Three-dimensional modeling device, information processing device, manufacturing method, and information processing method

Abstract

A three-dimensional modeling device according to the present disclosure is provided with: a first discharge head that discharges a structural fluid, which constitutes a structure of a modeled object, into a modeling region; a second discharge head that discharges a conductive fluid, which constitutes a conductor, into the modeling region; and a control section which, when modeling a modeled object including a conductor-exposed portion where no structure is modeled on the conductor and a structure modeled adjacent to the conductor-exposed portion, causes the second discharge head to discharge the conductive fluid into the modeling region to form the conductor, then causes the first discharge head to discharge the structural fluid to form the structure, and thereafter causes the second discharge head to discharge at least one layer of the conductive fluid onto the conductor-exposed portion to form a conduction layer.

Description

Three-dimensional modeling apparatus, information processing apparatus, manufacturing method and information processing method

[0001] The present specification discloses a three-dimensional modeling apparatus, an information processing apparatus, a manufacturing method and an information processing method.

[0002] Conventionally, as a three-dimensional modeling apparatus, there has been proposed an apparatus that forms a conductor on a resin layer, further forms a resin layer having a hole in which a part of the conductor is exposed, and forms a covering body that covers the conductor exposed inside the hole (see, for example, Patent Document 1). In this method, the resin layer is formed such that a wall surface defining the hole protrudes toward the inside of the hole as it goes downward, thereby reducing the force applied to the covering body and appropriately ensuring conduction of the conductor.

[0003] International Publication No. 2023 / 148888

[0004] However, in the three-dimensional modeling apparatus described in Patent Document 1, although conduction related to stress can be ensured by adjusting the wall surface defining the hole, conduction of the conductor may be difficult depending on modeling conditions. Thus, in three-dimensional modeling apparatuses, there has been a demand for further ensuring conduction of conductors.

[0005] The present disclosure has been made to solve such problems, and a main object thereof is to provide a three-dimensional modeling apparatus, an information processing apparatus, a manufacturing method and an information processing method that can more appropriately ensure conduction of a conductor.

[0006] The present disclosure adopts the following means to achieve the above-mentioned main object.

[0007] The three-dimensional molding apparatus of the present disclosure is a three-dimensional molding apparatus for molding an object, comprising: a first discharge head for discharging a structural fluid constituting the structure of the object into a molding region; a second discharge head for discharging a conductive fluid constituting a conductor into the molding region; and, in the case of molding an object including a conductive exposed portion on the conductor where the structure is not molded and the structure molded adjacent to the conductive exposed portion, a control unit which, after discharging the conductive fluid into the molding region with the second discharge head to mold the conductor, then discharging the structural fluid with the first discharge head to mold the structure, and thereafter discharging at least one layer of the conductive fluid onto the conductive exposed portion with the second discharge head to form a conductive layer.

[0008] In 3D printing systems, for example, when a structure is fabricated, components of the structural fluid may adhere to the fabricated conductive material, reducing its conductivity. This 3D printing system forms a thin conductive layer on the conductive material when fabricating a structure, thereby further reducing the influence of the structural fluid components. In this way, this 3D printing system can more effectively ensure the conductivity of the conductive material by forming a conductive layer.

[0009] A schematic diagram showing an example of the molding system 10. A schematic diagram showing an example of the structure of the 3D molding apparatus 11 viewed from the front at an angle. A schematic diagram showing an example of each ejection unit and moving unit 26. A schematic diagram showing an example of the coating unit 40. A schematic diagram showing an example of a molded object 62A. A schematic diagram showing an example of a molded object 62B. A flowchart showing an example of a molding job generation processing routine. A schematic diagram showing an example of the molding process of a molded object 62 based on molding job information 83. A flowchart showing an example of a molded object production processing routine. A schematic diagram showing an example of setting a conductor E that takes into account the conductive layer L. A flowchart showing an example of another molding job generation processing routine. A schematic diagram showing an example of the molding process of another molded object 62.

[0010] This embodiment will be described below with reference to the drawings. Figure 1 is a schematic diagram showing an example of a molding system 10, which is an example of the present disclosure. Figure 2 is a schematic diagram showing an example of the structure of a three-dimensional molding apparatus 11 viewed from the front at an oblique angle. Figure 3 is a schematic diagram showing an example of a first discharge unit 30, a second discharge unit 35, and a moving unit 26. Figure 4 is a schematic diagram showing an example of a coating unit 40. Figure 5 is a schematic diagram showing an example of a molded object 62A. Figure 6 is a schematic diagram showing an example of a molded object 62B. In this embodiment, the left-right direction (X-axis), front-back direction (Y-axis), and up-down direction (Z-axis) are as shown in Figures 1 to 4.

[0011] The molding system 10 comprises a three-dimensional molding device 11, a mounting device 12, and an information processing device 80. This molding system 10 is configured as a production line in which the three-dimensional molding device 11 first processes to mold an object, then second processes to form predetermined components on the object, and finally the mounting device 12 processes the mounting of the components. The three-dimensional molding device 11 may also form wiring (circuit) patterns as conductive material as the second process, and the mounting device 12 may perform the process of mounting components P at predetermined positions on the conductive material. In addition to the mounting device 12, the molding system 10 may also include one or more mounting-related devices from among a printing device for printing solder as a viscous fluid onto the object, a printing inspection device for inspecting the printing results, a mounting inspection device for inspecting the mounting results, and a transport device for transporting the molded object. In the molding system 10 shown in Figure 1, one 3D molding device 11 and one mounting device 12 are included, but multiple 3D molding devices 11 and mounting devices 12 may also be included.

[0012] The mounting device 12 is a device for mounting parts P onto an object fabricated by the 3D printing device 11. The mounting device 12 comprises a control device, a transport processing unit 13, a parts supply unit 14, an imaging unit 16, a mounting unit 17, an operation panel, and a communication unit. The control device is configured as a microprocessor centered on a mounting control unit such as a CPU, and is responsible for controlling the entire device. This control device outputs control signals to the transport processing unit 13, the parts supply unit 14, the imaging unit 16, the mounting unit 17, and the operation panel, and inputs signals from the transport processing unit 13, the parts supply unit 14, the imaging unit 16, the mounting unit 17, and the operation panel. The control device includes a storage unit, which is a large-capacity storage medium such as flash memory. The storage unit stores mounting information, which includes information about the parts P to be mounted, the arrangement order and position on the fabricated object, and the mounting position of the feeder 15 for picking up the parts. The transport processing unit 13 is responsible for loading, transporting, fixing at the mounting position, and unloading the pallet 60 on which the molded object is placed. The parts supply unit 14 is a unit that supplies parts P to the mounting unit 17. The parts supply unit 14 has a feeder 15 having a reel that holds parts attached to one or more mounting units. The imaging unit 16 is a camera that images the area above and images parts P and the like held by the mounting head 19 of the mounting unit 17. The operation panel is a unit that receives input from the operator and presents information to the operator. This operation panel has a display unit which is a display and an operation unit which has a touch panel and buttons. The mounting unit 17 is a unit that picks up parts P from the parts supply unit 14 and places them on the molded object fixed to the transport processing unit 13. The mounting unit 17 has a head moving unit 18, a mounting head 19 and a picking member. The head movement unit 18 includes a slider that moves in the XY direction guided by a guide rail, and a motor that drives the slider. The mounting head 19 is detachably mounted on the slider and moves in the XY direction by the head movement unit 18 after picking up one or more parts. One or more picking members are detachably mounted on the lower surface of the mounting head 19. The picking members may be suction nozzles that pick up parts using negative pressure, or mechanical chucks that mechanically hold parts. The communication unit is an interface for exchanging information with external devices such as the 3D modeling apparatus 11 and the information processing apparatus 80.

[0013] The 3D printing apparatus 11 is a 3D printing apparatus that extrudes a fluid onto an object to create and manufacture a 3D object having a substrate, conductive material, etc. as a structural element. The 3D object includes, for example, a substrate, as well as conductive material formed on and / or within the substrate, and components arranged on and / or within the substrate. The object is initially the pallet 60, and once the substrate, wiring (circuits), conductive material, etc. are formed on the pallet 60, it refers to that formed object. The material to be printed is not particularly limited, but examples include resins and ceramics. As shown in Figures 1 and 2, the 3D modeling apparatus 11 includes a control device 20, a storage unit 22, a moving unit 26, a flattening unit 29, a first discharge unit 30, a first maintenance unit 33, a first curing unit 34, a second discharge unit 35, a second maintenance unit 38, a second curing unit 39, a coating unit 40, a pressing unit 45, an inspection unit 58, an operation panel 48, and a communication unit 49. The 3D modeling apparatus 11 also includes a first gantry 51, a second gantry 52, a third gantry 53, and a housing 54 as part of its apparatus structure. Here, the 3D modeling apparatus 11 will be mainly described in which the first discharge unit 30 creates, for example, a base material for a modeled object that acts as an insulator, and the second discharge unit 35 performs a process to form conductive material such as a wiring pattern on the created insulator. Furthermore, the first discharge unit 30 and the second discharge unit 35 are collectively referred to simply as "discharge units," the first maintenance unit 33 and the second maintenance unit 38 are collectively referred to simply as "maintenance units," and the first curing unit 34 and the second curing unit 39 are collectively referred to simply as "curing units."

[0014] The control device 20 is configured as a microprocessor centered around a molding control unit 21 such as a CPU, and controls the entire 3D printing apparatus 11. The control device 20 exchanges information with the storage unit 22 and each unit. The molding control unit 21 executes the molding process of the object using the first ejection unit 30, the second ejection unit 35, the coating unit 40, etc. For example, when a substrate S of a predetermined standard thickness T is molded after a conductor E has been molded, the molding control unit 21 performs a process to form a conductive layer L that is thinner than the conductor E on the exposed conductor portion 68 where the conductor E is exposed (see Figure 8 below). The storage unit 22 is, for example, a large-capacity storage medium such as flash memory. The storage unit 22 stores molding job information 23 and inspection result information 24, etc. The molding job information 23 is information that includes, for example, the shape and size of the object to be manufactured, the wiring pattern as a conductor E formed on the substrate S, and printed images of each layer. The molding job information 23 includes, for example, a process to form a conductive layer L thinner than the conductive material E on the conductive material exposed portion 68 when a substrate S of a predetermined standard thickness T is molded after a conductive material E has been molded. The molding job information 23 may be generated as molding job information 83 by the information processing device 80 and stored in the storage unit 22 via the network. The 3D molding apparatus 11 executes the molding process based on the information stored in the storage unit 22.

[0015] As shown in Figures 1 to 3, the moving unit 26 is a stage that moves the pallet 60, which is the object from which the fluid is discharged. This moving unit 26 comprises a support section 27 and a support movement section 28. The support section 27 supports and fixes the pallet 60 on which the printed object is placed in the printing area 61. The support movement section 28 is a drive unit that moves the support section 27 along the printing path in the front-rear direction in the center of the housing 54, and also moves the distance between the discharge head and the object by raising and lowering the support section 27. The support movement section 28 may have a linear drive section, which can be configured as a linear motor or a ball screw mechanism.

[0016] The pallet 60 is a plate-shaped member having an area for forming objects, and is detachably attached to the support part 27. As shown in Figure 3, the pallet 60 has a forming area 61 and a receiving area. A removable film is attached to the upper surface of the pallet 60, and by replacing this film, it is possible to manufacture the next object. The forming area 61 is a printing area where an object is formed by the first discharge unit 30, a predetermined pattern is formed on the object by the second discharge unit 35, and a liquid substance is applied to the object by the coating unit 40. The receiving area is an area that receives unwanted fluids and liquids discharged from the first discharge head 32, the second discharge head 37, and the coating head 42.

[0017] The objects fabricated on the pallet 60 include, for example, multilayer substrates as shown in Figures 5 and 6. The fabricated object 62A is a multilayer substrate having holes, as shown in Figure 5. The fabricated object 62A has, for example, through holes 63, spring probe pins 64, bolts 65, hole electrodes 66, and upper electrodes 67. The fabricated object 62A has a structure in which each layer is fabricated and then fixed with bolts 65 to form a circuit. The upper electrode 67 is formed by placing a conductor E containing a conductive layer L on the bottom surface of a hole formed in the base material S, and applying conductive paste to form a pad. For example, a circuit is formed in which each layer is electrically connected by inserting and contacting the spring probe pin 64 into this pad. The hole electrode 66 is formed by filling a hole formed in the base material S with conductive paste. For example, the upper end of the spring probe pin 64 is inserted into the hole electrode 66 from below. As shown in Figure 6, the fabricated object 62B has a structure in which each layer is fabricated integrally. Conductors E, which serve as wiring for circuits, are formed on a base material S, bumps B are formed on the conductive material E, and components P are placed on the bumps B. In the fabricated object 62B, the base material S is fabricated on the conductive material E, and the conductive material E has a portion that is placed inside the base material S and a portion that is exposed to the outside of the base material S. The fabricated object 62B has the exposed conductive material portion at the position where the components P are to be mounted. Here, the fabricated objects 62A and 62B are collectively referred to as fabricated object 62.

[0018] The first discharge unit 30 is a unit that discharges a fluid, which will be the base material for the molded object, onto the molding area 61 of the pallet 60. The first discharge unit 30 is movably disposed to the left of the first gantry 51, which is fixed to the front region in the Y-axis direction of the housing 54 of the 3D molding apparatus 11. The first discharge unit 30 comprises a first moving unit 31, a first discharge head 32, and a first fluid processing unit. The first moving unit 31 comprises a slider that moves along the X-axis direction guided by a guide rail, and a motor that drives the slider. The first discharge head 32 is mounted on the slider, and the first discharge head 32 moves along the X-axis direction as the slider moves. The first moving unit 31 moves the first discharge head 32 between a standby position and a discharge position on the pallet 60. The first discharge head 32 is a structural fluid discharge head that discharges a structural fluid, which will be the structure of the molded object, from a nozzle 32a onto an object such as the pallet 60 to form the molded object. The first discharge head 32 has a nozzle 32a and a discharge drive unit. Multiple nozzles 32a are formed on a nozzle plate, constituting a nozzle row 32b. These nozzles 32a are openings that discharge the fluid supplied from the first fluid processing unit to the pallet 60. The discharge drive unit discharges the fluid toward the pallet 60, for example, and could be a piezoelectric element. The fluid discharged by the first discharge head 32 can be a liquid such as a liquid curable resin (e.g., UV curable resin, thermosetting resin, two-component mixed curable resin, etc.), a thermoplastic resin, or a slurry obtained by mixing a solvent with a solid substance such as an inorganic material. The first fluid processing unit comprises a first supply tank containing fluid and a first recovery tank containing recovered fluid, and is a unit that delivers fluid.

[0019] The first maintenance unit 33 is a unit that seals and protects the first discharge head 32 and performs discharge maintenance based on the discharge state of the first discharge head 32. The first maintenance unit 33 includes, for example, a first cap that seals the first discharge head 32, a first discharge receiving section that receives the fluid discharged from the first discharge head 32, and a first cleaning section that cleans the first discharge head 32. Discharge maintenance includes, for example, performing a flushing process and performing a process to wipe and clean the nozzle plate of the first discharge head 32.

[0020] The first curing unit 34 is a unit that performs a predetermined process on a fluid discharged from the first discharge head 32 onto an object such as a molded object that has been cured on the pallet 60 or on the pallet 60, thereby curing it. The first curing unit 34 may also cure the fluid discharged into the molding area 61 by irradiating it with light of a predetermined wavelength, such as ultraviolet light. Alternatively, the first curing unit 34 may also be a unit that performs drying and firing depending on the material of the fluid. For example, each time a layer of fluid is formed on the molding area 61 by the first discharge head 32, the pallet 60 is moved downwards and the fluid is cured.

[0021] The second discharge unit 35 is a unit that discharges conductive fluid, which will become conductive material such as wiring formed inside or on the surface of the molded object, onto the pallet 60 or onto the molded object. The second discharge unit 35 is movably disposed to the right of the first gantry 51, which is fixed to the front region in the Y-axis direction of the housing 54. The second discharge unit 35 comprises a second moving unit 36, a second discharge head 37, and a second fluid processing unit. The second moving unit 36 ​​comprises a slider that moves along the X-axis direction guided by a guide rail, and a motor that drives the slider. The second discharge head 37 is mounted on the slider, and the second discharge head 37 moves along the X-axis direction as the slider moves. The second moving unit 36 ​​moves the second discharge head 37 between a standby position and a discharge position on the pallet 60. The second discharge head 37 is a conductive material fluid discharge head that discharges fluid onto an object such as the pallet 60 to form conductive material. The second discharge head 37, like the first discharge head 32, has a plurality of nozzles 37a constituting a nozzle row 37b and a discharge drive unit. Note that the second discharge head 37 has the same structure and function as the first discharge head 32, so a detailed explanation is omitted. The fluid discharged by the nozzles 37a is a liquid, such as a mixture of a solvent and a solid, or a solution of a solvent in which a resin is dissolved. This fluid can be, for example, a conductive paste in which metal particles are dispersed in a resin that hardens upon heating, or a conductive metal ink fluid. For example, as an example of a conductive metal ink fluid, a conductive metal ink in which metal fine particles are dispersed in a solvent is used. For example, in a conductive paste, when the resin hardens and shrinks, the metal particles dispersed in the resin come into contact with it. This causes the conductive paste to exhibit conductivity. The resin in the conductive paste is, for example, an organic adhesive, which exhibits adhesive strength upon hardening. Furthermore, the first discharge head 32 and the second discharge head 37 are collectively referred to simply as "discharge heads," the nozzles 32a and 37a are collectively referred to simply as "nozzles," and the nozzle rows 32b and 37b are collectively referred to simply as "nozzle rows."

[0022] The second maintenance unit 38 is a unit that seals and protects the second discharge head 37 and performs discharge maintenance based on the discharge state of the second discharge head 37. The second maintenance unit 38 includes, for example, a second cap that seals the second discharge head 37, a second discharge receiving section that receives the fluid discharged from the second discharge head 37, and a second cleaning section that cleans the second discharge head 37. Discharge maintenance includes the flushing and cleaning processes described above.

[0023] The second curing unit 39 is a unit that performs a predetermined process on the fluid discharged from the second discharge head 37 onto the molding area 61 of the pallet 60 or onto the molded object that has been cured on the pallet 60, thereby curing it. The second curing unit 39 may also cure the fluid discharged onto the molding area 61 by irradiating it with light of a predetermined wavelength, such as infrared light. Alternatively, the second curing unit 39 may also be a unit that performs drying and firing depending on the material of the fluid. For example, each time a layer of fluid is formed on the pallet 60 by the second discharge head 37, the pallet 60 is moved downwards and the fluid is cured.

[0024] The flattening unit 29 is a unit that flattens the surface of the fluid discharged onto the pallet 60 and / or the molded object using a flattening member. The flattening member includes, for example, a flattening roller that rotates with relative movement to the molded object, or a flat flattening blade.

[0025] The coating unit 40 is a unit that applies a liquid substance to the molded object on the pallet 60. As shown in Figures 1 and 2, the coating unit 40 is movably disposed on a second gantry 52 fixed to the central region in the Y-axis direction of the housing 54 of the 3D molding apparatus 11. The coating unit 40 is located on a transport passage for loading and unloading the pallet 60 to and from the mounting apparatus 12, and is configured to perform not only coating processing by the dispenser 43, but also loading and unloading of the pallet 60, coating amount detection processing, imaging processing, and height measurement processing. The coating unit 40 consists of a coating movement unit 41, a coating head 42, and a coating amount detection unit. The coating head 42 of the coating unit 40 is also provided with a work unit 50 including an imaging unit 55, a height detection unit 56, and a mounting transport unit 57. The coating movement unit 41 includes a slider that moves along the X-axis direction guided by a guide rail disposed on the second gantry 52, and a motor that drives the slider. A coating head 42 is mounted on the slider, and the coating head 42 moves along the X-axis direction as the slider moves. As shown in Figure 1, the coating movement unit 41 moves the coating head 42 between a coating position, which is the upper part of the pallet 60 in the central region along the X-axis of the housing 54; an loading / unloading position on the mounting device 12 side; and a retracted position on the opposite side from the mounting device 12. Dispensers 43A to C are arranged on the coating head 42, such as one for coating conductive paste and another for coating underfill U as a filler. The dispenser 43 has a discharge port for dispensing liquid and is equipped with a syringe for containing the liquid. The syringe is a columnar member containing the liquid, and the liquid is dispensed from a discharge port at the lower end by pressure applied from above. Examples of liquids include multiple types of resins with different viscosity and conductivity, such as a resin in which a conductive material is dispersed, or an insulating resin.

[0026] The imaging unit 55 is a camera that images the area below, which is the pallet 60 side. The imaging unit 55 images, for example, the molded object on the molding area 61, the inspection area 59 of the inspection unit 58, etc. The height detection unit 56 is configured as a sensor that moves the contact terminal at its tip downward and determines the height of the object it has contacted based on the position where it contacts the object. The mounting transport unit 57 is used when transporting the pallet 60 to the mounting device 12 side, which is an area outside the printing passage, and when transporting the pallet 60 from the mounting device 12. The mounting transport unit 57 has a rod structure that can be extended downward, and moves the pallet 60 by contacting its tip with the edge of the pallet 60 and pushing it out or hooking and pulling it in. The coating amount detection unit detects the weight of the liquid substance dispensed from the dispenser 43. The coating amount detection unit applies an arbitrary pressure to the dispenser 43 and measures the amount of liquid substance dispensed from the syringe per unit time. Using these measured values, the control device 20 controls the discharge rate of the liquid to an appropriate value.

[0027] The pressing unit 45 is a unit that presses the molded object on the pallet 60, or a liquid applied to the pallet 60 or the molded object. The pressing unit 45 is located in a third gantry 53 fixed to the rear region in the Y-axis direction of the housing 54 of the 3D printing apparatus 11. The pressing unit 45 may also heat the molded object to press it. The pressing unit 45 consists of a pressing unit that presses the object with a pressing member 46, a heating unit that heats the pressing unit, and a pressing and transporting unit 47 that loads and unloads the pallet 60. The pressing member 46 is a member that contacts and pressurizes the molded object. When the pressing unit 45 is equipped with a heating unit, the pressing member 46 is a member that contacts the molded object, pressurizes it, and heats it. The pressing and conveying unit 47 is responsible for loading and unloading the pallet 60 to and from the pressing unit 45, which is located outside the movement lane of the moving unit 26. The pressing and conveying unit 47 may be mechanically similar to the mounting and conveying unit of the work unit 50.

[0028] The inspection unit 58 is used in a three-dimensional molding apparatus having a discharge head that discharges fluid, and inspects the discharge state of the fluid. This inspection unit 58 is located on a support unit 27 that supports the pallet 60 of the mobile unit 26, and moves along with the movement of the support unit 27 by the support movement unit 28. As shown in Figures 1 to 3, the inspection unit 58 has an inspection area 59 where the fluid is discharged as droplets. The control device 20 determines whether the fluid discharge state at the nozzle is normal or not based on the positional relationship between the fluid discharge position and a reference mark located in the inspection area 59, as well as the discharge area.

[0029] The control panel 48 is a unit that receives input from the operator and presents information to the operator. This control panel 48 comprises a display unit, which is a display, and an operation unit with a touch panel and buttons. The communication unit 49 is an interface for exchanging information with external devices such as the mounting device 12 and the information processing device 80.

[0030] The information processing device 80 is configured as a management server that processes information used by the 3D modeling apparatus 11 and manages the modeling system 10. This information processing device 80 includes an information control unit 81, a storage unit 82, a display device 86, an input device 87, and a communication unit 88. The information control unit 81 has a CPU and is responsible for controlling the entire apparatus. The information control unit 81 also functions as a generation unit that generates modeling job information 83 that causes the second discharge head 37 to discharge at least one layer of conductive fluid onto the conductive material exposed portion 68 to form a conductive layer L. The storage unit 82 is a large-capacity storage device such as flash memory. The storage unit 82 stores modeling job information 83, which includes information similar to that of modeling job information 23. The display device 86 is a display that displays images. The input device 87 includes a keyboard and mouse that accept input from the user. The communication unit 88 exchanges information with external devices such as the 3D modeling apparatus 11 and the mounting device 12 via a network such as a LAN. The information control unit 81 sets up molding job information 83 and other information based on requests from the 3D molding device 11 and the mounting device 12, and transmits it via the communication unit 88.

[0031] Next, the process of setting the molding job information 23 of the molding system 10 configured in this way will be described. Figure 7 is a flowchart showing an example of a molding job generation processing routine executed by the information control unit 81 of the information processing device 80. Figure 8 is an explanatory diagram showing an example of the molding process of a molded object 62 based on the molding job information 83, where Figure 8A is an explanatory diagram of each layer of the molded object 62, such as the base material S and the conductor E, and Figure 8B is an explanatory diagram of an example of the molded object 62. The molding job generation processing routine is stored in the storage unit 82 and executed by the information processing device 80 before the production process of the molded object 62. Alternatively, the functions of the information processing device 80 may be assigned to the control device 20, and this process may be executed by the control device 20. When this routine is started, the information control unit 81 first acquires the design data of the molded object 62 stored in the storage unit 22 (S100). The design data may be, for example, CAD data. Next, the information control unit 81 acquires the molding layers of the structure and the conductor based on the design data (S110). The information control unit 81 acquires the fabricated layers as printed images of each layer obtained by slicing the fabricated object 62 into layers. Next, the information control unit 81 generates the fabrication steps for the structure or conductive material (S120). Starting from the bottom layer of the fabricated object 62, the information control unit 81 generates the following steps in order: dispensing of structural fluid, flattening step, hardening of structural fluid, dispensing of conductive fluid, hardening step, application of liquid material, hardening step by pressing and heating, and loading / unloading steps for the mounting device 12.

[0032] Next, the information control unit 81 determines whether or not a structure with a predetermined reference thickness T has been fabricated after the conductor E has been fabricated (S130). The reference thickness T may be, for example, the thickness of the structure determined based on the decrease in conductivity of the conductor due to volatile components of the structural fluid. This reference thickness T may be a value obtained by empirically determining the thickness at which the decrease in conductivity of the conductor E appears and adding a margin as necessary to this thickness. Alternatively, the reference thickness T may be a value thinner than the allowable thickness Tm of the structure, which is the limit value determined based on the decrease in conductivity of the conductor due to volatile components of the structural fluid. In S130, the information control unit 81 may also determine whether or not the allowable thickness Tm has not been exceeded. If a structure with a predetermined reference thickness T has been fabricated after the conductor E has been fabricated, the information control unit 81 determines whether or not there is a conductor exposure portion 68 in the object fabricated in the current fabrication step where the conductor E is exposed to the outside (S140). When there is a conductive exposed portion 68, the information control unit 81 generates a process to form a conductive layer L that is thinner than the conductive material E on top of the fabricated conductive material E (S150-S160). The information control unit 81 determines the shape of the conductive exposed portion 68 that is exposed to the outside from the difference with the area occupied by the base material S, and generates this difference area as a printed image of the conductive layer L (S150). Next, the information control unit 81 sets the fabrication process to include a step to form the conductive layer L based on this printed image (S160). The conductive layer L may have a thickness that can mitigate the influence of volatile matter V from the base material S as a structure, and may, for example, form a conductive fluid in a range of 1 to 5 layers. This conductive layer L may not be related to the formation of the conductive material E that the fabricated object 62 is equipped with. That is, the conductive layer L may not be formed as part of the conductive material E, but may be a separate layer from the conductive material E. Furthermore, the conductive layer L is preferably thinner, preferably three or fewer layers of conductive fluid, and more preferably two or fewer layers. Since the thickness of the conductor E is preferably close to the design value, it is desirable that the conductive layer L, which is not included in the design value, be thinner.

[0033] As shown in Figure 8, in the fabrication process of the fabricated object 62 according to the fabrication job information 83, the conductor E and the substrate S are fabricated in each layer. The fabricated object 62 in Figure 8 has hole electrodes 66 that serve as pads and upper electrodes 67 to which terminals are connected, and is an example in which there is a conductive exposed portion 68 on the conductor E during fabrication. In the fabrication process of the fabricated object 62, for example, a conductive paste may be applied to the conductor E, but volatile substances V from the substrate S may inhibit the hardening of the conductive paste, causing poor conductivity. In this fabrication job information 83, if there is a possibility that volatile substances V may adhere to the surface of the conductor E that has been fabricated and is exposed to the outside to some extent, a conductive layer L of conductive fluid is formed to further suppress the occurrence of poor conductivity in the conductor E. Here, the thickness x of the conductive layer L may be thinner than the thickness X of the conductor E. Furthermore, in the molding job information 83, the conductive layer L may be set to be formed in a range where the substrate S is greater than or equal to a reference thickness T and less than an allowable thickness Tm. Note that in both the molded object 62A having a hole electrode 66 and an upper electrode 67 as shown in Figure 5, and the molded object 62B in which a component P is placed on a bump B as shown in Figure 6, the conductivity of the conductor E can be ensured by the formation of the conductive layer L.

[0034] If a structure of reference thickness T has not been fabricated after S160, or if there is no conductive exposed portion 68 in S140, the information control unit 81 determines whether all fabrication steps have been set (S170). If all fabrication steps have not been set, the information control unit 81 executes the processing from S120 onward. That is, the information control unit 81 generates the next fabrication step and constructs a fabrication process in which a conductive layer L is formed on the conductive exposed portion 68 when the substrate S of reference thickness T, before exceeding the allowable thickness Tm, is fabricated. On the other hand, if all fabrication steps have been set in S170, the information control unit 81 outputs fabrication job information 83 including the generated fabrication steps (S180) and terminates this routine. In S180, the information control unit 81 may store and output the fabrication job information 83 to the storage unit 82, or it may output the fabrication job information 83 to the storage unit 22 of the 3D fabrication apparatus 11 via the network. The 3D printing apparatus 11 stores the printing job information 83 as printing job information 23 in the storage unit 22, and uses this printing job information 23 to execute the manufacturing process of the printed object 62.

[0035] Next, the three-dimensional molding process of the three-dimensional molding apparatus 11 configured in this way will be described. Figure 9 is a flowchart showing an example of a molding production processing routine executed by the molding control unit 21 of the control device 20. This routine is stored in the storage unit 22 and is executed by the control device 20 after the operator inputs a production processing execution command. When this routine is started, the molding control unit 21 of the control device 20 first reads and acquires molding job information 23 from the storage unit 22 (S200). Alternatively, the molding control unit 21 may acquire molding job information 83 from the information processing device 80 and use that as the molding job information 23.

[0036] Next, the molding control unit 21 determines whether it is time for inspection and maintenance of the first ejection unit 30 and the second ejection unit 35 (S210). This timing may be, for example, at the start of a new production, when a predetermined number of molded objects such as 5 or 10 have been produced, or when a predetermined time such as 30 minutes or 1 hour has elapsed after the start of production. If it is currently time for inspection and maintenance, the molding control unit 21 performs inspection and maintenance processing of the first ejection head 32 and / or the second ejection head 37 (S220). In this process, the molding control unit 21 performs maintenance processing using the first maintenance unit 33 and the second maintenance unit 38, and performs inspection processing using the inspection unit 70.

[0037] After S220, or if it is not inspection / maintenance timing in S210, the molding control unit 21 checks the molding process to be executed based on the molding job information 23 (S230). If the process to be executed is the extrusion process of structural material, the molding control unit 21 executes the first printing process using the first extrusion head 32 (S240). At this time, the molding control unit 21 executes a process to print structural fluid based on the printed image of the molded object 62 contained in the molding job information 23, performs a flattening process with the flattening unit 29, and hardens the structural fluid with the first hardening unit 34. Through this process, a substrate S and cavities C as structural elements are formed in the molding area 61. Also, if the process to be executed in S230 is the extrusion process of conductive material, the molding control unit 21 executes the second printing process using the second extrusion head 37 (S250). In the second printing process as well, the molding control unit 21 executes a process to print conductive fluid onto the object based on the printed image of the molded object 62. This process forms a molded object 62 having a conductive material E in the molding area 61.

[0038] Furthermore, in S230, if the process to be executed is the process of forming a conductive layer L by the second discharge head 37, the molding control unit 21 executes the conductive layer formation process by thin-layer discharge of conductive fluid by the second discharge head 37 (S260). The molding job information 23 is set to form the conductive layer L after the substrate S has been molded, reaching a reference thickness T and before exceeding the allowable thickness Tm, if there is a conductive exposed portion 68. For this reason, the control device 20 that executes the molding job information 23 also forms the conductive layer L after the substrate S has been molded, reaching a reference thickness T and before exceeding the allowable thickness Tm, if there is a conductive exposed portion 68 (see Figure 8). In the case of the hole electrode 66 and upper electrode 67, which are filled with conductive paste filler F, even if volatile matter V adheres to the surface of the conductor E or conductive layer L, the conductivity of the filler F can be ensured by the formation of the conductive layer L on top of it.

[0039] Furthermore, if the process to be executed in S230 is a coating process by the dispenser 43, the molding control unit 21 executes the coating process by the coating head 42 (S270). In the coating process, the molding control unit 21 causes the coating head 42 to perform tasks such as coating the underfill U, forming the bumps B, and coating the conductive filler F. The molding control unit 21 also performs heating and pressing with the pressing unit 45 to perform a hardening process for the liquid material. Furthermore, if the process to be executed in S230 is a component mounting process, the molding control unit 21 causes the mounting transport unit 57 of the work unit 50 to perform the loading and unloading processes of the pallet 60 to the mounting device 12 (S280). When the mounting device 12 loads the pallet 60, it executes the component placement process based on the mounting job information. Here, the mounting device 12 places the components P, which are set in the mounting order, onto the molded object 62 based on the mounting job information. Once the assembly process is complete and the object on which the parts P are placed is brought into the 3D printing apparatus 11, the printing control unit 21 causes the dispenser 43 to apply underfill U as needed and the pressing unit 45 to perform the pressing process.

[0040] After steps S240 to S280, the molding control unit 21 determines whether all production processes have been completed (S290). If all production processes have not been completed, the molding control unit 21 executes the processes from S210 onward. On the other hand, if the production processes are completed in S290, this routine is terminated. In this way, the molding control unit 21 can more appropriately ensure the conductivity of the conductor E by first discharging conductive fluid into the molding area 61 to form the conductor E, then discharging structural fluid to form the base material S as a structure, and then discharging at least one layer of conductive fluid onto the conductor exposed portion 68 to form a conductive layer L.

[0041] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The three-dimensional molding apparatus 11 of this embodiment corresponds to an example of the three-dimensional molding apparatus of the present disclosure, the molding area 61 corresponds to an example of the molding area, the first ejection head 32 corresponds to an example of the first ejection head, the second ejection head 37 corresponds to an example of the second ejection head, the molding control unit 21 corresponds to an example of the control unit, the conductive material exposed portion 68 corresponds to an example of the conductive material exposed portion, and the conductive layer L corresponds to an example of the conductive layer. Furthermore, the coating head 42 corresponds to an example of the coating head, the hole in which the hole electrode 66 and the upper electrode 67 are exposed corresponds to an example of the hole, the first curing unit 34 corresponds to an example of the first curing unit, the second curing unit 39 corresponds to an example of the second curing unit, and the allowable thickness Tm corresponds to an example of the allowable thickness. Furthermore, the information processing device 80 corresponds to an example of an information processing device, the information control unit 81 corresponds to an example of a generation unit, the molding job information 23 and molding job information 83 correspond to an example of molding job information, and the part P corresponds to an example of a part. In this embodiment, by explaining the operation of the molding system 10, including the 3D molding apparatus 11 and the information processing device 80, an example of a manufacturing method for the molded object and an example of an information processing method of the disclosed object are also clarified.

[0042] The three-dimensional molding apparatus 11 of this embodiment described above is a device for molding a molded object 62, and comprises: a first discharge head 32 that discharges a structural fluid constituting a base material S as a structure of the molded object 62 into a molding area 61; a second discharge head 37 that discharges a conductive fluid constituting a conductor E into the molding area 61; and a molding control unit 21 that, when molding a molded object 62 including a conductive exposed portion 68 on the conductor E where no structure is molded and a structure molded adjacent to the conductive exposed portion 68, discharges the conductive fluid into the molding area 61 with the second discharge head 37 to mold the conductor E, then discharges the structural fluid with the first discharge head 32 to mold the structure, and then discharges at least one layer of conductive fluid onto the conductive exposed portion 68 with the second discharge head 37 to form a conductive layer L. In this 3D printing apparatus 11, for example, when a structure is fabricated, volatile substances V, which are components of the structural fluid, may adhere to the fabricated conductor E, causing a decrease in the conductivity of the conductor E. In this 3D printing apparatus 11, when a structure is fabricated, a thin conductive layer L is formed on the conductor E, for example, thereby further reducing the influence of volatile substances V of the structural fluid. In this way, in this 3D printing apparatus 11, the conductivity of the conductor E can be more appropriately ensured by forming the conductive layer L.

[0043] Furthermore, the 3D printing apparatus 11 is equipped with a coating head 42 for coating the printing area 61 with a conductive liquid, and the printing control unit 21 causes the coating head 42 to coat the conductive material exposed portion 68, including the conductive layer L. This 3D printing apparatus 11 can better ensure conductivity when a conductive liquid such as a filler F or bumps B is coated on the conductive material E. In addition, this 3D printing apparatus 11 can prevent conductivity problems such as those caused by inhibiting the hardening of the liquid, such as those caused by the filler F or bumps B. Furthermore, after forming the conductive layer L, the printing control unit 21 uses the first discharge head 32 to discharge the structural fluid onto the already formed structure to further form the structure. Even when multiple layers of the structure are formed, where the influence of volatile substances V from the structural fluid on the conductive material E becomes significant, this 3D printing apparatus 11 can ensure the conductivity of the conductive material E by periodically forming the conductive layer L. Furthermore, the molding control unit 21 causes the molding device 11 to fabricate an object 62A having holes in the structure through which the conductor exposed portion 68 and upper electrode 67 are exposed. In this 3D molding device 11, the conductivity of the conductor E can be more effectively guaranteed in the object 62A having holes. Then, the molding control unit 21 causes the molding device 11 to fabricate an object 62B having the conductor exposed portion 68 at the position where the component P is to be mounted. In this 3D molding device 11, the conductivity of the conductor E can be more effectively guaranteed in the object 62B on which the component P is mounted.

[0044] Furthermore, the modeling control unit 21 forms the conductive layer L by discharging a conductive fluid separate from the modeling of the conductor E, in order to form the conductive layer L that is not related to the formation of the conductor E included in the completed modeled object 62, thereby further ensuring the conductivity of the conductor E. Further, after modeling the conductor E, the modeling control unit 21 forms the conductive layer L on the exposed conductor portion 68 before modeling a structure exceeding a predetermined allowable thickness Tm that is determined based on a decrease in conductivity of the conductor E caused by volatile V of volatile components of the structural fluid. In this three-dimensional modeling apparatus 11, when modeling of a structure exceeding the predetermined allowable thickness Tm is continued, the conductive layer L is formed, and the decrease in conductivity of the conductor E caused by the volatile V of the structural fluid is further suppressed, thereby further ensuring the conductivity of the conductor E. Still further, the three-dimensional modeling apparatus 11 includes a first curing unit 34 that cures the structural fluid discharged into the modeling area 61 to become a structure, and a second curing unit 39 that cures the conductive fluid discharged into the modeling area 61 to become the conductor E. When the modeling control unit 21 models a modeled object 62 including the exposed conductor portion 68 and a structure formed adjacent to the exposed conductor portion 68, after causing the second discharge head 37 to discharge the conductive fluid into the modeling area 61 and causing the second curing unit 39 to cure the conductive fluid to model the conductor E, the modeling control unit 21 causes the first discharge head 32 to discharge the structural fluid and causes the first curing unit 34 to cure the structural fluid to model the structure. Thereafter, the modeling control unit 21 causes the second discharge head 37 to discharge at least one layer of the conductive fluid onto the exposed conductor portion 68, and causes the second curing unit 39 to cure the conductive fluid to form the conductive layer L on the conductor E. In this three-dimensional modeling apparatus 11, the conductivity of the conductor E can be further ensured by forming the conductive layer L while curing the conductive fluid and the structural fluid.

[0045] Furthermore, the information processing device 80 of this embodiment includes a first discharge head 32 that discharges a structural fluid constituting a base material S as a structure of the molded object 62 into the molding area 61, and a second discharge head 37 that discharges a conductive fluid constituting a conductor E into the molding area 61, and is a device that processes information used in a three-dimensional molding apparatus 11 that molds the molded object 62. When molding a molded object 62 that includes a conductive exposed portion 68 on the conductor E where no structure is molded and a structure molded adjacent to the conductive exposed portion 68, the information processing device 80 includes an information control unit 81 as a generation unit that generates molding job information 83 which, after discharging a conductive fluid into the molding area 61 using the second discharge head 37 to mold the conductor E, then discharging a structural fluid using the first discharge head 32 to mold the structure, and then discharging at least one layer of conductive fluid onto the conductive exposed portion 68 using the second discharge head 37 to form a conductive layer L. In this information processing device 80, after fabricating the conductor E, the substrate S as a structure is fabricated, and then fabrication job information 83 is generated to form, for example, a thin conductive layer L on the conductor E. Therefore, the 3D fabrication apparatus 11 that performs this can further reduce the influence of volatile substances V, which are components of the structural fluid. In this way, the information processing device 80 can more appropriately ensure the conductivity of the conductor E by forming the conductive layer L.

[0046] Furthermore, the manufacturing method for the molded object 62 of this disclosure is executed by the computer of a three-dimensional molding apparatus 11 that molds a molded object 62 which includes a first discharge head 32 that discharges a structural fluid constituting a base material S as a structure of the molded object 62 into a molding area 61, and a second discharge head 37 that discharges a conductive fluid constituting a conductor E into the molding area 61, and which includes a conductive exposed portion 68 on the conductor E where no structure is molded and a structure molded adjacent to the conductive exposed portion 68. This manufacturing method includes (a) a molding step in which a conductive fluid is discharged into a molding area 61 by a second discharge head 37 to form a conductor E; (b) a molding step in which, after molding step (a), a structural fluid is discharged by a first discharge head 32 to form a substrate S as a structure; and (c) a molding step in which, after molding step (b), at least one layer of conductive fluid is discharged by the second discharge head 37 onto a conductive exposed portion 68 on the conductor E where no structure has been formed to form a conductive layer L. In this manufacturing method, similar to the three-dimensional molding apparatus 11 described above, the conductivity of the conductor E can be more appropriately ensured by forming the conductive layer L.

[0047] Furthermore, in this manufacturing method, the three-dimensional molding apparatus 11 is equipped with a coating head 42 for coating a conductive liquid, and the manufacturing step further includes (d) coating the conductive material onto the conductive exposed portion 68 including the conductive layer L using the coating head 42. In this manufacturing method, conductivity can be better ensured when a conductive liquid such as a filler F or bumps B is coated on the conductive material E. In addition, this manufacturing method can prevent poor conductivity of the filler F or bumps B that may occur due to inhibiting the hardening of the liquid. Furthermore, this manufacturing method includes (e) a manufacturing step in which, after forming the conductive layer L, a structural fluid is discharged onto the molded structure using a first discharge head 32 to further mold the structure. Even when multiple layers of the structure are formed, in which the influence of volatile substances V of the structural fluid on the conductive material E becomes significant, this manufacturing method can ensure the conductivity of the conductive material E by periodically forming the conductive layer L.

[0048] Further, in the modeling step (b), since a modeled article 62A having a hole in the structure is formed by not forming a structure in the conductor exposed portion 68, this manufacturing method can further ensure the conductivity of the conductor E in the modeled article 62A having a hole. Furthermore, in the modeling step (b), when modeling the modeled article 62B on which the component P is to be mounted, the modeled article 62 having the conductor exposed portion 68 at a position where the component P is planned to be mounted is formed. This manufacturing method can further ensure the conductivity of the conductor E in the modeled article 62B on which the component P is mounted. Furthermore, in the modeling step (c), since the conductive layer L irrelevant to the formation of the conductor E included in the completed modeled article 62 is formed, in this manufacturing method, by forming the conductive layer L by discharging a conductive fluid separate from the modeling of the conductor E, the conductivity of the conductor E can be further ensured. Furthermore, after modeling the conductor E in the modeling step (c), before modeling a structure exceeding a predetermined allowable thickness Tm that is determined based on a decrease in conductivity of the conductor E caused by a volatile substance V that is a volatile component of the structural fluid, the conductive layer L is formed on the conductor exposed portion 68. In this manufacturing method, when the modeling of a structure exceeding the predetermined allowable thickness Tm is continued, by forming the conductive layer L and further suppressing a decrease in conductivity of the conductor E caused by the volatile substance V of the structural fluid, the conductivity of the conductor E can be further ensured.

[0049] Furthermore, in this manufacturing method, the three-dimensional molding apparatus 11 includes a first curing unit 34 for curing the structural fluid discharged into the molding area 61, and a second curing unit 39 for curing the conductive fluid discharged into the molding area 61. In molding step (a), the conductive fluid is discharged into the molding area 61 by the second discharge head 37 and cured by the second curing unit 39 to form a conductor E. In molding step (b), the structural fluid is discharged by the first discharge head 32 and cured by the first curing unit 34 to form a structure. In molding step (c), at least one layer of conductive fluid is discharged from the second discharge head 37 onto the exposed conductor portion 68 and cured by the second curing unit 39 to form a conductive layer L on the conductor E. In this manufacturing method, the conductivity of the conductor E can be better ensured by forming the conductive layer L while curing the conductive fluid and structural fluid.

[0050] Furthermore, the information processing method of the present disclosure is a method by which a computer processes information used in a three-dimensional molding apparatus 11 that molds a molded object 62, comprising a first discharge head 32 that discharges a structural fluid constituting a base material S as a structure of a molded object 62 into a molding area 61, and a second discharge head 37 that discharges a conductive fluid constituting a conductor E into the molding area 61. In the case of molding a molded object 62 that includes a conductive exposed portion 68 on the conductor E where no structure is molded and a structure molded adjacent to the conductive exposed portion, the information processing method includes a generation step of generating molding job information 83 which involves discharging a conductive fluid into the molding area 61 using the second discharge head 37 to mold the conductor E, then discharging a structural fluid using the first discharge head 32 to mold the structure, and then discharging at least one layer of conductive fluid onto the conductive exposed portion 68 using the second discharge head 37 to form a conductive layer L. In this information processing method, when a structure is fabricated after the conductor E is fabricated, fabrication job information 83 is generated that forms, for example, a thin conductive layer L on the conductor E. Therefore, the 3D fabrication apparatus 11 that performs this can further reduce the influence of volatile substances V of the structural fluid. In this way, this information processing method can more appropriately ensure the conductivity of the conductor E by forming the conductive layer L.

[0051] It goes without saying that the three-dimensional molding apparatus 11, information processing apparatus 80, molding system 10, manufacturing method of molded object, and information processing method of this disclosure are not limited in any way to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of this disclosure.

[0052] For example, in the embodiment described above, the molding control unit 21 performs the formation of the conductive layer L based on the reference thickness T and allowable thickness Tm of the structure, but this may be omitted. In this 3D molding apparatus 11 as well, when the structure is molded after the conductor E is molded, the conductive layer L is formed, which further suppresses the influence of volatile substances V and more appropriately ensures the conductivity of the conductor E.

[0053] In the above-described embodiment, the 3D printing apparatus 11 is equipped with a coating head 42 that fills the holes in which the hole electrodes 66 and upper electrodes 67 are exposed with filler material F. However, it is not limited to this, and the coating head 42 may be omitted.

[0054] In the embodiment described above, the substrate S as a structure is fabricated after the conductive layer L is formed, but the invention is not limited to this, and the substrate S may not be fabricated after the conductive layer L is formed. For example, the 3D fabrication apparatus 11 may form the conductive layer L after fabricating the last layer of the structure. In this 3D fabrication apparatus 11 as well, the conductivity of the conductor E can be more appropriately ensured by forming the conductive layer L.

[0055] In the embodiment described above, the conductive layer L is not related to the fabrication of the conductor E, but the invention is not limited to this, and as shown in Figure 10, the thickness x of the conductive layer L may be subtracted from the thickness X of the conductor E to fabricate the conductor E and form the conductive layer L. Figure 10 is an explanatory diagram showing an example of setting up a conductor E that takes the conductive layer L into account. In this 3D fabrication apparatus 11, taking into account the thickness x of the conductive layer L adds a complicated process to the job generation process, but it is possible to make the thickness of the conductor E more appropriate and to more properly ensure the conductivity of the conductor E.

[0056] In the embodiment described above, the molding job information 83 is set to form a conductive layer L that is sufficiently thinner than the conductor E, but it is not limited to this, and a conductive layer L having a thickness about the same as the conductor E may be formed. Figure 11 is a flowchart of an example of another molding job generation processing routine. Figure 12 is an explanatory diagram showing an example of the molding process of another molded object 62C, where Figure 12A is an explanatory diagram of each layer such as the base material S and conductor E of the molded object 62C, and Figure 12B is an explanatory diagram of an example of the molded object 62C. For the processes described above, the molding job generation processing routine is given the same step numbers and its detailed explanation is omitted. When this molding job generation processing routine is executed, the information control unit 81 performs the processes S100 to S150. After S150, the information control unit 81 determines whether or not there is an adjacent conductor E in the hole (S152), and if there is no adjacent conductor E, it sets a thin conductive layer L with a thickness of x (S154). On the other hand, when there is a conductor E adjacent to a hole, the information control unit 81 sets a conductive layer L having a thickness equal to the thickness X of the conductor E (S156). After S154 or after S156, the information control unit 81 executes the processing from S160 onwards. As shown in Figure 12, in holes filled with conductive filler F, the thickness of the conductor E is not a particular design issue, so it may be made thicker. In this 3D printing apparatus 11 as well, the conductivity of the conductor E can be more appropriately ensured by forming a conductive layer L.

[0057] In the embodiments described above, the disclosure was explained as a three-dimensional molding apparatus 11, an information processing device 80, and a molding system 10, but it is not limited to these, and it may be just the three-dimensional molding apparatus 11 or just the information processing device 80. Also, in the embodiments described above, it was described as a molding system 10, a three-dimensional molding apparatus 11, and an information processing device 80, but it may also be a method for manufacturing a molded object, a control method for the three-dimensional molding apparatus 11, a printing method, an information processing method, and a program therefor.

[0058] The present disclosure may be configured as follows. For example, the information processing device of the present disclosure is an information processing device used for processing information in a three-dimensional molding apparatus that molds an object, comprising a first discharge head for discharging a structural fluid that constitutes the structure of the molded object into a molding area, and a second discharge head for discharging a conductive fluid that constitutes a conductor into the molding area, wherein, when molding an object that includes a conductive exposed portion on the conductor where no structure is molded and the structure molded adjacent to the conductive exposed portion, the second discharge head discharges the conductive fluid into the molding area to mold the conductor, the first discharge head discharges the structural fluid to mold the structure, and then the second discharge head discharges at least one layer of the conductive fluid onto the conductive exposed portion to form a conductive layer.

[0059] In this information processing device, when a structure is fabricated after the conductive material is fabricated, it generates fabrication job information that forms, for example, a thin conductive layer on the conductive material. Therefore, the 3D fabrication device that performs this can further reduce the influence of the structural fluid components. In this way, this information processing device can more appropriately ensure the conductivity of the conductive material by forming a conductive layer. Furthermore, in this information processing device, various embodiments of the 3D fabrication device described above may be adopted, or processing that realizes each of the functions of the 3D fabrication device described above may be added.

[0060] A manufacturing method for a three-dimensional molding apparatus, comprising a first discharge head for discharging a structural fluid constituting the structure of the molded object into a molding area, and a second discharge head for discharging a conductive fluid constituting a conductor into the molding area, wherein the molded object includes a conductive exposed portion on the conductor where no structure is molded and the structure molded adjacent to the conductive exposed portion, and the manufacturing method for a molded object is executed by a computer of a three-dimensional molding apparatus, comprising: (a) a molding step of discharging the conductive fluid into the molding area by the second discharge head to mold the conductor; (b) a molding step after the molding step (a) of discharging the structural fluid by the first discharge head to mold the structure; and (c) a molding step after the molding step (b) of discharging at least one layer of the conductive fluid from the second discharge head onto the conductive exposed portion on the conductor where no structure is molded to form a conductive layer.

[0061] In this manufacturing method, similar to the three-dimensional molding apparatus described above, the conductivity of the conductor can be more appropriately ensured by forming a conductive layer. In this manufacturing method, various embodiments of the three-dimensional molding apparatus described above may be adopted, or steps that realize each of the functions of the three-dimensional molding apparatus described above may be added.

[0062] The information processing method of the present disclosure is an information processing method for a computer that processes information used in a three-dimensional molding apparatus that molds an object, the apparatus comprising a first discharge head for discharging a structural fluid constituting the structure of the molded object into a molding area, and a second discharge head for discharging a conductive fluid constituting a conductor into the molding area, wherein when molding an object that includes a conductive exposed portion on the conductor where no structure is molded and the structure molded adjacent to the conductive exposed portion, the method includes a generation step of generating molding job information which involves discharging the conductive fluid into the molding area with the second discharge head to mold the conductor, then discharging the structural fluid with the first discharge head to mold the structure, and then discharging at least one layer of the conductive fluid onto the conductive exposed portion with the second discharge head to form a conductive layer.

[0063] In this information processing method, when a structure is fabricated after the conductive material is fabricated, fabrication job information is generated that forms, for example, a thin conductive layer on the conductive material. Therefore, the 3D fabrication apparatus that performs this process can further reduce the influence of the structural fluid components. In this way, this information processing method can more appropriately ensure the conductivity of the conductive material by forming a conductive layer. In addition, various embodiments of the 3D fabrication apparatus described above may be adopted in this information processing method, or steps that realize each of the functions of the 3D fabrication apparatus described above may be added.

[0064] This specification describes the technical concept in which, in the original claim 4, "the three-dimensional molding apparatus described in claim 1 or 2" was changed to "the three-dimensional molding apparatus described in any one of claims 1 to 3", in the original claim 5, "the three-dimensional molding apparatus described in claim 1 or 2" was changed to "the three-dimensional molding apparatus described in any one of claims 1 to 4", in the original claim 6, "the three-dimensional molding apparatus described in claim 1 or 2" was changed to "the three-dimensional molding apparatus described in any one of claims 1 to 5", in the original claim 7, "the three-dimensional molding apparatus described in claim 1 or 2" was changed to "the three-dimensional molding apparatus described in any one of claims 1 to 6", and in the original claim 8, "the three-dimensional molding apparatus described in claim 1 or 2" was changed to "the three-dimensional molding apparatus described in any one of claims 1 to 7". In addition, the following technical ideas are disclosed: in the original claim 13, "the manufacturing method described in claim 10 or 11" is changed to "the manufacturing method described in any one of claims 10 to 12"; in the original claim 14, "the manufacturing method described in claim 10 or 11" is changed to "the manufacturing method described in any one of claims 10 to 13"; in the original claim 15, "the manufacturing method described in claim 10 or 11" is changed to "the manufacturing method described in any one of claims 10 to 14"; in the original claim 16, "the manufacturing method described in claim 10 or 11" is changed to "the manufacturing method described in any one of claims 10 to 15"; and in the original claim 17, "the manufacturing method described in claim 10 or 11" is changed to "the manufacturing method described in any one of claims 10 to 16".

[0065] This disclosure is applicable to the technical field of apparatus for manufacturing objects by discharging fluids.

[0066] 10 Molding system, 11 3D molding device, 12 Mounting device, 13 Transport processing unit, 14 Parts supply unit, 15 Feeder, 16 Imaging unit, 17 Mounting unit, 18 Head movement unit, 19 Mounting head, 20 Control device, 21 Molding control unit, 22 Storage unit, 23 Molding job information, 26 Movement unit, 27 Support unit, 28 Support movement unit, 29 Flattening unit, 30 First discharge unit, 32 First discharge head, 32a Nozzle, 32b Nozzle row, 33 First maintenance unit, 34 First curing unit, 35 Second discharge unit, 37 Second discharge head, 37a Nozzle, 37b Nozzle row, 38 Second maintenance unit, 39 Second curing unit, 40 Coating unit, 41 Coating movement unit, 42 Coating head, 43, 43A-43C Dispenser, 45 Pressing unit, 46 Pressing member, 47 Pressing transport unit, 48 Operation panel, 49 Communication unit, 50 Work unit, 51 First gantry, 52 Second gantry, 53 Third gantry, 54 Housing, 55 Imaging unit, 56 Height detection unit, 57 Mounting transport unit, 58 Inspection unit, 59 Inspection area, 60 Pallet, 61 Molding area, 62, 62A-C Molded object, 63 Through hole, 64 Spring probe pin, 65 Bolt, 66 Hole electrode, 67 Upper electrode, 68 Conductor exposed part, 80 Information processing device, 81 Information control unit, 82 Storage unit, 83 Molding job information, 86 Display device, 87 Input device, 88 Communication unit, B Bump, C Cavity, E Conductor, F Filler, P Part, S Substrate, T Reference thickness, Tm Allowable thickness, U Underfill, V Volatile matter.

Claims

1. A three-dimensional molding apparatus for molding an object, comprising: a first discharge head for discharging a structural fluid constituting the structure of the molded object into a molding area; a second discharge head for discharging a conductive fluid constituting a conductor into the molding area; and, in the case of molding an object including a conductive exposed portion on the conductor where the structure is not molded and the structure molded adjacent to the conductive exposed portion, a control unit which, after discharging the conductive fluid into the molding area with the second discharge head to mold the conductor, then discharging the structural fluid with the first discharge head to mold the structure, and thereafter discharging at least one layer of the conductive fluid onto the conductive exposed portion with the second discharge head to form a conductive layer.

2. A three-dimensional molding apparatus according to claim 1, comprising a coating head for coating a conductive liquid substance onto the molding region, wherein the control unit causes the coating head to coat the liquid substance onto the conductive exposed portion including the conductive layer.

3. The three-dimensional molding apparatus according to claim 1 or 2, wherein the control unit, after forming the conductive layer, discharges the structural fluid onto the molded structure using the first discharge head to further mold the structure.

4. The three-dimensional molding apparatus according to claim 1 or 2, wherein the control unit causes the structure to fabricate the molded object having a hole formed in the conductive exposed portion.

5. The three-dimensional molding apparatus according to claim 1 or 2, wherein the control unit causes the molded object on which the component is mounted to be molded, and the molded object having the conductive exposed portion at the position where the component is to be mounted.

6. The three-dimensional molding apparatus according to claim 1 or 2, wherein the control unit causes the conductive layer, which is not related to the formation of the conductor, to be present in the completed molded object.

7. The three-dimensional molding apparatus according to claim 1 or 2, wherein the control unit causes the conductive layer to be formed on the exposed portion of the conductive material after the conductive material has been fabricated, before fabricating the structure which exceeds a predetermined allowable thickness determined based on the decrease in conductivity of the conductive material due to volatile components of the structural fluid.

8. A three-dimensional molding apparatus according to claim 1 or 2, comprising: a first curing unit for curing the structural fluid that will become a structure discharged into the molding region; and a second curing unit for curing the conductive fluid that will become a conductor discharged into the molding region, wherein, when the control unit manufactures a molded object including a conductor exposed portion and a structure manufactured adjacent to the conductor exposed portion, the control unit causes the conductive fluid to be discharged into the molding region by the second discharge head, the conductive fluid to be cured by the second curing unit to manufacture the conductor, the structural fluid to be discharged by the first discharge head, the structural fluid to be cured by the first curing unit to manufacture the structure, and thereafter causes at least one layer of the conductive fluid to be discharged from the second discharge head to the conductor exposed portion, and the conductive fluid to be cured by the second curing unit to form the conductive layer on the conductor.

9. An information processing device used in a three-dimensional molding apparatus that molds an object, comprising a first discharge head for discharging a structural fluid that constitutes the structure of the molded object into a molding area, and a second discharge head for discharging a conductive fluid that constitutes a conductor into the molding area, wherein when molding an object that includes a conductive exposed portion on the conductor where no structure is molded and the structure molded adjacent to the conductive exposed portion, the information processing device comprises a generation unit that generates molding job information for molding in which, after discharging the conductive fluid into the molding area with the second discharge head to mold the conductor, the structural fluid is discharged with the first discharge head to mold the structure, and then at least one layer of the conductive fluid is discharged with the second discharge head onto the conductive exposed portion to form a conductive layer.

10. A manufacturing method for a three-dimensional molding apparatus, which comprises a first discharge head for discharging a structural fluid constituting the structure of the molded object into a molding area, and a second discharge head for discharging a conductive fluid constituting a conductor into the molding area, wherein the molded object includes a conductive exposed portion on the conductor where no structure is molded and the structure molded adjacent to the conductive exposed portion, the manufacturing method comprising: (a) a molding step of discharging the conductive fluid into the molding area using the second discharge head to mold the conductor; (b) a molding step after the molding step (a) of discharging the structural fluid using the first discharge head to mold the structure; and (c) a molding step after the molding step (b) of discharging at least one layer of the conductive fluid from the second discharge head onto the conductive exposed portion on the conductor where no structure is molded to form a conductive layer.

11. A manufacturing method according to claim 10, wherein the three-dimensional molding apparatus comprises a coating head for coating a conductive liquid, and further comprises a molding step of coating the conductive exposed portion including the conductive layer with the coating head.

12. A manufacturing method according to claim 10 or 11, comprising: (e) a molding step of forming the conductive layer, and then discharging the structural fluid onto the molded structure using the first discharge head to further mold the structure.

13. The manufacturing method according to claim 10 or 11, wherein in the molding step (b), the molded object having a hole in the structure is molded by not molding the structure on the conductive exposed portion.

14. The manufacturing method according to claim 10 or 11, wherein in the molding step (b), when molding the molded object on which the component is mounted, the molded object having the conductive exposed portion at the position where the component is to be mounted.

15. The manufacturing method according to claim 10 or 11, wherein in the molding step (c), the conductive layer that is not related to the formation of the conductor on the completed molded object is formed.

16. The manufacturing method according to claim 10 or 11, wherein in the molding step (c), after molding the conductor, the conductive layer is formed on the exposed portion of the conductor before molding the structure which exceeds a predetermined allowable thickness determined based on the decrease in the conductivity of the conductor due to the volatile components of the structural fluid. The manufacturing method according to claim 10 or 11, wherein the predetermined thickness is determined based on the decrease in the conductivity of the conductor due to the volatile components of the structural fluid.

17. The manufacturing method according to claim 10 or 11, wherein the three-dimensional molding apparatus comprises a first curing unit for curing the structural fluid discharged into the molding region and a second curing unit for curing the conductive fluid discharged into the molding region, wherein in molding step (a), the conductive fluid is discharged into the molding region by the second discharge head and the conductive fluid is cured by the second curing unit to form the conductor; in molding step (b), the structural fluid is discharged by the first discharge head and the structural fluid is cured by the first curing unit to form the structure; and in molding step (c), at least one layer of the conductive fluid is discharged from the second discharge head onto the exposed portion of the conductor and the conductive fluid is cured by the second curing unit to form the conductive layer on the conductor.

18. An information processing method for a computer that processes information used in a three-dimensional molding apparatus that molds an object, comprising a first discharge head for discharging a structural fluid constituting the structure of the molded object into a molding area, and a second discharge head for discharging a conductive fluid constituting a conductor into the molding area, the method comprising: a generation step of generating molding job information in which, when molding an object including a conductive exposed portion on the conductor where no structure is molded and the structure molded adjacent to the conductive exposed portion, the conductive fluid is discharged into the molding area by the second discharge head to mold the conductor, the structural fluid is discharged by the first discharge head to mold the structure, and then at least one layer of the conductive fluid is discharged by the second discharge head onto the conductive exposed portion to form a conductive layer.

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