Air-cooled semiconductor laser integrating fin-type heat dissipation

Abstract

An air-cooled semiconductor laser integrating fin-type heat dissipation, comprising: a structural member (1), one side of the structural member (1) being configured such that a chip module (01) and an optical component are mounted thereon; a heat dissipation portion (2), which is arranged on the other side of the structural member (1), the heat dissipation portion (2) being used to increase the heat conduction area of the structural member (1); an air-blowing portion (3), which acts on the heat dissipation portion (2) and is used to produce cold air and enable the cold air to be in sufficient contact with the heat dissipation portion (2) so as to complete heat transfer; and a flow guide portion (4), which is arranged at the bottom of the heat dissipation portion (2) and is used to guide some of the cold air to act on a heat concentration zone of the heat dissipation portion (2). The chip module (01) and the optical component are arranged on the structural member (1), and the heat generated during operation thereof is transferred to the heat dissipation portion (2); the cold air produced by the air-blowing portion (3) acts on the heat dissipation portion (2) to take away the heat; and during heat dissipation by the air-blowing portion (3), the cold air, when blown to the rear half of the heat dissipation portion (2), is blocked by the front half of the heat dissipation portion (2) and has undergone heat exchange with the front half, resulting in that the heat accumulates heavily at the rear half of the heat dissipation portion (2), and in this case, the flow guide portion (4) can guide some of the cold air to act on the heat concentration zone of the heat dissipation portion (2) on the basis of heat changes.

Description

A finned heat dissipation integrated air-cooled semiconductor laser Technical Field

[0001] This invention relates to the field of semiconductor laser structure technology, and in particular to a finned heat dissipation integrated air-cooled semiconductor laser. Background Technology

[0002] The statements herein provide only background information in relation to this invention and do not necessarily constitute prior art.

[0003] As industrial production demands ever-increasing power from semiconductor lasers, effective heat dissipation has become a crucial area for laser development. While water cooling and refrigerant cooling offer excellent heat dissipation, they require numerous cooling components and occupy a large area, making them unsuitable for certain applications. Therefore, air-cooled lasers urgently need improved heat dissipation efficiency to fill this application gap.

[0004] However, air-cooled heat sinks have the following drawbacks in use: traditional semiconductor pump sources are mounted on a metal tube base, while the heat exchange end of the heat sink contacts the metal tube, preventing the heat-generating end from directly contacting the heat sink and thus affecting heat dissipation efficiency; the airflow direction is fixed, and when the airflow reaches the rear half of each heat pipe and fin, it is blocked by the heat pipes and fins in the front half and has already undergone heat exchange in the front half, so the heat pipes and fins in the rear half cannot maximize their heat exchange efficiency, and the heat is relatively concentrated in this part of the heat pipes and fins. Traditional equipment cannot provide targeted heat dissipation in this area, leaving room for improvement. Therefore, a finned heat dissipation integrated air-cooled semiconductor laser is proposed to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to address the aforementioned shortcomings by providing a finned heat dissipation integrated air-cooled semiconductor laser.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a finned heat dissipation integrated air-cooled semiconductor laser, comprising:

[0007] A structural component, one side of which is used to mount a chip module and optical components;

[0008] A heat dissipation section is provided on the other side of the structural component, and the heat dissipation section is used to increase the heat conduction area of ​​the structural component;

[0009] The blower section acts on the heat dissipation section to generate cold air that comes into full contact with the heat dissipation section to complete heat transfer;

[0010] A flow guide section is located at the bottom of the heat dissipation section to guide a portion of the cool air to the heat concentration area of ​​the heat dissipation section.

[0011] Furthermore, the flow guide includes a baffle plate, on which a plurality of flow grooves are formed, and on which a temperature-sensitive metal assembly plate corresponding to each flow groove is provided. The temperature-sensitive metal assembly plate is disposed in the flow groove and is used to block the flow groove.

[0012] It also includes a support plate, which is disposed on the side of the partition away from the heat dissipation part, so as to form an air duct at the bottom of the partition corresponding to the flow groove;

[0013] A guide vane is provided at the inlet end of the air duct, and the guide vane controls the opening and closing of the air duct to control the direction of cold air flow;

[0014] It also includes a triggering unit, which is used to switch the state of the flow guide plate according to the deformation of the temperature-sensitive metal assembly plate.

[0015] Furthermore, the triggering unit includes contacts disposed within the flow channel, and,

[0016] An electromagnetic component installed at the inlet end of the air duct and corresponding to the guide vane, and,

[0017] Circuitry installed inside the partition to connect the contact points and electromagnetic components;

[0018] One end of the flow guide plate is provided with a magnetic suction element corresponding to the electromagnetic element, and the other end of the flow guide plate is provided with a reset hinge part.

[0019] Furthermore, the contact can be switched on and off to change the current flow in the circuit, thereby altering the operating state of the electromagnetic component.

[0020] Furthermore, the contact can be switched on and off to change the direction of current flow in the circuit, thereby changing the direction of the magnetic poles of the electromagnetic component.

[0021] Furthermore, the temperature-sensitive metal composite sheet is made of two metals with different coefficients of thermal expansion.

[0022] Furthermore, the reset hinge portion includes a hinge rod disposed on the support plate, and a hinge ring is disposed at one end of the reset hinge portion near the hinge rod, and a reset torsion spring is disposed inside the hinge ring.

[0023] Furthermore, the heat dissipation section includes heat pipes and equidistantly distributed heat dissipation fins;

[0024] The heat dissipation fins are provided with mounting slots corresponding to the heat pipes, and the heat pipes are disposed within the heat dissipation fins.

[0025] The spacing between the heat dissipation fins corresponds to the direction of the cold air flow in the blower section.

[0026] The beneficial effects of this invention are reflected in:

[0027] This invention proposes a structural design that places chip modules and optical components on structural components, so that the heat generated during operation is transferred to the heat dissipation section, while the cold air generated by the blower acts on the heat dissipation section to remove the heat generated during operation. During the heat dissipation process of the blower, when the cold air blows to the rear half of each heat dissipation section, the heat is relatively concentrated in the heat pipes and fins in that part because it is blocked by the heat dissipation section in the front half and has undergone heat exchange in the front half. At this time, the guide section can guide part of the cold air to act on the heat concentration area of ​​the heat dissipation section according to the change in heat. Attached Figure Description

[0028] Figure 1 is an explosion diagram of the present invention;

[0029] Figure 2 is a schematic diagram of the flow guide structure of the present invention;

[0030] Figure 3 is a schematic diagram of the flow guide portion of the present invention;

[0031] Figure 4 is a top view of the flow guide structure of the present invention.

[0032] In the diagram: 01, Chip Module; 1, Structural Component; 2, Heat Dissipation Unit; 21, Heat Pipe; 22, Heat Dissipation Fins; 3, Blower; 4, Flow Guide; 41, Partition; 42, Flow Channel; 43, Temperature-Sensitive Metal Assembly Sheet; 44, Support Plate; 45, Flow Guide Sheet; 451, Magnetic Attachment; 452, Reset Hinge; 46, Contact Point; 47, Electromagnetic Component. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Please refer to Figures 1-4. This invention discloses a finned heat dissipation integrated air-cooled semiconductor laser, comprising:

[0035] Structural component 1, one side of which is used to mount chip module 01 and optical components. Structural component 1 is a metal plate with good thermal conductivity. Preferably, chip module 01 and optical components are arranged on the metal plate according to the design layout. The simple pump surface is more conducive to the arrangement of chip module, optical components and power module.

[0036] Heat dissipation part 2 is disposed on the other side of structural component 1, and the heat dissipation part 2 is used to increase the heat conduction area of ​​structural component 1;

[0037] The blower 3 acts on the heat dissipation unit 2 to generate cold air that comes into full contact with the heat dissipation unit 2 to complete heat transfer;

[0038] The airflow guide 4 is located at the bottom of the heat dissipation section 2 and is used to guide some of the cold air to the heat concentration point of the heat dissipation section 2.

[0039] During use, structural component 1 transfers the heat generated by chip module 01 and optical components to heat dissipation unit 2, while the cold air generated by blower 3 acts on heat dissipation unit 2 to reduce the heat generated during equipment operation.

[0040] During the heat dissipation process of the blower section 3, when the cold air blows to the rear half of each heat dissipation section 2, the heat is relatively concentrated in the heat pipes and fins because the heat is blocked by the heat dissipation section 2 in the front half and has undergone heat exchange in the front half. At this time, the guide section 4 can guide some of the cold air to act on the heat concentration area of ​​the heat dissipation section 2 according to the change in heat, so as to solve the above problem and achieve the purpose of uniform heat dissipation.

[0041] It should be further explained that the flow guide 4 includes a partition 41, on which a plurality of flow grooves 42 are provided. The partition 41 is provided with temperature-sensitive metal combination pieces 43 corresponding to the flow grooves 42. The temperature-sensitive metal combination pieces 43 are disposed in the flow grooves 42 and are used to block the flow grooves 42.

[0042] It also includes a support plate 44, which is disposed on the side of the partition 41 away from the heat dissipation part 2, so as to form an air duct at the bottom of the partition 41 corresponding to the flow groove 42;

[0043] A guide vane 45 is provided at the inlet end of the air duct. The guide vane 45 controls the opening and closing of the air duct to control the direction of cold air flow. It should be noted that when the guide vane 45 is not triggered, it is in an inclined state to guide the cold air to flow from above the partition 41 and directly act on the heat dissipation part 2.

[0044] It also includes a triggering unit, which is used to switch the state of the flow guide plate 45 according to the deformation of the temperature-sensitive metal assembly plate 43.

[0045] Specifically, in a preferred embodiment, the temperature-sensitive metal assembly 43 at the location corresponding to the heat concentration point of the heat dissipation part 2 deforms and bends under the action of temperature, opening the flow groove 42. At this time, the triggering unit is triggered, thereby causing the guide plate 45 to guide the air duct. The air duct guides part of the cold air to be blown out from the flow groove 42, directly acting on the heat concentration point of the heat dissipation part 2 to achieve the purpose of uniform heat dissipation.

[0046] It should be further noted that the triggering unit includes a contact 46 disposed within the flow channel 42, and,

[0047] An electromagnetic component 47 is installed at the inlet end of the air duct and corresponds to the guide vane 45, and,

[0048] The circuit is set inside the partition 41 to connect the contact point 46 and the electromagnetic component 47.

[0049] One end of the flow guide plate 45 is provided with a magnetic suction member 451 corresponding to the electromagnetic member 47. The magnetic suction member 451 is made of metal iron. The other end of the flow guide plate 45 is provided with a reset hinge part 452.

[0050] In a preferred embodiment, the contact 46 is switched on and off to change the current flow in the circuit, thereby altering the operating state of the electromagnetic component 47.

[0051] The temperature-sensitive metal assembly 43 deforms and bends under the influence of temperature, and the contact 46 is disconnected. At this time, the electromagnetic component 47 loses its magnetic force, and the magnetic attractor 451 is no longer attracted. Under the dual action of the negative pressure in the air duct and the air pressure of the blower 3, the guide plate 45 overcomes the torque of the reset hinge 452. The guide plate 45 rotates to guide the air duct, allowing some cold air to enter the air duct and be discharged from the flow groove 42, acting on the corresponding heat concentration point. After the corresponding point cools down, the temperature-sensitive metal assembly 43 resets. At this time, the negative pressure in the air duct disappears, and the electromagnetic component 47 regains its magnetic force to attract the guide plate 45 and block the corresponding air duct.

[0052] In another preferred embodiment, the contact 46 is switched on and off to change the direction of current flow in the circuit, thereby changing the magnetic pole direction of the electromagnetic element 47.

[0053] The temperature-sensitive metal assembly 43 deforms and bends under the action of temperature, and does not contact the contact 46. At this time, the direction of the current inside the circuit is changed, and the electromagnetic component 47 generates the opposite magnetic force. In this embodiment, the magnetic attractor 451 is a permanent magnet. The magnetic attractor 451 is repelled. Under the multiple action of the negative pressure in the air duct and the wind pressure and repulsive force of the blower 3, the guide plate 45 overcomes the torque of the reset hinge 452. The guide plate 45 rotates to guide the air duct, allowing some cold air to enter the air duct and be discharged from the flow groove 42, acting on the corresponding heat concentration point. After the corresponding point is cooled down, the temperature-sensitive metal assembly 43 resets. At this time, the temperature-sensitive metal assembly 43 contacts the contact 46, the direction of the current inside the circuit is restored, the negative pressure in the air duct disappears, and the electromagnetic component 47 regains its magnetic force to attract the guide plate 45 to block the corresponding air duct.

[0054] In this embodiment, contact 46 is a double-pole double-throw switch. Specifically, the positive terminal of the power supply is connected to the middle terminal of the switch, and the negative terminal of the power supply is connected to the other middle terminal of the switch. One end of the electromagnetic component 47 is connected to one outer terminal of the switch, and the other end of the electromagnetic component 47 is connected to the other outer terminal of the switch. When the switch is flipped to one side, the current flows from the positive terminal to one end of the electromagnetic component 47, forming a magnetic field direction. When the switch is flipped to the other side, the current flows from the positive terminal to the other end of the electromagnetic component 47, the current direction is reversed, and the magnetic field direction is also reversed accordingly.

[0055] It should be further noted that the temperature-sensitive metal composite sheet 43 is made of two metals with different coefficients of thermal expansion.

[0056] In this application, the reset hinge part 452 includes a hinge rod disposed on the support plate 44. A hinge ring is disposed at one end of the reset hinge part 452 near the hinge rod. A reset torsion spring is disposed inside the hinge ring. The torsion of the reset torsion spring is equal to the air pressure of the blower part 3. When the guide vane 45 is subjected to external force, it can guide the air duct.

[0057] It should be noted that, as shown in Figure 1, the heat dissipation part 2 includes a heat pipe 21 and equidistantly distributed heat dissipation fins 22.

[0058] The heat dissipation fins 22 are provided with mounting slots corresponding to the heat pipes 21, and the heat pipes 21 are disposed within the heat dissipation fins 22;

[0059] The spacing between the heat dissipation fins 22 corresponds to the direction of the cold air flow in the blower section 3.

[0060] It is easy to imagine that the device also has an outer shell, with structural components 1, heat dissipation section 2 and air guide section 4 arranged from top to bottom inside the outer shell, while the blower section 3 is located on both sides of the outer shell. The cold air generated by the blower section 3 can act on the heat dissipation section 2 and, according to the internal temperature change, partially act on the air guide section 4. Under the guidance of the air guide section 4, the cold air can act on the heat concentration area at the rear half of the heat dissipation section 2 to achieve the purpose of uniform heat dissipation.

[0061] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0062] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0063] Additionally, "multiple" refers to two or more.

[0064] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A finned heat-dissipation integrated air-cooled semiconductor laser, characterized by, include: Structural component (1), one side of which is used to mount chip module (01) and optical components; A heat dissipation part (2) is provided on the other side of the structural member (1), and the heat dissipation part (2) is used to increase the heat conduction area of ​​the structural member (1); The blower (3) acts on the heat dissipation part (2) to generate cold air and make full contact with the heat dissipation part (2) to complete heat transfer; A flow guide (4) is provided at the bottom of the heat dissipation part (2) to guide part of the cold air to the heat concentration point of the heat dissipation part (2).

2. The finned heat-dissipation integrated air-cooled semiconductor laser of claim 1, wherein: The flow guide (4) includes a partition (41), on which a plurality of flow grooves (42) are provided. The partition (41) is provided with a temperature-sensitive metal assembly piece (43) corresponding to the flow grooves (42) one by one. The temperature-sensitive metal assembly piece (43) is disposed in the flow groove (42) and is used to block the flow groove (42). It also includes a support plate (44), which is disposed on the side of the partition (41) away from the heat dissipation part (2) to form an air duct at the bottom of the partition (41) corresponding to the flow groove (42); A guide vane (45) is provided at the inlet end of the air duct, and the guide vane (45) controls the opening and closing of the air duct to control the direction of cold air flow; It also includes a triggering unit, which is used to switch the state of the guide plate (45) according to the deformation of the temperature-sensitive metal assembly plate (43).

3. The finned heat sink integrated air-cooled semiconductor laser of claim 2, wherein: The triggering unit includes a contact (46) disposed within the flow channel (42), and, An electromagnetic component (47) is installed at the inlet end of the air duct and corresponds to the guide vane (45), and, A circuit is installed inside the partition (41) to connect the contact point (46) and the electromagnetic component (47); One end of the guide plate (45) is provided with a magnetic suction member (451) corresponding to the electromagnetic member (47), and the other end of the guide plate (45) is provided with a reset hinge part (452).

4. The finned heat sink integrated air-cooled semiconductor laser of claim 3, wherein: The contact (46) is switched on and off to change the current flow in the circuit, thereby changing the operating state of the electromagnetic component (47).

5. The finned heat sink integrated air-cooled semiconductor laser of claim 3, wherein: The contact (46) is switched on and off to change the direction of current flow in the circuit, thereby changing the direction of the magnetic poles of the electromagnetic component (47).

6. The finned heat sink integrated air-cooled semiconductor laser of claim 2, wherein: The temperature-sensitive metal composite sheet (43) is made of two metals with different coefficients of thermal expansion.

7. The finned heat-dissipation integrated air-cooled semiconductor laser of claim 3, wherein: The reset hinge part (452) includes a hinge rod disposed on the support plate (44), and a hinge ring is disposed at one end of the reset hinge part (452) near the hinge rod, and a reset torsion spring is disposed inside the hinge ring.

8. The finned heat-dissipation integrated air-cooled semiconductor laser of claim 3, wherein: The heat dissipation part (2) includes a heat pipe (21) and equidistantly distributed heat dissipation fins (22); The heat dissipation fins (22) are provided with mounting slots corresponding to the heat pipes (21), and the heat pipes (21) are disposed inside the heat dissipation fins (22); The spacing between the heat dissipation fins (22) corresponds to the direction of the cold air flow in the blower section (3).

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