Soldered member and manufacturing method therefor, circuit board assembly, and electronic device

Abstract

Embodiments of the present application provide a soldered member and a manufacturing method therefor, a circuit board assembly, and an electronic device. The soldered member is arranged on a surface of a substrate. The soldered member comprises a plurality of workpieces that are stacked and soldered together. Among any two adjacent stacked workpieces, one is a first workpiece and the other is a second workpiece, wherein the first workpiece comprises a first metal surface facing away from the substrate and a masking film formed on the first metal surface, the masking film is provided with an opening region, the opening region exposes a first portion of the first metal surface, the melting point of the masking film is higher than that of a brazing filler used for brazing, and a surface of the masking film has a contact angle of greater than 90 degrees with respect to the molten brazing filler; and the second workpiece comprises a second metal surface facing the first workpiece, and the second metal surface is brazed to the first portion of the first metal surface. According to the technical solution of the embodiments of the present application, the manufacturing accuracy of the soldered member can be improved while improving the design and production flexibility of the soldered member.

Description

Welded components and their manufacturing methods, circuit board assemblies, and electronic equipment

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202510386476.1, filed on March 28, 2025, with the invention entitled "Welding Components and Methods for Manufacturing the Same, Circuit Board Assemblies, and Electronic Devices", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of electronic equipment technology, and in particular to a welding component and its manufacturing method, a circuit board assembly, and an electronic device. Background Technology

[0004] In related technologies, with the trend of electronic devices such as mobile phones, tablets, laptops, smart wearables, servers, or in-vehicle equipment becoming thinner and smaller, the demand for greater freedom in the design and manufacturing processes of their internal components is also increasing.

[0005] For welded components inside electronic devices, how to improve their manufacturing precision while increasing their design and production freedom is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0006] This application provides a welding component and its manufacturing method, a circuit board assembly, and an electronic device, which improves the design and production freedom of the welding component while enhancing its manufacturing precision.

[0007] According to one aspect of this application, a welding member is provided for placement on the surface of a substrate. The welding member includes a plurality of stacked components, wherein in any two adjacent stacked components, one is a first component and the other is a second component. The first component includes: a first metal surface facing away from the substrate, and a masking film formed on the first metal surface, wherein the masking film has an opening area exposing a first portion of the first metal surface, the melting point of the masking film is greater than the melting point of the brazing filler metal, and the contact angle of the masking film surface with respect to the molten brazing filler metal is greater than 90 degrees. The second component includes a second metal surface facing the first component, the second metal surface being brazed to a first portion of the first metal surface.

[0008] According to the welding component of this application embodiment, since the melting point of the shielding film is greater than that of the brazing filler metal, and the contact angle of the shielding film surface with the molten brazing filler metal is greater than 90 degrees, the shielding film is not easily wetted by the molten brazing filler metal, which can prevent the molten brazing filler metal from adhering and spreading on its surface. Therefore, the molten brazing filler metal can be precisely confined to a first portion of the first metal surface, which is beneficial to improving the welding accuracy and reliability. The welding component as a whole has a three-dimensional stacked structure, which can realize the functional integration of multiple components, thus improving space utilization and making it particularly suitable for the compact and narrow layout space inside electronic devices. Furthermore, the individual components of the welding component do not necessarily need to be metal components, thus allowing for more flexible application and design, and giving the welding component a high degree of freedom in product application and design.

[0009] In some embodiments, the material of the masking film includes polyimide, silicone resin, bismaleimide, polyetheretherketone, cyanate ester resin, polybenzimidazole, modified epoxy resin, polyamide-imide, polytetrafluoroethylene, alumina, aluminum nitride, boron nitride, or quartz glass. The material of the masking film can be flexibly selected while meeting the aforementioned characteristic requirements. Depending on the specific material selected for the masking film, its preparation process on the first component can also be flexibly adjusted.

[0010] In some embodiments, the maximum distance between the edge of the second metal surface and the edge of the opening area is less than or equal to 0.3 mm. Allowing appropriate process tolerances facilitates, on the one hand, the assembly and alignment of the second and first components; on the other hand, it facilitates the dimensional control of the masking film, thereby facilitating the fabrication of the masking film on the first metal surface; furthermore, it allows the molten solder to fully spread and fill between the second metal surface and the first portion of the first metal surface, thereby improving the quality of the weld.

[0011] In some embodiments, the first component includes a first metal body, and the first metal surface is the surface of the first metal body facing away from the substrate; or, the first component includes a first metal shell, and the first metal surface is the surface of the first metal shell facing away from the substrate; or, the side of the first component facing away from the substrate has a first surface metal layer, and the first metal surface is the surface of the first surface metal layer facing away from the substrate. The first component is not required to be a metal component, thus its application and design are more flexible, thereby giving welded components a high degree of freedom in product application and design.

[0012] In some embodiments, the second component includes a second metal body, and the second metal surface is the surface of the second metal body facing the first component; or, the second component includes a second metal shell, and the second metal surface is the surface of the second metal shell facing the first component; or, a second surface metal layer is provided on the side of the second component facing the first component, and the second metal surface is the surface of the second surface metal layer facing the first component. The second component is not required to be a metal component, thus allowing for greater flexibility in its application and design, and consequently, providing welded components with a high degree of freedom in product application and design.

[0013] In some embodiments, the first component and the second component are mechanically connected. When the welded component comprises multiple components, they can be connected together in a similar manner to form a three-dimensional stacked structure, which is compact and has a high space utilization rate.

[0014] In some embodiments, the first component and the second component are electrically connected. The welded components have a three-dimensional stacked structure, which is not only compact and has a high space utilization rate, but also provides electrical functional support.

[0015] In some embodiments, the first component is a support or electronic device, and the second component is a mounting fastener, support, or electrical connector. The welded components can be flexibly designed in terms of their specific structure and function according to the application scenario, offering a high degree of freedom in product application and design.

[0016] According to one aspect of this application, a method for manufacturing a welded component is provided, comprising:

[0017] The first component is fixed to the surface of the substrate, wherein the first component includes a first metal surface facing away from the substrate;

[0018] A masking film is formed on the surface of a first metal, wherein the melting point of the masking film is greater than the melting point of the brazing filler metal used for brazing, and the masking film has an opening area that exposes a first portion of the first metal surface; and

[0019] The second component is stacked and welded to the first component having a shielding film, wherein the second component includes a second metal surface facing the first component, the second metal surface is brazed to a first portion of the first metal surface, and during the brazing process, an opening area is used to restrict the flow of molten brazing filler metal to the first portion of the first metal surface.

[0020] Using the above manufacturing method, on the one hand, since the melting point of the masking film is greater than that of the solder, and the contact angle of the masking film surface with the molten solder is greater than 90 degrees, the surface energy of the masking film is low and it is not easily wetted by the molten solder. This allows the molten solder to be precisely confined to the first part of the first metal surface during the brazing process, which is beneficial to improving the welding accuracy and reliability of the first and second components. On the other hand, the first and second components are not required to be metal components, thus allowing for more flexible application and design of the first and second components, and thus providing a high degree of freedom in product application and design of the welded components. Furthermore, two stacked adjacent components can be welded using surface mount technology, allowing the welded components to be manufactured on surface mount technology production lines for electronic devices, providing a high degree of freedom in manufacturing, which is beneficial to improving production efficiency and reducing production costs.

[0021] In some embodiments, forming a masking film on a first metal surface includes forming the masking film on the first metal surface by a coating process, a thin film deposition process, or an adhesive process. The fabrication process of the masking film on the first component can also vary depending on the specific material chosen.

[0022] In some embodiments, stacking and soldering the second component to a first component having a masking film includes: using a surface mount technology process to braze a first portion of the second metal surface to the first metal surface. In these embodiments, the soldered components can be fabricated on a surface mount technology production line for electronic devices, thus offering greater flexibility in manufacturing, which improves production efficiency and reduces production costs.

[0023] In some embodiments, a surface mount technology (SMT) process is used to braze a second metal surface to a first portion of a first metal surface. This includes: aligning a steel mesh with a first component having a masking film, wherein the steel mesh has a perforated area exposing a first portion of the first metal surface; filling the perforated area with brazing filler metal; separating the steel mesh from the first component having the masking film; and brazing the second metal surface to the first portion of the first metal surface together by reflow soldering. Multiple welded components can be assembled simultaneously in a single SMT process, or welded components and other structural parts requiring welding assembly can be assembled simultaneously, resulting in high production efficiency.

[0024] In some embodiments, stacking and welding the second component to a first component with a shielding film includes: using laser brazing to braze a first portion of the second metal surface to the first metal surface. Laser brazing, as an alternative, has advantages such as high welding precision, small heat-affected zone, non-contact processing, and high degree of automation.

[0025] According to one aspect of this application, a circuit board assembly is provided, comprising a circuit board and a welding member disposed on one side of the circuit board. The welding member is a welding member manufactured according to the first aspect described above, or a welding member manufactured according to the manufacturing method of the second aspect described above, wherein the circuit board serves as a substrate. The circuit board assembly according to the embodiments of this application has a high manufacturing precision for its welding member, and the welding member offers a high degree of freedom in design and production.

[0026] According to one aspect of this application, an electronic device is provided, comprising a housing, and a welding member disposed within the housing according to the aforementioned first aspect, or a welding member manufactured according to the aforementioned second aspect, or a circuit board assembly according to the aforementioned third aspect. The electronic device according to the embodiments of this application has a high degree of manufacturing precision for its welding member, and the welding member offers a high degree of freedom in design and production. Attached Figure Description

[0027] Figure 1 shows a schematic cross-sectional view of a welded component according to some embodiments of this application;

[0028] Figure 2 shows a schematic diagram of the relative positions of the shielding film of the first component and the second metal surface of the second component in some embodiments of this application;

[0029] Figure 3 shows a schematic cross-sectional view of a welded component according to some embodiments of this application;

[0030] Figure 4 shows a schematic cross-sectional view of a welded component according to some embodiments of this application;

[0031] Figure 5 shows a schematic cross-sectional view of a welded component according to some embodiments of this application;

[0032] Figure 6 shows a schematic cross-sectional view of a welded component according to some embodiments of this application;

[0033] Figure 7 shows a flowchart illustrating a method for manufacturing a welded component according to some embodiments of this application;

[0034] Figure 8 shows a schematic diagram of the process in step S3 of Figure 7;

[0035] Figure 9 shows a schematic diagram of the process in step S3 of Figure 7;

[0036] Figure 10 shows a schematic cross-sectional view of a circuit board assembly according to some embodiments of this application;

[0037] Figure 11 shows a schematic cross-sectional view of a circuit board assembly according to some embodiments of this application;

[0038] Figure 12 shows a simplified structural schematic diagram of an electronic device according to some embodiments of this application.

[0039] Reference numerals in the embodiments of this application: 100-Welding component; 30-Base; 10-Component; 110-First component; 130-Second component; 111-First metal surface; 1110-First part; 112-Shielding film; 1120-Opening area; 131-Second metal surface; 113-First metal body; 114-First metal shell; 115-First surface metal layer; 1150-Steel sheet; 116-Functional element; 117-First main structure; 118-Shielding shell; 119-Board-to-board connector; 120-Bracket; 132-Second metal body; 134-Second surface metal layer; 135-Wire clamp; 136-Snap-on; 137-Support; 138-Second main structure; 140-Other structural components; 141-Lower component; 142-Upper component; 20-Steel mesh; 21-Cutout area; 22-Solder metal; 23-Scraper; 300-Circuit board assembly; 310-Circuit board; 320-Structure; 500-Electronic equipment; 510-Casing; 800-Manufacturing method; S1~S3-Steps; S31~S34-Sub-steps. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this application clearer, the application will be described in further detail below with reference to the accompanying drawings.

[0041] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0042] References to “an embodiment” or “a specific embodiment” as used in this specification mean that one or more embodiments of this application include a particular feature, structure, or characteristic described in connection with that embodiment. The terms “comprising,” “including,” “having,” and variations thereof mean “including, but not limited to,” unless otherwise specifically emphasized.

[0043] Spot welding is a welding method that uses columnar electrodes to form a weld point between the contact surfaces of two overlapping components. During spot welding, pressure is first applied to bring the two components into close contact, then current is applied, and under the action of resistance heating, the contact area between the two components is melted, and after cooling, a weld point is formed.

[0044] Electronic devices typically include welded components inside. In related technologies, these welded components comprise multiple parts connected together by spot welding to form a three-dimensional structure. These welded components can be, for example, mechanical or electronic parts within the electronic device. This related technology suffers from at least the following technical drawbacks:

[0045] On the one hand, in order to meet the requirements of spot welding process, multiple components connected by spot welding need to be metal parts, which limits the freedom of welded components in product application and design;

[0046] On the other hand, the fabrication of welded components needs to be carried out on spot welding production lines, which cannot be used in surface mount technology (SMT) production lines commonly used in electronic equipment manufacturing. This results in a lack of flexibility in production, leading to low production efficiency and high production costs. Surface mount technology typically refers to the processing technology of mounting electronic components onto the surface of a circuit board, and it is an important step in the packaging process. Compared to traditional through-hole technology (THT), surface mount technology can significantly simplify the process, reduce production time and costs, and improve production efficiency and product quality.

[0047] On the other hand, spot welding may result in substandard weld point location and / or weld point size due to insufficient welding current, excessively short welding time, improper electrode pressure, electrode wear or contamination, improper surface treatment of the workpiece, or unreasonable selection of welding parameters, making it difficult to guarantee welding quality.

[0048] In view of this, embodiments of this application provide a welding component and its manufacturing method, a circuit board assembly, and an electronic device, so as to improve the design and production freedom of the welding component while improving its manufacturing precision. The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0049] In this application embodiment, the product type of the electronic device may include, but is not limited to, mobile phones, tablets, laptops, monitors, televisions, smart wearables, servers, or in-vehicle devices.

[0050] The internal components of an electronic device include welded members, which can be mechanical or electronic parts. As mechanical components, the welded members primarily provide mechanical structural support for the electronic device, such as serving as structural positioning components, structural support components, or structural connection components, and are not limited to these applications. As electronic components, the welded members primarily provide electrical structural support for the electronic device, such as serving as electrical connection devices, switching devices, or power devices, and are not limited to these applications. In some embodiments, while the welded members primarily provide electrical structural support, parts of their structure can also provide mechanical structural support, such as serving as a fixed mounting structure. The welded components of the electronic device can adopt the design scheme provided in any embodiment of this application.

[0051] Figure 1 shows a cross-sectional structural schematic diagram of a welding member 100 according to some embodiments of this application. The welding member 100 can be applied to a circuit board assembly 300, but is not limited to this application. The welding member 100 is used to be disposed on the surface of a substrate 30, wherein the substrate 30 may include, but is not limited to, the circuit board 310 shown in the figure. For example, in some embodiments, the substrate may also be a substrate or other structures with mounting surfaces.

[0052] As shown in Figure 1, the welded component 100 may include a plurality of stacked and welded parts 10, which are schematically represented as two parts in the figure: a first part 110 and a second part 130. Exemplarily, when the surface S of the substrate 30 is planar, the stacking direction D of the plurality of parts 10 may be orthogonal to the surface S of the substrate 30. In any two adjacent stacked parts 10, one may be defined as the first part 110, and the other as the second part 130. In Figure 1, exemplarily, the second part 130 may be further away from the substrate 30 than the first part 110.

[0053] In this embodiment, the first component 110 may include a first metal surface 111 facing away from the substrate 30, and a masking film 112 formed on the first metal surface 111. The masking film 112 has an opening 1120 that exposes a first portion 1110 of the first metal surface 111. This first portion 1110 of the first metal surface 111 can serve as a welding area for brazing with the second component 130. The melting point of the masking film 112 should be greater than the melting point of the brazing filler metal 22 used for brazing, and the contact angle of the masking film 112 surface with respect to the molten brazing filler metal 22 should be greater than 90 degrees.

[0054] In this embodiment of the application, the second component 130 may include a second metal surface 131 facing the first component 110, the second metal surface 131 being brazed to a first portion 1110 of the first metal surface 111.

[0055] Brazing is a welding method in which both the filler metal and the workpiece are heated to their melting point (below the melting point of the filler metal), and the liquid filler metal fills the gap between the workpieces to form a metal connection. Based on the welding temperature, brazing can be divided into two main categories: brazing with a welding temperature not exceeding 450°C is generally called soft brazing, and brazing with a temperature exceeding 450°C is generally called hard brazing. This application does not limit the type of brazing used for the first component 110 and the second component 130; for example, it can be either soft brazing or hard brazing. Suitable filler metals for soft brazing include, for example, tin-based filler metals, lead-based filler metals, or zinc-based filler metals. Suitable filler metals for hard brazing include, for example, aluminum-based filler metals, silver-based filler metals, copper-based filler metals, or nickel-based filler metals.

[0056] The embodiments of this application do not limit the number of components 10 included in the welding component 100. In the embodiments shown in FIG1, the welding component 100 may, exemplarily, include two components 10 stacked and welded along direction D in FIG1. ​​In other embodiments of this application, the welding component may also, exemplarily, include three or more components stacked and welded along direction D in FIG1. ​​The welding component 100 has a three-dimensional stacked structure, which can realize the functional integration of multiple components 10, thus improving space utilization and making it particularly suitable for compact and confined spaces within electronic devices.

[0057] In one comparative example of this application, the welding component may include a first component and a second component, both of which have metal surfaces for welding, and can be brazed together using solder or other brazing filler metal. In this comparative example, since the entire surface of the first component facing the second component is metal, when the solder is in a molten state, its flow and spread are almost unrestricted. Consequently, the second component may be affected by the flow of the molten solder and deviate or shift relative to the designed target welding area, which would significantly reduce the welding accuracy and reliability of the connection between the two components.

[0058] In this embodiment, since the melting point of the shielding film 112 is greater than that of the brazing filler metal 22, and the shielding film 112 can prevent the molten brazing filler metal 22 from adhering to and spreading on its surface, the shielding film 112 can precisely confine the molten brazing filler metal 22 within the opening area 1120 during the brazing process. As a result, the range of motion of the second component 130 on the molten brazing filler metal is also limited within the opening area 1120. Thus, compared with the above comparative example, the welding accuracy and connection reliability of the two components can be significantly improved.

[0059] In this embodiment, each component 10 of the welded component 100 is not required to be a metal component. This allows for greater flexibility in the application and design of the components, thus giving the welded component 100 a high degree of freedom in product application and design.

[0060] In some embodiments, two adjacent stacked components 10 can be soldered using surface mount technology. In electronic device manufacturing workshops, surface mount technology directly mounts surface mount components onto the surface of circuit boards, using automated equipment such as pick-and-place machines for positioning and reflow soldering for soldering. This enables miniaturized, high-density, high-precision, automated, and highly efficient electronic assembly. For example, in the production of some smartphone motherboards, 90% of the components are manufactured using surface mount technology. The soldered component 100 of this application embodiment can be manufactured on a surface mount technology production line for electronic devices. This provides greater flexibility in the manufacturing process, facilitating process optimization and thereby improving production efficiency and reducing costs.

[0061] As described above, the specific structural type of the substrate 30 is not limited in the embodiments of this application. For example, it can be a circuit board 310 used as a motherboard, a substrate, or other structures with mounting planes, etc.

[0062] In this embodiment, the melting point of the shielding film 112 should be greater than the melting point of the solder 22, and the contact angle of the surface of the shielding film 112 with respect to the molten solder 22 should be greater than 90 degrees. Based on this requirement, the material of the shielding film 112 can be selected from, but is not limited to, polyimide, silicone resin, bismaleimide, polyetheretherketone, cyanate ester resin, polybenzimidazole, modified epoxy resin, polyamide-imide, polytetrafluoroethylene, alumina, aluminum nitride, boron nitride, or quartz glass.

[0063] Depending on the specific material chosen for the masking film 112, its fabrication process on the first component 110 can also vary. For example, the masking film 112 can be formed on the first metal surface 111 of the first component 110 using one of the following processes: coating, thin film deposition, or bonding. As shown in FIG1, the outer edge of the masking film 112 can extend to the edge of the first metal surface 111. In other embodiments not illustrated in the drawings, the outer edge of the masking film can also be located inside the edge of the first metal surface.

[0064] Figure 2 shows a schematic diagram of the relative positions of the shielding film 112 of the first component 110 and the second metal surface 131 of the second component 130 in some embodiments of this application. Referring to Figure 2, in some embodiments of this application, the maximum distance c between the edge of the second metal surface 131 of the second component 130 and the edge of the opening area 1120 can be designed to be less than or equal to 0.3 mm. That is, the second metal surface 131 of the second component 130 is allowed to have a maximum process error of 0.3 mm relative to the opening area 1120. For example, the maximum distance c can be designed to be 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, or 0.3 mm, and is not limited to these specific values. Allowing appropriate process errors facilitates, on the one hand, the assembly and alignment of the second component 130 and the first component 110; on the other hand, it facilitates the size control of the masking film 112, thereby facilitating the fabrication of the masking film 112 on the first metal surface 111; furthermore, it allows the molten solder 22 to be fully spread and filled between the second metal surface 131 and the first portion 1110 of the first metal surface 111, thereby improving the quality of the weld.

[0065] The embodiments of this application do not limit the specific existence of the first metal surface 111 of the first component 110 and the second metal surface 131 of the second component 130. Some embodiments are listed below as examples.

[0066] Referring to Figure 1, in some embodiments of this application, the first component 110 may include a first metal housing 114, wherein the first metal surface 111 may specifically be the surface of the first metal housing 114 facing away from the substrate 30. The first metal housing 114 may be a protective shell or a shielding shell 118 for electromagnetic shielding; this application embodiment does not specifically limit this. Furthermore, the first component 110 may include functional elements 116 or structural components (not shown in the figure) located within the first metal housing 114; this application embodiment does not specifically limit this.

[0067] Figure 3 shows a cross-sectional structural schematic diagram of the welded component 100 according to some other embodiments of this application. Referring to Figure 3, in these embodiments, a first surface metal layer 115, such as a steel sheet 1150, may be provided on the side of the first component 110 facing away from the substrate 30. The first metal surface 111 is the surface of the first surface metal layer 115 facing away from the substrate 30. The first component 110 may include a first main structure 117, and the first surface metal layer 115 is disposed on the side of the first main structure 117 facing away from the substrate 30.

[0068] Figure 4 shows a cross-sectional structural schematic diagram of the welded component 100 according to some embodiments of the present application. Referring to Figure 4, in these embodiments, the first component 110 may include a first metal body 113 made of metal material, wherein the first metal surface 111 is the surface of the first metal body 113 facing away from the substrate 30.

[0069] Figure 5 shows a cross-sectional structural schematic diagram of the welded component 100 in some embodiments of the present application. Referring to Figure 5, in these embodiments, the second component 130 may include a second metal body 132 made of a metallic material, wherein the second metal surface 131 is the surface of the second metal body 132 facing the first component 110.

[0070] In other embodiments not illustrated in the accompanying drawings, the second component may also be designed to include a second metal housing, wherein the second metal surface is the surface of the second metal housing facing the first component. The second metal housing may be a protective shell or a shielding shell for electromagnetic shielding; this application does not specifically limit this. Furthermore, the second component may include functional elements or structural components located within the second metal housing; this application does not specifically limit this.

[0071] Referring to Figure 1, in some embodiments of this application, a second surface metal layer 134, such as a nickel plating layer or a tin plating layer, may be provided on the side of the second component 130 facing the first component 110. The second metal surface 131 is the surface of the second surface metal layer 134 facing the first component 110. The second component 130 may include a second main structure 138, and the second surface metal layer 134 is disposed on the side of the second main structure 138 facing the first component 110.

[0072] In some embodiments of this application, the first component 110 and the second component 130 can be mechanically connected by stacked welding, thereby joining the two together. When the welded component 100 includes multiple components 10, they can be connected together in a similar manner, resulting in a three-dimensional stacked structure that is compact and has high space utilization.

[0073] In some embodiments of this application, the first component 110 and the second component 130 can be electrically connected through stacked welding, thus achieving both mechanical and electrical connections. The welded component 100 has a three-dimensional stacked structure, which is not only compact and has high space utilization, but also provides electrical functional support.

[0074] In this embodiment, the first component 110 can be designed as a support or electronic device, and the second component 130 can be designed as a mounting fastener, support, or electrical connector. The support primarily provides structural support in the electronic device, the mounting fastener primarily provides mounting and fastening, and the electrical connector primarily provides electrical connection.

[0075] As can be seen from the above-listed embodiments, the embodiments of this application do not limit the specific structural form of the welded component 100. The welded component 100 can be flexibly designed in terms of its specific structure and function according to the application scenario, and has a high degree of freedom in product application and design. The following are some examples of the design schemes and application scenarios of the welded component 100 in the embodiments. It should be understood that the embodiments of this application are not limited thereto.

[0076] As shown in Figure 1, in some embodiments, exemplaryly, the substrate 30 may be a circuit board 310, and the first component 110 may be an electronic device disposed on the circuit board 310, having a shielding shell 118 for electromagnetic shielding and serving as the aforementioned first metal shell 114. A shielding film 112 is disposed on the surface of the shielding shell 118 facing away from the substrate 30. The second component 130 may be a wire clip 135 with a plastic body and a second surface metal layer 134 at the bottom, used to fix cables on the circuit board 310.

[0077] As shown in Figure 3, in some embodiments, exemplarily, the substrate 30 can be a circuit board 310, and the first component 110 can be a board-to-board connector 119 (BTB) disposed on the circuit board 310. A steel sheet 1150, serving as the first surface metal layer 115, is provided on the side of the steel sheet 1150 facing away from the circuit board 310, and a shielding film 112 is disposed on the surface of the steel sheet 1150 facing away from the circuit board 310. The second component 130 can be a snap-fit ​​136 with a plastic body and a second surface metal layer 134 at the bottom, used to engage with other corresponding snap-fit ​​structures inside the electronic device. The board-to-board connector is a key component in an electronic device used to directly connect two circuit boards, realizing functions such as signal transmission and power distribution through mechanical and electrical connections.

[0078] As shown in Figure 5, in some embodiments, exemplarily, the base 30 can be a structure 320 with a mounting plane, the first component 110 can be a bracket 120 disposed on the structure 320, and a steel sheet 1150 serving as the first surface metal layer 115 is provided on the side of the bracket 1150 facing away from the structure 320. A shielding film 112 is disposed on the surface of the steel sheet 1150 facing away from the structure 320. The second component 130 can be a support 137 made entirely of copper material, which serves to support the structure 320 and other structures of the electronic device.

[0079] Figure 6 shows a cross-sectional structural schematic diagram of the welding component 100 according to some embodiments of this application. Referring to Figure 6, in these embodiments, exemplarily, the substrate 30 can be a circuit board 310, and the welding component 100 can include three parts 10 stacked and welded along a direction D orthogonal to the surface S of the circuit board 310. Along the D direction, the first part and the second part, and the second part and the third part, respectively serve as the aforementioned "two stacked adjacent parts," and the design scheme of the aforementioned embodiments can be adopted. The first part and the second part can be mechanically or electrically connected, and the second part and the third part can be mechanically or electrically connected. The welding component 100 has a three-dimensional stacked structure, which not only realizes the functional integration of multiple parts 10, but also has a compact structure and high space utilization.

[0080] According to some embodiments of this application, a method for manufacturing a welded component is also provided. Figure 7 shows a schematic flowchart of a method 800 for manufacturing a welded component according to some embodiments of this application. This method 800 can be used to manufacture the aforementioned welded component 100. Referring to Figures 1 and 7, the manufacturing method 800 may include the following steps S1 to S3.

[0081] In step S1, the first component 110 is fixed to the surface of the substrate 30, wherein the first component 110 includes a first metal surface 111 facing away from the substrate 30.

[0082] In step S2, a shielding film 112 is formed on the first metal surface 111, wherein the melting point of the shielding film 112 is greater than the melting point of the brazing filler metal 22 used for brazing, and the shielding film 112 is provided with an opening area 1120, the opening area 1120 exposing a first portion 1110 of the first metal surface 111.

[0083] In step S3, the second component 130 is stacked and welded to the first component 110 on which the shielding film 112 is fabricated. The second component 130 includes a second metal surface 131 facing the first component 110. The second metal surface 131 is brazed to a first portion 1110 of the first metal surface 111. During the brazing process, the opening area 1120 of the shielding film 112 is used to restrict the flow of molten brazing filler metal 22 in the first portion 1110 of the first metal surface 111.

[0084] Compared with the aforementioned related technologies, the above-described manufacturing method 800 has at least the following advantages:

[0085] On the one hand, since the melting point of the shielding film 112 is greater than that of the brazing filler metal 22, and the contact angle of the surface of the shielding film 112 with the molten brazing filler metal 22 is greater than 90 degrees, the surface energy of the shielding film 112 is low and it is not easy to be wetted by the molten brazing filler metal 22. Thus, in step S3, the shielding film 112 can prevent the molten brazing filler metal 22 from adhering to and spreading on its surface. Therefore, the molten brazing filler metal 22 can be precisely confined within the opening area 1120 during the brazing process, that is, confined to the flow on the first part 1110 of the first metal surface 111. This is beneficial to improving the accuracy and reliability of the welding of the first part 110 and the second part 130.

[0086] On the other hand, the first component 110 and the second component 130 are not required to be metal components. This allows for more flexible application and design of the first component 110 and the second component 130, thus giving the welded component 100 a high degree of freedom in product application and design.

[0087] Furthermore, in some embodiments, two adjacent stacked components can be welded using surface mount technology. This allows the welded component 100 to be manufactured on a surface mount technology production line for electronic devices, offering greater flexibility in manufacturing and improving production efficiency while reducing costs.

[0088] In this embodiment, the material of the shielding film 112 may be selected from, but is not limited to, polyimide, silicone resin, bismaleimide, polyetheretherketone, cyanate resin, polybenzimidazole, modified epoxy resin, polyamide-imide, polytetrafluoroethylene, alumina, aluminum nitride, boron nitride, or quartz glass.

[0089] In this embodiment of the application, in step S2, a masking film 112 can be formed on the first metal surface 111 by, for example, coating, thin film deposition, or bonding. When the specific material of the masking film 112 is selected differently, its preparation process on the first part 110 can also be different.

[0090] For example, in some embodiments, the masking film 112 is made of insulating resin materials such as polyimide, silicone resin, bismaleimide, polyetheretherketone, cyanate resin, polybenzimidazole, modified epoxy resin, or polyamide-imide. The film layer can be pre-prepared according to certain specifications and patterns, and then bonded to the first metal surface 111 by an adhesive. The adhesive can be pre-made on the surface of the first metal surface 111 or the surface of the masking film 112.

[0091] For example, in some embodiments, the masking film 112 is made of polytetrafluoroethylene, which can be formed on the first metal surface 111 by a coating process using a polytetrafluoroethylene coating and a mask, wherein the mask is used to form the desired pattern of the coating.

[0092] For example, in some embodiments, the masking film 112 is made of materials such as aluminum oxide, aluminum nitride, boron nitride, or quartz glass, and it can be formed on the first metal surface 111 by a thin film deposition process, such as chemical vapor deposition, physical vapor deposition, or atomic layer deposition. More embodiments for preparing the masking film 112 are not listed here.

[0093] In some embodiments of this application, in step S3, surface mount technology can be used to braze the second metal surface 131 to the first portion 1110 of the first metal surface 111. Surface mount technology enables miniaturization, high density, high precision, and automated high-efficiency assembly, and is a major manufacturing process used in electronic device production. In these embodiments, the welded component 100 can be manufactured on a surface mount technology production line for electronic devices. This provides greater flexibility in the manufacturing process of the welded component 100, which helps improve production efficiency and reduce production costs.

[0094] Figure 8 shows a schematic diagram of the process of step S3 described above in some embodiments. Referring to Figure 8, in these embodiments, the above-described brazing connection of the second metal surface 131 to the first portion 1110 of the first metal surface 111 may include the following sub-steps S31 to S34.

[0095] In sub-step S31, the stencil 20 is aligned with the first part 110 on which the masking film 112 is fabricated. The stencil 20 has a cutout area 21, which exposes a first portion 1110 of the first metal surface 111. The stencil 20 serves as a mask, which can prevent the filling of brazing filler metal 22 in unnecessary areas in subsequent sub-step S32.

[0096] In some embodiments, referring to FIG8, when the surface of the substrate 30 needs to assemble the welding component 100 and other structural components 140 that need to be welded together, and the brazing filler metal 22 is arranged at approximately the same height position for the welding component 100 and the other structural components 140, the cutout area 21 of the stencil 20 can be designed to be opposite to the first portion 1110 of the first metal surface 111 and the welding area of ​​the other structural components 140. In this way, the welding component 100 and the other structural components 140 can be assembled in a single surface mount process, resulting in high production efficiency. As shown in FIG8, the other structural component 140 includes a lower component 141 and an upper component 142 that are welded together. The lower component 141 can be, for example, but not limited to, the support frame shown in the figure, and the upper component 142 can be, for example, but not limited to, the top plate shown in the figure, which needs to be welded together with the support frame. In practical applications, the height H2 of the lower component 141 of the other structural component 140 can be slightly higher than the height H1 of the first component 110 on which the shielding film 112 is made. For example, the maximum distance between H2 and H1 can be 0.8 mm. In this way, the first component 110 will not interfere with the arrangement of the steel mesh 20, and it is also beneficial for the molten brazing filler metal 22 to spread and fill the first part 1110 of the first metal surface 111.

[0097] In sub-step S32, the brazing filler metal 22 is filled into the cutout area 21. For example, a scraper 23 can be used to scrape a sufficient amount of brazing filler metal 22 along the surface of the steel mesh 20 under a certain pressure, thereby filling the cutout area 21 with brazing filler metal 22.

[0098] In sub-step S33, the stencil 20 is separated from the first part 110 on which the shielding film 112 is formed, thereby leaving the brazing filler metal 22 in the corresponding soldering area. As shown in FIG8, in these embodiments, in sub-step S33, the brazing filler metal 22 remains in the first portion 1110 of the first metal surface 111 and the top soldering area of ​​the lower part 141.

[0099] In sub-step S34, the second metal surface 131 is brazed to the first portion 1110 of the first metal surface 111 by reflow soldering. Reflow soldering utilizes high temperature for a short time on the soldering area provided with solder 22 to connect the two parts together. As shown in FIG8, in these embodiments, in sub-step S34, the upper part 142 and the lower part 141 are also simultaneously brazed together by reflow soldering.

[0100] In this sub-step S34, since the melting point of the shielding film 112 is greater than that of the solder 22, and the contact angle of the surface of the shielding film 112 with the molten solder 22 is greater than 90 degrees, the shielding film 112 is not easily wetted by the molten solder 22, and the molten solder 22 can be precisely confined within the opening area 1120, thereby improving the accuracy and reliability of welding the first part 110 and the second part 130.

[0101] Figure 9 shows a schematic diagram of the process of step S3 described above in some other embodiments of this application. In these embodiments, multiple welding components 100 need to be assembled on the surface of the substrate 30, and the solder 22 is arranged at approximately the same height position on the multiple welding components 100. Similar to the process shown in Figure 8, step S3 may include sub-steps S31 to S34. In these embodiments, the cutout area 21 of the stencil 20 is designed to face the first portion 1110 of the first metal surface 111 of the multiple first parts 110, so that multiple welding components 100 can be assembled in one surface mount process, resulting in high production efficiency.

[0102] In some embodiments of this application, in step S3 above, instead of surface mount technology, laser brazing can be used to braze the second metal surface 131 to the first portion 1110 of the first metal surface 111. Laser brazing is a process that uses a high-energy-density laser as a heat source to melt the brazing filler metal 22 to achieve material bonding. Laser brazing has advantages such as high welding precision, small heat-affected zone, non-contact processing, and high degree of automation.

[0103] According to some embodiments of this application, a circuit board assembly is also provided. Figures 10 and 11 respectively show schematic cross-sectional views of a circuit board assembly 300 according to some embodiments of this application. Referring to Figures 10 or 11, the circuit board assembly 300 may include a circuit board 310 and a welding member 100 disposed on one side of the circuit board 310. The welding member 100 may be a welding member of the aforementioned embodiments or a welding member manufactured according to the aforementioned manufacturing method 800, wherein the circuit board 310 serves as a base 30 for assembling the welding member 100.

[0104] Each component 10 of the welding component 100 is not required to be a metal component. For example, the aforementioned first component may include a first metal body made of a metal material, or the aforementioned first component may include a first metal shell, or the side of the aforementioned first component facing away from the circuit board may have a first surface metal layer. The aforementioned second component may include a second metal body made of a metal material, or the aforementioned second component may include a second metal shell, or the side of the aforementioned second component facing the first component may have a second surface metal layer.

[0105] In some embodiments, the first component 110 and the second component 130 on the circuit board assembly 300 can be mechanically connected by stacking and welding, thereby connecting the two together. When the welding component 100 includes multiple components 10, they can be connected together in a similar manner, resulting in a three-dimensional stacked structure that is compact and has high space utilization.

[0106] In other embodiments, the first component 110 and the second component 130 on the circuit board assembly 300 are electrically connected by stacking and soldering, thus achieving both mechanical and electrical connections. The soldered components 100 have a three-dimensional stacked structure, which is not only compact and space-efficient but also provides electrical functional support. In some embodiments, the first component 110 may be designed as a support or electronic device, and the second component 130 may be designed as a mounting fastener, support, or electrical connector.

[0107] In some embodiments, referring to FIG10, when the circuit board assembly 300 includes a plurality of soldering components 100, the plurality of soldering components 100 can be assembled by a single surface mount process, resulting in high production efficiency.

[0108] In some embodiments, referring to FIG11, when the circuit board assembly 300 includes a welding component 100 and other structural components 140 that need to be welded and assembled, the welding component 100 and other structural components 140 can be assembled in a single surface mount process, resulting in high production efficiency.

[0109] The circuit board assembly 300 of this application embodiment has a high manufacturing precision for its welding component 100, and the welding component 100 has a high degree of freedom in design and production.

[0110] According to some embodiments of this application, an electronic device is also provided. FIG12 shows a simplified structural schematic diagram of an electronic device 500 according to some embodiments of this application. As shown in FIG12, in these embodiments, the electronic device 500 may include a housing 510 and a circuit board assembly 300 of the above embodiments disposed within the housing 510.

[0111] The specific product type of Electronic Devices 500 is not limited, and may include, but is not limited to, mobile phones, tablets, laptops, monitors, televisions, smart wearables, servers, or in-vehicle devices.

[0112] In some embodiments of this application, the welding components of the electronic device may not be disposed on the circuit board, but rather on other substrates, such as a base plate or other structures with mounting planes. These embodiments are not illustrated in the accompanying drawings.

[0113] The electronic device according to the embodiments of this application has high manufacturing precision for its welded components, and the welded components have a high degree of freedom in design and production.

[0114] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A welded component (100), characterized in that, The welded component (100) is used to be disposed on the surface of the base (30). The welded component (100) includes a plurality of stacked welded parts (10). In any two stacked adjacent parts (10), one is a first part (110) and the other is a second part (130). The first component (110) includes: a first metal surface (111) facing away from the substrate (30) and a shielding film (112) formed on the first metal surface (111), wherein the shielding film (112) has an opening area (1120) that exposes a first portion (1110) of the first metal surface (111), the melting point of the shielding film (112) is greater than the melting point of the brazing filler metal (22) used for brazing, and the contact angle of the surface of the shielding film (112) with the molten brazing filler metal (22) is greater than 90 degrees; The second component (130) includes a second metal surface (131) facing the first component (110), and the second metal surface (131) is brazed to a first portion (1110) of the first metal surface (111).

2. The welded component (100) according to claim 1, characterized in that, The material of the shielding film (112) includes polyimide, silicone resin, bismaleimide, polyether ether ketone, cyanate resin, polybenzimidazole, modified epoxy resin, polyamide imide, polytetrafluoroethylene, alumina, aluminum nitride, boron nitride, or quartz glass.

3. The welded component (100) according to claim 1 or 2, characterized in that, The maximum distance between the edge of the second metal surface (131) and the edge of the opening area (1120) is less than or equal to 0.3 mm.

4. The welded component (100) according to any one of claims 1 to 3, characterized in that, The first component (110) includes a first metal body (113), and the first metal surface (111) is the surface of the first metal body (113) facing away from the substrate (30); or The first component (110) includes a first metal housing (114), the first metal surface (111) being the surface of the first metal housing (114) facing away from the substrate (30); or The first component (110) has a first surface metal layer (115) on the side opposite to the substrate (30), and the first metal surface (111) is the surface of the first surface metal layer (115) opposite to the substrate (30).

5. The welded component (100) according to any one of claims 1 to 4, characterized in that, The second component (130) includes a second metal body (132), and the second metal surface (131) is the surface of the second metal body (132) facing the first component (110); or The second component (130) includes a second metal housing, and the second metal surface (131) is the surface of the second metal housing facing the first component (110); or The second component (130) has a second surface metal layer (134) on the side facing the first component (110), and the second metal surface (131) is the surface of the second surface metal layer (134) facing the first component (110).

6. The welded component (100) according to any one of claims 1 to 5, characterized in that, The first component (110) is mechanically connected to the second component (130); or The first component (110) is electrically connected to the second component (130).

7. The welded component (100) according to any one of claims 1 to 5, characterized in that, The first component (110) is a support or electronic device, and the second component (130) is a mounting fastener, support, or electrical connector.

8. A method for manufacturing a welded component (800), characterized in that, include: The first component (110) is fixed to the surface of the substrate (30), wherein the first component (110) includes a first metal surface (111) facing away from the substrate (30); A shielding film (112) is formed on the first metal surface (111), wherein the melting point of the shielding film (112) is greater than the melting point of the brazing filler metal (22) used for brazing, and the shielding film (112) has an opening area (1120) that exposes a first portion (1110) of the first metal surface (111); and The second component (130) is stacked and welded to the first component (110) on which the shielding film (112) is formed, wherein the second component (130) includes a second metal surface (131) facing the first component (110), the second metal surface (131) is brazed to a first portion (1110) of the first metal surface (111), and during the brazing process, the opening area (1120) is used to restrict the flow of molten brazing filler metal (22) in the first portion (1110) of the first metal surface (111).

9. The manufacturing method (800) according to claim 8, characterized in that, Fabricating a masking film (112) on the first metal surface (111) includes: A masking film (112) is formed on the first metal surface (111) by means of a coating process, a thin film deposition process, or a bonding process.

10. The manufacturing method (800) according to claim 8 or 9, characterized in that, Stacking and welding the second component (130) to the first component (110) on which the shielding film (112) is formed, includes: The second metal surface (131) is brazed to the first part (1110) of the first metal surface (111) using surface mount technology.

11. The manufacturing method (800) according to claim 10, characterized in that, Using surface mount technology, the second metal surface (131) is brazed to the first portion (1110) of the first metal surface (111), including: Align the steel mesh (20) with the first part (110) on which the shielding film (112) is made, wherein the steel mesh (20) is provided with a hollow area (21), and the hollow area (21) exposes a first part (1110) of the first metal surface (111); Fill the hollow area (21) with brazing filler metal (22); Separate the steel mesh (20) from the first component (110) on which the shielding film (112) is formed; and The second metal surface (131) is brazed to the first portion (1110) of the first metal surface (111) by reflow soldering.

12. The manufacturing method (800) according to claim 8 or 9, characterized in that, Stacking and welding the second component (130) to the first component (110) on which the shielding film (112) is formed, includes: The second metal surface (131) is brazed to the first part (1110) of the first metal surface (111) using a laser brazing process.

13. A circuit board assembly (300), characterized in that, include: Circuit board (310); and A welding component (100) is disposed on one side of the circuit board (310). The welding component (100) is a welding component (100) according to any one of claims 1 to 7, or a welding component obtained by the manufacturing method (800) according to any one of claims 8 to 12, wherein the circuit board (310) serves as the substrate (30).

14. An electronic device (500), characterized in that, include: Outer shell (510); as well as The welding member (100) provided in the housing (510) according to any one of claims 1 to 7, or the welding member obtained by the manufacturing method (800) according to any one of claims 8 to 12, or the circuit board assembly (300) according to claim 13.

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