Heat dissipation structure, heat dissipation apparatus and electronic device

Abstract

The present application relates to the technical field of heat dissipation, and provides a heat dissipation structure, a heat dissipation apparatus and an electronic device, aiming to solve the problem of a relatively poor heat dissipation effect of a heat dissipation structure. The heat dissipation structure provided in the present application comprises a vapor chamber and a heat pipe. The vapor chamber comprises a plate body and a first cavity defined by the plate body, wherein the plate body comprises a first area, the first area having an outer surface and an inner surface, which face away from each other, and the first area being provided with a window that penetrates to the outer surface and the inner surface. The heat pipe comprises a pipe body and a second cavity defined by the pipe body, wherein a first end of the heat pipe is provided with an opening, and an open end of the heat pipe passes through the window. The first cavity and the second cavity are further internally provided with capillary structures. In the heat dissipation structure provided in the present application, the capillary structures are integrally formed at a connection position between the first end of the heat pipe and the inner surface of the first area, thereby ensuring the continuity of the capillary structures at the connection position, such that a medium can circulate effectively between the first cavity and the second cavity.

Description

A heat dissipation structure, heat dissipation device and electronic device

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202510359880.X, filed on March 24, 2025, entitled "A Heat Dissipation Structure, Heat Dissipation Device and Electronic Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation structure, heat dissipation device, and electronic device. Background Technology

[0004] Electronic devices generate heat during operation, requiring timely heat dissipation to ensure normal operation within a reasonable temperature range. Currently, commonly used electronic devices primarily employ air cooling for heat dissipation. Air cooling mainly relies on convective heat transfer between the air and the electronic device to remove the heat generated. However, air cooling is significantly constrained by parameters such as heat transfer area, which hinders achieving optimal heat dissipation efficiency. Summary of the Invention

[0005] This application provides a heat dissipation structure, heat dissipation device, and electronic device with good heat dissipation efficiency.

[0006] In a first aspect, this application provides a heat dissipation structure, including a vapor chamber and a heat pipe. The vapor chamber includes a plate body and a first cavity enclosed by the plate body. The plate body includes a first region having an outer surface and an inner surface facing away from each other, and the first region has a window extending through the outer surface and the inner surface. The heat pipe includes a tube body and a second cavity enclosed by the tube body, and a first end of the heat pipe has an opening communicating with the second cavity. The heat pipe passes through the window, with the first end located inside the window. The tube body and the window are hermetically connected to achieve a fixed connection between the heat pipe and the vapor chamber, as well as communication between the first cavity and the second cavity. The first cavity and the second cavity also have capillary structures, and the connection between the capillary structures and the first end and the inner surface is integrally formed.

[0007] In the heat dissipation structure provided in this application, the connection position of the capillary structure between the first end (or opening) of the heat pipe and the inner surface of the first region is integrally formed, thereby ensuring the continuity of the capillary structure at the connection position so that the medium can flow effectively between the first cavity and the second cavity.

[0008] In one example, the first end of the heat pipe can be located inside the window. That is, the first end of the heat pipe does not protrude from the inner surface of the first region, so that a smooth transition can be achieved between the first end of the heat pipe and the inner surface of the first region, which helps to ensure the continuity of the capillary structure.

[0009] In one example, the outer periphery of the opening also has a flange that abuts against the inner surface. By adding the flange, the connection area between the heat pipe and the vapor chamber can be increased, thereby improving the reliability of the connection between the heat pipe and the vapor chamber.

[0010] In one example, the flange may abut against the inner surface, or the flange may be hermetically connected to the inner surface to improve the reliability of the connection between the heat pipe and the vapor chamber.

[0011] In one example, the thickness of different regions of the flange is the same, which improves the ease of flange manufacturing.

[0012] In one example, the thickness of the flange near the opening is greater than the thickness of the flange away from the opening. This results in a smaller height difference between the edge of the flange and the inner surface of the first region, improving the continuity and smooth transition of the capillary structure at that location.

[0013] In one example, the flange has a recess on the side facing away from the inner surface, with one end of the recess extending to the edge of the flange. By providing the recess, a smaller height difference is created between the edge of the flange and the inner surface of the first region, improving the continuity and smooth transition of the capillary structure at that location.

[0014] In one example, the recess also extends to the opening. When a capillary structure is provided within the recess, the capillary structure can achieve an effective connection between the capillary structure located on the inner wall of the tube and the capillary structure on the inner surface of the first region, thereby ensuring the smooth flow of the medium in the capillary structure.

[0015] In one example, the recess is at least one of a groove, a slit, or an opening. That is, the recess may extend through the thickness of the flange, or it may not extend through the thickness of the flange, providing good flexibility in its design.

[0016] In one example, the capillary structure covers the flange. Alternatively, it can be understood that when the flange includes a recess, the capillary structure may be disposed only within the recess. Or, in some cases, the capillary structure may also cover the flange to increase the coverage area of ​​the capillary structure.

[0017] In one example, the tube is a closed-end cylindrical shape, and the flange extends perpendicularly to the extension direction of the tube. This perpendicularity refers to approximate perpendicularity, allowing the flange surface to achieve a good seal with the inner surface.

[0018] In one example, the panel includes a first panel, a second panel, and a side panel. The first and second panels are disposed opposite each other, and the side panel connects between the first and second panels, together forming a second cavity. The first region is at least a portion of the first panel. The first panel, second panel, and side panel can be manufactured separately. Alternatively, the first panel and side panel can be integrally formed, or the second panel and side panel can be integrally formed, which improves the ease of panel manufacturing.

[0019] In one example, the heat dissipation structure includes multiple heat pipes, and the vapor chamber includes multiple windows, with each heat pipe and window corresponding to the others. An airflow channel is formed between adjacent heat pipes to allow air circulation. Using multiple heat pipes effectively improves the heat dissipation efficiency of the structure. Furthermore, the presence of an airflow channel between adjacent heat pipes enhances the heat exchange efficiency between the air and the heat plate, further improving the overall heat dissipation efficiency of the structure.

[0020] Secondly, this application provides a heat dissipation device, including a fan and any of the above-mentioned heat dissipation structures. The fan is used to generate airflow over the outer surface of the heat pipe, so that the heat of the heat pipe can be dissipated quickly. The heat dissipation device can have good heat dissipation efficiency.

[0021] Thirdly, this application also provides an electronic device, including electronic components and the aforementioned heat dissipation structure or device. The electronic components are thermally bonded to the outer surface of the vapor chamber facing away from the heat pipe. The heat generated by the electronic components can be transferred to the surface of the vapor chamber through thermal conduction. The medium located in the first and second chambers can quickly transfer the heat generated by the electronic components to the heat pipe for dissipation, exhibiting good heat dissipation performance, thereby helping to ensure the working performance and reliability of the electronic components. Attached Figure Description

[0022] Figure 1 is a cross-sectional schematic diagram of a conventional heat dissipation structure provided in an embodiment of this application;

[0023] Figure 2 is a three-dimensional structural diagram of a heat dissipation structure provided in an embodiment of this application;

[0024] Figure 3 is an exploded structural diagram of a heat dissipation structure provided in an embodiment of this application;

[0025] Figure 4 is a cross-sectional schematic diagram of a heat dissipation structure provided in an embodiment of this application;

[0026] Figure 5 is a cross-sectional schematic diagram of a heat dissipation structure provided in an embodiment of this application applied to an electronic device;

[0027] Figure 6 is a cross-sectional schematic diagram of another heat dissipation structure provided in an embodiment of this application;

[0028] Figure 7 is a cross-sectional schematic diagram of another heat dissipation structure provided in an embodiment of this application;

[0029] Figure 8 is a cross-sectional schematic diagram of another heat dissipation structure provided in an embodiment of this application;

[0030] Figure 9 is a three-dimensional structural diagram of another heat pipe provided in an embodiment of this application;

[0031] Figure 10 is a cross-sectional view of another heat pipe provided in an embodiment of this application;

[0032] Figure 11 is a schematic cross-sectional view of another heat pipe provided in an embodiment of this application;

[0033] Figure 12 is a cross-sectional schematic diagram of the heat pipe in Figure 10 applied in the heat dissipation structure.

[0034] Figure 13 is a schematic cross-sectional view of another heat pipe provided in an embodiment of this application;

[0035] Figure 14 is a three-dimensional structural diagram of another heat pipe provided in an embodiment of this application;

[0036] Figure 15 is a schematic diagram of a planar structure of a flange provided in an embodiment of this application;

[0037] Figure 16 is a three-dimensional structural diagram of a heat dissipation device provided in an embodiment of this application. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0039] To facilitate understanding of the heat dissipation structure provided in the embodiments of this application, its application scenarios will be introduced first below.

[0040] The heat dissipation structure provided in this application embodiment can be applied in various scenarios with heat dissipation requirements, such as vehicles, power conversion equipment, and data centers.

[0041] For example, as shown in Figure 1, a current power conversion device includes an electronic component 01 and a heat dissipation structure 02. The electronic component 01 can specifically be a power device or other device requiring heat dissipation. The heat dissipation structure includes a heat spreader 021 and fins 022. The heat generated by the electronic component 01 can be dissipated through the heat dissipation structure 02, thereby ensuring that the electronic component 01 operates within its normal temperature range.

[0042] The outer surface of the heat spreader 021 includes two opposing first and second surfaces. Fins 022 are disposed on the first surface of the heat spreader 021, and electronic components 01 are disposed on the second surface of the heat spreader 021. Inside the heat spreader 021, there is a cavity 0210 containing a medium, and the inner wall of the cavity 0210 has a capillary structure (not shown in Figure 1).

[0043] Among them, the heat spreader 021 is also known as the heat conduction plate or superconducting heat plate. Its working principle is to achieve heat conduction and diffusion through the vaporization and condensation of the medium in the cavity 0210.

[0044] In simple terms, the heat generated by electronic component 01 can be transferred to the first surface of the vapor chamber 021 via thermal conduction. The medium inside the cavity 0210 vaporizes upon heating, rapidly expanding to fill the entire cavity. When the gaseous medium comes into contact with a cooler area, it condenses, releasing heat. For example, the second surface, equipped with fins 022, can maintain a lower temperature after heat exchange with the external environment, allowing the vaporized medium to condense and liquefy near the second surface. The condensed medium then flows back to the evaporation zone through a capillary structure, forming a cycle. The liquefied medium then flows back to the vicinity of the first surface through the capillary structure, thus circulating to cool electronic component 01.

[0045] The fins 022 are usually made of materials with good thermal conductivity, such as copper. The fins 022 can increase the heat dissipation area of ​​the heat spreader 021, so that the area near the second surface has a lower temperature, thereby giving the heat dissipation structure 02 better heat dissipation efficiency.

[0046] However, with the continuous improvement of the performance of power conversion equipment, the heat generated by electronic component 01 has also increased significantly. Therefore, how to improve the heat dissipation performance of heat dissipation structure 02 has become an urgent technical problem to be solved.

[0047] Currently, two methods are commonly used to improve the heat dissipation performance of the heat dissipation structure 02. One method is to increase the area of ​​the fins 022, allowing them to have a larger surface area for heat exchange with the outside air. However, due to space limitations, the area of ​​the fins 022 cannot be increased indefinitely, thus significantly restricting the heat dissipation performance of the structure. The other method is to increase the airflow velocity to more quickly remove heat from the fins 022. Currently, fans are typically used to generate airflow across the fins. However, as the fan speed increases, the fan thickness needs to be increased to maintain structural strength, which significantly increases the fan's weight and power consumption. Furthermore, when the outside air temperature is high, increasing the heat dissipation area or fan speed does not significantly improve heat dissipation performance, failing to achieve optimal cooling.

[0048] Therefore, this application provides a heat dissipation structure with better heat dissipation efficiency.

[0049] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0050] As shown in Figures 2 to 4, Figure 2 is a three-dimensional structural schematic diagram of a heat dissipation structure 10 provided in an embodiment of this application, Figure 3 is an exploded structural schematic diagram of the heat dissipation structure 10, and Figure 4 is a cross-sectional structural schematic diagram of the heat dissipation structure 10.

[0051] As shown in Figure 2, the heat dissipation structure 10 includes a heat spreader 11 and heat pipes 12 (six are shown in Figure 2). Referring to Figures 2 and 4, the heat spreader 11 includes a plate body 111 and a first cavity 110 enclosed by the plate body 111. The heat pipes 12 include a pipe body 121 and a second cavity 120 enclosed by the pipe body 121, and the first cavity 110 and the second cavity 120 are connected.

[0052] Specifically, as shown in Figures 2 and 4, the plate 111 includes a first region 1110, which has an outer surface (not shown in the figures) and an inner surface (not shown in the figures) that are opposite to each other. The inner surface of the first region 1110 refers to the surface of the first region 1110 facing the first cavity 110, and the outer surface of the first region 1110 refers to the surface of the first region 1110 that is opposite to the first cavity 110.

[0053] As shown in Figure 3, the first region 1110 has windows 11101 extending through the outer and inner surfaces (six are shown in the figure).

[0054] As shown in Figure 4, the first end of the heat pipe 12 has an opening 122 communicating with the second cavity 120. The heat pipe 12 passes through the window 11101, and the pipe body 121 is sealed to the window 11101. The first end is located inside the window 11101, thus achieving a fixed connection between the heat pipe 12 and the heat spreader 11, as well as communication between the first cavity 110 and the second cavity 120. The first cavity 110 and the second cavity 120 also have capillary structures 13. The capillary structure 13 is integrally formed at the connection point between the first end (or opening 122) of the heat pipe 12 and the inner surface of the first region 1110, ensuring the continuity of the capillary structure 13 at this connection point, so that the medium can effectively flow between the first cavity 110 and the second cavity 120.

[0055] To facilitate understanding of the technical solution of this application, the working principle of the heat dissipation structure 10 will be explained first below.

[0056] As shown in Figure 5, in one example, when the heat dissipation structure 10 is applied in an electronic device, it can dissipate heat from the electronic component 01. The electronic component 01 can be disposed on the surface of the heat spreader 11, allowing the heat generated by the electronic component 01 to be transferred to the plate 111 of the heat spreader 11 via thermal conduction. The plate 111 of the heat spreader 11 and the tube 121 of the heat pipe 12 can be made of a metal material with good thermal conductivity, such as copper, aluminum, or an alloy, or other non-metallic materials with good thermal conductivity. The first cavity 110 and the second cavity 120 contain a medium. After the heat generated by the electronic component 01 is transferred to the plate 111 of the heat spreader 11, the medium in the first cavity 110 is heated and vaporized. At this time, the medium absorbs heat and rapidly expands in volume, quickly filling the first cavity 110 and the second cavity 120 with the gaseous medium. When the gaseous medium comes into contact with a relatively cold area (such as the capillary structure 13 in heat pipe 12), it will condense and liquefy, thereby releasing the heat absorbed during vaporization. The condensed and liquefied medium enters the capillary structure 13 within heat pipe 12 due to capillary adsorption, and then flows back from the capillary structure 13 in heat pipe 12 to the capillary structure 13 in the heat spreader 11. This process repeats continuously within the first cavity 110 and the second cavity 120. This cycle removes the heat generated by electronic component 01, thus dissipating heat from electronic component 01. The medium can be water, kerosene, or other endothermic media undergoing a phase change; this application does not limit the specific type of medium.

[0057] It should be noted that in some instances, the temperature on the side of the heat spreader 11 away from the electronic component 01 is also lower. Therefore, the gaseous medium on the side of the heat spreader 11 away from the electronic component 01 will also condense and liquefy, and eventually flow back to the capillary structure 13 near the electronic component. This will not be elaborated here.

[0058] When fabricating the capillary structure 13 within the first cavity 110 and the second cavity 120, processes such as sintering can be employed. For example, after connecting the heat pipe 12 to the heat spreader 11, the capillary structure 13 can be fabricated on the inner walls of the first cavity 110 and the second cavity 120 to ensure continuity of the connection between the capillary structure 13 at the first end (or opening 122) of the heat pipe 12 and the inner surface of the first region 1110, thereby ensuring effective reflux of the liquefied medium. In one implementation, the capillary structure 13 can cover the entire inner wall of the first cavity 110 and the second cavity 120, or it can be distributed in a partial region within the first cavity 110 and the second cavity 120. To facilitate understanding of the technical solution of this application, the following example will exemplify the situation where the capillary structure 13 covers the entire inner wall of the first cavity 110 and the second cavity 120.

[0059] In one example, all capillary structures 13 within the first cavity 110 and the second cavity 120 can be integrally formed. Alternatively, the capillary structures 13 may be integrally formed only at the connection between the heat pipe 12 and the heat spreader 11, while the capillary structures 13 at other locations may be separately formed. Furthermore, the material, density, or capillary suction parameters of the capillary structures 13 in the first cavity 110 and the second cavity 120 may be the same or different. Alternatively, the entire capillary structure 13 may be made of the same material. Alternatively, the material and other parameters of the capillary structures 13 in some different regions of the entire capillary structure 13 may be different, which will not be elaborated here.

[0060] In one example, the inner surface of the first region 1110 is a plane, which makes the first region 1110 have relatively uniform structural strength. When the heat spreader 11 is heated, the first region 1110 is not easy to deform, which can ensure the reliability of the connection between the heat pipe 12 and the heat spreader 11, and also ensure the overall structural stability and reliability of the heat dissipation structure 10.

[0061] The inner surface of the first region 1110 is flat, which can be considered as the inner surface near the window 11101 without recessed structures such as grooves, in order to ensure the structural stability of the first region 1110 and prevent the first region 1110 of the plate 111 from undergoing adverse deformation when heated.

[0062] Alternatively, it can be understood that, in one example, the heat transfer efficiency of the plate 111 can be improved by reducing its thickness. In the example provided in this application, when the thickness of the plate 111 is small, no structure such as a sink is provided in the first region 1110, thus ensuring the structural strength of the entire plate 111.

[0063] Furthermore, in some cases, when a recessed structure such as a groove is provided on the inner surface of the first region 1110, the distance between two adjacent heat pipes 12 increases, which is not conducive to increasing the density of heat pipes 12 and thus affects the heat dissipation efficiency of the heat dissipation structure 10. In the example provided in this application, no recessed structure such as a groove is provided on the inner surface of the first region 1110. Therefore, the distance between two adjacent heat pipes 12 can be reduced as much as possible, which can effectively increase the density of heat pipes 12 and is beneficial to improving the heat dissipation efficiency of the heat dissipation structure 10.

[0064] In one example, the relative positional relationship between the first end of the heat pipe 12 and the inner surface of the first region 1110 can be varied.

[0065] For example, as shown in Figure 4, in one example provided in this application, the first end (or opening 122) of the heat pipe 12 is substantially flush with the inner surface of the first region 1110. This allows for a relatively smooth transition between the first end of the heat pipe 12 and the inner surface of the first region 1110, which is beneficial for achieving the continuity of the capillary structure 13.

[0066] Alternatively, in some examples, the first end of the heat pipe 12 may be slightly concave to the inner surface. This approach also allows for a smoother transition between the first end of the heat pipe 12 and the inner surface of the first region 1110, thereby facilitating the continuity of the capillary structure 13.

[0067] It is understandable that the first end of the heat pipe 12 is basically flush with the surface of the first region 1110 and the first end of the heat pipe 12 is slightly concave to the inner surface, which can be considered as the first end of the heat pipe 12 being located inside the window 11101.

[0068] Alternatively, in one example, the first end of the heat pipe 12 may protrude slightly beyond the outer surface of the first region 1110. That is, the first end of the heat pipe 12 extends into the first cavity 110 through the window 11101.

[0069] In one example, the structure of the heat spreader 11 can be varied.

[0070] For example, as shown in Figures 3 and 4, in one example provided in this application, the temperature distribution plate 11 is integrally formed as a hollow rectangular plate.

[0071] Specifically, the heat spreader 11 includes a first plate 1111, a second plate 1112, and a side plate 1113. The first plate 1111 and the second plate 1112 are both rectangular plates and are arranged opposite to each other. The side plate 1113 is a rectangular frame structure and is connected between the first plate 1111 and the second plate 1112, so that the first plate 1111, the second plate 1112, and the side plate 1113 together form the second cavity 120.

[0072] All windows 11101 are located on the first plate 1111, and multiple windows 11101 are spaced apart within the first plate 1111. As mentioned above, the windows 11101 are located in the first region 1110 of the plate 111. Therefore, in the examples provided in Figures 3 and 4, the windows 11101 can also be considered to be located within the first plate 1111. The first region 1110 can be a portion of the first plate 1111 or all of the regions within the first plate 1111. In one example, the positions of the windows 11101 within the first plate 1111 can be reasonably set according to actual needs. Furthermore, in the example provided in Figure 3, six windows 11101 are shown; in some examples, the number of windows 11101 can be one, two, or more. Additionally, in the example provided in Figure 3, six heat pipes 12 are shown. In some examples, the number of heat pipes 12 can also be one, two, or more. The number of windows 11101 and the number of heat pipes 12 can be the same. When there are multiple windows 11101 and multiple heat pipes 12, the multiple windows 11101 and the multiple heat pipes 12 correspond one-to-one.

[0073] In one example, the first plate 1111, the side plate 1113, and the second plate 1112 can be independent structural components, or they can be integrally formed. For example, when the first plate 1111, the side plate 1113, and the second plate 1112 are all independent structural components, the first plate 1111, the side plate 1113, and the second plate 1112 can be manufactured first, and then the side plate 1113 can be connected to the first plate 1111 and the second plate 1112 using processes such as welding. Alternatively, in some cases, the first plate 1111 and the side plate 1113 can be integrally formed. Alternatively, in some cases, the second plate 1112 and the side plate 1113 can be integrally formed.

[0074] In the example provided in Figure 3, the heat spreader 11 is a hollow rectangular plate, which is used as an example for illustrative purposes. In other examples, the heat spreader 11 may also be a hollow circular plate, an elliptical plate, or other shapes. This application does not limit the specific structural shape of the heat spreader 11.

[0075] In one example, the structure of heat pipe 12 can also be varied.

[0076] For example, as shown in Figure 4, in one example provided in this application, the tube body 121 of the heat pipe 12 is a cylindrical shape with one end closed and the other end having an opening 122.

[0077] In other examples, the heat pipe 12 may also be roughly elliptical or cylindrical in shape. This application does not limit the specific shape of the heat pipe 12.

[0078] It should be noted that, in order to facilitate the airtight connection between the heat pipe 12 and the heat spreader 11, in one implementation, the shape of the window 11101 in the heat spreader 11 is basically the same as the outer contour of the heat pipe 12, so as to reduce the gap between the heat pipe 12 and the heat spreader 11, thereby facilitating the airtight connection between the heat pipe 12 and the heat spreader 11.

[0079] In one example, the heat pipe 12 and the heat spreader 11 can be fixedly connected by welding or other means.

[0080] For example, the tube body 121 of the heat pipe 12 can be welded to the first plate body 1111 of the heat spreader 11 to achieve a fixed connection between the heat pipe 12 and the heat spreader 11, and has good connection sealing.

[0081] Alternatively, in one example, the tube body 121 of the heat pipe 12 can be connected to the window 11101 in the first plate 1111 by an interference fit.

[0082] Alternatively, in one example, when the heat pipe 12 body 121 and the window 11101 are connected by an interference fit, the heat pipe 12 can also be welded to the first plate 1111 to ensure the reliability of the connection between the heat pipe 12 and the heat spreader 11.

[0083] Additionally, as shown in Figure 6, in one example provided in this application, the heat dissipation structure 10 further includes fins 14. The fins 14 are thermally connected to the tube body 121 of the heat pipe 12, which can be used to improve the heat dissipation performance of the heat dissipation structure 10. Specifically, in the example provided in Figure 6, multiple fins 14 are arranged sequentially at intervals along the length of the heat pipe 12. Each fin 14 has a through hole through which the heat pipe 12 passes, and the outer circumferential surface of the tube body 121 is thermally connected to the inner wall of the through hole, so that the heat from the heat pipe 12 can be transferred to the fins 14 for dissipation. The fins 14 have a large area, resulting in a large heat exchange area between the fins 14 and the outside air, thereby quickly removing the heat from the fins 14 (or the heat pipe 12) and improving the heat dissipation efficiency of the heat dissipation structure 10. It should be noted that, in order to achieve a thermally conductive connection between the heat pipe 12 and the fin 14, an interference fit can be used to achieve a tight connection between the heat pipe 12 and the fin 14, thereby achieving both a fixed connection and a thermally conductive connection between the heat pipe 12 and the fin 14. Alternatively, in some examples, the heat pipe 12 and the fin 14 can also be connected by welding or other methods, which will not be elaborated here.

[0084] The fins 14 can be made of copper, aluminum, or alloys, or other materials with good thermal conductivity. The shape of the fins 14 can be a rectangular plate, a honeycomb structure, or other structural types. This application does not limit the specific material and shape of the fins 14.

[0085] It should be noted that in the example provided in Figure 4 above, the connection reliability between the heat pipe 12 and the heat spreader 11 is ensured by welding the heat pipe 12 to the first plate 1111. Alternatively, in one implementation, other methods can be used to further improve the connection reliability between the heat pipe 12 and the heat spreader 11.

[0086] For example, as shown in Figure 7, in one example provided in this application, the first plate 1111 also has a protrusion 11111, which is located around the periphery of the window 11101. Alternatively, the window 11101 can also be considered to extend through the protrusion 11111. The protrusion 11111 can effectively increase the connection area between the first plate 1111 and the heat pipe 12, thereby improving the connection reliability between the first plate 1111 and the heat pipe 12.

[0087] Alternatively, as shown in Figure 8, in another example provided in this application, the heat pipe 12 further includes a flange 123 located on the outer periphery of the opening 122 and extending radially outward, i.e., the extending direction of the flange 123 is perpendicular to the extending direction of the pipe body 121. Here, "perpendicular" refers to approximately perpendicularity. For example, the angle between the extending direction of the flange 123 and the extending direction of the pipe body 121 can be approximately 90°, or greater than or less than 90°.

[0088] In one example, the flange 123 can abut against the inner surface of the first plate 1111 to improve the reliability of the connection between the heat pipe 12 and the first plate 1111. For example, in actual use, when the medium in the first cavity 110 and the second cavity 120 is heated and vaporized, it increases the pressure in the first cavity 110 and the second cavity 120. This pressure acts between the heat pipe 12 and the heat spreader 11, generating a force that could cause the heat pipe 12 to separate from the heat spreader 11. When the flange 123 abuts against the inner surface of the first plate 1111, it can effectively prevent the heat pipe 12 from separating from the heat spreader 11, thereby improving the reliability of the connection between the heat pipe 12 and the heat spreader 11.

[0089] In one example, the flange 123 may abut against the inner surface of the first plate 1111. Alternatively, the flange 123 may be welded to the inner surface of the first plate 1111 to further increase the connection area between the heat pipe 12 and the first plate 1111, thereby improving the connection reliability between the heat pipe 12 and the heat spreader 11.

[0090] In one example, the tube body 121 and the flange 123 can be independent structural components or integrally formed. For example, when the tube body 121 and the flange 123 are independent structural components, they can be manufactured separately, and then connected by welding or other processes. Alternatively, when the tube body 121 and the flange 123 are integrally formed, the flange 123 can be considered as a part of the tube body 121. For example, one end of the tube body 121 can be flanged to form the flange 123.

[0091] When configuring flange 123, its structural type can be varied.

[0092] For example, as shown in FIG9, in one example provided in this application, the flange 123 is generally annular and surrounds the outer periphery of the opening 122.

[0093] In one example, the thickness of the flange 123 may be smaller than the thickness of the tube body 121. For example, the maximum thickness of the flange 123 may be smaller than the minimum thickness of the tube body 121.

[0094] In one example, the thickness dimensions of different regions of flange 123 can be approximately the same.

[0095] Alternatively, in one example, there are regions with different thicknesses within flange 123.

[0096] For example, as shown in Figure 10, in one example provided in this application, the thickness of the flange 123 near the opening 122 is greater than the thickness of the flange 123 away from the opening 122, resulting in a smaller thickness at the edge of the flange 123. Referring to Figures 10 and 8, a smaller edge thickness of the flange 123 reduces the height difference between the edge of the flange 123 and the inner surface of the first plate 1111. When the surface of the flange 123 and the inner surface of the first plate 1111 have an integrally formed capillary structure, the height difference generated by the capillary structure at the edge of the flange 123 can be reduced, ensuring the continuity of the capillary structure and thereby increasing the resistance to flow of the medium within the capillary structure.

[0097] In addition, when the thickness of the flange 123 near the opening 122 is large, the flange 123 and the tube body 121 have good structural strength, which can prevent deformation at the connection position between the flange 123 and the tube body 121, so as to ensure the stability of the heat dissipation structure 10.

[0098] In summary, when the thickness of the flange 123 near the opening 122 is large and the thickness of the edge of the flange 123 is small, the connection strength between the flange 123 and the tube body 121 and the continuity of the capillary structure can be effectively balanced, so that the heat dissipation structure 10 has good structural stability and heat dissipation performance.

[0099] Alternatively, as shown in FIG11, in another example provided in this application, the flange 123 also has a recess 1231, one end of which extends to the edge of the flange 123.

[0100] In the example provided in Figure 11, the recess 1231 is specifically a groove, meaning that the recess 1231 does not penetrate the thickness of the flange 123.

[0101] As shown in Figure 12, after the heat pipe 12 is connected to the heat spreader 11, the thickness of the recess 1231 at the edge of the flange 123 is relatively small, resulting in a small height difference between the recess 1231 at the edge of the flange 123 and the inner surface of the first plate 1111. When the recess 1231 and the inner surface of the first plate 1111 have an integrally formed capillary structure, the height difference generated by the capillary structure at the edge of the recess 1231 can be reduced, thus ensuring the continuity of the capillary structure and improving the resistance of the medium flowing in the capillary structure.

[0102] By providing a recess 1231 in the flange 123, the connection strength between the flange 123 and the tube body 121 can be effectively balanced, resulting in better structural stability of the heat dissipation structure 10. Specifically, the thickness of the flange 123 can be relatively large to ensure good structural strength. Furthermore, the connection point between the flange 123 and the tube body 121 also possesses good structural strength. In other words, the flange 123 itself can have good structural strength and is not prone to deformation. Moreover, the connection strength between the flange 123 and the tube body 121 can be effectively guaranteed.

[0103] In the example provided in Figure 11, the recess 1231 extends only to the edge of the flange 123, resulting in a low height difference between the recess 1231 and the inner surface of the first plate 1111.

[0104] As shown in Figure 13, in another example, the recess 1231 can also extend to the opening 122. That is, one end of the recess 1231 extends to the opening 122, and the other end extends to the edge of the flange 123. In one example, the capillary structure can cover the recess 1231, so that the capillary structure located in the recess 1231 can effectively connect the capillary structure in the tube 121 (or the second cavity 120) and the capillary structure on the inner surface of the first plate 1111, thereby ensuring the flow of the medium in the first cavity 110 and the second cavity 120.

[0105] Understandably, in one example, when a capillary structure is provided within the recess 1231, a capillary structure may also be provided on the surface of the flange 123 other than the recess 1231. Alternatively, a capillary structure may be provided only within the recess 1231 of the flange 123, while no capillary structure may be provided on the other surfaces of the flange 123.

[0106] When the recess 1231 is a groove, the depth dimension of different positions of the recess 1231 can be approximately the same or different. For example, when the depth dimension of different positions of the recess 1231 is different, the depth dimension of the recess 1231 near the edge of the flange 123 can be larger, and the depth dimension of the recess 1231 near the opening 122 can be smaller, which will not be elaborated here.

[0107] Furthermore, when the recess 1231 is a groove, its shape can be rectangular, fan-shaped, or the like. In one example, the specific shape of the recess 1231 can be flexibly adjusted, but this application will not elaborate on the specific shape of the recess 1231.

[0108] In the above example, the recess 1231 is an example of a groove. In other examples, the recess 1231 may also be a structure type such as a gap or an opening.

[0109] For example, as shown in Figures 14 and 15, in another example provided in this application, the recess 1231 is an opening. That is, the recess 1231 extends through the thickness of the flange 123.

[0110] When the recess 1231 is an opening, the arrangement of the recess 1231 can be similar to that described above when the recess 1231 is a groove.

[0111] In simple terms, the recess 1231 may extend only to the edge of the flange 123. Alternatively, one end of the recess 1231 may extend to the edge of the flange 123, and the other end may extend to the opening 122.

[0112] In another example, the number and location of the recesses 1231 included in the flange 123 can be varied.

[0113] For example, as shown in Figures 14 and 15, in one example provided in this application, the flange 123 includes two recesses 1231, both of which extend radially.

[0114] In addition, in the examples provided in Figures 14 and 15, the two recesses 1231 are rotationally symmetrical about the center of the flange 123.

[0115] In other examples, the flange 123 may also include one, three or more recesses 1231. When the flange 123 includes multiple recesses 1231, the shape or size of all the recesses 1231 may be the same. For example, the recesses 1231 may all be either grooves or openings 122.

[0116] Alternatively, when the flange 123 includes multiple recesses 1231, there may be at least two recesses 1231 with different shapes or sizes. For example, the multiple recesses 1231 may include recesses 1231 with groove structures or recesses 1231 with open structures, which will not be elaborated here.

[0117] It should be noted that the above example is an example of flange 123 being roughly circular in shape. In other examples, flange 123 may also be a polygonal ring structure such as a rectangular ring, or flange 123 may be other structural shapes, which will not be elaborated here.

[0118] In one example, the heat dissipation structure 10 described above can be used independently in an electronic device to dissipate heat from electronic components. Alternatively, the heat dissipation structure 10 can be used in conjunction with other structures.

[0119] For example, as shown in Figure 16, this embodiment of the application also provides a heat dissipation device, including a fan 21 and a heat dissipation structure 10. The fan 21 can generate airflow, thereby increasing the airflow speed. For example, a heat pipe 12 can be located on the air outlet side of the fan 21, and the airflow generated by the fan 21 can flow over the surface of the heat pipe 12 to quickly remove heat from its surface. Alternatively, in the example provided in Figure 16, multiple heat pipes 12 are spaced apart, forming an airflow channel between adjacent heat pipes 12.

[0120] It should be noted that the above example is exemplified by the heat pipe 12 being located on the exhaust side of the fan 21. In other examples, the heat pipe 12 may also be located on the intake side of the fan 21. Alternatively, the fan 21 may be disposed within an air duct formed by multiple heat pipes 12.

[0121] In the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terminology and / or descriptions of different embodiments are consistent and can be referenced by each other. The technical features of different embodiments can be combined to form new embodiments according to their inherent logical relationship.

[0122] In this application, "multiple" means two or more. "And / or" describes the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, or B exists alone, where A and B can be singular or plural.

[0123] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application. The order of the process numbers described above does not imply the order of execution; the execution order of each process should be determined by its function and internal logic.

Claims

1. A heat dissipation structure, characterized in that, Including a vapor chamber and heat pipes; The temperature distribution plate includes a plate body and a first cavity enclosed by the plate body; The plate includes a first region, the first region having an outer surface and an inner surface that are opposite to each other; The heat pipe includes a tube body and a second cavity enclosed by the tube body; The first end of the heat pipe has an opening that communicates with the second cavity; The first region has a window extending through the outer surface and the inner surface, the heat pipe passing through the window, and the pipe body being hermetically connected to the window; The first end is located within the window; The first cavity and the second cavity also have capillary structures, and the connection between the capillary structures and the inner surface is integrally formed.

2. The heat dissipation structure according to claim 1, characterized in that, The first end is located within the window.

3. The heat dissipation structure according to claim 1, characterized in that, The outer periphery of the opening also has a flange that abuts against the inner surface.

4. The heat dissipation structure according to claim 3, characterized in that, The thickness of different regions of the flange is the same.

5. The heat dissipation structure according to claim 3, characterized in that, The thickness of the flange near the opening is greater than the thickness of the flange away from the opening.

6. The heat dissipation structure according to any one of claims 3 to 5, characterized in that, The flange has a recess on the side opposite to the inner surface, and one end of the recess extends to the edge of the flange.

7. The heat dissipation structure according to claim 6, characterized in that, The recessed portion also extends to the opening.

8. The heat dissipation structure according to claim 6 or 7, characterized in that, The recess is at least one of a groove, a slit, or an opening.

9. The heat dissipation structure according to any one of claims 3 to 8, characterized in that, The capillary structure covers the flange.

10. The heat dissipation structure according to any one of claims 3 to 9, characterized in that, The flange is in a sealed connection with the inner surface.

11. The heat dissipation structure according to any one of claims 3 to 10, characterized in that, The tube body is a closed cylindrical shape at one end, and the extension direction of the flange is perpendicular to the extension direction of the tube body.

12. The heat dissipation structure according to any one of claims 1 to 11, characterized in that, The plate body includes a first plate body, a second plate body, and side plates; The first plate and the second plate are disposed opposite to each other, and the side plate is connected between the first plate and the second plate. The first plate, the second plate, and the side plate together form the second cavity. The first region is at least a portion of the first plate.

13. The heat dissipation structure according to any one of claims 1 to 12, characterized in that, The heat dissipation structure includes multiple heat pipes, and the heat spreader includes multiple windows, with each heat pipe and window corresponding to the other. Among them, an air duct is formed between two adjacent heat pipes to allow airflow.

14. A heat dissipation device, characterized in that, The device includes a fan and a heat dissipation structure as described in any one of claims 1 to 13, characterized in that the fan is used to generate airflow over the outer surface of the heat pipe.

15. An electronic device, characterized in that, Includes electronic components and a heat dissipation structure as described in any one of claims 1 to 13, or a heat dissipation device as described in claim 14; The electronic components are thermally bonded to the outer surface of the heat spreader that is away from the heat pipe.

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