Device for supplying conductive adhesive

Abstract

[Problem] To provide a device for supplying a conductive adhesive that exhibits adhesive force as a result of a plurality of chemical substances being mixed, the device efficiently using up each of the chemical substances that were present before the mixing in the device. [Solution] One device 100 for supplying a conductive adhesive according to the present invention comprises an integrated first syringe 12a and second syringe 12b. The first syringe 12a accommodates, between a first viscoelastic body 20a and first discharge part 14a of the first syringe 12a, a main agent (A)72 that contains a dispersed first conductive filler (C1)72a and is mainly composed of an epoxy resin. The second syringe 12b accommodates, between a second viscoelastic body 20b and a second discharge part 14b of the second syringe 12b, a curing agent (B)74 containing a dispersed second conductive filler (C2)74a. The first viscoelastic body 20a is non-reactive or hardly reactive with respect to the main agent (A)72 and the first conductive filler (C1)72a, and is non-invasive or hardly infiltrated. The second viscoelastic body 20b is non-reactive or hardly reactive with respect to the curing agent (B)74 and the second conductive filler (C2)74a, and is non-invasive or hardly infiltrated.

Description

Apparatus for supplying conductive adhesive

[0001] The present invention relates to an apparatus for supplying conductive adhesive that can be used, for example, for electrical connection or adhesion in electronic components, circuits and the like.

[0002] Conventionally, conductive adhesives obtained by mixing metal powder having high conductivity into resin adhesives have been adopted for obtaining electrical connections. For example, epoxy resins used as adhesives may provide high adhesiveness and durability when used together with a curing agent. Epoxy resin-based adhesives include a one-component type in which a base resin and a curing agent are mixed in advance, and a two-component type in which the base resin and the curing agent are stored in separate containers respectively and mixed when actually used.

[0003] The above-mentioned one-component adhesive has the advantages that the base resin and the curing agent are uniformly blended in a predetermined amount in advance, so that stable curing performance can be obtained, and there is no need to mix the components during use. However, when the one-component type is adopted, since the base resin and the curing agent are in a mixed state from the beginning, there is a technical problem that the curing reaction spontaneously progresses unless the adhesive is stored at a low temperature. Therefore, if the adhesive can be stored at normal temperature, the curing speed will be slowed down, so there are restrictions such as that the adhesive must be heated to a relatively high temperature before use.

[0004] On the other hand, when a two-component adhesive is used, the above-mentioned problems caused by the one-component adhesive are solved. However, since the base resin and the curing agent are mixed and cured, it is necessary to uniformly mix these two types of materials at an appropriate mixing ratio before use. As a result, the two-component adhesive has the disadvantages that it takes time and labor to prepare the mixture, and curing starts once the components are mixed, so unused mixture is wasted. In order to solve the above-mentioned problems, a plurality of adhesive supply apparatuses that develop adhesive force by mixing a plurality of types of chemical substances have been disclosed (Patent Documents 1 to 3).

[0005] Japanese Patent Application Laid-Open No. 2007-303086, Japanese Patent Application Laid-Open No. 2005-146753, Japanese Patent Application Laid-Open No. 2008-105739

[0006] However, as described above, the development and realization of a conductive adhesive supply device that can produce adhesive strength by mixing multiple types of chemical substances and also possess excellent conductivity suitable for use in electronic components and circuits, etc., and that incorporates ingenuity to solve at least one of the following technical problems (TC1) to (TC5), is still only halfway complete. (TC1) A method to ensure that each chemical substance in the container (e.g., syringe) containing the multiple chemical substances is used completely without waste before mixing them. (TC2) A method to mix multiple chemical substances in a way that minimizes uneven conductivity when attempting to impart conductivity to an adhesive. (TC3) In a mixture containing a resin component that can constitute the main agent or curing agent, and a metal powder (conductive material) with a specific gravity difference relative to the resin component, unlike a simple adhesive, a method to ensure that the mixture is supplied substantially uniformly and easily, especially when the mixture has a relatively high viscosity, in order to form and maintain a stable dispersion state of the conductive material. (TC4) A method to obtain a suitable cured product by blending the main agent and curing agent in the correct ratio in order to obtain a predetermined high conductivity, and further by mixing them substantially uniformly and easily at the time of use. (TC5) A method to stably store the contents remaining in the container without mixing and to allow them to be used again after a time interval.

[0007] In particular, in conductive adhesives containing a mixture of a resin-based adhesive consisting of an epoxy resin that can serve as the main component, or a curing agent for said epoxy resin, and a material with high conductivity (for example, metal powder such as silver or gold), there is a strong demand in the field for the realization of a conductive adhesive supply device that can solve the aforementioned technical problems.

[0008] The present invention can greatly contribute to the realization of a conductive adhesive supply device having at least some of the following features (I) and (II) by solving the above-mentioned technical problems. (I) In an adhesive supply device that generates adhesive strength by mixing multiple types of chemical substances, each chemical substance can be used completely without waste before mixing. (II) Contents with relatively high viscosity can be mixed and supplied almost uniformly and easily at a predetermined mixing ratio to stably achieve high conductivity, and the contents remaining in the container can be used stably many times with time intervals between uses.

[0009] The inventors conducted extensive research and analysis to create materials, components, and structures that can solve at least one of the above-mentioned technical problems. Specifically, the inventors believed that when multiple types of chemical substances are mixed, structural or component improvements are necessary to ensure that the ideal amount of each chemical substance is mixed at the time the predetermined mixing ratio is actually achieved.

[0010] However, overcoming the aforementioned structural or component challenges proved extremely difficult. The reasons for this are as follows: First, the adhesive that the inventors were researching and developing is conductive, and the chemical substance or material directly responsible for its conductivity is solid, and the contents consist of a main agent and / or curing agent mixed with a resin component that has a large difference in specific gravity, creating a difficult situation. Therefore, in order to mix and supply the relatively high-viscosity contents almost uniformly and easily, to cure almost uniformly and stably, and to consistently exhibit high conductivity, it is necessary to make special efforts in the appropriate structure and components of the supply device, as well as in the material properties of those components.

[0011] The inventors diligently conducted studies and analyses to overcome the above-mentioned problems. As a result, the inventors focused on a special viscoelastic material that may have the following features (p) and (q): (p) It is non-reactive or poorly reactive with the main component or the curing agent, and is non-penetrating or difficult to penetrate. (q) It not only easily deforms to follow changes in the container shape between the dispensing section that dispenses the main component and the curing agent towards the mixing section and the storage section that contains the main component or the curing agent, but also has sufficient rigidity to withstand the resistance when dispensing relatively high-viscosity contents.

[0012] Furthermore, the inventors have arranged the above-mentioned viscoelastic portion in each of the integrated containers that separately contain the main component and the curing agent, and have positioned the main component or the curing agent between the viscoelastic portion and each discharge portion for dispensing toward the mixing portion.

[0013] As a result, the inventors have found that, for example, even if the amount of chemical substance contained in each of the containers (syringes) that serve as the source of multiple types of chemical substances decreases and the pressure for dispensing the contents changes, the viscoelastic body deforms smoothly, enabling substantially uniform dispensing, thereby obtaining at least some of the following effects (a) to (c): (a) A predetermined amount can be stably and accurately dispensed from the dispensing section for dispensing from the container to the mixing section. (b) When pressure (or pressing force) is simultaneously applied to the chemical substance in the container by pressurized gas or a plunger (also called a "pressing member"), the viscoelastic body described above can accurately and simultaneously dispense a predetermined amount of the chemical substance into the dispensing section to the mixing section. (c) Each of the containers (syringes) that serve as the source can dispense each chemical substance to the dispensing section to the mixing section without waste before mixing.

[0014] Furthermore, the inventors' research yielded some very interesting findings. Specifically, it was found that when the solid responsible for conductivity is a conductive filler, and the conductive filler is not unevenly distributed among the main component and / or curing agent as chemical substances within each containment part (syringe), in other words, it maintains a dispersed state, the viscoelastic material can play a role in delivering it to the dispensing part for dispensing into the mixing part while substantially maintaining that dispersed state. Moreover, it was found that the viscoelastic material is a material that can also contribute to the efficient use of the chemical substances within the containment part (syringe). The present invention was created from the above-mentioned perspectives.

[0015] A conductive adhesive supply device according to the present invention comprises an integrated first syringe and a second syringe. The first syringe contains a main component (A) mainly composed of epoxy resin, which contains a dispersed first conductive filler (C1) between the first dispensing portion of the first syringe and a first viscoelastic body. The second syringe contains a curing agent (B) which contains a dispersed second conductive filler (C2) between the second dispensing portion of the second syringe and a second viscoelastic body. In addition, the first viscoelastic body is non-reactive or poorly reactive to the main component (A) and the first conductive filler (C1), and is non-penetrating or poorly permeable. The second viscoelastic body is non-reactive or poorly reactive to the curing agent (B) and the second conductive filler (C2), and is non-penetrating or poorly permeable.

[0016] This conductive adhesive supply device integrates a first syringe and a second syringe, and has a structure that facilitates simultaneous pressing of the first plunger for the first syringe and the second plunger for the second syringe by pressurized gas or pressure. In the first syringe, a main component (A) containing dispersed first conductive filler (C1) is contained between the first dispensing section and the first viscoelastic body. In the second syringe, a curing agent (B) containing dispersed second conductive filler (C2) is contained between the second dispensing section and the second viscoelastic body.

[0017] Here, both the first viscoelastic body and the second viscoelastic body are viscoelastic bodies that are non-reactive or poorly reactive to the main agent (A) and the first conductive filler (C1), or to the curing agent (B) and the second conductive filler (C2), and are non-penetrating or difficult to penetrate. Therefore, combined with their viscoelastic properties of being easily deformable and having appropriate rigidity, they can accurately and reliably transmit the pressure (or pressing force) applied simultaneously to the first plunger and the second plunger without being affected by each of the chemical substances, thereby playing the role of sending (in other words, supplying) each of the chemical substances from the containment section (syringe) of each container to the dispensing section for dispensing.

[0018] Furthermore, it should be noted that, according to the conductive adhesive supply device described above, by using the first viscoelastic body and the second viscoelastic body of the present invention, the main agent (A) and the first conductive filler (C1) in the first syringe before mixing, and the curing agent (B) and the second conductive filler (C2) in the second syringe before mixing, can be efficiently delivered to the dispensing unit for dispensing toward the mixing unit.

[0019] In the above-described invention of a conductive adhesive supply device, a preferred embodiment is that the main component (A), the curing agent (B), the first conductive filler (C1), and the second conductive filler (C2) are simultaneously supplied to a single mixing section by pressing the first plunger for the first syringe and the second plunger for the second syringe simultaneously with pressurized gas or pressure, and are then supplied from the discharge port after being mixed substantially uniformly in the mixing section. By adopting this configuration, the main component (A), the curing agent (B), the first conductive filler (C1), and the second conductive filler (C2) are simultaneously supplied from separate containers to a single mixing section by pressing the first plunger for the first syringe and the second plunger for the second syringe simultaneously with pressurized gas or pressure, where they merge and are further mixed substantially uniformly in the mixing section before being supplied from the discharge port at the tip of the mixing section. As a result, the main component (A) and the hardener (B) are supplied to the mixing section in a highly accurate manner to achieve the predetermined mixing ratio, and after being mixed substantially uniformly in the mixing section, a predetermined amount of uncured adhesive is supplied from the tip of the mixing section. Consequently, it is possible to supply uncured adhesive that has been mixed in a manner that makes it difficult to cause uneven curing and uneven conductivity of the cured product that could result from such uneven curing.

[0020] According to one conductive adhesive supply device of the present invention, at least some of the effects of (a), (b), and (c) described above can be achieved.

[0021] This is a partial cross-sectional view showing the configuration of the supply device 100 of the first embodiment, in which the main component (A) 72 containing dispersed first conductive filler (C1) 72a and the curing agent (B) 74 containing dispersed second conductive filler (C2) 74a are contained. This is an exploded assembly diagram including a partial cross-sectional view showing the configuration of the supply device 100 of the first embodiment in which the main component (A), curing agent (B), first conductive filler (C1), and second conductive filler (C2) are not contained. This is a perspective view of Figure 2. This is an enlarged perspective view of the first viscoelastic body 20a (20b) in the supply device 100 of the first embodiment. This is a diagram showing part of the manufacturing process of the supply device 100 of the first embodiment. This is a diagram showing part of the manufacturing process of the supply device 100 of the first embodiment. This is a diagram showing part of the manufacturing process of the supply device 100 of the first embodiment. This is an exploded assembly diagram showing the configuration of the supply device 200 of the second embodiment. This is an exploded assembly diagram including a partial cross-sectional view showing the configuration of the supply device 200 of the second embodiment. This is a partial cross-sectional view showing the configuration of the supply device 200 of the second embodiment in a state in which the main agent (A), curing agent (B), first conductive filler (C1), and second conductive filler (C2) are contained. This is a partial cross-sectional view showing the configuration of the supply device 200 of the second embodiment in a state after the main agent (A), curing agent (B), first conductive filler (C1), and second conductive filler (C2) have all been pushed out from the containment section. This is a partial cross-sectional view showing the configuration of the supply device 300 of the third embodiment in a state in which the main agent (A), curing agent (B), first conductive filler (C1), and second conductive filler (C2) are contained.

[0022] Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In this description, common reference numerals are used throughout the drawings unless otherwise specified. Furthermore, the elements of this embodiment are not necessarily shown to scale in the drawings. Also, some reference numerals and shapes may be omitted in order to improve clarity in each drawing.

[0023] <First Embodiment> [Configuration of this embodiment and conductive adhesive supply device]

[0024] In this embodiment, an example of how the conductive adhesive supply device 100 is stored or sold will be described. Furthermore, in the second and third embodiments described later, an example of how each conductive adhesive supply device 200, 300 is used will be described.

[0025] Figure 1 is a partial cross-sectional view showing the configuration of the conductive adhesive supply device 100 of this embodiment, with the main component (A) 72 containing dispersed first conductive filler (C1) 72a and the curing agent (B) 74 containing dispersed second conductive filler (C2) 74a contained within it. Figure 2 is an exploded assembly view including a partial cross-sectional view showing the configuration of the supply device 100 of this embodiment, with the main component (A), curing agent (B), first conductive filler (C1) 72a, and second conductive filler (C2) 74a not contained within it. Figure 3 is a perspective view of Figure 2. Figure 4 is an enlarged perspective view of the first viscoelastic body 20a in the supply device 100 of this embodiment. Figures 5 to 7 show a part of the manufacturing process of the supply device 100 of this embodiment.

[0026] As shown in Figures 1 to 4, the conductive adhesive supply device 100 in this embodiment is composed of the following five main components. Specifically, the supply device 100 comprises a housing section 10, a pressing member 40, a stopper 60, and viscoelastic bodies 20a, 20b and plungers 30a, 30b that are positioned inside the housing section 10 at least when the supply device 100 is in use.

[0027] The containment section 10 of this embodiment consists of two containers capable of containing a chemical substance, and each of the two containers is independent of the others but comprises a first syringe 12a and a second syringe 12b that are integrated as a whole. The manufacturing method of the containment section 10 in which the two containers are integrated is not particularly limited, but typically it is a molding method using a mold molding machine or a molding method using a 3D printer.

[0028] Furthermore, in the housing section 10, a first opening 18a is formed at one end of the first syringe 12a, and a second opening 18b is formed at one end of the second syringe 12b. Therefore, when using the conductive adhesive supply device 100 of this embodiment, when one end of the pressing member 40, which integrates the first piston 42a and the second piston 42b by a connecting portion 46, is inserted into the first piston 42a and the second piston 42b respectively, pressing the pressing member 40 allows it to move from the right side to the left side of the paper in Figure 1 (i.e., towards the respective discharge portions 14a and 14b in the housing section 10, where the inner diameter is narrowed).

[0029] Furthermore, the first syringe 12a of this embodiment contains a main component (A) 72, which is mainly an epoxy resin and contains dispersed first conductive filler (C1) 72a. Furthermore, the second syringe 12b of this embodiment contains a curing agent (B) 74, which contains second conductive filler (C2) 74a.

[0030] Looking at the supply device 100 in detail, as shown in Figures 1 to 3, in the first syringe 12a, a main component (A) 72, mainly composed of epoxy resin and containing dispersed first conductive filler (C1) 72a, is contained between the first dispensing section 14a and the first viscoelastic body 20a. In the second syringe 12b, a curing agent (B) 74 containing dispersed second conductive filler (C2) 74a is contained between the second dispensing section 14b and the second viscoelastic body 20b.

[0031] In addition, in this embodiment, the outer shapes of the first plunger 30a and the first viscoelastic body 20a that abuts the first plunger 30a are molded to conform to the shape of the inner wall surface of the first syringe 12a. Similarly, the outer shapes of the second plunger 30b and the second viscoelastic body 20b that abuts the second plunger 30b are molded to conform to the shape of the inner wall surface of the second syringe 12b. As a result, the main component (A) 72 containing dispersed first conductive filler (C1) 72a housed between the first discharge section 14a and the first viscoelastic body 20a, and the curing agent (B) 74 containing dispersed second conductive filler (C2) 74a housed between the second discharge section 14b and the second viscoelastic body 20b are highly unlikely to leak from the openings 18a, 18b even if the pressing member 40 moves within the housing section 10.

[0032] More specifically, the first plunger 30a and the second plunger 30b of this embodiment are molded by a mold molding machine using a resin material (for example, polyethylene) having appropriate rigidity as the raw material. The first plunger 30a has a non-through hole (not shown) on the side opposite to the contact surface 32a with the first viscoelastic body 20a, and the connecting portion (protrusion) 44a of the first piston 42a of the pressing member 40 is fitted into this non-through hole, thereby enabling the pressing force when the pressing member 40 is pressed to be transmitted to the first viscoelastic body 20a with high accuracy. Similarly to the first plunger 30a, the second plunger 30b can also transmit the pressing force when the pressing member 40 is pressed to the second viscoelastic body 20b with high accuracy by fitting the connecting portion (protrusion) 44b of the second piston 42b into a non-through hole (not shown) of the second plunger 30b. In this embodiment, it is noteworthy that when a pressing force is applied to the pressing member 40, the pressing force is transmitted substantially simultaneously to the first viscoelastic body 20a and the second viscoelastic body 20b via the first plunger 30a and the second plunger 30b.

[0033] Furthermore, as described above, the first plunger 30a and the second plunger 30b of this embodiment can also play a so-called sealing role, which reliably prevents the main component (A) 72 containing the first conductive filler (C1) 72a and the hardening agent (B) 74 containing the second conductive filler (C2) 74a from leaking out of the housing 10, even as they move within the housing 10 due to the pressing force applied to the pressing member 40.

[0034] In this embodiment, the housing portion 10 and the pressing member 40 are molded using a mold molding machine from a resin material having appropriate rigidity (for example, polypropylene). The manufacturing method of the housing portion 10 and the pressing member 40 is not particularly limited, but typically it is a molding method using a mold molding machine or a molding method using a 3D printer. The manufacturing method of the first viscoelastic body 20a and the second viscoelastic body 20b in this embodiment is not particularly limited, but typically it is a molding method disclosed in the embodiments described later.

[0035] Furthermore, when the conductive adhesive supply device 100 of this embodiment is stored or sold, the two sealing protrusions 52a and 52b on the lid 50 are formed by a mold molding machine using a resin material (for example, polypropylene) with appropriate rigidity as the raw material, and play the role of sealing the first dispensing portion 14a of the first syringe 12a and the second dispensing portion 14b of the second syringe 12b in the storage section 10.

[0036] Furthermore, the stopper 60 in this embodiment is molded using a mold molding machine from a resin material having appropriate rigidity (for example, polypropylene). The stopper 60 can house the lid 50 that closes the first discharge part 14a and the second discharge part 14b, while being engaged with the engaging part 16 having a key-shaped locking mechanism as shown in Figure 2, which is provided at the end of the housing part 10, and can maintain a state in which it can rotate relative to the lid 50. In this embodiment, when the stopper 60 is rotated to a predetermined position, the stopper 60 is locked to the housing part 10, and the stopper 60 is configured not to be removed from the housing part 10. The stopper 60 is detachable from the housing part 10, and can be removed from the housing part 10 by rotating the stopper 60 in the opposite direction to the rotation direction described above.

[0037] In the conductive adhesive supply device 100 of this embodiment, by attaching a stopper 60 that can accommodate a lid 50 capable of sealing the storage section 10, it is possible to contribute to the long-term storage (for example, at least one year at a temperature range of frozen to about 25°C) of the main component (A) 72 containing dispersed first conductive filler (C1) 72a and the curing agent (B) 74 containing second conductive filler (C2) 74a.

[0038] The type of epoxy resin that is the main component of the main component (A) 72 described above is not limited as long as the effects of this embodiment can be achieved, but typical examples of epoxy resins are bisphenol A type, bisphenol F type, cresol novolac type, and hydroxyphenyl type. In addition, the main component (A) 72 may contain diluents, dispersants, and various pigments as materials other than the main component.

[0039] Furthermore, the type of curing agent (B) 74 described above is not limited as long as the effects of this embodiment can be achieved, but typical examples of curing agent (B) 74 include amine-based, imidazole-based, acid anhydride-based, phenol-based, dicyandiamide-based curing agents, or curing agents containing an amine-based curing agent (I) and a cationic polymer dispersant (J).

[0040] Further, the type of the first conductive filler (C1) 72a described above is not limited as long as the effect of the present embodiment can be achieved. Typical examples of the first conductive filler (C1) 72a include the following various materials (conductive materials) (M1, M2): (M1) one or more metals selected from the group consisting of silver (Ag), tin (Sn), nickel (Ni), gold (Au), platinum (Pt), palladium (Pd), and copper (Cu), or alloys thereof; (M2) metals, ceramics such as glass, carbon, or resins coated with the metals or alloys recited in (M1) by plating or the like

[0041] Further, the type of the second conductive filler (C2) 74a described above is not limited as long as the effect of the present embodiment can be achieved. Typical examples of the second conductive filler (C2) 74a include the following various materials (M1, M2): (M1) one or more metals selected from the group consisting of silver (Ag), tin (Sn), nickel (Ni), gold (Au), platinum (Pt), palladium (Pd), and copper (Cu), or alloys thereof; (M2) metals, ceramics such as glass, carbon, or resins coated with the metals or alloys recited in (M1) by plating or the like

[0042] In the present embodiment, the case where the types of the first conductive filler (C1) 72a and the second conductive filler (C2) 74a are the same is a preferable aspect from the following viewpoints: avoiding localization of the conductive fillers due to chemical affinity when they are subsequently mixed in the mixing section, and / or achieving uniformity after mixing, and furthermore, developing uniform conductivity after final curing.

[0043] Furthermore, in order for the main agent (A) 72 of the present embodiment to exhibit the effects of the present embodiment with higher accuracy, for example, containing the dispersed first conductive filler (C1) 72a together with a plurality of liquid epoxy resins (D) having different molecular structures, a fatty acid-modified epoxy resin (E) and a reactive diluent (H) is another preferred embodiment. More specifically, examples of the aforementioned liquid epoxy resins (D) having different molecular structures include a bisphenol A-type epoxy resin and a bisphenol F-type epoxy resin. Furthermore, an example of the aforementioned fatty acid-modified epoxy resin (E) is a long-chain unsaturated fatty acid glycidyl ester. Furthermore, an example of the aforementioned reactive diluent (H) is a glycol ether.

[0044] Furthermore, in order to exhibit the effects of the present embodiment with higher accuracy, when the total volume of the main agent (A) 72 and the curing agent (B) 74 is defined as 1, the total volume of the first conductive filler (C1) 72a and the second conductive filler (C2) 74a being 0.4 or more and 1.5 or less is another preferred embodiment of the present embodiment.

[0045] Furthermore, in order to exhibit the effects of the present embodiment with higher accuracy, that both the first conductive filler (C1) 72a and the second conductive filler (C2) 74a are composed of flaky silver powder and spherical silver powder is another preferred embodiment of the present embodiment.

[0046] Furthermore, in order to exhibit the effects of the present embodiment with higher accuracy, that the average primary particle diameter of the primary particles of the first conductive filler (C1) 72a and the second conductive filler (C2) 74a is 0.1 µm or more and 20 µm or less, and the maximum particle diameter of the first conductive filler (C1) 72a and the second conductive filler (C2) 74a is 60 µm or less is another preferred embodiment of the present embodiment.

[0047] Furthermore, in order to exhibit the effects of the present embodiment with higher accuracy, that the aforementioned fatty acid-modified epoxy resin (E) is a long-chain unsaturated fatty acid glycidyl ester having a molecular weight of 400 or more and 1200 or less is another preferred embodiment of the present embodiment.

[0048] Furthermore, in order to achieve the effects of this embodiment with greater certainty, it is a preferred alternative aspect of this embodiment that the reactive diluent (H) described above is a glycol ether with a molecular weight of 150 to 350.

[0049] Furthermore, since the containment section 10 in this embodiment contains the aforementioned chemical substances, it is preferable that a chemically stable material be used as the material constituting the containment section 10. A typical example of a material constituting the containment section 10 is polypropylene.

[0050] Here, the first viscoelastic body 20a and the second viscoelastic body 20b of this embodiment play special roles within the housing 10. In this embodiment, the first viscoelastic body 20a is in contact with the main agent (A) 72 and the first conductive filler (C1) 72a within the first syringe 12a for a relatively long period of time, for example at room temperature (approximately 15°C to approximately 25°C). Similarly, the second viscoelastic body 20b is in contact with the curing agent (B) 74 and the second conductive filler (C2) 74a within the second syringe 12b for a relatively long period of time, for example at room temperature (approximately 15°C to approximately 25°C). Therefore, the first viscoelastic body 20a and the second viscoelastic body 20b have the following features. (p) It is non-reactive or poorly reactive to the main component (A) 72 containing dispersed first conductive filler (C1) 72a, or to the curing agent (B) 74 containing dispersed second conductive filler (C2) 74a, and is non-penetrating or difficult to penetrate. (q) The discharge sections 14a, 14b that discharge the main component (A) 72 containing dispersed first conductive filler (C1) 72a, or to the curing agent (B) 74 containing dispersed second conductive filler (C2) 74a, and the containment section 10, are not only easily deformable to follow changes in the container shape, but also have sufficient rigidity to withstand the resistance when extruding contents that are relatively high viscosity or have compressible viscoelastic properties.

[0051] An example of a content having relatively high viscosity and compressible viscoelastic properties is the main component (A) 72, which is mainly composed of an epoxy resin containing dispersed first conductive filler (C1) 72a.

[0052] Furthermore, if the first conductive filler (C1) 72a and / or the second conductive filler (C2) 74a are corrosive metals, it is preferable that they possess the characteristics of (p) described above to a high degree. In this embodiment, an example of the material for the first viscoelastic body 20a and the second viscoelastic body 20b is silicone (silicone resin) that can maintain a solid state. An example of such a material that can more reliably exhibit the characteristics of (p) and (q) described above is silicone (silicone resin) containing an inorganic filler. The type of inorganic filler is not limited, but a suitable inorganic filler that can realize the characteristics of (p) and (q) described above is one or more selected from the group of oxide fillers represented by silica, alumina, talc, calcium carbonate, aluminum hydroxide, magnesium hydroxide, and iron oxide.

[0053] Furthermore, a preferred embodiment is one in which the inorganic filler content of the first viscoelastic body 20a and the second viscoelastic body 20b is 10 wt% or more and 85 wt% or less (more preferably 20 wt% or more and 80 wt% or less, and even more preferably 30 wt% or more and 75 wt% or less), as this can be used to achieve properties that allow the pressing member 40 to reliably and stably contact substances with fluidity. If the filler content (e.g., inorganic filler) is less than 10 wt%, it may be too soft, potentially mixing with the chemical substances in the containment section 10, or failing to withstand the deformation resistance when pressed against relatively high-viscosity contents, potentially resulting in the pressure not being reliably transmitted. If the filler content (e.g., inorganic filler) exceeds 85 wt%, it may be too hard, making it difficult to deform to follow the shape of each discharge section 14a, 14b in the containment section 10, which has a smaller inner diameter, or it may become brittle, potentially mixing with the chemical substances in the containment.

[0054] Furthermore, as described above, the housing section 10 of this embodiment is equipped with a first discharge section 14a and a second discharge section 14b, which have a narrowed inner diameter, in other words, form a slender tip. Therefore, it is preferable that the first viscoelastic body 20a and the second viscoelastic body 20b have viscoelastic properties that allow them to flexibly deform to the shape of the inside of each discharge section 14a and 14b so that the main agent (A) 72, the first conductive filler (C1) 72a, the curing agent (B) 74, or the second conductive filler (C2) 74a are not left in the housing section 10 with high certainty. Moreover, they have rigidity that allows for reliable transmission of pressure to relatively high-viscosity conductive adhesives, enabling stable discharge, and furthermore, prevents mixing with fluid conductive adhesives during use or storage.

[0055] From the viewpoint of achieving the above-mentioned viscoelastic properties with high accuracy, an example of the storage modulus of the first viscoelastic body 20a and the second viscoelastic body 20b at 25°C in this embodiment is 5 × 10 under the condition that the shear strain is in the range of 0.01% to 20%. ４ Pa or more, 5×10 ６ Having a value of Pa or less is a preferred embodiment.

[0056] Furthermore, from the viewpoint of achieving the above-mentioned viscoelastic properties with high accuracy, the loss modulus of elasticity of the first viscoelastic body 20a and the second viscoelastic body 20b in this embodiment at 25°C is 5 × 10 under the condition that the shear strain is in the range of 0.01% to 20%. ４ Pa or more, 2×10 ６ Having a value of Pa or less is a preferred embodiment.

[0057] Furthermore, from the viewpoint of achieving the above-mentioned viscoelastic properties with high accuracy, it is a preferred embodiment that the storage modulus and loss modulus of the first viscoelastic body 20a and the second viscoelastic body 20b in this embodiment are designed to be perfectly identical or approximately equal at 25°C under the condition of a shear strain of 5% or more. In this embodiment, "approximately equal" means being within an error range of 20% from the perfectly identical value.

[0058] According to the conductive adhesive supply device 100 of this embodiment, which comprises a first viscoelastic body 20a and a second viscoelastic body 20b having the above-described features, even if, for example, the amount of chemical substance contained in the containment section 10 decreases and the pressure applied by the pressing member 40 to push out the contents changes, the viscoelastic bodies 20a and 20b of this embodiment deform smoothly, enabling substantially uniform dispensing from the dispensing sections 14a and 14b.

[0059] According to this embodiment, at least some of the following effects (aI) to (cI) can be achieved. (a) The main component (A) 72 containing dispersed first conductive filler (C1) 72a and the curing agent (B) 74 containing dispersed second conductive filler (C2) 74a (hereinafter, in this embodiment and the embodiments and examples described later, the four materials are collectively referred to as "four chemical substances") can be discharged with high accuracy and in a stable manner in a predetermined amount (i.e., highly accurate quantitative accuracy). (b) When pressure (or pressing force) is applied simultaneously to the four chemical substances in the containment section 10 by pressing with the pressing member 40, a predetermined amount of the four chemical substances can be supplied simultaneously and with high accuracy from each discharge section 14a and 14b (i.e., highly accurate simultaneity). (c) In the containment section 10, which is the source of the four chemical substances, the four chemical substances before mixing can be sent to each discharge section 14a and 14b without waste (i.e., highly accurate consumption).

[0060] The conductive adhesive supply device 100 of this embodiment, having the above-described configuration, allows the following chemical substance (X) contained in the first syringe 12a to be discharged from the first discharge port 14a on the other end of the first syringe 12a via the plungers 30a, 30b and the viscoelastic bodies 20a, 20b that contact the plungers 30a, 30b when the pressing member 40 is pressed, and the following chemical substance (Y) contained in the second syringe 12b to be discharged from the second discharge port 14b on the other end of the second syringe 12b. (X) Main component (A) 72 mainly composed of epoxy resin containing dispersed first conductive filler (C1) 72a (Y) Curing agent (B) 74 containing dispersed second conductive filler (C2) 74a

[0061] The material or shape used for the housing section 10 and the pressing member 40 in this embodiment is not particularly limited, as long as the function of storing and dispensing the contents (main agent (A) 72 containing the first conductive filler (C1) 72a, and the hardener (B) 74 containing the second conductive filler (C2) 74a) contained in the housing section 10 is maintained. For example, to simplify the operation of simultaneously pressing the contents of the two independent first syringes 12a and second syringes 12b provided in the conductive adhesive supply device 100 of this embodiment, the following two configurations (e1) and (e2) are provided, which is a preferred embodiment that allows the contents to be delivered to the respective dispensing sections 14a and 14b simultaneously with high accuracy. (e1) Housing section 10 in which the first syringe 12a and the second syringe 12b are integrated in parallel (e2) Pressing member 40 equipped with a first piston 42a and a second piston 42b integrated in parallel

[0062] [This Embodiment and Method for Manufacturing a Conductive Adhesive Supply Device] Figures 5 to 7 show a part of the manufacturing process of the supply device 100 of this embodiment.

[0063] As shown in Figures 5 and 6, in the manufacturing method of the supply device 100 of this embodiment, an integration step is performed in which the contact surface 32a of the first plunger 30a and the contact surface 22a of the first viscoelastic body 20a are brought into contact, and the contact surface 32b of the second plunger 30b and the contact surface 22b of the second viscoelastic body 20b are brought into contact.

[0064] Subsequently, with the first discharge section 14a and the second discharge section 14b of the housing section 10 sealed by a stopper 60 equipped with a lid 50, an injection process is performed in which a main component (A) 72, mainly composed of epoxy resin and containing dispersed first conductive filler (C1) 72a, is injected into the first syringe 12a manually or using a known automatic injection device through the first opening 18a, and a curing agent (B) 74, containing dispersed second conductive filler (C2) 74a, is injected into the second syringe 12b manually or using a known automatic injection device through the second opening 18b. At this time, in order to properly disperse the first conductive filler (C1) 72a in the main component (A) 72, it is preferable to perform processes such as adjusting the particle size and shape of the first conductive filler (C1) 72a, adjusting the specific gravity difference with the main component (A) 72, and adding a dispersant adapted to the material of the first conductive filler (C1) 72a to prevent aggregation. Furthermore, in order to properly disperse the second conductive filler (C2) 74a dispersed in the curing agent (B) 74, it is preferable to perform the same treatment as for the main agent (A) 72, including adjusting the particle size and shape of the second conductive filler (C2) 74a, adjusting the specific gravity difference with the main agent (A) 72, and adding a dispersant adapted to the material of the second conductive filler (C2) 74a to prevent aggregation. In the injection process of this embodiment, it is not necessarily required that the injection into the first syringe 12a and the injection into the second syringe 12b be performed simultaneously, but performing them simultaneously using an automatic injection device is a preferred embodiment from the viewpoint of improving the efficiency of the manufacturing process.

[0065] After the injection process is performed, the coupling portion 44a of the first piston 42a is fitted into the integrated first viscoelastic body 20a and first plunger 30a, and the coupling portion 44b of the second piston 42b is fitted into the integrated second viscoelastic body 20b and second plunger 30b. Subsequently, an insertion process is performed in which the integrated first viscoelastic body 20a and first plunger 30a, and the integrated second viscoelastic body 20b and second plunger 30b are inserted into the first syringe 12a and the second syringe 12b, respectively, with the first viscoelastic body 20a and second viscoelastic body 20b leading the way.

[0066] By going through the steps described above, the supply device 100 of this embodiment can be manufactured.

[0067] <Second Embodiment> The conductive adhesive supply device 200 of this embodiment is the same as the conductive adhesive supply device 100 of the first embodiment, except that the stopper 60 with a lid 50 is replaced with a mixing section 80 with a discharge port 82. Therefore, explanations that overlap with the first embodiment can be omitted.

[0068] Figure 8 is an exploded assembly view showing the configuration of the supply device 200 of this embodiment. Figure 9 is an exploded assembly view including a partial cross-sectional view showing the configuration of the supply device 200 of this embodiment. Figure 10 is a partial cross-sectional view showing the configuration of the supply device 200 of this embodiment in a state in which the main component (A) 72 containing dispersed first conductive filler (C1) 72a and the curing agent (B) 74 containing dispersed second conductive filler (C2) 74a (i.e., four types of chemical substances) are contained. In addition, Figure 11 is a partial cross-sectional view showing the configuration of the supply device 200 of this embodiment in a state after the main component (A) 72, curing agent (B) 74, first conductive filler (C1) 72a and second conductive filler (C2) 74a have all been extruded from the containment section 10.

[0069] As shown in Figures 8 to 11, the conductive adhesive supply device 200 in this embodiment is composed of the following five main components. Specifically, the supply device 200 comprises a mixing unit 80 having a housing unit 10, a pressing member 40, and a discharge port 82, and viscoelastic bodies 20a, 20b and plungers 30a, 30b that are arranged in the housing unit 10 at least when the supply device 200 is in use.

[0070] The mixing section 80 of this embodiment can be detachably engaged with the housing section 10 (more specifically, with the engaging section 16 having a key-type locking mechanism) in place of the stopper 60 with the lid 50 of the first embodiment.

[0071] Furthermore, the mixing unit 80 of this embodiment includes a first introduction unit 84a corresponding to the first discharge unit 14a of the first syringe 12a, a second introduction unit 84b corresponding to the second discharge unit 14b of the second syringe 12b, and a discharge port 82 for supplying four uncured chemical substances, in which a main agent (A) 72 containing dispersed first conductive filler (C1) 72a and a curing agent (B) 74 containing dispersed second conductive filler (C2) 74a (i.e., four chemical substances) are mixed substantially uniformly, toward the object to be coated.

[0072] Here, the mixing section 80 comprises a front section where the main agent (A) 72 containing the first conductive filler (C1) 72a and the curing agent (B) 74 containing the second conductive filler (C2) 74a merge, an intermediate section of the mixing section 80 equipped with a mechanism such as a static mixer that enables substantially uniform mixing, and a rear section of the mixing section 80 that gradually narrows its inner diameter and has a discharge port 82 at its tip. The mixing section 80 having this configuration can substantially uniformly mix the four chemical substances by utilizing the force of the four chemical substances being pushed out by pressure, particularly the force of the four chemical substances being pushed out by pressure, and by the action of passing through elements that promote the division, conversion, and reversal of the fluid.

[0073] In this embodiment, the mixing section 80, similar to the lid 50 for the stopper 60 in the first embodiment, utilizes the key-shaped locking action of the housing section 10, but instead of sealing, a different lid with a through-hole is attached. This ensures that leakage of the four types of chemical substances supplied from each discharge section 14a, 14b due to the pressing force of the pressing member 40 is reliably prevented, while still supplying the chemical substances to the mixing section 80.

[0074] Furthermore, the mixing section 80 in this embodiment is molded using a mold molding machine from a resin material having appropriate rigidity (for example, polypropylene). Similar to the stopper 60, the mixing section 80 can maintain a state in which it is rotatable relative to the housing section 10 when engaged with the engaging section 16 having a key-shaped locking mechanism as shown in Figure 2, which is provided at the end of the housing section 10. In this embodiment, when the mixing section 80 is rotated to a predetermined position, the mixing section 80 is locked to the housing section 10, and the mixing section 80 is configured not to be removed from the housing section 10. As described above, the mixing section 80 is detachable from the housing section 10, and can be removed from the housing section 10 by rotating the mixing section 80 in the opposite direction to the rotation direction described above.

[0075] Furthermore, in the conductive adhesive supply device 200 of this embodiment, by replacing the storage section 10 with a stopper 60 equipped with a sealable lid 50, it is possible to contribute to the long-term storage of the main component (A) 72 containing dispersed first conductive filler (C1) 72a and the curing agent (B) 74 containing second conductive filler (C2) 74a. Also, for example, after storing at room temperature for a certain period of time, the stopper 60 can be replaced again with the mixing section 80, and the main component (A) 72 containing dispersed first conductive filler (C1) 72a and the curing agent (B) 74 containing second conductive filler (C2) 74a remaining in the storage section 10 can be mixed again and used as a conductive adhesive.

[0076] Furthermore, as described above, the housing section 10 of this embodiment is equipped with a first discharge section 14a and a second discharge section 14b, which have a narrowed inner diameter, in other words, form a slender tip. Therefore, it is preferable that the first viscoelastic body 20a and the second viscoelastic body 20b have viscoelastic properties that allow them to flexibly deform to the shape of the inside of each discharge section 14a, 14b and the inside of the mixing section 80, so as to ensure that the main component (A) 72 containing dispersed first conductive filler (C1) 72a and the hardener (B) 74 containing dispersed second conductive filler (C2) 74a do not remain in the housing section 10 with high certainty. As shown in Figure 11, it is a preferred embodiment that the viscoelastic bodies (first viscoelastic body 20a and second viscoelastic body 20b) having the aforementioned viscoelastic properties are compressed by being pressed using a pressing member 40 equipped with a first piston 42a and a second piston 42b.

[0077] According to the conductive adhesive supply device 200 of this embodiment, which comprises a first viscoelastic body 20a and a second viscoelastic body 20b having the above-described features, even if the amount of chemical substance contained in the containment section 10 decreases and the pressure applied by the pressing member 40 to push out the contents changes, the viscoelastic bodies 20a and 20b of this embodiment deform smoothly, enabling the supply of substantially uniform uncured conductive adhesive directly from the respective discharge sections 14a and 14b, and ultimately from the discharge port 82.

[0078] As a result, at least some of the following effects (aII) to (cII) can be achieved. (aII) A predetermined amount of the main agent (A) 72 containing the first conductive filler (C1) 72a and the curing agent (B) 74 containing the second conductive filler (C2) 74a (i.e., four types of chemical substances) can be reliably and accurately supplied from each discharge port 14a, 14b for discharging from the containment section 10 toward the mixing section 80, and a predetermined amount of the four types of chemical substances mixed substantially uniformly can be reliably and accurately supplied from the discharge port 82 of the mixing section 80 (i.e., highly accurate quantitative accuracy). (bII) When pressure (or pressing force) is applied simultaneously to the four types of chemical substances in the containment section 10 by pressing with the pressing member 40, a predetermined amount of the four types of chemical substances can be reliably and simultaneously supplied from each discharge port 14a, 14b, and a predetermined blended amount of the four types of chemical substances can be supplied from the discharge port 82 of the mixing section 80 (i.e., highly accurate simultaneity). (cII) In the containment section 10, which serves as a source for the four chemical substances, the four chemical substances before mixing can be accurately and efficiently delivered to the respective discharge sections 14a and 14b, and the four chemical substances can be accurately and efficiently supplied from the discharge port 82 of the mixing section 80 (i.e., highly accurate consumption).

[0079] With the above configuration, when the pressing member 40 is pressed, the conductive adhesive supply device 200 of this embodiment allows the following chemical substance (X) contained in the first syringe 12a to be dispensed from the discharge port 14a on the other end of the first syringe 12a via the plungers 30a, 30b and the viscoelastic bodies 20a, 20b that contact the plungers 30a, 30b, and at the same time, allows the following chemical substance (Y) contained in the second syringe 12b to be dispensed from the discharge port 14b on the other end of the second syringe 12b. In addition, by being supplied from the discharge ports 14a and 14b, the chemical substances (X) and (Y) are supplied to the mixing port 80 with high accuracy to achieve a predetermined precise mixing ratio, and after being mixed substantially uniformly in the mixing port 80, a predetermined amount of uncured conductive adhesive is supplied from the tip of the mixing port 80. (X) Main component (A) 72, mainly composed of epoxy resin, containing dispersed first conductive filler (C1) 72a (Y) Curing agent (B) 74, containing dispersed second conductive filler (C2) 74a

[0080] As a result, the conductive adhesive supply device 200 of this embodiment can supply uncured adhesive that has been mixed in a state in which unevenness in curability and, consequently, the conductivity of the cured product is less likely to occur.

[0081] <Third Embodiment> The conductive adhesive supply device 300 of this embodiment is the same as the conductive adhesive supply device 100 of the first embodiment or the conductive adhesive supply device 200 of the second embodiment, except that the pressing member 40 of the first or second embodiment is replaced with a pressurized gas storage unit 90 equipped with a control unit 94 and a pressurized gas supply unit 92 equipped with a first pressurized gas introduction unit 92a and a second pressurized gas introduction unit 92b, and the stopper 60 equipped with a lid 50 of the first embodiment is replaced with a mixing unit 380. Therefore, explanations that overlap with the first or second embodiment can be omitted.

[0082] Figure 12 is a partial cross-sectional view showing the configuration of the supply device 300 of this embodiment, in which a main component (A) 72 containing dispersed first conductive filler (C1) 72a and a curing agent (B) 74 containing dispersed second conductive filler (C2) 74a (i.e., four types of chemical substances) are contained within the containment section 310. As shown in Figure 12, in the containment section 310, the first syringe 312a contains the main component (A) 72, which is mainly an epoxy resin and contains dispersed first conductive filler (C1) 72a, between the first dispensing section 314a and the first viscoelastic body 320a. The second syringe 312b contains the curing agent (B) 74, which contains dispersed second conductive filler (C2) 74a, between the second dispensing section 314b and the second viscoelastic body 320b.

[0083] Even though the housing section 310 of this embodiment differs in size from the housing section 10 of the first or second embodiment, the material and function it performs are the same. Similarly, even though the first syringe 312a, first viscoelastic body 320a, and first plunger 330a of this embodiment differ in size from the first syringe 12a, first viscoelastic body 20a, and first plunger 30a of the first or second embodiment, the material and function they perform are the same. Likewise, even though the second syringe 312b, second viscoelastic body 320b, and second plunger 330b of this embodiment differ in size from the second syringe 12b, second viscoelastic body 20b, and second plunger 30b of the first or second embodiment, the material and function they perform are the same. Furthermore, even though the mixing section 380 of this embodiment differs in size from the mixing section 80 of the first or second embodiment, the material and function it performs are the same.

[0084] Furthermore, as described above, the conductive adhesive supply device 300 of this embodiment includes a pressurized gas storage unit 90 equipped with a control unit 94. The pressurized gas storage unit 90 stores an inert gas, such as nitrogen, or air, and supplies the pressurized gas to the first plunger 330a and the second plunger 330b via a pressurized gas supply unit 92, which includes a first pressurized gas introduction unit 92a and a second pressurized gas introduction unit 92b, thereby pressing the first plunger 330a and the second plunger 330b substantially simultaneously.

[0085] Furthermore, the control unit 94 is provided to control the supply of pressurized gas from the pressurized gas storage unit 90 to press the first plunger 330a and the second plunger 330b. The control unit 94 is connected to a computer (not shown). The computer monitors or integrally controls the supply process by a supply control program for executing the pressurized gas supply process by the pressurized gas storage unit 90. In this embodiment, the supply control program is stored on a known recording medium such as a hard disk drive in the computer, an optical disc inserted into an optical disc drive provided in the computer, or a storage area using cloud computing, but the storage location of the supply control program is not limited to these. For example, part or all of the supply control program may be stored in the control unit 94 in this embodiment. In addition, the supply control program can be used to monitor or control the pressurized gas supply process remotely via known technologies such as a local area network or the Internet.

[0086] When the first plunger 330a and the second plunger 330b are pressed by the pressurized gas supplied from the pressurized gas reservoir 90, the pressure of the pressurized gas is transmitted substantially simultaneously in the first syringe 312a to the main component (A) 72, which is mainly epoxy resin and contains dispersed first conductive filler (C1) 72a, via the first viscoelastic body 320a. At the same time, in the second syringe 312b, the pressure is transmitted to the curing agent (B) 74, which contains dispersed second conductive filler (C2) 74a, via the second viscoelastic body 320b. The functions and roles of the first viscoelastic body 320a and the second viscoelastic body 320b in this embodiment using pressurized gas are the same as in the second embodiment.

[0087] When the pressure of the compressed gas is transmitted into the containment section 310, the main component (A) 72, which is mainly epoxy resin and contains dispersed first conductive filler (C1) 72a, is discharged from the first discharge section 314a of the first syringe 312a toward the mixing section 380. Substantly simultaneously, the curing agent (B) 74, which contains dispersed second conductive filler (C2) 74a, is discharged from the second discharge section 314b of the second syringe 312b toward the mixing section 380. Subsequently, the four chemical substances discharged from the first discharge section 314a and the second discharge section 314b toward the mixing section 380 in a predetermined and accurate mixing ratio are mixed substantially uniformly in the mixing section 380, after which a predetermined amount of uncured conductive adhesive is supplied from the discharge port 382 provided at the tip of the mixing section 380.

[0088] Furthermore, the pressure of the pressurized gas supplied from the pressurized gas storage unit 90 can be appropriately adjusted by pressing the first plunger 330a and the second plunger 330b, so that the uncured conductive adhesive mixed with the four chemical substances can be supplied from the discharge port 382 provided at the end of the mixing unit 380.

[0089] [Examples] The embodiments described above will be explained in more detail below with reference to examples and comparative examples. However, these examples are illustrative of the embodiments described above and do not limit the embodiments described above. The values ​​indicated by "%" for each component in the examples and comparative examples mean mass percent. Also, the values ​​indicated by "parts" for each component in the examples and comparative examples mean parts by mass.

[0090] (Preparation of Viscoelastic Bodies) The viscoelastic bodies shown in the Examples and Comparative Examples (viscoelastic bodies corresponding to the first viscoelastic bodies 20a, 320a or the second viscoelastic bodies 20b, 320b in the First to Third Embodiments) are manufactured as follows, taking the Examples as an example. For the sake of ease of explanation, the reference numerals for each component are represented by the reference numerals for each component in the First Embodiment.

[0091] A mixture is prepared by stirring and mixing the constituent components of a viscoelastic material—silicone (silicone resin), silica particles, alumina particles, iron oxide, and other trace additives—using a kneader mixer. During this process, the mixer kettle may be heated to a temperature of 30°C to 80°C depending on the viscosity of the mixture to facilitate mixing.

[0092] The mixture (viscoelastic material), which has been thoroughly and uniformly stirred and mixed, is shaped into a rod with a central diameter that matches the inner diameter of the housing 10, and then cut into pellets with a thickness of approximately 2 mm using a steel wire with a diameter of 0.05 mm. Alternatively, instead of the method described above, the stirred and mixed mixture (viscoelastic material) may be made into a sheet with a thickness of 2 mm and punched out into pellets with a predetermined inner diameter using an appropriate jig. Or, the mixture may be packed into a mold with a predetermined inner diameter and a thickness of 2 mm, and then subjected to a die-cutting process to obtain a pellet shape similar to that described above.

[0093] Two viscoelastic bodies, shaped into pellets (corresponding to the first viscoelastic body 20a and the second viscoelastic body 20b), are brought into contact with predetermined surfaces of the first plunger 30a and the second plunger 30b. Then, as in the first embodiment, the joints of the first piston 42a and the second piston 42b are fitted into the non-through holes of the first plunger 30a and the second plunger 30b, and inserted into the second syringe 12b containing the four chemical substances in the first embodiment. This operation and the filling of the conductive adhesive are performed under a degassed vacuum or a sufficiently reduced-pressure environment. This process can contribute to reliably preventing the formation of an air layer between the four chemical substances and the respective discharge sections 14a and 14b connected to the mixing section 80, and between the viscoelastic bodies and the four chemical substances, which may affect the transmission of pressure during use.

[0094] When applying the four uncured chemical substances (conductive adhesives), the stopper 60 is removed, a mixing member equipped with a predetermined discharge nozzle (corresponding to the discharge port 82) and a mixing unit 80 is attached, and the connecting portion 46 of the pressing member 40, which is equipped with a first piston 42a and a second piston 42b, is pressed to supply the conductive adhesive from the discharge nozzle to the object to be coated. In this case, when pressing using compressed gas, the pressing member 40 is not used, and pressure is applied to the first plunger 30a and the second plunger 30b by directly applying pressure to the compressed air from the compressed gas storage unit 90 adopted in the third embodiment, via the respective compressed gas introduction units 92a and 92b.

[0095] (Measurement of shear strain dependence of storage modulus and loss modulus of viscoelastic materials) The inventors measured the shear strain dependence of the storage and loss modulus of the viscoelastic materials (examples) and comparative examples described in each of the above embodiments using a dynamic viscoelastic device (manufactured by Anton Paar, model: MCR302). In this embodiment, the modulus of each shear strain ranged from 0.01% to 100% was measured at an ambient temperature of 25°C with the viscoelastic material sandwiched between parallel flat sensor plates.

[0096] (Conductive adhesive) An example of a conductive adhesive used in this embodiment is as follows:

[0097] A main component (corresponding to an example of main component (A)) consisting of 10 parts liquid bisphenol A epoxy resin, 1 part reactive epoxy diluent, 1 part glycol-based diluent, 30 parts flake silver powder, and 23 parts spherical silver powder, and a curing agent (corresponding to an example of curing agent (B)) consisting of 11 parts amine-based curing agent, 1 part cationic polymer dispersant, 22 parts flake silver powder, and 10 parts spherical silver powder were stirred and mixed in a planetary mixer, and the silver powder was further dispersed in a nearly uniform manner using a three-roll mixer to obtain raw materials for a conductive adhesive. The viscosities of the obtained main component and curing agent were approximately 20 Pa·s and approximately 30 Pa·s, respectively. The obtained main component and curing agent were filled into the first syringe 12a and the second syringe 12b, respectively, in a mass ratio of 5:4 (volume ratio, approximately 1:1).

[0098] (Measurement of effective usage rate) Approximately 2.0 g of the main agent described above was filled into the first syringe 12a, and 1.6 g of the hardener described above was filled into the second syringe 12b. Subsequently, the weight of each was measured in the following two states, (T1) and (T2), and the difference was considered as the effective usage amount. The ratio to the weight before use was evaluated as the effective usage rate. (T1) The conductive adhesive supply device 100 before use, equipped with a pressing member 40 and a mixing member that serves as the mixing section 80 (discharge port inner diameter 0.8 mm, static mixer section inner diameter 2.5 mm, static mixer section length 10 mm, mixing member total length 34.5 mm). (T2) The state in which the pressing member 40 is fully pressed by manual or compressed gas (i.e., each viscoelastic body is deformed so that the tips of each plunger (first plunger 30a and second plunger 30b) come into contact with the inner wall in front of each discharge section (first discharge section 14a and second discharge section 14b) where the diameter of the housing section 10 narrows).

[0099] (Evaluation of Tackiness) Tackiness was evaluated by a touch-dry test. After molding the viscoelastic material into pellets, they were left to stand for 2 hours in a container controlled at a temperature of 15°C to 26°C and a humidity of 50% to 70%. Then, the flat surface of the pellets was lightly touched with a fingertip and evaluated according to the following criteria. ○: The surface is not sticky, and no part of the pellet adheres to the fingertip. Furthermore, no fingerprints are left on the surface of the pellet that was touched. ×: The surface feels sticky, or part of the pellet adheres to the fingertip, or fingerprints are left on the surface of the pellet that was touched.

[0100] (Evaluation of uniformity and stability of conductive adhesive supply) Using the supply device 200 of the second embodiment, the pressing member 40 was pressed and moved linearly on a flat plate, and the conductive adhesive was continuously supplied (applied to the plate) until it was no longer being dispensed. The stability of the supply was evaluated from the change in shape according to the following criteria: ○: Almost the same amount of conductive adhesive is supplied from beginning to end. ×: The supply amount is uneven, or it is supplied in a splashy manner at the final stage, or a part of the viscoelastic material is included in the conductive adhesive during supply.

[0101] (Example) In this example, a viscoelastic body was used that contained 26% silicone (silicone resin), 37% silica particles, 18% alumina particles, 18% iron oxide, and 1% other additives.

[0102] (Comparative Example 1) This is the case where the viscoelastic material of this example was not used.

[0103] (Comparative Examples 2-4) The storage and loss modulus of the viscoelastic material were changed by increasing or decreasing the total amount of inorganic filler and the blending ratio of silicone (silicone resin) to inorganic filler based on the total amount.

[0104] The above-described examples and each comparative example were evaluated based on the following indicators (I) to (IV): (I) Storage modulus and loss modulus in the range of shear strain from 0.01% to 100% (II) Effective usage (III) Tackiness (IV) Uniformity and stability of supply

[0105] Table 1 shows the evaluation results for this example and the comparative example.

[0106]

[0107] As shown in Table 1, by using the conductive adhesive supply device of this embodiment, it was found that this embodiment exhibits superior characteristics in all evaluation items shown in Table 1, including effective usage rate, tackiness, and uniformity and stability of conductive adhesive supply. On the other hand, Comparative Examples 1 to 4 were significantly inferior to this embodiment in any of the aforementioned evaluation items.

[0108] <Other Embodiments> In the first to third embodiments described above, the first viscoelastic body 20a and the second viscoelastic body 20b are silicones containing inorganic fillers. However, the materials for the first viscoelastic body 20a and the second viscoelastic body 20b that can be used in this embodiment are not limited to silicone. For example, instead of silicone, polyolefin-based polymer resins, clay, etc., can be used. However, from the viewpoint of reactivity to the components of the conductive adhesive and stability such as wetting properties, it is a preferred embodiment to use silicone for the materials of the first viscoelastic body 20a and the second viscoelastic body 20b.

[0109] Furthermore, while the embodiments described above illustrate examples in which the first viscoelastic body 20a and the second viscoelastic body 20b can be stored, for example, at room temperature (approximately 15°C to approximately 25°C), the storage temperature conditions for the conductive adhesive supply devices 100, 200, and 300 in the embodiments described above are not limited to the above numerical ranges. For example, maintaining the first syringe 12a and the second syringe 12b, as well as the lid 50, stopper 60, or mixing unit 80, at -20°C to 50°C allows the uncured adhesive supplied from each conductive adhesive supply device 200 and 300, each equipped with a discharge port 82 and 382, ​​to exhibit the ability to cure at temperatures between 5°C and 100°C (more narrowly, between 10°C and 80°C).

[0110] The embodiments and examples described above are provided for illustrative purposes only and are not intended to limit the invention. In addition, other modifications within the scope of the invention, including other combinations of the embodiments and examples, are also included in the claims.

[0111] The conductive adhesive supply device of the present invention can be widely applied in various industrial fields.

[0112] 10, 310 Storage section 12a, 312a First syringe 12b, 312b Second syringe 14a, 314a First dispensing section 14b, 314b Second dispensing section 16 Engaging section 18a First opening 18b Second opening 20a, 320a First viscoelastic body 20b, 320b Second viscoelastic body 22a Contact surface 22b Contact surface 30a, 330a First plunger 30b, 330b Second plunger 32a Contact surface 32b Contact surface 40 Pressing member 42a First piston 42b Second piston 44a Joint section 44b Joint section 46 Connecting section 50 Lid 52a, 52b Sealing protrusion 60 Stopper 72 Main component 72a First conductive filler 74, curing agent 74a, second conductive filler 80, 380, mixing section 82, 382, ​​discharge port 84a, first introduction section 84b, second introduction section 90, pressurized gas storage section 92, pressurized gas supply section 92a, first pressurized gas introduction section 92b, second pressurized gas introduction section 94, control section 100, 200, 300, conductive adhesive supply device

Claims

1. A conductive adhesive supply device comprising an integrated first syringe and a second syringe, wherein the first syringe contains a main component (A) mainly composed of epoxy resin, which contains a dispersed first conductive filler (C1) between the first dispensing portion of the first syringe and a first viscoelastic body, and the second syringe contains a curing agent (B) which contains a dispersed second conductive filler (C2) between the second dispensing portion of the second syringe and a second viscoelastic body, the first viscoelastic body is non-reactive or poorly reactive to the main component (A) and the first conductive filler (C1), and is non-penetrating or poorly penetrating, and the second viscoelastic body is non-reactive or poorly reactive to the curing agent (B) and the second conductive filler (C2), and is non-penetrating or poorly penetrating.

2. A conductive adhesive supply device according to claim 1, wherein the main component (A), the curing agent (B), the first conductive filler (C1), and the second conductive filler (C2) are simultaneously supplied to a single mixing section by pressing the first plunger for the first syringe and the second plunger for the second syringe with pressurized gas or pressure, and are supplied from a discharge port after being mixed in the mixing section.

3. The conductive adhesive supply device according to claim 1 or claim 2, wherein the first viscoelastic body and the second viscoelastic body are silicones containing 10 wt% to 85 wt% of an inorganic filler.

4. In the range of shear strain of 0.01% to 20%, the storage modulus of the first viscoelastic material and the second viscoelastic material at 25°C is 5 × 10⁻⁶ ４ Pa or more, 5×10 ６ A conductive adhesive supply device according to claim 1 or claim 2, wherein the pressure is Pa or less.

5. In the range of shear strain of 0.01% to 20%, the loss modulus of elasticity at 25°C of the first viscoelastic body and the second viscoelastic body is 5 × 10⁻⁶ ４ Pa or more, 2×10 ６ A conductive adhesive supply device according to claim 1 or claim 2, wherein the pressure is Pa or less.

6. A conductive adhesive supply device according to claim 1 or claim 2, wherein, when the shear strain is 5% or more, the storage modulus and loss modulus of the first viscoelastic body and the second viscoelastic body at 25°C are substantially equal.

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