Vehicle, and measurement method for vehicle

Abstract

The present application relates to the technical field of vehicles. Provided are a vehicle, and a measurement method for the vehicle, which are configured to solve the problem of some functions of existing vehicles being prone to failure due to cable failure. The vehicle comprises a plurality of electrical systems and a plurality of circuit board assemblies. The plurality of circuit board assemblies are electrically connected to the plurality of electrical systems, and the plurality of electrical systems are electrically connected by means of the plurality of circuit board assemblies. The vehicle utilizes the circuit board assemblies to connect the electrical systems, thereby preventing vehicle function failure caused by cable failure.

Description

Vehicles and Vehicle Inspection Methods

[0001] This disclosure claims priority to Chinese patent application No. 202510378532.7, filed on March 28, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of vehicle technology, and more particularly to a vehicle and a method for detecting a vehicle. Background Technology

[0003] As people's living standards improve, cars have gradually become an essential means of transportation for most families. Among them, with the continuous development of vehicle electrification, electric vehicles have gradually become the primary choice for users. Summary of the Invention

[0004] In a first aspect, embodiments of this application provide a vehicle including multiple electrical systems and multiple circuit board assemblies. The multiple circuit board assemblies are electrically connected to the multiple electrical systems, and the multiple electrical systems are electrically connected through the multiple circuit board assemblies.

[0005] In one possible implementation, the circuit board assembly includes a plurality of first circuit boards. The plurality of first circuit boards form a receiving space with openings at both ends.

[0006] In one possible implementation, the circuit board assembly further includes a connecting busbar. The connecting busbar is connected to the first circuit board and is located on the periphery of the receiving space enclosed by the plurality of first circuit boards.

[0007] In one possible implementation, the circuit board assembly further includes at least one second circuit board. The second circuit board is located within the receiving space and is connected to the first circuit board.

[0008] In one possible implementation, the vehicle also includes connecting pipes. The connecting pipes extend within the receiving space.

[0009] In one possible implementation, the vehicle also includes a connecting cable. The connecting cable is routed within the receiving space.

[0010] In one possible implementation, the vehicle also includes a filler material. The filler material fills the accommodating space.

[0011] In one possible implementation, the circuit board assembly further includes a housing. An installation space is formed inside the housing. A plurality of first circuit boards are located within the installation space.

[0012] In one possible implementation, the housing has snap-fit ​​grooves. The vehicle also includes a body. The body includes a beam structure. A portion of the beam structure snaps into the snap-fit ​​grooves and connects to the housing.

[0013] In one possible implementation, the vehicle also includes multiple temperature sensors. These temperature sensors are disposed on multiple circuit board assemblies for detecting the temperature of the circuit board assemblies.

[0014] Secondly, embodiments of this application provide a vehicle detection method, including the steps of: detecting the temperature of multiple circuit board assemblies; and determining whether the temperature of the multiple circuit board assemblies is abnormal.

[0015] In one possible implementation, after detecting the temperature of multiple circuit board assemblies, the vehicle detection method further includes: comparing the temperatures of the multiple circuit board assemblies pairwise to obtain multiple sets of temperature difference values. Determining whether the temperatures of the multiple circuit board assemblies are abnormal includes: comparing the multiple sets of temperature difference values ​​with preset temperature difference values ​​respectively; if the temperature difference value is greater than the preset temperature difference value, the temperature of the circuit board assembly is abnormal.

[0016] In one possible implementation, determining whether the temperature of multiple circuit board assemblies is abnormal includes: comparing the temperature of the multiple circuit board assemblies with a preset temperature; if the temperature of a circuit board assembly is greater than the preset temperature, then the temperature of the circuit board assembly is abnormal. Attached Figure Description

[0017] Figure 1 is a structural schematic diagram of a vehicle according to an embodiment of this application;

[0018] Figure 2 is a structural schematic diagram of another vehicle according to an embodiment of this application;

[0019] Figure 3 is a schematic diagram of a circuit board assembly according to an embodiment of this application;

[0020] Figure 4 is a schematic diagram of another circuit board assembly according to an embodiment of this application;

[0021] Figure 5 is a schematic diagram of another circuit board assembly according to an embodiment of this application;

[0022] Figure 6 is a schematic diagram of a circuit board assembly according to an embodiment of the present application, in which connecting pipes and connecting cables are provided;

[0023] Figure 7 is a schematic diagram of another circuit board assembly according to an embodiment of the present application, in which connecting pipes and connecting cables are provided;

[0024] Figure 8 is a schematic diagram of the structure when the circuit board assembly according to an embodiment of this application is disposed inside the beam structure;

[0025] Figure 9 is a schematic diagram of another circuit board assembly according to an embodiment of this application;

[0026] Figure 10 is a schematic flowchart of one of the vehicle detection methods according to an embodiment of this application;

[0027] Figure 11 is a connection block diagram of a power management unit and a circuit board assembly according to an embodiment of this application;

[0028] Figure 12 is a second schematic flowchart of a vehicle detection method according to an embodiment of this application;

[0029] Figure 13 is a third schematic flowchart of a vehicle detection method according to an embodiment of this application;

[0030] Figure 14 is a fourth schematic flowchart of a vehicle detection method according to an embodiment of this application;

[0031] Figure 15 is a fifth schematic flowchart of a vehicle detection method according to an embodiment of this application.

[0032] Figure label:

[0033] 100 - Vehicle; 10 - Body; 101 - Beam structure; 20 - Circuit board assembly; 201 - Chamber; 21 - First circuit board; 22 - Connecting busbar; 23 - Second circuit board; 24 - Housing; 241 - Snap-in slot; 30 - Connecting pipe; 40 - Connecting cable; 50 - Power management unit; 60 - Power channel; 61 - Unit channel; 70 - Temperature sensor. Detailed Implementation

[0034] To enable those skilled in the art to better understand the technical solutions of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0035] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0036] As electric vehicles become increasingly intelligent, the number of electrical devices within them is also constantly increasing. Typically, these devices use cables for power supply and data transmission, leading to a growing number of cables in electric vehicles.

[0037] Because the quality of cables is difficult to control during production and installation, cables connecting electrical equipment in electric vehicles are prone to failure, leading to malfunctions in the corresponding functions of the electric vehicle, increasing the overall failure rate of the electric vehicle and affecting the user experience.

[0038] Based on this, embodiments of this application provide a vehicle. However, this application does not specifically limit the type of vehicle; for example, the vehicle provided in this application can be an electric vehicle, a hybrid electric vehicle, or a solar-powered vehicle, etc.

[0039] As shown in Figure 1, the vehicle 100 provided in this embodiment may include a body 10. The body 10 may include a frame, doors, and windows. The frame forms the overall external shape of the vehicle 100 and creates a passenger seating space. The doors are rotatably connected to the frame, allowing the interior passenger space to be opened or closed. Windows may be installed on the doors or the frame, facilitating passenger observation of the external environment.

[0040] Furthermore, to achieve the basic functions of vehicle 100, vehicle 100 may also include multiple electrical systems. These electrical systems can operate by supplying electricity. It is understood that the specific type of electrical system can be selected based on actual circumstances. For example, multiple electrical systems may include systems requiring power and data transmission, such as cockpit systems, battery management systems, and intelligent driving systems. Additionally, for example, the electrical system may also include components such as drive systems and power systems.

[0041] The drive system drives the wheels to rotate. Depending on the driving method, drive systems can be classified as front-wheel drive, rear-wheel drive, and four-wheel drive.

[0042] The powertrain system provides power to the vehicle 100, enabling it to perform basic driving functions. The composition of the powertrain system varies depending on the type of vehicle 100. For example, when the vehicle 100 is an electric vehicle, the powertrain system may include an electric motor.

[0043] To achieve circuit connections between multiple electrical systems, as shown in FIG1, the vehicle 100 provided in this embodiment may further include a circuit board assembly 20. Multiple circuit board assemblies 20 can be electrically connected to multiple electrical systems. Multiple electrical systems can be electrically connected through multiple circuit board assemblies 20. Thus, the electrical systems can be electrically connected through the circuit board assemblies 20, and the circuit board assemblies 20 can realize functions such as power supply and data transmission for the electrical systems.

[0044] Understandably, the electrical connections between multiple electrical systems can be designed according to actual conditions. For example, the battery management system and the power battery in an electrical system can be electrically connected through circuit board assembly 20.

[0045] Therefore, in the vehicle 100 provided in this application embodiment, since multiple circuit board assemblies 20 are electrically connected to multiple electrical systems, the multiple electrical systems can be electrically connected through the multiple circuit board assemblies 20. In this way, the electrical connection of multiple electrical systems is directly achieved by using the circuit board assemblies 20, without the need for cables, thereby avoiding the problem of partial functional failure of the vehicle 100 caused by cable failures, and improving the performance of the vehicle 100.

[0046] Furthermore, since multiple electrical systems are electrically connected through multiple circuit board assemblies 20, these assemblies 20 can be directly industrialized and automated using equipment, improving production efficiency and avoiding quality issues arising from manual production. At the same time, compared to cables, circuit board assemblies 20 are more regular in shape and have a more compact structure, saving installation space and resulting in a neater appearance after installation.

[0047] For example, in order to achieve an electrical connection between the circuit board assembly 20 and the electrical system, the circuit board assembly 20 may be designed with a connector. The electrical connection between the circuit board assembly 20 and the electrical system can be achieved by plugging in the connector.

[0048] It is understood that the circuit board assembly 20 can be disposed at different locations on the vehicle 100 to facilitate its connection with the electrical system. For example, as shown in Figures 1 and 2, the circuit board assembly 20 can be installed at various locations on the vehicle body 10 to form the basic frame structure of the entire vehicle, so that the electrical system disposed at each location can be electrically connected to the surrounding circuit board assembly 20.

[0049] In some embodiments, as shown in FIG3, the circuit board assembly 20 may include a plurality of first circuit boards 21. The plurality of first circuit boards 21 form a receiving space with openings at both ends. In this way, the plurality of first circuit boards 21 can form a three-dimensional spatial structure, thereby effectively utilizing the three-dimensional space and making installation more convenient.

[0050] It is understandable that the number of first circuit boards 21 can be designed according to the actual situation. For example, as shown in Figure 3, the number of first circuit boards 21 can be four. The four first circuit boards 21 together form a square space area. Of course, the number of first circuit boards 21 can also be other. For example, the number of first circuit boards 21 can also be three or five, etc.

[0051] Of course, in some embodiments, when the number of electrical systems that the circuit board assembly 20 needs to connect is small, the circuit board assembly 20 may also include only a single first circuit board 21. In this case, a single first circuit board 21 can complete the connection between the electrical systems.

[0052] In some embodiments, as shown in FIG4, the circuit board assembly 20 further includes a connecting busbar 22. The connecting busbar 22 is connected to the first circuit board 21 and is located on the periphery of the receiving space enclosed by the plurality of first circuit boards 21. By providing the connecting busbar 22, when a large current required for electrical connection of the electrical system cannot flow through the first circuit board 21, the connecting busbar 22 can be connected to the electrical system, thereby utilizing the connecting busbar 22 to carry a larger current.

[0053] For example, the connecting busbar 22 can be used to connect redundant power supplies in the intelligent driving system, redundant power supplies in the drive-by-wire chassis system, or high-power devices such as pedals.

[0054] It is understood that the connecting busbar 22 can be made of a metallic material. For example, the connecting busbar 22 can be made of copper or aluminum. Of course, the connecting busbar 22 can also be made of other metallic materials, as long as it can achieve the function of conducting electricity.

[0055] Furthermore, in some embodiments, there can be multiple connecting busbars 22. This allows for multiple electrical connections at various points, making the connection more efficient. Of course, in other embodiments, there can be only one connecting busbar 22; the specific design can be tailored to the actual situation.

[0056] In some embodiments, as shown in FIG5, the circuit board assembly 20 further includes at least one second circuit board 23. The second circuit board 23 is located within the receiving space and connected to the first circuit board 21. Thus, since the second circuit board 23 is disposed within the receiving space formed by the plurality of first circuit boards 21, space can be further saved, making installation more convenient. Simultaneously, by providing the second circuit board 23, the circuit board assembly 20 can make more electrical connections.

[0057] For example, as shown in Figure 6, there can be multiple second circuit boards 23. Multiple second circuit boards 23 can divide the receiving space into chambers 201. Of course, there can also be only one second circuit board 23, which can be set according to the actual situation.

[0058] In some embodiments, the circuit board assembly 20 may not include the second circuit board 23. In this case, the electrical system can be electrically connected solely through the first circuit board 21.

[0059] In some embodiments, as shown in FIG6, the vehicle 100 further includes a connecting pipe 30. The connecting pipe 30 passes through the receiving space. Thus, the connecting pipe 30 can be placed within the receiving space formed by the plurality of first circuit boards 21, achieving efficient use of space. For example, the connecting pipe 30 can be a connecting pipe 30 for flowing wash water, oil, or cooling medium.

[0060] In some embodiments, as shown in FIG6, the vehicle 100 further includes a connecting cable 40. The connecting cable 40 is disposed within the receiving space. When certain electrical connection lines of the electrical system cannot be connected via the circuit board, the connecting cable 40 can be used for connection. Simultaneously, since the connecting cable 40 can be disposed within the receiving space, space can be utilized efficiently. For example, the connecting cable 40 can be a cable for coaxial transmission, Ethernet transmission, High Speed ​​Data (HSD) transmission, or Universal Serial Bus (USB) transmission.

[0061] In some embodiments, the vehicle 100 also includes a filler material. The filler material fills the receiving space. By providing the filler material, the connecting cable 40 or connecting pipe 30 located within the receiving space can be kept stable, preventing it from swaying back and forth. For example, the filler material can be a soft material such as foam. Alternatively, the filler material can also be a material such as sealant.

[0062] In some embodiments, as shown in FIG7, the circuit board assembly 20 further includes a housing 24. An installation space is formed inside the housing 24. A plurality of first circuit boards 21 are disposed within the installation space. Thus, by providing the housing 24, the first circuit boards 21 can be disposed inside the housing 24, thereby protecting the first circuit boards 21 and preventing direct external impact.

[0063] In some embodiments, as shown in FIG8, the vehicle body 10 may include a beam structure 101. The circuit board assembly 20 may be disposed inside the beam structure 101. In this way, the beam structure 101 as a whole can protect the circuit board assembly 20. At the same time, the circuit board assembly 20 can be conveniently installed using the internal space of the beam structure 101 without occupying additional space elsewhere.

[0064] In some embodiments, as shown in FIG9, the housing 24 has a snap-fit ​​groove 241. A portion of the beam structure 101 (FIG. 8) snaps into the snap-fit ​​groove 241 and connects to the housing 24. In this way, the circuit board assembly 20 can also be mounted onto the beam structure 101 through the snap-fit ​​groove 241 formed in the housing 24, which is simple, convenient and easy to implement.

[0065] In some embodiments, the vehicle 100 further includes a plurality of temperature sensors. The plurality of temperature sensors are disposed on a plurality of circuit board assemblies 20 for detecting the temperature of the circuit board assemblies 20. Thus, by using multiple temperature sensors, the temperature of the circuit board assemblies 20 can be detected, and if the temperature of the circuit board assemblies 20 is too high, it can be detected in a timely manner, thereby avoiding potential safety hazards.

[0066] This application embodiment also provides a vehicle detection method, as shown in FIG10, which includes steps S100-S200.

[0067] S100: Temperature detection is performed on multiple circuit board assemblies. For example, as shown in FIG11, the temperature of circuit board assembly 20 can be obtained through temperature sensor 70. The vehicle's power management unit 50 is connected to multiple unit channels 61 of the power channel 60, and can control the on / off state of the power channel 60. Simultaneously, the power management unit 50 is also electrically connected to the temperature sensors 70 on the multiple circuit board assemblies 20. Thus, the temperature detected by the temperature sensors 70 can be transmitted to the power management unit 50.

[0068] S200: Determine if the temperature of multiple circuit board assemblies is abnormal. By determining if the temperature of the circuit board assemblies is abnormal, it is possible to determine whether the circuit board assemblies have malfunctioned, thereby preventing potential safety hazards. For example, referring to FIG11, if the temperature of one group of circuit board assemblies 20 is too high and causes a malfunction, the power management unit 50 can disconnect the corresponding unit channel 61 to prevent the temperature of the potentially malfunctioning circuit board assembly 20 from continuing to rise.

[0069] In some embodiments, after the temperature of multiple circuit board assemblies is detected, as shown in FIG12, the vehicle detection method may further include step S300.

[0070] S300: The temperature of multiple circuit board components is compared in pairs to obtain multiple sets of temperature difference values.

[0071] Determining whether the temperature of multiple circuit board components is abnormal includes step S201.

[0072] S201: Compare multiple temperature difference values ​​with a preset temperature difference value. If the temperature difference value is greater than the preset temperature difference value, the temperature of the circuit board assembly is abnormal. In this way, by comparing the temperature differences between the circuit board assemblies, if the temperature difference of the circuit board assembly is too high and exceeds the preset temperature difference value, it can be determined that one of the two sets of circuit board assemblies has a higher temperature, and the circuit board assembly may have failed.

[0073] Understandably, the testing time for circuit board assemblies can be designed according to actual conditions. For example, the temperature of the circuit board assembly can be measured every 100ms to obtain the temperature difference.

[0074] Different preset temperature difference values ​​can be set for different ambient temperatures and operating conditions. For example, a different preset temperature difference value can be set for every 5°C change in ambient temperature. When the ambient temperature is 25°C, the preset temperature difference value can be the first preset temperature difference value. When the ambient temperature is 30°C, the preset temperature difference value can be the second preset temperature difference value. The first preset temperature difference value and the second preset temperature difference value can be different.

[0075] As an example, based on the steps of the above scheme, the complete detection process can be shown in Figure 13. First, the vehicle is powered on. Then, the power management unit uses a temperature sensor to detect the temperature difference every 100ms and compares the temperature difference with a preset temperature difference. If the temperature difference is less than or equal to the preset temperature difference, the temperature difference detection is repeated cyclically. If the temperature difference is greater than the preset temperature difference, the vehicle will issue an abnormality warning and can perform a self-check after parking. Specifically, different unit channels of the circuit board assembly itself can be used to power on and off each unit channel to detect the temperature difference and find the abnormal unit channel. If the temperature difference decreases after disconnecting a certain unit channel, it indicates that the unit channel is abnormal and will generate an abnormal high temperature when powered on.

[0076] Of course, in other embodiments, as shown in FIG14, determining whether the temperature of multiple circuit board assemblies is abnormal includes step S202.

[0077] S202: Compare the temperatures of multiple circuit board assemblies with preset temperatures. If the temperature of a circuit board assembly is higher than the preset temperature, the temperature of the circuit board assembly is abnormal. In this way, by directly comparing the temperature of the circuit board assembly with the preset temperature, if the temperature of the circuit board assembly is too high and exceeds the preset temperature, it can be determined that the circuit board assembly has a high temperature and the circuit board assembly may be malfunctioning.

[0078] Furthermore, as shown in Figure 15, after determining that the temperature of the circuit board assembly is higher than the preset temperature, it can be further determined whether the temperature of the circuit board assembly exceeds the alarm temperature. If it exceeds the alarm temperature, the vehicle should be stopped immediately, the power supply should be cut off, and the vehicle should be powered off. If the temperature of the circuit board assembly does not exceed the alarm temperature, the unit channel corresponding to the circuit board assembly with the excessively high temperature can be disconnected first. Then, it can be determined whether the cumulative temperature in the next cycle exceeds T0. If it does not exceed T0, the vehicle can continue to drive. If it exceeds T0, the vehicle needs to be stopped and the power supply cut off for inspection.

[0079] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A vehicle (100), comprising: Multiple electrical systems; as well as, Multiple circuit board assemblies (20) are connected to multiple electrical systems; The multiple electrical systems are electrically connected through the multiple circuit board assemblies (20).

2. The vehicle according to claim 1, wherein, The circuit board assembly (20) includes: Multiple first circuit boards (21) form a receiving space with openings at both ends.

3. The vehicle according to claim 2, wherein, The circuit board assembly (20) also includes: A connecting busbar (22) is connected to the first circuit board (21) and is located outside the accommodating space formed by the plurality of first circuit boards (21).

4. The vehicle according to claim 2, wherein, The circuit board assembly (20) also includes: At least one second circuit board (23) is located within the receiving space and is connected to the first circuit board (21).

5. The vehicle according to claim 2, wherein, The vehicle (100) also includes: Connecting pipes (30) are installed within the receiving space; and / or, The connecting cable (40) is threaded through the receiving space.

6. The vehicle according to claim 5, wherein, The vehicle (100) also includes: A filling material is used to fill the accommodating space.

7. The vehicle according to claim 2, wherein, The circuit board assembly (20) also includes: The housing (24) has an installation space inside; a plurality of the first circuit boards (21) are disposed in the installation space.

8. The vehicle according to claim 7, wherein, The outer casing (24) has a snap-fit ​​groove (241); the vehicle (100) also includes: The vehicle body (10) includes a beam structure (101); a portion of the beam structure (101) is snapped into the snap-fit ​​groove (241) and connected to the outer shell (24).

9. The vehicle of claim 1, wherein, The vehicle (100) also includes: Multiple temperature sensors are disposed on multiple circuit board assemblies (20) for detecting the temperature of the circuit board assemblies (20).

10. A method for detecting a vehicle according to any one of claims 1-9, comprising: The temperature of multiple circuit board assemblies (20) is detected; as well as, Determine whether the temperature of the multiple circuit board assemblies (20) is abnormal.

11. The vehicle detection method according to claim 10, wherein, After detecting the temperature of multiple circuit board assemblies (20), the detection method for the vehicle (100) further includes: The temperatures of the multiple circuit board assemblies (20) are compared in pairs to obtain multiple sets of temperature difference values; Determining whether the temperature of the multiple circuit board assemblies (20) is abnormal includes: The multiple sets of temperature differences are compared with a preset temperature difference. If the temperature difference is greater than the preset temperature difference, the temperature of the circuit board assembly (20) is abnormal.

12. The vehicle detection method according to claim 10, wherein, Determining whether the temperature of the multiple circuit board assemblies (20) is abnormal includes: The temperature of the multiple circuit board assemblies (20) is compared with a preset temperature. If the temperature of the circuit board assembly (20) is greater than the preset temperature, then the temperature of the circuit board assembly (20) is abnormal.

Images