Chip recovery device and component mounting system

Abstract

A duct (main duct 30) of a chip recovery device for conveying chips of a tape member discharged from a tape feeder provided to a component mounting device is configured by coupling at least a first duct 31 and a second duct 33 by using a coupling tool 40. The coupling tool 40 is provided with: a pair of pressing parts PA, PB for pressing the first duct 31 and the second duct 33 in a direction approaching each other; and a fixing part 41 for fixing the positions of the pressed first duct 31 and second duct 33.

Description

Chip Collecting Apparatus and Component Mounting System

[0001] The present disclosure relates to a chip collecting apparatus that collects chips of a tape member discharged from a tape feeder, and to a component mounting system.

[0002] In a component mounting system for mounting components onto a substrate, there is known a chip collecting apparatus that collects chips of a tape member discharged from a tape feeder provided in a component mounting apparatus into a storage box. Patent Document 1 discloses a chip collecting apparatus comprising: a plurality of sub-ducts that receive chips discharged from tape feeders provided in a plurality of component mounting apparatuses; and a main duct to which the plurality of sub-ducts are connected, the main duct extending in a direction where the plurality of component mounting apparatuses are arranged, wherein the chip collecting apparatus discharges air to transfer the chips discharged from the tape feeders from the sub-ducts to the main duct, and stores the chips into the storage box through the main duct. Patent Document 1 also discloses that the main duct is formed by butting a plurality of main duct pieces against each other and connecting the butted main duct pieces with a connector.

[0003] Japanese Unexamined Patent Publication No. 2023-172984

[0004] However, in the conventional technology including Patent Document 1, if there is a gap between the main duct pieces of the main duct configured by a plurality of main duct pieces, there has been a problem that chips jump out of the gap to the outside. In addition, since the main duct is installed in a narrow space sandwiched between the factory floor and the lower surface of the component mounting apparatus, the range in which an operator can move their hands and arms during installation work and maintenance work is narrow, which also causes a problem of poor workability.

[0005] Accordingly, an object of the present disclosure is to provide a chip collecting apparatus and a component mounting system that can properly install a duct for conveying chips.

[0006] The chip collection device of the present disclosure is a chip collection device comprising a duct for transporting chips of tape members discharged from a tape feeder provided by a component mounting device, wherein at least a first duct and a second duct are connected by a connector, and the connector comprises a pair of pressing parts that press the first duct and the second duct toward each other, and a fixing part that fixes the positions of the pressed first duct and the second duct.

[0007] The component mounting system of the present disclosure comprises a component mounting device and a chip collection device equipped with a duct for transporting chips of tape material discharged from a tape feeder provided by the component mounting device, wherein the duct is configured such that at least a first duct and a second duct are connected by a connector, and the connector comprises a pair of pressing parts that press the first duct and the second duct toward each other, and a fixing part that fixes the pressed first duct and the second duct.

[0008] According to this disclosure, a duct for transporting chips can be properly installed.

[0009] A perspective view showing the configuration of a component mounting system including a chip recovery device and a plurality of component mounting devices according to one embodiment of the present disclosure. A side view showing the configuration of the main part of a component mounting device installed above the chip recovery device according to one embodiment of the present disclosure. A perspective view showing the configuration of a chip recovery device according to one embodiment of the present disclosure. An explanatory diagram of a plurality of ducts constituting the transport path of a chip recovery device according to one embodiment of the present disclosure. An exploded view of a connector that connects a plurality of ducts constituting the transport path of a chip recovery device according to one embodiment of the present disclosure. A cross-sectional view of a connector that connects a plurality of ducts in the transport path of a chip recovery device according to one embodiment of the present disclosure. An enlarged explanatory diagram of the lower pressing device in the transport path of a chip recovery device according to one embodiment of the present disclosure before pressing the plurality of ducts, and an enlarged explanatory diagram of the upper pressing device in the transport path of a chip recovery device according to one embodiment of the present disclosure before pressing the plurality of ducts, and an enlarged explanatory diagram of the upper pressing device in the transport path of a chip recovery device according to one embodiment of the present disclosure before pressing the plurality of ducts, and an enlarged explanatory diagram of the upper pressing device in the transport path of a chip recovery device according to one embodiment of the present disclosure (a)(b)(c) Diagram illustrating the process of installing a duct in a component mounting system according to one embodiment of the present disclosure. (a)(b) Diagram illustrating the process of installing a duct in a component mounting system according to one embodiment of the present disclosure. (a)(b) Diagram illustrating the process of installing a duct in a component mounting system according to one embodiment of the present disclosure.

[0010] An embodiment of this disclosure will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are illustrative examples for illustrative purposes and can be modified as appropriate according to the specifications of the component mounting system, component mounting device, chip collection device, and duct. In the following, corresponding elements are denoted by the same reference numerals in all drawings, and redundant explanations are omitted. In Figure 1 and in some parts described later, two mutually orthogonal axes in the horizontal plane are shown: the X-axis in the substrate transport direction (left-right direction for transferring substrates in Figure 1) and the Y-axis perpendicular to the substrate transport direction (front-back direction in Figure 1). Also, in Figure 1 and in some parts described later, the Z-axis (up-down direction) is shown as the height direction perpendicular to the horizontal plane.

[0011] First, the configuration of the component mounting system 1 will be explained with reference to Figure 1. The component mounting system 1 is composed of a plurality of component mounting devices M1 to M3 and a chip collection device 20. The component mounting system 1 has the function of passing a substrate KB between adjacent component mounting devices M1 to M3 and mounting components onto the substrate KB to produce mounted substrates. The component mounting system 1 also has the function of collecting chips from empty tape members that have been supplied with components. The component mounting devices M1 to M3 are installed above the collection path 21 (see Figure 2) and transport path 22 of the chip collection device 20.

[0012] The component mounting devices M1 to M3 have a feeder trolley 3 on which multiple tape feeders 2 that supply components using tape material are mounted, and have the function of mounting components onto the substrate KB. In this example, the component mounting devices M1 to M3 are equipped with a total of four feeder trolleys 3, two on the front and two on the rear. The chip collection device 20 has the function of collecting tape material chips discharged from the chutes of the feeder trolleys 3 mounted on the component mounting devices M1 to M3.

[0013] Furthermore, the component mounting devices M1 to M3 in the component mounting system 1 are not limited to three units, but may be one, two, or four or more. Also, the component mounting devices M1 to M3 may be configured to have one feeder trolley 3 attached to the front and one to the rear. In addition, the component mounting system 1 may be configured to include a printing device (not shown) for printing solder paste onto the circuit board upstream of the component mounting devices M1 to M3, and a reflow device (not shown) for melting the solder paste and soldering downstream.

[0014] Next, the configurations of the component mounting devices M1 to M3 will be described with reference to Figure 2. The three component mounting devices M1 to M3 have similar configurations, and here, component mounting device M1 will be used as an example. Component mounting device M1 comprises a component mounting main body 4 and four feeder trolleys 3. The feeder trolleys 3 are detachably connected to the front and rear component supply sections 5 of the component mounting main body 4, respectively.

[0015] Multiple tape feeders 2 are mounted on the upper surface of the feeder trolley 3, arranged along the X-axis. The feeder trolley 3 rotatably holds a reel 7 around which tape material T, which contains parts 6 to be supplied to the parts mounting body 4, is wound. The tape feeders 2 transport the tape material T stored on the reel 7 in the tape feeding direction to supply parts 6 to the parts mounting body 4.

[0016] In Figure 2, when the feeder trolley 3 is attached to the parts supply unit 5, the multiple tape feeders 2 are connected to the mounting control device 8 provided in the parts mounting main unit 4 via the feeder trolley 3. The mounting control device 8 transmits a command to supply parts 6 to the tape feeders 2, and upon receiving the command, the tape feeders 2 feed the tape members T to supply the parts 6 to the parts retrieval position.

[0017] The mounting control device 8 calculates the length of the empty tape member T discharged from the tape feeder 2 based on the length of the tape member T discharged from the tape feeder 2 in a single supply command and the number of parts 6 supplied by the tape feeder 2.

[0018] In Figure 2, two substrate transport mechanisms 10 are arranged front to back on the upper surface of the base 9 of the component mounting body 4, between the front and rear component supply sections 5. Each substrate transport mechanism 10 transports, positions, and holds a substrate KB along the X-axis. Above the substrate transport mechanisms 10, two mounting heads 12 are installed that move horizontally (in the X-axis and Y-axis directions) by a head moving mechanism 11.

[0019] The mounting control device 8 controls the head movement mechanism 11 and the mounting head 12 to perform a component mounting operation in which the mounting head 12 picks up the component 6 supplied by the tape feeder 2 to the component pick-up position and transfers and mounts it to the mounting point of the substrate KB held by the substrate transport mechanism 10. Above the feeder trolley 3, there is an openable and closable main body cover 13 that covers the movable mechanisms such as the mounting head 12 to prevent the worker from touching them during the component mounting operation.

[0020] In Figure 2, a chute 14 is installed on the side of the feeder trolley 3 that is connected to the base 9 to guide the empty tape material T discharged from the tape feeder 2 downwards. A cutter 15 is installed on the chute 14 to cut the empty tape material T.

[0021] The cutter 15 is controlled by the mounting control device 8, and when the empty tape members T discharged from any of the multiple tape feeders 2 reach a predetermined length (for example, 10 cm), it simultaneously cuts the empty tape members T. The cut tape members T are discharged from below the chute 14 as tape member T chips Ts. The predetermined length at which the tape members T are cut by the cutter 15 is set to a length that facilitates the collection of the chips Ts by the chip collection device 20.

[0022] Next, the configuration of the chip collection device 20 will be described with reference to Figures 1 to 3. The chip collection device 20 is equipped with 12 collection paths 21, 1 transport path 22, a positive pressure supply unit 23, and a storage unit 24. The transport path 22 is a tubular member extending in the direction of the alignment of the component mounting devices M1 to M3 (X-axis direction), and is installed on the floor FL. The transport path 22 has an air inlet 22A that opens on the upstream side of the flow of substrate KB and an air outlet 22B that opens on the downstream side of the flow of substrate KB.

[0023] In Figures 2 and 3, six recovery paths 21 corresponding to six feeder carts 3 connected to the front of the transport path 22 are connected. Similarly, six recovery paths 21 corresponding to six feeder carts 3 connected to the rear of the transport path 22 are connected. In the recovery paths 21, a transport-side opening 22K is provided at the end where it connects to the transport path 22.

[0024] A chip receiving opening 21a is formed on the upper surface of the recovery path 21. The chip receiving opening 21a is located directly below each chute 14 of the feeder trolley 3 mounted on the component mounting devices M1 to M3. The recovery path 21 receives the chips Ts of the tape material T discharged from the chute 14 through the chip receiving opening 21a.

[0025] In Figures 2 and 3, a recovery air discharge unit 25 is positioned in front of the wall inside the recovery path 21 that faces the transport-side opening 22K, and discharges air toward the transport-side opening 22K. The recovery air discharge unit 25 discharges air into the recovery path 21, transporting the chips Ts discharged from the chute 14 toward the transport-side opening 22K. The chips Ts transported in the recovery path 21 are then transported into the transport path 22 through the transport-side opening 22K.

[0026] Upstream of the air inlet 22A of the transport path 22, a transport air discharge unit 26 is positioned to discharge air toward the air outlet 22B. The transport air discharge unit 26 discharges air into the transport path 22, transporting the chips Ts that have been transported from the recovery path 21 into the transport path 22 toward the air outlet 22B. The chips Ts that have been transported to the air outlet 22B are discharged from the air outlet 22B and collected by the storage unit 24. The chips Ts stored in the storage unit 24 are transported by the conveyor 24a of the storage unit 24 and stored in the storage box 24b (see Figure 1).

[0027] In Figure 3, the positive pressure supply unit 23 is connected to a positive pressure source (not shown) that supplies positive pressure and incorporates a control valve (not shown). The operation of the control valve of the positive pressure supply unit 23 is controlled by a management device 27. The positive pressure supply unit 23 supplies positive pressure to each pipeline 28 by controlling the positive pressure supplied from the positive pressure source with the control valve. When positive pressure is supplied to a pipeline 28, air is blown out from the recovery air discharge section 25 in the recovery passage 21 connected to that pipeline 28. The positive pressure supply unit 23 also supplies positive pressure to the transport air discharge section 26 by controlling the positive pressure supplied from the positive pressure source with the control valve.

[0028] The control device 27 controls the control valve of the positive pressure supply unit 23, causing positive pressure to be discharged from the recovery air discharge unit 25 and the transport air discharge unit 26 at predetermined timings. As a result, the chips Ts discharged from the chute 14 are collected in the storage box 24b of the storage unit 24 via the recovery path 21, the transport path 22, and the air outlet 22B.

[0029] Although the chip collection device 20 shown in Figure 3 has one transport path 22, the chip collection device 20 is not limited to this configuration. For example, the chip collection device 20 may have two transport paths 22: a front transport path 22 corresponding to the three feeder carts 3 located at the front, and a rear transport path 22 corresponding to the three feeder carts 3 located at the rear.

[0030] Next, with reference to Figures 4 to 8, the main duct 30 that constitutes the transport path 22 of the chip collection device 20 will be described. The main duct 30 is constructed by connecting multiple ducts, taking into consideration easy installation and maintenance work. In this embodiment, the main duct 30 installed below each of the component mounting devices M1 to M3 is divided into three parts from the upstream side: a first duct 31, an intermediate duct 32, and a second duct 33. The first duct 31, the intermediate duct 32, and the second duct 33 are connected by a connector 40. The intermediate duct 32 is located between the first duct 31 and the second duct 33 and acts as an intermediate between the first duct 31 and the second duct 33.

[0031] In Figure 4, the upstream opening 31a of the first duct 31 has a recessed fastening portion that is inserted into a convex fastening portion 33c provided in the downstream opening 33b of the second duct 33 of the component mounting devices M1 to M3 located upstream. By inserting the convex fastening portion 33c into the recessed fastening portion and connecting the first duct 31 and the upstream second duct 33, it is possible to prevent chips Ts being transported through the main duct 30 by air from leaking out through the gap (see Figure 10(b)). The downstream opening 31b of the first duct 31 and the upstream opening 32a of the intermediate duct 32, and the downstream opening 32b of the intermediate duct 32 and the upstream opening 33a of the second duct 33 are connected by butting them together.

[0032] A recovery-side opening 31c is formed on the side of the first duct 31, which is connected to the recovery path 21. Similarly, a recovery-side opening 33d is formed on the side of the second duct 33, which is also connected to the recovery path 21. First pins 34 are positioned on the front and rear sides of the upper surface near the downstream opening 31b of the first duct 31. Second pins 35 are positioned on the front and rear sides of the upper surface near the upstream opening 33a of the second duct 33.

[0033] In Figures 7 and 8, the first pin 34 and the second pin 35 each have a base attached to the upper surface of the first duct 31 and the second duct 33, a main body portion 34a and a main body portion 35a extending away from the base, and a flange-like portion 34b and a flange-like portion 35b extending flat from the tips of the main body portion 34a and the main body portion 35a.

[0034] In Figures 4 and 5, the connector 40 is constructed by stacking a fixing part 41, a lower pressing part 42, and an upper pressing part 43 in order from bottom to top. The fixing part 41 is fixed to the front side surface of the intermediate duct 32 by two screws 44. Two screw holes 32c are formed on the front side surface of the intermediate duct 32, one above the other, into which the screws 44 engage. After the first duct 31, the intermediate duct 32, and the second duct 33 are butted together, the fixing part 41 is fixed to the front side surfaces of the first duct 31 and the second duct 33 by four screws 45.

[0035] Two screw holes 31d are formed vertically on the front side of the first duct 31, into which screws 45 engage. Two screw holes 33e are formed vertically on the front side of the second duct 33, into which screws 45 engage. Four elongated holes 41a are formed in the fixing part 41 at positions corresponding to the screw holes 31d of the first duct 31 and the screw holes 33e of the second duct 33. The screws 45 engage with the screw holes 31d of the first duct 31 and the screw holes 33e of the second duct 33 through the elongated holes 41a. The elongated holes 41a allow for some misalignment of the connected first duct 31, intermediate duct 32, and second duct 33.

[0036] In Figure 5, a pair of guide portions 41b are formed on the upper part of the fixing portion 41. The front projection 42a of the lower pressing tool 42 is positioned between the pair of guide portions 41b of the fixing portion 41. The lower pressing tool 42 is movable back and forth as the front projection 42a is guided by the pair of guide portions 41b. Behind the front projection 42a of the lower pressing tool 42, an upstream projection 42b that protrudes upstream and a downstream projection 42c that protrudes downstream are formed. Behind the upstream projection 42b and the downstream projection 42c, a rear projection 42d that protrudes rearward is formed.

[0037] In Figures 5 and 7, a forward-projecting lower upstream pressing portion 46 is formed on the front upstream side of the upstream projection 42b of the lower pressing tool 42. Also, a forward-projecting lower downstream pressing portion 47 is formed on the front downstream side of the downstream projection 42c. The lower upstream pressing portion 46 has a first pressing surface 46a that contacts the main body portion 34a of the front first pin 34 from the upstream side, with its tip inclined upstream. The lower downstream pressing portion 47 has a second pressing surface 47a that contacts the main body portion 35a of the front second pin 35 from the downstream side, with its tip inclined downstream.

[0038] In Figure 7(b), when the lower pressing tool 42 installed on the upper surface of the relay duct 32 moves forward (arrow a1), the first pressing surface 46a of the lower upstream pressing part 46 presses the main body 34a of the front first pin 34 downstream (arrow a2), and the second pressing surface 47a of the lower downstream pressing part 47 presses the main body 35a of the front second pin 35 upstream (arrow a3). In other words, the lower upstream pressing part 46 and the lower downstream pressing part 47 press in a direction that brings the first duct 31 and the second duct 33 closer together (arrows a2, arrows a3). As a result, the gap between the first duct 31 and the intermediate duct 32, and the gap between the intermediate duct 32 and the second duct 33 (see Figure 7(a)) gradually decrease, and eventually the first duct 31, the intermediate duct 32, and the second duct 33 are connected in a tight-fitting manner.

[0039] Thus, the lower upstream pressing section 46 and the lower downstream pressing section 47 constitute a pair of pressing sections PA that press in a direction that brings the first duct 31 and the second duct 33 closer together. The lower upstream pressing section 46 and the lower downstream pressing section 47 are movable in a direction (Y-axis direction) that intersects with the connection direction (substrate transport direction) of the first duct 31 and the second duct 33, and when the lower upstream pressing section 46 and the lower downstream pressing section 47 move in the direction that intersects (forward), they have a first pressing surface 46a and a second pressing surface 47a that press in a direction that brings the first duct 31 and the second duct 33 closer together. That is, the pair of pressing sections PA have a first pressing surface 46a that presses the front first pin 34, and a second pressing surface 47a that is positioned opposite the first pressing surface 46a and presses the front second pin 35.

[0040] In Figures 5 and 6, the upper pressing tool 43 is composed of a lower member 43a and an upper member 43b that is fixed on top of the lower member 43a. A groove 43c is formed in the portion where the lower member 43a and the upper member 43b overlap by cutting out a part of the lower member 43a. The rear projection 42d of the lower pressing tool 42 is inserted into the groove 43c. With the rear projection 42d of the lower pressing tool 42 inserted into the groove 43c, the upper pressing tool 43 can move back and forth along the rear projection 42d. The upper member 43b has an extension 43d that extends forward from the portion that overlaps with the lower member 43a.

[0041] In Figures 5 and 8, an upper upstream pressing portion 48 is formed on the upstream rear side of the lower member 43a of the upper pressing tool 43, projecting backward. Also, an upper downstream pressing portion 49 is formed on the downstream rear side of the lower member 43a, projecting backward. The upper upstream pressing portion 48 has a first pressing surface 48a that contacts the main body portion 34a of the rear first pin 34 from the upstream side, with its tip inclined upstream. The upper downstream pressing portion 49 has a second pressing surface 49a that contacts the main body portion 35a of the rear second pin 35 from the downstream side, with its tip inclined downstream.

[0042] In Figure 8(b), when the upper pressing tool 43, which is installed on the lower pressing tool 42, moves to the rear (arrow b1), the first pressing surface 48a of the upper upstream pressing part 48 presses the main body 34a of the rear first pin 34 downstream (arrow b2), and the second pressing surface 49a of the upper downstream pressing part 49 presses the main body 35a of the rear second pin 35 upstream (arrow b3). In other words, the upper upstream pressing part 48 and the upper downstream pressing part 49 press in a direction that brings the first duct 31 and the second duct 33 closer together (arrows b2, arrows b3). As a result, the gap between the first duct 31 and the intermediate duct 32, and the gap between the intermediate duct 32 and the second duct 33 (see Figure 8(a)) gradually decrease, and eventually the first duct 31, the intermediate duct 32, and the second duct 33 are connected in a tight-fitting manner.

[0043] As described above, the upper upstream pressing portion 48 and the upper downstream pressing portion 49 constitute a pair of pressing portions PB that press the first duct 31 and the second duct 33 in a direction to bring them closer together. The upper upstream pressing portion 48 and the upper downstream pressing portion 49 are movable in a direction (Y-axis direction) intersecting the connecting direction (substrate conveyance direction) of the first duct 31 and the second duct 33. When the upper upstream pressing portion 48 and the upper downstream pressing portion 49 move in the intersecting direction (rearward), they have a first pressing surface 48a and a second pressing surface 49a that press the first duct 31 and the second duct 33 in the direction to bring them closer together. That is, the pair of pressing portions PB have the first pressing surface 48a that presses the rear first pin 34, and the second pressing surface 49a disposed opposite to the first pressing surface 48a that presses the rear second pin 35.

[0044] In FIGS. 5 and 6, a lower front end portion 42e extending downward is formed at the front end of the front protruding portion 42a of the lower pressing tool 42. A screw hole 42f with which the fastening screw 50 engages is formed in the lower front end portion 42e. An upper front end portion 43e extending downward is formed at the front end of the extending portion 43d of the upper pressing tool 43. A screw hole 43f with which the fastening screw 50 engages is formed in the upper front end portion 43e. In a state where the upper pressing tool 43 is stacked on the lower pressing tool 42, the upper front end portion 43e of the upper pressing tool 43 is located forward of the lower front end portion 42e of the lower pressing tool 42. By engaging and tightening the fastening screw 50 from the front into the screw hole 43f of the upper front end portion 43e and the screw hole 42f of the lower front end portion 42e, the lower pressing tool 42 moves forward (arrow a1 in FIG. 7(b)), and the upper pressing tool 43 moves rearward (arrow b1 in FIG. 8(b)).

[0045] Next, referring to Figure 5, the method of connecting the first duct 31, the intermediate duct 32, and the second duct 33 using the connector 40 (connection work) will be explained. When connecting the first duct 31, the intermediate duct 32, and the second duct 33, first, the first duct 31 and the second duct 33 are placed side by side with enough space between them for the intermediate duct 32 to fit (Figure 9(b)). Next, the intermediate duct 32, whose fixing part 41 is fixed to the front side with screws 44, is inserted from the front between the first duct 31 and the second duct 33 (arrow c1). Then, the first duct 31 and the second duct 33 are temporarily fixed to the fixing part 41 with screws 45 (arrow c2).

[0046] Next, the lower pressing tool 42 is placed on the upper surface of the relay duct 32 such that the front projection 42a is positioned between the pair of guide portions 41b of the fixing portion 41 (arrow c3). Next, the upper pressing tool 43 is placed on top from above so that the rear projection 42d of the lower pressing tool 42 is inserted into the groove portion 43c (arrow c4). Next, the fastening screw 50 is engaged with the screw hole 43f of the upper front end portion 43e and the screw hole 42f of the lower front end portion 42e from the front and tightened (arrow c5).

[0047] As a result, the pair of pressing parts PA of the lower pressing tool 42 move forward (arrow a1 in Figure 7(b)), and the pair of pressing parts PA press the first duct 31 and the second duct 33 closer together (arrows a2, a3 in Figure 7(b)). At the same time, the pair of pressing parts PB of the upper pressing tool 43 move backward (arrow b1 in Figure 8(b)), and the pair of pressing parts PB press the first duct 31 and the second duct 33 closer together (arrows b2, b3 in Figure 8(b)). When the first duct 31, the intermediate duct 32, and the second duct 33 are in close contact, the first duct 31 and the second duct 33 are fixed to the fixing part 41 by the screw 45. In other words, the fixing part 41 fixes the positions of the pressed first duct 31 and the second duct 33.

[0048] As described above, the main duct 30 is configured by connecting a first duct 31, a relay duct 32, and a second duct 33 with a connecting tool 40. The scrap collecting device 20 includes the main duct 30 that conveys scraps Ts of the tape member T discharged from a tape feeder 2 provided in component mounting apparatuses M1 to M3. The fixing portion 41 is fixed to the relay duct 32 and fixes the positions of the pressed first duct 31 and second duct 33. In the present embodiment, the screw 45 can be engaged with the fastening screw 50 only by an operation from the front side, so that an operator can connect the first duct 31, the relay duct 32, and the second duct 33 via the connecting tool 40 even in a narrow space.

[0049] Note that the main duct 30 may have a configuration in which the first duct 31 and the second duct 33 are connected by the connecting tool 40 without using the relay duct 32. That is, the first duct 31 and the second duct 33 are arranged side by side, and the fixing portion 41 is temporarily fixed to the first duct 31 and the second duct 33 with the screw 45. Next, the lower pressing member 42 and the upper pressing member 43 are stacked and placed. Then, the fastening screw 50 is tightened to bring the first duct 31 and the second duct 33 into close contact with a pair of pressing portions PA and PB, and the first duct 31 and the second duct 33 may be fixed to the fixing portion 41 by the screw 45. As described above, the main duct 30 is configured by connecting at least the first duct 31 and the second duct 33 with the connecting tool 40.

[0050] Next, with reference to FIGS. 9 to 11, an installation method (installation work) for installing the main duct 30 constituting the conveyance path 22 and the sub ducts 52 and 53 (FIG. 11) constituting the recovery path 21 under the component mounting apparatuses M1 to M3 after the component mounting apparatuses M1 to M3 are installed in the component mounting system 1 will be described. When installing the main duct 30 and the sub ducts 52 and 53, the work is performed in a state where the feeder carriage 3 is removed from the component supply portions 5 of the component mounting apparatuses M1 to M3. Here, description will be given using an example in which the main duct 30 and the sub ducts 52 and 53 are installed under the component mounting apparatus M2.

[0051] In Figure 9(a), the component supply section 5 of the component mounting device M2 has multiple (three in this example) mounting legs 51 installed on the floor FL to support the component mounting device M2. The upstream component mounting device M1 has a second duct 33A, and the downstream component mounting device M3 has a first duct 31A. Due to the presence of multiple mounting legs 51, it is difficult to install a single long duct as the main duct 30 in the narrow space of about 10 cm below the component mounting device M2. In this embodiment, the main duct 30 to be installed below the component mounting device M2 is constructed by connecting a first duct 31, an intermediate duct 32, and a second duct 33 that are divided into three parts, thereby enabling efficient installation and maintenance work.

[0052] First, the worker inserts the recessed fastening portion of the first duct 31 of the component mounting device M2 into the convex fastening portion 33c of the second duct 33A of the component mounting device M1 and places it on the floor FL. The worker then inserts the convex fastening portion 33c of the second duct 33 of the component mounting device M2 into the recessed fastening portion of the first duct 31A of the component mounting device M3 and places it on the floor FL (Figure 9(b)). Next, the worker inserts the intermediate duct 32 between the first duct 31 and the second duct 33 (Figure 9(c)).

[0053] Next, the worker places the connector 40 on the relay duct 32 (Figure 10(a)) and performs the aforementioned connection work. In this embodiment, by placing the front projection 42a of the lower pressing tool 42 between the pair of guide parts 41b of the fixing part 41, and placing the groove 43c of the upper pressing tool 43 on the rear projection 42d of the lower pressing tool 42, the connector 40 can be installed with good workability even in the narrow space below the component mounting device M2.

[0054] Next, the worker tightens the fastening screws 50 from the front, causing the first duct 31 and the second duct 33 of the component mounting device M2 to be pressed together by the pair of pressing parts PA and PB (arrows d1 and d2 in Figure 10(b)), and the first duct 31, the intermediate duct 32, and the second duct 33 to be in close contact (Figure 10(b)). Next, the worker fixes the first duct 31 and the second duct 33 to the fixing part 41 with screws 45. In this embodiment, the first duct 31, the intermediate duct 32, and the second duct 33 can be fixed in close contact even in the narrow space below the component mounting device M2 by the simple operation of the worker tightening the fastening screws 50 and screws 45 from the front.

[0055] In the process of tightening the fastening screws 50 to bring the first duct 31, intermediate duct 32, and second duct 33 of the component mounting device M2 into close contact, gaps may occur between the second duct 33A of the component mounting device M1 and the first duct 31 of the component mounting device M2, and between the first duct 31A of the component mounting device M3 and the second duct 33 of the component mounting device M2. Even if such gaps occur, the presence of overlapping portions of the convex fastening portion 33c of the second duct 33A and the concave fastening portion of the first duct 31, and overlapping portions of the concave fastening portion of the first duct 31A and the convex fastening portion 33c of the second duct 33 prevents chips Ts from leaking out of the connecting portion.

[0056] Next, the worker inserts and secures the sub-duct 52 into the recovery-side opening 31c of the first duct 31 (arrow d3 in Figure 11(a)), and inserts and secures the sub-duct 53 into the recovery-side opening 33d of the second duct 33 (arrow d4 in Figure 11(a)). Next, the worker secures the second duct 33A of the component mounting device M1 and the first duct 31 of the component mounting device M2 with the first fixing member 54, and secures the first duct 31A of the component mounting device M3 and the second duct 33 of the component mounting device M2 with the second fixing member 55 (Figure 11(b)). This connects the main ducts 30 of the component mounting devices M1 to M3.

[0057] In this way, by connecting the main ducts 30 of the component mounting devices M1 to M3 using the first fixing member 54 and the second fixing member 55, it becomes possible to partially remove, for example, the main duct 30 of the component mounting device M2, thereby improving the efficiency of maintenance work. Furthermore, by setting the length of the intermediate duct 32 in the X-axis direction to be longer than the length of the convex fastening portion 33c of the second ducts 33, 33A in the X-axis direction, it becomes possible to partially remove the first duct 31 of the component mounting device M2 by removing the connector 40, the intermediate duct 32 and the first fixing member 54. Also, by removing the connector 40, the intermediate duct 32 and the second fixing member 55, it becomes possible to partially remove the second duct 33 of the component mounting device M2.

[0058] This further improves the efficiency of maintenance work. Note that in the process of installing the duct shown in Figure 11, the insertion of the sub-duct 52 into the recovery-side opening 31c of the first duct 31 of the component mounting device M2, and the insertion of the sub-duct 53 into the recovery-side opening 33d of the second duct 33 of the component mounting device M2 may be performed after connecting the main ducts 30 of the component mounting devices M1 to M3.

[0059] As explained above, this disclosure discloses the following technical concepts.

[0060] (Technology 1) A chip collection device 20 equipped with a duct (main duct 30) for transporting chips Ts of tape members T discharged from tape feeders 2 provided by component mounting devices M1 to M3, wherein the duct is configured such that at least a first duct 31 and a second duct 33 are connected by a connector 40, and the connector 40 comprises a pair of pressing parts PA and PB that press the first duct 31 and the second duct 33 toward each other, and a fixing part 41 that fixes the positions of the pressed first duct 31 and the second duct 33, the chip collection device 20.

[0061] This allows for the proper installation of the duct for transporting the chips Ts.

[0062] (Technology 2) The chip collection device 20 according to Technology 1, wherein the pressing parts PA and PB are movable in a direction intersecting the connection direction (substrate transport direction) of the first duct 31 and the second duct 33, and when the pressing parts PA and PB move in the direction of intersecting, they have pressing surfaces (first pressing surfaces 46a, 48a, second pressing surfaces 47a, 49a) that press in a direction bringing the first duct 31 and the second duct 33 closer together.

[0063] This allows the duct for sending chips Ts to be properly installed simply by moving the pressing parts PA and PB in a direction that intersects the connecting direction.

[0064] (Technology 3) The chip collection device 20 according to Technology 1 or 2, wherein the first duct 31 is provided with a first pin 34, the second duct 33 is provided with a second pin 35, and the pair of pressing parts PA and PB have first pressing surfaces 46a and 48a that press the first pin 34, and second pressing surfaces 47a and 49a that are positioned opposite the first pressing surfaces 46a and 48a that press the second pin 35.

[0065] This allows the pressing parts PA and PB to simultaneously press the first duct 31 and the second duct 33, thereby properly installing the duct for sending chips Ts.

[0066] (Technical 4) The chip collection device 20 according to Technical 3, wherein the first pin 34 and the second pin 35 each have a base attached to the upper surface of the first duct 31 and the second duct 33, a main body portion 34a, 35a extending away from the base, and a flange-shaped portion 34b, 35b extending in a flat manner from the tip of the main body portion 34a, 35a, and the first pressing surface 46a, 48a and the second pressing surface 47a, 49a press the main body portion 34a, 35a.

[0067] This allows the pressing parts PA and PB to simultaneously press the main body parts 34a and 35a, enabling proper installation of the duct for sending chips Ts.

[0068] (Technical 5) The chip collection device 20 according to any one of Technical 1 to 4, further comprising a relay duct 32 located between the first duct 31 and the second duct 33, which relays the first duct 31 and the second duct 33, wherein the fixing part 41 is fixed to the relay duct 32 and fixes the positions of the pressed first duct 31 and the second duct 33.

[0069] This allows the first duct 31, the intermediate duct 32, and the second duct 33 to be connected, enabling the proper installation of a duct for sending chips Ts.

[0070] (Technical 6) A component mounting system 1 comprising component mounting devices M1 to M3 and a chip collection device 20 equipped with a duct (main duct 30) for transporting chips Ts of tape members T discharged from tape feeders 2 provided by component mounting devices M1 to M3, wherein the duct is configured such that at least a first duct 31 and a second duct 33 are connected by a connector 40, and the connector 40 comprises a pair of pressing parts PA and PB that press the first duct 31 and the second duct 33 toward each other, and a fixing part 41 that fixes the pressed first duct 31 and the second duct 33, in a manner that brings them closer together, in the component mounting system 1.

[0071] This allows for the proper installation of the duct for transporting the chips Ts.

[0072] While embodiments have been described above with reference to the drawings, it goes without saying that this disclosure is not limited to such examples. It is clear to those skilled in the art that various modifications or alterations can be conceived within the scope of the claims, and these will naturally also fall within the technical scope of this disclosure. Furthermore, the components of the above embodiments may be combined in any way without departing from the spirit of the invention.

[0073] This application is based on Japanese Patent Application No. 2025-051727 filed on March 26, 2025, and its contents are incorporated herein by reference.

[0074] The chip recovery device and component mounting system of this disclosure have the effect of allowing for the proper installation of a duct for transporting chips, and are useful in the field of mounting components onto a substrate.

[0075] 1. Component mounting system 2. Tape feeder 20. Chip collection device 30. Main duct 31, 31A. First duct 32. Intermediate duct 33, 33A. Second duct 34. First pin 34a, 35a. Main body 34b, 35b. Flange-shaped part 35. Second pin 40. Connector 41. Fixing part 46a, 48a. First pressing surface 47a, 49a. Second pressing surface PA, PB. Pressing part T. Tape member Ts. Chips M1-M3. Component mounting device

Claims

1. A chip collection device comprising a duct for transporting chips of tape material discharged from a tape feeder of a component mounting device, wherein the duct is configured such that at least a first duct and a second duct are connected by a connector, and the connector comprises a pair of pressing parts that press the first duct and the second duct toward each other, and a fixing part that fixes the pressed positions of the first duct and the second duct.

2. The chip collection device according to claim 1, wherein the pressing portion is movable in a direction intersecting the connection direction of the first duct and the second duct, and when the pressing portion moves in the intersecting direction, it has a pressing surface that presses in a direction that brings the first duct and the second duct closer together.

3. The chip collection device according to claim 2, wherein the first duct comprises a first pin and the second duct comprises a second pin, and the pair of pressing portions comprises a first pressing surface for pressing the first pin and a second pressing surface positioned opposite the first pressing surface for pressing the second pin.

4. The chip collection device according to claim 3, wherein the first pin and the second pin each have a base portion attached to the upper surface of the first duct and the second duct, a main body portion extending away from the base portion, and a flange-shaped portion extending in a flat manner from the tip of the main body portion, and the first pressing surface and the second pressing surface press against the main body portion.

5. The chip collection device according to claim 1, further comprising a relay duct located between the first duct and the second duct and relaying the first duct and the second duct, wherein the fixing part is fixed to the relay duct and fixes the positions of the pressed first duct and the second duct.

6. A component mounting system comprising a component mounting device and a chip collection device equipped with a duct for transporting chips of tape material discharged from a tape feeder provided by the component mounting device, wherein the duct is configured such that at least a first duct and a second duct are connected by a connector, and the connector comprises a pair of pressing parts that press the first duct and the second duct toward each other, and a fixing part that fixes the pressed first duct and the second duct in place.

Images