Imaging device, electronic apparatus, and manufacturing method

Abstract

The present technology relates to an imaging device, an electronic apparatus, and a manufacturing method that make it possible to improve image quality by suppressing generation of stray light components. The present invention comprises: a chip that has a photoelectric conversion element formed thereon; a cover glass; a first member that is positioned between the chip and the cover glass, and bonds the chip and the cover glass; and a second member that is formed of a material different from that of the first member, is alternately disposed with the first member, and is disposed so as to surround an effective pixel region. The present technology can be applied, for example, to a packaged imaging device.

Description

Image pickup apparatus, electronic device, and manufacturing method

[0001] The present technology relates to an image pickup apparatus, an electronic device, and a manufacturing method, and for example, relates to an image pickup apparatus, an electronic device, and a manufacturing method that can improve image quality.

[0002] Conventionally, as a structure for bonding a glass substrate to a semiconductor substrate to seal a pixel region where a plurality of pixels are arranged, a cavity structure in which a gap is provided between the semiconductor substrate and the glass substrate has been employed (see, for example, Patent Document 1).

[0003] Japanese Unexamined Patent Application Publication No. 2012-175461

[0004] Since the structure has the semiconductor substrate and the glass substrate bonded to each other, there is a bonding portion where the semiconductor substrate and the glass substrate are bonded, and stray light components may be generated at this bonding portion. It is desired to suppress the generation of stray light components and further improve image quality.

[0005] The present technology has been made in view of such circumstances, and is intended to enable improvement of image quality.

[0006] An image pickup apparatus according to one aspect of the present technology includes: a chip on which a photoelectric conversion element is formed; a cover glass; a first member located between the chip and the cover glass and bonding the chip and the cover glass; and a second member formed of a material different from that of the first member, alternately arranged with the first member, and arranged to surround an effective pixel region.

[0007] An electronic device according to one aspect of the present technology includes: an image pickup apparatus including a chip on which a photoelectric conversion element is formed, a cover glass, a first member located between the chip and the cover glass and bonding the chip and the cover glass, and a second member formed of a material different from that of the first member, alternately arranged with the first member, and arranged to surround an effective pixel region; and a processing unit that processes a signal from the image pickup apparatus.

[0008] One aspect of this technology is a manufacturing method for an imaging device comprising a chip on which a photoelectric conversion element is formed, a cover glass, a first member positioned between the chip and the cover glass and joining the chip and the cover glass, and a second member formed of a different material from the first member, arranged alternately with the first member and arranged to surround the effective pixel area. This manufacturing method involves forming a portion to become the first member on a wafer on which a plurality of the chips are formed, joining the portion to become the first member to a glass substrate that will become the cover glass, cutting from the glass substrate side to a part of the wafer to form a groove, filling the groove with a material that will become the second member, and cutting the groove to separate the imaging device into individual pieces.

[0009] In one aspect of this technology, the imaging device includes a chip on which a photoelectric conversion element is formed, a cover glass, a first member located between the chip and the cover glass and joining the chip and the cover glass, and a second member formed of a different material from the first member, arranged alternately with the first member, and positioned to surround the effective pixel area.

[0010] One aspect of this technology is that the electronic equipment includes the aforementioned imaging device.

[0011] In one aspect of this technology, an imaging device is manufactured comprising a chip on which a photoelectric conversion element is formed, a cover glass, a first member positioned between the chip and the cover glass and joining the chip and the cover glass, and a second member formed of a different material from the first member, arranged alternately with the first member, and positioned to surround the effective pixel area. On a wafer on which multiple chips are formed, a portion to become the first member is formed, the glass substrate to become the cover glass and the portion to become the first member are joined, a portion of the wafer from the glass substrate side is cut to form a groove, the material to become the second member is filled into the groove, and the groove portion is cut to separate the imaging device into individual pieces.

[0012] The imaging device or electronic equipment may be an independent device or an internal block that constitutes a single device.

[0013] This is a diagram illustrating an example of the configuration of the imaging device in the first embodiment. This is a diagram illustrating an example of the configuration of the imaging device. This is a diagram illustrating an example of the configuration of the imaging device. This is a diagram illustrating the suppression of stray light components. This is a diagram illustrating the protection of the cover glass. This is a diagram illustrating the manufacturing of the imaging device. This is a diagram illustrating the method of filling with resin. This is a diagram illustrating the configuration of the imaging device in the second embodiment. This is a diagram illustrating the manufacturing of the imaging device. This is a diagram illustrating the configuration of the imaging device in the third embodiment. This is a diagram illustrating the manufacturing of the imaging device. This is a diagram illustrating the configuration of the imaging device in the fourth embodiment. This is a diagram illustrating the configuration of the imaging device in the fifth embodiment. This is a diagram illustrating the configuration of the imaging device in the sixth embodiment. This is a diagram illustrating the configuration of the imaging device in the seventh embodiment. This is a diagram illustrating the shape of the column. This is a diagram illustrating the shape of the wall. This is a diagram illustrating the shape of the column. This is a diagram illustrating the shape of the column. This is a diagram illustrating the shape of the column. This is a diagram illustrating the shape of the wall wall. This is a diagram illustrating the size of the scrub line. These are diagrams illustrating examples of electronic device configurations. One diagram shows a schematic example of an endoscopic surgical system configuration. Another is a block diagram illustrating an example of the functional configuration of a camera head and CCU. A third is a block diagram illustrating a schematic example of a vehicle control system configuration. Finally, there is an explanatory diagram showing an example of the installation location of an external information detection unit and an imaging unit.

[0014] The following describes the embodiments for implementing this technology.

[0015] <Configuration of the imaging device in the first embodiment> The configuration of the imaging device in the first embodiment will be described below.

[0016] Figure 1 shows an example of the planar configuration of the imaging device 201a in the first embodiment. Figure 2 shows an example of the cross-sectional configuration of the imaging device 201a along the line segment A-A' in the planar configuration example shown in Figure 1. Figure 3 shows an example of the cross-sectional configuration of the imaging device 201a along the line segment B-B' in the planar configuration example shown in Figure 1.

[0017] Referring to Figure 1, when the imaging device 201a is viewed from the cover glass 212 (Figure 2) side, the effective pixel area 221 is configured to be surrounded by a wall 231 and a column 232.

[0018] Referring to the cross-sectional configuration example of the imaging device 201a shown in Figures 2 and 3, the imaging device 201a consists of an image sensor chip 211 and a cover glass 212. The image sensor chip 211 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device). The effective pixel area 221 of the image sensor chip 211 is equipped with a plurality of photoelectric conversion elements (PDs: Photo Diodes) 223 that convert incident light into electric charge on a silicon substrate 222.

[0019] A color filter layer 224 is formed on the photoelectric conversion element 223 (silicon substrate 222). A configuration in which microlenses (not shown) are formed on the color filter layer 224 is also possible.

[0020] A wiring layer is formed on the lower part of the silicon substrate 222 of the image sensor chip 211 (the side opposite to the light incident surface), and wiring 225 is formed thereon. The wiring 225 is made of materials such as Al (aluminum) and Cu (copper), and is formed within an insulating film made of an oxide film or nitride film.

[0021] A predetermined wire 225 among the multiple wires 225 is connected to a connection terminal 226 and a surface electrode 227. The connection terminal 226 is a connection terminal for connecting to an external circuit and is formed at the bottom of the silicon substrate 222. The connection terminal 226 can also be made of anisotropic conductive material such as ACP (anisotropic conductive paste) or ACF (anisotropic conductive film) using solder balls.

[0022] The image sensor chip 211 and the cover glass 212 are joined by a wall 231 and a column 232. The column 232 and the wall 231 are located between the image sensor chip 211 and the cover glass 212. The column 232 has the role of maintaining a uniform distance between the image sensor chip 211 and the cover glass 212 and joining them, while the wall 231 is located between the column 232 and has the role of joining the image sensor chip 211 and the cover glass 212.

[0023] As shown in the plan view of Figure 1, the columns 232 are provided at the four corners of the imaging device 201a in a predetermined size and shape. In the example shown in Figure 1, they are provided in a rectangular shape at the four corners of the imaging device 201a. The cross-sectional configuration of the imaging device 201a, including the portion with columns 232, is shown in Figure 2.

[0024] Referring to Figure 2, walls 231 are provided on the side of the cover glass 212, the side of the column 232 (the side not facing the cavity), and the side of the image sensor chip 211.

[0025] As will be described later, the wall 231 can be formed from a liquid curing resin, and during manufacturing, when it is filled between column 232 and adjacent columns 232, it is also formed on the cavity side of column 232 by capillary action. Here, the wall 231 formed on the cavity side of column 232 by capillary action will be appropriately referred to as wall 233.

[0026] As shown in Figure 2, the side of the column 232 is surrounded by walls 231 and 233, the top surface is joined to the cover glass 12, and the bottom surface is joined to the image sensor chip 211.

[0027] The column 232 is made of a material that can bond the image sensor chip 211 and the cover glass 212, such as a silicone-based resin. For example, a heat-resistant adhesive tape can also be used. The column 232 is formed of a material with high performance in bonding (adhering) the image sensor chip 211 and the cover glass 212.

[0028] If an electrical connection is required between the image sensor chip 211 and the cover glass 212, a conductive resin may be used as the material for the column 232. For example, when a transparent electrode is used for the cover glass 212, or when a functional glass such as a liquid crystal panel is used, a conductive resin can be used for the column 232, and an electrical signal can be supplied from or to the image sensor chip 211.

[0029] A wall 231 is provided between the columns 232. The cross-sectional structure of the imaging device 201a outside the area where the columns 232 are provided is as shown in Figure 3. Referring to Figure 3, a wall 231 is provided between the image sensor chip 211 and the cover glass 212. In addition, a wall 231 is provided on the side of the image sensor chip 211 and the side of the cover glass 212.

[0030] The effective pixel area 221 is sealed by the wall 231 and column 232, forming a cavity. The wall 231 can be made of a sealing material, such as an epoxy resin or liquid curing resin used as an underfill material.

[0031] When focusing on a single image sensor chip 211, the effective pixel area 221 is sealed by the alternating arrangement of pillars 232 and walls 231, such that a wall 231 is located next to a pillar 232, and another pillar 232 is located next to that wall 231.

[0032] In conventional imaging devices, stray light components were generated by the bonding resin corresponding to the wall 231, and there was a possibility that this light would be incident on the photoelectric conversion element. To prevent such stray light, the wall 231 may be made of a material with high light absorption, such as a black or textured material.

[0033] By using different materials for the column 232 and the wall 231, it is possible to select and use materials with the desired performance characteristics for each, thereby further suppressing the effects of stray light and enabling miniaturization.

[0034] Referring to Figure 4, we will explain how stray light can be suppressed. Figure 4 is the same as the imaging device 201a shown in Figure 3, and the light incident on this imaging device 201a is represented by arrows. Here, we will explain using the example where the wall 231 (wall 233) is formed of a light-absorbing material.

[0035] Referring to the left side of Figure 4, some of the light incident from the right at an oblique angle hits the wall 233 and is reflected, but is absorbed and attenuated upon hitting the wall 233. Referring to the right side of Figure 4, light incident from the side of the imaging device 201a hits the wall 231, is absorbed and attenuated, and is therefore prevented from entering the imaging device 201a. In this way, the stray light component incident on the photoelectric conversion element 223 can be suppressed.

[0036] Since the wall 231 is also provided on the side surface of the silicon substrate 222 and the side surface of the cover glass 212, the effect shown in Figure 5 can also be obtained. Figure 5 is an enlarged view of the side surface of the cover glass 212. The edges of the silicon substrate 222 and the edges of the cover glass 212 are cut by dicing during manufacturing, as will be described later. At this time, jagged edges, so-called chipping, as shown in Figure 5 may occur, which may reduce the strength of the imaging device 201a.

[0037] By forming walls 231 on the sides of the silicon substrate 222 and the cover glass 212, chipping can be reinforced, thereby preventing a decrease in the strength of the imaging device 201a. Using such chipping, for example, it is possible to create a structure in which light incident on the side of the cover glass 212 is diffusely reflected, preventing stray light that would otherwise enter the imaging device 201a from the side. In this way, a structure that utilizes chipping can be created to suppress stray light components, and even with such a configuration, the strength of the imaging device 201a can be maintained.

[0038] <Manufacturing of the imaging device 201a in the first embodiment> The manufacturing method of the imaging device 201a shown in Figures 1 to 4 will be described with reference to Figure 6.

[0039] In step S101, a semiconductor wafer 241 is prepared, on a substrate formed from a silicon single crystal, on which multiple pixel regions containing photoelectric conversion elements 223 are formed. A bonding resin sheet 242, which is approximately the same size as the semiconductor wafer 241 and will form columns 232, is attached to the semiconductor wafer 241. The bonding resin sheet 242 may be a film-like sheet or a sheet formed by depositing a liquid bonding resin.

[0040] In step S102, the bonding resin sheet 242 is processed to form the portion that will become the column 232. For example, the portion that will become the column 232 is formed by patterning the bonding resin sheet 242. At this time, the portion that will become the column 232, which is left after patterning, is for example rectangular in shape, as will be described later, and is sized to allow a portion of the ends of the four image sensor chips 211 to touch, and is also sized to take into account the width to be diced. After the bonding resin sheet 242 is processed, the glass substrate 243 that will become the cover glass 212 is bonded to it.

[0041] In step S103, the glass substrate 243, the column 232, and a portion of the semiconductor wafer 241 are cut to form a groove 245 into which resin is poured. At the point when the groove 245 is formed, the glass substrate 243 is in pieces the size of the cover glass 212.

[0042] In step S104, a liquid-curable resin that will form the wall 231 is filled into the groove 245. Figure 7 is a diagram illustrating the method of resin filling performed in step S204, and is a perspective view of the imaging device 201a in the process of manufacturing, having the cross-sectional structure shown in step S104 of Figure 6. The example shown in Figure 7 shows the case where only the glass substrate 243 is half-cut.

[0043] The groove 245 is filled with the liquid curable resin 246 by moving a discharge nozzle 247 discharging the liquid curable resin 246 along the groove 245. The wall 231 is formed by filling the groove 245 between the pillars 232 with the resin 246. In addition, due to capillary action, the wall 233 is also formed on the cavity-side side surface of the pillars 232. The film thickness of the wall 233 can be adjusted depending on factors such as the viscosity of the material used as the resin 246 and the amount of the resin 246 poured into the groove 245. Therefore, depending on the viscosity, amount and other parameters of the resin 246, it is also possible to manufacture the imaging device 201a configured such that the wall 233 is not formed.

[0044] In step S104, the flow of the liquid curable resin 246 flowing into the photoelectric conversion elements 223 on the pixel side of the semiconductor wafer 241 (silicon substrate 222) can be controlled by providing a step via a lens array or the like on the pixel side. In addition, the region where the resin 246 flows can also be controlled by the gap distance between the cover glass 212 and the silicon substrate 222, and this gap distance can be generally determined by the thickness of the adhesive between the cover glass 212 and the silicon substrate 222 (the thickness of the wall 231). This thickness can be, for example, approximately 15 to 100 um.

[0045] The shape (including thickness) of the wall 231 serving as the side wall of the imaging device 201a can be controlled by the surface shapes of the silicon substrate 222 and the cover glass 212, the viscosity of the resin 246, the discharge amount of the resin 246, the temperature of the resin 246, and other factors.

[0046] In step S105 (FIG. 6), the semiconductor wafer 241 is thinned. The thinning is performed to at least the tip of the groove 245, resulting in a state where the filled resin 246 is exposed. The resin 246 is cured before the thinning is performed.

[0047] In step S106, dicing is performed with a blade using the position of the groove 245 filled with the resin 246 as a scribe line, thereby performing singulation to manufacture the imaging device 201a.

[0048] In this way, the pillars 232 are formed, and then the wall 231 is formed. In the image pickup apparatus 201a, the portion that seals the photoelectric conversion element 223 and the like is composed of the pillars 232 and the wall 231 made of different materials, and is manufactured through the manufacturing process as described above.

[0049] <Configuration and Manufacturing of Image Pickup Apparatus in Second Embodiment> FIG. 8 is a diagram showing a configuration example of an image pickup apparatus 201b according to the second embodiment.

[0050] The image pickup apparatus 201b shown in FIG. 8 is the same as the image pickup apparatus 201a shown in FIG. 2 in that the wall 251 provided on the side surface of the image pickup apparatus 201b covers the side surface of the cover glass 212 and the side surface of the pillar 232, but differs in that it does not cover the side surface of the image pickup element chip 211.

[0051] FIG. 9 is a diagram for explaining manufacturing of the image pickup apparatus 201b. Step S121 is a step corresponding to step S103 (FIG. 6), in which a portion to become the pillars 232 is formed, and a semiconductor wafer 241 to become the image pickup element chip 211 and a glass substrate 243 to become the cover glass 212 are bonded together. When dicing is performed with a blade on the image pickup apparatus 201b in this state, in step S121, dicing is performed such that only the glass substrate 243 and the pillars 232 are cut from the glass substrate 243 side, and the semiconductor wafer 241 is not cut.

[0052] By performing step S121, a groove 245 is formed in the glass substrate 243 and the pillars 232. This groove 245 is filled with a fluid curable resin 246 (step S122). Step S122 corresponds to step S104 (FIG. 6), and after the processing of step S122, processing corresponding to step S105 and step S106 is performed, whereby the image pickup apparatus 201b shown in FIG. 8 is manufactured.

[0053] In this way, by dicing the glass substrate 243 side and stopping the dicing at the position of the semiconductor wafer 241, the wall 251 covering the side surface of the cover glass 212 can be formed.

[0054] <Configuration and Manufacturing of the Imaging Device in the Third Embodiment> Figure 10 shows an example of the configuration of the imaging device 201c in the third embodiment.

[0055] The imaging device 201c shown in Figure 10 is identical to the imaging device 201a shown in Figure 2 in that the wall 252 provided on the side of the imaging device 201c covers the side of the column 232 and the side of the image sensor chip 211, but it differs in that it does not cover the side of the cover glass 212.

[0056] Figure 11 is a diagram illustrating the manufacturing process of the imaging device 201c. Process S131 corresponds to process S103 (Figure 6), in which the column 232 is formed and the semiconductor wafer 241, which will become the image sensor chip 211, and the glass substrate 243, which will become the cover glass 212, are bonded together. When dicing is performed on the imaging device 201c in this state using a blade, the blade is inserted from the semiconductor wafer 241 side, and dicing is performed in which only the semiconductor wafer 241 and the column 232 are cut, and the glass substrate 243 is not cut.

[0057] Step S131 is performed to form grooves 245 between the semiconductor wafer 241 and the column 232. Flow-curable resin 246 is filled into these grooves 245 (step S132). Step S132 corresponds to step S104 (Figure 6), and after the processing in step S132, the processes corresponding to steps S105 and S106 are performed to manufacture the imaging device 201c shown in Figure 10.

[0058] In this way, by dicing the semiconductor wafer 241 and stopping the dicing at the position of the glass substrate 243, a wall 252 that covers the side surface of the image sensor chip 211 can be formed.

[0059] <Configuration of the imaging device in the fourth embodiment> Figure 12 shows an example of the configuration of the imaging device 201d in the fourth embodiment.

[0060] The imaging device 201d shown in Figure 12 differs from the imaging device 201a shown in Figure 2 in that a film 271 is provided on the light incident surface side of the cover glass 212 of the imaging device 201d, but is otherwise identical.

[0061] The imaging device 201d shown in Figure 12 has a wall 231 on the side of the cover glass 212, and a film 271 is provided at the end on the light incident surface side. The film 271 is, for example, the region where the column 232 is provided, and is provided in the corresponding region of the light incident surface of the cover glass 212. By providing the film 271, light incident from the end of the imaging device 201d can be blocked by the film 271, and the stray light component can be suppressed.

[0062] The film 271 can be formed from the same material as the wall 231. The film 271 can be formed at the same time as the wall 231 is formed. For example, in step S104 (Figure 6), the wall 231 and the film 271 can be formed simultaneously by increasing the amount of resin 246 discharged from the discharge nozzle 247.

[0063] <Configuration of the imaging device in the fifth embodiment> Figure 13 shows an example of the configuration of the imaging device 201e in the fifth embodiment.

[0064] The imaging device 201e shown in Figure 13 differs from the imaging device 201a shown in Figure 2 in that the wall 281 on the side of the imaging device 201e has a pentagonal cross-sectional shape; otherwise, it is the same.

[0065] The side of the imaging device 201e shown in Figure 13 is provided with a wall 281 that has a pentagonal cross-section. In imaging devices such as the one shown in Figure 2, the wall 231 provided on the side of the imaging device 201a had a square cross-section, but as shown with the wall 281 in Figure 12, it may have a shape other than a square. For example, the wall 281 can be formed as a polygon.

[0066] When forming the wall 281 in a polygonal shape, for example, after individualizing the resin, the resin forming the wall 281 can be partially melted and deformed to process it into the desired shape.

[0067] By forming the wall 281 in a polygonal shape, even if some of the light incident on the side of the imaging device 201e is incident on the wall 281, the shape of the wall 281 adjusts the optical path length, causing it to attenuate before reaching the photoelectric conversion element 223 or to be redirected to a path other than the one leading to the photoelectric conversion element 223, thereby suppressing stray light components.

[0068] <Configuration of the imaging device in the sixth embodiment> Figure 14 shows an example of the configuration of the imaging device 201f in the sixth embodiment.

[0069] The imaging device 201f shown in Figure 14 differs from the imaging device 201a shown in Figure 2 in that the wall 291 on the side of the imaging device 201f is made of a transparent material, but is otherwise identical.

[0070] A wall 291 made of transparent resin is provided on the side of the imaging device 201f shown in Figure 14, and a wall 292 made of transparent resin is also provided on the cavity side of the column 232. A transparent resin is a resin that transmits light of a predetermined wavelength, and may be colored in visible light.

[0071] Even when walls 291 and 292 are formed from transparent resin, the sides of the imaging device 201f are protected by wall 291, thus maintaining the strength of the imaging device 201f.

[0072] <Configuration of the imaging device in the seventh embodiment> Figure 15 shows an example of the configuration of the imaging device 201g in the seventh embodiment.

[0073] The imaging device 201g shown in Figure 15 differs from the imaging device 201f shown in Figure 14 in that the cavity is filled with the same transparent resin 293 as the wall 291, and otherwise has the same configuration as the imaging device 201f shown in Figure 14.

[0074] The imaging device 201g shown in Figure 15 has a cavity-less structure in which a transparent resin 293 is filled inside the cavity. The resin 293 can be made of the same material as the wall 291, and during manufacturing, when the wall 291 is formed, it can be filled into the cavity by capillary action.

[0075] By forming the wall 291 with transparent resin, the sides of the imaging device 201g can be protected, and by filling the cavity with resin 293, the strength of the imaging device 201g can be increased.

[0076] <Regarding the shape of the columns and walls> Refer to Figures 16 and later to explain the shapes of the columns 232 and walls 231. In the following explanation, the imaging device 201a shown in Figure 2 will be used as an example.

[0077] Figure 16 shows a 2x2 image sensor chip 211 formed on a semiconductor wafer 241, where the dotted lines represent the boundary lines of the image sensor chip 211 and the areas that will become scrub lines. The same applies to the other drawings.

[0078] As shown in Figure 16, the columns 232 are formed in a rectangular shape and are located at the four corners of the image sensor chip 211. Focusing on the column 232 located in the center of the four 2x2 image sensor chips 211 shown in Figure 16, the column 232 is formed to be sized to overlap each end of the four image sensor chips 211.

[0079] When resin for forming walls 231 is poured into a semiconductor wafer 241 on which the columns 232 shown in Figure 16 are formed, walls 231 are formed as shown in Figure 17. The manufacturing of the imaging device 201 is explained with reference to Figures 6, 9, or 11, by pouring resin after the columns 232 have been diced. Therefore, the column 232 which was shown as one column 232 in Figure 16 is divided into four columns 232 as shown in Figure 17.

[0080] The wall 231 is formed as a wall 231 having a width approximately the same as that of the column 232 before division, as shown in Figure 17. When forming a wall 231 as shown in Figure 17, it is also possible to form a column 232 as shown in Figure 18.

[0081] The column 232 shown in Figure 18 is formed to be of roughly the same size and shape as the divided column 232 shown in Figure 17. When forming the column 232 by patterning in step S102 (Figure 6), the column 232 may be formed to be of a size and shape that fits inside the image sensor chip 211, as shown in Figure 18. By forming it in this way, when the resin is filled, a wall 231 as shown in Figure 17 is formed.

[0082] When the amount of resin used for filling is reduced, a narrow wall 231 can be formed, as shown in Figure 19. The wall 231 shown in Figure 19 can be formed when using the column 232 shown in Figure 16 or the column 232 shown in Figure 18. The wall 231 may be formed to be about the same width as the column 232, as shown in Figure 17, or it may be formed to be narrower than the column 232, as shown in Figure 19.

[0083] The shape of the column 232 does not have to be a rectangle. The column 232 shown in Figure 20 is circular. Thus, the column 232 may have no corners, for example, it may be circular.

[0084] As shown in Figure 21, the columns 232 are rectangular in shape, but their arrangement may differ from that of the columns 232 shown in Figure 16. Referring again to Figure 16, the columns 232 shown in Figure 16 have the center of each side located on the scrub line, so even after dicing, they remain rectangular, as shown in Figure 17.

[0085] As shown in Figure 21, the corners of the rectangular column 232 are located on the scrub line. Therefore, after dicing, the column 232 becomes triangular, as shown in Figure 22. The triangular column 232 shown in Figure 22 may be formed during the patterning process.

[0086] When a semiconductor wafer with the columns 232 shown in Figure 21 is processed and resin is poured into it, or when resin is poured into a semiconductor wafer with the columns 232 shown in Figure 22, a wall 231 is formed as shown in Figure 23. In the example shown in Figure 23, the columns 232 formed at both ends of the wall 231 are triangular in shape.

[0087] The columns 232 may be positioned not only at the four corners of the image sensor chip 211, but also along the edges of the image sensor chip 211, as shown in Figure 24. In the example shown in Figure 24, columns 232-1 are formed at each of the four corners of the image sensor chip 211, and columns 232-2 are formed along the edges of the image sensor chip 211. Columns 232-2 are formed in a smaller shape than columns 232-1.

[0088] When resin is poured into a semiconductor wafer on which columns 232-1 and 232-2 are formed, a wall 231 is formed as shown in Figure 25. The presence of column 232-2 makes it possible to create a structure that suppresses the resin from flowing into the cavity.

[0089] As shown in Figure 26, the columns 232-2 may be formed as multiple small columns between the large columns 232-1. In the example shown in Figure 26, the columns 232-2 are formed in a 2x4 arrangement. When resin is poured into a semiconductor wafer on which columns 232-1 and multiple small columns 232-2 are formed, a wall 231 is formed as shown in Figure 27. By providing multiple small columns 232-2, a structure can be created that further suppresses the flow of resin into the cavity.

[0090] The shape of the wall 233 at the column 232 may be a curved shape as shown in Figure 28. The column 232 shown in Figure 28 is the same as the column 232 shown in Figure 23, with triangular columns 232 positioned at the four corners of the image sensor chip 211. The wall 233 provided on the cavity side of this triangular column 232 is formed with a curved shape.

[0091] The resin shape described above can be formed by controlling the flow of the liquid-curable resin. The flow of the liquid-curable resin can be controlled by the shape of the adhesive between the image sensor chip 211 and the cover glass 212 (the part that becomes the column 232), the height of the adhesive, the width of the groove for filling the adhesive (for example, the groove 245 in Figure 6), the thickness of the cover glass 212, etc. It can also be controlled by the viscosity, flow rate, temperature, coating speed of the liquid-curable resin, the surface shape (irregularities) of the cover glass 212 surface and the image sensor chip 211 (silicon substrate 222), etc.

[0092] Furthermore, as shown in Figure 29, columns 232-1 and 232-2 can be formed to create a wall 231. Figure 29 is a plan view of one imaging device 201. Rectangular columns 232-1 are formed at the four corners of the imaging device 201, and between these columns 232-1, a number of columns 232-2, which are smaller than the columns 232-1, are formed in a row.

[0093] By arranging multiple small columns 232-2 and controlling the flow of liquid-curable resin, the shape of the liquid-curable resin surface (wall 231) inside the cavity can be formed into an uneven, corrugated shape. By forming the wall 231 in a corrugated shape, flare can be reduced due to diffuse reflection of reflected light.

[0094] Although not shown in the diagram, by using a resin that gives the surface of the liquid-curable resin (wall 231) a textured surface or a resin with numerous pores, reflection can be suppressed, and flare can be reduced by diffuse scattering of reflected light.

[0095] In the examples of the columns 232 shown in Figures 24 to 29, the case where columns 232-1 are formed at the four corners of the image sensor chip 211 is shown. However, it is also possible to have a configuration where there are no columns 232-1 at the four corners, and columns 232-2 are formed on the sides.

[0096] <Example of Scrub Line Reduction> Referring to Figure 30, another method of manufacturing the imaging device 201 will be described.

[0097] In step S201, dicing is performed on a semiconductor wafer 241 on which the image sensor chip 211 is formed and a glass substrate 243 which will become the cover glass 212, which are joined together by pillars 232.

[0098] In step S201, the blade is controlled so that only the glass substrate 243 is cut from the glass substrate 243 side. The width of the scrub line at this time is denoted as width e1. This width e1 is, for example, about 150 to 200 μm. Resin is filled into the groove 245 formed with width e1 (step S202).

[0099] As shown in step S202, resin is filled into the groove 245 with width e1, forming a portion that will become the wall 231. In this state, the resin forming the wall 231, the column 232, and the semiconductor wafer 241 are diced together. The width of the scrub line at this time is denoted as width e2. This width e2 is, for example, about 50 to 80 μm.

[0100] Thus, since the dicing of the glass substrate 243 and the dicing of the semiconductor wafer 241 are different, a blade suitable for each dicing method can be used. The blade used for dicing the semiconductor wafer 241 can be smaller than the blade used for dicing the glass substrate 243. In other words, when dicing the semiconductor wafer 241, the area to be cut can be reduced.

[0101] As shown in step S202 of Figure 30, the edges of the cover glass 212 and the image sensor chip 211 after dicing are in different positions when viewed in the vertical direction in the figure, with the image sensor chip 211 being located further out. This means that the image sensor chip 211 can be made larger than the cover glass 212.

[0102] The area where the image sensor chip 211 can be enlarged, in other words, the area that is the difference in size between the cover glass 212 and the image sensor chip 211, can be used to arrange circuits and other components. This increases the yield of the semiconductor wafer 241.

[0103] According to this technology, the portion joining the image sensor chip 211 and the cover glass 212 is constructed by dividing it into a column and a wall (for example, the column 232 and wall 231 shown in Figure 2). Therefore, materials with desired properties can be used for the column portion and the wall portion. By selecting appropriate materials, it is possible to create a structure that further suppresses stray light components or increases strength.

[0104] By using a material suitable for joining the image sensor chip 211 and the cover glass 212 for the wall, it is possible to obtain sufficient bonding strength even if the width of the wall is narrowed. This reduces the area of ​​the wall, allowing for miniaturization of the imaging device 201.

[0105] By protecting the side of the image sensor chip 211 with a wall (for example, the wall 231 shown in Figure 2), the reliability of the product can be improved.

[0106] <Configuration of Electronic Devices> The imaging device described above is applicable to all electronic devices that use an imaging device packaged in the image acquisition unit (photoelectric conversion unit), such as digital still cameras and video cameras, mobile terminal devices with imaging functions such as mobile phones, and photocopiers that use an imaging device in the image reading unit.

[0107] Figure 31 is a block diagram showing an example of the configuration of an electronic device according to this technology, such as an imaging device. As shown in Figure 31, the imaging device 1000 according to this technology includes an optical system including a lens group 1001, an image sensor (imaging device) 1002, a DSP circuit 1003, a frame memory 1004, a display device 1005, a recording device 1006, an operating system 1007, and a power supply system 1008. The DSP circuit 1003, frame memory 1004, display device 1005, recording device 1006, operating system 1007, and power supply system 1008 are interconnected via a bus line 1009.

[0108] The lens group 1001 captures incident light (image light) from the subject and forms an image on the imaging surface of the image sensor 1002. The image sensor 1002 converts the amount of incident light formed on the imaging surface by the lens group 1001 into an electrical signal on a pixel-by-pixel basis and outputs it as a pixel signal.

[0109] The display device 1005 consists of a panel-type display device such as a liquid crystal display device or an organic EL (electroluminescence) display device, and displays a video or still image captured by the image sensor 1002. The recording device 1006 records the video or still image captured by the image sensor 1002 onto a recording medium such as a videotape or a DVD (Digital Versatile Disk).

[0110] The control system 1007 issues operation commands for various functions of the imaging device under the user's control. The power supply system 1008 appropriately supplies various power sources to the DSP circuit 1003, frame memory 1004, display device 1005, recording device 1006, and control system 1007.

[0111] The imaging device with the above configuration can be used as an imaging device for video cameras, digital still cameras, and even camera modules for mobile devices such as mobile phones. In such an imaging device, the imaging device described above can be used as the image sensor 1002.

[0112] <Examples of application to endoscopic surgical systems> The technology disclosed herein (this technology) can be applied to various products. For example, the technology disclosed herein may be applied to endoscopic surgical systems.

[0113] Figure 32 is a diagram showing an example of a schematic configuration of an endoscopic surgical system to which the technology described herein (the technology) may be applied.

[0114] Figure 32 illustrates a surgeon (physician) 11131 performing surgery on a patient 11132 on a patient bed 11133 using an endoscopic surgical system 11000. As shown in the figure, the endoscopic surgical system 11000 consists of an endoscope 11100, other surgical instruments 11110 such as a pneumoperitoneum tube 11111 and an energy treatment device 11112, a support arm device 11120 for supporting the endoscope 11100, and a cart 11200 equipped with various devices for endoscopic surgery.

[0115] The endoscope 11100 consists of a barrel 11101, the tip of which is inserted into the body cavity of the patient 11132 for a predetermined length, and a camera head 11102 connected to the base end of the barrel 11101. In the illustrated example, the endoscope 11100 is shown as a so-called rigid endoscope having a rigid barrel 11101, but the endoscope 11100 may also be configured as a so-called flexible endoscope having a flexible barrel.

[0116] An opening into which an objective lens is fitted is provided at the tip of the microscope tube 11101. A light source device 11203 is connected to the endoscope 11100, and the light generated by the light source device 11203 is guided to the tip of the microscope tube by a light guide extending inside the microscope tube 11101, and is irradiated through the objective lens towards the object to be observed inside the body cavity of the patient 11132. The endoscope 11100 may be a straight-viewing endoscope, an oblique-viewing endoscope, or a side-viewing endoscope.

[0117] The camera head 11102 contains an optical system and an image sensor. Reflected light from the object being observed (observation light) is focused onto the image sensor by the optical system. The image sensor converts the observation light into electrical signals, generating an electrical signal corresponding to the observation light, i.e., an image signal corresponding to the observed image. This image signal is transmitted as RAW data to the camera control unit (CCU) 11201.

[0118] The CCU 11201 is composed of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), and other components, and comprehensively controls the operation of the endoscope 11100 and the display device 11202. Furthermore, the CCU 11201 receives an image signal from the camera head 11102 and performs various image processing operations on that image signal, such as development processing (demosaic processing), to display an image based on that image signal.

[0119] The display device 11202 displays an image based on an image signal that has been processed by the CCU 11201, under control from the CCU 11201.

[0120] The light source device 11203 is composed of a light source such as an LED (light-emitting diode) and supplies illumination light to the endoscope 11100 when photographing the surgical area, etc.

[0121] The input device 11204 is an input interface for the endoscopic surgical system 11000. The user can input various types of information and instructions to the endoscopic surgical system 11000 via the input device 11204. For example, the user can input instructions to change the imaging conditions (type of light, magnification, focal length, etc.) of the endoscope 11100.

[0122] The treatment instrument control device 11205 controls the drive of the energy treatment instrument 11112 for purposes such as tissue cauterization, incision, or blood vessel sealing. The insufflation device 11206 injects gas into the body cavity of the patient 11132 via the insufflation tube 11111 to inflate the body cavity for the purpose of securing a field of view by the endoscope 11100 and securing the operator's workspace. The recorder 11207 is a device capable of recording various information related to the surgery. The printer 11208 is a device capable of printing various information related to the surgery in various formats such as text, images, or graphs.

[0123] The light source device 11203 that supplies illumination light to the endoscope 11100 when photographing the surgical area can be configured as a white light source consisting of, for example, an LED, a laser light source, or a combination thereof. When the white light source is configured as a combination of RGB laser light sources, the output intensity and output timing of each color (each wavelength) can be controlled with high precision, so the white balance of the captured image can be adjusted in the light source device 11203. In this case, it is also possible to capture images corresponding to each of the RGB colors in time-division by irradiating the observation target with laser light from each of the RGB laser light sources in time-division and controlling the drive of the image sensor of the camera head 11102 in synchronization with the irradiation timing. According to this method, a color image can be obtained without providing a color filter on the image sensor.

[0124] Furthermore, the light source device 11203 may be controlled to change the intensity of the light it outputs at predetermined time intervals. By controlling the drive of the image sensor of the camera head 11102 in synchronization with the timing of the change in light intensity, images can be acquired in time-division order, and these images can be combined to generate high dynamic range images without so-called black crushing and white clipping.

[0125] Furthermore, the light source device 11203 may be configured to supply light in a predetermined wavelength band corresponding to special light observation. In special light observation, for example, by utilizing the wavelength dependence of light absorption in body tissue and irradiating with narrow-band light compared to the irradiation light used during normal observation (i.e., white light), so-called narrow-band imaging is performed to image predetermined tissues such as blood vessels on the surface of mucosa with high contrast. Alternatively, in special light observation, fluorescence observation may be performed to obtain an image from fluorescence generated by irradiation with excitation light. In fluorescence observation, excitation light is irradiated onto body tissue and fluorescence from the body tissue is observed (autofluorescence observation), or a reagent such as indocyanine green (ICG) is injected into body tissue and excitation light corresponding to the fluorescence wavelength of the reagent is irradiated onto the body tissue to obtain a fluorescence image. The light source device 11203 may be configured to supply narrow-band light and / or excitation light corresponding to such special light observation.

[0126] Figure 33 is a block diagram showing an example of the functional configuration of the camera head 11102 and CCU 11201 shown in Figure 32.

[0127] The camera head 11102 includes a lens unit 11401, an imaging unit 11402, a drive unit 11403, a communication unit 11404, and a camera head control unit 11405. The CCU 11201 includes a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera head 11102 and the CCU 11201 are connected to each other via a transmission cable 11400 so that they can communicate with each other.

[0128] The lens unit 11401 is an optical system provided at the connection point with the lens barrel 11101. Observation light taken in from the tip of the lens barrel 11101 is guided to the camera head 11102 and then incident on the lens unit 11401. The lens unit 11401 is composed of a combination of multiple lenses, including a zoom lens and a focus lens.

[0129] The imaging unit 11402 may consist of one image sensor (a so-called single-chip type) or multiple image sensors (a so-called multi-chip type). If the imaging unit 11402 is configured as a multi-chip type, for example, each image sensor may generate image signals corresponding to RGB, and these may be combined to obtain a color image. Alternatively, the imaging unit 11402 may be configured to have a pair of image sensors for acquiring image signals for the right eye and left eye, respectively, corresponding to 3D (dimensional) display. By performing 3D display, the surgeon 11131 can more accurately grasp the depth of the biological tissue in the surgical area. In addition, if the imaging unit 11402 is configured as a multi-chip type, multiple lens units 11401 may be provided corresponding to each image sensor.

[0130] Furthermore, the imaging unit 11402 does not necessarily have to be located on the camera head 11102. For example, the imaging unit 11402 may be located inside the lens barrel 11101, directly behind the objective lens.

[0131] The drive unit 11403 is composed of actuators and, under control from the camera head control unit 11405, moves the zoom lens and focus lens of the lens unit 11401 along the optical axis by a predetermined distance. This allows the magnification and focus of the image captured by the imaging unit 11402 to be adjusted as appropriate.

[0132] The communication unit 11404 is composed of communication devices for sending and receiving various types of information with the CCU 11201. The communication unit 11404 transmits the image signal obtained from the imaging unit 11402 as RAW data to the CCU 11201 via the transmission cable 11400.

[0133] Furthermore, the communication unit 11404 receives a control signal from the CCU 11201 to control the drive of the camera head 11102 and supplies it to the camera head control unit 11405. The control signal includes information about imaging conditions, such as information to specify the frame rate of the captured image, information to specify the exposure value at the time of imaging, and / or information to specify the magnification and focus of the captured image.

[0134] The imaging conditions such as frame rate, exposure value, magnification, and focus may be specified by the user as appropriate, or they may be automatically set by the control unit 11413 of the CCU 11201 based on the acquired image signal. In the latter case, the endoscope 11100 is equipped with so-called AE (Auto Exposure), AF (Auto Focus), and AWB (Auto White Balance) functions.

[0135] The camera head control unit 11405 controls the drive of the camera head 11102 based on the control signal received from the CCU 11201 via the communication unit 11404.

[0136] The communication unit 11411 is comprised of a communication device for sending and receiving various types of information with the camera head 11102. The communication unit 11411 receives image signals transmitted from the camera head 11102 via the transmission cable 11400.

[0137] Furthermore, the communication unit 11411 transmits control signals to the camera head 11102 to control the driving of the camera head 11102. Image signals and control signals can be transmitted by telecommunications, optical communications, etc.

[0138] The image processing unit 11412 performs various image processing operations on the image signal, which is RAW data transmitted from the camera head 11102.

[0139] The control unit 11413 performs various controls related to imaging the surgical area, etc., by the endoscope 11100, and the display of the images obtained from imaging the surgical area, etc. For example, the control unit 11413 generates a control signal to control the driving of the camera head 11102.

[0140] Furthermore, the control unit 11413 displays the captured image showing the surgical area, etc., on the display device 11202 based on the image signal processed by the image processing unit 11412. At this time, the control unit 11413 may recognize various objects in the captured image using various image recognition technologies. For example, the control unit 11413 can recognize surgical instruments such as forceps, specific biological sites, bleeding, mist when using the energy treatment device 11112, etc., by detecting the shape and color of the edges of objects included in the captured image. When the control unit 11413 displays the captured image on the display device 11202, it may use the recognition results to superimpose various surgical support information onto the image of the surgical area. By superimposing the surgical support information and presenting it to the surgeon 11131, the burden on the surgeon 11131 can be reduced, and the surgeon 11131 can proceed with the surgery reliably.

[0141] The transmission cable 11400 connecting the camera head 11102 and the CCU 11201 is an electrical signal cable compatible with electrical signal communication, an optical fiber compatible with optical communication, or a composite cable thereof.

[0142] In the illustrated example, communication was performed via a wired connection using a transmission cable 11400, but communication between the camera head 11102 and the CCU 11201 may be performed wirelessly.

[0143] <Examples of application to mobile devices> The technology disclosed herein (this technology) can be applied to various products. For example, the technology disclosed herein may be implemented as a device mounted on any type of mobile device such as automobiles, electric vehicles, hybrid electric vehicles, motorcycles, bicycles, personal mobility devices, airplanes, drones, ships, and robots.

[0144] Figure 34 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile control system to which the technology described herein may be applied.

[0145] The vehicle control system 12000 comprises a plurality of electronic control units connected via a communication network 12001. In the example shown in Figure 34, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an external information detection unit 12030, an internal information detection unit 12040, and an integrated control unit 12050. The functional configuration of the integrated control unit 12050 is shown in the figure, which includes a microcomputer 12051, an audio / image output unit 12052, and an in-vehicle network interface 12053.

[0146] The drivetrain control unit 12010 controls the operation of devices related to the vehicle's drivetrain according to various programs. For example, the drivetrain control unit 12010 functions as a control device for a drivetrain generating device that generates driving force for the vehicle, such as an internal combustion engine or a drive motor; a drivetrain transmission mechanism that transmits driving force to the wheels; a steering mechanism that adjusts the steering angle of the vehicle; and a braking device that generates braking force for the vehicle.

[0147] The body system control unit 12020 controls the operation of various devices mounted on the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window system, or various lamps such as headlights, reverse lights, brake lights, turn signals, or fog lights. In this case, the body system control unit 12020 may receive radio waves transmitted from a portable device that replaces a key or signals from various switches. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock system, power window system, lamps, etc.

[0148] The external information detection unit 12030 detects information from outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the external information detection unit 12030. The external information detection unit 12030 causes the imaging unit 12031 to capture images of the outside of the vehicle and receives the captured images. Based on the received images, the external information detection unit 12030 may perform object detection processing such as detecting people, cars, obstacles, signs, or characters on the road surface, or distance detection processing.

[0149] The imaging unit 12031 is a light sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0150] The in-vehicle information detection unit 12040 detects information inside the vehicle. The in-vehicle information detection unit 12040 is connected to, for example, a driver status detection unit 12041 that detects the driver's state. The driver status detection unit 12041 includes, for example, a camera that captures images of the driver, and the in-vehicle information detection unit 12040 may calculate the driver's level of fatigue or concentration, or determine whether the driver is drowsy, based on the detection information input from the driver status detection unit 12041.

[0151] The microcomputer 12051 can calculate control target values ​​for the drive force generator, steering mechanism, or braking device based on information inside and outside the vehicle acquired by the external information detection unit 12030 or the internal information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing ADAS (Advanced Driver Assistance System) functions, including collision avoidance or impact mitigation, following driving based on distance between vehicles, maintaining vehicle speed, vehicle collision warning, or vehicle lane departure warning.

[0152] Furthermore, the microcomputer 12051 can perform cooperative control for purposes such as autonomous driving, where the vehicle drives autonomously without driver intervention, by controlling the drive force generating device, steering mechanism, or braking device, etc., based on information about the vehicle's surroundings acquired by the external information detection unit 12030 or the internal information detection unit 12040.

[0153] Furthermore, the microcomputer 12051 can output control commands to the body system control unit 12020 based on external information acquired by the external information detection unit 12030. For example, the microcomputer 12051 can control the headlights according to the position of a preceding or oncoming vehicle detected by the external information detection unit 12030, and perform coordinated control aimed at reducing glare, such as switching from high beams to low beams.

[0154] The audio-image output unit 12052 transmits at least one of audio and image output signals to an output device capable of visually or audibly notifying information to the vehicle's occupants or to those outside the vehicle. In the example shown in Figure 34, the output devices are exemplified as an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include, for example, at least one of an onboard display and a head-up display.

[0155] Figure 35 shows an example of the installation position of the imaging unit 12031.

[0156] In Figure 35, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0157] The imaging units 12101, 12102, 12103, 12104, and 12105 are installed, for example, on the front nose, side mirrors, rear bumper, back door, and the upper part of the windshield inside the vehicle 12100. The imaging unit 12101 installed on the front nose and the imaging unit 12105 installed on the upper part of the windshield inside the vehicle mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 installed on the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 installed on the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 installed on the upper part of the windshield inside the vehicle is mainly used for detecting preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, or lanes.

[0158] Figure 35 shows an example of the imaging range of imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of imaging unit 12101 located on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of imaging units 12102 and 12103 located on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of imaging unit 12104 located on the rear bumper or back door. For example, by superimposing the image data captured by imaging units 12101 to 12104, an overhead view image of the vehicle 12100 can be obtained.

[0159] At least one of the imaging units 12101 to 12104 may have a function for acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera consisting of multiple image sensors, or an image sensor having pixels for phase difference detection.

[0160] For example, the microcomputer 12051, based on distance information obtained from the imaging units 12101 to 12104, can determine the distance to each object within the imaging range 12111 to 12114 and the temporal change of this distance (relative speed to the vehicle 12100). In particular, it can extract the closest object on the vehicle 12100's path that is traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (e.g., 0 km / h or more) as the preceding vehicle. Furthermore, the microcomputer 12051 can set a predetermined distance to be maintained before the preceding vehicle and perform automatic braking control (including follow-and-stop control) and automatic acceleration control (including follow-and-start control), etc. In this way, cooperative control aimed at autonomous driving, where the vehicle drives autonomously without driver intervention, can be performed.

[0161] For example, the microcomputer 12051 can use distance information obtained from imaging units 12101 to 12104 to classify and extract three-dimensional object data related to three-dimensional objects, such as motorcycles, passenger cars, large vehicles, pedestrians, utility poles, and other three-dimensional objects, and use this data for automatic obstacle avoidance. For example, the microcomputer 12051 identifies obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines the collision risk, which indicates the degree of risk of collision with each obstacle. If the collision risk is above a set value and there is a possibility of collision, the microcomputer 12051 can provide driving assistance to avoid collisions by outputting a warning to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or evasive steering via the drive system control unit 12010.

[0162] At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared light. For example, the microcomputer 12051 can recognize pedestrians by determining whether or not pedestrians are present in the images captured by the imaging units 12101 to 12104. Such pedestrian recognition is performed, for example, by a procedure to extract feature points from the images captured by the imaging units 12101 to 12104 as infrared cameras, and a procedure to perform pattern matching on a series of feature points that indicate the contour of an object to determine whether or not it is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the imaging units 12101 to 12104 and recognizes a pedestrian, the audio-image output unit 12052 controls the display unit 12062 to superimpose a rectangular contour line for emphasis on the recognized pedestrian. The audio-image output unit 12052 may also control the display unit 12062 to display an icon indicating a pedestrian at a desired position.

[0163] In this specification, "system" refers to an entire apparatus composed of multiple devices.

[0164] Furthermore, the effects described herein are merely illustrative and not limiting, and other effects may also occur.

[0165] Furthermore, the embodiments of this technology are not limited to those described above, and various modifications are possible without departing from the spirit of this technology.

[0166] Furthermore, this technology can also take the following configurations: (1) An imaging device comprising: a chip on which a photoelectric conversion element is formed; a cover glass; a first member located between the chip and the cover glass and joining the chip and the cover glass; and a second member formed of a different material from the first member, arranged alternately with the first member and arranged to surround the effective pixel area. (2) The imaging device according to (1), wherein the first member is formed of a material with high adhesive properties that joins the chip and the cover glass, and the second member is formed of a material that has light-shielding properties. (3) The imaging device according to (1) or (2), wherein the first member is located at the four corners of the chip. (4) The imaging device according to any one of (1) to (3), wherein the second member is also formed on the side surface of the chip. (5) The imaging device according to any one of (1) to (4), wherein the second member is also formed on the side surface of the cover glass. (6) The imaging device according to any one of (1) to (5), wherein the second member is also formed on a part of the upper surface of the cover glass. (7) The imaging device according to any one of (1) to (6), wherein the first member is composed of third members arranged at the four corners of the chip and fourth members smaller than the third members between the third members. (8) The imaging device according to (7), wherein a plurality of fourth members are arranged between the third members. (9) An electronic device comprising: a chip on which a photoelectric conversion element is formed; a cover glass; a first member located between the chip and the cover glass and joining the chip and the cover glass; a second member formed of a different material from the first member, arranged alternately with the first member and surrounding the effective pixel area; and a processing unit for processing signals from the imaging device.(10) A manufacturing method for manufacturing an imaging device comprising: a chip on which a photoelectric conversion element is formed; a cover glass; a first member located between the chip and the cover glass and joining the chip and the cover glass; and a second member formed of a different material from the first member, arranged alternately with the first member and arranged to surround an effective pixel area, the manufacturing method comprising: forming a portion to be the first member on a wafer on which a plurality of the chips are formed; joining the glass substrate to be the cover glass and the portion to be the first member; cutting from the glass substrate side to a part of the wafer to form a groove; filling the groove with a material to be the second member; and cutting the groove to make individual pieces of the imaging device.

[0167] 201 Imaging device, 211 Image sensor chip, 212 Cover glass, 221 Effective pixel area, 222 Silicon substrate, 223 Photoelectric conversion element, 224 Color filter layer, 225 Wiring, 226 Connection terminal, 227 Surface electrode, 231 Wall, 232 Column, 233 Wall, 241 Semiconductor wafer, 242 Bonding resin sheet, 243 Glass substrate, 245 Groove, 247 Discharge nozzle, 251, 252 Wall, 271 Film, 281, 291, 292 Wall

Claims

1. An imaging device comprising: a chip on which a photoelectric conversion element is formed; a cover glass; a first member positioned between the chip and the cover glass and joining the chip and the cover glass; and a second member formed of a different material from the first member, arranged alternately with the first member, and positioned to surround the effective pixel area.

2. The imaging apparatus according to claim 1, wherein the first member is formed of a material with high adhesive properties for joining the chip and the cover glass, and the second member is formed of a material having light-shielding properties.

3. The imaging device according to claim 1, wherein the first member is arranged at the four corners of the chip.

4. The imaging apparatus according to claim 1, wherein the second member is also formed on the side surface of the chip.

5. The imaging apparatus according to claim 1, wherein the second member is also formed on the side surface of the cover glass.

6. The imaging apparatus according to claim 1, wherein the second member is also formed on a part of the upper surface of the cover glass.

7. The imaging apparatus according to claim 1, wherein the first member comprises third members arranged at the four corners of the chip and a fourth member smaller than the third member, located between the third members.

8. The imaging apparatus according to claim 7, wherein a plurality of the fourth members are arranged between the third members.

9. An electronic device comprising: an imaging device having a chip on which a photoelectric conversion element is formed; a cover glass; a first member positioned between the chip and the cover glass and joining the chip and the cover glass; a second member formed of a different material from the first member, arranged alternately with the first member and positioned to surround an effective pixel area; and a processing unit for processing signals from the imaging device.

10. A manufacturing method for manufacturing an imaging device comprising: a chip on which a photoelectric conversion element is formed; a cover glass; a first member located between the chip and the cover glass and joining the chip and the cover glass; and a second member formed of a different material from the first member, arranged alternately with the first member and arranged to surround an effective pixel area, the manufacturing method comprising: forming a portion to become the first member on a wafer on which a plurality of the chips are formed; joining the glass substrate to become the cover glass and the portion to become the first member; cutting from the glass substrate side to a part of the wafer to form a groove; filling the groove with a material to become the second member; and cutting the groove to make individual pieces of the imaging device.

Images