Maintenance jig, plating apparatus, and maintenance method for power supply contact

Abstract

The present invention reduces the time required for maintenance that involves removing a plating metal from a power supply contact.　A maintenance jig 490 for removing a metal film deposited on a power supply contact 442-4 provided to a substrate holder of a plating apparatus comprises: a cathode chamber 492 configured to house an electrolytic solution; a cathode 493 that is disposed in the cathode chamber 492 and that is configured to apply a voltage with respect to the power supply contact 442-4; and a diaphragm 494 that has a first surface 494a in contact with the electrolytic solution in the cathode chamber 492 and a second surface 494b in contact with the power supply contact 442-4 when the maintenance jig 490 is placed on the substrate holder, that can hold the electrolytic solution in the cathode chamber 492, and that allows anions to permeate therethrough from the first surface 494a side to the second surface 494b side.

Description

Maintenance method for maintenance jigs, plating equipment, and power supply contacts.

[0001] This application relates to a maintenance jig, a plating apparatus, and a method for maintaining power supply contacts.

[0002] One example of a plating apparatus is a cup-type electrolytic plating apparatus. In a cup-type electrolytic plating apparatus, a substrate (e.g., a semiconductor wafer) held in a substrate holder is immersed in a plating solution with the surface to be plated facing downwards, and a voltage is applied between the substrate and the anode to deposit a conductive film on the surface of the substrate.

[0003] The substrate holder of the plating apparatus disclosed in Patent Document 1 is equipped with a power supply contact for applying voltage to the substrate. In such a plating apparatus, during the plating process, the plating solution may leak into the area where the power supply contact is installed, causing the plating metal (and its oxides) to deposit on the power supply contact. In the prior art, when plating metal deposits on the power supply contact, maintenance work was performed by removing the power supply contact from the substrate holder and removing the plating metal from the power supply contact.

[0004] Patent No. 7114002

[0005] However, maintenance work using conventional technology involved several steps: removing the power supply contact from the circuit board holder, removing the plated metal from the power supply contact, and reattaching the power supply contact to the circuit board holder, which took a considerable amount of time.

[0006] Therefore, one of the objectives of this invention is to shorten the time required for maintenance to remove plated metal from the power supply contact.

[0007] According to one embodiment, a maintenance jig is disclosed for removing a metal film deposited on a power supply contact provided on a substrate holder of a plating apparatus, comprising: a cathode chamber configured to contain an electrolyte; a cathode disposed in the cathode chamber and configured to have a voltage applied between it and the power supply contact; and a diaphragm having a first surface that contacts the electrolyte in the cathode chamber and a second surface that contacts the power supply contact when the maintenance jig is installed on the substrate holder, the diaphragm being capable of holding the electrolyte in the cathode chamber and being configured to allow anions to pass from the first surface to the second surface.

[0008] Figure 1 is a perspective view showing the overall configuration of the plating apparatus of this embodiment. Figure 2 is a plan view showing the overall configuration of the plating apparatus of this embodiment. Figure 3 is a longitudinal cross-sectional view schematically showing the configuration of the plating module of this embodiment. Figure 4 is a longitudinal cross-sectional view schematically showing the state in which the maintenance jig is installed on the plating module. Figure 5 is a longitudinal cross-sectional view schematically showing the configuration of the maintenance jig of this embodiment. Figure 6 is a longitudinal cross-sectional view schematically showing the configuration of the maintenance jig of this embodiment. Figure 7 is a flowchart of the maintenance method for the power supply contact of this embodiment.

[0009] Embodiments of the present invention will be described below with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and redundant descriptions are omitted.

[0010] <Overall Configuration of Plating Apparatus> Figure 1 is a perspective view showing the overall configuration of the plating apparatus of this embodiment. Figure 2 is a plan view showing the overall configuration of the plating apparatus of this embodiment. As shown in Figures 1 and 2, the plating apparatus 1000 includes a load port 100, a transport robot 110, an aligner 120, a pre-wet module 200, a pre-soak module 300, a plating module 400, a cleaning module 500, a spin rinse dryer 600, a transport device 700, and a control module 800.

[0011] The load port 100 is a module for loading substrates stored in cassettes such as FOUPs (not shown) into the plating apparatus 1000, and for unloading substrates from the plating apparatus 1000 into cassettes. In this embodiment, four load ports 100 are arranged horizontally, but the number and arrangement of load ports 100 are arbitrary. The transport robot 110 is a robot for transporting substrates and is configured to transfer substrates between the load port 100, the aligner 120, the pre-wet module 200, and the spin rinse dryer 600. When transferring substrates between the transport robot 110 and the transport device 700, the transfer of substrates can be done via a temporary placement stand (not shown).

[0012] The aligner 120 is a module for aligning the positions of orientation flats and notches on the substrate to a predetermined direction. In this embodiment, two aligners 120 are arranged side by side horizontally, but the number and arrangement of the aligners 120 are arbitrary. The pre-wet module 200 replaces the air inside the patterns formed on the substrate surface with a treatment solution by wetting the surface of the substrate to be plated with a treatment solution such as pure water or degassed water before the plating process. The pre-wet module 200 is configured to perform a pre-wetting process that makes it easier to supply the plating solution inside the patterns by replacing the treatment solution inside the patterns with the plating solution during plating. In this embodiment, two pre-wet modules 200 are arranged side by side vertically, but the number and arrangement of the pre-wet modules 200 are arbitrary.

[0013] The pre-soak module 300 is configured to perform a pre-soak treatment, which involves etching away an oxide film with high electrical resistance present on the surface of a seed layer formed on the surface of a substrate to be plated before plating, using a treatment solution such as sulfuric acid or hydrochloric acid, thereby cleaning or activating the surface of the substrate. In this embodiment, two pre-soak modules 300 are arranged side by side in the vertical direction, but the number and arrangement of the pre-soak modules 300 are arbitrary. The plating module 400 performs the plating treatment on the substrate. In this embodiment, there are two sets of 12 plating modules 400, arranged in a vertical direction of three modules and a horizontal direction of four modules, for a total of 24 plating modules 400, but the number and arrangement of the plating modules 400 are arbitrary.

[0014] The cleaning module 500 is configured to clean the substrate to remove any remaining plating solution after the plating process. In this embodiment, two cleaning modules 500 are arranged side by side in the vertical direction, but the number and arrangement of the cleaning modules 500 are arbitrary. The spin rinse dryer 600 is a module for drying the substrate after the cleaning process by rotating it at high speed. In this embodiment, two spin rinse dryers are arranged side by side in the vertical direction, but the number and arrangement of the spin rinse dryers are arbitrary. The transport device 700 is a device for transporting substrates between multiple modules in the plating apparatus 1000. The control module 800 is configured to control multiple modules of the plating apparatus 1000 and can consist of, for example, a general-purpose computer or a dedicated computer with an input / output interface with an operator.

[0015] An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, substrates stored in cassettes are loaded into the load port 100. Next, the transport robot 110 removes the substrates from the cassettes in the load port 100 and transports them to the aligner 120. The aligner 120 aligns the orientation flats and notches of the substrates to a predetermined direction. The transport robot 110 then transfers the substrates, whose orientation has been aligned by the aligner 120, to the pre-wet module 200.

[0016] The pre-wetting module 200 performs a pre-wetting treatment on the substrate. The transport device 700 transports the pre-wetting substrate to the pre-soak module 300. The pre-soak module 300 performs a pre-soak treatment on the substrate. The transport device 700 transports the pre-soaked substrate to the plating module 400. The plating module 400 performs a plating treatment on the substrate.

[0017] The transport device 700 transports the plated substrates to the cleaning module 500. The cleaning module 500 cleans the substrates. The transport device 700 then transports the cleaned substrates to the spin rinse dryer 600. The spin rinse dryer 600 dries the substrates. The transport robot 110 receives the substrates from the spin rinse dryer 600 and transports the dried substrates to the cassette in the load port 100. Finally, the cassette containing the substrates is discharged from the load port 100.

[0018] <Configuration of the Plating Module> Next, the configuration of the plating module 400 will be described. Since the 24 plating modules 400 in this embodiment have the same configuration, only one plating module 400 will be described. Figure 3 is a longitudinal cross-sectional view schematically showing the configuration of a plating module in one embodiment.

[0019] As shown in Figure 3, the plating module 400 includes a plating tank 410 for containing a plating solution. The plating module 400 includes a membrane 420 that separates the inside of the plating tank 410 in the vertical direction. The inside of the plating tank 410 is divided into a cathode region 422 and an anode region 424 by the membrane 420.

[0020] Plating solution is filled into the cathode region 422 and the anode region 424, respectively. The plating module 400 includes a nozzle 426 opening toward the cathode region 422 and a supply source 428 for supplying the plating solution to the cathode region 422 via the nozzle 426. The plating module 400 also includes a mechanism for supplying the plating solution to the anode region 424, but this is not shown in the figure. An anode 430 is provided at the bottom of the plating tank 410 in the anode region 424. A resistor 450 is positioned in the cathode region 422 opposite the membrane 420. The resistor 450 is a component for ensuring uniformity of the plating process on the plated surface Wf-a of the substrate Wf, and is composed of a plate-shaped member with numerous holes formed therein.

[0021] The plating module 400 also includes a substrate holder 440 for holding the substrate Wf with the plated surface Wf-a facing downwards. The substrate holder 440 includes a power supply contact for supplying power to the substrate Wf from a power source (not shown). The substrate holder 440 includes a seal ring holder 442 for supporting the outer edge of the plated surface Wf-a of the substrate Wf, and a frame 446 for holding the seal ring holder 442 in a substrate holder body (not shown). The substrate holder 440 also includes a back plate 444 for pressing the back surface of the plated surface Wf-a of the substrate Wf, and a shaft 448 attached to the back surface of the substrate pressing surface of the back plate 444.

[0022] The plating module 400 includes a lifting mechanism 443 for raising and lowering the substrate holder 440, and a rotating mechanism 447 for rotating the substrate holder 440 so that the substrate Wf rotates around a virtual axis of the shaft 448 (a virtual axis of rotation extending vertically through the center of the surface Wf-a to be plated). The lifting mechanism 443 and the rotating mechanism 447 can be implemented by known mechanisms such as motors. The plating module 400 is configured to perform a plating process on the surface Wf-a of the substrate Wf by immersing the substrate Wf in the plating solution of the cathode region 422 using the lifting mechanism 443 and applying a voltage between the anode 430 and the substrate Wf.

[0023] In the plating module 400 of this embodiment, during the plating process, the plating solution may leak into the area where the power supply contact of the substrate holder 440 is installed. In this case, the plating metal (and its oxides) may be deposited on the surface of the power supply contact, and as a result, the thickness of the conductive film formed on the plated surface Wf-a may become uneven.

[0024] In contrast, the plating module 400 of this embodiment is equipped with a maintenance jig for removing the metal film deposited on the power supply contact. The maintenance jig will be described below.

[0025] Figure 4 is a schematic longitudinal cross-sectional view showing the plating module with the maintenance jig installed. As shown in Figure 4, the maintenance jig 490 is formed in the shape of a disc with approximately the same diameter as the substrate Wf, and is held in place of the substrate Wf by the substrate holder 440. As shown in Figure 4, the maintenance jig 490 is configured to remove the metal film deposited on the power supply contact while installed in the substrate holder 440.

[0026] Figure 5 is a longitudinal cross-sectional view schematically showing the configuration of the maintenance jig of this embodiment. Figure 5 shows an enlarged view of region α in Figure 4. First, the configuration of the substrate holder 440 will be described.

[0027] The seal ring holder 442 includes an annular support member 442-1 for supporting the outer periphery of the maintenance jig 490. The support member 442-1 has a flange 442-1a that protrudes from the outer periphery of the lower surface of the maintenance jig 490. An annular seal member 442-2 is positioned on the flange 442-1a. The seal member 442-2 is an elastic material. The support member 442-1 supports the outer periphery of the maintenance jig 490 via the seal member 442-2.

[0028] The seal ring holder 442 includes an annular base 442-3 attached to the inner circumferential surface of the support member 442-1. The base 442-3 is made of a conductive material such as stainless steel. The seal ring holder 442 includes a power supply contact 442-4 for supplying power to the substrate. The power supply contact 442-4 is attached annularly to the inner circumferential surface of the base 442-3 by screws or the like. The support member 442-1 holds the power supply contact 442-4 via the base 442-3. The power supply contact 442-4 is made of a conductive material for supplying power to the substrate held in the substrate holder 440 during the plating process.

[0029] The substrate holder 440 includes an electrode member 484 positioned near the power supply contact 442-4. The electrode member 484 is an annular member that is conductive. The substrate holder 440 also includes an annular spacer 482 positioned between the power supply contact 442-4 and the electrode member 484. The spacer 482 is an insulator. By positioning the spacer 482, the power supply contact 442-4 and the electrode member 484 are insulated.

[0030] The plating module 400 can detect leakage of the plating solution into the area where the power supply contact 442-4 is installed by applying a voltage between the power supply contact 442-4 and the electrode member 484 using a power supply (not shown) and measuring the current flowing between them. That is, when the substrate Wf is held in the substrate holder 440 and plated, the plating solution may leak from the gap in the sealing member 442-2 into the internal area of ​​the substrate holder 440 (the area where the power supply contact 442-4 is installed). In that case, the measured current value will increase due to the influence of the leaked plating solution. Therefore, the plating module 400 can detect leakage of the plating solution into the area where the power supply contact 442-4 is installed based on the measured current.

[0031] Next, the details of the maintenance jig 490 will be described. The maintenance jig 490 comprises a disc-shaped jig body 491 having a diameter corresponding to the substrate Wf held in the substrate holder 440. The jig body 491 has a facing surface that faces the tip of the power supply contact 442-4 when the jig body 491 is installed on the substrate holder 440.

[0032] The maintenance jig 490 includes a cathode chamber 492 configured to contain an electrolyte. More specifically, the cathode chamber 492 includes a groove formed along the periphery of the surface of the jig body 491 facing the power supply contact 442-4. The cathode chamber 492 may include an inlet for injecting the electrolyte into the cathode chamber 492. The maintenance jig 490 includes a cathode 493 located within the cathode chamber 492. The cathode 493 is configured to have a voltage applied to it and the power supply contact 442-4.

[0033] The maintenance jig 490 includes a diaphragm 494 positioned to cover the groove of the cathode chamber 492. The diaphragm 494 has a first surface 494a that contacts the electrolyte in the cathode chamber 492, and a second surface 494b that contacts the power supply contact 442-4 when the maintenance jig 490 is placed on the substrate holder 440. The diaphragm 494 is configured to hold the electrolyte in the cathode chamber 492 and to allow anions to pass through from the first surface 494a to the second surface 494b. The diaphragm 494 may include an anion exchange membrane having the first surface 494a and the second surface 494b. Furthermore, the diaphragm 494 is not limited to an anion exchange membrane and may include a porous membrane having the first surface 494a and the second surface 494b. In this specification, contact between the power supply contact 442-4 and the second surface 494b of the diaphragm 494 includes not only direct contact between the power supply contact 442-4 and the second surface 494b of the diaphragm 494, but also contact between the power supply contact 442-4 and the second surface 494b of the diaphragm 494 via a liquid (e.g., water).

[0034] The maintenance jig 490 includes a water-retaining porous body (for example, sponge) 495 laminated on the second surface 494b. The porous body 495 is wetted with water when maintenance is performed on the power feeding contact 442-4. Accordingly, when the maintenance jig 490 is installed on the substrate holder 440, the power feeding contact 442-4 and the second surface 494b of the diaphragm 494 come into contact with each other via the water retained in the porous body 495. Furthermore, by providing the porous body 495, damage to the diaphragm 494 caused by direct contact of the tip of the power feeding contact 442-4 with the diaphragm 494 can be prevented.

[0035] The maintenance jig 490 includes a power source 497 arranged inside a jig main body 491. The power source 497 has a negative voltage terminal connected to a cathode 493, and a positive voltage terminal connected to a positive voltage port 498 formed in the jig main body 491. The maintenance jig 490 includes a connecting member 496 configured to connect the positive voltage port 498 and the power feeding contact 442-4 when the maintenance jig 490 is installed on the substrate holder 440.

[0036] By using the maintenance jig 490 of the present embodiment, the time required for maintenance to remove plated metal from the power feeding contact 442-4 can be shortened. Specifically, when plated metal deposits on the power feeding contact 442-4, the maintenance jig 490, in which the porous body 495 is wetted with water, is installed on the substrate holder 440. Then, by applying a voltage between the cathode 493 and the power feeding contact 442-4, negative ions are supplied from the cathode 493 side through the diaphragm 494, and at the same time, part of water decomposes on the surface of the power feeding contact 442-4 to generate acid. Further, the plated metal on the surface of the power feeding contact 442-4 is oxidized and dissolved, whereby the plated metal is electrolytically etched.

[0037] More specifically, when a maintenance jig 490 with a porous body 495 wetted by water is installed on a substrate holder 440, the power feeding contact 442-4 side of a diaphragm 494 is wetted by water, whereby part of the acid in an electrolytic solution permeates through the membrane and diffuses toward the power feeding contact 442-4 side. Further, by applying a voltage between a cathode 493 and the power feeding contact 442-4, negative ions in the electrolytic solution permeate through the diaphragm 494 and move toward the power feeding contact 442-4 side, and hydrogen ions are generated by electrolysis of water on the surface of the power feeding contact 442-4, resulting in an increased acid concentration (decreased pH). Then, the plated metal adhering to the surface of the power feeding contact 442-4 is oxidized by an electrode reaction, becomes a hydroxide and is passivated in a neutral region, but when pH decreases, the hydroxide is neutralized, becomes metal ions and dissolves.

[0038] As an example, when the electrolytic solution is H ２ SO ４ and the metal adhering to the power feeding contact 442-4 is Cu, the reaction on the surface of the power feeding contact 442-4 is as follows. H ２ O → 2H ＋ + 1 / 2O ２ + 2e － ... Electrolysis of water, generation of acid Cu + 2H ２ O → Cu(OH) ２ + 2H ＋ + 2e － ... Oxidation of Cu Cu(OH) ２ + H ２ SO ４ → Cu ２＋ + SO ４ ２－ + 2H ２ O... Neutralization of copper hydroxide, dissolution of Cu ions

[0039] By using the maintenance jig 490 of the present embodiment, the step of detaching the power feeding contact 442-4 from the substrate holder 440 and the step of attaching the power feeding contact 442-4 to the substrate holder 440 can be omitted, so the time required for maintenance to remove plated metal from the power feeding contact 442-4 can be shortened. Further, according to the maintenance jig 490 of the present embodiment, current flows concentratedly at the tip of the power feeding contact 442-4 near the diaphragm 494, whereby the tip of the power feeding contact 442-4 can be activated efficiently.

[0040] Note that, in the above description, an example using the porous body 495 wetted with water is shown, but the present invention is not limited thereto, and maintenance work may be performed by supplying water to a region of the substrate holder 440 where the power feeding contact 442-4 is disposed. Further, in the above description, an example in which the power source 497 is disposed inside the maintenance jig 490 is shown, but the present invention is not limited thereto, and power may be supplied from the outside of the maintenance jig 490. In this case, the jig body 491 only needs to be provided with a terminal for supplying power to the cathode 493.

[0041] The maintenance jig 490 can be stored in a storage location inside the plating module 400 or inside the plating apparatus 1000. When performing maintenance work on the power feeding contact 442-4, the maintenance jig 490 can be placed on the substrate holder 440 by a robot or the like.

[0042] Further, in the above description, an example in which the diaphragm 494 includes either an anion exchange membrane or a porous membrane is described, but the present invention is not limited thereto. FIG. 6 is a vertical cross-sectional view schematically showing the configuration of the maintenance jig of the present embodiment. As shown in FIG. 6, the diaphragm 494 may be configured to include an anion exchange membrane 494-1 having a first surface 494a, and a porous membrane 494-2 laminated on the anion exchange membrane 494-1 and having a second surface 494b.

[0043] Next, a method for maintaining a power feeding contact according to the present embodiment will be described. FIG. 7 is a flowchart of the method for maintaining a power feeding contact according to the present embodiment.

[0044] As shown in Figure 7, the maintenance method for the power supply contact in this embodiment involves applying a plating treatment to the substrate Wf held in the substrate holder 440 (plating step S110). Subsequently, the maintenance method detects leakage of the plating solution into the area of ​​the substrate holder 440 where the power supply contact 442-4 is installed after the plating step (S110) (leak detection step S112). In one example, the leak detection step S112 can be performed by applying a voltage between the power supply contact 442-4 and the electrode member 484 and measuring the current between them, but it is not limited to this.

[0045] Next, in the maintenance method, if a leak of the plating solution is detected in the leak detection step (S112), the porous body 495 is moistened with water (S114), and the maintenance jig 490 is placed on the substrate holder 440 (installation step S116). Next, in the maintenance method, a voltage is applied between the power supply contact 442-4 and the cathode 493 of the maintenance jig 490 to etch the power supply contact 442-4 (maintenance step S118). This removes the metal adhering to the power supply contact 442-4. Next, in the maintenance method, the maintenance jig 490 is removed from the substrate holder 440 (S120).

[0046] The maintenance method involves removing the maintenance jig 490 from the substrate holder 440, or, if no leakage of the plating solution is detected in the leak detection step (S112), supplying a cleaning solution (e.g., pure water) to the area of ​​the substrate holder 440 where the power supply contact 442-4 is installed, and cleaning the power supply contact 442-4 (S122).

[0047] According to the maintenance method of this embodiment, by using the maintenance jig 490, the steps of removing the power supply contact 442-4 from the substrate holder 440 and attaching the power supply contact 442-4 to the substrate holder 440 can be omitted, thus shortening the time required for maintenance to remove the plated metal from the power supply contact 442-4.

[0048] Although several embodiments of the present invention have been described above, the embodiments described above are for the purpose of facilitating understanding of the present invention and do not limit it. The present invention can be modified and improved without departing from its spirit, and of course, equivalents thereof are included in the present invention. Furthermore, any combination or omission of the components described in the claims and specification is possible to the extent that at least some of the above-mentioned problems can be solved or at least some of the effects can be achieved.

[0049] This application discloses, as one embodiment, a maintenance jig for removing a metal film deposited on a power supply contact provided on a substrate holder of a plating apparatus, comprising: a cathode chamber configured to contain an electrolyte; a cathode disposed in the cathode chamber and configured to have a voltage applied between it and the power supply contact; and a diaphragm having a first surface that contacts the electrolyte in the cathode chamber and a second surface that contacts the power supply contact when the maintenance jig is installed on the substrate holder, wherein the diaphragm is capable of holding the electrolyte in the cathode chamber and is configured to allow anions to pass from the first surface side to the second surface side.

[0050] Furthermore, the present application discloses a maintenance jig, as one embodiment, which further includes a disc-shaped jig body having a diameter corresponding to a substrate held in the substrate holder, and having an opposing surface that faces the power supply contact when the jig body is installed in the substrate holder, wherein the cathode chamber includes a groove formed along the peripheral edge of the opposing surface of the jig body, and the diaphragm is arranged to cover the groove of the cathode chamber.

[0051] Furthermore, the present application discloses, as one embodiment, a maintenance jig in which the diaphragm includes an anion exchange membrane having the first surface and the second surface.

[0052] Furthermore, the present application discloses, as one embodiment, a maintenance jig in which the diaphragm includes a porous membrane having the first surface and the second surface.

[0053] Furthermore, the present application discloses a maintenance jig in which, as one embodiment, the diaphragm includes an anion exchange membrane having a first surface and a porous membrane laminated on the anion exchange membrane and having a second surface.

[0054] Furthermore, the present application discloses, as one embodiment, a maintenance jig further comprising a water-retentive porous body laminated on the second surface.

[0055] Furthermore, the present application discloses a maintenance jig, as one embodiment, which further includes a power supply disposed within the jig body, wherein the negative voltage pole is connected to the cathode and the positive voltage pole is connected to a positive voltage port formed in the jig body, and a connecting member configured to connect the positive power port and the power supply contact when the maintenance jig is installed on the substrate holder.

[0056] Furthermore, the present application discloses a plating apparatus, as one embodiment, comprising: a plating tank for containing a plating solution; an anode disposed in the plating tank; a substrate holder configured to hold a substrate with the surface to be plated facing downward; and a maintenance jig as described above for removing a metal film deposited on a power supply contact provided on the substrate holder.

[0057] Furthermore, the present application discloses a method for maintaining a power supply contact, as one embodiment, which includes a plating step of applying a plating treatment to a substrate held in a substrate holder; a leak detection step of detecting a leak of plating solution into the area where the power supply contact of the substrate holder is installed after the plating step; an installation step of installing a maintenance jig described in any of the above on the substrate holder when a leak of plating solution is detected by the leak detection step; and a maintenance step of applying a voltage between the power supply contact and the cathode of the maintenance jig.

[0058] 400 Plating module 410 Plating bath 430 Anode 440 Substrate holder 442-4 Power supply contact 490 Maintenance jig 491 Jig body 492 Cathode chamber 493 Cathode 494 Diaphragm 494a First surface 494b Second surface 494-1 Anion exchange membrane 494-2 Porous membrane 495 Porous body 496 Connecting member 497 Power supply 498 Positive voltage port 1000 Plating apparatus Wf Substrate Wf-a Surface to be plated

Claims

1. A maintenance jig for removing a metal film deposited on a power supply contact provided on a substrate holder of a plating apparatus, comprising: a cathode chamber configured to contain an electrolyte; a cathode disposed in the cathode chamber and configured to have a voltage applied between it and the power supply contact; and a diaphragm having a first surface that contacts the electrolyte in the cathode chamber and a second surface that contacts the power supply contact when the maintenance jig is installed on the substrate holder, the diaphragm being capable of holding the electrolyte in the cathode chamber and being configured to allow anions to pass from the first surface to the second surface.

2. A maintenance jig according to claim 1, further comprising a disc-shaped jig body having a diameter corresponding to a substrate held in the substrate holder, the jig body having a facing surface that faces the power supply contact when the jig body is installed in the substrate holder, wherein the cathode chamber includes a groove formed along the peripheral edge of the facing surface of the jig body, and the diaphragm is arranged to cover the groove of the cathode chamber.

3. The maintenance jig according to claim 2, wherein the diaphragm includes an anion exchange membrane having the first surface and the second surface.

4. The maintenance jig according to claim 2, wherein the diaphragm includes a porous membrane having the first surface and the second surface.

5. The maintenance jig according to claim 2, wherein the diaphragm includes an anion exchange membrane having a first surface and a porous membrane laminated on the anion exchange membrane and having a second surface.

6. The maintenance jig according to any one of claims 3 to 5, further comprising a water-retentive porous body laminated on the second surface.

7. The maintenance jig according to claim 6, further comprising: a power supply disposed within the jig body, wherein the negative voltage pole is connected to the cathode and the positive voltage pole is connected to a positive voltage port formed in the jig body; and a connecting member configured to connect the positive voltage port and the power supply contact when the maintenance jig is installed on the substrate holder.

8. A plating apparatus comprising: a plating tank for containing a plating solution; an anode disposed in the plating tank; a substrate holder configured to hold a substrate with the surface to be plated facing downward; and a maintenance jig according to any one of claims 1 to 5 for removing a metal film deposited on a power supply contact provided on the substrate holder.

9. A method for maintaining a power supply contact, comprising: a plating step of applying a plating treatment to a substrate held in a substrate holder; a leak detection step of detecting a leak of plating solution into the area of ​​the substrate holder where the power supply contact is installed after the plating step; an installation step of installing a maintenance jig according to any one of claims 1 to 5 on the substrate holder when a leak of plating solution is detected by the leak detection step; and a maintenance step of applying a voltage between the power supply contact and the cathode of the maintenance jig.

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