Laser

Abstract

The present application relates to the technical field of optoelectronics, and discloses a laser. The laser comprises: an insulating substrate, an insulating housing, and a plurality of light-emitting chips. The insulating substrate and the insulating housing are integrally formed, and thus, there is no need to connect the insulating substrate and the insulating housing by means of an additional connecting member, and the overall size of the laser is small. In addition, in the present application, by providing a fluid channel inside the insulating substrate, heat generated by the laser is dissipated by means of a cooling fluid located in the fluid channel. Compared with a passive heat dissipation system, the heat dissipation system of the present application is not limited by the position of a heat dissipation device; compared with a macro-channel water-cooling system, the heat dissipation system used for the laser has a smaller overall size and higher heat exchange efficiency, and compared with a thermoelectric cooling system, the heat dissipation system of the present application has a lower cost. Therefore, during heat dissipation for the laser by an external heat dissipation assembly, the present application achieves the advantages of greater flexibility in installation location, smaller size, higher heat exchange efficiency, and lower cost.

Description

laser

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202510361836.2, filed on March 25, 2025, entitled "Laser", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of optoelectronic technology, and in particular to a laser. Background Technology

[0004] With the development of optoelectronic technology, lasers are being used more and more widely, for example in welding, cutting and laser display.

[0005] A laser typically includes a package structure and a light-emitting chip. The light-emitting chip can be mounted on a substrate within the package structure, allowing the package structure to seal the chip. To achieve miniaturization, multiple light-emitting chips in a laser are usually mounted together on a substrate.

[0006] However, the concentrated mounting of multiple light-emitting chips means that the heat generated by the chips cannot be dissipated in time, resulting in poor heat dissipation of the laser. Summary of the Invention

[0007] This application provides a laser. The technical solution, which improves the heat dissipation performance of the laser, is as follows:

[0008] A laser is provided, comprising: an insulating substrate, an insulating housing, and multiple light-emitting chips;

[0009] The insulating tube shell is disposed on one side of the insulating substrate, and the insulating substrate and the insulating tube shell are an integrally molded structure made of insulating material;

[0010] The plurality of light-emitting chips are fixed on one side of the insulating substrate where the insulating shell is disposed, and the plurality of light-emitting chips are distributed within the area enclosed by the insulating shell;

[0011] The insulating substrate has a fluid channel, and the side of the insulating substrate facing away from the insulating shell has a fluid inlet and a fluid outlet communicating with the fluid channel. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 is a side cross-sectional view of a laser provided in an embodiment of this application;

[0014] Figure 2 is a top view of a laser provided in an embodiment of this application;

[0015] Figure 3 is an exploded view of a laser provided in an embodiment of this application;

[0016] Figure 4 is a schematic diagram of the fluid channel structure of an insulating substrate provided in an embodiment of this application;

[0017] Figure 5 is a schematic diagram of the flow of heat dissipation fluid in a fluid channel according to an embodiment of this application;

[0018] Figure 6 is a schematic diagram of a laser provided in an embodiment of this application;

[0019] Figure 7 is a side cross-sectional view of another laser provided in an embodiment of this application;

[0020] Figure 8 is an exploded view of a laser provided in an embodiment of this application;

[0021] Figure 9 is a schematic diagram of the connection between a laser and an external heat dissipation component provided in an embodiment of this application;

[0022] Figure 10 is a schematic diagram of another connection between a laser and an external heat dissipation component provided in an embodiment of this application;

[0023] Figure 11 is a side cross-sectional view of another laser provided in an embodiment of this application;

[0024] Figure 12 is a side cross-sectional view of a laser provided in another embodiment of this application;

[0025] Figure 13 is a top view of another laser provided in an embodiment of this application;

[0026] Figure 14 is a cross-sectional view of the laser shown in Figure 13 at E-E';

[0027] Figure 15 is a top view of another laser provided in an embodiment of this application;

[0028] Figure 16 is a top view of another laser provided in an embodiment of this application;

[0029] Figure 17 is a top view of a laser provided in another embodiment of this application;

[0030] Figure 18 is a cross-sectional view of the laser shown in Figure 17 at point D-D'. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0032] Currently, to improve the heat dissipation of lasers, external cooling systems are generally used. Examples of such external cooling systems include passive cooling systems, macro-flow water cooling systems, and semiconductor cooling systems.

[0033] In a passive cooling system, the system may include a heat sink, and the laser needs to be mounted on the heat sink to make contact with it. Heat generated by the light-emitting chip in the laser can be quickly dissipated through the heat sink. However, in a passive cooling system, because the laser needs to be in contact with the heat sink, the laser's position is limited by the heat sink's location.

[0034] In a macrochannel water cooling system, there is a heat sink and a macrochannel cold plate. The laser can be mounted on the macrochannel cold plate to make contact with it, and the side of the macrochannel cold plate facing away from the laser can contact the heat sink. The heat generated by the light-emitting chip in the laser can be conducted to the heat sink through the macrochannel cold plate for dissipation. However, in macrochannel cooling systems, the macrochannel cold plate is generally large, resulting in a large overall size of the macrochannel water cooling system.

[0035] In semiconductor refrigeration systems, cooling is achieved through the thermoelectric effect of semiconductors. However, semiconductor refrigeration systems have a relatively low coefficient of performance (COP) and high power consumption. Therefore, semiconductor refrigeration is mainly used in applications that generate less heat, such as cooling certain low-power devices in electronic equipment. For high-power devices, the heat dissipation effect is poor and the cost is high.

[0036] This application provides a laser. Please refer to Figures 1, 2, and 3. Figure 1 is a side cross-sectional view of the laser provided in this application embodiment, Figure 2 is a top view of the laser provided in this application embodiment, and Figure 3 is an exploded view of the laser provided in this application embodiment. The laser may include: an insulating substrate 100, an insulating housing 200, and multiple light-emitting chips 400.

[0037] The insulating housing 200 in the laser can be located on one side of the insulating substrate 100, and the insulating substrate 100 and the insulating housing 200 can be an integrally molded structure made of insulating material. This facilitates laser assembly after the insulating substrate 100 and the insulating housing 200 are integrally molded. Furthermore, the integral molding of the insulating substrate 100 and the insulating housing 200 eliminates the need for additional connecting parts, resulting in a smaller overall size of the laser.

[0038] For example, the insulating substrate 100 and the insulating shell 200 can be a single-piece structure made of ceramic material. Of course, in other possible implementations, the insulating substrate 100 and the insulating shell 200 can also be single-piece molded using other insulating materials. This application does not limit this aspect.

[0039] Multiple light-emitting chips 400 in the laser are fixed on one side of the insulating substrate 100 where the insulating shell 200 is provided, and the multiple light-emitting chips 400 are located in the area enclosed by the insulating shell 200.

[0040] The insulating substrate 100 in the laser has a fluid channel H that is connected to each other. The side of the insulating substrate 100 facing away from the housing 200 has a fluid inlet O1 and a fluid outlet O2 that are connected to the fluid channel H.

[0041] The cooling fluid continuously enters the fluid channel H through the fluid inlet O1, flows continuously within the fluid channel H, and then continuously flows out of the fluid channel H through the fluid outlet O2, thus continuously circulating the cooling fluid within the fluid channel H. In this way, the heat generated by the light-emitting chip 400, which is mounted on the insulating substrate 100, during laser emission can be conducted through the insulating substrate 100 to the cooling fluid located in the fluid channel H, and then dissipated to the outside of the insulating substrate 100 by the continuously circulating cooling fluid. This allows the heat generated by the light-emitting chip 400 to be quickly dissipated through the circulating cooling fluid, improving the heat dissipation performance of the laser.

[0042] In this application, the laser may further include a light-transmitting sealing layer 1900, which is fixed to the side of the insulating housing 200 opposite to the insulating substrate 100. The light-transmitting sealing layer 1900 can seal the multiple light-emitting chips 400 to prevent damage to the light-emitting chips. Furthermore, the laser light emitted by the multiple light-emitting chips 400 of the laser can pass through the light-transmitting sealing layer 1900 to achieve laser light emission.

[0043] In summary, this application provides a laser, including an insulating substrate, an insulating shell, and multiple light-emitting chips. The insulating substrate and the insulating shell are integrally manufactured, eliminating the need for additional connecting parts, resulting in a smaller overall size of the laser. Furthermore, by providing fluid channels within the insulating substrate, the heat generated by the laser is dissipated by heat-dissipating fluid located within these channels. Compared to passive cooling systems, this is not limited by the location of the heat sink; compared to macro-channel water cooling systems, the overall size of the cooling system for this laser is smaller and the heat exchange efficiency is higher; and compared to semiconductor cooling systems, the cost is lower. Therefore, the laser in this application, when dissipated by external heat dissipation components, has the advantages of unrestricted location, smaller size, higher heat exchange efficiency, and lower cost.

[0044] It should be noted that, to ensure that most of the heat generated by the light-emitting chip 400 can be dissipated through the circulating cooling fluid, the distance between the side of the insulating substrate 100 where the light-emitting chip 400 is disposed and the fluid channel H needs to be small in the direction perpendicular to the insulating substrate 100. This ensures that the distance between the light-emitting chip 400 and the cooling fluid located in the fluid channel H is small, allowing most of the heat generated by the light-emitting chip 400 to be dissipated through the cooling fluid. Furthermore, the distance between the side of the insulating substrate 100 where the light-emitting chip 400 is disposed and the fluid channel H in the direction perpendicular to the insulating substrate 100 should not be too small to ensure a certain connection strength between the insulating substrate 100 and the light-emitting chip 400. It should be noted that the distance between the light-emitting chip 400 and the fluid channel H can be between 0.2 mm and 0.5 mm; in the example, the distance between the light-emitting chip 400 and the fluid channel H is 0.3 mm.

[0045] It should also be noted that the cross-section of the fluid channel H can be rectangular, and the size of the cross-section of the fluid channel H can be less than 0.5 mm × 0.5 mm. This ensures that the fluid channel H has a sufficient cross-sectional area to allow the heat dissipation fluid to flow, while also ensuring that the cutout volume of the insulating substrate 100 is small, so that the insulating substrate 100 has sufficient strength.

[0046] Optionally, as shown in Figure 4, which is a top cross-sectional view of a laser provided in an embodiment of this application. It should be noted that Figure 1 in the above embodiment is a cross-sectional view of the laser at C-C' shown in Figure 4, and Figures 11 and 12 in subsequent embodiments are also cross-sectional views of the laser at C-C' shown in Figure 4.

[0047] The fluid channel H of the insulating substrate 100 may include multiple branch channels H1 and a main channel H2 for connecting the multiple branch channels H1. The fluid inlet O1 and fluid outlet O2 may both be connected to the main channel H2. The multiple branch channels H1 of the fluid channel H may correspond to multiple light-emitting chips 400, and the orthographic projection of the light-emitting chip 400 on the side of the insulating substrate 100 opposite to the housing 200 may overlap with the orthographic projection of the corresponding branch channel H1 on the side of the insulating substrate 100 opposite to the housing 200. This ensures that the heat generated by each light-emitting chip 400 can be quickly conducted to the heat dissipation fluid for dissipation through circulation.

[0048] Optionally, as shown in Figures 2, 3, and 4, the plurality of light-emitting chips 400 in the laser can be arranged in at least two rows along the second direction Y, and the arrangement direction of each row of light-emitting chips 400 can be parallel to the first direction X. Here, the first direction X and the second direction Y intersect; for example, the first direction X can intersect the second direction Y perpendicularly. The light emission direction of the light-emitting chips 400 can intersect with the arrangement direction of a row of light-emitting chips 400, that is, the light emission direction of the light-emitting chips 400 can be parallel to the second direction Y. The plurality of branch channels H1 in the fluid channel H can also be arranged in at least two rows along the second direction Y, and the arrangement direction of each row of branch channels H1 is parallel to the first direction X, and the extension direction of each branch channel H1 in each row of branch channels H1 is parallel to the first direction Y, that is, the extension direction of the branch channel H1 can be parallel to the light emission direction of the light-emitting chips 400.

[0049] Here, as shown in Figure 5, which is a schematic diagram of the flow of heat dissipation fluid in a fluid channel according to an embodiment of this application, the heat dissipation direction of the light-emitting chip 400 is parallel to the light emission direction of the light-emitting chip 400. Thus, the heat dissipation direction of the light-emitting chip 400 can be parallel to the extension direction of the branch channel H1. In this way, the heat dissipation fluid flowing in the branch channel H1 can flow parallel to the heat dissipation direction of the light-emitting chip 400, thereby quickly carrying away the heat generated by the light-emitting chip 400 and further improving the heat dissipation performance of the laser. It should be noted that the direction of the dashed arrow in Figure 5 indicates the flow direction of the heat dissipation fluid.

[0050] It should be noted that, as shown in Figure 5, the main flow channel H2 in the fluid channel H may include: a first flow channel H21 distributed around multiple branch flow channels H1, and two second flow channels H22 located between two adjacent rows of branch flow channels H1 in the second direction Y. In the second direction Y, one end of each row of branch flow channels H1 is connected to a flow channel on one side of the first flow channel H21 distributed in the second direction Y, and the other end is connected to a second flow channel H22. Fluid inlet O1 and fluid inlet O2 are respectively connected to the flow channels on both sides of the first flow channel H21 distributed in the first direction X.

[0051] Optionally, please refer to Figures 6 and 7. Figure 6 is a structural schematic diagram of a laser provided in an embodiment of this application, and Figure 7 is a side cross-sectional view of another laser provided in an embodiment of this application. The laser may also include an adapter plate 900, which may be located on the side of the insulating substrate 100 away from the housing 200 and may be fixedly connected to the insulating substrate 100.

[0052] Here, when the insulating substrate 100 is made of ceramic material, its strength is relatively low, and because the insulating substrate 100 has a fluid channel H inside, its overall strength is also relatively low. Therefore, the adapter plate 900 provided on the side of the insulating substrate 100 facing away from the insulating housing 200 can be used to support the insulating substrate 100, thereby ensuring greater overall strength of the laser.

[0053] It should be noted that the overall dimensions of the adapter plate 900 can be larger than those of the insulating substrate 100 to ensure that the adapter plate 900 has sufficient strength. For example, the dimensions of the insulating substrate 100 can be 15 mm × 15 mm × 2.3 mm, and the dimensions of the adapter plate 900 can be 24 mm × 18 mm × 4 mm.

[0054] Optionally, as shown in Figures 6 and 7, the laser may further include a fixing member 1100, which can be engaged with the edge of the insulating substrate 100 and can be fixedly connected to the adapter plate 900. Thus, the fixing member 1100 enables a fixed connection between the insulating substrate 100 and the adapter plate 900.

[0055] Here, as shown in Figures 6 and 7, the edge of the insulating substrate 100 may have a boss 101, and the fixing member 1100 may abut against the boss 101 in the insulating substrate 100 to achieve a snap-fit ​​connection between the fixing member 1100 and the insulating substrate 100. The fixing member 1100 and the adapter plate 900 have multiple threaded holes B for connection, and the fixing member 1100 can be fixedly connected to the adapter plate 900 by screws located in the threaded holes B.

[0056] Optionally, as shown in Figure 8, which is an exploded view of a laser provided in an embodiment of this application, the adapter plate 900 may have a separately configured first connecting channel A1 and a second connecting channel A2. The first connecting channel A1 of the adapter plate 900 may communicate with the fluid inlet O1 of the insulating substrate 100, and the second connecting channel A2 of the adapter plate 900 may communicate with the fluid outlet O2 of the insulating substrate 100. The first connecting channel A1 and the second connecting channel A2 of the adapter plate 100 may be used to connect to an external heat dissipation component.

[0057] In this way, the heat dissipation fluid flowing into the fluid channel H through the first connecting channel A1 and the fluid inlet O1 absorbs the heat generated by the light-emitting chip 400, and can then flow out of the fluid channel H through the fluid outlet O2 and the second connecting channel A2. The heat-laden heat dissipation fluid can also flow into an external heat dissipation component through the second connecting channel A2, where the heat dissipation component can dissipate the heat of the heat dissipation fluid to the outside. Thus, the heat dissipation fluid flowing through the heat dissipation component can re-enter the fluid channel H to absorb the heat generated by the light-emitting chip 400 again, thereby achieving cyclic heat absorption by the heat dissipation fluid.

[0058] Optionally, as shown in Figure 9, which is a schematic diagram of the connection between a laser and an external heat dissipation component according to an embodiment of this application, the external heat dissipation component may include: a water pump 1200, a cold plate 1300, and an external pipe 1400. One end of the external pipe 1400 may be connected to the first communication channel A1 of the adapter plate 900, and the other end of the external pipe 1400 may be connected to the second communication channel A2 of the adapter plate 900. In this way, the heat dissipation fluid can circulate within the fluid channel H of the insulating substrate 100 through the external pipe 1400.

[0059] The water pump 1200 can be connected to the external pipe 1400, and the water pump 1200 can drive the heat dissipation fluid to flow continuously in the fluid channel H between the external pipe 1400 and the insulating substrate 100. The cold plate 1300 can contact a part of the external pipe 1400, and after the heat dissipation fluid flows through the cold plate, the heat carried by the heat dissipation fluid can be dissipated through the cold plate 1300.

[0060] It should be noted that the water pump 1200 can change the flow rate of the cooling fluid to alter the heat dissipation performance of the laser, thus achieving adjustable heat dissipation performance. When the light-emitting chip 400 generates a significant amount of heat, the water pump 1200 can accelerate the flow rate of the cooling fluid, allowing the rapidly circulating fluid to dissipate heat more quickly and improve the laser's heat dissipation performance.

[0061] Optionally, as shown in Figures 7 and 9, the external heat dissipation component may further include two quick connectors 1500. Here, the two quick connectors 1500 can be adapted to the first communication channel A2 and the second communication channel A2 of the adapter plate 900, respectively. One end of one quick connector 1500 can be connected to one end of the external pipe 1400, and the other end of the quick connector 1500 can be connected to the first communication channel A1. One end of the other quick connector 1500 can be connected to the other end of the external pipe 1400, and the other end of the quick connector 1500 can be connected to the second communication channel A2. Thus, quick connection between the first communication channel A1 and the second communication channel A2 of the adapter plate 900 and the external pipe 1400 can be achieved through the quick connectors 1500.

[0062] Optionally, as shown in Figure 9, the external heat dissipation components may also include an automatic fluid replenishment device 1600, a flow sensor 1700, and an expansion container 1800. The automatic fluid replenishment device 1600 can be used to replenish the heat dissipation fluid, and the flow sensor 1700 can be used to detect the flow rate of the heat dissipation fluid. The expansion container 1800 can provide a certain buffering effect for the flowing heat dissipation fluid.

[0063] In this application, please refer to FIG10, which is a schematic diagram of another connection between a laser and an external heat dissipation component provided in an embodiment of this application. The external conduit 1400 in the external heat dissipation component can communicate with fluid channels H in at least two insulating substrates 100. FIG10 provides a schematic illustration using the example of the external conduit 1400 communicating with the fluid channels H in the two insulating substrates 100. Through the circulation of cooling fluid within the fluid channels H in the two insulating substrates 100 and the external conduit 1400, the external heat dissipation component can simultaneously dissipate heat from two lasers.

[0064] In this application, the structure of the insulating substrate 100 in the laser can be implemented in the following two optional ways:

[0065] In a first optional implementation, please refer to Figures 8 and 11. Figure 11 is a side cross-sectional view of another laser provided in an embodiment of this application. The insulating substrate 100 in the laser may have a groove on the side facing the insulating housing 200. The laser may also include a cover plate 2300, which is fixedly connected to the side of the insulating substrate 100 facing the insulating housing 200, such that the cover plate 2300 can cover the groove of the insulating substrate 100 to form a fluid channel H.

[0066] In this application, the cover plate 2300 can be located within the area enclosed by the insulating tube shell 200, and the multiple light-emitting chips 400 in the laser can be fixed on the side of the cover plate 2300 away from the insulating substrate 100.

[0067] In this case, a groove corresponding to the fluid channel H can be first manufactured on the surface of the insulating substrate 100. After the cover plate 2300 is fixedly connected to the insulating substrate 100, the groove of the insulating substrate 100 and the cover plate 2300 can form the fluid channel H. This process is simpler than directly setting the fluid channel H inside the insulating substrate 100.

[0068] In this application, the cover plate 2300 can be made of a conductive material. For example, the cover plate 2300 is made of molybdenum-copper material, which has high structural strength, thereby further improving the overall strength of the laser.

[0069] When the cover plate 2300 is made of a conductive material, as shown in Figure 10, the laser may further include multiple heat sinks 2200, each corresponding to a multiple light-emitting chip 400. Here, the heat sinks 2200 can be made of an insulating material. The multiple heat sinks 2200 can be fixed to the side of the cover plate 2300 facing away from the insulating substrate 100. The light-emitting chip 400 can be fixed to the corresponding heat sink 2200 on the side facing away from the cover plate 2300. In this way, the light-emitting chip 400 is connected to the conductive cover plate 2300 through the insulating heat sinks 2200, ensuring that the multiple light-emitting chips 400 do not conduct electricity with the conductive cover plate 2300, thus ensuring that the light-emitting chips 400 can emit light normally.

[0070] In this way, during the operation of the laser, the heat generated by the light-emitting chip 400 can be conducted through the heat sink 2200 to the cover plate 2300, and then through the cover plate 2300 to the insulating substrate 100, so as to the heat dissipation fluid located in the fluid channel H. The heat can then be quickly dissipated through the circulation of the heat dissipation fluid in the fluid channel H.

[0071] It should be noted that the cover plate 2300 in the laser can also be made of an insulating material, and this embodiment does not limit this. When the cover plate 2300 is made of an insulating material, the cover plate 2300 and the insulating substrate 100 can be made of the same material. For example, both the cover plate 2300 and the insulating substrate 100 can be made of ceramic material.

[0072] In the second optional implementation, as shown in Figure 12, which is a side cross-sectional view of a laser according to another embodiment of this application, the insulating substrate 100 in the laser has a fluid channel H inside, that is, the insulating substrate 100 in the laser is a hollow structure with a fluid channel H. Multiple light-emitting chips 400 in the laser are fixedly connected to the side of the insulating substrate 100 facing the insulating shell 200.

[0073] In this way, there is no need for a heat sink to isolate the light-emitting chip 400 from the insulating substrate 100; the light-emitting chip 400 can be directly fixed to the insulating substrate 100. During the operation of the laser, the heat generated by the light-emitting chip 400 can be directly conducted to the insulating substrate 100, and then to the heat dissipation fluid located in the fluid channel H. The heat can then be rapidly dissipated through the circulation of the heat dissipation fluid within the fluid channel H. In this case, compared to when the light-emitting chip 400 is fixed to the cover plate 2300 via the heat sink 2200, the heat dissipation path of the light-emitting chip 400 is reduced, resulting in better heat dissipation for the laser.

[0074] It should be noted that the light-emitting chip 400 can be soldered onto the heat sink 2200 or the insulating substrate 100 using conductive solder. As shown in Figures 11 and 12, the conductive solder can form a conductive connection portion 300 on the side of the light-emitting chip 400 facing the insulating substrate 100, and the side of the light-emitting chip 400 facing the insulating substrate 100 can be electrically connected to the corresponding conductive connection portion 300. For example, the conductive connection portion 300 can be a conductive connection portion 300 formed by soldering the light-emitting chip 400 with gold-tin solder.

[0075] It should also be noted that when the insulating substrate 100 is made of ceramic material, the coefficients of thermal expansion of the light-emitting chip 400 and the insulating substrate 100 are matched. In this way, after the light-emitting chip 400 and the insulating substrate 100 are soldered together by the conductive connection part 300 made of gold-tin solder, the solder joint between the light-emitting chip 400 and the insulating substrate 100 has high strength and good durability, resulting in a longer service life of the laser.

[0076] In this application, as shown in Figures 11 and 12, the laser may further include a collimating lens group 2100, which may be located on the side of the light-transmitting sealing layer 1900 facing away from the insulating housing 200. The collimating lens group 2100 may include a plurality of collimating lenses T, which correspond one-to-one with the plurality of light-emitting chips 400. The laser emitted from each light-emitting chip 400 can be directed towards the corresponding collimating lens T, which collimates the incoming laser before emitting it, thereby completing the laser emission.

[0077] Optionally, please refer to Figures 13 and 14. Figure 13 is a top view of another laser provided in an embodiment of this application, and Figure 14 is a cross-sectional view of the laser shown in Figure 13 at E-E'. Multiple conductive conductors 201 are embedded inside the insulating shell 200 of the laser. The conductive conductors 201 can penetrate the insulating shell 200 and directly contact it. Here, since the insulating shell 200 is also made of insulating material, the conductive conductors 201 can be directly embedded inside the insulating shell 200, so that there is no electrical connection between the individual conductive conductors 201. Furthermore, during the integral manufacturing process of the insulating substrate 100 and the insulating shell 200, the multiple conductive conductors 201 can be manufactured together with the insulating shell 200.

[0078] It should be noted that the conductive conductor 201 embedded inside the insulating shell 200 can be tungsten paste. During the manufacturing process of the insulating shell 200, the locations within the insulating shell 200 where the conductive conductor 201 needs to be embedded can be filled with tungsten paste. After the tungsten paste is filled, the insulating shell 200 can be dried and sintered at high temperature, allowing the tungsten paste to bond tightly with the insulating shell 200, forming a stable circuit connection. It should also be noted that the surface of the conductive conductor 201 can be nickel-plated or gold-plated to facilitate welding the conductive conductor 201 to other conductive parts, for example, to facilitate welding the conductive conductor 201 to the external lead 640 in subsequent examples.

[0079] In this way, although the conductive conductor 201 penetrates the insulating shell 200, since the conductive conductor 201 is directly embedded inside the insulating shell 200, there is no gap between the conductive conductor 201 and the corresponding positions of the conductive conductor 201 distributed in the insulating shell 200. This ensures good airtightness of the laser, which can improve the service life of the light-emitting chip and thus improve the service life of the laser.

[0080] Optionally, one end of the conductive conductor 201 can be used to electrically connect to the light-emitting chip 400, and the other end of the conductive conductor 201 can be used to electrically connect to an external circuit. In this way, the external circuit can provide current to the light-emitting chip 400 through the conductive conductor 201 to excite the light-emitting chip 400 to emit laser light.

[0081] In this application, as shown in Figure 13, the multiple light-emitting chips 400 in the laser can be arranged in at least two rows. These at least two rows of light-emitting chips can include at least one row of first-type light-emitting chips 401 and at least one row of second-type light-emitting chips 402. The row of first-type light-emitting chips 401 includes multiple first-color light chips 4011 and multiple second-color light chips 4012, which are arranged alternately. Here, the multiple first-color light chips 4011 are used to emit first-color light, the multiple second-color light chips 4012 are used to emit second-color light, and the row of second-type light-emitting chips 402 are all used to emit third-color light. For example, the first-color light can be a blue laser, the second-color light can be a green laser, and the third-color light can be a red laser.

[0082] In this way, the multiple first-color light chips 4011 for emitting the first color light in the first type of light-emitting chip 401 can be arranged alternately with the multiple second-color light chips 4012 for emitting the second color light. That is, in the arrangement direction of a row of first-color light-emitting chips 401, multiple channels of the first color light and multiple channels of the second color light can be arranged alternately, so that the multiple channels of the first color light and multiple channels of the second color light are evenly distributed in the arrangement direction of a row of first-color light-emitting chips 401, thus making the uniformity of the laser emitted light better. After applying this laser to a projection device, the problem of color distortion in the projected image can be solved.

[0083] Here, each of the multiple first-type light-emitting chips 401 is electrically connected to an external circuit through two conductive conductors 201. These two conductive conductors 201 can be electrically connected to the positive and negative terminals of the corresponding first-type light-emitting chip 401, respectively. In this way, the external circuit can provide current to the corresponding first-type light-emitting chip 401 through the corresponding two conductive conductors 201 to excite the first-type light-emitting chip 401 to emit laser light.

[0084] A row of second-type light-emitting chips 402 can be connected in series and electrically connected to an external circuit through two conductive conductors 201. These two conductive conductors 201 can be electrically connected to the positive and negative terminals of the corresponding row of second-type light-emitting chips 402, respectively. In this way, the external circuit can simultaneously supply current to the row of second-type light-emitting chips 402 through the corresponding two conductive conductors 201, so as to simultaneously excite the row of light-emitting chips 402 to emit laser light.

[0085] Therefore, the number of conductive conductors 201 embedded inside the insulating casing 200 can be twice the sum of the number of multiple first-type light-emitting chips 401 and the number of rows of at least two rows of second-type light-emitting chips 402.

[0086] It should be noted that, as shown in Figures 13 and 14, the laser may further include: multiple first pin groups 610 and at least one second pin group 620. Each of the multiple first pin groups 610 corresponds one-to-one with a multiple first-type light-emitting chips 401, and each first-type light-emitting chip 401 is electrically connected to two corresponding conductive conductors 201 through a corresponding first pin group 610. Here, a first pin group 610 includes two pins; one end of each pin in a first pin group 610 is electrically connected to the positive and negative terminals of a first-type light-emitting chip 401, respectively, and the other ends of each pin are electrically connected to the two corresponding conductive conductors 201, respectively.

[0087] At least one row of second-type light-emitting chips 402 is electrically connected to at least one second pin group 620 in a one-to-one correspondence. That is, a row of second-type light-emitting chips 402 is electrically connected to a second pin group 620. Here, a second pin group 620 includes two pins. One end of the two pins in a second pin group 620 is electrically connected to the positive and negative terminals of a row of second-type light-emitting chips 402 connected in series, respectively. The other ends of the two pins are electrically connected to two corresponding conductive conductors 201, respectively.

[0088] It should be noted that the pin groups in the laser can be located within the area enclosed by the insulating housing 200, and can be distributed close to the insulating housing 200, so that one end of the conductive conductor 201 embedded inside the insulating housing 200 can be electrically connected to the corresponding pin in the corresponding pin group. Here, the other end of the conductive conductor 201 can be electrically connected to an external circuit.

[0089] In this application, at least three sides of the insulating housing 200 surrounding the plurality of light-emitting chips 400 are conductive lead-out sides. A plurality of conductive conductors 201 embedded inside the insulating housing 200 can be distributed on the three conductive lead-out sides of the insulating housing 200. A plurality of first pin groups 610 and at least one second pin group 620 can be led out through the three conductive lead-out sides of the housing to be electrically connected to the corresponding conductive conductors 201.

[0090] For example, multiple first-type light-emitting chips 401 in a row of first-type light-emitting chips 401 can be arranged along a first direction X. The insulating shell 200 can have two first conductive leads V1 and a second conductive lead V2 disposed opposite each other in the first direction X. In the first direction X, the multiple light-emitting chips 400 are all located between the two first conductive leads V1. In the second direction Y, the second conductive lead V2 is located on the side of the row of first-type light-emitting chips 401 away from the row of second-type light-emitting chips 402. Here, the first direction X and the second direction Y intersect.

[0091] In this application, in a row of first-type light-emitting chips 401, the number of first-color light-emitting chips 4011 can be one more than the number of second-color light-emitting chips 4012. Since multiple first-color light-emitting chips 4011 and multiple second-color light-emitting chips 4012 are arranged alternately, in a row of first-type light-emitting chips 401, the two outermost first-type light-emitting chips 401 are two first-color light-emitting chips 4011.

[0092] The two first pin groups 610, which are electrically connected to the two first color light chips 4011 located on the outermost side, can be led out through the two first conductive lead-out sides V1 respectively, so as to be electrically connected to the corresponding conductive conductors 201 located in the first conductive lead-out side V1.

[0093] The first pin group 610, which is electrically connected to at least one first color light chip 4011 located in the middle, can be led out through the second conductive lead-out side V2 to be electrically connected to the corresponding conductive conductor 201 located in the second conductive lead-out side V2.

[0094] The first pin group 610, which is electrically connected to at least two second color light chips 4012 located in the middle, can be led out through the second conductive lead-out side V2 to be electrically connected to the corresponding conductive conductor 201 located in the second conductive lead-out side V2.

[0095] Two pins in a second pin group 620, which are electrically connected to a row of second-type light-emitting chips 402, can be led out through two first conductive lead-out sides V1 respectively, so as to be electrically connected to the corresponding conductive conductors 201 located in the first conductive lead-out sides V1. Here, the row of second-type light-emitting chips 402 can be located between two pins in the corresponding second pin group 602 in the first direction X.

[0096] It should be noted that the side of the light-emitting chip 400 facing the corresponding conductive connection portion 300 can be electrically connected to the conductive connection portion 300. Here, the side of the light-emitting chip 400 facing the corresponding conductive connection portion 300 can be either the positive or negative electrode of the light-emitting chip 400. This embodiment of the application illustrates this by taking the example of the positive electrode of the light-emitting chip 400 being electrically connected to the corresponding conductive connection portion 300. When the side of the light-emitting chip 400 facing the conductive connection portion 300 is the positive electrode, the side of the light-emitting chip 400 away from the corresponding conductive connection portion 300 is the negative electrode.

[0097] As shown in Figures 13 and 14, the laser may further include multiple wires 630. The light-emitting chip 400 in the laser can be electrically connected to pins in corresponding pin groups via the wires 630. Specifically, the conductive connection portion 300 electrically connected to the positive electrode of the light-emitting chip 400 can be electrically connected to the corresponding pin via the wires 630, and then electrically connected to an external circuit via the corresponding conductive conductor 201. The negative electrode of the light-emitting chip 400 can be electrically connected to the corresponding pin via the wires 630, and then electrically connected to an external circuit via the corresponding conductive conductor 201. In this way, the light-emitting chip 400, with both its positive and negative electrodes electrically connected to the outside, can be connected to an external circuit to excite the light-emitting chip 400 to emit light.

[0098] It should be noted that the distribution positions of the multiple light-emitting chips 400 on the insulating substrate 100 are fixed, and there is a certain distance between the light-emitting chips 400 and the first conductive lead-out side V1 and the second conductive lead-out side V2. Since the first pin group 610 and the second pin group 620 need to be led out through the first conductive lead-out side V1 and the second conductive lead-out side V2, a wire 630 of a certain length is required to connect the conductive connection part 300 electrically connected to the light-emitting chip 400 and the corresponding pin group.

[0099] When the distance between the light-emitting chip 400 and the corresponding pin group is far, a long wire 630 is needed to connect the light-emitting chip 400 and the corresponding pin group. However, the excessive length of the wire 630 usually makes the wire 630 more prone to breakage, resulting in low reliability of the wire 630 and consequently, low reliability of the laser.

[0100] In this application, as shown in FIG13, the distance between the other first-type light-emitting chips 401 in a row of first-type light-emitting chips 401, except for the two first-color light-emitting chips 4011 located on both sides, and the corresponding first pin group 610 located in the second conductive lead-out side V2 is relatively far.

[0101] Therefore, as shown in Figure 15, which is a top view of another laser provided in an embodiment of this application, the laser may further include: a plurality of transition portions 700, which may be disposed on the side of the insulating substrate 100 facing the insulating housing 200. Furthermore, the plurality of transition portions 700 may be located in the second direction Y between a row of first-type light-emitting chips 401 and the second conductive lead-out side V2. Further, in the second direction Y, each of the first-type light-emitting chips 401 in the row of first-type light-emitting chips 401, except for the two first-color light-emitting chips 4011 located on both sides, has two transition portions 700 distributed between them and the second conductive lead-out side V2.

[0102] In this way, the positive and negative terminals of each of the first-type light-emitting chips 401 in a row, except for the two first-color light-emitting chips 4011 located on both sides, can be connected to a transition section 700 via a short wire 630, and then connected to the corresponding pin in the corresponding first pin group 610 via another short wire 630. By setting the transition section 700, the length of the wire 630 can be shortened, the reliability of the wire 630 can be improved, and thus the reliability of the laser can be improved.

[0103] It should be noted that, as shown in Figures 13 and 14, the laser may further include: multiple external leads 640, each corresponding to a plurality of conductive conductors 201. One end of each external lead 640 can be electrically connected to the corresponding conductive conductor 201, and the other end can be connected to an external circuit. Here, the external leads 640 can be soldered to the insulating housing 200 at the location where the corresponding conductive conductor 201 is embedded, so that the external leads 640 can be fixed to the insulating housing 200 and electrically connected to the corresponding conductive conductor 201.

[0104] It should be noted that when the light-emitting chip 400 is directly fixed to the side of the insulating substrate 100 facing the insulating shell 200, the pins and adapters in the above embodiments can also be directly fixed to the side of the insulating substrate 100 facing the insulating shell 200. When the light-emitting chip 400 is fixed to the side of the conductive cover plate 2300 away from the insulating substrate 100 by a heat sink, the pins and adapters in the above embodiments can be insulated from the conductive cover plate 2300 by an insulating heat sink.

[0105] When the light-emitting chip 400 is directly fixed to the side of the insulating substrate 100 facing the insulating housing 200, please refer to FIG16. FIG17 is a top view of another laser provided in the embodiment of this application. The laser may further include: a plurality of first insulating portions 810 and a plurality of second insulating portions 820. The plurality of first insulating portions 810 and the plurality of second insulating portions 820 are all disposed on the side of the insulating substrate 100 facing the insulating housing 200.

[0106] In the laser, multiple first insulating portions 810 correspond one-to-one with multiple conductive connection portions 300, and the first insulating portions 810 can be distributed around the corresponding conductive connection portions 300. Furthermore, the orthographic projection of the conductive connection portion 300 on the insulating substrate 100 can lie within the orthographic projection of the corresponding first insulating portion 810 on the insulating substrate 100. In this way, any two adjacent conductive connection portions 300 on the insulating substrate 100 can be completely separated by the corresponding first insulating portions 810, preventing electrical connection between adjacent conductive connection portions 300 and thus avoiding short circuits between adjacent light-emitting chips 400, thereby improving the reliability of the laser.

[0107] Multiple second insulating portions 820 in the laser can correspond one-to-one with multiple transition portions 700. The second insulating portions 820 can be distributed around the corresponding transition portions 700, and the orthographic projection of the transition portion 700 on the insulating substrate 100 can be located within the area enclosed by the orthographic projection of the corresponding second insulating portion 820 on the insulating substrate 100. In this way, each transition portion 700 can be separated by the corresponding second insulating portion 820 to prevent conduction between adjacent transition portions 700, ensuring that the external circuit can correctly drive the light-emitting chip 400 to emit light, and improving the reliability of the laser.

[0108] Optionally, as shown in Figures 17 and 18, Figure 17 is a top view of a laser provided in another embodiment of this application, and Figure 18 is a cross-sectional view of the laser shown in Figure 17 at point D-D'. The side of the insulating substrate 100 in the laser facing the insulating housing 200 may have a support groove S.

[0109] The laser may further include a reflecting prism 500 located on the light-emitting side of the light-emitting chip 400, with the reflecting surface of the reflecting prism 500 facing the light-emitting side of the light-emitting chip 400. Here, the laser emitted from the light-emitting chip 400 can be parallel to the surface of the insulating substrate 100 facing the insulating housing 200. After the laser emitted from the light-emitting chip 400 strikes the reflecting surface of the reflecting prism 500, the laser's emission direction can be changed from parallel to the surface of the insulating substrate 100 to perpendicular to the surface of the insulating substrate 100 after reflection by the reflecting surface of the reflecting prism 500, and then it can be emitted through the corresponding collimating lens T to realize laser emission.

[0110] Here, after the light-emitting chip 400 is soldered to the side of the insulating substrate 100 facing the insulating shell 200 via the conductive connection part 300, the light-emitting chip 400 is essentially directly fixed to the side of the insulating substrate 100 facing the insulating shell 200. Since the laser emitted by the light-emitting chip 400 has a certain divergence angle, that is, there will be a certain angle between the emission direction of the laser emitted by the light-emitting chip 400 and the side of the insulating substrate 100 facing the insulating shell 200, on the one hand, the laser emitted by the light-emitting chip 400 will be directed towards the direction of the insulating substrate 100 facing the insulating shell 200, and on the other hand, the laser emitted by the light-emitting chip 400 will be directed towards the direction of the insulating substrate 100 away from the insulating shell 200.

[0111] Here, to ensure that the laser emitted along the direction away from the insulating shell 200 from the insulating substrate 100, the laser emitted at the maximum divergence angle is not blocked by the insulating substrate 100, the reflecting prism 500 needs to be placed in the groove S of the insulating substrate 100. This ensures that the laser emitted along the direction away from the insulating shell 200 from the insulating substrate 100 is not blocked by the insulating substrate 100, and thus the laser emitted from the light-emitting chip 400 can all be directed towards the reflecting surface of the reflecting prism 500, and after being reflected by the reflecting surface of the reflecting prism 500, it is emitted in a direction perpendicular to the insulating substrate 100. This reduces the loss of laser emitted from the light-emitting chip 400 and improves the luminous efficiency of the light-emitting chip 400.

[0112] It should be noted that the depth of the groove S in the insulating substrate 100 needs to be less than the thickness of the insulating substrate 100, and greater than the critical depth. Here, the critical depth can be the depth at which the light rays emitted from the light-emitting chip 400 at the maximum angle just enter the bearing groove S. This ensures that all the laser light emitted from the light-emitting chip 400 can be reflected by the reflecting surface of the reflecting prism 500, thus guaranteeing the luminous efficiency of the light-emitting chip 400.

[0113] It should also be noted that the depth of the groove S in the insulating substrate 100 can be related to the maximum divergence angle of the laser emitted by the light-emitting chip 400 and the distance between the light-emitting chip 400 and the reflecting prism 500. For example, the maximum divergence angle of the laser emitted by the light-emitting chip 400 can be 28°. The depth of the groove S in the insulating substrate 100 can be determined based on the maximum emission angle of the light-emitting chip 400 and the distance between the light-emitting chip 400 and the reflecting prism 500.

[0114] In summary, this application provides a laser, including an insulating substrate, an insulating shell, and multiple light-emitting chips. The insulating substrate and the insulating shell are integrally manufactured, eliminating the need for additional connecting parts, resulting in a smaller overall size of the laser. Furthermore, by providing fluid channels within the insulating substrate, the heat generated by the laser is dissipated by heat-dissipating fluid located within these channels. Compared to passive cooling systems, this is not limited by the location of the heat sink; compared to macro-channel water cooling systems, the overall size of the cooling system for this laser is smaller and the heat exchange efficiency is higher; and compared to semiconductor cooling systems, the cost is lower. Therefore, the laser in this application, when dissipated by external heat dissipation components, has the advantages of unrestricted location, smaller size, higher heat exchange efficiency, and lower cost.

[0115] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0116] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A laser, characterized in that, include: Insulating substrate, insulating housing, and multiple light-emitting chips; The insulating tube shell is disposed on one side of the insulating substrate, and the insulating substrate and the insulating tube shell are an integrally molded structure made of insulating material; The plurality of light-emitting chips are distributed on one side of the insulating substrate where the insulating shell is disposed, and the plurality of light-emitting chips are distributed within the area enclosed by the insulating shell; The insulating substrate has a fluid channel, and the side of the insulating substrate facing away from the insulating shell has a fluid inlet and a fluid outlet communicating with the fluid channel.

2. The laser according to claim 1, characterized in that, The fluid channel includes: multiple branch channels, and a main channel for connecting the multiple branch channels; the fluid inlet and the fluid outlet are both connected to the main channel; The plurality of branch channels correspond to the plurality of light-emitting chips. The orthographic projection of the light-emitting chip on the side of the insulating substrate away from the insulating shell overlaps with the orthographic projection of the corresponding branch channel on the side of the insulating substrate away from the insulating shell. The extending direction of the branch channel is parallel to the light emission direction of the light-emitting chip.

3. The laser according to claim 1, characterized in that, The laser further includes: an adapter plate, which is located on the side of the insulating substrate facing away from the insulating tube shell and is fixedly connected to the insulating substrate; The adapter plate has a first connecting channel and a second connecting channel that are separately configured. The first connecting channel is connected to the fluid inlet, and the second connecting channel is connected to the fluid outlet. The first connecting channel and the second connecting channel are used to connect to external heat dissipation components.

4. The laser according to claim 3, characterized in that, The laser further includes a fixing member, which engages with the edge of the insulating substrate and is fixedly connected to the adapter plate.

5. The laser according to any one of claims 1-4, characterized in that, The insulating substrate has a groove on the side facing the insulating tube shell; The laser may also include: a cover plate and multiple heat sinks; The cover plate is fixedly connected to the side of the insulating substrate facing the insulating tube shell, so that the cover plate can cover the groove to form the fluid channel; The plurality of heat sinks are fixed to the side of the cover plate away from the insulating substrate, and the plurality of heat sinks correspond one-to-one with the plurality of light-emitting chips. The light-emitting chip is fixedly connected to the side of the corresponding heat sink away from the insulating substrate.

6. The laser according to any one of claims 1-4, characterized in that, The insulating substrate has the fluid channel inside; The laser further includes: a plurality of separately disposed conductive connection portions; the plurality of conductive connection portions are in direct contact with the side of the insulating substrate facing the insulating shell, and are distributed within the area enclosed by the insulating shell; The plurality of light-emitting chips correspond one-to-one with the plurality of conductive connection portions, and the light-emitting chip is fixedly connected to the side of the corresponding conductive connection portion away from the insulating substrate.

7. The laser according to claim 6, characterized in that, The insulating substrate has a bearing groove on the side facing the insulating tube shell; The laser further includes a reflecting prism located on the light-emitting side of the light-emitting chip, wherein the reflecting surface of the reflecting prism faces the light-emitting side of the light-emitting chip; The reflecting prism is disposed within the support groove, and in a direction perpendicular to the insulating substrate, a portion of the reflecting prism is located within the support groove, while the other portion of the reflecting prism is located outside the support groove.

8. The laser according to claim 6, characterized in that, The laser further includes: a plurality of first insulating portions, all of which are disposed on the side of the insulating substrate facing the insulating shell; The plurality of first insulating portions correspond one-to-one with the plurality of conductive connecting portions. The first insulating portions are distributed around the corresponding conductive connecting portions, and the orthographic projection of the conductive connecting portion on the insulating substrate is located within the area enclosed by the orthographic projection of the corresponding first insulating portion on the insulating substrate.

9. The laser according to any one of claims 1-4 and 7-8, characterized in that, Multiple conductive conductors are embedded inside the insulating shell. The conductive conductors penetrate the insulating shell and are in direct contact with it. One end of the conductive conductor is used to electrically connect to the light-emitting chip, and the other end is used to electrically connect to an external circuit.

10. The laser according to claim 9, characterized in that, The laser further includes: a plurality of adapters; the plurality of adapters are disposed on the side of the insulating substrate facing the insulating housing; at least a portion of the plurality of light-emitting chips are electrically connected to the conductive conductor through the adapters.

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