Display panel and manufacturing method therefor, and display apparatus
Patent Information
- Application Number
- PCT/CN2026/080357
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-26
- Filing Date
- 2026-02-27
- Publication Date
- 2026-10-01
Smart Images
Figure CN2026080357_01102026_PF_FP_ABST
Abstract
Description
Display panel and its manufacturing method, display device
[0001] Cross-references
[0002] This disclosure claims priority to Chinese Patent Application No. 202510377361.6, filed on March 26, 2025, entitled “Display Panel and Method of Manufacturing Thereof, Display Device”, the entire contents of which are incorporated herein by reference. Technical Field
[0003] This invention relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing the same, and a display device. Background Technology
[0004] Organic light-emitting diodes (OLEDs) have advantages such as self-illumination, low power consumption, and the ability to achieve flexible displays, making them one of the mainstream display technologies currently available.
[0005] To protect the light-emitting layer from water and oxygen corrosion, an encapsulation layer is formed on the side of the light-emitting layer away from the substrate. However, during the encapsulation process, water and oxygen channels are formed between the first structural part and foreign objects and the light-emitting layer, which can easily cause the light-emitting layer to fail.
[0006] It should be noted that the information in the background section above is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention
[0007] The purpose of this invention is to overcome the shortcomings of the prior art and provide a display panel, a method for manufacturing the same, and a display device.
[0008] According to one aspect of the present invention, a display panel is provided, which may include a driving backplate, a light-emitting layer, a first structural portion, and a first encapsulation layer. The light-emitting layer is disposed on one side of the driving backplate. The first structural portion is disposed on the side of the light-emitting layer away from the driving backplate, and the side of the first structural portion near the driving backplate and the side of the light-emitting layer away from the driving backplate form a cavity. The first encapsulation layer is disposed on the side of the light-emitting layer away from the driving backplate, and the first encapsulation layer includes at least two sub-first encapsulation layers, which are stacked sequentially in a direction away from the driving backplate. Each sub-first encapsulation layer completely covers the first structural portion, and the multiple sub-first encapsulation layers fill the cavity.
[0009] In one embodiment of the present invention, a boundary layer is provided between two adjacent sub-first encapsulation layers, and the film density in the boundary layer is less than the film density in the sub-first encapsulation layer.
[0010] In one embodiment of the present invention, the silicon content in the boundary layer is less than the silicon content in the first encapsulation layer.
[0011] In one embodiment of the present invention, the display panel has an opening, and the first structural part is a partition unit arranged around the opening. The partition unit includes at least two partition layers. The distance between the orthographic projection of the partition layer away from the driving back plate on the driving back plate and the edge of the opening is a first distance, and the distance between the orthographic projection of the partition layer close to the driving back plate on the driving back plate and the edge of the opening is a second distance. The first distance is greater than the second distance.
[0012] In one embodiment of the present invention, the partition unit is a double-layer partition unit or a single-layer partition unit. The double-layer partition unit includes two partition structures stacked together, and the single-layer partition unit includes one partition structure.
[0013] In one embodiment of the present invention, the partition structure includes a first partition layer, a second partition layer and a third partition layer arranged sequentially along a direction away from the drive back plate, wherein the width of the second partition layer is smaller than the width of the first partition layer and the third partition layer on the adjacent sides.
[0014] In one embodiment of the present invention, when the partition unit is a double-layer partition unit, the two partition structures are a first partition structure and a second partition structure arranged sequentially along the direction away from the drive back plate, respectively. The third partition layer of the first partition structure is reused as the first partition layer of the second partition structure, or the third partition layer of the first partition structure and the first partition layer of the second partition structure are stacked together.
[0015] In one embodiment of the present invention, the cross-sectional shape of the second partition layer of the partition structure along the width direction of the partition unit is a regular trapezoid.
[0016] In one embodiment of the present invention, the width of the third partition layer of the partition structure is smaller than the width of the first partition layer.
[0017] In one embodiment of the present invention, the width of the first blocking part corresponding to the double-layer partition unit is greater than the width of the first blocking part corresponding to the single-layer partition unit.
[0018] In one embodiment of the present invention, the display panel further includes a driving circuit layer disposed on one side of the driving back panel. The driving circuit layer includes a first source / drain metal layer and a second source / drain metal layer. When the partition unit is a single-layer partition unit, the partition structure is disposed in the same layer and with the same material as the first source / drain metal layer or the second source / drain metal layer. When the partition unit is a double-layer partition unit, the partition structure is disposed in the same layer and with the same material as the first source / drain metal layer and the second source / drain metal layer.
[0019] In one embodiment of the present invention, the number of partition units is at least two, and the at least two partition units are arranged at intervals along the direction away from the hole.
[0020] In one embodiment of the present invention, the light-emitting layer includes a light-emitting material layer and a common electrode. The light-emitting material layer is disposed on one side of the driving back plate, and the common electrode is disposed on the side of the light-emitting material layer away from the driving back plate. The common electrode is separated by a partition unit to form a plurality of common electrode portions. The common electrode portions include a first common electrode portion and a second common electrode portion. The first common electrode portion is disposed on the side of the partition unit away from the driving back plate, and the second common electrode portion is disposed between two adjacent partition units.
[0021] In one embodiment of the present invention, the material of the first structural part is different from the material of the first encapsulation layer.
[0022] In one embodiment of the present invention, the first structural portion has a first surface away from the drive backplate, a second surface close to the drive backplate, and a third surface connected between the first surface and the second surface, and a sub-first encapsulation layer covers the first surface, the second surface and the third surface.
[0023] According to another aspect of this application, a method for manufacturing a display panel according to any one aspect of the present invention is provided, the method comprising:
[0024] A light-emitting layer is formed on one side of the drive backplate, and a first structural part is formed on the side of the light-emitting layer away from the drive backplate.
[0025] A film-forming gas is introduced to replace the waste gas in the cavity formed between the first structural part and the light-emitting layer;
[0026] The film-forming gas is introduced again to control the generation of a sub-first encapsulation layer covering the first structural part;
[0027] The process involves repeatedly forming multiple sub-first encapsulation layers that cover the first structural part until the multiple sub-first encapsulation layers fill the cavity.
[0028] In one embodiment of the present invention, the film-forming gas includes SiH4, N2O, NH3, H2 and N2.
[0029] According to another aspect of this application, a display device is provided, comprising a display panel provided in any one aspect of the present invention.
[0030] The display panel of the present invention includes a first encapsulation layer, which includes at least two sub-first encapsulation layers. Since the waste gas generated by forming a sub-first encapsulation layer is relatively small, sufficient film-forming gas can be introduced before each sub-first encapsulation layer is formed to replace the waste gas in the cavity between the first structural part and the light-emitting layer, forming a new film-forming environment and increasing the film-forming rate in the cavity. This results in a shorter film-forming time for each sub-first encapsulation layer, and it is not affected by the waste gas generated by the formation of the sub-first encapsulation layer itself. Therefore, each sub-first encapsulation layer completely encapsulates the first structural part, and finally, multiple sub-first encapsulation layers fill the cavity, which can avoid the formation of water-oxygen channels and eliminate the risk of light-emitting layer failure.
[0031] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit the invention. Attached Figure Description
[0032] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention. It is obvious that the drawings described below are merely some embodiments of the invention, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.
[0033] Figure 1 is a cross-sectional schematic diagram of the display panel involved in the embodiment of the present invention when the partition unit is a single-layer partition unit.
[0034] Figure 2 is a plan view of the display panel according to an embodiment of the present invention.
[0035] Figure 3 is a plan view of the opening and transition area of the display panel according to the embodiment of the invention.
[0036] Figure 4 is a schematic diagram of the structure of the partition unit in the embodiment of the present invention when it is disposed on the light-emitting layer.
[0037] Figure 5 is a schematic diagram of the structure when the foreign object is disposed on the light-emitting layer according to an embodiment of the present invention.
[0038] Figure 6 is a schematic diagram of the water-oxygen channel formed between the partition unit and the light-emitting layer in an embodiment of the present invention.
[0039] Figure 7 is a schematic diagram of the water-oxygen channel formed between the foreign object and the light-emitting layer in an embodiment of the present invention.
[0040] Figure 8 is a cross-sectional schematic diagram of the display panel involved in the embodiment of the present invention when some partition units are single-layer partition units.
[0041] Figure 9 is a schematic diagram of the structure when the first encapsulation layer of the multilayer sub-encapsulation layer fills the cavity formed between the partition unit and the light-emitting layer.
[0042] Figure 10 is a schematic diagram of the structure when the partition unit is a single-layer partition unit and the multi-layer sub-first encapsulation layer fills the cavity formed between the partition unit and the light-emitting layer.
[0043] Figure 11 is a schematic diagram of the structure when the partition unit is a double-layer partition unit, and the multi-layer sub-first encapsulation layer fills the cavity formed between the partition unit and the light-emitting layer.
[0044] Figure 12 is a schematic diagram of the structure when the first encapsulation layer of the multilayer is filled with the cavity formed between the foreign object and the light-emitting layer.
[0045] Figure 13 is a schematic diagram of the structure when the film-forming gas replaces the waste gas in the cavity formed between the first structural part and the light-emitting layer.
[0046] Figure 14 is a schematic diagram of the structure when controlling the generation of the first sub-encapsulation layer covering the first structural part.
[0047] Figure 15 is a schematic diagram of the structure when the film-forming gas replaces the waste gas in the cavity formed between the first sub-encapsulation layer and the light-emitting layer.
[0048] Figure 16 is a schematic diagram of the structure when controlling the generation of the second sub-first encapsulation layer that covers the first sub-first encapsulation layer.
[0049] Figure 17 is a schematic diagram of the structure when the film-forming gas replaces the waste gas in the cavity formed between the second sub-first encapsulation layer and the light-emitting layer.
[0050] Figure 18 is a schematic diagram of the structure when controlling the generation of the third sub-first encapsulation layer that covers the second sub-first encapsulation layer.
[0051] In the diagram: 100-Display area; 200-Transition area; 2001-First sub-transition area; 300-Opening; 11-Substrate; 12-Buffer layer; 13-Drive circuit layer; 131-Active layer; 1321-First gate insulating layer; 1322-Second gate insulating layer; 1331-First gate; 1332-Second gate; 134-Interlayer dielectric layer; 135-First source; 136-Drain; 137-Protective layer; 138-Second source; 14-Planing layer group; 141-First planarization layer; 142-Second planarization layer; 15-Pixel boundary layer; 151-Pixel opening; 16-Light emitting layer; 161-Pixel electrode; 162-Light emitting material layer; 163-Common electrode; 17-Encapsulation layer, 171-First encapsulation layer, 1711-Sub-first encapsulation layer, 1712-Boundary layer, 172-Second encapsulation layer, 173-Third encapsulation layer; 18-Barrier dam; 181-First insulating layer, 182-Second insulating layer, 183-Third insulating layer; 19-Isolation unit, 190-Isolation layer, 191-First isolation structure, 192-Second isolation structure, 193-First isolation layer, 194-Second isolation layer, 195-Third isolation layer; 20-Common electrode section, 201-First common electrode section, 202-Second common electrode section, 203-Third common electrode section; 21-Grid line, 211-First grid line, 212-Second grid line; 22-Cavity; 23-Water-oxygen channel; 24-Foreign object; 25-First surface, 26-Second surface, 27-Third surface. Detailed Implementation
[0052] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that the invention will be thorough and complete, and the concept of the exemplary embodiments will be fully conveyed to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore their detailed description will be omitted. Furthermore, the drawings are merely illustrative of the invention and are not necessarily drawn to scale.
[0053] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another, these terms are used only for convenience, such as according to the orientation of the examples in the accompanying drawings. It is understood that if the device of the icon is flipped so that it is upside down, the component described as "upper" will become the component described as "lower." When a structure is "upper" of another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is "directly" mounted on the other structure, or that the structure is "indirectly" mounted on the other structure through another structure.
[0054] The terms “a,” “one,” “the,” “the,” and “at least one” are used to indicate the presence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first,” “second,” and “third,” etc., are used only as markers and are not a limitation on the number of objects.
[0055] As shown in Figures 1 to 3, a display panel generally includes a substrate 11, a driving circuit layer 13, a planarization layer group 14, and a light-emitting layer 16. The driving circuit layer 13 is disposed on one side of the substrate 11, the planarization layer group 14 is disposed on the side of the driving circuit layer 13 away from the substrate 11, and the light-emitting layer 16 is disposed on the side of the planarization layer group 14 away from the substrate 11. Additionally, the display panel may also include a buffer layer 12, which is disposed between the substrate 11 and the driving circuit layer 13.
[0056] The substrate 11 can be an inorganic material substrate 11 or an organic material substrate 11. For example, in one embodiment of this disclosure, the material of the substrate 11 can be a glass material such as soda-lime glass, quartz glass, or sapphire glass, or a metal material such as stainless steel, aluminum, or nickel.
[0057] In another embodiment of this disclosure, the substrate 11 may also be a flexible substrate 11, for example, the material of the substrate 11 may be polyimide (PI). The substrate 11 may also be a composite of multiple materials. For example, in one embodiment of this disclosure, the substrate 11 may include a bottom film layer, a pressure-sensitive adhesive layer, a first polyimide layer and a second polyimide layer stacked sequentially.
[0058] In the display area 100, the driving circuit layer 13 is provided with driving circuits for driving the light-emitting units. The driving circuits are located in the display area 100, and any driving circuit may include a transistor, which can be a thin-film transistor (TFT). The TFT can be selected from top-gate TFTs, bottom-gate TFTs, or dual-gate TFTs. Taking a top-gate TFT as an example, the TFT may include an active layer 131, a first gate 1331, a second gate 1332, a first gate insulating layer 1321, a second gate insulating layer 1322, and source / drain electrodes 136, wherein:
[0059] An active layer 131 is disposed on one side of the substrate 11. The material of the active layer 131 can be amorphous silicon semiconductor material, low-temperature polycrystalline silicon semiconductor material, metal oxide semiconductor material, organic semiconductor material, or other types of semiconductor material. Therefore, the thin film transistor can be an N-type thin film transistor or a P-type thin film transistor. The active layer 131 may include a channel region and two doped regions with different doping types located on both sides of the channel region.
[0060] A first gate insulating layer 1321 is disposed on the side of the active layer 131 away from the substrate 11. The first gate insulating layer 1321 can cover the active layer 131 and the substrate 11. A first gate 1331 is disposed on the side of the first gate insulating layer 1321 away from the substrate 11 and is directly opposite to the active layer 131. That is, the projection of the first gate 1331 on the substrate 11 is within the projection range of the active layer 131 on the substrate 11. For example, the projection of the first gate 1331 on the substrate 11 coincides with the projection of the channel region of the active layer 131 on the substrate 11. A second gate insulating layer 1322 is disposed on the side of the first gate 1331 away from the substrate 11. The second gate insulating layer 1322 can cover the first gate 1331 and the first gate insulating layer 1321. The second gate 1332 is disposed on the side of the second gate insulating layer 1322 away from the substrate 11 and is directly opposite to the active layer 131. The first gate insulating layer 1321 and the second gate insulating layer 1322 are both made of insulating materials such as silicon oxide.
[0061] The thin-film transistor may further include an interlayer dielectric layer 134, which is disposed on the side of the second gate 1332 away from the substrate 11. The interlayer dielectric layer 134 may cover the second gate 1332 and the second gate insulating layer 1322, and both interlayer dielectric layers 134 are made of insulating material. Source and drain electrodes 136 are disposed on the surface of the interlayer dielectric layer 134 away from the substrate 11, and the source and drain electrodes 136 include a first source electrode 135 and a drain electrode 136. The first source electrode 135 and the drain electrode 136 are connected to the active layer 131. For example, the first source electrode 135 and the drain electrode 136 are respectively connected to two doped regions of the corresponding active layer 131 through vias.
[0062] A first planarization layer 141 is disposed on the side of the source / drain electrode 136 away from the substrate 11, and the surface of the first planarization layer 141 away from the substrate 11 is planar. The source / drain electrode 136 may also include a second source electrode 138, which is connected to the first source electrode 135. A second planarization layer 142 is disposed on the side of the second source electrode 138 away from the substrate 11, and the second planarization layer 142 covers the second source electrode 138 and the first planarization layer 141. A protective layer 137 may also be disposed on the side of the first source electrode 135 away from the substrate 11, and the protective layer 137 covers the first source electrode 135 and the drain electrode 136. The first planarization layer 141 covers the protective layer 137. It should be noted that the first source electrode 135 and the drain electrode 136 are located in the first source / drain metal layer of the driving circuit layer 13, and the second source electrode 138 is located in the second source / drain metal layer of the driving circuit layer 13.
[0063] A pixel defining layer 15 is disposed on the side of the first planarization layer 141 or the second planarization layer 142 away from the array substrate. The pixel defining layer 15 has multiple pixel openings 151. The light-emitting layer 16 may include multiple light-emitting units, each disposed within a different pixel opening 151. Each light-emitting unit may include a pixel electrode 161, a light-emitting material layer 162, and a common electrode 163. The pixel electrode 161 is located on the surface of the first planarization layer 141 or the second planarization layer 142 away from the substrate 11. The light-emitting material layer 162 is disposed on the surface of the pixel electrode 161 away from the substrate 11, and the common electrode 163 is disposed on the surface of the light-emitting material layer 162 away from the substrate 11. The light-emitting material layer 162 can be driven to emit light through the pixel electrode 161 and the common electrode 163 to display an image.
[0064] Pixel electrode 161 is connected to either the first source 135 or the second source 138. A pixel defining layer 15 is provided on the side of pixel electrode 161 away from the substrate 11. When the thin-film transistor includes only the first source 135, pixel electrode 161 is connected to the first source 135, and the pixel defining layer 15 covers pixel electrode 161 and the first planarization layer 141. When the thin-film transistor also includes the second source 138, pixel electrode 161 is connected to the second source 138, and the pixel defining layer 15 covers pixel electrode 161 and the second planarization layer 142.
[0065] The common electrode 163 can serve as the cathode, and the pixel electrode 161 can serve as the anode. The light-emitting material layer 162 can be driven to emit light by applying a signal to the pixel electrode 161; the specific light-emitting principle will not be detailed here. The light-emitting material layer 162 may contain electroluminescent organic light-emitting materials and can be formed using processes such as vapor deposition. For example, the light-emitting material layer 162 may include a hole injection layer, a hole transport layer, a light generation layer, an electron transport layer, and an electron injection layer sequentially stacked on the pixel electrode 161 layer. It should be noted that the light-emitting material layer 162 may include a red light-emitting material layer 162, a green light-emitting material layer 162, and a blue light-emitting material layer 162, depending on the emitted color.
[0066] The display panel has an opening 300, a transition area 200, and a display area 100. The transition area 200 is located between the edge of the opening 300 and the edge of the display area 100. Due to the flow of liquid organic encapsulation material, leakage is likely. To prevent leakage, a barrier dam 18 is provided in the transition area 200. The barrier dam 18 is located on the side of the protective layer 137 away from the substrate 11 and surrounds the opening 300, serving as a barrier. The cross-sectional shape of the barrier dam 18 can be rectangular or trapezoidal, and the barrier dam 18 must have at least one beveled side near the display area 100; this is not limited here.
[0067] The stacked pattern of the barrier dam 18 includes an insulating layer group, which is made of the same material as one or more layers of the first planarization layer 141, the second planarization layer 142, and the pixel defining layer 15. As shown in Figure 2, the stacked pattern of the barrier dam 18 includes a first insulating layer 181, which is made of the same material as the first planarization layer 141. A second insulating layer 182 can also be provided on the first insulating layer 181, which is made of the same material as the second planarization layer 142. A third insulating layer 183 can also be provided on the second insulating layer 182, which is made of the same material as the pixel defining layer 15.
[0068] The transition region 200 includes a first sub-transition region 2001, which is located between the edge of the barrier dam 18 and the edge of the opening 300. A first gate insulating layer 1321 and a second gate insulating layer 1322 extend from the display region 100 to the first sub-transition region 2001. The display panel also includes gate lines 21, which include a first gate line 211 and a second gate line 212. The first gate line 211 is disposed on the side of the first gate insulating layer 1321 away from the substrate 11, and the second gate line 212 is disposed on the side of the second gate insulating layer 1322 away from the substrate 11. That is, the first gate line 211 and the first gate 1331 are disposed in the same layer and with the same material, and the second gate line 212 and the second gate 1332 are disposed in the same layer and with the same material.
[0069] The protective layer 137 extends from the display area 100 to the first sub-transition area 2001. The light-emitting material layer 162 extends to the first sub-transition area 2001, and is located on the side of the protective layer 137 away from the substrate 11. To ensure display performance, the common electrode 163 needs to be isolated; therefore, a first structural portion is provided on the side of the protective layer 137 in the first sub-transition area 2001 away from the substrate 11. The first structural portion is an isolation unit 19, and to further improve the isolation effect, at least two isolation units 19 are provided in the first sub-transition area 2001.
[0070] The width of at least a portion of the partition unit 19 is smaller than the width of the side furthest from the substrate 11. Specifically, the partition unit 19 can be configured as a structure that is wide at both ends and narrow in the middle, or it can be configured as an inverted trapezoidal structure in which the width gradually decreases from the end furthest from the substrate 11 to the end closer to the substrate 11, or it can be configured as other structures that are undercut in its height direction. For example, the partition unit 19 can be configured as a Ti-Al-Ti structure.
[0071] The common electrode 163 located on the side of the light-emitting material layer 162 away from the substrate 11 is separated by the partition unit 19, forming a plurality of common electrode portions 20. The common electrode portions 20 are divided into a first common electrode portion 201, a second common electrode portion 202 and a third common electrode portion 203. The first common electrode portion 201 is disposed on the side of the partition unit 19 away from the substrate 11, the second common electrode portion 202 is disposed between two adjacent partition units 19, and the third common electrode portion 203 is disposed on the side of the barrier dam 18 and the light-emitting material layer 162 away from the substrate 11.
[0072] Furthermore, the display panel of this disclosure may also include an encapsulation layer 17, which is disposed on the side of the light-emitting layer 16 away from the substrate 11, thereby encapsulating the light-emitting layer 16 and preventing water and oxygen corrosion. In this embodiment, the encapsulation layer 17 may include a first encapsulation layer 171, a second encapsulation layer 172, and a third encapsulation layer 173. The first encapsulation layer 171 is disposed on the side of the light-emitting layer 16 away from the substrate 11, the second encapsulation layer 172 is disposed on the side of the first encapsulation layer 171 away from the substrate 11, and the third encapsulation layer 173 is disposed on the side of the second encapsulation layer 172 away from the substrate 11. The first encapsulation layer 171 and the third encapsulation layer 173 may be inorganic encapsulation layers 17, and the second encapsulation layer 172 may be an organic encapsulation layer 17.
[0073] As shown in Figure 4, the partition unit 19 includes at least two partition layers 190. The distance between the orthographic projection of the partition layer 190 away from the drive back plate and the edge of the opening 300 is a first distance, and the distance between the orthographic projection of the partition layer 190 close to the drive back plate and the edge of the opening 300 is a second distance. The first distance is greater than the second distance. Therefore, the side of the partition layer 190 away from the drive back plate that is close to the drive back plate forms a cavity with the side of the light-emitting layer 16 that is away from the drive back plate.
[0074] In addition, during the manufacturing process of the display panel, some foreign objects 24, such as dust and fibers, inevitably fall randomly onto the side of the light-emitting layer 16 away from the substrate 11. In this case, the first structural part is the foreign object 24, and the side of the foreign object 24 near the driving back plate will also form a cavity with the side of the light-emitting layer 16 away from the driving back plate, as shown in Figure 5.
[0075] As shown in Figures 6 and 7, if a single-layer first encapsulation layer 171 is used to encapsulate the above two scenarios, the cavity cannot timely expel the waste gas generated during the formation of the first encapsulation layer 171. New film-forming gas cannot flow into the cavity to participate in the reaction, resulting in a film-forming rate in this area being much lower than in other areas, ultimately creating a water-oxygen channel 23. When water and oxygen enter through this channel 23, it causes the light-emitting layer 16 to fail, producing black spots. As water and oxygen continue to enter, the area where the light-emitting layer 16 fails will continue to grow, manifesting as increasingly larger black spots, affecting the display.
[0076] Based on this, the present invention provides a display panel. As shown in Figures 1 to 5 and Figures 8 to 12, the display panel may include a driving backplate, a light-emitting layer 16, a first structural portion, and a first encapsulation layer 171. The light-emitting layer 16 is disposed on one side of the driving backplate; the first structural portion is disposed on the side of the light-emitting layer 16 away from the driving backplate, and the side of the first structural portion near the driving backplate and the side of the light-emitting layer 16 away from the driving backplate form a cavity; the first encapsulation layer 171 is disposed on the side of the light-emitting layer 16 away from the driving backplate, and the first encapsulation layer 171 includes at least two sub-first encapsulation layers 1711, which are stacked sequentially along the direction away from the driving backplate. Each sub-first encapsulation layer 1711 completely covers the first structural portion, and the multiple sub-first encapsulation layers 1711 fill the cavity.
[0077] The first encapsulation layer 171 includes at least two sub-first encapsulation layers 1711, which are stacked sequentially in a direction away from the driving backplane. Since the waste gas generated by forming a sub-first encapsulation layer 1711 is relatively small, sufficient film-forming gas is introduced before each formation of the sub-first encapsulation layer 1711 to replace the waste gas in the cavity between the first structural part and the light-emitting layer 16, forming a new film-forming environment and increasing the film-forming rate in the cavity. This results in a shorter film-forming time for each sub-first encapsulation layer 1711, and it is not affected by the waste gas generated by the formation of the sub-first encapsulation layer 1711 itself. Therefore, each time the sub-first encapsulation layer 1711 forms a film, a complete film layer can be formed. Each sub-first encapsulation layer 1711 completely encapsulates the first structural part, and finally, multiple sub-first encapsulation layers 1711 fill the cavity, which can avoid the formation of water-oxygen channels 23 and eliminate the risk of failure of the light-emitting layer 16.
[0078] The display panel involved in the embodiments of the present invention will be described in detail below with reference to specific examples.
[0079] As shown in Figures 1 to 5, a first structural portion is provided on the side of the light-emitting layer 16 away from the substrate 11. The first structural portion is a partition unit 19 disposed around the opening 300 and is located in the first sub-transition region 2001. The side of the partition unit 19 near the driving backplate and the side of the light-emitting layer 16 away from the driving backplate form a cavity.
[0080] As shown in Figures 8 to 11, the first encapsulation layer 171 is disposed on the side of the light-emitting layer 16 away from the driving backplane. The first encapsulation layer 171 includes at least two sub-first encapsulation layers 1711, which are stacked sequentially in the direction away from the driving backplane. The required thickness of the first encapsulation layer 171 is achieved by stacking multiple sub-first encapsulation layers 1711. The material of the sub-first encapsulation layers 1711 is different from the material of the partition unit 19.
[0081] Since the amount of waste gas generated during the formation of a sub-first encapsulation layer 1711 is relatively small, sufficient film-forming gas can be introduced before each formation of the sub-first encapsulation layer 1711 to replace the waste gas in the cavity between the first structural part and the light-emitting layer 16, forming a new film-forming environment and increasing the film-forming rate in the cavity. This results in a shorter film-forming time for each sub-first encapsulation layer 1711, and it is not affected by the waste gas generated by the formation of the sub-first encapsulation layer 1711 itself. Therefore, each time the sub-first encapsulation layer 1711 is formed, a complete film layer can be formed, and each sub-first encapsulation layer 1711 completely encapsulates the first structural part.
[0082] The first encapsulation layer 171 is decomposed into multiple sub-first encapsulation layers 1711. Each sub-first encapsulation layer 1711 will completely encapsulate the first structural part. The cavity is finally filled by multiple sub-first encapsulation layers 1711, eliminating the water and oxygen pathways formed in the cavity between the first structural part and the light-emitting layer 16 due to residual waste gas and slow reaction.
[0083] Meanwhile, due to the switching on and off of the RF power supply and the start and stop of the film-forming gas input between multiple film formations, the film-forming gas gradually increases in the cavity at the start of input and gradually decreases in the cavity at the end of input. Therefore, the concentration of film-forming gas in the cavity is relatively low at both the start and end of input. As a result, a boundary layer 1712 is formed between the two sub-first encapsulation layers 1711. Each boundary layer 1712 is a transition layer between adjacent sub-first encapsulation layers 1711. The density of the film layer inside the boundary layer 1712 is less than the density of the film layer inside the sub-first encapsulation layer 1711, and the silicon content in the boundary layer 1712 is less than the silicon content in the sub-first encapsulation layer 1711.
[0084] The partition unit 19 can be a single-layer partition unit 19 or a double-layer partition unit 19. The display panel may include only a single-layer partition unit 19, or it may include both a double-layer partition unit 19 and a single-layer partition unit 19. The double-layer partition unit 19 includes a first partition structure 191 and a second partition structure 192. The single-layer partition unit 19 includes one of the first partition structure 191 and the second partition structure 192. The first partition structure 191 is disposed in the same layer and with the same material as the first source / drain metal layer, and the second partition structure 192 is disposed in the same layer and with the same material as the second source / drain metal layer.
[0085] The double-layer partition unit 19 includes a first partition structure 191 and a second partition structure 192. On the one hand, the thickness of the double-layer partition unit 19 is greater than that of the single-layer partition unit 19, which can achieve a better partition effect. On the other hand, both the first partition structure 191 and the second partition structure 192 have anchoring structures, which makes the display panel stronger in the thickness direction and easier to resist film peeling caused by film stress during cutting.
[0086] As shown in Figure 10, the partition unit 19 is a single-layer partition unit 19, which includes a first partition structure 191. The first partition structure 191 includes a first partition layer 193, a second partition layer 194, and a third partition layer 195 sequentially disposed along a direction away from the substrate 11. The width of the second partition layer 194 is smaller than the width of the adjacent first partition layers 193 and third partition layers 195. The cross-sectional shape of the second partition layer 194 of the first partition structure 191 along the width direction of the partition unit 19 is a trapezoid. The width of the third partition layer 195 of the first partition structure 191 is smaller than the width of the first partition layer 193. When the cross-sectional shape of the second partition layer 194 is a trapezoid, the sub-first encapsulation layer 1711 is more easily attached to the second partition layer 194, thereby allowing the sub-first encapsulation layer 1711 to better encapsulate the partition unit 19.
[0087] As shown in Figure 11, when the partition unit 19 is a double-layer partition unit 19, the double-layer partition unit 19 includes a first partition structure 191 and a second partition structure 192 arranged sequentially along the direction away from the substrate 11. The third partition layer 195 of the first partition structure 191 is reused as the first partition layer 193 of the second partition structure 192. Of course, the third partition layer 195 of the first partition structure 191 can also be stacked with the first partition layer 193 of the second partition structure 192.
[0088] The cross-sectional shape of the second partition layer 194 of the first partition structure 191 and the second partition structure 192 along the width direction of the partition unit 19 is a regular trapezoid. Along the direction away from the substrate 11, the width of the first partition layer 193 of the first partition structure 191, the width of the third partition layer 195 (the first partition layer 193 of the second partition structure 192), and the width of the third partition layer 195 of the second partition structure 192 gradually decrease. When the cross-sectional shape of the second partition layer 194 of the first partition structure 191 and the second partition structure 192 is a regular trapezoid, the sub-first encapsulation layer 1711 is more easily attached to the second partition layer 194 of the first partition structure 191 and the second partition structure 192, thereby allowing the sub-first encapsulation layer 1711 to better wrap the partition unit 19.
[0089] When the partition unit 19 is a single-layer partition unit 19, the single-layer partition unit 19 has a small height difference. When the first encapsulation layer 171 is divided into multiple sub-first encapsulation layers 1711, each sub-first encapsulation layer 1711 can effectively wrap the partition unit 19. When the partition unit 19 is a double-layer partition unit 19, even if the double-layer partition unit 19 has a large height difference, each sub-first encapsulation layer 1711 can completely wrap the partition unit 19, effectively preventing the formation of water-oxygen channels 23 while ensuring a better partition effect.
[0090] As shown in Figure 12, during the manufacturing process of the display panel, foreign objects 24 such as dust and fibers randomly fall onto the side of the light-emitting layer 16 away from the substrate 11. In this case, the first structural part is the foreign object 24, and the side of the foreign object 24 near the driving backplate will also form a cavity with the side of the light-emitting layer 16 away from the driving backplate. For the cavity formed between the foreign object 24 and the light-emitting layer 16, each sub-first encapsulation layer 1711 can also completely wrap the first structural part, and finally the multiple sub-first encapsulation layers 1711 fill the cavity, which can prevent the formation of water and oxygen channels 23.
[0091] As shown in Figures 9 and 12, regardless of whether the first structural part is the partition unit 19 or the foreign object 24, the first structural part has a first surface 1901 away from the substrate 11, a second surface 1902 close to the substrate 11, and a third surface 1903 connected between the first surface 1901 and the second surface 1902. The sub-first encapsulation layer 1711 covers the first surface 1901, the second surface 1902 and the third surface 1903.
[0092] This invention also provides a method for manufacturing any of the above-described display panels. As shown in Figures 13 to 18, the method includes:
[0093] Step S10: A light-emitting layer 16 is formed on one side of the driving backplate, and the side of the light-emitting layer 16 away from the driving backplate has a first structural part.
[0094] Step S20: Introduce film-forming gas to replace the waste gas in the cavity 22 formed between the first structural part and the light-emitting layer 16.
[0095] Step S30: The film-forming gas is introduced again to control the generation of the sub-first encapsulation layer 1711 covering the first structural part;
[0096] Step S40: Repeat the formation of multiple sub-first encapsulation layers 1711 covering the first structural part until the multiple sub-first encapsulation layers 1711 fill the cavity.
[0097] It should be noted that the process of generating the first sub-encapsulation layer 1711 requires the participation of an RF power supply. In step S20, when the waste gas in the cavity 22 is replaced with a film-forming gas, if no RF power supply is applied, the first sub-encapsulation layer 1711 will not be formed. In step S30, after the waste gas in the cavity 22 has been replaced and a new film-forming environment has been formed, the RF power supply is applied, and the formation of the first sub-encapsulation layer 1711 begins.
[0098] The film-forming gases typically include SiH4 at 1500–5000 sccm, N2O at 1000–1000 sccm, NH3 at 1000–5000 sccm, H2 at 5000–50000 sccm, and N2 at 5000–30000 sccm. The material of the sub-first encapsulation layer 1711 formed by the above film-forming process may include silicon nitride, silicon oxynitride, and silicon oxide.
[0099] Steps S20 and S30 will be described in detail below with reference to specific embodiments.
[0100] As shown in Figure 13, a film-forming gas is introduced to displace the waste gas in the cavity 22 formed between the first structural part and the light-emitting layer 16. As shown in Figure 14, the RF power supply is turned on, and the film-forming gas is introduced again. After the first sub-first encapsulation layer 1711 covering the first structural part is generated, the input of the film-forming gas is stopped, and the RF power supply is turned off. As shown in Figure 15, a film-forming gas is introduced to displace the waste gas in the cavity 22 formed between the first sub-first encapsulation layer 1711 and the light-emitting layer 16. As shown in Figure 16, the RF power supply is turned on, and the film-forming gas is introduced again. After the second sub-first encapsulation layer 1711 covering the first sub-first encapsulation layer 1711 is generated, the input of the film-forming gas is stopped, and the RF power supply is turned off. As shown in Figure 17, a film-forming gas is introduced to displace the waste gas in the cavity 22 formed between the second sub-first encapsulation layer 1711 and the light-emitting layer 16. As shown in Figure 18, turn on the RF power supply, introduce the film-forming gas again, and control the generation of the third sub-first encapsulation layer 1711 that covers the second sub-first encapsulation layer 1711. Then, stop the input of the film-forming gas and turn off the RF power supply.
[0101] This invention also provides a display device, which may include the display module described in any of the above embodiments of this invention. The specific structure and beneficial effects of the display module have already been described in detail above, and therefore will not be repeated here.
[0102] It should be noted that, in addition to the display module, the display device also includes other necessary components and parts, such as the casing, circuit board, power cord, etc. Those skilled in the art can make corresponding additions according to the specific usage requirements of the display device, which will not be elaborated here.
[0103] Display devices can also be emerging wearable devices, such as virtual reality and augmented reality devices, or traditional electronic devices, such as mobile phones, computers, televisions, and video recorders. These will not be listed exhaustively here.
[0104] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the appended claims.
Claims
1. A display panel, wherein, include: Drive backplane; A light-emitting layer is disposed on one side of the drive backplate; A first structural part is disposed on the side of the light-emitting layer away from the driving back plate, and the side of the first structural part near the driving back plate and the side of the light-emitting layer away from the driving back plate form a cavity; The first encapsulation layer is disposed on the side of the light-emitting layer away from the driving backplate. The first encapsulation layer includes at least two sub-first encapsulation layers. The at least two sub-first encapsulation layers are stacked sequentially in a direction away from the driving backplate. Each sub-first encapsulation layer completely encapsulates the first structural part, and the multiple sub-first encapsulation layers fill the cavity.
2. The display panel according to claim 1, wherein, A boundary layer is provided between two adjacent sub-first encapsulation layers, and the film density in the boundary layer is less than the film density in the sub-first encapsulation layer.
3. The display panel according to claim 2, wherein, The silicon content in the boundary layer is less than the silicon content in the sub-first encapsulation layer.
4. The display panel according to claim 1, wherein, The display panel has an opening, and the first structural part is a partition unit arranged around the opening. The partition unit includes at least two partition layers. The distance between the orthographic projection of the partition layer away from the driving back plate on the driving back plate and the edge of the opening is a first distance, and the distance between the orthographic projection of the partition layer close to the driving back plate on the driving back plate and the edge of the opening is a second distance. The first distance is greater than the second distance.
5. The display panel according to claim 4, wherein, The partition unit is a double-layer partition unit or a single-layer partition unit. The double-layer partition unit includes two partition structures stacked together, and the single-layer partition unit includes one partition structure.
6. The display panel according to claim 5, wherein, The partition structure includes a first partition layer, a second partition layer, and a third partition layer arranged sequentially along a direction away from the drive back plate, wherein the width of the second partition layer is smaller than the width of the first partition layer and the third partition layer on adjacent sides.
7. The display panel according to claim 6, wherein, When the partition unit is a double-layer partition unit, the two partition structures are a first partition structure and a second partition structure arranged sequentially along the direction away from the drive back plate, respectively. The third partition layer of the first partition structure is reused as the first partition layer of the second partition structure, or the third partition layer of the first partition structure and the first partition layer of the second partition structure are stacked together.
8. The display panel according to claim 6, wherein, The second partition layer of the partition structure has a trapezoidal cross-section along the width direction of the partition unit.
9. The display panel according to claim 8, wherein, The width of the third partition layer of the partition structure is smaller than the width of the first partition layer.
10. The display panel according to claim 5, wherein, The display panel further includes a driving circuit layer, which is disposed on one side of the driving back panel. The driving circuit layer includes a first source / drain metal layer and a second source / drain metal layer. When the partition unit is a single-layer partition unit, the partition structure is disposed in the same layer and with the same material as the first source / drain metal layer or the second source / drain metal layer. When the partition unit is a double-layer partition unit, the partition structure is disposed in the same layer and with the same material as the first source / drain metal layer and the second source / drain metal layer.
11. The display panel according to claim 4, wherein, The number of partition units is at least two, and the at least two partition units are arranged at intervals along a direction away from the opening.
12. The display panel according to claim 11, wherein, The light-emitting layer includes a light-emitting material layer and a common electrode. The light-emitting material layer is disposed on one side of the driving backplate, and the common electrode is disposed on the side of the light-emitting material layer away from the driving backplate. The common electrode is separated by the partition unit to form a plurality of common electrode portions. The common electrode portions include a first common electrode portion and a second common electrode portion. The first common electrode portion is disposed on the side of the partition unit away from the driving backplate, and the second common electrode portion is disposed between two adjacent partition units.
13. The display panel according to claim 1, wherein, The material of the first structural part is different from the material of the sub-first encapsulation layer.
14. The display panel according to claim 1, wherein, The first structural portion has a first surface away from the drive backplate, a second surface close to the drive backplate, and a third surface connecting the first surface and the second surface, and the sub-first encapsulation layer covers the first surface, the second surface and the third surface.
15. A method for manufacturing a display panel according to any one of claims 1 to 14, wherein, The method includes: A light-emitting layer is formed on one side of the drive backplate, and the side of the light-emitting layer away from the drive backplate has a first structural portion; A film-forming gas is introduced to replace the waste gas in the cavity formed between the first structural part and the light-emitting layer. The film-forming gas is introduced again to control the generation of a sub-first encapsulation layer that covers the first structural part; Multiple sub-first encapsulation layers are repeatedly formed to cover the first structural portion until the cavity is filled by multiple sub-first encapsulation layers.
16. The method for manufacturing a display panel according to claim 15, wherein, The film-forming gases include SiH4, N2O, NH3, H2, and N2.
17. A display device, wherein, Includes the display panel as described in any one of claims 1 to 14.