Electronics module unit with double sealing

WO2026201924A1PCT designated stage Publication Date: 2026-10-01AESCULAP AG
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
PCT/EP2026/058180
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-27
Filing Date
2026-03-23
Publication Date
2026-10-01

Smart Images

  • Figure EP2026058180_01102026_PF_FP_ABST
    Figure EP2026058180_01102026_PF_FP_ABST
Patent Text Reader

Abstract

The present disclosure relates to an electronics module unit (1) having a housing (2, 3) which has a first housing part (2) and a second housing part (3), and having an electronics module (4) which is accommodated in the housing (2, 3), wherein the first housing part (2) and the second housing part (3) enclose the electronics module (4) in cooperation with one another. According to the disclosure, the first housing part (2) and the second housing part (3) are integrally bonded to each other along the entire common contact surface thereof by means of at least two spatially separated sealing seams (5, 6).
Need to check novelty before this filing date? Find Prior Art

Description

[0001] AE2114P-WG-0004

[0002] 1 / 22

[0003] Electronic module unit with double sealing

[0004] Description

[0005] Technical field

[0006] The present disclosure relates to an electronic module unit (for medical purposes / applications) comprising a housing having a first housing part and a second housing part, and an electronic module which is received in the housing, wherein the first housing part and the second housing part cooperate with each other to enclose the electronic module (fluid-tight).

[0007] Background of the Revelation

[0008] In electronic module units of this type, the electronic module is typically a communication module, in particular a radio module, also referred to in the relevant technical field as a "radio beacon," which is housed in a fluid-tight enclosure. The radio module is designed to transmit radio waves from the interior of the enclosure, where it is located, to the surrounding environment of the electronic module unit. The radio module enclosed by the housing should therefore be able to receive and / or transmit radio waves, whereby the housing must, of course, be at least partially permeable to allow the transmission of radio waves.

[0009] Such electronic module units, which are equipped with a communication module or

[0010] Equipped with a radio module, these devices are used particularly in medical technology, for example, to be attached to a sterile container and / or a sterilization basket inserted or insertable within it, which holds medical products to be sterilized, especially medical instruments. The electronic module unit is typically attached to the sterile container (also known as a sterile goods container) or sieve basket via a mechanical interface provided on the housing (from the outside), preferably without tools (magnetically, by hook or adhesive strip, by clamps, clips, springs or straps, etc.). The AE2114P-WG-0004

[0011] 2 / 22

[0012] The electronic module unit, or radio module, is designed to transmit and / or receive radio waves before, during, and / or after the sterilization of the sterile container or sieve basket. This allows the radio module to gather information about the sterile container, such as its location, contents, and status (e.g., sterilized / cleaned / stored with monitoring of storage time). Steam sterilization is typically used for sterilization. Cleaning usually involves mildly alkaline to alkaline or enzymatic cleaning programs. Consequently, the environment in which the sterile container with the electronic module unit is located during the cleaning and sterilization process is, at least temporarily, a hot and humid environment.

[0013] Therefore, the housing of the electronic module unit must be sealed to the outside in such a way that no steam or moisture can penetrate the housing and damage the electronic module. Significant temperature fluctuations must also be taken into account, as these can lead to thermal stresses within the housing and corresponding heat distortion, which could potentially result in leaks. Contact between the electronic module and moisture could cause short circuits within the module.

[0014] During the sterilization process, the electronic module may be exposed to negative or positive pressure. Therefore, the housing should be robust enough to ensure that the seal completely prevents the ingress of steam or moisture, even under negative or positive pressure.

[0015] State of the art

[0016] In some cases, current technology uses a glass housing for a corresponding electronic module unit, which is then welded shut after the electronic module is inserted. Glass limits the freedom of choice regarding the shape and size of the housing. Furthermore, glass is fragile and requires additional protection against breakage.

[0017] Alternatively, plastic housings are used that are simply sealed in some way. The ingress of moisture (e.g., in the form of vapor) cannot be permanently prevented by the seal. The seal can be achieved, for example, by an adhesive bond, a screwed-on gasket, a clamp, or welding.

[0018] Another common method is to pot the electronic module, for example with two-component epoxy resin. Despite the potting layer surrounding the electronic module, moisture ingress to the module itself cannot be completely prevented. Furthermore, this method has the disadvantage that the potting compound can obscure LEDs or displays on the electronic module. Additionally, successful potting is difficult or impossible to verify during mass production of the electronic module units.

[0019] Another alternative solution based on the state of the art is to manufacture the housing from metal. Since metal shields the radio module's typically used frequency range, metal housings are equipped with externally routed antennas. This limits the design freedom for such metal housings, and mass production of these electronic module units is expensive. Status indicators, such as LEDs, would also need to be routed externally (e.g., via sterilizable data loggers). This is cumbersome and costly.

[0020] Summary of Revelation

[0021] The present disclosure therefore aims to provide an electronic module unit (for medical purposes or applications) that does not exhibit the disadvantages known from the prior art. In particular, the disclosure seeks to provide an electronic module unit (for medical purposes or applications) that offers maximum protection of the electronic module against moisture (even under pressure changes outside the electronic module unit) and is inexpensive and easy to manufacture. More specifically, the electronic module unit disclosed according to the disclosure (for medical purposes or applications) should enable effective protection of the electronic module against moisture during a cleaning and sterilization process. AE2114P-WG-0004

[0022] 4 / 22

[0023] This task is accomplished by the electronic module unit (medical or intended for medical purposes / applications) according to the main claim. Advantageous further developments are described in the dependent claims.

[0024] The disclosed electronic module unit (in particular a "radio beacon") (for medical purposes or applications) comprises a housing (transparent to radio waves, yet fluid-tight and resistant to chemicals (i.e., particularly mildly alkaline to alkaline or enzymatic cleaning), temperature, and pressure, with regard to medical cleaning and sterilization processes). The housing has a first housing part and a second housing part, or consists of the first and second housing parts. The electronic module unit further comprises an electronic module, which is configured in particular as a communication module, preferably as a radio module. The electronic module is housed within the casing, with the first housing part and the second housing part cooperating to (completely) enclose the electronic module. The housing parts can each form a housing half or be divided according to the lid-and-tub principle.The first housing part and the second housing part are connected to each other along their (complete) common (circumferential) contact surface by at least (in particular, exactly) two spatially separated sealing seams (without gaps or spaces), preferably by a material bond. In other words, (at least) two separately formed (essentially parallel) sealing seams are provided in the contact area between the first and second housing parts. The sealing seams each independently connect the first housing part completely to the second housing part. In other words, a double seal is provided between the first and second housing parts. In other words, the first housing part and the second housing part are fluid-tight, in particular by a material bond, connected to each other by the two separately formed sealing seams. AE2114P-WG-0004.

[0025] 5 / 22

[0026] According to generally accepted expert knowledge, the term "temperature and pressure resistant with regard to medical sterilization processes" can be understood to mean temperatures (in the sense of maximum temperatures) of approximately 110°C to 250°C, in particular temperatures up to 134°C, as well as pressures (in the sense of maximum pressures) of approximately 2 to 4 bar, in particular up to 3 bar.

[0027] The inclusion of two sealing seams between the first and second housing parts (almost) completely prevents the ingress of steam or moisture into the housing interior. This makes it possible to integrate moisture-sensitive electronics, such as an E-Ink display, into the electronic module. Thanks to these two sealing seams, the E-Ink ink of an E-Ink display is protected from mixing with moisture, especially water (vapor). The double sealing of the two housing parts prevents delamination of the electronic module's circuit board. Therefore, the electronic module unit can undergo multiple sterilization processes without moisture penetrating the housing and damaging the electronic module.This ensures a long service life for the electronic module unit as disclosed. Applying the two sealing seams between the two housing parts is simple and cost-effective.

[0028] It is advantageous if the first housing part is designed as a container, box, or case with a (e.g., rectangular or square) base and a surrounding wall. The second housing part could be designed as a lid that fits the first housing part and completely covers it. With this housing design, an electronic module can be arranged particularly well and efficiently within the housing, and the two sealing seams can be easily and quickly applied (after the electronic module has been placed inside the container) between the container and the lid.

[0029] Furthermore, it is advantageous if the first housing part and the second housing part have a sealing seam located on the inside and on the outside of the housing center along their common contact surface. If the two sealing seams are arranged relative to each other in this way, a tight connection between the first and second housing parts is particularly easy and reliable to achieve.

[0030] Furthermore, a step can be formed between the inner and outer sealing seams, so that the inner and outer sealing seams run on different planes with respect to the vertical direction. This type of spatial separation of the two sealing seams relative to each other is particularly easy to implement and guarantees a secure, tight connection between the first and second housing parts.

[0031] It is also advantageous if the step forms a positive-locking connection between the first and second housing parts. In other words, the second housing part engages (section by section) with the first housing part. In this way, the shape of the two housing parts themselves, in combination with the two sealing seams, ensures a tight connection between them.

[0032] Furthermore, it can be provided that the (circumferential) housing wall of the first housing part has a circumferential first step at its upper edge, defining an upper first step projection and a lower first step projection, and that the second housing part has a circumferential second step along its outer edge, which is complementary to the first step and has a lower second step projection and an upper second step projection, and that the inner sealing seam runs along the (circumferential) contact surface of the lower second step projection with the lower first step projection, and the outer sealing seam runs along the (circumferential) contact surface of the upper second step projection with the upper first step projection. AE2114P-WG-0004

[0033] 7 / 22

[0034] This arrangement of the two sealing seams relative to each other and to the housing parts is particularly advantageous and effective for ensuring a moisture-proof connection between the two housing parts.

[0035] It is advantageous if the first and / or second housing part(s) is / are transparent. This allows, for example, a display integrated into the electronic module to be seen through the housing from outside the electronic module unit. In another aspect, it is also advantageous if the first and / or second housing part(s) is / are translucent. This allows, for example, a status indicator integrated into the electronic module, such as an LED, to be seen through the housing from outside the electronic module unit. Similarly, optical signals emitted by the electronic module can be seen through the housing from the outside. In this context, transparency or translucency means the ability to transmit electromagnetic waves in at least the wavelength range in which the LED or display emits information (in the form of visible light).

[0036] Preferably, the housing is made of plastic. Manufacturing such a housing is correspondingly simple and cost-effective. Furthermore, plastic has the advantage that radio waves, which are emitted and / or received by the electronic module, for example, can pass through or be transmitted through the plastic. Providing the two sealing seams is particularly easy to implement when the housing (first and / or second housing part) is made of plastic.

[0037] It is further preferred if the housing, in particular the first housing part (on its outer side facing away from the electronic module), has a mechanical interface, e.g. a recess, rail, projection, etc., in order to be able to be arranged on a sterile container or on a sieve basket.

[0038] Preferably, the inner sealing seam is either an ultrasonic weld or a laser weld, and the outer sealing seam is preferably a laser weld (and not an ultrasonic weld). It is advantageous if, for technical reasons, only one of the sealing seams is designed as an ultrasonic weld. These types of sealing seams create a material-bonded connection between the first and second housing parts. Therefore, sealing seams designed in this way are particularly well-suited for sealing the housing against moisture. Furthermore, such sealing seams can be formed quickly and cost-effectively between the first and second housing parts.

[0039] If the internal seal is a laser weld, it is advantageous if at least one of the housing parts is transparent to laser light (i.e., transmittable for electromagnetic waves of the corresponding wavelength(s) of the laser light). This allows the laser to create the internal seal between the first and second housing parts. Simultaneously, it is advantageous if the second housing part is laser-absorbing (i.e., has sufficient opacity in the corresponding wavelength range of the laser light).

[0040] If both housing parts are transparent to laser light (e.g., transparent or translucent), it is advantageous to have a laser-impermeable or laser-absorbing (laser light-absorbing or opaque) element or coating at the sealing seams. Such a coating or element allows the laser energy to be converted into heat energy at the designated welding point (at the sealing seams).

[0041] In the case of two non-transparent housing parts, the position of the (internal) laser welding sealing seam can be determined via the focus of the laser beam or the intersection of several laser beams.

[0042] Alternatively, one of the sealing seams could be a weld (laser weld or ultrasonic weld) and the other an adhesive bond. AE2114P-WG-0004

[0043] 9 / 22

[0044] Furthermore, it is advantageous if the first housing part, in addition to its housing wall, has at least one support pillar projecting from its base and contacting the second housing part. Such a support pillar ensures that housing deflection during the sterilization process (especially under negative and positive pressure) is minimized. During the sterilization process, varying ambient pressures, up to and including a vacuum, prevail. Consequently, the housing may expand during sterilization, a phenomenon known as flexing. This flexing can stress the sealing seams. Significant flexing could damage the outer sealing seam and thus reduce its vapor tightness. The support pillar can absorb these compressive forces.This significantly reduces possible flexing movements of the housing, at least under overpressure during the sterilization process (with the same dimensions of the housing components).

[0045] Preferably, the support pillar is arranged as a (round) column in the center of the first housing part. In other words, the support pillar is preferably located centrally with respect to the housing wall of the first housing part. In this way, the support pillar can optimally support the second housing part against the first housing part and absorb compressive forces evenly.

[0046] It would also be conceivable to have several support pillars, for example two, on the first housing section. These support pillars should be evenly distributed with respect to their distance from the housing wall and from each other. These multiple support pillars together can absorb compressive forces particularly well.

[0047] Preferably, the electronic module, and in particular its circuit board, has a recess for the support pillar. This allows the electronic module to be positioned perfectly and easily within the housing.

[0048] It is further advantageous if at least one contact surface between the second housing part and the support pillar on the first housing part has at least one sealing seam. In other words, an additional sealing seam (in addition to the sealing seams already present between the first and second housing parts) is provided between the support pillar and the inner surface of the second housing part facing the support pillar. This (additional) sealing seam transforms the simple support pillar into a tension / compression pillar.

[0049] Accordingly, such a housing is particularly well protected against moisture ingress. More specifically, this sealing seam ensures a material-bonded connection (between the support pillar and the second housing part), thus enabling the support pillar to absorb the housing's flexing movements even under negative pressure during the sterilization process. In other words, when the support pillar is materially bonded to both housing parts, it can also absorb tensile forces, thereby reducing flexing movements even under negative pressure (for example, during the evacuation phase of the steam sterilization process).

[0050] Furthermore, the second housing part may be designed to have at least one reinforcing rib projecting from its inner surface facing the first housing part. This reinforcing rib strengthens the second housing part. Moreover, the support provided by the second housing part to the first housing part is particularly effective due to the interaction of the reinforcing rib and the supporting pillar. Consequently, such a housing can withstand deflection during the sterilization process particularly well and effectively, even under negative or positive pressure.

[0051] Another advantage of the support pillar (and the reinforcing rib in combination) is that both the base of the first housing part and the main surface of the second housing part can be designed to be significantly thinner (with much less pronounced ribs or without ribs at all), thus providing more space for batteries (primary cells) as a section of the electronic module despite the same overall height.

[0052] Against this background, it is possible that the support pillar has a first engagement structure on its upper side facing the second housing part, which is designed to be complementary to a second engagement structure, which is located on the AE2114P-WQ-0004

[0053] 11 / 22

[0054] The first and second engagement structures are arranged on the underside of the second housing part, facing the support pillar, with each interlocking. This interlocking creates a positive connection between the first and second housing parts. This interlocking design thus provides particularly effective support for the second housing part against the first.

[0055] The support pillar can also have a rectangular cross-section or, in particular, a cross-section adapted to the battery / accumulator. It is advantageous if each (horizontal) contact surface between the support pillar, especially between the first and second engagement structures, has a sealing seam. In this way, both housing parts are bonded together. This bonded connection ensures that the support pillar can absorb the flexural movements of the housing, even under negative pressure during the sterilization process.

[0056] It is also advisable for the electronic module itself to be (completely) surrounded or encased by an additional sealing layer. In this way, the sealing layer, in addition to the existing sealing seams, provides a further barrier against moisture for the electronic module.

[0057] The sealing layer can be, for example, a sealing lacquer, preferably an immersion lacquer, particularly a silicone-based lacquer, or a parylene coating. To coat the electronic module with the immersion lacquer, the electronic module is completely immersed in the lacquer. Once the sealing layer has cured, the coated electronic module can be placed in the housing or on the base of the first housing part.

[0058] The sealing layer can alternatively be implemented as a potting compound (1k / 2k epoxy resin / silicone etc.) of the electronic module, instead of a sealing lacquer. AE2114P-WQ-0004

[0059] 12 / 22

[0060] It would also be beneficial to include silicate inside the housing. This silicate would allow for the absorption of any residual moisture present from the production process of the electronic module unit.

[0061] For the electronics module, it would be conceivable to use passive RFID or active RFID with battery or primary cell and / or active Bluetooth Low Energy and / or NFC and / or UWB, WIFI, Zigbee, etc. as a communication method.

[0062] Passive communication technologies for the electronic module are also conceivable. This allows for higher temperatures during the manufacturing process of the electronic module unit.

[0063] Preferably, the two sealing seams are spaced parallel to each other.

[0064] It is advantageous if a step is provided between the two sealing seams, so that the two sealing seams are provided on different levels with respect to the vertical direction.

[0065] It is preferred if the two sealing seams are spaced parallel to each other and a step is provided between the two sealing seams.

[0066] Brief description of the characters

[0067] Fig. 1 A shows a cross-section of the electronic module unit according to a first embodiment as disclosed;

[0068] Fig. 1B shows a top view of the first housing part of the electronic module unit according to the disclosure in the first embodiment;

[0069] Fig. 1 C shows a top view of the second housing part of the electronic module unit according to the disclosure of the first embodiment AE2114P-WQ-0004

[0070] 13 / 22

[0071] Fig. 2 shows a cross-section of the electronic module unit according to a second embodiment as disclosed; and

[0072] Fig. 3 shows a cross-section of the electronic module unit according to a third embodiment as disclosed.

[0073] The following are preferred aspects of the present revelation, based on the associated figures. The figures are merely examples.

[0074] Fig. 1A shows a cross-section of the electronic module unit 1 according to a first embodiment. The electronic module unit 1 has a housing 2, 3. The housing 2, 3 is divided into a first housing part 2 and a second housing part 3. An electronic module 4 is arranged in the housing 2, 3. It can be seen that the first housing part 2 and the second housing part 3 cooperate to (completely) enclose the electronic module 4.

[0075] The first housing part 2 and the second housing part 3 are joined to each other along their common contact surface by at least two spatially separated sealing seams 5, 6 (material-bonded). The two sealing seams 5, 6 are subdivided into a sealing seam 5 located inside the center of the housing and a sealing seam 6 located outside the center of the housing.

[0076] The first housing part 2 is designed in the manner of a container with a base 2.1 and a surrounding housing wall 2.2 extending from it. The second housing part 3 is designed in the manner of a lid. The second housing part 3, designed as a lid, completely covers an upper opening of the first housing part 2 defined by the housing wall 2.2.

[0077] The housing wall 2.2 has a first step 2.3. The first step 2.3 is provided as a notch in the upper edge of the housing wall 2.2. The first step 2.3 extends around the entire housing wall 2.2 (without interruption). AE2114P-WQ-0004

[0078] 14 / 22

[0079] The first stage 2.3 has an L-shaped cross-section. The first stage 2.3 has an upper first stage projection 2.3a and a lower first stage projection 2.3b. The upper first stage projection 2.3a and the lower first stage projection 2.3b are parallel to each other and extend in the horizontal direction H. The upper first stage projection 2.3a defines the upper edge of the housing wall 2.2. Accordingly, the lower first stage projection 2.3b is recessed relative to the upper first stage projection 2.3a in the direction towards the base 2.1.

[0080] The second housing part 3 has a second step 3.1 along its circumferential outer edge. The second step 3.1 is complementary to the first step 2.3. Thus, the first housing part 2 and the second housing part 3 interlock positively with each other by means of the steps 2.3 and 3.1. The second step 3.1 extends along the entire circumferential outer edge of the second housing part 3. The second step 3.1 also has an L-shaped cross-section. The second step 3.1 has a lower second step projection 3.1a and an upper second step projection 3.1b. The lower second step projection 3.1a and the upper second step projection 3.1b are parallel to each other and each extend in the horizontal direction H. The upper second step projection 3.1b is recessed relative to the lower second step projection 3.1 with respect to an outer surface of the second housing part 3 facing away from the first housing part 2.

[0081] The lower second step projection 3.1a rests directly on the lower first step projection 2.3b. The upper second step projection 3.1b rests directly on the upper first step projection 2.3a. Accordingly, the inner sealing seam 5 is provided / arranged along the contact surface of the lower second step projection 3.1a with the lower first step projection 2.3b. The outer sealing seam 6 is provided / arranged along the contact surface of the upper second step projection 3.1b with the upper first step projection 2.3a.

[0082] Fig. 1B shows a top view of the first housing part 2 of the electronic module unit 1 according to the disclosure, based on the first embodiment (viewed from above or from the opening). It is clearly visible here that the AE2114P-WQ-0004

[0083] 15 / 22

[0084] The first step 2.3 forms the housing wall 2.2. The lower first step projection 2.3b is positioned further inward with respect to the housing center than the upper first step projection 2.3a. The lower first step projection 2.3b is directly adjacent to the upper first step projection 2.3a. It can be seen that both the lower first step projection 2.3b and the upper first step projection 2.3a are provided circumferentially (i.e., along the entire housing wall 2.2).

[0085] Fig. 1C shows a top view of the second housing part 3 of the electronic module unit 1 according to the first embodiment (viewing the underside or inside of the second housing part 3). The lower second step projection 3.1a is located further inward than the upper second step projection 3.1b with respect to a center point of the second housing part 3. The lower second step projection 3.1a is directly adjacent to the upper second step projection 3.1b. It can be seen that both the lower second step projection 3.1a and the upper second step projection 3.1b are provided circumferentially (i.e., along the entire circumferential outer edge of the second housing part 3).

[0086] Fig. 2 shows a cross-section of the electronic module unit 1 according to a second embodiment. In contrast to the first embodiment, a support pillar 7 is provided on the first housing part 2. Furthermore, in contrast to the first embodiment, a reinforcing rib 8 is provided on the second housing part 3. Apart from this, the electronic module unit 1 according to the second embodiment does not differ (significantly) from the electronic module unit 1 according to the first embodiment. Accordingly, the differences between the electronic module unit 1 according to the second embodiment and the electronic module unit 1 according to the first embodiment are discussed in detail.

[0087] The support pillar 7 extends vertically upwards from the base 2.1. Thus, the support pillar 7 extends in the vertical direction V. Preferably, the support pillar 7 is positioned (as far as possible) centrally with respect to the distance to the housing wall 2.2. The upper surface of the support pillar 7 does not project beyond the upper edge of the housing wall 2.2. Preferably, the support pillar 7 is designed as a (circular) cylinder. The electronic module 4, in particular its circuit board 4.1, has a recess at the location where the support pillar 7 is provided.

[0088] The reinforcing rib 8 extends from the inner side / underside of the second housing part 3, facing the first housing part 2, towards the first housing part 2. Thus, the reinforcing rib 8 also extends in the vertical direction V. The underside of the reinforcing rib 8 contacts the top side of the support pillar 7.

[0089] In the second embodiment, the support pillar 7 is provided with a first engagement structure 9. The reinforcing rib 8 is provided with a second engagement structure 10. The first engagement structure 9 and the second engagement structure 10 are complementary to each other (in terms of size and shape). In other words, the first engagement structure 9 and the second engagement structure 10 interlock like puzzle pieces. In this case, the first engagement structure 9 is designed as a projection. The second engagement structure 10 is designed as a recess / recess.

[0090] More specifically, the first engagement structure 9 extends upwards (in the vertical direction V) from the end section 7.1 of the support pillar 7 in a projecting manner. The upper surface of the first engagement structure 9 defines the upper surface of the support pillar 7. From the end section 8.1 of the reinforcing rib 8, the recess-like second engagement structure 10 extends away from the support pillar 7 (inwards). The outer surface / underside of the end section 8.1 of the reinforcing rib 8 contacts the outer surface / upper surface of the end section 7.1 of the support pillar 7 along a contact surface. An (annular) sealing seam 11 is formed along this contact surface.

[0091] The upper surface of the end section 7.1 is at the same level or extends in the same plane as the lower first step projection 2.3b. The upper surface of the first engagement structure 9 is at the same level as the upper first step projection 2.3a. Furthermore, an additional sealing seam 12 is formed at the point where the upper surface of the first engagement structure 9 contacts the inner surface of the second engagement structure 10. The two sealing seams 11, 12 between support pillar 7 and reinforcing rib 8 ensure a material-bonded connection between the first and second housing parts 2, 3 at this point. The sealing seams 11, 12 are provided in addition to the sealing seams 5, 6 between the housing wall 2.2 and the outer edge of the second housing part 3.

[0092] Electronic module 4 includes the circuit board with electronics 4.1. Furthermore, electronic module 4 includes a battery / accumulator 4.2.

[0093] Fig. 3 shows a cross-section of the electronic module unit 1 according to a third embodiment. In contrast to the first embodiment, a support pillar 7 is provided on the first housing part 2. Apart from this, the electronic module unit 1 according to the third embodiment does not differ (significantly) from the electronic module unit 1 according to the first embodiment.

[0094] Accordingly, particular attention is paid to the differences between the electronic module unit 1 according to the third embodiment and the electronic module unit 1 according to the first embodiment.

[0095] The support pillar 7 of the electronic module unit 1 according to the third embodiment corresponds to the support pillar 7 of the electronic module unit 1 according to the second embodiment, except that the support pillar 7 of the electronic module unit 1 according to the third embodiment does not have a first engagement structure 9.

[0096] Accordingly, the upper surface of the support pillar 7 is flat / smooth. The upper surface of the support pillar 7 contacts the underside of the second housing part 3 at a contact surface. This contact surface has a sealing seam 13. This sealing seam 13 creates a material-bonded connection between the support pillar 7 and the second housing part 3.

[0097] The top of support pillar 7 lies on the same level or is at the same height as the lower first step projection 2.3b.AE2114P-WG-0004

[0098] 18 / 22

[0099] List of reference symbols

[0100] 1 electronic module unit

[0101] 2 first housing part

[0102] 2.1 Floor

[0103] 2.2 Housing wall

[0104] 2.3 first stage

[0105] 2.3a upper first step projection

[0106] 2.3b lower first step projection

[0107] 3 second housing part

[0108] 3.1 second stage

[0109] 3.1a lower second step lead

[0110] 3.1b upper second step projection

[0111] 4 Electronic module

[0112] 4.1 Circuit board with electronics

[0113] 4.2 Battery / Rechargeable Battery

[0114] 5 internal sealing seam

[0115] 6 external sealing seam

[0116] 7 support pillars

[0117] 7.1 End section of the support pillar

[0118] 8 reinforcing ribs

[0119] 8.1 End section of the reinforcing rib

[0120] 9 first intervention structure

[0121] 10 second intervention structure

[0122] 11 Sealing seam between end sections 7.1, 8.1

[0123] 12 Sealing seam between first and second engagement structure 13 Sealing seam between support pillar and second housing part

[0124] H Horizontal direction

[0125] V Vertical direction

Claims

Claims 1. Electronic module unit (1) designed and adapted for a medical sterilization process, comprising a housing (2, 3) having a first housing part (2) and a second housing part (3), and an electronic module (4) received in the housing (2, 3), wherein the first housing part (2) and the second housing part (3) cooperate to enclose the electronic module (4), characterized in that the first housing part (2) and the second housing part (3) are joined together along their entire common contact surface by at least two spatially separated sealing seams (5, 6) in a material-bonded manner.

2. Electronic module unit (1) according to claim 1, wherein the sealing seams (5, 6) form an inner sealing seam (5) with respect to the interior of the housing and an outer sealing seam (6) with respect to the interior of the housing.

3. Electronic module unit (1) according to claim 2, wherein a step is provided between the inner sealing seam (5) and the outer sealing seam (6) such that the inner sealing seam (5) and the outer sealing seam (6) are each arranged on different planes with respect to the vertical direction (V).

4. Electronic module unit (1) according to one of claims 2 or 3, wherein a housing wall (2.2) of the first housing part (2) has a circumferential first step (2.3) along its upper edge, which has an upper first step projection (2.3a) and a lower first step projection (2.3b), and the second housing part (3) has a circumferential second step (3.1) along its outer edge, which is complementary to the first step (2.3) and has a lower second step projection (3.1a) and an upper second step projection (3.1b), and the inner sealing seam (5) runs along a contact surface of the lower second step projection (3.1a) with the lower first step projection (2.3b) and the outer sealing seam (6) runs along a contact surface of the upper second step projection (3.1b) with the upper first step projection (2.3a).

5. Electronic module unit (1) according to one of claims 2 to 4, wherein the inner sealing seam (5) and the outer sealing seam (6) are each a laser weld seam, or one of the inner sealing seams (5) and the outer sealing seam (6) is a laser weld seam and the other sealing seam (5, 6) is an ultrasonic weld seam.

6. Electronic module unit (1) according to one of claims 1 to 5, wherein the first housing part (2) has, in addition to its housing wall (2.2), at least one support pillar (7) projecting from its base (2.1) and contacting the second housing part (3).

7. Electronic module unit (1) according to claim 6, wherein at least one contact surface between the second housing part (3) and the support pillar (7) on the first housing part (2) has at least one sealing seam (11, 12, 13).

8. Electronic module unit (1) according to claim 6 or 7, wherein the second housing part (3) has at least one reinforcing rib (8) projecting from its inner side facing the first housing part (2), which cooperates with the support pillar (7) on the first housing part (2) to support the second housing part (3) on the first housing part (2).

9. Electronic module unit (1) according to claim 8, wherein the support pillar (7) has on its upper side facing the reinforcing rib (8) a first engagement structure (9) which is designed to be complementary to a second engagement structure (10) which is arranged on the lower side of the reinforcing rib (8) facing the support pillar (7), and the first intervention structure (9) and the second intervention structure (10) interlock.

10. Electronic module unit (1) according to claim 1, wherein the electronic module (4) itself is surrounded by a sealing layer.

11. Electronic module unit (1 ) according to claim 1 , wherein the sealing seams (5, 6) are spaced parallel to each other.

12. Electronic module unit (1) according to claim 1, wherein a step is provided between the sealing seams (5, 6) such that the two sealing seams (6) are each arranged on different planes with respect to the vertical direction (V).

13. Electronic module unit (1) according to claim 11 and claim 12, wherein the sealing seams (5, 6) are spaced parallel to each other and the step is provided between the two sealing seams (5, 6).