Substrate cleaning apparatus, substrate cleaning method, and coating and developing device

Abstract

A substrate cleaning apparatus, a substrate cleaning method, and a coating and developing device are provided, wherein the substrate cleaning apparatus (10) comprises: a carrier plate (11); a plurality of first clamping members (12); a plurality of second clamping members (13); a first driving member (14) configured to drive the second clamping members (13) to move in a radial direction of the carrier plate (11); a second driving member (15) configured to drive the second clamping members (13) to rotate; a cleaning brush (16) configured to brush-clean a lower surface of a substrate (20); and a third driving member (17) in driving connection with the carrier plate (11); in a brush-cleaning state, the first driving member (14) is configured to drive the second clamping members (13) to move radially inward along the carrier plate (11) so as to clamp an edge of the substrate (20), the second driving member (15) is configured to drive the second clamping members (13) to rotate the substrate (20) about its own axis, and the cleaning brush brush-cleans the lower surface of the substrate (20); and in a spin-drying state, the third driving member (17) is configured to drive the carrier plate (11) to rotate, and the first clamping members (12) are configured to clamp and drive the substrate (20) to rotate so as to spin-dry cleaning liquid on the substrate (20). The substrate cleaning apparatus improves the cleaning effect on the lower surface of the substrate and increases the cleaning efficiency of the substrate.

Description

Substrate cleaning apparatus, substrate cleaning method and coating and developing equipment Technical Field

[0001] This application relates to the field of semiconductor equipment, specifically to a substrate cleaning apparatus, a substrate cleaning method, and a coating and developing apparatus. Background Technology

[0002] Currently, the inline setup for photolithography consists of a coating and developing machine and a photolithography machine. The general process of photolithography is as follows: after the substrate is coated in the coating and developing machine, it is sent to the photolithography machine for exposure. After exposure, the substrate is returned to the coating and developing machine for development.

[0003] After the substrate has been coated and before it is transferred to the lithography machine for exposure, the back side of the substrate needs to be cleaned. The purpose of this cleaning is to prevent contaminant particles on the back side of the substrate from being transferred into the lithography machine. This would cause contaminant particles to become trapped between the substrate and the substrate support during the exposure process, causing the substrate surface to bend and form local bulges. Consequently, the focus cannot be aligned during exposure, resulting in defocusing, which affects the accuracy of the substrate exposure pattern and ultimately reduces the substrate processing yield.

[0004] Chinese patent document application number 200710160027.7 discloses a substrate cleaning apparatus and a substrate cleaning method. The substrate cleaning apparatus includes two substrate holding units for supporting the substrate from the back side. The support areas of the two substrate holding units on the back side of the substrate do not overlap, allowing for alternating support of the substrate during cleaning, so that the cleaning mechanism can clean different support areas on the back side of the substrate sequentially. Specifically, the first substrate holding unit includes an adsorption pad configured to support and adsorb onto the periphery of the back side of the substrate; the second substrate holding unit includes a rotating chuck configured to support and adsorb onto the central portion of the back side of the substrate; the cleaning mechanism includes a cleaning brush. During substrate cleaning, the periphery of the back side of the substrate is first supported by the adsorption pad, allowing the cleaning mechanism to clean the central portion of the back side of the substrate; then, the central portion of the back side of the substrate is supported by the rotating chuck, allowing the cleaning mechanism to clean the periphery of the back side of the substrate, thereby achieving cleaning of the entire back side of the substrate.

[0005] However, the above solution still has drawbacks. After the cleaning mechanism completes the cleaning of the central part of the substrate's back side, a rotating chuck is needed to support the central part of the substrate's back side to clean the peripheral part. This results in low cleaning efficiency, and during this process, there is a risk that contaminant particles on the rotating chuck may cause secondary contamination of the substrate's back side, thus affecting the cleaning effect of the device and potentially transferring contaminant particles from the substrate's back side into the lithography machine. Therefore, existing lithography machines generally also have a back side cleaning module for secondary cleaning of the substrate's back side before lithography. While this reduces the impact of contaminant particles on the substrate's back side on lithography accuracy to some extent, it also reduces the substrate processing efficiency of the lithography machine. Summary of the Invention

[0006] To address the aforementioned technical problems, the purpose of this application is to improve the cleaning effect on the lower surface of the substrate and increase the cleaning efficiency of the substrate.

[0007] To achieve the above objectives, this application provides a substrate cleaning apparatus, comprising: a carrier disk; a plurality of first clamping members arranged in a ring on the carrier disk for clamping the edges of a substrate; a plurality of second clamping members arranged in a ring on the carrier disk for clamping the edges of the substrate and driving the substrate to rotate; a first driving member, convexly connected to the second clamping members, for driving the second clamping members to move radially along the carrier disk; a second driving member, convexly connected to the second clamping members, for driving the second clamping members to rotate, thereby driving the substrate to rotate; and a cleaning brush for cleaning the substrate during rotation. During the process, the lower surface of the substrate is brushed; and a third driving member, which is connected to the carrier disk, is used to drive the carrier disk to rotate; wherein, in the brushing state, the first driving member is used to drive the second clamping member to move radially inward along the carrier disk to clamp the edge of the substrate, and the second driving member is used to drive the second clamping member to drive the substrate to rotate, and the cleaning brush brushes the lower surface of the substrate; in the spin-drying state, the third driving member is used to drive the carrier disk to rotate, and the first clamping member is used to clamp and drive the substrate to rotate to spin-dry the cleaning liquid on the substrate.

[0008] A substrate cleaning apparatus includes a cleaning brush, the cleaning brush comprising: a first swing arm; a support member vertically disposed on the first swing arm; and a cleaning brush body disposed on the first swing arm for brushing the lower surface of the substrate; wherein, in a transport mode, the cleaning brush body descends and / or the support member rises until the cleaning brush body is below the top of the support member, so that the support member supports the lower surface of the substrate; and in a brushing mode, the cleaning brush body rises and / or the support member descends until the cleaning brush body is above the top of the support member, so that the cleaning brush body brushes the lower surface of the substrate.

[0009] A coating and developing apparatus includes any of the above-described substrate cleaning devices for cleaning the lower surface of the substrate.

[0010] A substrate cleaning method, applicable to any of the substrate cleaning apparatuses described above, the substrate cleaning method comprising:

[0011] Step S710: Load the substrate onto the first clamping member;

[0012] In step S720, the first driving member drives the second clamping member to move radially inward along the carrier disk to lift and clamp the edge of the substrate, thereby separating the substrate from the first clamping member.

[0013] In step S730, the second driving member drives the second clamping member to rotate, thereby causing the substrate to rotate.

[0014] Step S740: The cleaning brush washes the lower surface of the substrate;

[0015] In step S750, the second driving member stops rotating;

[0016] In step S760, the first driving member drives the second clamping member to move radially outward along the carrier disk to lower the substrate and transfer it to the first clamping member;

[0017] In step S770, the third driving member drives the carrier disk to rotate, and the first clamping member clamps the edge of the substrate and drives the substrate to rotate, so as to spin-dry the substrate.

[0018] In step S780, the carrier disk stops rotating, the first clamping member releases its grip on the substrate, and the substrate is unloaded.

[0019] Compared with existing technologies, this application uses a second clamping member to hold and rotate the substrate, allowing the cleaning brush to clean the entire lower surface of the substrate. This avoids the need for two separate cleaning processes on the lower surface of the substrate, one for the central portion and one for the periphery, which reduces cleaning efficiency and increases the risk of secondary contamination to the central portion of the substrate's back side. Furthermore, after cleaning the lower surface of the substrate, this application uses a third driving member to rotate the support plate, causing the first clamping member to hold the edge of the substrate and rotate it to remove cleaning fluid. This improves the cleaning effect on the lower surface of the substrate and increases cleaning efficiency.

[0020] Overview of the attached figures

[0021] The preferred embodiments will now be described in a clear and easy-to-understand manner, in conjunction with the accompanying drawings, to further explain the above-mentioned characteristics, technical features, advantages, and implementation methods of this application.

[0022] Figure 1 is a schematic diagram of a substrate cleaning apparatus according to an embodiment of this application during substrate loading;

[0023] Figure 2 is a cross-sectional view of Figure 1 along direction a;

[0024] Figure 3 is a schematic diagram of the substrate cleaning apparatus of the embodiment shown in Figure 1 in the brushing state;

[0025] Figure 4 is a cross-sectional view of Figure 3 along direction b;

[0026] Figure 5 is a schematic diagram of the substrate cleaning apparatus of the embodiment shown in Figure 1 in the spin-drying state;

[0027] Figure 6 is a cross-sectional view of Figure 5 along direction c;

[0028] Figure 7 is a flowchart of a substrate cleaning method according to an embodiment of this application;

[0029] Figure 8 is a schematic diagram of a cleaning brush according to an embodiment of this application in transport mode;

[0030] Figure 9 is a schematic diagram of the cleaning brush in the brushing mode of the embodiment shown in Figure 8;

[0031] Figure 10 is a schematic diagram of the cleaning brush of another embodiment of this application in the transport mode;

[0032] Figure 11 is a schematic diagram of the cleaning brush in the brushing mode of the embodiment shown in Figure 10; and

[0033] Figure 12 is a schematic diagram of a coating and developing apparatus according to an embodiment of this application.

[0034] Preferred embodiments of this application

[0035] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the specific implementation methods of this application will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without creative effort.

[0036] To keep the drawings concise, each drawing only schematically shows the parts relevant to this application, and they do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of the components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one."

[0037] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0038] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0039] As shown in Figures 1 and 2, a substrate cleaning apparatus 10 according to an embodiment of this application is disclosed. The substrate cleaning apparatus 10 includes: a carrier plate 11, a plurality of first clamping members 12, a plurality of second clamping members 13, a first driving member 14, a second driving member 15, a cleaning brush 16, and a third driving member 17.

[0040] In this configuration, several first clamping members 12 are arranged in a ring on the support disk 11 to clamp the edge of the substrate 20. Several second clamping members 13 are arranged in a ring on the support disk 11, and can move and rotate radially along the support disk 11 to clamp the edge of the substrate 20 and drive the substrate 20 to rotate. A first driving member 14 is drivenly connected to the second clamping members 13 and drives the second clamping members 13 to move radially along the support disk 11. A second driving member 15 is drivenly connected to the second clamping members 13 and drives the second clamping members 13 to rotate, thereby driving the substrate 20 to rotate. As shown in Figure 4, a cleaning brush 16 is used to brush the lower surface of the substrate 20 during the rotation of the substrate 20. As shown in Figure 6, a third driving member 17 is drivenly connected to the support disk 11 and drives the support disk 11 to rotate. In the brushing state, the first driving member 14 drives the second clamping member 13 to move radially inward along the support plate 11 to clamp the edge of the substrate 20, the second driving member 15 drives the second clamping member 13 to rotate the substrate 20, and the cleaning brush 16 brushes the lower surface of the substrate 20; in the spin-drying state, the third driving member 17 drives the support plate 11 to rotate, and the first clamping member 12 clamps and drives the substrate 20 to rotate to spin-dry the cleaning liquid on the substrate 20.

[0041] In the above embodiment, the second clamping member 13 clamps and drives the substrate 20 to rotate, allowing the cleaning brush 16 to perform overall cleaning of the lower surface of the substrate 20. This avoids the need for two cleaning operations on the lower surface of the substrate 20, one on the center and one on the periphery, which affects the cleaning efficiency of the substrate 20 and increases the risk of secondary contamination to the central part of the back side of the substrate 20, as is done in the prior art. Furthermore, after the lower surface of the substrate 20 is cleaned, the third driving member 17 drives the carrier disk 11 to rotate, causing the first clamping member 12 to clamp the edge of the substrate 20 and rotate it to remove the cleaning liquid from the substrate 20. This improves the cleaning effect of the lower surface of the substrate 20 and increases its cleaning efficiency. For a lithography machine, before being fed into the lithography machine, the substrate 20 needs to undergo coating treatment in the coating and developing unit 10 of the coating and developing equipment 30 (refer to Figure 12), and then its lower surface needs to be cleaned in the substrate cleaning device 10 of the coating and developing equipment 30 before being fed into the lithography machine. If the cleanliness of the lower surface of the substrate 20 meets the requirements of the photolithography process after being cleaned by the substrate cleaning device 10, the photolithography machine will not need to perform a second cleaning on the substrate 20 after the substrate 20 is sent into the photolithography machine, and the focusing speed during exposure is improved, thereby increasing the substrate processing efficiency of the photolithography machine.

[0042] In one embodiment of this application, the first clamping member 12 is configured to hold the substrate 20 at a first vertical height h1. The second clamping member 13 is configured to, during radial inward movement along the support disk 11, drive the substrate 20 from the first vertical height h1 to a second vertical height h2, so that the substrate 20 is separated from the first clamping member 12, and the second clamping member 13 holds the substrate 20 at the second vertical height h2.

[0043] In one embodiment of this application, the first clamping member 12 includes a support portion 121, a fixing portion 123, and a swing portion 122. As shown in FIG2, the support portion 121 is disposed on the edge of the support plate 11 for supporting the substrate 20 and holding the substrate 20 at a first vertical height h1. The fixing portion 123 is disposed on the edge of the support plate 11, located on the side of the support portion 121 away from the center of the support plate 11. As shown in Figure 6, the swinging part 122 is rotatably mounted on the fixed part 123. The swinging part 122 includes a clamping end 1221 and a counterweight end 1222. The clamping end 1221 is located on the side near the center of the support plate 11. The swinging part 122 is configured such that when the rotation speed of the support plate 11 is higher than the preset speed, the counterweight end 1222 drives the swinging part 122 to rotate as a whole under the action of centrifugal force, so that the clamping end 1221 and the support part 121 jointly clamp the substrate 20. When the rotation speed of the support plate 11 is lower than the preset speed, the counterweight end 1222 drives the swinging part 122 to rotate as a whole under the action of its own gravity, so that the clamping end 1221 moves away from the substrate 20.

[0044] In the above embodiment, during the spin-drying state, the first clamping member 12 uses the centrifugal force generated by the rotation of the support plate 11 to clamp the substrate 20 with the swinging part 122 and drive the substrate 20 to rotate. After the substrate 20 is spin-dried, it returns to its original position using its own gravity. This allows the first clamping member 12 to perform the actions of clamping and releasing the substrate 20 even without a separate driving member, thereby reducing the structural complexity of the substrate cleaning device 10.

[0045] In one embodiment of this application, referring again to FIG2, the second clamping member 13 includes a sliding portion 131 and a limiting portion 132. The sliding portion 131 has a frustum structure that is larger at the bottom and smaller at the top. The sliding portion 131 is configured to provide a vertically upward component force to the edge of the substrate 20 when the second clamping member 13 slides radially inward along the support plate 11, so as to raise the substrate 20. As shown in FIG4, the limiting portion 132 is located at the top of the sliding portion 131 and has an annular groove 1321 adapted to the edge of the substrate 20. The limiting portion 132 is configured to hold the substrate 20 at a second vertical height h2 when the substrate 20 rises into the groove 1321, and to drive the substrate 20 to rotate during the rotation of the second clamping member 13.

[0046] In one embodiment of this application, the first driving component 14 includes a cylinder 141, and the second driving component 15 includes a pneumatic motor 151. The substrate cleaning apparatus 10 also includes a pneumatic pipeline 18, which is connected to both the cylinder 141 and the pneumatic motor 151 for driving their operation. The driving air pressure of the cylinder 141 is lower than that of the pneumatic motor 151. In this embodiment, the cylinder 141 and the pneumatic motor 151 are connected and supplied with air pressure by the same pneumatic pipeline 18. The start-stop sequence of the cylinder 141 and the pneumatic motor 151 can be controlled by controlling the air pressure in the pneumatic pipeline 18. Compared to the solution of setting multiple pneumatic lines to drive the cylinder 141 and the pneumatic motor 151 to start and stop respectively, setting multiple pneumatic lines requires machining multiple airflow channels 112 inside the drive shaft 111 of the support plate 11. This embodiment only requires machining one airflow channel 112 inside the drive shaft 111 of the support plate 11. The airflow channel 112 is used to set the pneumatic line 18 or as part of the pneumatic line 18, thus reducing the machining difficulty of the pneumatic line 18.

[0047] In the above embodiment, during the process of the substrate cleaning device 10 clamping and cleaning the substrate 20, the air pressure in the pneumatic pipeline 18 gradually increases. When the air pressure in the pneumatic pipeline 18 reaches the driving air pressure of the cylinder 141, as shown in Figures 1 and 2, the cylinder 141 drives the second clamping member 13 to move radially inward along the support plate 11 until the second clamping member 13 clamps and lifts the substrate 20 to the second vertical height h2, at which point the second clamping member 13 stops moving, and the cylinder 141 reaches its maximum stroke. When the air pressure in the pneumatic pipeline 18 continues to rise to the driving air pressure of the pneumatic motor 151, as shown in Figures 3 and 4, the pneumatic motor 151 drives the second clamping member 13 to rotate, causing the substrate 20 to rotate. At this time, the cleaning brush 16 brushes the lower surface of the substrate 20. After the lower surface of substrate 20 is cleaned, the air pressure in the pneumatic pipeline 18 gradually decreases. When the air pressure in the pneumatic pipeline 18 is lower than the driving air pressure of the pneumatic motor 151 but higher than the driving air pressure of the cylinder 141, the pneumatic motor 151 stops rotating, and the substrate 20 stops rotating. As shown in Figures 5 and 6, when the air pressure in the pneumatic pipeline 18 continues to decrease to below the driving air pressure of the cylinder 141, the cylinder 141 drives the second clamping member 13 to move radially outward along the support plate 11 to release and lower the substrate 20 to the first vertical height h1, transferring the substrate 20 to be supported by the first clamping member 12. Then, the third driving member 17 drives the support plate 11 to rotate, so that the first clamping member 12 clamps and drives the substrate 20 to rotate, drying the cleaning liquid on the substrate 20.

[0048] In one embodiment of this application, the pneumatic pipeline 18 includes a main pipeline 181 and several branch pipelines 182. The first end of the main pipeline 181 is connected to a pneumatic source 183, and the second end of the main pipeline 181 is connected to each of the branch pipelines 182. The ends of the branch pipelines 182 furthest from the main pipeline 181 are connected to different cylinders 141 and pneumatic motors 151. Furthermore, the pneumatic pipeline 18 also includes a one-way valve 184, which is disposed on the branch pipelines 182 connecting the main pipeline 181 and the pneumatic motor 151. The opening pressure of the one-way valve 184 is greater than the driving pressure of the cylinder 141, so that the driving pressure of the cylinder 141 is less than the driving pressure of the pneumatic motor 151.

[0049] As shown in Figure 7, a substrate cleaning method according to an embodiment of this application is disclosed, applicable to the substrate cleaning apparatus 10 in any of the above embodiments. The substrate cleaning method includes:

[0050] Step S710: Load the substrate 20 into the first clamping member 12;

[0051] In step S720, the first driving member 14 drives the second clamping member 13 to move radially inward along the support plate 11 to lift and clamp the edge of the substrate 20, thereby separating the substrate 20 from the first clamping member 12. The second clamping member 13 stops moving when it lifts the substrate 20 into the slot 1321 and clamps it there, i.e., when it rises to the second vertical height h2.

[0052] In step S730, the second driving member 15 drives the second clamping member 13 to rotate, thereby causing the substrate 20 to rotate.

[0053] Step S740: Cleaning brush 16 cleans the lower surface of substrate 20;

[0054] In step S750, the second drive component 15 stops rotating;

[0055] In step S760, the first driving member 14 drives the second clamping member 13 to move radially outward along the carrier disk 11 to lower the substrate 20 and transfer it to the first clamping member 12.

[0056] In step S770, the third driving member 17 drives the carrier disk 11 to rotate, so that the first clamping member 12 clamps the edge of the substrate 20 and drives the substrate 20 to rotate, so as to dry the substrate 20.

[0057] In step S780, the carrier disk 11 stops rotating, the first clamping member 12 releases its clamp on the substrate 20, and the substrate 20 is unloaded.

[0058] As shown in Figures 8 and 9, a substrate cleaning apparatus 10 according to an embodiment of this application is disclosed, including a cleaning brush 16 in any of the above embodiments. The cleaning brush 16 further includes: a first swing arm 161, a support member 162, and a cleaning brush body 163.

[0059] The support member 162 is vertically disposed on the first swing arm 161. The cleaning brush body 163 is disposed on the first swing arm 161 and is used to brush the lower surface of the substrate 20. In the transport mode, the cleaning brush body 163 is lowered and / or the support member 162 is raised until the cleaning brush body 163 is lower than the top of the support member 162, so that the support member 162 supports the lower surface of the substrate 20; in the brushing mode, the cleaning brush body 163 is raised and / or the support member 162 is lowered until the cleaning brush body 163 is higher than the top of the support member 162, so that the cleaning brush body 163 brushes the lower surface of the substrate 20. In some embodiments, the support member 162 includes a plurality of top rods or a cylindrical support member, and the cleaning brush body 163 is located at the center of the cylindrical support member.

[0060] It should be noted that in the previous embodiment, since the first clamping member 12 and the second clamping member 13 are arranged in a ring around the outer periphery of the substrate 20, they require a large internal space in the substrate cleaning device 10. Furthermore, due to the size limitations of the substrate cleaning device 10 itself, it cannot provide sufficient internal space for the robotic arm to pick up and place the substrate 20. Therefore, how to achieve the picking and placing of the substrate 20 within the relatively small internal space of the substrate cleaning device 10 is one of the problems solved in this embodiment. This embodiment achieves this by integrating the support member 162 with the cleaning brush body 163, so that the cleaning brush 16 has the dual function of brushing the substrate 20 and picking up and placing the substrate 20, thereby allowing the cleaning brush 16 to replace the robotic arm in picking up and placing the substrate 20 from the substrate cleaning device 10.

[0061] In one embodiment of this application, the first swing arm 161 includes: a housing 1611, a fixing plate 1612, a fourth drive member 1613, and a fifth drive member 1614.

[0062] The fixed plate 1612 is vertically and flexibly disposed inside the housing 1611, and is used to mount the cleaning brush body 163. The fourth driving member 1613 is disposed on the fixed plate 1612 and is connected to the cleaning brush body 163 via a first transmission belt 1617, and is used to drive the cleaning brush body 163 to rotate. The fifth driving member 1614 is disposed inside the housing 1611 and is connected to the fixed plate 1612, and is used to drive the fixed plate 1612, the cleaning brush body 163, and the fourth driving member 1613 to move up and down. In some embodiments, the fourth driving member 1613 is a rotary motor or a pneumatic motor, and the fifth driving member 1614 is a linear motor or a cylinder.

[0063] In one embodiment of this application, the first swing arm 161 further includes a linear guide rail 1616, which is vertically disposed at the inner bottom of the housing 1611 and connected to the first end of the fixing plate 1612. The linear guide rail 1616 is used to maintain the stability of the fixing plate 1612 during lifting. Furthermore, in the embodiment shown in Figures 8 and 9, the first end of the fixing plate 1612 is vertically and flexibly fixed to the inner bottom of the housing 1611 via the linear guide rail 1616, and the second end of the fixing plate 1612 is provided with a cleaning brush body 163. A fourth driving member 1613 is disposed in the middle of the fixing plate 1612 and is drive-connected to the cleaning brush body 163 via a first transmission belt 1617, which is located below the fixing plate 1612. A fifth driving member 1614 is drive-connected to the first end of the fixing plate 1612. In the embodiment shown in Figures 10 and 11, the linear guide rail 1616 and the fifth driving member 1614 are disposed in the middle of the fixed plate 1612, the fourth driving member 1613 is disposed at the first end of the fixed plate 1612, the cleaning brush body 163 is disposed at the second end of the fixed plate 1612, the fourth driving member 1613 is connected to the cleaning brush body 163 through the first transmission belt 1617, and the first transmission belt 1617 is located above the fixed plate 1612.

[0064] In one embodiment of this application, the first swing arm 161 further includes a pressure sensor 1615 for detecting the pressure of the cleaning brush body 163 on the lower surface of the substrate 20. For example, the pressure sensor 1615 is disposed at the connection between the fifth drive member 1614 and the fixing plate 1612.

[0065] In one embodiment of this application, the cleaning brush 16 further includes a second swing arm 164 and a lifting module 165. The first end of the second swing arm 164 is vertically and vertically mounted on the lifting module 165, which drives the second swing arm 164 to move up and down. The second end of the second swing arm 164 is hingedly connected to the first swing arm 161. The second swing arm 164 is provided with a sixth driving member 1641, which is connected to the first swing arm 161 via a second transmission belt 1642 to drive the first swing arm 161 to rotate.

[0066] As shown in Figure 12, this application also discloses a coating and developing apparatus 30, including a front-end module 31, a process station 32, and an interface station 33 connected in sequence. The front-end module 31 is used to load the substrate 20 to be processed and output the processed substrate 20. The process station 32 is used to perform coating, developing, heat treatment, and cleaning processes on the substrate 20. The interface station 33 is used to interface with a lithography machine. The process station 32 includes a coating unit 100, a developing unit 200, a heat treatment unit 300, and a substrate cleaning device 10 as described in any of the above embodiments. The coating unit 100 is used to coat the substrate 20, the developing unit 200 is used to develop the substrate 20, the heat treatment unit 300 is used to heat treat the substrate 20, and the substrate cleaning device 10 is used to clean the coated substrate 20.

[0067] It should be noted that the above embodiments can be freely combined as needed. The above are merely preferred embodiments of this application. For those skilled in the art, several improvements and modifications can be made without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A substrate cleaning apparatus, characterized in that, include: Carrier plate; Several first clamping members are arranged in a ring on the carrier disk to clamp the edge of the substrate; Several second clamping members are arranged in a ring on the support plate to clamp the edge of the substrate and drive the substrate to rotate. The first driving member is connected to the second clamping member in a transmission manner, and is used to drive the second clamping member to move radially along the support plate; The second driving member is connected to the second clamping member for driving the second clamping member to rotate, thereby causing the substrate to rotate. A cleaning brush is used to scrub the lower surface of the substrate during its rotation. as well as The third driving component is connected to the carrier disk in a transmission manner, and is used to drive the carrier disk to rotate; wherein... In the brushing state, the first driving member is used to drive the second clamping member to move radially inward along the support plate to clamp the edge of the substrate, and the second driving member is used to drive the second clamping member to rotate the substrate, and the cleaning brush brushes the lower surface of the substrate. In the spin-drying state, the third driving member is used to drive the carrier disk to rotate, and the first clamping member is used to clamp and drive the substrate to rotate, so as to spin-dry the cleaning liquid on the substrate.

2. The substrate cleaning apparatus according to claim 1, characterized in that, The first clamping member is configured to hold the substrate at a first vertical height; The second clamping member is configured to move the substrate from the first vertical height to the second vertical height during radial inward movement along the support disk, so as to separate the substrate from the first clamping member, and the second clamping member holds the substrate at the second vertical height.

3. The substrate cleaning apparatus according to claim 2, characterized in that, The first clamping member includes: A support portion is disposed at the edge of the carrier plate for supporting the substrate and holding the substrate at the first vertical height; A fixing part is provided at the edge of the bearing plate; The swinging part is rotatably mounted on the fixed part. The swinging part includes a clamping end and a counterweight end. The clamping end is located on the side near the center of the support plate. The swinging part is configured such that when the rotation speed of the support plate is higher than a preset speed, the counterweight end drives the swinging part to rotate as a whole under the action of centrifugal force, so that the clamping end and the support part jointly clamp the substrate. When the rotation speed of the support plate is lower than the preset speed, the counterweight end drives the swinging part to rotate as a whole under the action of its own gravity, so that the clamping end moves away from the substrate.

4. The substrate cleaning apparatus according to claim 2, characterized in that, The second clamping member includes: The sliding part has a frustum structure that is larger at the bottom and smaller at the top. The sliding part is configured to provide a vertically upward component force to the edge of the substrate when the second clamping member slides inward along the radial direction of the bearing disk, so as to make the substrate rise. The limiting part, located at the top of the sliding part, has an annular groove that matches the edge of the substrate. The limiting part is configured to hold the substrate at the second vertical height when the substrate rises into the groove, and to drive the substrate to rotate during the rotation of the second clamping member.

5. The substrate cleaning apparatus according to claim 1, characterized in that, The first driving component includes a cylinder; The second driving component includes a pneumatic motor; The substrate cleaning device further includes a pneumatic pipeline, which is connected to the cylinder and the pneumatic motor respectively, for driving the cylinder and the pneumatic motor to operate, and the driving air pressure of the cylinder is less than the driving air pressure of the pneumatic motor.

6. A substrate cleaning apparatus, characterized in that, Includes a cleaning brush, said cleaning brush comprising: First arm swing; The support member is vertically mounted on the first swing arm; A cleaning brush body is disposed on the first swing arm and is used to clean the lower surface of the substrate; wherein, In transport mode, the cleaning brush body descends and / or the support rises until the cleaning brush body is below the top of the support, so that the support supports the lower surface of the substrate; In the brushing mode, the cleaning brush body rises and / or the support descends until the cleaning brush body is above the top of the support, so that the cleaning brush body brushes the lower surface of the substrate.

7. The substrate cleaning apparatus according to claim 6, characterized in that, The first swing arm includes: case; A fixing plate, which can be raised and lowered, is installed inside the housing and is used to mount the cleaning brush body; The fourth driving component is disposed on the fixed plate and is used to drive the main body of the cleaning brush to rotate. The fifth driving component is disposed in the housing and is connected to the fixed plate for driving the fixed plate, the cleaning brush body and the fourth driving component to rise and fall.

8. The substrate cleaning apparatus according to claim 7, characterized in that, The first swing arm also includes: A pressure sensor is used to detect the pressure exerted by the cleaning brush body on the lower surface of the substrate.

9. A coating and developing apparatus, characterized in that, include: The substrate cleaning apparatus according to any one of claims 1-8 is used to clean the lower surface of the substrate.

10. A substrate cleaning method, characterized in that, The substrate cleaning apparatus according to any one of claims 1-5, the substrate cleaning method comprising: Step S710: Load the substrate onto the first clamping member; In step S720, the first driving member drives the second clamping member to move radially inward along the carrier disk to lift and clamp the edge of the substrate, thereby separating the substrate from the first clamping member. In step S730, the second driving member drives the second clamping member to rotate, thereby causing the substrate to rotate. Step S740: The cleaning brush washes the lower surface of the substrate; In step S750, the second driving member stops rotating; In step S760, the first driving member drives the second clamping member to move radially outward along the carrier disk to lower the substrate and transfer it to the first clamping member; Step S770: The third driving member drives the carrier disk to rotate, and the first clamping member clamps the edge of the substrate and drives the substrate to rotate, so as to spin-dry the substrate; and In step S780, the carrier disk stops rotating, the first clamping member releases its grip on the substrate, and the substrate is unloaded.

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