Component transfer device

Abstract

A component transfer device comprises a control unit that controls a suction head and a push-up pin. In a push-up movement process, the control unit causes the push-up pin to move so that a tip of the push-up pin positioned below a sheet reaches a target push-up position in a state in which the tip of the suction head is in contact with a target component on the sheet from above. In a pickup process, the control unit causes the suction head to pick up the target component by moving upward in a state where the tip of the push-up pin is positioned at the target push-up position. When a pickup failure of the target component occurs in an evaluation process, the control unit changes the position of the tip of the push-up pin upward and downward in relation to the target push-up position using a specific component other than the target component on the sheet as a target, and evaluates whether or not the pickup of the specific component succeeds. In an updating process, the control unit updates the target push-up position according to the result of the evaluation process.

Description

Component Transfer Apparatus

[0001] The present invention relates to a component transfer apparatus.

[0002] Patent Document 1 discloses a die supply apparatus. This die supply apparatus includes a push-up pin disposed below a dicing sheet having a plurality of dies (components) adhered thereto, and a suction head (suction nozzle) that sucks and picks up a die from above the dicing sheet. The die supply apparatus gradually increases the height of the push-up position of the push-up pin and repeatedly performs the pick-up operation of the suction head until it is determined that the die has been picked up by the suction head. Then, the die supply apparatus determines the height of the push-up position of the push-up pin at the time when it is determined that the die has been picked up by the suction head as an appropriate height of the push-up position.

[0003] However, in the die supply apparatus disclosed in Patent Document 1, sufficient measures have not been taken for updating the push-up position of the push-up pin to an accurate push-up position that can suppress the occurrence of pick-up failures of the suction head.

[0004] Japanese Unexamined Patent Publication No. 2012-64752

[0005] An object of the present invention is to provide a component transfer apparatus capable of updating the push-up position of a push-up pin to an accurate push-up position that can suppress the occurrence of pick-up failures of a suction head.

[0006] A component transfer device according to one aspect of the present invention comprises: a component supply unit that supplies a plurality of components attached to an elastically deformable sheet; a suction head that is movable vertically above the sheet and picks up a target component from above among the plurality of components on the sheet; a push-up pin that is movable vertically below the sheet and pushes up the target component from below the sheet when the suction head picks up the target component; and a control unit that controls the suction head and the push-up pin. The control unit performs the following operations: an upward movement process in which the tip of the push-up pin is moved vertically so that the tip of the push-up pin reaches a target push-up position while the tip of the suction head is in contact with the target part; a pickup process in which the suction head is moved upward while the tip of the push-up pin is positioned at the target push-up position as a result of the upward movement process so that the suction head picks up the target part; an evaluation process in which, depending on the result of the suction head picking up the target part in the pickup process, the position of the tip of the push-up pin is changed vertically relative to the target push-up position for a specific part other than the target part among the plurality of parts on the sheet, and an evaluation process in which the suction head is evaluated to see whether the pickup of the specific part is successful or not; and an update process in which the target push-up position of the push-up pin is updated based on the vertical position of the tip of the push-up pin when the pickup of the specific part by the suction head is successful in the evaluation process.

[0007] Figure 1 is a plan view showing the overall configuration of a component mounting device as a component transfer device according to an embodiment. Figure 2 is a perspective view and a side view of the head unit and the push-up unit provided in the component mounting device. Figure 3 is a block diagram showing the control configuration of the component mounting device. Figure 4 is a flowchart showing the processing flow executed by the control unit of the control unit provided in the component mounting device. Figure 5 is a diagram illustrating the estimation process, imaging movement process, and contact movement process executed by the control unit. Figure 6 is a diagram illustrating the push-up movement process executed by the control unit. Figure 7 is a diagram illustrating the pickup process executed by the control unit. Figure 8 is a diagram illustrating the evaluation process executed by the control unit.

[0008] Embodiments of the present invention will be described below with reference to the attached drawings. Note that the following embodiments are merely examples of the present invention and do not limit the technical scope of the present invention.

[0009] Furthermore, the directional relationships will be explained below using the XYZ Cartesian coordinate axes. The X and Y directions are perpendicular to each other on the horizontal plane, and the Z direction is the vertical direction perpendicular to both the X and Y directions. In addition, one side of the X direction is called the "+X side," and the other side opposite to the X direction is called the "-X side." Similarly, one side of the Y direction is called the "+Y side," and the other side opposite to the Y direction is called the "-Y side." The Z direction is sometimes referred to as the vertical direction.

[0010] The component transfer apparatus according to this embodiment can be applied to various devices, such as a taping device that stores dies diced from a wafer onto a tape, a die bonder that wire-bonds dies to a substrate, and a component mounting device that mounts dies to a substrate. Here, we will describe an example in which the component transfer apparatus according to this embodiment is applied to a component mounting device.

[0011] [Overall Configuration of the Component Mounting Apparatus] Figure 1 is a plan view showing the overall configuration of the component mounting apparatus 1 according to this embodiment. Figure 2 is a perspective view and a side view of the head unit 4 and the push-up unit 40 provided in the component mounting apparatus 1. The component mounting apparatus 1 is an apparatus that mounts dies 7a (components) diced from a wafer 7 onto a substrate P. The component mounting apparatus 1 comprises a base 2, a conveyor 3, a head unit 4, a component supply unit 5, a wafer supply device 6, a camera unit 32U, and a push-up unit 40.

[0012] The base 2 is the mounting base for various devices provided by the component mounting device 1. The conveyor 3 is a transport line for the substrate P, installed on the base 2 so as to extend in the X direction. The conveyor 3 transports the substrate P from outside the device to a predetermined mounting position and, after the mounting work is completed, transports the substrate P from the mounting position to outside the device. The conveyor 3 has a clamping mechanism to hold the substrate P at the mounting position. The position where the substrate P is shown in Figure 1 is the mounting position.

[0013] The component supply unit 5 supplies multiple dies 7a in the diced state from the wafer 7. The component supply unit 5 includes a wafer supply device 6 that supplies the wafer 7, divided into multiple dies 7a, to the wafer stage 10 while it is held on a pallet 8. The wafer 7 is a disc-shaped semiconductor wafer on which circuit patterns and the like are formed. The pallet 8 holds an elastically deformable sheet 8a. An assembly of multiple dies 7a, formed by dicing the wafer 7 in a grid pattern, is attached to the sheet 8a. In other words, the wafer supply device 6 supplies the wafer 7, with the multiple dies 7a attached to the sheet 8a, to the wafer stage 10 while it is held on the pallet 8.

[0014] The wafer supply device 6 includes a wafer storage elevator 9, a wafer stage 10, and a wafer conveyor 11. The wafer storage elevator 9 stores wafers 7, with multiple dies 7a attached to a sheet 8a, in multiple vertical layers, with wafers 7 held on pallets 8. The wafer stage 10 is installed on a base 2 at the -Y side position of the wafer storage elevator 9. The wafer stage 10 is positioned to align with the +Y side with respect to the mounting work position, which is the stopping position of the substrate P. The wafer stage 10 becomes a component placement area where the multiple dies 7a attached to the sheet 8a are placed. The wafer conveyor 11 pulls the pallets 8 from the wafer storage elevator 9 onto the wafer stage 10.

[0015] The head unit 4 includes a plurality of suction heads 4H, a head lifting motor 4M, a ball screw shaft 4J, a ball nut 4N, and a spring 4S.

[0016] The suction head 4H is positioned above the wafer stage 10, that is, above the sheet 8a, and is movable in the vertical direction (Z direction) relative to the head unit 4, while being pulled upward by a spring 4S. Above the sheet 8a, the suction head 4H moves downward to hold the die 7a attached to the sheet 8a from above at a predetermined negative pressure level, and then moves upward while holding the die 7a to remove and pick up the die 7a from the sheet 8a. Furthermore, above the substrate P placed at the mounting work position on the conveyor 3, the suction head 4H releases the die 7a it is holding in response to the release of the negative pressure, thereby mounting the die 7a onto the substrate P.

[0017] The head lifting motor 4M is a motor that generates the driving force to move the suction head 4H in the vertical direction. The ball screw shaft 4J and ball nut 4N transmit the driving force of the head lifting motor 4M to the suction head 4H. The ball screw shaft 4J extends vertically while connected to the head lifting motor 4M and is rotationally driven by the head lifting motor 4M. The ball nut 4N is screwed onto the ball screw shaft 4J while fixed to the suction head 4H. When the head lifting motor 4M operates and the ball screw shaft 4J is rotationally driven, the suction head 4H, to which the ball nut 4N is fixed, moves vertically.

[0018] The head unit 4 is equipped with a head camera 31 that images the circuit board P. From the image data captured by the head camera 31, the federal marks attached to the circuit board P are recognized. This allows the misalignment of the circuit board P to be recognized, and the misalignment is corrected when the die 7a is mounted on the circuit board P.

[0019] A component recognition camera 30 is mounted on the base 2. The component recognition camera 30 captures an image of the die 7a, which is held by the suction head 4H, from below before it is mounted on the substrate P. Based on this captured image data, any abnormalities or suction errors in the die 7a by the suction head 4H are determined.

[0020] The component mounting apparatus 1 includes a head horizontal drive mechanism D1 that moves the head unit 4 horizontally (in the X and Y directions) in the space above the substrate P and wafer stage 10, which are positioned at the mounting work location on the conveyor 3. The head horizontal drive mechanism D1 includes a pair of Y-axis fixed rails 13 on the +X side and -X side, a head Y-axis motor 14, and a head Y-movement axis 15 as a mechanism for moving the head unit 4 in the Y direction. The pair of Y-axis fixed rails 13 are fixed on the base 2 and extend in the Y direction parallel to each other at a predetermined distance in the X direction. The head Y-movement axis 15 is a ball screw shaft that is positioned close to the Y-axis fixed rails 13 and extends in the Y direction. The head Y-axis motor 14 rotates the head Y-movement axis 15. A support frame 16 that supports the head unit 4 is installed between the pair of Y-axis fixed rails 13. Nuts 17 are attached to the +X side end and -X side end of the support frame 16, and these nuts are screwed onto the respective head Y movement axes 15.

[0021] The head horizontal drive mechanism D1, as a mechanism for moving the head unit 4 in the X direction, includes a guide member mounted on the support frame 16, a head X-axis motor 18, and a head X-movement shaft 19. The guide member is a member that guides the movement of the head unit 4 in the X direction and is fixed to the support frame 16 on the +Y side surface so as to extend in the X direction. The head X-movement shaft 19 is a ball screw shaft arranged close to the guide member so as to extend in the X direction. The head X-axis motor 18 rotationally drives the head X-movement shaft 19. A nut is attached to the head unit 4, and the nut is screwed onto the head X-movement shaft 19.

[0022] With the head horizontal drive mechanism D1 having the above configuration, the head Y-axis motor 14 is activated and the head Y-movement axis 15 is rotationally driven, causing the head unit 4 to move in the Y direction together with the support frame 16. In addition, the head X-axis motor 18 is activated and the head X-movement axis 19 is rotationally driven, causing the head unit 4 to move in the X direction relative to the support frame 16.

[0023] The camera unit 32U is a unit that can move in the X and Y directions and includes a component camera 32. The component camera 32 images a portion of the wafer 7 positioned on the wafer stage 10, that is, the die 7a on the sheet 8a, from above. Based on this captured image data, the position of the die 7a to be picked up by the suction head 4H is recognized.

[0024] The component mounting apparatus 1 includes a camera horizontal drive mechanism D2 that moves the camera unit 32U horizontally (in the X and Y directions) in the space above the wafer stage 10 and a predetermined standby position. This camera horizontal drive mechanism D2 is a separate and independent drive system from the head horizontal drive mechanism D1 that drives the head unit 4. The standby position is located away from the wafer stage 10 on the +Y side.

[0025] The camera horizontal drive mechanism D2, as a mechanism for moving the camera unit 32U in the Y direction, comprises a pair of Y-axis fixed rails 33 on the +X side and -X side, and a camera Y-axis motor 34 and camera Y-movement axis 35 located on the +X side. The pair of Y-axis fixed rails 33 are fixed on the base 2 and extend in the Y direction parallel to each other at a predetermined distance in the X direction. The camera Y-movement axis 35 is a ball screw shaft positioned to extend in the Y direction at a location close to the Y-axis fixed rail 33 on the +X side. The camera Y-axis motor 34 rotates the camera Y-movement axis 35. A support frame 36 supporting the camera unit 32U is installed between the pair of Y-axis fixed rails 33. A nut 37, which is screwed onto the camera Y-movement axis 35, is assembled to the +X side end of the support frame 36.

[0026] The camera horizontal drive mechanism D2, as a mechanism for moving the camera unit 32U in the X direction, includes a guide member mounted on the support frame 36, a camera X-axis motor 38, and a camera X-axis movement shaft 39. The guide member is a member that guides the movement of the camera unit 32U in the X direction and is fixed to the -Y side of the support frame 36 so as to extend in the X direction. The camera X-axis movement shaft 39 is a ball screw shaft arranged close to the guide member so as to extend in the X direction. The camera X-axis motor 38 rotates the camera X-axis movement shaft 39. A nut is attached to the camera unit 32U, and the nut is screwed onto the camera X-axis movement shaft 39.

[0027] With the camera horizontal drive mechanism D2 having the above configuration, the camera Y-axis motor 34 is activated and the camera Y-movement axis 35 is rotated, causing the camera unit 32U to move in the Y direction together with the support frame 36. In addition, the camera X-axis motor 38 is activated and the camera X-movement axis 39 is rotated, causing the camera unit 32U to move in the X direction relative to the support frame 36.

[0028] The push-up unit 40 is positioned below the wafer stage 10. The push-up unit 40 includes a push-up pin 47, a pin lifting motor 40M, a ball screw shaft 40J, and a ball nut 40N.

[0029] The push-up pin 47 is provided below the wafer stage 10, that is, below the sheet 8a, so as to be movable in the vertical direction relative to the push-up unit 40. By moving upward below the sheet 8a, the push-up pin 47 pushes up the die 7a, which is to be picked up by the suction head 4H, from below the sheet 8a. The push-up unit 40 also performs a process of sucking the sheet 8a around the die 7a when the push-up pin 47 pushes up the die 7a.

[0030] The pin lifting motor 40M is a motor that generates a driving force to move the push-up pin 47 in the vertical direction. The ball screw shaft 40J and ball nut 40N transmit the driving force of the pin lifting motor 40M to the push-up pin 47. The ball screw shaft 40J extends vertically while connected to the pin lifting motor 40M and is rotationally driven by the pin lifting motor 40M. The ball nut 40N is screwed onto the ball screw shaft 40J while fixed to the push-up pin 47. When the pin lifting motor 40M operates and the ball screw shaft 40J is rotationally driven, the push-up pin 47, to which the ball nut 40N is fixed, moves vertically.

[0031] The component mounting apparatus 1 includes a horizontal push-up drive mechanism D3 that moves the push-up unit 40 horizontally (in the X and Y directions) in the space below the wafer stage 10. The horizontal push-up drive mechanism D3 includes a pair of guide rails 41, a push-up Y-movement axis 43, and a push-up Y-axis motor 44 as a mechanism for moving the push-up unit 40 in the Y direction. The pair of guide rails 41 are fixed on the base 2 and extend in the Y direction parallel to each other at a predetermined distance in the X direction. The push-up Y-movement axis 43 is a ball screw shaft arranged to extend in the Y direction at a position close to the guide rails 41. The push-up Y-axis motor 44 rotates the push-up Y-movement axis 43. A support frame 42 that supports the push-up unit 40 is installed between the pair of guide rails 41. Nuts that are screwed onto the push-up Y-movement axis 43 are assembled to the support frame 42.

[0032] The upward horizontal drive mechanism D3 comprises a guide member mounted on the support frame 42, an upward X-axis movement shaft 45, and an upward X-axis motor 46 as a mechanism for moving the upward unit 40 in the X direction. The guide member is a member that guides the movement of the upward unit 40 in the X direction and is fixed to the -Y side surface of the support frame 42 so as to extend in the X direction. The upward X-axis movement shaft 45 is a ball screw shaft arranged close to the guide member so as to extend in the X direction. The upward X-axis motor 46 rotationally drives the upward X-axis movement shaft 45. A nut is attached to the upward unit 40, and the nut is screwed onto the upward X-axis movement shaft 45.

[0033] With the above configuration, the upward horizontal drive mechanism D3 is activated, causing the upward Y-axis motor 44 to rotate and drive the upward Y-movement axis 43, which in turn causes the upward unit 40 to move in the Y-direction together with the support frame 42. Additionally, the upward X-axis motor 46 is activated, causing the upward X-movement axis 45 to rotate and move the upward unit 40 in the X-direction relative to the support frame 42.

[0034] [Control Configuration of Component Mounting Device] Figure 3 is a block diagram showing the control configuration of the component mounting device 1. Figure 4 is a flowchart showing the processing flow executed by the control unit 101 of the control unit 100 provided in the component mounting device 1. The component mounting device 1 includes a control unit 100. The control unit 100 is composed of a computer comprising a control unit 101 consisting of a processor that performs various calculations, and a storage unit 102 which is a memory that stores various information.

[0035] The control unit 101 performs various processes by controlling the drive of each motor: the head Y-axis motor 14, the head X-axis motor 18, the head lifting motor 4M, the camera Y-axis motor 34, the camera X-axis motor 38, the thrust Y-axis motor 44, the thrust X-axis motor 46, and the pin lifting motor 40M. The control unit 101 performs estimation processing S1, imaging movement processing S2, contact movement processing S3, thrust movement processing S4, pickup processing S5, evaluation processing S6, update processing S7, and mounting processing S8. The control unit 101 performs estimation processing S1 before production of the substrate P in the component mounting device 1, and performs imaging movement processing S2, contact movement processing S3, thrust movement processing S4, pickup processing S5, evaluation processing S6, update processing S7, and mounting processing S8 during the production of the substrate P.

[0036] Each process performed by the control unit 101 will be described in detail with reference to Figures 3 and 4, as well as Figures 5 to 8.

[0037] (Estimation Process) As shown in Figure 5, the multiple dies 7a on the sheet 8a are classified into good dies 7a1, which are good parts, and defective dies 7a2, which are defective parts, based on predetermined judgment criteria. Good dies 7a1 are dies 7a used in the production of substrate P in the component mounting device 1. Defective dies 7a2 are dies 7a that are not used in the production of substrate P in the component mounting device 1.

[0038] Before production of the substrate P in the component mounting device 1, the control unit 101 performs estimation processing S1 using the defective die 7a2 on the sheet 8a. In estimation processing S1, the control unit 101 performs estimation tests for each of the multiple locations of the defective die 7a2 on the sheet 8a to estimate the vertical position of the tip of the push-up pin 47 that will be successfully picked up by the suction head 4H. Based on the results of the estimation tests, the control unit 101 then estimates push-up surface data DD, which shows the position of the tip of the push-up pin 47 relative to the sheet 8a in three dimensions.

[0039] The control unit 101 selects five locations on the sheet 8a, for example, the central region of the sheet 8a, the +X side end region of the sheet 8a, the -X side end region of the sheet 8a, the +Y side end region of the sheet 8a, and the -Y side end region of the sheet 8a. The control unit 101 then performs an estimation test on the defective die 7a2 located in each of the five regions on the sheet 8a. In the estimation test, the control unit 101 controls the drive of the pin lifting motor 40M to move the push-up pin 47 upward until the tip of the push-up pin 47 contacts the sheet 8a from below. The control unit 101 also controls the drive of the head lifting motor 4M to move the suction head 4H downward until the tip of the suction head 4H contacts the defective die 7a2 from above. As a result, the defective die 7a2 on the sheet 8a is held between the push-up pin 47 and the suction head 4H.

[0040] With the defective die 7a2 on the sheet 8a held between the push-up pin 47 and the suction head 4H, the control unit 101 moves the push-up pin 47 vertically based on the control of the pin lifting motor 40M, thereby changing the position of the tip of the push-up pin 47 upwards and downwards. Each time the position of the tip of the push-up pin 47 is changed, the control unit 101 stops the movement of the push-up pin 47 and moves the suction head 4H upward based on the control of the head lifting motor 4M, and determines whether the pickup of the defective die 7a2 by the suction head 4H was successful based on the negative pressure level of the suction head 4H. In this way, the control unit 101 estimates the vertical position of the tip of the push-up pin 47 that will result in successful pickup by the suction head 4H for each of the five areas of the defective die 7a2 located on the sheet 8a.

[0041] The control unit 101 then estimates the push-up surface data DD using the least squares method, taking as input data the X and Y directions of the five defective dies 7a2 located in each of the five regions on the sheet 8a, and the vertical position of the tip of the push-up pin 47 that was successfully picked up by the suction head 4H targeting each of the five defective dies 7a2. The control unit 101 stores the estimated push-up surface data DD in the storage unit 102. In the push-up movement process S4 described later, the control unit 101 reads the push-up surface data DD from the storage unit 102 and determines the target push-up position P22 based on the push-up surface data DD. In other words, the push-up surface data DD is data that shows the target push-up position P22 of the tip of the push-up pin 47 relative to the sheet 8a in three dimensions.

[0042] When production of the substrate P in the component mounting device 1 begins, the control unit 101 executes the imaging movement process S2, contact movement process S3, upward movement process S4, pickup process S5, evaluation process S6, update process S7, and mounting process S8.

[0043] (Imaging Movement Processing) The imaging movement processing S2 executed by the control unit 101 will be described with reference to FIG. 5. In the imaging movement processing S2, the control unit 101 controls the driving of the camera Y-axis motor 34 and the camera X-axis motor 38, thereby moving the camera unit 32U to an upper imaging position P10 with respect to a target die 7aA that is a target component to be picked up by the suction head 4H among the plurality of dies 7a on the sheet 8a. Note that the control unit 101 selects the target die 7aA from non-defective dies 7a1 on the sheet 8a. Information about the imaging position P10 is stored in the storage unit 102. When the camera unit 32U is placed at the imaging position P10, the component camera 32 mounted on the camera unit 32U images, from above, the target die 7aA on the sheet 8a and an adjacent die 7aB which is an adjacent component adjacent to the target die 7aA, and acquires first image data GD1.

[0044] The control unit 101 acquires the first image data GD1 captured by the component camera 32. The first image data GD1 is image data obtained before the tip of the push-up pin 47 is positioned at the target push-up position P22 in push-up movement processing S4 described later. The first image data GD1 includes data of each of a target die area 7aAA indicating an image area of the target die 7aA on the sheet 8a, and an adjacent die area 7aBA indicating an image area of the adjacent die 7aB on the sheet 8a. The control unit 101 recognizes the position of the target die 7aA on the sheet 8a based on the data of the target die area 7aAA in the first image data GD1.

[0045] (Contact Movement Processing) The contact movement processing S3 executed by the control unit 101 will be described with reference to FIG. 5. After execution of the imaging movement processing S2, the control unit 101 controls the driving of the head Y-axis motor 14 and the head X-axis motor 18, thereby moving the head unit 4 in the horizontal direction such that the head unit 4 is positioned at a head standby position above the target die 7aA on the sheet 8a. Further, the control unit 101 controls the driving of the push-up Y-axis motor 44 and the push-up X-axis motor 46, thereby moving the push-up unit 40 in the horizontal direction such that the push-up unit 40 is positioned at a push-up standby position below the target die 7aA on the sheet 8a.

[0046] In a state where the push-up unit 40 is arranged at the push-up standby position and the head unit 4 is arranged at the head standby position, the control unit 101 reads information on the sheet contact position P21 and the component contact position P31 stored in the storage unit 102, and executes the contact movement process S3. The sheet contact position P21 indicates a position in the vertical direction when the tip end of the push-up pin 47 contacts the sheet 8a from below. The component contact position P31 indicates a position in the vertical direction when the tip end of the suction head 4H contacts the target die 7aA on the sheet 8a from above.

[0047] In the contact movement process S3, the control unit 101 controls the driving of the pin lifting motor 40M to move the push-up pin 47 upward until the tip end of the push-up pin 47 reaches the sheet contact position P21. Thereby, the push-up pin 47 contacts the sheet 8a from below. Further, the control unit 101 controls the driving of the head lifting motor 4M to move the suction head 4H downward until the tip end of the suction head 4H reaches the component contact position P31. Thereby, the suction head 4H contacts the target die 7aA on the sheet 8a from above.

[0048] When the push-up pin 47 contacts the sheet 8a from below and the suction head 4H contacts the target die 7aA from above, the target die 7aA is clamped between the push-up pin 47 and the suction head 4H. In a state where the target die 7aA is clamped between the push-up pin 47 and the suction head 4H, the push-up unit 40 performs a process of sucking the sheet 8a around the target die 7aA, and the suction head 4H sucks and holds the target die 7aA at a predetermined negative pressure level.

[0049] (Push-up movement processing) The push-up movement processing S4 performed by the control unit 101 will be explained with reference to Figure 6. After the execution of the contact movement processing S3, the control unit 101 performs the push-up movement processing S4. In the push-up movement processing S4, the control unit 101 reads the push-up surface data DD from the storage unit 102 and determines the target push-up position P22 based on the push-up surface data DD. The target push-up position P22 indicates the target position in the vertical direction of the tip of the push-up pin 47 when the target die 7aA is pushed up by the push-up pin 47. The control unit 101 stores the information of the determined target push-up position P22 in the storage unit 102.

[0050] In the upward movement process S4, the control unit 101 controls the drive of the pin lifting motor 40M to move the upward pin 47 upward until the tip of the upward pin 47 reaches the target upward position P22, which is above the sheet contact position P21, and also controls the drive of the head lifting motor 4M to move the suction head 4H upward in accordance with the upward movement of the upward pin 47. As a result, the upward pin 47 pushes the target die 7aA, which is held by the suction head 4H, upward from below the sheet 8a.

[0051] The component camera 32 may capture images of the target die 7aA on the sheet 8a and the adjacent die 7aB adjacent to the target die 7aA, with the tip of the push-up pin 47 positioned at the target push-up position P22, and acquire a second image data GD2.

[0052] The control unit 101 acquires second image data GD2 captured by the component camera 32. The second image data GD2 is image data after the tip of the push-up pin 47 is located at the target push-up position P22. The second image data GD2 includes data for the target die region 7aAA, which shows the image area of ​​the target die 7aA on the sheet 8a in the state of being pushed up by the push-up pin 47, and the adjacent die region 7aBA, which shows the image area of ​​the adjacent die 7aB on the sheet 8a.

[0053] If the target push-up position P22 is too high relative to the wafer stage 10 on which the sheet 8a is placed, exceeding a predetermined reference position, the adjacent die 7aB adjacent to the target die 7aA will tilt too much along the inclined surface of the sheet 8a that has been pushed up by the push-up pin 47. In this case, the difference in the data feature quantities of the adjacent die regions 7aBA in the first image data GD1 and the second image data GD2 will exceed a predetermined threshold. Examples of differences in feature quantities include differences in brightness of the adjacent die regions 7aBA and differences in the external dimensions of the adjacent die regions 7aBA. In the following explanation, brightness difference will be used as the difference in feature quantities. If the target push-up position P22 is too high, there is a risk that excessive load will be applied to the target die 7aA, which is held between the push-up pin 47 and the suction head 4H, causing damage to the target die 7aA. For this reason, it is effective to adjust the target push-up position P22 according to the brightness difference of the adjacent die regions 7aBA in the first image data GD1 and the second image data GD2.

[0054] Furthermore, when the tip of the push-up pin 47 is positioned at the target push-up position P22, the push-up pin 47 and the suction head 4H may shift horizontally beyond a predetermined tolerance range. In this case, the target die 7aA is held between the push-up pin 47 and the suction head 4H in a tilted position. In this case, the difference in the data features of each target die region 7aAA in the first image data GD1 and the second image data GD2 will exceed a predetermined threshold. Examples of differences in feature quantities include differences in brightness of the target die region 7aAA and differences in the external dimensions of the target die region 7aAA. In the following explanation, brightness difference will be used as the difference in feature quantities. When the target die 7aA is tilted due to horizontal displacement between the push-up pin 47 and the suction head 4H, there is a risk of pickup failure of the target die 7aA by the suction head 4H during the pickup process S5 described later. For this reason, it is effective to adjust the target push-up position P22 according to the brightness difference of each target die region 7aAA in the first image data GD1 and the second image data GD2.

[0055] In step S41 of the thrusting movement process S4, the control unit 101 determines whether the brightness difference between adjacent die regions 7aBA of the first image data GD1 and the second image data GD2 is greater than or equal to a predetermined threshold. The control unit 101 also determines whether the brightness difference between target die regions 7aAA of the first image data GD1 and the second image data GD2 is greater than or equal to a predetermined threshold. If the brightness difference between adjacent die regions 7aBA and target die regions 7aAA of the first image data GD1 and the second image data GD2 is not greater than or equal to a predetermined threshold (NO in step S41), the control unit 101 proceeds to the pickup process S5. On the other hand, if the brightness difference between the first image data GD1 and the second image data GD2 is greater than or equal to a predetermined threshold (YES in step S41), the control unit 101 performs a trial process S42 to attempt to adjust the target thrusting position P22.

[0056] The control unit 101 performs trial processing S42 using the defective die 7a2 closest to the target die 7aA on the sheet 8a. Based on the positions in the X and Y directions of each of the multiple defective dies 7a2 present on the sheet 8a and the positions in the X and Y directions of the target die 7aA, the control unit 101 selects the defective die 7a2 closest to the target die 7aA.

[0057] In the trial process S42, the control unit 101, with the tip of the suction head 4H in contact with the defective die 7a2 closest to the target die 7aA, changes the position of the tip of the push-up pin 47 downward by a second change amount V2 relative to the current target push-up position P22, based on the control of the pin lifting motor 40M. The second change amount V2 is smaller than the first change amount V1 when changing the position of the tip of the push-up pin 47 in the evaluation process S6 after the pickup process S5 described later.

[0058] The control unit 101 then moves the suction head 4H upward based on the control of the head lifting motor 4M and determines whether the pickup of the defective die 7a2 by the suction head 4H was successful based on the negative pressure level of the suction head 4H. If the pickup of the defective die 7a2 is successful, the control unit 101 sets the adjusted target push-up position P22 to a position lower than the current target push-up position P22, corresponding to the second change amount V2. On the other hand, if the pickup of the defective die 7a2 is unsuccessful, the control unit 101 maintains the current target push-up position P22 as is.

[0059] By adjusting the target push-up position P22 according to the brightness difference between adjacent die regions 7aBA in the first image data GD1 and the second image data GD2, it is possible to prevent excessive load from being applied to the target die 7aA held between the push-up pin 47 and the suction head 4H, which could result in damage to the target die 7aA, due to the current target push-up position P22 being too high. Furthermore, by adjusting the target push-up position P22 according to the brightness difference between the target die regions 7aAA in the first image data GD1 and the second image data GD2, it is possible to prevent the target die 7aA from becoming tilted due to horizontal misalignment between the push-up pin 47 and the suction head 4H, which could result in a pickup failure of the target die 7aA by the suction head 4H.

[0060] After the trial process S42, the control unit 101 controls the drive of the pin lifting motor 40M with respect to the target die 7aA on the sheet 8a, thereby moving the push-up pin 47 upward until the tip of the push-up pin 47 reaches the adjusted target push-up position P22. After that, the control unit 101 proceeds to the pickup process S5.

[0061] (Pickup Process) The pickup process S5 performed by the control unit 101 will be explained with reference to Figure 7. After the execution of the upward movement process S4, the control unit 101 performs the pickup process S5. In the pickup process S5, the control unit 101 moves the suction head 4H upward by controlling the drive of the head lifting motor 4M when the tip of the upward pin 47 is located at the target upward position P22. As a result, the suction head 4H picks up the target die 7aA that it has held by suction from the sheet 8a. The control unit 101 also moves the upward pin 47 downward by controlling the drive of the pin lifting motor 40M.

[0062] In step S51 of the pickup process S5, the control unit 101 determines whether or not a pickup failure of the target die 7aA by the suction head 4H has occurred, based on the negative pressure level of the suction head 4H. If no pickup failure occurs and the pickup of the target die 7aA by the suction head 4H is successful (NO in step S51), the control unit 101 proceeds to the mounting process S8. In the mounting process S8, the control unit 101 controls the drive of the head Y-axis motor 14 and the head X-axis motor 18 to move the head unit 4, in which the suction head 4H is holding the target die 7aA, to the mounting position above the substrate P. With the head unit 4 positioned above the substrate P, the suction head 4H releases the target die 7aA it is holding, thereby mounting the target die 7aA onto the substrate P.

[0063] If a pickup failure of the target die 7aA occurs by the suction head 4H (YES in step S51), the control unit 101 proceeds to evaluation processing S6 and update processing S7.

[0064] (Evaluation and Update Processing) The evaluation processing S6 performed by the control unit 101 will be explained with reference to Figure 8. The control unit 101 performs the evaluation processing S6 according to the result of the pickup of the target die 7aA by the suction head 4H in the pickup processing S5. Specifically, the control unit 101 performs the evaluation processing S6 if a pickup failure of the target die 7aA by the suction head 4H occurs in the pickup processing S5.

[0065] The control unit 101 performs evaluation processing S6 on specific parts of the multiple dies 7a on the sheet 8a, excluding the target die 7aA where the pickup failure occurred. In this embodiment, the control unit 101 performs evaluation processing S6 on the sheet 8a with the one defective die 7a2 closest to the target die 7aA where the pickup failure occurred as the specific part. Based on the X and Y directions of the positions of each of the multiple defective dies 7a2 present on the sheet 8a and the X and Y directions of the target die 7aA where the pickup failure occurred, the control unit 101 selects the one defective die 7a2 closest to the target die 7aA.

[0066] In evaluation process S6, the control unit 101, with the tip of the suction head 4H in contact with the one defective die 7a2 closest to the target die 7aA where the pickup failure occurred, changes the position of the tip of the push-up pin 47 upward and downward by a first change amount V1 relative to the target push-up position P22, based on the control of the pin lifting motor 40M. The first change amount V1 is greater than the second change amount V2 when the position of the tip of the push-up pin 47 is changed in trial process S42 in push-up movement process S4.

[0067] Then, each time the control unit 101 changes the position of the tip of the push-up pin 47 upward and downward relative to the target push-up position P22 by a positive integer (natural number) multiple of the first change amount V1, it stops the movement of the push-up pin 47 and moves the suction head 4H upward based on the control of the head lifting motor 4M, and evaluates whether the pickup of the defective die 7a2 by the suction head 4H is successful based on the negative pressure level of the suction head 4H. Then, the control unit 101 executes an update process S7 to update the target push-up position P22 of the push-up pin 47 based on the vertical position of the tip of the push-up pin 47 when the pickup of the defective die 7a2 by the suction head 4H is successful in the evaluation process S6.

[0068] Specifically, the control unit 101 changes the position of the tip of the push-up pin 47 upward by a first change amount V1 (1x) relative to the target push-up position P22 while the tip of the suction head 4H is in contact with the defective die 7a2, and then moves the suction head 4H upward to evaluate whether the pickup of the defective die 7a2 by the suction head 4H is successful. If the pickup of the defective die 7a2 by the suction head 4H is successful while the position has been changed upward by the first change amount V1 relative to the target push-up position P22, the control unit 101 sets the updated target push-up position P22 to the position above the target push-up position P22 that corresponds to the first change amount V1. On the other hand, if the pickup of the defective die 7a2 by the suction head 4H is unsuccessful when the target push-up position P22 is changed upward by a first change amount V1, the control unit 101 changes the position of the tip of the push-up pin 47 downward by a first change amount V1 (1x) relative to the target push-up position P22, and then moves the suction head 4H upward to evaluate whether the pickup of the defective die 7a2 by the suction head 4H is successful. If the pickup of the defective die 7a2 by the suction head 4H is successful when the target push-up position P22 is changed downward by a first change amount V1 in this way, the control unit 101 sets the updated target push-up position P22 to a position lower than the target push-up position P22 that corresponds to the first change amount V1.

[0069] If the suction head 4H fails to successfully pick up the defective die 7a2 when the pin 47 is moved upward and downward by a first change amount V1 equal to 1x the target pin position P22, the control unit 101 sequentially increases the multiple of the first change amount V1 to 2x, 3x, and so on, changing the position of the tip of the pin 47 upward and downward relative to the target pin position P22, and repeats this until the suction head 4H successfully picks up the defective die 7a2. Then, in the update process S7 after the evaluation process S6, the control unit 101 updates the target pin position P22 of the pin 47 based on the vertical position of the tip of the pin 47 when the suction head 4H successfully picks up the defective die 7a2.

[0070] In the pickup process S5, possible causes of pickup failure of the target die 7aA by the suction head 4H include the target die 7aA being pushed up too low by the push-up pin 47, or the target die 7aA being tilted due to horizontal displacement of the push-up pin 47 and the suction head 4H exceeding a predetermined allowable range. If the target die 7aA is being pushed up too low by the push-up pin 47, changing the position of the tip of the push-up pin 47 upward relative to the target push-up position P22 increases the likelihood of suppressing pickup failure of the target die 7aA by the suction head 4H. On the other hand, if the target die 7aA is tilted due to horizontal displacement of the push-up pin 47 and the suction head 4H, changing the position of the tip of the push-up pin 47 downward relative to the target push-up position P22 increases the likelihood of suppressing pickup failure of the target die 7aA by the suction head 4H. In other words, in order to suppress the occurrence of pickup failures of the target die 7aA by the suction head 4H, it is effective to change the position of the tip of the push-up pin 47 upward relative to the target push-up position P22, and it is effective to change the position of the tip of the push-up pin 47 downward relative to the target push-up position P22.

[0071] Therefore, as described above, the control unit 101 executes evaluation processing S6 and update processing S7 when a pickup failure of the target die 7aA by the suction head 4H occurs in the pickup processing S5. In evaluation processing S6, the control unit 101 evaluates whether the pickup of the defective die 7a2 by the suction head 4H is successful each time the position of the tip of the push-up pin 47 is changed upward and downward by a first change amount V1 relative to the target push-up position P22. In update processing S7, the control unit 101 updates the target push-up position P22 of the push-up pin 47 based on the vertical position of the tip of the push-up pin 47 when the pickup of the defective die 7a2 by the suction head 4H is successful. As a result, the control unit 101 can update the target push-up position P22 of the push-up pin 47 to an appropriate push-up position that can suppress the occurrence of pickup failures by the suction head 4H.

[0072] Furthermore, the control unit 101 performs an evaluation process S6 on the defective die 7a2 that is closest to the target die 7aA in which a pickup failure occurred during the pickup process S5. In this case, the control unit 101 can update the target push-up position P22 using the defective die 7a2 that has the most similar conditions to the target die 7aA in which the pickup failure occurred. Moreover, since the evaluation process S6 is performed on a defective die 7a2 other than the target die 7aA, which is a good die 7a1 used in the production of the substrate P in the component mounting apparatus 1, it is possible to suppress damage to the target die 7aA due to excessive load being applied between the push-up pin 47 and the suction head 4H during the evaluation process S6.

[0073] Furthermore, in evaluation process S6, the control unit 101 may evaluate whether the suction head 4H is successful in picking up one defective die 7a2 on the sheet 8a, and then use the vertical position of the tip of the push-up pin 47 when the suction head 4H is successful in picking up one defective die 7a2 to re-evaluate whether the suction head 4H is successful in picking up another defective die 7a2 that is closest to the first defective die 7a2. This allows the control unit 101 to confirm the reproducibility of the vertical position of the tip of the push-up pin 47 when the suction head 4H is successful in picking up one defective die 7a2.

[0074] Furthermore, the control unit 101 sequentially selects a plurality of good dies 7a1 on the sheet 8a as target dies 7aA and executes a pickup process S5, and executes an evaluation process S6 each time a pickup failure of the suction head 4H occurs during the pickup process S5. In this case, as shown in Figure 8, the control unit 101 reduces the first vertical change amount V1 of the position of the tip of the push-up pin 47 relative to the target push-up position P22 each time a pickup failure of the suction head 4H occurs during the pickup process S5, and executes the evaluation process S6. That is, the first change amount V1 when the pickup failure of the suction head 4H occurs for the second time is smaller than the first change amount V1 when the pickup failure of the suction head 4H occurs for the first time, and the first change amount V1 when the pickup failure of the 3rd time is smaller than the first change amount V1 when the pickup failure of the 2nd time is smaller. As a result, the control unit 101 can evaluate whether or not the pickup by the suction head 4H is successful by changing the position of the tip of the push-up pin 47 upward and downward with a smaller first change amount V1 relative to the target push-up position P22 each time a pickup failure occurs in the pickup process S5. Therefore, the position of the tip of the push-up pin 47 at which the pickup by the suction head 4H is successful can be precisely determined each time a pickup failure occurs in the suction head 4H.

[0075] If a pickup failure of the target die 7aA by the suction head 4H occurs during the pickup process S5, the control unit 101 uses the updated target push-up position P22, which was updated in the update process S7 after the evaluation process S6, to execute the push-up movement process S4 and the pickup process S5.

[0076] Furthermore, the control unit 101 may update the push-up surface data DD in the estimation process S1 using the vertical position of the tip of the push-up pin 47 when the pickup of the defective die 7a2 by the suction head 4H in the evaluation process S6 is successful. Specifically, the control unit 101 updates the push-up surface data DD using the least squares method, taking as input data the X and Y positions of the defective die 7a2 on the sheet 8a in the evaluation process S6, and the vertical position of the tip of the push-up pin 47 when the pickup of the defective die 7a2 by the suction head 4H is successful. As a result, the control unit 101 can update the push-up surface data DD to reflect the vertical position of the tip of the push-up pin 47 in order to resolve the pickup failure that occurred in the actual pickup process S5.

[0077] [Inventions included in the above embodiments] The embodiments described above include inventions having the following configurations.

[0078] A component transfer device according to one aspect of the present invention comprises: a component supply unit that supplies a plurality of components attached to an elastically deformable sheet; a suction head that is movable vertically above the sheet and picks up a target component from above among the plurality of components on the sheet; a push-up pin that is movable vertically below the sheet and pushes up the target component from below the sheet when the suction head picks up the target component; and a control unit that controls the suction head and the push-up pin. The control unit performs the following operations: an upward movement process in which the tip of the push-up pin is moved vertically so that the tip of the push-up pin reaches a target push-up position while the tip of the suction head is in contact with the target part; a pickup process in which the suction head is moved upward while the tip of the push-up pin is positioned at the target push-up position as a result of the upward movement process so that the suction head picks up the target part; an evaluation process in which, depending on the result of the suction head picking up the target part in the pickup process, the position of the tip of the push-up pin is changed upward and downward relative to the target push-up position for a specific part other than the target part among the plurality of parts on the sheet, and an evaluation process in which the suction head is changed to evaluate whether the pickup of the specific part is successful or not; and an update process in which the target push-up position of the push-up pin is updated based on the vertical position of the tip of the push-up pin when the pickup of the specific part by the suction head is successful in the evaluation process.

[0079] Furthermore, in the above-described component transfer device, the control unit may execute the evaluation process if a pickup failure of the target component by the suction head occurs during the pickup process.

[0080] In the pickup process, possible causes of pickup failures by the suction head include the target part being pushed up too low by the push-up pin, or the target part being tilted due to horizontal misalignment between the push-up pin and the suction head exceeding a predetermined tolerance range. If the target part is being pushed up too low by the push-up pin, changing the position of the tip of the push-up pin upward relative to the target push-up position increases the likelihood of suppressing pickup failures by the suction head. On the other hand, if the target part is tilted due to horizontal misalignment between the push-up pin and the suction head, changing the position of the tip of the push-up pin downward relative to the target push-up position increases the likelihood of suppressing pickup failures by the suction head. In other words, to suppress pickup failures by the suction head, it is sometimes effective to change the position of the tip of the push-up pin upward relative to the target push-up position, and sometimes it is effective to change the position of the tip of the push-up pin downward relative to the target push-up position.

[0081] Therefore, the control unit performs evaluation and update processing when a pickup failure of the target part by the suction head occurs during the pickup process. In the evaluation process, the control unit evaluates whether the suction head successfully picks up a specific part other than the target part each time the position of the tip of the push-up pin is changed upward and downward relative to the target push-up position. In the update process, the control unit updates the target push-up position of the push-up pin based on the vertical position of the tip of the push-up pin when the suction head successfully picks up a specific part. As a result, the control unit can update the target push-up position of the push-up pin to an accurate push-up position that can suppress the occurrence of pickup failures by the suction head.

[0082] In the above-described parts transfer device, the multiple parts on the sheet are classified into good parts and defective parts based on predetermined judgment criteria. In this case, the control unit may perform the push-up movement process and the pickup process on the good parts on the sheet as the target parts, and in the pickup process, it may perform the evaluation process on the one defective part closest to the target part where the pickup failure of the suction head occurred as the specific part.

[0083] In this embodiment, the control unit performs an evaluation process on the defective part closest to the target part where a pickup failure occurred during the pickup process. In this case, the control unit performs an evaluation process using the defective part with conditions most similar to the target part where the pickup failure occurred, and can update the target push-up position in the update process based on the results of the evaluation process. Moreover, since the evaluation process is performed on defective parts other than the target part which is a good part, it is possible to suppress damage to the target part due to excessive load being applied between the push-up pin and the suction head during the evaluation process.

[0084] In the above-described component transfer device, the control unit may, in the evaluation process, evaluate whether the suction head can successfully pick up one of the defective components on the sheet, and then, using the vertical position of the tip of the push-up pin when the suction head successfully picks up one of the defective components, re-evaluate whether the suction head can successfully pick up another defective component that is closest to the first defective component.

[0085] In this embodiment, by re-evaluating the pickup by the suction head on other defective parts, it is possible to confirm the reproducibility of the vertical position of the tip of the push-up pin when the pickup of one defective part by the suction head is successful.

[0086] In the above-described component transfer device, the control unit may, each time a pickup failure occurs in the pickup process of the suction head, reduce the amount of vertical change in the position of the tip of the push-up pin relative to the target push-up position and then execute the evaluation process.

[0087] In this embodiment, the control unit performs an evaluation process by reducing the amount of vertical change in the position of the tip of the push-up pin relative to the target push-up position each time a pickup failure occurs in the pickup process. That is, the amount of change when the pickup failure occurs for the second time is smaller than the amount of change when the pickup failure occurs for the first time, and the amount of change when the pickup failure occurs for the third time is smaller than the amount of change when the pickup failure occurs for the second time. As a result, each time a pickup failure occurs in the pickup process, the control unit can change the position of the tip of the push-up pin upwards and downwards relative to the target push-up position by a smaller amount of change, and evaluate whether or not the pickup by the suction head will be successful. Therefore, the position of the tip of the push-up pin at which the pickup by the suction head is successful can be precisely determined each time a pickup failure occurs in the suction head.

[0088] The above-described component transfer device may further include a component camera that images the plurality of components on the sheet from above. In this case, the control unit, in the upward movement process, acquires first image data captured by the component camera before the tip of the upward-moving pin is located at the target upward-moving position, and acquires second image data captured by the component camera after the tip of the upward-moving pin is located at the target upward-moving position. If the difference in the feature quantities of the first image data and the second image data is greater than or equal to a predetermined threshold, the control unit performs a trial process to attempt to adjust the target upward-moving position.

[0089] In this embodiment, during the thrusting movement process, the control unit can adjust the target thrusting position if the difference in the feature quantities of the first image data and the second image data before and after the tip of the thrusting pin is positioned at the target thrusting position is greater than or equal to a predetermined threshold.

[0090] In the above-described component transfer device, the control unit may, in the upward movement process, acquire the first image data and the second image data captured by the component camera for adjacent components adjacent to the target component on the sheet, and perform the trial process if the difference in the feature quantities of the first image data and the second image data for the adjacent components is greater than or equal to a predetermined threshold.

[0091] If the target push-up position is too high, adjacent parts to the target part will tilt too much along the inclined surface of the sheet pushed up by the push-up pin. In this case, the difference in the feature quantities of the first image data and the second image data targeting the adjacent parts will exceed a predetermined threshold. By adjusting the target push-up position according to the difference in the feature quantities of the first image data and the second image data targeting the adjacent parts, it is possible to suppress excessive load on the target part held between the push-up pin and the suction head, which could cause damage to the target part, such as when the current target push-up position is too high.

[0092] In the above-described component transfer device, the control unit may, in the upward movement process, acquire the first image data and the second image data captured by the component camera with respect to the target component on the sheet, and perform the trial process if the difference in the feature quantities of the first image data and the second image data with respect to the target component is greater than or equal to a predetermined threshold.

[0093] Even when the tip of the push-up pin is positioned at the target push-up position, the push-up pin and the suction head may shift horizontally beyond a predetermined tolerance range. In this case, the target part is held between the push-up pin and the suction head in a tilted position. In this case, the difference in the feature quantities of the first image data and the second image data of the target part exceeds a predetermined threshold. By adjusting the target push-up position according to the difference in the feature quantities of the first image data and the second image data of the target part, it is possible to suppress the occurrence of a tilted position of the target part and subsequent pickup failure of the target part by the suction head due to horizontal displacement between the push-up pin and the suction head.

[0094] In the above-described component transfer device, the control unit may, before executing the upward movement process, estimate the vertical position of the tip of the upward pin at which the suction head will successfully pick up each of the multiple locations on the sheet, and perform an estimation process to estimate upward surface data that shows the position of the tip of the upward pin relative to the sheet in three dimensions based on the estimation result. Then, in the upward movement process, the control unit determines the target upward position relative to the target component on the sheet based on the upward surface data.

[0095] In this embodiment, the control unit can estimate three-dimensional thrust surface data indicating the position of the tip of the thrust pin that is successfully picked up by the suction head, based on the horizontal position of each of the multiple locations on the sheet and the vertical position of the tip of the thrust pin that is successfully picked up by the suction head for each of the multiple locations on the sheet. The thrust surface data is data that indicates the target thrust position of the tip of the thrust pin relative to the sheet in three dimensions.

[0096] In the above-described component transfer device, the control unit may update the push-up surface data in the estimation process based on the vertical position of the tip of the push-up pin when the suction head successfully picks up the specific component in the evaluation process.

[0097] In this embodiment, the control unit updates the push-up surface data based on the horizontal position of the specific part being evaluated on the sheet and the vertical position of the tip of the push-up pin that successfully picked up the specific part with the suction head. This allows the control unit to update the push-up surface data to reflect the vertical position of the tip of the push-up pin in order to eliminate pickup defects that occurred during the actual pickup process.

Claims

1. A parts supply unit that supplies a plurality of parts attached to an elastically deformable sheet; a suction head that is movable vertically above the sheet and picks up a target part from the plurality of parts on the sheet from above; a push-up pin that is movable vertically below the sheet and pushes up the target part from below the sheet when the suction head picks up the target part; and a control unit that controls the suction head and the push-up pin, wherein the control unit performs a push-up movement process that moves the push-up pin vertically so that the tip of the push-up pin reaches a target push-up position while the tip of the suction head is in contact with the target part; and a pickup process that moves the suction head upward and causes the suction head to pick up the target part while the tip of the push-up pin is positioned at the target push-up position as a result of the push-up movement process. A component transfer device that performs the following: an evaluation process in which, depending on the result of the suction head picking up the target component in the pickup process, the position of the tip of the push-up pin is changed upward and downward relative to the target push-up position for a specific component other than the target component among the plurality of components on the sheet, and an evaluation process in which the suction head picks up the specific component; and an update process in which the target push-up position of the push-up pin is updated based on the vertical position of the tip of the push-up pin when the suction head successfully picks up the specific component in the evaluation process.

2. The component transfer apparatus according to claim 1, wherein the control unit executes the evaluation process when a pickup failure of the target component by the suction head occurs during the pickup process.

3. The component transfer device according to claim 2, wherein the plurality of components on the sheet are classified into good components and defective components based on predetermined judgment criteria, the control unit performs the push-up movement process and the pickup process with the good components on the sheet as the target components, and in the pickup process, performs the evaluation process with the one defective component closest to the target component where the pickup failure of the suction head occurred as the specific component.

4. The component transfer device according to claim 3, wherein the control unit, in the evaluation process, evaluates whether the suction head can successfully pick up one of the defective components on the sheet, and, using the vertical position of the tip of the push-up pin when the suction head successfully picks up one of the defective components, re-evaluates whether the suction head can successfully pick up another defective component that is closest to the first defective component.

5. The component transfer device according to any one of claims 2 to 4, wherein the control unit reduces the amount of vertical change in the position of the tip of the push-up pin relative to the target push-up position each time a pickup failure of the suction head occurs during the pickup process, and then performs the evaluation process.

6. The component transfer device according to claim 1, further comprising a component camera for imaging the plurality of components on the sheet from above, wherein the control unit, in the upward movement process, acquires first image data captured by the component camera before the tip of the upward pin is located at the target upward position, and acquires second image data captured by the component camera after the tip of the upward pin is located at the target upward position, and performs a trial process to attempt to adjust the target upward position if the difference in the feature quantities of the first image data and the second image data is greater than or equal to a predetermined threshold.

7. The part transfer device according to claim 6, wherein the control unit, in the upward movement process, acquires the first image data and the second image data captured by the part camera for adjacent parts adjacent to the target part on the sheet, and performs the trial process if the difference in the feature quantities of the first image data and the second image data for the adjacent parts is greater than or equal to a predetermined threshold.

8. The part transfer device according to claim 6, wherein the control unit, in the upward movement process, acquires the first image data and the second image data captured by the part camera with respect to the target part on the sheet, and performs the trial process when the difference in the feature quantities of the first image data and the second image data with respect to the target part is greater than or equal to a predetermined threshold.

9. The part transfer device according to claim 1, wherein the control unit, before executing the upward movement process, estimates the vertical position of the tip of the upward pin at which pickup by the suction head is successful for each of a plurality of locations on the sheet, and based on the estimation result, executes an estimation process to estimate upward surface data that shows the position of the tip of the upward pin relative to the sheet in three dimensions, and in the upward movement process, determines the target upward position relative to the target part on the sheet based on the upward surface data.

10. The component transfer device according to claim 9, wherein the control unit updates the push-up surface data in the estimation process based on the vertical position of the tip of the push-up pin when the suction head successfully picks up the specific component in the evaluation process.

Images