Semiconductor arrangement

Abstract

The present disclosure relates to a semiconductor arrangement having a package and to a server arrangement (19) having at least one of said semiconductor arrangement. The object of the present disclosure is to further develop cooling arrangements for the semiconductor arrangement. This object is solved by a semiconductor arrangement having a package (1) with at least one chip (2), electrical connectors, which are conductively connected to the at least one chip (2), a lid (4) at least partly covering the at least one chip (2), and a cooling arrangement comprising cooling features (5) for cooling the at least one chip (2), which cooling features (5) are fluidically connected to at least one fluid inlet and at least one fluid outlet of the package (1), wherein the at least one fluid inlet and the at least one fluid outlet each comprises a quick disconnect coupling (6) for fluidically connecting the cooling arrangement to a cooling circuit (29).

Description

[0001] Title: Semiconductor arrangement

[0002] The present disclosure relates to a semiconductor arrangement and a server arrangement comprising at least one semiconductor arrangement.

[0003] Background of the Disclosure

[0004] In semiconductor arrangements thermal management is needed for maintaining performance and reliability. Heat generated by the semiconductor arrangements is often dissipated via heat sinks interacting with air and / or liquids.

[0005] In the early days, the thermal management of semiconductor arrangements was based on passive cooling methods, such as metal heat sinks and natural air convection. As the semiconductor arrangements became more powerful, passive cooling methods were not capable of handling increasing heat generation and were thus replaced by active cooling methods, using fans attached to the heat sinks providing an air flow. With further increasing power of semiconductor arrangements, active cooling methods were improved by using liquids, such as water, for cooling the heat sinks.

[0006] Efforts are being made to find ways to absorb and extract heat closer to its source compared to passive and active cooling methods described above. As a result, in-chip and in-lid cooling methods for cooling the chip or the lid have been introduced in the literature.

[0007] The object of the present disclosure is to further improve cooling arrangements for a semiconductor arrangement

[0008] Summary of the Disclosure

[0009] The present disclosure addresses this object by the solutions defined in the independent claims. Optional embodiments are defined in the dependent claims, in this description and in the figures.

[0010] According to an aspect, a semiconductor arrangement is disclosed, having a package comprising

[0011] • at least one chip,

[0012] • a substrate,

[0013] March 19, 2026 1 / 36• electrical connectors, which are conductively connected to the at least one chip,

[0014] • a lid at least partly covering the at least one chip, and

[0015] • a cooling arrangement comprising cooling features for cooling the at least one chip, which cooling features are fluidically connected to at least one fluid inlet and at least one fluid outlet of the package, wherein the at least one fluid inlet and the at least one fluid outlet are each provided with comprises a quick disconnect coupling for fluidically connecting the cooling arrangement to a cooling circuit.

[0016] In other words or according to another aspect, a semiconductor arrangement comprises at least one chip and cooling features formed within the chip or within a lid of the chip, wherein the cooling features are fluidically connected to at least one quick disconnect coupling for supplying cooling agent to the cooling features and at least one quick disconnect coupling for discharging cooling agent from the cooling features. In this context, the cooling features and quick disconnect couplings can constitute a cooling arrangement. The semiconductor arrangement usually further comprises a substrate to which the at least one chip and / or the lid of the chip is attached and electrical connectors, which are conductively connected to the at least one chip.

[0017] According to the present disclosure, a chip is a semiconductor element capable of processing input information via logical steps and providing outlet information. Such chips are for example used in the form of microprocessors (CPUs), graphics processing units (GPUs) or the like.

[0018] A substrate can refer to a base material or platform onto which the chip is mounted. The substrate can form a physical support for the chip and typically comprises at least one material of a group consisting of ceramics, polymers, resins and fiberglass.

[0019] The electrical connectors can be arranged on the substrate, such as on the bottom of the substrate, and / or extend through the substrate. The electrical connectors are in conductive connection with the chip, allowing an electrical connection between the chip and a printed circuit board (PCB) or alike.

[0020] The lid functions as a protective means by at least partly covering the at least one chip. The lid may comprise at least one material of a group of materials consisting of polymers, metals, and ceramics, metal-matrix composites or metal-carbon composites that could include carbon nanotubes, graphene or diamond. Further, for example, the lid can be configured to retain the chip on the substrate. To do so, the lid covers and / or accommodates the chip at least partly, providing a positive fit between the chip and the lid, while the lid may be mounted to the substrate. In other words, the lid can, at least partially, be secured to the substrate.

[0021] March 19, 2026 2 / 36A cooling agent is fluidical ly guided by the fluid inlet, the cooling features, the fluid outlet and the quick disconnect couplings. The cooling agent is configured to absorb heat from the chip provided to the cooling agent via the cooling features and transfer the heat to a heat dump. In other words, the cooling agent is a heat transfer medium and configured to dissipate heat from the at least one chip.

[0022] When the chip performs logical tasks, some of the provided (electrical) power is transferred to heat, which needs to be dissipated. The cooling arrangement is configured to cool the at least one chip. Said cooling arrangement comprises at least one fluid inlet and at least one fluid outlet. The at least one fluid inlet and the at least one fluid outlet are in fluid communication with each other. A cooling agent is supplied to the at least one fluid inlet, while the cooling agent is discharged through the at least one fluid outlet.

[0023] Cooling features are provided between the fluid inlet and the fluid outlet. These cooling features are configured to dissipate heat from the chip to the cooling agent.

[0024] The cooling arrangement can be integrated into a cooling circuit for supplying the cooling agent to the semiconductor arrangement and discharging the cooling agent from the semiconductor arrangement.

[0025] By providing said semiconductor arrangement or package with cooling features directly within the chip or lid and with quick disconnect couplings for fluidically connecting the cooling arrangement to a peripheral cooling circuit, the semiconductor arrangement can as a whole, in other words as a package, be easily fluidically connected to and disconnected from the cooling circuit. This allows an easy and convenient removal and / or replacement of the semiconductor arrangement, without the risk of spilling cooling agent and without considerable effort. At the same time, it increases the cooling arrangements industrial applicability

[0026] The quick disconnect couplings are configured to allow a quick decoupling and coupling between for example a male connector and a female connector.

[0027] In one embodiment, the at least one chip and / or the lid is provided with the cooling features. By providing the at least one chip and / or the lid with the cooling features, the at least one chip and / or the lid comprises a fluid management to provide a fluid communication between the fluid inlet, the cooling features and the fluid outlet. The cooling features can be provided on the at least one chip, such that heat is directly transferred from the at least one chip to the cooling features. The term “directly” can encompass cases in which a thermal interface and / or a thermal interface material can be provided between the at least one chip and the cooling features. In addition or alternatively, the cooling features can also be provided at the lid, wherein the cooling

[0028] March 19, 2026 3 / 36features are permanently bonded to and / or formed within the lid.

[0029] In one embodiment, the cooling features are formed at least partly monolithic with the lid and / or the at least one chip. The term “monolithic” can refer to one-piece configuration or any permanent connection between the cooling features and the lid and / or the at least one chip. When providing the cooling features monolithic with the lid, the lid itself is cooled directly. Thus, a heat transfer can take place between the chip (where the heat origins) and the lid (where the heat is dissipated). The cooling features formed in the lid can be in direct or indirect contact with the chip, in a state in which the lid is arranged on the chip.

[0030] In addition or alternatively, the cooling features can be formed monolithic with the at least one chip. By forming the cooling features directly within the at least one chip, the cooling features are formed within the heat source itself. Thus, the heat generated by the at least one chip can be directly transferred from the chip to the cooling agent. Thus, efficient heat dissipating can be achieved.

[0031] In one embodiment, the at least one chip, the cooling features and / or at least part of the lid are inseparably connected with each other. The term “inseparably” can mean that separating the at least one chip and / or the lid from the cooling features results in a destruction of the chip, the lid and / or the cooling features. For example, the cooling features are physically provided at least partly inside the chip. In other words, the cooling features are at least partly encompassed by the at least one chip. This arrangement allows cooling the chip directly or close to the origin of the heat source, the chip itself.

[0032] In one embodiment, the chip comprises a logic chip and a silicon cooling chip, which are bonded by means of fusion bonding or direct bonding. The silicon cooling chip is equipped with cooling features, which are in fluid communication with the at least one fluid inlet and the at least one fluid outlet. This arrangement allows simultaneously producing the logic chip and the silicon chip, which rationalizes the production and results in good efficiency of the production.

[0033] In one embodiment, the chip comprises a logic chip. A silicon cooling chip or the lid is bonded to the logic chip by means of a metallic bond such as solder joint or an eutectic bond, or a glue bond, or by a thermal interface material (TIM) that is cured to form a solid. The cooling features are either provided on the silicon cooling chip or the lid, while the cooling features are in fluid communication with the at least one fluid inlet and with the at least one fluid outlet.

[0034] The metallic bond can be formed by using soldering methods and corresponding materials, such as solder and / or an eutectic material. In either case the soldering method comprises the steps of melting the solder and / or the eutectic material and solidifying it to its solid state.

[0035] March 19, 2026 4 / 36The glue bond can be achieved by attaching the silicon cooling chip or the lid to the logic chip by means of an adhesive. The adhesive can be equipped with heat transfer improving fillers, such as metal particles, graphite or alike.

[0036] The thermal interface material can be applied similar to the glue bond. Such a thermal interface material is designed for providing a good heat transfer between two adjoining elements which are bonded to each other by means of the thermal interface material. In the present case, the thermal interface material can be cured to a solid state forming a permanent bond between the bonded elements, such as the lid or the silicon cooling chip and the logic chip.

[0037] In one embodiment, the lid provided with cooling features is bonded to the substrate by means of an adhesive, wherein the chip and the lid are in contact with each other forming a heat transferable connection.

[0038] In one embodiment, the quick disconnect couplings are arranged on the semiconductor arrangement such that the longitudinal axes of the quick disconnect couplings are parallel to each other.

[0039] In one embodiment, the quick disconnect couplings are arranged on the semiconductor arrangement such that they are substantially or fully perpendicular to the electrical connectors. For example, the quick disconnect couplings can be arranged on or in the area of a side surface of the semiconductor arrangement while the electrical connectors are arranged on or in the area of a bottom surface of the semiconductor arrangement. This can mean that longitudinal axes of the quick disconnect couplings can be perpendicular to center axes of the electrical connectors.

[0040] In one embodiment, the quick disconnect couplings are arranged on the semiconductor arrangement such that they are substantially or fully parallel to the electrical connectors. For example, the quick disconnect couplings can be arranged on or in the area of a bottom surface of the semiconductor arrangement while the electrical connectors are arranged on or in the area of a bottom surface of the semiconductor arrangement. This can mean that longitudinal axes of the quick disconnect couplings can be substantially or fully perpendicular to center axes of the electrical connectors. The bottom surface on which the quick disconnect couplings are arranged can be the same or a different bottom surface on which the electrical connectors are arranged. In the latter case, the bottom surfaces face the same direction, such as a direction towards a baseboard of a server arrangement.

[0041] In one embodiment, the quick disconnect couplings are arranged on the semiconductor arrangement such that they face towards the same opposite area or surface, such towards an area or surface to which the semiconductor arrangement is to be installed.

[0042] March 19, 2026 5 / 36In one embodiment, the cooling features comprise micro geometries, which are between 50 pm and 3 mm in size. For example, the micro geometries can refer to a cross-sectional shape of a fluid channel, or the like. Design of the micro geometries can affect heat dissipation.

[0043] In one embodiment, the cooling features comprise at least one fluid channel and / or at least one fin, wherein the fluid channel comprises a fluid channel width of between 10 pm and 400pm, or 35 pm and 300 pm or 50 pm and 200 pm and a fluid channel depth of between 0.3 mm and 3 mm, wherein the at least one fin comprises a fin width of between 10 pm and 400pm, or 35 pm and 300 pm or 50 pm and 200 pm. The fluid channel width is at least 10 pm, or 35 pm or 50 pm. The fluid channel width is at most 400 pm, or 300 pm or 200 pm. The fin width is at least 10 pm, or 35 pm or 50 pm. The fin width is at most 400 pm, or 300 pm or 200 pm.

[0044] The micro geometries can be formed by providing different sized fluid channels and differently sized fins. However, it is also possible that different fluid channels have the same dimensions, and different fins have also the same dimensions. The fins can be arranged between two fluid channels.

[0045] A depth of each channel can e.g. be between 20 pm and 6 mm, or between 100 pm and 5 mm, or between 150 pm and 3 mm, or between 1 mm and 3 mm. The depth of the channel can be at least 20 pm, or at least 100 pm, or at least 150 pm, or at least 200 pm, or at least 1 mm. The depth of the channel can be 6 mm or less, or 5 mm or less, or 1.5 mm or less, or 700 pm or less. A width of the channel can e.g. be between 20 pm and 1 mm, or between 30 pm and 250 pm, or between 50 pm and 200 pm, or between 25 pm and 70 pm. The width of the channel can be at least 20 pm, or at least 30 pm, or at least 40 pm, or at least 50 pm. The width of the channel can be 1 mm or less, or 250 pm or less, or 200 pm or less, or 50 pm or less. The width may concern a dimension of the channel that extends orthogonally to the depth direction and to the length direction of the channel. In particular for small sized channels it can be important to provide unhindered flow of cooling agent through the channels so as to enhance cooling efficiency. For example, the width of the channel can be 75 pm to 80 pm for copper material or other metallic material.

[0046] According to another aspect of the solution, in addition or alternative to other aspects and embodiments, a width of the channel can vary less than 4 %, or less than 3 %, or less than 2 %, over its depth. The width of the channel can vary at least 0.01 %, or at least 0.1 %, or at least 0.5 % over its depth. The width of the channel in this context refers to a width of the channel viewed at a certain position within the channel, or in other words the width variation viewed at a certain cross-section transverse to the channel’s longitudinal extension. Hence, even in cases in which the channel has varying widths over its longitudinal extension when viewed in a top view,

[0047] March 19, 2026 6 / 36each width of the channel at a certain position of the channel can at this position vary less than 4 %, or less than 3 %, or less than 2 %, over its depth. The channel can have a depth to width aspect ratio between 3 and 40, or between 4 and 35, or between 5 and 30. The channel can have a depth to width aspect ratio between 15 and 40, or between 20 and 35. For example, the channel can have a depth to width aspect ratio between 15 and 40, or between 20 and 35 for a lid and / or chip comprising or made of a copper material or another metallic material. The channel can have a depth to width aspect ratio between 3 and 20, or between 4 and 15. The channel can have a depth to width aspect ratio of at least 3, or at least 4, or at least 5, or at least 7. The channel can have a depth to width aspect ratio of 40 or less, or 35 or less, or 30, or 15 or less, or 14 and less. Such aspect ratios can be considered as high aspect ratios.

[0048] In other words, critical dimensions can be those that are essential for a part's functionality, assembly, and performance. The critical dimensions as specified by the inventors have been determined by considering design requirements, manufacturing capabilities, material properties, and application-specific needs of lids and / or chips for semiconductor cooling applications.

[0049] Ensuring that these dimensions are met and maintaining control over critical dimensions is key to producing high-quality, reliable parts. Providing three-dimensional cooling features within the lid and / or chip having critical dimensions between 25 pm and 200 pm can mean that the 3D screen-printing process can be performed with a resolution between 25 pm and 200 pm to realize and fulfill such critical dimensions.

[0050] In an embodiment, the three-dimensional cooling features, can have critical dimensions between 30 pm and 150 pm, more preferably between 40 pm and 100 pm and 25 pm especially 50 pm. The three-dimensional cooling features can comprise critical dimensions of at least 25 pm, or at least 30 pm, or at least 40 pm, or of 50 pm. Additionally or alternatively, the three-dimensional cooling features can comprise critical dimensions of 200 pm or less, or of 150 pm or less, or of 100 pm or less.

[0051] In one embodiment, the at least one fluid channel branches and / or ramifies into at least one further fluid channel. This can increase the degrees of freedom to adjust a local coolant agent supply to local cooling needs of the semiconductor die. By branching of a further fluid channel, a big fluid channel can be split into two or more fluid channels, while the two or more fluid channels can be ramified into one fluid channel downstream of a flow direction of a cooling agent. In addition or alternatively fluid channels being supplied by different fluid inlets can be ramified into one channel and / or a fluid channel can be split into different further fluid channels supplying the cooling agent to different fluid outlets.

[0052] According to an embodiment, a plurality of fluid channels may be provided, the plurality of fluid

[0053] March 19, 2026 7 / 36channels being interconnected to form a network of fluid channels for a flow of cooling agent therethrough. The network of fluid channels can be substantially straight and / or form a regular cooling structure pattern. Alternatively or in another section of the network, the fluid channels can form a non-uniform, non-homogenous, non-straight, and / or irregular network of channels. The fluid channels can be branched and / or ramified. The fluid channels can be branched and / or ramified into each other.

[0054] Form, shape, geometry, configuration, and / or dimension of the plurality of fluid channels can be similar or can be different from one another. The plurality of fluid channels can comprise both one or more groups of fluid channels having similar form, shape, geometry, configuration, and / or dimension, and one or more groups of fluid channels having different forms, shapes, geometries, configurations, and / or dimensions.

[0055] The cooling features can comprise a plurality of fluid channels, including a first channel, with same and / or different channel sizes. The cooling features can comprise a plurality of fluid channels with a customized or optimized design with non-straight and / or irregular channels. The cooling features can comprise one or more fluid channels having a width of more than 300 pm and one or more fluid channels having a width of 60 pm to 80 pm.

[0056] In addition or alternatively, the cooling features can comprise straight and / or regular fluid channels which can have a width of 60 to 75 pm. The fluid channels can have a pitch of 130 pm to 150 pm.

[0057] In one embodiment, the at least one fluid channel comprises sidewalls being perpendicular to a channel ground. The term “perpendicular” can relate to an angel between 88.5° and 91.5°, or between 89° and 91°, or between 89.5° and 90.5°. The angle can be at least 88.5°, or at least 89°, or at least 89.5°. The angle can be at most 91.5°, or at most 91°, or at most 90.5°. The angle between each sidewall and the channel ground and / or between each sidewall and the surface of the component in which the fluid channel is formed can deviate not more than + / - 1° from 90°. By providing sidewalls that are perpendicular to the channel ground, a large surface area of the channel ground is formed. Accordingly, heat generated by the (logic) chip can be transferred from a large channel ground to the cooling agent, providing good heat transfer efficiency.

[0058] In one embodiment, the cooling features are sized for a flow rate of between 0.1 liters per minute per kilowatt of total power of the package and 5 liters per minute per kilowatt of total power of the package and / or is sized for a flow velocity of between 0.1 m / s and 5 m / s, or 0.25 liters per minute per kilowatt of total power of the package and 3 liters per minute per kilowatt of

[0059] March 19, 2026 8 / 36total power of the package and / or is sized for a flow velocity of between 0.2 m / s and 3,5 m / s, or 0.5 liters per minute per kilowatt of total power of the package and 1.5 liters per minute per kilowatt of total power of the package and / or is sized for a flow velocity of between 0.25 m / s and 2.5 m / s. The cooling features are sized for a flow rate of at least 0.1 liters per minute per kilowatt of total power of the package or 0.25 liters per minute per kilowatt of total power of the package or 0.5 liters per minute per kilowatt of total power of the package. The cooling features are sized for a flow rate of at most 5 liters per minute per kilowatt of total power of the package or 3 liters per minute per kilowatt of total power of the package or 1.5 liters per minute per kilowatt of total power of the package. The cooling features are sized for a flow velocity of at least 0.1 m / s or 0.2 m / s or 0.25 m / s. The cooling features are sized for a flow velocity of at most 5 m / s or 3.5 m / s or 2.5 m / s. The term “total power of the package” relates to an electrical power provided to the package. Such flow rates and / or flow velocity ensure that the package is sufficiently cooled.

[0060] In one embodiment, the cooling features are designed according to a precalculated heat dissipation depending on the chip to be cooled. Each chip, in particular each logic chip, generates heat when it is in use. The heat generating areas differ from chip to chip and can be determined by calculations, simulations and / or experiments. On the basis of results of the calculations, simulations and / or experiments, the cooling features are designed to achieve optimum heat dissipation. Different kinds of chips have different heat generating areas such that the cooling features can need to be adapted for each kind of chip individually.

[0061] In one embodiment, the cooling features are accessible via a removable cover, which is preferably formed as part of the lid. The removable cover is configured to be removed, such as from the lid, without harming any element to which the removable cover was attached to. The removable cover can be removed by using tools to disengage retaining components retaining the removable cover onto the lid, e.g. screws or alike. When the removable cover is removed, the cooling features are accessible, which allows to perform maintenance work, cleaning, inspecting or the like of the cooling features. This is advantageous in cases in which the cooling agent is contaminated with debris or the like. After maintenance work is finished, the removable cover is put back and closed to its initial state.

[0062] In one embodiment, a sealing arrangement is provided for sealing the removable cover, for example for sealing it to the lid. Such a sealing arrangement is for example a sealing agent, a sealing gasket, or an O-ring. This can ensure that the removable cover is held firmly and tightly in place.

[0063] In one embodiment, the sealing arrangement comprises a gasket comprising a material of a

[0064] March 19, 2026 9 / 36group of materials comprising Fluoroelastomer (FKM), Perfluoroelastomer (FFKM), Methylvinylsiloxane Rubber (VMQ), Fluorinated Methylvinylsiloxane Rubber (FMQ) and Thermoplastic Elastomer (TPE). This list is non-exhaustive and can comprise further sealing materials, which are temperature-resistant up to a temperature of at least 100°C, or 150°C, or 200°C.

[0065] In one embodiment, the cooling features are partly limited by a top member. The cooling features and the top member limit an area that is configured to be in contact with the cooling agent. To do so, the cooling features comprise a fluid guidance that is partly open on one side. Said one side is configured to be limited by the top member, such that the fluid guidance is closed and configured to allow a fluid flow from the fluid inlet to the fluid outlet. In some embodiments, the terms “top member” and “removable lid” may identify the same component.

[0066] In one embodiment, the top member comprises a manifold providing a fluid connection between the cooling features and the fluid inlet and outlet. The manifold is configured to supply the cooling agent from the fluid inlet to the cooling features and discharge the cooling agent from the cooling features to the fluid outlet. Further, the manifold is configured to provide a uniform flow of cooling agent to and through the cooling features, e.g. by having a corresponding fluid connection in terms of at least one manifold channel.

[0067] In one embodiment, the at least one chip and the lid are thermally connected via a thermal interface. The thermal interface is configured to provide a heat transfer from the at least one chip to the lid. This allows for example that heat generated by the chip is transferred to the lid, where the heat is transferred, by means of the cooling features provided on the lid, to the cooling agent. The thermal interface is characterized by a good heat transfer rate, and can be formed of materials such as a metal alloy comprising copper, iron, chromium, aluminum , silver and / or other suitable metals.

[0068] In one embodiment, the thermal interface comprises a thermal interface material being configured to transfer heat from the at least one chip to the lid. The thermal interface material ensures a consistent and / or constant heat transfer within the thermal interface. Accordingly, tolerances such as manufacturing tolerances can be equalized by the thermal interface material. This allows an optimum heat transfer from the chip to the lid.

[0069] In one embodiment, the cooling features are formed within the chip and are partly limited by the lid. Accordingly, the lid may comprise the functionality of the above described removable cover and / or the above described manifold. The cooling features formed within the chip can be partly limited by the lid, while a fluid flow from the fluid inlet to the cooling feature and to the fluid outlet

[0070] March 19, 2026 10 / 36is allowed. Thus, the chip is cooled directly by the cooling agent.

[0071] In one embodiment, the chip is formed of a material comprising silicon. The chip can comprise the logic chip and a silicon cooling chip, wherein both of said logic chip and silicon cooling chip are formed of a material comprising silicon. By using the same material for both chips, a differing thermal expansion between the logic chip and the silicon cooling chip can be avoided.

[0072] In one embodiment, the cooling features are formed by means of a lithography process, an etching process, an additive manufacturing process, a skiving process and / or a laser machining process.

[0073] The lithography process is common in the field of semiconductor manufacturing. During the etching process, material is chemically removed. Said etching process can be combined with the lithography process.

[0074] In additive manufacturing, material is added instead of being removed. To do so, in additive manufacturing methods the arrangement to be manufactured is split into various layers, which are applied one after the other. Accordingly, the arrangement is formed of several layers.

[0075] Materials for additive manufacturing comprise for example polymers, metals, resins, etc.

[0076] Skiving, also known as scarfing, is the process of removing material in slices. Skiving can be used to remove a thin dimension of material or to create thin slices in an existing material. This process can be used, for example, to create fins on a block of metal, by not shaving the part entirely off, e.g. for forming fins of a heat sink and / or other cooling features.

[0077] In the laser machining process, a laser (light amplification by stimulated emission of radiation) provides a (pulsed) laser beam which is directed towards a workpiece. The (pulsed) laser beam hits a surface of the workpiece and heats its surface material within an area of a focal point of the laser. The heated surface material vaporizes and is removed. By using the laser, the size of the cooling features depends on the size of the focal point. By using small focal points, small cooling features can be machined, while large focal points result in large cooling features.

[0078] In one embodiment, each of the quick disconnect couplings is configured to be detachably coupled to a mating component. For example, the quick disconnect couplings are formed as male parts, which are coupled to the mating components, which are in this case formed as female parts, or the other way around. The quick disconnect couplings of the semiconductor arrangement can both be formed as male or female parts or one can be formed as a male and the other one as a female part. The quick connect couplings and the corresponding mating components can be shaped in such a way that a misalignment is prevented. In other words,

[0079] March 19, 2026 11 / 36each quick disconnect coupling has a matching mating component.

[0080] In one embodiment, each of the quick disconnect couplings is a non-spill connector, providing a tight seal in a connected state and in a disconnected state. This allows that in neither the connected state nor in the disconnected state fluid, such as the cooling agent, is spilled and is instead retained by the quick disconnect couplings.

[0081] In one embodiment, each of the quick disconnect couplings is fluidically connected to the cooling features via fluid lines, preferably hoses. At least one of the quick disconnect couplings is fluidically connected to the fluid inlet, while at least another one of the quick disconnect couplings is fluidically connected to the fluid outlet. For example, the fluid lines are flexible hoses, which allows flexible movement of the fluid lines. In another example, the fluid lines are pipes, which are stiff compared to hoses. By using fluid lines, such as hoses or pipes, the quick disconnect couplings can be arranged distanced to or remote from the at least one chip and / or lid, allowing a flexible layout of the semiconductor arrangement.

[0082] In one embodiment, the hoses have a bending radius smaller than 40 mm, or smaller than 30 mm, or smaller than 25 mm. This ensures that the hoses can be easily integrated in a system. The bending radius can be more than 5 mm, or more than 10 mm.

[0083] In one embodiment, the hoses have an inner diameter of % inch (6,4 mm) and an outer diameter below 20 mm, typically less than 1 inch (12,5 mm). This allows an easy installation of the hoses.

[0084] In one embodiment, the hoses comprise at least one material of a group of materials comprising Ethylene Propylene Diene Monomer Rubber (EPDM), Polytetrafluoroethylene (PTFE) and Polyamide (PA). These materials can be easily processed.

[0085] In one embodiment, the hoses withstand a pressure of up to 7 bar, 10 bar, 15 bar or 20 bar.

[0086] In one embodiment, the quick disconnect is attached directly to cooling features of the semiconductor arrangement, in particular the lid, the manifold, the top member, or the chip. In such a configuration, a hose connecting the cooling features to the quick disconnect coupling can be omitted. This facilitates a manufacturing process.

[0087] In one embodiment, the quick disconnect coupling is configured to be separable from a mating component by means of a release mechanism. By operating the release mechanism, e.g. by pushing a button, or pushing / pull ing on part of the connector, the quick disconnect coupler can be separated from its mating component.

[0088] March 19, 2026 12 / 36In one embodiment, the quick disconnect coupling comprises an internal valve, which is configured to be shut when the quick disconnect coupling is disconnected. The internal valve can be transferred from an open state to a shut state on the quick disconnect coupling and on the mating component when disconnecting. This prevents any fluid, in particular the cooling agent, from leaking when disconnecting.

[0089] In one embodiment, the quick disconnect coupling comprises an internal valve, which is configured to be open when the quick disconnect coupling is connected. The internal valve can be transferred from a closed state to an open state on the quick disconnect coupling and on the mating component when connecting. This allows fluid to be transferred through the quick disconnect couplings and / or the mating component.

[0090] In one embodiment, the internal valve is spring biased. This can facilitate a movement of the internal valve.

[0091] In one embodiment, the quick disconnect coupling comprises a male or a female part, wherein a mating component being configured to be coupled to a corresponding quick disconnect coupling comprises a respective other of the male or a female part. Such an arrangement can facilitate connecting the quick disconnect coupling and the mating component, since the male part can be inserted into the male part, which allows an easy alignment of the female and the male parts.

[0092] In one embodiment, the quick disconnect coupling is a blind-mate quick disconnect coupling. A corresponding mating component comprises a corresponding arrangement. A blind-mate quick disconnect coupling allows connecting and separating the quick disconnect coupling to and from the mating component in a single motion. Furthermore, such a blind-mate quick disconnect coupling allows a spill-free design, is hot-swappable allowing connecting and separating the quick disconnect coupling to and from the mating component when under pressure.

[0093] In one embodiment, two blind-mate connectors are placed side-by-side in parallel. The two blind-mate connectors can be placed in the same plane, such that with one single motion, and with a single insertion force, both the inlet and outlet are simultaneously connected.

[0094] In one embodiment, the two mating components are configured to be physically attached to each other. The term “physically attached to each other” can relate to two mating components sharing a housing or the housings of the two mating components are fixed to each other. This can create a mating quick disconnect pair complementary to the pair of quick disconnect couplings found on or connected to the semiconductor arrangement. Thus the insertion of the two mating components and / or quick disconnect couplings can be automated with a single insertion motion.

[0095] March 19, 2026 13 / 36In one embodiment, the quick disconnect coupling and / or the mating component comprises a retaining mechanism, which is configured to retain the quick disconnect coupling and the mating component in a coupled state, wherein the quick disconnect coupling and the mating component are configured to be transferred from the coupled state to a separated state by applying a separating force directed in a separating direction. Further, the quick disconnect coupling and the mating component are configured to be transferred from the separated state into the coupled state by applying a coupling force in a coupling direction. The coupling direction can be opposed to the separating direction, wherein the coupling direction and the separating direction are each an axial direction and / or rotational direction. Said separating and coupling forces can be configured to open and / or close the valves, to stay in place and maintain a retaining to keep the mating connector and the quick disconnect coupling coupled.

[0096] In one embodiment, the semiconductor arrangement comprises a strain relief arrangement configured to compensate for strain acting on the fluid lines. The strain relief arrangement retains at least a portion of the fluid lines relative to the lid and / or the at least one chip, and absorbs or transfers forces introduced via the fluid lines to force transmission points protecting the package, in particular the at least one chip and the lid.

[0097] In one embodiment, the quick disconnect couplings are integrated in or directly attached to the lid, the removable cover and / or top member. By integrating the quick disconnect to the lid, the removable cover and / or top member, the package can be formed to be compact. Accordingly, the package can be easily transported, installed, removed and / or replaced. Further, a fluid line for supplying and discharging cooling agent to and from the package can be easily adapted.

[0098] In one embodiment, the cooling agent is a single phase or a two-phase cooling agent.

[0099] The single phase cooling agent remains its one phase during a cooling cycle, e.g., when it takes up heat, transfers heat and dumps heat. The phase of the single phase coolant is for example liquid or gaseous.

[0100] The two-phase cooling agent undergoes a phase change during the heat transfer process, typically from liquid to vapor and vice versa. In a two-phase system, the coolant absorbs heat and changes from liquid to vapor (evaporates), and then the vapor is condensed back into a liquid as it releases heat.

[0101] In one embodiment, the cooling agent comprises 25% propylene glycol, water, corrosion inhibitors and biological growth inhibitors. Such a cooling agent has good heat transfer characteristics and is easy to handle.

[0102] March 19, 2026 14 / 36In one embodiment, the semiconductor arrangement is prefilled with a cooling agent. As soon as the semiconductor arrangement is installed to its designated position and connected to the cooling circuit, the semiconductor arrangement can be cooled. There is no need for filling the semiconductor arrangement with the cooling agent during the installation process. Furthermore, the semiconductor arrangement can be filled during pressure testing and / or leakage testing, such that emptying the semiconductor for mounting can be omitted.

[0103] In one embodiment, an inlet temperature of the coolant is between 5°C and 80°C, or 10°C and 65°C, or 20°C and 50 C and / or an outlet temperature is between 20°C and 100°C, or 30°C and 85°C or 40°C and 70°C. The inlet temperature relates to a temperature of the cooling agent determined at the fluid inlet, while the outlet temperature relates to a temperature of the cooling agent determined at the at the fluid outlet when in use.

[0104] In one embodiment, the semiconductor arrangement comprises at least two chips, or at least 4 chips or at least 6 chips or at least 8 chips. A semiconductor arrangement comprising multiple chips has a high computing performance, while requiring little space.

[0105] Further, according to an aspect, the above-described objective is solved by a server arrangement comprising at least one semiconductor arrangement as described above, having a fluid system comprising a fluid supply being configured to supply a fluid to one of the quick disconnect couplings and a fluid discharge configured to discharge fluid from another one of the quick disconnect couplings.

[0106] Such a server arrangement is for example provided in datacenters and / or server farms, which comprises a high computing performance. The server arrangement comprises at least one semiconductor arrangement. For example, such a server arrangement comprises several dozen, several hundred or several thousand semiconductor arrangements as described above.

[0107] In order to cool the semiconductor arrangements, the server arrangement comprises the cooling circuit. The cooling circuit comprises the fluid supply configured to supply a cooling agent to each semiconductor arrangement. Further, the cooling circuit comprises a fluid discharge for discharging cooling agent from each semiconductor arrangement.

[0108] Additionally, the cooling circuit may comprise a cooling facility for cooling the cooling agent discharged by each of the at least one semiconductor arrangement. The cooling facility is configured to cool the cooing agent to a desired temperature and to introduce such cooled cooling agent to the fluid for supplying the cooled cooling agent to the fluid inlet of the semiconductor arrangement.

[0109] March 19, 2026 15 / 36In one embodiment, the server arrangement comprises mating components being configured to be detachably coupled to the quick disconnect couplings. For example, the mating components are non-spill connectors, providing a tight seal in a connected state and / or in a disconnected state. Thus, the mating components do not leak any cooling agent, neither in a connected nor in a disconnected state. The may components can be fl uidically connected to the fluid system via hoses and / or pipes.

[0110] In one embodiment, the fluid system withstands at least 5 bar, or 8 bar, or 10 bar of pressure. This ensures that the fluid system is tight and has no leakage. For example, the fluid system is operated at pressures of between 1 bar and 2 bar. Pressure testing the fluid system so check whether the fluid system withstands at least 5 bar, or 8 bar, or 10 bar of pressure ensures that there is no leakage during operation.

[0111] In one embodiment, the server arrangement comprises at least two semiconductor arrangements as described above, wherein the fluid supply is configured to supply the at least two semiconductor arrangements with the cooling agent in parallel and / or in series. In a parallel arrangement, the cooling agent flows parallel through each of the two semiconductor arrangements. In a serial arrangement, the cooling agent flows through a first semiconductor arrangement and subsequently through another semiconductor arrangement. In another example, the server arrangement comprises semiconductor arrangements, which are arranged in parallel and in series to each other.

[0112] In one embodiment, the server arrangement comprises 2, or 4, or 6, or 8 semiconductor arrangements according to the ones described above. Each of the multiple semiconductor arrangements can be cooled by a shared cooling circuit. This allows a high operating performance.

[0113] Further, according to an aspect, the above-described objective is solved by use of a quick disconnect coupling for a cooling a semiconductor arrangement, having a package comprising at least one chip, a substrate, electrical connectors, which are conductively connected to the at least one chip, a lid at least partly covering the at least one chip, and a cooling arrangement comprising cooling features for cooling the at least one chip, which cooling features are fluidically connected to at least one fluid inlet and at least one fluid outlet of the package, wherein the at least one fluid inlet and the at least one fluid outlet each comprises said quick disconnect coupling for fluidically connecting the cooling arrangement to a cooling circuit. By using a quick disconnect coupling said semiconductor arrangement can be easily connected to and separated from the cooling circuit.

[0114] March 19, 2026 16 / 36Further, according to an aspect, the above-described objective is solved by use of a quick disconnect coupling being for a server arrangement comprising at least one semiconductor arrangement as described above, having a cooling circuit comprising a fluid supply being configured to supply a fluid to one of the quick disconnect couplings and a fluid discharge configured to discharge fluid from another one of the quick disconnect couplings.

[0115] Further, according to an aspect, the above-described objective is solved by use of a quick disconnect coupling for connecting and / or disconnecting a cooling a semiconductor arrangement of the above described type to / from a cooling circuit, respectively.

[0116] According to an embodiment and / or to a further aspect, the server arrangement comprises a baseboard having at least one socket for accepting a semiconductor arrangement having at least one quick disconnect coupling, such as a semiconductor arrangement as described above. The at least one quick disconnect coupling can be arranged at the lid and / or the top member and / or the manifold. Mating components configured to be detachably coupled to the quick disconnect couplings are arranged on the baseboard, wherein the mating components are moveable relative to the socket. For example, the mating components can be linearly moveable and / or in a direction parallel to an upper side of the baseboard. The upper side can relate to the side of the baseboard being provided with the socket. The socket can comprise at least two electrical contacts.

[0117] According to a further aspect, to install the semiconductor arrangement to the baseboard, the following steps can be performed, for example in an installation method:

[0118] First step: the semiconductor arrangement, more precisely its electrical connectors, is brought into mechanical and / or electrical contact with the socket. To do so, the semiconductor arrangement can be installed to the baseboard by moving it partly or substantially perpendicular in a direction towards an upper side of the baseboard, in a electrical coupling direction, at least until the electrical connectors are in conductive connection with the socket.

[0119] Second step: the mating components can be moved relatively to the socket in order to engage with the quick disconnect couplings of the semiconductor arrangement. To do so, the mating components are moved in a fluid coupling direction, which can be a direction substantially parallel to the top surface of the baseboard.

[0120] Third step (optional): a retaining mechanism, being configured to retain the semiconductor arrangement to the baseboard and / or retain the quick disconnect couplings to the mating components, is engaged.

[0121] March 19, 2026 17 / 36In one embodiment, the above installation steps can be performed in said order. This allows a simple design of the server arrangement.

[0122] In an alternative embodiment, steps two and three can be performed simultaneously in combination, subsequently to the first step. This constitutes a very simple installation.

[0123] In one embodiment, the fluid coupling direction can be arranged substantially perpendicular to the electrical coupling direction. The electrical coupling direction can be an axial direction in view of a vertical axis of the semiconductor arrangement and / or the baseboard, such that the mating components can be moved in a substantially straight and / or linear line. The fluid coupling direction can be an axial direction in view of a longitudinal axis of an end portion of the mating components facing the quick disconnect couplings, which can be identical to an axial direction of the longitudinal axis of the quick disconnect couplings, when the semiconductor arrangement is connected to the baseboard in its intended position.

[0124] In one embodiment, movement of the mating components relative to the socket in the axial direction can be limited to a predefined distance, such as 100 mm or less, 75 mm or less, 50 mm or less, or 25 mm or less. The possible movement of the mating components can be at least 5 mm, at least 10 mm, at least 20 mm, or at least 25 mm. Possible movement can be between 5 mm and 100 mm. This movement can be oriented in the fluid coupling direction. Accordingly, the mating component can only be moved backwards and forwards within this distance, in particular between two points being arranged at respective ends of the distance.

[0125] In one embodiment, the fluid coupling direction is a rotational direction, such that the mating components can be moved along a circular path and / or in a pivoting motion. Such a rotational direction can be provided about a rotational axis, wherein the rotational axis may be oriented parallel to the upper side of the baseboard, perpendicular to the upper side of the baseboard or tilted relative to the upper side, for example in a tilting angel between 30°, 45° or 60° between the rotational axis and the upper side of the baseboard.

[0126] In one embodiment, the movement of the mating component in a rotational direction can be limited to 720°, 360°, 180° or less. The movement of the mating component in a rotational direction can be at least 15°, 45°, 90° or more.

[0127] In one embodiment, the fluid coupling direction comprises an axial direction and a rotational direction. For example, a threaded connection or a bayonet connection can be provided in such an embodiment to achieve such movement.

[0128] In one embodiment, the mating components can be fluidically connected to the cooling circuit by

[0129] March 19, 2026 18 / 36means of hoses. This results in an easy installation process.

[0130] In one embodiment or aspect, the server arrangement comprises a baseboard having at least one socket for accepting a semiconductor arrangement, for example as described above, wherein the at least one quick disconnect coupling can be arranged at the lid and / or the top member and / or the manifold of the semiconductor arrangement, wherein the mating components are arranged on the baseboard, wherein the mating components are fixed relative to the socket.

[0131] To install the semiconductor arrangement to the baseboard, the electrical components can be brought into engagement with the corresponding socket while the quick disconnect couplings can be brought into engagement with the mating components. By doing so, the semiconductor arrangement can be installed within one motion, for example with one linear motion.

[0132] In one embodiment, said one motion is carried out in a direction perpendicular to an under side of the substrate and / or perpendicular to an upper side of the baseboard. For example, the under side of the substrate can be substantially parallel to an upper side of the baseboard when installing the semiconductor arrangement.

[0133] In one embodiment, the electrical connectors can engage the socket when the quick disconnect couplings engage the mating components or the other way around. Said engagement can be performed simultaneously.

[0134] The term “simultaneously” can relate to a close timely relation, such as +-1 sec, +-0.5 sec, +-0.25 sec or less than 0.25 sec. This allows quick installation.

[0135] In one embodiment, a layout of the quick disconnect couplings and the electrical components can be adapted to a layout of the mating components and the socket or the other way around. More precisely, the layouts can be at least partially complementary.

[0136] In one embodiment, the one motion is oriented substantially perpendicular to the upper side of the baseboard. In this case an electric coupling direction and a fluid coupling direction can be parallel to an orientation of the one motion. Respective separating directions can be oriented opposite to the coupling directions.

[0137] In one embodiment, a fluid line, connecting the mating components and the cooling circuit, can be arranged parallel to an upper side of the baseboard. For example, the fluid line can be a pipe, a hose or alike. Further, the fluid line can be arranged to be in contact with the upper side of the base board and / or be distanced to the upper side. Such a distance can be between

[0138] March 19, 2026 19 / 360.5 mm and 20 mm, 1 mm and 15 mm or 1.5 mm and 10 mm. Said distance is at least 0.5 mm, 1 mm or 1.5 mm. Said distance is at most 20 mm, 15 mm or 10 mm. A transfer of vibration between the fluid line and the baseboard can be kept low.

[0139] In one embodiment, the server arrangement comprises a retaining mechanism configured to retain the semiconductor arrangement to the mating component and / or to retain the semiconductor arrangement to the baseboard. The retaining mechanism can be stationary. The retaining mechanism can be fixed to the baseboard.

[0140] The retaining mechanism can comprise a first state, in which the retaining mechanism is configured to retain the semiconductor arrangement to the mating component(s), and a second state, in which the quick disconnect coupling can be separated from or coupled to the mating components.

[0141] The retaining mechanism can comprise retaining components, for example a toggle lever system, screws, a bayonet catch, a latch, a clip, a frictional engagement, and / or a combination of the aforementioned.

[0142] The mating components can be moveable in a direction parallel to the upper side of the baseboard, wherein the direction allows a coupling and separation of the quick disconnect couplings and the mating components.

[0143] In one embodiment, the quick disconnect couplings are arranged perpendicular to the baseboard, when the quick disconnect couplings are connected to the mating components. The quick disconnect couplings can be blind-mate quick disconnect couplings. In such a configuration, a force required to separate the semiconductor device from the baseboard can be supported by the blind-mate quick disconnect couplings, which naturally provide a separating force when being separated. In other words, the blind-mate quick disconnect couplings provide the separating force, pushing the respective parts apart, when being separated. This simplifies separating the semiconductor arrangement from the baseboard.

[0144] In one embodiment, the mating components comprise tolerance compensation. This allows compensation for manufacturing and / or assembling tolerances. The tolerance compensation can comprise axial compensation and / or rotational compensation. This allows an easy assembly.

[0145] In one embodiment, the server arrangement comprises a support for supporting a hose being attached to the mating component when in a state being separated from the semiconductor device. By supporting the hoses and / or the mating component, dangling hoses can be avoided

[0146] March 19, 2026 20 / 36when the semiconductor arrangement is disconnected. This can help preventing damaging server arrangement components such as the socket.

[0147] Embodiments, features, advantages, or technical effects described in the context of one of the aspects can apply accordingly to the other aspects. For example, details described in the context of the semiconductor arrangement can apply accordingly to the server arrangement comprising a semiconductor arrangement and vice versa. Likewise, details described in the context of the server arrangement can apply accordingly to the installation and vice versa.

[0148] Brief Description of the Drawings

[0149] The disclosure is described below in conjunction with the drawing. Herein show:

[0150] Fig. 1 a schematic cross-sectional view of a semiconductor arrangement according to a first embodiment,

[0151] Fig. 2 a schematic cross-sectional view of a semiconductor arrangement according to a second embodiment,

[0152] Fig. 3 a schematic cross-sectional view of a semiconductor arrangement according to a third embodiment,

[0153] Fig. 4a a schematic cross-sectional view of a semiconductor arrangement according to a fourth embodiment having an attached removable cover,

[0154] Fig. 4b a schematic cross-sectional view of a semiconductor arrangement according to the fourth embodiment having a separated removable cover,

[0155] Fig. 5 a schematic top view of a semiconductor arrangement according to a fifth embodiment,

[0156] Fig. 6a a schematic view of an in-chip cooling,

[0157] Fig. 6b a schematic view of a semiconductor arrangement according to a sixth embodiment,

[0158] Fig. 7a a schematic view of an in-lid cooling,

[0159] Fig. 7b a schematic view of a semiconductor arrangement according to a seventh embodiment,

[0160] Fig. 8a a schematic top view of a server arrangement according to an eighth embodiment

[0161] March 19, 2026 21 / 36having a separated semiconductor arrangement,

[0162] Fig. 8b a schematic top view of a server arrangement according to an eighth embodiment having an attached semiconductor arrangement,

[0163] Fig. 9 a schematic top view of a server arrangement according to a sixth embodiment,

[0164] Fig. 10a a schematic view of a server arrangement having a detached semiconductor arrangement.

[0165] Fig. 10b a schematic view of a server arrangement having an attached semiconductor arrangement,

[0166] Fig. 11 a a schematic top view of the cooling features,

[0167] Fig. 11b a schematic cross-sectional view of cooling features,

[0168] Fig. 12a a schematic cross-sectional view of another embodiment,

[0169] Fig. 12b a schematic top view of the embodiment of Fig. 12a,

[0170] Fig. 13a a schematic top view of another embodiment,

[0171] Fig. 13b a schematic cross-sectional side view of the embodiment of Fig. 13a in a first state,

[0172] Fig. 13c a schematic cross-sectional side view of the embodiment of Figs. 13a and 13b in a second state,

[0173] Fig. 13d a schematic cross-sectional side view of the embodiment of Figs. 13a to 13c in a third state,

[0174] Fig. 14a a schematic top view of another embodiment,

[0175] Fig. 14b a schematic cross-sectional side view of the embodiment of Fig. 14a in a first state,

[0176] Fig. 14c a schematic cross-sectional side view of the embodiment of Figs. 14a and 14b in a second state.

[0177] Detailed

[0178]

[0179] of the

[0180]

[0181] Identical or similar elements are labelled with the same reference signs throughout various embodiments.

[0182] March 19, 2026 22 / 36Fig. 1 depicts a package 1 of a semiconductor arrangement according to a first embodiment. The package 1 comprises a chip 2, a substrate 3, electrical connectors, which are conductively connected to the chip 2, a lid 4 partly covering the chip 2 and having cooling features 5 being part of a cooling arrangement. The package 1 further comprises two quick disconnect couplings 6, which are in fluid communication by means of hoses 7 with the cooling features 5. The cooling features 5 are arranged within the lid 4 and are covered by a cover 8.

[0183] The lid 4 and the chip 2 are thermally connected to each other via a thermal interface 9. The thermal interface 9 can be equipped with a not-depicted thermal interface material, in order to provide a constant and / or consistent heat transfer from the chip 2 to the lid 4.

[0184] Fig. 2 depicts a package 1 of a semiconductor arrangement according to a second embodiment. The package 1 comprises a chip 2 having cooling features 5, a substrate 3 and a lid 4 covering the cooling features 5. The cooling features 5 are in fluid communication with the quick disconnect couplings 6, wherein the quick disconnect couplings 6 and the lid 4 are connected via fluid lines, such as hoses 7.

[0185] In the shown embodiments, at least the chip 2, the substrate 3, and the lid 4 are inseparably connected to each other. Also, further components of the shown semiconductor arrangement packages are inseparably connected to or formed within the package, unless otherwise specified.

[0186] Fig. 3 shows a third embodiment of a semiconductor arrangement according to the present disclosure, having a package 1 comprising a chip 2, a substrate 3, a lid 4 provided with cooling features 5, quick disconnect coupling 6 being in fluid communication with the cooling features 5 via hoses 7, and a cover 8 limiting the cooling features 5 in a direction pointing opposite to the direction of gravity. The cover 8 can be removable. The lid 4 is directly attached to the substrate 3 by means of a fixation 10. For example, the fixation 10 can be in form of an adhesive, a soldering joint, a glass fit, eutectic bond, thermocompression bond, diffusion bond or alike.

[0187] A fourth embodiment is depicted in Figs. 4a and 4b and based on the third embodiment. The fourth embodiment comprises the package 1 with the chip 2, the substrate 3, the lid 4, cooling features 5, quick disconnect couplings 6 being in fluid communication with the cooling features 5 via hoses 7, wherein the lid 4 is attached to the substrate 3 by means of the fixation 10.

[0188] According to the fourth embodiment, the lid 4 comprises the cooling features 5, wherein the cooling features 5 are limited at least partly by a cover 8 which can be removable. The cover 8 is mounted to the lid 4 by means of detachable fasteners 11 , such as screws or alike.

[0189] While Fig. 4a shows the cover 8 being attached to the lid 4, secured by detachable fasteners

[0190] March 19, 2026 23 / 3611, Fig. 4b depicts the cover 8 being separated from the lid 4. The lid 4 comprises holes 12, which are configured to interact with the detachable fasteners 11.

[0191] The lid 4 and the cover 8 comprises sealing surfaces 13, which are facing to each other, when the cover 8 is attached to the lid 4. A sealing arrangement in the form of a sealing gasket 13a can be provided between the two sealing surfaces 13.

[0192] Such a gasket 13a comprises a material of a group of materials comprising Fluoroelastomer (FKM), Perfluoroelastomer (FFKM), Methylvinylsiloxane Rubber (VMQ), Fluorinated Methylvinylsiloxane Rubber (FMQ) and Thermoplastic Elastomer (TPE).

[0193] Fig. 5 depicts a fifth embodiment of a semiconductor arrangement in a top view. The semiconductor comprises a package 1 having a substrate 3, two quick disconnect couplings 6 and a lid 4. The substrate 3 comprises mounting holes 14 which are configured to facilitate a mounting of the package 1 , e.g. via fasteners such as screws or alike.

[0194] Figs. 6a and 6b depict a sixth embodiment of the semiconductor arrangement. Fig. 6a depicts a chip 2 being mounted to a substrate 3, wherein the chip 2 comprises cooling features 5 facing away from the substrate 3.

[0195] Fig. 6b depicts the in Fig. 6a shown arrangement in combination with its periphery. The substrate 3 is provided on a stiffener frame 15, which supports the substrate 3. Electrical connectors 16 are provided on the stiffener frame 15 facing away from the substrate 3, while being in conductive connection with the chip 2. The cooling features 5 are in fluid communication with the quick disconnect couplings 6 via a manifold 17 and its manifold channels 18. The manifold channels 18 form a fluid communication between the cooling features 5, the hoses 7 and the quick disconnect couplings 6.

[0196] The seventh embodiment shown in Figs. 7a and 7b is similar to the sixth embodiment, while the arrangement of the cooling features 5 is not provided in the chip 2 but rather in the lid 4.

[0197] A package 1 of the seventh embodiment comprises the chip 2, which is mounted on a substrate 3. The chip 2 is further provided between the substrate 3 and a lid 4 comprising cooling features 5. The lid 4 itself is at least partly covered by a manifold 17 comprising manifold channels 18. The manifold channels 18 and hoses 7 provide a fluid communication between the quick disconnect connectors 6 and the cooling features 5. Further, the manifold 17 limits the cooling features 5 in a direction facing away from the substrate 3. The substrate 3 is supported by a stiffener frame 15, which comprises electrical connectors 16 being in conductive connection with the chip 2.

[0198] March 19, 2026 24 / 36A top member comprises the manifold 17 and can be configured to limit the cooling features 5 at least partially.

[0199] Figs. 8 to 10 relates to a server arrangement 19 comprising at least one of the above described packages 1 of the semiconductor arrangements. For the sake of simplicity, the package 1 is just depicted schematically in a top view, such that solely the hoses 7, the quick disconnect couplings 6 and the lid 4 are shown.

[0200] Figs. 8a and 8b depict a server arrangement 19 according to an eighth embodiment, wherein the package 1 is separated from the server arrangement 19. The server arrangement 19 comprises a socket 20 with two electrical contacts and a fluid system having a fluid supply 21 and a fluid discharge 22. The socket 20 is configured to be attached to electrical connectors 16 of the packages 1.

[0201] The fluid supply 21 and the fluid discharge 22 are in fluid communication via pipes 23 with distribution blocks 24. The distribution blocks 24 comprise each two mating components 25, wherein the mating components 25 are configured to be connectable to and / or separatable from the quick disconnect couplings 6 of the packages 1.

[0202] The arrow 26 shown in Fig. 8a indicates that the package is configured to be mounted to the server arrangement 19. The electrical connectors of the package 1 are configured to be mounted to slots provided in the socket 20.

[0203] Fig. 8b depicts the server arrangement 19 having two packages 1. The quick disconnect couplings 6 are in fluid communication with the mating components 25 allowing a fluid flow from the fluid supply 21 via the cooling features 5 to the fluid discharge 22.

[0204] Fig. 9 depicts a server arrangement 19 in a ninth embodiment. The ninth embodiment is based on the eighth embodiment shown in Figs. 8a and 8b. In addition to the eighth embodiment, the ninth embodiment comprises a strain relief arrangement 27. The strain relief arrangement 27 is configured to absorb a load introduced via the hoses 7 and transfer the load to a not depicted load bearing point. Thus, the chip 2 is protected from exceeding forces.

[0205] As depicted in Figs. 8a, 8b and 9, the two packages 1 are connected to the fluid supply 21 and to the fluid discharge 22 in a parallel manner.

[0206] Figs. 10a and 10b show a disconnected state (Fig. 10a) and a connected state (Fig. 10b) of the package 1 and the fluid system having a fluid supply 21 and a fluid discharge 22. In the disconnected state of Fig. 10a, the quick disconnect couplings 6 and the mating components 25

[0207] March 19, 2026 25 / 36are separated. Each of the fluid supply 21 and the fluid discharge 22 is equipped with mating components 25. In the connected state, as shown in Fig. 10b, the quick disconnect couplings 6 and the mating components 25 are coupled with each other in a separatable manner. The flow arrows 28 show a direction of flow of a cooling agent.

[0208] Fig. 11a and Fig. 11b schematically depict the above described cooling features 5. Fig. 11a, depicts the cooling features 5 in a top view, while Fig. 11b depicts the cooling features 5 in a cross-sectional view A-A as indicated in Fig. 11a. In this example, the cooling features 5 comprise micro geometries having a fluid channel 30 and a fin 31. The fluid channel 30 branches off into two fluid channels 30, while the two fluid channels 30 ramify into one fluid channel 30 downstream. The direction of flow of a cooling agent is indicated by the flow arrow 28.

[0209] The fluid channel 30 comprises sidewalls 32 and a channel ground 33, see Fig. 11b. The sidewalls 32 are perpendicular to the channel ground 33.

[0210] The above described micro geometries are between 10 pm and 5 mm, or 30 pm and 4 mm, or 50 pm and 3 mm in size, while the fluid channel width, corresponding to the width of the channel ground 33, is sized between 50 pm and 200 pm and / or the channel depth, corresponding to a height of the sidewall 31 , is sized between 0.3mm and 3 mm. The fin 31 has a fin width 34 of between 50 pm and 200 pm.

[0211] The cooling features 5 and the lid 4 can be formed at least partly monolithic. In this case, the cooling features 5 are incorporated into the lid 4 and its structure. In other words, the cooling features 5 are machined out of the lid 4.

[0212] Alternatively or in addition, the cooling features 5 and the chip 2 can be formed at least partly monolithic, wherein the cooling features 5 are incorporated into the chip and its structure. To do so, the cooling features 5 are processed during a manufacturing process of the chip 2.

[0213] The fluid channel 30 is sized for a flow rate of between 0.5 liters per minute per kilowatt of total power of the package 1 and 1.5 liters per minute per kilowatt of total power of the package 1 and / or is sized for a flow velocity of between 0.25 m / s and 2.5 m / s. The total power of the package 1 relates to the electrical power supplied to the package 1.

[0214] The above described embodiments comprise each a lid 4 covering the chip 2 at least partly. The chip 2 and the lid 4 may be thermally connected via a thermal interface 9, wherein the thermal interface 9 can be equipped with a thermal interface material (not shown). In case the cooling features 5 are solely provided within the chip 2, the thermal interface 8 between the lid 4

[0215] March 19, 2026 26 / 36and the chip 2 can be omitted.

[0216] Each of the above described packages 1 comprises electrical connectors 16, which are arranged on at least one outside face of the package 1 and provide a conductive connection to the chip 2. The electrical connectors 16 are configured to provide a conductive connection between a socket 20 of the server arrangement 19 and the chip 2.

[0217] Each of the above described embodiments comprises a fluid inlet (without reference sign) and a fluid outlet (without reference sign), wherein the fluid inlet comprises one of the quick disconnect couplings 6, while the fluid outlet comprises the other one of the quick disconnect couplings 6.

[0218] The cooling agent has an inlet temperature of between 20°C and 50°C and an outlet temperature of between 40°C and 70°C. The inlet temperature is determined at the fluid inlet while the outlet temperature is determined at the fluid outlet.

[0219] The cooling agent (not shown) is provided to any one of the above described embodiments. The cooling agent can be a single phase or a two-phase fluid, depending on the specification of the application of the semiconductor arrangement. The single phase cooling agent does not change its phase during a cooling cycle. The two phase cooling agent, however, changes its phase during the cooling cycle, typically from liquid to gas and from gas to liquid.

[0220] In the above described embodiments, the cooling agent comprises 25% propylene glycol, water, corrosion inhibitors and biological growth inhibitors.

[0221] The above described packages 1 can be prefilled with the cooling agent. Accordingly, elements configured to be in contact with the cooling agent are in contact with the same. Such elements are for example the hoses 7, the quick disconnect connectors 6, the cooling features 5, pipes 23, mating components 25, the fluid supply, the fluid discharge, the fluid inlet, the fluid outlet, the lid 4, the chip 2, the top member, the manifold 17 and / or the manifold channels 18. The manifold channels 18 provide a fluid connection between the cooling features 5 and the fluid inlet and fluid outlet.

[0222] Further, the package 1 and / or the server arrangement 19 can be pressure tested before installation. The package 1 and / or the server arrangement 19 should withstand a pressure of at least 5 bar, 8 bar or 10 bar.

[0223] The quick disconnect coupling 6 can be separable from a mating component by means of a release mechanism (not shown). By operating the release mechanism, e.g. by pushing a button, or pushing / pulling on part of the connector, the quick disconnect coupler can be separated from

[0224] March 19, 2026 27 / 36its mating component.

[0225] The quick disconnect coupling 6 can comprise an internal valve (not shown), which is configured to be shut when the quick disconnect coupling 6 is disconnected and to open when the quick disconnect coupling 6 is connected. The internal valve can be transferred from an open state to a shut state on the quick disconnect coupling 6 and on the mating component 25 when disconnecting and vice versa when connecting.

[0226] The internal valve can be spring biased, facilitating a movement of the internal valve.

[0227] The quick disconnect coupling 6 can comprise a male or a female part, wherein a mating component 25 being configured to be coupled to a corresponding quick disconnect coupling 6 comprises a respective other of the male or a female part. In the present embodiment, the quick disconnect couplings 6 can be both a female part, while the mating components 25 can be a male part. In other embodiments, the quick disconnect couplings 6 can be a female or a male part, while the corresponding mating component 25 are the receptive other.

[0228] The quick disconnect coupling 6 can be a blind-mate quick disconnect coupling. The corresponding mating component 25 can comprise a corresponding arrangement.

[0229] In another embodiment, Figs 12a and 12b, the quick disconnect couplings 6 are arranged within the lid 4. The quick disconnect couplings 6 are directly mounted to the lid 4, without any hoses or the like. The quick disconnect couplings 6 are in fluid communication with the cooling features 5. The mating components 25 are arranged in a separate state, being separated from the quick disconnect couplings 6 and configured to be transferred into a connected state by applying a connecting force in a connecting direction (from right to left). To disengage the quick disconnect coupling 6 from the mating component 25 a separating force is applied in a separation direction (left to right) transferring the mating component 25 and the quick disconnect coupling 6 from the connected state into the separate state.

[0230] The mating components 25 are connected to hoses 7 which are connected to the cooling circuit 29.

[0231] Fig. 12b shows that two quick disconnect coupling 6 are provided in the lid 4. The quick disconnect couplings 6 are provided side by side, preferably in the same plane, as shown in Fig.

[0232] 12a. In the same manner, the mating component 25 is analogue to the quick disconnect coupling 6. Further, the embodiment comprises a retaining mechanism 35. The retaining mechanism is configured to keep the quick disconnect coupling 6 and the mating component 25 coupled in a separatable manner. Said separating and coupling forces can be applied to open

[0233] March 19, 2026 28 / 36and / or close the valves, while the retaining force retains the connection of the quick disconnect couplings 6 and the mating component 25.

[0234] Figs. 13a to 13d show another embodiment of server arrangement 19.

[0235] Fig. 13a depicts a top view of a semiconductor arrangement 1 in particular a manifold 17 comprising recesses 36, which are configured to interact with retaining components (e.g. screws) to fasten the semiconductor arrangement 1 to a baseboard 37 of the server arrangement 19. Further, quick disconnect couplings 6 are formed in the manifold 17 in this embodiment. In other embodiments, a different position of the quick disconnect couplings 6 is possible.

[0236] The semiconductor arrangement 1 is a semiconductor arrangement as described with respect to the previous discussed embodiments, wherein the quick disconnect couplings 6 are formed on the manifold 17. There are no hoses or the like between the quick disconnect couplings 6 and the manifold 17.

[0237] Fig. 13b depicts a cross-sectional side view of the embodiment introduced with regard to Fig.

[0238] 13a. The server arrangement 19 comprises the semiconductor arrangement 1 being separated from the baseboard 37. An arrow points towards an intended installation position of the semiconductor arrangement 1 on the baseboard 37. The baseboard 37 comprises a socket 20 with two electrical contacts, which are configured to interact with the corresponding electrical connectors 16 of the semiconductor arrangement 1.

[0239] The embodiment shown in Figs. 13a to 13d comprises further a mating component 25, which is arranged on the baseboard 37 in a movable manner. The mating component 25 can be moved relative to the baseboard 37 within a limited distance. Said distance is limited by a movement limiter 38. The movement limiter 38 restricts the movement of the mating component 25 in an axial direction, while the distance in which the mating component 25 can move is restricted to distances between 5 mm and 100 mm. The movement limiter 38 comprises a slot 39 and a pin 40. The pin 40 is arranged in the slot 39 and fixed to the baseboard 37, while the slot 39 is arranged in a fixed manner to the mating component 25. A length of the slot 39 corresponds to the distance of movement of the mating component 25.

[0240] Fig. 13c depicts a state, in which the semiconductor arrangement 1 is arranged on the baseboard 37. The electrical connectors 16 are in conductive connection with the socket 20, while the quick disconnect couplings 6 are still separated and spaced from the mating components 25. In this state, the retaining mechanism 41 is not in engagement with the semiconductor arrangement 1, such that the semiconductor arrangement 1 can be separated

[0241] March 19, 2026 29 / 36from the baseboard 37, e.g. for maintenance or replacement.

[0242] Fig. 13d depicts the server arrangement 19 in a third state. The semiconductor arrangement 1 is placed on the baseboard 37 in an installation position, while the electrical connectors 16 are connected to the socket 20. The quick disconnect couplings 6 are in fluid connection with the mating components 25 allowing coolant to flow through the cooling features 5 in order to cool the chip 2. To this, the mating components 25 have been moved into a connecting state, while the movement limiter 38 defines a stop position, which can avoid damaging the semiconductor arrangement 1 and / or the socket 20.

[0243] The retaining mechanism 41 comprises a first lever 42, which is pivotably attached to the mating component 25, while a second lever 43 is pivotally attached to the first lever distanced to an attachment point 44 of the first lever 42 to the mating component 25. In other words, the retaining mechanism 41 comprises a toggle lever. The retaining mechanism can have different configurations in other embodiments.

[0244] The second lever 43 comprises a hook 45, which is configured to interact with the semiconductor arrangement 1. The hook 45 is arranged distanced from the attachment point 44.

[0245] The retaining mechanism 41 can be in a first state, in which the retaining mechanism 41 is configured to retain the semiconductor arrangement 1 to the mating component 25 (see Fig. 13d), and in a second state, in which the retaining mechanism 41 allows the quick disconnect couplings 6 to be separated from or coupled to the mating components 25 (see Fig. 13b and 13c).

[0246] In order to transfer the retaining mechanism 41 from the first state to the second state, the first lever 42 is lifted, such that the hook 45 can be separated from the semiconductor arrangement 1 and the mating component 25 can be disconnected from the quick disconnect couplings 6.

[0247] In order to transfer the retaining mechanism 41 from the second state into the first state, the hook 45 is placed on the semiconductor arrangement 1 and the second lever 42 is pushed towards the baseboard 37.

[0248] The embodiment relating to Figs. 13a to 13d, comprises pipes 23, which are flexible and / or comprise a compensation mechanism allowing a movement of the mating components 25.

[0249] Figs. 14a to 14c show another embodiment, in which the quick disconnect couplings 6 are fixed directly to the manifold 17, while the mating components 25 are fixed to the baseboard 37 in a

[0250] March 19, 2026 30 / 36fixed manner.

[0251] Fig. 14a depicts a semiconductor arrangement 1 in a top view. The semiconductor arrangement 1 corresponds to the semiconductor arrangements 1 described above, while the quick disconnect couplings 6 are directly attached to the manifold 17. Said quick disconnect couplings 6 are arranged at a bottom or under side of the manifold 17. The quick disconnect couplings 6 are depicted in a dashed line in Fig. 14a.

[0252] The manifold 17 comprises recesses 36, which are arranged within a manifold 17 and can be used to attach the semiconductor arrangement 1 to a baseboard 37, by means of retaining components, such as screws for example.

[0253] Fig. 14b depicts the server arrangement 19 and a corresponding semiconductor arrangement 1 separated and spaced from each other. An arrow 46 indicates a coupling direction, in which the semiconductor arrangement 1 can be moved to couple the electrical connectors 16 to the socket 20 and to couple the quick disconnect couplings 6 to the mating components 25. This arrangement allows coupling the electric components (socket 20 and electrical connectors 16) and fluid components (quick disconnect couplings 6 and mating components 25) in one single movement. This is quick and easy.

[0254] To transfer the semiconductor arrangement 1 from a state shown in Fig. 14b to a state shown in Fig. 14c, the semiconductor arrangement 1 is moved in a linear motion towards the baseboard 37 until the electrical connectors are in conductive connection with the socket 20 and the quick disconnect couplings 6 are in fluidic communication with the mating components 25.

[0255] Fig. 14c shows the server arrangement 19 being connected to the semiconductor arrangement 1. The electrical connectors 16 are in conductive connection with the socket 20 and the quick disconnect couplings 6 are in fluid connection with the mating components 25 allowing a cooling agent to provided and discharged to the cooling features 5 to cool the chip 2.

[0256] As described above, the mating components 25 are in fluidic connection with a cooling circuit via pipes 23.

[0257] The pipes 23 can be arranged distanced to the baseboard 37, for example by a distance of between 0.5 mm and 20 mm, 1 mm and 15 mm or 1.5 mm and 10 mm.

[0258] March 19, 2026 31 / 36

Claims

1. Claims1. Semiconductor arrangement, having a package (1) comprisingat least one chip (2),a substrate (3),electrical connectors, which are conductively connected to the at least one chip (2),a lid (4) at least partly covering the at least one chip (2), anda cooling arrangement comprising cooling features (5) for cooling the at least one chip (2), which cooling features (5) are fluidically connected to at least one fluid inlet and at least one fluid outlet of the package (1), wherein the at least one fluid inlet and the at least one fluid outlet each comprises a quick disconnect coupling (6) for fluidically connecting the cooling arrangement to a cooling circuit (29).

2. Semiconductor arrangement according to claim 1 , wherein the at least one chip (2) and / or the lid (4) is provided with the cooling features (5).

3. Semiconductor arrangement according to claim 1 or 2, wherein the cooling features (5) are formed at least partly monolithic with the lid (4) and / or the at least one chip (2).

4. Semiconductor arrangement according to any one of claims 1 to 3, wherein the at least one chip (2), the cooling features (5) and / or at least part of the lid (4) are inseparably connected with each other.

5. Semiconductor arrangement according to any one of the preceding claims, wherein the cooling features (5) comprise micro geometries, which are between 10 pm and 5 mm, or 30 pm and 4 mm, or 50 pm and 3 mm in size.

6. Semiconductor arrangement according to any one of the preceding claims, wherein the cooling features (5) comprise at least one fluid channel (30) and / or at least one fin (31), wherein the fluid channel (30) comprises a channel width of between 10 pm and 400pm, or 35 pm and 300 pm or 50 pm and 200 pm and a channel depth of between 0.3mm and 3 mm, wherein the fin (31) comprises a fin width (34) of between 10 pm and 400pm, or 35 pm and 300 pm or 50 pm and 200 pm.March 19, 2026 32 / 367. Semiconductor arrangement according to any one of the preceding claims, wherein the cooling features (5) sized for a flow rate of between 0.1 liters per minute per kilowatt of total power of the package and 5 liters per minute per kilowatt of total power of the package and / or is sized for a flow velocity of between 0.1 m / s and 5 m / s, or 0.25 liters per minute per kilowatt of total power of the package and 3 liters per minute per kilowatt of total power of the package and / or is sized for a flow velocity of between 0.2 m / s and 3,5 m / s, or 0.5 liters per minute per kilowatt of total power of the package and 1.5 liters per minute per kilowatt of total power of the package and / or is sized for a flow velocity of between 0.25 m / s and 2.5 m / s.

8. Semiconductor arrangement according to any one of the preceding claims, wherein the cooling features (5) are accessible via a removable cover (8), which is preferably formed as part of the lid (4).

9. Semiconductor arrangement according to claim 8, wherein a sealing arrangement is provided for sealing the removable cover (8) to preferably the lid (4).

10. Semiconductor arrangement according to claim 9, wherein the sealing arrangement comprises a gasket comprising a material of a group of materials comprising Fluoroelastomer (FKM), Perfluoroelastomer (FFKM), Methylvinylsiloxane Rubber (VMQ), Fluorinated Methylvinylsiloxane Rubber (FMQ) and Thermoplastic Elastomer (TPE).

11. Semiconductor arrangement according to any one of the preceding claims, wherein the cooling features (5) are partly limited by a top member.

12. Semiconductor arrangement according to claim 13, wherein the top member comprises a manifold (17) providing a fluid connection between the cooling features (5) and the fluid inlet and outlet.

14. Semiconductor arrangement according to any one of the preceding claims, wherein the at least one chip (2) and the lid (4) are thermally connected via a thermal interface (9).

15. Semiconductor arrangement according to any one of the preceding claims, wherein each of the quick disconnect couplings (6) is configured to be detachably coupled to a mating component (25).

16. Semiconductor arrangement according to any one of the preceding claims, wherein each of the quick disconnect couplings (6) is non-spill connectors, providing a tight seal in a connected state and / or in a disconnected state.

17. Semiconductor arrangement according to any one of the preceding claims, wherein each ofMarch 19, 2026 33 / 36the quick disconnect couplings (6) is fluidically connected to the cooling features (5) via fluid lines, preferably hoses (7).

18. Semiconductor arrangement according to any one of the preceding claims, wherein the quick disconnect coupling (6) is configured to be separable from a mating component (25) by means of a release mechanism.

19. Semiconductor arrangement according to any one of the preceding claims, wherein the quick disconnect coupling (6) comprises an internal valve, which is configured to be shut when the quick disconnect coupling (6) is disconnected.

20. Semiconductor arrangement according to any one of the preceding claims, wherein the quick disconnect coupling (6) comprises an internal valve, which is configured to be open when the quick disconnect coupling (6) is connected.

21. Semiconductor arrangement according to claim 19 or 20, wherein the internal valve is spring biased.

22. Semiconductor arrangement according to any one of the preceding claims, wherein the quick disconnect coupling (6) comprises a male or a female part, wherein a mating component (25) being configured to be coupled to a corresponding quick disconnect coupling (6) comprises a respective other of the male or a female part.

23. Semiconductor arrangement according to any one of the preceding claims, wherein the quick disconnect coupling (6) is a blind-mate quick disconnect coupling (6).

24. Semiconductor arrangement according to any one of the preceding claims 18, comprising a strain relief arrangement (27) configured to compensate for strain acting on the fluid lines.

25. Semiconductor arrangement according to any one of the preceding claims, wherein the quick disconnect coupling (6) are integrated in or directly attached to the lid (4), removable cover (8) and / or top member.

26. Semiconductor arrangement according to any one of the preceding claims, comprising a cooling agent, wherein the cooling agent is a single phase or a two-phase cooling agent.

27. Semiconductor arrangement according to claim 26, wherein the semiconductor arrangement is prefilled with cooling agent.

28. Semiconductor arrangement according to any one of the preceding claims, wherein an inlet temperature of the coolant is between 5°C and 80°C, or 10°C and 65°C, or 20°C and 50 CMarch 19, 2026 34 / 36and / or an outlet temperature is between 20°C and 100°C, or 30°C and 85°C or 40°C and 70°C.

29. Server arrangement (19) comprising at least one semiconductor arrangement according to any one of the preceding claims, having a cooling circuit (29) comprising a fluid supply being configured to supply a fluid to one of the quick disconnect couplings (6) and a fluid discharge configured to discharge fluid from another one of the quick disconnect couplings (6).

30. Server arrangement (19) according to claim 29, having mating components (25) being configured to be detachably coupled to the quick disconnect couplings (6).

31. Server arrangement (19) according to claim 29 or 30, wherein the cooling circuit (29) withstands at least 5 bar, or at least 8 bar, or at least 10 bar of pressure.

32. Server arrangement (19) according to any one of claims 29 to 31 , comprising at least two semiconductor arrangements according to any one of the claims 1 to 28, wherein the fluid supply is configured to supply the at least two semiconductor arrangements with a cooling agent in parallel and / or in series.

33. Server arrangement (19) according to any one of claims 29 to 32, comprising two, or four, or six, or eight semiconductor arrangements according to any one of the claims 1 to 33.

34. Server arrangement (19) according to any one of claims 29 to 33, comprising a baseboard (37) having at least one socket (20) for accepting a semiconductor arrangement according to any one of claims 1 to 28, wherein the at least one quick disconnect coupling (6) is arranged at the lid (4) and / or the top member and / or the manifold (17), wherein the mating components (25) are arranged on the baseboard (37), wherein the mating components (25) are moveable relative to the socket (20).

35. Server arrangement (19) according to any one of claims 29 to 33, comprising a baseboard (37) having at least one socket (20) for accepting a semiconductor arrangement according to any one of claims 1 to 28, wherein the at least one quick disconnect coupling (6) is arranged at the lid (4) and / or the top member and / or the manifold (17), wherein the mating components (25) are arranged on the baseboard (37), wherein the mating components (25) are fixed relative to the socket (20).March 19, 2026 35 / 36

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