Electronic assembly including a power unit with integrated active cooling and method for producing and assembling such an assembly

Abstract

The invention relates to an electronic assembly (20) including a housing (32) which houses a printed circuit board (26), and a power unit (30) with integrated cooling which is connected to the board (26), in which assembly (20) the housing (32) is delimited by a bottom wall (34); the unit (30) is delimited by a face (72) for connecting the unit (30) to the board (26) and at least one side face (64) for hydraulic connection, and the unit (30) includes two channels (66, 67) for connecting to an external coolant circuit; and a seal between the housing (32) and the unit (30) is produced at least between complementary portions of a part (50) of the vertical side wall of the housing (32) and of the at least one side face (64) of the power unit (30) with integrated cooling. The invention also provides a method for assembling the assembly including an initial step of producing a subassembly including the board (26) with the soldered unit (30).

Description

Electronic assembly comprising an integrated actively cooled power unit and method for manufacturing and assembling such an assembly DESCRIPTION technical field

[0001] The invention relates to a power electronic assembly incorporating an integrated active cooling power block arranged inside the assembly.

[0002] The invention also relates to a method of manufacturing and assembling such an assembly comprising at least one printed circuit board to which the cooled power block is connected by welding. Prior art

[0003] The trend in the automotive equipment market is towards a significant increase in power density (e.g., for High Voltage assemblies), primarily due to the reduction in the volume allocated in the vehicle and the miniaturization of electronic components.

[0004] The available cooling surface area decreases with the dimensions of the assembly concerned, and in particular its casing, which is generally made up of a top case closed by a top cover, and is no longer sufficient to effectively cool the power components that dissipate heat.

[0005] As a solution for modular design and cooling efficiency, a self-contained active cooling block or module has been developed and used which is arranged inside the case and which is a high-power block or module dedicated to the self-contained cooling of the power magnetic components and power MOSFETs (Metal Oxide Semiconductor Field Effect Transistor for insulated-gate field-effect transistor) which it houses and carries on its external surface.

[0006] The integrated cooling power block has a cavity to house power magnetic components and external cooling faces which carry, for example, power MOSFETs.

[0007] Such a power block with integrated cooling has an internal coolant circulation, commonly water, which is connected to an external forced coolant circulation circuit.

[0008] For this purpose, the integrated cooling power unit has at least two conduits, inlet and outlet, which extend from the integrated cooling power unit and which must be connected in a sealed manner to additional pipes belonging to the external circuit.

[0009] Common designs, for example, use threaded fittings and dedicated O-rings. With such a design, the inlet and outlet conduits are integrated into the overall housing.

[0010] Another known design uses an external cooling pipe as an interface to seal the integrated cooling power pack to the chassis by implementing a dual radial and axial sealing interface. Besides its complexity, such a solution is bulky and increases the overall volume and dimensions of the assembly.

[0011] The internal sealing interface between the case and the integrated cooling power block creates a risk of coolant leakage inside the power electronics product, and the geometry and design of the internal sealing interface impact the final compactness of the final power electronics product.

[0012] Thus, the use and implementation of an internal power unit with integrated cooling requires reducing, or preferably eliminating, the risks of possible hydraulic leaks within the assembly that are related to the hydraulic connections.

[0013] In addition to the sealing problems to be solved, the production and assembly of a power electronic product or assembly of the type mentioned above induces a general problem related to the connection by soldering of the pins and electrical connection tabs of the power block to the printed circuit board itself arranged inside the product's housing.

[0014] Indeed, according to current industrial processes, an assembly and welding step is used - in situ inside the case - of the integrated cooling power block onto the printed circuit board.

[0015] Such a process is very restrictive and generates additional costs, reliability problems related to access constraints to be able to carry out the soldering directly in the case and in particular due to the limited space to carry out the soldering operations and the presence of other electronic components and those carried by the power block.

[0016] Therefore, there is a need to enable the fixing and electrical connection operations of the integrated cooling power unit to be carried out outside the power product. Description of the invention

[0017] The invention proposes an electronic assembly comprising: - a housing suitable for housing electronic components, in particular power electronic components, mounted on a printed circuit board; - and an integrated cooling power unit with external cooling fluid circulation, electrically connected to the printed circuit board, arranged and / or extending inside the enclosure, and whose peripheral surface and / or internal cavities carry and / or house components electrically connected to the printed circuit board, an electronic assembly in which: - the enclosure is delimited by at least one bottom wall and at least one side wall with a generally vertical orientation which delimits an open top face of the enclosure; - the integrated cooling power unit is delimited by at least one horizontal face for electrical connection of the integrated cooling power unit to the printed circuit board and at least one side face, with a generally vertical orientation, for hydraulic connection, and the integrated cooling power unit has at least two connection conduits to an external cooling fluid circulation circuit, each of which extends outside the enclosure from said at least one side face; - a seal between the case and the integrated cooling power unit is achieved at least between complementary portions of, on the one hand, said at least one vertical wall of the case and, on the other hand, of said at least one lateral face of the integrated cooling power unit.

[0018] According to other characteristics of the assembly according to the invention: - said at least one side face of the integrated cooling power block is delimited by two first and second side edges forming a "V" and by a third edge; and said at least one side wall of the housing has a side window of complementary profile delimited by two first side edges forming a "V" and by a third edge by means of which said sealing is ensured by a watertight contact between said first, second and third edges of the integrated cooling power block and the housing; - said at least one horizontal electrical connection face of the power block with integrated cooling on the printed circuit board is a top face oriented towards the open top face of the case; - said at least one side face of the power block with integrated cooling is delimited by a third edge oriented downwards towards the horizontal bottom wall of the case, and that said side window of said at least one side wall of the case is delimited by a third edge oriented upwards; - said at least one side face of the integrated cooling power unit is delimited by a third edge oriented upwards towards the top face of the case, and said side window of said at least one side wall of the case is delimited by a third edge oriented downwards; - said side window of said at least one side wall of the case extends by a cutout in the horizontal bottom wall of the case which is suitable for housing in a watertight manner an additional part of the integrated cooling power unit; - said sealing is completed by a sealing gasket arranged between said complementary parts; - said sealing gasket is made by depositing a sealing bead, in particular silicone-based.

[0019] The invention also proposes a method for manufacturing and assembling an electronic assembly according to the invention, characterized in that it comprises steps consisting of: - E1) soldering onto one side of the printed circuit board: -- all of said electronic components; and -- the power unit with integrated cooling, - E3) then to bring the printed circuit board inside the case or onto the open top face of the case, making said seal between the case and the integrated cooling power block by ensuring a watertight contact between said complementary portions.

[0020] According to another characteristic of the process, it includes an intermediate step consisting of: - E2) proceed to deposit a sealing gasket on at least one of the said additional parts. Description of the drawings

[0021] Other features and advantages of the invention will become apparent upon reading the detailed description that follows. This description is purely illustrative and should be read in conjunction with the accompanying drawings, in which:

[0022] [Fig. 1]: Figure 1 is a perspective view of a first example of an embodiment of an assembly according to the invention;

[0023] [Fig. 2]: Figure 2 is an exploded perspective view of the main subsets of the assembly illustrated in Figure 1;

[0024] [Fig. 3]: Figure 3 is a view similar to that of Figure 2 from a different perspective angle;

[0025] [Fig. 4]: Figure 4 is a perspective view of the cooling block belonging to the assembly illustrated in Figures 1 to 3;

[0026] [Fig. 5]: Figure 5 is an elevation view of the main sub-assemblies of the assembly illustrated in Figures 2 and 3 which are positioned for a stage of their assembly;

[0027] [Fig. 6]: Figure 6 is a view analogous to that of Figure 5 on which the main sub-assemblies are positioned for a further stage of their assembly;

[0028] [Fig. 7]: Figure 7 is a cross-sectional view through a median vertical and longitudinal plane of the assembly illustrated in Figure 1;

[0029] [Fig. 8]: Figure 8 is a half-view in perspective and in section through a median vertical and longitudinal plane of a second embodiment of an assembly according to the invention

[0030] [Fig. 9]: Figure 9 is an exploded perspective view of the main components of the assembly illustrated in Figure 8;

[0031] [Fig. 10]: Figure 10 is an exploded perspective view of the cooling block and lower housing of the assembly illustrated in Figures 8 and 9;

[0032] [Fig. 11]: Figure 11 is a view similar to that of Figure 10 from a different perspective angle;

[0033] [Fig. 12]: Figure 12 is a detailed perspective view of the front longitudinal end portion of the cooling block illustrated in Figures 8 to 11. Description of the implementation methods

[0034] To facilitate the drafting and understanding of the following description and claims, and without limitation and without reference to Earth's gravity, the terms superior, inferior, top, bottom, etc., will be used with reference to a vertical orientation along an axis V belonging to a trihedron V, L, T shown in the figures, whose transverse axis T and longitudinal axis L lie in a horizontal plane. By convention, the longitudinal axis L is oriented from back to front and the transverse axis T is oriented from right to left.

[0035] First example of the realization of an electronic assembly comprising a power block with integrated cooling suitable for being mounted in a hermetic manner from a top face of the case and method of realization and assembly of such an electronic assembly.

[0036] Figures 1 to 3 show an electronic assembly 20 which, here as a non-limiting example, is a power electronic product such as a high-power chest which, in a vertical stacking from top to bottom, mainly and successively comprises: - a top cover 22, here metallic, which extends horizontally in a plane, which is delimited vertically by a top face 21 and by a bottom face 23, and laterally by a peripheral crimping edge 24 of rectangular contour; - a printed circuit board 26 (also called PCB for Printed Circuit Board) which extends horizontally in a plane, which is delimited vertically by a top face 25 and by a bottom face 27 and which, under its bottom face 27, carries in particular a sealed integrated cooling power block 30; - and a lower housing 32 which extends generally in a horizontal plane and which, in the assembled and closed position of the upper cover 22, houses the printed circuit board 26.

[0037] The housing 32 is notably delimited by a lower horizontal bottom wall 34 and by a side wall 36 of generally vertical orientation which extends upwards from an upper face 33 of the lower bottom wall 34 and which extends all along the rectangular peripheral contour of the lower bottom wall 34.

[0038] The case 32 has a series of vertical feet 35 which extend vertically upwards from the top face 33.

[0039] The feet 35 are support and fixing feet for the printed circuit board 26 inside the housing 32.

[0040] The lower face 27 of the printed circuit board 26 is thus supported on the coplanar vertices of the feet 35 and the fixing is ensured by a series of screws, each of which is mounted screwed into the upper section of an associated foot.

[0041] The housing 32, which is here made by molding in plastic material, delimits an internal space or volume 38.

[0042] The side wall 36, here of rectangular outline, comprises a right longitudinal side wall 39, a left longitudinal side wall 40, a rear transverse side wall 41 and a front transverse side wall 42.

[0043] The side wall 36 is delimited vertically upwards by a horizontal upper edge 44 which delimits an open upper face of the case 32 which is here suitable to be closed by crimping peripheral edge of crimping 24 of the cover 22.

[0044] By way of non-limitation, the rear side wall 41 is solid over its entire height, while the right side walls 39 and left side walls 41 have one or more openings or windows 43, each of which is formed with a profile delimited by two inclined side edges forming an upward-opening "V" and by a third lower horizontal edge giving each window 43 a truncated "V" profile.

[0045] Each window 43 is suitable for receiving in a sealed manner a complementary shaped part 46 of a component carried by the printed circuit board 26 or by the upper cover 22, the cooperation of each "V" window 43 and the complementary component 46 ensuring a seal of the internal space 38 with respect to the outside of the electronic assembly 20.

[0046] The transverse front side wall 42, with transverse orientation, here includes a front side window 50 which is suitable for receiving a front longitudinal section 64, of complementary shape belonging to the integrated cooling power block 30 which is delimited by two first and second opposing and inclined lateral edges 53 and by a third horizontal edge 55.

[0047] The front side window 50 is shaped with a profile delimited by two opposing inclined side edges 51 forming an upwardly open "V" and by a third lower horizontal edge 52 giving the front side window 50 a truncated "V" profile which is open upwards in the upper horizontal edge 44 which delimits the open upper face of the housing 32.

[0048] The cooperation of the side window 50 of the front transverse side wall 42 with the complementary front longitudinal section 64 of the integrated cooling power block 30 also ensures a sealing of the internal space 38 from the outside.

[0049] In addition to the complementarity of shapes and dimensions mentioned above, the sealing of the internal space 38 with respect to the outside can be completed by a sealing gasket (not shown) which is for example a sealing bead - for example made of silicone-based material - which is deposited along the horizontal upper edge 44 which delimits the open upper face of the housing 32 and along the various inclined edges and horizontal edges which delimit the windows 40 and 50. To facilitate the precise deposition of such a bead, these edges may have a groove with a "V" profile.

[0050] We will now refer more particularly to figures 2 to 4 on which we see that the main rear body 60 of the integrated cooling power block 30 is presented here, by way of non-limiting example, in the form of a block of general rectangular parallelepiped shape of great length parallel to the longitudinal axis L.

[0051] The main body 60 is delimited longitudinally towards the front by a front transverse side face 62 beyond which the integrated cooling power block 30 extends longitudinally towards the front by a front longitudinal end section 64 which is the complementary section which is suitable to be received in a complementary and sealed manner in the front side window 50 of the front transverse side wall 42 of the housing 32.

[0052] Thus, in the sense of the invention, the front longitudinal end section 64 of the integrated cooling power block with a "V" profile constitutes the lateral face, with a generally vertical orientation, of hydraulic connection of the integrated cooling power block.

[0053] Here and without limitation, the integrated cooling power block includes two parallel conduits 66 and 67 for connection to an external cooling fluid circulation circuit (not shown), each of which extends horizontally outside the integrated cooling power block 30, from the external surface 65 of the front longitudinal end section 64.

[0054] Thus, the integrated cooling power block 30 is a hydraulically sealed block whose hydraulic connections, and therefore the potential risks of leaks at the level of these hydraulic connections, are located outside the housing 32 and outside the electronic assembly 20.

[0055] The main rear body 60 of the integrated cooling power unit 30 is also laterally delimited by a rear transverse side face 68, and by two right side faces 69 and left side faces 70 with an overall vertical orientation.

[0056] The main rear body 60 of the integrated cooling power block 30 is also delimited vertically downwards by a flat horizontal lower face 71 and by a generally horizontal upper face 72 which is here the electrical connection face of the integrated cooling power block 30 with the printed circuit board 26.

[0057] As is known, the peripheral surface of the integrated cooling power block 30 carries electronic components 80 to be cooled (such as "Mosfets") electrically connected to the printed circuit board 26, while the rear main body has internal cavities that house components 82 to be cooled (such as magnetic components) electrically connected to the printed circuit board 26.

[0058] For these electrical connections, a series of connecting pins 81 and tabs 83 extend vertically upwards above the plane of the top face 72 to be received and soldered into holes in the printed circuit board 26.

[0059] According to the invention, with its pins 81 and tabs 83, the integrated cooling power block 30 is mounted and soldered onto the lower face 27 of the printed circuit board 26 (as well as all other electrical and / or electronic elements and components not shown necessary for the operation of the power product which is here the electronic assembly 20), this mounting and the associated soldering operations being carried out before the printed circuit board is placed in the upper part of the housing 32.

[0060] With reference in particular to figures 5 and 6, we will now describe the main steps of the process according to the invention for the realization and assembly of an electronic assembly 20.

[0061] The design just described of the electronic assembly 20 (allowing in particular the introduction of the integrated cooling power block "from the top" - through the open upper face of the housing 32 of the side wall 36) makes it possible to integrate the step of fixing and electrical connection of the integrated cooling power block 30 by soldering on the lower face 27 of the printed circuit board 26 into the overall process of assembling and soldering all the electrical and electronic components on the printed circuit board 26.

[0062] Thus, the process of manufacturing and assembling the electronic assembly 20 according to the design just described includes at least one step E1 consisting - outside the housing 32 - of soldering onto the face, called lower, 27 of the printed circuit board 26, all the electronic and mechanical components to be fitted to this board, including the integrated cooling power block 30. As can be seen in particular in figure 5, at the end of this step E1) we have a sub-assembly 100 ready to be mounted and fixed in and / or on the housing 32 only by mechanical operations.

[0063] To this end, the process of manufacturing and assembling the electronic assembly 20 includes a step E3) consisting here of bringing the printed circuit board 26 inside the case 32 onto the tops of the feet 35.

[0064] As can be seen in figure 6, at the end of this step E3) a sub-assembly 102 was produced consisting in particular of the lower housing 32 and the sub-assembly 100.

[0065] During this step, various seals are automatically made between complementary parts in the shape of a "V" or truncated "V", and in particular the seal between the front side window 50 of the front transverse side wall 42 and the front longitudinal section 64, of complementary shape belonging to the integrated cooling power block 30.

[0066] This ensures a seal between the housing 32 and the integrated cooling power block 30, ensuring a watertight contact between these complementary portions.

[0067] To guarantee this sealing, prior to step E3) and according to a preferred embodiment, the process includes an intermediate step E2) consisting of depositing a sealing gasket at least on the relevant areas of the complementary parts as explained above.

[0068] At the end of step E3), there are no more welding operations to be carried out "in situ" in the housing 32, such operations having been carried out beforehand and can be implemented industrially and in a standardized manner.

[0069] The process of manufacturing and assembling the electronic assembly 20 finally includes a step E4) of closing by means of the upper cover 22.

[0070] For this purpose, if necessary, the cover 22 has been previously equipped with components, such as for example a component 46 as illustrated in figures 1 to 3, to constitute a subassembly 103.

[0071] Step E4) here consists of placing the sub-assembly 103 in support on the upper edge 44 of the side wall 46 of the housing 32 (housing the sub-assembly 100) and then proceeding with the actual closing, here by crimping the edge 24 of the cover 22.

[0072] The seal between the cover 22 and the upper edge 44 can be completed by a sealing gasket previously placed on the upper edge 44, for example during the intermediate step E2) described above.

[0073] As can be seen in Figure 1, after the assembly steps, the electronic assembly 20 is in the form of a product that is sealed against the outside and does not present any risk of "hydraulic" leaks inside, since, thanks to the design of the integrated cooling power block 30, the hydraulic connections - and the sealing problems associated with them - are located outside the housing 32 and the electronic assembly 20.

[0074] Second example of the realization of an electronic assembly comprising a power block with integrated cooling suitable for being mounted in a hermetic manner from a lower face of the case.

[0075] In the following description of the second embodiment of the electronic assembly shown in figures 8 to 12, components and elements identical, analogous or similar to those previously described in relation to the first embodiment will be designated by the same reference numbers increased by 100 (one hundred).

[0076] The description that follows is made essentially by comparisons and additions to the detailed description of the first example of implementation.

[0077] According to this second embodiment, the electronic assembly 120 includes an integrated cooling power block 130 which is suitable for mounting on the housing 132 "from below" while having the same basic design regarding the arrangement of the "hydraulic" seals 166 and 167 outside the housing 132 and the implementation "Automatic" sealing of the integrated cooling power block 130 relative to the case 132 during assembly.

[0078] To allow the integrated cooling power supply 130 to be mounted from below, as before, the front transverse side panel 142 has a V-shaped window 150, which is in this case a truncated and inverted V. Indeed, referring for example to Figure 10, one can see that the V-shaped profile defined by the opposing and inclined side edges 151 is open downwards and terminates in the lower wall 134 of the housing 132.

[0079] In addition, the front longitudinal end section 164 of the integrated cooling power block 130 is delimited by two first and second opposing and inclined lateral edges 153 and by a third edge 155 forming a truncated and inverted “V”.

[0080] In addition to the side window 150, to allow the mounting and fixing of the integrated cooling power block 130 on the case 132, the lower face 171 of horizontal orientation of the integrated cooling power block 130 is formed with a peripheral side lug 184 which has a series of fixing tabs 185 with holes each of which is suitable for receiving a fixing screw 186.

[0081] In addition, the side window 150 of the side wall 142 of the housing 132 extends into the horizontal bottom wall 134 of the housing 132 by means of a rectangular cutout 188 of shape and dimensions complementary to those of the side heel 184 of the lower face 171 of the integrated cooling power block 130.

[0082] Along the rectangular cutout 188, in its thickness, the bottom wall 134 has a peripheral groove 190 suitable for housing the peripheral heel 184 with recesses 187 for the fixing tabs 185.

[0083] Figure 9 schematically represents the three-dimensional conformation of a sealing gasket 200 - which is for example made in the form of a bead of silicone-based sealing material - and which is here previously deposited on the periphery of the heel 184 and on the edges 153 and 155 of the front longitudinal section 164, in a peripheral groove 202 profiled in V for this purpose.

[0084] It is noted that the housing 132 constitutes the reference for geometric positioning along the vertical axis V of, on the one hand, the integrated cooling power block 130 which is mounted and screwed onto the lower wall and, on the other hand, of the printed circuit board 126 which rests on the tops of the vertical feet 135 and which is screwed onto these feet 135.

[0085] The design therefore allows the welding operations of the pins 181 and tabs 183 to be carried out after the integrated cooling power block 130 and the printed circuit board 126 have been mounted and mechanically fixed, and it also allows for great compactness along the vertical axis thanks to the control of the dimension chain between these three elements and sub-assemblies.

[0086] As in the first embodiment example, the mounting and fixing of the integrated cooling power block 130, with its front longitudinal section 164, in the cutout 188 and the side window 150 allows for automatic sealing against the lower housing 132 by arranging the hydraulic connections outside the housing 132.

[0087] As in the case of the first embodiment example, the complementary design of the housing 132 and the integrated cooling power block 130 makes it possible to eliminate any hydraulic sealing interface inside the electronic assembly 120, thus eliminating any risk of hydraulic leaks inside.

[0088] These designs allow for optimal product compactness. No additional components are required to create the sealing interface.

[0089] The inlet and outlet conduits 66, 67, 166, 167 are integrated into the integrated cooling power block 30, 130 and are, for example, made of die-cast material.

[0090] The product assembly process is simplified because the conduits are integrated into the integrated cooling power block.

[0091] As an alternative not shown, it is possible to design a "standardized" integrated cooling power unit which, depending on the requirements, allows: - a) either its mounting through the lower wall of a lower housing 132 as illustrated in the second embodiment example, - either b) its mounting through the open upper face of a lower housing 32 as illustrated in the first embodiment example, after having previously fixed and soldered it onto the printed circuit board.

[0092] To this end, to carry out the assembly according to hypothesis b) it is necessary to "turn" vertically the integrated cooling power block 130 to fix and solder it to the upper face of the printed circuit board; then it is enough to introduce the sub-assembly thus made into a lower case of the type of case 32 and to fix by screwing the printed circuit board in the bottom of the case, the printed circuit board then being interposed vertically between the lower wall of the bottom of the case and the integrated cooling power block.

Claims

Demands

1. Electronic assembly (20, 120) comprising: - a housing (32, 132) suitable for housing electronic components, in particular power electronic components, mounted on a printed circuit board (26, 126); - and an integrated cooling power unit (30, 130) with external cooling fluid circulation, which is electrically connected to the printed circuit board (26, 126), which is arranged and / or extends inside the housing (32, 132), and whose peripheral surface and / or internal cavities carry and / or house components (80, 180, 82, 182) electrically connected to the printed circuit board (26, 126), electronic assembly (20, 120) in which: - the housing (32, 132) is delimited by at least one bottom wall (34, 134) and at least one side wall (36, 136, 42, 142) of generally vertical orientation which delimits an open upper face (44, 144) of the housing (32, 132); - the integrated cooling power block (30, 130) is delimited by at least one horizontal face (72, 172) for electrical connection of the integrated cooling power block (30, 130) to the printed circuit board (26, 126) and at least one lateral face, (64, 164) of generally vertical orientation, for hydraulic connection, and the integrated cooling power block (30, 130) includes at least two conduits (66, 166, 67, 167) for connection to an external cooling fluid circulation circuit, each of which extends outside the housing (32, 132) from said at least one lateral face (64, 164); - a seal between the housing (32, 132) and the integrated cooling power unit (30, 130) is achieved at least between complementary portions of on the one hand (50, 150) of said at least one vertical wall (42, 142) of the housing (32, 132) and, on the other hand, of said at least one lateral face (64, 164) of the integrated cooling power unit (30, 130).

2. Electronic assembly (20, 120) according to claim 1, characterized: - in that said at least one side face (64, 164) of the integrated cooling power block (30, 130) is delimited by two first and second side edges (53, 153) forming a "V" and by a third edge (55, 155), - and in that said at least one side wall (42, 142) of the housing (32, 132) has a side window (50, 150) of complementary profile delimited by two first side edges (51, 151) forming a "V" and by a third edge (52, 152) by means of which said sealing is ensured by a watertight contact between said first, second (51-53, 151-153) and third edges (52-55, 152-155) of the integrated cooling power block (30, 130) and of the housing (32, 132).

3. Electronic assembly (20) according to any one of claims 1 or 2, characterized in that said at least one horizontal electrical connection face of the integrated cooling power block (30) to the printed circuit board (26) is a top face oriented towards the open top face (44) of the housing (32).

4. Electronic assembly (20) according to claim 3 taken in combination with claim 2, characterized in that said at least one side face (64) of the integrated cooling power block (30) is delimited by a third edge (55) oriented downwards towards the horizontal bottom wall (34) of the housing (32), and in that said side window (50) of said at least one side wall (42) of the housing (32) is delimited by a third edge (52) oriented upwards.

5. Electronic assembly (120) according to claim 3 taken in combination with claim 2, characterized in that said at least one side face (164) of the integrated cooling power block (130) is delimited by a third edge (155) oriented upwards towards the upper face of the housing (132), and in that said side window (150) of said at least one side wall of the housing (132) is delimited by a third edge (152) oriented downwards.

6. Electronic assembly (120) according to claim 5, characterized in that said side window (150) of said at least one side wall (142) of the housing (132) extends by a cutout (188) in the horizontal bottom wall (134) of the housing (132) which is suitable for hermetically sealing a complementary part (184) of the integrated cooling power block (130).

7. Electronic assembly (20, 120) according to any one of the preceding claims, characterized in that said seal is completed by a sealing gasket arranged (200) between said complementary parts.

8. Electronic assembly according to claim 7, characterized in that said sealing gasket is made by depositing a sealing bead, in particular silicone-based.

9. A method for manufacturing and assembling an electronic assembly (20) according to claim 4, characterized in that it comprises steps consisting of: - E1) to be soldered onto one side of the printed circuit board (26): -- all of said electronic components; and -- the integrated cooling power unit (30), - E3) then to bring the printed circuit board (26) inside the housing (32) or onto the open top face of the housing (32) by making said seal between the housing (32) and the integrated cooling power block (30) by ensuring a sealed contact between said complementary portions.

10. The method according to claim 9, characterized in that it comprises an intermediate step consisting of: - E2) proceed to deposit a sealing gasket (200) on at least one of the said additional parts.

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