Chip modules for smart cards, and methods of making

Abstract

A smartcard is provided with a chip module having electrically conductive contact pads on a front surface thereof, the contact pads having non-rectilinear shapes satisfying the positional and dimensional requirements of ISO / IEC 7816 and collectively constituting a design pattern on the front surface of the chip module. A graphic pattern on the card body complements, blends in with, or constitutes an extension of the design pattern on the chip module. According to a method of manufacturing transaction cards, chip modules having the design pattern on a front surface thereof are placed at card body sites on a substrate, the position and orientation of each placed chip module is optically captured, and individualised graphic application commands are computationally generated for each card body site on the basis of the captured positional data, such that the graphic pattern applied to each card body site is registered to the design pattern of the respective chip module. In a chip module for implantation in a smartcard, the contact pads on the obverse side of a flexible chip carrier tape are formed by selective removal of metallisation material from a metallisation layer, the non-rectilinear shapes of at least a subset of the contact pads collectively constituting a design pattern defined by the boundaries of the remaining metallisation material. Methods of manufacturing such chip modules and smartcards comprising such chip modules are also provided.

Description

[0001] KLUNKER IP K710845

[0002] CHIP MODULES FOR SMART CARDS, AND METHODS OF MAKING

[0003] FIELD OF THE INVENTION

[0004] The disclosure relates to secure and non-secure transaction cards such as payment smartcards and electronic identification cards (any of which may be referred to herein simply as "cards") having an RFID (radio frequency identification) chip capable of operating in a “contactless” mode (ISO 14443 orNFC / ISO 15693) including dual interface (DI or DIF) smartcards which can also operate in “contact” mode (ISO 7816-2) and, more particularly, to decorative transponder chip modules (TCMs) suitable for implanting, insertion or placement in smartcards.

[0005] Particularly, the invention relates to manufacturing transaction cards in which the position and orientation of each placed chip module is optically captured and used to compute individualised graphic application commands for each card body site.

[0006] The invention also relates to chip modules in which the contact pads on the front surface are formed by selective removal of metallisation material so as to define a visually distinctive design pattern.

[0007] Some of the disclosure(s) herein may relate to transaction cards comprising a decorative enlarged transponder chip module (E-TCM) with a contact and contactless interface, without the necessity for an in-card booster antenna circuit (BAC) or coupling frame (CF).

[0008] Some of the disclosure(s) herein may relate to transaction cards made from material other than plastic, wood, metal, ceramic, glass, leather or a combination thereof.

[0009] The techniques disclosed herein may also be applicable to RFID devices including “non-secure smartcards and tags” such as contactless cards in the form of key cards, access control cards, security badges, wearable devices, key fobs, mobile phones, tokens, small form factor tags, data carriers and the like operating in close proximity with a contactless reader.KLUNKER IP K710845

[0010] BACKGROUND OF THE INVENTION

[0011] A dual interface (DI or DIF) transaction card or smartcard (SC) may generally comprise: a chip module (CM) comprising a flexible circuit (FC) or module tape (MT) having 6 or 8 contact pads on its upward facing side (top side or contact side), a radio frequency identification (RFID) silicon die wire bonded or flip chip bonded to its downward facing side (rear side or bond side) and protected with an encapsulation having an application specific operating system and memory storage, the flexible circuit (FC) further having circuitry (a connection bridge(s), a plating line(s), vertical interconnects, pads and traces) and connection terminals (LA and LB) for a galvanic interconnection to an in-card booster antenna circuit (BAC) or a module antenna (MA) for inductive coupling with the coupler coil (CC) of an in-card booster antenna circuit (BAC) to function in contactless mode with an RFID terminal, and a card body (CB) having non-conductive layers of plastic, adhesive, resin, wood, paper, fleece, fibre or combinations thereof.

[0012] The chip module (CM), which may be referred to as a transponder chip module (TCM) or an inductive coupling chip module (ICM) may generally comprise: a flexible circuit (FC), module tape (MT) or chip carrier tape (CCT), more generally, simply a “substrate”; a contact pad array (CPA) comprising 6 or 8 contact pads (CP, or “ISO pads”) disposed on a “face up side” or “contact side” (or surface) of the flexible circuit (FC), for interfacing with a contact reader in a contact mode (ISO 7816); an RFID chip (IC) which may be a bare, unpackaged silicon die disposed on a “face down side” or “bond side” or “chip side” (or surface) of the flexible circuit (FC); a module antenna (MA) or antenna structure (AS) disposed on the face down side of the flexible circuit (FC) for implementing a contactless interface, such as ISO 14443 and NFC / ISO 15693 with a contactless reader or other RFID device. The flexible circuit may incorporate a surface mounted capacitor to enhance RF performance.

[0013] The chip module (CM) may be generally rectangular, having four sides, and measuring approximately 8.2 mm x 10.8 mm for a 6-pin module and 11.8 mm x 13.0 mm for an 8-pin module. Alternatively, the chip module (CM) may be round, elliptical, or other non-rectangu-lar shape. When operating in a contactless mode, the chip module (CM) may be powered passively by the electromagnetic field generated by an external RFID reader and may also communicate by radio frequency (RF) with the external RFID reader.KLUNKER IP K710845

[0014] The module antenna (MA) may be a planar antenna (PA), chemically-etched (CES) or laser-etched (LES), and is a type of antenna structure (AS) which may comprise a long conductive trace or track having two ends, in the form of a planar, rectangular spiral, disposed in an outer area of a flexible circuit (FC) or module tape (MT), surrounding the RFID chip on the facedown side of the flexible circuit. This will result in a number of traces or tracks (actually, one long spiraling trace or track), separated by spaces (actually, one long spiralling space). The track (or trace) width may be approximately 60 pm, 70 pm or 100 pm. Generally, with laser etching, the track width may be made narrower and the spaces between traces can be made smaller than with chemical etching. For example, whereas with chemical etching the spaces between tracks may be limited to 60 pm, 75 pm or 100 pm, with laser etching spacing of 25 pm or less may be achieved. The planar antenna may be fabricated on other than the flexible circuit, such as on a separate substrate or an interposer.

[0015] The module antenna (planar antenna) may have numerous windings to operate when connected to a RFID die at a resonance frequency between 14.0 and 16.0 MHz, such as having 10, 12 or 15 turns depending on the input capacitance of the silicon die.

[0016] Chip modules known in the prior art are designed and manufactured with the primary objective of satisfying the electrical and mechanical requirements of applicable standards, in particular ISO 7816 for the contact interface and ISO 14443 for the contactless interface. The contact pads on the front surface of the module tape are accordingly formed as substantially rectilinear, geometrically standardised areas of metallisation, the shape, dimensions and layout of which are determined solely by functional and normative considerations. Where personalised elements have been applied to chip modules in the prior art, these have taken the form of printed ink layers or surface coatings applied over the existing metallisation, leaving the underlying contact pad geometry unchanged. This is exemplified by US 9,117,153 and the data carrier shown in FIG. 1, in which a printed image on the contact plate matches a corresponding image on the card body, whilst the contact pad array beneath retains its standardised rectilinear geometry. The standardised appearance of the contact pad array has consequently remained uniform across different card products and issuers, rendering the chip module visually indistinct and readily replicable.KLUNKER IP K710845

[0017] There remains therefore a need for technical solutions that enable the metallisation layer on the front surface of a chip module to be structured so as to define a distinctive, individualised surface pattern whilst remaining fully compliant with the positional and dimensional requirements of ISO 7816, and that enable such a surface pattern to be accurately registered to graphic features applied to the surrounding card body during manufacture. Such solutions would offer improved visual integration between the chip module and the card body and also enhanced resistance to counterfeiting.

[0018] Some Definitions

[0019] Some of the following terms may be used or referred to herein.

[0020] Artificial Intelligence

[0021] Artificial intelligence (Al) refers to the development of computer systems capable of performing tasks that typically require human intelligence. These tasks can include learning, problemsolving, perception, decision-making, and language understanding. Essentially, Al aims to create machines that can mimic human cognitive functions.

[0022] Mimicking Human Intelligence

[0023] Al systems are designed to perform tasks that usually require human intellect, such as recognizing speech, understanding natural language, making decisions, and even creating art.

[0024] Digital Art

[0025] Digital art is defined as any artistic work or practice that uses digital technology as part of the creative or presentation process. This encompasses a wide range of mediums, from computergenerated images and animations to digital photography, sculpture, and even art created using virtual or augmented reality. Essentially, it's art created or presented using digital tools and technologies, blurring the lines between traditional art forms and modem technology.

[0026] Booster Antenna Circuit

[0027] In a conventional booster antenna circuit (wire embedded, chemically etched, plated copper, conductive printed or equivalent circuitry), the perimeter coil on the periphery of the cardKLUNKER IP K710845

[0028] body inductively couples with the contactless reader while the coupler coil inductively couples with the module antenna of a transponder chip module driving the RFID payment chip.

[0029] A booster antenna circuit in a transaction card may comprise a perimeter coil component with a given number of windings extending around the periphery edge of the card body, a coupler coil component with a given number of windings, a capacitor bank component connected in parallel with the coupler coil for frequency trimming, and a secondary coil component(s) contributing to energy harvesting. The components of the booster antenna circuit (e.g., tracks, windings or turns, parallel plates, vertical interconnects) may reside on both sides of a carrier layer. The carrier layer may comprise polyethylene terephthalate (PET) or acrylic.

[0030] The coupler coil may be an open or closed loop circuit being assembled on the carrier layer having vertical interconnects to the upper and lower plate electrodes of the capacitor bank.

[0031] In certain applications, a wire embedded antenna circuit, comprising a perimeter coil (aka communication coil), a coupler coil and an extension coil, may replace the conventional aluminium etched or plated copper antenna circuit on a PET or acrylic carrier, with the advantage that the wire conductor is countersunk in a material layer without the need for an additional synthetic carrier.

[0032] Coupling Frame

[0033] Generally, a "coupling frame" (CF) may comprise a metal layer, metal frame, metal plate or any electrically-conductive medium or surface with an electrical discontinuity such as in the form of a slit (S) extending from an outer edge of the layer to an inner position thereof, the coupling frame (CF) capable of being oriented so that the slit (S) overlaps (crosses-over) the module antenna (MA) of the transponder chip module (TCM), such as on at least one side thereof. The slit (S) may be straight and may have a width and a length. The slit (S) may extend to a module opening (MO) for accepting the transponder chip module. There may only be a slit, and no opening for the transponder chip module (TCM). Coupling frames of this type typically comprise a layer of metal with an opening for receiving a transponder chip module and a slit extending from a periphery of the layer to the opening wherein the slit overlaps at least a portion of the module antenna.KLUNKER IP K710845

[0034] A metal foil with a laser-cut slit (S) and module opening (MO) may act as a coupling frame (CF) in the form of a one turn booster antenna circuit (BAC) in a smartcard (SC), such as a timber transaction card (TTC).

[0035] SUMMARY OF THE INVENTION

[0036] It is an object of the invention, generally, to provide an improved chip module for smartcards.

[0037] It is an object of the invention to camouflage the chip module in a smart card.

[0038] It is an object of the invention to incorporate an artistic design of the chip module into an overall artistic design of a smart card.

[0039] It is an object of the invention to provide techniques for implementing the aforesaid objects.

[0040] It is an object of the invention to eliminate the need for in-card booster antenna circuit in the card construction. A chip module (CM) which may be able to operate without a booster antenna circuit (BAC) in the card body (CB) having an activation distance equal or greater than 3 or 4 cm may be referred to as an enlarged transponder chip module (E-TCM, or ETCM) or oversize transponder chip module (OS-TCM) which is approximately 75% larger in cross-dimension or 300% larger in area than the size of a conventional 6- or 8-pin chip module, enabling the module to have a correspondingly larger module antenna (MA) than the conventional 6- or 8-pin chip module. The enlarged transponder chip module may enable contactless communication at a distance equal or greater than 3 or 4 cm.

[0041] For example, the enlarged (or oversize) transponder chip module may have a footprint of approximately 13.0 mm x 17.5 mm for a 6-pin module or 14.40 mm x 16.4 mm for an 8-pin module, and may operate similar to a wearable payment device having an activation or read / write distance of 2 cm, requiring a waiver from the payment schemes. This may be contrasted with the conventional sizes of 8.2 mm x 10.8 mm for a 6-pin module and 11.8 mm x 13.0 mm for an 8-pin module.KLUNKER IP K710845

[0042] According to the invention, generally, a smartcard is provided with a chip module, which may be an oversize or enlarged chip module, with contact pads (or pins) having shapes forming a functional (i.e., electrically operative) part (or portion) of an overall artwork (design). For example, the contact pads may be shaped like leaves, in an overall design of a tree, or the contact pads may be shaped like windows in an overall design of a house or building, and may be colored, while complying with ISO 7816 requirements for minimum contact size and location. The overall artwork may be entirely contained on the chip module. Or, an additional portion of the overall artwork may be provided on the card body surrounding the chip module, as an extension of (such as matching or complementing) the portion of the artwork on the chip module. Some of the artwork on the module may be laser etched. Some of the artwork on the card may be printed. Artificial intelligence (Al) may be used to ensure that appropriate features of the artwork (such as leaves, branches, etc.) align and conform with ISO 7816 requirements for contacts.

[0043] Generally speaking, Al may be used to "convert" a conventional item of artwork, preferably but not necessarily having a plurality of visually discrete features such as leaves or branches, seamlessly into a "digital" artwork where some of those features align or are caused to align with ISO 7816 requirements for contacts. The result of applying an Al algorithm to the artwork may result in a digital file, such as a CAD file, which can be used by manufacturing equipment to realize the pattern of the resulting digital artwork contact pads, such as by laser or chemical etching of a metal layer on a module tape.

[0044] Additional conductive features which are electrically isolated from the contact pads may be incorporated into the artistic design of the metal contact pad layer of the chip module or extended chip module described herein, and may increase the activation distance.

[0045] Some embodiments of the invention(s) disclosed herein may comprise combining decorative designs, laser etched or chemically etched, in the front face metalized surface (or front face plate FFP) of a flexible circuit (FC) or module tape (MT) forming a transponder chip module (TCM) or an oversize or enlarged transponder chip module (OS-TCM, E-TCM, or ETCM) with functional contact pads (contact interface). The module further comprises a module antenna (MA) or an antenna structure (AS) connected to an RFID chip on the rear face of the module tape to facilitate contactless capability. Artificial intelligence (Al) assisted digital artKLUNKER IP K710845

[0046] may be used to create the decorative design on the front face of the chip module, with the digital art extending beyond the chip module onto the card body (entirely or partially) using techniques such as digital printing, laser etching or a combination thereof. The functional contact pads (which facilitate a contact interface) may be camouflaged within the decorative design and may be accompanied by imitation contact pads or metalized traces of various shapes and sizes. The graphic art on the chip module matches or complements the graphic art on the card body or is an extension thereof. In developing a customized graphic feature for a smartcard or transaction card, an algorithm may take on the tedious task of defining the ISO positions of the contact pads on the chip module and their geometrical shape relative to the dimensions and shape of the card body and blend their position and shape seamlessly into the digital art. The graphic art on the chip module may be digitally printed on a metalized or non-metalized surface forming the front face of the transponder chip module using a primer, UV curable inks and a protective top-coat. Electronic devices such as LEDs or sound actuators may be incorporated into the chip module, particularly an enlarged chip module. The chip module, particularly an enlarged chip module may be implanted in a 4-, 5- or 6-ply laminated structure of micro thin rotary peeled wood veneers bonded together using an adhesive coated substrate, adhesive coated paper and or adhesive coated fleece, wherein the wood veneers are prepressed to reduce their thickness and the final laminated structure is sanded-back to be ISO thickness compliant.

[0047] According to an embodiment of the invention, a transaction card or smartcard (SC) may have an oversize or enlarged transponder chip module (OS-TCM, E-TCM) with an enlarged module antenna (MA) to replace the combination of an inductive coupling chip module (ICM) with an in-card booster antenna circuit (BAC). The oversize transponder chip module (OS-TCM) with a 6 or 8 pin faceplate may occupy an area greater than the recess footprint for a standard 8-pin chip module (12.00 mm x 13.2 mm), with its surface area extending for example to 20.5 mm x 21.60 mm in the case of a rectangular geometry. The module antenna (MA) may occupy a standard area (11.40 mm x 12.40 mm) with 15 windings achieving an activation distance of 2.0 cm (without coupling with an in-card booster antenna circuit). Such module antenna (MA) when connected to an RFID chip may have windings with a track width of 60 pm or 70 pm and a spacing between tracks of 60 pm or 75 pm, operating at a resonance frequency of 14 to 16 MHz, with a Q-factor of 10, 15 or 30 and a bandwidth of 2.5 MHz. Alternatively, the module antenna (MA) may cover a significantly greater surface areaKLUNKER IP K710845

[0048] enhancing the activation distance to 3 or 4 cm. Depending on the input capacitance of the silicon die, the module antenna (MA) may then have 12 turns with linear spacing between tracks or the separation distance between tracks may change to regulate the capacitance of the RLC circuit. The silicon device may be wire-bonded or flip-chip bonded to the flexible circuit (FC: module tape (MT) or chip carrier tape (CCT)). The greater the surface area occupied by the module antenna (MA) the greater the activation distance. The shape of the oversize chip module may be rectangular, round, square, elongated, elliptical or of an irregular design. The outer contours of the module antenna (MA) may follow the same shape as the chip module (CM) or may differ in terms of antenna layout. The module antenna (MA) may be routed around the outer edges of the flexible circuit (FC) forming the chip module (CM). The oversize transponder chip module (OS-TCM) may also be referred to as an enlarged transponder chip module (E-TCM, or ETCM).

[0049] The contact pads may be electrodeposited copper plated with nickel and finished with a flash of gold or palladium.

[0050] Graphic features on the contact pads may have a combination of selective plating of gold and palladium.

[0051] The enlarged chip module may have a second antenna structure (AS) having a plurality of windings to concentrate and amplify the reception of electromagnetic waves. The second antenna structure may also have the addition of a silicon capacitor in forming an RLC circuit to regulate the frequency, Q-factor and bandwidth. The second antenna structure may be referred to as an inductive bridge.

[0052] According to an embodiment of the invention, a decorative dual interface chip module may comprise contact pads satisfying the positional requirements of ISO / IEC 7816-2 (dimensions and location of the contacts), wherein the individual contact pads have various shapes, forms and segments, forming individual parts of an overall decorative (artistic) design. The individual contact pads may bear little or no resemblance to standard ISO contact pads, and the form of each contact pad may be different from the other contact pads in the overall array of contact pads. Other parts (or portions) of the overall decorative design may appear on the card body. The artwork on the card body may be digitally printed or laser etched graphics. TheKLUNKER IP K710845

[0053] artwork of the contact pads, traces and segments may be chemically etched and plated. The design features may be produced on a photomask before chemical etching. Refer to figures 4 and 5.

[0054] The artwork formed by the contact pads and portion of the decorative design appearing on the card body may be referred to herein "digital art", which refers to any artistic work or practice that uses digital technology as part of the creative or presentation process.

[0055] The module antenna (MA) of an enlarged module may be significantly larger than the antenna in a standard 6- or 8-pin inductive coupling chip module, thus achieving a greater activation distance, eliminating the need for an in-card booster antenna circuit (BAC) or a coupling frame (CF).

[0056] According to an embodiment of the invention, an oversize transponder chip module (OS-TCM) or enlarged transponder chip module (E-TCM, ETCM) may comprise decorative designs, laser etched or chemically etched, in the front face metalized surface of the flexible circuit (FC) or module tape (MT) forming said chip module. Further comprising a module antenna (MA) or an antenna structure (AS) connected to an RFID chip on its rear face (contactless interface). Using artificial intelligence (Al) assisted digital art to create said decorative design on the front face of the transponder chip module (OS-TCMZE-TCM), with the digital art extending beyond the chip module to the card body (entirely or partially) using techniques such as digital printing, laser etching or a combination thereof. The functional contact pads (contact interface) may be camouflaged within the decorative design and may be accompanied by imitation contact pads or metalized traces of various shapes and sizes. Put differently, the graphic art on the chip module matches the graphic art on the card body or is an extension thereof. In developing a customized graphic feature for a smartcard or transaction card, an algorithm may take on the tedious task of defining the ISO positions of the contact pads on the chip module and their geometrical shape relative to the dimensions and shape of the card body and blend their position and shape in a seemingly manner into the digital art. Incorporating electronic devices such as LEDs or sound actuators into the transponder chip module.

[0057] For the purpose of clarity, the decorative artwork (chemically etched, laser ablated or digitally deposited) on the front face of the chip module matching, pairing or complementing the cardKLUNKER IP K710845

[0058] body artwork (laser marked or digitally deposited) may be applicable for an enlarged or oversize transponder chip module, a conventional chip module (6- or 8-pin chip) or any RFID device with a metalized front plate. Equally, the front face of a transponder chip module may have metalized areas (e.g. plated copper) on the flexible circuit (FC) or module tape (MT) and or non-metalized areas (e.g. underlying carrier layer: epoxy glass or polyimide) to which the decorative artwork is applied. The underlying module tape may be colored to provide contrast.

[0059] The enlarged transponder chip module may be extended to any edge of the card body such as, but not limited to the top or left side edges of the card. This may allow for the incorporation of a release tab into the card construction, allowing a cardholder at the end-of-life-use after the expiry date of the smartcard to dispose of the chip module separately from the card body, by pulling on the release tab to eject the chip module from the card body. This feature may be described in another provisional or nonprovisional patent application filed by the applicant or inventor hereof.

[0060] According to an embodiment of the invention, an array of card body sites arranged on a suitable substrate such as plastic, paper, wood, metal, glass or ceramic, or a laminated assembly comprising layers of plastic, paper, wood, metal, glass or ceramic, or a combination thereof may have recesses or cavities to accept the insertion or placement of a chip module with radio frequency capability via an antenna circuit in the application of contactless identification, payment or ticketing, and having elements (chemically or laser etched) on its front face surface (exposed side) in the form of contact pads, metalized areas or lines (electrically conductive), non-metalized areas or lines (non-conductive), traces, tracks or circuitry on a supporting carrier (flexible or rigid) such as epoxy glass or polyimide (colored or uncolored) forming a decorative design through the arrangement of the elements which complements, blends-in with or is an extension of the design features applied (by way of printing, lasing or a combination thereof) to the rest of each card body in the array of card body sites. In a chemical etch process, the elements may be produced from a photomask, and the metalized areas and lines may be nickel / copper plated with a flash of gold or palladium. Put differently, a decorative chip module with RFID capability is inserted or placed at each card body site in an array of card body sites (e.g. 3 x 8 or 5 x 5 format), unlike the conventional production method of singulat-ing (punching, milling or laser cutting) the card bodies from the array and later embedding aKLUNKER IP K710845

[0061] chip module into each individual card body (aka chip module implanting). Post insertion or placement of the decorative chip module, a vision system is used to ascertain the exact location (coordinates) and orientation of each chip module in the array as well as the dimensional size and position of each of the design elements on each of the decorative chip modules. Through the application of artificial intelligence (Al), this accumulation of data is transformed into print or laser commands so that the printed or laser etched features to be applied to the rest of the card body precisely match the elements on the decorative chip module.

[0062] The decorative chip module may or may not require a booster antenna circuit to enhance the communication distance.

[0063] According to an embodiment of the invention, individual card bodies made from a suitable material(s) or a laminated assembly of suitable material may be implanted with a decorative chip module, before printing (digital (DoD) or thermal) or laser etching in a personalization machine. Post implanting, the decorative design on the face plate is registered in its entirety using a vision system with the data manipulated by artificial intelligence (Al) to generate printing or laser etching commands, allowing the graphic features of the card to exactly match, blend in with or complement the decorative design on the chip module.

[0064] The elements and supporting carrier may be referred to as a chip carrier tape or module tape. The metalized areas and lines (copper, nickel, gold, palladium) on the supporting carrier (such as epoxy glass or polyimide) may have scratch resistance properties and may have received anti-fingerprint surface treatment. The metalized areas and lines may be black, instead of gold or palladium in color. The supporting carrier may be colored. Metalized areas may receive holographic designs. The metalized areas may be functional (for electrical contact) or nonfunctional (for aesthetics). An antenna structure may be applied to one or both sides of the chip carrier tape or module tape. In the case of contactless communication in the high frequency range (e.g. 13.56 MHz), the antenna structure may have several windings with a distance between tracks of 60 pm and a trackwidth of 60 pm. Other components (such as an SMD capacitor or LED device) may be mounted to the module tape. The tape may also be referred to as a flexible circuit.KLUNKER IP K710845

[0065] Before insertion or placement of the decorative chip module, the milled out cavity or recess to accept the chip module may be inkjet printed with ink to have an underlying colored surface. The inventions disclosed herein, in their various embodiments, may be incorporated into environmentally friendly wooden smartcards. Wooden smartcards (which may be referred to as "timber transaction cards (TTC)") may be described in another provisional or nonprovisional patent application filed by the applicant or inventor hereof.

[0066] According to an embodiment of the invention, a solid ceramic transaction card, a multi-layered ceramic card, a ceramic transaction card with a coupling frame or a ceramic coated transaction card may comprise an enlarged transponder chip module having its long side orientated parallel the length of the card body or parallel the width of the card body, wherein the decorative contact pads on the front face plate of the chip module blend in, match or complement the features laser etched in the ceramic. The same aesthetics may also apply to glass transaction cards.

[0067] The artistic integration as described above spans from the chip module contact pads into the card body artwork, potentially assisted by Al tools to produce designs that remain ISO-compliant, and include: Al-assisted design tools that balance artwork with ISO contact requirements; functional artwork where contact pad and peripheral artwork integrate into a cohesive motif; and artwork that serves additional functionality allowing the integration of a decorative enlarged transponder chip module into the card body.

[0068] In their various embodiments, the invention(s) described herein may relate to industrial and commercial industries, such RFID applications, payment smartcards (metal, plastic, wood, stone, ceramic, glass, leather or a combination thereof), electronic credentials, identity cards, loyalty cards, access control cards, biometric cards, and the like.

[0069] Other objects, features and advantages of the invention(s) disclosed herein may become apparent in light of the following illustrations and descriptions thereof.KLUNKER IP K710845

[0070] DISCLOSURE OF THE INVENTION

[0071] More specifically, the object of the present invention is addressed by the various aspects of the invention as described hereinbelow:

[0072] Particularly, the objective problem is solved by manufacturing transaction cards in which chip modules bearing an individualised design pattern on their front surfaces are placed at respective card body sites on a substrate. For each individually placed chip module, its precise location and orientation relative to the respective card body site is optically determined, and graphic application commands are computationally generated individually for each card body site on the basis of that positional data. As a result, the graphic pattern applied to each card body site is accurately registered to the design pattern of the respective chip module.

[0073] According to a first aspect of the invention, there is provided a method of manufacturing transaction cards, comprising the steps of providing a substrate comprising a plurality of card body sites, each card body site corresponding to a transaction card, and inserting or placing a chip module (TCM) having a design pattern on a front surface thereof at each card body site.

[0074] According to the invention, for each inserted chip module, positional data comprising at least the location and orientation of the chip module relative to the respective card body site is optically captured; individualised graphic application commands are computationally generated for each card body site on the basis of the captured positional data; and a graphic pattern is applied to each card body site in accordance with the individualised graphic application commands, such that the graphic pattern on the card body is registered to the design pattern on the chip module.

[0075] In other words, the method provides for a plurality of transaction cards to be manufactured from a common substrate, each card body site receiving an individual chip module whose front surface carries a design pattern. Rather than applying a uniform graphic pattern to all card body sites in a single operation, the method optically captures, for each chip module individually, the actual position and orientation of that module relative to the respective card body site, and uses that positional information as the basis for computing a set of graphic application commands specific to that card body site. The graphic pattern is then applied to each cardKLUNKER IP K710845

[0076] body site in accordance with those individually computed commands, with the result that the applied graphic pattern is brought into registration with the design pattern of the respective chip module.

[0077] The method thereby achieves accurate visual registration between the graphic pattern on the card body and the design pattern on the chip module, irrespective of the positional and orientational variability inherent in the placement of individual chip modules at their respective card body sites. As a result, the chip module and the surrounding card body present a visually coherent and unified appearance, in which the design pattern on the module is seamlessly integrated into the overall graphic design of the card. Furthermore, since the graphic application commands are computed individually for each card body site on the basis of the actual position and orientation of the placed chip module, each transaction card produced by the method bears a unique combination of module position and registered graphic pattern, thereby offering enhanced resistance to counterfeiting compared with transaction cards having a uniform, non-registered graphic appearance.

[0078] Preferably, the optical capturing is performed by a vision system configured to ascertain the location and orientation of each chip module within the card body site.

[0079] According to some embodiments, the optically capturing step further comprises determining the dimensional size and position of individual design elements on the front surface of each chip module. This enables the graphic application commands to be computed with reference not only to the overall position and orientation of the module but also to the precise geometry of its individual design elements, thereby achieving a higher degree of visual registration between the applied graphic pattern and the design pattern on the chip module.

[0080] According to some embodiments, the graphic application commands comprise print commands, laser commands, or a combination of print and laser commands. This allows the graphic pattern to be applied to the card body using whichever application technology is best suited to the card body material and the desired visual appearance, providing manufacturing flexibility without compromising registration accuracy.KLUNKER IP K710845

[0081] According to some embodiments, the graphic pattern applied to the card body complements, blends in with, or constitutes an extension of the design pattern on the chip module. This achieves a visually seamless transition between the chip module and the surrounding card body, so that the chip module is integrated into the overall card design rather than appearing as a visually distinct functional element.

[0082] According to some embodiments, the graphic pattern on the card body is applied by digital printing, laser etching, or a combination thereof. Digital printing enables full-colour graphic patterns with high spatial resolution, whilst laser etching produces permanent, abrasion-resistant markings directly in the card body surface; the combination of both techniques allows complex multi-layered visual effects to be achieved.

[0083] According to some embodiments, the computational generation of the individualised graphic application commands is performed using a computational model, in particular an artificial intelligence model. The use of a computational model, and in particular an artificial intelligence model, enables complex design patterns to be automatically adapted to the individual position and orientation of each chip module without manual intervention, significantly reducing processing time and enabling high-throughput manufacturing.

[0084] In other words, the step of computing the individualised graphic application commands for each card body site is not performed by a fixed transformation or a manually defined rule, but by a computational model that derives the appropriate commands from the captured positional data. Where the computational model is an artificial intelligence model, the model is capable of deriving optimised graphic application commands from the captured positional data for chip modules placed at any position and orientation within the card body site.

[0085] Preferably, the computational model processes a digital artwork file, such as a CAD file, derived from the design pattern of the chip module, and derives therefrom the individualised graphic application commands for each card body site. Further, the computational model may determine the geometrical shape of each contact pad relative to the dimensions and position of the card body site and adapt the graphic application commands such that the contact pad shapes are seamlessly integrated into the graphic pattern applied to the card body.KLUNKER IP K710845

[0086] According to some embodiments, the method further comprises the step of singulating the card body sites from the substrate to obtain individual transaction cards. This allows the registration and graphic application steps to be performed at the substrate level in a single manufacturing pass across all card body sites, after which individual transaction cards are obtained by singulation, improving manufacturing efficiency compared with processing individual card bodies sequentially.

[0087] According to some embodiments, the card body sites are arranged in an array on the substrate. An array arrangement enables the optical capturing step and the graphic application step to be performed across all card body sites in a single manufacturing pass, maximising the efficiency gains achieved by the substrate-level processing approach of the method.

[0088] Preferably, the card body sites are arranged in a rectangular array, such as a 3 / 8 or 5 / 5 format, on the substrate.

[0089] According to some embodiments, each card body site has a recess or cavity for receiving the chip module. A recess or cavity ensures accurate mechanical location of the chip module within the card body site and provides a flush front surface after module insertion, facilitating both the optical capturing step and the subsequent application of the graphic pattern.

[0090] Preferably, before insertion or placement of the chip module, the recess or cavity is inkjet-printed to provide a coloured underlying surface visible through non -metallised areas of the front surface of the chip module after insertion.

[0091] According to some embodiments, the design pattern on the front surface of the chip module comprises a plurality of contact pads (CP) formed in a metallisation layer on the front surface of a module tape (MT), each contact pad having a non-rectilinear shape and satisfying the positional and dimensional requirements of ISO 7816, and additional metallised areas electrically isolated from the contact pads. By forming the contact pads with non-rectilinear shapes and incorporating additional isolated metallised areas, the metallisation layer as a whole defines a distinctive and individualised surface pattern that is structurally integral to the module tape, rather than being applied as a removable surface coating. Unlike a printed or coated decoration, the surface pattern defined by the metallisation geometry cannot be removed orKLUNKER IP K710845

[0092] altered without destroying the electrical functionality of the chip module, providing an inherent level of tamper evidence in addition to the counterfeiting resistance arising from the individualised registration described above.

[0093] In other words, the design pattern on the front surface of the chip module is not a printed or applied decoration but is structurally defined by the metallisation layer itself. The contact pads are shaped so as to depart from the rectilinear standard geometries of conventional ISO 7816 contact arrays, whilst nonetheless satisfying the positional and dimensional requirements of that standard. The metallisation layer further comprises areas of metallisation that are electrically isolated from the contact pads. The contact pads and the isolated metallised areas together constitute the design pattern on the front surface of the module tape, so that the design pattern is an inherent structural feature of the chip module rather than a surface coating superimposed upon it.

[0094] Preferably, the individual contact pads have mutually different shapes from one another, so that the form of each contact pad differs from the forms of the other contact pads in the array. Preferably, the design pattern further comprises imitation contact pads or metallised traces electrically isolated from the functional contact pads, whereby the additional conductive area contributed by the imitation contact pads and metallised traces may increase the activation distance of the chip module in contactless operation.

[0095] According to some embodiments, the contact pads and the additional metallised areas are formed by chemical etching using a photomask and are plated with nickel and / or copper with a finish of gold or palladium. Chemical etching from a photomask enables the precise geometries of the non-rectilinear contact pads and isolated metallised areas to be reproduced with high dimensional accuracy, whilst nickel / copper plating with a gold or palladium finish ensures reliable electrical contact performance and corrosion resistance in accordance with applicable standards.

[0096] Preferably, the metallised areas and lines have scratch resistance properties and have received an anti-fingerprint surface treatment. Preferably, selected ones of the contact pads and additional metallised areas receive a combination of selective gold and palladium plating.KLUNKER IP K710845

[0097] According to some other embodiments, at least some of the contact pads are selectively coloured, plated, or finished to enhance visual differentiation while maintaining electrical conductivity. Selective colouring or finishing of individual contact pads introduces additional visual complexity into the surface pattern of the chip module, further increasing the difficulty of replication whilst maintaining full electrical functionality.

[0098] According to some other embodiments, the method further comprises the step of digitally printing a graphic layer on the front surface of the module tape using a primer, UV-curable inks and a protective top-coat. Digital printing directly onto the module tape surface allows photographic-quality imagery to be applied to the chip module, extending the range of achievable visual effects beyond those obtainable by metallisation alone; the protective top-coat ensures durability of the printed layer under normal card usage conditions.

[0099] Preferably, the graphic layer is digitally printed on both metallised and non-metallised areas of the front surface of the module tape.

[0100] According to some embodiments, the chip module has radio frequency capability via a module antenna (MA) disposed on a rear surface of a module tape (MT). Disposing the module antenna on the rear surface of the module tape leaves the front surface available for the full extent of the design pattern, whilst the rear surface accommodates both the module antenna and the RFID chip, providing a compact dual-interface module construction.

[0101] Preferably, the chip module further comprises a surface-mounted capacitor connected to the module antenna to enhance RF performance. Preferably, the module antenna is disposed on both sides of the module tape.

[0102] According to some embodiments, the module tape comprises epoxy glass or polyimide and is coloured. A coloured module tape provides a chromatic background on the front surface of the module tape, visible in areas not covered by metallisation, thereby adding a further visual dimension to the front surface appearance and enabling contrast effects between metallised and non-metallised areas.KLUNKER IP K710845

[0103] According to some embodiments, the chip module further comprises bonding pads on a rear surface of the module tape for connecting to an RFID chip, and vias extending through the module tape for connecting selected ones of the contact pads to selected ones of the bonding pads. This enables selected contact pads on the front surface to be electrically connected to bonding pads on the rear surface without the need for connection bridges traversing the front surface, thereby preserving the visual continuity of the design pattern.

[0104] According to some other embodiments, the chip module is an enlarged transponder chip module (E-TCM) having a surface area at least 300% larger than a standard 6-pin or 8-pin ISO chip module, such that the module antenna enables direct contactless communication with an external reader without a booster antenna circuit (B AC) or a coupling frame (CF) in the card body. The enlarged form factor provides a correspondingly larger module antenna, achieving an activation distance sufficient for direct contactless communication without requiring an incard booster antenna circuit or coupling frame, thereby simplifying the card body construction and reducing manufacturing complexity.

[0105] Preferably, the enlarged transponder chip module has a surface area of approximately 20.5 mm x 21.60 mm for a rectangular geometry. Preferably, the module antenna has 12 to 15 windings and achieves an activation distance of 2 to 4 cm without coupling to an in-card booster antenna circuit. Preferably, the enlarged transponder chip module further comprises a second antenna structure having a plurality of windings and a silicon capacitor forming an RLC circuit, configured to regulate the resonance frequency, Q-factor and bandwidth of the contactless interface and to concentrate and amplify the reception of electromagnetic waves.

[0106] According to some embodiments, the substrate comprises one or more layers of material selected from plastic, paper, wood, metal, glass, ceramic, or a combination thereof. This broad material compatibility allows the method to be applied to a wide range of transaction card types and constructions, including environmentally sustainable card bodies based on natural materials.

[0107] Preferably, where the substrate is a ceramic card body or a ceramic-coated card body, the chip module is an enlarged transponder chip module oriented with its long side parallel to the length or to the width of the card body.KLUNKER IP K710845

[0108] According to some embodiments, the substrate comprises a laminated structure of micro-thin rotary-peeled wood veneers bonded together using adhesive-coated paper and / or adhesive-coated fleece, the wood veneers being prepressed to reduce their thickness and the laminated structure being sanded back to an ISO-conforming thickness. Prepressing the wood veneers prior to lamination reduces their thickness and compresses the wood fibre structure, enabling the laminated assembly to be sanded back to an ISO-conforming card thickness whilst maintaining the structural integrity and surface quality required for both the optical capturing step and the subsequent graphic application step.

[0109] In other words, the substrate is a laminated wood structure built up from a plurality of wood veneers that have each been rotary-peeled to a micro-thin thickness and subsequently prepressed to further reduce their thickness and consolidate the wood fibre structure. The veneers are bonded together into a laminated assembly using adhesive-coated paper and / or adhesive-coated fleece as interlayer bonding media. The resulting laminated assembly is then sanded back on one or both surfaces until the overall thickness of the substrate conforms to the ISO-prescribed card thickness, yielding a card body substrate that combines the natural appearance and tactile properties of wood with the dimensional precision required for transaction card manufacture.

[0110] Preferably, the laminated structure comprises 4, 5 or 6 plies of micro-thin rotary-peeled wood veneers.

[0111] According to a second aspect of the invention, there is provided a transaction card manufactured according to the first aspect of the invention. The transaction card thereby has a graphic pattern on its card body that is accurately registered to the design pattern on the chip module, the graphic pattern having been applied in accordance with individualised graphic application commands generated on the basis of the positional data captured for that chip module during manufacture. As a result, the transaction card presents a visually coherent and unified appearance in which the design pattern on the chip module is seamlessly integrated into the overall graphic design of the card body.KLUNKER IP K710845

[0112] According to some embodiments, the design pattern on the chip module comprises a plurality of contact pads (CP) having non-rectilinear shapes compliant with ISO 7816, and additional metallised areas electrically isolated from the contact pads. The design pattern is accordingly defined by the metallisation geometry of the module tape itself, rather than by a printed or applied surface coating, so that the design pattern constitutes a structurally integral feature of the chip module that cannot be removed or altered without destroying the electrical functionality thereof.

[0113] In other words, the transaction card is characterised in that the visual appearance of the chip module is not determined by a printed, coated or otherwise applied decoration, but by the geometry of the metallisation layer on the front surface of the module tape itself. The contact pads depart from the rectilinear standard geometries of conventional ISO 7816 contact arrays whilst nonetheless satisfying the positional and dimensional requirements of that standard, so that each contact pad is individually shaped and electrically functional. The metallisation layer further defines areas of metallisation that are electrically isolated from the contact pads. The contact pads and the isolated metallised areas together constitute the design pattern of the chip module as seen on the front surface of the transaction card, the design pattern being an inherent structural feature of the chip module that is permanently and inseparably associated with its electrical functionality.

[0114] Preferably, the individual contact pads have mutually different shapes from one another. The design pattern may further comprise imitation contact pads or metallised traces electrically isolated from the functional contact pads, whereby the additional conductive area contributed by the imitation contact pads and metallised traces may increase the activation distance of the chip module in contactless operation.

[0115] According to some embodiments, the chip module is an enlarged transponder chip module (E-TCM) configured for contactless operation without a booster antenna circuit (BAC) or a coupling frame (CF) in the card body. The enlarged form factor provides a module antenna of correspondingly greater area, achieving an activation distance sufficient for direct contactless communication with an external reader, thereby simplifying the card body construction by eliminating the need for an in-card booster antenna circuit or coupling frame.KLUNKER IP K710845

[0116] Preferably, the enlarged transponder chip module has a surface area of approximately 20.5 mm x 21.60 mm for a rectangular geometry. Preferably, the module antenna has 12 to 15 windings and achieves an activation distance of 2 to 4 cm without coupling to an in-card booster antenna circuit. Preferably, the enlarged transponder chip module further comprises a second antenna structure having a plurality of windings and a silicon capacitor forming an RLC circuit, configured to regulate the resonance frequency, Q-factor and bandwidth of the contactless interface and to concentrate and amplify the reception of electromagnetic waves.

[0117] According to some embodiments, the graphic pattern on the card body is formed by digital printing, laser etching, or a combination thereof, enabling a wide range of visual effects and surface finishes to be achieved on the card body in registration with the design pattern on the chip module.

[0118] According to some embodiments, the graphic pattern on the card body complements, blends in with, or constitutes an extension of the design pattern on the chip module. The chip module is thereby integrated into the overall graphic design of the transaction card rather than presenting as a visually distinct functional element superimposed upon the card body.

[0119] According to some embodiments, the card body comprises one or more layers of material selected from plastic, paper, wood, metal, glass, ceramic, or a combination thereof. This broad material compatibility allows the transaction card to be realised in a wide range of constructions, including environmentally sustainable card bodies based on natural materials.

[0120] Preferably, where the card body is a ceramic card body or a ceramic-coated card body, the chip module is an enlarged transponder chip module (E-TCM) oriented with its long side parallel to the length or to the width of the card body. Further, the card body may comprise a laminated structure of micro-thin rotary-peeled wood veneers bonded together using adhesive-coated paper and / or adhesive-coated fleece, the wood veneers being prepressed to reduce their thickness and the laminated structure being sanded back to an ISO-conforming thickness; in this case, the laminated structure preferably comprises 4, 5 or 6 plies.

[0121] The objective problem is also solved by a chip module in which the electrically conductive contact pads are formed by selective removal of metallisation material from a metallisation layer on an obverse side of a carrier tape. The non-rectilinear shapes of at least a subsetKLUNKER IP K710845

[0122] collectively constitute a design pattern that is defined by the boundaries of the remaining metallisation material on the obverse side. As a result, the design pattern on the front surface of the chip module is suitable for visual integration with a graphic pattern on a surrounding card body of a smart card or the like.

[0123] According to a third aspect of the invention, there is provided a chip module for implantation in a smartcard, the chip module comprising a flexible chip carrier tape having an obverse side and a bond side, a plurality of electrically conductive contact pads disposed on the obverse side, electrically conductive circuitry disposed on the bond side, and a semiconductor die mounted to the bond side and electrically connected to the circuitry.

[0124] According to the invention, the contact pads are formed by selective removal of metallisation material from a metallisation layer on the obverse side, and at least a subset of the contact pads have non-rectilinear shapes satisfying the positional and dimensional requirements of ISO / IEC 7816, the non-rectilinear shapes of said subset collectively constituting a design pattern defined by the boundaries of the remaining metallisation material.

[0125] In other words, the chip module employs a subtractive patterning approach in which the metallisation layer on the obverse side of the carrier tape serves a dual function: it provides the electrically functional contact pads required for the contact interface and, at the same time, defines a visually distinctive design pattern on the front surface of the chip module. The shapes of the individual contact pads depart from conventional rectilinear geometries, whilst continuing to satisfy the positional and dimensional requirements of ISO / IEC 7816 for the contact interface. The design pattern is thus not superimposed upon the metallisation layer as an additional decorative element, but is inherently defined by the boundaries between the metallisation material that remains after selective removal and the areas from which metallisation material has been removed, so that the contact pad shapes and the design pattern arise from one and the same patterning operation.

[0126] Preferably, the individual contact pads have mutually different shapes from one another, so that the form of each contact pad differs from the forms of the other contact pads in the array.KLUNKER IP K710845

[0127] The design pattern is an inherent structural feature of the metallisation layer itself, rather than a printed or applied surface decoration. Since the design pattern and the electrically functional contact pads are formed by the same metallisation material, the design pattern cannot be removed or altered without destroying the electrical functionality of the chip module, providing inherent tamper evidence. The non-rectilinear contact pad shapes further enable the chip module to present a visually distinctive surface appearance whilst maintaining compliance with ISO / IEC 7816.

[0128] According to some embodiments, the remaining metallisation material on the obverse side further defines additional metallised areas that are electrically isolated from the contact pads and form a further portion of the design pattern. The additional metallised areas increase the visual complexity of the design pattern beyond the contact pad shapes alone.

[0129] Preferably, the additional metallised areas comprise imitation contact pads or metallised traces electrically isolated from the functional contact pads, whereby the additional conductive area contributed by the imitation contact pads and metallised traces may increase the activation distance of the chip module in contactless operation.

[0130] According to some embodiments, the contact pads and the remaining metallisation material are formed by chemical etching using a photomask and the underlying copper layer is plated with nickel and a finish of gold or palladium. Chemical etching from a photomask enables high dimensional accuracy in reproducing the non-rectilinear contact pad shapes and the design pattern, whilst the plating of the underlying copper layer ensures reliable electrical contact performance and corrosion resistance.

[0131] Preferably, selected ones of the contact pads and additional metallised areas receive a combination of selective gold and palladium plating. Preferably, the metallised areas and lines have scratch resistance properties and have received an anti-fingerprint surface treatment.

[0132] According to some embodiments, the metallisation layer on the obverse side further comprises connection bridges and / or plating lines formed by the selective removal of metallisation material, the connection bridges and / or plating lines forming a further portion of the designKLUNKER IP K710845

[0133] pattern. The connection bridges and plating lines thereby become visually integrated into the overall design pattern rather than appearing as separate functional elements.

[0134] According to some embodiments, the chip module further comprises a module antenna disposed on the bond side, the module antenna being a planar antenna having a plurality of spiral windings surrounding the semiconductor die. The module antenna provides the chip module with radio frequency capability for contactless communication.

[0135] Preferably, the chip module further comprises a surface-mounted capacitor connected to the module antenna to enhance RF performance. Preferably, the module antenna is disposed on both sides of the chip carrier tape.

[0136] According to some embodiments, the chip module is an enlarged transponder chip module having a surface area at least 300% larger than a standard 6-pin or 8-pin ISO chip module, such that the module antenna enables direct contactless communication with an external reader without a booster antenna circuit or a coupling frame in the card body. The enlarged form factor eliminates the need for an in-card booster antenna circuit or coupling frame, thereby simplifying the card body construction.

[0137] Preferably, the enlarged transponder chip module has a surface area of approximately 20.5 mm x 21.60 mm for a rectangular geometry. Preferably, the module antenna has 12 to 15 windings and achieves an activation distance of 2 to 4 cm without coupling to an in-card booster antenna circuit. Preferably, the enlarged transponder chip module further comprises a second antenna structure having a plurality of windings and a silicon capacitor forming an RLC circuit, configured to regulate the resonance frequency, Q-factor and bandwidth of the contactless interface and to concentrate and amplify the reception of electromagnetic waves.

[0138] According to some embodiments, the flexible chip carrier tape is coloured and thereby provides visual contrast against the metallised design pattern on the obverse side. The coloured carrier tape provides a chromatic background visible in the non-metallised areas of the obverse side, adding a further visual dimension to the design pattern and enabling contrast effects between the metallised contact pads and the underlying carrier tape surface.

[0139] Preferably, the chip carrier tape comprises epoxy glass or polyimide.KLUNKER IP K710845

[0140] According to a fourth aspect of the invention, there is provided a smartcard comprising a card body and a chip module according to the third aspect that is implanted in the card body.

[0141] In other words, the smartcard integrates the chip module of the third aspect into a card body, so that the design pattern of the chip module is visible on the front surface of the smartcard. The design pattern is then presented in the context of the surrounding card body.

[0142] The design pattern on the chip module is an inherent and permanent structural feature of the smartcard that cannot be removed or altered without destroying the electrical functionality of the chip module, providing the smartcard with inherent tamper evidence and a visually distinctive appearance.

[0143] According to some embodiments, a graphic pattern on the card body complements, blends in with, or constitutes an extension of the design pattern on the chip module, and preferably the graphic pattern and the design pattern together form a unitary image extending across the boundary between the chip module and the card body. The chip module is thereby visually integrated into the overall graphic design of the smartcard rather than appearing as a separate functional element.

[0144] According to some embodiments, the graphic pattern on the card body is formed by digital printing, laser etching, or a combination thereof. This provides flexibility in the choice of graphic application technique and the range of achievable visual effects.

[0145] According to some embodiments, the card body comprises one or more layers of material selected from wood, ceramic, glass, or a combination thereof. This enables the smartcard to be realised in constructions based on natural or non-plastic materials.

[0146] Preferably, where the card body is a ceramic card body or a ceramic-coated card body, the chip module is an enlarged transponder chip module oriented with its long side parallel to the length or to the width of the card body.KLUNKER IP K710845

[0147] According to some embodiments, the card body has a recess for receiving the chip module, and the recess has a coloured surface provided by inkjet printing prior to implantation of the chip module, the coloured surface being visible through non-metallised areas of the obverse side of the chip module. The coloured surface provides a chromatic background in the nonmetallised areas of the design pattern, adding a further visual dimension to the front surface appearance.

[0148] According to a fifth aspect of the invention, there is provided a method of manufacturing a chip module for implantation in a smartcard, the method comprising providing a flexible chip carrier tape having a metallisation layer on an obverse side thereof.

[0149] According to the invention, metallisation material is selectively removed from the metallisation layer to form a plurality of electrically conductive contact pads, at least a subset of the contact pads having non-rectilinear shapes satisfying the positional and dimensional requirements of ISO / IEC 7816, the non-rectilinear shapes of said subset collectively constituting a design pattern defined by the boundaries of the remaining metallisation material.

[0150] In other words, the method starts from a carrier tape that already carries a metallisation layer on its obverse side and derives the contact pads and the design pattern from that layer by selective material removal. The geometry of each contact pad is individually determined by the removal process, enabling at least a subset of the contact pads to assume non-rectilinear shapes compliant with the positional and dimensional requirements of ISO / IEC 7816. The design pattern arises not as a separately created decorative element, but as the contour defined by the boundaries between the metallisation material that remains on the obverse side and the areas from which material has been removed.

[0151] The subtractive patterning approach produces the electrically functional contact pads and the design pattern from the same metallisation layer. The resulting design pattern is an inherent structural feature of the metallisation layer that cannot be removed or altered without destroying the electrical functionality of the chip module, providing inherent tamper evidence.KLUNKER IP K710845

[0152] According to some embodiments, the selectively removing is performed by chemical etching using a photomask, and preferably the photomask defines opaque regions corresponding to the contact pad shapes and the design pattern. Chemical etching from a photomask enables high dimensional accuracy in reproducing the non-rectilinear contact pad shapes and the design pattern.

[0153] According to some embodiments, the method further comprises plating the contact pads with nickel and with a finish of gold or palladium. The plating ensures reliable electrical contact performance and corrosion resistance.

[0154] According to some embodiments, the method further comprises selectively plating portions of the contact pads with different plating materials to create visual contrast within the design pattern. The selective use of different plating materials introduces chromatic differentiation within the design pattern without additional decorative layers.

[0155] Preferably, selected ones of the contact pads receive a combination of selective gold and palladium plating.

[0156] According to some embodiments, the method further comprises implanting the chip module in a card body and applying a graphic pattern to the card body by printing or laser etching, such that the graphic pattern complements or constitutes an extension of the design pattern on the chip module. The chip module is thereby visually integrated into the overall graphic design of the completed smartcard.

[0157] According to some embodiments, the method further comprises forming vias in the chip carrier tape for electrically connecting selected ones of the contact pads on the obverse side to circuitry on the bond side. The vias provide electrical connection between the obverse and bond sides through the chip carrier tape.

[0158] According to a sixth aspect of the invention, there is provided a method of manufacturing a smartcard, comprising providing a chip module according to the third aspect or a chip module manufactured according to the fifth aspect, and implanting the chip module in a card body.KLUNKER IP K710845

[0159] The design pattern on the implanted chip module is an inherent structural feature of the completed smartcard that cannot be removed or altered without destroying the electrical functionality of the chip module, providing the smartcard with inherent tamper evidence and a visually distinctive appearance.

[0160] According to some embodiments, the method further comprises applying a graphic pattern to the card body by printing, laser etching, or a combination thereof, such that the graphic pattern complements, blends in with, or constitutes an extension of the design pattern on the chip module. The chip module is thereby visually integrated into the overall graphic design of the smartcard.

[0161] According to some embodiments, the method further comprises, prior to implanting the chip module, forming a recess in the card body and inkjet printing the recess to provide a coloured surface, the coloured surface being visible through non -metallised areas of the obverse side of the chip module after implantation. The coloured surface provides a chromatic background in the non-metallised areas of the design pattern, adding a further visual dimension to the front surface appearance.

[0162] According to some embodiments, the card body comprises one or more layers of material selected from wood, ceramic, metal, leather, glass, or a combination thereof. This enables the smartcard to be realised in constructions based on natural or non-plastic materials.

[0163] Preferably, the card body comprises a laminated structure of micro-thin rotary-peeled wood veneers bonded together using adhesive-coated paper and / or adhesive-coated fleece, the wood veneers being prepressed to reduce their thickness and the laminated structure being sanded back to an ISO-conforming thickness. Preferably, the laminated structure comprises 4, 5 or 6 plies.KLUNKER IP K710845

[0164] BRIEF DESCRIPTION OF THE DRAWINGS

[0165] Reference will be made in detail to embodiments of the disclosure, non-limiting examples of which may be illustrated in the accompanying drawing figures (FIGs). The figures may generally be in the form of diagrams. Some elements in the figures may be stylized, simplified or exaggerated, others may be omitted, for illustrative clarity.

[0166] Although the invention is generally described in the context of various exemplary embodiments, it should be understood that it is not intended to limit the invention to these particular embodiments, and individual features of various embodiments may be combined with one another. Any text (legends, notes, reference numerals and the like) appearing on the drawings are incorporated by reference herein.

[0167] Some elements may be referred to with letters (“BAC”, “CB”, “CF”, “E-TCM”, “FC”, “ICM”, “MA”, “OS-TCM”, etc.) rather than or in addition to numerals. Some similar (including substantially identical) elements in various embodiments may be similarly numbered, with a given numeral such as “310”, followed by different letters such as “A”, “B”, “C”, etc. (resulting in “310A”, “310B”, “310C”), and may collectively (all of them at once) referred to simply by the numeral (“310”).

[0168] FIG. 1 shows a data carrier having matching images, according to the prior art.

[0169] FIG. 2 is a view of the metallized contact pad array for an 8-pin chip module illustrating the concept of changing the shape and dimensions of the contact pads while observing the ISO positions, to form an image element as part of an overall design of the chip module, with said image element representing for example a leaf of a tree, according to an embodiment of the invention.

[0170] FIG. 3A is a plan view illustrating the contact pad arrangement for a 6-pin chip module, according to an embodiment of the invention.KLUNKER IP K710845

[0171] FIG. 3B is a plan view illustrating a customized contact pad arrangement for a 6-pin chip module with a brand logo, according to an embodiment of the invention.

[0172] FIG. 3C is a plan view illustrating the contact pad arrangement for an 8-pin chip module, according to an embodiment of the invention.

[0173] FIG. 3D is a plan view illustrating a customized contact pad arrangement for an 8-pin chip module with a brand logo, according to an embodiment of the invention.

[0174] FIG. 3E is a plan view illustrating the ISO positions, minimum dimensions and shape of the contact pads forming the face plate of an 8 module, according to an embodiment of the invention.

[0175] FIG. 3F is a plan view illustrating of an 8-pin customized contact pad arrangement with the logo of an issuing bank, according to an embodiment of the invention.

[0176] FIG. 4A is a front view of a transaction card or smartcard before artificial intelligence (Al) manipulation comprising artwork in the form of an inkjet-printed digital tree positioned on the right hand side of the card body, an embedded 6-pin chip module, an RFID symbol, a trademark name “Touchwood” and a laser etched graphic feature, according to an embodiment of the invention.

[0177] FIG. 4B is a front view of a transaction card or smartcard in which the artwork of the digital tree presented in FIG. 4A is shifted using artificial intelligence (Al) to the center position of the card body with some (selected ones) of the leaves of the tree overlapping the position of the 6-pin chip module and camouflaging the existence of the contact pads, according to an embodiment of the invention.

[0178] FIG. 4C is a front view of a transaction card or smartcard in which the artwork of the digital tree, Al manipulated, as presented in FIG. 4B emphasizes the faceplate of the 6-pin chip module detailing the position, shape and dimensions of the selected ones of the leaves (with veins) representing the contact pads and the branchesKLUNKER IP K710845

[0179] representing the plating lines and or connection bridges, according to an embodiment of the invention.

[0180] FIG. 4D is a magnified view of the contact pads in the form of leaves and the layout of the 6 pin chip module with dimension as presented in FIG. 4C, according to an embodiment of the invention.

[0181] FIG. 4E is a front view of a transaction card or smartcard in which the digital tree artwork,

[0182] Al manipulated, as presented in FIG. 4C showing the outline of the implanted chip module in the card body and the designation of the contact pads (Cl, C2, C3, C5, C6 and C7) on the faceplate in the form of leaves, according to an embodiment of the invention.

[0183] FIG. 4F is a magnified view of the contact pads in the form of leaves and their respective designations as presented in FIG. 4E, according to an embodiment of the invention.

[0184] FIG. 4G is a front view of a transaction card or smartcard in which the digital tree artwork as presented in FIG. 4E is shown in greyscale highlighting the faceplate of the 6- pin module and the designation of the contact pads, according to an embodiment of the invention. Note that each contact pad is associated with selected ones of the leaves. A given leaf is a functional element capable of functioning as a given one of the contact pads. A leaf may be bigger than required, as long as it satisfies the requirements of ISO 7816 for minimum contact size and location.

[0185] FIG. 5A is a front view of a decorative enlarged transponder chip module (module with functional artistic design) implanted in a transaction card or smartcard with a faceplate having plating lines and connection bridges representing branches, connection pads or pins (Cl, C2, C3, C5, C6 and C7) representing leaves, and additional metallization representing the trunk of a digital tree (center feature), according to an embodiment of the invention.KLUNKER IP K710845

[0186] FIG. 5B is a magnified view of the enlarged transponder chip module with contact pads in the form of leaves and their respective designations as presented in FIG. 5A, according to an embodiment of the invention.

[0187] FIG. 6A is a perspective view of a smartcard showing a dual interface (DI) elongated chip module starting at the left-hand side of a card body and extending to the center, having an insertion point indicator and a lift and pull release mechanism to remove the chip module at the end of card body life, according to an embodiment of the invention.

[0188] FIG. 6B is a perspective view of a smartcard showing the lip of the release tab prized from the card body after exercising indent pressure to the insertion point indicated on the card body, according to an embodiment of the invention.

[0189] FIG. 6C shows the release tab pulled away from the center area of the card body, according to an embodiment of the invention.

[0190] FIG. 6D shows the partial removal of the chip module revealing a groove (indent) under the module tape to facilitate the release of the tab, according to an embodiment of the invention.

[0191] FIG. 7 A is a digitized, black and white representation (greyscale) of an "original" painting in a vector file. The original painting is a picturesque townscape image of a trading port featuring multi-colored houses, establishments, fishing boats and ocean waves in creating a vibrant community scene.

[0192] FIG. 7B is a digitized image in card size format (card body CB) with the contact pads of the chip module (TCM) superimposed around the center point at the ISO positions of the contact pads, before artificial intelligence (Al) manipulation of the data. The illustrated module outline is a conventional size module with 6 contact pads. An enlarged chip module may also be integrated into the card body in a similar fashion, shows the partial removal of the chip module revealing a groove (indent)KLUNKER IP K710845

[0193] under the module tape to facilitate the release of the tab, according to an embodiment of the invention.

[0194] FIG. 7C is the digitized image of FIG. 7B, after Al manipulation of the data (vectors) in producing not only modified contact pads that replace some elements (such as windows and lines) in the "original" image, but may also alter other portions of the "original" image in order to better (such as seamlessly) blend the module and contact pads into the Al manipulated image. The card body (CB) and transponder chip module (TCM) are labeled, shows the partial removal of the chip module revealing a groove (indent) under the module tape to facilitate the release of the tab, according to an embodiment of the invention.

[0195] DETAILLED DESCRIPTION

[0196] Detailed explanations of the present invention are given below with reference to attached drawings that illustrate specific embodiment examples of the present invention. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It is to be understood that the various embodiments of the present invention, although different, are not necessarily mutually exclusive. For example, a particular feature, structure, or characteristic described herein in connection with one embodiment may be implemented within other embodiments without departing from the scope of the present invention. In addition, it is to be understood that the position or arrangement of individual elements within each disclosed embodiment may be modified without departing from the scope of the present invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, appropriately interpreted, along with the full range of equivalents to which the claims are entitled. In the drawings, like numerals refer to the same or similar functionality throughout the several views.

[0197] Various embodiments (or examples) may be described to illustrate teachings of the invention^), and should be construed as illustrative rather than limiting. It should be understood that it is not intended to limit the invention(s) to these particular embodiments. It should beKLUNKER IP K710845

[0198] understood that some individual features of various embodiments may be combined in different ways than shown, with one another. Reference herein to “one embodiment”, “an embodiment”, or similar formulations, may mean that a particular feature, structure, operation, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Some embodiments may not be explicitly designated as such (“an embodiment”).

[0199] The embodiments and aspects thereof may be described and illustrated in conjunction with systems, devices and methods which are meant to be exemplary and illustrative, not limiting in scope. Specific configurations and details may be set forth in order to provide an understanding of the invention(s). However, it should be apparent to one skilled in the art that the invention(s) may be practiced without some of the specific details being presented herein.

[0200] Furthermore, some well-known steps or components may be described only generally, or even omitted, for the sake of illustrative clarity. Elements referred to in the singular (e.g., "a widget") may be interpreted to include the possibility of plural instances of the element (e.g., "at least one widget"), unless explicitly otherwise stated (e.g., "one and only one widget").

[0201] In the following descriptions, some specific details may be set forth in order to provide an understanding of the invention(s) disclosed herein. It should be apparent to those skilled in the art that these invention(s) may be practiced without these specific details. Any dimensions and materials or processes set forth herein should be considered to be approximate and exemplary, unless otherwise indicated. Headings (typically underlined) may be provided as an aid to the reader, and should not be construed as limiting.

[0202] FIG. 1 shows a data carrier 1 card according to the prior art (see Fig. 3a of US 9,117,153) having the same artwork (9, 10) on both the contact plate and the card body.

[0203] The card is personalized as shown in FIG. 1. This is done by printing a dedicated image on the card which may be a unique artwork for that card or artwork that is limited to a particular print run. A number of printing techniques can be used, for example, Pad printing, Dye Diffusion Thermal Transfer (D2T2) printing, inkjet or LASER.KLUNKER IP K710845

[0204] US 9,117,153 discloses a data carrier having a main card body and a contact plate included on a surface of said main card body, wherein an area of the contact plate has a printed image thereon. In particular the image on the contact plate of the card is personalized and matches an image on the main card body so providing a further security feature for the data carrier.

[0205] FIG. 2 shows a metallized contact pad array for an 8-pin chip module illustrating the concept of changing the shape and dimensions of the contact pads while observing the ISO standard, to form an image element as part of an overall design of the chip module, with said image element representing for example a leaf of a tree or a window in a house. In this example, one leaf is shown as an image element covering the location of the Cl contact pad and performing the function thereof.

[0206] FIG. 3A is a plan view illustrating the contact pad arrangement for a 6-pin chip module.

[0207] FIG. 3B is a plan view illustrating a customized contact pad arrangement for a 6-pin chip module with a brand logo.

[0208] FIG. 3C is a plan view illustrating the contact pad arrangement for an 8-pin chip module.

[0209] FIG. 3D is a plan view illustrating a customized contact pad arrangement for an 8-pin chip module with a brand logo.

[0210] FIG. 3E is a plan view illustrating the ISO positions, minimum dimensions and shape of the contact pads forming the face plate of an 8 module.

[0211] FIG. 3F is a plan view illustrating of an 8-pin customized contact pad arrangement with the logo of an issuing bank.

[0212] FIG. 4A shows a transaction card or smartcard before artificial intelligence (Al) manipulation comprising artwork in the form of an inkjet-printed digital tree positioned on the right hand side of the card body, an embedded 6-pin chip module, an RFID symbol, a trademark name “Touchwood” and a laser etched graphic feature.KLUNKER IP K710845

[0213] FIG. 4B shows a transaction card or smartcard in which the artwork of the digital tree presented in FIG. 4A is shifted using artificial intelligence (Al) to the center position of the card body with some (selected ones) of the leaves of the tree overlapping the position of the 6-pin chip module and camouflaging the existence of the contact pads.

[0214] FIG. 4C shows a transaction card or smartcard in which the artwork of the digital tree, Al manipulated, as presented in FIG. 4B emphasizes the faceplate of the 6-pin chip module detailing the position, shape and dimensions of the selected ones of the leaves (with veins) representing the contact pads and the branches representing the plating lines and or connection bridges.

[0215] FIG. 4D shows contact pads in the form of leaves and the layout of the 6 pin chip module with dimension as presented in FIG. 4C.

[0216] FIG. 4E shows a transaction card or smartcard in which the digital tree artwork, Al manipulated, as presented in FIG. 4C showing the outline of the implanted chip module in the card body and the designation of the contact pads (Cl, C2, C3, C5, C6 and C7) on the faceplate in the form of leaves.

[0217] FIG. 4F shows contact pads in the form of leaves and their respective designations as presented in FIG. 4E.

[0218] FIG. 4G shows a transaction card or smartcard in which the digital tree artwork as presented in FIG. 4E is shown in greyscale highlighting the faceplate of the 6-pin module and the designation of the contact pads. Note that each contact pad is associated with selected ones of the leaves. A given leaf is a functional element capable of functioning as a given one of the contact pads. A leaf may be bigger than required, as long as it satisfies the requirements of ISO 7816 for minimum contact size and location.

[0219] FIG. 5A shows a decorative enlarged transponder chip module (module with functional artistic design) implanted in a transaction card or smartcard with a faceplate having plating lines and connection bridges representing branches, connection pads or pins (Cl, C2, C3, C5, C6 and C7) representing leaves, and additional metallization representing the trunk of a digitalKLUNKER IP K710845

[0220] tree (center feature), and the rear face of the chip module (not shown) having bonding pads for a silicon device, plated through holes for vertical interconnects, connection traces and an enlarged module antenna for communication directly with a contactless terminal, without the need for an in-card booster antenna circuit. The flexible module tape or chip carrier tape may be epoxy glass or Kapton and may be colored, and the contact pads may be gold, palladium or any highly conductive plating.

[0221] The enlarged chip package (oversize or enlarged transponder chip module (OS-TCM or E-TCM)) may have a footprint of approximately 13.0 mm x 17.5 mm.

[0222] As discussed above FIG. 5A is a front view of a decorative enlarged transponder chip module (module with functional artistic design) implanted in a transaction card or smartcard with a faceplate having plating lines and connection bridges representing branches, connection pads or pins (Cl, C2, C3, C5, C6 and C7) representing leaves, and additional metallization representing the trunk of a digital tree (center feature).

[0223] The metallization, in the form of artwork, would be on the front face of the module tape (MT). The lines around the individual elements of the artwork represent gaps in the metallization between adjacent elements of the metallic artwork.

[0224] In this example, the C5 pin (pad) extends into a central metal area of the contact pad array and slightly into the area of the card body.

[0225] The rear face of the chip module (not shown) may have bonding pads for a silicon device, plated through holes for vertical interconnects, connection traces and a module antenna (MA), all of which are omitted, as they are generally known.

[0226] The enlarged chip package (oversize or enlarged transponder chip module (OS-TCM or E-TCM)) may have a footprint of approximately 13.0 mm x 17.5 mm.

[0227] Note that the transponder chip module may be a standard size 6- or 8-pin transponder chip module (TCM), or it may be an enlarged or an oversize transponder chip module (E-TCM). In the case of an enlarged or oversize transponder chip module (E-TCM), the module antennaKLUNKER IP K710845

[0228] (MA, not shown) may be an enlarged or an oversize module antenna for communicating directly with a contactless terminal, without the need for an in-card booster antenna circuit or coupling frame.

[0229] FIG. 5B shows decorative enlarged transponder chip module having the shape and features of a digital tree implanted in a recess in the front face of the card body and the artwork of the card body being an extension of the chip module artwork (matching or pairing in design), with the artwork on the card body digitally printed or laser etched.

[0230] According to ISO / IEC 7816-2, the minimum dimensions of a contact pad are 2 mm in width and 1.7 mm in height. The shape of the contact pad may thus be rectangular. The faceplate of a chip module may have 6 or 8 contact pads (or pins). Any variations in contact pad design to this minimum ISO standard shape must include the prescribed 2.0 x 1.7 mm rectangular, functional, metallized area.

[0231] In the decorative dual interface chip module, including enlarged module, described herein, the contact pads may represent functional elements of an overall artwork, such as (by way of nonlimiting example), a shape of a leaf or droplet. Similarly, the connection bridge, plating line or a metalized central area may resemble the shape of a branch or twig, and a vertical metalized segment may represent a partial image of the trunk of a digital tree.

[0232] Splitting or Dividing the Artwork in Smartcards (Ornate Design. Technology and Function) The artwork split between the flexible circuit (module tape or chip carrier tape) and the card body (wood, paper, plastic, metal, leather, stone, glass, ceramic or the like) may also represent digital images of humans, plants, fruit, animals, birds, insects, objects, circuitry, science and technology, surroundings (mountain, sea, sky, sun) and conditions, any type of digital art (related to feelings, gestures, senses, expression, movement, etc.), symbols, mathematical formulas and brand logos. The card body artwork may be digitally printed or laser ablated (Ornate Design). The metalized module tape may be chemically and or laser etched to create the contact pads, tracks and antenna structure. The metalized contact pads for electrical connection may have various shapes and sizes, and may be accompanied by non-functional contact pads to create graphic features (Technology). The flexible circuit may also comprise at least oneKLUNKER IP K710845

[0233] antenna structure (AS) for radio frequency communication. The chip module may operate as a payment or identification device having a contact and contactless interface (Function).

[0234] The contact pads (functional) and imitation pads (non-functional) may have the following two dimensional geometric shape: oval, round, square, triangle, rectangle, ellipse, trapezoid, heptagon, hexagon, pentagon, octagon, decagon, star, heart, etc.). The contact pads may have the shape and contours of alphanumeric characters. Electrical traces or imitation traces may extend from said pads. For the purpose of clarity, the artwork as discussed above may be applied to the flexible circuit of the chip module to match or pair with the artwork applied to the card body, or the flexible circuit solely receives the artwork. The flexible circuit may also be referred to as flex-circuit.

[0235] Digital inkjet printing using UV curable or water-based inks may produce 2 or 3 dimensional images. Haptic print may also be applied to the card body to enhance the touch and feel of the graphic artwork.

[0236] Digital Art

[0237] Digital art refers to any artistic work or practice that uses digital technology as part of the creative or presentation process.

[0238] Digital painting is where artists use software to emulate techniques used in physical painting, digital illustration which involves creating rendered images for other media, and 3D modeling, where artists craft three-dimensional objects and scenes.

[0239] Reference is made to: internet.midjourney.com / home

[0240] Al-assisted Digital Art

[0241] Al-assisted digital art refers to the use of artificial intelligence (Al) tools and techniques to assist artists in creating artwork. This collaboration between human creativity and Al algorithms has opened up new possibilities for art creation by enhancing, streamlining, or even reimagining the creative process. Here are some of the ways Al is transforming digital art:KLUNKER IP K710845

[0242] 1. Generative Art

[0243] Al can generate patterns, images, or designs based on parameters set by the artist. Tools like DeepDream, GANs (Generative Adversarial Networks), and style transfer algorithms allow artists to create artwork by feeding in data or reference images, which the Al then manipulates to produce entirely new visuals and or visual effects.

[0244] Reference is made to: internet.deepdreamgenerator.com /

[0245] 2. Style Transfer

[0246] Al can mimic the style of famous artists or art movements and apply them to new images. For example, an Al might be trained on Van Gogh's works and apply his distinctive brushstroke style to a modern photograph, effectively blending classical techniques with contemporary subjects.

[0247] 3. Automating Tedious Tasks

[0248] Al tools can automate repetitive tasks such as background creation, shading, coloring, and line work. This allows artists to focus more on the conceptual aspects of their work while leaving some of the technical tasks to the Al.

[0249] 4. Interactive Al Collaborations

[0250] Some Al platforms allow artists to collaborate interactively with Al models, where the artist inputs creative prompts and the Al suggests various iterations. The artist can then refine or evolve the output into a final product. This collaboration helps artists explore unexpected ideas or approaches they might not have considered.

[0251] 5. 3D Rendering & Animation

[0252] Al is also advancing in the fields of 3D modeling, sculpting, and animation. Tools like Runway ML, Blender (with ALassisted plugins), and Adobe Sensei help artists speed up animation or 3D asset creation with more natural rendering, smoother motion, and faster workflows. Reference is made to: internet.runwayml.com / , internet.blender.org / , and to internet .business, adobe. com / products / sensei / adobe-sensei.html#KLUNKER IP K710845

[0253] 6. Expanding Accessibility

[0254] Al makes digital art more accessible to individuals without traditional artistic skills. Beginners can use Al-generated patterns, styles, or filters to produce sophisticated pieces with minimal input, allowing creativity to emerge even without formal training.

[0255] 7. Creative Exploration

[0256] Al opens doors for new creativity by departing from conventional rules or combining artistic elements in novel ways. Al-generated art often leads to a fusion of human inspiration with the unexpected outcomes that arise from machine learning algorithms.

[0257] There are many tools and platforms to help an artist explore Al-assisted digital art such as the following:

[0258] 1. Beginner-Friendly Al Tools

[0259] Artlist.io: The artist can transform photos into art by applying styles from famous paintings or images. Simply upload an image, select a style, and let the Al generate the artwork.

[0260] Reference is made to:

[0261] internet, artlist, io /

[0262] internet.photoleapapp.com / features / ai-photo-to-painting internet.deeparteffects.com / internet.recraft.ai /

[0263] Artbreeder: A collaborative platform that allows users to mix and evolve images using Al. It’s great for creating characters, landscapes, and surreal images by blending different visual elements. Reference is made to: internet.artbreeder.com /

[0264] Runway ML: A versatile tool with simple drag-and-drop functionality to create video, image, and animation-based art. It’s beginner-friendly but also powerful enough for professional use. Reference is made to: internet.runwayml.com /

[0265] 2. Intermediate Tools for Artists

[0266] Adobe Sensei (part of Adobe Creative Cloud): Helps with tasks like photo editing, color matching, and generating templates in Photoshop and Illustrator. The artist can use Al tools to automate complex processes while still retaining control over creative decisions.

[0267] Reference is made to: internet.business.adobe.com / uk / products / sensei / adobe-sensei.htmlKLUNKER IP K710845

[0268] Blender (with Al-assisted plugins): Blender offers a variety of plugins and tools that make the 3D modeling and animation process more intuitive, with features like Al-driven lighting and texturing. Reference is made to: internet.blender.org /

[0269] DALL E 2 (by OpenAI): This advanced Al tool generates images from textual descriptions. The artist can use it to create conceptual art based on ideas and descriptions, blending abstract concepts with visuals. Reference is made to: intemet.openai.com / index / dall-e-2 /

[0270] 3. Advanced Al for Professional Artists

[0271] GANs (Generative Adversarial Networks): GANs allow the artist to train models on custom datasets to generate images in a specific style or theme. It requires some coding knowledge (using Python libraries like TensorFlow or Py Torch) for real creative outcomes.

[0272] Reference is made to: intemet.tensorflow.org /

[0273] Processing (with Al Libraries): Processing is a flexible software sketchbook that allows artists to code their own art, combining machine learning libraries with generative art scripts. This tool is for more technically inclined users.

[0274] TouchDesigner: A visual programming environment that allows for real-time rendering and audiovisual art, often used in live performances and interactive installations. The artist can integrate Al into the creative workflow for stunning, evolving visuals.

[0275] Reference is made to: internet.derivative.ca /

[0276] Creating designs for timber transaction cards or smartcards typically involves minimalistic, modern, and visually striking elements that fit within a small format. Al-assisted abstract art can help generate unique and intricate patterns, shapes, and colors that align with this aesthetic.

[0277] Al tools that would work well for generating abstract art for smartcards:

[0278] Artlist.io: Upload a basic design or even a random shape, and it will transform it into a piece with an abstract painting style.KLUNKER IP K710845

[0279] Artbreeder: This allows the artist to blend and evolve abstract patterns and color combinations, by adjusting sliders to create unique styles.

[0280] - DALL E: With text prompts, the artist can generate abstract art designs based on specific ideas, such as "geometric shapes with vibrant color gradients" or "minimalist abstract patterns."

[0281] Visual Style Definition

[0282] Geometric Abstractions: Simple lines, shapes, and symmetry with bold color contrasts or gradients.

[0283] Organic Shapes: Flowing curves, abstract waves, or surreal blobs that add a softer feel. Color Gradients: Smooth transitions of color that create an elegant, modem look. Textures and Layers: Adding textures like brushstrokes or layered effects for a tactile, dynamic design.

[0284] Base Design Generation

[0285] Text-Based Generation (DALL E): The artist can provide a prompt like “vibrant geometric abstract art for a smartcard, with circular shapes and gradient colors” and see the results.

[0286] - Upload and Transform (Artlist.io): Upload a photo or a simple sketch, and the Al will transform it using different abstract styles.

[0287] Artbreeder Customization: Create a basic abstract shape, then tweak and evolve it by adjusting attributes such as color and style.

[0288] Further Design Refinement after generating some initial artwork:

[0289] Adobe Illustrator / Photoshop: The artist can import the ALgenerated art and enhance it by tweaking the design, refining colors, and adjusting layouts to fit the smartcard's small format.

[0290] - Blender (Optional for 3D): Ideal for incorporating 3D elements or texture into the abstract art, to create some depth and dimension to the design.

[0291] Adapt for Smartcard Layout - Smartcard designs need to fit a specific size (ISO dimensions), so after generating the abstract art, the layout needs to work for the smartcard format:KLUNKER IP K710845

[0292] o Aspect Ratio: Most smartcards are around 85 mm x 54 mm (credit card size), the artist can crop or resize the design to fit this format without losing key visual elements.

[0293] Placement of Key Elements: Key abstract elements should not be obscured by chip placement, card holder credentials, text, or brand logos on the card.

[0294] Al Algorithm

[0295] In developing a customized graphic feature for a smartcard or transaction card, the algorithm may take on the tedious task of defining the ISO positions of the contact pads on the chip module and their geometrical shape relative to the dimensions and shape of the card body, and blend their position and shape in a seemingly manner into the image the artist is attempting to create.

[0296] FIG. 1 shows a data carrier as a representation of an enlarged chip module with contact pads and orientated in a horizontal axis, with the image on the data carrier being identical to the printed image on the card.

[0297] Removable Chip Module

[0298] FIG. 6A shows a dual interface (DI) elongated chip module starting at the left-hand side of a card body and extending to the center, having an insertion point indicator and a lift and pull release mechanism (tab) to remove the chip module at the end of card body life, wherein the insertion point indicator informs the card holder the area to receive an indent by application of pressure to release the tab. The DI chip module comprises a 6 or 8 pin contact pad arrangement (contact interface) and a chemically etched logo or design on its obverse side. On the downward facing side of the DI chip module (not shown), also referred to as the bond side, an antenna circuit is routed around the perimeter edges of the module (on one or both sides of the metalized module tape) having 6 to 8 turns, an RFID silicon device and a (SMD) capacitor to enhance RF performance (contactless interface). The design on the obverse side of the DI chip module may match or compliment the design on the card body. The features on the front face of the module may be chemically etched, laser etched or digitally printed. The DI chip module may have a width of 13 mm and a length of 25 mm, 30, 35 or 40 mm, with an activation distance ranging from 2 to 4 cm from the center of the card body. The metallization on theKLUNKER IP K710845

[0299] module tape may receive selective plating such as a combination of gold and palladium. The tape may be epoxy glass or Kapton (polyimide).

[0300] Note the positional orientation of the elongated chip module is presented in the horizonal axis, but equally could be rotated towards the vertical axis. The shape of the elongated chip module has been presented as a rectangular module, but equally could have multiple shapes and sizes.

[0301] FIG. 6B shows the lip of the release tab prized from the card body after exercising indent pressure to the insertion point indicated on the card body. At the end of card body life (expiry date), the release tab requires force to detach from the card body, as it was initially adhesively attached thereto.

[0302] FIG. 6C shows the release tab pulled away from the center area of the card body and FIG. 10D shows the partial removal of the chip module revealing a groove (indent) under the module tape to facilitate the release of the tab.

[0303] Al image manipulation for artistic contact pads complying with ISO-7816

[0304] FIG. 6A shows an "original" painting in a vector file. The original painting is a picturesque townscape image of a trading port featuring multi-colored houses, establishments, fishing boats and ocean waves in creating a vibrant community scene. Reference is made to: https: / / www.saileendart.com /

[0305] The colored painting is converted to a grayscale image for dimensional manipulation.

[0306] ISO card body dimensions (ISO / IEC 7810, ID-1 format) are standardized at 85.60 mm wide by 53.98 mm high with a standard thickness of 0.76 mm and rounded corners (a radius of 2.88 - 3.48 mm, typically R 3.18 mm). A6-pin chip module has the dimensions of 11.0 mm wide by 8.4 mm high and rounded corners (R = 1.4 mm). The center point of the chip module relative to the dimensional footprint of the ISO card body is 15.06 mm wide from the left edge and 22.62 mm high from the top edge of the card body (CB).

[0307] The row of houses have windows which lend themselves to be replaced by contact pads (in the shape of windows).KLUNKER IP K710845

[0308] By selecting the center point of the chip module on the left hand side of the image, a card size format (card body CB) can be generated.

[0309] After the center point of the chip module is defined, the outline of the 6-pin chip module and the positional layout of the contact pads can be determined (with partial removal of design features in the image).

[0310] The arrangement of contact pads for a 6-pin chip module as defined by ISO / IEC 7816 with minimum contact area dimensions of 2.0 mm x 1.7 mm as shown in FIG. 1A, can be superimposed into the space surrounding the center point.

[0311] FIG. 6B is a digitized image in card size format (card body CB) with the contact pads of the chip module (TCM) superimposed around the center point at the ISO positions of the contact pads, before artificial intelligence (Al) manipulation of the data. The illustrated module outline is a conventional size module with 6 contact pads. An enlarged chip module may also be integrated into the card body in a similar fashion.

[0312] FIG. 6C is the digitized image of FIG. 6B, after Al manipulation of the data (vectors) in producing not only modified contact pads that replace some elements (such as windows and lines) in the "original" image, but may also alter other portions of the "original" image in order to better (such as seamlessly) blend the module and contact pads into the Al manipulated image. The card body (CB) and transponder chip module (TCM) are labeled.

[0313] According to an embodiment of the invention, an array of card body sites arranged on a suitable substrate such as plastic, paper, wood, metal, glass or ceramic, or a laminated assembly comprising layers of plastic, paper, wood, metal, glass or ceramic, or a combination thereof may have recesses or cavities to accept the insertion or placement of a chip module with radio frequency capability via an antenna circuit in the application of contactless identification, payment or ticketing, and having elements (chemically or laser etched) on its front face surface (exposed side) in the form of contact pads, metalized areas or lines (electrically conductive), non-metalized areas or lines (non-conductive), traces, tracks or circuitry on a supporting carrier (flexible or rigid) such as epoxy glass or polyimide (colored or uncolored) forming aKLUNKER IP K710845

[0314] decorative design through the arrangement of the elements which complements, blends-in with or is an extension of the design features applied (by way of printing, lasing or a combination thereof) to the rest of each card body in the array of card body sites. In a chemical etch process, the elements may be produced from a photomask, and the metalized areas and lines may be nickel / copper plated with a flash of gold or palladium. Put differently, a decorative chip module with RFID capability is inserted or placed at each card body site in an array of card body sites (e.g. 3 x 8 or 5 x 5 format), unlike the conventional production method of sin-gulating (punching, milling or laser cutting) the card bodies from the array and later embedding a chip module into each individual card body (aka chip module implanting). Post insertion or placement of the decorative chip module, a vision system is used to ascertain the exact location (coordinates) and orientation of each chip module in the array as well as the dimensional size and position of each of the design elements on each of the decorative chip modules. Through the application of artificial intelligence (Al), this accumulation of data is transformed into print or laser commands so that the printed or laser etched features to be applied to the rest of the card body precisely match the elements on the decorative chip module.

[0315] The decorative chip module may or may not require a booster antenna circuit to enhance the communication distance.

[0316] According to an embodiment of the invention, individual card bodies made from a suitable material(s) or a laminated assembly of suitable material may be implanted with a decorative chip module, before printing (digital (DoD) or thermal) or laser etching in a personalization machine. Post implanting, the decorative design on the face plate is registered in its entirety using a vision system with the data manipulated by artificial intelligence (Al) to generate printing or laser etching commands, allowing the graphic features of the card to exactly match, blend in with or complement the decorative design on the chip module.

[0317] The elements and supporting carrier may be referred to as a chip carrier tape or module tape. The metalized areas and lines (copper, nickel, gold, palladium) on the supporting carrier (such as epoxy glass or polyimide) may have scratch resistance properties and may have received anti-fingerprint surface treatment. The metalized areas and lines may be black, instead of gold or palladium in color. The supporting carrier may be colored. Metalized areas may receive holographic designs. The metalized areas may be functional (for electrical contact) or non-KLUNKER IP K710845

[0318] functional (for aesthetics). An antenna structure may be applied to one or both sides of the chip carrier tape or module tape. In the case of contactless communication in the high frequency range (e.g. 13.56 MHz), the antenna structure may have several windings with a distance between tracks of 60 pm and a trackwidth of 60 pm. Other components (such as an SMD capacitor or LED device) may be mounted to the module tape. The tape may also be referred to as a flexible circuit.

[0319] Before insertion or placement of the decorative chip module, the milled out cavity or recess to accept the chip module may be inkjet printed with ink to have an underlying colored surface.

[0320] While the invention(s) may have been described with respect to a limited number of embodiments, these should not be construed as limitations on the scope of the invention(s), but rather as examples of some of the embodiments of the invention(s). Those skilled in the art may envision other possible variations, modifications, and implementations that are also within the scope of the invention(s), and claims, based on the disclosure(s) set forth herein.

[0321] In the foregoing specification, the invention has been described with reference to specific embodiments thereof. It will, however, be evident that various modifications and changes may be made thereto without departing from the broader scope of the invention. For example, the above described process flows are described with reference to a particular ordering of process actions. However, the ordering of many of the described process actions may be changed without affecting the scope or operation of the invention. The specification and drawings are, accordingly, to be regarded in an illustrative rather than restrictive sense.

Claims

KLUNKER IP K710845CLAIMS1. A method of manufacturing transaction cards, comprising the steps of:providing a substrate comprising a plurality of card body sites, each card body site corresponding to a transaction card;inserting or placing a chip module (TCM) having a design pattern on a front surface thereof at each card body site;optically capturing, for each inserted chip module, positional data comprising at least the location and orientation of the chip module relative to the respective card body site;computationally generating, on the basis of the captured positional data, individualised graphic application commands for each card body site; andapplying a graphic pattern to each card body site in accordance with the individualised graphic application commands, such that the graphic pattern on the card body is registered to the design pattern on the chip module.

2. The method according to claim 1, wherein the optically capturing further comprises determining the dimensional size and position of individual design elements on the front surface of each chip module.

3. The method according to claim 1 or 2, wherein the graphic application commands comprise print commands and / or laser commands.

4. The method according to any one of the preceding claims, wherein the graphic pattern applied to the card body complements, blends in with, or constitutes an extension of the design pattern on the chip module.

5. The method according to any one of the preceding claims, wherein the graphic pattern on the card body is applied by digital printing, laser etching, or a combination thereof.

6. The method according to any one of the preceding claims, wherein the generating in step is performed using a computational model, particularly an artificial intelligence model.KLUNKER IP K7108457. The method according to any one of the preceding claims, further comprising the step of singulating the card body sites from the substrate to obtain individual transaction cards.

8. The method according to any one of the preceding claims, wherein the card body sites are arranged in an array on the substrate.

9. The method according to any one of the preceding claims, wherein each card body site has a recess or cavity for receiving the chip module.

10. The method according to any one of the preceding claims, wherein the design pattern on the front surface of the chip module comprises a plurality of contact pads (CP) formed in a metallisation layer on the front surface of a module tape (MT), each contact pad having a non-rectilinear shape and satisfying the positional and dimensional requirements of ISO 7816; and additional metallised areas electrically isolated from the contact pads.

11. The method according to claim 10, wherein the contact pads and the additional metallised areas are formed by chemical etching using a photomask and are plated with nickel and / or copper with a finish of gold or palladium; orwherein at least some of the contact pads are selectively coloured, plated, or finished to enhance visual differentiation while maintaining electrical conductivity; orwherein the method further comprises the step of digitally printing a graphic layer on the front surface of the module tape using a primer, UV-curable inks and a protective top-coat.

12. The method according to any one of the preceding claims, wherein the chip module has radio frequency capability via a module antenna (MA) disposed on a rear surface of a module tape (MT).

13. The method according to claim 10 or 12, wherein the module tape comprises epoxy glass or polyimide and is coloured.

14. The method according to claim 12, wherein the chip moduleKLUNKER IP K710845further comprises bonding pads on a rear surface of the module tape for connecting to an RFID chip, and vias extending through the module tape for connecting selected ones of the contact pads to selected ones of the bonding pads; oris an enlarged transponder chip module (E-TCM) having a surface area at least 300% larger than a standard 6-pin or 8-pin ISO chip module, such that the module antenna enables direct contactless communication with an external reader without a booster antenna circuit (BAC) or a coupling frame (CF) in the card body.

15. The method according to any one of the preceding claims, wherein the substrate comprises one or more layers of material selected from plastic, paper, wood, metal, glass, ceramic, or a combination thereof.

16. The method according to claim 15, wherein the substrate comprises a laminated structure of micro-thin rotary-peeled wood veneers bonded together using adhesive-coated paper and / or adhesive-coated fleece, the wood veneers being prepressed to reduce their thickness and the laminated structure being sanded back to an ISO-conforming thickness.

17. A transaction card, manufactured according to the method of any one of claims 1 to 16.

18. The transaction card according to claim 17, wherein the design pattern on the chip module comprises a plurality of contact pads (CP) having non-rectilinear shapes compliant with ISO 7816, and additional metallised areas electrically isolated from the contact pads.

19. The transaction card according to claim 17 or 18, wherein the chip module is an enlarged transponder chip module (E-TCM) configured for contactless operation without a booster antenna circuit (BAC) or a coupling frame (CF) in the card body.

20. The transaction card according to any one of claims 17 to 19, wherein the graphic pattern on the card body is formed by digital printing, laser etching, or a combination thereof.KLUNKER IP K71084521. The transaction card according to any one of claims 17 to 20, wherein the graphic pattern on the card body complements, blends in with, or constitutes an extension of the design pattern on the chip module.

22. The transaction card according to any one of claims 17 to 21, wherein the card body comprises one or more layers of material selected from plastic, paper, wood, metal, glass, ceramic, or a combination thereof.

23. A chip module for implantation in a smartcard, the chip module comprising:a flexible chip carrier tape having an obverse side and a bond side;a plurality of electrically conductive contact pads disposed on the obverse side, the contact pads being formed by selective removal of metallisation material from a metallisation layer on the obverse side;electrically conductive circuitry disposed on the bond side; anda semiconductor die mounted to the bond side and electrically connected to the circuitry;wherein at least a subset of the contact pads have non-rectilinear shapes satisfying the positional and dimensional requirements of ISO / IEC 7816, the non-rectilinear shapes of said subset collectively constituting a design pattern defined by the boundaries of the remaining metallisation material.

24. The chip module according to claim 23, wherein the remaining metallisation material on the obverse side further defines additional metallised areas that are electrically isolated from the contact pads and form a further portion of the design pattern.

25. The chip module according to claim 23 or 24, wherein the contact pads and the remaining metallisation material are formed by chemical etching using a photomask and the underlying copper layer is plated with nickel and a finish of gold or palladium.

26. The chip module according to any one of claims 23 to 25, wherein the metallisation layer on the obverse side further comprises connection bridges and / or plating lines formed by the selective removal of metallisation material, the connection bridges and / or plating lines forming a further portion of the design pattern.KLUNKER IP K71084527. The chip module according to any one of claims 23 to 26, further comprising a module antenna disposed on the bond side, the module antenna being a planar antenna having a plurality of spiral windings surrounding the semiconductor die.

28. The chip module according to claim 27, wherein the chip module is an enlarged transponder chip module having a surface area at least 300% larger than a standard 6-pin or 8-pin ISO chip module, such that the module antenna enables direct contactless communication with an external reader without a booster antenna circuit or a coupling frame in the card body.

29. The chip module according to any one of claims 23 to 28, wherein the flexible chip carrier tape is coloured and thereby provides visual contrast against the metallised design pattern on the obverse side.

30. A smartcard comprising a card body and a chip module according to any one of claims 23 to 29 implanted in the card body.

31. The smartcard according to claim 30, wherein a graphic pattern on the card body complements, blends in with, or constitutes an extension of the design pattern on the chip module and wherein, preferably, the graphic pattern and the design pattern together form a unitary image extending across the boundary between the chip module and the card body.

32. The smartcard according to claim 31, wherein the graphic pattern on the card body is formed by digital printing, laser etching, or a combination thereof.

33. The smartcard according to any one of claims 30 to 32, wherein the card body comprises one or more layers of material selected from wood, ceramic, glass, or a combination thereof.

34. The smartcard according to any one of claims 30 to 33, wherein the card body has a recess for receiving the chip module, and the recess has a coloured surface provided by inkjet printing prior to implantation of the chip module, the coloured surface being visible through non-metallised areas of the obverse side of the chip module.KLUNKER IP K71084535. A method of manufacturing a chip module for implantation in a smartcard, the method comprising:providing a flexible chip carrier tape having a metallisation layer on an obverse side thereof;selectively removing metallisation material from the metallisation layer to form a plurality of electrically conductive contact pads, at least a subset of the contact pads having non-rectilinear shapes satisfying the positional and dimensional requirements of ISO / IEC 7816, the non-rectilinear shapes of said subset collectively constituting a design pattern defined by the boundaries of the remaining metallisation material.

36. The method according to claim 35, wherein the selectively removing is performed by chemical etching using a photomask and wherein, preferably, the photomask defines opaque regions corresponding to the contact pad shapes and the design pattern.

37. The method according to claim 36, further comprising plating the contact pads with nickel and a finish of gold or palladium.

38. The method according to claim 37, further comprising selectively plating portions of the contact pads with different plating materials to create visual contrast within the design pattern.

39. The method according to any one of claims 35 to 38, further comprising implanting the chip module in a card body and applying a graphic pattern to the card body by printing or laser etching, such that the graphic pattern complements or constitutes an extension of the design pattern on the chip module.

40. The method according to any one of claims 35 to 39, further comprising forming vias in the chip carrier tape for electrically connecting selected ones of the contact pads on the obverse side to circuitry on the bond side.

41. A method of manufacturing a smartcard, comprisingKLUNKER IP K710845providing a chip module according to any one of claims 23 to 29 or a chip module manufactured according to a method of any one of claims 35 to 40;implanting the chip module in a card body.

42. The method according to claim 41, further comprising applying a graphic pattern to the card body by printing, laser etching, or a combination thereof, such that the graphic pattern complements, blends in with, or constitutes an extension of the design pattern on the chip module.

43. The method according to claim 41 or 42, further comprising, prior to implanting the chip module, forming a recess in the card body and inkjet printing the recess to provide a coloured surface, the coloured surface being visible through non-metallised areas of the obverse side of the chip module after implantation.

44. The method according to any one of claims 41 to 43, wherein the card body comprises one or more layers of material selected from wood, ceramic, metal, leather, glass, or a combination thereof.

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