Drying method

Abstract

This drying method includes cleaning a target member made of metal using a liquid, and after the cleaning, bringing at least an atmosphere to a first atmospheric pressure lower than a vapor pressure to evaporate moisture adhering to the target member. The target member includes a flow path therein, the cleaning is performed on the flow path, and the atmosphere is brought to the first atmospheric pressure to allow moisture inside the flow path to be evaporated.

Description

Drying Method

[0001] The present invention relates to a drying method. In particular, the present invention relates to a drying method for a target member made of metal.

[0002] In a film forming apparatus and a processing apparatus used in semiconductor manufacturing processes (hereinafter referred to as "semiconductor manufacturing apparatus"), a substrate stage on which a substrate is placed is used. The substrate stage is made of metal such as stainless steel or aluminum, for example. In some cases, the substrate stage is provided with, for example, a flow path for flowing a refrigerant and a flow path for flowing a process gas. In such a case, since the thickness of the substrate stage is required to be not less than a certain value, the volume of the substrate stage tends to increase. In the manufacturing process of a substrate stage, the outer shape of the substrate stage is formed by a processing step, foreign matter adhering to the surface of the substrate stage is removed by a cleaning step, and moisture adhering to the surface of the substrate stage is removed by a drying step.

[0003] Japanese Unexamined Patent Publication No. 08-213355

[0004] As described above, a large-volume member made of metal (hereinafter referred to as "target member") has a large heat capacity, and thus is characterized in that it is difficult to warm up and difficult to cool down. For example, if the target member is heated when drying the target member after cleaning, it takes time to cool the target member after drying, which reduces work efficiency.

[0005] The present invention has been made in view of such problems, and an object of the present invention is to shorten the drying time after cleaning a target member made of metal using a liquid.

[0006] A drying method according to an embodiment of the present invention comprises: cleaning a target member made of metal with a liquid; and after the cleaning, adjusting at least the atmosphere to a first pressure lower than the vapor pressure, thereby evaporating moisture adhering to the target member.

[0007] The target member may include a flow path inside, the cleaning may be performed on the flow path, and moisture inside the flow path may be evaporated by adjusting the atmosphere to the first pressure.

[0008] The length of the aforementioned flow path may be 30 mm or more.

[0009] The length of the channel is 30 mm or more, and the cross-sectional area at any point in the channel is 100 mm². ２ The following is also acceptable.

[0010] The heat capacity of the aforementioned member may be 1 kJ / K or more.

[0011] The aforementioned target member may be made of aluminum or stainless steel.

[0012] The aforementioned liquid may be pure water.

[0013] The aforementioned first atmosphere may be 0.0296 atmospheres or more and 0.059 atmospheres or less.

[0014] When evaporating the moisture inside the flow path, the temperature of the space where the target member is placed may be 25°C or higher.

[0015] According to the drying method of the present invention, the drying time after cleaning a target component made of metal with a liquid can be shortened.

[0016] This is a top view showing the overall configuration of the target component according to one embodiment of the present invention. This is a cross-sectional view of the target component according to one embodiment of the present invention along line A-A'. This is a flowchart showing the manufacturing process of the target component according to one embodiment of the present invention. This is a conceptual diagram showing an example of a drying apparatus according to one embodiment of the present invention. This is a conceptual diagram showing an example of a pressure reducing jig according to one embodiment of the present invention. This is a cross-sectional view of the target component according to one embodiment of the present invention.

[0017] The embodiments of the present invention will be described below with reference to the drawings. The following disclosure is merely an example. Configurations that a person skilled in the art could easily conceive by appropriately modifying the configuration of the embodiments while maintaining the spirit of the invention are naturally included within the scope of the present invention. In order to make the explanation clearer, the drawings may schematically represent the width, thickness, shape, etc. of each part compared to the actual embodiment. However, the illustrated shapes are merely examples and do not limit the interpretation of the present invention. In this specification and in each drawing, components similar to those described above with respect to previously shown drawings are denoted by the same reference numerals, and detailed descriptions may be omitted as appropriate.

[0018] In each embodiment of the present invention, the direction from the plate member toward the lid member is referred to as "up" or "upwards." Conversely, the direction from the lid member toward the plate member is referred to as "down" or "downwards." Thus, for the sake of explanation, the terms "up" or "downwards" are used, but for example, the vertical relationship between the plate member and the lid member may be arranged in a different orientation than shown in the figures. In the following description, for example, the expression "lid member on the plate member" merely describes the vertical relationship between the plate member and the lid member as described above, and other members may be arranged between the plate member and the lid member. Up or down refers to the order in a structure in which multiple members are stacked. That is, when referring to a second member above the first member, the first member and the second member may not overlap in a plan view. On the other hand, when referring to a second member vertically above the first member, it means that the first member and the second member overlap in a plan view.

[0019] In this specification, expressions such as "α includes A, B, or C," "α includes any one of A, B, and C," and "α includes one selected from the group consisting of A, B, and C" do not exclude cases where α includes multiple combinations of A through C, unless otherwise specified. Furthermore, these expressions do not exclude cases where α includes other elements.

[0020] Furthermore, the following embodiments can be combined with each other, provided that no technical inconsistencies arise.

[0021] [1. First Embodiment] The configuration of the target member according to the first embodiment of the present invention and its manufacturing process will be described with reference to Figures 1 to 4. In the first embodiment, a substrate stage 10 is exemplified as the target member.

[0022] [1-1. Configuration of the Substrate Stage] The overall configuration of the target member according to this embodiment will be described using Figures 1 and 2. Figure 1 is a top view showing the overall configuration of the target member according to one embodiment of the present invention. Figure 2 is a cross-sectional view of the target member according to one embodiment of the present invention taken along line A-A'.

[0023] As shown in Figure 1, the substrate stage 10 according to this embodiment has a plate member 100 and a lid member 200. In a top view, the outer shape of the plate member 100 is substantially the same as the outer shape of the lid member 200. The plate member 100 is provided with a flow path 110 and a plurality of external connection parts 120. In the following description, when distinguishing between the two external connection parts 120, they will be referred to as external connection part 120-1 and 120-2. In this embodiment, there are two external connection parts 120, but there may be three or more external connection parts 120.

[0024] The flow path 110 is provided to connect the external connection part 120-1 and the external connection part 120-2. The flow path 110 is provided to trace a substantially circular arc along the outer circumference of the plate member 100 in a counterclockwise direction (R2 direction), starting from the external connection part 120-1. The flow path 110, starting from the external connection part 120-1, is folded back by approximately 180 degrees at the folding part 111. At the folding part 111, the flow path 110 is folded back in a circular arc. At the folding part 111, the flow path 110 moves to the inside of the plate member 100, and starting from the folding part 111, extends in a substantially circular arc in a clockwise direction (R1 direction), along the adjacent flow path 110 on the outside.

[0025] The flow path 110, starting from the folded portion 111, is folded back by approximately 180 degrees at the folded portion 112. Similar to the folded portion 111, the flow path 110 is folded back in an arc at the folded portion 112. The flow path 110 moves inward from the plate member 100 at the folded portion 112, and starting from the folded portion 112, extends in a roughly arc in a counterclockwise direction (R2 direction) along the adjacent flow path 110 on the outside. The flow path 110 repeats the same configuration as the folded portions 111 and 112, and then moves inward from the plate member 100 while rotating in a vortex in a counterclockwise direction (R2 direction), and is connected to the external connection portion 120-2.

[0026] As shown in Figure 2, the flow path 110 is composed of a recess provided in the plate member 100 and a lid member 200. The external connection parts 120-1 and 120-2 are composed of a recess provided in the plate member 100 and a through hole provided in the lid member 200.

[0027] The heat capacity of the substrate stage 10 is 1 kJ / K or more, 1.5 kJ / K or more, 2 kJ / K or more, or 3 kJ / K or more.

[0028] The substrate stage 10 is made of metal. In other words, both the plate member 100 and the lid member 200 are made of metal. For example, aluminum, stainless steel, nickel, molybdenum, chromium, iron, or alloys thereof can be used as the substrate stage 10. More specifically, an alloy in which molybdenum, chromium, and / or iron are added to nickel, which is the main component, may be used as the substrate stage 10. At least one of cobalt, tungsten, silicon, manganese, and carbon may be added to the alloy. The specific heat of aluminum is approximately 0.905 kJ / kg·K. The specific heat of stainless steel is approximately 0.46 kJ / kg·K. The specific heat of the above-mentioned nickel-based alloy varies depending on the composition ratio, but is approximately 0.373 kJ / kg·K or more and 0.514 kJ / kg·K or less. The mass of a substrate stage 10 of average size (radius 1200 mm, height 30 mm) is approximately 3 kg. Therefore, the heat capacity of the substrate stage 10 made of aluminum is approximately 2.715 kJ / K, and the heat capacity of the substrate stage 10 made of stainless steel is approximately 1.38 kJ / K. The heat capacity of the substrate stage 10 made of the above nickel-based alloy is approximately 1.119 kJ / K or more and 1.542 kJ / K or less. The plate member 100 and the lid member 200 may be made of the same material or different materials.

[0029] The length of the flow path 110 is 30 mm or more, 50 mm or more, 100 mm or more, 200 mm or more, 500 mm or more, or 1000 mm or more. The cross-sectional area at any point in the flow path 110 (the area of ​​the cross-section perpendicular to the direction in which the flow path 110 extends) is 100 mm². ２ Below, 50mm２ Below, 25mm ２ Below, 10mm ２ The following, or 5 mm ２ The following applies:

[0030] Conventionally, when drying was performed after cleaning with a liquid (e.g., running water), a drying method involving heating the target component was employed. However, when drying a target component with a heat capacity of 1 kJ / K or more while heating it, a long time is required to cool the component after drying. This resulted in a significant deterioration of work efficiency in the manufacturing process of the target component.

[0031] Furthermore, conventionally, when drying target components with complex structures after washing with running water, an air-blowing drying method was employed. However, when using the air-blowing drying method, the area in which drying is effective by the air blow is limited to approximately 30 mm from the inlet and outlet. Therefore, if the length of the flow path 110 is greater than the lower limit mentioned above, it is difficult to dry the inside of the flow path 110 by air blowing. Moreover, if the cross-sectional area of ​​the flow path 110 is less than the upper limit mentioned above, the flow path 110 may become blocked by the surface tension of the water. If the flow path 110 is blocked with water, the air blown by the air blower cannot reach the inside of the flow path 110, making it difficult to dry the inside of the flow path 110 by air blowing. Therefore, conventionally, in order to dry a substrate stage 10 equipped with such a flow path, it was often necessary to heat the substrate stage 10.

[0032] As will be explained in detail below, in this embodiment, drying is performed under a reduced pressure atmosphere after cleaning (hereinafter referred to as "reduced pressure drying"). By performing reduced pressure drying, even if the target component has a heat capacity of 1 kJ / K or more, even if the length of the flow path 110 is greater than or equal to the lower limit as described above, and even if the cross-sectional area of ​​the flow path 110 is less than or equal to the upper limit as described above, the inside of the flow path 110 can be efficiently dried without heating the substrate stage 10.

[0033] For example, if aluminum is used as the substrate stage 10, and the cross-sectional area of ​​the flow path is 25 mm² ２If the following conditions are met, water will penetrate approximately 50 mm into the channel 110 from the inlet / outlet due to capillary action. Therefore, the length of the channel 110 is 50 mm or more, and the cross-sectional area of ​​the channel is 25 mm². ２ The effects of vacuum drying become more pronounced in the following cases:

[0034] [1-2. Manufacturing Process of the Substrate Stage] The manufacturing process of the substrate stage 10 will be explained using Figure 3. Figure 3 is a flowchart showing the manufacturing process of a target component according to one embodiment of the present invention. As shown in Figure 3, the manufacturing process of the substrate stage 10 includes a processing step (S301), a cleaning step (S302), and a reduced-pressure drying step (S303).

[0035] In S301, a processing treatment is performed to form the outer shape of the substrate stage 10. This processing treatment creates recesses in the plate member 100. Subsequently, the inner walls of the recesses (flow channels 110) of the plate member 100 are polished. After this polishing treatment, the average surface roughness (Ra) of the inner wall of the flow channel 110 is 3.2 μm or less, 1.6 μm or less, 0.8 μm or less, or 0.6 μm or less. The smaller the average surface roughness, the smaller the contact angle between the inner wall of the flow channel 110 and the water. Therefore, the moisture adhering to the inner wall of the flow channel 110 spreads over a wide area, and the height of the water droplets decreases, making it easier for the moisture to evaporate by reduced-pressure drying. Furthermore, in S301, after the flow channel 110 is formed by connecting the plate member 100 and the lid member 200, the top, side, and bottom surfaces of the substrate stage 10 are polished.

[0036] In S302, cleaning is performed using a liquid to remove debris generated by the processing step in S301. Pure water, organic solvents, and other chemical solutions can be used as the cleaning liquid. In this embodiment, a step using pure water is illustrated. This cleaning step cleans the inside of the flow path 110 with pure water. The cleaning in S302 may be performed by immersing the substrate stage 10 in pure water stored in a container, or by spraying pure water onto the substrate stage 10 from a nozzle or the like. In the latter case, the substrate stage 10 may be rotated around an axis perpendicular to the upper surface of the substrate stage 10 while the pure water is sprayed onto the upper surface of the substrate stage 10.

[0037] In S303, drying is performed to evaporate the moisture adhering to the top, side, and bottom surfaces of the substrate stage 10 and the inner walls of the flow path 110 by the cleaning process in S302. In this drying process, the space in which the substrate stage 10 is placed is reduced to a first atmosphere, which is lower than the vapor pressure. When pure water is used in the cleaning process in S302 and the temperature of the space in which the substrate stage 10 is placed is 25°C or higher and 30°C or lower, the first atmosphere is 0.0296 atmospheres or higher and 0.059 atmospheres or lower. As described above, in the drying process in S303, by reducing the pressure of the space in which the substrate stage 10 is placed to a first atmosphere, the boiling point of pure water is lowered, and thus the moisture can be evaporated.

[0038] As described above, conventionally, when drying structures that cannot be reached by air blowing, such as the channel 110, it was necessary to heat the substrate stage 10 in order to evaporate any remaining moisture inside the channel 110. However, by using the drying method according to this embodiment, even with such structures, it is possible to evaporate any remaining moisture inside the channel 110 without heating the substrate stage 10, or by low-temperature heating if the substrate stage 10 is heated.

[0039] Furthermore, for a flow path 110 as shown in FIG. 1, a method of drying the inside of the flow path 110 is conceived by causing air to flow from the external connection portion 120-1 to the external connection portion 120-2 via the flow path 110. However, as shown in FIG. 1, in the flow path 110 provided with folded portions 111 and 112, the pressure loss at the folded portions 111 and 112 is large, so it is difficult to dry the entire interior of the flow path 110. However, by using the drying method according to the present embodiment, even for the substrate stage 10 as shown in FIG. 1, moisture remaining inside the flow path 110 can be evaporated without heating the substrate stage 10, or by low-temperature heating even when the substrate stage 10 is heated.

[0040] [1-3. Configuration of Reduced Pressure Drying Apparatus] A reduced pressure drying apparatus 400 used in the reduced pressure drying step of the present embodiment will be described with reference to FIG. 4. FIG. 4 is a conceptual diagram showing an example of a drying apparatus according to an embodiment of the present invention. As shown in FIG. 4, the reduced pressure drying apparatus 400 includes a chamber 410, a vacuum pump 420, a valve 430, and a spacer 440.

[0041] The chamber 410 has a capacity that allows the substrate stage 10 to be placed therein. The chamber 410 has a structure capable of hermetically sealing the interior. Although not shown, the chamber 410 is provided with an entrance / exit through which the substrate stage 10 can be taken in and out. A pipe 411 is connected to the chamber 410. The chamber 410 and the vacuum pump 420 are connected via the pipe 411. As the vacuum pump 420, a vacuum pump such as a rotary pump or a turbo molecular pump is used. The valve 430 is provided in the pipe 411 between the chamber 410 and the vacuum pump 420. By opening and closing the valve 430, the space inside the chamber 410 and the vacuum pump 420 are connected or disconnected.

[0042] The spacer 440 is provided between the substrate stage 10 and the bottom surface of the chamber 410. The spacer 440 is, for example, spherical. The spacer 440 can prevent the lower surface of the substrate stage 10 from contacting the bottom surface of the chamber 410. As a result, in the reduced pressure drying step, moisture adhering to the lower surface of the substrate stage 10 can be evaporated.

[0043] As described above, according to the drying method of the present embodiment, the drying time after cleaning the substrate stage 10 made of metal with a liquid can be shortened.

[0044] [2. Second Embodiment] A decompression jig according to the present embodiment will be described with reference to FIG. 5. FIG. 5 is a conceptual diagram showing an example of a decompression jig according to an embodiment of the present invention. The substrate stage 10 shown in FIG. 5 is the same as the substrate stage 10 shown in FIG. 1 and FIG. 2, so the description thereof is omitted.

[0045] As shown in FIG. 5, in the present embodiment, two decompression jigs 500-1 and 500-2 are attached to the external connection portions 120-1 and 120-2. The two decompression jigs 500-1 and 500-2 are each connected to a vacuum pump 530. In the following description, when it is not necessary to distinguish between the two decompression jigs 500-1 and 500-2, they are simply referred to as the decompression jig 500.

[0046] The decompression jig 500 includes a suction nozzle 510 and a contact portion 520. The suction nozzle 510 is provided with a through-hole 511 penetrating the suction nozzle 510 in the vertical direction. A pipe 512 is connected to the upper end of the through-hole 511. The through-hole 511 and the vacuum pump 530 are connected via the pipe 512. A contact portion 520 is provided at the lower end of the through-hole 511. The contact portion 520 brings the decompression jig 500 into close contact with the substrate stage 10. For example, the contact portion 520 has elasticity.

[0047] As shown in FIG. 5, decompression of the flow path 110 is performed in a state where the contact portion 520 is in contact with the substrate stage 10 so as to surround the external connection portions 120-1 and 120-2. In this case, the upper surface, side surfaces, and lower surface of the substrate stage 10 exposed from the contact portion 520 are not decompressed.

[0048] As described above, by using the decompression jig 500, only the inside of the flow path 110 can be dried under reduced pressure.

[0049] [3. Third Embodiment] The vacuum drying apparatus according to this embodiment will be described with reference to Figure 6. Figure 6 is a cross-sectional view of a target member according to one embodiment of the present invention. The substrate stage 20 shown in Figure 6 is similar to the substrate stage 10 shown in Figure 2, but differs from the substrate stage 10 in that the substrate stage 20 is provided with a plurality of plate members. In the following description, the description of configurations similar to those of the substrate stage 10 may be omitted.

[0050] As shown in Figure 6, the substrate stage 20 has a plate member 600 between the plate member 100 and the lid member 200. In plan view, the outer shape of the plate member 600 is substantially the same as the outer shapes of the plate member 100 and the lid member 200. The plate member 600 is provided with a flow path 610 and a plurality of external connection parts 620. In this embodiment, there are six external connection parts 620, but the number of external connection parts 620 may be five or less, or seven or more.

[0051] The flow path 110 is composed of a recess provided in the plate member 100 and the plate member 600. The external connection parts 120-1 and 120-2 are composed of a recess provided in the plate member 100 and through holes provided in the plate member 600 and the lid member 200. The flow path 610 is composed of a recess provided in the plate member 600 and the lid member 200. The external connection part 620 is composed of a recess provided in the plate member 600 and a through hole provided in the lid member 200.

[0052] In a top view, the patterns of the flow path 110 and the flow path 610 are different. In the substrate stage 20, for example, a coolant is supplied to the flow path 110 and a process gas is supplied to the flow path 610. The process gas is the gas necessary for the processing performed by the equipment in which the substrate stage 20 is used. For example, if the substrate stage 20 is used in an etching apparatus, the process gas is the gas necessary for the etching process.

[0053] As described above, even for a substrate stage 20 in which channels are formed in multiple layers, the drying time can be shortened by applying the drying method according to this embodiment.

[0054] [4. Modifications] Modifications of the above embodiments will be described below.

[0055] [4-1. Target Members for Drying] In the above embodiment, an example of applying the above drying method to a substrate stage provided with a flow channel was described as the target member, but the method is not limited to this example. For example, the above drying method may be applied to a substrate stage that does not have a flow channel. For example, the above drying method may be applied to a substrate stage that does not have a flow channel and has a heat capacity of 1 kJ / K or more. Furthermore, the above drying method may be applied not only to substrate stages but also to other members made of metal.

[0056] The substrate stage according to the above embodiment is a stage that can be used in CVD apparatus, sputtering apparatus, evaporation apparatus, etching apparatus, plasma processing apparatus, polishing apparatus, measuring apparatus, inspection apparatus, and microscope, etc. However, the substrate stage according to the above embodiment is not limited to a stage used in the above apparatus, and may be a stage used in other apparatuses.

[0057] [4-2. Flow Path] In the above embodiment, a configuration is shown in which the flow path 110 is provided in an arc along the outer circumference of the plate member 100, but the system is not limited to this configuration. The flow path 110 may be freely arranged inside the plate member 100, rather than along the outer circumference of the plate member 100. Furthermore, in the above embodiment, a configuration is disclosed in which the flow path 110 has folded portions 111 and 112 (see Figure 1), but the system is not limited to this configuration. The flow path 110 does not have to have folded portions.

[0058] In the above embodiment, the flow path 110 is exemplified as being folded back in an arc shape at the folded-back portions 111 and 112 (see Figure 2), but the configuration is not limited to this. For example, the folded-back portions 111 and 112 may be folded back in a curved shape other than an arc, or they may be folded back while bending at a predetermined angle.

[0059] In the first embodiment, the flow path 110 is shown to be provided between a recess in the plate member 100 and the flat lower surface of the lid member 200 (see Figure 2), but the configuration is not limited to this. The flow path 110 may be provided between a recess in the plate member 100 and a recess in the lid member 200 (an upwardly recessed recess), or the plate member 100 may not have a recess and the flow path 110 may be provided between the flat upper surface of the plate member 100 and a recess in the lid member 200 (an upwardly recessed recess). The flow path 110 may be provided inside the plate member 100 or inside the lid member 200.

[0060] In the third embodiment, a configuration is shown in which the flow path 110 is provided between a recess provided in the plate member 100 and the flat lower surface of the plate member 600, but the configuration is not limited to this. The flow path 110 may be provided between a recess provided in the plate member 100 and a recess provided in the plate member 600 (an upwardly recessed recess), or the plate member 100 may not have a recess and the flow path 110 may be provided between the flat upper surface of the plate member 100 and a recess provided in the plate member 600 (an upwardly recessed recess). The flow path 110 may be provided inside the plate member 100 or inside the plate member 600.

[0061] Similarly, in the third embodiment, a configuration is shown in which the flow path 610 is provided between a recess provided in the plate member 600 and the flat lower surface of the lid member 200, but the configuration is not limited to this. The flow path 610 may be provided between a recess provided in the plate member 600 and a recess provided in the lid member 200 (an upwardly recessed recess), or the plate member 600 may not have a recess and the flow path 610 may be provided between the flat upper surface of the plate member 600 and a recess provided in the lid member 200 (an upwardly recessed recess). The flow path 610 may be provided inside the plate member 600 or inside the lid member 200.

[0062] [4-3. Drying Method] In the above embodiment, a method of vacuum drying of the target member without heating the target member was illustrated, but the method is not limited to this method. For example, a process to raise the temperature of the target member may be used in combination with vacuum drying. In that case, the ambient temperature when vacuum drying is performed can be 200°C or less.

[0063] [4-4. Vacuum Drying Apparatus] In the above embodiment, a configuration in which only a vacuum pump 420 is connected to the chamber 410 is illustrated, but the apparatus is not limited to this configuration. For example, gas piping for supplying gas to the chamber 410 may be provided. For example, heated gas can be supplied to the chamber 410 via gas piping that reduces the pressure inside the chamber 410. For example, helium, which has high thermal conductivity, may be supplied to the inside of the chamber 410 via gas piping. Alternatively, heated nitrogen gas may be supplied to the inside of the chamber 410 via gas piping.

[0064] It should be noted that the present invention is not limited to the embodiments described above, and can be modified as appropriate without departing from the spirit of the invention.

[0065] 10: Substrate stage, 20: Substrate stage, 100: Plate member, 110: Flow path, 111: Folded section, 112: Folded section, 120: External connection section, 200: Lid member, 400: Vacuum drying device, 410: Chamber, 411: Piping, 420: Vacuum pump, 430: Valve, 440: Spacer, 500: Vacuum jig, 510: Suction nozzle, 511: Through hole, 512: Piping, 520: Contact section, 530: Vacuum pump, 600: Plate member, 610: Flow path, 620: External connection section

Claims

1. A drying method comprising cleaning a target component made of metal with a liquid, and after the cleaning, evaporating any moisture adhering to the target component by lowering the atmosphere to at least a first atmosphere lower than the vapor pressure.

2. The drying method according to claim 1, wherein the target member includes a flow channel inside, the cleaning is performed on the flow channel, and the moisture inside the flow channel is evaporated by changing the atmosphere to a first atmosphere.

3. The drying method according to claim 2, wherein the length of the flow path is 30 mm or more.

4. The length of the flow path is 30 mm or more, and the cross-sectional area at any point in the flow path is 100 mm². ２ The drying method according to claim 2, which is as follows:

5. The drying method according to claim 1, wherein the heat capacity of the target member is 1 kJ / K or more.

6. The drying method according to claim 5, wherein the target member is aluminum or stainless steel.

7. The drying method according to any one of claims 1 to 6, wherein the liquid is pure water.

8. The drying method according to claim 7, wherein the first atmosphere is 0.0296 atmospheres or more and 0.059 atmospheres or less.

9. The drying method according to claim 8, wherein when the moisture of the target member is evaporated, the temperature of the space in which the target member is placed is 25°C or higher.

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