Antenna module and communication device equipped with same

Abstract

An antenna module (100) comprises: a substrate (130A) that has a main surface (131) and a main surface (132) facing each other; a substrate (130B) that has a main surface (133) and a main surface (134) facing each other, and that is connected to the substrate (130A); a radiation element (123A); a radiation element (121A); and a ground electrode (GND1). The linear-shape radiation element (123A) is at least partially disposed in the substrate (130A) and radiates radio waves having a first frequency band. The plate-shaped radiation element (121A) is disposed in the substrate (130A) and radiates radio waves having a second frequency band higher than the first frequency band. The ground electrode (GND1) is disposed between the radiation element (121A) and the main surface (132) in the substrate (130A) so as to face the radiation element (121A). The substrate (130A) and the substrate (130B) have different normal directions. When viewed from the normal direction of the main surface (131), the radiation element (123A) and the radiation element (121A) are disposed to be spaced apart from each other.

Description

Antenna Module and Communication Device Equipped with the Same

[0001] The present disclosure relates to an antenna module and a communication device equipped with the same, and more specifically to a configuration of an antenna module capable of radiating radio waves in two different frequency bands.

[0002] International Publication No. WO 2024 / 214737 (Patent Document 1) discloses an antenna module in which a radiation element is disposed on each of two substrates having different normal directions, and which can radiate radio waves in two different directions.

[0003] International Publication No. WO 2024 / 214737

[0004] In recent years, for the development of communication technology and further advancement of IoT, development of communication technologies for 5G-Advanced or 6G, which enhance the conventional 5th generation (5G) communication standard, is being promoted. Among these initiatives, in addition to the millimeter wave band (24.25 GHz to 52.6 GHz) frequency band (FR2) used in 5G, the combined use of radio waves in the 7 GHz to 24 GHz frequency band (FR3), which is lower than the aforementioned frequency, is under consideration.

[0005] However, since the difference between the center frequencies of these two frequency bands is relatively large, it is difficult to radiate these two high-frequency signals from the same radiation element. Therefore, it is necessary to use separate radiation elements for each frequency band. On the other hand, increasing the size of the antenna module to provide a radiation element compatible with FR3 can become a factor that hinders miniaturization of the device.

[0006] The present disclosure has been made to solve such problems, and an object thereof is to radiate radio waves in two different frequency bands without increasing the size of the antenna module.

[0007] An antenna module according to a certain aspect of the present disclosure comprises a first substrate, a second substrate, a first radiating element, a second radiating element, and a first ground electrode. The first substrate has opposing first and second main surfaces. The second substrate has opposing third and fourth main surfaces and is connected to the first substrate. A linear first radiating element is disposed on the first substrate in at least a portion thereof and radiates radio waves in a first frequency band. A planar second radiating element is disposed on the first substrate and radiates radio waves in a second frequency band higher than the first frequency band. The first ground electrode is disposed on the first substrate between the second radiating element and the second main surface, and opposite to the second radiating element. The normal direction of the first substrate is different from the normal direction of the second substrate. When viewed from a plan view from the normal direction of the first main surface, the first radiating element and the second radiating element are spaced apart.

[0008] In the antenna module of this disclosure, a linear first radiating element that radiates radio waves in the first frequency band (FR3) is arranged in the empty space between a flat second radiating element (patch antenna) that radiates radio waves in the second frequency band (FR2). Therefore, it is possible to radiate radio waves in two different frequency bands without increasing the size of the antenna module.

[0009] This is a block diagram of a communication device to which the antenna module according to Embodiment 1 is applied. This is a perspective view of the antenna module according to Embodiment 1. This is a side transparency view of the antenna module according to Embodiment 1 when it is mounted on a substrate, as seen from the Y-axis direction. This is a cross-sectional view along line A-A in Figure 3. This is a cross-sectional view along line B-B in Figure 3. This is a side transparency view of the antenna module according to a modified example when it is mounted on a substrate, as seen from the Y-axis direction. This is a side transparency view of the antenna module according to Embodiment 2 when it is mounted on a substrate, as seen from the Y-axis direction. This is a cross-sectional view along line C-C in Figure 7. This is a cross-sectional view along line D-D in Figure 7.

[0010] The embodiments of this disclosure will be described in detail below with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and their descriptions will not be repeated.

[0011] [Embodiment 1] (Basic configuration of communication device) Figure 1 is a block diagram of a communication device 10 to which the antenna module 100 according to Embodiment 1 is applied. The communication device 10 is, for example, a mobile terminal such as a mobile phone, smartphone or tablet, or a personal computer equipped with communication functions.

[0012] Referring to Figure 1, the communication device 10 comprises an antenna module 100 and a BBIC (Base Band Integrated Circuit) 200 that constitutes a baseband signal processing circuit. The antenna module 100 transmits and receives high-frequency signals via a radiating element, which will be described later. The antenna module 100 includes a power supply device, an RFIC (Radio Frequency Integrated Circuit) 110, and an antenna device 120. The RFIC 110 includes power supply circuits 110A to 110D.

[0013] The communication device 10 upconverts the signal transmitted from the BBIC 200 to the antenna module 100 into a high-frequency signal and radiates it from the antenna device 120, and also downconverts the high-frequency signal received by the antenna device 120 and processes the signal in the BBIC 200.

[0014] The antenna device 120 includes a dielectric substrate 105 having two substrates 130A and 130B. The normal direction of substrate 130A and the normal direction of substrate 130B are different from each other. At least two types of radiating elements are arranged on each substrate of the dielectric substrate 105. In Figure 1, one example configuration is shown in which four radiating elements 121A and three radiating elements 123A are alternately arranged on substrate 130A, and four radiating elements 121B and three radiating elements 123B are alternately arranged on substrate 130B, but the number of radiating elements arranged on each substrate is not limited to this. Also, in Figure 1, an example is shown in which the radiating elements are arranged in a one-dimensional array on each substrate of the dielectric substrate, but the radiating elements may be arranged in a two-dimensional array. Alternatively, each substrate may have a single radiating element.

[0015] In Embodiment 1, the radiating elements 121A and 121B are patch antennas having a substantially square, flat plate shape. The shape of the radiating elements 121A and 121B may also be circular, elliptical, or other polygons such as hexagons. Furthermore, in Embodiment 1, the radiating elements 123A and 123B are linear.

[0016] The power supply circuit 110A is a circuit for high-frequency signals transmitted and received from the radiating element 121A on the circuit board 130A. The power supply circuit 110A includes switches 111A to 111D, 113A to 113D, and 117A, power amplifiers 112AT to 112DT, low-noise amplifiers 112AR to 112DR, attenuators 114A to 114D, phase shifters 115A to 115D, signal combiner / distributor 116A, mixer 118A, and amplification circuit 119A.

[0017] When transmitting a high-frequency signal, switches 111A to 111D and 113A to 113D are switched to the power amplifier 112AT to 112DT side, and switch 117A is connected to the transmitting amplifier of the amplification circuit 119A. When receiving a high-frequency signal, switches 111A to 111D and 113A to 113D are switched to the low-noise amplifier 112AR to 112DR side, and switch 117A is connected to the receiving amplifier of the amplification circuit 119A.

[0018] The signal transmitted from the BBIC200 is amplified by the amplification circuit 119A and upconverted by the mixer 118A. The upconverted transmission signal is then split into four parts by the signal combiner / distributor 116A, passes through the corresponding signal path, and is supplied to the radiating element 121A via the power supply wiring 141A.

[0019] The phase shift of the phase shifters 115A to 115D, which are arranged in each signal path, can be individually adjusted to control the directivity of the high-frequency radio waves radiated from the radiating element 121A of the dielectric substrate 105. The attenuators 114A to 114D adjust the intensity of the transmitted signal.

[0020] The received signal received by the radiating element 121A is transmitted to the RFIC 110 via the power supply wiring 141A, and is combined in the signal combiner / distributor 116A via the corresponding signal path. The combined received signal is down-converted in the mixer 118A, further amplified in the amplification circuit 119A, and transmitted to the BBIC 200.

[0021] In Embodiment 1, a high-frequency signal in the FR2 frequency band is radiated as radio waves from the radiating element 121A of the substrate 130A via the power supply circuit 110A. More specifically, the FR2 frequency band is the frequency band from 24.25 GHz to 52.6 GHz. In the following description, the power supply circuits 110B to 110D have the same configuration as power supply circuit 110A, so a detailed description will not be repeated.

[0022] The power supply circuit 110C is a circuit for the high-frequency signal radiated from the radiating element 121B on the substrate 130B, and has the same configuration as the power supply circuit 110A. The power supply circuit 110C upconverts the signal transmitted from the BBIC 200 into a high-frequency signal and transmits it to the antenna device 120, and downconverts the high-frequency signal transmitted from the antenna device 120 and transmits it to the BBIC 200. In Embodiment 1, radio waves in the FR2 frequency band are radiated from the radiating element 121B on the substrate 130B via the power supply circuit 110C.

[0023] The power supply circuit 110B is a circuit for the high-frequency signal radiated from the radiating element 123A on the circuit board 130A, and has the same configuration as the power supply circuit 110A. The power supply circuit 110B upconverts the signal transmitted from the BBIC 200 into a high-frequency signal and transmits it to the antenna device 120, and downconverts the high-frequency signal transmitted from the antenna device 120 and transmits it to the BBIC 200.

[0024] In Embodiment 1, the frequency band of the high-frequency signal radiated from the radiating element 123A of the substrate 130A via the power supply circuit 110B is FR3, which is lower than FR2. More specifically, the frequency band of FR3 is the frequency band from 7 GHz to 24 GHz. Note that if the frequency band of the radio waves radiated from the radiating element 123A is the same as the frequency band of the intermediate frequency (IF) transmitted from the BBIC 200, that is, if the intermediate frequency transmitted from the BBIC 200 has the frequency band of FR3, then upconversion by the power supply circuit 110B does not need to be performed.

[0025] The power supply circuit 110D is a circuit for the high-frequency signal radiated from the radiating element 123B on the circuit board 130B, and has the same configuration as the power supply circuit 110A. The power supply circuit 110D upconverts the signal transmitted from the BBIC 200 into a high-frequency signal and transmits it to the antenna device 120, and downconverts the high-frequency signal transmitted from the antenna device 120 and transmits it to the BBIC 200.

[0026] In Embodiment 1, radio waves in the frequency band of FR3 are emitted from the radiating element 123B of the substrate 130B via the power supply circuit 110D. However, if the frequency band of the radio waves emitted from the radiating element 123B is the same as the intermediate frequency IF transmitted from BBIC 200, that is, if the intermediate frequency transmitted from BBIC 200 has the frequency band of FR3, then upconversion by the power supply circuit 110D does not need to be performed.

[0027] The power supply circuits 110A to 110D may be formed as one integrated circuit chip for each power supply circuit, or the RFIC 110 as a whole may be formed as one integrated circuit chip. Alternatively, the circuits for the radiating elements 121A and 121B for the patch antenna (power supply circuits 110A and 110C) and the circuits for the radiating elements 123A and 123B for FR3 (power supply circuits 110B and 110D) may each be formed as one integrated circuit chip. Furthermore, the power supply circuits 110A to 110D may be formed as a single integrated circuit chip including the equipment corresponding to the radiating elements 121A, 121B, 123A, and 123B (switches, power amplifiers, low-noise amplifiers, attenuators, phase shifters).

[0028] (Antenna Module Structure) Next, the details of the configuration of the antenna module 100 in Embodiment 1 will be explained using Figures 2 to 5. In the following explanation, the normal direction of substrate 130A will be the Y-axis direction, the normal direction of substrate 130B will be the Z-axis direction, and the arrangement direction of the radiating elements, which is the longitudinal direction of each substrate, will be the X-axis direction. In each figure, the positive direction of the Z-axis may be referred to as the top side, and the negative direction as the bottom side.

[0029] Figure 2 is a perspective view of the antenna module 100 according to Embodiment 1. Figure 3 is a side view of the antenna module 100 according to Embodiment 1 when mounted on the mounting substrate 20, as seen from the Y-axis direction. Figure 4 is a cross-sectional view taken along line A-A in Figure 3. Figure 5 is a cross-sectional view taken along line B-B in Figure 3. In the following description, for the sake of clarity, one of the multiple radiating elements 121A of the antenna module 100 may be described.

[0030] The antenna module 100 includes, in addition to the antenna device 120 shown in Figure 1, a connector 171 and a SiP (System In Package) module 125 including an RFIC 110. The antenna device 120 includes the dielectric substrate 105 (substrates 130A, 130B), radiating elements 121A, 121B, 123A, 123B, and power supply wiring 141A, 141B, 143A, 143B shown in Figure 1, as well as ground electrodes GND1, GND2.

[0031] The dielectric substrate 105 is, for example, a multilayer resin substrate formed by laminating multiple resin layers made of low-temperature co-fired ceramics (LTCC), epoxy, polyimide, or other resins. Alternatively, the dielectric substrate 105 may be a multilayer resin substrate formed by laminating multiple resin layers made of liquid crystal polymer (LCP) having a lower dielectric constant. Furthermore, the dielectric substrate 105 may be a multilayer resin substrate formed by laminating multiple resin layers made of fluororesin, for example. In addition, the dielectric substrate 105 may be a multilayer resin substrate formed by laminating multiple resin layers made of PET (polyethylene terephthalate), or a ceramic multilayer substrate other than LTCC. Note that the dielectric substrate 105 does not necessarily have a multilayer structure; it may be a single-layer substrate.

[0032] The dielectric substrate 105 has a roughly L-shaped cross-section in the X-axis direction, and a flat substrate 130B is connected to a flat substrate 130A. Substrate 130A has two opposing main surfaces 131 and 132. Substrate 130B also has two opposing main surfaces 133 and 134. In the antenna device 120, seven radiating elements are arranged in a line in the X-axis direction on each of the two substrates 130A and 130B.

[0033] The substrate 130A has a substantially rectangular shape when viewed from above in the Y-axis direction. On the main surface 131, four radiating elements 121A and three radiating elements 123A are arranged alternately in a line in the X-axis direction. When viewed from above in the Y-axis direction, the radiating elements 121A and 123A are spaced apart in the X-axis direction. Furthermore, on the substrate 130A, a ground electrode GND1 is arranged in the layer between the radiating elements 121A and the main surface 132, facing the radiating elements 121A.

[0034] When viewed from above in the Z-axis direction, the substrate 130B has a roughly rectangular shape with a long side and a short side. On the main surface 133, four radiating elements 121B and three radiating elements 123B are arranged alternately in a row in the X-axis direction. In addition, on the substrate 130B, a ground electrode GND2 is placed in the layer between the radiating elements 121B and the main surface 134. At one end of the substrate 130B in the short-side direction (the end in the negative Y-axis direction in the illustrated example), the main surface 134 is connected to one side of the substrate 130A relative to its long side (the side in the positive Z-axis direction in the illustrated example).

[0035] Furthermore, the main surface 134 has an SiP module 125 containing an RFIC 110 and a power module IC (not shown), as well as a connector 171. The substrate 130B is mounted on the mounting substrate 20 by connecting the connector 171 to a connector 172 located on the surface 21 of the mounting substrate 20. The mounting substrate 20 is positioned so that its side surface 22 in the negative direction of the Y-axis faces the main surface 132 of the substrate 130A. The substrate 130B may also be mounted on the mounting substrate 20 by soldering. Alternatively, the substrate 130B may be mounted on the mounting substrate 20 by bonding the RFIC 110 to the mounting substrate 20 via a thermal interface material (TIM). In this case, the connector 171 may be connected to a connector 172 located on another substrate, such as a flexible substrate.

[0036] Referring to Figure 4, a high-frequency signal in the frequency band of FR2 is transmitted from the RFIC 110 in the SiP module 125 to the power supply point SP1A of the radiating element 121A on the substrate 130A via the power supply wiring 141A. More specifically, the power supply wiring 141A from the SiP module 125 first extends along the main surface 134 in the layer between the main surface 134 of the substrate 130B and the ground electrode GND2. The power supply wiring 141A that has extended inside the substrate 130B is then connected to the substrate 130A via conductive members 151 and 161, which will be described later. The power supply wiring 141A connected to the substrate 130A then extends along the main surface 132 in the layer between the main surface 132 of the substrate 130A and the ground electrode GND1. The power supply wiring 141A, which extends to a position opposite the power supply point SP1A of the radiating element 121A, then extends in the Y-axis direction toward the power supply point SP1A and is connected to the power supply point SP1A of the radiating element 121A.

[0037] The feed point SP1A of the radiating element 121A is positioned offset from the center of the radiating element 121A in the positive Z-axis direction. When a high-frequency signal in the frequency band of FR2 is supplied to the feed point SP1A, radio waves with polarization in the Z-axis direction are radiated from the radiating element 121A in the negative Y-axis direction.

[0038] Similarly, a high-frequency signal in the frequency band of FR2 is transmitted from the RFIC 110 in the SiP module 125 to the feed point SP1B of the radiating element 121B on the substrate 130B via the feed wiring 141B. The feed wiring 141B extends in the layer between the main surface 134 of the substrate 130B and the ground electrode GND2 to a position facing the feed point SP1B of the radiating element 121B, and then extends in the Z-axis direction toward the feed point SP1B.

[0039] The feed point SP1B of the radiating element 121B is positioned offset from the center of the radiating element 121B in the positive direction of the Y-axis. When a high-frequency signal in the frequency band of FR2 is supplied to the feed point SP1B, radio waves with polarization in the Y-axis direction are radiated from the radiating element 121B in the positive direction of the Z-axis.

[0040] Although not shown in Figure 4, the ground electrode GND2 is connected to the ground electrode GND1 in the positive X-axis direction from the conductive member 151 via via 180 and conductive member 160.

[0041] Next, referring to Figure 5, the radiating element 123A is positioned to span both substrate 130A and substrate 130B. That is, at least a portion of the radiating element 123A is positioned on substrate 130A. Specifically, the radiating element 123A includes a wiring pattern 191A positioned on substrate 130A and a via 192A positioned on substrate 130B. The wiring pattern 191A and the via 192A are connected to each other by a conductive member 153 positioned to be exposed on the side surface 135 of the Z-axis end of substrate 130A, and a conductive member 163 positioned to be exposed on the negative Y-axis end of the main surface 134 of substrate 130B.

[0042] The conductive member 185 is positioned so as to be exposed at the negative Y-axis end of the main surface 133 of the substrate 130B and is connected to the positive Z-axis end of the radiating element 123A. The conductive member 186 extends in the Z-axis direction on the substrate 130B and connects the conductive member 185 to the ground electrode GND2. In other words, the radiating element 123A is grounded at its positive Z-axis end by being connected to the ground electrode GND2 via the conductive members 185 and 186.

[0043] A high-frequency signal in the FR3 frequency band is transmitted from the RFIC 110 in the SiP module 125 to the feed point SP3A of the radiating element 123A via the feed wiring 143A. The feed wiring 143A extends into the layer between the main surface 134 of the substrate 130B and the ground electrode GND2, and is connected to a conductive member 163. The conductive member 163 is connected to a conductive member 153 located on the side surface 135 of the substrate 130A. The conductive member 153 is connected to the feed point SP3A in the wiring pattern 191A of the radiating element 123A. In other words, the RFIC 110 is connected to the feed point SP3A of the radiating element 123A via the conductive members 153, 163 and the feed wiring 143A. That is, the radiating element 123A is an inverted F antenna to which the high-frequency signal of FR2 is transmitted and which is connected to the ground potential.

[0044] Similarly, a high-frequency signal in the frequency band of FR3 is transmitted from the RFIC 110 in the SiP module 125 to the feeding point SP3B of the radiating element 123B on the substrate 130B via the feeding wiring 143B. The feeding wiring 143B extends in a layer between the main surface 134 of the substrate 130B and the ground electrode GND2 to a position facing the feeding point SP3B of the radiating element 123B, and then extends in the Z-axis direction toward the feeding point SP3B. The end of the radiating element 123B in the positive Y-axis direction is connected to the ground electrode GND2 via a via. That is, the radiating element 123B constitutes an inverted F antenna.

[0045] FR3 is a lower frequency band than FR2. The frequency that a radiating element can transmit is higher as the length of the radiating element in the polarization direction is shorter, and lower as the length is longer. Therefore, the radiating elements 123A, 123B may need to be longer than the radiating elements 121A, 121B.

[0046] Further, for example, when the antenna module 100 is used in a smartphone, the antenna module 100 is arranged such that the Y-axis direction is the normal direction of the side surface of the smartphone, and the Z-axis direction is the normal direction of the main surface on which the display screen of the smartphone is arranged (that is, the thickness direction of the smartphone).

[0047] Therefore, the entire radiating element 123B, which is arranged to extend along the surface direction of the substrate 130B, can be arranged within the substrate 130B. However, with respect to the radiating element 123A arranged on the substrate 130A, due to the dimensional limitation in the thickness direction of the smartphone, the entire radiating element 123A may not be able to be arranged within the substrate 130A. For this reason, in the antenna module 100 according to the first embodiment, the radiating element 123A is arranged so as to extend over the substrate 130B as well.

[0048] In the above description, an example has been described in which the radiating elements 121A, 121B, a part of the radiating element 123A, and the radiating element 123B are arranged so as to be exposed on the main surfaces 131, 133 of the substrates 130A, 130B, respectively. However, all of the radiating elements 121A, 121B, the radiating element 123A, and the radiating element 123B may be disposed inside the substrates 130A, 130B. Alternatively, by forming the via 192A on the side surface of the substrate 130B on the negative direction side of the Y-axis, the entire radiating element 123A may be disposed so as to be exposed on the surfaces of the substrate 130A and the substrate 130B. Alternatively, the line length of the radiating element 123A may be secured by bending 191A into a meander shape, and the entire radiating element 123A may be disposed on the substrate 130A.

[0049] In the antenna module 100 according to the first embodiment described above, the radiating elements 123A and 123B that form a linear inverted-F antenna capable of radiating FR3 radio waves are arranged adjacent to the radiating elements 121A and 121B, which are flat patch antennas that radiate FR2 radio waves. The radiating elements 121A and 121B are arranged between the patch antennas on each substrate, or between a patch antenna and an end of the substrate, and are arranged by utilizing the empty space of the radiating elements for FR2. Therefore, radio waves in two different frequency bands can be radiated without increasing the size of the antenna module 100.

[0050] It should be noted that the "substrate 130A" and "substrate 130B" in the first embodiment respectively correspond to the "first substrate" and the "second substrate" in the present disclosure. The "main surface 131" and "main surface 132" of the substrate 130A in the first embodiment respectively correspond to the "first main surface" and the "second main surface" in the present disclosure. The "main surface 133" and "main surface 134" of the substrate 130B in the first embodiment respectively correspond to the "third main surface" and the "fourth main surface" in the present disclosure. The "ground electrode GND1" and "ground electrode GND2" in the first embodiment respectively correspond to the "first ground electrode" and the "second ground electrode" in the present disclosure.

[0051] The multiple "radiating elements 123A" on substrate 130A in Embodiment 1 correspond to the "first radiating element" and "third radiating element" in this disclosure. The multiple "radiating elements 121A" on substrate 130A in Embodiment 1 correspond to the "second radiating element" and "fourth radiating element" in this disclosure. The "radiating element 123B" on substrate 130B in Embodiment 1 corresponds to the "fifth radiating element" in this disclosure. The "radiating element 121B" on substrate 130B in Embodiment 1 corresponds to the "sixth radiating element" in this disclosure. The "wiring pattern 191A" and "via 192A" of radiating element 123A in Embodiment 1 correspond to the "wiring pattern" and "via," respectively, in this disclosure.

[0052] (Modified Version) In the modified version, a configuration in which the radiating elements 121B and 123B on the substrate 130B are removed from the antenna module 100 according to Embodiment 1 will be described. Figure 6 is a side view from the Y-axis direction of the modified antenna module 100A when it is mounted on the mounting substrate 20.

[0053] As shown in Figure 6, in the antenna module 100A, only radiating elements 121A and 123A for radiating radio waves in the Y-axis direction are arranged. Furthermore, in the antenna module 100A, one of the radiating elements 123A of the inverted F antenna, which was arranged on both sides of the radiating element 121A, has been removed.

[0054] Even in this configuration, since the radiating element 123A that radiates FR3 radio waves is placed in the empty space of the radiating element 121A that radiates FR2 radio waves, it is possible to radiate radio waves in two different frequency bands without increasing the size of the antenna module 100A.

[0055] [Embodiment 2] In Embodiment 2, the arrangement of radiating elements when the connection configuration of the two substrates is different will be described.

[0056] Figure 7 is a side view of the antenna module 100B according to Embodiment 2, as seen from the Y-axis direction, when mounted on the mounting substrate 20. Figure 8 is a cross-sectional view taken along line C-C in Figure 7. Figure 9 is a cross-sectional view taken along line D-D in Figure 7.

[0057] The substrate 130BY in the antenna device 120B of the antenna module 100B has a substantially rectangular shape with a longer side in the X-axis direction and a shorter side in the Y-axis direction. In the antenna module 100B, a plurality of recesses are formed in the X-axis direction on the side surface of the longer side (the positive direction of the X-axis extending of the substrate 130BY), recessed in the Y-axis direction. The substrate 130AY is provided with a projection that fits into the recess of the substrate 130BY, and includes a region RG1 that is in contact with the main surface 134 of the substrate 130BY and a region RG2 that is positioned to fit into the interior of the recess of the substrate 130BY. In other words, when viewed from the Y-axis direction, the substrate 130AY has a substantially T-shape.

[0058] The radiating element 121AY is located in region RG2 of substrate 130AY. At least a portion of the radiating element 123AY is located in region RG1 of substrate 130AY. When viewed from a plan view in the Y-axis direction, the via 192A of the radiating element 123AY is located on substrate 130BY.

[0059] Antenna module 100B is a so-called dual-polarization type antenna module in which two feed points SP1A and SP2A are arranged on the radiating element 121AY. Feed point SP1A is positioned offset from the center of the radiating element 121AY in the negative direction of the Z axis. Feed point SP2A is positioned offset from the center of the radiating element 121AY in the negative direction of the Y axis.

[0060] A high-frequency signal is supplied to the feed point SP1A via the feed wiring 141A through the conductive member 151 of one region RG1. It is not essential that the antenna module be a dual-polarization type; the configuration of Embodiment 2 can also be applied to single-polarization type antenna modules such as antenna modules 100 and 100A.

[0061] Thus, in the antenna module 100B according to Embodiment 2, when viewed from the X-axis direction, the position of the radiating element 121AY in the Z-axis direction overlaps with the substrate 130BY. As a result, the dimension in the Z-axis direction can be made even shorter than that of the antenna module 100 according to Embodiment 1, making the antenna module 100B lower profile.

[0062] Furthermore, the radiating elements 121AY and 121BY are located between the patch antennas on each substrate, or between the patch antennas and the edges of the substrate, utilizing the available space for the radiating elements for FR2. Therefore, it is possible to radiate radio waves in two different frequency bands without increasing the size of the antenna module 100B.

[0063] In the second embodiment, "region RG1" and "region RG2" of the substrate 130AY correspond to "first region" and "second region" in this disclosure, respectively.

[0064] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of the present invention is indicated by the claims rather than by the description of the embodiments above, and all modifications within the meaning and scope of the claims are intended to be included.

[0065] 10 Communication device, 20 Mounting board, 100, 100A, 100B Antenna module, 105 Dielectric substrate, 110 RFIC, 110A-110D Power supply circuit, 130A, 130AY, 130B, 130BY Substrate, 111A-111D, 113A-113D, 117A Switch, 112AR-112DR Low-noise amplifier, 112AT-112DT Power amplifier, 114A-114D Attenuator, 115A-115D Phase shifter, 116A Distributor, 118A Mixer, 119A Amplifier circuit, 120, 120A, 120B Antenna device, 121A, 121AY, 121B, 123A, 123AY, 123B Radiating element, 125 SiP modules, 141A, 141B, 143A, 143B Power supply wiring, 151, 153, 160, 161, 163, 185, 186 Conductive components, 171, 172 Connector, 191A Wiring patterns, 180, 192A Vias, GND1, GND2 Grounding electrodes.

Claims

1. An antenna module comprising: a first substrate having opposing first main surfaces and second main surfaces; a second substrate having opposing third main surfaces and fourth main surfaces and connected to the first substrate; a linear first radiating element having at least a portion disposed on the first substrate and radiating radio waves in a first frequency band; a flat plate-shaped second radiating element disposed on the first substrate and radiating radio waves in a second frequency band higher than the first frequency band; and a first ground electrode disposed on the first substrate between the second radiating element and the second main surface, facing the second radiating element, wherein the normal direction of the first substrate and the normal direction of the second substrate are different from each other, and when viewed from the normal direction of the first main surface, the first radiating element and the second radiating element are spaced apart in a first direction along the main surface of the second substrate.

2. The antenna module according to claim 1, wherein the first radiating element is an inverted F antenna to which a high-frequency signal in the first frequency band is transmitted and which is connected to the ground potential.

3. The antenna module according to claim 1 or 2, wherein the second substrate has a substantially rectangular shape with a long side and a short side, and a recess is formed in the long side, the first substrate includes a first region in contact with the fourth main surface of the second substrate and a second region arranged to fit into the recess, at least a portion of the first radiating element is arranged in the first region, and the second radiating element is arranged in the second region.

4. The antenna module according to any one of claims 1 to 3, wherein the first radiating element includes a wiring pattern disposed on the first substrate and vias disposed on the second substrate and connected to the wiring pattern.

5. The antenna module according to claim 1 or claim 2, further comprising a linear third radiating element which is at least a portion of the first substrate and radiates radio waves in the first frequency band, wherein the second radiating element is disposed between the first radiating element and the third radiating element.

6. The antenna module according to claim 5, wherein the third radiating element is an inverted F antenna to which a high-frequency signal in the first frequency band is transmitted and which is connected to the ground potential.

7. The antenna module according to claim 5 or 6, wherein the second substrate has a substantially rectangular shape having a long side and a short side, and a recess is formed on the long side, the first substrate includes a first region in contact with the fourth main surface of the second substrate and a second region positioned to fit into the recess, and at least a portion of the third radiating element is positioned in the first region.

8. The antenna module according to any one of claims 5 to 7, wherein the third radiating element includes a second wiring pattern disposed on the first substrate and a second via disposed on the second substrate and connected to the second wiring pattern.

9. The antenna module according to claim 1 or 2, further comprising a flat plate-shaped fourth radiating element disposed on the first substrate and radiating radio waves in the second frequency band, wherein the fourth radiating element is disposed opposite to the first ground electrode and, when viewed in plan from the direction normal to the first main surface, is disposed at a distance from the second radiating element in the first direction.

10. The antenna module according to claim 9, wherein the second substrate has a substantially rectangular shape with a long side and a short side, and a recess is formed on the long side, the first substrate includes a first region in contact with the fourth main surface of the second substrate and a second region positioned to fit into the recess, and the fourth radiating element is positioned in the second region.

11. The antenna module according to any one of claims 1 to 10, further comprising a linear fifth radiating element disposed on the second substrate and radiating radio waves in the first frequency band.

12. The antenna module according to claim 11, wherein the fifth radiating element is an inverted F antenna to which a high-frequency signal in the first frequency band is transmitted and which is connected to the ground potential.

13. The antenna module according to any one of claims 1 to 10, further comprising: a flat plate-shaped sixth radiating element disposed on the second substrate and radiating radio waves in the second frequency band; and a second ground electrode disposed on the second substrate between the sixth radiating element and the fourth main surface, facing the sixth radiating element.

14. The antenna module according to any one of claims 1 to 13, further comprising a power supply device arranged on the fourth main surface.

15. A communication device comprising an antenna module according to any one of claims 1 to 14.

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