Cooling device and power conversion apparatus

Abstract

A cooling device and a power conversion apparatus. The cooling device comprises: a main board, which is configured to be connected to a first component; and a cooling plate, which comprises a plurality of plate bodies, wherein the plurality of plate bodies form a medium flow channel by means of enclosing, at least one plate body is a first plate body, and the side of the first plate body facing away from the medium flow channel is connected to the main board.

Description

Cooling devices and power conversion equipment

[0001] This disclosure claims priority to Chinese Patent Application No. 202510369548.1, filed on March 25, 2025, entitled "Cooling Device and Power Conversion Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to a cooling device and a power conversion device. Background Technology

[0003] With the rise of new energy industries such as photovoltaics, wind power, and energy storage, the related electrical equipment is constantly iterating towards higher power and integration. During the operation of electrical equipment, the heat generated by heat-generating devices increases, and the heat dissipation requirements of power devices are constantly increasing. This has led to the development of devices used for equipment heat dissipation towards higher efficiency and more compact structures.

[0004] In order to fix the heat-generating device to the heat sink, connection points for the heat-generating device are pre-arranged on the heat sink. These connection points can easily affect the structure of the heat sink itself. Summary of the Invention

[0005] The following is an overview of the detailed description of this disclosure. This overview is not intended to limit the scope of the claims.

[0006] In a first aspect, embodiments of this disclosure provide a cooling device, comprising:

[0007] The motherboard is configured to connect to the first component.

[0008] The cooling plate includes multiple plates that enclose a medium flow channel. At least one plate is a first plate, and the side of the first plate facing away from the medium flow channel is connected to the main board.

[0009] In some embodiments, the motherboard is provided with a first through hole, which is disposed opposite to a first component.

[0010] In some embodiments, the first plate is provided with a second through hole communicating with the medium flow channel, a portion of the first component passes through the first through hole and the second through hole and is located in the medium flow channel, and the first component is sealed to the second through hole.

[0011] In some embodiments, the first plate is provided with a heat-conducting portion, and at least a portion of the heat-conducting portion is disposed opposite to the first component in a first direction, the first direction being the thickness direction of the first plate.

[0012] In some embodiments, at least a portion of the heat-conducting portion is located within the first through-hole and abuts against the first component.

[0013] In some embodiments, the heat-conducting part is provided with a heat-conducting channel and a plurality of openings communicating with the heat-conducting channel, the plurality of openings communicating with the medium channel.

[0014] In some embodiments, at least one opening is an input port and at least another opening is an output port.

[0015] In some embodiments, the heat-conducting part includes a first enclosure plate, a second enclosure plate, and a third enclosure plate arranged sequentially and connected to each other along the thickness direction of the cooling plate, a plurality of openings are provided in the first enclosure plate, and two adjacent openings are spaced apart, and a heat-conducting channel is provided in the second enclosure plate.

[0016] In some embodiments, the first enclosure plate is provided with a first nozzle, which is connected to a heat conduction channel and a medium channel respectively, and at least one opening is an output port.

[0017] In some embodiments, the heat-conducting part further includes a fourth enclosure plate and a fifth enclosure plate connected to each other, the fourth enclosure plate being connected to the first enclosure plate, and the fourth enclosure plate being provided with a first channel and a second channel;

[0018] The fifth enclosure plate is connected to the second enclosure plate. The fifth enclosure plate is provided with a second nozzle and a third channel. The second nozzle is connected to the first channel and the heat conduction channel, and the third channel is connected to the second channel and the medium channel.

[0019] At least one opening is connected to the first channel and is an input port; at least one opening is connected to the second channel and is an output port.

[0020] In some embodiments, the number of second channels and third channels is provided in multiples, with multiple second channels distributed on both sides of the first channel and each second channel connected to an output port, and multiple third channels distributed on both sides of the second nozzle and each third channel connected to a second channel.

[0021] In some embodiments, the number of second nozzles is provided to be multiple, and the second nozzles and the first component are distributed relative to each other in a first direction.

[0022] In some embodiments, the inner diameter of at least one second nozzle is smaller than the inner diameter of the remaining second nozzles.

[0023] In some embodiments, at least two adjacent enclosure plates of the first enclosure plate, second enclosure plate, third enclosure plate, fourth enclosure plate and fifth enclosure plate are integrally formed.

[0024] In some embodiments, a heat-conducting module is provided on the side of the third enclosure plate facing the heat-conducting flow channel.

[0025] In some embodiments, the medium flow channel includes a first flow channel and a second flow channel, the pressure in the first flow channel is different from the pressure in the second flow channel, and the first flow channel and the second flow channel are each connected to an opening.

[0026] In some embodiments, the motherboard is further configured to connect to a second component, and a third through hole is provided on the motherboard, through which the second component abuts against the first board body;

[0027] Alternatively, a heat-conducting layer is provided on the first plate, at least a portion of which is located within the third through hole and abuts against the second component.

[0028] In some embodiments, the cooling device further includes a plurality of fixing posts disposed on the motherboard and connected to at least one of the first component and the second component.

[0029] In some embodiments, the cooling device further includes a plurality of fixing posts disposed on the first plate, the fixing posts passing through the main plate in a first direction and connected to at least one of the first component and the second component.

[0030] Secondly, embodiments of this disclosure also provide a power conversion device, which includes any of the cooling devices described above.

[0031] In some embodiments, the power conversion device further includes an electrical box having a receiving cavity and a cooling device disposed inside the electrical box.

[0032] In some embodiments, the power conversion device further includes an electrical box having a receiving cavity and a first opening and a second opening communicating with the receiving cavity. The first opening and the second opening are disposed opposite to each other, or the first opening and the second opening are disposed adjacent to each other. A cooling device is disposed in the second opening and connected to the electrical box.

[0033] In some embodiments, the power conversion device further includes a PCB board disposed on the side of at least one of the first component and the second component away from the cooling plate.

[0034] Other features and advantages of this disclosure will be described in detail in the following detailed description section.

[0035] Brief description of the attached figures

[0036] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 is a schematic diagram of the cooling device provided in an embodiment of this disclosure;

[0038] Figure 2 is a schematic diagram of the structure of the first plate and the second plate provided in the embodiment of this disclosure;

[0039] Figure 3 is a schematic diagram of the structure of the first through hole provided in an embodiment of this disclosure;

[0040] Figure 4 is a schematic diagram of the structure of the heat-conducting part provided in an embodiment of this disclosure;

[0041] Figure 5 is a schematic diagram of the structure of the first component and the dielectric flow channel provided in the embodiment of this disclosure;

[0042] Figure 6 is a schematic diagram of the heat conduction channel provided in an embodiment of this disclosure;

[0043] Figure 7 is another structural schematic diagram of the heat conduction channel provided in an embodiment of this disclosure;

[0044] Figure 8 is a schematic diagram of the structure of the medium flow channel provided in an embodiment of this disclosure;

[0045] Figure 9 is another structural schematic diagram of the medium flow channel provided in an embodiment of this disclosure;

[0046] Figure 10 is a structural schematic diagram of the first enclosure plate, the second enclosure plate, and the third enclosure plate provided in an embodiment of this disclosure;

[0047] Figure 11 is a schematic diagram of the structure of the first nozzle and the output port provided in an embodiment of this disclosure;

[0048] Figure 12 is a schematic diagram of the structure of the first nozzle and multiple output ports provided in an embodiment of this disclosure;

[0049] Figure 13 is a structural schematic diagram of the fourth and fifth enclosing plates provided in the embodiments of this disclosure;

[0050] Figure 14 is another structural schematic diagram of the heat-conducting part provided in an embodiment of this disclosure;

[0051] Figure 15 is a schematic diagram of the second component and the third through hole provided in an embodiment of this disclosure;

[0052] Figure 16 is a structural schematic diagram of the electrical box and cooling device provided in an embodiment of this disclosure;

[0053] Figure 17 is another structural schematic diagram of the electrical box and cooling device provided in an embodiment of this disclosure.

[0054] Explanation of reference numerals in the attached figures:

[0055] 11. Main board; 110. First through hole; 111. Third through hole; 12. Fixing post; 13. Thermal conductive layer; 21. Cooling plate; 210. Medium flow channel; 2101. First flow channel; 2102. Second flow channel; 211. Plate body; 2111. First plate body; 2112. Second plate body; 213. Second through hole; 22. Thermal conductive part; 221. Thermal conductive flow channel; 222. Opening; 2221. Inlet; 2222. Outlet; 223. The... 1. Enclosure plate; 2231. First nozzle; 224. Second enclosure plate; 225. Third enclosure plate; 2251. Heat conduction module; 226. Fourth enclosure plate; 2261. First channel; 2262. Second channel; 227. Fifth enclosure plate; 2271. Second nozzle; 2272. Third channel; 3. First component; 4. Second component; 5. Electrical box; 50. Receiving cavity; 51. First opening; 52. Second opening; 6. PCB board. Embodiments of the present invention

[0056] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0057] In the description of this disclosure, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this disclosure, "a plurality of" means two or more, unless otherwise explicitly specified.

[0058] Heat sinks for electrical equipment are typically cold plates. These cold plates have internal channels for the flow of cooling media. When electrical equipment is fixed to the cold plate, connection points for the equipment are pre-arranged on the cold plate. These connection points are riveted, which creates through-points on the cold plate. This damages the surface structure of the cold plate, causing localized weaknesses, making it difficult to process and prone to leakage. Furthermore, the through-point riveting affects the internal flow channels of the cold plate, requiring the flow channel design to bypass the through-points, thus increasing the complexity of the flow channel design.

[0059] Referring to Figures 1, 2, and 3, the cooling device of this embodiment includes a main board 11 and a cooling plate 21. The main board 11 is configured to connect to a first component 3, which can be a power module or other component that generates a large amount of heat. To facilitate the fixing of the first component 3, the cooling device also includes multiple fixing posts 12, which are disposed on the main board 11. The fixing posts 12 are riveted or welded to the main board 11. The first component 3 has holes for insertion and engagement with the fixing posts 12, so that the first component 3 can be fixed to the main board 11. Alternatively, the multiple fixing posts 12 are disposed on the cooling plate 21, and the fixing posts 12 penetrate the main board 11 along a direction perpendicular to the cooling plate 21. The fixing posts 12 and the cooling plate 21 can be fixed by riveting or welding. The fixing posts 12 and the main board 11 can also be welded to strengthen the connection between the fixing posts 12. The component 3 has holes for insertion and engagement with the fixing posts 12, so as to fix the first component 3.

[0060] The cooling plate 21 includes multiple plates 211, which enclose a cavity. A medium flow channel 210 is provided inside the cavity. At least one plate 211 is a first plate 2111, and the side of the first plate 2111 facing away from the medium flow channel 210 is connected to the main board 11. The first plate 2111 has a first direction X, which is the thickness direction of the first plate 2111.

[0061] In this embodiment, multiple plates 211 are arranged along the first direction X and overlap each other. At least one plate 211 is a first plate 2111, and at least another plate 211 is a second plate 2112. A cavity is formed between the first plate 2111 and the second plate 2112. One of the first plate 2111 and the second plate 2112 has a protrusion that extends in a direction away from the other. The first plate 2111 and the second plate 2112 are welded together to form a sealed medium flow channel 210 at the protrusion. The protrusion can be formed on the plate 211 by stamping, or by blowing or milling.

[0062] In some other embodiments, one of the first plate 2111 and the second plate 2112 has a recess and the other has a protrusion, the protrusion being inserted into the recess to divide the internal space of the recess into a medium flow channel 210. Alternatively, one of the first plate 2111 and the second plate 2112 has a recess, and the other covers the recess to form a sealed medium flow channel 210.

[0063] Multiple plates 211 can also be distributed in different directions to form a polyhedral structure and form cavities inside. When the fixing column 12 is provided on the cooling plate 21, the fixing column 12 is connected to the first plate 2111 and avoids the medium flow channel 210 to avoid interfering with the medium flow channel 210.

[0064] The medium flow channel 210 is used to supply cooling medium input to absorb the heat generated by the first component 3 during operation and transfer it to the cooling plate 21, thereby achieving heat dissipation for the first component 3. The cooling medium can be air, water, ethylene glycol solution, oil-based coolant, etc.

[0065] The connection between the cooling plate 21 and the motherboard 11 can be a direct connection or an indirect connection. For example, the cooling plate 21 can be soldered to the motherboard 11; the cooling plate 21 can be connected to the motherboard 11 by fasteners; the cooling plate 21 can be attached to the motherboard 11; or the two can be connected by thermal grease, thermal adhesive or thermal pad.

[0066] The motherboard 11 serves to connect the first component 3 and transfer the heat of the first component 3 to the cooling plate 21, thus separating the first component 3 from the cooling plate 21. This avoids the situation where various first components 3 are directly assembled on the cooling plate 21, which protects the integrity of the cooling plate 21 structure and avoids interference with the medium flow channel 210.

[0067] Referring to Figure 3, in some embodiments, the motherboard 11 is provided with a first through hole 110, which is disposed opposite to the first component 3. The first component 3 has an orthographic projection on the motherboard 11 along a first direction X, at least a portion of which covers the first through hole 110. The first component 3 directly or indirectly abuts against the cooling plate 21 through the first through hole 110. In the case of indirect abutment, thermal grease, thermal adhesive, or thermal pads can be provided between the first component 3 and the cooling plate 21 to indirectly conduct heat to meet the requirements of different operating conditions.

[0068] Referring to Figure 5, in some embodiments, the first plate 2111 is provided with a second through hole 213 communicating with the medium flow channel 210. A portion of the first component 3 passes through the first through hole 110 and the second through hole 213 and is located within the medium flow channel 210. The first component 3 is sealed to the second through hole 213. This seal can be achieved by adhesive sealing, such as epoxy resin or silicone sealant, or by welding sealing, for example, by the component having a heat dissipation structure similar to a heat sink, extending the heat dissipation structure into the medium flow channel 210, and fixing the heat dissipation structure to the first plate 2111 by welding or brazing. After passing through the first through hole 110 and the second through hole 213, the first component 3 directly enters the medium flow channel 210, reducing the heat transfer path between the first component 3 and the cooling medium. A portion of the first component 3 is directly immersed in the cooling medium, achieving direct heat exchange with the cooling medium, which helps to improve heat exchange efficiency.

[0069] Referring to Figure 4, in some embodiments, the first plate 2111 is provided with a heat-conducting part 22. In the first direction X, at least a portion of the heat-conducting part 22 is disposed opposite to the first component 3, that is, the orthographic projections of the heat-conducting part 22 and the first component 3 on the same projection plane in the first direction X at least partially overlap, and the heat-conducting part and the first component are distributed on both sides of the first through hole.

[0070] The heat-conducting part 22 has low thermal resistance and can be made of thermal grease, thermal pads, phase change materials, etc. The heat-conducting part 22 can directly contact the first component for heat transfer or indirectly contact it for heat transfer. The heat-conducting part improves the speed and efficiency of heat transfer by reducing the thermal resistance between the first plate 2111 and the main plate 11.

[0071] Referring to Figure 4, in some embodiments, at least a portion of the heat-conducting part 22 is located within the first through-hole 110 and abuts against the first component 3. The heat-conducting part 22 may be partially located within the first through-hole 110, and the first component 3 may also be partially located within the first through-hole 110 and abut against each other; alternatively, the heat-conducting part 22 may be entirely located within the first through-hole 110 and abut against the first component 3; or the heat-conducting part 22 may pass through the first through-hole 110 and abut against the first component 3. In the aforementioned cases, the contact between the heat-conducting part 22 and the first component 3 can be direct heat transfer or indirect heat transfer through thermal grease, thermal adhesive, or a thermal pad.

[0072] The heat-conducting part 22 can be an integrally formed boss on the first plate 2111, or it can be an independent heat-conducting plate or heat spreader plate, which is welded to the first plate 2111. Alternatively, the heat-conducting part 22 can also be formed by filling the first through hole 110 with a semi-solid heat-conducting material. One side of the semi-solid heat-conducting material is in contact with the cooling plate 21, and the other side is in contact with the first component 3. The semi-solid heat-conducting material includes at least one of thermal grease, thermal silicone, and thermal gel.

[0073] On the one hand, the first component 3 can directly transfer heat to the cooling plate 21 through the heat-conducting part 22, shortening the heat conduction path and helping to accelerate the heat dissipation speed of the first component 3. The first component 3 mainly contacts the heat-conducting part 22, and the contact surface between the heat-conducting part 22 and the motherboard 11 is relatively small, so that the heat of the first component 3 is concentrated in the heat-conducting part 22, reducing the impact of heat transfer to other components through the motherboard 11. Due to the presence of the heat-conducting part 22, the need to design the first through hole 110 according to different specifications of the first component 3 is reduced. This helps to reduce the specifications of the motherboard 11, improve processing efficiency, and also takes into account the requirements of the size of the first through hole 110 and the strength of the cooling plate 21.

[0074] On the other hand, the insertion structure between the heat-conducting part 22 and the first through hole 110 restricts the relative displacement between the motherboard 11 and the cooling plate 21, and plays a role in positioning the relative positions of the two.

[0075] In addition, the medium flow channel 210 is welded with a turbulence structure corresponding to the first component 3, such as fins or cylinders. Therefore, when the first plate 2111 and the main board 11 are fully soldered, the first through hole 110 allows the first plate 2111 to be directly exposed in the corresponding part, reducing the interference of the flux between the first plate 2111 and the main board 11 on the welding detection of the turbulence structure.

[0076] In some embodiments, the motherboard 11 is connected to the side of the heat-conducting part 22 away from the cooling plate 21, or a portion of the motherboard 11 is connected to the side of the heat-conducting part 22 away from the cooling plate 21. The heat-conducting part 22 changes the relative position between the first component 3 and the cooling plate 21, which can meet the installation requirements of the first component 3 under different space conditions. At the same time, the high-power first component 3 can be arranged opposite to the heat-conducting part 22, so that the heat of the high-power device is concentrated in the heat-conducting part 22, and then transferred to the cooling medium in the cooling plate 21 by the heat-conducting part 22, reducing the impact on the low-power first component 3.

[0077] Referring to Figures 6 and 7, in some embodiments, the heat-conducting part 22 is provided with a heat-conducting channel 221 and multiple openings 222 communicating with the heat-conducting channel 221, each opening 222 communicating with the medium channel 210. The cooling plate 21 is provided with ports corresponding to the multiple openings 222, and each port is interconnected with its corresponding opening 222. The connected ports and openings 222 are sealed together. The cooling medium in the medium channel 210 enters the heat-conducting channel 221 through the ports and openings 222, directly absorbing the heat transferred by the heat-conducting part 22, thereby accelerating the cooling speed of the first component 3. In other embodiments, the number of openings 222 can also be set to one, sufficient to introduce the cooling medium in the medium channel 210 into the heat-conducting channel 221.

[0078] Referring to Figures 6 and 7 together, in some embodiments, among the plurality of openings 222, at least one opening 222 is an input port 2221, and at least another opening 222 is an output port 2222.

[0079] The inlet 2221 is used to introduce the medium in the medium flow channel 210 into the heat conduction channel 221, and the outlet 2222 is used to return the medium in the heat conduction channel 221 to the medium flow channel 210, so as to realize the flow of the medium in the heat conduction channel 221, reduce the occurrence of dead zones, and thus enhance the heat transfer efficiency. The inlet 2221 and outlet 2222 can be set to correspond to different pressure zones of the medium flow channel 210, so that the flow direction of the medium in the heat conduction channel 221 remains constant. During the flow process, the fluid will encounter resistance (such as frictional resistance, local resistance, etc.), which will cause the pressure to gradually decrease. In the medium flow channel 210, the cooling medium is delivered by a pump, which creates a pressure difference between the upstream and downstream sides. The pressure difference causes the medium in the medium flow channel 210 to flow in fixedly from the inlet 2221 and then flow out through the outlet 2222, realizing the unidirectional flow of the cooling medium in the heat conduction channel 221. This reduces the possibility of backflow and maintains the stability of the cooling medium flow in the heat conduction channel 221, thereby reducing the fluctuation impact on the medium flow channel 210.

[0080] In another implementation, the opening 222 can be configured as a one-way valve structure, or a power drive can be added separately at a specific opening 222.

[0081] Referring to Figures 6 and 8, for example, the medium flow channel 210 includes a first flow channel 2101 and a second flow channel 2102. The pressure in the first flow channel 2101 is different from the pressure in the second flow channel 2102. Each of the first and second flow channels 2101 is connected to an opening 222. The first and second flow channels 2101 are independent of each other. When the pressure in the first flow channel 2101 is greater than the pressure in the second flow channel 2102, the opening 222 connected to the first flow channel 2101 is the inlet 2221, while the opening 222 connected to the second flow channel 2102 is the outlet 2222. The cooling medium in the first flow channel 2101 enters the heat-conducting flow channel 221 through the inlet 2221 and then flows back to the second flow channel 2102 through the outlet 2222. When the pressure in the first flow channel 2101 is less than the pressure in the second flow channel 2102, the opening 222 connected to the first flow channel 2101 is the output port 2222, while the opening 222 connected to the second flow channel 2102 is the input port 2221. At this time, the flow path of the cooling medium is reversed, which will not be described in detail here.

[0082] Referring to Figures 7 and 9, for example, each first flow channel 2101 is provided with a second flow channel 2102 on both sides, and the first flow channel 2101 and the second flow channels 2102 on both sides are independent of each other. At this time, the cooling medium in the first flow channel 2101 enters the heat conduction flow channel 221 through the inlet 2221, and then flows back to the second flow channel 2102 through the two outlets 2222 respectively.

[0083] In some other embodiments, the first flow channel 2101 and the second flow channel 2102 may also be interconnected, and one of the first flow channel 2101 and the second flow channel 2102 is located upstream of the other.

[0084] Referring to Figure 10, in some embodiments, the heat-conducting part 22 includes a first enclosing plate 223, a second enclosing plate 224, and a third enclosing plate 225 arranged sequentially and interconnected along the thickness direction of the cooling plate 21. The first enclosing plate 223 is disposed on the cooling plate 21, and multiple openings 222 are disposed on the first enclosing plate 223, with adjacent openings 222 spaced apart. A heat-conducting channel 221 is disposed on the second enclosing plate 224, and the third enclosing plate 225 covers the heat-conducting channel 221 and is used to cooperate with the first component 3 or the main board 11. The first enclosing plate 223, the second enclosing plate 224, and the third enclosing plate 225 are plate-shaped or sheet-shaped, and can be sealed and fixed to each other by welding or bonding. The heat-conducting part 22 has a layered structure, and the multiple enclosing plates can be replaced individually, increasing interchangeability. The overall thickness of the heat-conducting part 22 can be changed by adjusting the thickness of the enclosing plates, ensuring space for the heat-conducting channel 221 and effective contact between the heat-conducting part 22 and the first component 3. For example, the number of second enclosure plates 224 can be increased, with multiple second enclosure plates 224 arranged between the first enclosure plate 223 and the second enclosure plate 224. The multiple second enclosure plates 224 are stacked in sequence, which increases the space of the heat conduction channel 221, allowing it to accommodate more cooling medium and helping to improve heat exchange efficiency. Alternatively, the size of the second enclosure plates 224 can be increased, which can also expand the space of the heat flow channel. Therefore, the number and size of each enclosure plate can be freely set, and no specific limitation is made here.

[0085] Referring to Figure 11, in some embodiments, the first enclosure plate 223 is provided with a first nozzle 2231, which is connected to the heat conduction channel 221 and the medium channel 210 respectively. At least one opening 222 is an output port 2222, which is connected to the medium channel 210. The portions of the medium channel 210 that are connected to the output port 2222 and the first nozzle 2231 are independent of each other. The first nozzle 2231 and the outlet 2222 are distributed at intervals along the length of the first enclosure plate 223. The first nozzle 2231 and the first component 3 are arranged opposite each other in the first direction X. In the direction perpendicular to the first direction X, the cross-sectional size of the first nozzle 2231 is smaller than the cross-sectional size of the opening 222. When the cooling medium enters the first nozzle 2231, the flow rate of the cooling medium gradually increases due to the decrease in the cross-sectional area of ​​the first nozzle 2231, and a jet is formed and impacts the side of the third enclosure plate 225 facing the heat guide channel 221. The other side of the third enclosure plate 225 is used for direct or indirect contact with the power device for heat dissipation, thereby forming a strong local heat exchange near the impact point and enhancing the heat dissipation effect on the first component 3 mounted on the third enclosure plate 225.

[0086] Referring to Figure 12, in some other embodiments, at least two openings 222 are output ports 2222, and the two output ports 2222 are distributed on both sides of the first nozzle 2231. Increasing the number of output ports 2222 accelerates the return flow of the cooling medium in the heat conduction channel 221 and reduces heat accumulation.

[0087] Referring to Figure 13, in some embodiments, the heat-conducting part 22 further includes a fourth enclosure plate 226 and a fifth enclosure plate 227 connected to each other. The fourth enclosure plate 226 is connected to the first enclosure plate 223, and the fourth enclosure plate 226 is provided with a first channel 2261 and a second channel 2262 arranged at intervals. The size of the first channel 2261 is larger than the size of the second channel 2262. At least one opening 222 is an input port 2221, and the input port 2221 communicates with the first channel 2261; at least one opening 222 is an output port 2222, and the output port 2222 communicates with the second channel 2262.

[0088] The fifth enclosure plate 227 is connected to the second enclosure plate 224. The fifth enclosure plate 227 is provided with a second nozzle 2271 and a third channel 2272 arranged at intervals. The second nozzle 2271 connects the first channel 2261 and the heat conduction channel 221. The axis of the second nozzle 2271 is parallel to the thickness direction of the cooling plate 21, so that the second nozzle 2271 is arranged opposite to the third enclosure plate 225. In the direction perpendicular to the first direction, the cross-sectional dimension of the second nozzle 2271 is smaller than the cross-sectional dimension of the first channel 2261. The third channel 2272 connects the second channel 2262 and the heat conduction channel 221.

[0089] In this embodiment, there is one input port 2221 and one output port 2222. The input port 2221 and the output port 2222 are arranged at intervals along the length of the first enclosure plate 223. In order to make the cooling medium pass through the heat conduction channel 221 constantly, the input port 2221 can be associated with the first channel and the output port 2222 can be associated with the second channel.

[0090] The cooling medium in the medium flow channel 210 enters the first channel 2261 through the inlet 2221, and is then sprayed into the heat conduction channel 221 through the second nozzle 2271. It then flows back into the medium flow channel 210 sequentially through the third channel 2272, the second channel 2262, and the outlet 2222. After entering the second nozzle 2271, the flow velocity gradually increases due to the reduced cross-sectional area of ​​the second nozzle 2271. The cooling medium forms a jet and impacts the side of the third enclosure plate 225 facing the heat conduction channel 221. The other side of the third enclosure plate 225 is used for direct or indirect contact with the power device for heat dissipation, thereby forming a strong local heat exchange near the impact point and enhancing the heat dissipation effect on the first component 3 mounted on the third enclosure plate 225. To ensure the jetting effect of the second nozzle 2271, its size can be reduced, increasing the input pressure of the cooling medium in the medium flow channel 210. Alternatively, the second nozzle 2271 can be configured as a cone or slit; the specific shape and structure of the second nozzle 2271 are not limited. In other embodiments, multiple inlet ports 2221 can be provided to increase the flow rate in the first channel 2261. Since the cross-sectional area of ​​the second nozzle 2271 remains unchanged, the flow velocity of the cooling medium can be increased, which helps maintain the jetting effect of the second nozzle 2271.

[0091] Referring to Figure 14, in some embodiments, multiple second channels 2262 and multiple third channels 2272 are provided. Multiple second channels 2262 are distributed on both sides of the first channel 2261, and each second channel 2262 is connected to an output port 2222. Multiple third channels 2272 are distributed on both sides of the second nozzle 2271, and each third channel 2272 is connected to one second channel 2262, meaning that each third channel 2272 corresponds to one second channel 2262.

[0092] In this embodiment, the number of the second channel 2262 and the third channel 2272 are each set to two, and correspondingly, the number of the output ports 2222 is two, which are distributed on both sides of the input port 2221 along the length direction of the first enclosure plate 223; in order to make the cooling medium pass through the heat conduction channel 221 constantly, the input port 2221 can be connected to the first channel 2101, and each of the two output ports 2222 can be connected to a second channel 2102.

[0093] The cooling medium in the medium flow channel 210 enters the first channel 2261 through the inlet 2221, and is then sprayed into the heat conduction channel 221 through the second nozzle 2271. It is then split through two third channels 2272, and the split cooling medium flows back into the medium flow channel 210 through the second channel 2262 and the outlet 2222. Multiple outlets 2222 accelerate the return flow of the cooling medium in the heat conduction channel 221, preventing the accumulation of heat after heat exchange with the first component 3 within the heat conduction channel 221, which would affect the cooling effect on the first component 3. The cooling medium in the heat conduction channel 221 flows out through multiple openings 222, achieving cooling medium splitting. This allows the cooling medium, after absorbing heat from the first component 3, to be distributed relatively evenly to different areas of the heat conduction channel 221, preventing localized overheating and increasing the uniformity of heat transfer. Due to the splitting of the cooling medium, the flow rate of the cooling medium in a single second channel is reduced, thus reducing its flow resistance and pressure loss, and improving the cooling medium flow efficiency. In addition, the multiple output ports 2222 form a redundant design, so even if one output port 2222 is blocked or malfunctions, the other output ports 2222 can still work normally, which increases the reliability of the cooling device.

[0094] Referring to Figures 13 and 14, in some embodiments, at least two adjacent enclosure plates of the first enclosure plate 223, second enclosure plate 224, third enclosure plate 225, fourth enclosure plate 226, and fifth enclosure plate 227 are integrally formed, or at least two adjacent enclosure plates are welded together. In the case of integral forming, the number of enclosure plates required to form the heat-conducting part 22 is reduced, simplifying the structural design; in the case of welding, each enclosure plate is an independent component, and different flow channel systems can be formed by increasing or decreasing their number, offering high flexibility.

[0095] Referring to Figures 13 and 14, in some embodiments, a heat-conducting module 2251 is provided on the side of the third enclosure plate 225 facing the heat-conducting channel 221. Specifically, the heat-conducting module 2251 is disposed opposite to the second nozzle 2271. The heat-conducting module 2251 can be a pin fin structure, which is a needle-fin structure for heat dissipation or multiple protruding small cylinders that protrude from the third enclosure plate 225 and are in direct contact with the cooling medium. The height of the heat-conducting module 2251 is not greater than the height of the heat-conducting channel 221, thereby increasing the heat transfer efficiency by increasing the surface area between the cooling medium and the third enclosure plate 225. In other embodiments, the heat-conducting module 2251 can also be a finned structure or a cylindrical structure.

[0096] Referring to Figures 9 and 10 together, in some embodiments, the number of second nozzles 2271 is multiple. Multiple second nozzles 2271 can form multiple jets to enhance the heat exchange effect.

[0097] Due to factors such as differences in current density and uneven distribution of power loss, the heat generated by the first component 3 during operation may be unevenly distributed. Therefore, in this embodiment, multiple second nozzles 2271 are set to correspond to the heat-generating areas of the first component 3. That is, more second nozzles 2271 are set in areas with higher heat generation to enhance the local cooling effect and improve the overall heat transfer efficiency. Correspondingly, fewer second nozzles 2271 are set in areas with relatively lower heat generation. By reasonably configuring the number of second nozzles 2271, the full utilization rate of the structure can be increased.

[0098] In other embodiments, multiple second nozzles 2271 can also be evenly distributed on the surface of the first component 3, so that the cooling medium can cover the entire heat-generating area relatively evenly and avoid local overheating. Specifically, it can be set according to the heat zoning of different first components 3.

[0099] Referring to Figures 13 and 14, in some embodiments, the inner diameter of at least one second nozzle 2271 is smaller than the inner diameter of the other second nozzles 2271. The heat generation of the first component 3 may vary in different regions. By differentiating the inner diameters of the second nozzles 2271, the heat dissipation requirements of different regions can be better adapted. For example, a second nozzle 2271 with a relatively smaller inner diameter can generate a high-velocity jet to enhance the impact cooling effect on areas of the first component 3 with relatively high heat generation; a second nozzle 2271 with a relatively larger inner diameter can allow for uniform cooling of low-heat areas. Combining the inner diameter and quantity distribution of the second nozzles 2271 can improve the heat dissipation effect.

[0100] Referring to Figure 15, in some embodiments, the motherboard 11 is also configured to be connected to the second component 4. The motherboard 11 is provided with a third through hole 111. The second component 4 abuts against the first plate 2111 through the third through hole 111, that is, part of the second component 4 is disposed in the third through hole 111 and abuts against the first plate 2111.

[0101] Alternatively, a heat-conducting layer 13 may be provided on the first plate 2111, at least a portion of which is located within the third through hole 111 and abuts against the second component 4, thereby achieving indirect heat transfer between the first plate 2111 and the second component 4. The heat-conducting layer 13 may be one of thermal grease, thermal adhesive, or thermal pad.

[0102] The second component 4 can be a capacitor, inductor, or other component with relatively low heat generation. It is connected via fixing posts 12, and the connection structure can be the same as that of the first component 3. That is, multiple fixing posts 12 can be set on the motherboard 11, and the fixing posts 12 are riveted or soldered to the motherboard 11. The second component 4 has holes that can be inserted into the fixing posts 12, so that the first component 3 can be fixed to the motherboard 11. Alternatively, multiple fixing posts 12 can also be set on the first plate 2111, and the fixing posts 12 pass through the motherboard 11 in a direction perpendicular to the first plate 2111 before connecting to the second component 4. The second component 4 can directly exchange heat with the first plate 2111 or indirectly transfer heat with the first plate 2111, which can meet different heat dissipation requirements. When combined with the heat-conducting part 22, the heat-conducting part 22 is paired with high-power devices, so that the cooling plate 21 can cover the heat dissipation requirements of low-power density devices and high-power devices, and the corresponding heat dissipation structure can be arranged according to different heat dissipation conditions, which helps to optimize the use of the structure.

[0103] Referring to Figures 16 and 17, the power conversion device provided in this disclosure includes the cooling device described in the above embodiments.

[0104] Referring to Figure 16, in some embodiments, the power conversion device further includes an electrical box 5, which has a receiving cavity 50, and a cooling device is disposed inside the electrical box 5. The electrical box 5 serves to house and protect the cooling device, and the cooling plate 21 is supported on the inner bottom surface of the electrical box 5, which can prevent the medium flow channel 210 from being directly subjected to external impact.

[0105] Referring to Figure 17, in some embodiments, the power conversion device further includes an electrical box 5. The electrical box 5 has a receiving cavity 50 and a first opening 51 and a second opening 52 communicating with the receiving cavity 50. The first opening 51 and the second opening 52 are arranged opposite to each other, or the first opening 51 and the second opening 52 are arranged adjacent to each other. A cooling device is disposed in the second opening 52 and connected to the electrical box 5. The first component 3 and the second component 4 are located inside the receiving cavity 50. The cooling device serves to cover the second opening 52. The main board 11 is arranged opposite to the receiving cavity 50, and the cooling plate 21 is located on the side of the main board 11 away from the receiving cavity 50. In this case, the cooling device can be a component of the electrical box 5, forming a side plate or bottom plate of the electrical box 5, to simplify the structure and improve space utilization.

[0106] Referring to Figure 17, in some embodiments, the power conversion device further includes a PCB board 6, which is disposed on the side of at least one of the first component 3 and the second component 4 away from the cooling plate 21. The PCB board 6 is located within the receiving cavity 50 and is an independent component that can be connected to at least one of the first component 3 and the second component 4.

[0107] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0108] The cooling device, power conversion equipment, and converter cabinet provided in the embodiments of this disclosure have been described in detail above, and specific examples have been used to illustrate the principles and implementation methods of this disclosure. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this disclosure. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this disclosure.

Claims

1. A cooling device, comprising: A motherboard (11) configured to be connected to a first component (3); The cooling plate (21) includes multiple plates (211), which enclose a medium flow channel (210). At least one of the plates (211) is a first plate (2111), and the side of the first plate (2111) facing away from the medium flow channel (210) is connected to the main board (11).

2. The cooling device according to claim 1, wherein, The motherboard (11) is provided with a first through hole (110), which is disposed opposite to the first component (3).

3. The cooling device according to claim 2, wherein, The first plate (2111) is provided with a second through hole (213) communicating with the medium flow channel (210). Part of the first component (3) passes through the first through hole (110) and the second through hole (213) and is located in the medium flow channel (210). The first component (3) is sealed to the second through hole (213).

4. The cooling device according to claim 2, wherein, The first plate (2111) is provided with a heat-conducting part (22). In the first direction (X), at least a portion of the heat-conducting part (22) is disposed opposite to the first component (3). The first direction (X) is the thickness direction of the first plate (2111).

5. The cooling device according to claim 4, wherein, At least a portion of the heat-conducting part (22) is located within the first through hole (110) and abuts against the first component (3).

6. The cooling device according to claim 4 or 5, wherein, The heat-conducting part (22) is provided with a heat-conducting channel (221) and a plurality of openings (222) communicating with the heat-conducting channel (221), and the plurality of openings (222) communicating with the medium channel (210).

7. The cooling device according to claim 6, wherein, At least one of the openings (222) is an input port (2221), and at least another opening (222) is an output port (2222).

8. The cooling device according to claim 6, wherein, The heat-conducting part (22) includes a first enclosure plate (223), a second enclosure plate (224) and a third enclosure plate (225) arranged sequentially and connected to each other along the thickness direction of the cooling plate (21). A plurality of openings (222) are provided on the first enclosure plate (223), and two adjacent openings (222) are spaced apart. The heat-conducting channel (221) is provided on the second enclosure plate (224).

9. The cooling device according to claim 8, wherein, The first enclosure plate (223) is provided with a first nozzle (2231), which is connected to the heat conduction channel (221) and the medium channel (210) respectively, and at least one of the openings (222) is an output port (2222).

10. The cooling device according to claim 8, wherein, The heat-conducting part (22) also includes a fourth enclosure plate (226) and a fifth enclosure plate (227) connected to each other. The fourth enclosure plate (226) is connected to the first enclosure plate (223). The fourth enclosure plate (226) is provided with a first channel (2261) and a second channel (2262). The fifth enclosure plate (227) is connected to the second enclosure plate (224). The fifth enclosure plate (227) is provided with a second nozzle (2271) and a third channel (2272). The second nozzle (2271) is connected to the first channel (2261) and the heat-conducting channel (221). The third channel (2272) is connected to the second channel (2262) and the medium channel (210). At least one of the openings (222) is connected to the first channel (2261) and the opening (222) is an input port (2221). At least one of the openings (222) is connected to the second channel (2262) and the opening (222) is an output port (2222).

11. The cooling device according to claim 10, wherein, The number of the second channel (2262) and the third channel (2272) are respectively provided in multiples. The multiple second channels (2262) are distributed on both sides of the first channel (2261), and each second channel (2262) is connected to one of the output ports (2222). The multiple third channels (2272) are distributed on both sides of the second nozzle (2271), and each third channel (2272) is connected to one of the second channels (2262).

12. The cooling device according to claim 11, wherein, The number of the second nozzles (2271) is multiple, and the second nozzles (2271) and the first component (3) are distributed relative to each other in the first direction (X).

13. The cooling device according to claim 12, wherein, The inner diameter of at least one of the second nozzles (2271) is smaller than the inner diameter of the other second nozzles (2271).

14. The cooling device according to claim 10, wherein, Among the first enclosure plate (223), the second enclosure plate (224), the third enclosure plate (225), the fourth enclosure plate (226), and the fifth enclosure plate (227), at least two adjacent ones are integrally formed.

15. The cooling device according to claim 8, wherein, A heat-conducting module (2251) is provided on the side of the third enclosure plate (225) facing the heat-conducting channel (221).

16. The cooling device according to claim 8, wherein, The medium flow channel (210) includes a first flow channel (2101) and a second flow channel (2102). The pressure in the first flow channel (2101) is different from the pressure in the second flow channel (2102). The first flow channel (2101) and the second flow channel (2102) are respectively connected to an opening (222).

17. The cooling device according to claim 1, wherein, The motherboard (11) is also configured to connect with the second component (4). The motherboard (11) is provided with a third through hole (111). The second component (4) abuts against the first board body (2111) through the third through hole (111). Alternatively, a heat-conducting layer (13) may be provided on the first plate (2111), at least a portion of which is located within the third through hole (111) and abuts against the second component (4).

18. The cooling device according to claim 17, wherein, The cooling device also includes a plurality of fixing posts (12), which are disposed on the main board (11) and connected to at least one of the first component (3) and the second component (4).

19. The cooling device according to claim 17, wherein, The cooling device further includes a plurality of fixing posts (12), which are disposed on the first plate (2111). The fixing posts (12) pass through the main plate (11) along a first direction (X) and are connected to at least one of the first component (3) and the second component (4).

20. A power conversion device, comprising the cooling device according to any one of claims 1 to 19.

21. The power conversion device according to claim 20, wherein, The power conversion device also includes an electrical box (5), which has a receiving cavity (50), and the cooling device is disposed inside the electrical box (5).

22. The power conversion device according to claim 20, wherein, The power conversion device further includes an electrical box (5), which has a receiving cavity (50) and a first opening (51) and a second opening (52) communicating with the receiving cavity (50). The first opening (51) and the second opening (52) are arranged opposite to each other, or the first opening (51) and the second opening (52) are arranged adjacent to each other. The cooling device is arranged in the second opening (52) and connected to the electrical box (5).

23. The power conversion device according to claim 20, characterized in that... in, The power conversion device further includes a PCB board (6), which is disposed on the side away from the cooling plate (21) of at least one of the first component (3) and the second component (4).

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