Heat dissipation assembly, domain controller and movable platform

Abstract

Provided in the present application are a heat dissipation assembly, a domain controller and a movable platform. The heat dissipation assembly comprises a housing, wherein a fan and a plurality of heat dissipation fins are provided in the housing; the housing comprises a bottom wall; the plurality of heat dissipation fins are all located on the bottom wall and are arranged at intervals on the outer peripheral side of the fan; an air duct is formed between every two adjacent heat dissipation fins; the bottom wall is further provided with a heat-conducting portion; and within a plane parallel to the bottom wall, the projection of the fan is located within the projection range of the heat-conducting portion. The heat-conducting portion comprises at least one heat dissipation column and a plurality of guide fins, wherein the heat dissipation column is arranged close to the center of the fan; the plurality of guide fins are arranged at intervals around the heat dissipation column; at least some of the guide fins are connected to the heat dissipation fins; and within the plane parallel to the bottom wall, the projections of the guide fins are arc-shaped. The present application facilitates a reduction in air resistance, thereby reducing the energy loss of the fan and improving the heat dissipation performance of the heat dissipation assembly.

Description

Thermal components, domain controllers and mobile platforms

[0001] This application claims priority to Chinese Patent Application No. 202520568723.5, filed on March 27, 2025, entitled "Heat Dissipation Assembly, Domain Controller and Mobile Platform", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to domain controller heat dissipation technology, and more particularly to a heat dissipation component, a domain controller, and a mobile platform. Background Technology

[0003] A domain controller is a critical network server used to manage and control computers, users, and resources within a domain. For example, in the automotive field, a domain controller manages and controls various vehicle functions, including but not limited to powertrain, chassis control, and smart cockpit information processing. Domain controllers integrate multiple heat-generating components, such as chips; therefore, they are equipped with corresponding heat dissipation components that contact these components to dissipate heat as quickly as possible, ensuring the domain controller maintains optimal operating conditions.

[0004] In related technical solutions, the heat dissipation component installed within the domain controller includes a housing, inside which a fan and multiple heat dissipation fins are housed. The fan is located above the heat-generating devices, and the multiple heat dissipation fins are spaced apart on the outer periphery of the fan, forming an airflow channel between adjacent heat dissipation fins. The heat dissipation component also includes guide fins located below the fan, which are used to direct the airflow blown by the fan into the airflow channel.

[0005] However, the solution using related technologies will cause some wind resistance when guiding the fins, resulting in energy loss and poor heat dissipation effect of the heat dissipation component. Summary of the Invention

[0006] In order to overcome the above-mentioned defects in related technologies, the purpose of this application is to provide a heat dissipation component, a domain controller and a mobile platform. This application is beneficial to reducing wind resistance, thereby reducing the energy loss of the fan and improving the heat dissipation performance of the heat dissipation component.

[0007] On the one hand, this application provides a heat dissipation component, including a housing, a fan and a plurality of heat dissipation fins are provided inside the housing, the housing includes a bottom wall, the plurality of heat dissipation fins are all located on the bottom wall and are spaced apart on the outer periphery of the fan, and an air duct is formed between two adjacent heat dissipation fins;

[0008] The bottom wall is also provided with a heat-conducting part. In a plane parallel to the bottom wall, the projection of the fan is located within the projection range of the heat-conducting part. The heat-conducting part includes at least one heat dissipation column and multiple guide fins. The heat dissipation column is located close to the center of the fan. The multiple guide fins are spaced around the heat dissipation column. At least some of the guide fins are connected to the heat dissipation fins. In a plane parallel to the bottom wall, the projection of the guide fins is arc-shaped.

[0009] In one possible implementation, the guide fins include a plurality of first guide fins and a plurality of second guide fins. The first end of the first guide fin is connected to the heat dissipation fin, and the second end of the first guide fin is a free end. The first end of the second guide fin is connected to the heat dissipation fin, and the second end of the second guide fin is a free end. The second end of the first guide fin is closer to the center of the fan than the second end of the second guide fin.

[0010] In one possible implementation, the guide fins further include several third guide fins, which are located between two adjacent first guide fins or two adjacent second guide fins, or between adjacent first guide fins and second guide fins; the third guide fins are disposed close to the heat dissipation fins, and both ends of the third guide fins are free ends.

[0011] In one possible implementation, the heat-conducting part includes a heat dissipation column, and the guide fins include a plurality of fourth guide fins. The first end of the fourth guide fins is connected to the heat dissipation fins, or the first end of the fourth guide fins is a free end, and the second end of the fourth guide fins is connected to the heat dissipation column.

[0012] In one possible implementation, the heat-conducting part includes a plurality of heat dissipation columns, which are arranged in several loops around the center of the fan.

[0013] In one possible implementation, multiple guide fins are bent toward the same side in the circumferential direction of the fan.

[0014] In one possible implementation, the heat-conducting part further includes a protrusion, on which both the heat dissipation column and the guide fin are disposed, and the height of the protrusion gradually decreases from the center of the fan to the edge of the fan.

[0015] In one possible implementation, the protrusion, the heat dissipation column, the guide fin, and the heat dissipation fin are integrally formed with the outer casing.

[0016] In one possible implementation, the distance between the top of the heat dissipation column and the bottom wall is 8-9 mm, and the distance between the top of the guide fin and the bottom wall is 8-9 mm.

[0017] In one possible implementation, the diameter of the heat dissipation column is 2-3 mm, and the width of the guide fin is 1-2 mm.

[0018] In one possible implementation, the line connecting the first end of the guide fin and the projection of the center of the fan onto the bottom wall, and the line connecting the first end of the adjacent guide fin and the projection of the center of the fan onto the bottom wall, form an angle of 5-15°.

[0019] In one possible implementation, the radius difference between two adjacent heat dissipation pillars is 5.5-6.5 mm.

[0020] On the other hand, this application provides a domain controller including the heat dissipation components described above.

[0021] In another aspect, this application provides a mobile platform, including the domain controller described above.

[0022] This application provides a heat dissipation component, a domain controller, and a mobile platform. The heat dissipation component includes a housing, within which a fan and multiple heat dissipation fins are disposed. The housing includes a bottom wall, and the multiple heat dissipation fins are all located on the bottom wall and spaced apart on the outer periphery of the fan. An air duct is formed between two adjacent heat dissipation fins. A heat-conducting part is also provided on the bottom wall. In a plane parallel to the bottom wall, the projection of the fan is located within the projection range of the heat-conducting part. The heat-conducting part includes at least one heat dissipation column and multiple guide fins. The heat dissipation column is located near the center of the fan, and the multiple guide fins are spaced apart around the heat dissipation column. At least some of the guide fins are connected to the heat dissipation fins. In a plane parallel to the bottom wall, the projection of the guide fins is arc-shaped. The heat-conducting part of this application includes at least one heat dissipation column and multiple arc-shaped guide fins. The heat dissipation column can disrupt the originally smooth flow when the cold air comes into contact with the surface of the heat dissipation column, generating small vortex-like turbulence. The arc-shaped guide fins make the angle transition of the fins more linear and smooth, avoiding the situation where the cold air hits the fins vertically and causes energy loss, and can effectively reduce wind resistance. Some of the guide fins are also connected to the heat dissipation fins, which helps to increase the air volume entering the air duct and improve the heat dissipation performance of the heat dissipation component. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 is a simulation diagram of the flow performance of a heat dissipation component in the related technology;

[0025] Figure 2 shows a simulation diagram of the flow performance of another heat dissipation component in the related technology;

[0026] Figure 3 is an isometric view of a heat dissipation assembly provided in an embodiment of this application;

[0027] Figure 4 is a top view of a heat dissipation assembly provided in an embodiment of this application;

[0028] Figure 5 is a magnified view of a portion of Figure 4;

[0029] Figure 6 is a partial sectional view of Figure 3;

[0030] Figure 7 is a simulation diagram of the flow performance of a heat dissipation component provided in an embodiment of this application;

[0031] Figure 8 is a top view of a heat dissipation assembly provided in another embodiment of this application;

[0032] Figure 9 is a magnified view of a portion of Figure 8.

[0033] Reference numerals: 100-outer shell; 110-bottom wall; 200-heat dissipation fins; 300-heat conduction part; 310-heat dissipation pillar; 320-guide fins; 321-first guide fin; 322-second guide fin; 323-third guide fin; 324-fourth guide fin; 330-protrusion; X-first direction; Y-second direction. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this application, but not all embodiments.

[0035] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0036] As described in the background section, in the solutions of related technologies, the energy loss of the heat dissipation component is relatively large, resulting in poor heat dissipation effect of the heat dissipation component.

[0037] Specifically, as shown in Figure 1, in a heat dissipation component of the related technology, a plurality of heat dissipation fins 200 are provided on the bottom wall 110 of the outer casing. The plurality of heat dissipation fins 200 include several heat dissipation fins 200 spaced apart along a first direction X and several heat dissipation fins 200 spaced apart along a second direction Y, and an air duct is formed between two adjacent heat dissipation fins 200; wherein, the first direction X and the second direction Y are perpendicular to each other. A plurality of guide fins 320 are also provided in the area of ​​the bottom wall 110 corresponding to the fan. The plurality of guide fins 320 are all arranged along the first direction X, and the guide fins 320 are used to introduce the air from the fan into the surrounding air ducts.

[0038] In the simulation diagram of the heat dissipation component's flow performance shown in Figure 1, the colors of the heat dissipation component—red, yellow, green, and blue—represent a gradual decrease in temperature, and the arrow colors—red, yellow, green, and blue—represent a gradual decrease in airflow speed. As shown in Figure 1, the air blown out by the fan generally flows along the first direction X towards the air ducts on both sides. The air blown out by the fan is blocked by the guide fins 320, resulting in almost no airflow out of the air ducts in the second direction Y. Therefore, the temperature in the area corresponding to the heat dissipation component and the fan is relatively high, and the temperature around the heat dissipation component (especially the area on the right side of the figure) is also relatively high, resulting in poor heat dissipation.

[0039] Figure 2 shows another heat dissipation component of the related technology. Unlike the heat dissipation component shown in Figure 1 above, in this solution, multiple guide fins 320 in the area corresponding to the fan are evenly distributed circumferentially on the bottom wall 110, so as to better introduce the air blown out by the fan into the surrounding air duct.

[0040] In the simulation diagram of the heat dissipation component's flow performance shown in Figure 2, the colors of the heat dissipation component (red, yellow, green, blue) represent a gradual decrease in temperature, and the arrow colors (red, yellow, green, blue) represent a gradual decrease in airflow speed. As shown in Figure 2, the air blown out by the fan flows uniformly in the circumferential direction. Compared to the scheme shown in Figure 1, the scheme in Figure 2 makes full use of the airflow channels in the first direction X and the second direction Y, thereby improving the heat dissipation efficiency to a certain extent. However, since the air blown out by the fan diffuses gently in the circumferential direction after contacting the bottom wall 110, some air will still hit the guide fins 320 vertically, resulting in some energy loss. Furthermore, the gaps between the guide fins 320 and the surrounding heat dissipation fins 200 also cause some energy loss, resulting in a relatively high temperature in the area corresponding to the heat dissipation component and the fan, and a still poor heat dissipation effect.

[0041] In view of this, the embodiments of this application aim to provide a heat dissipation component, a domain controller, and a mobile platform. By setting at least one heat dissipation column and multiple arc-shaped guide fins, the heat dissipation column can disrupt the originally smooth flow of cold air when it comes into contact with the surface of the heat dissipation column, generating small vortex-like turbulence; the arc-shaped guide fins make the angle transition of the fins more linear and smooth, avoiding the situation where cold air hits the fins vertically and causes energy loss, and can effectively reduce wind resistance, thereby helping to increase the air volume entering the air duct and improve the heat dissipation performance of the heat dissipation component.

[0042] The embodiments of this application will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can gain a more detailed understanding of the contents of this application.

[0043] Referring to Figures 3-9, this embodiment provides a heat dissipation component, including a housing 100. The housing 100 contains a fan (not shown) and multiple heat dissipation fins 200. It is understood that Figure 3 only shows a portion of the structure of the housing 100. The housing 100 includes a bottom wall 110, and the multiple heat dissipation fins 200 are all located on the bottom wall 110 and spaced apart on the outer periphery of the fan. An airflow channel is formed between adjacent heat dissipation fins 200. Specifically, the multiple heat dissipation fins 200 include several heat dissipation fins 200 spaced apart along a first direction X and several heat dissipation fins 200 spaced apart along a second direction Y, wherein the first direction X and the second direction Y are perpendicular to each other. In this embodiment, the fan can be fixed to the bottom wall 110 using bolts, screws, or other fasteners, forming a certain gap between the fan and the bottom wall 110 after fixing. In this embodiment, the fan can be, for example, an axial flow fan. The air blown by the fan is directed towards the bottom wall 110 in a direction perpendicular to the bottom wall 110, and after contacting the bottom wall 110, the air diffuses and flows in all directions.

[0044] A heat-conducting part 300 is also provided on the bottom wall 110. In a plane parallel to the bottom wall 110, the projection of the fan lies within the projection range of the heat-conducting part 300; that is, the heat-conducting part 300 corresponds to the fan and is located within the gap between the fan and the bottom wall 110, allowing the air blown by the fan to directly contact the heat-conducting part 300. It can be understood that the heat-conducting part 300 is used to come into contact with the area of ​​highest heat generation within the electronic device, thereby better dissipating heat. The heat-conducting part 300 includes at least one heat dissipation column 310 and multiple guide fins 320. The heat dissipation column 310 is located near the center of the fan and can be, for example, cylindrical. Multiple guide fins 320 are spaced around the heat dissipation column 310, and at least some of the guide fins 320 are connected to the heat dissipation fins 200, thereby better guiding air into the air duct. In a plane parallel to the bottom wall 110, the projection of the guide fin 320 is arc-shaped, which avoids the energy loss caused by cold air hitting the fin vertically, and helps to reduce wind resistance.

[0045] In this embodiment, the density of the guide fins 320 can be greater than the density of the surrounding heat dissipation fins 200, thereby improving the heat dissipation effect. The height of the guide fins 320 is lower than the height of the surrounding heat dissipation fins 200, so that after the fan is installed, the overall height of the fan and the heat conduction part 300 is roughly the same as the height of the heat dissipation fins 200, so that the fan will not protrude from the heat dissipation fins 200, maintaining the overall aesthetics.

[0046] As described above, the heat-conducting part 300 of this embodiment includes at least one heat dissipation column 310 and multiple arc-shaped guide fins 320. The heat dissipation column 310 can disrupt the originally smooth flow of cold air when it comes into contact with the surface of the heat dissipation column 310, generating fine vortex-like turbulence. The arc-shaped guide fins 320 make the angle transition of the fins more linear and smooth, avoiding the situation where cold air hits the fins vertically and causes energy loss, and can effectively reduce wind resistance. Some of the guide fins 320 are also connected to the heat dissipation fins 200, which helps to increase the airflow into the air duct and improve the heat dissipation performance of the heat dissipation component.

[0047] Referring to Figures 4 and 8, the guide fin 320 of this embodiment includes several first guide fins 321 and several second guide fins 322. The first end of the first guide fin 321 is connected to the heat dissipation fin 200, and the second end of the first guide fin 321 is a free end. The first end of the second guide fin 322 is connected to the heat dissipation fin 200, and the second end of the second guide fin 322 is a free end. The second end of the first guide fin 321 is closer to the center of the fan than the second end of the second guide fin 322.

[0048] In this embodiment, the arrangement of the plurality of first guide fins 321 and the plurality of second guide fins 322 can be determined as needed. For example, the plurality of first guide fins 321 and the plurality of second guide fins 322 can be distributed alternately along the circumference of the fan. It is understood that, since the size near the center of the fan is small, in this embodiment, the length of the first guide fin 321 is set to be greater than the length of the second guide fin 322, so that the first guide fin 321 is closer to the center of the fan. This allows for a reasonable arrangement of the first guide fins 321 and the second guide fins 322 within a limited space, ensuring that each heat dissipation fin 200 can be connected to a guide fin 320, thereby increasing the airflow into the air duct and improving the heat dissipation performance of the heat dissipation component.

[0049] Furthermore, the guide fin 320 in this embodiment also includes several third guide fins 323, which are located between two adjacent first guide fins 321 or two adjacent second guide fins 322. Alternatively, the third guide fin 323 is located between adjacent first guide fins 321 and second guide fins 322. The third guide fins 323 are disposed close to the heat dissipation fins 200, and both ends of the third guide fins 323 are free ends.

[0050] Understandably, due to the large size of the area far from the center of the fan, the number of first guide fins 321 and second guide fins 322 cannot completely fill this area, resulting in large gaps between adjacent fins. Therefore, in this embodiment, a third guide fin 323 is provided in this area to fill it, thereby increasing the density of the guide fins, enhancing the airflow effect, and thus improving the heat dissipation performance of the heat dissipation component.

[0051] Please refer to Figure 4. In one possible implementation, the heat-conducting part 300 of this embodiment includes a heat dissipation column 310, and the guide fin 320 further includes several fourth guide fins 324. The first end of the fourth guide fin 324 is connected to the heat dissipation fin 200, or the first end of the fourth guide fin 324 is a free end, and the second end of the fourth guide fin 324 is connected to the heat dissipation column 310.

[0052] This embodiment improves the passive heat dissipation area near the center of the fan by setting multiple fourth guide fins 324 connected to the heat dissipation column 310. The area with the highest heat generation in the electronic device can transfer more heat to the heat dissipation column 310 and multiple fourth guide fins 324 through heat conduction, thereby improving the heat dissipation performance of the heat dissipation component.

[0053] Please refer to Figure 8. In another possible implementation, the heat-conducting part 300 of this embodiment includes a plurality of heat dissipation columns 310, which are arranged in several circles around the center of the fan.

[0054] In this embodiment, by setting several rings of heat dissipation columns 310 near the center of the fan, the air blown out by the fan can be disrupted when it comes into contact with the surface of the heat dissipation columns 310, generating small vortex-like turbulence in the area, making the air flow in the area disordered, generating more heat exchange, and thus improving the heat dissipation performance of the heat dissipation component.

[0055] Furthermore, in this embodiment, the outermost heat dissipation column 310 can also be connected to some of the guide fins 320, which helps to guide the heat absorbed by the heat dissipation column 310 to the surrounding guide fins 320 more quickly, thereby improving the heat dissipation effect near the center of the fan.

[0056] Please refer to Figures 4 and 8. In this embodiment, multiple guide fins 320 are bent toward the same side in the circumferential direction of the fan.

[0057] In this embodiment, the multiple guide fins 320 can be bent in a clockwise direction, for example. By setting the multiple guide fins 320 to bend towards the same side, it can be ensured that the air duct size between adjacent guide fins 320 is basically equal, thereby making the air duct distribution more uniform and improving the heat dissipation performance of the heat dissipation component. Furthermore, in this embodiment, the bending direction of the guide fins 320 is consistent with the rotation direction of the fan blades in the fan, which helps to reduce wind resistance and improve the heat dissipation effect.

[0058] Please continue to refer to Figures 3 and 6. The heat-conducting part 300 in this embodiment also includes a protrusion 330. The heat dissipation column 310 and the guide fin 320 are all disposed on the protrusion 330. The height of the protrusion 330 gradually decreases from the center of the fan to the edge of the fan.

[0059] This embodiment uses a protrusion 330 whose height gradually decreases in all directions to better guide the airflow blown by the fan in all directions, which helps to improve the heat dissipation performance of the heat dissipation component.

[0060] In this embodiment, the protrusion 330, heat dissipation column 310, guide fin 320, heat dissipation fin 200 are integrated with the outer shell 100.

[0061] For example, the protrusion 330, heat dissipation column 310, guide fin 320, heat dissipation fin 200 and the outer shell 100 can be integrally die-cast by die casting, which helps to improve production efficiency.

[0062] In this embodiment, the distance between the top of the heat dissipation column 310 and the bottom wall 110 is 8-9 mm. The distance between the top of the guide fin 320 and the bottom wall 110 is 8-9 mm.

[0063] Table 1. Temperature of electronic devices corresponding to heat dissipation columns and guide fins of different heights.

[0064] As can be seen from Table 1 above, this embodiment takes into account existing manufacturing processes and costs, and sets the height of the heat sink 310 and the height of the guide fins 320 within the above range. This ensures that the electronic device has a lower temperature, that is, the heat dissipation speed of the heat dissipation component is faster, and the heat dissipation component has better heat dissipation performance.

[0065] Please refer to Figure 5. In this embodiment, the diameter D of the heat dissipation column 310 is 2-3 mm, and the width T of the guide fin 320 is 1-2 mm.

[0066] Table 2 Temperature of Electronic Devices Corresponding to Different Heatsink Diameters

[0067] As can be seen from Table 2 above, this embodiment takes into account existing manufacturing processes and costs, and sets the diameter of the heat sink 310 and the width of the guide fins 320 within the above range. This ensures that the electronic device has a lower temperature, that is, the heat dissipation speed of the heat dissipation component is faster, and the heat dissipation component has better heat dissipation performance.

[0068] Please refer to Figure 5. In this embodiment, the line L1 connecting the first end of the guide fin 320 and the projection of the center of the fan on the bottom wall 110, and the line L2 connecting the first end of the adjacent guide fin 320 and the projection of the center of the fan on the bottom wall 110, have an included angle α of 5-15°.

[0069] Table 3. Temperature of electronic devices corresponding to different guide fin angles.

[0070] As can be seen from Table 3 above, this embodiment takes into account existing manufacturing processes and costs, and sets the angle α between two adjacent guide fins 320 within the above range, which can ensure that the electronic device has a lower temperature, that is, the heat dissipation speed of the heat dissipation component is faster, and the heat dissipation component has better heat dissipation performance.

[0071] Please refer to Figure 9. In this embodiment, the radius difference r2-r1 between two adjacent heat dissipation pillars 310 is 5.5-6.5mm.

[0072] In this embodiment, taking into account existing manufacturing processes and costs, the radius difference between two adjacent heat dissipation columns 310 is set within the above-mentioned range. This ensures that the airflow in this area has good turbulence performance, generating more heat exchange, which is beneficial to improving the heat dissipation performance of the heat dissipation component.

[0073] Figure 7 shows a simulation diagram of the flow performance of a heat dissipation component according to an embodiment of this application. The colors of the heat dissipation component (red, yellow, green, blue) represent a gradual decrease in temperature, and the arrow colors (red, yellow, green, blue) represent a gradual decrease in wind speed. As shown in Figure 7, the air blown from the fan flows uniformly around the perimeter. Compared to the scheme shown in Figure 2, the airflow entering the surrounding air ducts in this embodiment is significantly increased, and the temperature of the area corresponding to the heat dissipation component and the fan, as well as the temperature around the heat dissipation component, is significantly reduced. Measurements show that the heat dissipation component of this embodiment can reduce the temperature of electronic devices by more than 3°C compared to the scheme shown in Figure 2, thereby significantly improving the heat dissipation performance of the heat dissipation component.

[0074] This embodiment also provides a domain controller, including the above-described heat dissipation component.

[0075] It is understood that the domain controller in this embodiment uses the above-mentioned heat dissipation components, which can improve the heat dissipation capacity of the domain controller and thus keep the domain controller in good working condition.

[0076] This embodiment also provides a mobile platform, including the domain controller described above.

[0077] Specifically, the mobile platform in this embodiment can be, for example, a vehicle, a drone, or a robot. Because of the domain controller described above, the heat dissipation capacity of the mobile platform can be improved, allowing it to maintain optimal operating conditions.

[0078] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0079] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0080] It should be noted that in the description of this application, the terms "first" and "second" are used only for convenience in describing different components and should not be construed as indicating or implying a sequential relationship, relative importance, or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of those features.

[0081] The embodiments or implementation methods in this application are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0082] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with an embodiment or example that are included in at least one embodiment or example of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation component, characterized in that, The device includes an outer casing, inside which a fan and multiple heat dissipation fins are provided. The outer casing includes a bottom wall, on which the multiple heat dissipation fins are located and spaced apart on the outer periphery of the fan. An air duct is formed between two adjacent heat dissipation fins. The bottom wall is also provided with a heat-conducting part. In a plane parallel to the bottom wall, the projection of the fan is located within the projection range of the heat-conducting part. The heat-conducting part includes at least one heat dissipation column and multiple guide fins. The heat dissipation column is located close to the center of the fan. The multiple guide fins are spaced around the heat dissipation column. At least some of the guide fins are connected to the heat dissipation fins. In a plane parallel to the bottom wall, the projection of the guide fins is arc-shaped.

2. The heat dissipation assembly according to claim 1, characterized in that, The guide fins include several first guide fins and several second guide fins. The first end of the first guide fin is connected to the heat dissipation fin, and the second end of the first guide fin is a free end. The first end of the second guide fin is connected to the heat dissipation fin, and the second end of the second guide fin is a free end. The second end of the first guide fin is closer to the center of the fan than the second end of the second guide fin.

3. The heat dissipation assembly according to claim 2, characterized in that, The guide fins also include several third guide fins, which are located between two adjacent first guide fins or two adjacent second guide fins, or between adjacent first guide fins and second guide fins; the third guide fins are located close to the heat dissipation fins, and both ends of the third guide fins are free ends.

4. The heat dissipation component according to any one of claims 1-3, characterized in that, The heat-conducting part includes a heat dissipation column, and the guide fins include a plurality of fourth guide fins. The first end of the fourth guide fin is connected to the heat dissipation fins, or the first end of the fourth guide fin is a free end, and the second end of the fourth guide fin is connected to the heat dissipation column.

5. The heat dissipation component according to any one of claims 1-3, characterized in that, The heat-conducting part includes a plurality of heat dissipation columns, which are arranged in several circles around the center of the fan.

6. The heat dissipation assembly according to claim 1, characterized in that, The multiple guide fins are bent toward the same side in the circumferential direction of the fan.

7. The heat dissipation assembly according to claim 1, 2, 3 or 6, characterized in that, The heat-conducting part also includes a protrusion, and the heat dissipation column and the guide fin are both disposed on the protrusion. The height of the protrusion gradually decreases from the center of the fan to the edge of the fan.

8. The heat dissipation assembly according to claim 7, characterized in that, The protrusion, the heat dissipation column, the guide fin, and the heat dissipation fin are integrated with the outer shell.

9. The heat dissipation assembly according to claim 7, characterized in that, The distance between the top of the heat dissipation column and the bottom wall is 8-9 mm, and the distance between the top of the guide fin and the bottom wall is 8-9 mm.

10. The heat dissipation assembly according to claim 7, characterized in that, The diameter of the heat dissipation column is 2-3 mm, and the width of the guide fin is 1-2 mm.

11. The heat dissipation assembly according to claim 7, characterized in that, The angle between the line connecting the first end of the guide fin and the projection of the center of the fan onto the bottom wall, and the line connecting the first end of the adjacent guide fin and the projection of the center of the fan onto the bottom wall, is 5-15°.

12. The heat dissipation assembly according to claim 5, characterized in that, The radius difference between two adjacent heat dissipation pillars is 5.5-6.5 mm.

13. A domain controller, characterized in that, Includes the heat dissipation component as described in any one of claims 1-12.

14. A mobile platform, characterized in that, This includes the domain controller as described in claim 13.

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