Packaging structure for image sensor and packaging method therefor

Abstract

Disclosed are a packaging structure for an image sensor and a packaging method therefor. The packaging structure comprises: a printed circuit board; an image sensor chip mounted on the printed circuit board; a support member disposed on the printed circuit board; a filter disposed on the side of the image sensor chip away from the printed circuit board and supported by the support member; and a sealant disposed between the printed circuit board and the filter and surrounding the image sensor chip to bond the filter to the printed circuit board.

Description

Packaging Structure and Packaging Method for Image Sensors Technical Field

[0001] Embodiments of this disclosure relate to a packaging structure for an image sensor, and also to a packaging method for the packaging structure of an image sensor. Background Technology

[0002] In the prior art, image sensors typically have an image sensor chip mounted on a printed circuit board. To protect the image sensor from light that the sensor cannot capture, a filter is usually placed on the side of the image sensor chip away from the printed circuit board. In the prior art, this filter is usually attached to a holder, which is then attached to the printed circuit board. However, due to the large size of the holder, the overall size of the image sensor is large, and the number of components and assembly steps are increased, resulting in higher costs. Summary of the Invention

[0003] One object of this disclosure is to address at least one aspect of the aforementioned problems and defects existing in the prior art.

[0004] According to an exemplary embodiment of one aspect of this disclosure, a packaging structure for an image sensor is provided, the packaging structure comprising: a printed circuit board; an image sensor chip mounted on the printed circuit board; a support member disposed on the printed circuit board; a filter disposed on the side of the image sensor chip away from the printed circuit board and supported by the support member; and a sealant disposed between the printed circuit board and the filter and surrounding the image sensor chip to bond the filter to the printed circuit board.

[0005] According to an exemplary embodiment of the present disclosure, the support member is mounted on the printed circuit board using surface mount technology.

[0006] According to an exemplary embodiment of this disclosure, the printed circuit board, the filter, and the sealant form a closed space, the image sensor chip is located within the closed space, and the printed circuit board also has a through hole, through which the closed space communicates with the outside.

[0007] According to an exemplary embodiment of the present disclosure, the through hole has a circular cross-section and a diameter of 0.1 mm to 0.3 mm.

[0008] According to an exemplary embodiment of the present disclosure, there are multiple support members, which are spaced apart around the image sensor chip.

[0009] According to an exemplary embodiment of this disclosure, the image sensor chip is connected to the printed circuit board via a bonding lead, and the distance between the sealant and the connection point where the bonding lead connects to the printed circuit board is ≥1mm.

[0010] According to an exemplary embodiment of this disclosure, the sealant is located on the side of the support member away from the image sensor chip in a plane parallel to the printed circuit board.

[0011] According to an exemplary embodiment of this disclosure, the sealant is located on the side of the support member closer to the image sensor chip in a plane parallel to the printed circuit board.

[0012] According to an exemplary embodiment of this disclosure, the support member is located inside the sealant in a plane parallel to the printed circuit board.

[0013] According to another aspect of this disclosure, a packaging method for an image sensor packaging structure as described above is also provided, wherein the packaging method includes: S1: providing a printed circuit board on which a support member is disposed; S2: mounting an image sensor chip on the printed circuit board; S3: applying a sealant to the printed circuit board; and S4: placing a filter over the sealant and the support member, and pressing the filter to bond the filter to the printed circuit board.

[0014] According to an exemplary embodiment of this disclosure, the height of the pre-cured sealant applied to the printed circuit board in a direction perpendicular to the plane of the printed circuit board is greater than or equal to the height of the support member.

[0015] According to another aspect of this disclosure, a motor vehicle is also provided. The motor vehicle includes an image sensor packaged according to the packaging structure described above. Attached Figure Description

[0016] The above and other aspects, features, and advantages of various embodiments of the present disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0017] Figure 1 is a top view schematic diagram of a packaging structure for an image sensor according to an exemplary embodiment of the present disclosure.

[0018] Figure 2 is a cross-sectional schematic diagram of the packaging structure for the image sensor shown in Figure 1.

[0019] Figure 3 is a cross-sectional schematic diagram of a packaging structure for an image sensor according to another exemplary embodiment of the present disclosure.

[0020] Figure 4 is a cross-sectional schematic diagram of a packaging structure for an image sensor according to yet another exemplary embodiment of the present disclosure.

[0021] Figure 5 is a flowchart of a packaging method for an image sensor according to yet another exemplary embodiment of the present disclosure.

[0022] Figure 6 is a motor vehicle according to an exemplary embodiment of the present disclosure. Detailed Implementation

[0023] The exemplary embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of this disclosure. In the drawings, the same or similar components are indicated by the same or similar reference numerals. In the following detailed description, numerous specific details are set forth for ease of explanation in order to provide a thorough understanding of the embodiments of this disclosure. However, it will be apparent that one or more embodiments may be practiced without these specific details. Furthermore, well-known structures and apparatuses are illustrated herein to simplify the drawings, and descriptions of well-known structures and technologies are omitted to avoid unnecessarily obscuring the concepts of this disclosure.

[0024] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this disclosure. The terms “comprising,” “including,” “having,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0025] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid manner.

[0026] Based on the general inventive concept of this disclosure, a packaging structure for an image sensor is provided, the packaging structure comprising: a printed circuit board; an image sensor chip mounted on the printed circuit board; a support member disposed on the printed circuit board; a filter disposed on the side of the image sensor chip away from the printed circuit board and supported by the support member; and a sealant disposed between the printed circuit board and the filter and surrounding the image sensor chip to bond the filter to the printed circuit board. Here, the image sensor chip may include photosensitive devices based on various imaging principles, such as charge-coupled devices (i.e., CCD image sensors), metal-oxide-semiconductor elements (i.e., CMOS image sensors), etc. This disclosure does not limit the type or packaging form of the image sensor chip.

[0027] As shown in Figures 1-4, an exemplary embodiment of this disclosure provides a packaging structure for an image sensor, comprising: a printed circuit board 1, an image sensor chip 2, a support member 5, and a filter 3. The image sensor chip 2 is mounted on the printed circuit board 1. The support member 5 is disposed on the printed circuit board 1. The filter 3 is disposed on the side of the image sensor chip 2 away from the printed circuit board 1 and is supported by the support member 5. Furthermore, the packaging structure includes a sealant 4 disposed between the printed circuit board 1 and the filter 3 and surrounding the image sensor chip 2. The sealant 4 may be, for example, a non-conductive paste-like adhesive. During assembly, the sealant 4 is applied around the outer side of the image sensor chip 2 onto the printed circuit board 1, then the filter 3 is placed over the support member 5 and the sealant 4, and pressed towards the printed circuit board 1 to firmly bond the filter 3 to the printed circuit board 1 via the sealant 4. According to the packaging structure disclosed herein, a support member 5 supports the filter 3 to control the distance between the filter 3 and the printed circuit board 1. Furthermore, the packaging structure securely bonds the filter 3 to the printed circuit board 1 using a sealant 4. This eliminates the need for a retainer in the prior art, thereby reducing the number of parts and assembly steps, and ultimately lowering costs. Moreover, by removing the retainer, the dimensions of the packaging structure in the direction perpendicular to the plane of the printed circuit board 1 can be significantly reduced.

[0028] According to exemplary embodiments of the present disclosure, as shown in Figures 2 to 4, the printed circuit board 1, the filter 3, and the sealant 4 form a closed space, within which the image sensor chip 2 is located to prevent external foreign objects from entering and damaging the image sensor chip 2. As shown in Figure 1, the printed circuit board 1 of the packaging structure according to the present disclosure also has a through hole 6, through which the closed space formed by the printed circuit board 1, the filter 3, and the sealant 4 communicates with the outside. Thus, when the filter 3 is pressed towards the printed circuit board 1, excess air in the closed space can be squeezed out through the through hole to balance the pressure inside and outside the closed space.

[0029] In this embodiment, as shown in FIG1, the cross-section of the through hole 6 is circular, and its diameter is preferably in the range of 0.1 mm to 0.3 mm. This allows excess air to be discharged from the enclosed space while preventing foreign objects from entering it. It should be noted that in other embodiments of this disclosure, the through hole may also be of other shapes, such as rectangular or elliptical. When other shapes are used, the maximum dimension of the through hole 6 in any direction is preferably in the range of 0.1 mm to 0.3 mm.

[0030] In this embodiment, as shown in FIG1, six support members 5 are arranged at intervals around the image sensor chip 2 to apply a uniform supporting force to the filter 3. However, in other embodiments of this disclosure, the number of support members 5 may be one or more, such as two, three, or four. When multiple support members are present, they are preferably located at the corners of the filter 3. Furthermore, the support members 5 can be mounted on the printed circuit board 1 using surface mount technology (SMT). It should be noted that in other embodiments of this disclosure, the support members 5 can also be mounted on the printed circuit board 1 by other means, such as soldering.

[0031] According to embodiments of this disclosure, as shown in Figures 2 to 4, the image sensor chip 2 is connected to the printed circuit board 1 via bonding leads 7, wherein the distance between the sealant 4 and the connection point where the bonding leads 7 and the printed circuit board 1 are connected should be ≥1mm. This prevents the sealant 4 from adhering to the connection point and / or the bonding leads 7 when the filter 3 is pressed.

[0032] In this embodiment, as shown in Figures 1 and 2, the sealant 4 is located on the side of the support 5 away from the image sensor chip 2 in a plane parallel to the printed circuit board 1. However, it should be noted that in some other embodiments of this disclosure, as shown in Figure 3, the sealant 4 may also be located on the side of the support 5 closer to the image sensor chip 2 in a plane parallel to the printed circuit board 1, or as shown in Figure 4, the support 5 may be located inside the sealant 4 in a plane parallel to the printed circuit board 1.

[0033] According to another aspect of this disclosure, as shown in FIG5, a packaging method for an image sensor packaging structure as described above is also provided, the packaging method comprising:

[0034] S1: A printed circuit board 1 is provided, on which a support member 5 is provided, which can be mounted on the printed circuit board 1, for example, by surface mount technology (SMT).

[0035] S2: Mount the image sensor chip 2 onto the printed circuit board 1;

[0036] S3: Apply sealant 4 to printed circuit board 1; and

[0037] S4: Place the filter 3 on top of the sealant 4 and the support 5, and press the filter 3 down.

[0038] In this embodiment, in step S3, the height of the pre-cured sealant 4 applied to the printed circuit board 1 in the direction perpendicular to the plane of the printed circuit board 1 is greater than or equal to the height of the support member 5. For example, the height of the sealant 4 in the direction perpendicular to the plane of the printed circuit board 1 is 1 mm, while the height of the support member 5 in the direction perpendicular to the plane of the printed circuit board 1 is 0.9 ± 0.1 mm. This allows the cured sealant 4 to be firmly bonded to the filter 3 without being affected by the support member 5.

[0039] According to another aspect of this disclosure, as shown in FIG6, a motor vehicle 100 is also provided. The motor vehicle 100 includes an image sensor 10 packaged according to the packaging structure described above. For a detailed description of the packaging structure given above with reference to FIGS. 1 to 4, it will not be repeated here for the sake of brevity.

[0040] Those skilled in the art will understand that the embodiments described above are merely exemplary, and that modifications can be made thereto without departing from the spirit and scope of the application as set forth in the claims and the full scope of equivalents thereof. Although some embodiments of the present general inventive concept have been shown and described, it will be apparent to those having ordinary skill in the art that changes can be made in the embodiments without departing from the spirit and the principles of the general inventive concept, the scope of which is not intended to be limited to the embodiments shown but is intended to be accorded the full scope consistent with the claims and their equivalents.

Claims

1. A packaging structure for an image sensor, the packaging structure comprising: Printed circuit boards; An image sensor chip, wherein the image sensor chip is mounted on the printed circuit board; A support member disposed on the printed circuit board; A filter is disposed on the side of the image sensor chip away from the printed circuit board and is supported by the support member; as well as A sealant is disposed between the printed circuit board and the filter and surrounds the image sensor chip to bond the filter to the printed circuit board. The number of the support members is multiple, and the multiple support members are arranged at intervals around the image sensor chip.

2. The packaging structure according to claim 1, wherein, The support component is mounted on the printed circuit board using surface mount technology.

3. The packaging structure according to claim 1, wherein, The printed circuit board, the filter, and the sealant form a closed space, and the image sensor chip is located inside the closed space. The printed circuit board also has through holes, and the closed space is connected to the outside world through the through holes.

4. The packaging structure according to claim 3, wherein, The through hole has a circular cross-section and a diameter of 0.1 mm to 0.3 mm.

5. The packaging structure according to claim 1, wherein, The image sensor chip is connected to the printed circuit board via bonding leads, and the distance between the sealant and the connection point between the bonding leads and the printed circuit board is ≥1mm.

6. The packaging structure according to any one of claims 1 to 5, wherein, The sealant is located on the side of the support member away from the image sensor chip in a plane parallel to the printed circuit board.

7. The packaging structure according to any one of claims 1 to 5, wherein, The sealant is located on the side of the support member closest to the image sensor chip in a plane parallel to the printed circuit board.

8. The packaging structure according to any one of claims 1 to 5, wherein, The support member is located inside the sealant in a plane parallel to the printed circuit board.

9. A packaging method for a packaging structure for an image sensor according to any one of claims 1 to 8, wherein, The encapsulation method includes: S1: A printed circuit board is provided, on which a support member is provided; S2: Install the image sensor chip on the printed circuit board; S3: Apply sealant to the printed circuit board; and S4: Place the filter on top of the sealant and the support, and press the filter to bond it to the printed circuit board.

10. The packaging method according to claim 9, wherein, The height of the pre-cured sealant applied to the printed circuit board in the direction perpendicular to the plane of the printed circuit board is greater than or equal to the height of the support member.

11. A motor vehicle comprising an image sensor encapsulated in an encapsulation structure according to any one of claims 1 to 8.

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