Photovoltaic module and manufacturing method for frame of photovoltaic module

Abstract

The present application relates to the technical field of solar cells. Provided are a photovoltaic module and a manufacturing method for a frame of the photovoltaic module. The photovoltaic module comprises a chip layer and a frame, the frame being located on one side of the chip layer. The frame comprises: a conductive layer; an insulating layer, which coats the outer side of the conductive layer; and an adhesive layer, which is located between the conductive layer and the insulating layer, wherein the insulating layer and the adhesive layer are provided with a first opening, and the conductive layer is exposed through the first opening and used for electrical connection with the chip layer. The frame provided in the present application has a current collecting function, so that the photovoltaic module does not need to be provided with a separate busbar, thereby reducing the overall thickness of the photovoltaic module and lowering the risk of solar cell cracking.

Description

Manufacturing methods for photovoltaic modules and their frames

[0001] This application claims priority to Chinese Patent Application No. 202510369694.4, filed with the State Intellectual Property Office of China on March 26, 2025, entitled "Manufacturing Method of Photovoltaic Module and Frame of Photovoltaic Module", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of solar cell technology, and more specifically to a method for manufacturing a photovoltaic module and a frame for the photovoltaic module. Background Technology

[0003] In related technologies, the busbars of photovoltaic modules are usually set on the frame or chip layer, which affects the thickness of the photovoltaic module and can easily lead to problems such as solar cell cracking.

[0004] Application content

[0005] This application aims to at least solve or improve the technical problem in the prior art that photovoltaic modules require separate busbars.

[0006] Therefore, the first aspect of this application proposes a photovoltaic module.

[0007] The second aspect of this application proposes a method for manufacturing the frame of a photovoltaic module.

[0008] In view of the above, according to the first aspect of this application, this application proposes a photovoltaic module, including: a chip layer and a frame, the frame being located on one side of the chip layer, the frame including: a conductive layer; an insulating layer covering the outside of the conductive layer; an adhesive layer located between the conductive layer and the insulating layer; wherein the insulating layer and the adhesive layer are provided with a first opening, the conductive layer being exposed through the first opening and used for electrical connection with the chip layer.

[0009] According to a second aspect of this application, this application proposes a method for manufacturing a frame of a photovoltaic module, for manufacturing a frame of a photovoltaic module as provided in the first aspect embodiment, the method comprising: providing a set of adhesive layers and an insulating layer on both sides of a conductive layer; bonding the conductive layer, adhesive layers and insulating layer by a lamination process; and forming a first opening in the insulating layer and the adhesive layers to expose the conductive layer to the first opening.

[0010] The beneficial effects of this application are as follows: the frame provided by this application has a busbar function, so that the photovoltaic module does not need to be set with a separate busbar, reducing the overall thickness of the photovoltaic module and reducing the risk of solar cell cracking.

[0011] Additional aspects and advantages of this application will become apparent in the following description or may be learned by practice of this application. Attached Figure Description

[0012] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0013] Figure 1 shows a schematic diagram of the structure of a photovoltaic module provided in an embodiment of this application;

[0014] Figure 2 shows a schematic diagram of the frame structure of a photovoltaic module provided in one embodiment of this application;

[0015] Figure 3 shows a schematic diagram of the structure of the insulating layer in the frame of a photovoltaic module provided in an embodiment of this application;

[0016] Figure 4 shows a schematic diagram of the structure of the insulating layer in the frame of a photovoltaic module provided in an embodiment of this application;

[0017] Figure 5 shows one of the flowcharts of a method for manufacturing the frame of a photovoltaic module according to an embodiment of this application;

[0018] Figure 6 shows a second flowchart of a method for manufacturing the frame of a photovoltaic module according to an embodiment of this application.

[0019] The correspondence between the reference numerals and component names in Figures 1 to 4 is as follows: 100 photovoltaic module, 110 chip layer, 120 frame, 122 conductive layer, 124 insulating layer, 126 first opening, 128 second opening, 130 adhesive layer. Detailed Implementation

[0020] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0021] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0022] The following describes a method for manufacturing a photovoltaic module 100 and a frame of a photovoltaic module according to some embodiments of this application, with reference to Figures 1 to 6.

[0023] As shown in Figures 1, 2, and 3, according to a first aspect of this application, this application provides a photovoltaic module 100, including: a chip layer 110 and a frame 120, the frame 120 being located on one side of the chip layer 110, the frame 120 including: a conductive layer 122; an insulating layer 124 covering the outside of the conductive layer 122; and an adhesive layer 130 located between the conductive layer 122 and the insulating layer 124; wherein the insulating layer 124 and the adhesive layer 130 are provided with a first opening 126, the conductive layer 122 being exposed to the first opening 126 and used for electrical connection with the chip layer 110.

[0024] The photovoltaic module 100 provided in this application includes a chip layer 110 and a frame 120. The frame 120 is disposed on one side of the chip layer 110. The frame 120 includes a conductive layer 122, an adhesive layer 130, and an insulating layer 124. The insulating layer 124 covers the outside of the conductive layer 122, and the adhesive layer 130 is located between the conductive layer 122 and the insulating layer 124, thereby ensuring the reliability of the frame 120. The insulating layer 124 and the adhesive layer 130 are provided with a first opening 126, through which the conductive layer 122 is exposed. The conductive layer 122 is electrically connected to the chip layer 110 through the exposed portion of the first opening 126, thereby enabling the frame 120 to have a current-carrying function. That is, the frame 120 provided in this application has a current-carrying function, so that the photovoltaic module does not need to be provided with a separate busbar, reducing the overall thickness of the photovoltaic module and reducing the risk of solar cell cracking.

[0025] The conductive layer 122 can be a through hole corresponding to the position of the first opening 126, with the edge of the through hole exposed to the first opening 126, or the conductive layer 122 can be shielded from the position of the first opening 126.

[0026] In related technologies, circuit wires are typically placed on the frame 120 or on the battery cell layer. Due to the height difference, this can lead to defects such as bubbles and cracks in the laminated components, and also makes the installation complex and cumbersome. However, the frame 120 provided in this application has an internal conductive layer 122, eliminating the need for busbars and other components, thus solving the above problems.

[0027] As shown in Figure 4, in some embodiments, optionally, the insulating layer 124 is provided with a second opening 128, the adhesive layer is also provided with a second opening (not shown in the figure), and the conductive layer 122 is exposed to the second opening 128 and is used for electrical connection with external circuitry.

[0028] In this embodiment, the insulating layer 124 and the adhesive layer 130 are further provided with a second opening 128, the conductive layer 122 is exposed through the second opening 128, and the conductive layer 122 is electrically connected to the external circuit through the exposed portion of the second opening 128, thereby enabling the frame 120 to transmit electrical energy to the external circuit.

[0029] As shown in Figures 2, 3 and 4, in some embodiments, optionally, the second opening 128 is located at the end of the insulating layer 124 and the end of the adhesive layer 130, and the first opening 126 is located on the side of the insulating layer 124 and the side of the adhesive layer 130.

[0030] In this embodiment, the second opening 128 is located at the end of the insulating layer 124 and the end of the adhesive layer 130, thereby facilitating the electrical connection between the conductive layer 122 and the external circuit. The first opening 126 is located on the side of the insulating layer 124 and the side of the adhesive layer 130, thereby making the first opening 126 correspond to the chip layer 110, which facilitates the electrical connection between the conductive layer 122 and the chip layer 110.

[0031] Specifically, the frame 120 is strip-shaped, and at least one of the two ends of the insulating layer 124 has a second opening 128. Correspondingly, at least one of the two ends of the adhesive layer 130 has a second opening 128. The first opening 126 is located on the side of the insulating layer 124 and the side of the adhesive layer 130, that is, the first opening 126 is located between the two ends of the insulating layer 124. Correspondingly, the first opening 126 is also located between the two ends of the adhesive layer 130. Furthermore, the number of first openings 126 on the insulating layer 124 and the adhesive layer 130 can be one, two, or more, depending on the chip layer 110 and the circuit design. Similarly, the number of second openings 128 on the insulating layer 124 and the adhesive layer 130 can be one, two, or more, depending on the circuit design.

[0032] In some embodiments, optionally, the insulation resistance of the insulating layer 124 is greater than or equal to 1 × 10⁻⁶. 4 MΩ.

[0033] In this embodiment, the insulation resistance of the insulating layer 124 is greater than or equal to 1×10⁻⁶. 4 MΩ, thereby ensuring the safety of photovoltaic modules.

[0034] In some embodiments, the insulation layer 124 may optionally withstand a voltage greater than or equal to 3 kV / min.

[0035] In this embodiment, the insulation layer 124 has a withstand voltage greater than or equal to 3KV / min, thereby ensuring the safety of the photovoltaic module.

[0036] In some embodiments, the insulating layer 124 may optionally be doped with an ultraviolet absorber.

[0037] In this embodiment, the insulating layer 124 is doped with an ultraviolet absorber, thereby improving the insulating layer 124's resistance to photoaging and enhancing the reliability of the photovoltaic module.

[0038] Specifically, the content of ultraviolet absorber in the insulation layer 124 is 0.01% to 0.2%, specifically, the content of ultraviolet absorber in the insulation layer 124 is 0.05%, 0.1%, or 0.2%, etc.

[0039] In some embodiments, the conductive layer 122 may optionally be a highly conductive carbon fiber layer, a copper strip layer, or an aluminum alloy layer, etc.

[0040] In some embodiments, the insulating layer 124 may optionally be a glass fiber (GFRP) layer, a polyurethane (PUR) layer, or an acrylic resin (ASA) layer.

[0041] In some embodiments, the adhesive layer 130 may optionally be an epoxy resin layer, a polyurethane film layer, or a hot melt adhesive film layer, and the adhesive layer 130 is compatible with the insulating layer 124. The hot melt adhesive film layer may be an ethylene-vinyl acetate copolymer (EVA) layer, or a polyolefin elastomer (POE) layer, etc.

[0042] In some embodiments, the thickness of the adhesive layer 130 is optionally between 0.1 mm and 0.5 mm.

[0043] In some embodiments, the conductive layer 122 may optionally not protrude from the edge of the insulating layer 124, that is, the area of ​​the conductive layer 122 is smaller than the area of ​​the insulating layer 124.

[0044] In some embodiments, the insulating layer 124 may optionally fully cover the conductive layer 122, that is, except for the first opening 126 and the second opening 128, the conductive layer 122 is completely covered by the insulating layer 124. Alternatively, the insulating layer 124 may partially cover the conductive layer 122, that is, except for the first opening 126 and the second opening 128, a portion of the conductive layer 122 is not covered by the insulating layer 124. For example, the conductive layer 122 is covered by the insulating layer 124 on both sides, and the portion that is not attached to the insulating layer 124, that is, the portion between the two insulating layers 124, is not covered by the insulating layer 124. This position can be insulated by means of spraying insulation or other methods.

[0045] As shown in Figure 1, there are two borders 120, located on both sides of the chip layer 110. One border 120 is connected to the positive electrode, and the other is connected to the negative electrode.

[0046] The connection between the chip layer 110 and the conductive layer 122 can be achieved by screws, terminals, wires, or solder, or by bonding.

[0047] The photovoltaic module 100 provided in this application does not require a separate busbar, which simplifies the installation process, improves product production efficiency, and can effectively reduce the possibility of cracking, bubbles, and other problems, thereby improving product yield and reducing costs and saving materials.

[0048] Among them, photovoltaic module 100 can be a portable photovoltaic module, such as a foldable photovoltaic module.

[0049] Figure 5 shows one of the flowcharts of a method for manufacturing the frame of a photovoltaic module according to an embodiment of this application.

[0050] As shown in Figure 5, the specific process of manufacturing a photovoltaic module frame according to an embodiment of this application is as follows:

[0051] Step 502: Set a set of adhesive layer and insulating layer on both sides of the conductive layer.

[0052] Specifically, a set of adhesive layer and insulating layer are respectively set on both sides of the conductive layer. The stacking method of the conductive layer, adhesive layer and insulating layer is insulating layer-adhesive layer-conductive layer-adhesive layer-insulating layer. The five layers of materials are stacked in sequence in the mold.

[0053] Step 504: Combine the conductive layer, adhesive layer and insulating layer through a lamination process.

[0054] Specifically, through a lamination process, a conductive layer, an adhesive layer, and an insulating layer are pressed together, so that the conductive layer, adhesive layer, and insulating layer form a whole.

[0055] Step 506: Create a first opening in the insulating layer and the adhesive layer to expose the conductive layer to the first opening.

[0056] Specifically, a first opening is made in the insulating layer and the adhesive layer to expose the conductive layer to facilitate electrical connection between the conductive layer and the chip layer.

[0057] As shown above, this allows the frame to have a busbar function, eliminating the need for separate busbars in photovoltaic modules, reducing the overall thickness of photovoltaic modules, and lowering the risk of solar cell cracking.

[0058] The surface area of ​​the conductive layer facing the insulating layer is smaller than the surface area of ​​the insulating layer facing the conductive layer.

[0059] In some embodiments, optionally, after bonding the conductive layer, adhesive layer, and insulating layer by a lamination process, the method further includes insulating the conductive layer that is at least partially exposed outside the insulating layer.

[0060] In this embodiment, the conductive layer, adhesive layer, and insulating layer can be used to insulate at least a portion of the conductive layer exposed outside the insulating layer, thereby reducing the possibility of frame leakage.

[0061] For example, if the conductive layer is covered by insulating layers on both sides, and the part between the two insulating layers is not covered by insulating layers, this part can be insulated by spraying insulation or other methods.

[0062] In some embodiments, the method may optionally include, after bonding the conductive layer, adhesive layer and insulating layer by a lamination process, forming a second opening at the end of the insulating layer and the end of the adhesive layer.

[0063] In this embodiment, after combining the conductive layer, adhesive layer, and insulating layer through a lamination process, the method further includes: opening a second opening at the end of the insulating layer and the end of the adhesive layer, exposing the conductive layer to the second opening, and electrically connecting the conductive layer to the external circuit through the portion exposed by the second opening, thereby enabling the frame to transmit electrical energy to the external circuit.

[0064] In some embodiments, the method may optionally include pretreating the surface of the conductive layer before setting a set of adhesive layers and an insulating layer on each side of the conductive layer to increase the adhesion of the conductive layer surface.

[0065] In this embodiment, before setting a set of adhesive layers and insulating layers on both sides of the conductive layer, the surface of the conductive layer is pretreated to increase the adhesion of the conductive layer surface, improve the connection strength between the conductive layer and the adhesive and insulating layers, and improve the reliability of the frame.

[0066] Specifically, the conductive layer undergoes pretreatment, such as anodizing (15μm to 25μm film thickness) or chemical etching on aluminum alloy or copper materials, to enhance roughness and improve adhesive adhesion. Carbon fiber conductive composites require coupling agent treatment to prevent electrochemical corrosion with the insulating layer.

[0067] In some embodiments, optionally, after bonding the conductive layer, adhesive layer and insulating layer by lamination, the method further includes: trimming the insulating layer so that the roughness of the insulating layer is less than or equal to 0.8Ra.

[0068] In this embodiment, after the conductive layer, adhesive layer and insulating layer are combined through a lamination process, the insulating layer is trimmed so that the roughness of the insulating layer is less than or equal to 0.8Ra, thereby reducing the possibility of the insulating layer scratching other objects and improving the safety of the photovoltaic module.

[0069] Specifically, this can involve cutting off excess glue edges, sanding burrs, and ensuring that the roughness of the edge is less than or equal to 0.8Ra.

[0070] In some embodiments, optionally, the lamination process employs a staged heating method; the pressure range of the lamination process is 15 MPa to 30 MPa; the vacuum degree of the lamination process is -0.09 MPa to -0.1 MPa; and the lamination process time is 10 min to 15 min.

[0071] In this embodiment, the lamination process employs staged heating to reduce cracking caused by differences in material expansion coefficients. The pressure range of the lamination process is 15MPa to 30MPa, ensuring the reliability of the conductive layer, adhesive layer, and insulating layer formation. The vacuum degree of the lamination process is -0.09MPa to -0.1MPa, reducing the possibility of air bubbles between the conductive layer, adhesive layer, and insulating layer. The lamination process time is 10min to 15min, ensuring the reliability of the connection between the conductive layer, adhesive layer, and insulating layer.

[0072] The staged heating can be done in three stages, for example, the temperatures of the three stages are 110 degrees Celsius, 130 degrees Celsius and 150 degrees Celsius respectively.

[0073] The vacuum degree of the lamination composite process is -0.09MPa, -0.095MPa, -0.098MPa or -0.1MPa, etc.

[0074] Figure 6 shows a second flowchart of a method for manufacturing a border according to an embodiment of this application.

[0075] As shown in Figure 6, the specific process of the border manufacturing method provided in one embodiment of this application is as follows:

[0076] Step 602: Preprocessing.

[0077] Specifically, the conductive layer undergoes pretreatment, such as anodizing (15μm to 25μm film thickness) or chemical etching on aluminum alloy or copper materials, to enhance roughness and improve adhesive adhesion. Carbon fiber conductive composites require coupling agent treatment to prevent electrochemical corrosion with the insulating layer.

[0078] Step 604: Framing.

[0079] Specifically, the prepared materials are stacked into a special mold in sequence as follows: insulating layer - adhesive layer - conductive layer - adhesive layer - insulating layer.

[0080] Step 606: Lamination and bonding.

[0081] Specifically, a lamination composite process is used for molding, with the temperature increased in stages (110 degrees Celsius - 130 degrees Celsius - 150 degrees Celsius) to avoid cracking caused by differences in the thermal expansion coefficients of the materials. The lamination time is 10 to 15 minutes under a pressure of 15 MPa to 30 MPa and a vacuum degree of -0.098 MPa.

[0082] Step 608: Post-processing.

[0083] Specifically, cut off excess glue edges and sand down burrs to ensure the edge roughness is less than 0.8Ra.

[0084] Step 610: Drill a hole.

[0085] Specifically, a localized insulating treatment (such as spraying insulating paint) is applied to a portion of the frame, and holes are made at both ends to allow the conductive layer to connect to external circuits. These holes consist of a first opening and a second opening.

[0086] In this application, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise expressly defined. The terms "install," "connect," "link," and "fix" should be interpreted broadly. For example, "connect" can mean a fixed connection, a detachable connection, or an integral connection; "link" can mean a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0087] In the description of this application, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the components or units referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0088] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0089] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A photovoltaic module, characterized in that, include: A chip layer and a border, the border being located on one side of the chip layer, the border comprising: Conductive layer; An insulating layer is formed by covering the outside of the conductive layer. An adhesive layer is located between the conductive layer and the insulating layer; The insulating layer and the adhesive layer are provided with a first opening, the conductive layer is exposed to the first opening and is used for electrical connection with the chip layer.

2. The photovoltaic module according to claim 1, characterized in that, The conductive layer has a through hole at a position corresponding to the first opening, and the edge of the through hole is exposed to the first opening.

3. The photovoltaic module according to claim 1, characterized in that, The insulating layer and the adhesive layer are provided with a second opening, the conductive layer is exposed through the second opening, and is used for electrical connection with an external circuit.

4. The photovoltaic module according to claim 3, characterized in that, The second opening is located at the end of the insulating layer and the end of the adhesive layer, and the first opening is located on the side of the insulating layer and the side of the adhesive layer.

5. The photovoltaic module according to claim 3, characterized in that, The number of first openings on the insulating layer and the adhesive layer is at least one; the number of second openings on the insulating layer and the adhesive layer is at least one.

6. The photovoltaic module according to any one of claims 1 to 5, characterized in that, The insulation resistance of the insulating layer is greater than or equal to 1×10⁻⁶. 4 MΩ, the withstand voltage of the insulating layer is greater than or equal to 3KV / min, and the insulating layer is doped with an ultraviolet absorber.

7. The photovoltaic module according to any one of claims 1 to 6, characterized in that, The area of ​​the conductive layer is smaller than the area of ​​the insulating layer.

8. The photovoltaic module according to any one of claims 1 to 7, characterized in that, The thickness of the adhesive layer is 0.1 mm to 0.5 mm.

9. The photovoltaic module according to any one of claims 1 to 8, characterized in that, The conductive layer is a carbon fiber layer, a copper strip layer, or an aluminum alloy layer.

10. The photovoltaic module according to any one of claims 1 to 9, characterized in that, The insulating layer is a glass fiber layer, a polyurethane layer, or an acrylic resin layer.

11. The photovoltaic module according to any one of claims 1 to 10, characterized in that, The adhesive layer is an epoxy resin layer, a polyurethane film layer, or a hot melt adhesive film layer.

12. The photovoltaic module according to any one of claims 1 to 11, characterized in that, The photovoltaic module includes two frames, which are located on both sides of the chip layer.

13. A method for manufacturing a frame for a photovoltaic module, characterized in that, The method for manufacturing a frame for a photovoltaic module as described in any one of claims 1 to 12 includes: A set of adhesive layer and an insulating layer are respectively provided on both sides of the conductive layer; The conductive layer, the adhesive layer, and the insulating layer are combined through a lamination process. A first opening is formed in the insulating layer and the adhesive layer, exposing the conductive layer to the first opening.

14. The method for manufacturing the frame of a photovoltaic module according to claim 13, characterized in that, After bonding the conductive layer, the adhesive layer, and the insulating layer through a lamination process, the method further includes: The conductive layer, which is at least partially exposed outside the insulating layer, is insulated.

15. The method for manufacturing the frame of a photovoltaic module according to claim 14, characterized in that, After bonding the conductive layer, the adhesive layer, and the insulating layer through a lamination process, the method further includes: A second opening is made at the end of the insulating layer and at the end of the adhesive layer.

16. A method for manufacturing the frame of a photovoltaic module according to any one of claims 13 to 15, characterized in that, Before setting a set of adhesive layers and an insulating layer on each side of the conductive layer, the method further includes: The surface of the conductive layer is pretreated to increase the adhesion of the conductive layer surface.

17. The method for manufacturing the frame of a photovoltaic module according to claim 16, characterized in that, The pretreatment is anodizing, chemical etching, or coupling agent treatment.

18. A method for manufacturing the frame of a photovoltaic module according to any one of claims 13 to 15, characterized in that, After bonding the conductive layer, the adhesive layer, and the insulating layer through a lamination process, the method further includes: The insulating layer is trimmed so that its roughness is less than or equal to 0.8Ra.

19. A method for manufacturing the frame of a photovoltaic module according to any one of claims 13 to 15, characterized in that, The lamination process employs a staged heating method; The pressure range of the lamination process is 15MPa to 30MPa. The vacuum degree of the lamination process is -0.09MPa to -0.1MPa; The lamination process takes 10 to 15 minutes.

20. The method for manufacturing the frame of a photovoltaic module according to claim 19, characterized in that, The staged heating includes three stages, with temperatures of 110 degrees Celsius, 130 degrees Celsius, and 150 degrees Celsius, respectively.

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