Laser light adjustment method, mounting head, component mounting machine, and adjustment jig

Abstract

A method according to the present invention adjusts an irradiation position of laser light emitted from a laser light emission unit of a component mounting machine including a mounting head which includes a mounting-holding unit that detachably holds a component mounting fixture for mounting a component onto a substrate, and a raising / lowering unit that raises and lowers the component mounting fixture in the vertical direction, and the laser light emission unit, which emits, in a direction inclined with respect to the vertical direction, laser light for heating a bonding material for boding the component and the substrate toward any of the bonding material, the component, and the substrate. Said method comprises: a jig attachment step for attaching an adjustment jig to the mounting-holding unit, the adjustment jig having a prescribed inclined surface that is substantially orthogonal to the optical axis of laser light which is emitted from the laser light emission unit; a light emission step for emitting laser light from the laser light emission unit toward the prescribed inclined surface of the adjustment jig attached to the mounting-holding unit; and an adjustment step for adjusting the irradiation position on the basis of drawing information that is drawn on the prescribed inclined surface which is irradiated with the laser light.

Description

Laser light adjustment method, mounting head, component mounting machine, and adjustment jig

[0001] The present specification relates to a laser light adjustment method, a mounting head, a component mounting machine, and an adjustment jig.

[0002] Conventionally, as a technology for mass-producing substrate products provided with electronic circuits, a method of joining components serving as circuit components to a substrate on which a circuit pattern is formed is known (see, for example, Patent Documents 1 and 2). As a production line for substrate production, some adopt a line configuration in which when mounting components on a substrate printed with solder as a joining material, the solder is heated by a reflow machine to secure a predetermined joining strength. There are also line configurations in which solder is applied to electrodes of components instead of being printed on a substrate, and line configurations in which conductive paste is used instead of solder.

[0003] On the other hand, when the substrate cannot be exposed to high temperatures due to its material or when a reflow machine is not used for efficiency improvement, there are techniques that use laser light to directly or indirectly heat the joining material in order to secure a predetermined joining strength between the component and the substrate.

[0004] The joining method described in Patent Document 1 uses laser light to heat the joining material. In this joining method, a laser light irradiation unit that irradiates laser light for heating the joining material provided on the mutually contacting contact surfaces of the component and the substrate is provided integrally with a component mounting tool that mounts the component on the substrate so as to be liftable and lowerable, and the laser light from the laser light irradiation unit is irradiated toward the joining material, the component, or the substrate from a direction inclined with respect to the lifting shaft that lifts and lowers the component mounting tool. Thereby, the joining material is heated directly or indirectly via the component or the substrate, and the component and the substrate are joined via the joining material.

[0005] Furthermore, the joining method described in Patent Document 2 uses laser light to heat and melt the joining metal. In this joining method, a laser light irradiation unit for irradiating the joining metal on the electrodes of the substrate with laser light is integrally provided with a component mounting device for attaching the component to the substrate so as to be able to move up and down, and the laser light from the laser light irradiation unit is irradiated toward the lead portion of the component from a direction inclined with respect to the lifting axis that moves the component mounting device up and down. As a result, the joining metal on the electrodes of the substrate is indirectly heated through the component, and the lead portion of the component and the electrodes of the substrate are joined via the joining metal.

[0006] International Publication No. 2023 / 203708 JP 3-217094 Publication

[0007] However, in joining methods such as those described in Patent Documents 1 and 2, where the laser beam is irradiated from a direction inclined with respect to the lifting axis, the smaller the size of the object to be irradiated with the laser beam, the more difficult it becomes to align the irradiation position of the laser beam on the object. Furthermore, in this method, since the laser beam is incident at an oblique angle to the irradiation surface of the object, the spot shape of the laser beam on the irradiation surface of the object becomes a vertically elongated ellipse or rectangle compared to a normal perfect circle or a positive direction, and as a result, it may become difficult to adjust the irradiation position of the laser beam on the object.

[0008] Therefore, the objective of this specification is to provide a laser beam adjustment method, a mounting head, a component mounting machine, and an adjustment jig that enable easy adjustment of the irradiation position of the laser beam on the target object when heating a bonding material that joins a component and a substrate.

[0009] This specification discloses a method for adjusting the irradiation position of laser light emitted from a laser light irradiation unit of a component mounting machine, comprising: a mounting head having a mounting and holding unit for detachably holding a component mounting device for mounting a component to a substrate, and a lifting and lowering unit for raising and lowering the component mounting device in the vertical direction; and a laser light irradiation unit for irradiating a laser beam for heating a bonding material that joins the component and the substrate, toward the bonding material, the component, or the substrate in a direction inclined with respect to the vertical direction, the method comprising: a jig mounting step of attaching an adjustment jig having a predetermined inclined surface substantially perpendicular to the optical axis of the laser light emitted from the laser light irradiation unit to the mounting and holding unit; a light irradiation step of irradiating the laser light from the laser light irradiation unit toward the predetermined inclined surface of the adjustment jig attached to the mounting and holding unit; and an adjustment step of adjusting the irradiation position based on drawing information drawn on the predetermined inclined surface irradiated with the laser light.

[0010] This specification discloses a mounting head comprising: a mounting and holding section for detachably holding a component mounting device for mounting a component to a substrate; a lifting and lowering section for raising and lowering the component mounting device in the vertical direction; and a laser beam irradiation section for irradiating a laser beam for heating a bonding material that joins the component and the substrate, toward the bonding material, the component, or the substrate in a direction inclined with respect to the vertical direction, wherein the irradiation position of the laser beam irradiated from the laser beam irradiation section is adjustable, and the mounting head comprises: an adjustment jig attached to the mounting and holding section and having a predetermined inclined surface substantially perpendicular to the optical axis of the laser beam irradiated from the laser beam irradiation section; a light irradiation control section for irradiating the laser beam from the laser beam irradiation section toward the predetermined inclined surface of the adjustment jig attached to the mounting and holding section; and an adjustment section for adjusting the irradiation position based on drawing information drawn on the predetermined inclined surface irradiated with the laser beam.

[0011] This specification discloses a component mounting machine equipped with the above-described mounting head.

[0012] Furthermore, this specification discloses an adjustment jig used in a device for adjusting the irradiation position of laser light emitted from the laser light irradiation unit of a component mounting machine, which comprises a mounting head having a mounting and holding unit for detachably holding a component mounting device for mounting a component to a substrate, and a lifting and lowering unit for raising and lowering the component mounting device in the vertical direction, and a laser light irradiation unit for irradiating laser light for heating a bonding material that joins the component and the substrate in a direction inclined with respect to the vertical direction toward the bonding material, the component, or the substrate, and which is attached to the mounting and holding unit, the adjustment jig having a predetermined inclined surface substantially perpendicular to the optical axis of the laser light emitted from the laser light irradiation unit.

[0013] According to these disclosures, the irradiation position of the laser beam on the target object can be easily adjusted when heating the bonding material that joins the component and the substrate.

[0014] Furthermore, this specification also discloses the technical idea of ​​changing "the laser beam adjustment method described in claim 1" to "the laser beam adjustment method described in claim 1 or 2" in claim 3 of the original application, and the technical idea of ​​changing "the mounting head described in claim 4" to "the mounting head described in claim 4 or 5" in claim 6 of the original application.

[0015] This is a schematic plan view showing the overall configuration of a component mounting machine equipped with a mounting head according to one embodiment. This is a perspective view of a nozzle tool provided on the mounting head. This is a perspective view of the mounting head equipped with a laser beam irradiation unit. This is a view showing the mounting head and laser beam irradiation unit viewed from below. This is a view showing the suction nozzle held in the nozzle holder of the mounting head mounting a component to the substrate. This is a perspective view of an adjustment jig held in the nozzle holder for adjusting the laser beam irradiation position. This is a view showing the state in which laser light is irradiated from the laser beam irradiation unit onto the adjustment jig held in the nozzle holder. This is a flowchart of an example of a control routine executed in the laser beam adjustment method according to one embodiment.

[0016] A laser beam adjustment method, mounting head, component mounting machine, and adjustment jig according to one embodiment will be described below with reference to Figures 1 to 8.

[0017] 1. Overall Configuration of the Component Mounting Machine The component mounting machine 1 is a device that mounts components P onto a substrate B. The component mounting machine 1 constitutes a substrate production system that produces substrate products with components P mounted using multiple types of substrate work machines. Component P is a circuit component of an electronic circuit. Substrate B is a workpiece on which the circuit pattern of an electronic circuit is formed.

[0018] In the component mounting machine 1, components P are mounted onto the substrate B using a bonding material M. The bonding material M generates a predetermined bonding force when heated, and is, for example, a non-conductive resin material or solder. As shown in Figure 1, the component mounting machine 1 includes a substrate transport device 10, a component supply device 20, and a component transfer device 30. In Figure 1, the direction from left to right on the page is the horizontal X direction in which the substrate B is transported, the direction from the bottom to the top of the page is the horizontal Y direction in which the feeder 21 supplies components P, and the direction from the back to the front of the page is the vertical Z direction.

[0019] The substrate transport device 10 is a device that transports substrates B in the X direction. The substrate transport device 10 can sequentially transport multiple substrates B in the X direction and position the substrates B at a work position near the center of the base 2 of the component mounting machine 1 for component mounting. The substrate transport device 10 is composed of a pair of guide rails 11, a transport belt (not shown), and a clamping mechanism 12, etc.

[0020] The guide rail 11 is a rail member that extends in the X direction, traversing the center of the upper surface of the base 2 of the component mounting machine 1. A pair of guide rails 11 are assembled to the base 2 parallel to each other. The conveyor belt is a member that rotates along the guide rail 11. This conveyor belt rotates with two sides of the substrate B that are opposite in the Y direction and parallel in the X direction placed on it, and transports the substrate B to the work position. The clamping mechanism 12 pushes up the substrate B that has been transported to the work position, clamps it, and positions it.

[0021] The component supply device 20 is a device that supplies components P to be mounted on the substrate B to predetermined supply positions. The component supply device 20 is located on the base 2 on the Y-direction front side of the substrate transport device 10. The component supply device 20 has a feeder 21, a slot 22, and a bonding material supply unit 23. The slot 22 is a part provided on the base 2 where the feeder 21 is mounted. Multiple slots 22 are provided on the component supply device 20, arranged in the X direction. The component supply device 20 can supply components with multiple feeders 21 arranged in the X direction and set in the slots 22.

[0022] The feeder 21 is formed in a flattened shape that is long in the Y direction and thin in the X direction. The feeder 21 is, for example, a tape feeder that feeds and moves a carrier tape containing multiple parts P at predetermined intervals in the longitudinal direction of the tape toward the back in the Y direction to sequentially supply each part P to a predetermined supply position so that it can be picked up, or a bulk feeder that supplies parts P contained in bulk (i.e., loose and not in a constant orientation) to a predetermined supply position so that they can be picked up. Unlike tape feeders, bulk feeders have the advantage of being able to omit the loading of carrier tapes and the collection of used tapes by supplying parts P contained in bulk.

[0023] The bonding material supply unit 23 is the part that supplies the bonding material M. The bonding material supply unit 23 is located upstream of the slot 22 in the X direction on the base 2. The bonding material supply unit 23 has a supply tray capable of holding liquid bonding material M inside, a supply mechanism that replenishes bonding material M inside the supply tray when the bonding material M is consumed and decreases, and a heat retention unit that applies heat to the bonding material M inside the supply tray to prevent solidification due to temperature drop. The supply tray is formed in the shape of a flat-bottomed tray that opens upward. Preferably, the supply tray has a mechanism to flatten the liquid surface of the bonding material M as needed. The heat retention unit is located below the supply tray.

[0024] The bonding material M generates a predetermined bonding force when it cools and solidifies after being heated to a predetermined temperature or higher. The bonding material M is applied to at least one of the contact surfaces of the component P and the substrate B that come into contact with each other. In this embodiment, the bonding material M is applied to the lower surface (contact surface) of the component P by the bonding material supply unit 23. However, it is not limited to this, and the bonding material M may also be applied to the upper surface (contact surface) of the substrate B where the component P is bonded, or it may be printed by a solder printing machine. An example of a predetermined temperature for heating the bonding material M is about 100°C. An example of a bonding material M application thickness is about 10 μm.

[0025] The material of the bonding agent M is selected considering the materials of the component P and the substrate B. The predetermined temperature and application thickness of the bonding agent M are set appropriately according to the material and properties of the bonding agent M. As the bonding agent M, an adhesive of the type that generates a predetermined bonding strength when heated above a predetermined temperature may be used instead of a resin material. The bonding agent supply unit 23 may be configured to apply the bonding agent M to the component P using a brush, or to spray the bonding agent M towards the component from a spray nozzle. Alternatively, a configuration in which the bonding agent M is pre-applied to the component P supplied from the feeder 21 or another type of component supply unit, and the bonding agent supply unit 23 is omitted, may be applied.

[0026] The component transfer device 30 is a device that transfers components P supplied to a predetermined supply position by the component supply device 20 to a predetermined mounting position on a substrate B positioned at the work execution position by the substrate transport device 10. The transfer by this component transfer device 30 includes the operation of picking up components P at the predetermined supply position and the operation of placing or mounting components P at the predetermined mounting position, and in some cases includes the operation of applying a bonding material M.

[0027] As shown in Figures 1, 2, 3, and 4, the component transfer device 30 includes a Y-axis moving body 31, an X-axis moving body 32, a mounting head 33, a tool member 34, a component mounting device 35, a substrate recognition camera 36, ​​a component recognition camera 37, a nozzle station 38, and a laser beam irradiation unit 39.

[0028] The Y-axis moving body 31 is a moving body that moves in the Y direction. The Y-axis moving body 31 is formed to extend in the X direction. The Y-axis moving body 31 is driven by a Y-direction drive mechanism (not shown). The X-axis moving body 32 is a moving body that moves in the X direction. The X-axis moving body 32 is attached to the Y-axis moving body 31 so as to be movable in the X direction. The X-axis moving body 32 is driven by an X-direction drive mechanism (not shown).

[0029] The mounting head 33 is a head member for moving the component mounting device 35 that mounts the component P onto the substrate B. The mounting head 33 is detachably attached to the X-axis moving body 32 by a clamping mechanism (not shown). The mounting head 33 can be moved in a horizontal plane including the Y and X directions by the movement of the Y-axis moving body 31 and the X-axis moving body 32.

[0030] The tool member 34 is a member that detachably holds a plurality (for example, 12 in the example shown in Figure 2) of component holders 35. The tool member 34 constitutes a part of the mounting head 33 and is supported by the head body of the mounting head 33. The tool member 34 is formed in a substantially cylindrical shape. The tool member 34 is formed as an integral part of a rotating body that is supported by the head body and rotates around a central axis AV (see Figure 2) extending in the Z direction. The tool member 34 can rotate around the central axis AV due to the rotation of the rotating body around the central axis AV.

[0031] The component mounting device 35 is a component used to mount the component P onto the substrate B. Multiple component mounting devices 35 are mounted on the tool member 34 around the central axis AV. The component mounting devices 35 can revolve around the central axis AV by the rotation of the tool member 34. The component mounting devices 35 can move up and down in the Z direction along the lifting axis by driving the lifting unit 33a, which will be described later. By moving up and down, the component mounting device 35 approaches the component P on the feeder 21 and holds the component P at its lower end, and then approaches the substrate B and places the component P at its lower end onto the substrate B.

[0032] The component mounting device 35 is a suction nozzle that performs a suction operation on the nozzle tip by supplying negative pressure air to pick up components P from the feeder 21, and also performs a placement operation on the substrate B by stopping the supply of negative pressure air or supplying positive pressure air to attach the picked-up components P to the substrate B. When the component mounting device 35 is a suction nozzle, the tool member 34 is a nozzle tool capable of holding multiple suction nozzles. In addition, the component mounting device 35 may be a type of mounting device with a chuck for gripping components, or other types of mounting devices, instead of a suction nozzle.

[0033] As shown in Figure 2, the tool member 34 includes a tool body 41, a mounting and holding portion 42, an elastic body 43, a θ-axis gear 44, a cylindrical gear 45, a locking piece 46, and a valve operating piece 47.

[0034] The tool body portion 41 is the main body component of the tool member 34. The tool body portion 41 is supported on the underside of the head body of the mounting head 33. The tool body portion 41 is driven by an R-axis drive mechanism (not shown) provided on the head body of the mounting head 33, and rotates around the central axis AV. When the tool body portion 41 rotates, the entire tool member 34 rotates.

[0035] The mounting and holding portion 42 is a member that detachably holds the component holder 35. For example, when the component holder 35 is a suction nozzle, the mounting and holding portion 42 is a nozzle holder that holds the suction nozzle. The mounting and holding portion 42 extends shaft-like in the Z direction. The mounting and holding portion 42 is supported on the tool body portion 41 so as to be able to move up and down in the Z direction. Multiple mounting and holding portions 42 are provided on the tool body portion 41 (12 in Figure 2). The multiple mounting and holding portions 42 are arranged at equal angular intervals around the central axis AV of the tool body portion 41 and at equal distances radially outward from the central axis AV.

[0036] The number of mounting and holding portions 42 on the tool member 34 may vary depending on the type of mounting head 33. The mounting and holding portions 42 may be arranged at equal angular intervals around the central axis AV on the tool member 34, or they may be arranged linearly or in a matrix. Each mounting and holding portion 42 holds the component holder 35 via an elastic body 43. When the tool body 41 rotates, all the mounting and holding portions 42 of the tool member 34, and consequently all the component holders 35, revolve around the central axis AV.

[0037] The elastic body 43 is a member that generates elastic force between the mounting and holding portion 42 and the component holder 35. The elastic body 43 extends in the Z direction. The elastic body 43 is an elastically deformable coil spring or the like, with its upper end supported by the mounting and holding portion 42 and its lower end supported by the component holder 35. Under normal conditions, the elastic body 43 generates a pressing force that biases the component holder 35 downward relative to the mounting and holding portion 42, and holds the component holder 35 in its lower end position.

[0038] The component mounting device 35 has a structure that allows it to be held by the mounting and holding portion 42. That is, as shown in Figure 5, the component mounting device 35 has a cylindrical portion 35a, a flange portion 35b, and a locking pin portion 35c.

[0039] The cylindrical portion 35a is a part that extends cylindrically in the Z direction. The upper part of the cylindrical portion 35a is inserted into the cylindrical space of the mounting and holding portion 42 when the component mounting device 35 is held by the mounting and holding portion 42. The flange portion 35b is a part that protrudes radially outward in a flange-like manner from the outer surface of the cylindrical portion 35a along its entire circumference. For example, a label indicating individual identification information of the adjustment jig 60 is attached to the upper surface of the flange portion 35b. The lower surface of the flange portion 35b is the surface that forms the background of the component P held at the lower end of the component mounting device 35 when the component mounting device 35 is imaged from below.

[0040] The locking pin portion 35c is the part that locks the component holder 35 to the mounting and holding portion 42. The locking pin portion 35c extends radially outward from the outer surface of the cylindrical portion 35a in a rod shape. Two locking pin portions 35c are provided on either side of the axis of the cylindrical portion 35a. The two locking pin portions 35c may be formed by a single pin passing through the cylindrical portion 35a. The component holder 35 is mounted to the mounting and holding portion 42 by the locking of the two locking pin portions 35c into locking grooves formed in the mounting and holding portion 42, which will be described later.

[0041] Furthermore, the mounting and holding portion 42 has a structure that allows the component mounting device 35 to be attached and detached. That is, as shown in Figure 7, the mounting and holding portion 42 has a syringe portion 42a, a locking ring portion 42b, and an elastic body portion 42c. The syringe portion 42a is a cylindrical part that forms the main body of the mounting and holding portion 42. The syringe portion 42a has a locking groove (not shown) into which the locking pin portion 35c of the component mounting device 35 is fitted and locked. This locking groove is open downward at the lower end of the syringe portion 42a, extends upward from the lower end of the syringe portion 42a and extends circumferentially, extends further downward, and is closed at the end without being opened at the lower end of the syringe portion 42a. That is, this locking groove is formed in the shape of, for example, an inverted L or an inverted J.

[0042] The locking ring portion 42b is an annular part that assists in attaching the component holder 35 to the mounting and holding portion 42. The elastic body portion 42c is a part that generates elastic force between the syringe portion 42a and the locking ring portion 42b. The elastic body portion 42c is an elastically deformable coil spring or the like, with its upper end supported by the syringe portion 42a and its lower end supported by the locking ring portion 42b. The locking ring portion 42b and the elastic body portion 42c are located on the outer circumference of the lower part of the syringe portion 42a. In its normal state, the locking ring portion 42b is located in the Z direction position where the gravity of the locking ring portion 42b and the elastic force of the elastic body portion 42c are balanced relative to the syringe portion 42a. The elastic body portion 42c contracts when the locking ring portion 42b is pressed upward from below, and then expands back to its original state when the pressing force is released.

[0043] The θ-axis gear 44 is a gear integrally provided on the upper portion of the mounting and holding portion 42. The θ-axis gear 44 is provided for each mounting and holding portion 42. The cylindrical gear 45 is a large-diameter gear provided on the central axis AV. The cylindrical gear 45 meshes with all the θ-axis gears 44. The cylindrical gear 45 is arranged radially inward of each θ-axis gear 44. The cylindrical gear 45 is driven by a θ-axis drive mechanism (not shown) provided on the mounting head 33, and rotates about the central axis AV. When the cylindrical gear 45 rotates on its axis, all the mounting and holding portions 42 and all the component mounting tools 35 revolve around the central axis AV collectively.

[0044] The locking piece 46 is a member that moves the mounting and holding portion 42 up and down. The locking piece 46 is supported so as to be able to move up and down with respect to the tool main body portion 41. The locking piece 46 is arranged radially outward of the θ-axis gear 44. The locking piece 46 is provided for each mounting and holding portion 42. The locking piece 46 is driven by an elevating portion 33a provided on the mounting head 33 to move up and down in the Z direction (see the arrow MV shown in FIG. 2). When the locking piece 46 moves up and down, the mounting and holding portion 42 moves up and down between an ascending position and a descending position along an elevating shaft extending in the Z direction, and at the same time the component mounting tool 35 moves up and down.

[0045] The valve operating piece 47 is a member that opens and closes an air flow path (not shown) connected to the component mounting tool 35. The valve operating piece 47 is provided for selectively switching the air guided to the air flow path between negative pressure air and positive pressure air. The valve operating piece 47 is provided for each mounting and holding portion 42.

[0046] The elevating portion 33a described above is an elevating device that moves the component mounting tool 35 up and down in the Z direction. The elevating portion 33a is provided corresponding to one or a plurality of limited positions on the revolution track of the component mounting tool 35. The elevating shaft of the elevating portion 33a is set to pass through the position. Hereinafter, the position where the elevating shaft of the elevating portion 33a is set is referred to as a liftable position AP. The liftable position AP is fixed in position relative to the mounting head 33 regardless of the rotation of the tool member 34. Only the component mounting tool 35 that has entered the liftable position AP can move up and down relative to the tool main body portion 41.

[0047] The lifting / lowering section 33a is operationally controlled by the control section 33b. The control section 33b is configured by software such as a microcomputer. For example, the control section 33b sets the lowering position at which the lifting / lowering section 33a lowers the mounting and holding section 42 via the locking piece 46, and the dwell time for which the mounting and holding section 42 remains at the lowering position.

[0048] In the mounting head 33 described above, when the component mounting tool 35 that holds the component P enters the liftable position AP and is lowered toward the substrate B by the driving of the lifting / lowering section 33a, initially the mounting and holding section 42 and the component mounting tool 35 interlock with each other and lower integrally. Then, when the component P abuts against the substrate B, the lowering of the component mounting tool 35 is restricted, while the mounting and holding section 42 continues to lower while the elastic body 43 undergoes compressive deformation. In this case, while the compression amount of the elastic body 43 gradually increases, the downward pressing force acting on the component P from the elastic body 43 via the component mounting tool 35 gradually increases.

[0049] That is, the component mounting tool 35 is attached to the mounting head 33 side via the elastic body 43, and presses the component P against the substrate B with the pressing force generated by the compression of the elastic body 43. When the component P is pressed against the substrate B in this manner, the bonding between the substrate B and the component P using the bonding material M is stabilized. After this bonding is completed, when the mounting and holding section 42 subsequently rises from the lowering position, the compression amount of the elastic body 43 decreases, and the downward pressing force acting on the component P from the elastic body 43 gradually decreases. Then, when the component mounting tool 35 moves away from the component P mounted on the substrate B and rises, the pressing force disappears.

[0050] When the lowering position of the mounting and holding section 42 is set to be relatively low, the compression amount of the elastic body 43 increases, and the pressing force when the component mounting tool 35 presses the component P against the substrate B increases. Conversely, when the lowering position of the mounting and holding section 42 is set to be relatively high, the compression amount of the elastic body 43 decreases, and the pressing force when pressing the component P against the substrate B decreases.

[0051] The control unit 33b can set a variable pressing force of the component holder 35 when it is pressing the component P against the substrate B. The control unit 33b may change the set pressing force of the component holder 35 according to, for example, the type of component P and the type of bonding material M. For example, a recommended value for the pressing force during bonding may be determined depending on the type of bonding material M. In that case, the control unit 33b sets a pressing force corresponding to that recommended value.

[0052] Furthermore, the control unit 33b can variably set the residence time during which the mounting and holding unit 42 remains in the lowered position. In other words, the control unit 33b can set an appropriate residence time based on the method of performing the joining work and the expected heating time. In addition, the control unit 33b may change the residence time depending on at least one of the type of part P and the type of joining material M.

[0053] The substrate recognition camera 36 is a camera that captures position reference marks attached to the substrate B from above. The substrate recognition camera 36 is positioned on the mounting head 33 or the X-axis moving body 32. The substrate recognition camera 36 has a downward-facing optical axis. The image data captured by the substrate recognition camera 36 is processed and used to recognize the work position on the substrate B. Examples of the substrate recognition camera 36 include digital imaging devices having image sensors such as CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor).

[0054] The component recognition camera 37 is a camera that captures images of the component P held by the component mounting device 35 from below while the mounting head 33 is moving onto the substrate B. The component recognition camera 37 is positioned on a base 2 between the substrate transport device 10 and the component supply device 20. The component recognition camera 37 has an upward-facing optical axis. The image data captured by the component recognition camera 37 is processed. The results of this image processing are used to determine the quality of the adhesive M applied to the component P, to detect the position and orientation of the component P relative to the component mounting device 35, and to mount the component P onto the substrate B. As an example of the component recognition camera 37, a digital imaging device having an image sensor such as a CCD or CMOS can be used.

[0055] The nozzle station 38 is a part that interchangeably holds multiple component holders 35. The component holders 35 held in the nozzle station 38 are interchangeable with the component holders 35 held in the mounting and holding portion 42 of the tool member 34. The nozzle station 38 is located on the base 2 between the substrate transport device 10 and the component supply device 20, and is provided adjacent to the component recognition camera 37 in the X direction.

[0056] Multiple types of component mounters 35 are available, for example, each with different nozzle diameters. The component mounters 35 held in the mounting and holding section 42 of the tool member 34 are replaced as appropriate according to various components P of different sizes and various substrates B of different types. Furthermore, the component mounters 35 held in the mounting and holding section 42 of the tool member 34 may be replaced with another component mounter 35 of the same type when the error rate of the current component mounter 35's suction and mounting operations increases. The mounting head 33 has a function to move to the nozzle station 38 and automatically replace the component mounter 35. Note that the component mounter 35 may be replaced manually, not just automatically as described above. In addition, the mounting head 33 may have a function to automatically replace the tool member 34, or the tool member 34 may be replaced manually.

[0057] The laser beam irradiation unit 39 is a device that irradiates laser beam LL to heat the bonding material M that joins the component P and the substrate B. The laser beam irradiation unit 39 irradiates laser beam LL towards the bonding material M, component P, or substrate B at an appropriate timing. The laser beam irradiation unit 39 irradiates laser beam LL towards the bonding material M, component P, or substrate B from a direction inclined with respect to the lifting axis. Note that the target of the laser beam LL irradiation can be any one or more of the bonding material M, component P, or substrate B.

[0058] The laser beam irradiation unit 39 constitutes part of the mounting head 33 and is supported by the head body of the mounting head 33. There are two laser beam irradiation units 39, one on each side of the mounting head 33 in the X direction. The two laser beam irradiation units 39 are positioned symmetrically on either side of the mounting head 33 in the X direction, at the same position in the Y direction. If there are two vertically movable positions AP on which the component mounting device 35 can move up and down around the central axis AV of the tool member 34, the two laser beam irradiation units 39 may be positioned offset in the Y direction, sandwiching the mounting head 33 in the X direction. Alternatively, the laser beam irradiation unit 39 may be provided on the X-axis moving body 32 to which the mounting head 33 is integrated, instead of on the head body of the mounting head 33.

[0059] With the laser beam irradiation unit 39 provided on this mounting head 33, it is unnecessary to place a dedicated heating device for heating the bonding material M in the pre-process or post-process of the component mounting machine 1. This makes it possible to shorten the bonding work line, save space, and reduce line construction costs.

[0060] As shown in Figures 3 and 5, the laser beam irradiation unit 39 includes an optical switching mechanism 51, a laser light source 52, and a reflective mirror 53.

[0061] The optical switching mechanism 51 is the part that switches the irradiation position of the laser beam LL. The optical switching mechanism 51 switches the irradiation position of the laser beam LL by changing the position of the laser light source 52 and the reflective mirror 53 relative to the mounting head 33. Specifically, the optical switching mechanism 51 can raise and lower the laser light source 52 and the reflective mirror 53 in the Z direction, thereby changing the height position of the laser light source 52 and the reflective mirror 53 in the Z direction. The optical switching mechanism 51 is provided in contact with the upper surface and the outer side surface (right side or left side) in the X direction of the mounting head 33.

[0062] Furthermore, the optical switching mechanism 51 may have the function of finely adjusting the height positions of the laser light source 52 and the reflective mirror 53 between an elevated position and a lowered position by using, for example, a servo motor as a drive source. Alternatively, the optical switching mechanism 51 may fix the height position of the laser light source 52 on the mounting head 33 and raise or lower only the reflective mirror 53 in the Z direction. Also, instead of a servo motor, the optical switching mechanism 51 may use, for example, a linear motor or an air-operated mechanism. Furthermore, the optical switching mechanism 51 may move the laser light source 52 and the reflective mirror 53 in the X and Y directions relative to the mounting head 33, in addition to or in conjunction with raising and lowering the laser light source 52 and the reflective mirror 53 in the Z direction, thereby changing their X and Y positions.

[0063] The laser light source 52 is a light source that emits laser light LL. The laser light source 52 is formed in a rectangular parallelepiped shape that is elongated in the Z direction. The laser light source 52 is supported by the optical switching mechanism 51 so as to be able to move up and down. The laser light source 52 emits laser light LL downward parallel to the lifting axis. The type of laser light LL is suitable for heating the bonding material M. The intensity of the laser light LL is, for example, the highest class 4 as specified in the JIS standard. With this laser light LL, the bonding material M can be heated to a predetermined temperature or higher with irradiation of the laser light LL for a short time on the order of tens of milliseconds.

[0064] The reflective mirror 53 is a mirror that reflects the laser light LL emitted from the laser light source 52. The reflective mirror 53 is positioned below the laser light source 52 using a support member 54. The reflective mirror 53 moves up and down integrally with the laser light source 52. The reflective mirror 53 reflects the laser light LL emitted downward from the laser light source 52 in an oblique downward direction, inclined with respect to the vertical axis, and facing in the X direction. As a result, the laser light LL reaches the component P held by the component holder 35, which is located at the vertically movable position AP.

[0065] Furthermore, the laser beam LL may be irradiated onto the entire component P, or onto only a part of the component P. For example, in the case of a component P on which the entire bottom surface is coated with bonding material M, the laser beam LL may be irradiated onto the entire component P, heating the entire bonding material M. On the other hand, in the case of a component P on which solder or conductive paste as bonding material M is applied to the electrodes, the laser beam LL may be irradiated onto a part of the component P that is in close proximity to the electrodes, efficiently heating the electrodes and bonding material M. In addition, when the mounting angle of the component P is rotated by 90° when it is mounted on the substrate B, the optical switching mechanism 51 may be operated to irradiate the position of the electrodes of the component P with laser beam LL, thereby efficiently heating the electrodes.

[0066] Furthermore, instead of raising and lowering the laser light source 52 and the reflective mirror 53 relative to the mounting head 33 to switch the irradiation position of the laser light LL, the laser light irradiation unit 39 may change the tilt angle of the reflective mirror 53 while fixing the height position of the laser light source 52 and the reflective mirror 53. However, in this case, the change in the tilt angle of the reflective mirror 53 is performed within a range in which the optical axis of the laser light LL from the laser light irradiation unit 39 is substantially perpendicular to the predetermined inclined surface 65 of the adjustment jig 60 described later. In addition, the laser light irradiation unit 39 may be able to raise and lower the laser light source 52 and the reflective mirror 53 relative to the mounting head 33, and also be able to change the tilt angle of the reflective mirror 53, in order to switch the irradiation position of the laser light LL.

[0067] Furthermore, the laser beam irradiation unit 39 may use a prism or a glass refractor instead of the reflective mirror 53 to refract the downward-facing laser beam LL in a diagonally downward direction inclined with respect to the vertical axis. The reflective mirror 53, prism, and glass refractor are examples of optical members that reflect or refract the downward-facing laser beam LL in a direction inclined with respect to the vertical axis. The laser beam irradiation unit 39 may also have an optical path restricting member that restricts the laser beam LL from reaching the substrate B. This optical path restricting member is formed, for example, using a metal plate through which the laser beam LL does not pass, and is positioned diagonally below the component P held by the component mounting fixture 35 at the vertically movable position AP. This optical path restricting member protects the substrate B from being irradiated with the laser beam LL.

[0068] As shown in Figures 3 and 4, the two sets of laser beam irradiation units 39 each irradiate the component P held by the component mounting fixture 35 at the vertically movable position AP with laser beam LL. Note that the target of the laser beam LL is not limited to the component mounting fixture 35 at the vertically movable position AP, but may also be set to, for example, the component mounting fixture 35 located one position before the vertically movable position AP.

[0069] Furthermore, multiple laser beam irradiation units 39 are provided for a single lifting axis (lifting / lowering position AP). This allows two laser beams LL to be irradiated onto a single component P at the lifting / lowering position AP from different directions, making it easy to ensure high heating efficiency and sufficient heat. The two sets of laser beam irradiation units 39 are controlled synchronously, with the lifting / lowering of the two laser light sources 52 and the irradiation time of the laser beams LL synchronized.

[0070] Furthermore, the laser beam LL may be irradiated onto the contact surface of the substrate B to which the component P is to be joined, or, if a bonding material M is applied to the contact surface of the substrate B, the laser beam LL may be irradiated onto the bonding material M. The optical switching mechanism 51 can switch the irradiation position of the laser beam LL by changing the vertical position of the laser light source 52 and the reflective mirror 53 relative to the mounting head 33.

[0071] Furthermore, the optical switching mechanism 51 may also be configured to have a function for fine-tuning the irradiation position of the laser beam LL. For example, if the size or shape of component P changes due to differences in the type of component P, the irradiation position that can be heated efficiently changes, so the optical switching mechanism 51 fine-tunes the irradiation position of the laser beam LL. For example, with respect to two types of components P that have the same shape on the bottom surface but different heights, the optical switching mechanism 51 fine-tunes the irradiation position to be higher for the component P with the relatively larger height, and to be lower for the component P with the relatively smaller height. Also, if there are shape errors such as warping in the substrate B, the height position of the component P mounted on the substrate B will fluctuate, so the optical switching mechanism 51 fine-tunes the irradiation position to match the actual height position of the component P.

[0072] The component transfer device 30 can repeat multiple component bonding cycles on a substrate B positioned at the work execution position. In a component bonding cycle, first, the mounting head 33 moves above the feeder 21, and the component mounting tools 35 descend and ascend sequentially to perform a component suction operation. Next, the mounting head 33 moves above the bonding material supply unit 23, and the component mounting tools 35 descend and ascend sequentially to immerse and apply the bonding material M to the lower surface of the component P held by each component mounting tool 35. After that, the mounting head 33 moves above the component recognition camera 37, and the component recognition camera 37 takes an image. Then, the mounting head 33 moves above the substrate B, and the component mounting tools 35 descend and ascend sequentially to perform the component mounting operation.

[0073] Furthermore, the laser beam irradiation unit 39 irradiates the laser beam LL for at least a portion of the time while the mounting head 33 is moving from the bonding material supply unit 23 to above the substrate B, and while the component mounting device 35 is descending and rising above the substrate B. As a result, the bonding material M is heated to a predetermined temperature or higher, and then cools and solidifies, thereby performing the bonding operation. Once the mounting operation of the component P is complete, the mounting head 33 moves back towards the feeder 21. This series of operations constitutes one bonding cycle.

[0074] Furthermore, the laser beam irradiation unit 39 may irradiate the laser beam LL in a pattern selected according to the irradiation position and irradiation time of the laser beam LL, and whether the bonding material M is applied to component P or substrate B. Examples of such patterns include the following first and second patterns. The first and second patterns may be used in combination.

[0075] (1) The first pattern is one in which the irradiation of the laser beam LL is performed at a timing that includes the time when the component mounting tool 35 is in contact with the component P on the substrate B at the lowered position of the laser light source 52. In this first pattern, the irradiation of the laser beam LL is performed when the component mounting tool 35 is pressing the component P on the substrate B with a predetermined pressing force. In this case, since the bonding material M, the component P, and the substrate B are stacked vertically, it is preferable from the viewpoint of ease of laser irradiation that the irradiation position of the laser beam LL be the uppermost component P. In addition, in this first pattern, the irradiation of the laser beam LL is performed each time the tool member 34 rotates and each component mounting tool 35 performs the mounting operation in sequence.

[0076] (2) The second pattern is one in which the laser beam LL is irradiated during the time period before the component holder 35 makes contact with the substrate B at the raised position of the laser light source 52. In this second pattern, the laser beam LL is irradiated during the time period from when the component holder 35 picks up the component P from the feeder 21 until it moves to the substrate B and is in the process of descending. In this case, the irradiation position of the laser beam LL is the component P held by the component holder 35 at the raised position. In this second pattern, the bonding material M may be applied to the lower surface of the component P (pattern (2-1)), or the bonding material M may be applied to the contact surface of the substrate B (pattern (2-2)).

[0077] In the second pattern, the laser beam LL is directed towards the component P held by each component holder 35 each time the tool member 34 rotates and each component holder 35 reaches a vertically movable position AP, after the multiple component holders 35 on the tool member 34 have held the component P. In pattern (2-1), before the component P contacts the substrate B, the bonding material M attached to the underside of the component P is indirectly heated through the component P by the irradiation of the laser beam LL. In pattern (2-2), heat is accumulated in the component P before it contacts the substrate B, and after the component P contacts the substrate B, the bonding material M is heated by heat transfer from the component P.

[0078] As shown in Figure 1, the component mounting machine 1 is equipped with a control device 70. The control device 70 is mainly composed of a CPU, various memories, control circuits, etc. The control device 70 has a storage unit composed of an optical drive device such as a hard disk drive or flash memory, etc. Various data such as control programs used to control the mounting process, control programs used to adjust the irradiation position of the laser beam LL, and reference data are stored in this storage unit. The control device 70 has a light irradiation control unit 71 and a position control unit 72.

[0079] The light irradiation control unit 71 is the part that irradiates the laser beam LL from the laser beam irradiation unit 39 when adjusting the irradiation position of the laser beam LL. The light irradiation control unit 71 commands the laser beam irradiation unit 39 to irradiate the laser beam LL as described later, with the adjustment jig 60 described later attached to the mounting and holding part 42 of the mounting head 33. The laser beam irradiation unit 39 irradiates the laser beam LL according to the command from the light irradiation control unit 71.

[0080] The position control unit 72 is the part that switches the irradiation position of the laser beam LL. As described later, the position control unit 72 switches the irradiation position of the laser beam LL by at least one of the following: raising and lowering the laser light source 52 and the reflective mirror 53 by the optical switching mechanism 51, or changing the tilt angle of the reflective mirror 53, based on the result of the laser beam LL being irradiated by the optical irradiation control unit 71 in the state in which the adjustment jig 60 is attached to the mounting and holding part 42.

[0081] 2. Laser Beam Adjustment Method The laser beam irradiation unit 39 is composed of a laser light source 52 that emits laser beam LL downward parallel to the lifting axis of the lifting unit 33a, and a reflective mirror 53 that reflects the emitted laser beam LL in an oblique downward direction inclined with respect to the lifting axis. With this configuration, laser beam LL can be irradiated toward the part P at the tip of the part holder 35 held by the mounting and holding part 42 of the rotating tool member 34.

[0082] However, in this laser irradiation method, the laser beam LL is incident at an oblique angle to the irradiation surface of the target object. As a result, the spot shape of the laser beam LL on the irradiation surface of the target object becomes a vertically elongated ellipse or rectangle compared to, for example, a perfect circle or square in a structure where the laser beam LL is incident perpendicularly to the irradiation surface of the target object. Consequently, it may become difficult to adjust the irradiation position of the laser beam on the target object.

[0083] Therefore, in this embodiment, the irradiation position of the laser beam LL on the irradiated object is easily adjusted when heating the bonding material M that joins the component P and the substrate B. Specifically, an adjustment jig 60 is attached to the mounting and holding part 42 in place of the component mounting tool 35, and the irradiation position of the laser beam LL irradiated from the laser beam irradiation part 39 is adjusted using the adjustment jig 60.

[0084] 2-1. Configuration of the Adjustment Jig The adjustment jig 60 has a shape that allows it to be held in the mounting and holding part 42, similar to the component mounting tool 35. Specifically, as shown in Figure 6, the adjustment jig 60 has a cylindrical part 61, a flange part 62, and a locking pin part 63.

[0085] The cylindrical portion 61 is a part that extends cylindrically in the Z direction. The upper part of the cylindrical portion 61 is inserted into the cylindrical space of the mounting and holding portion 42 when the component mounting device 35 is held by the mounting and holding portion 42. The flange portion 62 is a part that protrudes radially outward in a flange-like manner from the outer surface of the cylindrical portion 61 along its entire circumference. For example, a label indicating individual identification information of the adjustment jig 60 is attached to the upper surface of the flange portion 62.

[0086] The locking pin portion 63 is the part that locks the adjustment jig 60 to the mounting and holding portion 42. The locking pin portion 63 extends radially outward from the outer surface of the cylindrical portion 61 in a rod shape. There are two locking pin portions 63, one on each side of the axis of the cylindrical portion 61. The two locking pin portions 63 may be formed by a single pin passing through the cylindrical portion 61. The adjustment jig 60 is mounted to the mounting and holding portion 42 by the locking of the two locking pin portions 63 into the locking grooves formed in the mounting and holding portion 42.

[0087] The adjustment jig 60 also has a predetermined inclined surface 65. The predetermined inclined surface 65 is a surface that is substantially perpendicular to the optical axis of the laser beam LL irradiated from the laser beam irradiation unit 39. The predetermined inclined surface 65 is formed to face diagonally upward with respect to the Z direction, which is the vertical direction when facing the X direction. That is, the angle at which the predetermined inclined surface 65 is inclined with respect to the Z direction corresponds to the angle at which the laser beam LL irradiated by the laser beam irradiation unit 39 is inclined with respect to the Z direction. The predetermined inclined surface 65 is formed in a planar shape over a wider area than the region in which the laser beam irradiation unit 39 irradiates the laser beam LL in order to heat the bonding material M when the component mounting tool 35 mounts the component P to the substrate B.

[0088] The predetermined inclined surface 65 is formed in a block-shaped portion 66 located below the flange portion 62. Two predetermined inclined surfaces 65 are provided in the block-shaped portion 66, corresponding to each of the two laser beam irradiation portions 39. The block-shaped portion 66 is formed so that its cross-sectional shape is trapezoidal, as shown in Figures 6 and 7, for example. The two predetermined inclined surfaces 65 are provided in the block-shaped portion 66 facing each other in the X direction.

[0089] The adjustment jig 60 further includes an irradiation area indicator 67. The irradiation area indicator 67 is a marker that indicates the area on the surface of a predetermined inclined surface 65 where the laser beam LL from the laser beam irradiation unit 39 should be irradiated. The irradiation area indicator 67 is formed on the surface of the predetermined inclined surface 65. The irradiation area indicator 67 may be drawn directly on the surface of the predetermined inclined surface 65, or a separate part such as a sticker may be attached to the surface of the predetermined inclined surface 65. In addition, the irradiation area indicator 67 may be formed in the shape of a frame surrounding the area so that it can be distinguished from other areas, or the entire area may be filled in. Furthermore, the irradiation area indicator 67 may be formed in the shape of a perfect circle or a polygon such as a square.

[0090] Furthermore, it is preferable that the irradiation area display unit 67 is displayed on the surface of the predetermined inclined surface 65 in a manner visible to a person. The position and range of the irradiation area display unit 67 on the predetermined inclined surface 65 are set so that, when the adjustment jig 60 is attached to the mounting and holding unit 42 and the component mounting device 35 is attached in place of the adjustment jig 60, the laser beam LL irradiated by the laser beam irradiation unit 39 in a direction inclined with respect to the Z direction is incident on a desired position of the irradiation target, whether it be the bonding material M, the component P, or the substrate B. In other words, there is a predetermined relationship between the desired position of the irradiation target to which the laser beam LL should be incident when the component mounting device 35 is held in the mounting and holding unit 42, and the position of the irradiation area display unit 67 on the predetermined inclined surface 65 when the adjustment jig 60 is attached to the mounting and holding unit 42. This predetermined relationship is used when adjusting the irradiation position of the laser beam LL, as described later.

[0091] 2-2. Laser Beam Adjustment Method In this embodiment, in order to adjust the irradiation position of the laser beam emitted from the laser beam irradiation unit 39 on the mounting head 33 of the component mounting machine 1, the following steps are performed in order, as shown in Figure 8: (1) Jig mounting step (step S100), (2) Light irradiation step (step S110), and (3) Adjustment step (step S120).

[0092] In the jig mounting process, the adjustment jig 60 is attached to the mounting and holding portion 42 of the mounting head 33. When a component mounter 35 is attached to the target mounting and holding portion 42, the adjustment jig 60 is attached to the mounting and holding portion 42 in exchange for the component mounter 35, as shown in Figure 7. Once the adjustment jig 60 is attached to the mounting and holding portion 42, the predetermined inclined surface 65 of its block-shaped portion 66 is set facing the laser beam irradiation portion 39 (specifically, the reflective mirror 53).

[0093] As described above, once the adjustment jig 60 is attached to the mounting and holding section 42 in the jig mounting process, the next step in the light irradiation process is for the light irradiation control section 71 of the control device 70 to irradiate the adjustment jig 60 with laser light LL from the laser light irradiation section 39 toward the predetermined inclined surface 65. When this irradiation is performed, the laser light LL irradiated from the laser light irradiation section 39 is incident on the predetermined inclined surface 65 of the adjustment jig 60.

[0094] If the laser beam LL incident on the predetermined inclined surface 65 of the adjustment jig 60 is not misaligned with respect to the irradiation area display unit 67, then, assuming the component mounting device 35 is held in the mounting and holding unit 42, the laser beam LL will incident on the desired position of the irradiation target, whether it be the bonding material M, component P, or substrate B. In this case, it is not necessary to adjust the irradiation position of the laser beam LL from the laser beam irradiation unit 39. On the other hand, if the laser beam LL incident on the predetermined inclined surface 65 of the adjustment jig 60 is misaligned with respect to the irradiation area display unit 67, then, assuming the component mounting device 35 is held in the mounting and holding unit 42, the laser beam LL will incident at a misalignment from the desired position of the irradiation target. In this case, it is necessary to adjust the irradiation position of the laser beam LL from the laser beam irradiation unit 39.

[0095] During the light irradiation process, when the laser beam LL is irradiated from the laser beam irradiation unit 39 toward a predetermined inclined surface 65 of the adjustment jig 60, drawing information of the laser beam LL drawn on the predetermined inclined surface 65 is detected. This detection of drawing information is performed by the position control unit 72. The position control unit 72 detects the drawing information of the laser beam LL on the predetermined inclined surface 65 by processing, for example, image data captured by the substrate recognition camera 36 or image data captured by a dedicated camera provided on the mounting head 33 for detecting this drawing information.

[0096] In the adjustment process, the irradiation position of the laser beam LL is adjusted based on the drawing information drawn by the laser beam LL on a predetermined inclined surface 65 onto which the laser beam LL is irradiated. Specifically, the position control unit 72 sets an adjustment amount to adjust the irradiation position of the laser beam LL based on the drawing information of the laser beam LL on the predetermined inclined surface 65, so that the laser beam LL from the laser beam irradiation unit 39 enters the irradiation area display unit 67, and issues an adjustment command to the optical switching mechanism 51 or the reflective mirror 53. This adjustment of the irradiation position of the laser beam LL is performed by raising and lowering the laser light source 52 and the reflective mirror 53 by the optical switching mechanism 51, or by changing the inclination angle of the reflective mirror 53. Note that this adjustment of the irradiation position of the laser beam LL may also be feedback controlled based on the drawing information of the laser beam LL on the predetermined inclined surface 65.

[0097] In the adjustment process described above, once the irradiation position of the laser beam LL from the laser beam irradiation unit 39 is adjusted, the laser beam LL will be incident within the irradiation area display unit 67 of the adjustment jig 60. In this case, if the component mounting tool 35 is held in the mounting and holding unit 42 instead of the adjustment jig 60, the laser beam LL will be incident on the desired position of the irradiation target, either the bonding material M, the component P, or the substrate B, so that the bonding material M can be appropriately heated by the irradiation of the laser beam LL from the laser beam irradiation unit 39.

[0098] As described above, according to this embodiment, an adjustment jig 60 having a predetermined inclined surface 65 is attached to the mounting and holding portion 42 of the mounting head 33, which detachably holds the component mounting device 35. Laser light LL is irradiated from the laser light irradiation unit 39 toward the predetermined inclined surface 65 of the adjustment jig 60, and the irradiation position of the laser light LL from the laser light irradiation unit 39 is adjusted based on the drawing information drawn by the laser light LL on the predetermined inclined surface 65 of the adjustment jig 60.

[0099] The predetermined inclined surface 65 of the adjustment jig 60 is a surface that is substantially perpendicular to the optical axis of the laser beam LL irradiated from the laser beam irradiation unit 39. In this configuration, the laser beam LL irradiated from the laser beam irradiation unit 39 is incident on the adjustment jig 60 substantially perpendicular to the predetermined inclined surface 65, so the spot shape of the laser beam LL drawn on the predetermined inclined surface 65 of the adjustment jig 60 is not stretched out from a normal circular or square shape, and it becomes possible to adjust the irradiation position of the laser beam LL from the laser beam irradiation unit 39 on the adjustment jig 60 (especially the irradiation area display unit 67) with high precision.

[0100] When the component mounting tool 35 is held in the mounting and holding section 42, the desired position of the irradiation target to which the laser beam LL should be incident, and the position of the irradiation area display section 67 on the predetermined inclined surface 65 when the adjustment jig 60 is attached to the mounting and holding section 42, are in a predetermined relationship. Therefore, if the irradiation position of the laser beam LL is adjusted accurately using the adjustment jig 60, the irradiation position of the laser beam LL on the irradiation target of the component mounting machine 1 will be adjusted to the desired position.

[0101] Therefore, according to this embodiment, when heating the bonding material M that joins the component P and the substrate B in the component mounting machine 1 using the laser beam irradiation unit 39, the irradiation position of the laser beam LL on the irradiation target, which is any of the bonding material M, component P, or substrate B, can be easily adjusted.

[0102] In the above embodiment, the position control unit 72 sets an adjustment amount to adjust the irradiation position of the laser beam LL from the laser beam irradiation unit 39 so that the laser beam LL from the laser beam irradiation unit 39 is incident into the irradiation area display unit 67, based on the drawing information of the laser beam LL on the predetermined inclined surface 65. According to this adjustment amount, at least one of the following is performed: raising or lowering the laser light source 52 and the reflective mirror 53 by the optical switching mechanism 51, or changing the inclination angle of the reflective mirror 53. This corresponds to the "adjustment unit" described in the claims.

[0103] 3. Modified Forms In the above embodiment, the component mounting device 35 presses the component P against the substrate B. However, the disclosure is not limited thereto, and a different type of component mounting device 35 may simply place the component P on the contact surface of the substrate B.

[0104] Furthermore, in the above embodiment, the control device 70 of the component mounting machine 1, in the position control unit 72, detects the drawing information of the laser beam LL drawn on the predetermined inclined surface 65 of the adjustment jig 60 while the laser beam LL is being irradiated from the laser beam irradiation unit 39 toward the predetermined inclined surface 65, and adjusts the irradiation position of the laser beam LL from the laser beam irradiation unit 39 by controlling the optical switching mechanism 51, etc., based on the detection result. However, the disclosure is not limited thereto, and the irradiation position of the laser beam LL from the laser beam irradiation unit 39 may be adjusted by the operator visually observing the drawing information of the laser beam LL drawn on the predetermined inclined surface 65 and, according to the result, by the operator's operation causing the laser beam irradiation unit 39 to move in the X, Y, and Z directions relative to the mounting head 33 or by changing the inclination angle of the reflection mirror 53.

[0105] Furthermore, this disclosure is not limited to the embodiments and modifications described above, and various modifications can be made without departing from the spirit of this disclosure.

[0106] 1: Component mounting machine, 10: Substrate transport device, 20: Component supply device, 21: Feeder, 23: Bonding material supply unit, 30: Component transfer device, 33: Mounting head, 33a: Lifting unit, 34: Tool member, 35: Component mounting device, 39: Laser beam irradiation unit, 41: Tool body unit, 42: Mounting and holding unit, 43: Elastic body, 51: Optical switching mechanism, 52: Laser light source, 53: Reflective mirror, 60: Adjustment jig, 61: Cylinder unit, 62: Flange unit, 63: Locking pin unit, 65: Determined inclined surface, 66: Block-shaped unit, 67: Irradiation area display unit, AP: Lifting and lowering position, AV: Central axis, LL: Laser beam, B: Substrate, P: Component, M: Bonding material.

Claims

1. A method for adjusting the irradiation position of laser light emitted from the laser light irradiation unit of a component mounting machine, comprising: a mounting head having a mounting and holding unit for detachably holding a component mounting device for mounting a component to a substrate, and a lifting and lowering unit for raising and lowering the component mounting device in the vertical direction; and a laser light irradiation unit for irradiating laser light for heating a bonding material that joins the component and the substrate, toward the bonding material, the component, or the substrate in a direction inclined with respect to the vertical direction, the method comprising: a jig mounting step of attaching an adjustment jig having a predetermined inclined surface substantially perpendicular to the optical axis of the laser light emitted from the laser light irradiation unit to the mounting and holding unit; a light irradiation step of irradiating the laser light from the laser light irradiation unit toward the predetermined inclined surface of the adjustment jig attached to the mounting and holding unit; and an adjustment step of adjusting the irradiation position based on drawing information drawn on the predetermined inclined surface irradiated with the laser light.

2. The laser beam adjustment method according to claim 1, wherein the adjustment jig has an irradiation area display unit that indicates an area on the surface of the predetermined inclined surface to be irradiated with the laser beam, and in the adjustment step, the irradiation position is adjusted so that the laser beam from the laser beam irradiation unit is incident into the irradiation area display unit.

3. The laser beam adjustment method according to claim 1, wherein in the adjustment step, the irradiation position is adjusted by any one of the following: vertical movement and horizontal movement of the laser beam irradiation unit, or a change in the irradiation angle of the laser beam from the laser beam irradiation unit.

4. A mounting head comprising: a mounting and holding section for detachably holding a component mounting device for mounting a component to a substrate; a lifting and lowering section for raising and lowering the component mounting device in the vertical direction; a laser beam irradiation section for irradiating a laser beam for heating a bonding material that joins the component and the substrate, toward the bonding material, the component, or the substrate in a direction inclined with respect to the vertical direction, wherein the irradiation position of the laser beam irradiated from the laser beam irradiation section is adjustable, comprising: an adjustment jig attached to the mounting and holding section and having a predetermined inclined surface substantially perpendicular to the optical axis of the laser beam irradiated from the laser beam irradiation section; a light irradiation control section for irradiating the laser beam from the laser beam irradiation section toward the predetermined inclined surface of the adjustment jig attached to the mounting and holding section; and an adjustment section for adjusting the irradiation position based on drawing information drawn on the predetermined inclined surface irradiated with the laser beam.

5. The mounting head according to claim 4, wherein the adjustment jig has an irradiation area display unit that indicates an area on the surface of the predetermined inclined surface to be irradiated with laser light, and the adjustment unit adjusts the irradiation position so that the laser light from the laser light irradiation unit is incident into the irradiation area display unit.

6. The mounting head according to claim 4, wherein the adjustment unit adjusts the irradiation position by any of the following: vertical movement and horizontal movement of the laser beam irradiation unit, and a change in the irradiation angle of the laser beam from the laser beam irradiation unit.

7. A component mounting machine comprising a mounting head as described in any one of claims 4 to 6.

8. An adjustment jig used in a device for adjusting the irradiation position of laser light emitted from the laser light irradiation unit of a component mounting machine, which comprises a mounting head having a mounting and holding unit for detachably holding a component mounting device for mounting a component to a substrate, and a lifting and lowering unit for raising and lowering the component mounting device in the vertical direction, and a laser light irradiation unit for irradiating laser light for heating a bonding material that joins the component and the substrate in a direction inclined with respect to the vertical direction toward the bonding material, the component, or the substrate, and the adjustment jig attached to the mounting and holding unit, the adjustment jig having a predetermined inclined surface substantially perpendicular to the optical axis of the laser light emitted from the laser light irradiation unit.

9. The adjustment jig according to claim 8, further comprising an irradiation area display unit that indicates an area on the surface of the predetermined inclined surface to be irradiated with laser light.

Images