Component mounting device, component mounting system, and component mounting method

Abstract

A component mounting device (10) comprises a component installation unit (40) that installs components (2) on substrates (80), an error detection unit (11) that detects errors, an image capture unit (12) that captures images of a component extraction region (Tp) of a supply device (31) that supplies the components (2), an inspection unit (13) that inspects the placement state of the components in the component extraction region (Tp), a storage unit (16) that stores inspection execution information (16c) that indicates whether inspection of the component extraction region (Tp) has been executed or is yet to be executed by the inspection unit (13), and a control unit (15).

Description

Component mounting apparatus, component mounting system and component mounting method

[0001] The present disclosure relates to a component mounting apparatus, a component mounting system and a component mounting method.

[0002] Conventionally, component mounting apparatuses that mount components onto a substrate are known. Patent Document 1 discloses a component mounting apparatus that, when occurrence of an abnormality is detected in one component supply unit, sets an adjacent component supply unit as a monitoring target as well.

[0003] Japanese Unexamined Patent Publication No. 2020-191391

[0004] In component mounting apparatuses, when mounting components onto a substrate, various mounting errors may occur, such as mounting a component different from the component that should originally be mounted, mounting a plurality of components at one mounting position, or mounting a component at a position deviated from the original mounting position.

[0005] The present disclosure provides a component mounting apparatus and the like that can suppress occurrence of mounting errors.

[0006] A component mounting apparatus according to one aspect of the present disclosure includes: a component mounting unit that removes components supplied by a plurality of supply devices from the component removal areas of each of the plurality of supply devices and mounts them on a substrate; an error detection unit that detects errors that occur between the time the component is removed from the component removal area and mounted on the substrate using the component mounting unit; an imaging unit that images the component removal area; an inspection unit that inspects the arrangement of components in the component removal area based on the image obtained by the imaging unit; and a storage unit that stores inspection execution information indicating whether the inspection by the inspection unit on the component removal area has been performed or not. The system comprises a unit and a control unit that accesses the storage unit and controls the component mounting unit, the error detection unit, the imaging unit, and the inspection unit, wherein the storage unit stores the inspection execution information corresponding to the component removal area after the error detection unit has detected the most recent error, and the control unit acquires the inspection execution information stored in the storage unit before the component mounting unit removes a component supplied by a predetermined supply device among the plurality of supply devices, and if it confirms that the inspection of the component removal area of ​​the predetermined supply device has not yet been performed, it causes the imaging unit to image the component removal area of ​​the predetermined supply device.

[0007] A component mounting system according to one aspect of the present disclosure is a component mounting device that removes components and mounts them on a substrate, and a server device that inspects a component removal area, which is an area from which components are removed by the component mounting device, wherein the component mounting device includes a component mounting unit that removes each component supplied by a plurality of supply devices from the respective component removal areas of the plurality of supply devices and mounts them on the substrate, an error detection unit that detects errors that occur between the time the component is removed from the component removal area using the component mounting unit and the component is mounted on the substrate, an imaging unit that images the component removal area, a mounting communication unit that transmits the image obtained by the imaging unit to the server device, a storage unit that stores inspection execution information indicating whether the server device's inspection of the component removal area has been performed or not, and a unit that accesses the storage unit and The system comprises a component mounting unit, an error detection unit, an imaging unit, and a control unit that controls the mounting communication unit. The storage unit stores inspection execution information corresponding to the component removal area after the error detection unit has detected the most recent error. The control unit retrieves the inspection execution information stored in the storage unit before removing a component supplied by a predetermined supply device from among the plurality of supply devices using the component mounting unit. If the control unit confirms that an inspection of the component removal area of ​​the predetermined supply device has not yet been performed, it causes the imaging unit to image the component removal area of ​​the predetermined supply device. The mounting communication unit transmits the image of the component removal area obtained by the imaging unit to the server device. The server device inspects the arrangement of components in the component removal area based on the image transmitted from the mounting communication unit and transmits the inspection result to the component mounting device.

[0008] A component mounting method according to one aspect of the present disclosure includes: a mounting step of removing each component supplied by a plurality of supply devices from the respective component removal area of ​​the plurality of supply devices and mounting them on a substrate; an error detection step of detecting errors that occurred between the time the component was removed from the component removal area in the mounting step and the time it was mounted on the substrate; an imaging step of imaging the component removal area; an inspection step of inspecting the arrangement of components in the component removal area based on the image obtained in the imaging step; and an inspection execution information indicating whether the inspection of the component removal area of ​​each of the plurality of supply devices has been performed or not, wherein the inspection execution information corresponding to the component removal area after the most recent error was detected in the error detection step is stored, wherein the inspection execution information is acquired before removing the component supplied by a predetermined supply device among the plurality of supply devices in the mounting step, and if it is confirmed that the inspection of the component removal area of ​​the predetermined supply device has not been performed, the component removal area of ​​the predetermined supply device is imaged in the imaging step.

[0009] These comprehensive or specific embodiments may be implemented as a system, method, integrated circuit, computer program, or recording medium such as a computer-readable CD-ROM, or as any combination of a system, method, integrated circuit, computer program, and recording medium. Furthermore, the recording medium may be a non-temporary recording medium.

[0010] The component mounting apparatus, etc., described herein can suppress the occurrence of mounting errors.

[0011] Further advantages and effects of one aspect of this disclosure will be made apparent from the specification and drawings. Such advantages and / or effects are provided by several embodiments and features described in the specification and drawings, but not all of them are necessarily provided in order to obtain one or more identical features.

[0012] This figure shows an example of a case where the arrangement of components in the component removal area of ​​a component mounting device is not normal. This figure shows a state in which a scattered component different from the component that should have been removed is removed by a suction nozzle. This is a schematic diagram of a component mounting system comprising a component mounting device and a server device according to the embodiment. This is a block diagram showing the functional configuration of the component mounting system according to the embodiment. This is a top view of the component mounting device according to the embodiment. This is a side view of a part of the component mounting device according to the embodiment. This is a top view of the component removal area of ​​the component mounting device according to the embodiment. This figure shows a case where the arrangement of components in the component removal area is normal. This figure shows an example of a case where the arrangement of components in the component removal area is not normal. This figure shows an example of component supply information stored in the memory of the component mounting device. This figure shows an example of mounting data stored in the memory of the component mounting device. This figure shows an example of inspection execution information stored in the memory of the component mounting device. This is a flowchart of a component mounting method according to the embodiment. This is a block diagram showing the functional configuration of a component mounting system according to a modified example of the embodiment. This is a flowchart showing the operation of a component mounting system according to a modified example of the embodiment.

[0013] [Background to this Disclosure] Component mounting equipment is known for manufacturing component-mounted substrates by mounting components onto a substrate. In component mounting equipment, components are picked up from the component pick-up area of ​​a component supply device using a suction nozzle and mounted onto the substrate. Various mounting errors can occur when mounting components onto a substrate in component mounting equipment.

[0014] Figure 1A shows an example of a case where the arrangement of components in the component removal area of ​​a component mounting device is not normal.

[0015] Figure 1A shows an example in which a scattered part 2x, which is a different part from the part 2 that should have been picked up, has entered the part pick-up area Tp of the supply device 31. The event of scattered parts 2x entering the part pick-up area Tp can occur due to various factors, such as the part 2 being flicked away when picked up by the suction nozzle, the part 2 being dropped while being carried by the suction nozzle, or the part 2 being returned to the supply device because it could not be attached to the substrate.

[0016] Figure 1B shows a situation where a scattered part, different from the part that was originally intended to be removed, has been removed by the suction nozzle.

[0017] As shown in Figure 1A, if a scattered component 2x enters the component removal area Tp, a mounting error occurs where the scattered component 2x is picked up by the suction nozzle 43 and mounted to the substrate, as shown in Figure 1B. In particular, if the scattered component 2x is the same size as the component 2 that should be mounted, the camera cannot identify it as the wrong component, making it difficult to prevent mounting errors. Furthermore, if a scattered component 2x enters the component removal area Tp, a mounting error may occur where both component 2 and the scattered component 2x are picked up by the suction nozzle 43, and both component 2 and the scattered component 2x are mounted to the same mounting location on the substrate. In addition, when the suction nozzle 43 picks up component 2, the scattered component 2x may interfere, causing the suction position of component 2 to shift, resulting in a mounting error where component 2 is mounted in a position shifted from its intended mounting location.

[0018] Patent Document 1 discloses a component mounting device that, when an abnormality is detected in a predetermined supply device, monitors not only the predetermined supply device but also other adjacent supply devices. This component mounting device can suppress the occurrence of mounting errors. However, if only adjacent supply devices are monitored, mounting errors may occur when removing components from supply devices located at a distance.

[0019] Therefore, in order to suppress the occurrence of mounting errors as described above, the component mounting apparatus, etc. of this disclosure has the following configuration.

[0020] The embodiments will be described in detail below with reference to the drawings. The embodiments described below are all general or specific examples. The numerical values, shapes, materials, components, arrangement and connection configurations of components, steps, and the order of steps shown in the embodiments below are examples and are not intended to limit the disclosure. Furthermore, components in the embodiments below that are not described in the independent claim representing the highest-level concept will be described as optional components. Also, the figures are schematic diagrams and not necessarily strictly accurate. In each figure, the same components are denoted by the same reference numerals.

[0021] (Embodiment) [Configuration of component mounting apparatus and component mounting system] The configuration of the component mounting apparatus and component mounting system according to the embodiment will be described with reference to Figures 2 to 10.

[0022] Figure 2 is a schematic diagram of a component mounting system comprising a component mounting device and a server device according to an embodiment. Figure 3 is a block diagram showing the functional configuration of the component mounting system according to an embodiment. In addition to the component mounting device 10, Figure 2 also shows a printing device 6 for printing conductive paste onto a substrate 80, and an inspection device 7 for inspecting the substrate 80 on which the components 2 are mounted.

[0023] As shown in Figures 2 and 3, the component mounting system 1 comprises a plurality of component mounting devices 10 and a server device 90. The plurality of component mounting devices 10 and the server device 90 are installed, for example, on the premises of a factory, which is a production site, and are able to communicate with each other via a communication network 9.

[0024] The server device 90 is a device that manages the production of component-mounted circuit boards. In this embodiment, the configuration of the component mounting device 10 will be described in detail.

[0025] The component mounting device 10 is a device for mounting components 2 onto a substrate 80. The components 2 are surface-mount type electronic components, such as rectangular parallelepiped chip components and components with lead terminals.

[0026] As shown in Figure 3, the component mounting device 10 includes an error detection unit 11, an imaging unit 12, an inspection unit 13, a control unit 15, a storage unit 16, an input unit 17, a display unit 18, and a mounting communication unit 19. The mounting communication unit 19 is a communication module and can communicate with a server device 90 via a communication network 9.

[0027] Furthermore, the component mounting apparatus 10 includes a substrate transport unit 20 for transporting the substrate 80, a component mounting unit 40 for mounting components 2 onto the substrate 80, and a component supply unit 30 for supplying components 2 to the component mounting unit 40.

[0028] Figure 4 is a top view of a component mounting apparatus according to an embodiment. Figure 5 is a side view of a part of the component mounting apparatus according to an embodiment.

[0029] The substrate transport unit 20 shown in Figures 4 and 5 transports and positions the substrate 80 placed on the carrier 85 by transporting and positioning the carrier 85. The carrier 85 is a flat transport jig made of, for example, a metal material.

[0030] The substrate 80 is either a plate-shaped printed circuit board or a film-shaped flexible circuit board. The substrate 80 is attached to the carrier 85 by adhesive tape or the like and supported by the carrier 85. Alternatively, the substrate 80 may be supported by a clamping member on the carrier 85.

[0031] The parts supply unit 30 is equipped with multiple supply devices 31 corresponding to each of the multiple types of parts 2 in order to supply multiple types of parts 2. The supply devices 31 are at least one of a tape feeder 31a, a tray feeder 31b, and a bulk feeder. The tape feeder 31a supplies parts 2 contained on a tape 32 to the parts mounting unit 40. The tray feeder 31b supplies parts 2 contained on a tray 33 to the parts mounting unit 40. The bulk feeder supplies parts 2 contained in a bulk case to the parts mounting unit 40.

[0032] The supply device 31 transports the components 2 from the component packaging material, such as the tape 32 wound on the reel, the tray 33, or the bulk case, toward the substrate transport unit 20. The supply device 31 is provided with a component removal area Tp, which is an area for removing the components 2.

[0033] Figure 6 is a top view of the component removal area of ​​a component mounting device.

[0034] The component removal area Tp is located near the downstream end in the direction in which the component 2 is transported from the component packaging material toward the substrate transport unit 20 (hereinafter referred to as the component transport direction dp). The component removal area Tp is approximately the same as the imaging area of ​​the imaging camera 46, which will be described later, and is set to include at least one component 2. In this example, the component removal area Tp is rectangular, but is not limited to that and may be circular. The component removal area Tp may be the same size as the opening 35a of the guide member 35, which will be described later, or it may be wider than the opening 35a.

[0035] Figure 6 shows an example where the supply device 31 is a tape feeder 31a. In the parts retrieval area Tp, there are parts 2 supplied by the movement of the tape 32. The parts 2 are stored in a concave storage section 32a provided in the tape 32. In the parts retrieval area Tp, the tape 32 has its cover film removed. The position of the tape 32 in the thickness and width directions is restricted by a guide member 35 of the supply device 31, and its position in the longitudinal direction, which is the parts transport direction dp, is restricted by a feeding mechanism (not shown). The guide member 35 is provided with a window-shaped opening 35a, and the parts 2 stored in the storage section 32a are retrieved from the opening 35a using a suction nozzle 43 or the like.

[0036] The component mounting unit 40 takes each component 2 supplied by the multiple supply devices 31 from the respective component removal area Tp of the multiple supply devices 31 and mounts it onto the substrate 80. The component mounting unit 40 is equipped with a two-axis table 41, a mounting head 42, a suction nozzle 43, and the like.

[0037] The two-axis table 41 is a moving mechanism that moves the mounting head 42 in the horizontal direction. The mounting head 42 is a moving mechanism that moves the suction nozzles 43 in the vertical direction. Multiple suction nozzles 43 are arranged on the mounting head 42. The suction nozzles 43 can move vertically by a drive motor provided on the mounting head 42 and can also rotate about a vertical axis. The suction nozzles 43 hold the component 2 by suction when the vacuum valve provided on the mounting head 42 is turned on, and release the component 2 when the suction is released. In this way, the component mounting unit 40 takes the component 2 supplied by the supply device 31 and mounts it on the substrate 80.

[0038] The error detection unit 11 detects a misapplied component 2. In this embodiment, the error detection unit 11 detects errors that occur between the time the component 2 is removed from the component removal area Tp using the component mounting unit 40 and when it is mounted on the substrate 80. For example, the error detection unit 11 detects errors using at least one of the flow sensor 48 and the component recognition camera 47.

[0039] The error detection unit 11 measures the airflow rate in the flow path connected to the suction nozzle 43 using a flow sensor 48 and detects whether or not the part 2 is being adsorbed by the suction nozzle 43. For example, if the airflow rate is higher than a predetermined value at the timing when the part 2 should be adsorbed, it is determined that the part 2 is not being adsorbed by the suction nozzle 43. The error detection unit 11 is not limited to the flow sensor 48; it may also use a pressure sensor that measures the vacuum pressure in the flow path to detect whether or not the part 2 is being adsorbed by the suction nozzle 43. In this case, if the vacuum pressure in the flow path is lower than a predetermined value (or the absolute pressure is higher than a predetermined value) at the timing when the part 2 should be adsorbed, it is determined that the part 2 is not being adsorbed by the suction nozzle 43.

[0040] Furthermore, the error detection unit 11 captures an image of the suction nozzle 43 using the component recognition camera 47, thereby detecting whether or not the component 2 is suction-held by the suction nozzle 43. The component recognition camera 47 is disposed between the component supply unit 30 and the substrate conveyance unit 20, and captures an image of the suction nozzle 43 moving from the component supply unit 30 to the substrate conveyance unit 20 from below, thereby detecting whether or not the component 2 is suction-held by the suction nozzle 43. Note that the component recognition camera 47 can also detect the position and posture of the component 2 suction-held by the suction nozzle 43.

[0041] The error detection unit 11 outputs detection information obtained by the flow sensor 48 and the component recognition camera 47 to the control unit 15.

[0042] The imaging unit 12 images the component pick-up area Tp of the supply device 31 using an imaging camera 46 attached to the mounting head 42. The mounting head 42 moves to the component pick-up area Tp of the supply device 31 where the next component 2 to be mounted on a substrate 80 is supplied, in order to pick up said next component 2. The imaging camera 46 moves onto the component pick-up area Tp of the supply device 31 along with the movement of the mounting head 42, and images the arrangement state and the like of components in the component pick-up area Tp. Note that the imaging camera 46 may image the component pick-up area Tp when passing through the component pick-up area Tp, and image the arrangement state and the like of components in the component pick-up area Tp.

[0043] The imaging camera 46 is also used to capture images of identification marks on the substrate 80 or a carrier 85, and is also used to capture images of the mounting state of the component 2 mounted on the substrate 80. The imaging unit 12 outputs an image obtained by imaging to the inspection unit 13 and the control unit 15.

[0044] The inspection unit 13 inspects the arrangement state of components on the basis of the image obtained by the imaging camera 46.

[0045] FIG. 7A is a diagram showing a case where the arrangement state of components in the component pick-up area is normal. FIG. 7B is a diagram showing an example of a case where the arrangement state of components in the component pick-up area is not normal.

[0046] 7A and 7B show a plurality of storage portions 32a for storing components 2, and a plurality of feed holes 32b for feeding out a tape 32 using a feed mechanism.

[0047] Of the two storage portions 32a shown in Fig. 7A, the storage portion 32a positioned on the upstream side in the component conveyance direction dp shows a state where the component 2 is stored, and the storage portion 32a positioned on the downstream side in the component conveyance direction dp shows an empty state after the component 2 has been picked out. Fig. 7B shows a state where the component 2 that should originally be picked out is stored in the storage portion 32a, and two scattered components 2x different from the component 2 are mixed into the component pick-out region Tp.

[0048] The inspection unit 13 inspects the arrangement state of components based on the image of the component pick-out region Tp and the component supply information 16a stored in the storage unit 16. For example, the inspection unit 13 inspects whether or not a plurality of components are present in the component pick-out region Tp, whether or not the scattered component 2x is present in the component pick-out region Tp, and whether or not the component 2 to be picked out is properly stored in the storage portion 32a.

[0049] Fig. 8 is a diagram showing an example of component supply information stored in a storage unit of a component mounting apparatus.

[0050] The component supply information 16a includes identification information and specification information of the component 2, identification information of a component packaging material that accommodates a plurality of components 2, identification information of a supply device 31, and image information of the component pick-out region Tp.

[0051] The specification information of the component 2 includes information related to the shape and size of the component 2. The identification information of the component packaging material includes identification information of the tape 32, the tray 33, the bulk case and the like that accommodate the components 2. The identification information of the supply device 31 includes identification information of the tape feeder 31a, the tray feeder 31b, the bulk feeder and the like. The image information of the component pick-out region Tp includes image information when the arrangement state of components in the component pick-out region Tp is normal. The image information of the component pick-out region Tp may include information related to imaging conditions when the imaging camera 46 images the component pick-out region Tp.

[0052] The identification information and specification information of part 2, the identification information of the part packaging material, the identification information of the supply device 31, and the image information of the part removal area Tp are stored in the storage unit 16 in a linked state.

[0053] The inspection unit 13 compares the image of the component extraction area Tp obtained by the imaging unit 12 with the image information of the component extraction area Tp stored in the storage unit 16 to check whether the arrangement of the components is normal or not. The inspection unit 13 outputs the inspection result from the inspection unit 13 to the control unit 15.

[0054] The control unit 15 is a computing device equipped with CPU functionality, which accesses the storage unit 16 and controls the error detection unit 11, the imaging unit 12, and the inspection unit 13 based on the programs and data stored in the storage unit 16.

[0055] The memory unit 16 stores the aforementioned component supply information 16a and the mounting data 16b, which is data for mounting the component 2 onto the circuit board 80. The component supply information 16a and the mounting data 16b are input by the user interface, the input unit 17, or the server device 90, and stored in the memory unit 16.

[0056] Figure 9 shows an example of mounting data stored in the memory unit of a component mounting device.

[0057] The mounting data 16b shown in Figure 9 includes identification information for component 2, identification information for the substrate 80, and information regarding the coordinates and rotation angle of the component mounting position when mounting component 2 on the substrate 80. The mounting data 16b also includes information regarding the array number of the suction nozzle 43 that picks up component 2, the identification number of component 2, the coordinates of the component mounting position, and the number of components to be mounted. The control unit 15 mounts component 2 on the substrate 80 based on the mounting data 16b.

[0058] Furthermore, the memory unit 16 stores inspection execution information 16c indicating whether or not the inspection by the inspection unit 13 has been performed on the parts extraction area Tp.

[0059] The control unit 15 controls the substrate transport unit 20, the component supply unit 30, and the component mounting unit 40 based on information such as inspection execution information 16c and mounting data 16b acquired from the storage unit 16, information obtained from the error detection unit 11, and information obtained from the inspection unit 13.

[0060] For example, the control unit 15 acquires inspection execution information 16c stored in the storage unit 16 before the component mounting unit 40 takes out the component 2 supplied by a predetermined supply unit 31 from among the multiple supply units 31. Specifically, the control unit 15 acquires inspection execution information 16c corresponding to the component removal area Tp of the predetermined supply unit 31.

[0061] Figure 10 shows an example of inspection execution information stored in the memory unit of a component mounting device.

[0062] The inspection execution information 16c stores information indicating whether the inspection of each component extraction area Tp of the multiple supply devices 31 has been "executed" or "not yet executed". This inspection execution information 16c indicates whether or not an inspection was performed, not whether the inspection result was good or bad. Furthermore, if there is a history of errors detected by the error detection unit 11, this inspection execution information 16c does not indicate whether or not an inspection was performed before the error was detected, but rather whether or not an inspection was performed after the most recent error was detected.

[0063] If the control unit 15 confirms that an inspection of the parts removal area Tp of the predetermined supply device 31 has not been performed, it determines that there is a possibility that scattered parts 2x are present in the parts removal area Tp, and therefore causes the imaging unit 12 to image the parts removal area Tp of the predetermined supply device 31.

[0064] The imaging unit 12 images a predetermined parts extraction area Tp of the supply device 31 and outputs the image of the parts extraction area Tp to the inspection unit 13. The inspection unit 13 inspects the arrangement of parts in the parts extraction area Tp based on the image obtained by the imaging unit 12.

[0065] The control unit 15 stops the operation of the component mounting unit 40 if the arrangement of components in the component removal area Tp is not normal. The control unit 15 then notifies the surroundings that the arrangement of components in the component removal area Tp is not normal by emitting an alarm sound or by displaying an alarm screen on the display unit 18. The control unit 15 may also display an instruction screen on the display unit 18 instructing the supply device 31 to remove the scattered components 2x from the component removal area Tp.

[0066] If the component placement in the component removal area Tp is normal, the control unit 15 operates the component mounting unit 40 as planned and removes component 2 from the component removal area Tp. By removing component 2 from the component removal area Tp in this way, mounting errors can be suppressed.

[0067] Each time the inspection unit 13 completes its inspection of the component extraction area Tp of each supply device 31, the control unit 15 changes the inspection execution information 16c of the supply device 31 that has been inspected to "completed" and stores it in the storage unit 16. The control unit 15 continues to change the inspection execution information 16c of the supply device 31 that has been inspected to "completed" until the error detection unit 11 detects an error, in other words, until a state occurs where the component 2 is not picked up by the suction nozzle 43.

[0068] Furthermore, if the error detection unit 11 detects an error, the control unit 15 rewrites all the inspection execution information for the multiple supply devices 31 included in the inspection execution information 16c to "not executed". For example, if the error detection unit 11 detects an error, there is a possibility that abnormalities leading to mounting errors have occurred in locations other than where the error was detected. In this example, the error detection indicates that the suction nozzle 43 has detected that the component 2 is not being picked up, and in that case, there is a possibility that an abnormality has occurred in which scattered components 2x have entered the component extraction area Tp. Therefore, the control unit 15 rewrites all the inspection execution information for the multiple supply devices 31 to "not executed" in order to restart the inspection for the multiple supply devices 31 from the beginning.

[0069] On the other hand, if the control unit 15 confirms that an inspection of the component removal area Tp of the predetermined supply device 31 has already been performed, there is no need to perform another inspection of the component removal area Tp. Therefore, the control unit 15 does not allow the imaging unit 12 to image the component removal area Tp, and instead allows the component mounting unit 40 to remove the component 2 from the component removal area Tp.

[0070] For example, in conventional component mounting equipment, the status of adjacent supply devices is monitored by cameras, etc., each time an abnormality is detected, which leads to a decrease in production efficiency. In contrast, in the component mounting equipment 10 of this embodiment, instead of simultaneously inspecting multiple supply devices when an error is detected, the inspection of the component extraction area Tp is performed in the sequence of going to the supply device 31 to retrieve the component 2. In this way, inspection can be performed in the sequence of going to retrieve the component 2, so there is no need to stop production to inspect the supply device 31, and a decrease in production efficiency can be suppressed. In addition, there is no need to inspect the supply device 31 which is not scheduled to extract the component 2, so unnecessary inspection time can be reduced compared to conventional component mounting equipment.

[0071] The component mounting apparatus 10 of this embodiment includes: a component mounting unit 40 that removes each component 2 supplied by a plurality of supply devices 31 from each component removal area Tp of the plurality of supply devices 31 and mounts it on a substrate 80; an error detection unit 11 that detects errors that occur between the time the component 2 is removed from the component removal area Tp using the component mounting unit 40 and when it is mounted on the substrate 80; an imaging unit 12 that images the component removal area Tp; an inspection unit 13 that inspects the arrangement state of the components in the component removal area Tp based on the image obtained by the imaging unit 12; a storage unit 16 that stores inspection execution information 16c indicating whether the inspection by the inspection unit 13 on the component removal area Tp has been performed or not; and a control unit 15 that accesses the storage unit 16 and controls the component mounting unit 40, the error detection unit 11, the imaging unit 12, and the inspection unit 13.

[0072] The memory unit 16 stores inspection execution information 16c corresponding to the component removal area Tp after the error detection unit 11 detected the most recent error.

[0073] Before the component 2 supplied by a predetermined supply device 31 is removed by the component mounting unit 40, the control unit 15 acquires inspection execution information 16c stored in the storage unit 16. If it confirms that an inspection has not yet been performed on the component removal area Tp of the predetermined supply device 31, it causes the imaging unit 12 to image the component removal area Tp of the predetermined supply device 31.

[0074] In this way, when inspection of the component extraction area Tp has not yet been performed, imaging the component extraction area Tp allows us to confirm, for example, whether the arrangement of components in the component extraction area Tp that has not been inspected is normal. This allows component 2 to be extracted from the component extraction area Tp when the component arrangement is normal, thereby suppressing the occurrence of mounting errors.

[0075] [Component Mounting Method] The component mounting method according to the embodiment will be explained with reference to Figure 11.

[0076] Figure 11 is a flowchart showing a component mounting method according to an embodiment.

[0077] The component mounting device 10 moves the mounting head 42 of the component mounting section 40 to a predetermined component removal area Tp of the supply device 31 (step S10).

[0078] Next, before the component mounting device 10 removes the component 2 from the component removal area Tp of the predetermined supply device 31, it acquires inspection execution information 16c for the component removal area Tp (step S15).

[0079] The inspection execution information 16c includes information indicating whether an inspection has been performed or not for each of the component extraction areas Tp of the multiple supply devices 31. This inspection execution information 16c indicates whether an inspection was performed or not, not whether the inspection result was good or bad. Furthermore, if there is a history of errors detected by the error detection unit 11, this inspection execution information 16c does not indicate whether an inspection was performed before the error was detected, but rather whether an inspection was performed after the most recent error was detected.

[0080] Based on the inspection execution information 16c acquired in step S15, the component mounting device 10 determines whether or not an inspection has been performed on the component extraction area Tp of the predetermined supply device 31 (step S20).

[0081] If the inspection of the component extraction area Tp of the predetermined supply device 31 has been performed (Yes in S20), the component mounting device 10 proceeds to step S60 and extracts component 2 from the component extraction area Tp of the predetermined supply device 31.

[0082] On the other hand, if the inspection of the component extraction area Tp of the predetermined supply device 31 has not been performed (No in S20), the component mounting device 10 uses the imaging camera 46 to image the component extraction area Tp of the predetermined supply device 31 (step S30). After imaging is complete, the component mounting device 10 changes the inspection execution information 16c of the predetermined supply device 31 to "executed" and saves it in the storage unit 16 (step S34). Step S34 may be performed simultaneously with step S40, which will be described later.

[0083] The component mounting apparatus 10 inspects the arrangement of components in the component removal area Tp based on the image obtained by the imaging camera 46, and determines whether the arrangement of components is normal or not (step S40).

[0084] If the component placement is not normal (No in S40), the component mounting device 10 stops the operation of the component mounting section 40 (step S50). The component mounting device 10 notifies nearby workers of an alarm indicating that the component placement is not normal (step S51).

[0085] If the component placement is normal (Yes in S40), the component mounting device 10 operates the component mounting section 40 to remove component 2 from the component removal area Tp (step S60).

[0086] The component mounting device 10 detects whether an error occurred between the time the component 2 was removed from the component removal area Tp in the component mounting section 40 and when it was mounted on the substrate 80 (step S70). The component mounting device 10 uses at least one of the flow sensor 48 and the component recognition camera 47 to detect whether the component 2 is being adsorbed by the suction nozzle 43.

[0087] If no error is detected (No in S70), the component mounting device 10 mounts the component 2 onto the circuit board 80 (step S80).

[0088] If an error is detected (Yes in S70), the component mounting device 10 notifies nearby workers of an alarm indicating that the component 2 has not been picked up by the suction nozzle 43 (step S90). Also, if the component mounting device 10 detects an error in the error detection unit 11 (Yes in S70), it rewrites all of the inspection execution information for the multiple supply devices 31 included in the inspection execution information 16c of the storage unit 16 to "not executed" (step S91).

[0089] By repeatedly executing these steps S10 to S91, it is possible to suppress the occurrence of mounting errors when mounting the component 2 onto the circuit board 80.

[0090] Although the above example shows step S70 being performed before step S80, it is not limited to this. For example, the component mounting device 10 may perform the same process as step S70 again after step S80. In this case, after placing the component 2 on the substrate 80, the component mounting device 10 may use the imaging camera 46 to check whether the component 2 is properly mounted on the substrate 80, thereby detecting whether an error occurred between the time the component 2 was removed from the component removal area Tp and mounted on the substrate 80. Then, steps S80, S90, and S91 may be performed in the same manner as above.

[0091] [Modified Embodiment] A modified component mounting system 1A according to the embodiment will be described. In this modified embodiment, an example will be described in which the server device 90A inspects the placement status of the components.

[0092] Figure 12 is a block diagram showing the functional configuration of a component mounting system according to a modified example of the embodiment.

[0093] As shown in Figure 12, the component mounting system 1A comprises a plurality of component mounting devices 10A and a server device 90A. The plurality of component mounting devices 10A and the server device 90A are installed, for example, on the premises of a factory, which is a production site, and are able to communicate with each other via a communication network 9.

[0094] The server device 90A is a device that manages the production of component-mounted circuit boards. In the modified component mounting system 1A, the server device 90A inspects the placement of components.

[0095] As shown in Figure 12, the component mounting device 10A includes an error detection unit 11, an imaging unit 12, a control unit 15, a storage unit 16, an input unit 17, a display unit 18, and a mounting communication unit 19. The configurations of the error detection unit 11, imaging unit 12, control unit 15, storage unit 16, input unit 17, display unit 18, and mounting communication unit 19 are substantially the same as in the embodiment.

[0096] The component mounting apparatus 10A includes a substrate transport unit 20 for transporting the substrate 80, a component mounting unit 40 for mounting components 2 onto the substrate 80, and a component supply unit 30 for supplying components 2 to the component mounting unit 40. The configurations of the substrate transport unit 20, the component mounting unit 40, and the component supply unit 30 are the same as in the embodiment.

[0097] In the modified component mounting system 1A, the mounting communication unit 19 of the component mounting device 10A transmits the image information obtained by the imaging unit 12 to the server device 90A.

[0098] The server device 90A includes an inspection unit 93, a storage unit 96, and a server communication unit 99. The storage unit 96 stores component supply information 16a. This component supply information 16a is the same information as the component supply information 16a stored in the storage unit 16 of the embodiment.

[0099] The server communication unit 99 acquires image information transmitted from the component mounting device 10A and outputs it to the inspection unit 93.

[0100] The inspection unit 93 inspects the arrangement of components in the component removal area Tp based on the image information output from the server communication unit 99. Specifically, the inspection unit 93 compares the image of the component removal area Tp transmitted from the component mounting device 10A with the image information of the component removal area Tp stored in the storage unit 96 to check whether the arrangement of components is normal. For example, the inspection unit 13 checks whether there are multiple components in the component removal area Tp, whether there are scattered components 2x in the component removal area Tp, and whether the component 2 to be removed is properly stored in the storage unit 32a. The server device 90A transmits the inspection results performed by the inspection unit 93 to the component mounting device 10A via the server communication unit 99.

[0101] The control unit 15 of the component mounting device 10A accesses the storage unit 16 and controls the error detection unit 11, the imaging unit 12, and the like based on the programs and data stored in the storage unit 16.

[0102] The memory unit 16 stores the implementation data 16b and the inspection execution information 16c. The memory unit 16 may also store a portion of the component supply information 16a.

[0103] The control unit 15 controls the substrate transport unit 20, the component supply unit 30, and the component mounting unit 40 based on information such as inspection execution information 16c and mounting data 16b acquired from the storage unit 16, information obtained from the error detection unit 11, and information obtained from the server device 90A.

[0104] In the modified configuration, the control unit 15 also acquires inspection execution information 16c stored in the storage unit 16 before the component 2 supplied by a predetermined supply unit 31 is removed by the component mounting unit 40. Specifically, the control unit 15 acquires inspection execution information 16c corresponding to the component removal area Tp of the predetermined supply unit 31.

[0105] If the control unit 15 confirms that an inspection of the parts removal area Tp of the predetermined supply device 31 has not been performed, it determines that there is a possibility that scattered parts 2x are present in the parts removal area Tp, and therefore causes the imaging unit 12 to image the parts removal area Tp of the predetermined supply device 31.

[0106] The imaging unit 12 images a predetermined parts extraction area Tp of the supply device 31 and outputs the image of the parts extraction area Tp to the server device 90A. The inspection unit 93 of the server device 90A inspects the arrangement of parts in the parts extraction area Tp based on the image obtained by the imaging unit 12.

[0107] The control unit 15 stops the operation of the component mounting unit 40 if the arrangement of components in the component removal area Tp is not normal. On the other hand, if the arrangement of components in the component removal area Tp is normal, the control unit 15 operates the component mounting unit 40 as scheduled and removes component 2 from the component removal area Tp. Furthermore, if the control unit 15 confirms that the inspection of the component removal area Tp by the predetermined supply device 31 has been completed, it does not allow the imaging unit 12 to image the component removal area Tp and allows the component mounting unit 40 to remove component 2 from the component removal area Tp.

[0108] The modified component mounting system 1A includes a component mounting device 10A that removes a component 2 and mounts it on a substrate 80, and a server device 90A that inspects the component removal area Tp, which is the area from which the component 2 is removed by the component mounting device 10A. The component mounting device 10A includes a component mounting unit 40 that removes each component 2 supplied by a plurality of supply devices 31 from each component removal area Tp of the plurality of supply devices 31 and mounts it on a substrate 80; an error detection unit 11 that detects errors that occur between the time the component 2 is removed from the component removal area Tp using the component mounting unit 40 and mounted on the substrate 80; an imaging unit 12 that images the component removal area Tp; a mounting communication unit 19 that transmits the image obtained by the imaging unit 12 to a server device 90A; a storage unit 16 that stores inspection execution information 16c indicating whether the server device 90A's inspection of the component removal area Tp has been performed or not; and a control unit 15 that accesses the storage unit 16 and controls the component mounting unit 40, the error detection unit 11, the imaging unit 12, and the mounting communication unit 19.

[0109] The memory unit 16 stores inspection execution information 16c corresponding to the component removal area Tp after the error detection unit 11 detected the most recent error.

[0110] Before the component 2 supplied by a predetermined supply device 31 is removed by the component mounting unit 40, the control unit 15 acquires inspection execution information 16c stored in the storage unit 16. If it confirms that an inspection has not yet been performed on the component removal area Tp of the predetermined supply device 31, it causes the imaging unit 12 to image the component removal area Tp of the predetermined supply device 31.

[0111] The implementation communication unit 19 transmits the image of the component extraction area Tp obtained by the imaging unit 12 to the server device 90A.

[0112] The server device 90A inspects the arrangement of components in the component removal area Tp based on the image transmitted from the mounting communication unit 19, and transmits the inspection result to the component mounting device 10A.

[0113] The modified configuration can achieve the same effects as the embodiment. Furthermore, by performing the inspection of the component placement status on the server device 90A, the computational load on the component mounting device 10A during inspection can be reduced. In addition, if the component 2 handled by the component mounting device 10A is changed, the component supply information 16a can be easily modified.

[0114] Figure 13 is a flowchart showing the operation of a component mounting system according to a modified embodiment.

[0115] The component mounting device 10A moves the mounting head 42 of the component mounting section 40 to a predetermined component removal area Tp of the supply device 31 (step S110).

[0116] Next, before the component mounting device 10A removes the component 2 from the component removal area Tp of the predetermined supply device 31, it acquires inspection execution information 16c for the component removal area Tp (step S115).

[0117] Based on the inspection execution information 16c acquired in step S115, the component mounting device 10A determines whether or not an inspection has been performed on the component extraction area Tp of the predetermined supply device 31 (step S120).

[0118] If the inspection of the component extraction area Tp of the predetermined supply device 31 has been performed (Yes in S120), the component mounting device 10A proceeds to step S160 and extracts component 2 from the component extraction area Tp of the predetermined supply device 31.

[0119] On the other hand, if the inspection of the component extraction area Tp of the predetermined supply device 31 has not been performed (No in S120), the component mounting device 10A uses the imaging camera 46 to image the component extraction area Tp of the predetermined supply device 31 (step S130). After imaging is complete, the component mounting device 10A changes the inspection execution information 16c of the predetermined supply device 31 to "executed" and saves it in the storage unit 16 (step S134). Then the component mounting device 10A transmits the image of the component extraction area Tp obtained by the imaging unit 12 to the server device 90A (step S135).

[0120] The server device 90A inspects the arrangement of components in the component removal area Tp based on the image of the component removal area Tp transmitted from the component mounting device 10A (step S136).

[0121] The server device 90A transmits the inspection results obtained in step S140 to the component mounting device 10A (step S137). The component mounting device 10A receives the inspection results regarding the placement status of the components (step S138).

[0122] The control unit 15 of the component mounting device 10A determines whether the component placement is normal or not based on the inspection results (step S140).

[0123] If the component placement is not normal (No in S140), the component mounting device 10A stops the operation of the component mounting section 40 (step S150). The component mounting device 10A notifies nearby workers of an alarm indicating that the component placement is not normal (step S151).

[0124] If the component placement is normal (Yes in S140), the component mounting device 10A operates the component mounting section 40 to remove component 2 from the component removal area Tp (step S160).

[0125] The component mounting device 10A detects whether an error occurred between the time the component 2 was removed from the component removal area Tp in the component mounting section 40 and when it was mounted on the substrate 80 (step S170). The component mounting device 10A uses at least one of the flow sensor 48 and the component recognition camera 47 to detect whether the component 2 is being adsorbed by the suction nozzle 43.

[0126] If no error is detected (No in S170), the component mounting device 10A mounts the component 2 onto the circuit board 80 (step S180).

[0127] If an error is detected (Yes in S170), the component mounting device 10A notifies nearby workers of an alarm indicating that the component 2 has not been picked up by the suction nozzle 43 (step S190). Also, if the error detection unit 11 detects an error (Yes in S170), the component mounting device 10A rewrites all of the inspection execution information for the multiple supply devices 31 included in the inspection execution information 16c of the storage unit 16 to "not executed" (step S191).

[0128] By repeatedly executing these steps S110 to S191, it is possible to suppress the occurrence of mounting errors when mounting the component 2 onto the circuit board 80.

[0129] Although the above example shows step S170 being performed before step S180, it is not limited to this. For example, the component mounting device 10A may perform the same process as step S170 again after step S180.

[0130] (Summary) Examples of component mounting devices, etc. relating to one aspect of this disclosure are given below.

[0131] The component mounting apparatus 10 of Example 1 includes a component mounting unit 40 that removes each component 2 supplied by a plurality of supply devices 31 from each component removal area Tp of the plurality of supply devices 31 and mounts it on a substrate 80; an error detection unit 11 that detects errors that occur between the time the component 2 is removed from the component removal area Tp using the component mounting unit 40 and when it is mounted on the substrate 80; an imaging unit 12 that images the component removal area Tp; an inspection unit 13 that inspects the arrangement state of the components in the component removal area Tp based on the image obtained by the imaging unit 12; a storage unit 16 that stores inspection execution information 16c indicating whether the inspection by the inspection unit 13 for the component removal area Tp has been performed or not; and a control unit 15 that accesses the storage unit 16 and controls the component mounting unit 40, the error detection unit 11, the imaging unit 12, and the inspection unit 13. The storage unit 16 stores inspection execution information 16c corresponding to the component removal area Tp after the error detection unit 11 detected the most recent error. Before the component 2 supplied by a predetermined supply device 31 is removed by the component mounting unit 40, the control unit 15 acquires inspection execution information 16c stored in the storage unit 16. If it confirms that an inspection has not yet been performed on the component removal area Tp of the predetermined supply device 31, it causes the imaging unit 12 to image the component removal area Tp of the predetermined supply device 31.

[0132] In this way, when inspection of the component extraction area Tp has not yet been performed, imaging the component extraction area Tp allows us to confirm, for example, whether the arrangement of components in the component extraction area Tp that has not been inspected is normal. This allows component 2 to be extracted from the component extraction area Tp when the component arrangement is normal, thereby suppressing the occurrence of mounting errors.

[0133] The component mounting apparatus 10 in Example 2 is the component mounting apparatus described in Example 1, wherein the inspection unit 13 inspects the arrangement of components in the component removal area Tp based on an image obtained by the imaging unit 12 imaging the component removal area Tp of a predetermined supply device 31, and the control unit 15 may stop the operation of the component mounting unit 40 if the arrangement of components is not normal, and operate the component mounting unit 40 to remove the component 2 from the component removal area Tp if the arrangement of components is normal.

[0134] In this way, by stopping the operation of the component mounting unit 40 when the component placement is not normal, and activating the component mounting unit 40 to remove component 2 from the component removal area Tp when the component placement is normal, it is possible to suppress the occurrence of mounting errors.

[0135] The component mounting apparatus 10 in Example 3 is the component mounting apparatus described in Example 1 or 2, and the control unit 15 may, when it confirms that an inspection of the component removal area Tp of a predetermined supply device 31 has been performed, not allow the imaging unit 12 to image the component removal area Tp, and instead allow the component mounting unit 40 to remove the component from the component removal area Tp.

[0136] According to this, if inspection of the component extraction area Tp has already been performed, imaging and inspection of the component extraction area Tp can be omitted. This makes it possible to shorten the mounting time when mounting the component 2 onto the substrate 80.

[0137] The component mounting apparatus 10 in Example 4 is a component mounting apparatus described in any of Examples 1 to 3, and the control unit 15 may, when an error is detected by the error detection unit 11, rewrite all of the inspection execution information for the multiple supply devices 31 included in the inspection execution information 16c to "not executed".

[0138] For example, if the error detection unit 11 detects an error, the component 2 may not be picked up by the suction nozzle 43, and scattered components 2x may be mixed into the component removal area Tp. However, with the above configuration, the inspection of each component removal area Tp of the multiple supply devices 31 can be restarted from the beginning. This helps to suppress the occurrence of mounting errors.

[0139] The component mounting system 1A in Example 5 is a component mounting system comprising a component mounting device 10A that picks up a component 2 and mounts it on a circuit board 80, and a server device 90A that inspects the component pick-up area Tp, which is the area from which the component 2 is picked up by the component mounting device 10A. The component mounting device 10A includes a component mounting unit 40 that removes each component 2 supplied by a plurality of supply devices 31 from each component removal area Tp of the plurality of supply devices 31 and mounts it on a substrate 80; an error detection unit 11 that detects errors that occur between the time the component 2 is removed from the component removal area Tp using the component mounting unit 40 and when it is mounted on the substrate 80; an imaging unit 12 that images the component removal area Tp; a mounting communication unit 19 that transmits the image obtained by the imaging unit 12 to a server device 90A; a storage unit 16 that stores inspection execution information 16c indicating whether the server device 90A's inspection of the component removal area Tp has been performed or not; and a control unit that accesses the storage unit 16 and controls the component mounting unit 40, the error detection unit 11, the imaging unit 12, and the mounting communication unit 19. The storage unit 16 stores inspection execution information 16c corresponding to the component removal area Tp after the error detection unit 11 detected the most recent error. The control unit 15 acquires inspection execution information 16c stored in the storage unit 16 before the component 2 supplied by a predetermined supply unit 31 is removed by the component mounting unit 40. If it confirms that the inspection of the component removal area Tp of the predetermined supply unit 31 has not yet been performed, it causes the imaging unit 12 to image the component removal area Tp of the predetermined supply unit 31. The mounting communication unit 19 transmits the image of the component removal area Tp obtained by the imaging unit 12 to the server device 90A. Based on the image transmitted from the mounting communication unit 19, the server device 90A inspects the arrangement of components in the component removal area Tp and transmits the inspection result to the component mounting device 10A.

[0140] In this way, when inspection of the component extraction area Tp has not yet been performed, imaging the component extraction area Tp allows us to confirm, for example, whether the arrangement of components in the component extraction area Tp that has not been inspected is normal. This allows component 2 to be extracted from the component extraction area Tp when the component arrangement is normal, thereby suppressing the occurrence of mounting errors.

[0141] The component mounting system 1A in Example 6 is the component mounting system described in Example 5, wherein the server device 90A inspects the arrangement of components in the component removal area Tp based on an image obtained by the imaging unit 12 imaging the component removal area Tp of a predetermined supply device 31, and the control unit 15 may stop the operation of the component mounting unit 40 if the arrangement of components is not normal, and operate the component mounting unit 40 to remove the component 2 from the component removal area Tp if the arrangement of components is normal.

[0142] In this way, by stopping the operation of the component mounting unit 40 when the component placement is not normal, and activating the component mounting unit 40 to remove component 2 from the component removal area Tp when the component placement is normal, it is possible to suppress the occurrence of mounting errors.

[0143] The component mounting system 1A in Example 7 is the component mounting system described in Example 5 or 6, and the control unit 15 may, when it confirms that an inspection of the component removal area Tp of a predetermined supply device 31 has been performed, not allow the imaging unit 12 to image the component removal area Tp, and allow the component mounting unit 40 to remove the component 2 from the component removal area Tp.

[0144] In this way, if the component removal area Tp has already been inspected, the imaging and inspection of the component removal area Tp can be omitted, thereby shortening the mounting time when mounting the component 2 onto the substrate 80.

[0145] The component mounting system 1A in Example 8 is a component mounting system described in any of Examples 5 to 7, and the control unit 15 may, after detecting an error in the error detection unit 11, rewrite all information regarding whether or not an inspection is performed in the inspection execution information 16c of the storage unit 16 to not performed.

[0146] For example, if the error detection unit 11 detects an error, the component 2 may not be picked up by the suction nozzle 43, and scattered components 2x may be mixed into the component removal area Tp. However, with the above configuration, the inspection of each component removal area Tp of the multiple supply devices 31 can be restarted from the beginning. This helps to suppress the occurrence of mounting errors.

[0147] The component mounting method of Example 9 includes a mounting step of taking each component 2 supplied by multiple supply devices 31 from each component removal area Tp of the multiple supply devices 31 and mounting it on a substrate 80; an error detection step of detecting errors that occurred between the time the component 2 was taken out of the component removal area Tp in the mounting step and mounted on the substrate 80; an imaging step of imaging the component removal area Tp; an inspection step of inspecting the arrangement state of the component 2 in the component removal area Tp based on the image obtained in the imaging step; and the component removal of each of the multiple supply devices 31. The process includes a step of saving inspection execution information 16c that indicates whether an inspection has been performed on area Tp or not, and which corresponds to the part removal area Tp after the most recent error was detected in the error detection step. The process involves acquiring inspection execution information 16c before removing the part 2 supplied by a predetermined supply device 31 from among a plurality of supply devices 31 in the mounting step, and if it is confirmed that an inspection has not been performed on the part removal area Tp of the predetermined supply device 31, the part removal area Tp of the predetermined supply device 31 is imaged in the imaging step.

[0148] In this way, when inspection of the component extraction area Tp has not yet been performed, imaging the component extraction area Tp allows us to confirm, for example, whether the arrangement of components in the component extraction area Tp that has not been inspected is normal. This allows component 2 to be extracted from the component extraction area Tp when the component arrangement is normal, thereby suppressing the occurrence of mounting errors.

[0149] (Other Embodiments) Although one or more embodiments of component mounting devices, component mounting systems, etc. have been described above based on embodiments, this disclosure is not limited to these embodiments. Various modifications to the embodiments that a person skilled in the art can conceive of may also be included within the scope of this disclosure, as long as they do not depart from the spirit of this disclosure.

[0150] In the embodiments described above, each component may be implemented by dedicated hardware or by executing a software program suitable for each component. Each component may also be implemented by a program execution unit such as a CPU (Central Processing Unit) or processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory. Here, the software that implements the apparatus of the embodiments described above is a program that causes a computer to execute each step included in the flowchart.

[0151] This disclosure can be used as a component mounting device, etc., that can suppress the occurrence of mounting errors.

[0152] 1, 1A Component mounting system 2 Components 2x Scattered components 6 Printing device 7 Inspection device 9 Communication network 10 Component mounting device 11 Error detection unit 12 Imaging unit 13 Inspection unit 15 Control unit 16 Storage unit 16a Component supply information 16b Mounting data 16c Inspection execution information 17 Input unit 18 Display unit 19 Mounting communication unit 20 Substrate transport unit 30 Component supply unit 31 Supply device 31a Tape feeder 31b Tray feeder 32 Tape 32a Storage unit 32b Feed hole 33 Tray 35 Guide member 35a Opening 40 Component mounting unit 41 Two-axis table 42 Mounting head 43 Suction nozzle 46 Imaging camera 47 Component recognition camera 48 Flow sensor 80 Substrate 85 Carrier 90, 90A Server device 93 Inspection unit 96 Storage unit 99 Server communication unit dp Component transport direction Tp Component extraction area

Claims

1. The system comprises: a component mounting unit that removes components supplied by multiple supply devices from the component removal areas of each of the multiple supply devices and mounts them onto a circuit board; an error detection unit that detects errors that occur between the time the component is removed from the component removal area using the component mounting unit and the time it is mounted onto the circuit board; an imaging unit that images the component removal area; an inspection unit that inspects the arrangement of components in the component removal area based on the image obtained by the imaging unit; a storage unit that stores inspection execution information indicating whether the inspection by the inspection unit on the component removal area has been performed or not; and a control unit that accesses the storage unit and controls the component mounting unit, the error detection unit, the imaging unit, and the inspection unit, wherein the storage unit stores the inspection execution information corresponding to the component removal area after the error detection unit has detected the most recent error. The control unit acquires the inspection execution information stored in the storage unit before removing a component supplied by a predetermined supply unit from the plurality of supply units at the component mounting unit, and when it confirms that an inspection of the component removal area of ​​the predetermined supply unit has not yet been performed, it causes the imaging unit to image the component removal area of ​​the predetermined supply unit.

2. The component mounting apparatus according to claim 1, wherein the inspection unit inspects the arrangement of components in the component removal area of ​​the predetermined supply device based on an image obtained by the imaging unit imaging the component removal area of ​​the predetermined supply device, and the control unit stops the operation of the component mounting unit if the arrangement of components is not normal, and operates the component mounting unit to remove the components from the component removal area if the arrangement of components is normal.

3. The component mounting apparatus according to claim 1, wherein, when the control unit confirms that an inspection of the component removal area of ​​the predetermined supply device has been performed, the imaging unit does not cause the component removal area to image, and the component mounting unit removes the component from the component removal area.

4. The component mounting apparatus according to any one of claims 1 to 3, wherein the control unit, when it detects the error, rewrites all of the inspection execution information for the plurality of supply devices included in the inspection execution information to "not executed".

5. A component mounting system comprising: a component mounting device for removing components and mounting them on a circuit board; and a server device for inspecting a component removal area, which is the area from which the component mounting device removes the components, wherein the component mounting device comprises: a component mounting unit for removing each component supplied by a plurality of supply devices from the respective component removal areas of the plurality of supply devices and mounting them on the circuit board; an error detection unit for detecting errors that occur between the time the component is removed from the component removal area using the component mounting unit and the time it is mounted on the circuit board; an imaging unit for imaging the component removal area; a mounting communication unit for transmitting the image obtained by the imaging unit to the server device; a storage unit for storing inspection execution information indicating whether the server device's inspection of the component removal area has been performed or not; and a control unit for accessing the storage unit and controlling the component mounting unit, the error detection unit, the imaging unit, and the mounting communication unit, wherein the storage unit stores the inspection execution information corresponding to the component removal area after the error detection unit has detected the most recent error. The component mounting system comprises the following functions: The control unit acquires the inspection execution information stored in the storage unit before removing a component supplied by a predetermined supply unit from among the plurality of supply units at the component mounting unit, and, upon confirming that an inspection of the component removal area of ​​the predetermined supply unit has not yet been performed, causes the imaging unit to image the component removal area of ​​the predetermined supply unit; the mounting communication unit transmits the image of the component removal area obtained by the imaging unit to the server unit; and the server unit inspects the arrangement of components in the component removal area based on the image transmitted from the mounting communication unit and transmits the inspection result to the component mounting unit.

6. The component mounting system according to claim 5, wherein the server device inspects the arrangement of components in the component removal area based on an image obtained by the imaging unit imaging the component removal area of ​​the predetermined supply device, and the control unit stops the operation of the component mounting unit if the arrangement of components is not normal, and operates the component mounting unit to remove the components from the component removal area if the arrangement of components is normal.

7. The component mounting system according to claim 5, wherein the control unit, upon confirming that an inspection of the component removal area of ​​the predetermined supply device has been performed, does not allow the imaging unit to image the component removal area, and causes the component mounting unit to remove the component from the component removal area.

8. The component mounting system according to any one of claims 5 to 7, wherein the control unit, after detecting the error in the error detection unit, rewrites all information regarding whether or not an inspection has been performed in the inspection execution information of the storage unit to "not performed".

9. A component mounting method comprising: a mounting step of removing each component supplied by a plurality of supply devices from the respective component removal area of ​​the plurality of supply devices and mounting them on a substrate; an error detection step of detecting errors that occurred between the time the component was removed from the component removal area in the mounting step and the time it was mounted on the substrate; an imaging step of imaging the component removal area; an inspection step of inspecting the arrangement of components in the component removal area based on the image obtained in the imaging step; and an inspection execution information indicating whether the inspection of the component removal area of ​​each of the plurality of supply devices has been performed or not, wherein the inspection execution information corresponding to the component removal area after the most recent error was detected in the error detection step is stored; wherein the inspection execution information is acquired before removing a component supplied by a predetermined supply device among the plurality of supply devices in the mounting step, and if it is confirmed that the inspection of the component removal area of ​​the predetermined supply device has not been performed, the imaging step is used to image the component removal area of ​​the predetermined supply device.

Images