Pillar assembly and vehicle

Abstract

A pillar assembly, comprising a support (20) and pillar glass (10). The pillar glass (10) is mounted on the outer side of the support (20), and has a surface hardness HV and a first thermal expansion coefficient CTE1, wherein the surface hardness HV is greater than or equal to 500, and the first thermal expansion coefficient CTE1 is less than or equal to 80X10-7 / °C. The pillar assembly not only exhibits good anti-friction performance, but can also reduce crack propagation, thereby reducing scratches and abrasion for the pillar glass, improving the surface appearance of the pillar glass, prolonging the service life of the pillar glass, and lowering maintenance costs. In addition, the influence of pillar glass scratches on a sensing assembly is also reduced, and the working effect of the sensing assembly is improved. Further disclosed is a vehicle having the pillar assembly.

Description

Column assembly and vehicle

[0001] This disclosure claims priority to Chinese patent application filed on March 28, 2025, with application number 202510377685.X, entitled "Column Assembly and Vehicle", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application belongs to the field of vehicle technology, specifically relating to pillar assemblies and vehicles. Background Technology

[0003] As the requirements for vehicle intelligence continue to increase, sensing components are usually integrated into the vehicle's pillars. For example, NFC modules are integrated into the B-pillar assembly, and a card is used to unlock the vehicle. The card is placed close to the B-pillar surface to sense the NFC unlock.

[0004] However, prolonged use of cards can easily cause scratches on the pillar glass, reducing the vehicle's appearance and lifespan. Furthermore, the B-pillar assembly encapsulates sensor components such as cameras with functions like surround view, facial recognition, driver assistance, and sentry mode. Scratches or cracks on the pillar glass can affect the recognition capabilities of these sensors, impacting their performance. Summary of the Invention

[0005] In view of this, the first aspect of this application provides a column assembly, the column assembly including a bracket and a column glass, the column glass being mounted on the outside of the bracket, the column glass having a surface hardness HV and a first coefficient of thermal expansion CTE1, the surface hardness HV ≥ 500, and the first coefficient of thermal expansion CTE1 ≤ 80 × 10⁻⁶. -7 / ℃.

[0006] Wherein, the surface hardness HV is ≥550, or ≥575, or ≥600.

[0007] Wherein, the surface hardness HV≤700.

[0008] Wherein, the first coefficient of thermal expansion CTE1 ≤ 70X10 -7 / ℃, or ≤60X10 -7 / ℃, or ≤50X10 -7 / ℃.

[0009] Wherein, the first coefficient of thermal expansion CTE1 ≥ 30X10 -7 / ℃.

[0010] The column glass is extruded using a diamond square pyramid indenter, and the surface hardness HV of the column glass satisfies: HV=0.1891×F×9.8 / ((L1+L2) / 2)2 , F=5Kgf, 115μm≤L1≤135μm, 115μm≤L2≤135μm;

[0011] The pressure exerted by the diamond pyramid indenter on the column glass is F, where F is in kgf; the length of the first diagonal indentation formed by the diamond pyramid indenter on the surface of the column glass is L1, where L1 is in μm; the length of the second diagonal indentation formed by the diamond pyramid indenter on the surface of the column glass is L2, where L2 is in μm, and the first diagonal indentation and the second diagonal indentation are interleaved.

[0012] Wherein, the length L1 of the first diagonal indentation is 115μm~130μm, or 120μm~130μm, or 120μm~125μm;

[0013] The length L2 of the second diagonal indentation is 115μm~130μm, or 120μm~130μm, or 120μm~125μm.

[0014] The column glass includes a glass substrate and a shielding layer disposed on one side of the glass substrate. The glass substrate has a first coefficient of thermal expansion CTE1, and the shielding layer has a second coefficient of thermal expansion CTE2. The ratio of the second coefficient of thermal expansion CTE2 to the first coefficient of thermal expansion CTE1 is 0.9 to 1.1.

[0015] Wherein, the second coefficient of thermal expansion CTE2 ≤ 80X10 -7 / ℃, or ≤70X10 -7 / ℃, or ≤60X10 -7 / ℃;

[0016] The second coefficient of thermal expansion, CTE2, is ≥30 x 10⁻⁶. -7 / ℃.

[0017] The bracket and the glass column are bonded together by an adhesive, which contacts the shielding layer. The adhesive has a third coefficient of thermal expansion (CTE3), and the ratio of the second coefficient of thermal expansion (CTE2) to the third coefficient of thermal expansion (CTE3) is 0.04 to 0.1.

[0018] The third coefficient of thermal expansion, CTE3, is 30 x 10⁻⁶. -7 / ℃~500X10 -7 / ℃.

[0019] The tensile strength of the adhesive is ≤10 N / mm. 2 or ≤7N / mm 2 or ≤5N / mm 2 .

[0020] The column glass is made of at least one of borosilicate glass and high-alumina glass.

[0021] The borosilicate glass, by mass of oxides, is composed of the following components in the following mass percentages: 75%–85% SiO2, 10%–16% B2O3, 2%–3% Al2O3, 3%–7% Na2O and K2O.

[0022] The high-alumina glass, by mass of oxides, is composed of the following components in the following mass percentages: 52%–75% SiO2, 15%–27% Al2O3, 0%–5% K2O, and 0%–1% Na2O.

[0023] Wherein, the visible light transmittance TL of the column glass is ≥90%, or ≥92%, or ≥95%;

[0024] And / or, the physical thickness of the column glass is ≤5mm, or ≤4mm, or ≤3mm.

[0025] The column glass includes a first glass plate, an adhesive layer, and a second glass plate. The first glass plate has a first surface and a second surface, and the second glass plate has a third surface and a fourth surface. The adhesive layer connects the second surface and the third surface.

[0026] The support is located on the fourth side, and the first glass plate has the surface hardness HV and the first coefficient of thermal expansion CTE1.

[0027] The column assembly satisfies at least one of the following conditions:

[0028] The pillar assembly also includes a sensing component for acquiring data on the external environment of the vehicle, the sensing component being located on the inner side of the pillar glass;

[0029] The bracket is installed on the A-pillar, B-pillar, C-pillar, or D-pillar of the vehicle.

[0030] The column assembly also includes an NFC module or an RFID module.

[0031] A second aspect of this application provides a vehicle including a vehicle body and a pillar assembly as provided in the first aspect of this application, the pillar assembly being mounted on the vehicle body.

[0032] The pillar assembly and vehicle provided in this application utilize a surface hardness HV≥500 and a first thermal expansion coefficient CTE1≤80X10. -7The condenser glass, with a temperature of / ℃, possesses excellent anti-friction properties and reduces crack propagation, thereby reducing scratches and wear on the condenser glass, improving its appearance, extending its service life, and reducing maintenance costs. In addition, it also reduces the impact of condenser glass scratches on the sensing components, improving the working performance of the sensing components. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0034] Figure 1 is a schematic diagram of the structure of the column glass provided in one embodiment of this application.

[0035] Figure 2 is a structural schematic diagram of the column glass provided in another embodiment of this application.

[0036] Figure 3 is a structural schematic diagram of the column assembly provided in one embodiment of this application.

[0037] Figure 4 is a structural schematic diagram of a column assembly provided in another embodiment of this application.

[0038] Figure 5 shows the abrasion test data of borosilicate glass, high-alumina glass, and soda-lime glass as column glass, respectively.

[0039] Labeling: Column assembly 1, Column glass 10, Glass substrate 11, Shielding layer 12, First glass plate 13, First surface 131, Second surface 132, Adhesive layer 14, Second glass plate 15, Third surface 151, Fourth surface 152, Support 20, Sensing component 30. Detailed Implementation

[0040] The following are preferred embodiments of this application. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principles of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.

[0041] Before introducing the technical solution of this application, let's go over the technical issues in related technologies in detail.

[0042] As the requirements for vehicle intelligence continue to increase, sensing components are usually integrated into the vehicle's pillars. For example, NFC modules are integrated into the B-pillar assembly, and a card is used to unlock the vehicle. The card is placed close to the B-pillar surface to sense the NFC unlock.

[0043] However, long-term use of cards can easily cause scratches on the pillar glass, reducing the vehicle's appearance and lifespan.

[0044] Furthermore, since vehicles can easily accumulate mud, sand, dust, and other contaminants on their exterior surfaces when stopped or in motion, the card will pick up these substances and move along the glass when it touches the B-pillar glass to unlock the vehicle. This causes friction between the mud, sand, dust, and the glass surface, resulting in scratches that accumulate and become deeper over time.

[0045] In addition, the B-pillar assembly also encapsulates sensor components such as cameras with functions like surround view, facial recognition, driver assistance, and sentry mode. Scratches or cracks in the pillar glass will affect the recognition of these sensor components and their working performance. If the B-pillar assembly contains a camera, the granular fragments after the glass breaks will severely affect the camera's functionality.

[0046] In view of this, in order to solve the above problems, please refer to Figures 1-4. This embodiment provides a column assembly 1, which includes a bracket 20 and a column glass 10. The column glass 10 is installed on the outside of the bracket 20. The column glass 10 has a surface hardness HV and a first coefficient of thermal expansion CTE1. The surface hardness HV ≥ 500 and the first coefficient of thermal expansion CTE1 ≤ 80 × 10⁻⁶. -7 / ℃.

[0047] The pillar glass 10 is in contact with the external environment of the vehicle, while the bracket 20 is in contact with the internal environment of the vehicle. The bracket 20 is located on the A-pillar, B-pillar, C-pillar, or D-pillar of the vehicle. Preferably, the bracket 20 is located on the B-pillar of the vehicle.

[0048] The pillar assembly also includes an NFC module or an RFID module. For example, using an NFC or RFID module, the vehicle's pillar assembly can achieve rapid identity verification and door opening / closing control by identifying a card.

[0049] The higher the surface hardness HV, the stronger the ability of the pillar glass 10 to resist plastic deformation, which is beneficial to improving the friction resistance of the pillar glass 10. The pillar glass 10 has a surface hardness HV ≥ 500, specifically, 500, 525, 550, 575, 600, 625, or 650, etc. Preferably, the surface hardness HV ≥ 550, more preferably, the surface hardness HV ≥ 575, and even more preferably, the surface hardness HV ≥ 600.

[0050] Furthermore, the surface hardness HV ≤ 700, in other words, the surface hardness HV of the column glass 10 is 500 to 700.

[0051] In related technologies, materials with high CTE will expand and contract more with temperature changes, and the greater thermal stress will easily lead to cracking or breakage of the column glass 10.

[0052] A smaller coefficient of thermal expansion (CTE1) is beneficial for reducing crack propagation in the pillar glass 10. The pillar glass 10 has a coefficient of thermal expansion CTE1 ≤ 80 × 10⁻⁶. -7 / ℃, for example, 75X10 -7 / ℃, or 70X10 -7 / ℃, or 65X10 -7 / ℃, or 60X10 -7 / ℃, or 55X10 -7 / ℃, or 50X10 -7 / ℃, etc., preferably, the first coefficient of thermal expansion CTE1 ≤ 70X10 -7 / ℃, and more preferably, the first coefficient of thermal expansion CTE1 ≤ 60X10 -7 / ℃, and more preferably, the first coefficient of thermal expansion CTE1 ≤ 50X10 -7 / ℃.

[0053] Furthermore, the first coefficient of thermal expansion CTE1 ≥ 30 × 10⁻⁶ -7 / ℃, for example, 30X10 -7 / ℃, or 35X10 -7 / ℃, or 40X10 -7 / ℃, or 45X10 -7 / ℃, or 50X10 -7 / ℃, etc. In other words, the first coefficient of thermal expansion, CTE1, is 30 x 10⁻⁶. -7 / ℃~80X10 -7 / ℃.

[0054] In summary, the column assembly 1 provided in this application achieves its desired surface hardness (HV) ≥ 500 and a first thermal expansion coefficient (CTE1) ≤ 80 × 10⁻⁶. -7 The pillar glass 10, with a temperature of / ℃, possesses both excellent anti-friction properties and reduces crack propagation, thereby reducing scratches and wear on the pillar glass 10, improving its appearance, extending its service life, and reducing maintenance costs. Furthermore, it reduces the impact of scratches on the sensing component 30, improving its operational efficiency. In the event of breakage, the pillar glass 10 provided in this application also reduces glass fragments, minimizing their impact on the sensing component 30 and ensuring its functional integrity.

[0055] In addition to limiting the surface hardness HV and the first coefficient of thermal expansion CTE1 of the pillar glass 10, surface stress can also be formed by chemical strengthening or thermal tempering, thereby further enhancing the friction resistance and compressive strength of the pillar glass 10.

[0056] In one embodiment, the column glass 10 is pressed using a diamond pyramid indenter, and the surface hardness HV of the column glass 10 satisfies: HV=0.1891×F×9.8 / ((L1+L2) / 2) 2 , F=5Kgf, 115μm≤L1≤135μm, 115μm≤L2≤135μm.

[0057] The pressure exerted by the diamond pyramid indenter on the column glass 10 is F, where F is in kgf; the length of the first diagonal indentation formed by the diamond pyramid indenter on the surface of the column glass 10 is L1, where L1 is in μm; the length of the second diagonal indentation formed by the diamond pyramid indenter on the surface of the column glass 10 is L2, where L2 is in μm, and the first diagonal indentation and the second diagonal indentation are interleaved.

[0058] The length L1 of the first diagonal indentation is 115μm to 135μm, specifically for example, 115μm, 120μm, 125μm, 130μm, or 135μm, etc. Preferably, the length L1 of the first diagonal indentation is 115μm to 130μm, more preferably, the length L1 of the first diagonal indentation is 120μm to 130μm, and even more preferably, the length L1 of the first diagonal indentation is 120μm to 125μm.

[0059] The length L2 of the second diagonal indentation is 115μm to 135μm, specifically for example, 115μm, 120μm, 125μm, 130μm, or 135μm, etc. Preferably, the length L2 of the second diagonal indentation is 115μm to 130μm, more preferably, the length L2 of the second diagonal indentation is 120μm to 130μm, and even more preferably, the length L2 of the second diagonal indentation is 120μm to 125μm.

[0060] Please refer to Figure 1. In one embodiment, the pillar glass 10 includes a glass substrate 11 and a shielding layer 12 disposed on one side of the glass substrate 11. The glass substrate 11 has a first coefficient of thermal expansion CTE1, and the shielding layer 12 has a second coefficient of thermal expansion CTE2. The ratio of the second coefficient of thermal expansion CTE2 to the first coefficient of thermal expansion CTE1 is 0.9 to 1.1.

[0061] The glass substrate 11 can be a single layer of glass or a laminated glass formed together with other glass. The material of the shielding layer 12 can be selected from ink. The shielding layer 12 can be applied to the glass substrate 11 by screen printing. The shielding layer 12 can cover the entire surface of the pillar glass 10, or it can be partially set on the surface of the pillar glass 10 as needed. The shielding layer 12 is used to shield other components provided on the three-dimensional glass, such as for shielding the bracket 20. Optionally, the shielding layer 12 is provided on the surface of the glass substrate 11 facing the bracket 20, or on the surface of the glass substrate 11 away from the bracket 20.

[0062] The ratio of the second thermal expansion coefficient CTE2 to the first thermal expansion coefficient CTE1 is 0.9 to 1.1, specifically, such as 0.9, 0.95, 1, 1.05, or 1.1. Preferably, the ratio of the second thermal expansion coefficient CTE2 to the first thermal expansion coefficient CTE1 is 0.95 to 1.05.

[0063] The second coefficient of thermal expansion, CTE2, is ≤ 80 × 10⁻⁶. -7 / ℃, for example, 75X10 -7 / ℃, or 70X10 -7 / ℃, or 65X10 -7 / ℃, or 60X10 -7 / ℃, or 55X10 -7 / ℃, or 50X10 -7 / ℃, etc., preferably, the second coefficient of thermal expansion CTE2 ≤ 70X10 -7 / ℃, and more preferably, the second coefficient of thermal expansion CTE2 ≤ 60X10 -7 / ℃, and more preferably, the second coefficient of thermal expansion CTE2 ≤ 50X10 -7 / ℃.

[0064] Furthermore, the second coefficient of thermal expansion, CTE2, is ≥30×10⁻⁶. -7 / ℃, for example, 30X10 -7 / ℃, or 35X10 -7 / ℃, or 40X10 -7 / ℃, or 45X10 -7 / ℃, or 50X10 -7 / ℃, etc. In other words, the coefficient of thermal expansion CTE2 is 30 x 10⁻⁶. -7 / ℃~80X10 -7 / ℃.

[0065] When thermal expansion occurs between the shielding layer 12 and the glass substrate 11, a large difference in their coefficients of thermal expansion can easily weaken the surface of the glass substrate 11, making it prone to cracking or breakage. However, this embodiment limits the ratio of the coefficients of thermal expansion between the shielding layer 12 and the glass substrate 11 to 0.9 to 1.1, thus reducing the difference in their coefficients of thermal expansion. This makes the coefficients of thermal expansion of the shielding layer 12 and the glass substrate 11 similar or even equal, resulting in lower thermal stress between them. This improves the problem of cracking or breakage of the glass substrate 11 in the shielded area where the shielding layer 12 is located due to high thermal stress, thereby increasing the structural strength of the pillar glass 10. It further improves the problem of the pillar glass 10 being prone to breakage when hit by a vehicle or squeezed by stones on the road during driving, further reduces scratches and wear on the pillar glass 10, further improves the appearance performance of the pillar glass 10, further extends the service life of the pillar glass 10, and further reduces maintenance costs.

[0066] Please refer to Figure 4. In one embodiment, the bracket 20 and the column glass 10 are bonded together by an adhesive. The adhesive contacts the shielding layer 12. The adhesive has a third coefficient of thermal expansion CTE3. The ratio of the second coefficient of thermal expansion CTE2 to the third coefficient of thermal expansion CTE3 is 0.04 to 0.1.

[0067] The bracket 20 is located inside the column glass 10 and is used to support the sensing component 30. Optionally, the bracket 20 can be made of thermoplastic material; the back plate of the bracket 20 can be made of a material containing glass fiber, such as at least one of ABS, ABS / PC, and ASA plastic; the thickness of the bracket 20 is 1mm to 5mm. The adhesive can be PU adhesive.

[0068] For example, the bracket 20 is bonded to the column glass 10 with PU adhesive, forming a receiving cavity between the bracket 20 and the column glass 10. At least a portion of the sensing component 30 is disposed within the receiving cavity, and the sensing component 30 is fixed within the receiving cavity. Specifically, the sensing component 30 includes a camera, which is locked onto the bracket 20, and the camera's lens assembly is encapsulated and protected within the receiving cavity.

[0069] The ratio of the second thermal expansion coefficient CTE2 to the third thermal expansion coefficient CTE3 is 0.04 to 0.1, specifically, such as 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, or 0.1. Preferably, the ratio of the second thermal expansion coefficient CTE2 to the third thermal expansion coefficient CTE3 is 0.06 to 0.08.

[0070] The third coefficient of thermal expansion, CTE3, is 30 x 10. -7 / ℃~500X10 -7 / ℃, for example, 30X10 -7 / ℃, or 50X10 -7 / ℃, or 100X10 -7 / ℃, or 150X10 -7 / ℃, or 200X10 -7 / ℃, or 250X10 -7 / ℃, or 300X10 -7 / ℃, or 350X10 -7 / ℃, or 400X10 -7 / ℃, or 450X10 -7 / ℃, or 500X10 -7 / ℃, etc., preferably, the third coefficient of thermal expansion CTE3 is 50X10. -7 / ℃~400X10 -7 / ℃, and more preferably, the third coefficient of thermal expansion CTE3 is 100×10⁻⁶℃. -7 / ℃~300X10 -7 / ℃, and more preferably, the third coefficient of thermal expansion CTE3 is 150 x 10⁻⁶. -7 / ℃~250X10 -7 / ℃.

[0071] The lower the tensile strength of the adhesive, the softer the adhesive is, and the less stress it can withstand under tensile force. The reaction force of the adhesive on the column glass 10 will also be smaller. The tensile strength of the adhesive is ≤10 N / mm². 2 For example, 10 N / mm 2 or 9N / mm 2 or 8N / mm 2 or 7N / mm 2 or 6N / mm 2 or 5N / mm 2 or 4N / mm 2 or 3N / mm 2 or 2N / mm 2 or 1N / mm 2 Preferably, the tensile strength of the adhesive is ≤7 N / mm². 2 More preferably, the tensile strength of the adhesive is ≤5 N / mm². 2 Furthermore, the tensile strength of the adhesive is >0. Optionally, the adhesive material is selected from at least one of HV3 adhesive and SIKA adhesive.

[0072] In related technologies, the coefficient of thermal expansion of the adhesive is usually greater than that of the glass substrate 11 and the shielding layer 12. This causes the adhesive to expand or contract at a greater rate with temperature changes, increasing the tension on the pillar glass 10 itself or the crack, and increasing the crack propagation rate.

[0073] However, by limiting the ratio of the coefficient of thermal expansion between the shielding layer 12 and the adhesive to 0.04 to 0.1, this embodiment reduces the difference in the coefficient of thermal expansion between the shielding layer 12 and the adhesive, making their coefficients of thermal expansion similar or even equal. This results in lower thermal stress between the shielding layer 12 and the adhesive, reducing the pulling force on the pillar glass 10 itself or the cracks, reducing the crack propagation rate, and further improving the problem of the pillar glass 10 being prone to breakage when hit during vehicle loading or squeezed by road stones during driving. It also further reduces scratches and wear on the pillar glass 10, further improves the appearance performance of the pillar glass 10, further extends the service life of the pillar glass 10, and further reduces maintenance costs.

[0074] Furthermore, this embodiment considers the tensile strength of the adhesive to be ≤10 N / mm. 2 This reduces the stress that the adhesive can withstand under tensile force, thereby reducing the reaction force of the adhesive on the column glass 10 and further reducing the pulling force of the adhesive on the crack.

[0075] The column glass 10 is made of at least one of borosilicate glass and high-alumina glass.

[0076] In one embodiment, the borosilicate glass, by mass of oxides, comprises the following components in the following mass percentages: 75%–85% SiO2, 10%–16% B2O3, 2%–3% Al2O3, 3%–7% Na2O and K2O.

[0077] In another embodiment, the high-alumina glass is composed of the following components by mass percentage: 52%–75% SiO2, 15%–27% Al2O3, 0%–5% K2O, and 0%–1% Na2O, based on the mass of oxides.

[0078] The column glass 10 in the related technology is usually soda-lime glass, with a surface hardness HV less than 500 and a coefficient of thermal expansion CTE greater than 80 x 10⁻⁶. -7 The temperature is / ℃, which makes the pillar glass 10 prone to scratches, reducing the vehicle's appearance and service life. However, this embodiment uses at least one of borosilicate glass and high-alumina glass, ensuring that the pillar glass 10 meets the following requirements: surface hardness HV≥500, first coefficient of thermal expansion CTE1≤80X10. -7The temperature is / ℃, which gives the pillar glass 10 excellent anti-friction properties and reduces crack propagation, thereby reducing scratches and wear on the pillar glass 10, improving the appearance performance of the pillar glass 10, extending the service life of the pillar glass 10, and reducing maintenance costs.

[0079] The visible light transmittance TL of the pillar glass 10 is ≥90%, specifically, examples include 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, or 99%, etc. Preferably, the visible light transmittance TL of the pillar glass 10 is ≥92%, and more preferably, the visible light transmittance TL of the pillar glass 10 is ≥95%. If the pillar assembly 1 includes a sensing component 30, limiting the visible light transmittance TL of the pillar glass 10 to ≥90% is beneficial to improving the recognition effect of the sensing component 30. For example, if the sensing component 30 includes a camera, limiting the visible light transmittance TL of the pillar glass 10 to ≥90% is more beneficial for clear recognition by the camera's field of view.

[0080] The physical thickness of the pillar glass 10 is ≤5mm, specifically for example, 5mm, 4mm, 3mm, 2mm, or 1mm, etc. Preferably, the physical thickness of the pillar glass 10 is ≤4mm, and more preferably, the physical thickness of the pillar glass 10 is ≤3mm.

[0081] Please refer to Figure 2. In one embodiment, the column glass 10 includes a first glass plate 13, an adhesive layer 14, and a second glass plate 15. The first glass plate 13 has a first surface 131 and a second surface 132. The second glass plate 15 has a third surface 151 and a fourth surface 152. The adhesive layer 14 connects the second surface 132 and the third surface 151. The bracket 20 is disposed on the fourth surface 152. The first glass plate 13 has the surface hardness HV and the first coefficient of thermal expansion CTE1.

[0082] Specifically, the first glass panel 13 serves as the outer glass panel of the pillar glass 10. The first glass panel 13 has a first surface 131 and a second surface 132. The first surface 131 is away from the adhesive layer 14 and in contact with the external environment of the vehicle, while the second surface 132 is close to the adhesive layer 14. The second glass panel 15 serves as the inner glass panel of the pillar glass 10. The second glass panel 15 has a third surface 151 and a fourth surface 152. The third surface 151 is close to the adhesive layer 14, while the fourth surface 152 is away from the adhesive layer 14 and close to the bracket 20. The adhesive layer 14 connects the second surface 132 and the third surface 151. Optionally, the shielding layer 12 is disposed on the fourth surface 152.

[0083] The adhesive layer 14 can be a transparent thermoplastic polymer film or a light-colored thermoplastic polymer film, and the thickness of the adhesive layer 14 is 0.38 mm to 2.28 mm. For example, the thickness of the adhesive layer 14 can be, but is not limited to, 0.38 mm, 0.76 mm, 1.14 mm, 1.52 mm, 1.9 mm, 2.28 mm, or other values ​​between 0.38 mm and 2.28 mm. The material of the thermoplastic polymer film can be selected from at least one of polyurethane, polycarbonate, polyvinyl butyral (PVB), polymethyl methacrylate (PMMA), ethylene vinyl acetate (EVA), or ionomer resin.

[0084] Optionally, the adhesive layer 14 can be a single-layer or multi-layer structure. Examples of multi-layer structures include double-layer, triple-layer, quadruple-layer, and five-layer structures. The adhesive layer 14 can also have other functions, such as adding infrared absorbers to provide sun protection or heat insulation, adding ultraviolet absorbers to provide ultraviolet protection, or having at least one layer of the multi-layer structure with a higher plasticizer content to provide sound insulation.

[0085] In one embodiment, the pillar assembly 1 further includes a sensing component 30 for acquiring data on the external environment of the vehicle, the sensing component 30 being disposed on the inner side of the pillar glass 10.

[0086] Optionally, the sensing component 30 can be at least one of a visible light camera, a near-infrared camera, a thermal imager, a lidar, and a gesture detection sensor. The pillar glass 10 protects the sensing component 30, which is directly mounted on the pillar glass 10 or indirectly mounted on the pillar glass 10 via other components. For example, the pillar assembly 1 includes a bracket 20, which is bonded to the pillar glass 10 with adhesive, and the sensing component 30 is mounted on the bracket 20.

[0087] This application also provides a vehicle, including a vehicle body and a pillar assembly as described above, the pillar assembly being mounted on the vehicle body.

[0088] The vehicle provided in this embodiment, by adopting the pillar assembly provided above in this application, uses a surface hardness HV≥500 and a first thermal expansion coefficient CTE1≤80X10. -7 The condenser glass, with a temperature of / ℃, possesses excellent anti-friction properties and reduces crack propagation, thereby reducing scratches and wear on the condenser glass, improving its appearance, extending its service life, and reducing maintenance costs. In addition, it also reduces the impact of condenser glass scratches on the sensing components, improving the working performance of the sensing components.

[0089] To make the objectives and advantages of this application clearer, the effects of the column assembly of this application will be further explained in detail below with reference to specific embodiments.

[0090] Surface hardness HV test: A micro Vickers hardness tester was used with a diamond square pyramid indenter. A pressure of F = 5 kgf was applied to the glass column for 10 seconds to indent the surface. The lengths of the first diagonal indentation (L1) and the second diagonal indentation (L2) were measured at a multiplier of 1000. The surface hardness HV was then calculated using the following formula: Surface hardness HV = 0.1891 × F × 9.8 / ((L1 + L2) / 2) 2 .

[0091] In Examples 1-9, the column glass is made of high-alumina glass with a physical thickness of 3.2 mm.

[0092] In Examples 10-17, the column glass is made of borosilicate glass with a physical thickness of 3.2 mm.

[0093] In Examples 18-25, the column glass is made of soda-lime glass with a physical thickness of 3.2 mm.

[0094] The structural parameters of the column assemblies in Examples 1-9 are shown in Table 1.

[0095] Table 1: Structural parameters of the column assembly in Examples 1-9

[0096] The structural parameters of the column assemblies in Examples 10-17 are shown in Table 2.

[0097] Table 2: Structural parameters of the column assembly in Examples 10-17

[0098] The structural parameters of the column assemblies in Examples 18-25 are shown in Table 3.

[0099] Table 3: Structural parameters of the column assembly in Examples 18-25

[0100] Please refer to Figure 5. The data in Figure 5 were obtained through an abrasion test using an abrasion tester. The unit of the test cycle is the number of revolutions, r. The abrasion test method follows the test procedure described in Chapter 7.0 of the national standard GB / T 5137.1 Automotive Safety Glass Test Methods Part 1: Mechanical Properties Test.

[0101] As shown in Figure 5, compared with related technologies that use soda-lime glass as the material for the column glass, this embodiment uses borosilicate glass and high-alumina glass as the materials for the column glass, which reduces the indentation of the diamond square pyramid indenter on the column glass and makes the test period for the column glass to remain intact in the abrasion test significantly longer.

[0102] Furthermore, referring to Tables 1-3, it can be seen that compared to related technologies that use soda-lime glass as the material for the column glass, this embodiment uses borosilicate glass and high-alumina glass as the materials for the column glass, limiting the surface hardness HV ≥ 500 and the first coefficient of thermal expansion CTE1 ≤ 80X10. -7 The temperature of / ℃ gives the pillar glass excellent anti-friction properties and reduces crack propagation, thereby reducing scratches and wear on the pillar glass, improving its appearance, extending its service life, and reducing maintenance costs. In addition, it also reduces the impact of scratches on the sensing components, improving the working effect of the sensing components.

[0103] The above description represents some embodiments of this application. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.

Claims

1. A column assembly, characterized in that, The column assembly includes a bracket and a column glass. The column glass is mounted on the outside of the bracket. The column glass has a surface hardness HV and a first coefficient of thermal expansion CTE1. The surface hardness HV ≥ 500, and the first coefficient of thermal expansion CTE1 ≤ 80 × 10⁻⁶. -7 / ℃.

2. The column assembly as described in claim 1, characterized in that, The surface hardness HV is ≥550, ≥575, or ≥600.

3. The column assembly as described in claim 1 or 2, characterized in that, The surface hardness is HV≤700.

4. The column assembly as described in claim 1, characterized in that, The first coefficient of thermal expansion, CTE1, is ≤70 x 10⁻⁶. -7 / ℃, or ≤60X10 -7 / ℃, or ≤50X10 -7 / ℃.

5. The column assembly as described in claim 1 or 4, characterized in that, The first coefficient of thermal expansion, CTE1, is ≥30 x 10⁻⁶. -7 / ℃.

6. The column assembly as described in claim 1, characterized in that, The column glass is pressed using a diamond pyramid indenter, and the surface hardness HV of the column glass satisfies: HV=0.1891×F×9.8 / ((L1+L2) / 2) 2 , F=5Kgf, 115μm≤L1≤135μm, 115μm≤L2≤135μm; The pressure exerted by the diamond pyramid indenter on the column glass is F, where F is in kgf; the length of the first diagonal indentation formed by the diamond pyramid indenter on the surface of the column glass is L1, where L1 is in μm; the length of the second diagonal indentation formed by the diamond pyramid indenter on the surface of the column glass is L2, where L2 is in μm, and the first diagonal indentation and the second diagonal indentation are interleaved.

7. The column assembly as described in claim 6, characterized in that, The length L1 of the first diagonal indentation is 115μm~130μm, or 120μm~130μm, or 120μm~125μm; The length L2 of the second diagonal indentation is 115μm~130μm, or 120μm~130μm, or 120μm~125μm.

8. The column assembly as described in claim 1, characterized in that, The pillar glass includes a glass substrate and a shielding layer disposed on one side of the glass substrate. The glass substrate has a first coefficient of thermal expansion CTE1, and the shielding layer has a second coefficient of thermal expansion CTE2. The ratio of the second coefficient of thermal expansion CTE2 to the first coefficient of thermal expansion CTE1 is 0.9 to 1.

1.

9. The column assembly as described in claim 8, characterized in that, The second coefficient of thermal expansion, CTE2, is ≤80 x 10⁻⁶. -7 / ℃, or ≤70X10 -7 / ℃, or ≤60X10 -7 / ℃; The second coefficient of thermal expansion, CTE2, is ≥30 x 10⁻⁶. -7 / ℃.

10. The column assembly as described in claim 8, characterized in that, The bracket and the column glass are bonded together by adhesive, the adhesive is in contact with the shielding layer, and the adhesive has a third coefficient of thermal expansion CTE3, the ratio of the second coefficient of thermal expansion CTE2 to the third coefficient of thermal expansion CTE3 is 0.04 to 0.

1.

11. The column assembly as described in claim 10, characterized in that, The third coefficient of thermal expansion, CTE3, is 30 x 10. -7 / ℃~500X10 -7 / ℃.

12. The column assembly as described in claim 10, characterized in that, The tensile strength of the adhesive is ≤10 N / mm. 2 or ≤7N / mm 2 or ≤5N / mm 2 .

13. The column assembly as claimed in claim 1, characterized in that, The column glass is made of at least one of borosilicate glass and high-alumina glass.

14. The column assembly as described in claim 13, characterized in that, The borosilicate glass, by mass of oxides, is composed of the following components in the following mass percentages: 75%–85% SiO2, 10%–16% B2O3, 2%–3% Al2O3, 3%–7% Na2O and K2O.

15. The column assembly as described in claim 13, characterized in that, The high-alumina glass, by mass of oxides, is composed of the following components in the following mass percentages: 52%–75% SiO2, 15%–27% Al2O3, 0%–5% K2O, and 0%–1% Na2O.

16. The column assembly as claimed in claim 1, characterized in that, The visible light transmittance TL of the column glass is ≥90%, ≥92%, or ≥95%; And / or, the physical thickness of the column glass is ≤5mm, or ≤4mm, or ≤3mm.

17. The column assembly as claimed in claim 1, characterized in that, The column glass includes a first glass plate, an adhesive layer, and a second glass plate. The first glass plate has a first surface and a second surface, and the second glass plate has a third surface and a fourth surface. The adhesive layer connects the second surface and the third surface. The support is located on the fourth side, and the first glass plate has the surface hardness HV and the first coefficient of thermal expansion CTE1.

18. The column assembly as claimed in claim 1, characterized in that, The column assembly satisfies at least one of the following conditions: The pillar assembly also includes a sensing component for acquiring data on the external environment of the vehicle, the sensing component being located on the inner side of the pillar glass; The bracket is installed on the A-pillar, B-pillar, C-pillar, or D-pillar of the vehicle.

19. The column assembly as claimed in claim 1, characterized in that, The column assembly also includes an NFC module or an RFID module.

20. A vehicle, characterized in that, It includes a vehicle body and a pillar assembly as described in any one of claims 1-19, the pillar assembly being mounted on the vehicle body.

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