Substrate electroplating device
Patent Information
- Application Number
- PCT/CN2026/080035
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-27
- Filing Date
- 2026-02-26
- Publication Date
- 2026-10-01
Smart Images
Figure CN2026080035_01102026_PF_FP_ABST
Abstract
Description
Substrate electroplating equipment Technical Field
[0001] This application relates to the field of semiconductor manufacturing equipment, and in particular to a substrate electroplating apparatus. Background Technology
[0002] In the substrate electroplating process, a cup-shaped chuck is used to hold the substrate. The cup-shaped chuck is typically equipped with a contact ring and a seal. The contact ring conducts electricity to the substrate during electroplating. The seal isolates the electroplating solution from the contact ring, preventing the contact ring from becoming contaminated with the solution. After electroplating, the substrate needs to be removed from the cup-shaped chuck. During this process, residual electroplating solution on the substrate flows along the edges of the substrate towards the contact ring and seal. This residual solution accumulates on the contact ring and seal, gradually affecting the normal operation of the electroplating process; therefore, the cup-shaped chuck needs to be cleaned promptly.
[0003] In existing solutions, the cup-shaped chuck is typically cleaned with a cleaning solution immediately after electroplating a certain number of substrates (e.g., 25 pieces). The remaining cleaning and electroplating solutions are then spun out of the chuck at high speed. However, in actual cleaning processes, prolonged cleaning and high-speed spin-drying are required, significantly impacting production efficiency. Furthermore, even after extended cleaning and high-speed spin-drying, the cleaning effect of the cup-shaped chuck is not guaranteed, and issues such as metal plating on the edges of the substrate front and the contact ring still occur. Therefore, improving the cleaning effect and efficiency of the cup-shaped chuck is a crucial issue. Summary of the Invention
[0004] In view of the shortcomings of the prior art described above, the purpose of this application is to provide a substrate electroplating apparatus to solve the technical problem of how to improve the cleaning effect and cleaning efficiency of the cup-shaped chuck of the substrate electroplating apparatus.
[0005] To achieve the above and other related objectives, one aspect of this application provides a substrate electroplating apparatus, comprising: an electroplating chamber for containing an electroplating solution; a substrate holding device for holding a substrate, the substrate holding device including a cup-shaped clamp and a driving assembly, the cup-shaped clamp including a contact ring and a support portion, the support portion for supporting the substrate when the substrate holding device holds the substrate; the contact ring being located above the support portion and including a plurality of conductive pins for conducting electricity to the substrate during electroplating, the plurality of conductive pins having a first gap between adjacent conductive pins; the driving assembly including a rotary drive for driving the cup-shaped clamp to rotate; and a nozzle assembly including a first nozzle configured to blow dry gas from above the conductive pins toward the conductive pins while the cup-shaped clamp rotates, and to allow a portion of the dry gas to enter below the conductive pins through the first gap to blow dry gas onto the upper surface of the support portion.
[0006] As described above, this application provides a substrate electroplating apparatus, which has at least the following beneficial effects: while rotating the cup-shaped chuck, dry gas is blown from above the conductive contact pin towards the conductive contact pin, and part of the dry gas enters below the conductive contact pin through the first gap to blow the upper surface of the support portion. This can peel off residues such as cleaning liquid and electroplating liquid from the conductive contact pin and the upper surface of the support portion, and throw them out from the first gap under the action of centrifugal force, thereby improving the cleaning effect and cleaning efficiency of the cup-shaped chuck.
[0007] Overview of the attached figures
[0008] Figure 1 is a schematic diagram of the structure of a substrate electroplating apparatus according to an exemplary embodiment of this application;
[0009] Figure 2 is a three-dimensional schematic diagram of the cup-shaped clamp in Figure 1;
[0010] Figure 3 is a partial sectional view of section AA in Figure 2;
[0011] Figure 4 is a magnified view of part B in Figure 3;
[0012] Figure 5 is a partial schematic diagram of the contact ring in Figure 2;
[0013] Figure 6 is a schematic diagram of the structure of a substrate electroplating apparatus according to another exemplary embodiment of this application;
[0014] Figure 7 is a schematic diagram of the structure of a substrate electroplating apparatus according to another exemplary embodiment of this application;
[0015] Figure 8 is a schematic diagram of the structure of a substrate electroplating apparatus according to another exemplary embodiment of this application; and
[0016] Figure 9 is a top view of the substrate electroplating apparatus in Figure 8.
[0017] Preferred embodiments of this application
[0018] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or adjusted based on different viewpoints and applications without departing from the spirit of this application.
[0019] It should be noted that the accompanying drawings are only schematic representations of the basic concept of this application. Although the drawings only show components related to this application and are not drawn according to the actual number, shape and size of the components, the shape, quantity and proportion of each component can be arbitrarily adjusted in actual implementation, and the layout of the components may also be more complex.
[0020] In the following description, when referring to the accompanying drawings, the same numbers in different drawings denote the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses consistent with some aspects of this application as detailed in the appended claims.
[0021] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.
[0022] In the description of this application, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to mechanical or electrical connections, or internal connections between two components. They can be direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.
[0023] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another.
[0024] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., which may be used to indicate the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0025] One aspect of this application provides a substrate electroplating apparatus. An exemplary electroplating apparatus is described in detail below with reference to Figures 1 to 5. Figure 1 is a structural schematic diagram of a substrate electroplating apparatus according to an exemplary embodiment of this application; Figure 2 is a perspective view of the cup-shaped chuck in Figure 1; Figure 3 is a partial cross-sectional view at section AA in Figure 2; Figure 4 is a partial enlarged view at point B in Figure 3; and Figure 5 is a partial schematic diagram of the contact ring in Figure 2.
[0026] Referring first to Figure 1, the substrate electroplating apparatus 10 includes an electroplating chamber 11, a substrate holding device, and a nozzle assembly 13. The electroplating chamber 11 is used to contain the electroplating solution, and the substrate holding device is used to hold the substrate. Exemplarily, as shown in Figure 1, the electroplating chamber 11 includes an inner cavity 111, an outer cavity 112, and a water-retaining ring 113. The inner cavity 111 and the water-retaining ring 113 are located inside the outer cavity 112, and the water-retaining ring 113 is located above the inner cavity 111. During electroplating, the substrate holding device holds the substrate and immerses the substrate in the electroplating solution in the inner cavity 111 for electroplating.
[0027] Referring to Figures 1 to 5, the substrate holding device includes a cup-shaped chuck 121 and a drive assembly 122. The cup-shaped chuck 121 has a through-hole receiving space 1210 at its center, which is used to hold a substrate (not shown). The cup-shaped chuck 121 includes a contact ring 1211 and a support portion 1212. The support portion 1212 is used to support the substrate when the substrate holding device holds the substrate. The contact ring 1211 is located above the support portion 1212 and includes a plurality of conductive pins 1211a, which are used to conduct electricity to the substrate during electroplating. A first gap 1211b is provided between adjacent conductive pins 1211a. The drive assembly 122 includes a rotation drive 1221 for driving the cup-shaped chuck 121 to rotate. The nozzle assembly 13 includes a first nozzle 131 configured to blow dry gas over the conductive contact pin 1211a from above while the cup-shaped chuck 121 rotates, and to allow a portion of the dry gas to enter below the conductive contact pin 121a through a first gap 1211b to blow dry gas over the upper surface 1212a of the support portion 1212. Optionally, the dry gas includes one or more of clean, dry air, nitrogen, and inert gases.
[0028] Referring to Figures 3 and 4, exemplarily, the support portion 1212 includes a support body 1213 and a seal 1214. The seal 1214 at least covers a portion of the support body 1213 for isolating the contact ring 1211 from the electroplating solution. Optionally, in some embodiments, the cup-shaped chuck 121 includes an inner pressure ring 121a, a middle frame 121b, and an outer pressure ring 121c. The inner pressure ring 121a is locked to the inner circumferential surface of the middle frame 121b, and the outer pressure ring 121c is locked to the outer circumferential surface of the middle frame 121b. The bottom of the middle frame 121b extends radially inward to form the support body 1213. As an example, the seal 1214 has an upper end portion 1214a and a sealing lip 1214b. The upper end portion 1214a covers at least a portion of the upper surface of the support body 1213, and the sealing lip 1214b is located at the radial end of the support body 1213. The thickness of the sealing lip 1214b is greater than that of other parts of the seal 1214. The substrate holding device typically also includes a clamping plate. During electroplating, when the substrate is loaded into the cup-shaped clamping plate 121, the clamping plate presses down on the back side of the substrate to tightly fit the substrate edge with the sealing lip 1214b, thereby sealing the substrate edge and back side.
[0029] It should be noted that in the examples shown in Figures 3 and 4, the upper end portion 1214a of the seal 1214 covers the entire area of the upper surface of the support body 1213. Therefore, the upper surface of the upper end portion 1214a is the upper surface 1212a of the support 1212. In other possible embodiments, the upper end portion 1214a covers a portion of the upper surface of the support body 1213, then the upper surface 1212a of the support 1212 includes the upper surface of the upper end portion 1214a and the uncovered upper surface of the support body 1213.
[0030] As a component that directly contacts the substrate, the cleanliness of the cup-shaped chuck 121 is crucial for the electroplating process. In existing solutions, the cup-shaped chuck is typically cleaned with a cleaning solution immediately after electroplating a certain number of substrates (e.g., 25), and then the residual cleaning and electroplating solutions are spun out by high-speed rotation. However, in actual cleaning processes, prolonged cleaning and high-speed spin-drying are required, significantly impacting production efficiency. Furthermore, even after extended cleaning and high-speed spin-drying, the cleaning effect of the cup-shaped chuck is difficult to guarantee in actual production, resulting in issues such as metal plating on the edges of the substrate front and the contact ring.
[0031] Referring to Figures 2 and 3, the inventors of this application have discovered that the contact ring 1211 and support portion 1212 of the cup-shaped chuck 121 are key factors affecting the cleaning efficiency and effect of the cup-shaped chuck 121. Since most areas of the cup-shaped chuck 121 (e.g., the inner circumferential surface of the inner pressure ring 121a, the outer circumferential surface of the outer pressure ring 121c, etc.) are not obstructed by other components, these areas can be easily cleaned with cleaning fluid even if contaminants are present. During the cleaning process, the cleaning fluid and some residual contaminants (e.g., electroplating solution) adhering to these areas are also easily ejected by rotation. However, regarding the contact ring 1211 and support portion 1212 of the cup-shaped chuck 121, the contact ring 1211 is located above the support portion 1212, and a second gap 1212b exists between the contact ring 1211 and the support portion 1212. Due to the obstruction of the conductive contact pin 1211a, various contaminants easily accumulate in the second gap 1212b and are difficult to clean. For example, during the cleaning process using a cleaning solution, the solution may contain plating solution from the contact ring 1211 and support portion 1212, as well as other potential contaminants, remaining in the second gap 1212b. If the residue in the second gap 1212b is to be further removed by rotation, the rotational speed of the cup-shaped chuck 121 needs to be increased, requiring more time. This not only places high demands on the performance of the substrate plating apparatus, making it difficult to guarantee the cleaning effect, but also reduces the cleaning efficiency of the cup-shaped chuck 121, thereby affecting the production efficiency of the substrate plating apparatus and reducing the hourly output (WPH) of the substrate plating apparatus.
[0032] The substrate electroplating apparatus 10 of this application embodiment, while rotating the cup-shaped chuck 121, blows dry gas from above the conductive contact pin 1211a toward the conductive contact pin 1211a, and causes part of the dry gas to enter through the first gap 1211b to blow the upper surface 1212a of the support portion 1212 below the conductive contact pin 1211a. This can peel off residues such as cleaning liquid and electroplating liquid from the conductive contact pin 1211a and the upper surface 1212a of the support portion 1212, and throw them out through the first gap 1211b under the action of centrifugal force, thereby quickly and effectively removing residues on the conductive contact pin 1211a and the support portion 1212, improving the cleaning effect and cleaning efficiency of the cup-shaped chuck 121.
[0033] Optionally, as shown in Figure 1, in some embodiments, as described above, the electroplating chamber 11 includes an inner cavity 111, an outer cavity 112, and a water-retaining ring 113. The inner cavity 111 and the water-retaining ring 113 are located inside the outer cavity 112, and the water-retaining ring 113 is located above the inner cavity 111. The first nozzle 131 is located above the water-retaining ring 113 and is set at a preset height on the outer cavity 112. When purging the cup-shaped chuck 121, the cup-shaped chuck 121 is located between the first nozzle 131 and the water-retaining ring 113. It should be understood that during the cleaning of the cup-shaped chuck 121, in order to avoid contamination and dilution of the electroplating solution in the inner cavity 111 of the electroplating chamber 11 by the cleaning solution, the cup-shaped chuck 121 is located above the water-retaining ring 113 when cleaning the cup-shaped chuck 121, and the water-retaining ring 113 is provided with a drain port 1131. After the cleaning fluid detaches from the cup-shaped chuck 121, it drains from the drain port 1131 of the water-retaining ring 113 into the outer cavity 112 of the electroplating chamber 11, and then exits from the outer cavity 112. Similarly, when purging the cup-shaped chuck 121, the cup-shaped chuck 121 is located between the first nozzle 131 and the water-retaining ring 113, allowing residual cleaning fluid and electroplating solution to drain from the drain port 1131 of the water-retaining ring 113, preventing them from falling into the inner cavity 111. Therefore, the preset height of the first nozzle 131 should take into account the position of the cup-shaped chuck 121 in the electroplating chamber 11 and the height of the cup-shaped chuck 121 during the purging process, to ensure that the first nozzle 131 can blow dry gas from above the conductive contact pin 1211a toward the conductive contact pin 1211a.
[0034] Optionally, in some embodiments, the dry gas blown by the first nozzle 131 forms a columnar airflow, and the area of the blowing region of the dry gas (i.e., the projected area of the dry gas on the object being blown) is smaller than the area of a single conductive pin 1211a. Referring to FIG4, the nozzle assembly 13 further includes a nozzle drive 130 for driving the first nozzle 131 to swing within a preset angle range when the first nozzle 131 blows the dry gas, so as to change the position of the blowing region of the dry gas on the upper surface 1212a of the conductive pin 1211a and the support 1212.
[0035] For example, as shown in FIG4, regions X and Y illustrate the purging area of the drying gas on the upper surface 1212a of the support 1212. After the first nozzle 131 swings upward by an angle α, the position of the purging area of the drying gas on the upper surface 1212a of the support 1212 changes from region X to region Y. In these embodiments, the drying gas forms a columnar airflow, reducing the purging area of the drying gas and concentrating the energy of the drying gas. This reduces gas dispersion and pressure attenuation during the transmission of the drying gas from the first nozzle 131 to the conductive contact pin 1211a, thereby improving the purging effect of the drying gas. Furthermore, while driving the cup-shaped chuck 121 to rotate, driving the first nozzle 131 to swing up and down within a preset angle range can change the position of the purging area of the drying gas on the conductive contact pin 1211a and the upper surface 1212a of the support 1212, allowing the drying gas to purge the entire area on the conductive contact pin 1211a and the upper surface 1212a of the support 1212. It should be noted that the preset angle range should ensure that the dry gas can effectively fall on the upper surface 1212a of the conductive contact pin 1211a and the support 1212 during the swing of the first nozzle 131.
[0036] Optionally, in some embodiments, the drive assembly 122 further includes a lifting drive 1222, used to drive the cup-shaped chuck 121 to rise and fall within a preset height range when the first nozzle 131 blows dry gas, thereby changing the position of the blowing area of the dry gas on the upper surface 1212a of the conductive contact pin 121a and the support portion 1212. It should be understood that driving the cup-shaped chuck 121 to rotate while simultaneously driving it to rise and fall within the preset height range can also change the position of the blowing area of the dry gas on the upper surface 1212a of the conductive contact pin 121a and the support portion 1212. It should be noted that the preset height range should be less than or equal to the height of the cup-shaped chuck 121 to ensure that the dry gas can effectively fall on the upper surface 1212a of the conductive contact pin 121a and the support portion 1212 during the rising and falling of the cup-shaped chuck 121. In these embodiments, the cup-shaped chuck 121 is driven to rise and fall directly by the lifting drive device of the substrate holding device itself, that is, the lifting drive device of the substrate holding device itself is used as the lifting drive component 1222, and no additional drive device is required.
[0037] Optionally, as shown in FIG1, in some embodiments, the first nozzle 131 is also used to spray cleaning fluid onto the cup-shaped chuck 121 while it rotates before purging the dry gas, so as to clean the cup-shaped chuck 121. For example, deionized water may be sprayed onto the inner and outer rings of the cup-shaped chuck 121 respectively to thoroughly clean the cup-shaped chuck 121.
[0038] Exemplarily, as shown in FIG1, the nozzle assembly 13 further includes an air supply line 132 and a liquid supply line 133, respectively connected to the same first nozzle 131. The air supply line 132 supplies drying gas to the first nozzle 131, and the liquid supply line 133 supplies cleaning fluid to the first nozzle 131. The air supply line 132 and the liquid supply line 133 are respectively provided with an air supply control valve 134 and a liquid supply control valve 135, respectively used to control the opening and closing of the air supply line 132 and the liquid supply line 133. Furthermore, although the nozzle assembly 13 has only one first nozzle 131 in the example shown in FIG1, this should not be construed as a limitation of this application. In other embodiments, the nozzle assembly 13 may also include multiple first nozzles 131.
[0039] Optionally, in some embodiments, the gas supply line 132 and the liquid supply line 133 may be connected to different nozzles. Referring to FIG6, FIG6 is a schematic structural diagram of a substrate electroplating apparatus of another exemplary embodiment. In these embodiments, the nozzle assembly 13 further includes a second nozzle 136, which is used to spray cleaning liquid onto the cup-shaped chuck 121 while the cup-shaped chuck 121 rotates, before the first nozzle 131 purges the drying gas, in order to clean the cup-shaped chuck 121. The liquid supply line 133 is connected to the second nozzle 136 and is used to supply cleaning liquid to the second nozzle 136, while the gas supply line 132 is connected to the first nozzle 131 and is used to supply drying gas to the first nozzle 131. Furthermore, in some embodiments, the nozzle assembly 13 may include a plurality of first nozzles 131 and / or a plurality of second nozzles 136.
[0040] Furthermore, in some embodiments, the rotary drive 1221 is also used to drive the cup-shaped chuck 121 to rotate after the spraying of cleaning fluid onto the cup-shaped chuck 121 stops and before the first nozzle 131 blows dry gas, in order to perform a spin-drying process on the cup-shaped chuck. In these embodiments, most of the cleaning fluid and electroplating solution adhering to the cup-shaped chuck 121 is removed by rotational spin-drying before the dry gas is blown onto the conductive contact pin 1211a. This is because if there is a large amount of liquid remaining on the cup-shaped chuck 121, directly blowing it with dry gas may cause the liquid to splash everywhere, for example, the liquid may splash into the inner cavity 111 or onto the outside of the electroplating chamber 11.
[0041] Referring now to Figure 7 and in conjunction with Figures 2 to 4, Figure 7 is a schematic structural diagram of a substrate electroplating apparatus according to another exemplary embodiment. Optionally, in some embodiments, the nozzle assembly 13 further includes a movable arm 137 and a movable drive member 138. One end of the movable arm 137 is connected to the first nozzle 131, and the other end of the movable arm 137 is connected to the movable drive member 138. The movable drive member 138 is disposed on the outer cavity 112 and is used to drive the movable arm 137 to move, thereby moving the first nozzle 131 between a working position and a standby position. The standby position is located outside the accommodating space 1210 of the cup-shaped chuck 121, and the working position is located inside the accommodating space 1210 of the cup-shaped chuck 121 when the cup-shaped chuck 121 is being purged.
[0042] To prevent the cup-shaped chuck 121 from obstructing the movement of the first nozzle 131 and the moving arm 137, the cup-shaped chuck 121 can be driven to rise above the working position before moving the first nozzle 131 and the moving arm 137. Then, the moving arm 137 can be driven to move along the extension direction of the first arm 1371, so that the first nozzle 131 can move between the working position and the standby position. Specifically, when the cup-shaped chuck 121 does not need to be purged, the first nozzle 131 is in the standby position (shown as a solid line in Figure 7) to avoid affecting the cup-shaped chuck 121's lifting, rotating, and other common electroplating processes. When the cup-shaped chuck 121 needs to be purged, after driving the cup-shaped chuck 121 to rise above the working position, the first nozzle 131 is moved to the working position (shown as a dashed line in Figure 7), and then the cup-shaped chuck 121 is driven to descend. At this time, the first nozzle 131 is located within the receiving space 1210 of the cup-shaped chuck 121 and aligned with the conductive contact pin 1211a of the cup-shaped chuck 121, so as to blow dry gas from above the conductive contact pin 1211a. Similarly, after the blowing ends, the cup-shaped chuck 121 is first driven to rise above the working position, and then the first nozzle 131 is moved to the standby position.
[0043] For example, in the embodiment shown in FIG7, the movable arm 137 includes a first arm 1371 and a second arm 1372. The first arm 1371 has a first end and a second end. The first end is connected to the movable drive member 138, and the second end is connected to the second arm 1372. The second arm 1372 extends upward from the second end, and a first nozzle 131 is disposed on the second arm 1372. The movable drive member 138 is used to drive the movable arm 137 to move along the extension direction of the first arm 1371, so as to move the first nozzle 131 between a working position and a standby position.
[0044] Optionally, in some embodiments, referring to Figures 8 and 9, Figure 8 is a structural schematic diagram of a substrate electroplating apparatus in another exemplary embodiment, and Figure 9 is a top view schematic diagram of the substrate electroplating apparatus in Figure 8. Compared with the embodiment shown in Figure 7, the movement forms of the moving arm 137 and the moving drive member 138 are different in the embodiments shown in Figures 8 and 9. Specifically, the moving arm 137 includes a swing arm, and the moving drive member 138 is disposed on the outer cavity 112 for driving the swing arm to rotate. Exemplarily, the moving drive member 138 drives the swing arm to rotate about a rotating shaft extending in the vertical direction, so as to move the first nozzle 131 between the working position (shown as solid lines in Figure 9) and the standby position (shown as dashed lines in Figure 9).
[0045] Referring to Figures 2 and 7 through 9, in the embodiments shown in Figures 7 through 9, when purging the dry gas, the first nozzle 131 is located within the receiving space 1210 of the cup-shaped chuck 121, close to and aligned with the conductive contact pin 1211a. Compared to the embodiment shown in Figure 1, this reduces the transmission distance of the dry gas between the first nozzle 131 and the conductive contact pin 1211a, thereby reducing the dispersion and pressure attenuation of the dry gas during transmission and improving the purging effect of the dry gas. Furthermore, since the first nozzle 131 is close to the conductive contact pin 1211a, in these embodiments, the dry gas can be configured to form a fan-shaped airflow, effectively expanding the purging area of the dry gas and improving purging efficiency. It should be noted that although the dry gas can be configured to form a fan-shaped airflow in the embodiments shown in Figures 7 through 9, this does not constitute a limitation on these embodiments. In these embodiments, the dry gas can also be configured to form a columnar airflow, and correspondingly, the position of the purging area of the dry gas can be changed by setting the nozzle drive 130 and / or the lifting drive 1222.
[0046] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.
Claims
1. A substrate electroplating apparatus, characterized in that, include: Electroplating chamber, used to hold electroplating solution; A substrate holding device for holding a substrate, the substrate holding device including a cup-shaped clamp and a driving assembly, the cup-shaped clamp including a contact ring and a support portion, the support portion for supporting the substrate when the substrate holding device holds the substrate; the contact ring located above the support portion including a plurality of conductive pins for conducting electricity to the substrate during electroplating, the plurality of conductive pins having a first gap between adjacent conductive pins; the driving assembly including a rotary drive for driving the cup-shaped clamp to rotate; The nozzle assembly, including a first nozzle, is configured to blow dry gas from above the conductive contact pin toward the conductive contact pin while the cup-shaped chuck rotates, and to allow a portion of the dry gas to enter below the conductive contact pin through the first gap to blow dry gas onto the upper surface of the support.
2. The substrate electroplating apparatus according to claim 1, characterized in that, The electroplating chamber includes an inner cavity, an outer cavity, and a water-blocking ring. The inner cavity and the water-blocking ring are located inside the outer cavity, and the water-blocking ring is located above the inner cavity. The first nozzle is located above the water-retaining ring and disposed on the outer cavity, wherein, when the cup-shaped clamp is purged, the cup-shaped clamp is located between the first nozzle and the water-retaining ring.
3. The substrate electroplating apparatus according to claim 1, characterized in that, The nozzle assembly further includes a movable arm and a movable drive. One end of the movable arm is connected to the first nozzle, and the other end of the movable arm is connected to the movable drive. The movable drive is used to drive the movable arm to move, thereby moving the first nozzle between a working position and a standby position. The standby position is located outside the accommodating space of the cup-shaped chuck, and the working position is located inside the accommodating space of the cup-shaped chuck when the cup-shaped chuck is being purged.
4. The substrate electroplating apparatus according to claim 3, characterized in that, The movable arm includes a first arm and a second arm. The first arm has a first end and a second end, the first end being connected to the moving drive member, and the second end being connected to the second arm; the second arm extends upward from the second end, and the first nozzle is disposed on the second arm; The moving drive is used to drive the moving arm to move along the extension direction of the first arm, so as to move the first nozzle between the working position and the standby position.
5. The substrate electroplating apparatus according to claim 3, characterized in that, The moving arm includes a swing arm, and the moving drive is used to drive the swing arm to rotate so as to move the first nozzle between a working position and a standby position.
6. The substrate electroplating apparatus according to claim 1, characterized in that, The nozzle assembly further includes a nozzle drive for driving the first nozzle to swing within a preset angle range when the first nozzle is blowing the dry gas, so as to change the position of the dry gas in the blowing area on the upper surface of the conductive contact pin and the support.
7. The substrate electroplating apparatus according to claim 1, characterized in that, The drive assembly further includes a lifting drive component, used to drive the cup-shaped chuck to rise and fall within a preset height range when the first nozzle blows the dry gas, so as to change the position of the dry gas in the blowing area on the upper surface of the conductive contact pin and the support.
8. The substrate electroplating apparatus according to claim 1, characterized in that, The first nozzle is also used to spray cleaning fluid onto the cup-shaped chuck before the first nozzle blows the dry gas, so as to clean the cup-shaped chuck.
9. The substrate electroplating apparatus according to claim 1, characterized in that, The nozzle assembly further includes a second nozzle, which is used to spray cleaning fluid onto the cup-shaped chuck before the first nozzle purges the drying gas, so as to clean the cup-shaped chuck.
10. The substrate electroplating apparatus according to claim 8 or 9, characterized in that, The rotary drive is also used to drive the cup-shaped chuck to rotate after the spraying of cleaning fluid onto the cup-shaped chuck stops and before the drying gas is blown out by the first nozzle, so as to perform a spin-drying process on the cup-shaped chuck.