute pressure of the second liquid tank 12 are both less than atmospheric pressure, and the absolute pressure in the second liquid tank 12 is greater than the absolute pressure in the first liquid tank 11. This allows the cooling medium in the second liquid tank 12 to flow out of the second liquid tank 12 through the inlet pipe 60 under the pressure difference between the first liquid tank 11 and the second liquid tank 12, and return to the first liquid tank 11 through the outlet pipe 70. The inlet of the circulation pump 13 is connected to the outlet of the first liquid tank 11, and the outlet of the circulation pump 13 is connected to the inlet of the second liquid tank 12. The circulation pump 13 is used to pump the cooling medium in the first liquid tank 11 to the second liquid tank 12.

[0082] Thus, because the negative pressure generating device 20 can make the absolute pressure of both the first liquid tank 11 and the second liquid tank 12 less than atmospheric pressure (i.e., both the first liquid tank 11 and the second liquid tank 12 are under negative pressure), and the absolute pressure in the second liquid tank 12 is greater than the absolute pressure in the first liquid tank 11, the negative pressure liquid cooling distribution unit 10 can be in the first state. Under the action of the pressure difference between the first liquid tank 11 and the second liquid tank 12 (which can be understood as the suction force of the first liquid tank 11 on the cooling medium being greater than that of the second liquid tank 12), the cooling medium can flow out from the second liquid tank 12 and flow into the immersion chamber 41 through the liquid inlet pipe 60. After exchanging heat with the server node 50, it flows back to the first liquid tank 11 through the liquid outlet pipe 70, thereby achieving heat dissipation and cooling of the server node 50. Since the absolute pressure in the second liquid tank 12 is greater than the absolute pressure in the first liquid tank 11, the circulation pump 13 can provide driving force to overcome the pressure difference between the second liquid tank 12 and the first liquid tank 11, pumping the cooling medium in the first liquid tank 11 into the second liquid tank 12. In this way, the cooling medium is circulated between the negative pressure liquid cooling distribution unit 10 and the server node 50 cooling structure, namely, the inlet pipe 60, the immersion chamber 41 and the outlet pipe 70.

[0083] In other words, this disclosure achieves the flow of the cooling medium between the second liquid tank 12, the cooling structure of the server node 50 (i.e., the inlet pipe 60, the immersion chamber 41, and the outlet pipe 70, etc.), and the first liquid tank 11 by creating a pressure difference between the first liquid tank 11 and the second liquid tank 12. The flow of the cooling medium between the first liquid tank 11 and the second liquid tank 12 is achieved through the circulation pump 13, ultimately realizing the circulation of the cooling medium between the negative pressure liquid cooling distribution unit 10 and the cooling structure of the server node 50. This disclosure does not require switching the pressure between the first liquid tank 11 and the second liquid tank 12 during the circulation of the cooling medium between the negative pressure liquid cooling distribution unit 10 and the cooling structure of the server node 50; it only requires ensuring that the absolute pressure in the second liquid tank 12 is greater than the absolute pressure in the first liquid tank 11, and that the circulation pump 13 is activated. In this way, on the one hand, the number of valves in the negative pressure liquid cooling distribution unit 10 can be reduced, simplifying the structural complexity of the negative pressure liquid cooling distribution unit 10, thereby reducing manufacturing costs and improving system reliability; on the other hand, the increase in energy consumption, control costs and difficulty caused by frequent switching of the pressure of the first liquid tank 11 and the second liquid tank 12 can be reduced; furthermore, since the pressure of the first liquid tank 11 and the second liquid tank 12 does not need to be switched frequently, the pressure fluctuation of the cooling medium is small, which is conducive to improving the heat dissipation effect on the server node 50.

[0084] Furthermore, since the negative pressure generating device 20 can make the absolute pressure of both the first liquid tank 11 and the second liquid tank 12 less than atmospheric pressure, the absolute pressure of the inlet pipe 60, the outlet pipe 70, and the immersion chamber 41 can also be less than atmospheric pressure, i.e., in a negative pressure state. Even if any one of the inlet pipe 60, the outlet pipe 70, and the immersion chamber 41 is damaged, the cooling medium will not leak into the external environment under the action of negative pressure.

[0085] It should be noted that when the negative pressure generating device 20 makes the absolute pressure of the first liquid tank 11 and the absolute pressure of the second liquid tank 12 both less than atmospheric pressure, and the absolute pressure in the second liquid tank 12 is greater than the absolute pressure in the first liquid tank 11, the state of the negative pressure liquid cooling distribution unit 10 is the first state mentioned above. After the negative pressure liquid cooling distribution unit 10 is in the first state, the negative pressure generating device 20 can continue to operate for a certain period of time to maintain the absolute pressure of the first liquid tank 11 and the absolute pressure of the second liquid tank 12 within a certain range. The negative pressure generating device 20 may also not operate, and this disclosure does not limit it in this way.

[0086] Furthermore, in the first state, even if the circulating pump 13 can pump the cooling medium in the first liquid tank 11 to the second liquid tank 12, the circulating pump 13 will not change the pressure relationship between the first liquid tank 11 and the second liquid tank 12. That is, while pumping the cooling medium, the circulating pump 13 ensures that the absolute pressure of the first liquid tank 11 and the absolute pressure of the second liquid tank 12 are both less than atmospheric pressure, and the absolute pressure in the second liquid tank 12 is greater than the absolute pressure in the first liquid tank 11.

[0087] The negative pressure liquid cooling distribution unit 10 provided in this disclosure can have multiple working states, and is not limited to the first state described above. For example, the negative pressure liquid cooling distribution unit 10 also has a second state. In the second state, the absolute pressure in the first liquid tank 11 is less than the atmospheric pressure, and the absolute pressure in the second liquid tank 12 can be greater than or equal to the atmospheric pressure under the action of the circulating pump 13, so that the cooling medium in the second liquid tank 12 can flow out of the second liquid tank 12 through the inlet pipe 60 under the action of the pressure difference between the first liquid tank 11 and the second liquid tank 12, and return to the first liquid tank 11 through the outlet pipe 70.

[0088] In other words, by controlling the circulating pump 13, the absolute pressure in the second liquid tank 12 can be made greater than or equal to atmospheric pressure. Since the absolute pressure in the second liquid tank 12 is greater than or equal to atmospheric pressure, while the absolute pressure in the first liquid tank 11 is less than atmospheric pressure, the absolute pressure in the second liquid tank 12 remains greater than that in the first liquid tank 11. Therefore, a pressure difference still exists between the first liquid tank 11 and the second liquid tank 12. The cooling medium in the second liquid tank 12 can flow out of the second liquid tank 12 under the pressure difference between the first liquid tank 11 and the second liquid tank 12, and return to the first liquid tank 11 after flowing through the inlet pipe 60, the immersion chamber 41, and the outlet pipe 70. In the second state, the second liquid tank 12 squeezes the cooling medium outward, causing it to flow out of the second liquid tank 12, while the first liquid tank 11 is under negative pressure, drawing in the cooling medium and causing it to return to the first liquid tank 11.

[0089] Furthermore, since the absolute value of the pressure difference between the first liquid tank 11 and the second liquid tank 12 in the second state is greater than the absolute value of the pressure difference between the first liquid tank 11 and the second liquid tank 12 in the first state, the flow velocity of the cooling medium between the first liquid tank 11 and the second liquid tank 12 can be increased, thereby increasing the heat dissipation effect on the server node 50.

[0090] Here, it is understandable that, since an inlet pipe 60 is provided between the second liquid tank 12 and the immersion chamber 41, and the inlet pipe 60, which has a certain length, has a certain flow resistance, a certain pressure drop will occur in the cooling medium. Therefore, the absolute pressure in the inlet pipe 60 may be greater than or equal to atmospheric pressure, or it may be less than atmospheric pressure. However, regardless of whether the absolute pressure in the inlet pipe 60 is positive or negative, since the pressure in the outlet pipe 70 is always negative, the outlet pipe 70 can always play a role in absorbing the cooling medium, and the cooling medium will not leak from the inlet pipe 60, the immersion chamber 41, or the outlet pipe 70 to the outside.

[0091] Optionally, as shown in Figures 9 and 10, a first vent valve 14 is provided on the top of the first liquid tank 11, which can selectively connect the outside atmosphere with the interior of the first liquid tank 11. A second vent valve 15 is provided on the top of the second liquid tank 12, which can selectively connect the outside atmosphere with the interior of the second liquid tank 12. Through the first vent valve 14 and the second vent valve 15, the interior of the first liquid tank 11 and / or the interior of the second liquid tank 12 can be connected to the outside atmosphere, thereby making the absolute pressure in the first liquid tank 11 and the second liquid tank 12 equal to the atmospheric pressure, so as to drain the cooling medium in the first liquid tank 11 and the second liquid tank 12 and maintain the first liquid tank 11 and the second liquid tank 12.

[0092] Furthermore, by controlling the first vent valve 14 and the second vent valve 15, the negative pressure liquid cooling distribution unit 10 can also have a third state. In the third state, the absolute pressure in the first liquid tank 11 is less than atmospheric pressure, and the absolute pressure in the second liquid tank 12 can be equal to atmospheric pressure under the action of the second vent valve 15. This allows the cooling medium in the second liquid tank 12 to flow out of the second liquid tank 12 under the pressure difference between the first liquid tank 11 and the second liquid tank 12, and return to the first liquid tank 11 after flowing through the inlet pipe 60, the immersion chamber 41, and the outlet pipe 70. It can be understood that in the third state, the first vent valve 14 is closed so that the absolute pressure in the first liquid tank 11 can be less than atmospheric pressure under the action of the negative pressure generating device 20, and the second vent valve 15 is open to connect the second liquid tank 12 with the outside atmosphere, so that the absolute pressure in the second liquid tank 12 is equal to atmospheric pressure.

[0093] Since the absolute pressure in the second liquid tank 12 is equal to the atmospheric pressure, the absolute pressure in the first liquid tank 11 is less than the atmospheric pressure. The absolute pressure in the second liquid tank 12 is still greater than the absolute pressure in the first liquid tank 11. There is still a pressure difference between the first liquid tank 11 and the second liquid tank 12. The cooling medium in the second liquid tank 12 can flow out of the second liquid tank 12 under the action of the pressure difference between the first liquid tank 11 and the second liquid tank 12, and return to the first liquid tank 11 after flowing through the inlet pipe 60, the immersion chamber 41 and the outlet pipe 70.

[0094] Furthermore, since the absolute value of the pressure difference between the first liquid tank 11 and the second liquid tank 12 is greater than that in the first state in the third state, the flow velocity of the cooling medium between the first liquid tank 11 and the second liquid tank 12 can be increased, thereby increasing the heat dissipation effect on the server node 50.

[0095] Furthermore, when it is necessary to adjust the absolute pressure in the second liquid tank 12 from less than atmospheric pressure to greater than atmospheric pressure (i.e., when switching from the first state to the second state), the second vent valve 15 can be opened first to make the absolute pressure in the second liquid tank 12 equal to the atmospheric pressure, and then the second vent valve 15 can be closed to increase the head of the circulating pump 13, thereby quickly adjusting the absolute pressure in the second liquid tank 12 to greater than atmospheric pressure.

[0096] When the cooling medium flows through the immersion chamber 41, it can absorb the heat of the server node 50. In order for the negative pressure liquid cooling distribution unit 10 to cool the cooling medium flowing back to the negative pressure liquid cooling distribution unit 10, the negative pressure liquid cooling distribution unit 10 may optionally include a heat exchanger 16. The heat exchanger 16 may be located upstream of the first liquid tank 11 (i.e., upstream of the liquid inlet of the first liquid tank 11) or downstream of the second liquid tank 12 (i.e., downstream of the liquid outlet of the second liquid tank 12). This disclosure does not limit this.

[0097] In one embodiment provided in this disclosure, as shown in Figures 9 and 10, the negative pressure liquid cooling distribution unit 10 further includes a heat exchanger 16. The outlet of the circulating pump 13 is connected to the first inlet of the heat exchanger 16, the first outlet of the heat exchanger 16 is connected to the inlet of the second liquid tank 12, the second inlet of the heat exchanger 16 is connected to the outlet of the heat dissipation device, and the second outlet of the heat exchanger 16 is connected to the inlet of the heat dissipation device, so that the cooling medium flowing into the heat exchanger 16 from the heat dissipation device can absorb the heat of the cooling medium flowing into the heat exchanger 16 from the circulating pump 13. In other words, the heat exchanger 16 is located between the first liquid tank 11 and the second liquid tank 12. The cooling medium flowing out of the first liquid tank 11 after heat exchange can flow through the heat exchanger 16 under the action of the circulating pump 13, and then flow back to the second liquid tank 12 after heat exchange in the heat exchanger 16. In this way, on the one hand, the temperature of the cooling medium flowing back into the second liquid tank 12 can be reduced, so that the cooling medium flowing from the second liquid tank 12 to the immersion chamber 41 has a lower temperature, thereby dissipating heat from the server node 50. On the other hand, the location of the heat exchanger 16 between the first liquid tank 11 and the second liquid tank 12 can prevent the heat exchanger 16 from reducing the pressure or flow rate of the cooling medium flowing from the second liquid tank 12 to the immersion chamber 41, or reducing the pressure or flow rate of the cooling medium flowing from the immersion chamber 41 to the first liquid tank 11.

[0098] It should be noted that this disclosure does not limit the specific type of the heat dissipation device. The heat dissipation device can be any heat dissipation device suitable for dissipating heat from the cooling medium. For example, the heat dissipation device can be a cooling tower, or it can be a dry cooler, a water chiller, an evaporator, a radiator, etc.

[0099] To facilitate the discharge of cooling medium from the first liquid tank 11 and the second liquid tank 12, optionally, as shown in Figures 9 and 10, a first switching valve 17 is provided at the bottom of the first liquid tank 11, and a second switching valve 18 is provided at the bottom of the second liquid tank 12. Thus, by simply opening the first switching valve 17 and / or the second switching valve 18, the cooling medium in the first liquid tank 11 and / or the second liquid tank 12 can be connected to the outside, thereby achieving the discharge of the cooling medium.

[0100] Furthermore, since the first switching valve 17 and the second switching valve 18 are respectively located at the bottom of the first liquid tank 11 and the second liquid tank 12, there is no need to set up a liquid extraction structure (such as a pump) during the process of the first liquid tank 11 and / or the second liquid tank 12 discharging the cooling medium. The cooling medium can be discharged from the first liquid tank 11 and / or the second liquid tank 12 under its own gravity. This helps to further simplify the structure of the negative pressure liquid cooling distribution unit 10 and reduce the cost of the negative pressure liquid cooling distribution unit 10.

[0101] To ensure that the absolute pressure inside the first liquid tank 11 and the second liquid tank 12 is less than atmospheric pressure, optionally, as shown in Figures 9 and 10, the negative pressure generating device 20 includes a vacuum pump 21, with both the first liquid tank 11 and the second liquid tank 12 connected to the suction port of the vacuum pump 21. The vacuum pump 21 can extract air from the first liquid tank 11 and the second liquid tank 12, thereby reducing the absolute pressure inside the first liquid tank 11 and the second liquid tank 12.

[0102] Furthermore, by controlling the amount of air pumped by the vacuum pump 21 to the first liquid tank 11 and the second liquid tank 12 respectively, the first liquid tank 11 and the second liquid tank 12 can have different absolute pressures, thereby creating a pressure difference between the first liquid tank 11 and the second liquid tank 12, and thus realizing the circulation of the cooling medium.

[0103] In the above embodiment, the first liquid tank 11 and the second liquid tank 12 are connected to the same vacuum pump 21. The vacuum pump 21 can adjust the pressure of both the first liquid tank 11 and the second liquid tank 12, which can simplify the structure of the negative pressure liquid cooling distribution unit 10 and reduce the manufacturing cost.

[0104] To facilitate connection between the first liquid tank 11 and the second liquid tank 12 and the vacuum pump 21, optionally, as shown in Figures 9 and 10, the first liquid tank 11 is connected to the vacuum pump 21's suction port via a first suction pipe 22, and the second liquid tank 12 is connected to the vacuum pump 21's suction port via a second suction pipe 23. A first switching valve 17 is provided on the first suction pipe 22, and a second switching valve 18 is provided on the second suction pipe 23. Since the first switching valve 17 and the second switching valve 18 are respectively provided on the first suction pipe 22 and the second suction pipe 23, the first switching valve 17 and the second switching valve 18 can open or close the first suction pipe 22 and the second suction pipe 23 respectively. Thus, the vacuum pump 21 can selectively connect to the first liquid tank 11 and the second liquid tank 12.

[0105] For example, when both the first switching valve 17 and the second switching valve 18 are open, the vacuum pump 21 can simultaneously evacuate the first liquid tank 11 and the second liquid tank 12, thereby changing the absolute pressure within the first liquid tank 11 and the second liquid tank 12. When one of the first switching valves 17 and the second switching valve 18 is open and the other is closed, one of the first liquid tank 11 and the second liquid tank 12 can be evacuated by the vacuum pump 21, while the other is unaffected. When both the first switching valves 17 and the second switching valve 18 are closed, the vacuum pump 21 cannot evacuate the first liquid tank 11 and the second liquid tank 12, and the absolute pressure within the first liquid tank 11 and the second liquid tank 12 can remain constant, thereby achieving a stable circulation of the cooling medium.

[0106] In the negative pressure liquid cooling distribution unit 10 provided in this disclosure, the first liquid tank 11 and the second liquid tank 12 can both be connected to the same vacuum pump 21 as described in the above embodiments, or the first liquid tank 11 and the second liquid tank 12 can be connected to different vacuum pumps 21, which is not limited in this disclosure. Optionally, as shown in Figures 9 and 10, the negative pressure generating device 20 includes a first vacuum pump 26 and a second vacuum pump 27. The suction port of the first vacuum pump 26 is connected to the first liquid tank 11, and the suction port of the second vacuum pump 27 is connected to the second liquid tank 12. In other words, the first liquid tank 11 and the second liquid tank 12 are respectively connected to different vacuum pumps 21. Different vacuum pumps 21 can evacuate the first liquid tank 11 and the second liquid tank 12 respectively, thereby reducing the control requirements of the vacuum pumps 21 and facilitating the separate evacuation of the first liquid tank 11 and the second liquid tank 12, and making the first liquid tank 11 and the second liquid tank 12 have different absolute pressures.

[0107] To facilitate connection between the first liquid tank 11 and the first vacuum pump 26, optionally, as shown in Figures 9 and 10, the first liquid tank 11 is connected to the suction port of the first vacuum pump 26 via a first suction pipe 22, and a third switching valve 24 is provided on the first suction pipe 22. The first suction pipe 22 enables the connection between the first liquid tank 11 and the first vacuum pump 26, thereby facilitating the vacuum pump 21 to evacuate the first liquid tank 11.

[0108] Furthermore, since a third switching valve 24 is provided on the first suction pipe 22, the third switching valve 24 can open or close the first suction pipe 22. On the one hand, the vacuum pump 21 does not need to be in a constant operating state, as the third switching valve 24 can close the first suction pipe 22, effectively avoiding the situation where the vacuum pump 21 is always in a constant operating state, resulting in high energy consumption and easy damage to the vacuum pump 21. On the other hand, it can also prevent the vacuum pump 21 from leaking air, causing changes in the absolute pressure in the first liquid tank 11, which would affect the normal use of the negative pressure liquid cooling distribution unit 10.

[0109] To facilitate connection between the second liquid tank 12 and the second vacuum pump 27, optionally, as shown in Figures 9 and 10, the second liquid tank 12 is connected to the suction port of the second vacuum pump 27 via a second suction pipe 23, and a fourth switching valve 25 is provided on the second suction pipe 23. The second suction pipe 23 enables the connection between the second liquid tank 12 and the second vacuum pump 27, thereby facilitating the vacuum pump 21 to evacuate the second liquid tank 12.

[0110] Furthermore, since a fourth switching valve 25 is provided on the second suction pipe 23, the fourth switching valve 25 can open or close the second suction pipe 23. On the one hand, the fourth switching valve 25 can close the second suction pipe 23 without the vacuum pump 21 being in constant operation, effectively avoiding the situation where the vacuum pump 21 is always in operation, resulting in high energy consumption and easy damage to the vacuum pump 21. On the other hand, it can also prevent the vacuum pump 21 from leaking air, causing changes in the absolute pressure in the second liquid tank 12, which would affect the normal use of the negative pressure liquid cooling distribution unit 10.

[0111] A second aspect of this disclosure provides a data center including the server assembly 200 as described above.

[0112] This data center has all the beneficial effects of the aforementioned server assembly 200, which will not be elaborated here.

[0113] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0114] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0115] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A server assembly, comprising a cabinet, server nodes, liquid inlet pipes, liquid outlet pipes, and a negative pressure liquid cooling distribution unit; The cabinet has an immersion chamber for containing a cooling medium, and the server nodes are disposed in the immersion chamber and at least partially immersed in the cooling medium so that the cooling medium can absorb the heat of the server nodes. The liquid outlet of the negative pressure liquid cooling distribution unit is connected to the immersion chamber through the liquid inlet pipe, and the immersion chamber is connected to the liquid return end of the negative pressure liquid cooling distribution unit through the liquid outlet pipe. The negative pressure liquid cooling distribution unit is configured such that the absolute pressure in the liquid outlet pipe is less than the atmospheric pressure, and the absolute pressure in the liquid inlet pipe is greater than the absolute pressure in the liquid outlet pipe.

2. The server assembly according to claim 1, wherein, The server node includes a housing and a plurality of electrical components disposed within the housing. The plurality of electrical components include at least one device to be cooled. The liquid inlet pipe has a liquid distribution section disposed within the immersion chamber and located above the server node. The liquid distribution section is in communication with the immersion chamber. The server node also includes a drainage pipe corresponding to the heat dissipation device. The first end of the drainage pipe is connected to the liquid distribution section, and the second end of the drainage pipe passes through the outer shell and extends toward the heat dissipation device to guide the cooling medium to the heat dissipation device. The outer shell has a discharge hole that communicates with the immersion chamber.

3. The server assembly according to claim 2, wherein, The second end of the drain pipe faces the device to be cooled, so that the cooling medium flowing out of the drain pipe can flow through the device to be cooled; or... The server node also includes a heat dissipation shroud, which covers the device to be cooled. One side of the shroud has a liquid inlet, and the other side is open. The second end of the drainage tube is connected to the liquid inlet, and the liquid inlet communicates with the interior of the shroud. Alternatively... The server node also includes a cold plate, which covers the device to be cooled and makes thermal contact with the device. One side of the cold plate is provided with a liquid inlet, and the other side of the cold plate is formed as an open end. The cold plate is provided with multiple channels for the cooling medium to flow through. One end of the multiple channels is connected to the liquid inlet, and the other end of the multiple channels is connected to the open end.

4. The server assembly according to claim 2, wherein, The liquid separation section is provided with a docking interface, which is adapted to be sleeved with the first end of the drainage tube.

5. The server assembly according to claim 1, wherein, The cabinet includes a cabinet body and an insertion shell. The cabinet body is provided with a first receiving slot. The insertion shell can be inserted into or removed from the first receiving slot through the slot opening of the first receiving slot. The interior of the insertion shell is the immersion cavity.

6. The server assembly according to claim 5, wherein, The insertion shell includes a shell body and a sealing plate. The shell body has an opening through which the server node can pass, and the sealing plate can cover or expose the opening.

7. The server assembly according to claim 6, wherein, A sealing ring is provided between the sealing plate and the shell body.

8. The server assembly according to claim 5, wherein, The insertion shell is provided with a wire-passing hole for the server node's wire harness to pass through. A sealing plug is provided at the wire-passing hole to seal the gap between the wire-passing hole and the wire harness.

9. The server assembly according to any one of claims 1-8, wherein, The inlet pipe is connected to the top of the immersion chamber, and the outlet pipe is connected to the bottom of the immersion chamber.

10. The server assembly according to any one of claims 1-8, wherein, The inlet pipe is equipped with a first switching valve, and the outlet pipe is equipped with a second switching valve.

11. The server assembly according to any one of claims 1-8, wherein, The server assembly also includes a return air pipe located within the immersion chamber and extending vertically along the immersion chamber. The upper end of the return air pipe is connected to the immersion chamber, and the lower end of the return air pipe is connected to the negative pressure liquid cooling distribution unit. The negative pressure liquid cooling distribution unit is configured to ensure that the absolute pressure within the return air pipe is less than atmospheric pressure.

12. The server assembly according to any one of claims 1-8, characterized in that, The immersion chambers are multiple, and the multiple immersion chambers are arranged at intervals along the vertical direction of the cabinet. Each immersion chamber is provided with a liquid inlet pipe and a liquid outlet pipe. There are multiple server nodes, and each server node is set up in a corresponding immersion chamber. Each server node is set up in a corresponding immersion chamber.

13. The server assembly according to claim 12, wherein, The server assembly also includes a distribution pipe and a manifold, both of which extend in the vertical direction. The upper end or lower end of the distribution pipe is connected to the liquid outlet of the negative pressure liquid cooling distribution unit. One end of each of the plurality of liquid inlet pipes is connected to the distribution pipe. The upper end or lower end of the manifold is connected to the liquid inlet of the negative pressure liquid cooling distribution unit. One end of each of the plurality of liquid outlet pipes is connected to the manifold.

14. The server assembly according to any one of claims 1-8, wherein, The cabinet is provided with a second receiving slot, through which the negative pressure liquid cooling distribution unit can be inserted into or removed from the receiving slot; or... There are multiple cabinets, and the negative pressure liquid cooling distribution unit is located outside the cabinet. The liquid inlet pipe and the liquid outlet pipe corresponding to each cabinet are connected to the negative pressure liquid cooling distribution unit.

15. The server assembly according to any one of claims 1-8, wherein, The negative pressure liquid cooling distribution unit includes a first liquid tank, a second liquid tank, a negative pressure generating device, and a circulating pump; The outlet of the second liquid tank is the outlet of the negative pressure liquid cooling distribution unit, and the inlet of the first liquid tank is the return end of the negative pressure liquid cooling distribution unit. The negative pressure generating device is connected to the first liquid tank and the second liquid tank. The negative pressure generating device is configured to make the absolute pressure in the first liquid tank and the absolute pressure in the second liquid tank less than atmospheric pressure. The negative pressure liquid cooling distribution unit has a first state. In the first state, the absolute pressure in the first liquid tank and the absolute pressure in the second liquid tank are both less than atmospheric pressure, and the absolute pressure in the second liquid tank is greater than the absolute pressure in the first liquid tank. This allows the cooling medium in the second liquid tank to flow out of the second liquid tank through the inlet pipe under the pressure difference between the first liquid tank and the second liquid tank, and return to the first liquid tank through the outlet pipe. The inlet of the circulating pump is connected to the outlet of the first liquid tank, and the outlet of the circulating pump is connected to the inlet of the second liquid tank. The circulating pump is used to pump the cooling medium in the first liquid tank to the second liquid tank.

16. The server assembly according to claim 15, wherein, The negative pressure liquid cooling distribution unit also has a second state. In the second state, the absolute pressure in the first liquid tank is less than the atmospheric pressure, and the absolute pressure in the second liquid tank can be greater than or equal to the atmospheric pressure under the action of the circulating pump, so that the cooling medium in the second liquid tank can flow out of the second liquid tank through the inlet pipe under the action of the pressure difference between the first liquid tank and the second liquid tank, and return to the first liquid tank through the outlet pipe.

17. The server assembly according to claim 15, wherein, The first liquid tank is provided with a first vent valve at the top, and the second liquid tank is provided with a second vent valve at the top. The negative pressure liquid cooling distribution unit also has a third state, in which the absolute pressure in the first liquid tank is less than the atmospheric pressure, and the absolute pressure in the second liquid tank can be equal to the atmospheric pressure under the action of the second vent valve, so that the cooling medium in the second liquid tank can flow out of the second liquid tank through the inlet pipe under the action of the pressure difference between the first liquid tank and the second liquid tank, and return to the first liquid tank through the outlet pipe.

18. The server assembly according to claim 15, wherein, The negative pressure liquid cooling distribution unit also includes a heat exchanger. The outlet of the circulating pump is connected to the first inlet of the heat exchanger, the first outlet of the heat exchanger is connected to the inlet of the second liquid tank, and the second inlet and the second outlet of the heat exchanger are used to connect to a heat dissipation device so that the cooling medium flowing into the heat exchanger from the heat dissipation device can absorb the heat of the cooling medium flowing into the heat exchanger from the circulating pump.

19. A data center comprising the server assembly of any one of claims 1-18.