Piezoelectric ceramic module, piezoelectric ceramic module packaging method, and electronic device

Abstract

The present disclosure provides a piezoelectric ceramic module, a piezoelectric ceramic module packaging method, and an electronic device. The piezoelectric ceramic module comprises piezoelectric ceramic and a housing. The housing is provided with an accommodating cavity, and the piezoelectric ceramic is disposed in the accommodating cavity. The housing is provided with at least one slit, and the slit can release stress experienced by the piezoelectric ceramic.

Description

Piezoelectric ceramic modules, piezoelectric ceramic module packaging methods and electronic devices

[0001] This disclosure claims priority to Chinese Patent Application No. 202510389082.1, filed on March 28, 2025, entitled “Piezoelectric Ceramic Module, Piezoelectric Ceramic Module Packaging Method and Electronic Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to a piezoelectric ceramic module, a piezoelectric ceramic module packaging method, and an electronic device. Background Technology

[0003] In related technologies, piezoelectric ceramics are typically made into long strips for use in electronic devices such as smartphones, smart headphones, or smart wearables, serving as pressure detection devices, positioning devices, or sound-generating devices. However, during daily use, electronic devices are inevitably subject to drops, causing the long strip-shaped piezoelectric ceramics to easily crack due to impact or vibration.

[0004] Therefore, a new technical solution is needed to solve the above-mentioned technical problems. Summary of the Invention

[0005] One objective of this disclosure is to provide a new technical solution for a piezoelectric ceramic module, a piezoelectric ceramic module packaging method, and an electronic device.

[0006] According to a first aspect of this disclosure, a piezoelectric ceramic module is provided, wherein the piezoelectric ceramic module comprises:

[0007] Piezoelectric ceramics;

[0008] A housing having a receiving cavity, wherein the piezoelectric ceramic is disposed in the receiving cavity;

[0009] The housing has at least one gap, which can release the stress on the piezoelectric ceramic.

[0010] Optionally, the housing includes a support plate and a cover plate, the cover plate being disposed on the support plate to form the receiving cavity;

[0011] The gap is provided on the support plate and / or on the cover plate.

[0012] Optionally, the support plate includes a main body, and the piezoelectric ceramic is connected to the side of the main body near the cover plate;

[0013] The main body has a first gap and a second gap at both ends along its length, and the first gap and the second gap communicate with the receiving cavity.

[0014] Optionally, the support plate further includes a first guardrail and a second guardrail. In the width direction of the main body, the first guardrail is connected to one side of the main body, and the second guardrail is connected to the other side of the main body.

[0015] Optionally, the cover plate includes a first flange, a second flange, and a filling hole, wherein a first gap is formed between the first flange and the first railing, and a second gap is formed between the second flange and the second railing.

[0016] It also includes a seal that fills the first gap and the second gap through the filling hole.

[0017] Optionally, the first guardrail is provided with a first groove, and the second guardrail is provided with a second groove;

[0018] The sealant fills the first groove and the second groove through the filling hole.

[0019] Optionally, the housing further includes a first encapsulation end and a second encapsulation end, wherein the first encapsulation end is connected to one end of the support plate along the length of the support plate, and the second encapsulation end is connected to the other end of the support plate.

[0020] Optionally, the support plate further includes a first extension and a second extension, wherein the first extension is connected to one end of the main body and the second extension is connected to the other end of the main body in the length direction of the main body;

[0021] The support plate is connected to the first encapsulation end via the first extension, and the support plate is connected to the second encapsulation end via the second extension.

[0022] Optionally, it also includes a coupling plate disposed between the support plate and the piezoelectric ceramic, or the coupling plate disposed between the cover plate and the piezoelectric ceramic.

[0023] Optionally, it also includes a flexible circuit board, which has a first end and a second end, the first end being connected to the piezoelectric ceramic; the second end passing through the gap and extending to the outside of the housing.

[0024] According to a second aspect of this disclosure, a piezoelectric ceramic module packaging method is provided, applied to a piezoelectric ceramic module as described in any of the first aspects, wherein the piezoelectric ceramic module packaging method includes:

[0025] The piezoelectric ceramic is disposed in the receiving cavity formed by the housing;

[0026] The slit is formed on the housing to release the stress on the piezoelectric ceramic.

[0027] Optionally, before placing the piezoelectric ceramic in the receiving cavity formed by the housing, the following steps are included:

[0028] A coupling plate is installed on the support plate.

[0029] Optionally, after the coupling plate is provided on the support plate, before placing the piezoelectric ceramic in the receiving cavity formed by the housing, the following steps are included:

[0030] A cover plate is provided on the support plate to form the receiving cavity between the support plate and the cover plate.

[0031] Optionally, after the piezoelectric ceramic is disposed in the receiving cavity formed by the housing, and before forming the slit on the housing to release the stress on the piezoelectric ceramic, the method further includes:

[0032] Along the length of the support plate, a first encapsulation end is connected to one end of the support plate, and a second encapsulation end is connected to the other end of the support plate.

[0033] Optionally, placing the piezoelectric ceramic within the receiving cavity formed by the housing includes:

[0034] The piezoelectric ceramic is disposed on the side of the coupling plate opposite to the support plate.

[0035] Optionally, after forming the slit in the housing to release the stress on the piezoelectric ceramic, the process further includes:

[0036] The first end of the flexible circuit board is connected to the piezoelectric ceramic, and the second end of the flexible circuit board passes through the gap and extends to the outside of the housing.

[0037] According to a second aspect of this disclosure, an electronic device is provided, comprising a piezoelectric ceramic module as described in any of the first aspects.

[0038] The piezoelectric ceramic module disclosed herein uses a gap in the housing to concentrate the impact and vibration of the electronic device from the ground around the gap after the electronic device is dropped. This effectively releases the impact and vibration on the piezoelectric ceramic and improves the drop impact resistance of the piezoelectric ceramic.

[0039] Other features and advantages of this disclosure will become clear from the following detailed description of exemplary embodiments of the disclosure with reference to the accompanying drawings. Attached Figure Description

[0040] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments of the present disclosure and, together with their description, serve to explain the principles of the present disclosure.

[0041] Figure 1 is a schematic diagram of the structure of a piezoelectric ceramic module in one embodiment of this disclosure.

[0042] Figure 2 is an exploded view of a piezoelectric ceramic module in one embodiment of this disclosure.

[0043] Figure 3 is a schematic diagram of the structure of a piezoelectric ceramic in one embodiment of this disclosure.

[0044] Figure 4 is a schematic diagram of the structure of the coupling plate in one embodiment of this disclosure.

[0045] Figure 5 is a schematic diagram of the structure of the support plate in one embodiment of this disclosure.

[0046] Figure 6 is a schematic diagram of the structure of the first package end in the first embodiment of this disclosure.

[0047] Figure 7 is a schematic diagram of the structure of the first package end in the first embodiment of this disclosure.

[0048] Figure 8 is a schematic diagram of the structure of the first encapsulation end in the second embodiment of this disclosure.

[0049] Figure 9 is a schematic diagram of the structure of the first encapsulation end in the second embodiment of this disclosure.

[0050] Figure 10 is a schematic diagram of the structure of the first encapsulation end in the third embodiment of this disclosure.

[0051] Figure 11 is a schematic diagram of the structure of the first encapsulation end in the third embodiment of this disclosure.

[0052] Figure 12 is a schematic diagram of the cover plate in one embodiment of this disclosure.

[0053] Figure 13 is a flowchart of a piezoelectric ceramic module packaging method in one embodiment of the present disclosure.

[0054] Figure 14 is a schematic diagram of the structure after a coupling plate is provided on the main body of the support plate in one embodiment of the present disclosure.

[0055] Figure 15 is a schematic diagram of the structure after piezoelectric ceramics are disposed on the side of the coupling plate away from the support plate in one embodiment of the present disclosure.

[0056] Figure 16 is a schematic diagram of the structure after connecting the first package end and the first extension and connecting the second package end and the second extension in one embodiment of the present disclosure.

[0057] Figure 17 is a magnified view of a portion of Figure 16.

[0058] Figure 18 is a schematic diagram of the structure after one end of the cover plate is connected to the first encapsulation end and the other end of the cover plate is connected to the second encapsulation end in one embodiment of the present disclosure.

[0059] Figure 19 is a bottom view of Figure 18.

[0060] Figure 20 is a partial sectional view of Figure 18.

[0061] Explanation of reference numerals in the attached drawings: 1. Piezoelectric ceramic; 101. Positive electrode; 102. Negative electrode; 2. Coupling plate; 201. First coupling part; 202. Second coupling part; 3. Support plate; 300. Main body part; 301. First gap; 302. Second gap; 303. First extension part; 3031. First connecting hole; 304. Second extension part; 3041. Second connecting hole; 305. First guard plate; 3051. First groove; 306. Second guard plate; 3061. Second groove; 4. First encapsulation end; 401. First protrusion; 402. First guide part; 403. Third connecting hole; 5. Second encapsulation end; 501. Second protrusion; 6. Cover plate; 601. First flange; 602. Second flange; 603. Glue overflow hole; 604. Filling hole; 7. Flexible circuit board; 701. First end; 702. Second end; 8. Receiving cavity; 9. First gap; 10. Second gap; 11. Housing. Detailed Implementation

[0062] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present disclosure.

[0063] The embodiments of this disclosure will now be described in detail, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this disclosure, and should not be construed as limiting it. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without inventive effort are within the scope of protection of this disclosure.

[0064] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0065] According to one embodiment of this disclosure, a piezoelectric ceramic module is provided, the piezoelectric ceramic module including a piezoelectric ceramic 1 and a housing 11, the housing 11 having a receiving cavity 8, the piezoelectric ceramic 1 being disposed in the receiving cavity 8; the housing 11 is provided with at least one gap, the gap being capable of releasing the stress on the piezoelectric ceramic 1.

[0066] Specifically, as shown in Figure 3, the piezoelectric ceramic module of this disclosure includes a piezoelectric ceramic 1, which exhibits both direct and inverse piezoelectric effects. Under the action of the direct piezoelectric effect, the piezoelectric ceramic 1 can sense deformation and generate electric charge to form an electrical signal. Under the action of the inverse piezoelectric effect, by applying different electrical signals to the piezoelectric ceramic 1, the piezoelectric ceramic 1 can produce different deformations. Thus, through the direct and inverse piezoelectric effects of the piezoelectric ceramic 1, the piezoelectric ceramic module can be used as a pressure detection device, positioning device, or sound-generating device in electronic devices such as smartphones, smart headphones, or smart wearables.

[0067] In electronic devices such as smartphones, smart headphones, or smart wearables, the piezoelectric ceramic 1 is typically fabricated into a long strip shape so that it can bend more effectively through lengthwise expansion and contraction, thereby transmitting force and displacement outwards, or sensing force and displacement. However, the piezoelectric ceramic 1 is usually made of leaded or lead-free piezoelectric ceramic materials. Both leaded and lead-free piezoelectric ceramic materials are highly brittle, resulting in poor bending strength of the piezoelectric ceramic 1. Furthermore, when subjected to impact and vibration, such as when an electronic device is dropped, the piezoelectric ceramic 1 made of these materials is extremely prone to cracking and rapid propagation, which can even lead to breakage in severe cases.

[0068] Therefore, as shown in Figures 1 and 2, the piezoelectric ceramic module of this disclosure further includes a housing 11, which has a receiving cavity 8. By placing the piezoelectric ceramic 1 in the receiving cavity 8, the housing 11 can protect the piezoelectric ceramic 1, effectively preventing breakage failure caused by the piezoelectric ceramic 1 directly contacting the ground after the electronic device is dropped. Furthermore, the housing 11 also has gaps, which can reduce the rigidity of the housing. This allows the impact and vibration of the ground on the piezoelectric ceramic module during a drop to be concentrated and weakened at the gaps. In other words, this disclosure releases the stress on the piezoelectric ceramic through the gaps, effectively improving the drop impact resistance of the piezoelectric ceramic 1.

[0069] It should be noted that the gaps described in this disclosure can be one, two, three or more, as long as they can concentrate the impact and vibration of the piezoelectric ceramic module to the gaps for weakening. Those skilled in the art can choose according to actual needs, and this disclosure does not impose specific limitations.

[0070] In one embodiment, the housing 11 includes a support plate 3 and a cover plate 6, the cover plate 6 being disposed on the support plate 3 to form the receiving cavity 8; wherein the support plate 3 is provided with the gap, and / or the cover plate 6 is provided with the gap.

[0071] Specifically, as shown in Figure 2, when assembling the piezoelectric ceramic module, this disclosure can first place the support plate 3 at the bottom of the piezoelectric ceramic module, then place the piezoelectric ceramic 1 on the support plate 3, and finally form the housing 11 by combining the cover plate 6 and the support plate 3. Compared to the scheme of first forming the receiving cavity 8 in the housing 11 and then placing the piezoelectric ceramic 1 in the receiving cavity 8, this disclosure can further simplify the packaging difficulty of the piezoelectric ceramic module and improve the packaging efficiency of the piezoelectric ceramic module by using the split configuration of the housing 11. Of course, in another embodiment, this disclosure can also adopt the scheme of first forming the receiving cavity 8 in the housing 11 and then placing the piezoelectric ceramic 1 in the receiving cavity 8 to improve the sealing performance of the receiving cavity 8 formed by the housing 11.

[0072] The piezoelectric ceramic 1 described in this disclosure can be disposed not only on the support plate 3, but also on the cover plate 6. In this case, the support plate 3 is provided with the gap, and / or the cover plate 6 is provided with the gap.

[0073] For example, when the piezoelectric ceramic 1 is disposed on the support plate 3, the gap can be provided only on the support plate 3, as shown in Figure 2. By providing a first gap 301 and a second gap 302 on the support plate 3, the impact and vibration received by the support plate 3 are concentrated at the first gap 301 and the second gap 302 for weakening, thereby effectively improving the drop impact resistance of the piezoelectric ceramic 1. When the support plate 3 and the cover plate 6 are fixedly connected, the gap can also be provided only on the cover plate 6. In this case, the impact and vibration received by the support plate 3 can be concentrated at the gap provided on the cover plate 6 for weakening, thereby improving the drop impact resistance of the piezoelectric ceramic 1.

[0074] Furthermore, when the piezoelectric ceramic 1 is disposed on the cover plate 6, and the support plate 3 and the cover plate 6 are fixedly connected, the gap can be provided only on the support plate 3, as shown in Figure 2. By providing a first gap 301 and a second gap 302 on the support plate 3, the impact and vibration received by the cover plate 6 can be concentrated at the first gap 301 and the second gap 302 for weakening, thereby improving the drop impact resistance of the piezoelectric ceramic 1. When the support plate 3 and the cover plate 6 are not fixedly connected, the gap can also be provided only on the cover plate 6. In this case, the impact and vibration received by the cover plate 6 can be concentrated at the gap provided on the cover plate 6 for weakening, thereby improving the drop impact resistance of the piezoelectric ceramic 1.

[0075] Furthermore, when the support plate 3 and the cover plate 6 are fixedly connected, regardless of whether the piezoelectric ceramic 1 is disposed on the support plate 3 or the cover plate 6, the gap can be provided on both the support plate 3 and the cover plate 6. Those skilled in the art can choose according to actual needs, and this disclosure does not impose specific limitations here.

[0076] In addition, when the housing 11 includes the support plate 3 and the cover plate 6, the material of the support plate 3 can be stainless steel, iron-nickel alloy or titanium alloy, or composite material such as FR4 (Flame Retardant Grade 4) plate or carbon fiber plate; the material of the cover plate 6 can be stainless steel, iron-nickel alloy or titanium alloy, or composite material such as FR4 plate or carbon fiber plate. Those skilled in the art can choose according to actual needs, and no specific limitation is made here.

[0077] In one embodiment, the support plate 3 includes a main body 300, and the piezoelectric ceramic 1 is connected to the side of the main body 300 near the cover plate 6; wherein, a first gap 301 and a second gap 302 are provided at both ends of the main body 300 in the length direction, and the first gap 301 and the second gap 302 communicate with the receiving cavity 8.

[0078] Specifically, as shown in Figure 5, the support plate 3 of this disclosure is provided with the main body 300. The main body 300 can not only support and protect the piezoelectric ceramic 1, so that the piezoelectric ceramic 1 can avoid direct contact with the ground and breakage failure after the electronic device is dropped, but also prevent water vapor and other impurities in the external environment from directly contacting the piezoelectric ceramic 1 and affecting the service life of the piezoelectric ceramic 1.

[0079] Furthermore, as shown in Figures 2 and 5, in the length direction of the main body 300, since the first gap 301 and the second gap 302 are respectively provided at the two ends of the main body 300, the stiffness of the two ends of the main body 300 can be effectively reduced. Thus, during the drop of the electronic device, the strain generated by the impact and vibration of the piezoelectric ceramic module can be concentrated at the two ends of the main body 300. That is, the stress on the piezoelectric ceramic is released through the first gap 301 and the second gap 302, effectively reducing the impact and vibration of the piezoelectric ceramic 1 and improving the drop impact resistance of the piezoelectric ceramic 1.

[0080] Furthermore, since the first gap 301 and the second gap 302 weaken the stiffness of the two ends of the main body 300, the overall resonant frequency of the piezoelectric ceramic module is further reduced, thereby further improving the vibration feedback force of the piezoelectric ceramic module.

[0081] Of course, in another embodiment, the gap can also be provided in the middle part of the main body 300. In this case, the gap can reduce the rigidity of the middle part of the main body 300, so that during the drop of the electronic device, the deformation caused by the impact and vibration of the piezoelectric ceramic module can be concentrated in the middle part of the main body 300. In this way, the impact and vibration of the piezoelectric ceramic 1 can also be reduced, and the drop impact resistance of the piezoelectric ceramic 1 can be improved.

[0082] Furthermore, as shown in Figure 2, in order to ensure the protective effect of the main body 300 on the piezoelectric ceramic 1, it is preferable that the length of the main body 300 is greater than the length of the piezoelectric ceramic 1, and it is also preferable that the width of the main body 300 is greater than the width of the piezoelectric ceramic 1.

[0083] In addition, it should be noted that the shape of the first gap 301 in this disclosure can be a circle, a rectangle or a rounded rectangle, etc., and the shape of the second gap 302 can also be a circle, a rectangle or a rounded rectangle, etc. Those skilled in the art can choose according to actual needs, and this disclosure does not make specific restrictions here.

[0084] In one embodiment, the support plate 3 further includes a first guardrail 305 and a second guardrail 306. In the width direction of the main body 300, the first guardrail 305 is connected to one side of the main body 300, and the second guardrail 306 is connected to the other side of the main body 300.

[0085] Specifically, as shown in Figures 2 and 5, the support plate 3 of this disclosure is further provided with a first guardrail 305 and a second guardrail 306. The first guardrail 305 and the second guardrail 306 can enhance the connection effect between the support plate 3 and the cover plate 6 when they are connected. On the other hand, they can also protect the piezoelectric ceramic 1 from interference by external impurities after it is placed in the receiving cavity 8.

[0086] In one embodiment, the cover plate 6 includes a first flange 601, a second flange 602, and a filling hole 604. A first gap 9 is formed between the first flange 601 and the first railing 305, and a second gap 10 is formed between the second flange 602 and the second railing 306. It also includes a sealing member, which fills the first gap 9 and the second gap 10 through the filling hole 604.

[0087] Specifically, as shown in Figure 2, when the support plate 3 and the cover plate 6 are connected, a first gap 9 is formed between the first flange 601 and the first guardrail 305, and a second gap 10 is formed between the second flange 602 and the second guardrail 306. That is, this disclosure effectively simplifies the packaging difficulty of the piezoelectric ceramic module by using the gap fit between the first flange 601 and the first guardrail 305, and the gap fit between the second flange 602 and the second guardrail 306.

[0088] As shown in Figures 12 and 20, after the support plate 3 and the cover plate 6 are connected, the present disclosure further ensures the sealing performance of the receiving cavity 8 formed between the support plate 3 and the cover plate 6 by filling the sealing element into the first gap 9 and the second gap 10 through the filling hole 604 on the cover plate 6.

[0089] In addition, as shown in FIG12, the cover plate 6 of this disclosure also includes an overflow hole 603, which allows excess sealant in the receiving cavity 8 to overflow from the overflow hole 603, thereby determining the amount of sealant filling in the receiving cavity 8.

[0090] In addition, the sealing element described in this disclosure can be silicone oil, grease or adhesive, etc., and those skilled in the art can choose according to actual needs. This disclosure does not impose any specific restrictions here.

[0091] In one embodiment, the first guardrail 305 is provided with a first groove 3051, and the second guardrail 306 is provided with a second groove 3061; the sealing member fills the first groove 3051 and the second groove 3061 through the filling hole 604.

[0092] Specifically, as shown in Figures 2 and 5, this disclosure effectively reduces the bending strength of the support plate 3 by providing the first groove 3051 on the first guardrail 305 and the second groove 3061 on the second guardrail 306, enabling the support plate 3 to withstand greater bending deformation. Therefore, after connecting the support plate 3 and the cover plate 6, the housing 11 can withstand stronger impacts and vibrations, further improving the drop impact resistance of the piezoelectric ceramic 1.

[0093] Furthermore, as shown in Figure 12, after the support plate 3 and the cover plate 6 are connected, this disclosure further ensures the connection stability between the support plate 3 and the cover plate 6 by filling the sealing element into the first groove 3051 and the second groove 3061 through the filling hole 604 on the cover plate 6.

[0094] In one embodiment, the housing 11 further includes a first encapsulation end 4 and a second encapsulation end 5. In the length direction of the support plate 3, the first encapsulation end 4 is connected to one end of the support plate 3, and the second encapsulation end 5 is connected to the other end of the support plate 3.

[0095] Specifically, after the support plate 3 and the cover plate 6 are connected, in the length direction of the piezoelectric ceramic module, the present disclosure connects the first encapsulation end 4 to one end of the support plate 3, thereby sealing one end of the piezoelectric ceramic module; the second encapsulation end 5 connects to the other end of the support plate 3, thereby sealing the other end of the piezoelectric ceramic module. This effectively avoids the problem of the piezoelectric ceramic 1 directly contacting water vapor in the external environment during subsequent high temperature and high humidity processes, which would reduce the service life of the piezoelectric ceramic 1.

[0096] In one embodiment, the support plate 3 further includes a first extension 303 and a second extension 304. In the length direction of the main body 300, the first extension 303 is connected to one end of the main body 300, and the second extension 304 is connected to the other end of the main body 300. The support plate 3 is connected to the first encapsulation end 4 through the first extension 303, and the support plate 3 is connected to the second encapsulation end 5 through the second extension 304.

[0097] Specifically, as shown in Figure 2, when the support plate 3 of this disclosure is provided with the first extension 303 and the second extension 304, the support plate 3 can be connected to the first encapsulation end 4 through the first extension 303 and to the second encapsulation end 5 through the second extension 304. This effectively avoids the problem of the piezoelectric ceramic 1 being in direct contact with water vapor in the external environment during subsequent high temperature and high humidity processes, which would reduce the service life of the piezoelectric ceramic 1.

[0098] As shown in Figures 5 and 7, when the support plate 3 of this disclosure is connected to the first encapsulation end 4 via the first extension 303 and to the second encapsulation end 5 via the second extension 304, the first extension 303 may also be provided with a first connecting hole 3031. In this case, the first encapsulation end 4 may be provided with a first protrusion 401 that engages with the first connecting hole 3031, thereby further improving the connection reliability between the support plate 3 and the first encapsulation end 4. Similarly, the second extension 304 may also be provided with a second connecting hole 3041. In this case, the second encapsulation end 5 may be provided with a second protrusion 501 that engages with the second connecting hole 3041, thereby further improving the connection reliability between the support plate 3 and the second encapsulation end 5.

[0099] As shown in Figures 10 and 11, the first encapsulation end 4 of this disclosure may also be provided with a third connecting hole 403. In this case, the first extension 303 may be provided with a third protrusion (not shown in the figure) that engages with the third connecting hole 403, thereby further improving the connection reliability between the support plate 3 and the first encapsulation end 4. Of course, the second encapsulation end 5 of this disclosure may also be provided with a fourth connecting hole (not shown in the figure). In this case, the second extension 304 may be provided with a fourth protrusion (not shown in the figure) that engages with the fourth connecting hole, thereby further improving the connection reliability between the support plate 3 and the second encapsulation end 5.

[0100] Furthermore, as shown in Figures 7 and 9, the first packaging end 4 of this disclosure may also be provided with a first guide portion 402 for guiding and fixing the flexible circuit board 7, thereby improving the fixing effect on the flexible circuit board 7. Of course, the second packaging end 5 of this disclosure may also have a second guide portion (not shown in the figures) for guiding and fixing the flexible circuit board 7. Those skilled in the art can choose according to actual needs, and this disclosure does not impose specific limitations here.

[0101] Furthermore, as shown in Figures 5 to 11, the shape of the first connecting hole 3031 in this disclosure can be circular, rectangular, or rounded rectangle. In this case, the shape of the first protrusion 401 that mates with the first connecting hole 3031 can also be circular, rectangular, or rounded rectangle, as long as the connection reliability between the support plate 3 and the first encapsulation end 4 can be guaranteed. Those skilled in the art can choose according to actual needs, and this disclosure does not impose specific limitations here. Similarly, as shown in Figures 5 to 11, the shape of the second connecting hole 3041 in this disclosure can also be circular, rectangular, or rounded rectangle. In this case, the shape of the second protrusion 501 that mates with the second connecting hole 3041 can also be circular, rectangular, or rounded rectangle, and those skilled in the art can also choose according to actual needs, and this disclosure does not impose specific limitations here.

[0102] In addition, when the support plate 3 described in this disclosure is not provided with the first extension 303 and the second extension 304, the first encapsulation end 4 and the second encapsulation end 5 can be used to seal the two ends of the piezoelectric ceramic module in the length direction of the piezoelectric ceramic module, so as to avoid the piezoelectric ceramic 1 from directly contacting water vapor in the external environment during subsequent high temperature and high humidity processes, which would lead to a reduction in the service life of the piezoelectric ceramic 1.

[0103] In another embodiment, as shown in Figures 2 and 12, along the length of the piezoelectric ceramic module, one end of the cover plate 6 can overlap the first encapsulation end 4, and the other end of the cover plate 6 can overlap the second encapsulation end 5, thereby forming a sealed receiving cavity 8 between the support plate 3, the cover plate 6, the first encapsulation end 4, and the second encapsulation end 5. This effectively avoids the piezoelectric ceramic 1 from directly contacting water vapor in the external environment, which would reduce the service life of the piezoelectric ceramic 1.

[0104] In this embodiment, the connection between the cover plate 6 and the first encapsulation end 4, and the connection between the cover plate 6 and the second encapsulation end 5, can be welding or bonding. Those skilled in the art can choose according to actual needs, and this disclosure does not impose specific limitations here.

[0105] In another embodiment, when the housing does not include the first encapsulation end and the second encapsulation end, the first extension 303 and the second extension 304 can be used to seal the two ends of the piezoelectric ceramic module in the length direction of the piezoelectric ceramic module, so as to prevent impurities such as water vapor in the external environment from directly contacting the piezoelectric ceramic 1 and affecting the service life of the piezoelectric ceramic 1.

[0106] In this embodiment, the main body 300 of the support plate 3 and the cover plate 6 can be connected first. Then, the piezoelectric ceramic 1 can be placed in the receiving cavity through any end of the piezoelectric ceramic module along its length. Finally, one end of the piezoelectric ceramic module along its length is sealed by the first extension 303, and the other end of the piezoelectric ceramic module along its length is sealed by the second extension 304.

[0107] In one embodiment, the piezoelectric ceramic module further includes a coupling plate 2, which is disposed between the support plate 3 and the piezoelectric ceramic 1, or the coupling plate 2 is disposed between the cover plate 6 and the piezoelectric ceramic 1.

[0108] Specifically, as shown in Figures 2 and 4, the coupling plate 2 of this disclosure can be disposed between the support plate 3 and the piezoelectric ceramic 1. This allows the coupling plate 2 to form a deformation coupling with the piezoelectric ceramic 1, enhancing the bending vibration effect of the piezoelectric ceramic 1. Furthermore, it allows the coupling plate 2 to form a stiffness superposition with the main body 300 of the support plate 3, enhancing the protective effect of the support plate 3. Alternatively, the coupling plate 2 of this disclosure can also be disposed between the cover plate 6 and the piezoelectric ceramic 1. This also allows the coupling plate 2 to form a deformation coupling with the piezoelectric ceramic 1, enhancing the bending vibration effect of the piezoelectric ceramic 1. Additionally, it allows the coupling plate 2 to form a stiffness superposition with the cover plate 6, enhancing the protective effect of the cover plate 6.

[0109] Furthermore, as shown in Figure 4, the coupling plate 2 of this disclosure may also include a first coupling portion 201 and a second coupling portion 202 with different width dimensions, thereby forming a notch on one side of the coupling plate 2 along the width direction that can accommodate a flexible circuit board. In this way, when the piezoelectric ceramic 1 is connected to an external device through the side electrode, the piezoelectric ceramic module can be effectively prevented from short-circuiting.

[0110] In addition, the material of the coupling plate 2 described in this disclosure can be stainless steel, iron-nickel alloy or titanium alloy, etc. Those skilled in the art can choose according to actual needs, and this disclosure does not make specific restrictions.

[0111] In one embodiment, the piezoelectric ceramic module further includes a flexible circuit board 7, which includes a first end 701 and a second end 702. The first end 701 is connected to the piezoelectric ceramic 1, and the second end 702 extends through the gap to the outside of the housing 11.

[0112] Specifically, as shown in Figure 2, the first end 701 of the flexible circuit board 7 of this disclosure can be connected to the positive electrode 101 or the negative electrode 102 of the piezoelectric ceramic 1, and the second end 702 of the flexible circuit board 7 can extend to the outside of the housing 11 through the first gap 301, thereby effectively improving the stability of the piezoelectric ceramic module and simplifying the overall structure of the piezoelectric ceramic module.

[0113] As shown in Figure 17, after the flexible circuit board 7 is encapsulated, the present disclosure can also use fillers such as silicone oil, grease or glue to fill the gap between the flexible circuit board 7 and the support plate 3, thereby effectively avoiding the problem that the piezoelectric ceramic 1 is easily damaged due to its low breakdown voltage.

[0114] According to another embodiment of this disclosure, a piezoelectric ceramic module packaging method is provided, applied to the piezoelectric ceramic module as described in this disclosure, wherein, as shown in FIG13, the SIP module packaging method includes the following steps S101 to S102:

[0115] S101, the piezoelectric ceramic 1 is disposed in the receiving cavity 8 formed by the housing 11;

[0116] It is worth noting that the housing 11 described here can be a cylindrical structure with an opening, allowing the piezoelectric ceramic 1 to be disposed within the receiving cavity of the housing 11 through the opening. Alternatively, the housing 11 can be a separate structure with a support plate 3 and a cover plate 6, such that after the piezoelectric ceramic 1 is disposed on the support plate 3, the support plate 3 and the cover plate 6 are connected to form the housing 11, thereby forming the receiving cavity 8 between the support plate 3 and the cover plate 6. That is, the receiving cavity 8 in this disclosure is an unclosed receiving cavity 8.

[0117] S102, the gap is formed on the housing 11 to release the stress on the piezoelectric ceramic 1.

[0118] Here, the gap on the housing 11 can be a structure that is already present on the housing 11 itself. For example, when the housing 11 is a split structure with a support plate 3 and a cover plate 6, the gap is first machined on the support plate 3 and / or the cover plate 6, and then the support plate 3 and the cover plate 6 are connected to form the housing 11. Of course, the gap can also be machined on the housing 11 directly using a stamping process or other processing techniques.

[0119] In one embodiment, as shown in Figures 14 to 19, this disclosure also provides another piezoelectric ceramic module packaging method, which includes:

[0120] S201, A coupling plate 2 is installed on the support plate 3;

[0121] It is worth noting that, as shown in Figure 14, the support plate 3 here includes a main body 300, which is used to set the coupling plate 2. The length of the main body 300 is greater than the length of the coupling plate 2, and the width of the main body 300 is greater than the width of the coupling plate 2, so as to improve the support effect of the support plate 3.

[0122] Furthermore, before setting the coupling plate 2 on the support plate 3, the gap can be machined on the support plate 3 first. For example, as shown in Figure 14, a first gap 301 and a second gap 302 are also provided at both ends of the main body 300 along its length. The first gap 301 and the second gap 302 are used to reduce the stiffness of the two ends of the main body 300, so that during the drop of the electronic device, the strain generated by the impact and vibration of the piezoelectric ceramic module can be concentrated at the two ends of the main body 300, thereby improving the drop impact resistance of the piezoelectric ceramic 1.

[0123] Furthermore, as shown in FIG14, in the length direction of the main body 300, a first extension 303 and a second extension 304 are respectively connected to both ends of the main body 300. The first extension 303 is provided with a first connecting hole 3031 that engages with the first encapsulation end 4, and the second extension 304 is provided with a second connecting hole 3041 that engages with the second encapsulation end 5.

[0124] Additionally, as shown in Figure 14, in the width direction of the main body 300, a first guardrail 305 and a second guardrail 306 are respectively connected to both sides of the main body 300. The first guardrail 305 is used to cooperate with the first flange 601 of the cover plate 6 with a clearance, and the second guardrail 306 is used to cooperate with the second flange 602 of the cover plate 6 with a clearance.

[0125] S202, the piezoelectric ceramic 1 is disposed on the side of the coupling plate 2 away from the support plate 3;

[0126] It is worth noting that, as shown in Figure 15, the positive electrode 101 of the piezoelectric ceramic 1 is located on the coupling plate 2 and close to the first gap 301, and the negative electrode 102 of the piezoelectric ceramic 1 is located on the coupling plate 2 and close to the second gap 302.

[0127] S203, in the length direction of the support plate 3, the first encapsulation end 4 is connected to one end of the support plate 3, and the second encapsulation end 5 is connected to the other end of the support plate 3;

[0128] It is worth noting that, as shown in Figure 16, the first encapsulation end 4 is connected to one end of the support plate 3 via the first extension 303, and the second encapsulation end 5 is connected to the other end of the support plate 3 via the second extension 304. The first encapsulation end 4 and the first extension 303, and the second encapsulation end 5 and the second extension 304, can be connected together by adhesive or welding.

[0129] In addition, to ensure the sealing and waterproofing effect of the piezoelectric ceramic module, before the support plate 3 is connected to the first encapsulation end 4 and the second encapsulation end 5, a curing adhesive can be applied to the connection surfaces of the first encapsulation end 4 and the support plate 3, and the second encapsulation end 5 and the support plate 3, to achieve a seal between the support plate 3 and the first encapsulation end 4, and between the support plate 3 and the second encapsulation end 5.

[0130] S204, the slit is formed on the housing 11 to release the stress on the piezoelectric ceramic 1.

[0131] It is worth noting that this step can be omitted if the gap has already been machined into the support plate 3.

[0132] S205, the first end 701 of the flexible circuit board 7 is connected to the piezoelectric ceramic 1, and the second end 702 of the flexible circuit board 7 is passed through the gap and extended to the outside of the housing 11;

[0133] It is worth noting that, as shown in Figure 16, one end of the flexible circuit board 7 is electrically connected to the side of the piezoelectric ceramic 1 away from the coupling plate 2, and the other end of the flexible circuit board 7 passes through the first gap 301 or the second gap 302 and extends to the side of the support plate 3 away from the coupling plate 2, thereby realizing the connection between the piezoelectric ceramic 1 and the external device.

[0134] In addition, as shown in Figure 17, after the flexible circuit board 7 is encapsulated, silicone oil, grease or glue can be used to fill the gap between the flexible circuit board 7 and the support plate 3, so as to effectively avoid the problem that the piezoelectric ceramic 1 is easily damaged due to its low breakdown voltage.

[0135] S206, a cover plate 6 is provided on the support plate 3 to form the receiving cavity 8 between the support plate 3 and the cover plate 6;

[0136] It is worth noting that, as shown in Figure 18, in the length direction of the piezoelectric ceramic module, one end of the cover plate 6 can be connected to the first encapsulation end 4, and the other end of the cover plate 6 can be connected to the second encapsulation end 5, so as to form a receiving cavity 8 between the support plate 3, the cover plate 6, the first encapsulation end 4 and the second encapsulation end 5, and so that the piezoelectric ceramic 1 and the coupling plate 2 are located in the receiving cavity 8.

[0137] In addition, to ensure the sealing, waterproofing, and vapor-proofing effect of the piezoelectric ceramic module, before connecting one end of the cover plate 6 to the first encapsulation end 4 and the other end of the cover plate 6 to the second encapsulation end 5, a curing adhesive can be applied to the connection surfaces of the first encapsulation end 4 and the cover plate 6, as well as the connection surfaces of the second encapsulation end 5 and the cover plate 6, thereby achieving a seal between the cover plate 6 and the first encapsulation end 4, and between the cover plate 6 and the second encapsulation end 5.

[0138] S207, the sealant is filled into the receiving cavity 8 through the filling hole 604.

[0139] It is worth noting that, as shown in Figures 18 and 19, the present disclosure can fill the cavity 8 with sealants such as silicone oil, grease or glue, thereby further improving the isolation effect of the piezoelectric ceramic module against water vapor in the external environment.

[0140] Furthermore, due to the capillary action of the seal, the seal is able to fill the first gap 9 formed between the first flange 601 and the first guardrail 305, and the second gap 10 formed between the second flange 602 and the second guardrail 306. The first guardrail 305 is provided with a first groove 3051, and the second guardrail 306 is provided with a second groove 3061.

[0141] In one embodiment, this disclosure also provides another method for packaging a piezoelectric ceramic module, the method comprising:

[0142] A coupling plate 2 is installed on the support plate 3;

[0143] A cover plate 6 is provided on the support plate 3 to form the receiving cavity 8 between the support plate 3 and the cover plate 6;

[0144] The piezoelectric ceramic 1 is disposed on the side of the coupling plate 2 away from the support plate 3;

[0145] Along the length of the support plate 3, the first encapsulation end 4 is connected to one end of the support plate 3, and the second encapsulation end 5 is connected to the other end of the support plate 3.

[0146] The slit is formed on the housing 11 to release the stress on the piezoelectric ceramic 1;

[0147] The first end 701 of the flexible circuit board 7 is connected to the piezoelectric ceramic 1, and the second end 702 of the flexible circuit board 7 passes through the gap and extends to the outside of the housing 11.

[0148] The seal is filled into the receiving cavity 8 through the filling hole 604.

[0149] It is worth noting that the steps of the piezoelectric ceramic module packaging method described in this disclosure may have other orders, as long as the packaging of the piezoelectric ceramic module can be achieved. Those skilled in the art can choose according to actual needs, and this disclosure does not impose specific restrictions here.

[0150] According to another embodiment of this disclosure, an electronic device is provided, the electronic device including the piezoelectric ceramic module described in this disclosure.

[0151] Specifically, the piezoelectric ceramic module described in this disclosure can be applied not only to wearable electronic devices such as smartwatches, smart glasses, or smart bracelets, but also to other electronic devices such as mobile phones, tablets, virtual reality terminal devices, augmented reality terminal devices, drones, radar, and vehicle-mounted devices. Those skilled in the art can choose according to actual needs, and this disclosure does not impose specific limitations.

[0152] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0153] While specific embodiments of this disclosure have been described in detail by way of example, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this disclosure. The scope of this disclosure is defined by the appended claims.

Claims

1. A piezoelectric ceramic module, comprising: Piezoelectric ceramics (1); A housing (11) having a receiving cavity (8), wherein the piezoelectric ceramic (1) is disposed in the receiving cavity (8); The housing (11) is provided with at least one gap, which can release the stress on the piezoelectric ceramic (1).

2. The piezoelectric ceramic module according to claim 1, wherein, The housing (11) includes a support plate (3) and a cover plate (6), the cover plate (6) being disposed on the support plate (3) to form the receiving cavity (8); The gap is provided on the support plate (3) and / or on the cover plate (6).

3. The piezoelectric ceramic module according to claim 2, wherein, The support plate (3) includes a main body (300), and the piezoelectric ceramic (1) is connected to the side of the main body (300) near the cover plate (6); A first gap (301) and a second gap (302) are respectively provided at both ends of the main body (300) along its length, and the first gap (301) and the second gap (302) communicate with the receiving cavity (8).

4. The piezoelectric ceramic module according to claim 3, wherein, The support plate (3) further includes a first guardrail (305) and a second guardrail (306). In the width direction of the main body (300), the first guardrail (305) is connected to one side of the main body (300), and the second guardrail (306) is connected to the other side of the main body (300).

5. The piezoelectric ceramic module according to claim 4, wherein, The cover plate (6) includes a first flange (601), a second flange (602) and a filling hole (604). A first gap (9) is formed between the first flange (601) and the first guardrail (305), and a second gap (10) is formed between the second flange (602) and the second guardrail (306). It also includes a seal that fills the first gap (9) and the second gap (10) through the filling hole (604).

6. The piezoelectric ceramic module according to claim 5, wherein, The first guardrail (305) is provided with a first groove (3051), and the second guardrail (306) is provided with a second groove (3061); The seal fills the first groove (3051) and the second groove (3061) through the filling hole (604).

7. The piezoelectric ceramic module according to claim 3, wherein, The housing (11) further includes a first encapsulation end (4) and a second encapsulation end (5). In the length direction of the support plate (3), the first encapsulation end (4) is connected to one end of the support plate (3), and the second encapsulation end (5) is connected to the other end of the support plate (3).

8. The piezoelectric ceramic module according to claim 7, wherein, The support plate (3) further includes a first extension (303) and a second extension (304). In the length direction of the main body (300), the first extension (303) is connected to one end of the main body (300), and the second extension (304) is connected to the other end of the main body (300). The support plate (3) is connected to the first encapsulation end (4) through the first extension (303), and the support plate (3) is connected to the second encapsulation end (5) through the second extension (304).

9. The piezoelectric ceramic module according to claim 2, wherein, It also includes a coupling plate (2), which is disposed between the support plate (3) and the piezoelectric ceramic (1), or the coupling plate (2) is disposed between the cover plate (6) and the piezoelectric ceramic (1).

10. The piezoelectric ceramic module according to claim 1, wherein, It also includes a flexible circuit board (7), which has a first end (701) and a second end (702), the first end (701) being connected to the piezoelectric ceramic (1); and the second end (702) passing through the gap and extending to the outside of the housing (11).

11. A piezoelectric ceramic module packaging method, applied to the piezoelectric ceramic module as described in any one of claims 1-10, the piezoelectric ceramic module packaging method comprising: The piezoelectric ceramic (1) is disposed in the receiving cavity (8) formed by the housing (11); The slit is formed on the housing (11) to release the stress on the piezoelectric ceramic (1).

12. The piezoelectric ceramic module packaging method according to claim 11, wherein, Before placing the piezoelectric ceramic (1) in the receiving cavity (8) formed by the housing (11), the following steps are included: A coupling plate (2) is installed on the support plate (3).

13. The piezoelectric ceramic module packaging method according to claim 12, wherein, After the coupling plate (2) is disposed on the support plate (3), the process before placing the piezoelectric ceramic (1) in the receiving cavity (8) formed by the housing (11) includes: A cover plate (6) is provided on the support plate (3) to form the receiving cavity (8) between the support plate (3) and the cover plate (6).

14. The piezoelectric ceramic module packaging method according to claim 13, wherein, After the piezoelectric ceramic (1) is disposed in the receiving cavity (8) formed by the housing (11), the gap is formed on the housing (11) to release the stress on the piezoelectric ceramic (1), and the following steps are included: Along the length of the support plate (3), the first encapsulation end (4) is connected to one end of the support plate (3), and the second encapsulation end (5) is connected to the other end of the support plate (3).

15. The piezoelectric ceramic module packaging method according to claim 12, wherein, The piezoelectric ceramic (1) is disposed in the receiving cavity (8) formed by the housing (11) including: The piezoelectric ceramic (1) is disposed on the side of the coupling plate (2) away from the support plate (3).

16. The piezoelectric ceramic module packaging method according to claim 15, wherein, After forming the slit in the housing (11) to release the stress on the piezoelectric ceramic (1), the process further includes: The first end (701) of the flexible circuit board (7) is connected to the piezoelectric ceramic (1), and the second end (702) of the flexible circuit board (7) is passed through the gap and extended to the outside of the housing (11).

17. An electronic device comprising a piezoelectric ceramic module as described in any one of claims 1-10.

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