Method for processing a multilayer laminate and processing line

Abstract

The present invention relates to a method for processing a multilayer laminate (1), wherein the multilayer laminate (1) comprises at least a first layer (2) and a second layer (3) coupled via an adhesive (4) distributed according to an adhesive pattern, comprising the steps of :a) providing said multilayer laminate (1) in web form, b) guiding the multilayer laminate (1) in motion at a multilayer laminate linear speed (V1) towards a cutting area (5), c) generating a laser beam having a selected wavelength, d) during the movement of the multilayer laminate (1) through the cutting area (5), directing the laser beam towards the first layer (2) in the cutting area (5) to cut the first layer (2) along a cutting path corresponding to the boundaries of the adhesive pattern, avoiding cutting the second layer (3), wherein the first layer (2) is cut into shaped portions (7) corresponding to the adhesive pattern and into scrap portions (8), e) supplying a covering film (6) in web form, f) guiding in motion the covering film (6) sliding with a covering film linear speed (V2) towards the cutting area (5), g) superimposing the covering film (6) in contact with the multilayer laminate (1) so that the covering film (6) is resting on the multilayer laminate (1) at least in the cutting area (5), wherein, during step d), the laser beam is incident on the covering film (6) and passes through the covering film (6), while cutting the first layer (2) along the cutting path, wherein, at least in the cutting area (5), the covering film linear speed (V2) is equal to the multilayer laminate linear speed (V1).

Description

METHOD FOR PROCESSING A MULTILAYER LAMINATE AND PROCESSING LINEDESCRIPTION

[0001] . Field of the invention

[0002] . The present invention relates to a method for processing a multilayer laminate and a processing line for a multilayer laminate, wherein the multilayer laminate is a web comprising a first layer foil coupled to a second layer or substrate via an adhesive distributed according to an adhesive pattern.

[0003] . Background art

[0004] . It is known to use multi-layer laminates, for example, multi-layer flexible sheets or films made as a web, for a multiplicity of applications and products.

[0005] . The production of webs of multilayer laminates wound into reels is known in the packaging sector, in the electronics sector in the form of flexible circuits for sensors or for radiofrequency identification (RFID) antennas or for electrical resistors, and further in the label sector. Multilayer laminates may comprise one or more layers connected and supported by one or more support substrates. The layers and substrates may be made of a plurality of combinations, such as, for example, polymer films, paper films, or metal films.

[0006] . Multilayer laminates may be made via reel-to-reel manufacturing processes, wherein one or more layers are supplied wound on respective reels to be unwound for subsequent processing, for example laminated, shaped, or separated by continuously sliding the material to be processed or the processed material from one roller to another, to be rewound into reels after processing, allowing continuous processing and reducing production costs.

[0007] . To increase the production speed of the multilayer laminates, while maintaining high precision and reducing the environmental impact, laser cutting stations are used to cut or partially score the multilayer laminates. The laser cutting stations may comprise at least one laser source for generating a laser beam and a galvanometric head, or galvanometric scanner, configured to direct the laser beam at very high speed towards a work area on the multilayer laminate to cut or score it.

[0008] . It is known to slide a first layer or a support substrate through an adhesive distribution station, wherein an adhesive is distributed on the surface of the first layer or of the support substrate according to a predetermined distribution pattern, for example wherein the adhesive is distributed via flexography or via digital printing, and downstream of the adhesive distribution station, the first layer and the support substrate are coupled into a laminate or multi-layer film via the adhesive in a coupling station, for example a calender that may be heated or cooled. Downstream of the coupling station, the multi-layer film slides through a laser cutting station to cut the first layer according to a pattern corresponding to the boundaries of the predetermined distribution pattern of the adhesive, withoutcutting the substrate. The first layer will thus be cut into shaped portions coupled to the substrate via the adhesive distributed according to the predetermined adhesive distribution pattern, and scrap portions which must be separated from the substrate and which are not bonded to the substrate via the adhesive. Downstream of the laser cutting station, the laser-cut multilayer laminate slides into a removal station wherein the scrap portions are removed from the substrate, for example via air knives and suction devices for the scrap portions.

[0009] . A solution of this type is known, for example, from document EP0790123, wherein a metal foil is coupled to a substrate by interposition of an adhesive layer distributed according to a predefined pattern, the metal foil is subsequently laser cut along the boundaries of the predefined pattern of the adhesive layer, and subsequently the scrap portions of the metal foil are removed from the substrate, obtaining a multilayer laminate with shaped portions of metal foil coupled to the substrate film, wherein the shaped portions of metal foil may form respective antennas for RFID identifiers.

[0010] . In these solutions, the laser cutting of the first layer occurs during the linear sliding of the multilayer laminate at a scanning and cutting speed, by virtue of the laser head or galvanometric scanner, much greater with respect to the linear sliding speed of the multilayer laminate.

[0011] . The multilayer laminate is conveyed at the linear sliding speed into the cutting station, and during laser cutting it has been observed that some portions of the first layer may lift, for example curling, with respect to the surface of the substrate, or also with respect to the adhesive distributed according to the predefined pattern. The lifting of portions of the first layer during cutting may for example be caused by friction with the air due to the sliding speed of the multilayer laminate, or due to suction air flows of laser ablation fumes that may be present in the laser cutting station, or else due to elastic tensions between the coupled layers of the laminate conveyed in the machine, for example elastic tensions due to different elastic characteristics, or elastic tensions due to a difference in tensioning of the first layer web and the substrate web to ensure the transport and / or the advancement of the two webs in the machine, or else elastic tensions due to overheating of the first layer during laser cutting.

[0012] . In these solutions, it has been observed that, especially in the more peripheral portions of the working area of the laser beam, the portions of the first layer that lift during laser cutting may be interposed between the laser beam and the laser cutting point and may lead to undesired delaminations of the first layer with respect to the adhesive layer or with respect to the substrate.

[0013] . Consequently, the portions of first layer that lift during laser cutting may obstruct the laser beam and prevent the laser beam from cutting the first layer along the predefined path, generating defects in the cutting path that maintain connecting bridges between the portions of first layer to be removed and the portions of first layer bonded to the substrate via the adhesive pattern.

[0014] . These defects in the cutting path and these undesired connecting bridges may, on the one hand, make the removal of the portions of the first layer to be removed difficult or inefficient viasuction in the collection stations or via the air knives, or via mechanical cleaning, and on the other hand, may generate defects on the boundaries of the portions of the first layer, thereby obtaining semi-finished products that cannot be used and, consequently, must be selected and discarded.

[0015] . To solve this problem, solutions are known wherein the adhesive for laminating or coupling the first layer and the substrate, in addition to being distributed according to the predefined distribution pattern corresponding to the portions of the first layer that are to be cut and remain bonded to the substrate, is also distributed at discrete points in a plurality of adhesion or bonding points to keep, once cut, the portions of the first layer that are to be removed from the substrate and discarded partially bonded to the substrate. Thereby, during the laser cutting and after the laser cutting of the first layer with respect to the boundaries of the adhesive pattern, the first layer portions external to the adhesive pattern are free of connections and completely separated from the first layer portions corresponding to the adhesive pattern, remaining, albeit partially, connected to the substrate via the discrete adhesion points. Thereby, it is possible to counteract the undesired lifting, during laser cutting, of the portions of first layer that must be removed after cutting, allowing uninterrupted laser cutting on the first layer along the pattern corresponding to the adhesive pattern. A solution of this type is, for example, known from the document EP2856848.

[0016] . This solution, although satisfactory in certain respects, makes the set-up step of the production line longer and more costly, since the definition and distribution of the discrete adhesive bonding points is highly dependent on the nature and thicknesses of the layer and substrate materials in coupling and on the cutting outline of the final product, increasing production costs and production times. Further, this solution does not reduce the risk of delamination due to undesired lifting of the portions of first layer that are coupled to the substrate via the predefined pattern of the adhesive and shaped correspondingly to the predefined pattern of the adhesive layer, during the linear sliding of the multilayer laminate through the laser cutting station.

[0017] . Further, this solution, renders the separation of the first-layer portions to be separated from the substrate more difficult, such portions being partially connected to the substrate via adhesion points, which, if not precisely balanced and positioned, may be sufficient to prevent detachment in the removal station, thereby generating unusable semi-finished products.

[0018] . Further, this solution makes many empirical tests necessary before finding the combination of the arrangement and distribution of the adhesive bonding points that enable correct separation of the scraps of the first layer, which on the one hand generate many initial production scraps in the set-up of the machine, and on the other hand make the presence of personnel with field experience necessary for assessing how to modify the bonding parameters to obtain an acceptable result of separation of the scraps of the first layer from the substrate.

[0019] . Therefore, there is a need in the field to process a multilayer laminate, by laser cutting afirst layer with respect to a second layer or substrate of the multilayer laminate along cutting lines corresponding to the boundaries of a pattern of adhesive material applied between the first layer and the substrate, in a precise and efficient manner, reducing risks of production errors with respect to the prior art, and reducing production costs with respect to the prior art.

[0020] . Solution

[0021] . The present invention aims to provide a method for processing a multilayer laminate.

[0022] . This and other objects and advantages are achieved by a processing method and a processing line according to the independent claims.

[0023] . Certain advantageous embodiments are the subject of the dependent claims.

[0024] . From the analysis of this solution, it has emerged that the proposed solution makes it possible to process a multilayer laminate, in web form, comprising a first layer coupled to a second layer via an adhesive distributed according to an adhesive pattern, in linear movement towards a cutting area for cutting, with a laser beam, the first layer into shaped portions and scrap portions along continuous cutting paths, by virtue of the provision of a covering film, in web form, superimposed in contact with the multilayer laminate during laser cutting, in linear movement at the same linear speed as the multilayer laminate, preventing the scrap portions of the first layer from lifting with respect to the second layer during cutting, wherein the laser beam is incident on the covering film and passes through the covering film without cutting or perforating it, cutting the first layer.

[0025] . Further, the proposed solution makes it possible to prevent the lifting of the scrap portions of the first layer during laser cutting, without the need for setting up processing operations dependent on personnel and experience, in a simple and effective way, by placing a covering film on the first layer of the multilayer laminate and moving the covering film and the multilayer laminate at the same linear speed in the laser cutting area, wherein the covering film transmits the selected wavelength of the laser beam, substantially without absorbing it, so that the laser beam is focused on the first layer for cutting it and the covering film is traversed by the laser beam preferably without being cut or perforated and the covering film forms a physical barrier that prevents the scrap portions of the first layer from lifting with respect to the second layer.

[0026] . Further, the proposed solutions make it possible to obtain multilayer laminates with laser-cut first layer shaped portions coupled to the second layer without defects, and first layer scrap portions completely separated from the first layer shaped portions after laser cutting, which may be removed from the second layer with very high efficiency, without generating production scraps.

[0027] . According to an aspect, the laser-cut first layer shaped portions are made of conductive material, for example metal, and are coupled to a flexible substrate, allowing the manufacture of semifinished webs for printed electronic devices.

[0028] . Figures

[0029] . Further features and the advantages of the processing method and of the processing line will become apparent from the description set forth below of preferred embodiments thereof, given by way of non-limiting example, with reference to the accompanying drawings, in which:

[0030] . - Figure 1 schematically shows a detail of a processing line of a multilayer laminate for processing the multilayer laminate according to processing methods of the prior art, wherein the multilayer laminate in web form comprises a first layer and a second layer coupled with an adhesive distributed according to an adhesive pattern, wherein the multilayer laminate is moved into a cutting area of a laser cutting station, wherein some scrap portions of first layer are lifted, at least along the boundaries, with respect to the second layer and / or with respect to the adhesive, subsequent to or during laser cutting, which may cause undesired delamination defects and laser cutting line interruption defects,

[0031] . - Figure 2 schematically shows a processing line of a multilayer laminate for processing the multilayer laminate in accordance with the method of the present invention, wherein a multilayer laminate, in web form, comprising a first layer and a second layer coupled with an adhesive distributed according to an adhesive pattern, is moved at a multilayer laminate linear speed towards a cutting area of a laser cutting station, wherein a film or covering film, in web form, is moved at a covering film linear speed towards the cutting area and superimposed, resting on the multilayer laminate in the cutting area, wherein the laser cutting station comprises a laser source configured to generate a laser beam at a selected wavelength and a galvanometric laser head or galvanometric scanner, configured to direct the laser beam in the cutting area towards the multilayer laminate to cut the first layer along a cutting line corresponding to the boundaries of the adhesive pattern, without cutting the second layer, wherein the laser beam is incident on the covering film and passes through the covering film without cutting it along a continuous line, wherein the multilayer laminate linear speed is equal to the covering film linear speed at least in the cutting area so that the multilayer laminate and the covering film are conveyed linearly through the cutting area in contact one on the other at the same speed, wherein downstream of the cutting area the covering film is deflected from the multilayer laminate, interrupting contact between the covering film and the multilayer laminate, wherein downstream of the cutting area the scrap portions of the first layer are removed from the second layer, for example in a removal station comprising, for example, air knives, so that the multilayer laminate may slide downstream of the removal station with only the shaped portions of the first layer, corresponding to the adhesive pattern, coupled to the second layer;

[0032] . - Figure 3 diagrammatically shows the processing line in Figure 2, wherein the covering film is unwound from a reel of covering film upstream of the cutting area, and is rewound onto a reel of covering film downstream of the cutting area;

[0033] . - Figure 4 diagrammatically shows the processing line in Figure 2, wherein the coveringfilm is a continuous and endless web moved along a closed path, at the inlet and at the outlet of the cutting area, allowing the multilayer laminate to be processed without winding and unwinding the covering film, but providing a covering web that extends along a closed path, and continuously moving the web of covering film under tension along a closed path;

[0034] . - Figure 5 diagrammatically shows the processing line in Figure 2, wherein the covering film is unwound from a covering film reel upstream of the cutting area, and is rewound onto a covering film reel downstream of the cutting area, wherein during the laser cutting of the multilayer laminate, the covering film, during the laser cutting of the first layer, is partially thermally degraded or partially melted by the heat generated by the laser cutting of the first layer, preferably without creating holes or cuts in the covering film, wherein the partial melting or thermal degradation of the covering film form adhesion points with the first layer along the portions around the cutting path, allowing the scrap portions to remain attached to the covering film when the covering film is lifted from the multilayer laminate, removing the contact, or wherein the covering film is electrostatically charged, for example with a corona treatment, so that downstream of the cutting area, when the covering film is lifted from the multilayer laminate, by removing the contact, the scrap portions remain attached to the covering film;

[0035] . - Figure 6 diagrammatically shows the processing line in Figure 2, wherein the first layer or the first-layer foil is unwound from a first-layer reel and the substrate or second layer is unwound from a substrate reel, wherein the first layer is moved at a first-layer linear speed V3 towards a coupling station, for example a calender, wherein the substrate is moved at a substrate linear speed V4 through an adhesive distribution station and towards the coupling station, so that the first layer and the second layer are laminated, forming the multilayer laminate, wherein the first-layer linear speed V3 is equal to the substrate linear speed V4, and in the cutting area the first-layer linear speed V3 and the substrate linear speed V4 are equal to the covering film linear speed, wherein the covering film is superimposed, in contact with the first layer, while passing through the coupling station, without providing adhesive layers between the first layer and the covering film;

[0036] . - Figure 7 diagrammatically shows a processing line for materials in web form being moved from left to right to process a multilayer laminate according to the method of the present invention, wherein a substrate or second layer is supplied in motion towards a coupling or lamination area, wherein an adhesive is distributed according to an adhesive pattern on the second layer, wherein the adhesive pattern may comprise a first adhesive pattern and a second adhesive pattern which form the adhesive coupling base for the shaped semi-finished portions of the first layer and for the reference shaped portions of the first layer for subsequent processing, wherein an ink is distributed according to an ink pattern on at least one side portion of the second layer, wherein the ink pattern defines an alignment reference for laser cutting, wherein a first layer is supplied in motion towards the coupling area and is coupled to the second layer via the adhesive pattern forming a multilayer laminate, leavingthe at least one lateral freely exposed portion of the second layer, wherein a covering film is supplied in motion so as to be superimposed in contact with the first layer of the multilayer laminate towards a cutting area of a laser cutting station, wherein in the cutting area a laser beam cuts the first layer along cutting lines corresponding to the boundaries of the adhesive pattern, passing through the covering film, without cutting the covering film and preferably without cutting the second layer, wherein downstream of the cutting area the covering film is moved away from the laser-cut multilayer laminate, wherein downstream of the cutting area the laser-cut multilayer laminate is processed so that the scrap portions of the first layer, namely the portions of first layer cut and not bonded to the second layer along the boundaries of the adhesive pattern, are removed from the second layer, for example via air knives and / or mechanical cleaning means and / or by partial bonding with the covering film, wherein downstream of the removal of the scrap portions of the first layer, the multilayer laminate comprising the second layer with the shaped portions of first layer, namely the portions of first layer that have been laser cut and that are bonded to the second layer via the adhesive pattern, continues in motion to be further processed or wound onto a reel;

[0037] . - Figure 8 diagrammatically shows a processing line for materials in web form moving from left to right to process a multilayer laminate according to the method of the present invention, wherein a substrate or second layer is supplied moving towards a coupling or lamination area, wherein an adhesive is distributed according to an adhesive pattern on a central portion of the second layer, wherein an ink is distributed in accordance with an ink pattern on the side portions of the second layer, wherein the ink is a pigmented adhesive so that the ink pattern is configured to form both an alignment reference for laser cutting and to form an adhesive coupling, preferably wherein the adhesive is also a pigmented adhesive so that it is possible to distribute the adhesive according to the adhesive pattern on the central portion of the second layer and according to the ink pattern on the side portions of the second layer, wherein a first layer is supplied moving towards the coupling area and is coupled to the second layer via the adhesive pattern, leaving freely exposed the side portions of the second layer on which the ink pattern is present, forming a multilayer laminate, wherein a covering film is supplied moving so as to be superimposed in contact with the first layer of the multilayer laminate towards a cutting area of a laser cutting station, wherein the covering film is superimposed in contact with the first layer and is coupled via the ink pattern to the side portions of the second layer, wherein the covering film is at least partially transparent to the vision system of the laser station so that the vision system detects the ink pattern under the covering film, wherein in the cutting area a laser beam cuts the first layer along cutting lines corresponding to the boundaries of the adhesive pattern, passing through the covering film, without cutting the second layer and preferably without cutting the covering film, wherein downstream of the cutting area the laser-cut multilayer laminate is trimmed in a trimming station, cutting the strips of covering film glued to the side portions of the second layer at the second adhesive pattern,wherein downstream of the trimming station the remaining covering film - and superimposed in contact with the laser-cut first layer and coupled to the central portion of the second layer with the adhesive pattern - is moved away from the laser-cut multilayer laminate, wherein downstream of the trimming station the laser-cut multilayer laminate is processed so that the scrap portions of the first layer, namely the portions of first layer cut and not glued to the second layer along the boundaries of the adhesive pattern, are removed from the second layer, for example via air knives and / or mechanical cleaning means and / or by partial gluing with the covering film, wherein downstream of the removal of the scrap portions of the first layer, the multilayer laminate comprising the second layer with the shaped portions of first layer proceeds in movement, namely the portions of first layer that have been laser-cut and that are glued to the second layer via the adhesive pattern, to be further processed or wound onto a reel;

[0038] . - Figure 9 diagrammatically shows a processing line of the present invention.

[0039] . Description of some preferred embodiments

[0040] . In accordance with a general operating mode, a method for processing a multilayer laminate 1 is provided. The multilayer laminate 1 comprises at least a first layer 2 and a second layer (or substrate) 3 coupled via at least one adhesive 4 distributed according to an adhesive pattern. In an embodiment, the adhesive 4 is distributed according to the adhesive pattern delimited by boundaries of the adhesive pattern, so as to define a plurality of shaped portions 7 of the first layer 2 connected via the adhesive 4 to the second layer 3, and a plurality of scrap portions 8 of the first layer 2 not connected to the second layer 3 via the adhesive 4. Adhesive pattern means a pattern or arrangement for distributing the adhesive 4 between the first layer 2 and the second layer 3, defining portions in which the adhesive 4 is present and which are delimited by at least one adhesive pattern boundary, to form the shaped portions 7, and portions devoid of the adhesive 4, to form the scrap portions 8. The adhesive pattern may be a pattern or arrangement of distribution of the adhesive 4 between the first layer 2 and the second layer 3, which is repeated in a predetermined way, either constantly or with predetermined variations. In an embodiment, the adhesive pattern is a predetermined pattern. In an embodiment, the adhesive pattern comprises the adhesive distributed continuously within the at least one adhesive pattern boundary. In an embodiment, the adhesive pattern comprises adhesive distributed non-continuously, for example at discrete points or in stripes, within the at least one adhesive pattern boundary. In an embodiment, the adhesive 4, being distributed according to an adhesive pattern, defines adhesive areas and non-adhesive areas between the first layer and the second layer, wherein the adhesive areas are delimited by the boundaries of the adhesive pattern. The adhesive areas are configured to connect, via the adhesive, the shaped portions 7 to the second layer 3. The non-adhesive areas are configured to avoid connecting via the adhesive the scrap portions 8 to the second layer 3. The adhesive areas are configured to connect, via the adhesive, the shaped portions 7 to the second layer 3. The non-adhesive areas are configured to avoid connecting via the adhesive the scrap portions8 to the second layer 3. The adhesive 4 in the adhesive areas may be distributed continuously within the boundaries of the adhesive pattern. The adhesive 4 in the adhesive areas may be distributed in a discrete manner, for example at discrete points or in stripes or in geometric spots, within the boundaries of the adhesive pattern. The adhesive 4 in the adhesive areas may be distributed, discretely or continuously, within the boundaries of the adhesive pattern so as to form a frame along the boundaries of the adhesive pattern. The boundaries of the adhesive pattern may be considered as the boundary lines that enclose the outlines of the adhesive areas, within which the adhesive is distributed discretely or continuously. The boundaries of the adhesive pattern may be considered the perimeter boundary lines that enclose the shapes of the adhesive areas configured to correspond to the perimeter of the shaped portions of the first layer once the first layer is cut. The boundaries of the adhesive pattern may be considered the design lines that enclose the shapes of the adhesive pattern that are configured to define the cutting path so as to cut the shaped portions of the first layer.

[0041] . In one mode of operation, the first layer 2 may comprise one or more layers laminated to each other, and the second layer 3 may comprise one or more layers laminated to each other. In one mode of operation, the first layer 2 is coupled to the second layer 3, leaving at least one side portion 10, 11 of the second layer 3 freely exposed, wherein on the at least one side portion 10, 11 of the second layer 3 an ink 14 is present, distributed according to an ink pattern so as to form alignment references (ink markers) for a vision system of a laser cutting station.

[0042] . The method comprises step a) of providing said multilayer laminate 1, wherein the multilayer laminate 1 is in web form. In one mode of operation, the multilayer laminate 1 is a multilayer laminate web which can be wound into a reel or roll.

[0043] . The method comprises step b) of guiding the multilayer laminate 1 in motion with a multilayer laminate linear speed V1 towards a cutting area 5. In one mode of operation, the multilayer laminate 1 is guided by pulling or under tension, between a plurality of rollers upstream and downstream of the cutting area 5.

[0044] . The method comprises step c) of generating a laser ray or laser beam having a selected wavelength.

[0045] . The method comprises step d) of directing, during the movement of the multilayer laminate 1 through the cutting area 5, the laser beam towards the first layer 2 in the cutting area 5 to cut the first layer 2 along a cutting path, preferably avoiding cutting the second layer 3. The cutting path along which the first layer 2 is cut corresponds to the boundaries of the adhesive pattern. Thereby, the first layer 2 is cut into shaped portions 7 corresponding to the adhesive pattern and into scrap portions 8, wherein the scrap portions 8 are configured to be separated from the second layer 3 in subsequent processing operations. In an embodiment, the shaped portions 7 are bonded or coupled to the second layer 3 via the adhesive and / or the adhesive pattern, whereas the scrap portions 8 are not bondedand / or not glued to the second layer 3 via the adhesive and / or the adhesive pattern or the scrap portions 8 are devoid of the adhesive 4 and not bonded to the second layer 3. In an embodiment, the scrap portions 8 are free of contact with the adhesive 4 and / or the adhesive pattern. In an embodiment, the scrap portions 8 are not bonded to the second layer 3. By virtue of the correspondence between the cutting path and the boundaries of the adhesive pattern, the shaped portions 7 are superimposed on the adhesive pattern and exhibit a plan shape corresponding to the shape of the adhesive pattern. In other words, the orthogonal projections of the shaped portions 7 correspond to the shapes defined by the boundaries of the adhesive pattern. The adhesive pattern may comprise a first adhesive pattern corresponding to first shaped portions 7’ and a second adhesive pattern corresponding to second shaped portions 7”, wherein the first shaped portions 7’ define semi-finished product outlines, such as, for example, portions of printed electronics such as an antenna of an RFID tag, and the second shaped portions 7” correspond to a plurality of alignment marks or outlines, wherein the second shaped portions 7” form a reference for subsequent processing of the first shaped portions 7’. In one mode of operation, during step d) the first layer 2 is cut during movement in the cutting area of the multilayer laminate 1 , for example during linear sliding through the cutting area, along the cutting path. In one mode of operation, during step d) the first layer 2 is cut along the cutting path, avoiding cutting the second layer 3 through its entire thickness. In one mode of operation, during step d) the first layer 2 is cut along the cutting path, avoiding cutting, with a continuous line, the second layer 3 through its entire thickness. In one mode of operation, during step d) the first layer 2 is cut along the cutting path, avoiding perforating the second layer. In one mode of operation, during step d) the first layer 2 is cut along the cutting path, and the second layer may be partially scored without being cut. In one mode of operation, step d) is achieved via a galvanometric laser head 101 of the known type to direct the laser beam onto a work surface, and comprising focusing optics of the laser beam, to focus the laser beam on the first layer 2 for performing the laser cut.

[0046] . Advantageously, the method comprises step e) of providing a covering film (or third layer) 6 in web form. In one mode of operation, the covering film 1 is a web of covering film (or third layer web) which can be wound into a reel or roll.

[0047] . Advantageously, the method comprises step f) of guiding in motion the covering film 6 at a covering film linear speed V2 towards the cutting area 5. In one mode of operation, the covering film 6 is guided by pulling or under tension, between a plurality of rollers upstream and downstream of the cutting area 5.

[0048] . Advantageously, the method comprises step g) of superposing the covering film 6 in contact with the first layer 2 of the multilayer laminate 1 so that the covering film 6 is resting on the first layer 2 at least in the cutting area 5.

[0049] . Advantageously, during step d), the laser beam is incident on the covering film 6, passesthrough the covering film 6, and cuts the first layer 2 along the cutting path, wherein at least in the cutting area 5, the covering film linear speed V2 is equal to the multilayer laminate linear speed V1.

[0050] . In one mode of operation, the method comprises step i) of moving the covering film 6 away from the multilayer laminate 1 , interrupting the resting of the covering film 6 on the first layer 2 of the multilayer laminate 1, downstream of the cutting area 5. In one mode of operation, step i) provides for deflecting the movement path, for example by linear sliding, of the covering film 6 with respect to the movement path, for example linear sliding, of the laser-cut multilayer laminate 1.

[0051] . In one mode of operation, the method comprises step h) of removing, downstream of the cutting area 5, the scrap portions 8 of the first layer 2 from the second layer 3. In one mode of operation, step h) includes drawing air over the multilayer laminate 1 to remove the scrap portions 8. In one mode of operation, step h) provides for blowing air onto the multilayer laminate 1 to remove the scrap portions 8. In one mode of operation, step h) provides for mechanically brushing the multilayer laminate 1 to remove the scrap portions 8.

[0052] . In one mode of operation, during step d) the first layer 2 is cut along the cutting path, avoiding cutting the covering film 6 through its own covering film thickness continuously along a cutting line. In one mode of operation, during step d) the first layer 2 is cut along the cutting path, avoiding perforating the covering film 6. In one mode of operation, during step d) the first layer 2 is cut along the cutting path, and the covering film 6 may be partially scored without being perforated. In one mode of operation, during step d) the first layer 2 is cut along the cutting path, avoiding degrading the covering film 6 to such a point as to reduce the pull or the tensioning during its guided movement through the cutting area, preventing the covering film linear speed speed V2 being kept equal to the multilayer laminate linear speed V1.

[0053] . In one mode of operation, during step d) the covering film 6 is thermally resistant at the cutting path of the first layer 2, without degrading.

[0054] . In one mode of operation, in step f) the covering film 6 is guided along a closed-loop path, so that the covering film 6 is used in a continuous cycle.

[0055] . In one mode of operation, during step d) the covering film 6 thermally degrades at the cutting path of the first layer 2. In one mode of operation, during step d) the covering film 6 thermally degrades at the cutting path of the first layer 2, partially melting. In one mode of operation, during step d) the covering film 6 thermally degrades at the cutting path of the first layer 2, being scored, without being cut or without being continuously perforated along the cutting path. In one mode of operation, during step d) the covering film 6 thermally degrades at the cutting path of the first layer 2, without being perforated. In one mode of operation, in the event that the covering film 6 partially thermally degrades at the cutting path of the first layer 2, forming holes along the cutting path through the thickness of the covering film 6, the covering film 6 avoids exhibiting portions that lift during the movement of the coveringfilm through the cutting area 5, and the covering film 6 continues to be moved at the same linear speed as the multilayer laminate linear speed.

[0056] . In one mode of operation, during step d) the covering film 6 thermally degrades at the cutting path of the first layer 2, forming adhesion points with the first layer 2, so that, downstream of the cutting area 5, by moving the covering film 6 away from the multilayer laminate 1, the scrap portions 8 of the first layer 2 are removed from the second layer 3 while remaining attached to the covering film 6. Thereby, step i) and step h) occur simultaneously.

[0057] . In one mode of operation, the covering film 6 is electrostatically treated, for example with corona treatment.

[0058] . In one mode of operation, when the covering film 6 is electrostatically treated, for example with corona treatment, downstream of the cutting area 5, by moving the covering film 6 away from the multilayer laminate 1, the scrap portions 8 of the first layer 2 are removed from the second layer 3, remaining electrostatically attached to the covering film 6. Thereby, step i) and step h) occur simultaneously.

[0059] . In one mode of operation, step i) and step h) occur simultaneously.

[0060] . In one mode of operation, during step g) the covering film 6 physically prevents the areas of the first layer 2 from lifting with respect to the second layer film 3 during laser cutting of the first layer 2.

[0061] . In one mode of operation, during step g), the covering film 6 forms a retention barrier configured to mechanically retain the first layer 2 on the second layer 3.

[0062] . In one mode of operation, during laser cutting, the covering film 6 is configured to keep the scrap portions 8 or the areas of the first layer 2 that are not bonded to the substrate 3 resting on the second layer 3.

[0063] . In one mode of operation, during step g) the laser beam is free to cut the first layer 2, without being obstructed by scrap portions 8.

[0064] . In one mode of operation, during step g) the covering film 6 is resting on the first layer 2 without providing an interposition of adhesive material.

[0065] . In one mode of operation, in the cutting area, the multilayer laminate 1 and the covering film 6 translate in contact at the same linear speed so as to avoid friction and relative sliding forces between the covering film 6 and the first layer 2.

[0066] . In one mode of operation, the covering film 6 is transparent to the selected wavelength of the laser beam. In one mode of operation, the covering film 6 is substantially transparent to the wavelength selected by the laser, allowing the laser beam to pass through. In one mode of operation, the covering film 6 is configured to transmit the wavelength selected by the laser, allowing the laser beam to pass through it, without being cut or without being continuously perforated along the cuttingline.

[0067] . In one mode of operation, the covering film 6 has insufficient absorption at the selected wavelength of the laser beam to be cut. In one mode of operation, the covering film 6 has a thickness and an absorption at the selected wavelength of the laser beam that are insufficient to be cut.

[0068] . In one mode of operation, the first layer 2 has an absorption at the selected wavelength of the laser beam sufficient to be cut by the laser beam. In one mode of operation, the first layer 2 has a thickness and an absorption at the selected wavelength of the laser beam sufficient to be cut by the laser beam

[0069] . In one mode of operation, the laser has a pulse energy and a pulse length selected so as to cut the first layer 2.

[0070] . In one mode of operation, during step d) the laser beam at the selected wavelength is focused onto the first layer 2, to continuously cut the first layer along the thickness, following the cutting path. In one mode of operation, during step d) the laser beam at the selected wavelength is focused on the first layer 2, to cut the first layer 2, without cutting the second layer 3 and without directly cutting the covering film 6. In one mode of operation, during step d), the covering film 6 may be thermally degraded and / or indirectly scored by heat transfer during the laser cutting of the first layer. In one mode of operation, during step d), the covering film 6 may be thermally degraded and / or indirectly scored due to the laser plume of vapors and / or fumes generated by ablation and vaporization of the first layer along the cutting path and emitted in the direction from which the laser beam originates.

[0071] . In one mode of operation, step a) includes the step of providing a first layer 2, in web form. In one mode of operation, the first layer 2 is a first layer web which can be wound into a reel or roll. In one mode of operation, the first layer 2 is guided by pulling or under tension, between a plurality of rollers at least upstream of the cutting area 5. In one mode of operation, the first layer 2 is guided by pulling or under tension, between a plurality of rollers upstream and downstream of the cutting area 5. In one mode of operation, the first layer 2 is guided by pulling or under tension, between a plurality of rollers downstream of the cutting area 5 after being coupled to the second layer 3.

[0072] . In one mode of operation, step a) includes the step of providing a second layer 3, in web form. In one mode of operation, the second layer 3 is a second layer web which can be wound into a reel or roll. In one mode of operation, the second layer 3 is guided by pulling or under tension, between a plurality of rollers upstream and downstream of the cutting area 5.

[0073] . In one mode of operation, step a) includes the step of distributing an adhesive 4 according to an adhesive pattern on the second layer 3 or on the first layer 2.

[0074] . In one mode of operation step a) includes the step of moving the first layer 2 at a first layer linear speed V3 towards a coupling station 109.

[0075] . In one mode of operation, step a) comprises the step of moving the second layer 3 at asecond layer linear speed V4 towards the coupling station 109.

[0076] . In one mode of operation, step a) includes the step of coupling the first layer 2 and the second layer 3 with the adhesive 4 in the coupling station 109, wherein the first layer 2 and the second layer 3 are moved towards the cutting area.

[0077] . In one mode of operation, step a) provides that in the cutting area the first layer linear speed V3 and the second layer linear speed V4 are equal to the covering film speed V2.

[0078] . In one mode of operation, the covering film 6 is superimposed on the first layer 2 passing through the coupling station 109, wherein the coupling station 109 is a calender.

[0079] . In one mode of operation, the covering film 6 is unwound from a reel of covering film upstream of the cutting area 5 and is wound onto a reel of covering film downstream of the cutting area 5, translating under tension through the cutting area at the covering film linear speed V2.

[0080] . In one mode of operation, the first layer 2 is unwound from a first-layer reel upstream of the cutting area 5 and the second layer 3 is unwound from a second-layer reel upstream of the cutting area 5 and they are fed towards the coupling station 109, wherein the first layer 2 and the second layer 3 downstream of the cutting area 5 are wound, coupled, onto a reel of processed multilayer laminate, translating under tension through the cutting area at the first layer linear speed V3 and the second layer linear speed V4, equal to the multilayer laminate linear speed V1. In one mode of operation, the first layer linear speed V3 and the second layer linear speed V4 are equal by virtue of the coupling between the first layer 2 and the second layer 3.

[0081] . In one mode of operation, each web is a foil or film, ora plurality of foils or films laminated to each other, which are flexible and may be wound in rolls or reels, wherein each web defines a prevalent extension direction, a thickness direction, and a width direction, orthogonal to each other at each point when the web is processed under tension or by pulling between a plurality of rollers. In one mode of operation, each web mainly extends along the respective web extension direction, and has a thickness which is perpendicular to the web extension direction, and a width which is perpendicular to the thickness and to the web extension direction.

[0082] . In one mode of operation, in the step of distributing the adhesive 4, the adhesive 4 is distributed according to an adhesive pattern on a central part 9 of the second layer 3 or on the first layer 2. In one mode of operation, the second layer 3 comprises a central part 9 and at least one side part 10, 11. In one mode of operation, the web of the first layer 2 has a first layer width. In one mode of operation, the web of the second layer 3 has a second layer width. In one mode of operation, the width of the first layer is less than the width of the second layer so that the first layer 2 is superimposable on a central part 9 of the second layer 3, leaving free at least one side part 10, 11 of the second layer 3, and preferably leaving free a first side part 10 of the second layer 3 and a second side part 11 of the second layer 3. In one mode of operation, the web of the covering film 6 has a covering film width. Inone mode of operation, the covering film width is greater than or equal to the first layer width. In one mode of operation, the covering film width is such that it covers the central part 9 of the second layer 3, and at least partially the at least one side part 10, 11. In one mode of operation, the covering film width is such as to cover the central part 9 of the second layer 3, leaving the at least one side part 10, 11 freely exposed.

[0083] . In one mode of operation, in the step of coupling the first layer 2 and the second layer 3 with the adhesive 4, the first layer 2 is coupled to the central part 9 of the second layer 3 with the adhesive pattern, leaving free at least one side part 10, 11 of the second layer 3. In one mode of operation, the adhesive pattern comprises a first adhesive pattern and a second adhesive pattern, wherein the first adhesive pattern defines the plan shapes of the first shaped portions 7’ of the first layer after it is laser cut, wherein the second adhesive pattern defines the plan shapes of the second shaped portions 7” which define a plurality of reference or alignment shapes with respect to the first shaped portions 7’ that may form a reference for subsequent processing.

[0084] . In one mode of operation, the method comprises the step of distributing an ink 14 according to an ink pattern on the at least one side part 10, 11 of the second layer 3 or on the covering film 6.

[0085] . In one mode of operation, the ink 14 is a pigmented adhesive or pigmented glue so that the ink pattern is configured to form both an alignment reference (reference) for laser cutting and to form an adhesive coupling, and the method comprises the step of coupling the covering film 6 to the at least one lateral part 10, 11 of the second layer 3 with the ink pattern, superimposing the second layer 3 and superimposing the first layer 2 during step g). In one mode of operation, the adhesive 4 and the ink 14 are both a pigmented adhesive or pigmented glue so that it is possible to distribute the pigmented adhesive according to the adhesive pattern on the central part 9 of the second layer 3 and according to the ink pattern on each side part 10, 11 of the second layer 3. By virtue of the provision of the pigmented adhesive, it is possible to use the same process fluid, namely the pigmented adhesive, both to distribute the adhesive according to the adhesive pattern and to distribute the ink according to the ink pattern.

[0086] . In one mode of operation, downstream of the cutting area, after step d), the method comprises a trimming step wherein each side part 10, 11 of the second layer 3, to which the covering film 6 is coupled via the ink pattern, is trimmed or cut, forming a respective lateral trimming strip 12, 13 which may be discarded or rewound onto a trimming reel. In one mode of operation, each side part 10, 11 of the second layer 3 to which the covering film 6 is coupled via the ink pattern is trimmed or cut to be separated from the central part 9 of the second layer 3, on which the first layer 2, which has been laser cut, is superimposed, wherein, in turn, the covering film 6 is superimposed, resting, on the first layer 2 and is guided in movement downstream of the trimming step with a web width reduced by the width of each trimming side strip 12, 13 that has been trimmed.

[0087] . In one mode of operation, the selected wavelength which is generated by the laser source may be comprised between 0.4 pm and 4 pm. For example the selected wavelength may be comprised between 0.7pm and 1.5 pm, near infrared (NIR) wavelengths.

[0088] . In one mode of operation, the laser source and the laser beam focused on the first layer 2 to be cut, deliver an energy density to the multilayer laminate such as to melt and / or vaporize the first layer 2 along the cutting path. The energy density may be between 5 J / cm2 and 150 J / cm2. The laser source that can be used to generate the laser beam may be a fiber laser, a solid-state laser, a semiconductor laser or a gas laser. The pulsed generation of the laser beam may occur via a plurality of techniques such as, for example, Q-switching, mode-locking, chirp modulation, MOPA laser, and the like.

[0089] . The laser source employed depends on the materials of the layers of the multilayer laminate that are to be cut. On the basis of the wavelength selected for cutting the first layer of multilayer laminate, the material of the covering film 6 to be superposed in contact with the first layer of the multilayer laminate during cutting is selected, which must mainly transmit the selected wavelength, avoiding being cut continuously along a line corresponding to the cutting path on the first layer.

[0090] . In one mode of operation, the laser source is a pulsed laser source with a wavelength selected in the near infrared (NIR). The pulse length may be between 1ps and 400 ns. The pulse length is selected on the basis of the type of processing. For example, for laser cutting of copper layers very short pulse lengths are used even in the order of picoseconds. For example, for laser cutting of aluminum layers pulse lengths between 1 ns and 400 ns may be used. The peak power of the laser source may be greater than 3kW. The energy of the pulse may be comprised between 150 pJ and 3000 pj, focused on a spot diameter of the laser beam at the focal point between 20 pm and 100 pm. In one mode of operation, the laser source is a fiber laser at a near-infrared wavelength, for example 1.064 pm, pulsed, with power comprised between 100 W and 200 W, preferably between 120 W and 130 W, and with a 150kHz frequency, wherein the maximum laser beam speed is 6 meters per second (m / s). With a laser beam of this type multilayer laminates comprising a first layer 2 of aluminum for example of 6 pm thickness may be cut.

[0091] . In one mode of operation, the first layer 2 may be made of a conductive material. In one mode of operation, the first layer 2 is a conductive polymer or a metal material, for example aluminum, or copper.

[0092] . In one mode of operation, the first layer 2 may be made of a polymer material, for example a thermoplastic polymer.

[0093] . In one mode of operation, the second layer 3 (or substrate) may be made of paper or of a polymer material, for example a polyimide forming a substrate for printed electronics on flexible supports.

[0094] . In one mode of operation, the covering film 6 may be a polymer material, such as, for example, one selected from a polyester, such as, for example, polyethylene terephthalate (PET), a thermoplastic polyolefin, such as, for example, polyethylene (PE) and polypropylene (PP), a polyimide, for example poly (4,4' - oxydiphenylene-pyromellitimide) or, for example, Kapton made by DuPont, a polyether ether ketone (PEEK).

[0095] . In one mode of operation, the first layer 2 has a thickness comprised between 3 pm and 50 pm. For example, the first layer 2 has a thickness comprised between 6 pm and 20 pm.

[0096] . In one mode of operation, the second layer 3 has a thickness greater than 10 pm. For example, the second layer 3 has a thickness greater than 30 pm. In one mode of operation, the second layer 3 has a thickness comprised between 10 pm and 100 pm.

[0097] . In one mode of operation, the covering film 6 has a thickness comprised between 5 pm and 500 pm. For example, the covering film 6 has a thickness comprised between 10 pm and 50. In one mode of operation, the covering film 6 has a thickness comprised between 10 pm and 20 pm.

[0098] . In one mode of operation, the second layer 3 is made of paper, the first layer is made of aluminum having a thickness of 6 pm, and the covering film 6 is made of PET having a thickness of 12 pm. In this case, it is possible to cut the first layer 2 without scoring the second layer 3 and without perforating the covering film. In one mode of operation, in this case, it is possible to partially score the covering film 6, forming a scored outline on the covering film 6 corresponding to the cutting path of the first layer 2 without perforating the covering film 6. In one mode of operation, in this case, it is possible to achieve heat shading around the scored outline on the covering film 6. In one mode of operation, in this case, it is possible to achieve adhesion points, by softening or partial melting of the covering film, between the covering film 6 and the first layer 2 during laser cutting.

[0099] . In one mode of operation, the second layer 3 is made of paper, the first layer is made of aluminum having a thickness of 6 pm, and the covering film 6 is made of PET having a thickness of 45 pm. In one mode of operation, in this case, it is possible to partially score the covering film 6, forming a scored outline on the covering film 6 corresponding to the cutting path of the first layer 2 without perforating the covering film 6. In one mode of operation, in this case, it is possible to cut the first layer 2, score the second layer 3 and cut - perforating- partially the covering film in the curved areas of the cutting path of the first layer, wherein the curved areas correspond to areas wherein the laser beam slows down transferring more concentrated power with respect to the straight areas of the cutting path of the first layer. In one mode of operation, it is possible to control the power of the laser beam so as to avoid perforating the covering film both in the curved areas of the cutting path and in the straight areas of the cutting path.

[0100] . In one mode of operation, the second layer 3 is made of paper, the first layer is made of aluminum having a thickness of 6 pm, and the covering film 6 is made of PEEK having a thickness of100 m. PEEK has greater thermal resistance with respect to PET, and undergoes less thermal degradation without forming adhesion points between the first layer 2 and the covering film 6. In one mode of operation, in this case, it is possible to partially score the covering film 6, forming a scored outline on the covering film 6 corresponding to the cutting path of the first layer 2 without perforating the covering film 6. In one mode of operation, in this case, it is possible to avoid forming shadowing due to heating around the scored outline on the covering film 6, avoiding forming adhesion points between the covering film 6 and the first layer 2. In one mode of operation, in this case, it is possible to cut the first layer 2 without scoring the second layer 3and without perforating the covering film 6, which has sufficient thermal resistance to be used in continuous cycle.

[0101] . In one mode of operation, the second layer 3 is made of paper, the first layer is made of aluminum having a thickness of 6 pm, and the covering film 6 is made of polyimide for example Kapton produced by DuPont having a thickness of 25 pm. In one mode of operation, in this case, it is possible to partially score the covering film 6, forming a scored outline on the covering film 6 corresponding to the cutting path of the first layer 2 without perforating the covering film 6. In one mode of operation, in this case, it is possible to avoid forming shadowing due to heating around the scored outline on the covering film 6, avoiding forming adhesion points between the covering film 6 and the first layer 2. In one mode of operation, in this case, it is possible to cut the first layer 2 without scoring the second layer 3 and without perforating the covering film 6, which has sufficient thermal resistance to be used in continuous cycle.

[0102] . In one mode of operation, the present method allows multilayer laminates to be processed for obtaining semi-finished products in web form, such as, for example, labels, antennas for RFID tags, printed electronic semi-finished products, or even micro-sensors. Printed electronics refers to all those devices that exhibit electrical and electronic functionality and that may be made using techniques and substrates typical of the printing sector. A non-exhaustive example of printed electronic devices includes thin-film transistors, printed photovoltaic cells, printed light emitters (oLED), batteries, electrochromic devices, sensors such as, for example, pressure, light, temperature, humidity, presence of gases or volatile substances, heating elements, buttons and / or resistive or capacitive membranes for user interfaces (HMI). These devices are obtained by forming specific structures consisting of a set of different materials with electrical conduction, semiconducting, or electrically insulating properties. Further, such devices are provided with a network of conductive materials whose purpose is to achieve the electrical connections between two or more devices or between the device and the external electrical connections. The solutions currently adopted for manufacturing conductive structures are the printing of conductive inks deposited from solution, such as, for example, inks based on silver, copper, or carbon particles, or on conductive polymers, or the use of materials that are applied in a uniform manner on the substrate in its entirety, such as, for example, aluminum, copper, or conductive oxidessuch as indium tin oxide (ITO) and that are subsequently patterned with subtractive techniques by virtue of photochemical lithography or laser ablation - laser cutting.

[0103] . Shaped conductive portions coupled to a substrate, obtained via the method of the present invention may find application both within the structures of electronic devices and for achieving their electrical connections. This is by virtue of the advantages offered by this invention that make it possible to precisely define a pattern of conductive material, working at low temperature, on flexible substrates, with good precision and at low cost.

[0104] . The present invention also relates to a processing line 100 for a multilayer laminate web 1, for processing the multilayer laminate 1 according to the method described above. The multilayer laminate 1 is in web form and comprises at least a first layer 2 and a second layer (or substrate) 3 coupled via at least one adhesive 4 distributed according to an adhesive pattern.

[0105] . The processing line 1 comprises a laser cutting station 102 defining a cutting area 5 for laser cutting the multilayer laminate 1. The laser cutting station 102 comprises at least one galvanometric laser head 101 configured to direct a laser beam onto a work surface to cut the multilayer laminate 1 in the cutting area 5.

[0106] . The processing line 1 comprises at least one inlet roller 103 arranged upstream of the laser cutting station 102 and at least one outlet roller 104 arranged downstream of the laser cutting station 102. The outlet roller 104 and the inlet roller 103 are motorized. The outlet roller 104 and the inlet roller 103 are configured to guide the web of multilayer laminate 1, in controlled pulling motion, through the cutting area 5 at a multilayer laminate linear speed V1. The galvanometric laser head 101 is configured to direct the laser beam having a selected wavelength towards the first layer 2 in the cutting area 5 to cut the first layer 2 along a cutting path corresponding to the boundaries of the adhesive pattern, avoiding cutting the second layer 3, wherein the first layer 2 is cut into shaped portions 7 corresponding to the adhesive pattern and into scrap portions 8.

[0107] . Advantageously, the processing line 100 comprises at least a first covering film roller 105 arranged upstream of the laser cutting station 102 and at least a second covering film roller 106 downstream of the laser cutting station. The first covering film roller 105 and the second covering film roller 106 are motorized. The first covering film roller 105 and the second covering film roller 106 are configured to guide a covering film 6 in controlled pulling motion through the cutting area 5 at a multilayer laminate linear speed V2 equal to the multilayer laminate linear speed V1.

[0108] . Advantageously, the processing line 1 comprises a first contact roller 107 arranged upstream of the laser cutting station and a second contact roller 108 arranged downstream of the laser cutting station, wherein the first contact roller 107 and the second contact roller 108 are configured to superimpose the covering film 6 resting on the first layer 2 of the multilayer laminate 1 and to keep it superimposed at least in the cutting area 5.

[0109] . In an embodiment, the first contact roller 107 and the second contact roller 108 are idle rollers. In an embodiment, the at least one inlet roller 103 and the at least one first covering film roller 105 are arranged in different positions with respect to one another, wherein the at least one outlet roller 104 and the at least one second covering film roller 106 are arranged in different positions with respect to one another.

[0110] . In an embodiment, the first covering film roller 105, the second covering film roller 106, the first contact roller 107 and the second contact roller 108 are arranged so that the covering film 6 is guided along a closed loop path, so that the covering film 6 is usable in continuous cycle in input and in output from the laser cutting station. According to an embodiment, the processing line 100 comprises the covering film 6. In an embodiment, the covering film 6 forms a closed loop, as shown in Figure 4.

[0111] . In an embodiment, the processing line 100 comprises a removal station 111 downstream of the laser cutting station 102. The removal station 111 is configured to remove the scrap portions 8 of the first layer 2 from the second layer 3, after the first layer 2 has been cut. The removal station 111 may comprise a plurality of air knives.

[0112] . In an embodiment, the second contact roller 108 and the second covering film roller 106 are arranged so that the sliding path of the covering film 6 is deflected from the linear sliding path of the multilayer laminate 1, going towards the second covering film roller 108 moving the covering film 6 away from the multilayer laminate 1 and interrupting the contact and support between the covering film 6 and the first layer 2 of the multilayer laminate 1.

[0113] . In an embodiment, the processing line 100 comprises a first inlet roller 103’ configured to unwind a reel of the web of the second layer 3, and a second inlet roller 103” configured to guide the web of the second layer 3 in controlled pulling motion towards an adhesive distributing station 110 and towards a coupling station 109, upstream of the laser cutting station 102. The outlet roller 104 and the first inlet roller 103’ and the second inlet roller 103” are configured to guide in controlled pulling motion the web of the second layer 1 through the cutting area 5 at a second layer linear speed V4. The first inlet roller 103’ and the second inlet roller 103” are motorized. In an embodiment, the first inlet roller 103’ is independently motorized with software-controlled tension control. In an embodiment, the second inlet roller 103” is motorized and feedback-controlled by a dancer system to maintain constant tension, with motor torque control.

[0114] . In an embodiment, the processing line 100 comprises a third inlet roller 103’” configured to unwind a reel of first layer web 2. The third inlet roller 103’” and the outlet roller 104 are configured to guide, in controlled pulling motion, the first layer web 2 towards the coupling station 109, upstream of the laser cutting station 102, to couple the first layer 2 to the second layer 3, and through the laser cutting station at a first layer linear speed V3. The third inlet roller 103’” is motorized and is provided with dual tension control, both with software control and with a load cell to maintain constant tension. Inan embodiment, the coupling station 109 comprises the first contact roller 107, which is, for example, one of the rollers or cylinders of the coupling calender.

[0115] . In an embodiment, the processing line 100 comprises a first outlet roller 104’ configured to wind the web of multilayer laminate after it has been cut and after the scrap portions have been removed, and a second outlet roller 104” configured to guide the web of multilayer laminate in controlled pulling motion downstream of the removal station. The first outlet roller 104’ and the second outlet roller 104” are motorized. In an embodiment, the first output roller 104’ is independently motorized with software-controlled tension control. In an embodiment, the second outlet roller 104” is motorized and feedback-controlled by a load cell to maintain constant tension, with motor torque control.

[0116] . In an embodiment, the processing line 100 comprises an adhesive distributing station 110 configured to distribute at least one adhesive according to at least one adhesive pattern. In an embodiment, the processing line 100 comprises an ink distributing station configured to distribute at least one ink according to an ink pattern, wherein the ink distributing station may be, for example, a flexographic printing station and / or a digital printing station. In an embodiment, the adhesive distribution station 110 may be, as illustrated in Figure 9 along the processing line towards the coupling station, a flexographic printing station and / or a digital printing station, which may be activated independently depending on the adhesive distribution requirements. In an embodiment, the adhesive and / or the ink is a pigmented adhesive or pigmented glue, so that with the same adhesive distributing station 110 it is possible to distribute the pigmented adhesive according to the adhesive pattern and according to the ink pattern. In an embodiment, the processing line 100 comprises a coupling station 109, for example a calender. In an embodiment, the processing line 100 comprises a removal station 111 , for example a calender for scrap removal. In an embodiment, the processing line 100 comprises one or more ultraviolet UV radiation lamps 112 to at least partially polymerize the at least one adhesive 4 and / or the ink 14, or the pigmented adhesive, for example downstream of the adhesive distribution station 110, for example of the flexographic printing station and / or of the digital printing station, or else downstream of the coupling station 109 to further polymerize the adhesive with the first layer and the second layer laminated to each other.

[0117] . In an embodiment, the alignment of the speeds of the multilayer laminate 1, in particular of the second layer 3 of the multilayer laminate 1, is performed through a virtual master that rotates some rollers of the line, for example those of the adhesive distributing station, those of the coupling station, and that of the removal station, at a determined speed and where control is performed in position.

[0118] . In an embodiment, the first layer 2 and the covering film 6 are drawn by the other rollers, for example by the roller of the coupling station through the presser, and the motor of the motorized rollers upstream of the coupling station and downstream of the cutting station, thus generates a torquesuch as to maintain the tension constant in that segment of the covering film 6 and of the first layer coupled to the second layer.LIST OF REFERENCE NUMERALSmultilayer laminatelayer or first layersubstrate or second layeradhesive or adhesive layer’ second adhesivecutting areacovering filmshaped portionsscrap portionscentral part0 first side part1 second side part2 first trimming strip3 second trimming strip4 ink00 processing line01 galvanometric laser head02 laser cutting station03 inlet roller03’ first inlet roller03” second inlet roller03”’ third inlet roller04 outlet roller04’ first outlet roller04” second outlet roller05 first covering film roller06 second covering film roller07 first contact roller08 second contact roller09 coupling station110 adhesive distribution station 111 removal station112 UV IampV1 multilayer laminate linear speed V2 covering film linear speed V3 first layer linear speedV4 second layer linear speed

Claims

CLAIMS1. A method for processing a multilayer laminate (1),wherein the multilayer laminate (1) comprises at least a first layer (2) and a second layer (3) coupled via an adhesive (4), wherein the adhesive (4) is distributed according to an adhesive pattern, the method comprising the steps of:a) providing said multilayer laminate (1) in web form,b) guiding the multilayer laminate (1) in motion with a multilayer laminate linear speed (V1) towards a cutting area (5),c generating a laser beam having a selected wavelength,d during movement of the multilayer laminate (1) through the cutting area (5), directing the laser beam towards the first layer (2) in the cutting area (5) to cut the first layer (2) along a cutting path corresponding to the boundaries of the adhesive pattern, avoiding cutting the second layer (3), so as to cut the first layer (2) into a plurality of shaped portions (7) corresponding to the adhesive pattern and into a plurality of scrap portions (8), wherein the plurality of shaped portions (7) is bonded to the second layer (3) via the adhesive (4), whereas the plurality of scrap portions (8) is not bonded to the second layer (3) via the adhesive (4),wherein the method is characterized by the following steps of:e supplying a covering film (6) in web form,f guiding in motion the covering film (6) sliding with a covering film linear speed (V2) towards the cutting area (5),g superimposing the covering film (6) in contact with the first layer (2) of the multilayer laminate (1) such that the covering film (6) is resting on the first layer (2) at least in the cutting area (5), wherein during step d), the laser beam is incident on the covering film (6), passes through the covering film (6), and cuts the first layer (2) along the cutting path,wherein at least in the cutting area (5), the covering film linear speed (V2) is equal to the multilayer laminate linear speed (V1).2 A method according to the preceding claim, comprising the steps ofi moving the covering film (6) away from the multilayer laminate (1) by interrupting the resting of the covering film (6) on the first layer (2) of the multilayer laminate (1), downstream of the cutting area (5), h removing, downstream of the cutting area (5), the scrap portions (8) of the first layer (2) from the second layer (3).3 A method according to any one of the preceding claims, wherein in step f) the covering film (6) is guided along a closed loop path, such that the covering film (6) is used in continuous cycle.4 A method according to claim 2, wherein during step d) the covering film (6) thermally degrades, or partially melts, at the cutting path of the first layer (2), forming points of adhesion with the first layer (2),such that, downstream of the cutting area (5), by moving the covering film (6) away from the multilayer laminate (1), the scrap portions (8) of the first layer (2) are removed from the second layer (3) remaining attached to the covering film (6).

5. A method according to claim 2, wherein the covering film (6) is electrostatically treated so that, downstream of the cutting area (5), by moving the covering film (6) away from the multilayer laminate (1), the scrap portions (8) of the first layer (2) are removed from the second layer (3) remaining electrostatically attached to the covering film (6).

6. A method according to any one of the preceding claims,wherein during step g) the covering film (6) is resting on the first layer (2) without providing an interposition of adhesive material.

7. A method according to any one of the preceding claims, wherein step a) provides the following steps of:-supplying the first layer (2), in web form,-supplying the second layer (3), in web form,- distributing the adhesive (4) according to said adhesive pattern on the second layer (3) or on the first layer (2),- moving the first layer (2) with a first layer linear speed (V3) towards a coupling station,- moving the second layer (3) with a second layer linear speed (V4) towards the coupling station, - coupling the first layer (2) and the second layer (3) with the adhesive (4) in the coupling station, wherein the first layer (2) and the second layer (3) are moved towards the cutting area,wherein in the cutting area the first layer linear speed (V3) and the second layer linear speed (V4) are equal to the covering film speed (V2).

8. A method according to the preceding claim, wherein the covering film (6) is superimposed on the first layer (2) passing through the coupling station, wherein the coupling station is a calender.

9. A method according to any one of the preceding claims 7 to 8,wherein in the step of distributing the adhesive (4), the adhesive (4) is distributed according to the adhesive pattern over a central part (9) of the second layer (3) or on the first layer (2),wherein in the step of coupling the first layer (2) and the second layer (3) with the adhesive (4), the first layer (2) is coupled to the central portion (9) of the second layer (3) with the adhesive pattern, leaving free at least one side portion (10, 11) of the second layer (3),wherein the method comprises the step of distributing an ink (14) over the at least one side portion (10, 11) of the second layer (3) or over the covering film (6) according to an ink pattern.

10. A method according to the preceding claim, wherein the ink (14) is a pigmented adhesive, wherein the method comprises the step of coupling the covering film (6) to the at least one side portion (10, 11) of the second layer (3) with the ink pattern, superimposing the second layer (3) andsuperimposing the first layer (2) during step g).

11. A method according to the preceding claim,wherein downstream of the cutting area, after step d), the method comprises a trimming step in which each side portion (10, 11) of the second layer (3) to which the covering film (6) is coupled via the adhesive pattern is trimmed or cut to be separated from the central portion (9) of the second layer (3) on which the first layer (2) that has been laser cut is superimposed, on which the covering film (6) is in turn resting superimposed, forming a respective trimming side strip (12, 13) which can be discarded or rewound into a trimming reel,wherein downstream of the trimming step, the covering film (6) from the multilayer laminate (1), interrupting the support of the covering film (6) on the first layer (2) of the multilayer laminate (1), downstream of the cutting area (5),h) removing, downstream of the cutting area (5), the scrap portions (8) of the first layer (2) from the second layer (3).

12. A method according to any one of the preceding claims, wherein the method comprises the step of obtaining semi-finished printed electronic devices in web form, whereinthe first layer (2) is made of a conductive material, wherein the conductive material is a metal material or a conductive polymer,the second layer (3) is made of paper or a polymer material,the covering film (6) is made of a polymer material,wherein the shaped portions (7) define first conductive portions of printed electronic devices.

13. Method according to the preceding claim, wherein the semi-finished printed electronic devices in web form are semi-finished printed electronic devices in web form of RFID tag antennas, wherein the conductive material is aluminum, and wherein the shaped portions (7) define first conductive portions of respective RFID tag antennas.

14. A method according to any one of the preceding claims, wherein during step d), the laser beam is incident on the covering film (6), passes through the covering film (6), and cuts the first layer (2) along the cutting path, avoiding cutting the covering film (6) continuously and / or avoiding cutting the covering film (6) through its own covering film thickness continuously along a cutting line;and / or wherein during step d), the laser beam is incident on the covering film (6), passes through the covering film (6), and cuts the first layer (2) along the cutting path, avoiding perforating the covering film (6).

15. A method according to any one of the preceding claims, wherein during step d) the first layer (2) is cut along the cutting path, avoiding degrading the covering film (6) to such an extent as to reduce the pull or tensioning during its guided movement through the cutting area preventing the covering film linear speed (V2) being kept equal to the multilayer laminate linear speed (V1).

16. A method according to any one of the preceding claims,wherein the adhesive (4), being distributed according to the adhesive pattern, defines adhesive areas and non-adhesive areas between the first layer (2) and the second layer (3), wherein the adhesive areas are delimited by at least one respective boundary of the adhesive pattern, wherein the adhesive areas are configured to connect, via the adhesive (4), the shaped portions (7) to the second layer (3), wherein the non-adhesive areas are configured to avoid connecting, via the adhesive (4), the scrap portions (8) to the second layer (3).

17. A method according to the preceding claim,wherein the adhesive (4) in the adhesive areas is distributed according to at least one of the following ways:continuously inside the at least one respective boundary of the adhesive pattern,in a discrete manner within the at least one respective boundary of the adhesive pattern, for example at discrete points or in stripes or in geometric spots,so as to form an adhesive frame along the respective boundaries of the adhesive pattern.

18. A method according to any one of the preceding claims,wherein during step g) the covering film (6) physically prevents the areas of the first layer (2) that are not bonded to the substrate (3) from rising with respect to the second layer (3) during cutting of the first layer (2).

19. A method according to any one of the preceding claims,wherein, during step g), the covering film (6) forms a retention barrier configured to mechanically retain the first layer (2) on the second layer (3) and / or the covering film (6) is configured to maintain the resting on the second layer (3), during laser cutting, of the scrap portions (8) or areas of the first layer (2) which are not bonded to the second layer (3),wherein during step g) the laser beam is free to cut the first layer (2), without being obstructed by scrap portions (8).

20. A method according to any one of the preceding claims,wherein the plurality of shaped portions (7) is arranged so as to cover the adhesive pattern, and wherein the plurality of scrap portions (8) is arranged so as to avoid covering the adhesive pattern, and / or wherein the boundaries of the shaped portions (7) are superimposed on the boundaries of the adhesive pattern,and / or wherein the orthogonal projections of the shaped portions (7) correspond to the shapes defined by the boundaries of the adhesive pattern.

21. A processing line (100) for processing a multilayer laminate (1), wherein the multilayer laminate (1) is in web form and comprises at least a first layer (2) and a second layer (3) coupled via at least one adhesive (4), wherein the adhesive (4) is distributed according to an adhesive pattern, the processingline (100) comprising:- the multilayer laminate (1);-a laser cutting station (102) defining a cutting area (5) for laser cutting the multilayer laminate (1), - at least one inlet roller (103) arranged upstream of the laser cutting station (102), and- at least one outlet roller (104) arranged downstream of the laser cutting station (102),wherein the outlet roller (104) and the inlet roller (103) are motorized, wherein the outlet roller (104) and the inlet roller (103) are configured to guide the web of multilayer laminate (1) in controlled pulling motion through the cutting area (5) with a multilayer laminate linear speed (V1),wherein the laser cutting station (102) comprises a galvanometric laser head (101) configured to direct a laser beam having a selected wavelength towards the first layer (2) in the cutting area (5), during movement of the multilayer laminate (1), to cut the first layer (2) along a cutting path corresponding to the boundaries of the adhesive pattern, avoiding cutting the second layer (3), wherein the first layer (2) is cut into a plurality of shaped portions (7) corresponding to the adhesive pattern and into a plurality of scrap portions (8), wherein the plurality of shaped portions (7) is bonded to the second layer (3) via the adhesive pattern, whereas the plurality of scrap portions (8) is not bonded to the second layer (3) via the adhesive pattern,characterized in that the processing line (100) comprises:- a covering film (6),- at least one first covering film roller (105) arranged upstream of the laser cutting station (102), - at least one second covering film roller (106) downstream of the laser cutting station (102),- a first contact roller 107 arranged upstream of the laser cutting station (102), and- a second contact roller 108 arranged downstream of the laser cutting station (102),wherein the first covering film roller (105) and the second covering film roller (106) are motorized, wherein the first covering film roller (105) and the second covering film roller (106) are configured to guide the covering film (6) in controlled pulling motion through the cutting area (5) with a covering film linear speed (V2) equal to the multilayer laminate linear speed (V1),wherein the first contact roller (107) and the second contact roller (108) are configured to superimpose the covering film (6) resting on the first layer (2) of the multilayer laminate (1) and keep the covering film (6) resting on the first layer (2) of the multilayer laminate (1) at least in the cutting area (5).

22. A processing line (100) according to the preceding claim,wherein the first covering film roller (105), the second covering film roller (106), the first contact roller (107) and the second contact roller (108) are arranged such that the covering film (6) is guided along a closed loop path, wherein the covering film (6) is a web extending in a closed loop.

23. A processing line (100) according to claim 21 or 22, wherein the at least one inlet roller (103) and the at least one first covering film roller (105) are arranged in different positions with respect to oneanother,wherein the at least one outlet roller (104) and the at least one second covering film roller (106) are arranged in different positions with respect to one another.

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