Haptic device and haptic system

Abstract

The invention relates to a haptic device (100) which comprises a piezoelectric actuator (1) having a main body (10) and at least one reinforcing element (30) on a first main surface (11) of the piezoelectric actuator (1), wherein the at least one reinforcing element (30) has at least one securing portion (39) via which the at least one reinforcing element (30) is secured to the main body (10), and a reciprocatingly movable portion (31) which is arranged at a distance above the first main surface (11), and an electrical functional element (2) is secured on the first main surface (11) between the reciprocatingly movable portion (31) and the main body (10). The invention also relates to a haptic system (1000) comprising a haptic device (100).

Description

[0001] P2025, 0200 WO N 17 March 2026

[0002] Description

[0003] Haptic device and haptic system

[0004] A haptic device is described. Such a device has an actuator that can generate and / or detect movement. The actuator is, for example, a piezoelectric actuator, in particular a piezoceramic actuator.

[0005] Furthermore, a haptic system is defined as comprising a haptic device. For example, the haptic device within the haptic system can be coupled with a movable and / or flexible element, which may be designed, for instance, as a touch-sensitive surface of a button or display. The haptic device may be designed, for example, to detect the application of force through touch and / or to generate haptic feedback upon contact. The haptic device may be used, for example, in a touchscreen, trackpad, push button, or stylus (pen-like device). For example, the haptic device may be used in the automotive sector. Furthermore, the haptic device may be used in the field of wearable information processing devices.

[0006] Devices for generating haptic feedback are known from the publications DE 10 2015 117 262 Al, DE 10 2016 116 763 Al and WO 2018 / 046 201 Al, in which a gain element is attached to a piezoelectric actuator for P2025, 0200 WO N 17 . March 2026

[0007] 2

[0008] The lifting reinforcement is attached. The reinforcing element is, for example, in the form of a metal sheet.

[0009] At least one function of some implementation forms is to specify a haptic device. At least another function of some implementation forms is to specify a haptic system.

[0010] These tasks are solved by articles according to the independent patent claims. Advantageous

[0011] The various forms and further developments of the items are characterized in the dependent claims and are further shown in the following description and drawings.

[0012] A haptic device is specified according to at least one embodiment. For example, the haptic device may be designed to detect haptic input. Furthermore, the haptic device may also be designed to output haptic feedback. In other words, the haptic device may be configured to detect a haptic signal caused by a user. It may also be configured to output a haptic signal to a user. In particular, the haptic device may be designed to generate haptic feedback. Therefore, the haptic device may be configured to provide perceptible feedback to a user for certain actions or inputs.

[0013] According to at least one further embodiment, a haptic system with at least one haptic device is specified. P2025, 0200 WO N 17 March 2026

[0014] 3

[0015] The design forms and features described herein apply equally to the haptic device and the haptic system.

[0016] The haptic device preferably comprises a piezoelectric actuator. The piezoelectric actuator can be configured to detect haptic input and / or to output haptic feedback. The piezoelectric actuator can be based on a piezoelectric material, in particular a piezoelectric ceramic material or a piezoelectric polymer material. The piezoelectric actuator can have a base body containing the piezoelectric material. In the following, the term "piezoelectric actuator" can refer to both the base body and vice versa.

[0017] Furthermore, one or more electrodes can be provided on and / or within the base body. If no electrodes are present in the base body, i.e., if the base body has no internal electrodes, the piezoelectric actuator can be designed as a monolithic actuator, for example, as a disk or plate. Alternatively, the piezoelectric actuator can have at least one or more internal electrodes. In this case, the base body of the piezoelectric actuator can be constructed in a multilayer design with multiple piezoelectric layers arranged along a stacking direction and the internal electrodes.

[0018] The base body, and thus the piezoelectric actuator, can preferably be cuboid in shape and have a longitudinal direction. For example, the longitudinal direction can be a direction with the greatest extent of the P2025, 0200 WO N 17 . March 2026

[0019] 4

[0020] The basic body corresponds to the base body. If the base body is constructed using a multi-layered design, the longitudinal direction can preferably be perpendicular to the stacking direction.

[0021] By applying a suitable electrical signal, the piezoelectric actuator can undergo a change in its dimensions in at least one direction, whereby this change can be part of the haptic signal. Applying an alternating voltage can generate a periodic change and thus a vibration. In particular, the change in the dimensions of the piezoelectric actuator can be caused at least by the d31 effect and correspond at least to a change in the length of the piezoelectric actuator along its longitudinal direction. Conversely, a mechanical action, caused by haptic input, can induce a change in the dimensions of the base body in at least one direction, particularly preferably the longitudinal direction. Due to the inverse piezoelectric effect, this change in dimensions can generate an electrical voltage in the piezoelectric material, which can be detected, for example, via the internal electrodes.

[0022] The use of a piezoelectric actuator for detection and / or generation of a haptic signal offers significant advantages. A piezoelectric actuator has a short response and decay time.

[0023] Accordingly, the time and period in which the haptic signal is detected or generated can be determined very precisely. Furthermore, when generating a haptic signal by varying the control signal applied to the piezoelectric actuator, for example with regard to frequency, voltage, pulse rate, and signal type, the following can be determined: P2025, 0200 WO N 17 March 2026

[0024] 5

[0025] The amplitude, frequency, and duration of the vibration of the piezoelectric actuator can be determined. Different control signals can be used to generate different haptic signals.

[0026] According to another embodiment, the haptic device has at least one mechanical reinforcing element, which is hereinafter referred to simply as at least one reinforcing element. The at least one reinforcing element is attached to the piezoelectric actuator. In particular, the at least one reinforcing element can be attached to the piezoelectric actuator such that a change in the extension of the piezoelectric actuator in at least one direction deforms the at least one reinforcing element, thereby moving at least some areas of the first reinforcing element. Particularly preferably, the at least one reinforcing element can be attached to the piezoelectric actuator such that a change in the length of the piezoelectric actuator, and in particular of the base body, at least along its longitudinal direction, moves an area of ​​the at least one reinforcing element in a direction perpendicular to the longitudinal direction.Furthermore, a direction is also possible that forms an angle with the longitudinal direction greater than 0° and less than 90°. In other words, a section of at least one reinforcing element can be moved in a direction oblique to the longitudinal direction.

[0027] In particular, the base body can have a first main surface and a second main surface opposite the first main surface. The first main surface and the second main surface can each be a P2025, 0200 WO N 17 March 2026

[0028] 6

[0029] The main extension direction must be parallel to the longitudinal direction. The arrangement direction from the first main surface to the second main surface, which in the case of a multi-layered base body may preferably coincide with the stacking direction, is particularly preferably perpendicular to the longitudinal direction. The at least one reinforcing element may preferably be applied to and attached to one of the main surfaces. Without being intended as a limitation, it is assumed below that if the haptic device has only one reinforcing element, this element is arranged on the first main surface of the base body.

[0030] The basic body can further have side surfaces that connect the first and second main surfaces. In particular, the basic body can have two opposing side surfaces. Furthermore, the basic body can have two opposing end faces. The side surfaces extend along the longitudinal direction, while the end faces are preferably oriented perpendicular to the longitudinal direction.

[0031] The at least one amplifying element may comprise or be a first mechanical amplifying element, hereinafter referred to as the first amplifying element, which is applied and attached to the first main surface of the base body and thus to the first main surface of the piezoelectric actuator. Furthermore, the at least one amplifying element may, in addition to the first amplifying element, comprise at least a second mechanical amplifying element, hereinafter referred to as the second amplifying element, which is applied to the second main surface of the base body and thus to the P2025, 0200 WO N 17 March 2026

[0032] 7

[0033] The second main surface of the piezoelectric actuator is applied and attached. Thus, the haptic device can particularly preferably have the piezoelectric actuator arranged between the first and second reinforcing elements.

[0034] The following description is essentially limited to the aforementioned at least one reinforcing element and applies to the first reinforcing element and, if present in the haptic device, also to the second reinforcing element. The features and properties described above and below for the at least one reinforcing element can therefore apply accordingly to the first reinforcing element and, if present in the haptic device, to the second reinforcing element. Preferably, the first reinforcing element and, if present, the second reinforcing element are identical and can thus exhibit the same features and properties. If the haptic device has more than two reinforcing elements, the described features and embodiments apply accordingly.

[0035] The at least one reinforcing element can be made of or comprise metal, for example steel and / or titanium. For example, the at least one reinforcing element can be plate-shaped. Particularly preferably, the at least one reinforcing element can be a metal bracket, i.e., a metal strip or a metal sheet with a non-planar geometry. The at least one reinforcing element can, for example, have at least one or preferably at least two fastening areas, which preferably are edge regions of the at least one reinforcing element along the P2025, 0200 WO N 17 . March 2026

[0036] 8

[0037] The reinforcement element can be attached to one or two end regions of a main surface of the base body along the longitudinal direction of the piezoelectric actuator. Adjacent to one of the attachment regions or between the at least two attachment regions, the at least one reinforcement element can have at least one stroke region spaced apart from the piezoelectric actuator. Thus, the at least one reinforcement element preferably has at least one attachment region by which it is fastened to the base body, and a stroke region spaced apart above the corresponding main surface. A free space can therefore be provided between the stroke region and the corresponding main surface, allowing the stroke region to move towards the main surface when a corresponding external force is applied.If at least one reinforcing element has more than one fastening area, these, as well as the manner of the respective fastening, are preferably designed in the same way.

[0038] For example, a bonding layer can be arranged between the at least one mounting area and the first main surface, so that the mounting of the at least one mounting area to the base body, and thus to the piezoelectric actuator, can particularly preferably be effected by the bonding layer. The bonding layer can particularly preferably comprise an adhesive or be an adhesive layer. Thus, the term "bonding layer" in the following can also include the material of the bonding layer, i.e., for example, an adhesive. The at least one reinforcing element can thus preferably be attached to the piezoelectric actuator by a P2025, 0200 WO N 17 . March 2026

[0039] 9

[0040] The adhesive bond should be used. If this is at least one reinforcing element made of or containing titanium, it can have the advantage that its coefficient of thermal expansion is very similar to that of the piezoelectric actuator, so that temperature changes result in only slight or no mechanical stress, meaning that the adhesive bond is not subjected to any or only minimal mechanical stress during temperature changes. Furthermore, the bonding layer can also be, for example, a solder layer, a weld layer, or a silver sinter layer.

[0041] As described above, at least one amplifying element can convert a change in expansion, and particularly preferably a change in length, of the piezoelectric actuator into a change in expansion and / or a stroke movement perpendicular or oblique to the change in expansion and preferably to the change in length. Conversely, a mechanically induced change in expansion and / or stroke movement, for example by a user, can be converted into a change in expansion and particularly preferably a change in length of the piezoelectric actuator that is perpendicular or oblique to it. In the case of a multi-layer piezoelectric actuator, the direction of the stroke movement can preferably correspond to the stacking direction. The stroke movement can have a significantly larger amplitude than the change in length. For example, the amplitude of the stroke movement can be 5 to 40 times the amplitude of the change in length.By combining the piezoelectric actuator with at least one amplifying element, an amplification can thus be achieved. P2025, 0200 WO N 17 . March 2026.

[0042] 10

[0043] According to another embodiment, an electrical functional element is arranged and attached to the main surface on which the at least one reinforcing element is located, below the stroke area, i.e., particularly when viewed from the stroke area in a direction perpendicular to said main surface. In other words, the electrical functional element is attached to the main surface between the stroke area and the base body. Attaching the electrical functional element to the main surface allows for a larger contact area compared to attaching it to a side surface of the piezoelectric actuator, thereby strengthening the attachment and achieving higher release forces. The electrical functional element can, in particular, be arranged in the free space between the stroke area and the piezoelectric actuator on the main surface.The electrical functional element can particularly preferably be attached to the main surface by means of at least one soldered connection and / or at least one adhesive connection. In other words, at least one connecting material, which may include an adhesive and / or a solder, can be arranged between the electrical functional element and the main surface, preferably in direct contact with the electrical functional element and the main surface. The main surface with the at least one reinforcing element and the electrical functional element can, for example, be the first main surface, wherein, in addition, a further electrical functional element can be attached to the opposite second main surface of the base body, irrespective of whether a second reinforcing element is arranged on the second main surface. Further P2025, 0200 WO N 17 March 2026.

[0044] 11

[0045] An electrical functional element can also be attached only to the second main surface. Features and embodiments described here and below for an electrical functional element can apply to any electrical functional element on the base body. An electrical functional element on the first main surface and another electrical functional element on the second main surface can be identical or different.

[0046] According to another embodiment, the haptic device has at least one outer electrode for electrically contacting the piezoelectric actuator on a main surface, particularly preferably the main surface on which the at least one reinforcing element is mounted. The at least one outer electrode is arranged below the stroke range of the at least one reinforcing element. The at least one outer electrode can, for example, be a first outer electrode on the piezoelectric actuator. Particularly preferably, the haptic device has at least two outer electrodes on the piezoelectric actuator. The at least two outer electrodes can be different or, preferably, identical or similar. Features and embodiments described here and below in connection with the at least one outer electrode can relate to one, several, or preferably all outer electrodes of the haptic device.

[0047] In particular, the haptic device can have at least two external electrodes for electrically contacting the piezoelectric actuator. Specifically, the at least two external electrodes can be used for electrical P2025, 0200 WO N 17 . March 2026

[0048] 12

[0049] Control of the base body, and thus of the piezoelectric actuator, must be provided and configured. The at least two outer electrodes can be formed on the same main surface or on opposing main surfaces, so that in this case a first outer electrode can be formed on the first main surface and a second outer electrode on the second main surface. In other words, the first and second outer electrodes can, for example, be formed on the first main surface below the stroke area of ​​a first reinforcement element, regardless of whether a second reinforcement element is arranged on the second main surface.Alternatively, it is also possible that a first outer electrode is arranged on the first main surface with a first reinforcing element, and that a second outer electrode is formed on the second main surface, regardless of whether a second reinforcing element is arranged on the second main surface. Alternatively, it is also possible that a reinforcing element is arranged on the first main surface, and that a first outer electrode and a second outer electrode are arranged on the second main surface, regardless of whether a second reinforcing element is arranged on the second main surface. If at least one outer electrode and a second reinforcing element are present on the second main surface, the at least one outer electrode is located below the stroke area of ​​the second reinforcing element.

[0050] The at least one outer electrode can preferably be in the form of a coating, in particular with one or more metal layers, each comprising one or more metals. P2025, 0200 WO N 17 . March 2026

[0051] 13

[0052] and / or alloys. The at least one outer electrode can preferably be applied by means of a metallization process at least on a main surface or also on a side surface of the base body.

[0053] If the piezoelectric actuator has internal electrodes as described above, at least one external electrode can be in electrical contact with internal electrodes, so that the respective internal electrodes can be electrically contacted via the external electrode. For example, two external electrodes can be present in the form of a first external electrode and a second external electrode, and the internal electrodes can be in alternating electrical contact with the first external electrode or with the second external electrode, so that the internal electrodes can be alternately controlled by the first external electrode or the second external electrode.

[0054] According to another embodiment, the haptic device has at least one electrical through-hole, also referred to as an electrical via or simply as a via, which extends from the main surface on which the at least one outer electrode is formed into the base body and is in electrical contact with internal electrodes in the base body. Furthermore, it is also possible that the at least one outer electrode extends onto a side surface of the base body adjacent to the first main surface and is in electrical contact with internal electrodes in the base body at that side surface. P2025, 0200 WO N 17 March 2026

[0055] According to another embodiment, the electrical functional element is in electrical contact with the at least one outer electrode. In particular, the electrical functional element can be mounted on the at least one outer electrode. For example, the electrical functional element can be soldered to the at least one outer electrode, i.e., attached by means of a soldered connection, or attached by means of an adhesive connection with an electrically conductive adhesive. In addition, the electrical functional element can also be attached, for example, by means of an adhesive connection to a part of the main surface, i.e., directly adjacent to and / or spaced apart from the at least one outer electrode and / or to a side surface adjacent to the main surface.This allows for higher release forces of the electrical functional element from the piezoelectric actuator and thus a more durable connection between the electrical functional element and the piezoelectric actuator.

[0056] According to another embodiment, the electrical functional element is at least partially designed as a connection element, preferably as an at least partially flexible connection element. The connection element can comprise a rigid printed circuit board (PBC), a flexible printed circuit board (FPC), and / or a cable, in particular a multi-pole cable such as a two-pole cable, and may, for example, have one or more connection points, such as solder contacts or a connector, on a side facing away from the base body or at other positions, via which the haptic device can be connected externally. The term "printed circuit board" may, in the following, refer to a PBC or FPC or a combination thereof, also P2025, 0200 WO N 17 March 2026

[0057] 15

[0058] can be described as rigid-flex printed circuit board or rigid-flex PCB.

[0059] Thus, the electrical functional element can preferably be configured, at least partially, as a connection element that is connected to the at least one external electrode and that has at least one connection point for the external electrical connection of the haptic device. In particular, the connection element can have at least one connection point for each external electrode to which the electrical functional element is electrically connected. Furthermore, the connection element can have one or more connection points via which one or more components, which may be part of the electrical functional element, can be electrically contacted, as described below.

[0060] According to another embodiment, the electrical functional element comprises at least one electrical component, also referred to simply as a component. The electrical component can have electrical and / or electronic properties and may, for example, be designed as an active or passive electrical or electronic component. For instance, the at least one component may be a sensor such as a temperature sensor, an acceleration sensor, a force sensor, a deformation sensor, a capacitive sensor, a current and / or voltage sensor, or a combination thereof. Alternatively or additionally, the at least one electrical component may comprise one or more active and / or passive electrical components, which may be part of a control circuit for operating the haptic device. P2025, 0200 WO N 17 March 2026

[0061] 16

[0062] According to another embodiment, the base body has exactly one inner electrode or group of inner electrodes with a plurality of inner electrodes, which is connected to a further outer electrode. The further outer electrode can, in particular, be a third outer electrode if a first outer electrode and a second outer electrode are provided for electrical contacting the remaining inner electrodes and for electrically controlling the haptic device as described above. The further outer electrode can be formed on the first main surface or on the second main surface and can only be electrically connected to the exactly one inner electrode or group of inner electrodes.

[0063] By measuring an electrical charge at the single inner electrode or group of inner electrodes via the additional outer electrode, a force acting on the haptic device can be determined. This allows the single inner electrode or group of inner electrodes connected to the additional outer electrode to serve as a force sensor integrated into the base body.

[0064] According to another embodiment, the electrical functional element has an electrode layer that can form a first electrode of a capacitive sensor. The at least one amplification element above the electrical functional element can preferably form a second electrode of the capacitive sensor.

[0065] According to another embodiment, the haptic device has a stop structure. The stop structure can be designed and configured to prevent movement of at least one reinforcing element and, in particular, the stroke area in the direction of the base body. P2025, 0200 WO N 17. March 2026

[0066] 17

[0067] to limit, for example, permanent deformation of the at least one reinforcing element or detachment of the at least one reinforcing element from the piezoelectric actuator, and thus irreversible damage to the haptic device. The stop structure thus prevents excessive deformation of the reinforcing element under excessive force, as it limits the travel distance of the stroke in the direction of the base body.

[0068] For example, the at least one reinforcing element in the stroke area has a stop structure for contacting the piezoelectric actuator. The stop structure can be formed, for example, by a forming process such as stamping or deep drawing of a section of the stroke area, or by attaching an additional element to an underside of the stroke area facing the base body. Particularly preferably, the electrical functional element has a recess in the form of an opening through which the main surface of the base body is exposed, and into which the stop structure can engage and, when the at least one reinforcing element is deformed, reach the first main surface, so that the stop structure can effect the same stroke limitation for the stroke area as if no electrical functional element were present.

[0069] For example, the stop structure may have a stiffening layer or be formed by a stiffening layer, which may be an integral part of, for example, a printed circuit board, which in turn may be the electrical functional element or part P2025, 0200 WO N 17 . March 2026

[0070] 18

[0071] This can be formed from it. Furthermore, it is also possible that an additional stop layer is applied to the electrical functional element as an additional element and, for example, glued to the electrical functional element. The thickness of the stop structure can be adapted to the requirements of the haptic device with regard to functionality and durability. For example, the stop structure, in the form of a stiffening layer or a stop layer, can be made of plastic and / or metal. Particularly preferably, the haptic device can have an electrical functional element with a stop structure as described above on both the first and second main surfaces, wherein, for example, only one or both of the electrical functional elements are provided as connection elements (e) for the haptic device.

[0072] According to another embodiment, the haptic system has a support element on which the haptic device is mounted. For example, the haptic device can be attached to the support element by a connecting material.

[0073] According to another embodiment, the bonding material can, for example, be liquefied and / or cured by the application of heat, electromagnetic radiation, an electrical voltage, and / or an electric current. In other words, the bonding material can, for example, be applied in at least partially liquid form and subsequently cured by at least one of the aforementioned effects, so that the bonding material is preferably rigid after curing. "Rigid" with respect to the bonding material can, in particular, mean that the P2025, 0200 WO N 17 March 2026

[0074] 19

[0075] The bonding material in the finished haptic system must possess sufficient hardness so that it no longer changes shape, at least under normal operating conditions. Furthermore, the bonding material can be applied in at least a partially solid form, such as a powder, granules, or block, and can be liquefied by at least one of the aforementioned processes, for example, by melting. After liquefaction, the bonding material preferably resolidifies, i.e., solidifies, and ultimately becomes rigid when the process is removed. In the following, the bonding material in a state after hardening or after liquefaction and subsequent solidification can also be referred to as the "rigid bonding material." The rigid bonding material particularly preferably has a Shore D hardness greater than or equal to 75.

[0076] The bonding material can particularly preferably comprise or be made of a plastic, especially an adhesive or a resin. The plastic can particularly be curable. For example, the plastic can be applied to the support element in liquid or at least partially liquid form and be curable by at least one of the aforementioned processes. Preferably, the plastic can be a thermoplastic or, more preferably, a thermoset. Particularly preferably, the bonding material can be an epoxy and / or acrylate.

[0077] According to another embodiment, the joining material comprises at least one metal, for example in the form of an alloy. In particular, the joining material in this case can be a solder, preferably a P2025, 0200 WO N 17. March 2026

[0078] 20

[0079] low melting solder, exhibit or be made of.

[0080] The solder preferably has a melting point of less than or equal to 160°C and greater than or equal to 130°C. Preferred examples of solders are tin-based solders, particularly in the form of an alloy with one or more selected elements of Pb, Ag, and Cu, for example Sn-Pb and Sn-Ag-Cu.

[0081] Furthermore, the haptic system can include an interaction element that a user can touch to interact with the haptic system. The interaction element can be, for example, a button, a push button, or a display (i.e., a screen or touchscreen), or a part of one of these elements. The haptic device is preferably arranged between the support element and the interaction element. The interaction element can be mechanically coupled to the haptic device directly or indirectly, so that movements of the haptic device, in particular of the reinforcement elements, can be transmitted to the interaction element and vice versa.

[0082] According to another embodiment, the haptic device rests on the support element with a spring element. The spring element can, for example, be integrated into the haptic device and, in this case, is particularly preferably part of a reinforcing element of the haptic device. Alternatively, the spring element can be a separate component arranged between the haptic device and the support element. To manufacture the haptic system, the haptic device with the integrated spring element can be placed on the support element. In the case of a separate spring element, the spring element can be placed on the P2025, 0200 WO N 17. March 2026

[0083] 21

[0084] The support element is placed on the spring element, and the haptic device can be positioned on the spring element. The interaction element can then be arranged above the haptic device and attached directly or indirectly to the support element. Preferably, the interaction element can be mounted above the haptic device from the support element's perspective in such a way that the spring element is at least slightly compressed, thus pressing the haptic device against the interaction element. The spring element can therefore preferably clamp the haptic device between the support element and the interaction element. In other words, the spring element can push the support element and the haptic device apart, thereby pressing the haptic device against the interaction element.

[0085] The spring element can preferably be embedded in the rigid connecting material in such a way that the spring element is essentially immobile. Furthermore, the spring element can be attached to the support element by the connecting material. The connecting material can be provided in the area of ​​the spring element before the interaction element is mounted. For example, before the interaction element is mounted, the spring element can be at least partially covered with liquid, uncured connecting material and / or with solid, unliquefied and subsequently solidified connecting material.After assembly, the joining material can be cured and / or melted and re-solidified in the manner described above, so that the spring element is at least embedded in the joining material and fixed by the rigid joining material in such a way that the spring element is essentially or completely immobile, see P2025, 0200 WO N 17 March 2026.

[0086] 22

[0087] that the haptic device is reliably pressed against the interaction element under normal operating conditions. In the case of a solid bonding material as the starting material, the solid bonding material can also be arranged on the support element, and the spring element can be arranged on the bonding material. By melting the bonding material, the spring element can sink into the molten bonding material until it abuts the support element. Upon subsequent solidification of the bonding material, the spring element is then also at least partially embedded in the bonding material.

[0088] Furthermore, it may be possible that the rigid connecting material adheres directly to the haptic device, in particular to the lifting area of ​​the reinforcement element facing the support element, thus also attaching the haptic device directly to the support element.

[0089] According to another embodiment, the support element has a basin area in which the spring element and the connecting material are at least partially arranged. The basin area can be a depression and / or formed by a raised rim. The basin area can form a cavity that prevents the connecting material from spreading uncontrollably, whether it is in liquid form, in powder form before hardening, or in liquid form after melting.

[0090] Furthermore, the support element may have an electrical structure. The electrical structure may, in particular, be designed and configured to connect the connecting material j eP2025, 0200 WO N 17 . March 2026

[0091] 23

[0092] to harden and / or melt according to the type of connecting material. For example, the electrical structure can be at least part of a heating device such as a heating coil or a structure for applying an electrical voltage and / or current, such as one or more electrode surfaces. Furthermore, it is also possible that the spring element is part of a heating device. The electrical structure can particularly preferably be located in the previously described basin area, for example on or in a bottom surface of the basin area.The electrical structure makes it possible to ensure that the structures required for hardening and / or melting the bonding material are present in the haptic system itself, so that the interaction element can be mounted and the action for hardening or melting the bonding material can then be brought about in a targeted manner, without, for example, having to heat the entire haptic system.

[0093] Further advantages, advantageous designs and further developments result from the exemplary embodiments described below in conjunction with the figures.

[0094] Figures 1A and 1B show schematic representations of a haptic device according to one embodiment, Figures 2A to 2D show schematic representations of a haptic device according to a further embodiment.

[0095] Figures 3 and 4 show schematic representations of a haptic device according to further embodiments, Figures 5 to 7 show schematic representations of a haptic device according to further embodiments, P2025, 0200 WO N 17 . March 2026

[0096] 24

[0097] Figures 8A and 8B show schematic representations of parts of a haptic device according to a further embodiment.

[0098] Figures 9A and 9B show schematic representations of a haptic device according to a further embodiment,

[0099] Figure 10 shows a schematic representation of a haptic device according to a further embodiment,

[0100] Figures 11A and 11B show schematic representations of a haptic device according to a further embodiment,

[0101] Figure 12 shows a schematic representation of a haptic device according to a further embodiment,

[0102] Figures 13A and 13B show schematic representations of a haptic device according to a further embodiment,

[0103] Figure 14 shows a schematic representation of a haptic device according to a further embodiment,

[0104] Figures 15A and 15B show schematic representations of a haptic device according to a further embodiment,

[0105] Figures 16 to 19 show schematic representations of a haptic device according to further embodiments, Figures 20A and 20B show schematic representations of a haptic device according to a further embodiment.

[0106] Figure 21 shows a schematic representation of a haptic system according to a further embodiment, Figure 22 shows a schematic representation of a haptic system according to a further embodiment, P2025, 0200 WO N 17 . March 2026

[0107] 25

[0108] Figures 23A and 23B show schematic representations of a haptic system according to a further embodiment, Figure 24 shows a schematic representation of a haptic system according to a further embodiment, Figures 25A and 25B show schematic representations of a haptic device according to further embodiments, Figures 26A to 26C show schematic representations of parts of a haptic system according to a further embodiment.

[0109] Figure 27 shows a schematic representation of part of a haptic system according to a further embodiment.

[0110] In the exemplary embodiments and figures, identical, similar, or similarly functioning elements may each be designated with the same reference numerals. The depicted elements and their relative sizes are not to be considered to scale; rather, individual elements, such as layers, components, building elements, and areas, may be exaggeratedly large for clarity and / or better understanding.

[0111] The features and embodiments described below in connection with the figures can be combined with each other according to further embodiments, even if not all combinations are explicitly described.

[0112] Furthermore, the embodiments described in connection with the figures may alternatively or additionally have further features as described in the general part.

[0113] Figures 1A and 1B show an embodiment of a haptic device 100 with a piezoelectric actuator 1P2025, 0200 WO N 17 . March 2026

[0114] 26

[0115] The piezoelectric actuator 1 and the amplification elements 30 are shown in a perspective view and a sectional view. The geometries of the piezoelectric actuator 1 and the amplification elements 30 shown in Figures 1A and 1B are purely exemplary and serve to illustrate the operating principle and interaction of the piezoelectric actuator 1 with the amplification elements 30. Deviations from the illustrated embodiment, for example with regard to geometric configurations, are not precluded by the following description. Furthermore, in the illustrated embodiment, as well as in the embodiments described below, there may, for example, be only one amplification element 30.

[0116] The piezoelectric actuator 1 has a base body 10 with a first main surface 11 and a second main surface 12, on each of which one of the amplifying elements 30 is arranged. The base body 10 has a stack of inner electrodes 13 and piezoelectric layers 14 arranged alternately in a stacking direction S, which are electrically contacted by the inner electrodes 13. The inner electrodes 13 can be electrically contacted from the outside via outer electrodes (not shown) on at least one surface of the base body 10, as explained in connection with the following figures. Although a plurality of inner electrodes 13 is shown in Figure 1B, the base body 10 can, for example, also have only one or two or another number of inner electrodes 13.Furthermore, the base body 10 can also be free of internal electrodes, so that the base body 10 can be designed as a monolithic disk or plate that is free of internal electrodes. P2025, 0200 WO N 17. March 2026.

[0117] 27

[0118] In this case, electrical contact is made exclusively via external electrodes, as illustrated in the following figures.

[0119] The base body 10 is preferably cuboid in shape with an elongated form, as shown, and has a longitudinal direction of length L, which corresponds to the principal extension direction of the base body 10. Perpendicular to the longitudinal direction, the base body 10 has a lateral direction of width B. Perpendicular to the longitudinal direction, the base body 10 terminates with end faces 16. Along the lateral direction, the base body 10 terminates with side faces 17, which are oriented perpendicular to the lateral direction. The end faces 16 and the side faces 17 form the side faces of the base body 10. In the vertical direction, which is perpendicular to both the longitudinal and lateral directions, the base body 10 has a height H and terminates with a top surface 18, which forms the first principal surface 11, and a bottom surface 19, which forms the second principal surface 12, both of which are perpendicular to the vertical direction.The height direction preferably corresponds to the stacking direction S. As an alternative to the cuboid shape shown, the base body 10 can also have other shapes, wherein preferably at least the top surface 18 and the bottom surface 19 are parallel to each other and thus corresponding main surfaces 11, 12 are present.

[0120] A first reinforcement element 30 is arranged on the first main surface 11 of the base body 10 and thus of the piezoelectric actuator 1, and the second of the reinforcement elements 30 is located on the first main surface 11 opposite the stacking direction S. P2025, 0200 WO N 17 . March 2026

[0121] 28

[0122] The reinforcing elements 30 are arranged on the second main surface 12 of the base body 10 and thus of the piezoelectric actuator 1. Although two reinforcing elements 30 are always shown here and in the following, it is also possible that, for example, only the first reinforcing element 30 is present on the first main surface 11. The reinforcing elements 30 have fastening areas 39 with which the reinforcing elements 30 are fastened to the respective main surfaces 11 and 12.

[0123] The piezoelectric layers 14 can, for example, be lead zirconate titanate ceramics (PZT ceramics). The PZT ceramic can furthermore contain Nd and Ni. Alternatively, the PZT ceramic can also contain Nd, K, and optionally Cu. Alternatively, the piezoelectric layers 14 can be a

[0124] Pb (Zr x Tii- xThe composition contains Oa + y Pb (Mni / aNb2 / 3) O3. Alternatively, a piezoelectric polymer can be used instead of a piezoelectric ceramic material. The inner electrodes 13, as well as the outer electrodes described below, contain copper or are made of copper or a copper alloy.

[0125] The base body 10, and thus the piezoelectric actuator 1, can, for example, have a length L of ≥ 5 mm and ≤ 100 mm, and a width B of ≥ 2 mm and ≤ 8 mm. The height H of the piezoelectric actuator 10 can, for example, be ≥ 300 pm and ≤ 3 mm.

[0126] The piezoelectric actuator 1 is designed such that when an electrical voltage is applied to the P2025, 0200 WO N 17 . March 2026

[0127] 29

[0128] The outer electrodes, and, if present, also the inner electrodes 13, cause a deformation of the base body 10, particularly in the multilayer construction shown with the inner electrodes 13, resulting in a change in length in the direction of length change RI indicated in Figure 1B. Specifically, the piezoelectric layers 14 are polarized such that applying an electrical voltage between the inner electrodes 13 leads to a contraction of the base body 10, whereby the length L of the base body 10 changes perpendicular to the stacking direction S. Consequently, the base body 10, and thus the piezoelectric actuator 1, expands transversely to the polarization direction and the electric field, a phenomenon also known as the d31 effect. Other expansion changes can be achieved through different configurations with or without inner electrodes in the base body 10.For the sake of clarity, the following description refers, without being limiting, to the multi-layered construction shown with the described change in length.

[0129] To redirect the effect of the length change in the stacking direction S, the reinforcing elements 30 are provided. When a voltage is applied to the piezoelectric actuator 1, the reinforcing elements 30 deform at least partially as a result of the change in the extension of the base body 10. In particular, the reinforcing elements 30 are dimensioned and connected to the base body 10 of the piezoelectric actuator 1 such that each stroke section 31 of the reinforcing elements 30, as a result of a change in the length L of the base body 10, performs a stroke movement in the stroke direction R2 corresponding to the stacking direction S, indicated in Figure 1B, whereby the amplitude of the P2025, 0200 WO N 17 . March 2026

[0130] 30

[0131] The stroke movement can preferably be larger than the amplitude of the change in length L of the piezoelectric actuator 1.

[0132] The piezoelectric actuator 1 is preferably arranged between the reinforcing elements 30, as shown. Each of the reinforcing elements 30 is preferably formed in one piece and, in the illustrated embodiment, is strip-shaped with a rectangular base. Furthermore, each of the reinforcing elements 30 is curved or bent and is U-shaped. For example, the reinforcing elements 30 each comprise a sheet metal strip or are made of it, in particular of steel and / or titanium.

[0133] Each of the reinforcing elements 30 is preferably subdivided into several areas or sections. Each reinforcing element 30 has, in addition to the stroke area 31, edge areas 32 which are connected to the respective stroke area 31 via transition areas 33. The two edge areas 32 of each of the reinforcing elements 30 rest on one of the main surfaces 11, 12 of the base body 10. The edge areas 32 are preferably permanently connected to the respective main surface 11, 12, so that in the illustrated embodiment, the edge areas 32 of the reinforcing elements 30 are the fastening areas 39 of the reinforcing elements 30. In particular, each of the fastening areas 39 is connected to the respective main surface 11, 12 by a bonding layer 20, which is indicated in Figure 1B.Although the connection layers 20 are not always shown in Figure 1A and in the figures described below, a connection layer is always arranged between a mounting area 39 and the piezoelectric actuator 1. P2025, 0200 WO N 17 . March 2026.

[0134] 31

[0135] The bonding layer 20 can particularly preferably be formed by an adhesive, for example an epoxy, so that the reinforcing elements 30 are preferably connected to the base body 10 and thus to the piezoelectric actuator by adhesive bonds. A solder layer, microsilver, or a weld layer are also possible for the bonding layers 20.

[0136] The stroke areas 31 are spaced apart from the respective main surfaces 11, 12. In particular, a clearance area 38 is located between the stroke area 31 of each of the reinforcement elements 30 and the respective main surface 11. The clearance areas 38 have a height that is, for example, greater than or equal to 0.1 mm and less than or equal to 5.0 mm when no voltage is applied to the piezoelectric actuator 1 and no external force acts on the reinforcement elements 30.

[0137] Preferably, the stroke areas 31 are designed such that they run substantially parallel to the main surfaces 11, 12. The transition areas 33 run obliquely to the main surfaces 11, 12. In other words, each of the transition areas 33 forms an angle with the main surfaces 11, 12. The angle is preferably less than or equal to 45°. This reduces the height of the clearance area 38 in the direction from the stroke area 31 towards the edge areas 32 and thus towards the fastening areas 39 of the respective reinforcement element 30.

[0138] If an electrical voltage is now applied to the piezoelectric actuator 1, for example by a control device connected to the outer electrodes 15 of the piezoelectric actuator 1, the stroke ranges 31 of the amplification elements 30P2025, 0200 WO N 17 . March 2026 move as described above.

[0139] 32

[0140] relative to the base body 10 in the stroke direction R2, which can be perceived as a haptic signal, for example, by a user. The reinforcing elements 30 preferentially bend at transitions between the stroke regions 31 and the transition regions 33, as well as between the transition regions 33 and the edge regions 32. Movement of the edge regions 32 in the stroke direction R2 is prevented by their attachment to the piezoelectric actuator 1 via the connecting layers 20. Instead, the edge regions 32 move with the base body 10 in the longitudinal direction RI. Thus, a relative movement occurs between the edge regions 32 and the stroke regions 31.

[0141] When a force is applied to the piezoelectric actuator 1 along the stroke movement R2, for example by a user's haptic input, the reinforcement elements 30 are deformed such that the stroke areas 31 are pressed closer to the respective main surfaces 11, 12, and the edge areas 32 are pushed away from each other in the longitudinal direction RI. Because the reinforcement elements 30 are attached to the base body 10 of the piezoelectric actuator 1, this body is also deformed in the longitudinal direction RI. This generates an electrical voltage in the piezoelectric actuator 1. This voltage can be detected at the outer electrodes 15, thus indicating a haptic input. The piezoelectric actuator 1 can therefore be used as a sensor that can detect a force applied by a user.For this purpose, the piezoelectric actuator 1 can be connected to a control device at the external electrodes described in conjunction with the following figures, which evaluates the electrical voltages generated at the piezoelectric actuator 1. P2025, 0200 WO N 17 . March 2026.

[0142] - 33 -

[0143] Modifications and further developments of the haptic device 100 according to the previous embodiment are shown in conjunction with the figures described below. Therefore, the following description is essentially limited to differences from previous embodiments. For the sake of clarity, it is possible that not all elements and components are shown in the figures described below, or that they are shown but not labeled and / or explained. Elements and components not shown, labeled, and / or explained in a figure may, for example, be designed according to the description of the respective preceding or subsequent embodiments.

[0144] Figures 2A to 2D show schematic representations of a haptic device 100 and parts thereof according to a further embodiment, wherein the haptic device 100 has external electrodes 15 and an electrical functional element 2 on the first main surface 11. For better illustration, Figure 2A shows a three-dimensional oblique view of the haptic device without the amplifying element 30 on the first main surface 11 of the piezoelectric actuator 1 and without the electrical functional element 2. In the corresponding oblique view in Figure 2B, the electrical functional element 2 is additionally shown compared to Figure 2A. Figures 2C and 2D show the complete haptic device 100 in a further corresponding oblique view and a side view, i.e., in comparison to the representation in Figure 2B, additionally with the amplifying element 30 on the first main surface 11. P2025, 0200 WO N 17. March 2026

[0145] 34

[0146] shown. The following description applies equally to all figures 2A to 2D.

[0147] In the illustrated embodiment, the piezoelectric actuator 1 has two external electrodes 15, which are provided for external electrical contacting of the base body 10 and thus of the piezoelectric actuator 1. The external electrodes 15 are applied to the first main surface 11. In particular, the two external electrodes 15 on the first main surface 11 of the base body 10 are arranged below the stroke area 31 and thus in the free area 38. Additionally, the external electrodes 15 are applied to one of the side surfaces 17. The portion of the external electrodes 15 on the side surface 17 allows the internal electrodes in the base body 10 of the piezoelectric actuator 1 to be electrically contacted, while the portion of the external electrodes 15 on the first main surface 11 is provided and configured for the electrical and mechanical connection of the electrical functional element 2.

[0148] As shown in the present embodiment, the outer electrodes 15 can be formed on the same main surface 11. Thus, as shown, a first outer electrode 15 and a second outer electrode 15 can be formed on the first main surface 11 below the stroke area 31 of a first reinforcing element 30, regardless of whether a second reinforcing element 30 is arranged on the second main surface 12. Alternatively, as shown, for example, in Figures 9A to 10 and described below, outer electrodes 15 can also be formed on both opposing main surfaces 11, 12, so that in this case at least a first outer electrode 15 is formed on the first main surface 11 and P2025, 0200 WO N 17. March 2026

[0149] 35

[0150] At least one second outer electrode 15 can be formed on the second main surface 12. Thus, a first outer electrode 15 can be arranged on the first main surface 11 with a first reinforcing element 30, while a second outer electrode 15 can be formed on the second main surface 12, regardless of whether a second reinforcing element 30 is arranged on the second main surface 12. Alternatively, it is also possible that a first reinforcing element 30 is arranged on the first main surface 11 and that, regardless of whether a second reinforcing element 30 is arranged on the second main surface 12, for example, two outer electrodes 15 are arranged on the second main surface 12.If at least one outer electrode 15 and a second reinforcing element 30 are present on the second main surface, the at least one outer electrode 15 is located on the first main surface 11 below the stroke area 31 of the second reinforcing element 30 on the second main surface 12, as shown in the arrangement.

[0151] The outer electrodes 15 are applied, for example, in the form of one or more metal layers, each of which may comprise one or more metals, for example with or made of copper, and / or alloys thereof, preferably by sputtering, screen printing, dip coating, or another suitable process. By arranging the outer electrodes 15 side by side on the same main surface 11 and the same side surface 17, the manufacturing process can preferably be carried out in common steps. For example, the inner electrodes are first joined together, according to their polarity, by depositing a metal layer on the side surface 17. P2025, 0200 WO N 17 . March 2026

[0152] 36

[0153] Subsequently, a layer for connecting the side contact thus produced to the top surface of the base body 10 can be formed by depositing another metal layer. A solderable layer can then be applied to this layer on the first main surface 11. This solderable layer can either already contain a solder, or, as indicated in Figure 2A, an additional layer with a connecting material 150, in particular a solder layer with a suitable solder, can be applied to it. Alternatively, the connecting material 150 can, for example, also be an electrically conductive adhesive.

[0154] The electrical functional element 2 is located on the first main surface 11 below the stroke area 31, i.e., when viewed from the stroke area 31 in a direction perpendicular to the first main surface 11, it is positioned below the stroke area 31. It is attached to the first main surface 11 such that the electrical functional element 2 is located on the first main surface between the stroke area 31 and the base body 10. The electrical functional element 2 is therefore located in the free space 38 between the stroke area 31 and the piezoelectric actuator 1 on the first main surface 11.

[0155] In the illustrated embodiment, the electrical functional element 2 is designed as an electrical connection element, preferably as an at least partially flexible connection element, which may comprise a printed circuit board (PBC), a flexible printed circuit board (FPC), a rigid-flex PCB (i.e., a combination of a PCB and an FPC), and / or a cable, in particular a multi-pole cable such as a two-pole cable. In the illustrated embodiment, the entire electrical P2025, 0200 WO N 17 March 2026

[0156] 37

[0157] Functional element 2 is formed from a flexible printed circuit board and has a mounting area 21 which is attached to the first main surface 11 and which has connection points 210 on the underside facing the base body 1, which are indicated by dashed lines in Figure 2B.

[0158] Furthermore, the electrical functional element 2 has a connection area 22 that leads away from the mounting area 21 and has, for example, at an end facing away from the base body 1 or at other positions, one or more connection points 220, such as solder contacts or a plug as shown, which are electrically connected to the connection points 210 of the mounting area 21, for example, via conductive traces (not shown), and through which the haptic device 100 can be electrically connected externally. Furthermore, the mounting area 21 can, for example, be formed by a rigid printed circuit board (PCB), which can be connected to a flexible printed circuit board (FPC) or cables as a connection area 22.

[0159] In particular, the electrical functional element 2, designed as an electrical connection element, can have at least one connection point 220 for each outer electrode 15 of the piezoelectric actuator 1, with which the electrical functional element 2 is electrically connected. Furthermore, the connection area 22 can have one or more additional connection points 220 via which one or more components, which may be part of the electrical functional element 2 and which are described below, can be electrically contacted.

[0160] The electrical functional element 2 is formed on the underside facing the base body 1 via the P2025, 0200 WO N 17 . March 2026

[0161] 38

[0162] The connection points 210 are attached to the outer electrodes 15 by the previously described connection material 150 and thus electrically connected to the outer electrodes 15. In other words, the electrical functional element 2 can be attached to the piezoelectric actuator 1 by a soldered connection or an adhesive connection using an electrically conductive adhesive.

[0163] Furthermore, the electrical functional element 2 can additionally be attached to the first main surface 11 away from the connection points 210 by means of an adhesive bond. In other words, at least one material, which may include an adhesive and / or a solder, can be arranged between the electrical functional element 2 and the first main surface 11, preferably in direct contact with both. Figure 2A shows an exemplary attachment area 151, in which an adhesive or solder may be provided. Other areas are also possible as attachment areas. Furthermore, it is also possible, for example, to use an anisotropic conductive film (ACF) as the connection material 150 and as the adhesive in the attachment area 151.

[0164] By arranging the outer electrodes 15 on at least one main surface 11, 12 of the piezoelectric actuator 1, a large contact area for the outer electrodes 15 can be achieved. This, and the possibility of additionally providing a mounting area 151, reduces the risk of delamination, which is particularly common in piezoelectric components with a low height, for example, less than or equal to 0.5 mm. P2025, 0200 WO N 17. March 2026

[0165] - 39 -

[0166] and can be reduced or even prevented by external electrodes located only on the side surfaces. In other words, the reliability of the mechanical connection of the electrical connection can be greatly improved by the larger contact areas provided.

[0167] To further improve the reliability of the mechanical connection and, in particular, to increase the release force required to detach the electrical functional element 2 from the piezoelectric actuator 1, a portion of the electrical functional element 2 can be pressed against a side surface 17, as shown in Figures 3 and 4 and in corresponding views in Figure 2C. In these embodiments, the electrical functional element 2 is bent in a bending area between the mounting area 21 and the connection area 22 such that a portion of the connection area 22 rests against the side surface 17, where, for example, the external electrodes are also formed. For example, the connection area 22 can be attached to the side surface 17 by means of an adhesive layer.It may also be possible that part of the electrical functional element 2, for example part of the mounting area 21 and / or part of the connection area 22, is bent over onto the second main surface of the piezoelectric actuator 1 and is also attached there, for example by means of an adhesive layer. Additionally or alternatively, as shown in Figure 4, clamping elements 23 may be provided on the electrical functional element 2, which bear against the first and second main surfaces 11, 12 and, for example, hold the base body 10 by means of a clamping force to provide mechanical fastening. P2025, 0200 WO N 17 . March 2026.

[0168] 40

[0169] The measures shown in Figures 3 and 4 allow at least part of the connection area 22 to serve as a strain relief, thus reducing tensile forces that could act on the assembly area 21.

[0170] To facilitate the bending of the connection area 22 and thus the adaptation of the electrical functional element 2 to the piezoelectric actuator 1, one or more openings 24 can be provided between the mounting area 21 and the connection area 22 in the bending area of ​​the electrical functional element 2, as shown in further embodiments in Figures 5, 6 and 7 in views corresponding to the views in Figures 20, 3 and 4.

[0171] As indicated in Figures 8A and 8B, instead of electrically contacting the inner electrodes 13 via areas of the outer electrodes 15 on a side surface 17 of the base body 10, electrical vias 152 can also be provided. The view in Figure 8A corresponds to the view in Figure 2A, while Figure 8B shows a section through the base body 10. The electrical vias 152 extend from the first main surface 11, more precisely from each of the outer electrodes 15, into the base body 10 and are in electrical contact with the corresponding inner electrodes 13 with respect to their respective polarity. As explained above in connection with the embodiment shown in Figures 2A to 2D, a first layer can be applied to the first main surface 11 to form the outer electrodes 15 and establish electrical contact with the vias 152.On this respective first shift, another shift P2025, 0200 WO N 17. March 2026.

[0172] 41

[0173] applied, which can be formed, for example, by the connecting material 150, in order to achieve a solderable connection.

[0174] In contrast to the previously shown embodiments with the outer electrodes on the first main surface, as described above, for example, a first outer electrode can be formed on the first main surface, while a second outer electrode is formed on the second main surface. The haptic device 100 can, as shown in Figures 9A and 9B in views corresponding to those of Figures 2B and 20, have an electrical functional element 2 on the first main surface 11 and another electrical functional element 2 on the second main surface 12, which can be configured like the electrical functional element 2 described previously, with the difference that each of the electrical functional elements 2 now used is provided for the electrical connection of one outer electrode.Accordingly, the two exemplary electrical functional elements 2 each have only one connection point 220 in the connection area 22 and only one connection point in the mounting area 21 intended for contacting an external electrode. The connection areas 22 of the two electrical functional elements 2 can, for example, lead away from the respective mounting area 21 in the same direction, as shown.

[0175] Furthermore, it is also possible that the connection areas 22 lead away in different directions, as shown in another embodiment in Figure 10 in a view corresponding to Figure 9B. P2025, 0200 WO N 17 . March 2026

[0176] 42

[0177] The variability in the design of the electrical functional elements 2 thus makes it possible, for example, to find ways to avoid installation errors when installing the haptic device 100 according to the Poka-Yoke principle.

[0178] During operation, the haptic device can experience forces of up to 100, which may exceed safety limits.

[0179] For example, high impact forces can lead to deformation or even delamination of at least one reinforcing element 30. Therefore, it can be advantageous if the haptic device 100 has a stop structure that can limit the overall compression of the component to prevent damage to the haptic device 100. Exemplary embodiments are shown in conjunction with Figures 11A to 14, in which the haptic device 100 has a stop structure 3 that can be designed and configured to restrict the movement of at least one reinforcing element 30, and in particular the stroke area 31, in the direction of the base body 10, in order to prevent, for example, permanent deformation or detachment from the piezoelectric actuator 1 and thus irreversible damage to the haptic device 100. The stop structures 3 described below can also be combined with one another.

[0180] Figures 11A and 11B show an embodiment in views corresponding to those of Figures 2C and 2D, in which each of the reinforcing elements 30 has a stop structure 3 in the stroke range 31 for abutting the piezoelectric actuator 1. The stop structure 3 of each of the reinforcing elements 30 can be formed, for example, by a forming process such as stamping, as shown. P2025, 0200 WO N 17. March 2026

[0181] 43

[0182] or deep drawing of an area of ​​the lifting area 31 or alternatively also by attaching an additional element to an underside of the lifting area 31 facing the base body 10.

[0183] To compensate for the thickness of the electrical functional element 2 on the first main surface 11 and thus the different height of the clearance 38 above the electrical functional element 2 compared to the height of the clearance 38 above the second main surface 12, the stop structure 3 of the reinforcement element 30 on the first main surface 11 can, for example, have a shallower depth, measured from the top of the stroke area 31 facing away from the first main surface 11, than the depth of the stop structure 3 of the reinforcement element 30 on the second main surface 12, measured from the top of the stroke area 31 facing away from the second main surface 11.Furthermore, for example, another functional element corresponding to the electrical functional element 2 on the first main surface 11, which is not electrically connected, can be provided on the second main surface 12 to compensate for the aforementioned height difference of the free areas 38. In addition, the electrical functional element 2 can also extend, for example, by bending over a side surface 17 to the second main surface 12.

[0184] Particularly preferably, the electrical functional element 2, as shown in a further embodiment in Figure 12, can have a recess 25 in the form of an opening through which the first main surface 11 of the base body 10 is exposed and into which the stop structure 3 of the reinforcement element 30 arranged above engages. P2025, 0200 WO N 17 . March 2026

[0185] 44

[0186] can. This allows the stop structure 3 to reach the first main surface 11 when the said reinforcement element 30 is deformed, so that the stop structures 3 of both reinforcement elements 30 can effect the same travel distance limitation for the respective stroke range 3.

[0187] Furthermore, the stop structure 3 can additionally or alternatively have a stiffening layer or be formed by a stiffening layer that can be an integral part of the electrical functional element 2, for example, a printed circuit board. Such a stop structure 3 can be integrated into the electrical functional element 2 during its manufacture. It is also possible, as shown in another embodiment in Figures 13A and 13B in the views corresponding to Figures 2B and 2D, that a stop layer is applied as an additional element to the electrical functional element 2 and, for example, glued to it. Such a stop structure 3 can, for example, be applied to the electrical functional element 2 after its manufacture.

[0188] The thickness of the stop structure 3 can be designed with regard to the specifications of the haptic device 100 in terms of functionality and durability.

[0189] For example, the stop structure 3 can be in the form of a stiffening layer or a stop layer made of a plastic such as polyimide or FR4 or another printed circuit board plastic and / or a metal.

[0190] Particularly preferably, the haptic device 100 can be shown in a further embodiment in Figure 14, P2025, 0200 WO N 17 . March 2026

[0191] On the first and second main surfaces 11, 12, each an electrical functional element 2 with a previously described stop structure 3 is provided, wherein, for example, only one or both of the electrical functional elements 2 are provided as an electrical connection element (e) for the haptic device 100 as described above. Furthermore, it is also possible that a single electrical functional element 2 is applied to both main surfaces 11, 12 by bending it over a side surface. In all cases, preferably an electrical functional element 2 is applied to the corresponding main surface 11, 12 in front of the reinforcing element 30.

[0192] The stop structures 3 described in conjunction with Figures 13A to 14 can offer greater stability than stop structures 3 integrated into the reinforcement elements 30, since the materials used can exhibit greater stiffness than deep-drawn metal structures, which can deform under extremely high forces. Furthermore, the contact area between the stop structure 3 and the components of the piezoelectric actuator 1 can be larger in the embodiments shown in Figures 13A to 14, which can also contribute to high impact force resistance.

[0193] In conjunction with Figures 15A to 19, further embodiments are shown in views according to Figures 2B and 2D, in which the electrical functional element 2 has at least one electrical component 26 which has electrical and / or electronic properties and is, for example, an active or passive electrical or electronic component. P2025, 0200 WO N 17 . March 2026

[0194] 46

[0195] The at least one component 6 can be configured as a sensor. For example, the at least one component 6 can be a sensor such as a temperature sensor, an acceleration sensor, a force sensor, a deformation sensor, a capacitive sensor, a current and / or voltage sensor, or a combination thereof. Alternatively or additionally, the at least one electrical component 6 can comprise one or more active and / or passive electrical components, which can be part of a control circuit for operating the haptic device 100.

[0196] The limited sensor functionality of piezoelectric actuators can be extended, for example, by adding one or more electrical components 6 to the electrical functional element 2. In general, piezoelectric actuators can be used in a limited capacity as pressure and / or force sensors. Particularly in button replacement applications, where a haptic system with a haptic device replaces a mechanical button, sensor functionality may be essential. Within a short time window, i.e., during a brief button press, the piezoelectric actuator 1 can provide a voltage signal upon actuation that is stable enough to obtain a reliable dynamic force measurement. For longer periods, i.e., during a constant button press, the voltage signal may begin to drift, which can lead to an inaccurate dynamic force measurement.In this case, the state of the pressed button can no longer be reliably detected. This problem can be solved by using an additional sensor on the electrical functional element 2, as described in P2025, 0200 WO N 17. March 2026.

[0197] 47

[0198] to measure dynamic or static force acting on the haptic device 100.

[0199] Figures 15A and 15B show an embodiment with an electrical component 26 on the mounting area 21 of the electrical functional element 2, which is arranged in the free area 38 below the stroke area 31, for example on a printed circuit board as part of the electrical functional element 2. For example, the electrical component 26 can be a sensor.

[0200] The integration of additional sensor functions on the electrical functional element 2 in the form of suitable electrical components 6 can also enable the monitoring of the condition and the prediction of the service life of the haptic device 100. For monitoring the haptic device 100 during operation, one or more sensors in the form of one or more electrical components 6 can be provided on the electrical functional element 2. For example, mechanical forces, strains, and temperatures can be measured. For this purpose, force and strain measurements described below can also be used for component monitoring. Various sensors can be used for temperature monitoring, which can perform measurements during the operation of the haptic device 100.

[0201] For example, such sensors can be selected from NTC thermistors (NTC: "negative temperature coefficient", thermistors), PTC thermistors (PTC: "positive temperature coefficient", thermistors), Pt thermocouples, silicon bandgap temperature sensors, pyroelectric sensors and the PVDF-based sensors described below (PVDF:P2025, 0200 WO N 17 March 2026).

[0202] 48

[0203] Polyvinylidene fluoride). Corresponding electrical components 6 can be integrated directly onto the electrical functional element 2.

[0204] Figure 16 shows an electrical functional element 2 with an electrical component 26 that forms an integrated force sensor. A PVDF material is applied to a built-in meandering structure on the top side of a printed circuit board, facing away from the ceramic. This material allows the impact force or pressure to be measured directly. The stack thus formed is preferably in contact with the reinforcement element mounted above it to measure the force. Therefore, the height of this stack is preferably adjusted so that it fits into the free space under the reinforcement element without completely blocking it. In this form, the stack also serves as a hard stop structure according to the corresponding previous embodiments.

[0205] Figure 17 shows a further embodiment of an electrical component 26, which is integrated into a printed circuit board of the electrical functional element 2 in the form of a simple meandering structure. In this case, the meandering structure acts as a strain sensor for the haptic device 100. The resistance of the meandering structure can change when the piezoelectric actuator 1, and thus also the electrical functional element 2, experiences positive or negative strain. The strain measurement enables an indirect measurement of the force acting on the haptic device 100.

[0206] Figure 18 shows a further embodiment in which the electrical functional element 2 is an electrode layer. P2025, 0200 WO N 17 . March 2026

[0207] 49

[0208] The electrical component 26 can form a first electrode of a capacitive sensor. The amplifying element above the electrical functional element 2, which is not shown in Figure 18, can form a second electrode of the capacitive sensor. The capacitance of this sensor changes when the distance between the electrode formed by the electrical component 26 of the electrical functional element 2 and the electrode formed by the amplifying element arranged above it changes.

[0209] In addition to a capacitive sensor, for example, an accelerometer can also be used as a further electrical component 6 to detect any pressure on the haptic device. Here, the accelerometer can be used similarly to tap detection in smartphones. Furthermore, such a sensor can also determine whether the haptic device has been triggered, since triggering it would cause the haptic device itself to accelerate.

[0210] Furthermore, in addition to or as an alternative to sensors, other active or passive components can also be provided as electrical components 6 on the electrical functional element 2. Figure 19 shows an embodiment with several passive electrical components 6 arranged on the electrical functional element 2. These components can, for example, be part of an operating circuit of the haptic device. By placing the components 6 on the electrical functional element 2, additional space becomes available for the actual application, or costs can be saved. P2025, 0200 WO N 17 March 2026

[0211] 50

[0212] Figures 20A and 20B show a further embodiment in a sectional view through the base body 10 and in a three-dimensional view of the base body 10, in which the base body 10 has exactly one inner electrode 13', or alternatively an inner electrode group with a plurality of inner electrodes, which is connected to a further outer electrode 15'. The further outer electrode 15' can, in particular, be a third outer electrode, while a first outer electrode 15 and a second outer electrode 15 are provided for electrical contacting the remaining inner electrodes 13 and for electrically controlling the haptic device as described above. The further outer electrode 15' can be formed, as shown, with the other outer electrodes 15 on the first main surface 11 or alternatively also on the second main surface 12 and is electrically connected only to the exactly one inner electrode 13'.By measuring an electrical charge at the single inner electrode 13' via the outer electrode 15', a force acting on the haptic device can be determined. This allows the single inner electrode 13', connected to the outer electrode 15', to serve as a force sensor integrated into the base body 10, since the inner electrode 13' is used as a dedicated measuring layer. Because the inner electrode 13' is electrically decoupled from all other inner electrodes 13, the signals cannot overlap. By integrating a capacitive sensor, as described, for example, in connection with Figure 18, an additional method can be incorporated for determining the pressure on the haptic device. Furthermore, a capacitive sensor enables differentiation. P2025, 0200 WO N 17. March 2026.

[0213] 51

[0214] whether the haptic device is pressed or only accidentally touched.

[0215] In conjunction with the figures described below, exemplary embodiments of a haptic system 1000 with a haptic device 100 are given. Unless otherwise specified, the haptic device 100 can be designed, for example, according to one or more of the exemplary embodiments described above.

[0216] The haptic system 1000 has, as shown in a sectional view in Figure 21, a support element 200 on which the haptic device 100 is mounted.

[0217] For example, the haptic device 100 can be attached to the support element 200 by a bonding material such as an adhesive or solder. The support element 200 can have a recess such as the trough area described below, in which the haptic device 100 is arranged, as indicated in Figure 21.

[0218] Furthermore, the haptic system 1000 includes an interaction element 300, which can be touched by a user to interact with the haptic system 1000. The interaction element 300 can be, for example, a button or push button, as indicated in Figure 21, or alternatively a display, i.e., a screen or touchscreen, or a part of one of these elements. In addition, other parts, such as housing parts 400, may be present. For example, as shown, at least one frame may be present, by means of which the interaction element 300 is arranged on the support element 200. P2025, 0200 WO N 17 . March 2026

[0219] 52

[0220] The haptic device 100 is arranged between the support element 200 and the interaction element 300. As shown, the interaction element 300 can be mechanically coupled to the haptic device 100 directly or, alternatively, indirectly via other elements, so that movements of the haptic device 100, in particular of the reinforcement elements, can be transferred to the interaction element 300 and vice versa. By appropriately designing the interaction element 300, or the interaction element 300 and other components of the haptic system 1000, a stop structure 303 can be formed that prevents further compression of the haptic device 100 after reaching a predetermined state. In the illustrated embodiment, the interaction element 300 can be pressed until the edge region designed as the stop structure 303 rests on a housing part 400.

[0221] Figure 22 shows another embodiment of the haptic system 1000, in which a haptic device 100 with stop structures as described above is used.

[0222] The haptic device 100 described herein has the advantage that it can be easily integrated into haptic systems 1000 with different geometric and connection-related boundary conditions. Figures 23A and 23B show a further embodiment of the haptic system 100 in a sectional view and a three-dimensional view of the support element 200 with the haptic device 100, in which the haptic device 100 is equipped with an electrical functional element 2 designed at least as an electrical connection element. P2025, 0200 WO N 17 March 2026

[0223] 53

[0224] The haptic device 100 has a connector on the side of the connection area facing away from the piezoelectric actuator for electrical connection. By using an FPC (Functional Contact Panel) at least for the connection area of ​​the electrical functional element 2, the haptic device 100 can be easily integrated into a variety of different haptic systems, for example, by bending the connection area. The use of a connector on the electrical functional element 2 of the haptic device 100 enables easy interchangeability. The round shape of the haptic system 1000 shown is not to be considered restrictive. The haptic system 1000 can alternatively have other shapes, for example, oval or angular, in particular square or rectangular.

[0225] When integrating components like the haptic device 100 into a haptic system 1000, the cumulative tolerances of the individual elements can lead to a deterioration in functionality. In haptic systems, the deflection of a piezoelectric actuator typically ranges from a few tens to several hundred micrometers. To ensure that the majority of the force exerted by the piezoelectric actuator is transferred to the interaction surface, such as a user's finger, any tolerances occurring in the system design must be minimized or completely compensated for. The cumulative tolerance, which in a worst-case scenario is the sum of all individual component tolerances, describes the additive tolerances of all components in the system. Optimizing the cumulative tolerance would require reducing the tolerance of each individual component in the system, which in turn would lead to higher costs for each component.The possibility of an integrated tolerance compensation P2025, 0200 WO N 17 . March 2026.

[0226] 54

[0227] is described below in conjunction with Figures 24 to 27.

[0228] Figure 24 shows an embodiment of the haptic system 1000, in which the haptic device 100 rests on the support element 200 with a spring element 101. Various types of springs can be used for the spring element 101, for example flat springs, wave springs, compression springs, spring clips, or combinations thereof.

[0229] The spring element 101 can, for example, be a separate component arranged between the haptic device 100 and the support element 200. Alternatively, the spring element 101 can also be integrated into the haptic device 100 and, in this case, is particularly preferably part of a reinforcing element 30 of the haptic device 100, as indicated in Figures 25A and 25B in two exemplary embodiments of the haptic device 100.

[0230] To manufacture the haptic system 1000 in Figure 24, the haptic device 100 with an integrated spring element 101 can be placed on the support element 200. In the case of the separate spring element 100, the spring element 101 can be placed on the support element 200 and the haptic device 100 can be positioned on the spring element 101.

[0231] The interaction element 300 can then be arranged above the haptic device 100 and attached directly or indirectly to the support element 200. Particularly preferably, the interaction element 300 can be mounted above the haptic device 100 from the perspective of the support element 200 in such a way that the spring element 101 is at least slightly compressed and thus pre-tensioned, causing the haptic device 100 to press against the interaction element 300. Particularly preferably P2025, O200 WO N 17 March 2026

[0232] 55

[0233] The preload lies in a range greater than 0 N and less than or equal to 20 N. The spring element 101 thus allows the haptic device 100 to be preferably clamped between the support element 200 and the interaction element 300. In other words, the spring element 101 can push the support element 200 and the haptic device 100 apart, thereby pressing the haptic device 100 against the interaction element 300.

[0234] The spring element 101 is embedded in a rigid bonding material 102, which renders the spring element 101 essentially immobile. Furthermore, the spring element 101 can preferably be attached to the support element 200 by the bonding material 102. Before the interaction element 300 is mounted, the bonding material 102 in the area of ​​the spring element 101 can be in a non-rigid state. For example, before the interaction element 300 is mounted, the spring element 101 can be at least partially covered with liquid, uncured bonding material 102 and / or with solid, unliquefied, and subsequently solidified bonding material 102. In particular, the bonding material 102 is liquefiable and / or curable by the application of heat, electromagnetic radiation, an electric voltage, and / or an electric current, as described above in the general section.The bonding material 102 can particularly preferably comprise or be made of a plastic, especially an adhesive or a resin. The plastic can particularly be curable. For example, the plastic can be applied to the carrier element 200 in liquid or at least partially liquid form and be curable by at least one of the above-mentioned processes. Preferably, the plastic can be a P2025, 0200 WO N 17 . March 2026.

[0235] The joining material 102 is a thermoplastic or, more preferably, a thermoset. It is selected such that, after solidification, i.e., after a curing process, it exhibits sufficiently high stiffness. For example, the joining material 102 may be an epoxy that can be cured by heat or by applying stress. Alternatively, the joining material 102 may comprise or be composed of at least one metal, for example, in the form of an alloy. In this case, the joining material 102 may, in particular, comprise or be composed of a solder, preferably a low-melting-point solder.

[0236] After the interaction element 300 has been mounted, the connecting material 102 can be cured and / or melted and re-solidified in the manner described above, so that the spring element 101 is at least partially or completely embedded in the rigid connecting material 102 and is fixed by the rigid connecting material 102 in such a way that the spring element 101 is preferably completely immobile, so that the haptic device 100 is reliably pressed against the interaction element 300 under normal operating conditions.Thus, the spring element 101, which acts with a specific preload in the haptic system 1000, and the connecting material 102, which hardens sufficiently to maintain the spring element 101 and thus the system under preload, form an effective integrated tolerance compensation mechanism that can lead to an optimal mechanical connection of the haptic device 100 to the interaction element 300, independent of the individual manufacturing tolerances of the individual components. Furthermore, it may be possible that the rigid connecting material 102 directly P2025, 0200 WO N 17 . March 2026.

[0237] 57

[0238] on the haptic device 100, in particular on the lifting area of ​​the reinforcement element facing the support element 200, and thus the haptic device 100 is also directly attached to the support element 200.

[0239] As shown in Figure 24, the support element 200 preferably has a basin 201 in which the spring element 101 and the bonding material 102 are at least partially arranged. The basin 201 can, as shown in Figures 26A to 27 below, have a recess and / or, as indicated in Figure 24, have or be formed by a raised rim. The basin 201 prevents the bonding material 102 from spreading uncontrollably when it is still in liquid form, in powder form before hardening, or in liquid form after melting. Furthermore, the basin 201 facilitates easy positioning of the spring element 101 and the haptic device 100.

[0240] Figures 26A to 26C show in three-dimensional views a support element 200 with a basin area 201 formed by a recess, the support element 200 with a mounted haptic device 100, and, purely for illustrative purposes, the support element 200 with only the arranged piezoelectric actuator 1 of the haptic device 100 in a semi-transparent view.

[0241] The support element 200 has an electrical structure 202 which is designed and configured to cure and / or melt the bonding material 102, depending on the type of bonding material 102. Particularly preferred P2025, 0200 WO N 17 . March 2026

[0242] 58

[0243] The electrical structure 202 can be located in the cavity formed by the basin area 201 as shown, for example on or in a floor surface of the basin area 201.

[0244] In the illustrated embodiment, the electrical structure 202 is a heating device, such as a heating coil. During the fabrication of the haptic system, the uncured bonding material 102 is arranged in the well area 201. For example, the well area 201 can be filled with the bonding material 102. For instance, in the case of a temperature-curing epoxy, the well area 201 is then filled with liquid material. Subsequently, the spring element 101 is inserted into the well area 201, and the piezoelectric actuator 100 is arranged on the spring element 101 as described above, or the haptic device 100 with integrated spring element 101 is inserted into the well area 201 along with the spring element 101. Preferably, the spring element 101 is completely or almost completely immersed in the bonding material 102, which ensures the fixation of the preload after curing.After the haptic system is fully assembled and a specific preload is applied to the entire system, the resistance heating element in the form of the electrical structure 202 is activated to cure the bonding material 102, for example, the epoxy resin, in situ. The support element 200 preferably has externally contactable terminals for the electrical structure 202 or an inductive connection for it to enable in-situ curing. Furthermore, it is also possible that the spring element 101 is part of a heating device and is connected to the electrical structure 202 and, for example, the P2025, 0200 WO N 17 . March 2026.

[0245] 59

[0246] The reinforcing element of the haptic device 100 is electrically contactable. In the case of a solid connecting material 102 as the starting material, an analogous procedure can be chosen, as is also described, for example, in the general part.

[0247] The electrical structure 202 enables the structures required for curing and / or melting the bonding material to be present within the haptic system itself. This allows the interaction element to be mounted and the subsequent curing or melting of the bonding material to be applied in a targeted manner, without, for example, having to heat the entire haptic system. After the curing process, the accumulating tolerance is compensated, thus ensuring the maximum force effect of the haptic device 100 during operation.

[0248] Figure 27 shows a further embodiment of the support element 200, which, as an electrical structure 202, has a structure for applying an electrical voltage and / or an electric current in the form of electrode surfaces. This allows the previously described method to be carried out, for example, with a stress-curing adhesive as the bonding material 102. Furthermore, the electrode surfaces can, for example, be provided as an electrical connection for a spring element designed as a heating element.

[0249] The invention is not limited to the exemplary embodiments described therein. Rather, the invention encompasses every new feature as well as every combination of features, which in particular includes every combination of features in P2025, 0200 WO N 17 March 2026.

[0250] - 60 -

[0251] included in the patent claims, even if this feature or combination itself is not explicitly stated in the patent claims or embodiments. P2025, 0200 WO N 17 . March 2026

[0252] - 61 -

[0253] Reference symbol list

[0254] 1 piezoelectric actuator

[0255] 2 electrical functional element 3 stop structure

[0256] 10 basic shapes

[0257] 11, 12 Main surface

[0258] 13, 13 ' Inner electrode

[0259] 14 piezoelectric layer

[0260] 15, 15 ' external electrode

[0261] 16 Front surface

[0262] 17 side surface

[0263] 18 Top

[0264] 19 Subpage

[0265] 20 bonding layer

[0266] 21 Assembly area

[0267] 22 Connection area

[0268] 23 bracket element

[0269] 24-hour opening

[0270] 25 recess

[0271] 26 electrical components

[0272] 30 reinforcement elements

[0273] 31 lifting range

[0274] 32 Edge area

[0275] 33 Uber gangsber eich

[0276] 38 outdoor area

[0277] 39 Mounting area

[0278] 100 haptic devices

[0279] 101 Spring element

[0280] 102 Connecting material

[0281] 150 connection materials

[0282] 151 Mounting area

[0283] 152 electrical through-calculation 200 carrier element

[0284] 201 Bathtub area

[0285] 202 electrical structure

[0286] 210 Junction P2025, 0200 WO N 17 March 2026

[0287] 62

[0288] 220 Junction

[0289] 300 Interaction element 303 Stop structure

[0290] 400 Housing part

[0291] 1000 haptic system

[0292] B Width

[0293] H height

[0294] Length L

[0295] RI Length change direction R2 Stroke direction

[0296] S Stacking direction

Claims

P2025 , 0200 WO N 17 March 2026 Patent claims 1. Haptic device ( 100 ) , comprising - comprising a piezoelectric actuator ( 1 ) and a base body ( 10 ) and - at least one amplification element ( 30 ) on a first main surface ( 11 ) of the piezoelectric actuator ( 1 ) , where - the at least one reinforcing element (30) has at least one fastening area (39) with which the at least one reinforcing element (30) is attached to the base body (10) and a lifting area (31) which is spaced apart above the first main surface (11) and - an electrical functional element (2) is attached to the first main surface (11) between the lifting area (31) and the base body (10).

2. Haptic device (100) according to claim 1, wherein on the first main surface (11) between the stroke area (31) and the base body (10) at least one outer electrode (15) is formed, a first outer electrode (15) for electrical contacting the haptic device (100) is formed.

3. Haptic device (100) according to claim 2, wherein the first outer electrode (15) extends to a side surface (17) of the base body (10) adjacent to the first main surface (11).

4. Haptic device (100) according to claim 3, wherein the first outer electrode (15) is located on the side surface (17) inP2025, 0200 WO N 17. March 2026 - 64 - electrical contact with internal electrodes ( 13 ) in the base body ( 10 ).

5. Haptic device (100) according to claim 2 or 3, wherein the first outer electrode (15) is in electrical contact with inner electrodes (13) in the base body (10) via at least one electrical through-hole (152) extending from the first main surface (11) into the base body (10).

6. Haptic device (100) according to one of claims 2 to 5, wherein at least a second outer electrode (15) for electrical contacting the piezoelectric actuator (1) is formed on the first main surface (11).

7. Haptic device (100) according to one of claims 2 to 6, wherein at least one second outer electrode (15) for electrical contacting the haptic device (100) is formed on a second main surface (12) opposite the first main surface (11).

8. Haptic device (100) according to one of claims 2 to 7, wherein at least one further outer electrode (15') is formed on the first main surface (11) or on the second main surface (12), which is electrically connected to exactly one inner electrode (13') or inner electrode group in the base body (10).

9. Haptic device (100) according to one of claims 2 to 8, wherein the electrical functional element (2) is connected to the P2025, 0200 WO N 17. March 2026 - 65 - at least one external electrode ( 15) is in electrical contact.

10. Haptic device ( 100) according to one of claims 2 to 9, wherein the electrical functional element (2 ) is at least partially designed as an electrical connection element which is electrically conductively connected to the at least one external electrode ( 15) and which has at least one connection point (220) for the external electrical connection of the haptic device ( 100 ).

11. Haptic device ( 100) according to one of claims 2 to 10, wherein the electrical functional element (2 ) is soldered onto the at least one outer electrode ( 15) or is attached by means of an electrically conductive adhesive.

12. Haptic device (100) according to claim 11, wherein the electrical functional element (2) is additionally attached by means of an adhesive to the at least one outer electrode (15) and / or to the first main surface (11) and / or to a side surface (17) adjacent to the first main surface (11).

13. Haptic device ( 100) according to one of the preceding claims, wherein the electrical functional element (2 ) comprises an electrical component (26) selected from active and passive electrical and electronic components.

14. Haptic device (100) according to claim 13, wherein the electrical component (26) is a sensor. P2025, 0200 WO N 17 . March 2026 15. Haptic device ( 100) according to one of the preceding claims, wherein a further electrical functional element (2 ) is attached to a second main surface ( 12 ) opposite one of the first main surface ( 11 ).

16. Haptic device ( 100) according to one of the preceding claims, wherein the at least one reinforcing element (30) in the stroke area (31 ) has a stop structure (3) for stopping against the piezoelectric actuator ( 1 ) and the electrical functional element (2 ) has a recess (25) through which the first main surface ( 11 ) is exposed and into which the stop structure (3) can engage when the at least one reinforcing element (30) is deformed.

17. Haptic device ( 100) according to one of the preceding claims, wherein the electrical functional element (2 ) has a stiffening layer which is an integral part of the electrical functional element and which forms a stop structure (3) for stopping the at least one reinforcing element (30 ).

18. Haptic device ( 100) according to one of the preceding claims, wherein the haptic device ( 100) has a stop layer which is applied to the electrical functional element (2 ) and which forms a stop structure (3) for stopping the at least one reinforcing element (30 ).

19. Haptic system ( 1000) , exhibiting - a haptic device (100) according to one of the preceding claims and P2025 , 0200 WO N 17 March 2026 - 67 - - a support element ( 200 ) , where - the haptic device ( 200 ) with a spring element ( 101 ) rests on the support element ( 200 ) and - the spring element ( 101 ) is embedded in a rigid connecting material ( 102 ) such that the spring element ( 101 ) is essentially immobile .

20. Haptic system ( 1000 ) , having - a haptic device (100) with a piezoelectric actuator (1) comprising a base body (10) and with at least one reinforcing element (30) on a main surface (11, 12) of the piezoelectric actuator (1), and - a support element ( 200 ) , where - the haptic device ( 100 ) with a spring element ( 101 ) rests on the support element ( 102 ) and - the spring element ( 101 ) is embedded in a rigid connecting material ( 102 ) such that the spring element ( 101 ) is essentially immobile .

21. Haptic system (1000) according to claim 19 or 20, wherein the haptic device (100) is attached to the carrier element (200) by the connecting material (102).

22. Haptic system (1000) according to one of claims 19 to 21, wherein the spring element (101) is part of a reinforcing element (30) of the haptic device (100).

23. Haptic system (1000) according to one of claims 19 to 21, wherein the spring element (101) is defined as P2025, 0200 WO N 17. March 2026 Haptic device ( 100 ) separate component is arranged between a reinforcing element ( 30 ) of the haptic device ( 30 ) and the support element ( 200 ).

24. Haptic system (1000) according to one of claims 19 to 23, wherein the connecting material (102) comprises a plastic or a solder.

25. Haptic system (1000) according to one of claims 19 to 24, further comprising an interaction element (300), wherein the haptic device (100) is clamped between the support element (200) and the interaction element (300) by the spring element (101) and the spring element (101) is fixed by the connecting material (102).

26. Haptic system (1000) according to one of claims 19 to 25, wherein the spring element (101) and the connecting material (102) are arranged at least partially in a trough area (201) of the support element (200).

27. Haptic system (1000) according to claim 26, wherein the support element (200) has an electrical structure (202) in the basin area (201).

28. Haptic system (1000) according to claim 27, wherein the electrical structure (202) is at least part of a heating device or a structure for applying an electrical voltage and / or an electric current.

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