Semiconductor manufacturing device, application device, application method, and method for manufacturing semiconductor device

Abstract

The present invention provides a technology with which optimum application conditions can be obtained.　Provided is a semiconductor manufacturing device comprising: a syringe that discharges a paste serving as a bonding material and applies the paste to a substrate; an imaging device that images the paste applied to the substrate; and a control device that performs image processing on image data of the paste imaged by the imaging device. The control device is configured to: register in advance a normal application area (pre-registered area) of the paste in a region to be inspected; calculate and store an application area (area to be inspected) in the region to be inspected of the paste applied during production; set an upper limit area and a lower limit area on the basis of a threshold indicating a ratio with respect to the pre-registered area; and determine whether or not it is necessary to correct a discharge pressure of the paste on the basis of a comparison between the area to be inspected and the upper limit area and the lower limit area.

Description

Semiconductor manufacturing apparatus, coating apparatus, coating method and method for manufacturing semiconductor device

[0001] The present disclosure relates to a semiconductor manufacturing apparatus, and is applicable to, for example, a die bonder having a function of coating a paste adhesive.

[0002] As one step in the manufacturing process of a semiconductor device, a picked-up die is bonded to a substrate with a paste adhesive. It may be determined whether the state of the applied paste adhesive is normal or abnormal (for example, Japanese Patent Laid-Open No. 2023-42715).

[0003] Japanese Patent Laid-Open No. 2023-42715

[0004] An object of the present disclosure is to provide a technique capable of obtaining optimal coating conditions. Other objects and novel features will become apparent from the description of the present specification and the accompanying drawings.

[0005] A brief outline of a typical one of the present disclosure is as follows. That is, the semiconductor manufacturing apparatus includes: a syringe that discharges a paste as a bonding material and coats the paste onto a substrate; an imaging device that images the paste coated on the substrate; and a control device that performs image processing on image data of the paste captured by the imaging device. The control device registers in advance a normal coating area (pre-registered area) of the paste in an inspection target area, calculates and stores a coating area (inspected area) of the paste coated during production in the inspection target area, sets an upper limit area and a lower limit area based on a threshold indicating a ratio to the pre-registered area, and is configured to determine whether correction of the discharge pressure of the paste is necessary based on a comparison between the inspected area and the upper limit area and the lower limit area.

[0006] According to the present disclosure, it is possible to obtain optimal coating conditions.

[0007] Figure 1 is a top view showing a schematic of the die bonder in the embodiment. Figure 2 is a diagram illustrating the schematic configuration when viewed from the direction of arrow A in Figure 1. Figure 3 is a side view showing a schematic of the preform section shown in Figure 1. Figure 4 is a flowchart illustrating a method for manufacturing a semiconductor device using the die bonder shown in Figure 1. Figure 5 is a flowchart illustrating the correction of the discharge pressure of paste-like adhesive for a single inspection target area in the embodiment. Figure 6 is a diagram showing an image obtained by binarizing an image taken immediately after applying paste-like adhesive to the package area of ​​a substrate, and an example of the inspection area. Figure 7 is a table illustrating the correction direction of the discharge pressure of paste-like adhesive with respect to the area of ​​the inspection target area in Figure 6. Figure 8 is a diagram showing the relationship between discharge pressure and application area for correcting the discharge pressure of paste-like adhesive in the embodiment. Figure 9 is a table illustrating an example of a recipe for setting the correction of the discharge pressure of paste-like adhesive during continuous operation and single-acting operation of the device in the embodiment. Figure 10 is a diagram illustrating the work flow when changing the recipe in the embodiment. Figure 11 is a flowchart illustrating the correction of the discharge pressure of paste-like adhesive for multiple inspection target areas in the embodiment. Figure 12(a) is a diagram illustrating a first example of the area of ​​each inspection target region of the paste-type adhesive in the embodiment. Figure 12(b) is a diagram illustrating a second example of the area of ​​each inspection target region of the paste-type adhesive in the embodiment. Figure 13 is a table illustrating an example of the correction direction of the discharge pressure of the paste-type adhesive in Figures 12(a) and 12(b).

[0008] The embodiments will be described below with reference to the drawings. However, in the following description, the same reference numerals will be used for the same components, and repeated explanations may be omitted. In addition, the drawings may be schematically represented in terms of the width, thickness, shape, etc. of each part, rather than in the actual embodiment, in order to make the explanation clearer, but these are merely examples and do not limit the interpretation of this disclosure.

[0009] The configuration of a die bonder as one embodiment of a semiconductor manufacturing apparatus will be described using Figures 1, 2, and 3. Figure 1 is a schematic top view of the die bonder in the embodiment. Figure 2 is a diagram illustrating the schematic configuration as seen from the direction of arrow A in Figure 1. Figure 3 is a schematic side view of the preform section shown in Figure 1.

[0010] The die bonder 1 is broadly composed of a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a preform unit 90, a bonding unit 40, a transport unit 50, a substrate supply unit 60, a substrate unloading unit 70, and a control unit (control device, controller) 80. The Y2-Y1 direction is the front-to-back direction of the die bonder 1, the X2-X1 direction is the left-to-right direction, and the Z1-Z2 direction is the up-and-down direction. The wafer supply unit 10 is located on the front side of the die bonder 1, and the bonding unit 40 is located on the rear side.

[0011] The wafer supply unit 10 includes a wafer cassette lifter 11, a wafer holding base 12, and a peeling unit 13.

[0012] The wafer cassette lifter 11 moves a wafer cassette (not shown) containing multiple wafer rings WR up and down to the wafer transport height. The wafer rings WR supplied from the wafer cassette lifter 11 are aligned by a wafer correction chute (not shown). A wafer extractor (not shown) removes the wafer rings WR from the wafer cassette and supplies them to the wafer holder 12, or removes them from the wafer holder 12 and stores them in the wafer cassette.

[0013] A wafer W is bonded (attached) to a dicing tape DT, and the wafer W is divided into multiple dies D. The dicing tape DT is held in a wafer ring WR. The wafer W is, for example, a semiconductor wafer or a glass wafer, and the dies D are semiconductor chips, glass chips, or MEMS (Micro Electro Mechanical Systems).

[0014] The wafer holder 12 moves in the X1-X2 and Y1-Y2 directions by an XY table and drive unit (not shown) to move the die D to be picked up to the position of the peeling unit 13. The wafer holder 12 rotates the wafer ring WR in the XY plane by a drive unit (not shown). The peeling unit 13 moves in the Z1-Z2 direction by a drive unit (not shown). The peeling unit 13 peels the die D from the dicing tape DT.

[0015] The pickup unit 20 includes a pickup head 21 and a pickup head table 23. The pickup head 21 is provided with a collet 22 that adsorbs and holds the detached die D at its tip. The pickup head 21 picks up the die D from the wafer supply unit 10 and places it on the intermediate stage 31. The pickup head table 23 moves the pickup head 21 in the Z1-Z2 direction, Y1-Y2 direction, and X1-X2 direction. The pickup head table 23 may also rotate the pickup head 21. The wafer recognition camera 24 grasps the pickup position of the die D to be picked up from the wafer W and performs surface inspection of the die D.

[0016] The intermediate stage section 30 includes an intermediate stage 31 on which the die D is placed, and a stage recognition camera 34 for recognizing the die D on the intermediate stage 31. The intermediate stage 31 is equipped with suction holes (not shown) for attracting the placed die D. The placed die D is temporarily held on the intermediate stage 31.

[0017] The preform unit 90 includes a preform head 91, a drive unit 93, a preform camera 94 as an imaging device, and a preform stage 96. The preform head 91 is composed of a syringe 92 having a nozzle. The syringe 92 is filled with a paste-like bonding material (for example, a paste-like adhesive) (hereinafter simply referred to as "paste"), and the paste is discharged from the nozzle. The preform head 91 applies the paste to the substrate S that has been transported to the preform stage 96 by the transport unit 50. The drive unit 93 moves the preform head 91 in the X1-X2 direction, Y1-Y2 direction, and Z1-Z2 direction. The substrate S is, for example, a wiring board, a lead frame formed from a thin metal plate, a glass substrate, etc.

[0018] The preform camera 94 uses the preform head 91 to identify the surface to which the paste should be applied and to determine the application position. The preform stage 96 rises when applying the paste to the substrate S, supporting the substrate S from below. The preform stage 96 has suction holes (not shown) for vacuum adsorption of the substrate S, and can fix the substrate S in place.

[0019] Furthermore, the syringe 92, preform camera 94, and control unit 80 constitute the coating apparatus. A preform stage 96 may also be included in the coating apparatus.

[0020] The bonding unit 40 includes a bond head 41, a bond head table 43, a substrate recognition camera 44, and a bond stage 46. The bond head 41 is provided with a collet 42 that adsorbs and holds the die D at its tip. The bond head table 43 moves the bond head 41 in the Z1-Z2, Y1-Y2, and X1-X2 directions. The bond head table 43 may also rotate the bond head 41. The substrate recognition camera 44 images the substrate S and recognizes the bond position. Here, the substrate S is, for example, a wiring board, a lead frame, a glass substrate, etc. The substrate S has multiple product areas (hereinafter referred to as package areas P) formed on it, which ultimately become one package. The bond stage 46 is raised when the die D is placed on the substrate S to support the substrate S from below. The bond stage 46 has a suction hole (not shown) for vacuum adsorption of the substrate S, and can fix the substrate S in place. The bond stage 46 has a heating section (not shown) for heating the substrate S.

[0021] With this configuration, the bond head 41 corrects its pickup position and orientation based on the image data from the stage recognition camera 34 and picks up the die D from the intermediate stage 31. Then, based on the image data from the substrate recognition camera 44, the bond head 41 bonds (places and adheres) the die D onto the package area P on the substrate S that is being transported, where paste has been applied.

[0022] The transport unit 50 includes transport claws 51 that grasp and transport the substrate S, and a pair of transport lanes (chutes) 52 on which the substrate S moves. The substrate S moves in the X1-X2 direction by driving nuts (not shown) of the transport claws 51, which are provided on the transport lanes 52, with ball screws (not shown) provided along the transport lanes 52. With this configuration, the substrate S moves from the substrate supply unit 60 along the transport lanes 52 to the bonding position, and after bonding, moves to the substrate discharge unit 70 and hands over the substrate S to the substrate discharge unit 70.

[0023] The substrate supply unit 60 takes the substrates S that have been stored in a transport jig (not shown) and delivered, and supplies them to the transport unit 50. The substrate discharge unit 70 stores the substrates S that have been transported by the transport unit 50 into a transport jig (not shown).

[0024] As shown in Figure 1, the control unit 80 is configured as a computer having a CPU (Central Processing Unit) 81, a storage device 82, and an input / output device 83. The control unit 80 is also called a control device or controller. The storage device 82 has a main memory 82a and an auxiliary storage device 82b. The main memory 82a is composed of RAM (Random Access Memory) which stores processing programs and the like. The auxiliary storage device 82b is composed of an HDD (Hard Disk Drive) or SSD (Solid State Drive) which stores control data and image data necessary for control. The processing program is a process recipe which describes the procedures and conditions for processing.

[0025] The input / output device 83 includes an image acquisition device 83a, a motor control device 83b, an I / O signal control device 83c, a monitor 83d, and an input device 83e. The image acquisition device 83a acquires image data from an optical system such as a substrate recognition camera 44. The motor control device 83b controls the drive units of the wafer supply unit 10, such as the XY table (not shown), the pickup head table 23, and the bond head table 43. The I / O signal control device 83c acquires signals from various sensors and outputs electrical signals to control the device. The monitor 83d displays the device status and information. The input device 83e is a pointing device such as a touch panel for inputting operator instructions, a keyboard, or a mouse for operating the monitor 83d.

[0026] A part of the semiconductor device manufacturing process using the die bonder 1 (method of manufacturing a semiconductor device) will be explained with reference to Figure 4. Figure 4 is a flowchart showing the method of manufacturing a semiconductor device using the die bonder shown in Figure 1. In the following explanation, the operation of each part constituting the die bonder 1 is controlled by the control unit 80.

[0027] (Wafer loading process: process S1) A wafer cassette containing wafer rings WR is loaded into the wafer cassette lifter 11. The wafer rings WR are supplied (loaded) from the loaded wafer cassette to the wafer holder 12.

[0028] (Substrate loading process: process S2) A transport jig (not shown) containing the substrate S is loaded into the substrate supply unit 60. In the substrate supply unit 60, the substrate S stored in the transport jig (not shown) is removed from the transport jig. It is then supplied (loaded) to the preform unit 90 via the transport unit 50.

[0029] (Pickup process: process S3) After process S1, the wafer holder 12 is moved so that the desired die D can be picked up from the dicing tape DT. The die D is imaged by the wafer recognition camera 24 and image data is acquired. By processing the image data, the amount of displacement (in the X, Y, and θ directions) of the die D on the wafer holder 12 from the die position reference point of the die bonder 1 is calculated and positioning is performed. The die position reference point is set in advance to a predetermined position on the wafer holder 12 as the initial setting of the device. By processing the image data, a surface inspection of the die D is performed.

[0030] The die D is peeled off from the dicing tape DT by the peeling unit 13 and the pickup head 21. The die D, peeled off from the dicing tape DT, is attracted and held by the collet 22 provided on the pickup head 21, and is transported to and placed on the intermediate stage 31.

[0031] The die D on the intermediate stage 31 is imaged by the stage recognition camera 34, and image data is acquired. By processing the image data, the amount of displacement (in the X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder 1 is calculated, and positioning is performed. The die position reference point is a predetermined position on the intermediate stage 31, which is held as the initial setting of the device. Surface inspection of the die D is performed by processing the image data.

[0032] The pickup head 21, which has transported die D to the intermediate stage 31, is returned to the wafer supply unit 10. Following the procedure described above, the next die D is peeled off from the dicing tape DT, and thereafter, die D is peeled off one by one from the dicing tape DT following the same procedure.

[0033] (Preform process: process S4) The preform process includes processes S41 to S43 shown in Figure 5. Details of paste application to the substrate S in this process will be described later in processes S41 to S43.

[0034] (Bonding process: process S5) If there are no problems with the coating, the substrate S is transported to the bonding stage 46 by the transport unit 50. The substrate S placed on the bonding stage 46 is imaged by the substrate recognition camera 44 and image data is acquired. By processing the image data, the amount of displacement of the substrate S from the substrate position reference point of the die bonder 1 (in the X, Y, and θ directions) is calculated. The substrate position reference point is set in advance to a predetermined position of the bonding unit 40 as the initial setting of the device.

[0035] In step S3, the suction position of the bond head 41 is corrected based on the amount of displacement of the die D on the intermediate stage 31 calculated, and the die D is picked up by the collet 42. The die D is bonded to a predetermined location on the substrate S supported by the bond stage 46 by the bond head 41, which has picked up the die D from the intermediate stage 31. The die D bonded to the substrate S is imaged by the substrate recognition camera 44, and an inspection is performed based on the image data acquired by the image to determine whether the die D has been bonded to the desired position.

[0036] The bond head 41, which has bonded die D to substrate S, is returned to the intermediate stage 31. Following the procedure described above, the next die D is picked up from the intermediate stage 31 and bonded to substrate S. This is repeated until die D is bonded to all package areas P of substrate S.

[0037] (Substrate unloading process: process S6) The substrate S to which the die D has been bonded is transported from the bonding section 40 to the substrate unloading section 70 by the transport section 50. In the substrate unloading section 70, the substrate S is removed and stored in a transport jig (not shown) and the substrate S is unloaded. The transport jig (not shown) containing the substrate S is unloaded from the die bonder 1.

[0038] As described above, die D is mounted on substrate S and discharged from die bonder 1. Subsequently, for example, the transport jig containing the substrate S on which die D is mounted is transported to the wire bonding process, where the electrodes of die D are electrically connected to the electrodes of substrate S via Au wire or the like. Then, substrate S is transported to the molding process, where die D and Au wire are sealed with molding resin (not shown) to complete the semiconductor package.

[0039] Next, a method for applying paste to the preform section 90, which corrects the amount of paste applied relative to the area of ​​the inspection target based on the results of the visual inspection, will be described. Figure 5 is a flowchart illustrating the correction of the paste discharge pressure for one inspection target area in the embodiment. Figure 6 shows an image obtained by binarizing an image taken immediately after applying paste to the package area of ​​the substrate, and an example of the inspection area. Figure 7 is a table illustrating the correction direction of the paste discharge pressure relative to the area of ​​the inspection target area in Figure 6.

[0040] This section describes the process of setting the normal coating area (pre-registered area) in the inspection target area before production begins, and setting the upper limit area (ULA) and lower limit area (LLA) for this pre-registered area using thresholds. Furthermore, it describes the processes of determining the coating area (area to be inspected) of the paste applied during production within the inspection target area, determining whether this area to be inspected is within the range of ULA and LLA, and correcting the discharge pressure. The calculation of the area to be inspected is performed by image processing in the control unit 80, and the unit of area is pixels.

[0041] (Pre-registration area registration step: Step S101) In order to allow the control unit 80 to determine whether paste is discharged at an appropriate discharge pressure during production based on the inspected area, an operator, at or before the start of production (continuous operation), registers a pre-registered area, which is input via the input device 83e on the monitor 83d, in the storage device 82.

[0042] (Threshold setting step: Step S102) In order to allow the control unit 80 to determine whether the inspected area of the paste applied during production falls within an allowable range with respect to the pre-registered area, the control unit 80 registers a threshold representing a ratio (percentage) relative to the pre-registered area in the storage device 82.

[0043] This threshold does not depend on the position or size of the inspection target area, nor the size of the pre-registered area. Since this threshold is a ratio relative to the pre-registered area, ULA and LLA do not become fixed values, and can be used for inspection target areas of various sizes.

[0044] For example, when 10% of the pre-registered area is set as the threshold, ULA is pre-registered area × (100+10)%, and LLA is pre-registered area × (100-10)%. A comparison and determination step described later determines whether the inspected area of the inspection target area falls within the range between ULA and LLA. This threshold can be set by the operator, for example, with reference to past data on variations in applied area. In other words, ULA and LLA for the pre-registered area in the inspection target area can be calculated and set based on empirical rules.

[0045] (Inspection target area and size setting step: Step S103) The control unit 80 registers, in the storage device 82, the position and size of the inspection target area input by the operator via the input device 83e on the monitor 83d at the start of production.

[0046] (Positioning step: Step S41) The substrate S is conveyed to the preform stage 96 by the conveying unit 50. The surface of the substrate S before application is imaged by the preform camera 94, the application surface is confirmed based on the image data acquired by the imaging, and the position where paste is to be applied is grasped. If there is no problem on the surface to be applied, the position where paste is to be applied on the substrate S supported by the preform stage 96 is confirmed and positioned.

[0047] (Paste coating step: step S42) By the control unit 80, paste is coated from a syringe 92 onto a coating surface of a package area P at a discharge pressure according to a predetermined recipe. When the paste is coated onto a substrate S, the paste is filled in the syringe 92, and a pressurized gas such as air is supplied from an upper portion of the syringe 92 for a certain period of time from an air pulse type dispenser or the like. During coating, with the nozzle brought close to the substrate S, the control unit 80 causes the syringe 92 to perform one-stroke two-dimensional scanning (drawing operation) within the XY plane (generally starting from the center and returning to the center).

[0048] (Appearance inspection step: step S43) (Imaging step: step S431) The coated paste is imaged by a preform camera 94. Based on an image obtained by imaging, whether the paste is coated accurately is confirmed, and inspection (appearance inspection) of the coated paste is performed. That is, in the appearance inspection, it is confirmed whether the coated paste is applied in a predetermined shape and a predetermined amount at a predetermined position on the substrate S. The inspection contents include, for example, the presence / absence of paste, coating area, and coating shape (excess / deficiency, bleeding), etc. The discharge pressure of the paste is corrected based on the appearance inspection. Correction of the discharge pressure will be described later.

[0049] (Inspected area calculation step: step S432) Next, the control unit 80 performs binarization processing on an image captured by the preform camera 94, to obtain a binarized image as shown in FIG. 6. In a part of the appearance inspection of step S43 described above, the coating area is calculated. Here, let CP-A be the inspection target region that includes the entire coated paste PA, and CP-B be the specific inspection target region indicated by the broken line of the paste PA. The control unit 80 calculates the respective inspected areas of the paste PA included in CP-A or CP-B by image processing, and stores the calculated areas in a storage device 82. In addition, the inspected area calculated in step S432 can be checked on a monitor 83d.

[0050] Here, CP-A or CP-B can be arbitrarily set by the operator in step S103 described above, and there can be multiple CP-A units. If multiple paste PAs are applied to one package area, there will also be multiple CP-A units. Furthermore, CP-B can be arbitrarily set within the application area of ​​a single paste, rather than at a predetermined position on the paste PA.

[0051] (Correction Necessity Determination Process: Process S433) The control unit 80 compares the area to be inspected obtained in process S432 with the ULA and LLA set in process S102. As shown in Figure 7, the control unit 80 automatically determines the direction of correction based on the comparison result. For example, if the area to be inspected in CP-A exceeds the ULA (determination a), the control unit 80 adjusts the correction in process S441 in the direction of decreasing the discharge pressure for coating to the next coating area. On the other hand, if the area to be inspected falls below the LLA (determination c), the control unit 80 adjusts the correction in process S442 in the direction of increasing the discharge pressure for coating to the next coating area.

[0052] Thus, if there is only one inspection target area in a single inspection, after determining whether correction is necessary, the process returns to the positioning step of step S41, and paste application in step S42 is performed on the next inspection target area with a discharge pressure corresponding to the result of the correction determination. In other words, a determination is made as to whether correction of the discharge pressure is necessary for each inspection target area.

[0053] If the area is within the range of ULA and LLA (determination b), or if the area becomes within the range of ULA and LLA due to the discharge pressure correction in step S441 or step S442, the control unit 80 returns to step S41 without performing any correction and applies the coating to the next package area P of the substrate S.

[0054] Next, we will explain the correction of the increase or decrease in discharge pressure as described above. The correction of discharge pressure is performed based on experimental results that were conducted in advance, showing the relationship between discharge pressure and application area. Figure 8 is a diagram showing the relationship between discharge pressure and application area for correcting the discharge pressure of the paste in the embodiment.

[0055] As shown in Figure 8, the discharge pressure and the coating area are in a relationship of an approximate straight line, and are proportional as shown by the dashed line. The pre-registered area registered in step S101 follows this approximate straight line. The control unit 80 stores this data (approximate straight line) that the operator has previously entered using the input device 83e in the storage device 82. If the discharge pressure exceeds ULA, the control unit 80 corrects the discharge pressure according to this approximate straight line so that it falls below ULA. On the other hand, if the discharge pressure falls below LLA, the control unit 80 corrects the discharge pressure according to this approximate straight line so that it exceeds LLA.

[0056] By using this approximate straight line to correct the discharge pressure, it is possible to obtain a more accurate coating area.

[0057] As described above, in the embodiment described, the control unit 80 pre-sets threshold values, i.e., ULA and LLA, in the pre-registered area of ​​the inspection target area in the storage device 82 (step S102), and the method for comparing and correcting the inspection area of ​​the paste PA was explained. These ULA and LLA are set in step S102 by the calculation method described above. Furthermore, for example, the operator can arbitrarily change the threshold values, i.e., expand or contract the range of ULA and LLA, depending on the size of the bonding die or the coating shape.

[0058] Such discharge pressure correction is performed based on the approximate linear data in Figure 8, but this correction is not always performed during paste application. For example, when the die bonder 1 is performing an adjustment operation (single-acting) before production (continuous operation), no correction is generally made, and application is performed at the discharge pressure specified in the recipe. The discharge pressure correction described above is a method that is performed during continuous operation. This is because, during single-acting operation of die bonder 1, the application state of the device should be checked without any correction.

[0059] This section describes an example of the discharge recipe for continuous production and single-acting adjustment. Figure 9 is a table illustrating an example of the paste discharge pressure correction setting recipe for production and adjustment operations of the apparatus in this embodiment. In both production and adjustment operations, the discharge pressure is set to 30 kPa and the correction pressure to +2, meaning the corrected discharge pressure is 32 kPa. However, the control unit 80 has configured the recipe so that this correction is not performed during single-acting operation. In single-acting operation to adjust the apparatus, the correction is deliberately omitted in order to understand the apparatus state, such as the discharge state.

[0060] Next, we will explain whether or not correction is necessary on the monitor 83d when the substrate is changed or the discharge pressure is changed before production operation. Figure 10 is a diagram illustrating the workflow when the recipe is changed in the embodiment. Note that the screen changes for each process are controlled and displayed by the control unit 80.

[0061] (Discharge pressure change process: process S401) If the already set recipe is changed and the discharge pressure is updated before production operation, the control unit 80 displays a message to that effect and an operation continuation confirmation window on the monitor 83d to inform the operator. The operator can choose to continue operation with the changed discharge pressure or stop operation using the operation continuation confirmation window. If operation continuation is selected in the window, the control unit 80 resets (clears) the correction pressure of the discharge pressure at that time and continues operation (process S402). If operation continuation is not selected in the window, the control unit 80 stops operation (process S403). In the case of process S402, where the correction pressure is reset at that time, the process proceeds to processes S41 and S42 of the paste application process and process S432 of the inspection area calculation described above. It is then possible to correct the discharge pressure again.

[0062] Furthermore, if the operation is stopped in process S403, the control unit 80 notifies the operator by displaying a window on the monitor 83d indicating this and a window for setting the discharge pressure. The operator can choose to revert to the previously set recipe or keep the modified recipe as is. If "reset discharge pressure" is selected in the window, the control unit 80 restores the paste discharge pressure of the recipe to its original value. If "maintain discharge pressure" is selected in the window, the control unit 80 leaves the paste discharge pressure of the recipe as is. In either case, the control unit 80 does not perform continuous operation, but instead returns the monitor 83d to the main screen, allowing the operator to confirm the recipe. As described above, the necessity of performing corrections can be appropriately determined by operating the monitor 83d.

[0063] By allowing operators to make settings before the production operation, operational errors caused by recipe changes, i.e., changes in discharge pressure or correction pressure, can be prevented, improving the operability of the die bonder 1. Furthermore, if the mass-produced product itself is changed, the inspection target area, its position, and size may also change, so the risk of processing with the same discharge pressure or correction conditions can be reduced.

[0064] Furthermore, as the amount of paste remaining in the syringe 92 decreases during continuous production, the amount of paste dispensed decreases even at the same dispensing pressure, resulting in a smaller coating area. In this case as well, as described above, it is possible to achieve an appropriate coating area that exceeds the lower limit by correcting the increase in the dispensing pressure in the inspection area comparison judgment of process S433 using a threshold.

[0065] In this way, by using this embodiment, a stable coating area can be obtained that is independent of the amount of paste remaining in the syringe.

[0066] According to this embodiment, one or more of the following effects can be obtained.

[0067] Based on a threshold value for the pre-registered area, the direction of correction for the discharge pressure, which is a coating condition, can be easily determined.

[0068] The approximate linear relationship between discharge pressure and coating area allows for recalculation of the correction pressure for the coating area even when the discharge pressure is changed before production, enabling more accurate coating.

[0069] Since the operator can arbitrarily set the threshold while checking the coating surface or the condition of the device, excessive or insufficient dispensing can be prevented, thereby suppressing the occurrence of defective products.

[0070] Because operators can arbitrarily set or select recipes, including thresholds, during production and adjustment operations, flexible work becomes possible, improving the operability of the equipment.

[0071] Next, as another embodiment, a method for applying paste that corrects the discharge pressure based on the visual inspection results in multiple inspection target areas will be described.

[0072] Figure 11 is a flowchart illustrating the correction of the paste discharge pressure for multiple pastes to the inspection target areas in the embodiment. Figure 12(a) is a diagram illustrating a first example of the area in each inspection target area of ​​the paste in the embodiment. Figure 12(b) is a diagram illustrating a second example of the area in each inspection target area of ​​the paste in the embodiment. Figure 13 is a table illustrating an example of the correction direction of the paste discharge pressure in Figures 12(a) and 12(b).

[0073] From the registration of the pre-registered area in step S101 to the setting of the threshold in step S102, the process is the same as in the case of a single inspection target area as described above. Similarly, step S103 is the same as step S103 performed for a single inspection target area, although there is a difference in that multiple inspection target areas are set.

[0074] Steps S41 and S42 are performed a predetermined number of times corresponding to the inspection target areas of multiple pastes, and are the same process as steps S41 and S42 for one inspection target area. As shown in Figures 12(a) and 12(b), an inspection target area is set for each package area P. The position, number, and size of the inspection target areas within each package area P are predetermined values. As an example, Figures 12(a) and 12(b) show four inspection target areas: CP1, CP2, CP3, and CP4, and only these inspection target areas are extracted and shown. The inspection area of ​​the paste in each inspection target area is PB1, PB2, PB3, and PB4, respectively. In Figures 12(a) and 12(b), the predetermined number of times step 434 in Figure 11 is 4.

[0075] (Visual inspection: process 43a) (Imaging: process S431) In a single inspection, the inspection target area is one, and the preform camera 94 images a predetermined number of pastes that have been applied.

[0076] (Calculation of area to be inspected: Process S432) Similar to the standalone process S432, the control unit 80 calculates the area to be inspected in the area to be inspected.

[0077] (Comparison and determination process: process S434) The area to be inspected, determined in process S432, is compared with the pre-registered area registered in process S101 and the ULA and LLA determined by the threshold setting in process S102 to determine whether or not it falls within the range of ULA and LLA.

[0078] (Confirmation of predetermined number of times: Step S435) The control unit 80 determines whether the inspection has been performed a predetermined number of times corresponding to the number of inspection target areas. If it has been performed a predetermined number of times, it proceeds to step 433a. If it has not been performed a predetermined number of times, it returns to step S41.

[0079] (Correction necessity determination process: process S433a) The control unit 80 extracts the number of inspection target areas that exceed ULA, the number of inspection target areas that fall below LLA, and the number of inspection target areas that fall within the range of ULA and LLA, and automatically performs a comparison determination. Based on the comparison results, the control unit 80 automatically determines the direction of correction.

[0080] If the control unit 80 determines that the number of inspection target areas exceeding ULA is the maximum number (determination d), it proceeds to the correction step of reducing the paste discharge pressure in step S441. If the control unit 80 determines that the number of inspection target areas below LLA is the maximum number (determination e), it proceeds to the correction step of increasing the paste discharge pressure in step S442. The correction is performed using the approximate straight line shown in Figure 8 above.

[0081] On the other hand, if the number of inspection target areas within the range of ULA and LLA is the maximum number, or if the number of inspection target areas exceeding ULA, the number of multiple inspection target areas below LLA, and the number of multiple inspection target areas within the range of ULA and LLA are the same (judgment f), the process returns to step S41 without correction and coating in step S42 is performed using the same recipe.

[0082] Here, specific examples of judgments will be explained using Figures 12(a) and 12(b). In the example shown in Figure 12(a), PB1 > ULA, PB2 > ULA, PB3 > ULA, and PB4 > ULA, and the inspected area of ​​all four inspection target regions CP1 to CP4 exceeds ULA, so a correction is made to reduce the discharge pressure as shown in step S441. In the example shown in Figure 12(b), PB1 > ULA, PB2 > ULA, PB3 > ULA, and PB4 < LLA, and although the inspected area PB4 of one inspection target region CP4 is below LLA, the inspected areas of the other three inspection target regions CP1 to CP3 exceed ULA, so in this case as well, a correction is made to reduce the discharge pressure as shown in step S441.

[0083] If the results for all inspection areas do not match, the process proceeds to either correct the results according to the trend of the most frequently inspected area, or to leave the results unchanged. An example of these is summarized in the table shown in Figure 13.

[0084] If all of the inspection areas of the inspection target regions CP1, CP2, CP3, and CP4 exceed ULA (as in Figure 12(a)), the result is d, and the control unit 80 corrects the discharge pressure in the decreasing direction. On the other hand, if all of the inspection areas are below LLA, the result is e, and the control unit 80 corrects the discharge pressure in the increasing direction.

[0085] If, for example, only the area PB4 of CP4 under inspection falls below LLA, while the others exceed ULA (Figure 12(b)), the result is d, and the control unit 80 corrects the discharge pressure in the decreasing direction. Also, for example, if only the area PB1 of CP1 under inspection falls below ULA, while the others fall below LLA, the result is e, and the control unit 80 corrects the discharge pressure in the increasing direction.

[0086] If the number of inspection target areas CP1, CP2, CP3, and CP4 that exceed the ULA is equal to the number of inspection target areas that fall below the LLA, the determination is f, and the control unit 80 does not correct the discharge pressure. In this case, coating is performed on the coating surface of the next package area P on the substrate S.

[0087] Figure 13 shows an example of the results for the inspection areas CP1, CP2, CP3, and CP4, but it goes without saying that there are various other patterns, including those within the range of ULA and LLA. The case where the results fall within the range of ULA and LLA, as shown in Figure 7 above (judgment b), is also possible. Thus, the correction direction is determined by the number of inspection areas that exceed ULA, the number of inspection areas that fall below LLA, and the number of inspection areas that fall within the range of ULA and LLA.

[0088] Furthermore, even when imaging multiple package areas of a single inspection target region, such as CP-A in Figure 6, or when imaging multiple specific inspection target regions at predetermined positions on the paste PA, such as CP-B in Figure 6, the correction of the discharge pressure can be determined for multiple inspection target regions, just as in the other embodiments.

[0089] By setting multiple inspection target areas, it is possible to check the variation in the coating area across the entire substrate S, i.e., the coating stability of the die bonder 1.

[0090] Furthermore, compared to methods that make judgments and corrections for each of the multiple inspection target areas, the communication time with the control unit 80 can be shortened, thereby improving the productivity of the device.

[0091] The disclosures made by the Disclosers have been described in detail above based on the embodiments and other embodiments, but it goes without saying that the disclosures are not limited to the embodiments and other embodiments described above and are subject to various modifications.

[0092] In the other embodiments described above, the same effects as in the embodiments can be achieved, namely, the establishment of optimal coating conditions.

[0093] In this other embodiment, comparative judgment across multiple inspection target areas eliminates the need to perform corrections for each inspection target area, thereby improving the operating rate and productivity of the device.

[0094] In this embodiment, an intermediate stage section 30 is provided between the pickup section 20 and the bonding section 40. The die D picked up from the pickup section 20 by the pickup head 21 is placed on the intermediate stage 31, and the die D is picked up again from the intermediate stage 31 by the bond head 41 and bonded to the transported substrate S. However, the bond head 41 may also be used to bond the die D picked up by the pickup section 20 to the substrate S.

[0095] Furthermore, although a semiconductor manufacturing apparatus was described in the embodiment, it can also be applied to mounting apparatus for mounting electronic components onto printed circuit boards.

[0096] 1... Die bonder (semiconductor manufacturing equipment) 80... Control unit (control device) 92... Syringe 94... Preform camera (imaging device)

Claims

1. A coating apparatus comprising: a syringe for dispensing a paste as a bonding material and applying it to a substrate; an imaging device for imaging the paste applied to the substrate; and a control device for image processing the image data of the paste captured by the imaging device, wherein the control device pre-registers the normal application area of ​​the paste in the inspection target area (pre-registered area), calculates and stores the application area of ​​the paste applied in the inspection target area during production (area to be inspected), sets an upper limit area and a lower limit area based on a threshold value indicating a ratio to the pre-registered area, and determines whether or not correction of the discharge pressure of the paste is necessary based on a comparison of the area to be inspected with the upper limit area and the lower limit area.

2. A coating apparatus according to claim 1, wherein the control device is configured to perform the correction, which involves reducing the discharge pressure when the area to be inspected exceeds the upper limit area, and increasing the discharge pressure when the area to be inspected falls below the lower limit area.

3. The coating apparatus according to claim 1, wherein the control device is configured not to perform the correction of the discharge pressure when the area to be inspected is within the range of the upper limit area and the lower limit area.

4. The coating apparatus according to claim 1, wherein the area to be inspected stored is the area of ​​application in multiple inspection target areas of a paste applied to multiple coating areas (multiple areas to be inspected), and the area to be inspected compared with the upper limit area and the lower limit area is each of the multiple areas to be inspected.

5. The coating apparatus according to claim 4, wherein the control device is configured to decrease the discharge pressure when the number of the plurality of inspection target areas whose area to be inspected exceeds the upper limit area, and to increase the discharge pressure when the number of the plurality of inspection target areas whose area to be inspected falls below the lower limit area.

6. A coating apparatus according to claim 4, wherein the control device is configured not to perform the correction of the discharge pressure when the number of the plurality of inspection target areas whose inspection area is within the range of the upper limit area and the lower limit area is the maximum number, or when the number of the plurality of inspection target areas whose inspection area exceeds the upper limit area is the same as the number of the plurality of inspection target areas whose inspection area is below the lower limit area.

7. A coating apparatus according to claim 2 or claim 5, wherein the control device is configured to determine the correction of the discharge pressure from a previously acquired discharge pressure and an approximate straight line of the coating area of ​​the coating surface.

8. A coating apparatus according to claim 1, wherein the control device is configured to determine the correction when the discharge pressure or the substrate is changed, rather than when the correction is performed during the adjustment operation.

9. A semiconductor manufacturing apparatus comprising: a coating apparatus according to claim 1; and a bond head for placing a die on the paste to be coated.

10. A coating method using the coating apparatus of claim 1, wherein the paste is applied to the substrate based on the result of determining whether or not the correction is necessary.

11. A method for manufacturing a semiconductor device, comprising the coating method of claim 10.

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