Conductive member

Abstract

A conductive member (1) comprises: first conductive lines (10) provided on the upper surface of a substrate (2); second conductive lines (20) provided on the upper surface of the substrate (2) and including a first line (21) and a second line (22); and a conductive protective layer (40a) located on the upper side of the substrate (2) and overlapping the second conductive lines (20) as viewed from above. The line width of the first line (21) is greater than that of the first conductive line (10). The line width of the second line (22) is greater than that of the first conductive line (10). The conductive protective layer (40a) covers the first line (21) and the second line (22) as viewed from above. The conductive protective layer (40a) electrically connects the first line (21) and the second line (22).

Description

Conductive member

[0001] The present disclosure relates to a conductive member.

[0002] Conventionally, conductive members as disclosed, for example, in Patent Documents 1 to 3 are known.

[0003] Patent Document 1 discloses a conductive member (conductive film 101) including a substrate (flexible substrate 40), a temperature measuring resistance portion (temperature measuring resistance portion 12) provided on the substrate, and conductive wires (lead wirings 11a, 11b) provided on the substrate. One end of each conductive wire is connected to both ends of sensor wires (sensor wires 122, 123) constituting the temperature measuring resistance portion. The other end of each conductive wire is connected to each terminal of a connector (connector 19). The width of the conductive wires (lead wirings 11a, 11b) is set to 0.5 mm to 10 mm to secure a sufficient current capacity.

[0004] Patent Document 2 discloses a conductive composite sheet (conductive composite sheet 10) including a substrate (sheet-shaped base material 1), a conductive wire (conductive thread 5) provided on the substrate, and a flexible wiring board (relay wiring member 20) connected to the substrate. The flexible wiring board includes a plurality of wires (wires 22), a first electrode terminal (first electrode terminal 23) formed at one end of the wires, and a second electrode terminal (second electrode terminal 24) formed at the other end of the wires. The conductive wire (conductive thread 5) provided on the substrate is electrically connected to the first electrode terminal of the flexible wiring board. A connector (first connector CN1) is electrically connected to the second electrode terminal of the flexible wiring board. That is, the conductive wire (conductive thread 5) is electrically connected to the connector via the flexible wiring board.

[0005] Patent Document 3 discloses a conductive film comprising a substrate (substrate 5), sensor electrodes (transmitting electrodes 11 or receiving electrodes 12) provided on the substrate, wiring (routing wiring 13) provided on the substrate, and a flexible wiring board (flexible wiring board 16) provided on the substrate. One end of the wiring is electrically connected to the sensor electrode. The other end of the wiring (connecting pad 15) is electrically connected to the flexible wiring board. The sensor electrode and wiring are electrically connected to an external circuit by this flexible wiring board (see paragraph 0029 of Patent Document 3). The wiring (routing wiring 13) is composed of conductive wires (second conductive wires 25) with a line width of 8.0 μm or more and 12.0 μm or less.

[0006] Japanese Patent Publication No. 2021-56161, Japanese Patent Publication No. 2023-115681, Japanese Patent Publication No. 2016-21729

[0007] As described above, in the conductive member of Patent Document 1, the other end of the conductive wire is connected to the terminal of the connector (hereinafter referred to as "connector terminal"). In other words, in the conductive member of Patent Document 1, the conductive wire is connected to the connector without using a flexible wiring board.

[0008] Incidentally, the portion of a general-purpose connector terminal that comes into contact with the conductive wire (hereinafter referred to as the "contact portion") is formed in a planar or spherical shape. Furthermore, the contact portion of a general-purpose connector terminal has a contact surface that is relatively larger than the wire width of the conductive wire and is formed from a relatively hard metal material.

[0009] In the conductive member described in Patent Document 1, the wire width of the conductive wires (lead wiring 11a, 11b) is relatively large (approximately 0.5 mm to 10 mm) in order to ensure sufficient current capacity. This makes it easier for the conductive wires to make surface contact with the contact portion of the connector terminals. As a result, in the conductive member described in Patent Document 1, conductivity between the connector terminals and the conductive wires is ensured without the use of a flexible wiring board.

[0010] In contrast, the conductive members described in Patent Document 2 and Patent Document 3 use thinner conductive wires. In particular, the conductive member described in Patent Document 3 has a wire width of 8.0 μm or more and 12.0 μm or less for the conductive wire (second conductive wire 25). That is, the conductive wire in Patent Document 3 is thinner than the conductive wire in Patent Document 1. Therefore, if the thinned conductive wires in the conductive members of Patent Document 2 or Patent Document 3 are connected directly to the connector terminals without using a flexible wiring board, the conductive wires will not be able to make surface contact with the contact portion of the connector terminals. As a result, it will be difficult to ensure conductivity between the conductive wires and the connector terminals.

[0011] Furthermore, a common problem with the conductive materials described in each document is that if the contact area of ​​a connector terminal, which has relatively high hardness, is in direct contact with a conductive wire without using a flexible wiring board, the conductive wire may wear down due to the contact pressure from the connector terminal, potentially leading to damage to the conductive wire. In other words, when the connector terminal is in direct contact with the conductive wire, there is a problem in that the conductive wire is not properly protected.

[0012] This disclosure has been made in view of the above, and its purpose is to ensure conductivity between external terminals such as connector terminals and conductive wires, and to properly protect the conductive wires.

[0013] To achieve the above objective, one embodiment of the present disclosure is a conductive member comprising: a substrate; a first conductive wire provided on the upper surface of the substrate; a second conductive wire provided on the upper surface of the substrate and including a first wiring and a second wiring; and a conductive protective layer located on the upper surface side of the substrate and overlapping the second conductive wire in a top view. The wire width of the first wiring is wider than the wire width of the first conductive wire. The wire width of the second wiring is wider than the wire width of the first conductive wire. The conductive protective layer covers the first wiring and the second wiring in a top view. The conductive protective layer electrically connects the first wiring and the second wiring.

[0014] According to this disclosure, conductivity between the external terminal and the conductive wire can be ensured, and the conductive wire can be properly protected.

[0015] Figure 1 is a schematic overall perspective view showing the configuration of a conductive member according to an embodiment of this disclosure. Figure 2 is a partially enlarged view of part II shown in Figure 1. Figure 3 is a cross-sectional view showing the cross-sectional structure of the first conductive wire. Figure 4 is a partially enlarged view showing the configuration of the conductive region, busbar, and conductive protective layer located on the upper side of the paper in Figure 1. Figure 5 is a cross-sectional view taken along line V-V in Figure 4. Figure 6 is a cross-sectional view showing the cross-sectional structure of the second conductive wire. Figure 7 is a plan view showing a modified example of the conductive member. Figure 8 is a cross-sectional view taken along line VIII-VIII in Figure 7.

[0016] Embodiments of the present disclosure will be described in detail below with reference to the drawings. The following description of embodiments is illustrative in nature and is not intended to limit the present disclosure, its applications, or its uses.

[0017] Figure 1 shows an overall view of the conductive member 1 according to an embodiment of this disclosure. The conductive member 1 shown in this embodiment is configured, for example, as a heater. However, the conductive member 1 is not limited to use as a heater and can be widely applied to various technical fields such as touch sensors, liquid crystal displays, organic electroluminescent displays (OLEDs), micro-LED displays, solar cell devices, antenna devices, and electromagnetic wave shielding sheets.

[0018] The conductive member 1 is connected to the connector 100 (see Figure 1). The connector 100 illustrated in Figure 1 is one of the external devices.

[0019] The connector 100 has a connector body 101 and connector terminals 102a and 102b. Connector terminal 102a is connected to the terminal connection portion 43a of the conductive protective layer 40a, which will be described later. Connector terminal 102b is connected to the terminal connection portion 43b of the conductive protective layer 40b, which will be described later. In this embodiment, the conductive member 1 is electrically connected to the connector 100 without using a flexible wiring board (not shown).

[0020] In the embodiments of this disclosure, for the sake of explanation, the direction from the left side of Figure 1 to the right side of the page (direction D1 shown in Figure 1) is defined as the "first direction." The direction from the bottom of Figure 1 to the top of the page (direction D2 shown in Figure 1) is defined as the "second direction."

[0021] Furthermore, in the following explanation, the side where the later-described first layer 3 is located (the lower side of the paper in the figures) as shown in Figures 3 and 6 will be referred to as the "lower side" of the conductive member 1, and the side where the later-described second layer 4 is located (the upper side of the paper in the figures) will be referred to as the "upper side" of the conductive member 1, and the positional relationships of the elements constituting the conductive member 1 will be defined accordingly. Note that such positional relationships are unrelated to the actual vertical direction of the equipment or device on which the conductive member 1 is mounted.

[0022] As shown in Figures 1, 2, and 4, the conductive member 1 comprises a substrate 2, a plurality of first conductive wires 10, a plurality of second conductive wires 20, a protective layer 30, and conductive protective layers 40a and 40b. Each component will be described in detail below.

[0023] (Substrate) As shown in Figures 3 and 6, the substrate 2 has a first layer 3 and a second layer 4.

[0024] The third layer consists of a transparent resin material. Examples of transparent resin materials include PET (polyethylene terephthalate), PC (polycarbonate), COP (cycloolefin polymer), and COC (cycloolefin copolymer). The thickness of the third layer is, for example, 50 μm to 300 μm.

[0025] The second layer 4 is laminated on top of the first layer 3. The second layer 4 is made of a resin material that has insulating and permeable properties. The thickness of the second layer 4 is greater than the depth of the first groove 5 and the second groove 6, which will be described later.

[0026] Furthermore, a metal reinforcing plate 7 is provided on the underside of the substrate 2 (underside of the first layer 3) (see Figure 5). This reinforcing plate 7 overlaps with the conductive protective layers 40a and 40b when viewed from above.

[0027] (First groove) Multiple first grooves 5 are formed on the upper surface of the second layer 4. As shown in Figure 3, the first grooves 5 have a bottomed shape that is recessed downwards toward the second layer 4.

[0028] In this embodiment, the side surface of the first groove 5 is tapered, widening upward from the bottom surface of the first groove 5 (towards the opening side of the first groove 5). Specifically, in the thickness direction of the second layer 4, the side surface of the first groove 5 is inclined upward from the bottom surface of the first groove 5 (towards the opening side of the first groove 5) to the left or right side of the paper in Figure 3. Note that the side surface of the first groove 5 does not necessarily have to be tapered.

[0029] The groove width of the first groove 5 (dimension GW1 shown in Figure 3) is, for example, 0.5 μm or more and 3.0 μm or less. The depth of the first groove 5 (dimension GD1 shown in Figure 3) is, for example, 0.5 μm or more and 2.0 μm or less. The aspect ratio of the first groove 5 (value obtained by dividing dimension GD1 by dimension GW1) is, for example, 0.1 or more and 1.0 or less.

[0030] (Second groove) Multiple second grooves 6 are formed on the upper surface of the second layer 4. As shown in Figure 6, the second grooves 6 have a bottomed shape that is recessed downwards toward the second layer 4.

[0031] In this embodiment, the side surface of the second groove 6 is formed in a tapered shape, widening upward from the bottom surface of the second groove 6 (towards the opening side of the second groove 6). However, the side surface of the second groove 6 does not necessarily have to be formed in a tapered shape.

[0032] The groove width of the second groove 6 (dimension GW2 shown in Figure 6) is greater than the groove width of the first groove 5 (dimension GW1). Specifically, the groove width of the second groove 6 (dimension GW2 shown in Figure 6) is, for example, 8.0 μm or more and 12.0 μm or less. The depth of the second groove 6 (dimension GD2 shown in Figure 2) is, for example, 0.5 μm or more and 10.0 μm or less. The aspect ratio of the second groove 6 (value obtained by dividing dimension GD2 by dimension GW2) is, for example, 0.1 or more and 1.0 or less.

[0033] (Conductive Region) As shown in Figure 1, the conductive member 1 is provided with a conductive region C. The conductive region C illustrated in Figure 1 is formed in a substantially rectangular shape when viewed from above. The conductive region C is located between busbars 8a and 8b when viewed from above. In this embodiment, the conductive region C becomes the heat-generating portion when the conductive member 1 is used as a heater.

[0034] (First Conductive Wires) As shown in Figure 2, a plurality of first conductive wires 10 are located in the conductive region C. A mesh pattern is formed in the conductive region C by the plurality of first conductive wires 10. The plurality of first conductive wires 10 extend in directions that intersect each of the first direction D1 and the second direction D2. Although not shown, the plurality of first conductive wires 10 may also extend along each of the first direction D1 and the second direction D2.

[0035] The wire width of the first conductive wire 10 is the same as the groove width of the first groove 5 (dimension GW1 shown in Figure 3). The distance between adjacent first conductive wires 10 is, for example, 100 μm or more and 500 μm or less.

[0036] As shown in Figure 3, the first conductive wire 10 is provided in the first groove 5 located on the upper surface of the substrate 2. Specifically, the first conductive wire 10 is made of a conductive material embedded in the first groove 5 of the second layer 4. That is, the first conductive wire 10 is conductive.

[0037] By providing the first conductive wire 10 in the first groove 5, it becomes possible to position the upper surface of the first conductive wire 10 below the upper surface of the substrate 2. Furthermore, it becomes possible to reduce the thickness of the protective layer 30 provided on the upper surface of the substrate 2. Although not shown in the figures, the upper surface of the first conductive wire 10 may be flush with the upper surface of the substrate 2.

[0038] The first conductive wire 10 has a conductive layer M1, an adhesion layer M2, and a seed layer M3. The conductive layer M1, the adhesion layer M2, and the seed layer M3 correspond to the conductive material described above.

[0039] The conductive layer M1 is embedded in the first groove 5. The conductive layer M1 is laminated on the adhesion layer M2 and seed layer M3 provided within the first groove 5.

[0040] The adhesion layer M2 is an element for ensuring the adhesion of the seed layer M3 to the first groove portion 5. The adhesion layer M2 is a metal layer composed of, for example, a metal nitride or a metal oxide containing at least one or more metals selected from the group consisting of Ti, Ni, Al, V, W, Ta, Si, Cr, Ag, Mo, Cu, and Zn. The adhesion layer M2 may be a single layer or a laminate in which a plurality of layers having different compositions are laminated. The adhesion layer M2 is laminated in a thin film form on the lower surface and side surfaces of the first groove portion 5 by, for example, vapor deposition or sputtering.

[0041] The seed layer M3 has a function of bonding the conductive layer M1 to the adhesion layer M2. Specifically, the seed layer M3 functions as a cathode for laminating the conductive layer M1, which contains copper (Cu) and will be described later, on the adhesion layer M2 in this embodiment, for example, during electroplating for forming the conductive layer M1. The seed layer M3 is laminated in a thin film form on the adhesion layer M2 by, for example, vapor deposition or sputtering.

[0042] The conductive layer M1 is made of a conductive metal such as copper (Cu). The conductive layer M1 is formed by electroplating, electroless plating, vacuum vapor deposition, or the like. When electroplating is performed, the conductive layer M1 and the seed layer M3 are integrally formed. As a result, there may be cases where the interface between the conductive layer M1 and the seed layer M3 cannot be distinguished. Although copper (Cu) is suitable as the main component of the wiring, metals other than copper (for example, silver, gold, nickel, aluminum) may be included.

[0043] The first conductive wire 10 includes a blackening layer M4. The blackening layer M4 has a function to prevent the first conductive wire 10 from being visually recognized when viewed from above. In a case where the visibility as the conductive member 1 is not particularly affected, the blackening layer M4 may be omitted according to the use state of the conductive member 1.

[0044] The blackening layer M4 is laminated on the upper surface of the conductive layer M1. From the viewpoint of suppressing the electrical resistance of the first conductive wire 10, the thickness of the blackening layer M4 is preferably, for example, 3 nm or more and 50 nm or less.

[0045] (First recessed portion) As shown in FIG. 3, the first conductive wire 10 includes a first recessed portion 10a. The first recessed portion 10a is formed as a bottomed shape recessed downward from the opening side of the first groove portion 5. The first recessed portion 10a is formed in a curved shape having a predetermined radius of curvature. The longitudinal direction of the first recessed portion 10a extends along the extending direction of the first groove portion 5. Note that the concept of the above "curved shape" includes "arc shape".

[0046] In this embodiment, the recess width of the first recessed portion 10a is substantially the same as the groove width dimension of the first groove portion 5 (dimension GW1 shown in FIG. 3). Further, the recess depth of the first recessed portion 10a (dimension d1 shown in FIG. 3) is, for example, 0.0045 µm or more and 0.6 µm or less. Note that the recess depth (dimension d1) of the first recessed portion 10a refers to the distance from the upper surface of the second layer 4 to the position corresponding to the deepest part of the first recessed portion 10a.

[0047] (Bus bars) As shown in FIG. 1, bus bars 8a and 8b are provided on the conductive member 1. The bus bar 8a is located on the upper side of the sheet of FIG. 1 with respect to the conductive region C. The bus bar 8b is located on the lower side of the sheet of FIG. 1 with respect to the conductive region C. The bus bars 8a and 8b extend along the first direction D1.

[0048] The bus bar 8a is electrically connected to the connector terminal 102a via the conductive protective layer 40a. The bus bar 8b is electrically connected to the connector terminal 102b via the conductive protective layer 40b.

[0049] (Second conductive wires) As shown in FIG. 1 and FIG. 4, each of the bus bars 8a and 8b is formed in a ladder shape by a plurality of second conductive wires 20. The plurality of second conductive wires 20 extend along the first direction D1 or the second direction D2. In this embodiment, the second conductive wires 20 extending in the first direction D1 are longer than the second conductive wires 20 extending in the second direction D2.

[0050] The line width of the second conductive wire 20 is the same as the groove width of the second groove portion 6 (dimension GW2 shown in FIG. 6). Further, the line width of the second conductive wire 20 is wider than the line width of the first conductive wire 10.

[0051] In the first direction D1, the distance between adjacent second conductive wires 20 is, for example, 8 μm or more and 12 μm or less. Similarly, in the second direction D2, the distance between adjacent second conductive wires 20 is, for example, 8 μm or more and 12 μm or less.

[0052] Here, with respect to the busbar 8a shown in Figure 4, among the multiple second conductive wires 20 extending in the second direction D2, the second conductive wire 20 located second from the left side of the page in the figure may be referred to as the "first wiring 21". Also, the second conductive wire 20 located third from the left side of the page in Figure 4 may be referred to as the "second wiring 22". The first wiring 21 and the second wiring 22 are arranged with a gap between them in the first direction D1. The relationship between the first wiring 21, the second wiring 22, and the conductive protective layer 40a will be described later.

[0053] As shown in Figure 6, the second conductive wire 20 is provided in the second groove 6 located on the upper surface of the substrate 2. Specifically, the second conductive wire 20 is made of a conductive material embedded in the second groove 6 of the second layer 4. That is, the second conductive wire 20 is conductive.

[0054] By providing the second conductive wire 20 in the second groove 6, it becomes possible to position the upper surface of the second conductive wire 20 below the upper surface of the substrate 2. Furthermore, it becomes possible to reduce the thickness of the conductive protective layer 40a (or conductive protective layer 40b) provided on the upper surface of the substrate 2. Although not shown in the figures, the upper surface of the second conductive wire 20 may be flush with the upper surface of the substrate 2.

[0055] The second conductive wire 20 has a conductive layer M1, an adhesion layer M2, and a seed layer M3. The conductive layer M1, adhesion layer M2, and seed layer M3 correspond to the conductive material described above. Note that the conductive layer M1, adhesion layer M2, and seed layer M3 constituting the second conductive wire 20 are the same as the conductive layer M1, adhesion layer M2, and seed layer M3 constituting the first conductive wire 10 described above. For this reason, a detailed explanation of each layer constituting the second conductive wire 20 is omitted.

[0056] (Second recess) As shown in Figure 6, the second conductive wire 20 has a second recess 20a. The second recess 20a is formed as a bottomed recess that is recessed downward from the opening side of the second groove 6. The second recess 20a is formed as a curved shape having a predetermined radius of curvature. The longitudinal direction of the second recess 20a extends along the extension direction of the second groove 6.

[0057] In this embodiment, the width of the second recess 20a is approximately the same as the groove width dimension of the second groove 6 (dimension GW2 shown in Figure 6). The depth of the second recess 20a (dimension d2) is, for example, 0.004 μm or more and 7.0 μm or less. The depth of the second recess 20a (dimension d2) refers to the distance from the upper surface of the second layer 4 to the position corresponding to the deepest part of the second recess 20a.

[0058] (Protective layer) As shown in Figures 1, 2, 4, and 5, the protective layer 30 is located on the upper surface side of the substrate 2. The protective layer 30 is formed in a substantially rectangular shape when viewed from above. The protective layer 30 is transparent and insulating. The thickness of the protective layer 30 is, for example, 4 μm or more and 10 μm or less.

[0059] In Figures 1, 2, 4, and 5, the protective layer 30 is shown using dot hatching to clearly indicate its presence. Note that in Figures 3 and 6, the protective layer 30 is omitted from the illustration in order to clearly show the cross-sectional structure of the first conductive wire 10 and the second conductive wire 20.

[0060] The protective layer 30 overlaps with the conductive region C when viewed from above. That is, the protective layer 30 covers the multiple first conductive wires 10 when viewed from above (see Figures 2 and 4).

[0061] The protective layer 30 overlaps with the busbars 8a and 8b when viewed from above. That is, the protective layer 30 covers the multiple second conductive wires 20 that make up each of the busbars 8a and 8b when viewed from above (see Figure 5).

[0062] As shown in Figures 4 and 5, the protective layer 30 has a main body portion 31 and a first overlap portion 32. The main body portion 31 is the portion that does not overlap with the conductive protective layer 40a when viewed from above. The first overlap portion 32 is the portion in which a part of the protective layer 30 overlaps with the conductive protective layer 40a when viewed from above. In the vertical direction, the first overlap portion 32 is located between the upper surface of the substrate 2 (second layer 4) and the upper surface of the second conductive wire 20 and the conductive protective layer 40a.

[0063] In this embodiment, the protective layer 30 is formed by applying an organic material, described later, to the upper surface of the substrate 2 (second layer 4), and then curing the applied organic material. The thickness of the protective layer 30 can be adjusted by appropriately setting the amount and viscosity of the organic material applied during the manufacturing process.

[0064] The protective layer 30 contains an organic material. This organic material may be in solution form, dissolved in a solvent. Alternatively, the organic material may be in emulsion form, in which the resins described later are dispersed as particulate matter.

[0065] Examples of the above-mentioned organic materials include silicone resins, vinyl ester resins, and polyimide resins. Other examples of the above-mentioned organic materials include acrylic resins, polyurethane resins, polyolefin resins, polyester resins, vinyl chloride resins, epoxy resins, ethylene-vinyl acetate copolymer resins, polycarbonate resins, phenoxy resins, and terpene resins. These resins may be used individually or as a mixture of two or more types.

[0066] When the above organic material contains a crosslinking agent, preferably the organic material has crosslinkable groups that react with the crosslinking agent. Examples of the above crosslinking agent include oxazoline-based crosslinking agents, carbodiimide-based crosslinking agents, epoxy-based crosslinking agents, isocyanate-based crosslinking agents, melamine-based crosslinking agents, carbodiimide-based crosslinking agents, and oxazoline-based crosslinking agents.

[0067] As mentioned above, a first recess 10a is formed on the upper surface of the first conductive wire 10. Similarly, a second recess 20a is formed on the upper surface of the second conductive wire 20. These first and second recesses allow the organic material applied to the upper surfaces of the first and second conductive wires 20 to penetrate the first and second recesses 20a during the manufacturing process of the protective layer 30. This improves the adhesion between the first and second conductive wires 10 and 20 and the protective layer 30.

[0068] The upper surface of the protective layer 30 is formed to be substantially flat (see Figure 5). This is because, in the manufacturing process of the protective layer 30, when the solution-type organic material is applied to the upper surface of the substrate 2 (second layer 4), the portion of the organic material located on the side opposite to the upper surface of the second layer 4 hardens to be flat, regardless of the positions of the first recess 10a and the second recess 20a. Note that "flat" means that there are no irregularities on the upper surface of the protective layer 30 on the order of μm (generally 0.1 μm to 1000 nm).

[0069] (Conductive protective layer) As shown in Figure 1, the conductive protective layers 40a and 40b are located on the upper surface side of the substrate 2. Each of the conductive protective layers 40a and 40b is formed in a roughly strip shape when viewed from above. The thickness of each of the conductive protective layers 40a and 40b is, for example, 5 μm or more and 20 μm or less.

[0070] In Figures 1, 4, and 5, the conductive protective layers 40a and 40b are shown by dot hatching to clearly indicate them. In Figures 3 and 6, the conductive protective layers 40a and 40b are omitted from the illustration in order to clearly show the cross-sectional structure of the first conductive wire 10 and the second conductive wire 20.

[0071] In this embodiment, the conductive protective layers 40a and 40b do not overlap with the conductive region C in a top view (see Figures 1 and 4). That is, the conductive protective layers 40a and 40b in this embodiment do not overlap with the plurality of first conductive wires 10 in a top view.

[0072] The conductive protective layers 40a and 40b include a binder (not shown) and a plurality of conductive particles (not shown) made of metal or carbon. Alternatively, the conductive protective layers 40a and 40b may include a plurality of conductive fibers (not shown) made of metal or carbon instead of the plurality of conductive particles.

[0073] The conductive protective layers 40a and 40b are guaranteed to be conductive by containing multiple conductive particles or multiple conductive fibers. A specific example of the conductive protective layers 40a and 40b is a carbon coating that can be printed on the upper surface of the substrate 2.

[0074] Furthermore, the hardness of the conductive protective layers 40a and 40b is improved by including multiple conductive particles or multiple conductive fibers. As a result, the function of the conductive protective layers 40a and 40b in protecting the second conductive wire 20 (including the first wiring 21 and the second wiring 22) can be enhanced.

[0075] The hardness of the conductive protective layers 40a and 40b is higher than that of the protective layer 30. Preferably, the hardness of the conductive protective layers 40a and 40b is 3H or higher on the pencil hardness scale. With this configuration, even if the connector terminals 102a and 102b, which have relatively high hardness in a general-purpose connector 100, are brought into contact with the upper surfaces of the conductive protective layers 40a and 40b located directly above the second conductive wire 20 (including the first wiring 21 and the second wiring 22), damage to the conductive protective layers 40a and 40b (especially damage due to abrasion) can be avoided. As a result, even if the conductive protective layers 40a and 40b are subjected to contact pressure from the connector terminals 102a and 102b, the second conductive wire 20 covered by the conductive protective layers 40a and 40b can be properly protected.

[0076] The pencil hardness mentioned above is measured using the pencil hardness test specified in JIS K5600-5-4 (1999).

[0077] As mentioned above, a second recess 20a is formed on the upper surface of the second conductive wire 20. Due to this second recess 20a, the binder applied to the upper surface of the second conductive wire 20 enters the second recess 20a during the manufacturing process of the conductive protective layers 40a and 40b. This improves the adhesion between the second conductive wire 20 and the conductive protective layers 40a and 40b.

[0078] As shown in Figures 1 and 4, the conductive protective layer 40a has a connecting portion 41a, an extension portion 42a, and a terminal connecting portion 43a.

[0079] The connection portion 41a is located on the right side of the paper in Figure 1 within the entire conductive protective layer 40a. The connection portion 41a is the portion of the conductive protective layer 40a that overlaps with a part of the busbar 8a (a part of the busbar 8a located on the left side of the paper in Figures 1 and 4) when viewed from above.

[0080] The length of the connection portion 41a in the conductive protective layer 40a in the width direction (first direction D1) of the second conductive wire 20 is longer than the line width of the second conductive wire 20 (each of the first wiring 21 and the second wiring 22) (see Figures 4 and 5). With this configuration, even if the first wiring 21 and the second wiring 22 are separated in the first direction D1 as in this embodiment, it is possible to ensure that the conductive protective layer 40a is long enough to cover the first wiring 21 and the second wiring 22 when viewed from above. As a result, the conductive protective layer 40a can cover the first wiring 21 and the second wiring 22 when viewed from above, and properly protect the first wiring 21 and the second wiring 22.

[0081] The extension portion 42a is formed in a roughly strip-like shape when viewed from above. The extension portion 42a extends from the connection portion 41a toward the connector terminal 102a located on the upper left side of the page in Figure 1. The extension portion 42a connects the connection portion 41a and the terminal connection portion 43a.

[0082] The extension portion 42a does not overlap with the busbar 8a in a top view. That is, the extension portion 42a does not overlap with the multiple second conductive wires 20 that constitute the busbar 8a in a top view.

[0083] The terminal connection portion 43a is located on the upper left side of the paper in Figure 1, within the entire conductive protective layer 40a. The terminal connection portion 43a is electrically connected to the connector terminal 102a.

[0084] As described above, the connection portion 41a of the conductive protective layer 40a overlaps with a part of the busbar 8a in a top view. That is, the conductive protective layer 40a (connection portion 41a) overlaps with a plurality of second conductive wires 20 that constitute a part of the busbar 8a in a top view. In this embodiment, the conductive protective layer 40a (connection portion 41a) covers the second conductive wires 20 (including the first wiring 21 and the second wiring 22) in a top view (see Figures 4 and 5). The conductive protective layer 40a then electrically connects the first wiring 21 and the second wiring 22.

[0085] As shown in Figures 4 and 5, the conductive protective layer 40a has a second double-layer portion 44a. The second double-layer portion 44a corresponds to the portion where a part of the conductive protective layer 40a overlaps with the protective layer 30 in a top view (see Figure 4). The second double-layer portion 44a is located on the upper side of the protective layer 30 (see Figure 5).

[0086] As shown in Figure 1, the conductive protective layer 40b has a connecting portion 41b, an extension portion 42b, and a terminal connecting portion 43b.

[0087] The connection portion 41b is located on the lower right side of the paper in Figure 1, within the entire conductive protective layer 40b. The connection portion 41b is the portion of the conductive protective layer 40b that overlaps with a part of the busbar 8b (a part of the busbar 8a located on the left side of the paper in Figures 1 and 4) when viewed from above.

[0088] Although not shown in the diagram, the length of the connection portion 41b in the conductive protective layer 40b in the width direction (first direction D1) of the second conductive wire 20 is longer than the wire width of the second conductive wire 20. With this configuration, similar to the connection portion 41a of the conductive protective layer 40a, the conductive protective layer 40b (connection portion 41b) covers the second conductive wires 20, 20 (wirings similar to the first wiring 21 and second wiring 22) that constitute a part of the busbar 8b when viewed from above, thereby properly protecting the second conductive wire 20.

[0089] The extension portion 42b is formed in a roughly strip-like shape when viewed from above. The extension portion 42b extends from the connection portion 41b toward the connector terminal 102b located on the upper left side of the page in Figure 1. The extension portion 42b connects the connection portion 41b and the terminal connection portion 43b.

[0090] The extension portion 42b does not overlap with the busbar 8b in a top view. That is, the extension portion 42b does not overlap with the multiple second conductive wires 20 that constitute the busbar 8b in a top view.

[0091] The terminal connection portion 43b is located on the upper left side of the conductive protective layer 40b in Figure 1. The terminal connection portion 43b is electrically connected to the connector terminal 102b.

[0092] As described above, the connection portion 41b of the conductive protective layer 40b overlaps with a part of the busbar 8b when viewed from above. That is, the conductive protective layer 40b (connection portion 41b) overlaps with a plurality of second conductive wires 20 that constitute a part of the busbar 8b when viewed from above. The connection portion 41b of the conductive protective layer 40b covers the second conductive wires 20 that constitute a part of the busbar 8b when viewed from above, similar to the conductive protective layer 40a. The connection portion 41b of the conductive protective layer 40b then electrically connects with the second conductive wires 20, 20 (wirings similar to the first wiring 21 and second wiring 22) that constitute a part of the busbar 8b.

[0093] Although not shown in the figures, the conductive protective layer 40b has an overlapping portion corresponding to the second double layer 44a, similar to the conductive protective layer 40a.

[0094] (Characteristic Configuration) However, in a configuration different from the conductive member 1 according to the embodiment of this disclosure, if an external terminal such as the connector terminal 102a is brought into contact with the upper surface of the second conductive wire 20 (first wiring 21 or second wiring 22) without relying on the conductive protective layer 40a (hereinafter referred to as the "provisional configuration"), the upper surface of the second conductive wire 20 (first wiring 21 or second wiring 22) becomes the contact surface when connecting the connector terminal 102a. In the above provisional configuration, if the second conductive wire 20 (first wiring 21 or second wiring 22) is thinned, the contact surface between the upper surface of the second conductive wire 20 and the connector terminal 102a becomes smaller. As a result, in the above provisional configuration, there is a risk that the conductivity between the connector terminal 102a and the busbar 8a will decrease.

[0095] In contrast to the above provisional configuration, in the conductive member 1 according to the embodiment of this disclosure, the conductive protective layer 40a ensures conductivity between the connector terminal 102a and the busbar 8a. That is, as a characteristic configuration of this disclosure, as described above, the conductive protective layer 40a (connection portion 41a) covers the first wiring 21 and the second wiring 22 when viewed from above (see Figures 4 and 5). With this configuration, even if the first wiring 21 and the second wiring 22 are separated in a predetermined direction, for example, the first wiring 21 and the second wiring 22 are electrically connected via the conductive protective layer 40a. Furthermore, since the conductive protective layer 40a covers the first wiring 21 and the second wiring 22 when viewed from above, the upper surface of the conductive protective layer 40a becomes the contact surface when an external terminal such as the connector terminal 102a is connected to the first wiring 21 and the second wiring 22. The upper surface of the conductive protective layer 40a substantially enlarges the contact surface for electrically connecting the connector terminal 102a to the second conductive wire 20 (including the first wiring 21 and the second wiring 22). As a result, the upper surface of the conductive protective layer 40a makes surface contact with the connector terminal 102a, making it easy to electrically connect the connector terminal 102a to the second conductive wire 20 (the first wiring 21 and the second wiring 22). In this way, by the connector terminal 102a contacting the conductive protective layer 40a (terminal connection portion 43a in this embodiment), it becomes possible to electrically connect the connector 100 to the second conductive wire 20 (the first wiring 21 and the second wiring 22) without using a flexible wiring board (not shown). As a result, conductivity between the connector terminal 102a and the second conductive wire 20 (the first wiring 21 and the second wiring 22) is ensured regardless of whether the second conductive wire 20 is thinned or not. Furthermore, similar to the conductive protective layer 40a, the conductive protective layer 40b also ensures conductivity between the connector terminal 102b and the multiple second conductive wires 20 that constitute the busbar 8b.

[0096] Furthermore, since the conductive protective layer 40a covers the first wiring 21 and the second wiring 22 when viewed from above, the relatively hard connector terminal 102a does not directly contact the second conductive wire 20 (first wiring 21 and second wiring 22), and the second conductive wire 20 is not worn down by contact pressure from the connector terminal 102a. In other words, there is no risk of the second conductive wire 20 being damaged by contact pressure from the connector terminal 102a. In this way, the first wiring 21 and the second wiring 22 are properly protected by the conductive protective layer 40a.

[0097] Therefore, in the conductive member 1 according to the embodiment of this disclosure, the above-described characteristic configuration ensures conductivity between external terminals such as connector terminals 102a and 102b and the second conductive wire 20, and also provides appropriate protection for the second conductive wire 20.

[0098] However, since the upper surface of the second conductive wire 20 is flush with the upper surface of the substrate 2 or located below the upper surface of the substrate 2, in the above provisional configuration (a configuration in which the connector terminal 102a is in contact with the upper surface of the second conductive wire 20 provided in the second groove 6 without relying on the conductive protective layer 40a), it becomes difficult to bring the connector terminal 102a into contact with the upper surface of the second conductive wire 20. On the other hand, as a characteristic configuration of this disclosure, since the conductive protective layer 40a covers the first wiring 21 and the second wiring 22 when viewed from above, regardless of the positional relationship between the upper surface of the substrate 2 and the upper surface of the second conductive wire 20, the connector terminal 102a comes into contact with the conductive protective layer 40a (terminal connection portion 43a in this embodiment), making it possible to electrically connect the connector 100 and the second conductive wire 20 (first wiring 21 and second wiring 22) without using a flexible wiring board. Therefore, in a configuration in which the second conductive wire 20 is provided in the second groove 6, as in the conductive member 1 according to the embodiment of this disclosure, it is possible to ensure conductivity between the connector terminal 102a and the second conductive wire 20 (first wiring 21 and second wiring 22).

[0099] Furthermore, since the conductive protective layer 40a covers the first wiring 21 and the second wiring 22 when viewed from above, even if the second conductive wire 20 is provided in the second groove 6, the conductive protective layer 40a prevents corrosive substances from entering the second groove 6, at least for the first wiring 21 and the second wiring 22. As a result, the first wiring 21 and the second wiring 22 can be properly protected. The conductive protective layer 40b can also provide the same effects as the conductive protective layer 40a.

[0100] [Modifications of the Embodiment] Modifications of the above embodiment will be described below. In the following, the differences in configuration of the conductive member 1 according to the modification compared to the conductive member 1 according to the above embodiment will be described in detail.

[0101] (Relationship between busbar and connection) In the above embodiment, the connection portion 41a of the conductive protective layer 40a is shown to overlap with a part of the busbar 8a when viewed from above, but the embodiment is not limited to this. For example, as shown in Figure 7, the connection portion 41c of the conductive protective layer 40c may overlap with the entire busbar 8c when viewed from above. That is, in this modified example, the connection portion 41c of the conductive protective layer 40c may overlap with all of the second conductive wires 20 constituting the busbar 8c when viewed from above.

[0102] (Relationship between conductive region and conductive protective layer) In the above embodiment, the conductive protective layer 40a is shown not overlapping with the conductive region C in a top view, but the embodiment is not limited to this. That is, as shown in Figure 7, the conductive protective layer 40c may overlap with a part of the conductive region C (the part of the conductive region C located on the left side of the paper) in a top view.

[0103] As shown in Figure 8, the protective layer 30 has a first overlapping portion 32. Similar to the above embodiment, the first overlapping portion 32 is a portion of the protective layer 30 that overlaps with the conductive protective layer 40c in a top view. Also, unlike the above embodiment, the first overlapping portion 32 is located in the vertical direction between the upper surface of the substrate 2 and the upper surface of the first conductive wire 10 and the conductive protective layer 40c (second overlapping portion 44c).

[0104] The conductive protective layer 40c has a second overlapping portion 44c. The second overlapping portion 44c is the portion where a part of the conductive protective layer 40c overlaps with the protective layer 30 in a top view (see Figure 4). The second overlapping portion 44c is located above the first overlapping portion 32 of the protective layer 30, similar to the embodiment described above.

[0105] As shown in this modified example, since the first overlapping portion 32 of the protective layer 30 is located between the upper surface of the first conductive wire 10 and the second overlapping portion 44c, it is possible to maintain electrical insulation between the first conductive wire 10 and the conductive protective layer 40c even if the conductive protective layer 40c overlaps with a part of the conductive region C in a top view. In other words, the first overlapping portion 32 makes it possible to maintain electrical insulation between the first conductive wire 10 covered by the protective layer 30 and the second conductive wire 20 (including the first wiring 21 or the second wiring 22) covered by the conductive protective layer 40c.

[0106] (Regarding the connecting portion) In the above embodiment, the entire side of the rectangle constituting the conductive region C is shown to be in contact with the second conductive wire 20 in the extending direction of the busbar 8a (or busbar 8b), but the embodiment is not limited to this. For example, as shown in Figure 7, a part of the side of the rectangle constituting the conductive region C may be in contact with the second conductive wire 20 (second wiring 22 in this modified example) in the extending direction of the busbar 8c (second direction D2).

[0107] Specifically, the conductive protective layer 40c of this modified example has a connecting portion 23. The connecting portion 23 corresponds to the second conductive wire 20 extending in the first direction D1. The connecting portion 23 extends from the middle of the second conductive wire 20, located on the left side of the paper in Figure 7, toward the conductive region C. The connecting portion 23 connects the busbar 8c and the conductive region C.

[0108] (Relationship between the imaginary line and the extension) The substrate 2 of the conductive member 1 in this modified example is provided with an imaginary line VL (see Figure 7). This imaginary line VL is located on the opposite side of the connection portion 41c from the side where the conductive region C is located (i.e., on the left side of the page in Figure 7 relative to the connection portion 41c).

[0109] On the other hand, the conductive protective layer 40c has an extension portion 45. The extension portion 45 does not overlap with the multiple second conductive wires 20 in a top view and extends from the connection portion 41c. The extension portion 45 is formed in a substantially L-shape in a top view. Specifically, the extension portion 45 extends in a substantially strip shape from the lower left side of the plane of Figure 7 at the connection portion 41c toward the upper left side of the plane of Figure 7 at the substrate 2.

[0110] The extension 45 is located on the upper surface of the substrate 2 to the left of the virtual line VL in Figure 7. That is, the extension 45 is separated from the conductive region C (multiple first conductive wires 10) and the busbar 8c (multiple second conductive wires 20) in the direction opposite to the first direction D1.

[0111] In this modified example, for instance, the virtual line VL may be configured as a "cutting line," and the portion of the substrate 2 located to the left of the plane of Figure 7 from the virtual line VL (the portion where the extension 45 is located) may be cut off. In this case, the extension 45 can be used as a test pattern to check the conductivity of the conductive member 1. Specifically, after the confirmation of the conductivity is complete, the portion of the substrate 2 located to the right of the plane of Figure 7 from the virtual line VL is cut off. This prevents damage to the conductive region C (multiple first conductive wires 10) and the multiple second conductive wires 20 that constitute the busbar 8c when checking the conductivity of the conductive member 1.

[0112] Furthermore, in this modified example, for instance, the virtual line VL may be configured as a "bending line," and the portion of the substrate 2 located to the left of the plane of Figure 7 from the virtual line VL (the portion where the extension 45 is located) may be bent. In this case, the portion of the substrate 2 located to the left of the plane of Figure 7 from the virtual line VL (the portion where the extension 45 is located) can be configured as a pseudo-flexible wiring board. That is, the extension 45 functions as a connection portion for connecting to a connector terminal (not shown in Figure 7). In this way, when the virtual line VL is configured as a "bending line," the flexible wiring board (not shown) can be omitted, and the busbar 8c (multiple second conductive wires 20) can be prevented from being damaged when the conductive member 1 is in use.

[0113] (Regarding the omission of terminal connection portions) In the above embodiment, the conductive protective layers 40a and 40b were shown to have terminal connection portions 43a and 43b, but the embodiment is not limited to this. That is, as shown in the modified example in Figure 7, the terminal connection portions may be omitted.

[0114] [Other Embodiments] In the above embodiments and modifications, the first conductive wire 10 is shown to be provided in the first groove 5, but the embodiment is not limited to this form. That is, the first conductive wire 10 does not have to be provided in the first groove 5. For example, the first conductive wire 10 may be made of a conductive material that protrudes upward from the upper surface of the substrate 2 by etching or the like (not shown). The same applies to the second conductive wire 20.

[0115] [Summary] The first to eighth disclosures are described below as a summary of the above embodiments and modifications. Regarding the first to sixth disclosures below, since the basic configuration of the conductive protective layer 40a and the conductive protective layer 40b is the same, only the conductive protective layer 40a will be described, and the description of the conductive protective layer 40b will be omitted.

[0116] As a first disclosure, the conductive member 1 comprises a substrate 2, a first conductive wire 10 provided on the upper surface of the substrate 2, a second conductive wire 20 provided on the upper surface of the substrate 2 and including a first wiring 21 and a second wiring 22, and a conductive protective layer 40a located on the upper side of the substrate 2 and overlapping the second conductive wire 20 in a top view. The width of the first wiring 21 is wider than the width of the first conductive wire 10. The width of the second wiring 22 is wider than the width of the first conductive wire 10. The conductive protective layer 40a covers the first wiring 21 and the second wiring 22 in a top view. The conductive protective layer 40a electrically connects the first wiring 21 and the second wiring 22.

[0117] A characteristic configuration of this disclosure is that the conductive protective layer 40a covers the first wiring 21 and the second wiring 22 when viewed from above. With this configuration, even if the first wiring 21 and the second wiring 22 are separated, for example, the first wiring 21 and the second wiring 22 are electrically connected via the conductive protective layer 40a. Furthermore, since the conductive protective layer 40a covers the first wiring 21 and the second wiring 22 when viewed from above, the upper surface of the conductive protective layer 40a becomes the contact surface when an external terminal such as a connector terminal 102a is connected to the first wiring 21 and the second wiring 22. The upper surface of the conductive protective layer 40a substantially enlarges the contact surface for electrically connecting the connector terminal 102a to the second conductive wire 20 (including the first wiring 21 and the second wiring 22). As a result, the upper surface of the conductive protective layer 40a makes surface contact with the connector terminal 102a, making it easy to electrically connect the connector terminal 102a to the second conductive wire 20 (including the first wiring 21 and the second wiring 22). Thus, in the first disclosure, by having the connector terminal 102a contact the conductive protective layer 40a, it becomes possible to electrically connect the connector 100 and the second conductive wire 20 (including the first wire 21 and the second wire 22) without using a flexible wiring board. As a result, conductivity between the connector terminal 102a and the second conductive wire 20 (including the first wire 21 and the second wire 22) is ensured regardless of whether the second conductive wire 20 is thinned or not.

[0118] Furthermore, since the conductive protective layer 40a covers the first wiring 21 and the second wiring 22 when viewed from above, the relatively hard connector terminal 102a does not directly contact the second conductive wire 20 (first wiring 21 and second wiring 22), and the second conductive wire 20 is not worn down by contact pressure from the connector terminal 102a. In other words, there is no risk of the second conductive wire 20 being damaged by contact pressure from the connector terminal 102a. Thus, in the first disclosure, the conductive protective layer 40a appropriately protects the second conductive wire 20 (first wiring 21 and second wiring 22).

[0119] Therefore, the first disclosure can ensure conductivity between an external terminal such as the connector terminal 102a and the second conductive wire 20, and can also properly protect the second conductive wire 20.

[0120] As a second disclosure, the length of the conductive protective layer 40a in the width direction of the second conductive wire 20 is longer than the wire width of the second conductive wire 20. With this configuration, even if the first wiring 21 and the second wiring 22 are separated, it is possible to ensure that the conductive protective layer 40a is long enough to cover the first wiring 21 and the second wiring 22 when viewed from above. As a result, the conductive protective layer 40a can cover the first wiring 21 and the second wiring 22 when viewed from above, thereby properly protecting the first wiring 21 and the second wiring 22.

[0121] As a third disclosure, a first groove 5 and a second groove 6 are formed on the upper surface of the substrate 2. The first conductive wire 10 is provided in the first groove 5. The second conductive wire 20 is provided in the second groove 6.

[0122] According to the third disclosure, the upper surfaces of the first conductive wire 10 and the second conductive wire 20 can be made flush with the upper surface of the substrate 2, or positioned below the upper surface of the substrate 2. Furthermore, by providing the second conductive wire 20 in the second groove 6, it becomes possible to reduce the thickness of the conductive protective layer 40a provided on the upper surface of the substrate 2.

[0123] Furthermore, in a configuration different from the present disclosure, if the connector terminal 102a is to be in contact with the upper surface of the second conductive wire 20 provided in the second groove 6 without relying on the conductive protective layer 40a (the above-mentioned hypothetical configuration), the upper surface of the second conductive wire 20 is located flush with the upper surface of the substrate 2 or below the upper surface of the substrate 2, making it difficult to bring the connector terminal 102a into contact with the upper surface of the second conductive wire 20. On the other hand, as described above, a characteristic configuration of the present disclosure is that the conductive protective layer 40a covers the first wiring 21 and the second wiring 22 when viewed from above. Therefore, regardless of the positional relationship between the upper surface of the substrate 2 and the upper surface of the second conductive wire 20, the connector terminal 102a can contact the conductive protective layer 40a, making it possible to electrically connect the connector 100 and the second conductive wire 20 (first wiring 21 and second wiring 22) without using a flexible wiring board. Therefore, in the configuration in which the second conductive wire 20 is provided in the second groove 6, as in the third disclosure, conductivity between the connector terminal 102a and the second conductive wire 20 (first wiring 21 and second wiring 22) can be ensured.

[0124] Furthermore, since the conductive protective layer 40a covers the first wiring 21 and the second wiring 22 when viewed from above, even in the configuration where the second conductive wire 20 is provided in the second groove 6 as in the third disclosure, the conductive protective layer 40a can prevent corrosive substances from entering the second groove 6 in the first wiring 21 and the second wiring 22. As a result, the first wiring 21 and the second wiring 22 can be properly protected in the third disclosure.

[0125] As a fourth disclosure, the conductive protective layer 40a includes a plurality of conductive particles made of metal or carbon. The presence of such a plurality of conductive particles improves the conductivity of the conductive protective layer 40a. As a result, conductivity between the connector terminal 102a and the second conductive wire 20 (first wiring 21 and second wiring 22) is ensured. Furthermore, the inclusion of a plurality of conductive particles in the conductive protective layer 40a improves the hardness of the conductive protective layer 40a. As a result, the protective function of the conductive protective layer 40a in protecting the first wiring 21 and the second wiring 22 can be enhanced.

[0126] Furthermore, as a fifth disclosure, the conductive protective layer 40a includes a plurality of conductive fibers made of metal or carbon. The conductivity of the conductive protective layer 40a is improved by these plurality of conductive fibers. As a result, conductivity between the connector terminal 102a and the second conductive wire 20 (first wiring 21 and second wiring 22) is ensured. In addition, the hardness of the conductive protective layer 40a is improved by including a plurality of conductive fibers. As a result, the function of the conductive protective layer 40a in protecting the first wiring 21 and the second wiring 22 can be enhanced.

[0127] As a sixth disclosure, the hardness of the conductive protective layer 40a is 3H or higher on the pencil hardness scale. With this configuration, for example, even if a connector terminal 102a, which has relatively high hardness in a general-purpose connector 100, is brought into contact with the upper surface of the conductive protective layer 40a located directly above the first wiring 21 or the second wiring 22, damage to the conductive protective layer 40a due to abrasion can be avoided. As a result, even if the conductive protective layer 40a is subjected to contact pressure from the connector terminal 102a, the first wiring 21 and the second wiring 22 covered by the conductive protective layer 40a can be properly protected.

[0128] As a seventh disclosure, the conductive member 1 further comprises a protective layer 30 that is transparent and insulating and covers the first conductive wire 10. The protective layer 30 has a first overlapping portion 32 (overlapping portion) that overlaps with the conductive protective layer 40c in a top view. The first overlapping portion 32 (overlapping portion) is located between the top surface of the substrate 2 and the conductive protective layer 40c.

[0129] In the seventh disclosure, the first conductive wire 10 can be protected by a transparent and insulating protective layer 30. Furthermore, since the first overlapping portion 32 of the protective layer 30 is located between the upper surface of the substrate 2 and the conductive protective layer 40c, even if the conductive protective layer 40c overlaps with the first conductive wire 10 (the first conductive wire 10 constituting a part of the conductive region C shown in Figures 7 and 8 of the above modified example) when viewed from above, it is possible to maintain electrical insulation between the first conductive wire 10 and the conductive protective layer 40c. In other words, the first overlapping portion 32 of the protective layer 30 makes it possible to maintain electrical insulation between the first conductive wire 10 covered by the protective layer 30 and the second conductive wire 20 (including the first wiring 21 or the second wiring 22) covered by the conductive protective layer 40c.

[0130] In the eighth disclosure, the conductive protective layer 40c has a connection portion 41c that overlaps with the plurality of second conductive wires 20 in a top view, and an extension portion 45 (see Figure 7) that does not overlap with the plurality of second conductive wires 20 in a top view and extends from the connection portion 41c. In the eighth disclosure, as described in the above modification, the extension portion 45 can be used as a test pattern for confirming the conductivity state of the conductive member 1. The extension portion 45 can also function as a connection portion for connecting to a connector terminal.

[0131] This disclosure is applicable to industrial use as a conductive material.

[0132] 1: Conductive component 2: Substrate 3: First layer 4: Second layer 5: First groove 6: Second groove 8a, 8b, 8c: Busbar 10: First conductive wire 10a: First recess 20: Second conductive wire 20a: Second recess 21: First wiring 22: Second wiring 23: Connecting part 30: Protective layer 31: Main body 32: First overlap 40a, 40b, 40c: Conductive protective layer 41a, 41b, 41c: Connection part 42a, 42b, 45: Extension part 43a, 43b: Terminal connection part 44a, 44c: Second double overlap 100: Connector 101: Connector body 102a, 102b: Connector terminal C: Conductive region VL: Virtual line

Claims

1. A conductive member comprising: a substrate; a first conductive wire provided on the upper surface of the substrate; a second conductive wire provided on the upper surface of the substrate and including a first wiring and a second wiring; and a conductive protective layer located on the upper surface side of the substrate and overlapping the second conductive wire in a top view, wherein the wire width of the first wiring is wider than the wire width of the first conductive wire; the wire width of the second wiring is wider than the wire width of the first conductive wire; the conductive protective layer covers the first wiring and the second wiring in a top view; and the conductive protective layer electrically connects the first wiring and the second wiring.

2. A conductive member according to claim 1, wherein the length of the conductive protective layer in the width direction of the second conductive wire is longer than the wire width of the second conductive wire.

3. A conductive member according to claim 1 or 2, wherein a first groove and a second groove are formed on the upper surface of the substrate, the first conductive wire is provided in the first groove, and the second conductive wire is provided in the second groove.

4. A conductive member according to any one of claims 1 to 3, wherein the conductive protective layer comprises a plurality of conductive particles made of metal or carbon.

5. A conductive member according to claim 4, wherein the conductive protective layer includes a plurality of conductive fibers made of metal or carbon.

6. A conductive member according to claim 4 or 5, wherein the hardness of the conductive protective layer is 3H or higher on a pencil hardness scale.

7. A conductive member according to any one of claims 1 to 6, further comprising a protective layer having transparency and insulating properties and covering the first conductive wire, wherein the protective layer has an overlapping portion that overlaps with the conductive protective layer in a top view, and the overlapping portion is located between the top surface of the substrate and the conductive protective layer.

8. A conductive member according to any one of claims 1 to 7, wherein the conductive protective layer has a connection portion that overlaps with the plurality of second conductive wires in a top view, and an extension portion that does not overlap with the plurality of second conductive wires in a top view and extends from the connection portion.

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