Punching and transferring device and punching and transferring method therefor

Abstract

The present application discloses a punching and transferring device and a punching and transferring method therefor. The punching and transferring device comprises: a fixed module; a carrier module, the carrier module being disposed on one side of the fixed module, the surface of the side of the carrier module facing the fixed module being provided with a plurality of accommodating slots, and the bottoms of the plurality of accommodating slots being provided with a plurality of corresponding first through holes; a punching module, the punching module being disposed on the other side of the fixed module opposite to the carrier module; and a transferring module, the transferring module being disposed on the side of the carrier module opposite to the fixed module, and the transferring module being configured such that, when the transferring module applies an upward acting force to the carrier module, the transferring module and the carrier module are connected by insertion by means of the plurality of first through holes. The technical solution can ensure automated taping efficiency of non-planar plastic products.

Description

Punching and Transfer Device and Punching and Transfer Method

[0001] This application claims priority to Chinese Patent Application No. 202510397764.7, filed on March 28, 2025, entitled "A punching and transferring device and a punching and transferring method thereof", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of injection molding processing technology, and in particular to a punching and transfer device and a punching and transfer method thereof. Background Technology

[0003] As is well known, the blue film taping process involves pre-arranging plastic products on a blue film (a blue, sticky film), and then taping them together using methods such as visual scanning positioning and suction nozzles. In the traditional blue film taping process, the pre-arranging of plastic products on the blue film primarily involves a vibratory feeder separating the front and back sides of the plastic products before automatically transferring them in batches onto the blue film. Summary of the Invention

[0004] This application provides a punching and transfer device and a punching and transfer method, which aims to improve the technical problem that the existing blue film taping process cannot efficiently and directionally arrange a large number of non-planar plastic products on the blue film, thus seriously affecting the automated taping efficiency of non-planar plastic products.

[0005] Therefore, this application provides a punching and transfer device, which includes: a fixing module;

[0006] A material loading module is disposed on one side of the fixed module, and a plurality of receiving grooves are provided on the surface of the side facing the fixed module, and a plurality of first through holes are provided on the bottom of the plurality of receiving grooves.

[0007] A punching module, wherein the punching module is disposed on the opposite side of the fixed module opposite to the material loading module; and

[0008] A transfer module is disposed on the side of the material-carrying module opposite to the fixed module, and the transfer module is configured such that when the transfer module applies an upward force to the material-carrying module, the transfer module and the material-carrying module are connected by insertion through the plurality of first through holes.

[0009] Furthermore, this application embodiment also provides a punching and transfer method, applied in the above-mentioned punching and transfer device, the punching and transfer method comprising the following steps:

[0010] The fixing module is used to pre-enclose and fix the injection molded part to be processed, so that the side surface of the injection molded part to be processed with a plurality of plastic components is set downward, while each of the plastic components is exposed.

[0011] The punching module performs a punching operation on the injection molded part to be processed, so that each of the plastic components on the injection molded part to be processed falls into the corresponding receiving groove on the material loading module;

[0012] Remove the fixing module and attach the blue film to be processed with the adhesive surface facing down to the side of the material loading module facing the fixing module;

[0013] The transfer module applies an upward force to the plastic components in the corresponding receiving groove through each of the first through holes, so that all the plastic components in the receiving groove are bonded to the blue film to be processed in a preset direction.

[0014] The technical solution provided in this application, through the above-described structural configuration, allows for the arrangement of a large number of non-planar plastic products (i.e., irregularly shaped plastic parts) on a blue film to complete the corresponding blue film taping process. Only a corresponding punching and transfer operation needs to be performed on the corresponding injection molded parts. The specific process is as follows: First, the corresponding injection molded parts are pre-set and fixed using the fixing module of this punching and transfer device, so that the side surface of the injection molded part with several protruding plastic parts faces downwards, exposing at least each plastic part and the corresponding punching portion. Then, the punching and transfer device... The cutting die assembly performs a cutting operation on each punching portion of the injection molded part, causing each plastic component on the injection molded part to fall vertically into the corresponding receiving groove on the material loading module of this cutting and transfer device. Finally, after the bonding surface of the blue film is attached downwards to the side of the material loading module facing the fixing module, the transfer module of this cutting and transfer device passes through each first through hole on the material loading module to apply an upward force to the plastic components in the corresponding receiving grooves, ultimately ensuring that all plastic components in the receiving grooves are bonded to the blue film in a preset direction. In this way, this cutting and transfer device can efficiently and consistently transfer a large number of non-planar plastic products (i.e., irregularly shaped plastic components) to the surface of the blue film, ensuring the automated tape-making efficiency of non-planar plastic products. Therefore, this technical solution effectively improves the technical problem that existing blue film tape-making processes cannot efficiently and consistently arrange a large number of non-planar plastic products on the blue film, thus seriously affecting the automated tape-making efficiency of non-planar plastic products. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 is a schematic diagram of the punching and transfer device according to an embodiment of this application;

[0017] Figure 2 is a schematic diagram of one working state of the punching and transfer device shown in Figure 1;

[0018] Figure 3 is a schematic diagram of another working state of the punching and transfer device shown in Figure 1;

[0019] Figure 4 is a schematic diagram of another working state of the punching and transfer device shown in Figure 1;

[0020] Figure 5 is a schematic diagram of another working state of the punching and transfer device shown in Figure 1;

[0021] Figure 6 is a schematic diagram of another working state of the punching and transfer device shown in Figure 1;

[0022] Figure 7 is a schematic diagram of the finished product structure obtained after the punching and transfer device shown in Figure 1 performs punching and transfer operations on the injection molded part.

[0023] Figure 8 is a flowchart of the punching and transfer method according to an embodiment of this application. Embodiments of the present invention

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0025] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0026] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of a person skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, the user should consider such a combination of technical solutions to be non-existent and not within the scope of protection claimed in this application.

[0027] As shown in Figures 1 to 7, this application embodiment provides a punching and transfer device 100. The punching and transfer device 100 includes a fixing module 110. The fixing module 110 is used to pre-enclose and fix the injection molded part 200, such that the side surface of the injection molded part 200 with a plurality of plastic components 210 protruding is set downward, and at least each plastic component 210 and the corresponding punching part (not shown) of each plastic component 210 are exposed. The punching and transfer device 100 also includes a material loading module 120. The material loading module 120 is located below the fixing module 110, and a plurality of receiving grooves 121 are recessed on the side surface facing the fixing module 110. The plurality of receiving grooves 121 are arranged one-to-one with the plurality of plastic components 210. The inner contour of each receiving groove 121 is adapted to the outer contour of the corresponding plastic component 210, and a first through hole 1211 is opened at the bottom of each receiving groove 121. The punching and transfer device 100 also includes a punching module 130. The punching module 130 is located above the fixed module 110 and is used to perform punching operations on each punching portion of the injection molded part 200 on the fixed module 110, so that each plastic component 210 on the injection molded part 200 falls vertically into the corresponding receiving groove 121. The punching and transfer device 100 also includes a transfer module 140. The transfer module 140 is located below the material carrier module 120 and is used to apply an upward force to the plastic component 210 in the corresponding receiving groove 121 through each first through hole 1211 when the adhesive surface of the blue film 300 is attached downwards to the side surface of the material carrier module 120 facing the fixed module 110, so that all the plastic components 210 in the receiving grooves 121 are adhered to the blue film 300 in a preset direction.

[0028] It is understood that the punching and transfer device 100 in this embodiment is mainly used for the punching and transfer operation of the injection molded part 200. The injection molded part 200 mainly refers to the integral part formed during the mass production of plastic components 210 to be subjected to the blue film braiding process. That is, after the injection molded part 200 is injection molded through the corresponding injection molding process, a number of plastic components 210 will be protruding on one side surface of the injection molded part 200. Since these plastic components 210 are uniformly injection molded through the same injection molding process, they not only have the same shape, but also have the same placement angle (or placement direction) on the injection molded part 200. By performing the punching and transfer operation on the injection molded part 200 through this punching and transfer device 100, not only can all these plastic components 210 be separated from the waste on the injection molded part 200, but these plastic components 210 can also be transferred in batches to the corresponding blue film 300 to complete the relevant steps of the corresponding blue film braiding process. The aforementioned fixing module 110 pre-encloses and fixes the injection molded part 200. Specifically, the fixing module 110 uses a conventional semi-enclosed or fully enclosed clamping structure to position the side of the injection molded part 200 with several protruding plastic components 210 facing downwards above the supporting module, exposing at least each plastic component 210 and its corresponding punched portion, to facilitate subsequent punching operations on each plastic component 210. The aforementioned punching operation, which ensures that each plastic component 210 on the injection molded part 200 falls vertically into its corresponding receiving groove 121, refers to a structural arrangement where the inner contour of each receiving groove 121 matches the outer contour of the corresponding plastic component 210. This ensures that the placement angle (or placement direction) of the plastic components 210 within each receiving groove 121 is consistent. Thus, when the transfer module 140 applies an upward force to the plastic component 210 in the corresponding receiving tank 121 through each first through hole 1211, it can ensure that all the plastic components 210 in the receiving tank 121 are bonded to the blue film 300 in the preset direction.

[0029] In addition, to achieve support, fixation and connection between the various components of the punching and transfer device 100, the punching and transfer device 100 also includes a frame (not shown). The fixing module 110, the loading module 120, the punching module 130 and the transfer module 140 are respectively mounted on the frame by a fixed method or by a movable method.

[0030] Thus, the punching and transfer device 100 in this embodiment, through the above-described structural configuration, when a large number of non-planar plastic products (i.e., irregularly shaped plastic components 210) need to be arranged on the blue film 300 to complete the corresponding blue film taping process, only the corresponding injection molded parts 200 need to be punched and transferred. The specific process is as follows: First, the corresponding injection molded parts 200 are pre-set and fixed by the fixing module 110 of the punching and transfer device 100, so that the side surface of the injection molded part 200 with several plastic components 210 protruding is set downwards, and at least each plastic component 210 and the corresponding punching part of each plastic component 210 are exposed. Then, the punching module 130 of the punching and transfer device 100 is used to... Each punching portion on the injection molded part 200 is punched, so that each plastic component 210 on the injection molded part 200 falls vertically into the corresponding receiving groove 121 on the material loading module 120 of the punching transfer device 100. Finally, when the adhesive surface of the blue film 300 is attached downward to the side of the material loading module 120 facing the fixing module 110, the transfer module 140 of the punching transfer device 100 passes through each first through hole 1211 on the material loading module 120 to apply an upward force to the plastic component 210 in the corresponding receiving groove 121, so that all the plastic components 210 in the receiving groove 121 are bonded to the blue film 300 in a preset direction. Thus, this punching and transfer device 100 can efficiently and consistently transfer a large number of non-planar plastic products (i.e., irregularly shaped plastic devices 210) onto the surface of the blue film 300, thereby ensuring the automated tape-making efficiency of non-planar plastic products.

[0031] In some examples, as shown in Figures 1 and 2, the fixing module 110 includes a first fixing module 111, which is movably disposed above the material loading module 120. The first fixing module 111 has a first fixing surface on its side away from the material loading module 120 for attaching and fixing the injection molded part 200. The first fixing module 111 also has several clearance holes 1111, so that when the side surface of the injection molded part 200 with several plastic components 210 protruding is attached and fixed to the first fixing surface, the several plastic components 210 are correspondingly accommodated in the several clearance holes 1111, thus exposing the corresponding plastic component 210 through each clearance hole 1111. In this way, through the above structural arrangement, the fixing module 110 can effectively achieve the pre-set enclosure and fixing of the injection molded part 200, so that while the side surface of the injection molded part 200 with several plastic components 210 protruding faces downwards, each plastic component 210 is exposed.

[0032] It is understood that, in this example, the first fixing surface used to attach and fix the injection molded part 200 specifically means that the side surface of the injection molded part 200 with several protruding plastic components 210 can be tightly attached and fixed to the first fixing surface by means of adhesive bonding or with the assistance of other auxiliary structures. These other auxiliary structures can specifically be screw structures, snap-fit ​​structures, or clip structures, etc.

[0033] In some examples, as shown in Figures 1 to 3, the fixing module 110 further includes a second fixing module 112. The second fixing module 112 is movably disposed above the first fixing module 111, and a second fixing surface is provided on the side of the second fixing module 112 facing the first fixing module 111 to cooperate with the first fixing surface to surround and fix the injection molded part 200. The first fixing module 111 also has a plurality of second through holes 1121, which are respectively provided with a plurality of punched parts, so that the corresponding punched parts are exposed through each second through hole 1121. In this way, through the above structural arrangement, the fixing module 110 can effectively achieve the preset surrounding and fixing of the injection molded part 200 through the clamping cooperation between the second fixing module 112 and the first fixing module 111, so that the side surface of the injection molded part 200 with a plurality of plastic components 210 is set downward, and at least each plastic component 210 and the corresponding punched part of each plastic component 210 are exposed.

[0034] Furthermore, the fixing module 110 also includes a first power mechanism (not shown). At least one of the first fixing module 111 and the second fixing module 112 is driven by the first power mechanism, so that the distance between the first fixing module 111 and the second fixing module 112 changes under the drive of the first power mechanism, thereby pre-setting and fixing the injection molded part 200 through the first fixing surface and the second fixing surface. In this way, when the first power mechanism is driven by only one of the first fixing module 111 and the second fixing module 112, it can achieve the pre-setting and fixing of the injection molded part 200 by driving one of the first fixing module 111 and the second fixing module 112 to move closer to the other of the first fixing module 111 and the second fixing module 112. When the first power mechanism is driven by both the first fixing module 111 and the second fixing module 112, it can achieve the pre-setting and fixing of the injection molded part 200 by driving the first fixing module 111 and the second fixing module 112 to move towards each other.

[0035] Furthermore, the fixing module 110 also includes a second power mechanism (not shown). The second power mechanism is simultaneously connected to both the first fixing module 111 and the second fixing module 112, so that, driven by the second power mechanism, the first fixing module 111 and the second fixing module 112 are either located directly above the material loading module 120 or away from directly above the material loading module 120. Thus, with the above structural arrangement, the entire fixing module 110 can be movably positioned directly above the material loading module 120, facilitating the movement of the fixing module 110 to or away from directly above the material loading module 120 as needed during the actual punching and transfer operation.

[0036] It is understood that either the first power mechanism or the second power mechanism in this example can be a conventional electric motor power structure or a cylinder power structure, driving the first fixed module 111 or the second fixed module 112 to move in the corresponding direction through a motor-driven transmission wheel or a cylinder telescopic movement. Generally, the first power mechanism in this example can be a lifting power mechanism, and the second power mechanism in this example can be a rotational power mechanism.

[0037] In some examples, as shown in Figures 1 and 4, the punching module 130 includes a first ejector module 131 and a third power mechanism for driving the first ejector module 131 to rise and fall. The first ejector module 131 includes a plurality of first ejector pins 1311, and the plurality of first ejector pins 1311 are arranged in a one-to-one correspondence with a plurality of second through holes 1121. Thus, with the above structural arrangement, the punching operation of a corresponding plastic component 210 on the injection molded part 200 can be completed by each first ejector pin 1311.

[0038] It is understood that the third power mechanism in this example can be a conventional motor power structure or a cylinder power structure, which drives the first ejector module 131 to rise and fall through the means of motor drive and transmission wheel transmission, or through the extension and retraction of the cylinder. The first ejector module 131 in this example can also adopt the following structure, which includes only one first ejector 1311. In this case, the punching module 130 also includes a first translation mechanism, which is used to drive the first ejector 1311 to move horizontally to directly above each second through hole 1121, so as to complete the punching operation on each plastic part 210 on the injection molded part 200 through the first ejector 1311.

[0039] In some examples, as shown in Figures 1 and 3 to 6, the transfer module 140 includes a second ejector module 141 and a fourth power mechanism for driving the second ejector module 141 to move up and down. The second ejector module 141 includes a plurality of second ejector pins 1411, which are correspondingly arranged with a plurality of first through holes 1211. Thus, with the above structural arrangement, each second ejector pin 1411 can apply an upward force to the plastic component 210 in the corresponding receiving groove 121. Furthermore, the diameter of the second ejector pin 1411 is smaller than the diameter of the first ejector pin 1311. This parameter setting ensures that the second ejector pin 1411 can better apply an upward force to the plastic component 210 in the corresponding receiving groove 121.

[0040] It is understood that the fourth power mechanism in this example can be a conventional motor power structure or a cylinder power structure, which drives the second ejector module 141 to rise and fall through the means of motor drive and transmission wheel transmission, or through the extension and retraction of the cylinder. The second ejector module 141 in this example can also adopt the following structure, which includes only one second ejector 1411. In this case, the punching module 130 also includes a second translation mechanism, which is used to drive the second ejector 1411 to move horizontally to directly below each first through hole 1211, so as to apply an upward force to the plastic component 210 in each receiving groove 121 on the bearing module through the second ejector 1411.

[0041] In some examples, as shown in Figures 1 and 6, the transfer module 140 also includes a rolling module 142 and a fifth power mechanism for driving the rolling module 142 to roll. The rolling module 142 is located above the transfer module 140 and is used to roll the surface of the blue film 300 away from the material loading module 120 when the second ejector pins 1411 have bonded all the plastic parts 210 in the receiving grooves 121 to the blue film 300 in a preset direction. In this way, the above structural arrangement ensures a stronger bond between all the plastic parts 210 and the blue film 300.

[0042] It is understood that the fifth power mechanism in this example can be a conventional motor power structure, so as to realize the rolling movement of the rolling module 142 by driving the rolling module 142 to rotate through the motor.

[0043] In one embodiment, as shown in FIG8, this application embodiment also provides a punching and transfer method, applied in the punching and transfer device of the above embodiment, which specifically includes the following steps:

[0044] Step S110: The injection molded part to be processed is pre-set and fixed by the fixing module, so that the side surface of the injection molded part to be processed with several plastic parts is set downward, while each plastic part is exposed.

[0045] As can be understood, as shown in Figures 1 to 3, the fixing module 110 can be used to pre-set and fix the injection molded part 200 to be processed by clamping and cooperating the first fixing module 111 and the second fixing module 112, so that the side surface of the injection molded part 200 to be processed with a plurality of plastic components 210 is set downward, while each plastic component 210 is exposed through each clearance hole 1111.

[0046] Step S120: The punching module performs a punching operation on the injection molded part to be processed, so that each plastic component on the injection molded part to be processed falls vertically into the corresponding receiving groove on the material loading module.

[0047] As can be understood, as shown in Figure 4, when the injection molded part 200 to be processed is pre-set and fixed through the above method steps, so that the side surface of the injection molded part 200 with a plurality of plastic components 210 protruding is set downward, and each plastic component 210 is exposed through each clearance hole 1111, the injection molded part to be processed can be punched by the downward pressing movement of the first ejector module 131 of the punching module 130. At this time, each first ejector 1311 of the first ejector module 131 passes through each second through hole 1121 to punch each plastic component 210 on the injection molded part 200, so that each plastic component 210 on the injection molded part 200 is separated and then falls vertically into the corresponding receiving groove 121 on the material loading module 120.

[0048] Step S130: Remove the fixing module and attach the adhesive surface of the blue film to be processed to the side of the material carrier module facing the fixing module with the adhesive surface facing down.

[0049] As can be understood, as shown in Figure 5, after each plastic component 210 on the injection molded part 200 to be processed is vertically dropped into the corresponding receiving groove 121 on the material carrier module 120 through the above method steps, the fixing module 110 (including the first fixing module 111 and the second fixing module 112) can be removed, and the adhesive surface of the blue film 300 to be processed is attached downward to the side surface of the material carrier module 120 facing the fixing module 110.

[0050] Step S140: The transfer module applies an upward force to the plastic components in the corresponding receiving tank through each first through hole, so that all the plastic components in the receiving tank are bonded to the blue film to be processed in a preset direction.

[0051] As can be understood, as shown in Figure 6, after the bonding surface of the blue film 300 to be processed is attached downwards to the side surface of the material carrier module 120 facing the fixed module 110 through the above method steps, an upward force can be applied to the plastic components 210 in all the receiving grooves 121 on the carrier module 120 by the upward movement of the second ejector module 141 of the transfer module 140. At this time, each second ejector 1411 of the second ejector module 141 passes through each first through hole 1211 to apply an upward force to the plastic component 210 in the corresponding receiving groove. In this way, all the plastic components 210 in the receiving grooves 121 can be bonded to the blue film 300 to be processed in a preset direction, thus obtaining the finished product shown in Figure 7. In order to ensure a stronger bond between all plastic components 210 and the blue film 300, when several second ejector pins 1411 bond all plastic components 210 in the receiving groove 121 to the blue film 300 in a preset direction, the rolling module 142 of the transfer module 140 can also perform a rolling operation on the side of the blue film 300 away from the material loading module 120 as shown in Figure 6.

[0052] In this way, the punching and transfer method in the application embodiment can efficiently and orientedally transfer a large number of non-planar plastic products (i.e., irregularly shaped plastic devices 210) to the surface of the blue film 300 through the above method steps, so as to ensure the automated tape-making efficiency of non-planar plastic products.

[0053] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A punching and transferring device, the punching and transferring device comprising: Fixed module; A material loading module is disposed on one side of the fixed module, and a plurality of receiving grooves are provided on the surface of the side facing the fixed module, and a plurality of first through holes are provided on the bottom of the plurality of receiving grooves. A punching module is disposed on the opposite side of the fixed module, opposite to the material loading module. as well as A transfer module is disposed on the side of the material-carrying module opposite to the fixed module, and the transfer module is configured such that when the transfer module applies an upward force to the material-carrying module, the transfer module and the material-carrying module are connected by insertion through the plurality of first through holes.

2. The punching and transferring device according to claim 1, wherein, The fixing module includes a first fixing module, which is movably disposed above the material loading module, and a first fixing surface is provided on the side of the first fixing module away from the material loading module. The first fixing module also has several clearance holes.

3. The punching and transferring device according to claim 2, wherein, The fixing module further includes a second fixing module, which is movably disposed above the first fixing module, and the side of the second fixing module facing the first fixing module is provided with a second fixing surface; The first fixing module also has a number of second through holes, and the number of second through holes are configured to correspond one-to-one with the number of avoidance holes.

4. The punching and transferring device according to claim 3, wherein, The fixing module further includes a first power mechanism, and at least one of the first fixing module and the second fixing module is driven by the first power mechanism to change the distance between the first fixing module and the second fixing module under the drive of the first power mechanism.

5. The punching and transferring device according to claim 4, wherein, The first power mechanism is a lifting power mechanism.

6. The punching and transferring device according to claim 5, wherein, The lifting power mechanism is either an electric motor power structure or a cylinder power structure.

7. The punching and transferring device according to claim 3, wherein, The fixing module also includes a second power mechanism, which is simultaneously connected to both the first fixing module and the second fixing module for driving. Under the drive of the second power mechanism, the first fixing module and the second fixing module are either located directly above the material loading module or located away from directly above the material loading module.

8. The punching and transferring device according to claim 7, wherein, The second power mechanism is a rotary power mechanism.

9. The punching and transferring device according to claim 8, wherein, The rotary power mechanism is either an electric motor power structure or a cylinder power structure.

10. The punching and transferring device according to claim 3, wherein, The punching module includes a first ejector module and a third power mechanism for driving the first ejector module to rise and fall. The first ejector module includes one or more first ejectors, and the plurality of first ejectors are configured to correspond one-to-one with a plurality of second through holes.

11. The punching and transferring device according to claim 10, wherein, The one or more first ejector pins include a single ejector pin, and the punching module further includes a first translation mechanism for driving the single first ejector pin to move horizontally toward or away from the plurality of second through holes.

12. The punching and transferring device according to claim 10 or 11, wherein, The transfer module includes a second ejector module and a fourth power mechanism for driving the second ejector module to rise and fall. The second ejector module includes one or more second ejectors, and the plurality of second ejectors are configured to correspond one-to-one with a plurality of first through holes.

13. The punching and transferring device according to claim 12, wherein, The one or more second ejector pins include a second ejector pin, and the punching module further includes a second translation mechanism for driving the one second ejector pin to move horizontally toward or away from the plurality of first through holes.

14. The punching and transferring device according to claim 12, wherein, The plurality of second ejector pins are configured in a one-to-one correspondence with the plurality of second through holes.

15. The punching and transferring device according to any one of claims 12 to 14, wherein, The diameter of the second ejector pin is smaller than the diameter of the first ejector pin.

16. The punching and transferring device according to any one of claims 12 to 15, wherein, The transfer module also includes a rolling module and a fifth power mechanism for driving the rolling module to roll and move, the rolling module being configured opposite to the second ejector pin module.

17. A punching transfer method, wherein, Applied in the punching and transfer apparatus as described in any one of claims 1-16, the punching and transfer method comprises: The fixing module is used to pre-enclose and fix the injection molded part to be processed, so that the side surface of the injection molded part to be processed with a plurality of plastic components is set downward, while each of the plastic components is exposed. The punching module performs a punching operation on the injection molded part to be processed, so that each of the plastic components on the injection molded part to be processed falls into the corresponding receiving groove on the material loading module; Remove the fixing module and attach the blue film to be processed with the adhesive surface facing down to the side of the material loading module facing the fixing module; The transfer module applies an upward force to the plastic components in the corresponding receiving groove through each of the first through holes, so that all the plastic components in the receiving groove are bonded to the blue film to be processed in a preset direction.

Images