Wafer transfer device and wafer transfer method

Abstract

The present invention ensures that the suction force on a wafer is stable, and the wafer can be held and transferred to a transfer destination. The present invention is a wafer transfer device for manually transferring a wafer W. The wafer transfer device comprises: a suction unit 21 which has a suction surface facing the wafer W mounted on a wafer stage 2b, and which has a plurality of tip sections 25a to 25d; and a plurality of positioning sections 22 which are provided on the tip sections 25a to 25d, and which are fitted into an outer peripheral fitting section 15 of the wafer stage 2b. The wafer W is suctioned, with the positioning sections 22 in a state supported by joint members 14a to 14d serving as stands provided to the wafer stage 2b.

Description

Wafer transfer apparatus and wafer transfer method

[0001] The present disclosure relates to a wafer transfer apparatus and a wafer transfer method for manually transferring wafers.

[0002] Examples of wafer transfer apparatuses that manually transfer wafers include the apparatus disclosed in Patent Document 1, for instance. The wafer transfer apparatus of Patent Document 1 includes an apparatus main body having a bifurcated fork shape, an I-shape, and a cross shape, and a handle gripped by a user. The apparatus main body sucks wafers by utilizing Bernoulli's principle. Then, a user transfers the wafer transfer apparatus sucking the wafer to a transfer destination.

[0003] Japanese Patent No. 6888852

[0004] In wafer processing, the back surface is often ground to reduce the thickness of the wafer. Ultra-thin wafers are prone to warping due to unbalanced external force applied during previous processing. In a warped wafer, the gap between the wafer and the suction surface of the wafer transfer apparatus is not constant. Therefore, the wafer transfer apparatus cannot stably suck and hold the wafer, and there is a risk that the wafer may fall and crack during transfer.

[0005] In one aspect, a wafer transfer apparatus that enables manual wafer transfer is provided. The wafer transfer apparatus includes: a suction unit having a suction surface configured to face a wafer placed on a wafer stage, and a plurality of tip portions; and a plurality of alignment portions provided respectively on the tip portions and fittable into an outer peripheral fitting portion of the wafer stage, wherein the wafer transfer apparatus is configured to suck the wafer in a state where the alignment portions are supported by a support portion included in the wafer stage.

[0006] In another embodiment, a wafer transport method is provided for transporting a wafer placed on a wafer stage using the wafer transport device. The wafer transport device is connected to an air control unit, and the wafer is attracted to the wafer stage by a first suction force. The wafer transport method includes: positioning the wafer transport device relative to the wafer stage by fitting the alignment part to the outer peripheral fitting part and supporting it with the support part; starting the suction operation of the wafer transport device on the wafer with a second suction force smaller than the first suction force of the wafer stage; stopping the suction operation of the wafer stage to attract the wafer to the suction part; and manually moving the wafer transport device to a destination and stopping the suction operation of the wafer transport device at the destination.

[0007] Figure 1 is a perspective view of the wafer transfer system. Figure 2 is a side view of a wafer. Figure 3 is a perspective view showing a warped wafer. Figure 4 is a plan view of the wafer stage. Figure 5 is a schematic cross-sectional view showing the relationship between the wafer, the wafer stage, and the wafer transfer device. Figure 6 is a perspective view showing a wafer placed on the wafer stage. Figure 7 is a perspective view showing the wafer placed on the wafer transfer device. Figure 8 is a perspective view of the wafer transfer device from the suction side. Figure 9 is a perspective view of the main part illustrating the alignment guide lines provided in the translucent section. Figure 10 is a perspective view showing the wafer held by the wafer transfer device being placed on a tray. Figure 11 is a perspective view showing the relationship between the recess of the tray and the alignment section of the suction section. Figure 12 is a flowchart illustrating the process of transferring a wafer from the first device to the second device. Figure 13 is a perspective view of the TAIKO® wafer from the back side. Figure 14 is a cross-sectional view of the TAIKO wafer. Figure 15 is a schematic cross-sectional view showing the relationship between the TAIKO wafer, the wafer stage, and the wafer transport device.

[0008] An embodiment of a wafer transport system using a wafer transport apparatus and wafer transport method will be described with reference to Figures 1 to 14. (Overall configuration) As shown in Figure 1, the wafer transport system 1 comprises a first apparatus 2 equipped with a wafer stage that supports a wafer W, a second apparatus 3 which is the destination for transport, and a wafer transport apparatus 4 configured to allow the wafer W to be transported manually, i.e., by hand, from the first apparatus 2 to the second apparatus 3.

[0009] The first apparatus 2 is, as an example, a prober for inspecting chips formed on a wafer. The first apparatus 2 performs inspection with the probe in contact with the electrode pads provided on the chips on the wafer W. The first apparatus 2 comprises an apparatus body 2a, a wafer stage 2b arranged in the internal space of the apparatus body 2a, and a lid 2c for opening and closing the internal space.

[0010] The second device 3 is used to transport and load wafers W between wafer cassettes such as FOUP (Front Opening Unified Pod) and FOSB (Front Opening Shipping Box) and the first device 2. The second device 3 includes a load port 3a on which wafer cassettes are placed and a tray 3b for holding wafers W. The tray 3b moves in and out of the load port 3a. With the tray 3b protruding from the load port 3a, wafers W transported from the first device 2 by the wafer transport device 4 are placed on it. After that, the tray 3b is moved to the load port 3a.

[0011] The chips formed on the wafer W are inspected in the first apparatus 2, and once the inspection is complete, they are transported to the second apparatus 3 by an automated transport device. However, a warped wafer W may not be transportable by the suction pads of the automated transport device. Also, if any abnormality occurs in the first apparatus 2 or the second apparatus 3, a warped wafer W may not be transportable by automated transport. In such cases, the lid 2c of the first apparatus 2 is opened, and the wafer W placed on the wafer stage 2b is manually transported to the tray 3b of the second apparatus 3 by the wafer transport device 4.

[0012] (Wafer W) As shown in Figure 2, wafer W comes in sizes such as 4 inches, 5 inches, 6 inches, 8 inches, and 12 inches. Furthermore, wafer W is being made thinner. For example, when the thickness of wafer W is 120 μm or less, a TAIKO shape is required (see Figures 13 and 14). For 12-inch wafer W, the mainstream thickness is 80 μm or less. Some 12-inch wafer W have thicknesses of 40 μm or less, or even 20 μm or less. The wafer stage 2b of this embodiment is compatible with wafer W of 8-inch and 12-inch sizes.

[0013] As shown in Figure 3, a wafer W thinned in this way may have warping. For example, a warped wafer W will deform so that two opposing points A1 and A2 are relatively high points, and points B1 and B2, which are 90° offset from A1 and A2, are relatively low points. With such a wafer W, the distance between the wafer and the suction pad is difficult to keep constant, and the suction of the wafer W is also difficult to stabilize. Even in such cases, the wafer transport device 4 is configured to transport the wafer W to the tray 3b of the second device 3 while the wafer W is being suctioned.

[0014] (Wafer Stage 2b) As shown in Figure 4, the wafer stage 2b of the first apparatus 2 is configured by placing a top 11 on a bottom 10 (see Figure 5). The top 11 is adsorbed to the bottom 10. The surface of the top 11 is the mounting surface 12 on which the wafer W is placed. The mounting surface 12 has a plurality of adsorption holes 13a, 13b arranged concentrically. For example, the inner circumference adsorption holes 13a are for adsorbing an 8-inch wafer W. The outer circumference adsorption holes 13b are for adsorbing a 12-inch wafer W. Furthermore, Bernoulli holes 13c are provided between the inner circumference adsorption holes 13a and the outer circumference adsorption holes 13b. The Bernoulli holes 13c create negative pressure near the surface of the top 11 by injecting air for Bernoulli adsorption. For example, the Bernoulli holes 13c are provided concentrically at 30° intervals.

[0015] An 8-inch wafer W is adsorbed by the inner circumference adsorption hole 13a. A 12-inch wafer W is adsorbed by both the inner circumference adsorption hole 13a and the outer circumference adsorption hole 13b. When the wafer W is significantly warped and cannot be adsorbed by the inner circumference adsorption hole 13a and the outer circumference adsorption hole 13b alone, the first apparatus 2 corrects the warp of the wafer W and enables adsorption by injecting air from the Bernoulli hole 13c to create negative pressure.

[0016] Joint members 14a to 14d are arranged at the same height on the outer periphery of the wafer stage 2b. The positions where the joint members 14a to 14d are arranged are, in a plan view, the first position P1, second position P2, third position P3, and fourth position P4, which are provided at 90° intervals in the circumferential direction. At the first position P1, four joint members 14a to 14d are arranged in a row. At each of the second position P2 to fourth position P4, two joint members 14a and 14b are arranged side by side.

[0017] As shown in Figures 4 and 5, all joint members 14a to 14d, positioned at the first position P1 to the fourth position P4, have an elongated rectangular parallelepiped shape, and the upper surfaces of each joint member are aligned at the same height. These joint members 14a to 14d are support parts that support the wafer transport device 4 and form a stand 14 on which the wafer transport device 4 is temporarily placed. Furthermore, on the outer peripheral side surface of the wafer stage 2b, the space between the mounting surface 12 and the upper surface of the stand 14 is an outer peripheral fitting portion 15 into which the inner region of the alignment portion 22 of the wafer transport device 4 is fitted.

[0018] The joint members 14a at positions 1 to 4 P4 are connected to the outer circumferential suction holes 13b. The joint members 14b at positions 1 to 4 P4 are connected to the inner circumferential suction holes 13a. The joint member 14c at position 1 P1 is connected to the Bernoulli hole 13c. The joint member 14d at position 1 P1 is for adsorbing the top 11 to the bottom 10. The joint members 14a to 14d are connected to the air control unit 16 via air tubes. The air control unit 16 is a suction pump to which the joint members 14a and 14b are connected. The air control unit 16 is also an air compression pump to which the joint member 14c is connected. Furthermore, the air control unit 16 is also a suction pump to which the joint member 14d is connected.

[0019] As shown in Figure 6, a wafer W is placed on the mounting surface 12. The mounting surface 12 has a larger diameter than the wafer W. When the wafer W is placed on the mounting surface 12, the wafer stage 2b adsorbs the wafer W using the inner circumferential adsorption holes 13a, or the inner circumferential adsorption holes 13a and the outer circumferential adsorption holes 13b, according to the size of the wafer W. If the wafer W cannot be adsorbed by the wafer stage 2b, air is further injected from the Bernoulli holes 13c to create negative pressure and assist in adsorption. As a result, even if the wafer W has warping, the warping is corrected so that it approaches flatness. As a result, the wafer W is adsorbed by the wafer transport device 4 and can be manually transported to the second device 3.

[0020] (Wafer transfer device 4) As shown in Figures 7 and 8, the wafer transfer device 4 includes a suction unit 21 and an alignment unit 22. Furthermore, the wafer transfer device 4 includes a handle 23 and a light-transmitting unit 24.

[0021] The suction section 21 is a suction plate equipped with four arm sections 21a to 21d. The four arm sections 21a to 21d extend radially from the center and, for example, have a cross shape. That is, one of the arms 21a to 21d is perpendicular to the adjacent arm section. The arm sections 21a to 21d are rectangular thin plates. In the arm sections 21a to 21d, the opposing surface facing the wafer W is the suction surface 26 for adsorbing the wafer W. The suction surface 26 is a flat surface. The arm sections 21a to 21d are equipped with four tip sections 25a to 25d.

[0022] As shown in Figure 8, each of the suction surfaces 26 of the arm portions 21a to 21d is provided with a hole 27. The hole 27 is an injection hole for injecting air for Bernoulli adsorption. The hole 27 is formed to create a swirling flow between itself and the wafer W placed on the mounting surface 12 of the wafer stage 2b, and the wafer W is attracted by the negative pressure at the center of the swirling flow. The hole 27 is connected to an air compression pump through internal piping of the suction portion 21. The further outward the hole 27 is positioned, the more warped wafers W can be attracted.

[0023] Each of the suction surfaces 26 of the arm portions 21a to 21d is provided with an alignment portion 22 at its tip portion 25a to 25d. The alignment portion 22 is a projection that protrudes from the suction surface 26 at the tip portion 25a to 25d. The alignment portion 22 comprises a top surface 22a and an inner circumferential side wall 22b. The top surface 22a is a flat surface parallel to the suction surface 26 and is at the same height as the other top surfaces 22a. The top surface 22a is the surface that contacts the base 14 of the wafer stage 2b. The inner circumferential side wall 22b is a fitting side wall that fits into the outer circumferential fitting portion 15 of the wafer stage 2b. As a result, the suction portion 21 is positioned relative to the mounting surface 12 in the height direction and in the lateral direction parallel to the mounting surface 12.

[0024] The alignment portion 22 is made of a resin material. As an example, the alignment portion 22 is made of a resin material that is relatively superior to other resin materials in terms of chemical resistance, high-temperature characteristics, abrasion resistance, hydrolysis resistance, and flame retardancy. As the resin material, PEEK (polyetheretherketone) resin is preferred. By being made of a resin material, the alignment portion 22 suppresses contamination of the alignment portion 22, wafer stage 2b, and wafer W even if it accidentally comes into contact with the wafer stage 2b or wafer W.

[0025] The suction section 21 is provided with a handle 23 on the upper surface 23a opposite to the suction surface 26. The handle 23 is constructed, for example, by bending a rod-shaped member into a C-shape. A pair of handles 23 are provided. The two ends of each handle 23 are fixed to the central part of the suction section 21 by fixing members such as screws. The pair of handles 23 are configured so that the user U can grasp them with both hands.

[0026] A light-transmitting section 24 is positioned above the upper surface 23a of the suction section 21. The light-transmitting section 24 is, for example, a fan-shaped light-transmitting plate. Alternatively, the light-transmitting section 24 is, for example, a semi-circular light-transmitting plate. The light-transmitting section 24 is fixed to the central part of the suction section 21 by fixing members such as screws. The light-transmitting section 24 is made of a light-transmitting resin plate. Alternatively, the light-transmitting section 24 is made of a transparent acrylic plate. The user U can see the wafer W placed on the wafer stage 2b because the light-transmitting section 24 is light-transmitting. The light-transmitting section 24 is, for example, provided to overlap with the arm section 21a. The light-transmitting section 24 is configured to overlap with at least one of the arm sections 21a to 21d.

[0027] As shown in Figure 9, the outer edge portion of the light-transmitting section 24 has an arc shape corresponding to the arc shape of the mounting surface 12 of the wafer stage 2b. The light-transmitting section 24 is provided with an arc-shaped alignment guide line 24a that corresponds to the outer edge 24b of the wafer W placed on the mounting surface 12. For example, the alignment guide line 24a is a marking line corresponding to the outer edge 24b of a 12-inch wafer W placed on the mounting surface 12. Alternatively, for example, the alignment guide line 24a is a marking line corresponding to the outer edge 24b of an 8-inch wafer W placed on the mounting surface 12. The user U can align the suction section 21 with respect to the wafer stage 2b by moving the suction section 21 to the upper side of the wafer stage 2b using the alignment guide line 24a as a guide. In other words, the user U can easily fit the inner peripheral side wall 22b into the outer peripheral fitting portion 15 of the wafer stage 2b without causing the alignment portion 22 to come into contact with an unintended location on the wafer W or wafer stage 2b.

[0028] A base portion 28 is provided in the central part of the upper surface 23a of the suction portion 21. The base portion 28 is provided with a joint member 28b to which an air tube 28a for connecting to an air compression pump is connected. An on / off valve 28c is provided on the joint member 28b. When the on / off valve 28c is open, it supplies air to the hole 27, and when it is closed, it shuts off the air.

[0029] (Tray 3b) As shown in Figure 10, the tray 3b of the second apparatus 3 is able to move in and out of the load port 3a. The wafer W is placed on the tray 3b when it is protruding from the load port 3a. The load port 3a is provided with a tray cover member 31 on the lower and front sides of the tray 3b. The tray cover member 31 comprises a support plate 31a and a cover portion 31b. The support plate 31a supports the tray 3b from below. The tray 3b moves together with the support plate 31a when it moves in and out of the load port 3a. The cover portion 31b closes the opening 31c of the load port 3a when the tray 3b is stored in the load port 3a.

[0030] Tray 3b comprises a tray body 32 having a U-shaped plate. The open end of the U-shape of the tray body 32 is the insertion side for the load port 3a. The tray body 32 is provided with a retaining recess 33 for holding the wafer W.

[0031] The tray body 32 is provided with recesses 34a to 34c on its front edge and both side edges. Recess 34a is provided on the front edge of the tray body 32. Recesses 34b and 34c are provided on both side edges of the tray body 32. Recesses 34a to 34c are recesses that connect the retaining recess 33 to the outside of the tray body 32. Recesses 34a to 34c have a width W2 that corresponds to the width W1 of the alignment portion 22 of the arm portions 21a to 21d.

[0032] The recesses 34a to 34c engage with the alignment portions 22 provided by three of the arm portions 21a to 21d. Specifically, as shown in Figure 11, the recess 34a engages with the alignment portion 22 provided by one of the arm portions 21a to 21d. This positions the suction unit 21 in a direction intersecting the direction in which the tray 3b enters and exits. In addition, the recesses 34b and 34c engage with the alignment portions 22 provided by the arm portions located on both sides of the arm portion corresponding to the recess 34a. This positions the suction unit 21 in the direction in which the tray 3b enters and exits. The bottom of the recesses 34a to 34c is in contact with the top surface 22a of the alignment portion 22.

[0033] When holding a wafer W in such a tray 3b, the alignment part 22 is engaged with the recesses 34a to 34c before the suction operation is stopped. As a result, the wafer W is released from the suction part 21 and held in the holding recess 33.

[0034] (Controller 41) The first device 2, the second device 3, and the wafer transport device 4 are controlled by the controller 41 (see Figure 1). For example, the controller 41 is a computer. The controller 41 includes a communication device, an input device, an output device, a storage device, a processor, etc. Note that this hardware configuration is just an example, and it can be implemented with other hardware.

[0035] Communication devices are interfaces that establish communication paths with other devices and perform data transmission and reception. Examples of communication devices include network interface cards and wireless interfaces. Input devices are devices that accept input of various types of information. Examples of input devices include touch panels, mice, and keyboards. Output devices are displays that show various types of information, speakers, etc. Storage devices store data, programs, etc., necessary to perform various functions of the control device. Examples of storage devices include ROM, RAM, hard disks, and SSDs.

[0036] A processor controls various processes using programs and data stored in memory. Examples of processors include CPUs and MPUs. A processor loads programs stored in ROM or other memory into RAM and executes various instructions corresponding to various processes. For example, when an application program is launched, the processor executes instructions corresponding to each process.

[0037] A processor is not limited to performing software processing for all the processes it executes. For example, a processor may have dedicated hardware circuits (e.g., application-specific integrated circuits: ASICs) that perform hardware processing for at least some of the processes it executes. That is, a processor can be configured as a circuit including (1) one or more processors that operate according to a computer program (software), (2) one or more dedicated hardware circuits that perform at least some of the various processes, and (3) a combination of (1) and (2). A processor includes a CPU and memory such as RAM and ROM, where memory stores program code or instructions configured to cause the CPU to execute processes. Memory includes any available medium that can be accessed by a general-purpose or dedicated computer.

[0038] (Wafer Transfer Method) Figure 12 is a flowchart showing the manual transfer of a wafer W from the first apparatus 2 to the second apparatus 3 using the wafer transfer device 4. In this embodiment, a wafer W that could not be transferred by the suction pad of the automatic transfer device remains on the wafer stage 2b of the first apparatus 2, and the case in which this wafer W is transferred to the second apparatus 3 using the wafer transfer device 4 will be described.

[0039] In step S1, the wafer W remaining on the mounting surface 12 of the wafer stage 2b is sucked up. Specifically, the wafer stage 2b adsorbs the wafer W using the inner periphery adsorption holes 13a, or the inner periphery adsorption holes 13a and the outer periphery adsorption holes 13b, according to the size of the wafer W. At this time, air is injected from the Bernoulli holes 13c to straighten the warped wafer W.

[0040] In step S2, user U grasps the handle 23 of the wafer transport device 4 and manually moves the wafer transport device 4 onto the wafer W. User U then fits the inner circumferential side wall 22b of the alignment part 22 into the outer circumferential fitting part 15. At the same time, user U brings the top surface 22a of the alignment part 22 into contact with the base 14. As a result, the wafer transport device 4 is placed on the wafer stage 2b while being supported by the base 14. In this state, the distance between the surface of the wafer W and the suction surface 26 of the suction part 21 is maintained constant. The suction part 21 is also aligned with the mounting surface 12 of the wafer stage 2b in the lateral direction parallel to the mounting surface 12. In this operation, user U can place the wafer transport device 4 while viewing the outer edge 24b of the wafer W through the light-transmitting part 24 and aligning the alignment guide line 24a with the outer edge 24b of the wafer W.

[0041] In this configuration, the position of the suction unit 21 relative to the mounting surface 12 is determined by the alignment unit 22 being supported by the base 14 and the inner peripheral side wall 22b being fitted into the outer peripheral fitting unit 15, thereby ensuring positioning in both the height and lateral directions. Consequently, the wafer transport device 4 is positioned to reliably perform Bernoulli suction on the suction surface 26 of the suction unit 21.

[0042] Furthermore, since the wafer transfer device 4 is supported by the mounting table 14, the position of the suction unit 21 relative to the wafer stage 2b is maintained even when the user U releases their hand from the handle 23. At this time, the user U can operate the first device 2, the second device 3, and the wafer transfer device 4 using both hands.

[0043] In step S3, the user U, who now has both hands free, operates the opening / closing valve 28c to open it. Accordingly, the wafer transfer device 4 injects air from the hole 27 and starts the suction operation for the wafer W. At this time, a second suction force, which is the suction force with which the wafer transfer device 4 suctions the wafer W, is smaller than a first suction force, which is the suction force with which the wafer stage 2b suctions the wafer W. Therefore, the wafer W suctioned onto the mounting surface 12 is not suctioned by the suction unit 21 and remains placed on the mounting surface 12.

[0044] In step S4, the user U operates the input device of the first device 2 to stop the suction operation of the wafer stage 2b via the controller 41. Accordingly, the wafer W is suctioned onto the suction surface 26 of the suction unit 21 by the second suction force of the wafer transfer device 4. Note that air may be injected between the wafer W and the mounting surface 12 from at least one of the inner circumferential suction hole 13a, the outer circumferential suction hole 13b, and the Bernoulli hole 13c.

[0045] Here, for example, if the positioning unit 22 is not provided on the suction unit 21 and the suction unit is not supported by the mounting table 14, the user U needs to hold the wafer transfer device 4 at all times. When the user U holds the wafer transfer device 4 by hand, the posture of the wafer transfer device 4 becomes unsteady, and the gap between the suction surface 26 and the wafer W is not kept constant. For this reason, the suction force acting on the wafer W becomes unstable, and as a result, there is a risk that the wafer W cannot be suctioned. In this regard, in the present embodiment, the position of the suction unit 21 of the wafer transfer device 4 is supported on the mounting table 14 by the positioning unit 22, and the inner circumferential side wall 22b is fitted to the outer circumferential fitting unit 15, so that positioning in the height direction and the lateral direction is performed. Therefore, in the wafer transfer device 4, the suction force is also stable, and the wafer W can be suction-held with high accuracy.

[0046] Next, in step S5, the user U grips the handle 23 and moves the wafer transfer device 4 to the second apparatus 3. Accordingly, the wafer W is transferred from the first apparatus 2 to the second apparatus 3. Even during this transfer, the possibility that the wafer W falls off from the wafer transfer device 4 can be reduced.

[0047] In step S6, the second apparatus 3 is in a state where the tray 3b is projected from the load port 3a. The tray 3b is in a state where the wafer W can be placed thereon. The user U engages the positioning portions 22 with the three recesses 34a to 34c of the tray 3b. Accordingly, the wafer W is placed in the holding recess 33 of the tray 3b. In this state, the wafer W is in a state of being Bernoulli-adsorbed to the suction surface 26. Therefore, the wafer W is not in contact with the bottom surface of the holding recess 33.

[0048] In step S7, when the user U closes the open / close valve 28c, air injection from the hole 27 is stopped, and the wafer W is placed on the holding recess 33. Accordingly, the transfer of the wafer W from the first apparatus 2 to the second apparatus 3 is completed.

[0049] (Effects of the Embodiment) (1) In the wafer transfer device 4, the plurality of positioning portions 22 are fitted to the outer peripheral fitting portion 15 of the wafer stage 2b. At the same time, the wafer transfer device 4 is supported on the mounting table 14 by the positioning portions 22. Accordingly, since the height of the suction portion 21 relative to the wafer W can be kept constant, the suction force of the wafer transfer device 4 for the wafer W is stabilized. Therefore, the wafer transfer device 4 can reliably transfer the wafer W from the first apparatus 2 to the second apparatus 3 that is the transfer destination while stably holding the wafer W. That is, the wafer W can be prevented from falling off from the wafer transfer device 4 during transfer of the wafer W.

[0050] (2) Furthermore, the wafer transfer device 4 is supported by the mounting table 14. Therefore, the user U can perform operations such as stopping suction of the first apparatus 2 without holding the wafer transfer device 4 by hand. That is, with the wafer transfer device 4, the user U can perform the transfer work of the wafer W without requiring an assistant.

[0051] (3) Since the outer peripheral fitting portion 15 of the wafer stage 2b is located just outside the outer edge 24b of the wafer W, the area inside the alignment portion 22 can be easily fitted into the wafer stage 2b using the alignment guide line 24a as a reference. In this case, it is possible to prevent the user U from accidentally bringing the suction portion 21 or the alignment portion 22 into contact with the wafer W or wafer stage 2b.

[0052] (4) The four alignment parts 22 are provided so that the wafer is stably supported on the base 14. (5) The joint members 14a to 14d, which are essential components for attracting the wafer W to the wafer stage 2b, can function as the base 14.

[0053] (6) In the second apparatus 3, the wafer transport device 4 can be positioned relative to the tray 3b by engaging the alignment part 22 of the suction part 21 with the recesses 34a to 34c of the tray 3b with respect to the tray 3b.

[0054] (7) The suction unit 21 can be aligned with the tray 3b by engaging the alignment unit 22 of the suction unit 21 with the three recesses 34a to 34c of the tray 3b. Specifically, the suction unit 21 can be aligned with the tray 3b in two directions: the direction in which the tray 3b enters and exits, and a direction intersecting the direction in which the tray 3b enters and exits.

[0055] (Modifications) This embodiment can be implemented with the following modifications. This embodiment and the following modifications can be combined with each other to the extent that they do not contradict each other technically.

[0056] As shown in Figures 13 and 14, the wafer W may be a TAIKO® wafer W1. A TAIKO wafer W1 is a wafer with a concave shape, which is created by grinding and thinning the wafer, leaving the outer peripheral portion Wb (approximately 3 mm) intact and grinding only the inside. In this case, as shown in Figure 15, the wafer stage 2b is equipped with a protruding support portion 29 into which the concave portion Wa of the wafer W1 fits. Even such a wafer W1 may have warping, as shown in Figures 2 and 3, and may not be able to be picked up by the suction pad of the automatic transfer device. Even in such cases, the wafer transfer device 4 can transfer the wafer W1 from the first device 2 to the second device 3.

[0057] The number of recesses 34a to 34c in tray 3b is not limited to three. For example, they may be provided only on the front edge of the tray body 32, or only on both side edges.

[0058] - The positions in which the joint members 14a to 14d are provided on the wafer stage 2b are not limited to four locations at 90° intervals. For example, they may be provided at two locations at 180° intervals, or at three locations at 120° intervals. Furthermore, the number of joint members provided at each position is not particularly limited; there may be two, three, or four, as long as the wafer transport device 4 can be stably supported.

[0059] The support portion configured as the base 14 may be composed of something other than the joint members 14a to 14d. For example, it may be composed of a step provided on the outer peripheral side wall of the wafer stage 2b, or it may be composed of a combination of a step and a joint member.

[0060] - The light-transmitting portion 24 may be semi-transparent rather than transparent, as long as it is light-transmitting and the wafer W is visible. The light-transmitting portion 24 may be located between adjacent arm portions among the arm portions 21a to 21d, i.e., in areas without arm portions. The light-transmitting portion 24 may be omitted from the wafer transport device 4. The alignment guide line 24a may be omitted for the light-transmitting portion 24.

[0061] Furthermore, there is no prerequisite that the light-transmitting portion 24 be made of a plate material that does not transmit light. Alternatively, the light-transmitting portion 24 may be omitted. The handle 23 may be a rod-shaped grip suitable for gripping in the palm, extending in any direction of the arm portions 21a to 21d. There may be one or more grips. The wafer transport device 4 may omit the handle 23. If the handle 23 is not provided, the wafer can be transported from the first device 2 to the second device 3 by grasping a part of the light-transmitting portion 24, etc.

[0062] The suction section 21 is not limited to a cross shape as long as it has a radial shape. For example, three arm sections may extend in three directions at 120° intervals. Furthermore, six arm sections may be arranged radially at 60° intervals. Alternatively, the arm sections may be two I-shaped sections. Three or more arm sections can be stably supported on the base 14.

[0063] - The first device 2 is not limited to a prober. - The first device 2 is not limited to the load port 3a, etc.

[0064] 1...wafer transport system, 2...first device, 2b...wafer stage, 3...second device, 3b...tray, 4...wafer transport device, 12...mounting surface, 13a...inner periphery suction hole, 13b...outer periphery suction hole, 13c...Bernoulli hole, 14...stand, 14a-14d...joint member, 15...outer periphery fitting part, 21...suction part, 21a-21d...arm part, 22...alignment part, 22a...top surface, 22b...inner periphery side wall, 23...handle, 24...translucent part, 24a...alignment guide line, 25a-25d...tip part, 26...suction surface, 27...hole, 32...tray body, 33...holding recess.

Claims

1. A wafer transport device that enables manual wafer transport, comprising: a suction surface configured to face a wafer placed on a wafer stage; a suction unit having a plurality of tip portions; a plurality of alignment portions provided on each of the tip portions and capable of fitting into an outer peripheral fitting portion of the wafer stage, wherein the wafer is suctioned while the alignment portions are supported by a support portion of the wafer stage.

2. The wafer transport device according to claim 1, further comprising a light-transmitting portion located on the upper side opposite to the suction surface, wherein the light-transmitting portion is provided with alignment guide lines corresponding to the outer edge of the wafer.

3. The wafer transport apparatus according to claim 1 or 2, wherein the suction portion has a radial shape comprising at least three of the aforementioned tip portions.

4. The wafer transport apparatus according to claim 1, wherein the support portion is a stand composed of a joint member connected to the wafer stage.

5. A wafer transport method for transporting a wafer placed on a wafer stage using the wafer transport device described in claim 1, the wafer being attracted to the wafer stage by a first suction force, the wafer transport device being positioned relative to the wafer stage by fitting the alignment part to the outer peripheral fitting part and supporting it with the support part, the wafer transport device being started to perform a suction operation on the wafer with a second suction force smaller than the first suction force of the wafer stage, the wafer being attracted to the suction part by stopping the suction operation of the wafer stage, and the wafer transport device being manually moved to a transport destination, and the suction operation of the wafer transport device being stopped at the transport destination.

6. The wafer transport method according to claim 5, wherein the support portion is a stand composed of a joint connected to the wafer stage.

7. The wafer transport method according to claim 5, wherein the transport destination comprises a tray on which the wafer transported by the wafer transport device is placed, the tray comprises a recess provided on its outer circumference, the suction portion is plate-shaped and has a width that can engage with the recess, and the wafer is positioned relative to the tray by engaging the suction portion with the recess.

8. The wafer transport method according to claim 7, wherein the tray has at least three recesses on its outer circumference.

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