Circuit board, high-frequency module, communication device, and method for manufacturing circuit board

Abstract

The present invention provides a circuit board with which it is possible to miniaturize a mounting board and a circuit element. The circuit board (1) comprises a mounting board (2), a protruding part (3), and a conductive part (4). The mounting board (2) has one main surface. The protruding part (3) is made of the same material as the mounting board (2) and is disposed on the one main surface of the mounting board (2). The conductive part (4) is disposed on a main surface (31) of the protruding part (3) and constitutes at least a portion of a circuit element (5). The circuit element (5) is an element selected from among an inductor (51) and a capacitor (52).

Description

Circuit Board, High-Frequency Module, Communication Device, and Method for Manufacturing Circuit Board

[0001] The present invention generally relates to a circuit board, a high-frequency module, a communication device, and a method for manufacturing a circuit board, and more particularly to a circuit board including a mounting substrate, a high-frequency module including the circuit board, a communication device including the high-frequency module, and a method for manufacturing a circuit board including a mounting substrate.

[0002] Patent Document 1 describes a circuit board in which passive components such as inductors and capacitors are embedded in a mounting substrate.

[0003] Japanese Unexamined Patent Publication No. 10-303566

[0004] In recent years, miniaturization of mounting substrates and circuit elements has been demanded.

[0005] The present invention has been made in view of the above points, and an object of the present invention is to provide a circuit board, a high-frequency module, a communication device, and a method for manufacturing a circuit board that can achieve miniaturization of a mounting substrate and a circuit element.

[0006] A circuit board according to one aspect of the present invention includes a mounting substrate, a convex portion, and a conductive portion. The mounting substrate has one main surface. The convex portion is made of the same material as the mounting substrate and is disposed on the one main surface of the mounting substrate. The conductive portion is disposed on a main surface of the convex portion and constitutes at least a part of a circuit element. The circuit element is an element selected from among an inductor and a capacitor.

[0007] A high-frequency module according to one aspect of the present invention includes the circuit board and a filter. The filter is disposed on the circuit board.

[0008] A communication device according to one aspect of the present invention includes the high-frequency module and a signal processing circuit. The signal processing circuit is connected to the high-frequency module.

[0009] In a method for manufacturing a circuit board according to one aspect of the present invention, a substrate body is prepared. The substrate body becomes part of a mounting substrate. In the manufacturing method, a protruding portion body is placed on the substrate body. The protruding portion body is made of the same material as the substrate body and becomes part of the protruding portion. In the manufacturing method, a sheet member is bonded to the substrate body and the protruding portion body such that the conductive layer overlaps with the protruding portion body. The sheet member is a member on which the conductive layer is disposed on the base. The base is made of the same material as the substrate body and the protruding portion body and becomes part of the mounting substrate and part of the protruding portion. The conductive layer becomes a conductive portion. The conductive portion constitutes at least part of a circuit element. The circuit element is an element selected from inductors and capacitors.

[0010] According to the above-described embodiment of the present invention, the circuit board, high-frequency module, communication device, and method for manufacturing the circuit board can be miniaturized, and the mounted substrate and circuit elements can be miniaturized.

[0011] Figure 1 is a schematic diagram of a circuit board and high-frequency module according to Embodiment 1. Figure 2 is a plan view of the inductor of the same circuit board. Figure 3 is a plan view of the capacitor of the same circuit board. Figure 4 is a circuit diagram of the main part of the same high-frequency module. Figure 5 is a process diagram showing a first example of a method for manufacturing the same circuit board. Figure 6 is a process diagram showing a second example of a method for manufacturing the same circuit board. Figure 7 is a side view of a plurality of inductors of a circuit board according to Embodiment 2. Figure 8 is a plan view of a plurality of inductors of the same circuit board. Figure 9 is a cross-sectional view of a capacitor of a circuit board according to Embodiment 3. Figure 10 is a side view of a plurality of inductors of a circuit board according to Embodiment 4. Figure 11 is a cross-sectional view of a capacitor of the same circuit board. Figure 12 is a schematic diagram of a circuit board and high-frequency module according to Embodiment 5. Figure 13 is a plan view of the meander-shaped conductive part of the same circuit board. Figure 14 is a circuit diagram of the main part of the same high-frequency module. Figure 15 is a side view of a plurality of inductors of a circuit board according to Embodiment 6. Figure 16 is a plan view of the multiple inductors on the same circuit board. Figure 17 is a schematic diagram of the circuit board and high-frequency module according to Embodiment 7. Figure 18 is a side view of the multiple inductors on the same circuit board. Figure 19 is a plan view of the multiple inductors on the same circuit board. Figure 20 is a schematic diagram of the communication device according to Embodiment 8.

[0012] The circuit board 1 and high-frequency module 6 according to Embodiments 1 to 7, and the communication device 9 according to Embodiment 8 will be described below with reference to the drawings. Figures 1 to 3, 5 to 13, and 15 to 19, which are referenced in the embodiments below, are schematic diagrams, and the ratios of the size and thickness of each component in the figures do not necessarily reflect the actual dimensional ratios. Also, Figure 1 shows a cross-section of a part of the circuit board 1.

[0013] (Embodiment 1) (1) Circuit board The circuit board 1 according to Embodiment 1 comprises a mounting substrate 2, a plurality of protrusions 3, and a plurality of conductive parts 4, as shown in Figure 1. The mounting substrate 2 has a first main surface 21. The plurality of protrusions 3 are made of the same material as the mounting substrate 2 (the dielectric layer of the mounting substrate 2). In other words, the material of the plurality of protrusions 3 is the same as the main material of the mounting substrate. The plurality of protrusions 3 are arranged on the first main surface 21 of the mounting substrate 2. The plurality of conductive parts 4 are arranged on the main surface 31 of the plurality of protrusions 3. Each of the plurality of conductive parts 4 constitutes at least a part of a circuit element 5. The circuit element 5 is an element selected from an inductor 51 and a capacitor 52. The first main surface 21 of the mounting substrate 2 corresponds to one of the main surfaces of the mounting substrate 2. Here, in the present invention, "same material" refers to a material in which the main component (80% by weight or more of the total components constituting the material) is the same.

[0014] According to the circuit board 1 of Embodiment 1, the mounting board 2 and the circuit elements 5 can be miniaturized.

[0015] (2) The high-frequency module 6 according to the high-frequency module embodiment 1 comprises a circuit board 1 and a filter 7, as shown in Figure 1. The filter 7 is located on the circuit board 1.

[0016] (3) Components of the circuit board Hereinafter, each component of the circuit board 1 according to Embodiment 1 will be described with reference to the drawings.

[0017] (3.1) Mounting board The mounting board 2 has a first main surface 21 and a second main surface 22, as shown in Figure 1. The first main surface 21 and the second main surface 22 face each other. More specifically, the first main surface 21 and the second main surface 22 face each other in the thickness direction D1 of the mounting board 2. The mounting board 2 has a ground layer 24.

[0018] (3.2) The multiple protrusions 3 shown in Figure 1 are made of the same material as the mounting substrate 2 (the dielectric layer of the mounting substrate 2). In other words, the material of the multiple protrusions 3 is the same as the main material of the mounting substrate. The multiple protrusions 3 are arranged on the first main surface 21 of the mounting substrate 2. More specifically, the multiple protrusions 3 are arranged in a direction D2 perpendicular to the thickness direction D1 of the mounting substrate 2. The multiple protrusions 3 include two protrusions 3a and one protrusion 3b. Here, in the present invention, "same material" refers to a material in which the main component (80% by weight or more of the total components constituting the material) is the same.

[0019] (3.3) Conductive parts The multiple conductive parts 4 are arranged on the main surface 31 of the multiple protrusions 3, as shown in Figure 1. More specifically, the multiple conductive parts 4 correspond to the multiple protrusions 3. The multiple conductive parts 4 include two conductive parts 4a and a conductive part 4b. In the example of Figure 1, the multiple conductive parts 4 correspond one-to-one with the multiple protrusions 3. Each of the multiple conductive parts 4 is arranged on the main surface 31 of the corresponding protrusion 3 among the multiple protrusions 3. Specifically, conductive part 4a is arranged on the main surface 31 of protrusion 3a. Conductive part 4b is arranged on protrusion 3b.

[0020] Each of the multiple conductive parts 4 constitutes at least a part of the circuit element 5. The circuit element 5 is a passive element selected from among an inductor 51 and a capacitor 52.

[0021] As shown in Figures 1 and 2, the conductive portion 4a constitutes at least a part of the inductor 51. In other words, the circuit element 5 in which the conductive portion 4a is part is the inductor 51. Specifically, the conductive portion 4a is the coil 511 that constitutes the inductor 51.

[0022] As shown in Figures 1 and 3, the conductive portion 4b constitutes at least a part of the capacitor 52. In other words, the circuit element 5 in which the conductive portion 4b is part is the capacitor 52. The capacitor 52 has a first electrode 521 and a second electrode 522. The first electrode 521 and the second electrode 522 face each other. Specifically, the conductive portion 4b is the first electrode 521 of the capacitor 52. The second electrode 522 of the capacitor 52 is provided within the protrusion 3.

[0023] The area of ​​the first electrode 521 of the capacitor 52 is larger than the area of ​​the second electrode 522 of the capacitor 52.

[0024] (4) Components of the High-Frequency Module Hereinafter, each component of the high-frequency module 6 according to Embodiment 1 will be described with reference to the drawings.

[0025] The filter 7 shown in Figure 1 has a passband that includes the frequency band of the high-frequency signal passing through the high-frequency module 6, and allows the high-frequency signal to pass through.

[0026] The filter 7 comprises a filter body 71, a plurality of connection parts 72, and a functional electrode 73 (not shown in Figure 1, see Figure 12). The plurality of connection parts 72 are, for example, solder bumps. The plurality of connection parts 72 are components for connecting to the outside. The functional electrode 73 is housed in the filter body 71.

[0027] The filter 7 is located on the circuit board 1. More specifically, the filter 7 is located on the first main surface 21 of the circuit board 1 by connecting a plurality of connection parts 72 to a plurality of electrodes 23 on the mounting board 2.

[0028] In the high-frequency module 6 according to Embodiment 1, as shown in Figure 4, the inductor 51 is connected between the output terminal 75 of the filter 7 and the low-noise amplifier 61, and the capacitor 52 is connected between the input terminal 74 of the filter 7 and ground.

[0029] (5) Method for manufacturing a circuit board Next, the method for manufacturing the circuit board 1 according to Embodiment 1 will be described with reference to Figures 5 and 6.

[0030] The circuit board 1 can be manufactured, for example, using a 3D printer. Specifically, an unfired laminate is produced by inkjet printing using dielectric layer ink and internal electrode ink. Subsequently, the unfired laminate is immersed in a conductive paste for external electrodes, then fired, and a plating layer is formed as needed to obtain the circuit board 1. Alternatively, the unfired laminate may be fired before being immersed in the conductive paste for external electrodes.

[0031] (5.1) First example of manufacturing method The first example of a manufacturing method for the circuit board 1 according to Embodiment 1 comprises a first step, a second step, and a third step.

[0032] In the first step, the substrate body 101 is prepared as shown in Figure 5 (see Step 1 in Figure 5). The substrate body 101 becomes part of the mounting substrate 2 (see Step 4 in Figure 5).

[0033] In the second step, as shown in Figure 5, multiple protrusion bodies 102 are placed on the substrate body 101 (see Step 2 in Figure 5). The multiple protrusion bodies 102 are made of the same material as the substrate body 101 (the dielectric layer of the substrate body 101). The multiple protrusion bodies 102 become part of the multiple protrusions 3 (see Step 4 in Figure 5).

[0034] In the third step, as shown in Figure 5, the sheet member 103 is bonded to the substrate body 101 and the multiple protrusion bodies 102 (see Step 3 in Figure 5). The sheet member 103 is a member in which multiple conductive layers 105 are arranged on a base portion 104. The base portion 104 is made of the same material as the substrate body 101 (dielectric layer of the substrate body 101) and the multiple protrusion bodies 102. The base portion 104 becomes part of the mounting substrate 2 and part of the multiple protrusions 3. The multiple conductive layers 105 become multiple conductive parts 4 (see Step 4 in Figure 5). Each of the multiple conductive parts 4 constitutes at least part of a circuit element 5 (see Figure 1). In the first example, the circuit element 5 is an inductor 51 (see Figure 1). In the third step, the sheet member 103 is bonded to the substrate body 101 and the multiple protrusion bodies 102 so that the multiple conductive layers 105 overlap with the multiple protrusion bodies 102.

[0035] The circuit board 1 can be manufactured through the first, second, and third steps (see Step 4 in Figure 5).

[0036] (5.2) Second example of manufacturing method The second example of the manufacturing method of the circuit board 1 according to Embodiment 1 comprises a first step, a second step, and a third step.

[0037] In the first step, the substrate body 101 is prepared as shown in Figure 6 (see Step 1 in Figure 6). The substrate body 101 becomes part of the mounting substrate 2 (see Step 4 in Figure 6).

[0038] In the second step, as shown in Figure 6, multiple protrusion bodies 102 are placed on the substrate body 101 (see Step 2 in Figure 6). The multiple protrusion bodies 102 are made of the same material as the substrate body 101 (the dielectric layer of the substrate body 101). The multiple protrusion bodies 102 become part of the multiple protrusions 3 (see Step 4 in Figure 6).

[0039] In the third step, as shown in Figure 6, the sheet member 106 is bonded to the substrate body 101 and the multiple protrusion bodies 102. Then, the sheet member 103 is bonded to the substrate body 101 and the multiple protrusion bodies 102 via the sheet member 106 (see Step 3 in Figure 6). The sheet member 103 is a member in which multiple conductive layers 105 are arranged on a base portion 104. The base portion 104 is made of the same material as the substrate body 101 (dielectric layer of the substrate body 101) and the multiple protrusion bodies 102. The base portion 104 becomes part of the mounting substrate 2 and part of the multiple protrusions 3. The multiple conductive layers 105 become multiple conductive parts 4 (see Step 4 in Figure 6). Each of the multiple conductive parts 4 constitutes at least part of the circuit element 5 (see Figure 1). The sheet member 106 is a member in which multiple conductive layers 108 are arranged on a base portion 107. The base portion 107 is made of the same material as the substrate body 101 (dielectric layer of the substrate body 101) and the multiple protrusion bodies 102. The base portion 107 becomes part of the mounting substrate 2 and part of the multiple protrusions 3. Each of the multiple conductive layers 108 is a layer provided inside the protrusions 3. Each of the multiple conductive layers 108 constitutes at least part of the circuit element 5. In the second example, the circuit element 5 is a capacitor 52 (see Figure 1). In the third step, the sheet member 106 is bonded to the substrate body 101 so that the multiple conductive layers 108 overlap with the multiple protrusion bodies 102, and then the sheet member 103 is bonded to the substrate body 101 and the multiple protrusion bodies 102 so that the multiple conductive layers 105 overlap with the multiple protrusion bodies 102.

[0040] The circuit board 1 can be manufactured through the first, second, and third steps (see Step 4 in Figure 6).

[0041] The first and second examples of the above manufacturing methods are examples of methods for manufacturing the circuit board 1, and the circuit board 1 may be manufactured using other manufacturing methods.

[0042] (6) Effect The circuit board 1 according to Embodiment 1 includes a mounting substrate 2, a convex portion 3, and a conductive portion 4. The mounting substrate 2 has a first main surface 21 (one main surface). The convex portion 3 is made of the same material as the mounting substrate 2 (the dielectric layer of the mounting substrate 2), and is disposed on the first main surface 21 of the mounting substrate 2. The conductive portion 4 is disposed on the main surface 31 of the convex portion 3 and constitutes at least a part of the circuit element 5. The circuit element 5 is an element selected from among an inductor 51 and a capacitor 52.

[0043] According to the circuit board 1 of Embodiment 1, the conductive portion 4 constituting at least a part of the circuit element 5 selected from an inductor 51 and a capacitor 52 is disposed on the convex portion 3 that is made of the same material as the mounting substrate 2 (the dielectric layer of the mounting substrate 2) and is disposed on the mounting substrate 2. This makes it possible to reduce the size of the mounting substrate 2 and the circuit element 5. More specifically, since the number of components can be reduced compared to a case where the circuit element is a chip component, the mounting substrate 2 and the circuit element 5 can be reduced in size. In other words, the mounting substrate 2 and the circuit element 5 can be reduced in size compared to a case where a chip component that is a circuit element is disposed on one main surface of the mounting substrate.

[0044] According to the circuit board 1 of Embodiment 1, since the mounting substrate 2 (the dielectric layer of the mounting substrate 2) and the convex portion 3 are made of the same material, the mounting substrate 2 and the convex portion 3 can be integrally formed. As a result, the productivity of the circuit board 1 can be improved.

[0045] According to the circuit board 1 of Embodiment 1, the distance between the circuit element 5 and the ground layer 24 of the mounting substrate 2 can be increased, so the stray capacitance between the circuit element 5 and the ground layer 24 can be reduced. Since the distance between the circuit element 5 and the wiring conductor layer 25 of the mounting substrate 2 can be increased, the isolation between the circuit element 5 and the wiring conductor layer 25 can be improved. As a result, the characteristics of the circuit element 5 can be improved.

[0046] According to the circuit board 1 according to the first embodiment, the quality of the circuit board 1 can be improved. More specifically, compared to a case where the circuit element is a chip component, connection between the chip component serving as the circuit element and a mounting substrate is not required, so that the quality of the circuit board 1 can be improved.

[0047] In the circuit board 1 according to the first embodiment, the circuit element 5 is a capacitor 52. The capacitor 52 includes a first electrode 521 and a second electrode 522. The first electrode 521 and the second electrode 522 face each other. The conductive portion 4b is the first electrode 521 of the capacitor 52. The second electrode 522 of the capacitor 52 is provided inside the convex portion 3.

[0048] According to the circuit board 1 according to the first embodiment, not only a part of the capacitor 52 but the entire capacitor 52 can be provided in the convex portion 3, so that further size reduction can be achieved.

[0049] In the circuit board 1 according to the first embodiment, the area of the first electrode 521 of the capacitor 52 is larger than the area of the second electrode 522 of the capacitor 52.

[0050] According to the circuit board 1 according to the first embodiment, compared to a capacitor formed on a flat surface, the capacitor 52 can be formed in a space-saving manner, and can be more resistant to lamination misalignment when the first electrode 521 and the second electrode 522 are laminated. Compared to a capacitor formed on a flat surface, the space occupied by the capacitor 52 can be reduced in a plan view from the thickness direction D1 of the mounting substrate 2.

[0051] According to the high-frequency module 6 according to the first embodiment, the high-frequency module 6 includes the circuit board 1 and a filter 7. The filter 7 is disposed on the circuit board 1.

[0052] According to the high-frequency module 6 according to the first embodiment, in the circuit board 1, size reduction of the mounting substrate 2 and the circuit element 5 can be achieved, productivity of the circuit board 1 can be improved, characteristics of the circuit element 5 can be improved, and quality of the circuit board 1 can be improved.

[0053] In the manufacturing method of the circuit board 1 according to Embodiment 1, a substrate body 101 is prepared. The substrate body 101 becomes part of the mounting substrate 2. A protrusion body 102 is placed on the substrate body 101. The protrusion body 102 is made of the same material as the substrate body 101 (the dielectric layer of the substrate body 101). The protrusion body 102 becomes part of the protrusion 3. A sheet member 103 is bonded to the substrate body 101 and the protrusion body 102 so that the conductive layer 105 overlaps with the protrusion body 102. The sheet member 103 is a member on which the conductive layer 105 is arranged on a base portion 104. The base portion 104 is made of the same material as the substrate body 101 (the dielectric layer of the substrate body 101) and the protrusion body 102. The base portion 104 becomes part of the mounting substrate 2 and part of the protrusion 3. The conductive layer 105 becomes the conductive portion 4. The conductive portion 4 constitutes at least a part of the circuit element 5. The circuit element 5 is selected from among the inductor 51 and the capacitor 52.

[0054] According to the manufacturing method of the circuit board 1 of Embodiment 1, a conductive portion 4 constituting at least a part of a circuit element 5 selected from an inductor 51 and a capacitor 52 is placed on a protrusion 3 made of the same material as the mounting substrate 2 (the dielectric layer of the mounting substrate 2) and arranged on the mounting substrate 2. This makes it possible to miniaturize the mounting substrate 2 and the circuit element 5. More specifically, the number of components can be reduced compared to when the circuit element is a chip component, thus enabling miniaturization. In other words, compared to when the chip component, which is the circuit element, is arranged on one main surface of the mounting substrate, the mounting substrate 2 and the circuit element 5 can be miniaturized.

[0055] According to the manufacturing method of the circuit board 1 in Embodiment 1, since the mounting substrate 2 (dielectric layer of the mounting substrate 2) and the protrusion 3 are made of the same material, it is possible to integrally mold the mounting substrate 2 and the protrusion 3. As a result, the productivity of the circuit board 1 can be improved.

[0056] According to the manufacturing method of the circuit board 1 in Embodiment 1, the distance between the circuit element 5 and the ground layer 24 of the mounting substrate 2 can be increased, thereby reducing the stray capacitance between the circuit element 5 and the ground layer 24. The distance between the circuit element 5 and the wiring conductor layer 25 of the mounting substrate 2 can be increased, thereby improving the isolation between the circuit element 5 and the wiring conductor layer 25. As a result, the characteristics of the circuit element 5 can be improved.

[0057] According to the manufacturing method of the circuit board 1 in Embodiment 1, the quality of the circuit board 1 can be improved. More specifically, compared to the case where the circuit elements are chip components, the connection between the chip components, which are the circuit elements, and the mounting board is unnecessary, thus improving the quality of the circuit board 1.

[0058] (7) Modifications Below, modifications of Embodiment 1 will be described.

[0059] As a modification 1 of Embodiment 1, the circuit board 1 may have one protrusion 3 instead of multiple protrusions 3.

[0060] As a second modification of Embodiment 1, the circuit board 1 may have one conductive part 4 instead of multiple conductive parts 4.

[0061] As a third modification of Embodiment 1, it is not necessary for conductive portions 4 to be placed on all of the multiple protrusions 3 of the circuit board 1; conductive portions 4 may be placed on only some of the multiple protrusions 3.

[0062] The circuit board 1 according to each of the above modified examples also provides the same effects as the circuit board 1 according to Embodiment 1.

[0063] (Embodiment 2) The circuit board 1 according to Embodiment 2 differs from the circuit board 1 according to Embodiment 1 (see Figure 1) in that, as shown in Figure 7, the winding axes A1 of the two inductors 51 are in directions different from the parallel direction. Regarding the circuit board 1 according to Embodiment 2, components similar to those in the circuit board 1 according to Embodiment 1 are denoted by the same reference numerals and their descriptions are omitted.

[0064] (1) The circuit board 1 of the second embodiment is provided with a plurality of protrusions 3 as shown in Figures 7 and 8, instead of the plurality of protrusions 3 of the first embodiment. Also, the circuit board 1 of the second embodiment is provided with a plurality of conductive parts 4 as shown in Figures 7 and 8, instead of the plurality of conductive parts 4 of the first embodiment.

[0065] The circuit element 5 is an inductor 51, as shown in Figures 7 and 8.

[0066] The winding axes A1 of the multiple inductors 51 shown in Figures 7 and 8 are aligned in directions different from both the direction normal to the first main surface 21 (one main surface) of the mounting substrate 2 (see Figure 1) and the direction parallel to the first main surface 21 of the mounting substrate 2.

[0067] As shown in Figures 7 and 8, the multiple protrusions 3 include a first protrusion 3c and a second protrusion 3d. The first protrusion 3c is made of the same material as the mounting substrate 2 (the dielectric layer of the mounting substrate 2) and is located on the first main surface 21 of the mounting substrate 2. The second protrusion 3d is made of the same material as the mounting substrate 2 (the dielectric layer of the mounting substrate 2) and is located on the first main surface 21 of the mounting substrate 2. Regarding the protrusions 3 of Embodiment 2, the same configuration and function as the protrusions 3 of Embodiment 1 (see Figure 1) will not be described.

[0068] As shown in Figures 7 and 8, the multiple conductive parts 4 include a first conductive part 4c and a second conductive part 4d. The first conductive part 4c is located on the main surface 31 of the first protrusion 3c among the multiple protrusions 3, and is a first coil 511a that constitutes the first inductor 51a. The second conductive part 4d is located on the main surface 31 of the second protrusion 3d among the multiple protrusions 3, and is a second coil 511b that constitutes the second inductor 51b. Regarding the conductive part 4 of Embodiment 2, the same configuration and function as the conductive part 4 of Embodiment 1 (see Figure 1) will not be described.

[0069] In Embodiment 2, the winding axis A11 of the first inductor 51a and the winding axis A12 of the second inductor 51b are not parallel. That is, the direction of the winding axis A11 of the first inductor 51a and the direction of the winding axis A12 of the second inductor 51b are different from the parallel direction. In Embodiment 2, the direction of the magnetic flux of the first inductor 51a and the direction of the magnetic flux of the second inductor 51b are different from each other. When current flows through the first inductor 51a and the second inductor 51b, the direction of the magnetic flux generated in the first inductor 51a and the direction of the magnetic flux generated in the second inductor 51b are different from each other.

[0070] (2) In the circuit board 1 according to the second embodiment of the effect, the circuit element 5 is an inductor 51. The winding axis A1 of the inductor 51 is aligned in a direction different from both the direction normal to the first main surface 21 (one main surface) of the mounting board 2 and the direction parallel to the first main surface 21 of the mounting board 2.

[0071] According to the circuit board 1 of Embodiment 2, it is possible to keep the magnetic flux from the inductor 51 away from parts that do not want to be affected by the magnetic flux from the inductor 51.

[0072] According to the circuit board 1 of Embodiment 2, the stray capacitance between the inductor 51 and the ground layer 24 of the mounting board 2 can be reduced, thereby improving the characteristics of the inductor 51.

[0073] The circuit board 1 according to Embodiment 2 comprises a plurality of protrusions 3 including a convex portion 3, and a plurality of conductive portions 4 including a conductive portion 4. The plurality of conductive portions 4 correspond to the plurality of protrusions 3. The plurality of protrusions 3 include a first protrusion 3c and a second protrusion 3d. The first protrusion 3c is made of the same material as the mounting substrate 2 (dielectric layer of the mounting substrate 2) and is located on the first main surface 21 (one main surface) of the mounting substrate 2. The second protrusion 3d is made of the same material as the mounting substrate 2 (dielectric layer of the mounting substrate 2) and is located on the first main surface 21 of the mounting substrate 2. The plurality of conductive portions 4 include a first conductive portion 4c and a second conductive portion 4d. The first conductive portion 4c is located on the main surface 31 of the first protrusion 3c among the plurality of protrusions 3, and is a first coil 511a that constitutes the first inductor 51a. The second conductive portion 4d is located on the main surface 31 of the second protrusion 3d among the multiple protrusions 3, and is the second coil 511b that constitutes the second inductor 51b. The winding axis A11 of the first inductor 51a and the winding axis A12 of the second inductor 51b are not parallel.

[0074] According to the circuit board 1 of Embodiment 2, since the winding axis A11 of the first inductor 51a and the winding axis A12 of the second inductor 51b are not parallel, it is possible to easily couple the first inductor 51a and the second inductor 51b, so that sufficient inductance can be obtained even with a small number of turns in at least one of the first inductor 51a and the second inductor 51b.

[0075] In the circuit board 1 according to Embodiment 2, the direction of the magnetic flux of the first inductor 51a and the direction of the magnetic flux of the second inductor 51b are different from each other.

[0076] According to the circuit board 1 of Embodiment 2, a transformer can be formed between the first inductor 51a and the second inductor 51b by making the direction of the magnetic flux of the first inductor 51a and the direction of the magnetic flux of the second inductor 51b different from each other.

[0077] (3) Modifications Below, modifications of Embodiment 2 will be described.

[0078] As a modification 1 of Embodiment 2, the circuit board 1 may have one protrusion 3 instead of multiple protrusions 3.

[0079] As a second modification of Embodiment 2, the circuit board 1 may have one conductive part 4 instead of multiple conductive parts 4.

[0080] As a third modification of Embodiment 2, in the circuit board 1, it is not necessary for conductive parts 4 to be placed on all of the multiple protrusions 3, and conductive parts 4 may be placed on only some of the multiple protrusions 3.

[0081] The circuit board 1 according to each of the above modified examples also provides the same effects as the circuit board 1 according to Embodiment 2.

[0082] (Embodiment 3) The circuit board 1 according to Embodiment 3 differs from the circuit board 1 according to Embodiment 1 (see Figure 1) in that, as shown in Figure 9, a plurality of capacitors 52 are provided on the protrusion 3. Regarding the circuit board 1 according to Embodiment 3, components similar to those in the circuit board 1 according to Embodiment 1 are denoted by the same reference numerals and their descriptions are omitted.

[0083] (1) The circuit board 1 of Embodiment 3 is equipped with a protrusion 3 as shown in Figure 9, instead of the protrusion 3 of Embodiment 1 (see Figure 1). Regarding the protrusion 3 of Embodiment 3, the same configuration and function as the protrusion 3 of Embodiment 1 will not be described.

[0084] The circuit element 5 in Embodiment 3 is a capacitor 52. In Embodiment 3, a plurality of capacitors 52 are provided on the protrusion 3. The plurality of capacitors 52 include capacitor 52a and capacitor 52b. Capacitor 52a has a first electrode 521a and a second electrode 522a. The first electrode 521a and the second electrode 522a face each other. Capacitor 52b has a first electrode 521b and a second electrode 522b. The first electrode 521b and the second electrode 522b face each other. In the example of Figure 9, the second electrode 522a of capacitor 52a and the first electrode 521b of capacitor 52b are common members.

[0085] In Embodiment 3, the conductive part 4 is the first electrode 521a of the capacitor 52a.

[0086] The second electrode 522a of the capacitor 52a is provided within the protrusion 3.

[0087] In Embodiment 3, the area of ​​the first electrode 521a of capacitor 52a is larger than the area of ​​the second electrode 522a of capacitor 52a. Also, the area of ​​the first electrode 521b of capacitor 52b is larger than the area of ​​the second electrode 522b of capacitor 52b.

[0088] (2) Effect In the circuit board 1 according to Embodiment 3, the circuit element 5 is a plurality of capacitors 52 (52a, 52b). Capacitor 52a has a first electrode 521a and a second electrode 522a. The first electrode 521a and the second electrode 522a face each other. Capacitor 52b has a first electrode 521b and a second electrode 522b. The first electrode 521b and the second electrode 522b face each other. The conductive part 4 is the first electrode 521a of capacitor 52a. The second electrode 522a of capacitor 52a is provided in the protrusion 3. The first electrode 521b and the second electrode 522b of capacitor 52b are provided in the protrusion 3.

[0089] According to the circuit board 1 of Embodiment 3, not only a part of the capacitor 52 but all of it can be provided on the protrusion 3, thus enabling further miniaturization.

[0090] In the circuit board 1 according to Embodiment 3, the area of ​​the first electrode 521 (521a, 521b) of the capacitor 52 (52a, 52b) is larger than the area of ​​the second electrode 522 (522a, 522b) of the capacitor 52 (52a, 52b).

[0091] According to the circuit board 1 of Embodiment 3, compared to the case of a capacitor formed on a plane, the capacitor 52 can be formed in a space-saving manner and is more resistant to displacement during stacking. Compared to the case of a capacitor formed on a plane, the space occupied by the capacitor 52 can be reduced in a plan view from the thickness direction D1 of the mounting substrate 2.

[0092] (3) Modifications Below, modifications of Embodiment 3 will be described.

[0093] As a modification 1 of Embodiment 3, the circuit board 1 may have one protrusion 3 instead of multiple protrusions 3.

[0094] As a second modification of Embodiment 3, the circuit board 1 may have one conductive part 4 instead of multiple conductive parts 4.

[0095] As a third modification of Embodiment 3, in the circuit board 1, it is not necessary for conductive parts 4 to be placed on all of the multiple protrusions 3, and conductive parts 4 may be placed on only some of the multiple protrusions 3.

[0096] The circuit board 1 according to each of the above modified examples also provides the same effects as the circuit board 1 according to Embodiment 3.

[0097] (Embodiment 4) The circuit board 1 according to Embodiment 4 differs from the circuit board 1 according to Embodiment 1 (see Figure 1) in that the shape of the protrusion 3 is frustoconical, as shown in Figures 10 and 11. Regarding the circuit board 1 according to Embodiment 4, components similar to those in the circuit board 1 according to Embodiment 1 are denoted by the same reference numerals and their descriptions are omitted.

[0098] (1) The circuit board 1 according to the fourth embodiment of the configuration is provided with a plurality of protrusions 3 as shown in Figures 10 and 11, instead of the plurality of protrusions 3 of the first embodiment.

[0099] The shape of the multiple protrusions 3 in Embodiment 4 is a frustoconical shape, as shown in Figures 10 and 11. Note that the configuration and function of the protrusions 3 in Embodiment 4 are the same as those of the protrusions 3 in Embodiment 1 (see Figure 1), but this explanation will be omitted.

[0100] (2) In the circuit board 1 according to the effect embodiment 4, the shape of the protrusion 3 is a frustoconical shape.

[0101] In the circuit board 1 according to Embodiment 4, similar to the circuit board 1 according to Embodiment 1, the mounting substrate 2 and circuit elements 5 can be miniaturized, the productivity of the circuit board 1 can be improved, the characteristics of the circuit elements 5 can be improved, and the quality of the circuit board 1 can be improved.

[0102] (3) Modifications Below, modifications of Embodiment 4 will be described.

[0103] As a modification 1 of Embodiment 4, the circuit board 1 may have one protrusion 3 instead of multiple protrusions 3.

[0104] As a second modification of Embodiment 4, the circuit board 1 may have one conductive part 4 instead of multiple conductive parts 4.

[0105] As a third modification of Embodiment 4, in the circuit board 1, it is not necessary for conductive parts 4 to be placed on all of the multiple protrusions 3, and conductive parts 4 may be placed on only some of the multiple protrusions 3.

[0106] The circuit board 1 according to each of the above modified examples also provides the same effects as the circuit board 1 according to Embodiment 4.

[0107] (Embodiment 5) The high-frequency module 6 according to Embodiment 5 differs from the high-frequency module 6 according to Embodiment 1 (see Figure 1) in that the conductive part 4 and the connection part 72 of the filter 7 are directly connected, as shown in Figure 12. Regarding the high-frequency module 6 according to Embodiment 5, components similar to those in the high-frequency module 6 according to Embodiment 1 are denoted by the same reference numerals and their descriptions are omitted.

[0108] (1) The high-frequency module 6 according to Embodiment 5 comprises a circuit board 1 and a filter 7, as shown in Figure 12. Regarding the circuit board 1 according to Embodiment 5, the same configuration and functions as those of the circuit board 1 according to Embodiment 1 (see Figure 1) will not be described.

[0109] As shown in Figure 12, the circuit board 1 of Embodiment 5 comprises a plurality of protrusions 3 and a plurality of conductive parts 4.

[0110] The multiple protrusions 3 include a first protrusion 3c and a second protrusion 3d. The first protrusion 3c is made of the same material as the mounting substrate 2 (the dielectric layer of the mounting substrate 2) and is located on the first main surface 21 (one main surface) of the mounting substrate 2. The second protrusion 3d is made of the same material as the mounting substrate 2 (the dielectric layer of the mounting substrate 2) and is located on the first main surface 21 of the mounting substrate 2.

[0111] The multiple conductive parts 4 include a conductive part 4b, a first conductive part 4c, and a second conductive part 4d. The first conductive part 4c is located on the main surface 31 of the first protrusion 3c among the multiple protrusions 3, and is a first coil 511a that constitutes the first inductor 51a. The second conductive part 4d is located on the main surface 31 of the second protrusion 3d among the multiple protrusions 3, and is a second coil 511b that constitutes the second inductor 51b.

[0112] The first conductive part 4c is connected to the input terminal 74 of the filter 7 (see Figure 14), and the second conductive part 4d is connected to the output terminal 75 of the filter 7 (see Figure 14).

[0113] As shown in Figure 12, the filter 7 of Embodiment 5 has a filter body 71, a plurality of connection parts 72, and a functional electrode 73. Regarding the filter 7 of Embodiment 5, the same configuration and function as the filter 7 of Embodiment 1 (see Figure 1) will not be described.

[0114] In Embodiment 5, the filter 7 overlaps with the conductive portion 4 in a plan view from the thickness direction D1 of the mounting substrate 2. "The filter 7 overlaps with the conductive portion 4 in a plan view from the thickness direction D1 of the mounting substrate 2" includes cases where a part of the filter 7 overlaps with the entire conductive portion 4 in a plan view from the thickness direction D1 of the mounting substrate 2, and cases where a part of the filter 7 overlaps with a part of the conductive portion 4 in a plan view from the thickness direction D1 of the mounting substrate 2.

[0115] In Embodiment 5, the multiple conductive parts 4 and the multiple connection parts 72 of the filter 7 are directly connected, as shown in Figure 12. The multiple connection parts 72 include connection part 72a, connection part 72b, connection part 72c, connection part 72d, and connection part 72e. Connection part 72a is connected to the first protrusion 3c on which the first conductive part 4c is located. Connection part 72b is connected to the protrusion 3b on which the conductive part 4b is located. Connection part 72c is connected to the second protrusion 3d on which the second conductive part 4d is located. Connection part 72d is connected to the electrode 23 of the mounting substrate 2. Connection part 72e is connected to the protrusion 3e on which the conductive part 4e is located.

[0116] As shown in Figure 13, the conductive portion 4e is meander-shaped and positioned on the convex portion 3e. The conductive portion 4e has a wiring conductor 53. A connecting portion 72e (see Figure 12) is connected to the region including the contact portion 531 of the wiring conductor 53.

[0117] In the high-frequency module 6 according to Embodiment 5, as shown in Figure 14, the first inductor 51a is connected to the input terminal 74 of the filter 7, the second inductor 51b is connected to the output terminal 75 of the filter 7, and the capacitor 52 is connected between the input terminal 74 of the filter 7 and ground.

[0118] (2) In the high-frequency module 6 according to the effect embodiment 5, the conductive part 4 and the connection part 72 of the filter 7 are directly connected.

[0119] According to the high-frequency module 6 of Embodiment 5, since the conductive part 4 and the connection part 72 of the filter 7 are directly connected, losses in the circuit (wiring) between the circuit element 5 and the filter 7 can be reduced compared to the case where the conductive part and the connection part of the filter are indirectly connected.

[0120] In the high-frequency module 6 according to Embodiment 5, the filter 7 overlaps with the conductive portion 4 in a plan view from the thickness direction D1 of the mounting substrate 2.

[0121] According to the high-frequency module 6 of Embodiment 5, the high-frequency module 6 can be miniaturized.

[0122] (3) Modifications Below, modifications of Embodiment 5 will be described.

[0123] As a modification 1 of Embodiment 5, the circuit board 1 may have one protrusion 3 instead of multiple protrusions 3.

[0124] As a second modification of Embodiment 5, the circuit board 1 may have one conductive part 4 instead of multiple conductive parts 4.

[0125] As a third modification of Embodiment 5, in the circuit board 1, it is not necessary for conductive parts 4 to be placed on all of the multiple protrusions 3, and conductive parts 4 may be placed on only some of the multiple protrusions 3.

[0126] The circuit board 1 according to each of the above modified examples also provides the same effects as the circuit board 1 according to Embodiment 5.

[0127] (Embodiment 6) The high-frequency module 6 according to Embodiment 6 differs from the high-frequency module 6 according to Embodiment 5 (see Figure 12) in that, as shown in Figures 15 and 16, the direction of the magnetic flux of the inductor 51 is away from the functional electrode 73 of the filter 7 (see Figure 12). Regarding the high-frequency module 6 according to Embodiment 6, components similar to those in the high-frequency module 6 according to Embodiment 5 are denoted by the same reference numerals and their descriptions are omitted.

[0128] (1) The high-frequency module 6 according to embodiment 6 comprises a circuit board 1 and a filter 7, similar to the high-frequency module 6 according to embodiment 5. The circuit element 5 of embodiment 6 is an inductor 51, as shown in Figures 15 and 16.

[0129] The filter 7 of Embodiment 6, like the filter 7 of Embodiment 5, includes a filter body 71, a plurality of connection parts 72 (see Figure 12), and a functional electrode 73 (see Figure 12). The plurality of connection parts 72 include an input terminal 74 (connection part 72a) (see Figures 12 and 14) and an output terminal 75 (connection part 72c) (see Figures 12 and 14).

[0130] The circuit board 1 according to Embodiment 6 includes a plurality of conductive parts 4 as shown in Figures 15 and 16, instead of the plurality of conductive parts 4 of Embodiment 1. The plurality of conductive parts 4 include a first conductive part 4c and a second conductive part 4d. The first conductive part 4c is the first coil 511a of the first inductor 51a. The second conductive part 4d is the second coil 511b of the second inductor 51b.

[0131] The winding axis A1 of the inductor 51 is tilted away from the functional electrode 73 of the filter 7. More specifically, the winding axis A11 of the first inductor 51a and the winding axis A12 of the second inductor 51b are tilted away from the functional electrode 73 of the filter 7.

[0132] The winding axis A11 of the first inductor 51a and the winding axis A12 of the second inductor 51b are tilted so as to be away from each other. That is, the direction of the magnetic flux of the first inductor 51a and the direction of the magnetic flux of the second inductor 51b are away from the functional electrode 73 of the filter 7 (see Figure 12). When current flows through the first inductor 51a and the second inductor 51b, the direction of the magnetic flux generated in the first inductor 51a and the direction of the magnetic flux generated in the second inductor 51b are away from the functional electrode 73 of the filter 7.

[0133] (2) In the high-frequency module 6 according to the effect embodiment 6, the circuit element 5 is an inductor 51. The filter 7 has a functional electrode 73. The winding axis A1 of the inductor 51 is tilted away from the functional electrode 73 of the filter 7.

[0134] According to the high-frequency module 6 of embodiment 6, interference of the magnetic flux from the inductor 51 to the functional electrode 73 can be reduced.

[0135] In the high-frequency module 6 according to Embodiment 6, the filter 7 has a functional electrode 73, an input terminal 74, and an output terminal 75. The circuit board 1 includes a plurality of protrusions 3, including a convex portion 3, and a plurality of conductive portions 4, including a conductive portion 4. The plurality of conductive portions 4 correspond to the plurality of protrusions 3. The plurality of protrusions 3 have a first convex portion 3c and a second convex portion 3d. The first convex portion 3c is made of the same material as the mounting substrate 2 (dielectric layer of the mounting substrate 2) and is located on the first main surface 21 (one main surface) of the mounting substrate 2. The second convex portion 3d is made of the same material as the mounting substrate 2 (dielectric layer of the mounting substrate 2) and is located on the first main surface 21 of the mounting substrate 2. The plurality of conductive portions 4 include a first conductive portion 4c and a second conductive portion 4d. The first conductive portion 4c is located on the main surface 31 of the first convex portion 3c among the plurality of protrusions 3, and is a first coil 511a that constitutes the first inductor 51a. The second conductive part 4d is located on the main surface 31 of the second protrusion 3d among the multiple protrusions 3, and is the second coil 511b that constitutes the second inductor 51b. The first conductive part 4c is connected to the input terminal 74 of the filter 7. The second conductive part 4d is connected to the output terminal 75 of the filter 7. The winding axis A11 of the first inductor 51a and the winding axis A12 of the second inductor 51b are tilted so as to be separated from each other.

[0136] According to the high-frequency module 6 of Embodiment 6, the coupling between the first inductor 51a on the input side of the filter 7 and the second inductor 51b on the output side of the filter 7 can be weakened.

[0137] (3) Modifications Below, modifications of Embodiment 6 will be described.

[0138] As a modification 1 of Embodiment 6, the circuit board 1 may have one protrusion 3 instead of multiple protrusions 3.

[0139] As a second modification of Embodiment 6, the circuit board 1 may have one conductive part 4 instead of multiple conductive parts 4.

[0140] As a third modification of Embodiment 6, in the circuit board 1, it is not necessary for conductive parts 4 to be placed on all of the multiple protrusions 3, and conductive parts 4 may be placed on only some of the multiple protrusions 3.

[0141] The circuit board 1 according to each of the above modified examples also provides the same effects as the circuit board 1 according to Embodiment 6.

[0142] (Embodiment 7) The high-frequency module 6 according to Embodiment 7 differs from the high-frequency module 6 according to Embodiment 1 (see Figure 1) in that an annular projection 8 is arranged on the main surface 31 of the convex portion 3, as shown in Figure 17. Regarding the high-frequency module 6 according to Embodiment 7, components similar to those in the high-frequency module 6 according to Embodiment 1 are denoted by the same reference numerals and their descriptions are omitted.

[0143] (1) The high-frequency module 6 according to the configuration embodiment 7 comprises a circuit board 1, a filter 7, and a plurality of protrusions 8, as shown in Figure 17.

[0144] As shown in Figure 17, the filter 7 has a plurality of connection points 72 which are solder bumps.

[0145] Each of the multiple protrusions 8 is annular, as shown in Figures 18 and 19. Each of the multiple protrusions 8 is positioned on the main surface 31 of the convex portion 3, as shown in Figure 17. More specifically, each of the multiple protrusions 8 is positioned around the portion 32 of the main surface 31 of the convex portion 3 that the solder bump (connecting portion 72) contacts, as shown in Figures 17 to 19.

[0146] (2) The high-frequency module 6 according to the effect embodiment 7 further comprises an annular projection 8. The projection 8 is arranged on the main surface 31 of the protrusion 3. The filter 7 has solder bumps (connection portion 72). The projection 8 is arranged around the portion 32 of the main surface 31 of the protrusion 3 that the solder bumps contact.

[0147] According to the high-frequency module 6 of Embodiment 7, the projection 8 arranged on the main surface 31 of the protrusion 3 reduces the spread of solder on the main surface 31 of the protrusion 3, thereby reducing the likelihood of short circuits between the circuit element 5 and solder at unintended locations. As a result, the stability of the characteristics of the circuit element 5 can be improved.

[0148] (3) Modifications Below, modifications of Embodiment 7 will be described.

[0149] As a modification 1 of Embodiment 7, the circuit board 1 may have one protrusion 3 instead of multiple protrusions 3.

[0150] As a second modification of Embodiment 7, the circuit board 1 may have one conductive part 4 instead of multiple conductive parts 4.

[0151] As a third modification of Embodiment 7, in the circuit board 1, it is not necessary for conductive parts 4 to be placed on all of the multiple protrusions 3, and conductive parts 4 may be placed on only some of the multiple protrusions 3.

[0152] The circuit board 1 according to each of the above modified examples also provides the same effects as the circuit board 1 according to Embodiment 7.

[0153] (Embodiment 8) Embodiment 8 describes a communication device 9 equipped with a high-frequency module 6.

[0154] (1) The communication device 9 according to the configuration embodiment 8 comprises a high-frequency module 6, an antenna 91, and a signal processing circuit 92, as shown in Figure 20. The communication device 9 is, for example, a mobile terminal (e.g., a smartphone). However, the communication device 9 is not limited to a mobile terminal, but may be, for example, a wearable device (e.g., a smartwatch).

[0155] The high-frequency module 6 according to Embodiment 8 is a module having the same configuration as the high-frequency module 6 according to Embodiment 1. With respect to the high-frequency module 6 according to Embodiment 8, components that are the same as those in the high-frequency module 6 according to Embodiment 1 are denoted by the same reference numerals and their descriptions are omitted.

[0156] The high-frequency module 6 is configured to amplify the transmission signal (high-frequency signal) from the signal processing circuit 92 and output it to the antenna 91. The high-frequency module 6 is also configured to amplify the received signal (high-frequency signal) received by the antenna 91 and output it to the signal processing circuit 92. The high-frequency module 6 is controlled, for example, by the signal processing circuit 92.

[0157] The high-frequency module 6 is a module that supports, for example, 4G (fourth-generation mobile communication) standards and 5G (fifth-generation mobile communication) standards. The 4G standard is, for example, the 3GPP (registered trademark, Third Generation Partnership Project) LTE (registered trademark, Long Term Evolution) standard. The 5G standard is, for example, 5G NR (New Radio). The high-frequency module 6 is a module that supports carrier aggregation and dual connectivity.

[0158] In the communication device 9, the high-frequency module 6 is electrically connectable to an external circuit board (not shown). The external circuit board corresponds to, for example, the motherboard of a mobile terminal or communication device. The statement that the high-frequency module 6 is electrically connectable to the external circuit board includes not only cases where the high-frequency module 6 is directly mounted on the external circuit board, but also cases where the high-frequency module 6 is indirectly mounted on the external circuit board. Furthermore, cases where the high-frequency module 6 is indirectly mounted on the external circuit board include cases where the high-frequency module 6 is mounted on another high-frequency module mounted on the external circuit board.

[0159] (1.1) Antenna The antenna 91 is connected to the antenna terminal (not shown) of the high-frequency module 6, as shown in Figure 20. The antenna 91 has a transmitting function that radiates the transmission signal output from the high-frequency module 6 as radio waves, and a receiving function that receives the reception signal as radio waves from the outside and outputs it to the high-frequency module 6.

[0160] (1.2) Signal Processing Circuit The signal processing circuit 92 is connected to the high-frequency module 6, as shown in Figure 20. The signal processing circuit 92 processes the high-frequency signals passing through the high-frequency module 6. More specifically, the signal processing circuit 92 is configured to process the received signals received from the high-frequency module 6. The signal processing circuit 92 is also configured to process the transmitted signals output to the high-frequency module 6.

[0161] The signal processing circuit 92 includes a baseband signal processing circuit 93 and an RF signal processing circuit 94.

[0162] (1.2.1) Baseband signal processing circuit The baseband signal processing circuit 93 is, for example, a BBIC (Baseband Integrated Circuit).

[0163] The baseband signal processing circuit 93 performs predetermined signal processing on signals from outside the signal processing circuit 92. More specifically, the baseband signal processing circuit 93 generates a transmission signal from baseband signals (e.g., audio signals and image signals) from outside the signal processing circuit 92, and outputs the generated transmission signal to the RF signal processing circuit 94.

[0164] The baseband signal processing circuit 93 performs predetermined signal processing on the signal from the RF signal processing circuit 94. More specifically, the baseband signal processing circuit 93 outputs the received signal received from the RF signal processing circuit 94 to the outside. The received signal processed by the baseband signal processing circuit 93 is used, for example, as an image signal for image display or as an audio signal for telephone communication.

[0165] (1.2.2) RF signal processing circuit The RF signal processing circuit 94 is, for example, an RFIC (Radio Frequency Integrated Circuit) and performs signal processing on high-frequency signals (transmitted signals and received signals).

[0166] The RF signal processing circuit 94 performs signal processing on the transmission signal output from the baseband signal processing circuit 93 and outputs the processed transmission signal to the high-frequency module 6. Specifically, the RF signal processing circuit 94 performs signal processing such as upconversion on the transmission signal output from the baseband signal processing circuit 93 and outputs the processed transmission signal to the transmission path of the high-frequency module 6.

[0167] The RF signal processing circuit 94 performs signal processing on the received signal output from the high-frequency module 6 and outputs the processed received signal to the baseband signal processing circuit 93. Specifically, the RF signal processing circuit 94 performs signal processing such as down-conversion on the received signal output from the receiving path of the high-frequency module 6 and outputs the processed received signal to the baseband signal processing circuit 93.

[0168] (2) The communication device 9 according to the effective embodiment 8 comprises a high-frequency module 6 and a signal processing circuit 92. The signal processing circuit 92 is connected to the high-frequency module 6.

[0169] According to the communication device 9 of Embodiment 8, in the high-frequency module 6, the mounting substrate 2 and circuit elements 5 can be miniaturized, the productivity of the circuit board 1 can be improved, the characteristics of the circuit elements 5 can be improved, and the quality of the circuit board 1 can be improved.

[0170] (3) Modifications Below, modifications of Embodiment 8 will be described.

[0171] The communication device 9 according to a modified embodiment 8 may include one of the high-frequency modules 6 according to embodiments 2 to 7 instead of the high-frequency module 6 according to embodiment 1.

[0172] The communication device 9 according to the above modified example also provides the same effects as the communication device 9 according to Embodiment 8.

[0173] In the embodiments and modifications described above, "identical material" refers to materials in which the main component (80% or more by weight of the total components constituting the material) is the same.

[0174] The embodiments and modifications described above are only a part of the various embodiments and modifications of the present invention. Furthermore, the embodiments and modifications can be modified in various ways depending on the design, etc., as long as the objectives of the present invention are achieved.

[0175] 1 Circuit board 101 Main board body 102 Protrusion body 103 Sheet member 104 Base 105 Conductive layer 106 Sheet member 107 Base 108 Conductive layer 2 Mounting board 21 First main surface (first main surface) 22 Second main surface 23 Electrode 24 Ground layer 25 Wiring conductor layer 3, 3a, 3b Protrusion 3c First protrusion 3d Second protrusion 3e Protrusion 31 Main surface 32 Parts that solder bumps contact 4, 4a, 4b, 4e Conductive part 4c First conductive part 4d Second conductive part 5 Circuit elements 51 Inductor 51a First inductor 51b Second inductor 511 Coil 511a First coil 511b Second coil 52, 52a, 52b Capacitor 521, 521a, 521b First electrodes 522, 522a, 522b Second electrodes 53 Wiring conductor 531 Contact part 6 High-frequency module 61 Low-noise amplifier 7 Filter 71 Filter body 72, 72a, 72b, 72c, 72d, 72e Connection part (solder bump) 73 Functional electrode 74 Input terminal 75 Output terminal 8 Protrusion 9 Communication device 91 Antenna 92 ​​Signal processing circuit 93 Baseband signal processing circuit 94 RF signal processing circuit A1, A11, A12 Winding axis D1 Thickness direction D2 Direction

Claims

1. A circuit board comprising: a mounting substrate having one main surface; a protrusion made of the same material as the mounting substrate and disposed on the one main surface of the mounting substrate; and a conductive portion disposed on the main surface of the protrusion and constituting at least a part of a circuit element selected from inductors and capacitors.

2. The circuit board according to claim 1, wherein the circuit element is an inductor, and the winding axis of the inductor is aligned in a direction different from both the direction normal to the one main surface of the mounting board and the direction parallel to the one main surface of the mounting board.

3. A circuit board according to claim 2, comprising: a plurality of protrusions including the aforementioned protrusions; a plurality of conductive parts including the aforementioned conductive parts and corresponding to the plurality of protrusions; and a plurality of circuit elements including the aforementioned circuit elements, wherein the plurality of circuit elements include: a first inductor; a second inductor different from the first inductor; the plurality of protrusions include: a first protrusion made of the same material as the mounting substrate and located on one main surface of the mounting substrate; a second protrusion made of the same material as the mounting substrate and located on one main surface of the mounting substrate; the plurality of conductive parts include: a first conductive part which is a first coil constituting the first inductor and is located on the main surface of the first protrusion among the plurality of protrusions; and a second conductive part which is a second coil constituting the second inductor and is located on the main surface of the second protrusion among the plurality of protrusions, and the winding axis of the first inductor and the winding axis of the second inductor are not parallel.

4. The circuit board according to claim 3, wherein the direction of the magnetic flux of the first inductor and the direction of the magnetic flux of the second inductor are different from each other.

5. The circuit board according to claim 1, wherein the circuit element is a capacitor having a first electrode and a second electrode facing each other, the conductive portion is the first electrode of the capacitor, and the second electrode of the capacitor is provided within the protrusion.

6. The circuit board according to claim 5, wherein the area of ​​the first electrode of the capacitor is larger than the area of ​​the second electrode of the capacitor.

7. The circuit board according to any one of claims 1 to 6, wherein the shape of the convex portion is frustoconical.

8. A high-frequency module comprising a circuit board according to any one of claims 1 to 7, and a filter disposed on the circuit board.

9. The high-frequency module according to claim 8, wherein the filter has a connection portion for connecting to the outside, and the conductive portion and the connection portion of the filter are directly connected.

10. The high-frequency module according to claim 8 or 9, wherein the filter overlaps with the conductive portion in a plan view from the thickness direction of the mounting substrate.

11. The high-frequency module according to any one of claims 8 to 10, wherein the circuit element is an inductor, the filter has a functional electrode, and the winding axis of the inductor is tilted away from the functional electrode of the filter.

12. The filter has a functional electrode, an input terminal, and an output terminal; the circuit board comprises a plurality of protrusions including the protrusion, a plurality of conductive parts including the conductive part and corresponding to the plurality of protrusions, and a plurality of circuit elements including the circuit element; the plurality of circuit elements include a first inductor and a second inductor different from the first inductor; the plurality of protrusions include a first protrusion made of the same material as the mounting board and disposed on one main surface of the mounting board, and a second protrusion made of the same material as the mounting board and disposed on one main surface of the mounting board; the plurality of conductive parts include a first conductive part which is a first coil constituting the first inductor and is disposed on the main surface of the first protrusion among the plurality of protrusions, and a second conductive part which is a second coil constituting the second inductor and is disposed on the main surface of the second protrusion among the plurality of protrusions; the first conductive part is connected to the input terminal of the filter, and the second conductive part is connected to the output terminal of the filter. The high-frequency module according to any one of claims 8 to 10, wherein the winding axis of the first inductor and the winding axis of the second inductor are inclined to move away from each other as they move from the mounting substrate toward the filter.

13. The high-frequency module according to any one of claims 8 to 12, further comprising an annular projection disposed on the main surface of the convex portion, wherein the filter has solder bumps, and the projections are disposed around the portion of the main surface of the convex portion that contacts the solder bumps.

14. A communication device comprising a high-frequency module according to any one of claims 8 to 13, and a signal processing circuit connected to the high-frequency module.

15. A method for manufacturing a circuit board, comprising: preparing a substrate body that will become part of a mounting board; placing a protrusion body made of the same material as the substrate body that will become part of a protrusion on the substrate body; and bonding a sheet member made of the same material as the substrate body and the protrusion body, on which a conductive layer that will constitute a conductive part of at least a part of a circuit element selected from inductors and capacitors is arranged, to the substrate body and the protrusion body such that the conductive layer overlaps with the protrusion body.

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