Cover tape for electronic component packaging, electronic component package, method for manufacturing electronic component package, and method for inspecting electronic component package

Abstract

A cover tape (10) for electronic component packaging comprises a base layer (1) and a sealant layer (3), and has a diffuse light transmittance at a wavelength of 630 nm of 35% or less, as measured by a predetermined method.

Description

Cover tape for packaging electronic components, electronic component package, method for producing electronic component package, and method for inspecting electronic component package

[0001] The present invention relates to a cover tape for packaging electronic components, an electronic component package, a method for producing an electronic component package, and a method for inspecting an electronic component package.

[0002] Electronic components such as transistors, diodes, capacitors, piezoelectric elements and resistors are housed in recesses of a carrier tape formed with recesses capable of accommodating electronic components to prevent damage, and are sometimes transported in the form of an electronic component package obtained by heat-sealing a cover tape to the carrier tape so as to enclose the electronic components in the recesses. When in use, the packaged electronic component is taken out from the recess by peeling off the cover tape of the electronic component package. Examples of technologies related to cover tapes for electronic component packaging include those described in Patent Document 1 and Patent Document 2.

[0003] Patent Document 1 discloses a cover tape for packaging electronic components, comprising a base material layer and a heat-seal layer disposed on one surface side of the base material layer, wherein the cover tape for packaging electronic components has a haze value of 50% or less and a water vapor permeability of 2.0 g / (m ２ ・day) or more and 9.0 g / (m ２ ・day) or less. Patent Document 1 describes that this cover tape for packaging electronic components can suppress blocking while suppressing deterioration of visibility.

[0004] Patent Document 2 describes a cover tape for packaging electronic components, comprising a base layer, a heat seal layer disposed on one side of the base layer, and an antistatic layer disposed on the side of the base layer opposite to the side of the heat seal layer, wherein the antistatic layer comprises an antistatic agent, a lubricant, and a binder resin, the lubricant being an ethylene oxide-based nonionic surfactant with an HLB value of 2 to 11, and the binder resin being an acrylic binder resin or an epoxy binder resin. Furthermore, Patent Document 2 describes that it is possible to provide a cover tape for packaging electronic components that can maintain a good haze value and suppress blocking.

[0005] Japanese Patent Publication No. 2023-037999 Japanese Patent Publication No. 2023-038475

[0006] According to the inventors' investigation, it has become clear that when electronic components inside an electronic component package are inspected by camera using red light illumination through the cover tape for electronic component packaging, visibility may not be sufficient in some cases.

[0007] A first embodiment of the present invention provides a cover tape for electronic component packaging that can improve visibility during camera inspection using red light illumination.

[0008] Furthermore, our investigations have revealed that when electronic components inside an electronic component package are inspected by camera using blue light illumination through the cover tape for electronic component packaging, visibility may not be sufficient in some cases.

[0009] A second embodiment of the present invention provides a cover tape for electronic component packaging that can improve visibility during camera inspection using blue light illumination.

[0010] Furthermore, our investigations have revealed that when electronic components inside an electronic component package are inspected using ultraviolet light and a camera through the cover tape for electronic component packaging, visibility may not be sufficient in some cases.

[0011] A third embodiment of the present invention provides a cover tape for electronic component packaging that can improve visibility during camera inspection using ultraviolet illumination.

[0012] Furthermore, our investigations have revealed that when electronic components inside an electronic component package are inspected using infrared illumination and a camera through the cover tape for electronic component packaging, visibility may not be sufficient in some cases.

[0013] A fourth embodiment of the present invention provides a cover tape for packaging electronic components that can improve visibility during camera inspection using infrared illumination.

[0014] The inventors diligently conducted research to achieve the above objectives. As a result, they discovered that by setting the diffuse light coefficient at a predetermined wavelength to below a predetermined value, visibility during camera inspection using red light illumination can be improved, and thus completed the first embodiment of the present invention.

[0015] According to a first embodiment of the present invention, the following are provided: a cover tape for packaging electronic components, an electronic component package, a method for manufacturing an electronic component package, and a method for inspecting an electronic component package.

[0016] [1A] A cover tape for packaging electronic components, comprising a base layer and a sealant layer, wherein the diffuse light transmittance at a wavelength of 630 nm is 35% or less, according to Method 1 below. (Method 1) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 630 nm of the cover tape for packaging electronic components are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 630 nm. [2A] The cover tape for packaging electronic components according to [1A], wherein the thickness of the sealant layer is 0.01 μm or more and 15 μm or less. [3A] The cover tape for packaging electronic components according to [1A] or [2A], wherein the sealant layer contains one or more selected from the group consisting of styrene resin, (meth)acrylic resin, olefin resin, urethane resin, and ester resin. [4A] The cover tape for packaging electronic components according to any one of [1A] to [3A] above, wherein the thickness of the base layer is 5 μm or more and 50 μm or less. [5A] The cover tape for packaging electronic components according to any one of [1A] to [4A] above, wherein the base layer comprises one or more selected from the group consisting of ester resins, amide resins, olefin resins, (meth)acrylic resins, imide resins, carbonate resins, and acrylonitrile-butadiene-styrene resins. [6A] The cover tape for packaging electronic components according to any one of [1A] to [5A] above, further comprising an intermediate layer between the base layer and the sealant layer. [7A] The cover tape for packaging electronic components according to [6A] above, wherein the intermediate layer comprises one or more selected from the group consisting of polyacrylic acid derivatives, polyacrylic acid ester derivatives, polyvinyl acetate derivatives, styrene resins, olefin resins, and cyclic olefin resins. [8A] The cover tape for packaging electronic components according to [6A] or [7A], wherein the thickness of the intermediate layer is 10 μm or more and 60 μm or less. [9A] The cover tape for packaging electronic components according to any one of [1A] to [8A], wherein the total light transmittance at a wavelength of 630 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more.[10A] A cover tape for packaging electronic components according to any one of [1A] to [9A] above, wherein the total light transmittance measured with light source D65 in accordance with JIS K 7361-1:1997 is 50% or more. [11A] An electronic component package comprising a carrier tape having a recess, an electronic component housed in the recess, and a cover tape for packaging electronic components according to any one of [1A] to [10A] above, wherein the sealant layer is adhered to the carrier tape so as to enclose the electronic component. [12A] A method for manufacturing an electronic component package, comprising an adhesion step of adhering the cover tape for packaging electronic components according to any one of [1A] to [10A] above to a carrier tape housing an electronic component in a recess to obtain an electronic component package, and a camera inspection step of inspecting the electronic component in the electronic component package using red light illumination through the cover tape for packaging electronic components. [13A] A method for inspecting an electronic component package, wherein the electronic component package comprises a carrier tape having a recess, an electronic component housed in the recess, and an electronic component packaging cover tape as described in any of [1A] to [10A] above, the sealant layer being adhered to the carrier tape so as to enclose the electronic component, and the method further comprises a camera inspection step of inspecting the electronic component in the electronic component package through the electronic component packaging cover tape using red light illumination.

[0017] Furthermore, according to the first embodiment of the present invention, the following cover tape for packaging electronic components, electronic component packaging, a method for manufacturing electronic component packaging, and a method for inspecting electronic component packaging are also provided.

[0018] [1a] A cover tape for packaging electronic components, comprising a base layer and a sealant layer, wherein the diffuse light transmittance at a wavelength of 630 nm is 35% or less, according to Method 1 below. (Method 1) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 630 nm of the cover tape for packaging electronic components are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 630 nm. [2a] The cover tape for packaging electronic components according to [1a] above, wherein the diffuse light transmittance at a wavelength of 630 nm is 0% or more and 35% or less. [3a] The cover tape for packaging electronic components according to [1a] or [2a] above, wherein the diffuse light transmittance at a wavelength of 630 nm is 1% or more and 25% or less. [4a] A cover tape for packaging electronic components according to any of [1a] to [3a] above, wherein the diffuse light transmittance at a wavelength of 470 nm is 0% or more and 40% or less, according to Method 2 below. (Method 2) Using an ultraviolet-visible near-infrared spectrophotometer, the total light transmittance at a wavelength of 470 nm and the parallel line transmittance at a wavelength of 470 nm are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 470 nm. [5a] A cover tape for packaging electronic components according to [4a] above, wherein the diffuse light transmittance at a wavelength of 470 nm is 1% or more and 35% or less. [6a] A cover tape for packaging electronic components according to any of [1a] to [5a] above, wherein the diffuse light transmittance at a wavelength of 375 nm is 0% or more and 35% or less, according to Method 3 below. (Method 3) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance of the electronic component packaging cover tape at a wavelength of 375 nm are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 375 nm. [7a] The electronic component packaging cover tape according to [6a] above, wherein the diffuse light transmittance at a wavelength of 375 nm is 1% or more and 33% or less. [8a] The electronic component packaging cover tape according to any one of [1a] to [7a] above, wherein the diffuse light transmittance at a wavelength of 900 nm is 0% or more and 30% or less, according to Method 4 below.(Method 4) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance of the electronic component packaging cover tape at a wavelength of 900 nm are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 900 nm. [9a] The electronic component packaging cover tape according to [8a] above, wherein the diffuse light transmittance at a wavelength of 900 nm is 1% or more and 20% or less. [10a] The electronic component packaging cover tape according to any one of [1a] to [9a] above, wherein the thickness of the sealant layer is 0.01 μm or more and 15 μm or less. [11a] The electronic component packaging cover tape according to any one of [1a] to [10a] above, wherein the thickness of the sealant layer is 0.2 μm or more and 1 μm or less. [12a] The cover tape for packaging electronic components according to any one of [1a] to [11a] above, wherein the sealant layer comprises one or more selected from the group consisting of styrene resin, (meth)acrylic resin, olefin resin, urethane resin, and ester resin. [13a] The cover tape for packaging electronic components according to any one of [1a] to [12a] above, wherein the sealant layer comprises a (meth)acrylic resin. [14a] The cover tape for packaging electronic components according to any one of [1a] to [13a] above, wherein the thickness of the base layer is 5 μm or more and 50 μm or less. [15a] The cover tape for packaging electronic components according to any one of [1a] to [14a] above, wherein the thickness of the base layer is 10 μm or more and 30 μm or less. [16a] The cover tape for packaging electronic components according to any one of [1a] to [15a], wherein the base layer comprises one or more selected from the group consisting of ester resins, amide resins, olefin resins, (meth)acrylic resins, imide resins, carbonate resins, and acrylonitrile-butadiene-styrene resins. [17a] The cover tape for packaging electronic components according to any one of [1a] to [16a], wherein the base layer comprises an ester resin. [18a] The cover tape for packaging electronic components according to any one of [1a] to [17a], further comprising an intermediate layer between the base layer and the sealant layer.[19a] The cover tape for packaging electronic components according to [18a], wherein the intermediate layer comprises one or more selected from the group consisting of polyacrylic acid derivatives, polyacrylic acid ester derivatives, polyvinyl acetate derivatives, styrene resins, olefin resins, and cyclic olefin resins. [20a] The cover tape for packaging electronic components according to [18a] or [19a], wherein the intermediate layer comprises one or more selected from the group consisting of polyethylene and styrene resins. [21a] The cover tape for packaging electronic components according to any one of [18a] to [20a], wherein the thickness of the intermediate layer is 10 μm or more and 60 μm or less. [22a] The cover tape for packaging electronic components according to any one of [18a] to [21a], wherein the thickness of the intermediate layer is 20 μm or more and 40 μm or less. [23a] A cover tape for packaging electronic components according to any one of [1a] to [22a] above, wherein the total light transmittance at a wavelength of 630 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more. [24a] A cover tape for packaging electronic components according to [23a] above, wherein the total light transmittance at a wavelength of 630 nm is 50% or more and 100% or less. [25a] A cover tape for packaging electronic components according to [23a] or [24a] above, wherein the total light transmittance at a wavelength of 630 nm is 70% or more and 99% or less. [26a] A cover tape for packaging electronic components according to any one of [1a] to [25a] above, wherein the total light transmittance at a wavelength of 470 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more and 100% or less. [27a] The cover tape for packaging electronic components according to [26a], wherein the total light transmittance at a wavelength of 470 nm is 70% or more and 99% or less. [28a] The cover tape for packaging electronic components according to any one of [1a] to [27a], wherein the total light transmittance at a wavelength of 375 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more and 100% or less. [29a] The cover tape for packaging electronic components according to [28a], wherein the total light transmittance at a wavelength of 375 nm is 70% or more and 99% or less.[30a] A cover tape for packaging electronic components according to any one of [1a] to [29a] above, wherein the total light transmittance at a wavelength of 900 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more and 100% or less. [31a] A cover tape for packaging electronic components according to [30a] above, wherein the total light transmittance at a wavelength of 900 nm is 70% or more and 99% or less. [32a] A cover tape for packaging electronic components according to any one of [1a] to [31a] above, wherein the total light transmittance, as measured with a light source D65 in accordance with JIS K 7361-1:1997, is 50% or more. [33a] An electronic component packaging body comprising a carrier tape having a recess, an electronic component housed in the recess, and a cover tape for packaging electronic components according to any one of [1a] to [32a] above, wherein the sealant layer is adhered to the carrier tape so as to enclose the electronic component. [34a] A method for manufacturing an electronic component package, comprising: an adhesion step of adhering an electronic component packaging cover tape described in any of [1a] to [32a] above to a carrier tape containing electronic components in recesses to obtain an electronic component package; and a camera inspection step of inspecting the electronic components in the electronic component package with a camera using red light illumination through the electronic component packaging cover tape. [35a] The method for manufacturing an electronic component package according to [34a], further comprising a camera inspection step of inspecting the electronic components in the electronic component package with a camera using blue light illumination through the electronic component packaging cover tape. [36a] The method for manufacturing an electronic component package according to [34a] or [35a], further comprising a camera inspection step of inspecting the electronic components in the electronic component package with a camera using ultraviolet light illumination through the electronic component packaging cover tape. [37a] A method for manufacturing an electronic component package according to any one of [34a] to [36a], further comprising a camera inspection step of inspecting the electronic component in the electronic component package using infrared illumination through the cover tape for electronic component packaging.[38a] A method for inspecting an electronic component package, wherein the electronic component package comprises a carrier tape having a recess, an electronic component housed in the recess, and an electronic component packaging cover tape as described in any of [1a] to [10a] above, the sealant layer being adhered to the carrier tape so as to enclose the electronic component, and the method further comprises a camera inspection step of inspecting the electronic component in the electronic component package with a camera using red light illumination through the electronic component packaging cover tape. [39a] The method for inspecting an electronic component package according to [38a] above, further comprising a camera inspection step of inspecting the electronic component in the electronic component package with a camera using blue light illumination through the electronic component packaging cover tape. [40a] The method for inspecting an electronic component package according to [38a] or [39a] above, further comprising a camera inspection step of inspecting the electronic component in the electronic component package with a camera using ultraviolet light illumination through the electronic component packaging cover tape. [41a] The method for inspecting an electronic component package according to any one of [38a] to [40a], further comprising a camera inspection step of inspecting the electronic component in the electronic component package using infrared illumination through the cover tape for electronic component packaging.

[0019] Furthermore, the inventors diligently conducted research to achieve the above objectives. As a result, they discovered that by setting the diffuse light emission rate at a predetermined wavelength to below a predetermined value, visibility during camera inspection using blue light illumination can be improved, and thus completed a second embodiment of the present invention.

[0020] According to a second embodiment of the present invention, the following are provided: a cover tape for packaging electronic components, an electronic component package, a method for manufacturing an electronic component package, and a method for inspecting an electronic component package.

[0021] [1B] A cover tape for packaging electronic components, comprising a base layer and a sealant layer, wherein the diffuse light transmittance at a wavelength of 470 nm is 40% or less, according to Method 2 below. (Method 2) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 470 nm of the cover tape for packaging electronic components are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 470 nm. [2B] The cover tape for packaging electronic components according to [1B], wherein the thickness of the sealant layer is 0.01 μm or more and 15 μm or less. [3B] The cover tape for packaging electronic components according to [1B] or [2B], wherein the sealant layer contains one or more selected from the group consisting of styrene resin, (meth)acrylic resin, olefin resin, urethane resin, and ester resin. [4B] The cover tape for packaging electronic components according to any one of [1B] to [3B] above, wherein the thickness of the base layer is 5 μm or more and 50 μm or less. [5B] The cover tape for packaging electronic components according to any one of [1B] to [4B] above, wherein the base layer comprises one or more selected from the group consisting of ester resins, amide resins, olefin resins, (meth)acrylic resins, imide resins, carbonate resins, and acrylonitrile-butadiene-styrene resins. [6B] The cover tape for packaging electronic components according to any one of [1B] to [5B] above, further comprising an intermediate layer between the base layer and the sealant layer. [7B] The cover tape for packaging electronic components according to [6B] above, wherein the intermediate layer comprises one or more selected from the group consisting of polyacrylic acid derivatives, polyacrylic acid ester derivatives, polyvinyl acetate derivatives, styrene resins, olefin resins, and cyclic olefin resins. [8B] The cover tape for packaging electronic components according to [6B] or [7B], wherein the thickness of the intermediate layer is 10 μm or more and 60 μm or less. [9B] The cover tape for packaging electronic components according to any one of [1B] to [8B], wherein the total light transmittance at a wavelength of 470 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more.[10B] A cover tape for packaging electronic components according to any one of [1B] to [9B] above, wherein the total light transmittance measured with light source D65 in accordance with JIS K 7361-1:1997 is 50% or more. [11B] An electronic component package comprising a carrier tape having a recess, an electronic component housed in the recess, and a cover tape for packaging electronic components according to any one of [1B] to [10B] above, wherein the sealant layer is adhered to the carrier tape so as to enclose the electronic component. [12B] A method for manufacturing an electronic component package, comprising: an adhesion step of adhering a cover tape for packaging electronic components according to any one of [1B] to [10B] above to a carrier tape housing an electronic component in a recess to obtain an electronic component package; and a camera inspection step of inspecting the electronic component in the electronic component package using blue light illumination through the cover tape for packaging electronic components. [13B] A method for inspecting an electronic component package, wherein the electronic component package comprises a carrier tape having a recess, an electronic component housed in the recess, and an electronic component packaging cover tape as described in any of [1B] to [10B] above, the sealant layer being adhered to the carrier tape so as to enclose the electronic component, and the method further comprises a camera inspection step of inspecting the electronic component in the electronic component package through the electronic component packaging cover tape using blue light illumination.

[0022] Furthermore, according to a second embodiment of the present invention, the following cover tape for electronic component packaging, electronic component packaging, a method for manufacturing electronic component packaging, and a method for inspecting electronic component packaging are also provided.

[0023] [1b] A cover tape for packaging electronic components, comprising a base layer and a sealant layer, wherein the diffuse light transmittance at a wavelength of 470 nm is 40% or less, according to Method 2 below. (Method 2) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 470 nm of the cover tape for packaging electronic components are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 470 nm. [2b] The cover tape for packaging electronic components according to [1b] above, wherein the diffuse light transmittance at a wavelength of 470 nm is 0% or more and 40% or less. [3b] The cover tape for packaging electronic components according to [1b] or [2b] above, wherein the diffuse light transmittance at a wavelength of 470 nm is 1% or more and 35% or less. [4b] The cover tape for packaging electronic components according to any one of [1b] to [3b] above, wherein the thickness of the sealant layer is 0.01 μm or more and 15 μm or less. [5b] The cover tape for packaging electronic components according to any one of [1b] to [4b] above, wherein the thickness of the sealant layer is 0.2 μm or more and 1 μm or less. [6b] The cover tape for packaging electronic components according to any one of [1b] to [5b] above, wherein the sealant layer contains one or more selected from the group consisting of styrene resin, (meth)acrylic resin, olefin resin, urethane resin, and ester resin. [7b] The cover tape for packaging electronic components according to any one of [1b] to [6b] above, wherein the sealant layer contains (meth)acrylic resin. [8b] The cover tape for packaging electronic components according to any one of [1b] to [7b] above, wherein the thickness of the base layer is 5 μm or more and 50 μm or less. [9b] The cover tape for packaging electronic components according to any one of [1b] to [8b] above, wherein the thickness of the base layer is 10 μm or more and 30 μm or less. [10b] The cover tape for packaging electronic components according to any one of [1b] to [9b] ​​above, wherein the base layer comprises one or more selected from the group consisting of ester resins, amide resins, olefin resins, (meth)acrylic resins, imide resins, carbonate resins, and acrylonitrile-butadiene-styrene resins.[11b] The cover tape for packaging electronic components according to any one of [1b] to [10b], wherein the base layer contains an ester resin. [12b] The cover tape for packaging electronic components according to any one of [1b] to [11b], further comprising an intermediate layer between the base layer and the sealant layer. [13b] The cover tape for packaging electronic components according to [12b], wherein the intermediate layer contains one or more selected from the group consisting of polyacrylic acid derivatives, polyacrylic acid ester derivatives, polyvinyl acetate derivatives, styrene resins, olefin resins, and cyclic olefin resins. [14b] The cover tape for packaging electronic components according to [12b] or [13b], wherein the intermediate layer contains one or more selected from the group consisting of polyethylene and styrene resins. [15b] The cover tape for packaging electronic components according to any one of [12b] to [14b], wherein the thickness of the intermediate layer is 10 μm or more and 60 μm or less. [16b] A cover tape for packaging electronic components according to any one of [12b] to [15b] above, wherein the thickness of the intermediate layer is 20 μm or more and 40 μm or less. [17b] A cover tape for packaging electronic components according to any one of [1b] to [16b] above, wherein the total light transmittance at a wavelength of 470 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more. [18b] A cover tape for packaging electronic components according to [17b] above, wherein the total light transmittance at a wavelength of 470 nm is 50% or more and 100% or less. [19b] A cover tape for packaging electronic components according to [17b] or [18b] above, wherein the total light transmittance at a wavelength of 470 nm is 70% or more and 99% or less. [20b] A cover tape for packaging electronic components according to any one of [1b] to [19b] above, wherein the total light transmittance measured with a light source D65 in accordance with JIS K 7361-1:1997 is 50% or more. [21b] An electronic component package comprising a carrier tape having a recess, an electronic component housed in the recess, and a cover tape for packaging electronic components according to any one of [1b] to [20b] above, wherein the sealant layer is adhered to the carrier tape so as to enclose the electronic component.[22b] A method for manufacturing an electronic component package, comprising: an adhesion step of adhering an electronic component packaging cover tape described in any of [1b] to [20b] above to a carrier tape having an electronic component in a recess to obtain an electronic component package; and a camera inspection step of inspecting the electronic component in the electronic component package with a camera using blue light illumination through the electronic component packaging cover tape. [23b] A method for inspecting an electronic component package, wherein the electronic component package comprises a carrier tape having a recess, an electronic component housed in the recess, and an electronic component packaging cover tape described in any of [1b] to [20b] above, the sealant layer being adhered to the carrier tape so as to enclose the electronic component, and a camera inspection step of inspecting the electronic component in the electronic component package with a camera using blue light illumination through the electronic component packaging cover tape.

[0024] Furthermore, the inventors diligently conducted research to achieve the above objectives. As a result, they discovered that by setting the diffuse light coefficient at a predetermined wavelength to below a predetermined value, visibility during camera inspection using ultraviolet illumination can be improved, and thus completed a third embodiment of the present invention.

[0025] According to a third embodiment of the present invention, the following are provided: a cover tape for packaging electronic components, an electronic component package, a method for manufacturing an electronic component package, and a method for inspecting an electronic component package.

[0026] [1C] A cover tape for packaging electronic components, comprising a base layer and a sealant layer, wherein the diffuse light transmittance at a wavelength of 375 nm is 35% or less, according to Method 3 below. (Method 3) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 375 nm of the cover tape for packaging electronic components are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 375 nm. [2C] The cover tape for packaging electronic components according to [1C] above, wherein the thickness of the sealant layer is 0.01 μm or more and 15 μm or less. [3C] The cover tape for packaging electronic components according to [1C] or [2C] above, wherein the sealant layer contains one or more selected from the group consisting of styrene resin, (meth)acrylic resin, olefin resin, urethane resin, and ester resin. [4C] The cover tape for packaging electronic components according to any one of [1C] to [3C] above, wherein the thickness of the base layer is 5 μm or more and 50 μm or less. [5C] The cover tape for packaging electronic components according to any one of [1C] to [4C] above, wherein the base layer comprises one or more selected from the group consisting of ester resins, amide resins, olefin resins, (meth)acrylic resins, imide resins, carbonate resins, and acrylonitrile-butadiene-styrene resins. [6C] The cover tape for packaging electronic components according to any one of [1C] to [5C] above, further comprising an intermediate layer between the base layer and the sealant layer. [7C] The cover tape for packaging electronic components according to [6C] above, wherein the intermediate layer comprises one or more selected from the group consisting of polyacrylic acid derivatives, polyacrylic acid ester derivatives, polyvinyl acetate derivatives, styrene resins, olefin resins, and cyclic olefin resins. [8C] The cover tape for packaging electronic components according to [6C] or [7C], wherein the thickness of the intermediate layer is 10 μm or more and 60 μm or less. [9C] The cover tape for packaging electronic components according to any one of [1C] to [8C], wherein the total light transmittance at a wavelength of 375 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more.[10C] A cover tape for packaging electronic components according to any one of [1C] to [9C] above, wherein the total light transmittance measured with light source D65 in accordance with JIS K 7361-1:1997 is 50% or more. [11C] An electronic component package comprising a carrier tape having a recess, an electronic component housed in the recess, and a cover tape for packaging electronic components according to any one of [1C] to [10C] above, wherein the sealant layer is adhered to the carrier tape so as to enclose the electronic component. [12C] A method for manufacturing an electronic component package, comprising an adhesion step of adhering a cover tape for packaging electronic components according to any one of [1C] to [10C] above to a carrier tape housing an electronic component in a recess to obtain an electronic component package, and a camera inspection step of inspecting the electronic component in the electronic component package using ultraviolet illumination through the cover tape for packaging electronic components. [13C] A method for inspecting an electronic component package, wherein the electronic component package comprises a carrier tape having a recess, an electronic component housed in the recess, and an electronic component packaging cover tape as described in any of [1C] to [10C] above, the sealant layer being adhered to the carrier tape so as to enclose the electronic component, and the method further comprises a camera inspection step of inspecting the electronic component in the electronic component package with a camera using ultraviolet illumination through the electronic component packaging cover tape.

[0027] Furthermore, according to a third embodiment of the present invention, the following cover tape for packaging electronic components, electronic component packaging, a method for manufacturing electronic component packaging, and a method for inspecting electronic component packaging are also provided.

[0028] [1c] A cover tape for packaging electronic components, comprising a base layer and a sealant layer, wherein the diffuse light transmittance at a wavelength of 375 nm is 35% or less, according to Method 3 below. (Method 3) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 375 nm of the cover tape for packaging electronic components are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 375 nm. [2c] The cover tape for packaging electronic components according to [1c] above, wherein the diffuse light transmittance at a wavelength of 375 nm is 0% or more and 35% or less. [3c] The cover tape for packaging electronic components according to [1c] or [2c] above, wherein the diffuse light transmittance at a wavelength of 375 nm is 1% or more and 33% or less. [4c] The cover tape for packaging electronic components according to any one of [1c] to [3c] above, wherein the thickness of the sealant layer is 0.01 μm or more and 15 μm or less. [5c] The cover tape for packaging electronic components according to any one of [1c] to [4c] above, wherein the thickness of the sealant layer is 0.2 μm or more and 1 μm or less. [6c] The cover tape for packaging electronic components according to any one of [1c] to [5c] above, wherein the sealant layer contains one or more selected from the group consisting of styrene resin, (meth)acrylic resin, olefin resin, urethane resin, and ester resin. [7c] The cover tape for packaging electronic components according to any one of [1c] to [6c] above, wherein the sealant layer contains (meth)acrylic resin. [8c] The cover tape for packaging electronic components according to any one of [1c] to [7c] above, wherein the thickness of the base layer is 5 μm or more and 50 μm or less. [9c] A cover tape for packaging electronic components according to any one of [1c] to [8c] above, wherein the thickness of the base layer is 10 μm or more and 30 μm or less. [10c] A cover tape for packaging electronic components according to any one of [1c] to [9c] above, wherein the base layer comprises one or more selected from the group consisting of ester resins, amide resins, olefin resins, (meth)acrylic resins, imide resins, carbonate resins, and acrylonitrile-butadiene-styrene resins.[11c] The cover tape for packaging electronic components according to any one of [1c] to [10c] above, wherein the base layer contains an ester resin. [12c] The cover tape for packaging electronic components according to any one of [1c] to [11c] above, further comprising an intermediate layer between the base layer and the sealant layer. [13c] The cover tape for packaging electronic components according to [12c] above, wherein the intermediate layer contains one or more selected from the group consisting of polyacrylic acid derivatives, polyacrylic acid ester derivatives, polyvinyl acetate derivatives, styrene resins, olefin resins, and cyclic olefin resins. [14c] The cover tape for packaging electronic components according to [12c] or [13c] above, wherein the intermediate layer contains one or more selected from the group consisting of polyethylene and styrene resins. [15c] The cover tape for packaging electronic components according to any one of [12c] to [14c] above, wherein the thickness of the intermediate layer is 10 μm or more and 60 μm or less. [16c] A cover tape for packaging electronic components according to any one of [12c] to [15c] above, wherein the thickness of the intermediate layer is 20 μm or more and 40 μm or less. [17c] A cover tape for packaging electronic components according to any one of [1c] to [16c] above, wherein the total light transmittance at a wavelength of 375 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more. [18c] A cover tape for packaging electronic components according to [17c] above, wherein the total light transmittance at a wavelength of 375 nm is 50% or more and 100% or less. [19c] A cover tape for packaging electronic components according to [17c] or [18c] above, wherein the total light transmittance at a wavelength of 375 nm is 70% or more and 99% or less. [20c] A cover tape for packaging electronic components according to any one of [1c] to [19c] above, wherein the total light transmittance measured with a light source D65 in accordance with JIS K 7361-1:1997 is 50% or more. [21c] An electronic component packaging body comprising a carrier tape having a recess, an electronic component housed in the recess, and a cover tape for packaging electronic components according to any one of [1c] to [20c] above, wherein the sealant layer is adhered to the carrier tape so as to enclose the electronic component.[22c] A method for manufacturing an electronic component package, comprising: an adhesion step of adhering an electronic component packaging cover tape described in any of [1c] to [20c] above to a carrier tape having an electronic component in a recess to obtain an electronic component package; and a camera inspection step of inspecting the electronic component in the electronic component package with a camera using ultraviolet illumination through the electronic component packaging cover tape. [23c] A method for inspecting an electronic component package, wherein the electronic component package comprises a carrier tape having a recess, an electronic component housed in the recess, and an electronic component packaging cover tape described in any of [1c] to [20c] above, the sealant layer being adhered to the carrier tape so as to enclose the electronic component, and a camera inspection step of inspecting the electronic component in the electronic component package with a camera using ultraviolet illumination through the electronic component packaging cover tape.

[0029] Furthermore, the inventors diligently conducted research to achieve the above objectives. As a result, they discovered that by setting the diffuse light coefficient at a predetermined wavelength to below a predetermined value, visibility during camera inspection using infrared illumination can be improved, and thus completed a fourth embodiment of the present invention.

[0030] According to a fourth embodiment of the present invention, the following are provided: a cover tape for packaging electronic components, an electronic component package, a method for manufacturing an electronic component package, and a method for inspecting an electronic component package.

[0031] [1D] A cover tape for packaging electronic components, comprising a base layer and a sealant layer, wherein the diffuse light transmittance at a wavelength of 900 nm is 30% or less, according to the following method 4. (Method 4) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 900 nm of the cover tape for packaging electronic components are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 900 nm. [2D] The cover tape for packaging electronic components according to [1D], wherein the thickness of the sealant layer is 0.01 μm or more and 15 μm or less. [3D] The cover tape for packaging electronic components according to [1D] or [2D], wherein the sealant layer contains one or more selected from the group consisting of styrene resin, (meth)acrylic resin, olefin resin, urethane resin, and ester resin. [4D] The cover tape for packaging electronic components according to any one of [1D] to [3D] above, wherein the thickness of the base layer is 5 μm or more and 50 μm or less. [5D] The cover tape for packaging electronic components according to any one of [1D] to [4D] above, wherein the base layer comprises one or more selected from the group consisting of ester resins, amide resins, olefin resins, (meth)acrylic resins, imide resins, carbonate resins, and acrylonitrile-butadiene-styrene resins. [6D] The cover tape for packaging electronic components according to any one of [1D] to [5D] above, further comprising an intermediate layer between the base layer and the sealant layer. [7D] The cover tape for packaging electronic components according to [6D] above, wherein the intermediate layer comprises one or more selected from the group consisting of polyacrylic acid derivatives, polyacrylic acid ester derivatives, polyvinyl acetate derivatives, styrene resins, olefin resins, and cyclic olefin resins. [8D] The cover tape for packaging electronic components according to [6D] or [7D], wherein the thickness of the intermediate layer is 10 μm or more and 60 μm or less. [9D] The cover tape for packaging electronic components according to any one of [1D] to [8D], wherein the total light transmittance at a wavelength of 900 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more.[10D] A cover tape for packaging electronic components according to any one of [1D] to [9D] above, wherein the total light transmittance measured with light source D65 in accordance with JIS K 7361-1:1997 is 50% or more. [11D] An electronic component package comprising a carrier tape having a recess, an electronic component housed in the recess, and a cover tape for packaging electronic components according to any one of [1D] to [10D] above, wherein the sealant layer is adhered to the carrier tape so as to enclose the electronic component. [12D] A method for manufacturing an electronic component package, comprising: an adhesion step of adhering the cover tape for packaging electronic components according to any one of [1D] to [10D] above to a carrier tape housing an electronic component in a recess to obtain an electronic component package; and a camera inspection step of inspecting the electronic component in the electronic component package using infrared illumination through the cover tape for packaging electronic components. [13D] A method for inspecting an electronic component package, wherein the electronic component package comprises a carrier tape having a recess, an electronic component housed in the recess, and an electronic component packaging cover tape as described in any of [1D] to [10D] above, the sealant layer being adhered to the carrier tape so as to enclose the electronic component, and the method further comprises a camera inspection step of inspecting the electronic component in the electronic component package with a camera using infrared illumination through the electronic component packaging cover tape.

[0032] Furthermore, according to a fourth embodiment of the present invention, the following cover tape for packaging electronic components, electronic component packaging, a method for manufacturing electronic component packaging, and a method for inspecting electronic component packaging are also provided.

[0033] [1d] A cover tape for packaging electronic components, comprising a base layer and a sealant layer, wherein the diffuse light transmittance at a wavelength of 900 nm is 30% or less, according to Method 4 below. (Method 4) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 900 nm of the cover tape for packaging electronic components are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 900 nm. [2d] The cover tape for packaging electronic components according to [1d] above, wherein the diffuse light transmittance at a wavelength of 900 nm is 0% or more and 30% or less. [3d] The cover tape for packaging electronic components according to [1d] or [2d] above, wherein the diffuse light transmittance at a wavelength of 900 nm is 1% or more and 20% or less. [4d] A cover tape for packaging electronic components according to any one of [1d] to [3d], wherein the thickness of the sealant layer is 0.01 μm or more and 15 μm or less. [5d] A cover tape for packaging electronic components according to any one of [1d] to [4d], wherein the thickness of the sealant layer is 0.2 μm or more and 1 μm or less. [6d] A cover tape for packaging electronic components according to any one of [1d] to [5d], wherein the sealant layer contains one or more selected from the group consisting of styrene resin, (meth)acrylic resin, olefin resin, urethane resin, and ester resin. [7d] A cover tape for packaging electronic components according to any one of [1d] to [6d], wherein the sealant layer contains (meth)acrylic resin. [8d] A cover tape for packaging electronic components according to any one of [1d] to [7d], wherein the thickness of the base layer is 5 μm or more and 50 μm or less. [9d] A cover tape for packaging electronic components according to any one of [1d] to [8d], wherein the thickness of the base layer is 10 μm or more and 30 μm or less. [10d] A cover tape for packaging electronic components according to any one of [1d] to [9d], wherein the base layer contains one or more selected from the group consisting of ester resins, amide resins, olefin resins, (meth)acrylic resins, imide resins, carbonate resins, and acrylonitrile-butadiene-styrene resins.[11d] The cover tape for packaging electronic components according to any one of [1d] to [10d], wherein the base layer comprises an ester resin. [12d] The cover tape for packaging electronic components according to any one of [1d] to [11d], further comprising an intermediate layer between the base layer and the sealant layer. [13d] The cover tape for packaging electronic components according to [12d], wherein the intermediate layer comprises one or more selected from the group consisting of polyacrylic acid derivatives, polyacrylic acid ester derivatives, polyvinyl acetate derivatives, styrene resins, olefin resins, and cyclic olefin resins. [14d] The cover tape for packaging electronic components according to [12d] or [13d], wherein the intermediate layer comprises one or more selected from the group consisting of polyethylene and styrene resins. [15d] The cover tape for packaging electronic components according to any one of [12d] to [14d], wherein the thickness of the intermediate layer is 10 μm or more and 60 μm or less. [16d] A cover tape for packaging electronic components according to any one of [12d] to [15d], wherein the thickness of the intermediate layer is 20 μm or more and 40 μm or less. [17d] A cover tape for packaging electronic components according to any one of [1d] to [16d], wherein the total light transmittance at a wavelength of 900 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more. [18d] A cover tape for packaging electronic components according to [17d], wherein the total light transmittance at a wavelength of 900 nm is 50% or more and 100% or less. [19d] A cover tape for packaging electronic components according to [17d] or [18d], wherein the total light transmittance at a wavelength of 900 nm is 70% or more and 99% or less. [20d] A cover tape for packaging electronic components according to any one of [1d] to [19d] above, wherein the total light transmittance measured with light source D65 in accordance with JIS K 7361-1:1997 is 50% or more. [21d] An electronic component packaging body comprising a carrier tape having a recess, an electronic component housed in the recess, and a cover tape for packaging electronic components according to any one of [1d] to [20d] above, wherein the sealant layer is adhered to the carrier tape so as to enclose the electronic component.[22d] A method for manufacturing an electronic component package, comprising: an adhesion step of adhering an electronic component packaging cover tape according to any one of [1d] to [20d] above to a carrier tape having an electronic component in a recess to obtain an electronic component package; and a camera inspection step of inspecting the electronic component in the electronic component package with a camera using infrared illumination through the electronic component packaging cover tape. [23d] A method for inspecting an electronic component package, wherein the electronic component package comprises a carrier tape having a recess, an electronic component housed in the recess, and an electronic component packaging cover tape according to any one of [1d] to [20d] above, the sealant layer is adhered to the carrier tape so as to enclose the electronic component, and the method for inspecting an electronic component package comprises a camera inspection step of inspecting the electronic component in the electronic component package with a camera using infrared illumination through the electronic component packaging cover tape.

[0034] According to the first embodiment of the present invention, a cover tape for packaging electronic components can be provided that can improve visibility during camera inspection using red light illumination.

[0035] Furthermore, according to a second embodiment of the present invention, a cover tape for packaging electronic components can be provided that can improve visibility during camera inspection using blue light illumination.

[0036] Furthermore, according to a third embodiment of the present invention, a cover tape for packaging electronic components can be provided that can improve visibility during camera inspection using ultraviolet illumination.

[0037] Furthermore, according to a fourth embodiment of the present invention, a cover tape for packaging electronic components can be provided that can improve visibility during camera inspection using infrared illumination.

[0038] This figure schematically shows an example of the layer structure of the cover tape of the first embodiment. This figure shows an example of the state in which the cover tape of the first embodiment is adhered (heat-sealed) to the carrier tape. This figure schematically shows an example of the layer structure of the cover tape of the second embodiment. This figure shows an example of the state in which the cover tape of the second embodiment is adhered (heat-sealed) to the carrier tape. This figure schematically shows an example of the layer structure of the cover tape of the third embodiment. This figure shows an example of the state in which the cover tape of the third embodiment is adhered (heat-sealed) to the carrier tape. This figure schematically shows an example of the layer structure of the cover tape of the fourth embodiment. This figure shows an example of the state in which the cover tape of the fourth embodiment is adhered (heat-sealed) to the carrier tape.

[0039] The embodiments of the present invention will be described below with reference to the drawings. In all drawings, similar components are denoted by the same reference numerals, and explanations are omitted as appropriate. Also, the figures are schematic diagrams and do not correspond to the actual dimensional ratios. Furthermore, unless otherwise specified, "A to B" indicating a numerical range represents A or greater and B or less. Figures 1, 3, 5, and 7 show the cover tape of the first embodiment, the cover tape of the second embodiment, the cover tape of the third embodiment, and the cover tape of the fourth embodiment, respectively, but unless otherwise specified, the definitions of the reference numerals for each layer are the same. The same applies to Figures 2, 4, 6, and 8.

[0040] In this specification, the term "(meth)acrylic" refers to a concept that encompasses both acrylic and methacrylic. The same applies to similar terms such as "(meth)acrylate."

[0041] <<First Embodiment>> The following describes the cover tape for packaging electronic components and the electronic component packaging body according to the first embodiment of the present invention.

[0042] [Cover Tape for Packaging Electronic Components] The cover tape for packaging electronic components according to the first embodiment (hereinafter, also simply referred to as "cover tape" where appropriate) includes a base layer and a sealant layer, and has a diffuse light transmittance of 35% or less at a wavelength of 630 nm measured by the following method 1. (Method 1) Using an ultraviolet-visible-near infrared spectrophotometer, the total light transmittance at a wavelength of 630 nm and the parallel light transmittance at a wavelength of 630 nm of the cover tape for packaging electronic components are measured respectively. Then, the value obtained by subtracting the parallel light transmittance from the total light transmittance is defined as the diffuse light transmittance at the wavelength of 630 nm.

[0043] With the configuration as described above, a cover tape for packaging electronic components that can improve visibility during camera inspection using red light illumination can be provided. Here, the visibility during camera inspection using red light illumination includes, for example, visibility in inspection for scratches or foreign matters on the surface of red-based electronic components; reading of white-based or blue-based printed marks on the surface of electronic components; or reading of barcodes, QR codes (registered trademark) and the like on the surface of electronic components.

[0044] The reason why the effect of the first embodiment can be obtained is not necessarily clear, but the following reason is presumed. Since the cover tape of the first embodiment has a diffuse light transmittance of 35% or less at a wavelength of 630 nm measured by the above method 1, it is considered that the diffusion of red light near a wavelength of 630 nm occurring when the light transmits through the cover tape can be suppressed, thereby improving visibility during camera inspection using red light illumination.

[0045] Next, a specific structure of the cover tape for packaging electronic components according to the first embodiment will be described with reference to the drawings. Fig. 1 is a schematic view showing the layer structure of a cover tape 10, which is an example of the cover tape according to the first embodiment.

[0046] The cover tape 10 includes a base layer 1, an intermediate layer 2, and a sealant layer 3 in this order. That is, the cover tape 10 includes the base layer 1, the intermediate layer 2 on the base layer 1, and the sealant layer 3 on the intermediate layer 2.

[0047] From the perspective of improving the performance balance between the strength and handling properties of the cover tape, the overall thickness of the cover tape is preferably not less than 1 μm and not more than 100 μm, more preferably not less than 10 μm and not more than 90 μm, still more preferably not less than 20 μm and not more than 80 μm, still more preferably not less than 30 μm and not more than 70 μm, still more preferably not less than 40 μm and not more than 60 μm, and still more preferably not less than 45 μm and not more than 55 μm.

[0048] The width and length of the cover tape can be appropriately set mainly according to the width and length of the carrier tape. The width of the cover tape is, for example, not less than 1 mm and not more than 100 mm. Further, the length of the cover tape is, for example, not less than 100 m and not more than 30000 m.

[0049] Next, specific examples will be given to describe each configuration of the cover tape according to the first embodiment.

[0050] <Base Material Layer> The cover tape of the first embodiment includes a base material layer. In the cover tape of the first embodiment, a film can be used as the material constituting the base material layer.

[0051] The base material layer of the first embodiment preferably includes one or more selected from the group consisting of ester resins, amide resins, olefin resins, (meth)acrylic resins, imide resins, carbonate resins and acrylonitrile-butadiene-styrene resins. From the perspective of improving the mechanical strength of the cover tape, the base material layer of the first embodiment preferably includes one or more selected from the group consisting of ester resins and olefin resins, more preferably includes an ester resin, and still more preferably includes polyethylene terephthalate.

[0052] The film used for the base material layer of the first embodiment is, for example, a stretched film. From the perspective of improving the mechanical strength of the cover tape, the film used for the base material layer preferably includes one or more selected from the group consisting of uniaxially stretched films and biaxially stretched films.

[0053] The base layer of the first embodiment preferably contains an antistatic agent, from the viewpoint of reducing the static charge generated when the carrier tape is peeled off. In addition, the cover tape of the first embodiment may have an antistatic layer as one of the base layer layers on the surface of the base layer opposite to the surface on which the sealant layer is provided.

[0054] In the first embodiment, the thickness of the base layer is preferably 50 μm or less, more preferably 45 μm or less, even more preferably 40 μm or less, even more preferably 35 μm or less, and even more preferably 30 μm or less, from the viewpoint of reducing the rigidity of the cover tape. If the rigidity of the cover tape is not too high, even if torsional stress is applied to the carrier tape after sealing, the cover tape can follow the deformation of the carrier tape, thus reducing the peeling of the cover tape from the carrier tape. Furthermore, in the first embodiment, the thickness of the base layer is preferably 5 μm or more, more preferably 7 μm or more, even more preferably 8 μm or more, even more preferably 9 μm or more, and even more preferably 10 μm or more, from the viewpoint of improving the mechanical strength of the cover tape. If the mechanical strength of the cover tape is not too low, even if the cover tape is peeled off from the carrier tape at high speed, the breakage of the cover tape can be reduced. The thickness of the base material layer in the first embodiment is preferably 5 μm to 50 μm, more preferably 7 μm to 45 μm, even more preferably 8 μm to 40 μm, even more preferably 9 μm to 35 μm, and even more preferably 10 μm to 30 μm, from the viewpoint of reducing the rigidity of the cover tape and improving the mechanical strength of the cover tape.

[0055] <Intermediate Layer> The cover tape of the first embodiment preferably further comprises an intermediate layer between the base layer and the sealant layer, from the viewpoint of improving the overall cushioning of the cover tape and improving the heat sealability.

[0056] The intermediate layer of the first embodiment preferably contains one or more selected from the group consisting of polyacrylic acid derivatives, polyacrylic acid ester derivatives, polyvinyl acetate derivatives, styrene resins, olefin resins, and cyclic olefin resins, from the viewpoint of improving the cushioning of the entire cover tape, more preferably contains one or more selected from the group consisting of ethylene-(meth)acrylic acid ester copolymers, ethylene-vinyl acetate copolymers, polyethylene, and styrene resins, even more preferably contains one or more selected from the group consisting of polyethylene and styrene resins, and even more preferably contains one or more selected from the group consisting of low-density polyethylene, linear low-density polyethylene, and styrene-ethylene-butylene-styrene block copolymers.

[0057] The styrene-based resin includes, for example, one or more selected from the group consisting of polystyrene, styrene-ethylene-butylene-styrene block copolymer, styrene-butadiene copolymer, styrene-butadiene-styrene block copolymer, styrene-ethylene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-propylene-styrene block copolymer, styrene-(meth)acrylate methyl copolymer, and hydrogenated styrene block copolymer.

[0058] The resin used in the intermediate layer of the first embodiment is preferably of type two or less, and more preferably of type one, from the viewpoint of further improving visibility during camera inspection using red light illumination.

[0059] In the first embodiment, the thickness of the intermediate layer is preferably 10 μm to 60 μm, more preferably 12 μm to 55 μm, even more preferably 15 μm to 50 μm, even more preferably 18 μm to 45 μm, and even more preferably 20 μm to 40 μm, from the viewpoint of improving the adhesion between the cover tape and the carrier tape during heat sealing.

[0060] <Sealant Layer> The cover tape of the first embodiment includes a sealant layer. The sealant layer is typically located on the outermost surface of the cover tape and is in close contact with the carrier tape during the manufacturing of the electronic component packaging.

[0061] The sealant layer of the first embodiment preferably contains a thermoplastic resin, and more preferably contains one or more selected from the group consisting of styrene resins, (meth)acrylic resins, olefin resins, urethane resins, and ester resins, from the viewpoint of heat sealability.

[0062] The styrene-based resin includes, for example, one or more selected from the group consisting of polystyrene, styrene-ethylene-butylene-styrene block copolymer, styrene-butadiene copolymer, styrene-butadiene-styrene block copolymer, styrene-ethylene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-propylene-styrene block copolymer, styrene-(meth)acrylate methyl copolymer, and hydrogenated styrene block copolymer.

[0063] (Meth)acrylic resins include resins having structural units derived from one or more monomers selected from the group consisting of, for example, (meth)acrylic acid; (meth)acrylic acid esters such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate; (meth)acrylonitrile; and (meth)acrylamide. (Meth)acrylic resins may further contain structural units derived from monomers other than these monomers.

[0064] The sealant layer of the first embodiment preferably comprises one or more selected from the group consisting of (meth)acrylic resins and styrene resins, more preferably comprises one or more selected from the group consisting of acrylic resins and methyl methacrylate-styrene copolymers, and even more preferably comprises an acrylic resin.

[0065] The resin used in the sealant layer of the first embodiment is preferably of type two or less, and more preferably of type one, from the viewpoint of further improving visibility during camera inspection using red light illumination.

[0066] The sealant layer of the first embodiment preferably contains an antistatic agent from the viewpoint of improving antistatic properties. The antistatic agent includes, for example, one or more selected from the group consisting of conductive polymers, metal oxides, conductive carbons, and lithium salts. The sealant layer of the first embodiment preferably contains a conductive polymer from the viewpoint of further improving visibility during camera inspection using red light illumination. The conductive polymer includes, for example, one or more selected from the group consisting of π-conjugated conductive polymers, polyvinylcarbazoles, polymers containing polyether structures, carboxylic acid base-containing polymers, quaternary ammonium salt polymers, and polyether / polyolefin copolymers. The π-conjugated conductive polymer includes, for example, one or more selected from the group consisting of polypyrroles, polythiophenes, polyacetylenes, polyphenylenes, polyphenylenevinylenes, polyanilines, polyacenes, polythiophenevinylenes, and copolymers thereof.

[0067] The conductive polymer preferably includes a π-conjugated conductive polymer from the viewpoint of improving the balance between good conductivity and availability, more preferably includes one or more selected from the group consisting of polypyrroles, polythiophenes, and polyanilines from the viewpoint of stability in air, and more preferably includes polythiophenes from the viewpoint of improving the balance between good conductivity and heat resistance during heat sealing, and even more preferably includes poly(3,4-ethylenedioxythiophene) or a derivative thereof.

[0068] The metal oxide includes, for example, one or more selected from the group consisting of tin oxide, zinc oxide, titanium oxide, antimond-doped tin oxide, phosphorus-doped tin oxide, and the like.

[0069] From the viewpoint of improving heat sealability, the thickness of the sealant layer in the first embodiment is preferably 0.01 μm to 15 μm, more preferably 0.05 μm to 10 μm, even more preferably 0.1 μm to 8 μm, even more preferably 0.2 μm to 5 μm, and even more preferably 0.2 μm to 1 μm.

[0070] <Other Layers> The cover tape of the first embodiment may further comprise layers other than those described above. The cover tape of the first embodiment may further comprise an adhesive layer between the base layer and the intermediate layer, for example. As the material for forming the adhesive layer, for example, a known solvent-based or water-based dry laminating agent or anchor coating agent can be used.

[0071] <Physical Properties of Cover Tape> The diffuse light emission coefficient at a wavelength of 630 nm (hereinafter also referred to as "diffuse light emission coefficient at a wavelength of 630 nm" as appropriate) of the cover tape of the first embodiment, according to Method 1 above, is 35% or less, preferably 25% or less, more preferably 20% or less, even more preferably 18% or less, even more preferably 16% or less, and even more preferably 15% or less. The lower limit of the diffuse light emission coefficient at a wavelength of 630 nm of the cover tape of the first embodiment is not particularly limited, but may be, for example, 0% or more, 1% or more, 2% or more, 3% or more, 4% or more, 5% or more, or 7% or more. The diffuse light emission coefficient of the cover tape of the first embodiment at a wavelength of 630 nm is, for example, 0% to 35%, and may be 1% to 25%, 2% to 20%, 3% to 18%, 4% to 16%, 5% to 15%, or 7% to 15%.

[0072] The diffuse light emission coefficient of the cover tape of the first embodiment at a wavelength of 630 nm can be adjusted, for example, by reducing the thickness of the sealant layer containing an antistatic agent; by the method of forming the sealant layer; by smoothing each layer; and by adjusting the overall thickness of the cover tape, the composition of the base layer, the thickness of the base layer, the composition of the intermediate layer, the thickness of the intermediate layer, the composition of the sealant layer, the thickness of the sealant layer, the type of antistatic agent, etc.

[0073] The total light transmittance at a wavelength of 630 nm of the cover tape of the first embodiment, as measured using an ultraviolet-visible-near-infrared spectrophotometer (hereinafter also referred to as simply "total light transmittance at a wavelength of 630 nm"), is preferably 50% or more, more preferably 70% or more, even more preferably 80% or more, and even more preferably 85% or more, from the viewpoint of further improving visibility during camera inspection using red light illumination. The upper limit of the total light transmittance at a wavelength of 630 nm of the cover tape of the first embodiment is not particularly limited, but may be, for example, 100% or less, 99% or less, 98% or less, or 97% or less. The total light transmittance at a wavelength of 630 nm of the cover tape of the first embodiment may be, for example, 50% or more and 100% or less, 70% or more and 99% or less, 80% or more and 98% or less, or 85% or more and 97% or less.

[0074] The total light transmittance of the cover tape of the first embodiment, as measured by light source D65 in accordance with JIS K 7361-1:1997 (hereinafter also referred to simply as "total light transmittance" as appropriate), is preferably 50% or more, more preferably 60% or more, even more preferably 70% or more, and even more preferably 80% or more, from the viewpoint of improving the visibility of the electronic components packaged with the cover tape. The upper limit of the total light transmittance of the cover tape of the first embodiment is not particularly limited, but may be, for example, 100% or less, 99% or less, 98% or less, or 97% or less. The total light transmittance of the cover tape of the first embodiment may be, for example, 50% or more and 100% or less, 60% or more and 99% or less, 70% or more and 98% or less, or 80% or more and 97% or less.

[0075] The diffuse light emission coefficient at a wavelength of 470 nm of the cover tape of the first embodiment, according to method 2 below (hereinafter also referred to as simply "diffuse light emission coefficient at a wavelength of 470 nm" as appropriate), is 40% or less, more preferably 35% or less, even more preferably 30% or less, even more preferably 25% or less, even more preferably 23% or less, and even more preferably 20% or less, from the viewpoint of improving visibility during camera inspection using blue light illumination. The lower limit of the diffuse light emission coefficient at a wavelength of 470 nm of the cover tape of the first embodiment is not particularly limited, but may be, for example, 0% or more, 1% or more, 3% or more, 5% or more, 7% or more, or 8% or more. The diffuse light emission coefficient at a wavelength of 470 nm of the cover tape of the first embodiment may be, for example, 0% or more and 40% or less, 1% or more and 35% or less, 3% or more and 30% or less, 5% or more and 25% or less, 7% or more and 23% or less, or 8% or more and 20% or less.

[0076] (Method 2) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 470 nm of the cover tape for electronic component packaging are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance at a wavelength of 470 nm from the total light transmittance at a wavelength of 470 nm is defined as the diffuse light transmittance at a wavelength of 470 nm.

[0077] The total light transmittance at a wavelength of 470 nm of the cover tape of the first embodiment, as measured using an ultraviolet-visible-near-infrared spectrophotometer (hereinafter also referred to as simply "total light transmittance at a wavelength of 470 nm"), is preferably 50% or more, more preferably 70% or more, even more preferably 80% or more, and even more preferably 85% or more, from the viewpoint of further improving visibility during camera inspection using blue light illumination. The upper limit of the total light transmittance at a wavelength of 470 nm of the cover tape of the first embodiment is not particularly limited, but may be, for example, 100% or less, 99% or less, 98% or less, or 97% or less. The total light transmittance at a wavelength of 470 nm of the cover tape of the first embodiment may be, for example, 50% or more and 100% or less, 70% or more and 99% or less, 80% or more and 98% or less, or 85% or more and 97% or less.

[0078] The diffuse light emission coefficient at a wavelength of 375 nm (hereinafter also referred to as "diffuse light emission coefficient at a wavelength of 375 nm" as appropriate) of the cover tape of the first embodiment, as determined by method 3 below, is preferably 35% or less, more preferably 33% or less, even more preferably 30% or less, even more preferably 28% or less, even more preferably 25% or less, and even more preferably 20% or less, from the viewpoint of improving visibility during camera inspection using ultraviolet illumination. The lower limit of the diffuse light emission coefficient at a wavelength of 375 nm of the cover tape of the first embodiment is not particularly limited, but may be, for example, 0% or more, 1% or more, 3% or more, 5% or more, 8% or more, or 10% or more. The diffuse light emission coefficient of the cover tape of the first embodiment at a wavelength of 375 nm is, for example, 0% to 35%, may be 1% to 33%, 3% to 30%, 5% to 28%, 8% to 25%, or 10% to 20%.

[0079] (Method 3) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 375 nm of the cover tape for electronic component packaging are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance at a wavelength of 375 nm from the total light transmittance at a wavelength of 375 nm is defined as the diffuse light transmittance at a wavelength of 375 nm.

[0080] The total light transmittance at a wavelength of 375 nm of the cover tape of the first embodiment, as measured using an ultraviolet-visible-near-infrared spectrophotometer (hereinafter also referred to as simply "total light transmittance at a wavelength of 375 nm"), is preferably 50% or more, more preferably 70% or more, even more preferably 80% or more, and even more preferably 85% or more, from the viewpoint of further improving visibility during camera inspection using ultraviolet illumination. The upper limit of the total light transmittance at a wavelength of 375 nm of the cover tape of the first embodiment is not particularly limited, but may be, for example, 100% or less, 99% or less, 98% or less, or 97% or less. The total light transmittance at a wavelength of 375 nm of the cover tape of the first embodiment may be, for example, 50% or more and 100% or less, 70% or more and 99% or less, 80% or more and 98% or less, or 85% or more and 97% or less.

[0081] The diffuse light emission coefficient at a wavelength of 900 nm (hereinafter also referred to as "diffuse light emission coefficient at a wavelength of 900 nm") of the cover tape of the first embodiment, according to method 4 below, is preferably 30% or less, more preferably 25% or less, even more preferably 20% or less, even more preferably 15% or less, even more preferably 13% or less, and even more preferably 10% or less, from the viewpoint of improving visibility during camera inspection using infrared illumination. The lower limit of the diffuse light emission coefficient at a wavelength of 900 nm of the cover tape of the first embodiment is not particularly limited, but may be, for example, 0% or more, 1% or more, 2% or more, 3% or more, 4% or more, or 5% or more. The diffuse light emission coefficient at a wavelength of 900 nm of the cover tape of the first embodiment may be, for example, 0% or more and 30% or less, 1% or more and 25% or less, 2% or more and 20% or less, 3% or more and 15% or less, 4% or more and 13% or less, or 5% or more and 10% or less.

[0082] (Method 4) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 900 nm of the cover tape for electronic component packaging are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance at a wavelength of 900 nm from the total light transmittance at a wavelength of 900 nm is taken as the diffuse light transmittance at a wavelength of 900 nm.

[0083] The total light transmittance at a wavelength of 900 nm of the cover tape of the first embodiment, as measured using an ultraviolet-visible-near-infrared spectrophotometer (hereinafter also referred to as simply "total light transmittance at a wavelength of 900 nm"), is preferably 50% or more, more preferably 70% or more, and even more preferably 80% or more, from the viewpoint of further improving visibility during camera inspection using infrared illumination. The upper limit of the total light transmittance at a wavelength of 900 nm of the cover tape of the first embodiment is not particularly limited, but may be, for example, 100% or less, 99% or less, or 98% or less. The total light transmittance at a wavelength of 900 nm of the cover tape of the first embodiment may be, for example, 50% or more and 100% or less, 70% or more and 99% or less, or 80% or more and 98% or less.

[0084] <Applications of the Cover Tape> Next, the applications of the cover tape will be explained. The cover tape of the first embodiment has improved visibility during camera inspection using red light illumination, and therefore can be used with various carrier tapes.

[0085] <Method for Manufacturing Cover Tape> The cover tape of the first embodiment can be manufactured using appropriate materials and following an appropriate manufacturing process. The following describes in more detail a suitable manufacturing method and the materials used in that manufacturing method.

[0086] First, prepare the substrate layer. Next, form a sealant layer on one side of the substrate layer. The sealant layer can be formed, for example, by applying a sealant-forming coating solution to the substrate layer and drying it. For example, gravure coating can be used as the coating method.

[0087] The solvent used in the coating solution for forming the sealant layer is not particularly limited, but may include, for example, one or more selected from the group consisting of esters such as ethyl acetate and butyl acetate; ketones such as methyl ethyl ketone, acetone, cyclohexanone, and methyl isobutyl ketone; aromatic hydrocarbons such as toluene and xylene; aliphatic alcohols such as methanol, ethanol, n-propanol, and isopropanol; alicyclic alcohols such as cyclohexanol; and water.

[0088] Furthermore, if the cover tape of the first embodiment further includes an intermediate layer between the base material layer and the sealant layer, the cover tape can be formed by, for example, the following method. First, an intermediate layer is formed on at least one side of the base material layer. The intermediate layer can be formed by, for example, an extrusion lamination method or a dry lamination method. Next, a sealant layer is formed by applying a coating liquid for forming a sealant layer to the side of the intermediate layer opposite to the base material layer and drying it.

[0089] [Electronic component packaging] The electronic component packaging of the first embodiment comprises a carrier tape having a recess, an electronic component housed in the recess, and a cover tape of the first embodiment. In other words, the electronic component packaging of the first embodiment comprises a carrier tape in which the electronic component is housed in the recess, and a cover tape of the first embodiment. In the electronic component packaging of the first embodiment, a sealant layer is adhered to the carrier tape so as to encapsulate the electronic component.

[0090] In the electronic component packaging of the first embodiment, the shape and material of the carrier tape are not particularly limited.

[0091] Next, the specific structure of the electronic component packaging of the first embodiment will be described using Figure 2.

[0092] The electronic component packaging 100 comprises a carrier tape 20 having recesses (pockets 21), electronic components (not shown) housed in the pockets 21, and a cover tape 10. The cover tape 10 is used as a lid material for the strip-shaped carrier tape 20, which has a continuous arrangement of recessed pockets 21 that conform to the shape of the electronic components (not shown). Specifically, the cover tape 10 is adhered (usually heat-sealed) to the surface of the carrier tape 20 so as to cover the entire opening of the pockets 21 of the carrier tape 20.

[0093] The electronic component packaging 100 allows for the storage of electronic components, for example, while they are wound around a core, until the electronic components are ready for use. Furthermore, the electronic component packaging 100, while the electronic components are wound around a core, can be transported to distant locations by sea or air freight. The core includes, for example, a metal core, a paper core, a resin core, and the like.

[0094] When using electronic components, the cover tape 10 is peeled off from the carrier tape 20, and the contained electronic components are removed. The electronic components contained in the electronic component packaging 100 are not particularly limited, but include all components used in the manufacture of electrical and electronic equipment, such as semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related components, connectors, electrodes, etc.

[0095] [Method for Manufacturing Electronic Component Packaging] The method for manufacturing electronic component packaging according to the first embodiment comprises at least the following steps: (S) A bonding step to obtain electronic component packaging by bonding the cover tape of the first embodiment to a carrier tape containing electronic components in recesses. (A) A camera inspection step to inspect the electronic components in the electronic component packaging using red light illumination through the cover tape of the first embodiment.

[0096] (Bonding Process (S)) In Bonding Process (S), for example, the electronic component packaging is manufactured by following the procedure below. First, the electronic component is placed in the recess of the carrier tape. Next, the cover tape of the first embodiment is bonded to the surface of the carrier tape by a heat sealing method so as to cover the entire opening of the recess of the carrier tape. At this time, the sealant layer of the cover tape of the first embodiment is made to be in contact with the carrier tape. The specific method or conditions of heat sealing are not particularly limited as long as the cover tape of the first embodiment is bonded to the carrier tape sufficiently strongly. Heat sealing can be performed, for example, using a known heat sealing machine, under conditions of a temperature of 100°C to 240°C, a load of 0.1 kgf to 10 kgf, and a time of 0.0001 seconds to 1 second.

[0097] (Camera Inspection Process (A)) In the camera inspection process (A), the electronic components in the electronic component packaging are inspected by camera using red light illumination through the cover tape of the first embodiment. The inspection of the electronic components includes, for example, one or more selected from the group consisting of inspecting for scratches or foreign matter on the surface of red-colored electronic components; reading white or blue-colored markings on the surface of electronic components; or reading barcodes, QR codes (registered trademarks), etc., on the surface of electronic components. The red light illumination preferably includes light with a wavelength of 630 nm.

[0098] The method for manufacturing the electronic component packaging of the first embodiment may further include any of the following steps: (B) A camera inspection step in which the electronic components in the electronic component packaging are inspected by camera using blue light illumination through the cover tape of the first embodiment. (C) A camera inspection step in which the electronic components in the electronic component packaging are inspected by camera using ultraviolet illumination through the cover tape of the first embodiment. (D) A camera inspection step in which the electronic components in the electronic component packaging are inspected by camera using infrared illumination through the cover tape of the first embodiment.

[0099] (Camera Inspection Process (B)) In camera inspection process (B), the electronic components in the electronic component packaging 100 are inspected by camera using blue light illumination through the cover tape 10. The inspection of the electronic components includes, for example, one or more selected from the group consisting of: inspection for scratches or foreign matter on the metal part of the surface of the electronic component; inspection for scratches or foreign matter on the surface of blue-colored electronic components; reading red-colored printing on the surface of the electronic component; or measurement of the dimensions of the electronic component. The blue light illumination preferably includes light with a wavelength of 470 nm.

[0100] (Camera Inspection Process (C)) In the camera inspection process (C), the electronic components in the electronic component packaging 100 are inspected by camera using ultraviolet illumination through the cover tape 10. The inspection of the electronic components includes, for example, reading stealth printing on the surface of the electronic components. Stealth printing includes, for example, printing using black light ink. The ultraviolet illumination preferably includes light with a wavelength of 375 nm.

[0101] (Camera Inspection Process (D)) In the camera inspection process (D), the electronic components in the electronic component packaging 100 are inspected by camera using infrared illumination through the cover tape 10. The inspection of the electronic components includes, for example, a transmission inspection of the inside of the electronic components. The transmission inspection of the inside of the electronic components includes, for example, an inspection of the internal electrodes that can be seen by passing through the resin part of the surface layer of the electronic components. The infrared illumination preferably includes light with a wavelength of 900 nm.

[0102] [Method for inspecting electronic component packaging] The method for inspecting electronic component packaging according to the first embodiment comprises at least the camera inspection step (A) described above. The method for inspecting electronic component packaging according to the first embodiment may further comprise any of the camera inspection steps (B) to (D) described above.

[0103] Although the first embodiment of the present invention has been described above, these are merely examples of the first embodiment, and various other configurations can be adopted. Furthermore, the present invention is not limited to the first embodiment described above, and modifications, improvements, etc., that do not impair the effects of the present invention are included in the present invention.

[0104] <<Second Embodiment>> The following describes a cover tape for electronic component packaging and an electronic component packaging body according to a second embodiment of the present invention.

[0105] [Cover Tape for Electronic Component Packaging] The cover tape for electronic component packaging of the second embodiment (hereinafter also referred to simply as "cover tape" as appropriate) comprises a base layer and a sealant layer, and has a diffuse light transmittance of 40% or less at a wavelength of 470 nm, according to Method 2 below. (Method 2) The total light transmittance and the parallel line transmittance at a wavelength of 470 nm of the cover tape for electronic component packaging are measured using an ultraviolet-visible-near-infrared spectrophotometer. The value obtained by subtracting the parallel line transmittance from the total light transmittance is then taken as the diffuse light transmittance at a wavelength of 470 nm.

[0106] By having the above configuration, we can provide a cover tape for electronic component packaging that can improve visibility during camera inspection using blue light illumination. Here, visibility during camera inspection using blue light illumination includes, for example, the inspection of scratches or foreign objects on the metal parts of the surface of electronic components; the inspection of scratches or foreign objects on the surface of blue-colored electronic components; the reading of red-colored printing on the surface of electronic components; or the visibility when measuring the dimensions of electronic components.

[0107] The reason why the effects of the second embodiment are obtained is not entirely clear, but the following reasons can be inferred. The cover tape of the second embodiment has a diffuse light coefficient of 40% or less at a wavelength of 470 nm due to the method 2 described above. Therefore, it is thought that the diffusion of blue light around a wavelength of 470 nm that occurs when transmitted through the cover tape can be suppressed, thereby improving visibility during camera inspection using blue light illumination.

[0108] Next, the specific structure of the cover tape for packaging electronic components according to the second embodiment will be described with reference to the figures. Figure 3 schematically shows the layer configuration of a cover tape 10, which is an example of the cover tape according to the second embodiment.

[0109] The cover tape 10 comprises a base layer 1, an intermediate layer 2, and a sealant layer 3 in this order. In other words, the cover tape 10 comprises a base layer 1, an intermediate layer 2 on top of the base layer 1, and a sealant layer 3 on top of the intermediate layer 2.

[0110] The overall thickness of the cover tape is preferably 1 μm to 100 μm, more preferably 10 μm to 90 μm, even more preferably 20 μm to 80 μm, even more preferably 30 μm to 70 μm, even more preferably 40 μm to 60 μm, and even more preferably 45 μm to 55 μm, from the viewpoint of improving the performance balance between the strength and handling properties of the cover tape.

[0111] The width and length of the cover tape can be set as appropriate, primarily according to the width and length of the carrier tape. For example, the width of the cover tape is between 1 mm and 100 mm. The length of the cover tape is between 100 m and 30,000 m.

[0112] Next, specific examples of the components of the cover tape in the second embodiment will be given.

[0113] <Base Layer> The cover tape of the second embodiment includes a base layer. In the cover tape of the second embodiment, a film can be used as the material constituting the base layer.

[0114] The base layer of the second embodiment preferably contains one or more selected from the group consisting of ester resins, amide resins, olefin resins, (meth)acrylic resins, imide resins, carbonate resins, and acrylonitrile-butadiene-styrene resins. From the viewpoint of improving the mechanical strength of the cover tape, the base layer of the second embodiment preferably contains one or more selected from the group consisting of ester resins and olefin resins, more preferably contains an ester resin, and even more preferably contains polyethylene terephthalate.

[0115] The film used for the base layer in the second embodiment is, for example, a stretched film. From the viewpoint of improving the mechanical strength of the cover tape, the film used for the base layer preferably includes one or more selected from the group consisting of a film stretched in one axis direction and a film stretched in two axes direction.

[0116] The base layer of the second embodiment preferably contains an antistatic agent, from the viewpoint of reducing the static charge generated when the carrier tape is peeled off. In addition, the cover tape of the second embodiment may have an antistatic layer as one of the base layer layers on the surface of the base layer opposite to the surface on which the sealant layer is provided.

[0117] In the second embodiment, the thickness of the base layer is preferably 50 μm or less, more preferably 45 μm or less, even more preferably 40 μm or less, even more preferably 35 μm or less, and even more preferably 30 μm or less, from the viewpoint of reducing the rigidity of the cover tape. If the rigidity of the cover tape is not too high, even if torsional stress is applied to the carrier tape after sealing, the cover tape can follow the deformation of the carrier tape, thus reducing the peeling of the cover tape from the carrier tape. Furthermore, in the second embodiment, the thickness of the base layer is preferably 5 μm or more, more preferably 7 μm or more, even more preferably 8 μm or more, even more preferably 9 μm or more, and even more preferably 10 μm or more, from the viewpoint of improving the mechanical strength of the cover tape. If the mechanical strength of the cover tape is not too low, even if the cover tape is peeled from the carrier tape at high speed, the breakage of the cover tape can be reduced. In the second embodiment, the thickness of the base material layer is preferably 5 μm to 50 μm, more preferably 7 μm to 45 μm, even more preferably 8 μm to 40 μm, even more preferably 9 μm to 35 μm, and even more preferably 10 μm to 30 μm, from the viewpoint of reducing the rigidity of the cover tape and improving the mechanical strength of the cover tape.

[0118] <Intermediate Layer> The cover tape of the second embodiment preferably further comprises an intermediate layer between the base layer and the sealant layer, from the viewpoint of improving the overall cushioning of the cover tape and improving the heat sealability.

[0119] The intermediate layer of the second embodiment preferably comprises one or more selected from the group consisting of polyacrylic acid derivatives, polyacrylic acid ester derivatives, polyvinyl acetate derivatives, styrene resins, olefin resins, and cyclic olefin resins, from the viewpoint of improving the cushioning of the entire cover tape; more preferably comprises one or more selected from the group consisting of ethylene-(meth)acrylic acid ester copolymers, ethylene-vinyl acetate copolymers, polyethylene, and styrene resins; even more preferably comprises one or more selected from the group consisting of polyethylene and styrene resins; even more preferably comprises one or more selected from the group consisting of low-density polyethylene, linear low-density polyethylene, and styrene-ethylene-butylene-styrene block copolymers; and from the viewpoint of further improving visibility during camera inspection using blue light illumination, even more preferably comprises one or more selected from the group consisting of low-density polyethylene and linear low-density polyethylene.

[0120] The styrene-based resin includes, for example, one or more selected from the group consisting of polystyrene, styrene-ethylene-butylene-styrene block copolymer, styrene-butadiene copolymer, styrene-butadiene-styrene block copolymer, styrene-ethylene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-propylene-styrene block copolymer, styrene-(meth)acrylate methyl copolymer, and hydrogenated styrene block copolymer.

[0121] The resin used in the intermediate layer of the second embodiment is preferably of type two or less, and more preferably of type one, from the viewpoint of further improving visibility during camera inspection using blue light illumination.

[0122] In the second embodiment, the thickness of the intermediate layer is preferably 10 μm to 60 μm, more preferably 12 μm to 55 μm, even more preferably 15 μm to 50 μm, even more preferably 18 μm to 45 μm, and even more preferably 20 μm to 40 μm, from the viewpoint of improving the adhesion between the cover tape and the carrier tape during heat sealing.

[0123] <Sealant Layer> The cover tape of the second embodiment includes a sealant layer. The sealant layer is typically located on the outermost surface of the cover tape and is in close contact with the carrier tape during the manufacturing of the electronic component packaging.

[0124] The sealant layer of the second embodiment preferably contains a thermoplastic resin, and more preferably contains one or more selected from the group consisting of styrene resins, (meth)acrylic resins, olefin resins, urethane resins, and ester resins, from the viewpoint of heat sealability.

[0125] The styrene-based resin includes, for example, one or more selected from the group consisting of polystyrene, styrene-ethylene-butylene-styrene block copolymer, styrene-butadiene copolymer, styrene-butadiene-styrene block copolymer, styrene-ethylene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-propylene-styrene block copolymer, styrene-(meth)acrylate methyl copolymer, and hydrogenated styrene block copolymer.

[0126] (Meth)acrylic resins include resins having structural units derived from one or more monomers selected from the group consisting of, for example, (meth)acrylic acid; (meth)acrylic acid esters such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate; (meth)acrylonitrile; and (meth)acrylamide. (Meth)acrylic resins may further contain structural units derived from monomers other than these monomers.

[0127] The sealant layer of the second embodiment preferably comprises one or more selected from the group consisting of (meth)acrylic resins and styrene resins, more preferably comprises one or more selected from the group consisting of acrylic resins and methyl methacrylate-styrene copolymers, and even more preferably comprises an acrylic resin.

[0128] The resin used in the sealant layer of the second embodiment is preferably of type two or less, and more preferably of type one, from the viewpoint of further improving visibility during camera inspection using blue light illumination.

[0129] The sealant layer of the second embodiment preferably includes an antistatic agent from the viewpoint of improving antistatic properties. The antistatic agent includes, for example, one or more selected from the group consisting of conductive polymers, metal oxides, conductive carbons, and lithium salts. The sealant layer of the second embodiment preferably includes a conductive polymer from the viewpoint of further improving visibility during camera inspection using blue light illumination. The conductive polymer includes, for example, one or more selected from the group consisting of π-conjugated conductive polymers, polyvinylcarbazoles, polymers containing polyether structures, carboxylic acid base-containing polymers, quaternary ammonium salt polymers, and polyether / polyolefin copolymers. The π-conjugated conductive polymer includes, for example, one or more selected from the group consisting of polypyrroles, polythiophenes, polyacetylenes, polyphenylenes, polyphenylenevinylenes, polyanilines, polyacenes, polythiophenevinylenes, and copolymers thereof.

[0130] The conductive polymer preferably includes a π-conjugated conductive polymer from the viewpoint of improving the balance between good conductivity and availability, more preferably includes one or more selected from the group consisting of polypyrroles, polythiophenes, and polyanilines from the viewpoint of stability in air, and more preferably includes polythiophenes from the viewpoint of improving the balance between good conductivity and heat resistance during heat sealing, and even more preferably includes poly(3,4-ethylenedioxythiophene) or a derivative thereof.

[0131] The metal oxide includes, for example, one or more selected from the group consisting of tin oxide, zinc oxide, titanium oxide, antimond-doped tin oxide, phosphorus-doped tin oxide, and the like.

[0132] From the viewpoint of improving heat sealability, the thickness of the sealant layer in the second embodiment is preferably 0.01 μm to 15 μm, more preferably 0.05 μm to 10 μm, even more preferably 0.1 μm to 8 μm, even more preferably 0.2 μm to 5 μm, and even more preferably 0.2 μm to 1 μm.

[0133] <Other Layers> The cover tape of the second embodiment may further comprise layers other than those described above. The cover tape of the second embodiment may further comprise an adhesive layer between the base layer and the intermediate layer, for example. As the material for forming the adhesive layer, for example, a known solvent-based or water-based dry laminating agent or anchor coating agent can be used.

[0134] <Physical Properties of Cover Tape> The diffuse light emission coefficient at a wavelength of 470 nm (hereinafter also referred to as "diffuse light emission coefficient at a wavelength of 470 nm" as appropriate) of the cover tape of the second embodiment, as determined by Method 2 above, is 40% or less, more preferably 35% or less, even more preferably 30% or less, even more preferably 25% or less, even more preferably 23% or less, and even more preferably 20% or less, from the viewpoint of improving visibility during camera inspection using blue light illumination. The lower limit of the diffuse light emission coefficient at a wavelength of 470 nm of the cover tape of the second embodiment is not particularly limited, but may be, for example, 0% or more, 1% or more, 3% or more, 5% or more, 7% or more, or 8% or more. The diffuse light emission coefficient of the cover tape of the second embodiment at a wavelength of 470 nm is, for example, 0% to 40%, and may be 1% to 35%, 3% to 30%, 5% to 25%, 7% to 23%, or 8% to 20%.

[0135] The diffuse light emission coefficient of the cover tape of the second embodiment at a wavelength of 470 nm can be adjusted, for example, by reducing the thickness of the layer containing the styrene resin; by smoothing each layer; and by adjusting the overall thickness of the cover tape, the composition of the base layer, the thickness of the base layer, the composition of the intermediate layer, the thickness of the intermediate layer, the composition of the sealant layer, the thickness of the sealant layer, the type of antistatic agent, etc.

[0136] The total light transmittance at a wavelength of 470 nm of the cover tape of the second embodiment, as measured using an ultraviolet-visible-near-infrared spectrophotometer (hereinafter also referred to as simply "total light transmittance at a wavelength of 470 nm"), is preferably 50% or more, more preferably 70% or more, even more preferably 80% or more, and even more preferably 85% or more, from the viewpoint of further improving visibility during camera inspection using blue light illumination. The upper limit of the total light transmittance at a wavelength of 470 nm of the cover tape of the second embodiment is not particularly limited, but may be, for example, 100% or less, 99% or less, 98% or less, or 97% or less. The total light transmittance at a wavelength of 470 nm of the cover tape of the second embodiment may be, for example, 50% or more and 100% or less, 70% or more and 99% or less, 80% or more and 98% or less, or 85% or more and 97% or less.

[0137] The total light transmittance of the cover tape of the second embodiment, as measured by light source D65 in accordance with JIS K 7361-1:1997 (hereinafter also referred to simply as "total light transmittance" as appropriate), is preferably 50% or more, more preferably 60% or more, even more preferably 70% or more, and even more preferably 80% or more, from the viewpoint of improving the visibility of the electronic components packaged with the cover tape. The upper limit of the total light transmittance of the cover tape of the second embodiment is not particularly limited, but may be, for example, 100% or less, 99% or less, 98% or less, or 97% or less. The total light transmittance of the cover tape of the second embodiment may be, for example, 50% or more and 100% or less, 60% or more and 99% or less, 70% or more and 98% or less, or 80% or more and 97% or less.

[0138] <Applications of the Cover Tape> Next, the applications of the cover tape will be explained. The cover tape of the second embodiment has improved visibility during camera inspection using blue light illumination, and therefore can be used with various carrier tapes.

[0139] <Method for Manufacturing Cover Tape> The cover tape of the second embodiment can be manufactured using appropriate materials and following an appropriate manufacturing process. The following describes in more detail a suitable manufacturing method and the materials used in that manufacturing method.

[0140] First, prepare the substrate layer. Next, form a sealant layer on one side of the substrate layer. The sealant layer can be formed, for example, by applying a sealant-forming coating solution to the substrate layer and drying it. For example, gravure coating can be used as the coating method.

[0141] The solvent used in the coating solution for forming the sealant layer is not particularly limited, but may include, for example, one or more selected from the group consisting of esters such as ethyl acetate and butyl acetate; ketones such as methyl ethyl ketone, acetone, cyclohexanone, and methyl isobutyl ketone; aromatic hydrocarbons such as toluene and xylene; aliphatic alcohols such as methanol, ethanol, n-propanol, and isopropanol; alicyclic alcohols such as cyclohexanol; and water.

[0142] Furthermore, if the cover tape of the second embodiment further includes an intermediate layer between the base material layer and the sealant layer, the cover tape can be formed by, for example, the following method. First, an intermediate layer is formed on at least one side of the base material layer. The intermediate layer can be formed by, for example, an extrusion lamination method or a dry lamination method. Next, a sealant layer is formed by applying a coating liquid for forming a sealant layer to the side of the intermediate layer opposite to the base material layer and drying it.

[0143] [Electronic component packaging] The electronic component packaging of the second embodiment comprises a carrier tape having a recess, an electronic component housed in the recess, and a cover tape of the second embodiment. In other words, the electronic component packaging of the second embodiment comprises a carrier tape in which the electronic component is housed in the recess, and a cover tape of the second embodiment. In the electronic component packaging of the second embodiment, a sealant layer is adhered to the carrier tape to seal the electronic component.

[0144] In the electronic component packaging of the second embodiment, the shape and material of the carrier tape are not particularly limited.

[0145] Next, the specific structure of the electronic component packaging of the second embodiment will be described using Figure 4.

[0146] The electronic component packaging 100 comprises a carrier tape 20 having recesses (pockets 21), electronic components (not shown) housed in the pockets 21, and a cover tape 10. The cover tape 10 is used as a lid material for the strip-shaped carrier tape 20, which has a continuous arrangement of recessed pockets 21 that conform to the shape of the electronic components (not shown). Specifically, the cover tape 10 is adhered (usually heat-sealed) to the surface of the carrier tape 20 so as to cover the entire opening of the pockets 21 of the carrier tape 20.

[0147] The electronic component packaging 100 allows for the storage of electronic components, for example, while they are wound around a core, until the electronic components are ready for use. Furthermore, the electronic component packaging 100, while the electronic components are wound around a core, can be transported to distant locations by sea or air freight. The core includes, for example, a metal core, a paper core, a resin core, and the like.

[0148] When using electronic components, the cover tape 10 is peeled off from the carrier tape 20, and the contained electronic components are removed. The electronic components contained in the electronic component packaging 100 are not particularly limited, but include all components used in the manufacture of electrical and electronic equipment, such as semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related components, connectors, electrodes, etc.

[0149] [Method for Manufacturing Electronic Component Packaging] The method for manufacturing electronic component packaging according to the second embodiment comprises at least the following steps: (S) A bonding step of bonding the cover tape of the second embodiment to a carrier tape containing electronic components in recesses to obtain electronic component packaging. (B) A camera inspection step of inspecting the electronic components in the electronic component packaging using blue light illumination through the cover tape of the second embodiment.

[0150] (Bonding Process (S)) In the bonding process (S), for example, the electronic component packaging is manufactured by following the procedure below. First, the electronic component is placed in the recess of the carrier tape. Next, the cover tape of the second embodiment is bonded to the surface of the carrier tape by a heat sealing method so as to cover the entire opening of the recess of the carrier tape. At this time, the sealant layer of the cover tape of the second embodiment is made to be in contact with the carrier tape. The specific method or conditions of heat sealing are not particularly limited as long as the cover tape of the second embodiment is bonded to the carrier tape sufficiently strongly. Heat sealing can be performed, for example, using a known heat sealing machine, under conditions of a temperature of 100°C to 240°C, a load of 0.1 kgf to 10 kgf, and a time of 0.0001 seconds to 1 second.

[0151] (Camera Inspection Process (B)) In the camera inspection process (B), the electronic components in the electronic component packaging are inspected by camera using blue light illumination through the cover tape of the second embodiment. The inspection of the electronic components includes, for example, one or more selected from the group consisting of: inspection for scratches or foreign matter on the metal part of the surface of the electronic component; inspection for scratches or foreign matter on the surface of blue-colored electronic components; reading red-colored markings on the surface of electronic components; or measurement of the dimensions of electronic components. The blue light illumination preferably includes light with a wavelength of 470 nm.

[0152] [Method for inspecting electronic component packaging] The method for inspecting electronic component packaging according to the second embodiment comprises at least the camera inspection step (B) described above.

[0153] Although a second embodiment of the present invention has been described above, these are merely examples of the second embodiment, and various other configurations can be adopted. Furthermore, the present invention is not limited to the second embodiment described above, and modifications, improvements, etc., that do not impair the effects of the present invention are included in the present invention.

[0154] <<Third Embodiment>> The following describes a cover tape for electronic component packaging and an electronic component packaging body according to a third embodiment of the present invention.

[0155] [Cover Tape for Electronic Component Packaging] The cover tape for electronic component packaging of the third embodiment (hereinafter also referred to simply as "cover tape" as appropriate) comprises a base layer and a sealant layer, and has a diffuse light transmittance of 35% or less at a wavelength of 375 nm, as determined by the following method 3. (Method 3) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 375 nm of the cover tape for electronic component packaging are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 375 nm.

[0156] By having the above configuration, we can provide a cover tape for electronic component packaging that can improve visibility during camera inspection using ultraviolet illumination. Here, visibility during camera inspection using ultraviolet illumination includes, for example, visibility in reading stealth printing on the surface of electronic components. Stealth printing includes, for example, printing using black light ink.

[0157] The reason why the effects of the third embodiment are obtained is not entirely clear, but the following reasons can be inferred. The cover tape of the third embodiment has a diffuse light coefficient of 35% or less at a wavelength of 375 nm due to the method 3 described above. Therefore, it is thought that the diffusion of ultraviolet light around a wavelength of 375 nm that occurs when transmitted through the cover tape can be suppressed, thereby improving visibility during camera inspection using ultraviolet illumination.

[0158] Next, the specific structure of the cover tape for packaging electronic components according to the third embodiment will be described with reference to the figures. Figure 5 schematically shows the layer configuration of a cover tape 10, which is an example of a cover tape according to the third embodiment.

[0159] The cover tape 10 comprises a base layer 1, an intermediate layer 2, and a sealant layer 3 in this order. In other words, the cover tape 10 comprises a base layer 1, an intermediate layer 2 on top of the base layer 1, and a sealant layer 3 on top of the intermediate layer 2.

[0160] The overall thickness of the cover tape is preferably 1 μm to 100 μm, more preferably 10 μm to 90 μm, even more preferably 20 μm to 80 μm, even more preferably 30 μm to 70 μm, even more preferably 40 μm to 60 μm, and even more preferably 45 μm to 55 μm, from the viewpoint of improving the performance balance between the strength and handling properties of the cover tape.

[0161] The width and length of the cover tape can be set as appropriate, primarily according to the width and length of the carrier tape. For example, the width of the cover tape is between 1 mm and 100 mm. The length of the cover tape is between 100 m and 30,000 m.

[0162] Next, specific examples of the components of the cover tape in the third embodiment will be given.

[0163] <Base Layer> The cover tape of the third embodiment includes a base layer. In the cover tape of the third embodiment, a film can be used as the material constituting the base layer.

[0164] The base layer of the third embodiment preferably comprises one or more selected from the group consisting of ester resins, amide resins, olefin resins, (meth)acrylic resins, imide resins, carbonate resins, and acrylonitrile-butadiene-styrene resins. From the viewpoint of improving the mechanical strength of the cover tape, the base layer of the third embodiment preferably comprises one or more selected from the group consisting of ester resins and olefin resins, more preferably comprises an ester resin, and even more preferably comprises polyethylene terephthalate.

[0165] The film used for the base layer in the third embodiment is, for example, a stretched film. From the viewpoint of improving the mechanical strength of the cover tape, the film used for the base layer preferably includes one or more selected from the group consisting of a film stretched in one axis direction and a film stretched in two axes direction.

[0166] The base layer of the third embodiment preferably contains an antistatic agent, from the viewpoint of reducing the static charge generated when the carrier tape is peeled off. Furthermore, the cover tape of the third embodiment may have an antistatic layer as one of the base layer layers on the surface of the base layer opposite to the surface on which the sealant layer is provided.

[0167] In the third embodiment, the thickness of the base layer is preferably 50 μm or less, more preferably 45 μm or less, even more preferably 40 μm or less, even more preferably 35 μm or less, and even more preferably 30 μm or less, from the viewpoint of reducing the rigidity of the cover tape. If the rigidity of the cover tape is not too high, even if torsional stress is applied to the carrier tape after sealing, the cover tape can follow the deformation of the carrier tape, thus reducing the peeling of the cover tape from the carrier tape. Furthermore, in the third embodiment, the thickness of the base layer is preferably 5 μm or more, more preferably 7 μm or more, even more preferably 8 μm or more, even more preferably 9 μm or more, and even more preferably 10 μm or more, from the viewpoint of improving the mechanical strength of the cover tape. If the mechanical strength of the cover tape is not too low, even if the cover tape is peeled from the carrier tape at high speed, the breakage of the cover tape can be reduced. In the third embodiment, the thickness of the base material layer is preferably 5 μm to 50 μm, more preferably 7 μm to 45 μm, even more preferably 8 μm to 40 μm, even more preferably 9 μm to 35 μm, and even more preferably 10 μm to 30 μm, from the viewpoint of reducing the rigidity of the cover tape and improving the mechanical strength of the cover tape.

[0168] <Intermediate Layer> The cover tape of the third embodiment preferably further comprises an intermediate layer between the base layer and the sealant layer, from the viewpoint of improving the overall cushioning of the cover tape and improving the heat sealability.

[0169] The intermediate layer of the third embodiment preferably contains one or more selected from the group consisting of polyacrylic acid derivatives, polyacrylic acid ester derivatives, polyvinyl acetate derivatives, styrene resins, olefin resins, and cyclic olefin resins, from the viewpoint of improving the cushioning of the entire cover tape; more preferably contains one or more selected from the group consisting of ethylene-(meth)acrylic acid ester copolymers, ethylene-vinyl acetate copolymers, polyethylene, and styrene resins; even more preferably contains one or more selected from the group consisting of polyethylene and styrene resins; even more preferably contains one or more selected from the group consisting of low-density polyethylene, linear low-density polyethylene, and styrene-ethylene-butylene-styrene block copolymers; and from the viewpoint of further improving visibility during camera inspection using ultraviolet illumination, even more preferably contains one or more selected from the group consisting of low-density polyethylene and linear low-density polyethylene.

[0170] The styrene-based resin includes, for example, one or more selected from the group consisting of polystyrene, styrene-ethylene-butylene-styrene block copolymer, styrene-butadiene copolymer, styrene-butadiene-styrene block copolymer, styrene-ethylene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-propylene-styrene block copolymer, styrene-(meth)acrylate methyl copolymer, and hydrogenated styrene block copolymer.

[0171] The resin used in the intermediate layer of the third embodiment is preferably of type two or less, and more preferably of type one, from the viewpoint of further improving visibility during camera inspection using ultraviolet illumination.

[0172] In the third embodiment, the thickness of the intermediate layer is preferably 10 μm to 60 μm, more preferably 12 μm to 55 μm, even more preferably 15 μm to 50 μm, even more preferably 18 μm to 45 μm, and even more preferably 20 μm to 40 μm, from the viewpoint of improving the adhesion between the cover tape and the carrier tape during heat sealing.

[0173] <Sealant Layer> The cover tape of the third embodiment includes a sealant layer. The sealant layer is typically located on the outermost surface of the cover tape and is in close contact with the carrier tape during the manufacturing of the electronic component packaging.

[0174] The sealant layer of the third embodiment preferably contains a thermoplastic resin, and more preferably contains one or more selected from the group consisting of styrene resins, (meth)acrylic resins, olefin resins, urethane resins, and ester resins, from the viewpoint of heat sealability.

[0175] The styrene-based resin includes, for example, one or more selected from the group consisting of polystyrene, styrene-ethylene-butylene-styrene block copolymer, styrene-butadiene copolymer, styrene-butadiene-styrene block copolymer, styrene-ethylene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-propylene-styrene block copolymer, styrene-(meth)acrylate methyl copolymer, and hydrogenated styrene block copolymer.

[0176] (Meth)acrylic resins include resins having structural units derived from one or more monomers selected from the group consisting of, for example, (meth)acrylic acid; (meth)acrylic acid esters such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate; (meth)acrylonitrile; and (meth)acrylamide. (Meth)acrylic resins may further contain structural units derived from monomers other than these monomers.

[0177] The sealant layer of the third embodiment preferably comprises one or more selected from the group consisting of (meth)acrylic resins and styrene resins, more preferably comprises one or more selected from the group consisting of acrylic resins and methyl methacrylate-styrene copolymers, and even more preferably comprises an acrylic resin.

[0178] The resin used in the sealant layer of the third embodiment is preferably of two types or less, and more preferably of one type, from the viewpoint of further improving visibility during camera inspection using ultraviolet illumination.

[0179] The sealant layer of the third embodiment preferably includes an antistatic agent from the viewpoint of improving antistatic properties. The antistatic agent includes, for example, one or more selected from the group consisting of conductive polymers, metal oxides, conductive carbons, and lithium salts. The sealant layer of the third embodiment preferably includes a conductive polymer from the viewpoint of further improving visibility during camera inspection using ultraviolet illumination. The conductive polymer includes, for example, one or more selected from the group consisting of π-conjugated conductive polymers, polyvinylcarbazoles, polymers containing polyether structures, carboxylic acid base-containing polymers, quaternary ammonium salt polymers, and polyether / polyolefin copolymers. The π-conjugated conductive polymer includes, for example, one or more selected from the group consisting of polypyrroles, polythiophenes, polyacetylenes, polyphenylenes, polyphenylenevinylenes, polyanilines, polyacenes, polythiophenevinylenes, and copolymers thereof.

[0180] The conductive polymer preferably includes a π-conjugated conductive polymer from the viewpoint of improving the balance between good conductivity and availability, more preferably includes one or more selected from the group consisting of polypyrroles, polythiophenes, and polyanilines from the viewpoint of stability in air, and more preferably includes polythiophenes from the viewpoint of improving the balance between good conductivity and heat resistance during heat sealing, and even more preferably includes poly(3,4-ethylenedioxythiophene) or a derivative thereof.

[0181] The metal oxide includes, for example, one or more selected from the group consisting of tin oxide, zinc oxide, titanium oxide, antimond-doped tin oxide, phosphorus-doped tin oxide, and the like.

[0182] From the viewpoint of improving heat sealability, the thickness of the sealant layer in the third embodiment is preferably 0.01 μm to 15 μm, more preferably 0.05 μm to 10 μm, even more preferably 0.1 μm to 8 μm, even more preferably 0.2 μm to 5 μm, and even more preferably 0.2 μm to 1 μm.

[0183] <Other Layers> The cover tape of the third embodiment may further comprise layers other than those described above. The cover tape of the third embodiment may further comprise an adhesive layer between the base layer and the intermediate layer, for example. As the material for forming the adhesive layer, for example, a known solvent-based or water-based dry laminating agent or anchor coating agent can be used.

[0184] <Physical Properties of Cover Tape> The diffuse light emission coefficient at a wavelength of 375 nm (hereinafter also referred to as "diffuse light emission coefficient at a wavelength of 375 nm" as appropriate) of the cover tape of the third embodiment, as determined by method 3 above, is 35% or less, preferably 33% or less, more preferably 30% or less, even more preferably 28% or less, even more preferably 25% or less, and even more preferably 20% or less, from the viewpoint of improving visibility during camera inspection using ultraviolet illumination. The lower limit of the diffuse light emission coefficient at a wavelength of 375 nm of the cover tape of the third embodiment is not particularly limited, but may be, for example, 0% or more, 1% or more, 3% or more, 5% or more, 8% or more, or 10% or more. The diffuse light emission coefficient of the cover tape of the third embodiment at a wavelength of 375 nm is, for example, 0% to 35%, and may be 1% to 33%, 3% to 30%, 5% to 28%, 8% to 25%, or 10% to 20%.

[0185] The diffuse light emission coefficient of the cover tape of the third embodiment at a wavelength of 375 nm can be adjusted, for example, by reducing the thickness of the layer containing the styrene resin; by smoothing each layer; and by adjusting the overall thickness of the cover tape, the composition of the base layer, the thickness of the base layer, the composition of the intermediate layer, the thickness of the intermediate layer, the composition of the sealant layer, the thickness of the sealant layer, the type of antistatic agent, etc.

[0186] The total light transmittance at a wavelength of 375 nm of the cover tape of the third embodiment, as measured using an ultraviolet-visible-near-infrared spectrophotometer (hereinafter also referred to as simply "total light transmittance at a wavelength of 375 nm"), is preferably 50% or more, more preferably 70% or more, even more preferably 80% or more, and even more preferably 85% or more, from the viewpoint of further improving visibility during camera inspection using ultraviolet illumination. The upper limit of the total light transmittance at a wavelength of 375 nm of the cover tape of the third embodiment is not particularly limited, but may be, for example, 100% or less, 99% or less, 98% or less, or 97% or less. The total light transmittance at a wavelength of 375 nm of the cover tape of the third embodiment may be, for example, 50% or more and 100% or less, 70% or more and 99% or less, 80% or more and 98% or less, or 85% or more and 97% or less.

[0187] The total light transmittance of the cover tape of the third embodiment, as measured by light source D65 in accordance with JIS K 7361-1:1997 (hereinafter also referred to simply as "total light transmittance" as appropriate), is preferably 50% or more, more preferably 60% or more, even more preferably 70% or more, and even more preferably 80% or more, from the viewpoint of improving the visibility of the electronic components packaged with the cover tape. The upper limit of the total light transmittance of the cover tape of the third embodiment is not particularly limited, but may be, for example, 100% or less, 99% or less, 98% or less, or 97% or less. The total light transmittance of the cover tape of the third embodiment may be, for example, 50% or more and 100% or less, 60% or more and 99% or less, 70% or more and 98% or less, or 80% or more and 97% or less.

[0188] <Applications of the Cover Tape> Next, the applications of the cover tape will be explained. The cover tape of the third embodiment has improved visibility during camera inspection using ultraviolet illumination, and therefore can be used with various carrier tapes.

[0189] <Method for Manufacturing Cover Tape> The cover tape of the third embodiment can be manufactured using appropriate materials and following an appropriate manufacturing process. The following describes in more detail a suitable manufacturing method and the materials used in that manufacturing method.

[0190] First, prepare the substrate layer. Next, form a sealant layer on one side of the substrate layer. The sealant layer can be formed, for example, by applying a sealant-forming coating solution to the substrate layer and drying it. For example, gravure coating can be used as the coating method.

[0191] The solvent used in the coating solution for forming the sealant layer is not particularly limited, but may include, for example, one or more selected from the group consisting of esters such as ethyl acetate and butyl acetate; ketones such as methyl ethyl ketone, acetone, cyclohexanone, and methyl isobutyl ketone; aromatic hydrocarbons such as toluene and xylene; aliphatic alcohols such as methanol, ethanol, n-propanol, and isopropanol; alicyclic alcohols such as cyclohexanol; and water.

[0192] Furthermore, if the cover tape of the third embodiment further includes an intermediate layer between the base material layer and the sealant layer, the cover tape can be formed by, for example, the following method. First, an intermediate layer is formed on at least one side of the base material layer. The intermediate layer can be formed by, for example, an extrusion lamination method or a dry lamination method. Next, a sealant layer is formed by applying a coating liquid for forming a sealant layer to the side of the intermediate layer opposite to the base material layer and drying it.

[0193] [Electronic component packaging] The electronic component packaging of the third embodiment comprises a carrier tape having a recess, an electronic component housed in the recess, and a cover tape of the third embodiment. In other words, the electronic component packaging of the third embodiment comprises a carrier tape in which the electronic component is housed in the recess, and a cover tape of the third embodiment. In the electronic component packaging of the third embodiment, a sealant layer is adhered to the carrier tape to seal the electronic component.

[0194] In the electronic component packaging of the third embodiment, the shape and material of the carrier tape are not particularly limited.

[0195] Next, the specific structure of the electronic component packaging of the third embodiment will be described with reference to Figure 6.

[0196] The electronic component packaging 100 comprises a carrier tape 20 having recesses (pockets 21), electronic components (not shown) housed in the pockets 21, and a cover tape 10. The cover tape 10 is used as a lid material for the strip-shaped carrier tape 20, which has a continuous arrangement of recessed pockets 21 that conform to the shape of the electronic components (not shown). Specifically, the cover tape 10 is adhered (usually heat-sealed) to the surface of the carrier tape 20 so as to cover the entire opening of the pockets 21 of the carrier tape 20.

[0197] The electronic component packaging 100 allows for the storage of electronic components, for example, while they are wound around a core, until the electronic components are ready for use. Furthermore, the electronic component packaging 100, while the electronic components are wound around a core, can be transported to distant locations by sea or air freight. The core includes, for example, a metal core, a paper core, a resin core, and the like.

[0198] When using electronic components, the cover tape 10 is peeled off from the carrier tape 20, and the contained electronic components are removed. The electronic components contained in the electronic component packaging 100 are not particularly limited, but include all components used in the manufacture of electrical and electronic equipment, such as semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related components, connectors, electrodes, etc.

[0199] [Method for Manufacturing Electronic Component Packaging] The method for manufacturing electronic component packaging according to the third embodiment comprises at least the following steps: (S) A bonding step of bonding the cover tape of the third embodiment to a carrier tape containing electronic components in recesses to obtain electronic component packaging. (C) A camera inspection step of inspecting the electronic components in the electronic component packaging using ultraviolet illumination through the cover tape of the third embodiment.

[0200] (Bonding Process (S)) In the bonding process (S), for example, the electronic component packaging is manufactured by following the procedure below. First, the electronic component is placed in the recess of the carrier tape. Next, the cover tape of the third embodiment is bonded to the surface of the carrier tape by a heat sealing method so as to cover the entire opening of the recess of the carrier tape. At this time, the sealant layer of the cover tape of the third embodiment is made to be in contact with the carrier tape. The specific method or conditions of heat sealing are not particularly limited as long as the cover tape of the third embodiment is bonded to the carrier tape sufficiently strongly. Heat sealing can be performed, for example, using a known heat sealing machine, under conditions of a temperature of 100°C to 240°C, a load of 0.1 kgf to 10 kgf, and a time of 0.0001 seconds to 1 second.

[0201] (Camera Inspection Process (C)) In the camera inspection process (C), the electronic components in the electronic component packaging are inspected by camera using ultraviolet illumination through the cover tape of the third embodiment. The inspection of the electronic components includes, for example, reading stealth printing on the surface of the electronic components. Stealth printing includes, for example, printing using black light ink. The ultraviolet illumination preferably includes light with a wavelength of 375 nm.

[0202] [Method for inspecting electronic component packaging] The method for inspecting electronic component packaging according to the third embodiment comprises at least the camera inspection step (C) described above.

[0203] Although a third embodiment of the present invention has been described above, these are merely examples of the third embodiment, and various other configurations can be adopted. Furthermore, the present invention is not limited to the aforementioned third embodiment, and modifications, improvements, etc., that do not impair the effects of the present invention are included in the present invention.

[0204] <<Fourth Embodiment>> The following describes the cover tape for electronic component packaging and the electronic component packaging body according to the fourth embodiment of the present invention.

[0205] [Cover Tape for Electronic Component Packaging] The cover tape for electronic component packaging of the fourth embodiment (hereinafter also referred to simply as "cover tape" as appropriate) comprises a base layer and a sealant layer, and has a diffuse light transmittance of 30% or less at a wavelength of 900 nm, as determined by the following method 4. (Method 4) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 900 nm of the cover tape for electronic component packaging are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 900 nm.

[0206] By having the above configuration, we can provide a cover tape for packaging electronic components that can improve visibility during camera inspection using infrared illumination. Here, visibility during camera inspection using infrared illumination includes, for example, visibility in internal inspection of electronic components. Internal inspection of electronic components includes, for example, inspection of internal electrodes that can be seen by passing through the resin part of the surface layer of the electronic component.

[0207] The reason why the effects of the fourth embodiment are obtained is not entirely clear, but the following reasons can be inferred. The cover tape of the fourth embodiment has a diffuse light coefficient of 30% or less at a wavelength of 900 nm due to the method 4 described above. Therefore, it is thought that the diffusion of infrared light around a wavelength of 900 nm that occurs when transmitted through the cover tape can be suppressed, thereby improving visibility during camera inspection using infrared illumination.

[0208] Next, the specific structure of the cover tape for packaging electronic components according to the fourth embodiment will be described with reference to the figures. Figure 7 schematically shows the layer configuration of a cover tape 10, which is an example of the cover tape according to the fourth embodiment.

[0209] The cover tape 10 comprises a base layer 1, an intermediate layer 2, and a sealant layer 3 in this order. In other words, the cover tape 10 comprises a base layer 1, an intermediate layer 2 on top of the base layer 1, and a sealant layer 3 on top of the intermediate layer 2.

[0210] The overall thickness of the cover tape is preferably 1 μm to 100 μm, more preferably 10 μm to 90 μm, even more preferably 20 μm to 80 μm, even more preferably 30 μm to 70 μm, even more preferably 40 μm to 60 μm, and even more preferably 45 μm to 55 μm, from the viewpoint of improving the performance balance between the strength and handling properties of the cover tape.

[0211] The width and length of the cover tape can be set as appropriate, primarily according to the width and length of the carrier tape. For example, the width of the cover tape is between 1 mm and 100 mm. The length of the cover tape is between 100 m and 30,000 m.

[0212] Next, specific examples of the components of the cover tape in the fourth embodiment will be given and explained.

[0213] <Base Layer> The cover tape of the fourth embodiment includes a base layer. In the cover tape of the fourth embodiment, a film can be used as the material constituting the base layer.

[0214] The base layer of the fourth embodiment preferably contains one or more selected from the group consisting of ester resins, amide resins, olefin resins, (meth)acrylic resins, imide resins, carbonate resins, and acrylonitrile-butadiene-styrene resins. From the viewpoint of improving the mechanical strength of the cover tape, the base layer of the fourth embodiment preferably contains one or more selected from the group consisting of ester resins and olefin resins, more preferably contains an ester resin, and even more preferably contains polyethylene terephthalate.

[0215] The film used for the base layer in the fourth embodiment is, for example, a stretched film. From the viewpoint of improving the mechanical strength of the cover tape, the film used for the base layer preferably includes one or more selected from the group consisting of a film stretched in one axis direction and a film stretched in two axes direction.

[0216] The base layer of the fourth embodiment preferably contains an antistatic agent, from the viewpoint of reducing the static charge generated when the carrier tape is peeled off. In addition, the cover tape of the fourth embodiment may have an antistatic layer as one of the base layer layers on the surface of the base layer opposite to the surface on which the sealant layer is provided.

[0217] In the fourth embodiment, the thickness of the base layer is preferably 50 μm or less, more preferably 45 μm or less, even more preferably 40 μm or less, even more preferably 35 μm or less, and even more preferably 30 μm or less, from the viewpoint of reducing the rigidity of the cover tape. If the rigidity of the cover tape is not too high, even if torsional stress is applied to the carrier tape after sealing, the cover tape can follow the deformation of the carrier tape, thus reducing the peeling of the cover tape from the carrier tape. Furthermore, in the fourth embodiment, the thickness of the base layer is preferably 5 μm or more, more preferably 7 μm or more, even more preferably 8 μm or more, even more preferably 9 μm or more, and even more preferably 10 μm or more, from the viewpoint of improving the mechanical strength of the cover tape. If the mechanical strength of the cover tape is not too low, even if the cover tape is peeled from the carrier tape at high speed, the breakage of the cover tape can be reduced. In the fourth embodiment, the thickness of the base layer is preferably 5 μm to 50 μm, more preferably 7 μm to 45 μm, even more preferably 8 μm to 40 μm, even more preferably 9 μm to 35 μm, and even more preferably 10 μm to 30 μm, from the viewpoint of reducing the rigidity of the cover tape and improving the mechanical strength of the cover tape.

[0218] <Intermediate Layer> The cover tape of the fourth embodiment preferably further comprises an intermediate layer between the base layer and the sealant layer, from the viewpoint of improving the overall cushioning of the cover tape and improving the heat sealability.

[0219] The intermediate layer of the fourth embodiment preferably comprises one or more selected from the group consisting of polyacrylic acid derivatives, polyacrylic acid ester derivatives, polyvinyl acetate derivatives, styrene resins, olefin resins, and cyclic olefin resins, from the viewpoint of improving the cushioning properties of the entire cover tape; more preferably comprises one or more selected from the group consisting of ethylene-(meth)acrylic acid ester copolymers, ethylene-vinyl acetate copolymers, polyethylene, and styrene resins; even more preferably comprises one or more selected from the group consisting of polyethylene and styrene resins; and even more preferably comprises one or more selected from the group consisting of low-density polyethylene, linear low-density polyethylene, and styrene-ethylene-butylene-styrene block copolymers.

[0220] The styrene-based resin includes, for example, one or more selected from the group consisting of polystyrene, styrene-ethylene-butylene-styrene block copolymer, styrene-butadiene copolymer, styrene-butadiene-styrene block copolymer, styrene-ethylene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-propylene-styrene block copolymer, styrene-(meth)acrylate methyl copolymer, and hydrogenated styrene block copolymer.

[0221] The resin used in the intermediate layer of the fourth embodiment is preferably of type two or less, and more preferably of type one, from the viewpoint of further improving visibility during camera inspection using infrared illumination.

[0222] In the fourth embodiment, the thickness of the intermediate layer is preferably 10 μm to 60 μm, more preferably 12 μm to 55 μm, even more preferably 15 μm to 50 μm, even more preferably 18 μm to 45 μm, and even more preferably 20 μm to 40 μm, from the viewpoint of improving the adhesion between the cover tape and the carrier tape during heat sealing.

[0223] <Sealant Layer> The cover tape of the fourth embodiment includes a sealant layer. The sealant layer is typically located on the outermost surface of the cover tape and is in close contact with the carrier tape during the manufacturing of the electronic component packaging.

[0224] The sealant layer of the fourth embodiment preferably contains a thermoplastic resin, and more preferably contains one or more selected from the group consisting of styrene resins, (meth)acrylic resins, olefin resins, urethane resins, and ester resins, from the viewpoint of heat sealability.

[0225] The styrene-based resin includes, for example, one or more selected from the group consisting of polystyrene, styrene-ethylene-butylene-styrene block copolymer, styrene-butadiene copolymer, styrene-butadiene-styrene block copolymer, styrene-ethylene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-propylene-styrene block copolymer, styrene-(meth)acrylate methyl copolymer, and hydrogenated styrene block copolymer.

[0226] (Meth)acrylic resins include resins having structural units derived from one or more monomers selected from the group consisting of, for example, (meth)acrylic acid; (meth)acrylic acid esters such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate; (meth)acrylonitrile; and (meth)acrylamide. (Meth)acrylic resins may further contain structural units derived from monomers other than these monomers.

[0227] The sealant layer of the fourth embodiment preferably comprises one or more selected from the group consisting of (meth)acrylic resins and styrene resins, more preferably comprises one or more selected from the group consisting of acrylic resins and methyl methacrylate-styrene copolymers, and even more preferably comprises an acrylic resin.

[0228] The resin used in the sealant layer of the fourth embodiment is preferably of two types or less, and more preferably of one type, from the viewpoint of further improving visibility during camera inspection using infrared illumination.

[0229] The sealant layer of the fourth embodiment preferably includes an antistatic agent from the viewpoint of improving antistatic properties. The antistatic agent includes, for example, one or more selected from the group consisting of conductive polymers, metal oxides, conductive carbons, and lithium salts. The sealant layer of the fourth embodiment preferably includes a conductive polymer from the viewpoint of further improving visibility during camera inspection using infrared illumination. The conductive polymer includes, for example, one or more selected from the group consisting of π-conjugated conductive polymers, polyvinylcarbazoles, polymers containing polyether structures, carboxylic acid base-containing polymers, quaternary ammonium salt polymers, and polyether / polyolefin copolymers. The π-conjugated conductive polymer includes, for example, one or more selected from the group consisting of polypyrroles, polythiophenes, polyacetylenes, polyphenylenes, polyphenylenevinylenes, polyanilines, polyacenes, polythiophenevinylenes, and copolymers thereof.

[0230] The conductive polymer preferably includes a π-conjugated conductive polymer from the viewpoint of improving the balance between good conductivity and availability, more preferably includes one or more selected from the group consisting of polypyrroles, polythiophenes, and polyanilines from the viewpoint of stability in air, and more preferably includes polythiophenes from the viewpoint of improving the balance between good conductivity and heat resistance during heat sealing, and even more preferably includes poly(3,4-ethylenedioxythiophene) or a derivative thereof.

[0231] The metal oxide includes, for example, one or more selected from the group consisting of tin oxide, zinc oxide, titanium oxide, antimond-doped tin oxide, phosphorus-doped tin oxide, and the like.

[0232] From the viewpoint of improving heat sealability, the thickness of the sealant layer in the fourth embodiment is preferably 0.01 μm to 15 μm, more preferably 0.05 μm to 10 μm, even more preferably 0.1 μm to 8 μm, even more preferably 0.2 μm to 5 μm, and even more preferably 0.2 μm to 1 μm.

[0233] <Other Layers> The cover tape of the fourth embodiment may further comprise layers other than those described above. The cover tape of the fourth embodiment may further comprise an adhesive layer between the base layer and the intermediate layer, for example. As the material for forming the adhesive layer, for example, a known solvent-based or water-based dry laminating agent or anchor coating agent can be used.

[0234] <Physical Properties of Cover Tape> The diffuse light emission coefficient at a wavelength of 900 nm (hereinafter also referred to as "diffuse light emission coefficient at a wavelength of 900 nm") of the cover tape of the fourth embodiment, as determined by method 4 above, is 30% or less, preferably 25% or less, more preferably 20% or less, even more preferably 15% or less, even more preferably 13% or less, and even more preferably 10% or less, from the viewpoint of improving visibility during camera inspection using infrared illumination. The lower limit of the diffuse light emission coefficient at a wavelength of 900 nm of the cover tape of the fourth embodiment is not particularly limited, but may be, for example, 0% or more, 1% or more, 2% or more, 3% or more, 4% or more, or 5% or more. The diffuse light emission coefficient of the cover tape of the fourth embodiment at a wavelength of 900 nm is, for example, 0% to 30%, and may be 1% to 25%, 2% to 20%, 3% to 15%, 4% to 13%, or 5% to 10%.

[0235] The diffuse light emission coefficient of the cover tape of the fourth embodiment at a wavelength of 900 nm can be adjusted, for example, by reducing the thickness of the sealant layer containing an antistatic agent; by the method of forming the sealant layer; by smoothing each layer; and by adjusting the overall thickness of the cover tape, the composition of the base layer, the thickness of the base layer, the composition of the intermediate layer, the thickness of the intermediate layer, the composition of the sealant layer, the thickness of the sealant layer, the type of antistatic agent, etc.

[0236] The total light transmittance at a wavelength of 900 nm of the cover tape of the fourth embodiment, as measured using an ultraviolet-visible-near-infrared spectrophotometer (hereinafter also referred to as simply "total light transmittance at a wavelength of 900 nm"), is preferably 50% or more, more preferably 70% or more, and even more preferably 80% or more, from the viewpoint of further improving visibility during camera inspection using infrared illumination. The upper limit of the total light transmittance at a wavelength of 900 nm of the cover tape of the fourth embodiment is not particularly limited, but may be, for example, 100% or less, 99% or less, or 98% or less. The total light transmittance at a wavelength of 900 nm of the cover tape of the fourth embodiment may be, for example, 50% or more and 100% or less, 70% or more and 99% or less, or 80% or more and 98% or less.

[0237] The total light transmittance of the cover tape of the fourth embodiment, as measured by light source D65 in accordance with JIS K 7361-1:1997 (hereinafter also referred to simply as "total light transmittance" as appropriate), is preferably 50% or more, more preferably 60% or more, even more preferably 70% or more, and even more preferably 80% or more, from the viewpoint of improving the visibility of the electronic components packaged with the cover tape. The upper limit of the total light transmittance of the cover tape of the fourth embodiment is not particularly limited, but may be, for example, 100% or less, 99% or less, 98% or less, or 97% or less. The total light transmittance of the cover tape of the fourth embodiment may be, for example, 50% or more and 100% or less, 60% or more and 99% or less, 70% or more and 98% or less, or 80% or more and 97% or less.

[0238] <Applications of the Cover Tape> Next, the applications of the cover tape will be explained. The cover tape of the fourth embodiment has improved visibility during camera inspection using infrared illumination, and therefore can be used with various carrier tapes.

[0239] <Method for Manufacturing Cover Tape> The cover tape of the fourth embodiment can be manufactured using appropriate materials and following an appropriate manufacturing process. The following describes in more detail a suitable manufacturing method and the materials used in that manufacturing method.

[0240] First, prepare the substrate layer. Next, form a sealant layer on one side of the substrate layer. The sealant layer can be formed, for example, by applying a sealant-forming coating solution to the substrate layer and drying it. For example, gravure coating can be used as the coating method.

[0241] The solvent used in the coating solution for forming the sealant layer is not particularly limited, but may include, for example, one or more selected from the group consisting of esters such as ethyl acetate and butyl acetate; ketones such as methyl ethyl ketone, acetone, cyclohexanone, and methyl isobutyl ketone; aromatic hydrocarbons such as toluene and xylene; aliphatic alcohols such as methanol, ethanol, n-propanol, and isopropanol; alicyclic alcohols such as cyclohexanol; and water.

[0242] Furthermore, if the cover tape of the fourth embodiment further includes an intermediate layer between the base material layer and the sealant layer, the cover tape can be formed by, for example, the following method. First, an intermediate layer is formed on at least one side of the base material layer. The intermediate layer can be formed by, for example, an extrusion lamination method or a dry lamination method. Next, a sealant layer is formed by applying a coating liquid for forming a sealant layer to the side of the intermediate layer opposite to the base material layer and drying it.

[0243] [Electronic component packaging] The electronic component packaging of the fourth embodiment comprises a carrier tape having a recess, an electronic component housed in the recess, and a cover tape of the fourth embodiment. In other words, the electronic component packaging of the fourth embodiment comprises a carrier tape in which the electronic component is housed in the recess, and a cover tape of the fourth embodiment. In the electronic component packaging of the fourth embodiment, a sealant layer is adhered to the carrier tape to seal the electronic component.

[0244] In the electronic component packaging of the fourth embodiment, the shape and material of the carrier tape are not particularly limited.

[0245] Next, the specific structure of the electronic component packaging of the fourth embodiment will be described using Figure 8.

[0246] The electronic component packaging 100 comprises a carrier tape 20 having recesses (pockets 21), electronic components (not shown) housed in the pockets 21, and a cover tape 10. The cover tape 10 is used as a lid material for the strip-shaped carrier tape 20, which has a continuous arrangement of recessed pockets 21 that conform to the shape of the electronic components (not shown). Specifically, the cover tape 10 is adhered (usually heat-sealed) to the surface of the carrier tape 20 so as to cover the entire opening of the pockets 21 of the carrier tape 20.

[0247] The electronic component packaging 100 allows for the storage of electronic components, for example, while they are wound around a core, until the electronic components are ready for use. Furthermore, the electronic component packaging 100, while the electronic components are wound around a core, can be transported to distant locations by sea or air freight. The core includes, for example, a metal core, a paper core, a resin core, and the like.

[0248] When using electronic components, the cover tape 10 is peeled off from the carrier tape 20, and the contained electronic components are removed. The electronic components contained in the electronic component packaging 100 are not particularly limited, but include all components used in the manufacture of electrical and electronic equipment, such as semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related components, connectors, electrodes, etc.

[0249] [Method for Manufacturing Electronic Component Packaging] The method for manufacturing electronic component packaging according to the fourth embodiment comprises at least the following steps: (S) A bonding step of bonding the cover tape of the fourth embodiment to a carrier tape containing electronic components in recesses to obtain electronic component packaging. (D) A camera inspection step of inspecting the electronic components in the electronic component packaging using infrared illumination through the cover tape of the fourth embodiment.

[0250] (Bonding Process (S)) In the bonding process (S), for example, the electronic component packaging is manufactured by following the procedure below. First, the electronic component is placed in the recess of the carrier tape. Next, the cover tape of the fourth embodiment is bonded to the surface of the carrier tape by a heat sealing method so as to cover the entire opening of the recess of the carrier tape. At this time, the sealant layer of the cover tape of the fourth embodiment is made to be in contact with the carrier tape. The specific method or conditions of heat sealing are not particularly limited as long as the cover tape of the fourth embodiment is bonded to the carrier tape sufficiently strongly. Heat sealing can be performed, for example, using a known heat sealing machine, under conditions of a temperature of 100°C to 240°C, a load of 0.1 kgf to 10 kgf, and a time of 0.0001 seconds to 1 second.

[0251] (Camera Inspection Process (D)) In the camera inspection process (D), the electronic components in the electronic component packaging are inspected using infrared illumination through the cover tape of the fourth embodiment. The inspection of the electronic components includes, for example, a light transmission inspection of the inside of the electronic components. The light transmission inspection of the inside of the electronic components includes, for example, an inspection of the internal electrodes that can be seen by passing through the resin portion of the surface layer of the electronic components. The infrared illumination preferably includes light with a wavelength of 900 nm.

[0252] [Method for inspecting electronic component packaging] The method for inspecting electronic component packaging according to the fourth embodiment comprises at least the camera inspection step (D) described above.

[0253] Although a fourth embodiment of the present invention has been described above, these are merely examples of the fourth embodiment, and various other configurations can be adopted. Furthermore, the present invention is not limited to the aforementioned fourth embodiment, and modifications, improvements, etc., that do not impair the effects of the present invention are included in the present invention.

[0254] Although embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations can be adopted. Furthermore, the present invention is not limited to the embodiments described above, and modifications, improvements, etc., within the scope that can achieve the objectives of the present invention are included in the present invention. Examples of reference embodiments are provided below. [1] A cover tape for packaging electronic components comprising a base layer and a sealant layer, wherein the diffuse light transmittance at a wavelength of 630 nm is 35% or less according to Method 1 below. (Method 1) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 630 nm of the cover tape for packaging electronic components are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 630 nm. [2] A cover tape for packaging electronic components comprising a base layer and a sealant layer, wherein the diffuse light transmittance at a wavelength of 470 nm is 40% or less according to Method 2 below. (Method 2) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 470 nm of the cover tape for electronic component packaging are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 470 nm. [3] A cover tape for electronic component packaging comprising a base layer and a sealant layer, wherein the diffuse light transmittance at a wavelength of 375 nm is 35% or less according to Method 3 below. (Method 3) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 375 nm of the cover tape for electronic component packaging are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 375 nm. [4] A cover tape for packaging electronic components, comprising a base layer and a sealant layer, wherein the diffuse light transmittance at a wavelength of 900 nm is 30% or less according to Method 4 below. (Method 4) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 900 nm of the cover tape for packaging electronic components are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 900 nm.[5] The cover tape for packaging electronic components according to any one of [1] to [4] above, wherein the thickness of the sealant layer is 0.01 μm or more and 15 μm or less. [6] The cover tape for packaging electronic components according to any one of [1] to [5] above, wherein the sealant layer contains one or more selected from the group consisting of styrene resin, (meth)acrylic resin, olefin resin, urethane resin, and ester resin. [7] The cover tape for packaging electronic components according to any one of [1] to [6] above, wherein the thickness of the base material layer is 5 μm or more and 50 μm or less. [8] The cover tape for packaging electronic components according to any one of [1] to [7] above, wherein the base material layer contains one or more selected from the group consisting of ester resin, amide resin, olefin resin, (meth)acrylic resin, imide resin, carbonate resin, and acrylonitrile-butadiene-styrene resin. [9] A cover tape for packaging electronic components according to any one of [1] to [8] above, further comprising an intermediate layer between the base material layer and the sealant layer.

[10] A cover tape for packaging electronic components according to [9] above, wherein the intermediate layer comprises one or more selected from the group consisting of polyacrylic acid derivatives, polyacrylic acid ester derivatives, polyvinyl acetate derivatives, styrene resins, olefin resins, and cyclic olefin resins.

[11] A cover tape for packaging electronic components according to [9] or

[10] above, wherein the thickness of the intermediate layer is 10 μm or more and 60 μm or less.

[12] A cover tape for packaging electronic components according to any one of [1] to

[11] above, wherein the total light transmittance at a wavelength of 630 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more.

[13] A cover tape for packaging electronic components according to any one of [1] to

[12] above, wherein the total light transmittance at a wavelength of 470 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more.

[14] A cover tape for packaging electronic components according to any of [1] to

[13] above, wherein the total light transmittance at a wavelength of 375 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more.

[15] A cover tape for packaging electronic components according to any one of [1] to

[14] above, wherein the total light transmittance at a wavelength of 900 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more.

[16] A cover tape for packaging electronic components according to any one of [1] to

[15] above, wherein the total light transmittance, as measured with a light source D65 in accordance with JIS K 7361-1:1997, is 50% or more.

[17] An electronic component package comprising a carrier tape having a recess, an electronic component housed in the recess, and a cover tape for packaging electronic components according to any one of [1] to

[16] above, wherein the sealant layer is adhered to the carrier tape so as to enclose the electronic component.

[18] A method for manufacturing an electronic component package, comprising: an adhesion step of adhering an electronic component packaging cover tape described in any of [1] to

[16] above to a carrier tape containing electronic components in recesses to obtain an electronic component package; and a camera inspection step of inspecting the electronic components in the electronic component package using red light illumination through the electronic component packaging cover tape.

[19] A method for manufacturing an electronic component package, comprising: an adhesion step of adhering an electronic component packaging cover tape described in any of [1] to

[16] above to a carrier tape containing electronic components in recesses to obtain an electronic component package; and a camera inspection step of inspecting the electronic components in the electronic component package using blue light illumination through the electronic component packaging cover tape.

[20] A method for manufacturing an electronic component package, comprising: an adhesion step of adhering an electronic component packaging cover tape described in any of [1] to

[16] above to a carrier tape containing electronic components in recesses to obtain an electronic component package; and a camera inspection step of inspecting the electronic components in the electronic component package using ultraviolet illumination through the electronic component packaging cover tape.

[21] A method for manufacturing an electronic component package, comprising: an adhesion step of adhering an electronic component packaging cover tape described in any of [1] to

[16] above to a carrier tape containing electronic components in recesses to obtain an electronic component package; and a camera inspection step of inspecting the electronic components in the electronic component package using infrared illumination through the electronic component packaging cover tape.

[22] A method for inspecting an electronic component package, wherein the electronic component package comprises a carrier tape having a recess, an electronic component housed in the recess, and a cover tape for electronic component packaging described in any of [1] to

[16] above, the sealant layer is adhered to the carrier tape so as to enclose the electronic component, and the method comprises a camera inspection step of inspecting the electronic component in the electronic component package with a camera using red light illumination through the cover tape for electronic component packaging.

[23] A method for inspecting an electronic component package, wherein the electronic component package comprises a carrier tape having a recess, an electronic component housed in the recess, and a cover tape for electronic component packaging described in any of [1] to

[16] above, the sealant layer is adhered to the carrier tape so as to enclose the electronic component, and the method comprises a camera inspection step of inspecting the electronic component in the electronic component package with a camera using blue light illumination through the cover tape for electronic component packaging.

[24] A method for inspecting an electronic component package, wherein the electronic component package comprises a carrier tape having a recess, an electronic component housed in the recess, and a cover tape for electronic component packaging described in any of [1] to

[16] above, the sealant layer is adhered to the carrier tape so as to enclose the electronic component, and the method comprises a camera inspection step of inspecting the electronic component in the electronic component package with a camera using ultraviolet illumination through the cover tape for electronic component packaging.

[25] A method for inspecting an electronic component package, wherein the electronic component package comprises a carrier tape having a recess, an electronic component housed in the recess, and a cover tape for electronic component packaging described in any of [1] to

[16] above, the sealant layer is adhered to the carrier tape so as to enclose the electronic component, and the method comprises a camera inspection step of inspecting the electronic component in the electronic component package with a camera using infrared illumination through the cover tape for electronic component packaging.

[0255] <<Examples 1A to 4A and Comparative Example 1A>> The first embodiment of the present invention will be described in detail below with reference to Examples 1A to 4A and Comparative Example 1A. However, the first embodiment of the present invention is not limited in any way to the description of these examples.

[0256] The cover tapes for Examples 1A to 4A and Comparative Example 1A were prepared by the following method.

[0257] First, the materials used for the cover tapes in Examples 1A to 4A and Comparative Example 1A are shown. (Base layer) ・Antistatic polyethylene terephthalate film: E7415 (manufactured by Toyobo Co., Ltd., thickness 25 μm) (hereinafter also referred to as PET1A) ・Antistatic polyethylene terephthalate film: E7415 (manufactured by Toyobo Co., Ltd., thickness 16 μm) (hereinafter also referred to as PET2A) ・Antistatic polyethylene terephthalate film: E7415 (manufactured by Toyobo Co., Ltd., thickness 12 μm) (hereinafter also referred to as PET3A)

[0258] (Intermediate layer) - Low-density polyethylene (Sumikasen L705, manufactured by Sumitomo Chemical Co., Ltd.) (hereinafter also referred to as LDPE1A) - Styrene-ethylene-butylene-styrene block copolymer (ToughTec H1041, manufactured by Asahi Kasei Corporation) (hereinafter also referred to as SEBS1A) - A mixture of 75 parts by mass of LDPE1A and 25 parts by mass of SEBS1A (hereinafter also referred to as LDPE1A / SEBS1A)

[0259] (Sealant layer) ・Coating solution 1A Coating solution 1A was prepared by thoroughly dissolving 70 parts by mass of acrylic resin (B810, manufactured by Kusumoto Kasei Co., Ltd.) and 30 parts by mass of conductive polymer (polythiophene resin, CPA-24, manufactured by Kleva Co., Ltd.) in methyl ethyl ketone and adjusting the non-volatile component concentration to 12.5% ​​by mass. ・Coating solution 2A Coating solution 2A was prepared by thoroughly dissolving or dispersing 40 parts by mass of acrylic resin (B810, manufactured by Kusumoto Kasei Co., Ltd.) and 60 parts by mass of antimond-doped tin oxide (T-1, manufactured by Mitsubishi Materials Corporation) in methyl ethyl ketone and adjusting the non-volatile component concentration to 12.5% ​​by mass.

[0260] <Example 1A> Takelac A-3210 (manufactured by Mitsui Chemicals, Inc.) and Takenate A-3070 (manufactured by Mitsui Chemicals, Inc.) were mixed in a mass ratio of 3:1, and the resulting mixture was diluted with ethyl acetate to a mass ratio of 10 to prepare an anchor coating agent. Next, the anchor coating agent was applied to PET 1A by gravure coating to a wet film thickness of 4 μm and dried at 100°C. Next, an intermediate layer with a thickness of 25 μm was formed by extrusion lamination of LDPE 1A. Next, coating solution 1A was applied on the intermediate layer by gravure coating and dried to a thickness of 0.5 μm to form a sealant layer. Cover tape was then manufactured.

[0261] <Example 2A> A cover tape was prepared under the same conditions as in Example 1A, except that coating solution 1A was changed to coating solution 2A.

[0262] <Example 3A> A cover tape was prepared under the same conditions as in Example 1A, except that PET1A was changed to PET2A, the resin of the intermediate layer was changed from LDPE1A to SEBS1A, the thickness of the intermediate layer was changed from 25 μm to 34 μm, and coating solution 1A was changed to coating solution 2A.

[0263] <Example 4A> A cover tape was prepared under the same conditions as in Example 1A, except that PET1A was changed to PET3A, the resin of the intermediate layer was changed from LDPE1A to SEBS1A, the thickness of the intermediate layer was changed from 25 μm to 38 μm, and coating solution 1A was changed to coating solution 2A.

[0264] <Comparative Example 1A> A cover tape was prepared under the same conditions as in Example 1A, except that the resin of the intermediate layer was changed from LDPE1A to LDPE1A / SEBS1A, and coating solution 1A was changed to coating solution 2A.

[0265] The physical properties of the cover tapes of Examples 1A to 4A and Comparative Example 1A were measured using the following method. Furthermore, the cover tapes of Examples 1A to 4A and Comparative Example 1A were evaluated using the following method. The results are shown in Table 1.

[0266] <Diffuse light transmittance and total light transmittance at 630 nm> The total light transmittance and parallel line transmittance at 630 nm were measured for the cover tapes of Examples 1A to 4A and Comparative Example 1A using a UV-Vis near-infrared spectrophotometer (V-650, manufactured by JASCO Corporation) at a wavelength of 630 nm. The diffuse light transmittance at 630 nm was then calculated by subtracting the parallel line transmittance at 630 nm from the total light transmittance at 630 nm.

[0267] <Total Light Transmittance> For the cover tapes of Examples 1A to 4A and Comparative Example 1A, the total light transmittance measured at light source D65 was measured using a haze meter (NDH 2000, manufactured by Nippon Denshoku Industries Co., Ltd.) in accordance with JIS K 7361-1:1997.

[0268] <Diffuse light transmittance and total light transmittance at 470 nm> The total light transmittance and parallel line transmittance at 470 nm were measured for the cover tapes of Examples 1A to 4A and Comparative Example 1A using a UV-Vis near-infrared spectrophotometer (V-650, manufactured by JASCO Corporation) at a wavelength of 470 nm. The diffuse light transmittance at 470 nm was then calculated by subtracting the parallel line transmittance at 470 nm from the total light transmittance at 470 nm.

[0269] <Diffuse light transmittance and total light transmittance at 375 nm> The total light transmittance and parallel line transmittance at 375 nm were measured for the cover tapes of Examples 1A to 4A and Comparative Example 1A using a UV-Vis near-infrared spectrophotometer (V-650, manufactured by JASCO Corporation) at a wavelength of 375 nm. The diffuse light transmittance at 375 nm was then calculated by subtracting the parallel line transmittance at 375 nm from the total light transmittance at 375 nm.

[0270] <Diffuse light transmittance and total light transmittance at 900 nm> The total light transmittance and parallel line transmittance at 900 nm were measured for the cover tapes of Examples 1A to 4A and Comparative Example 1A using a UV-Vis near-infrared spectrophotometer (V-650, manufactured by JASCO Corporation) at a wavelength of 900 nm. The diffuse light transmittance at 900 nm was then calculated by subtracting the parallel line transmittance at 900 nm from the total light transmittance at 900 nm.

[0271] <Evaluation of Visibility During Camera Inspection Using Red Light Illumination> Electronic components with white printing are placed inside the electronic component packaging equipped with cover tape according to Examples 1A to 4A and Comparative Example 1A. Next, the electronic components are inspected by camera using red LED illumination through the cover tape, and the visibility of the white printing on the surface of the electronic components is evaluated based on the following criteria. A: Printing is clearly visible B: Printing is blurry but visible C: Printing is difficult to see

[0272]

[0273] <<Examples 1B to 4B and Comparative Example 1B>> The second embodiment of the present invention will be described in detail below with reference to Examples 1B to 4B and Comparative Example 1B. However, the second embodiment of the present invention is not limited in any way to the description of these examples.

[0274] The cover tapes for Examples 1B to 4B and Comparative Example 1B were prepared by the following method.

[0275] First, the materials used for the cover tapes in Examples 1B to 4B and Comparative Example 1B are shown. (Base layer) ・Antistatic polyethylene terephthalate film: E7415 (manufactured by Toyobo Co., Ltd., thickness 25 μm) (hereinafter also referred to as PET1B) ・Antistatic polyethylene terephthalate film: E7415 (manufactured by Toyobo Co., Ltd., thickness 16 μm) (hereinafter also referred to as PET2B) ・Antistatic polyethylene terephthalate film: E7415 (manufactured by Toyobo Co., Ltd., thickness 12 μm) (hereinafter also referred to as PET3B)

[0276] (Intermediate layer) - Low-density polyethylene (Sumikasen L705, manufactured by Sumitomo Chemical Co., Ltd.) (hereinafter also referred to as LDPE1B) - Styrene-ethylene-butylene-styrene block copolymer (ToughTec H1041, manufactured by Asahi Kasei Corporation) (hereinafter also referred to as SEBS1B) - A mixture of 75 parts by mass of LDPE1B and 25 parts by mass of SEBS1B (hereinafter also referred to as LDPE1B / SEBS1B)

[0277] (Sealant layer) ・Coating solution 1B Coating solution 1B was prepared by thoroughly dissolving 70 parts by mass of acrylic resin (B810, manufactured by Kusumoto Kasei Co., Ltd.) and 30 parts by mass of conductive polymer (polythiophene resin, CPA-24, manufactured by Kleva Co., Ltd.) in methyl ethyl ketone and adjusting the non-volatile component concentration to 12.5% ​​by mass. ・Coating solution 2B Coating solution 2B was prepared by thoroughly dissolving or dispersing 40 parts by mass of acrylic resin (B810, manufactured by Kusumoto Kasei Co., Ltd.) and 60 parts by mass of antimond-doped tin oxide (T-1, manufactured by Mitsubishi Materials Corporation) in methyl ethyl ketone and adjusting the non-volatile component concentration to 12.5% ​​by mass.

[0278] <Example 1B> Takelac A-3210 (manufactured by Mitsui Chemicals, Inc.) and Takenate A-3070 (manufactured by Mitsui Chemicals, Inc.) were mixed in a mass ratio of 3:1, and the resulting mixture was diluted with ethyl acetate to a mass ratio of 10 to prepare an anchor coating agent. Next, the anchor coating agent was applied to PET 1B by gravure coating to a wet film thickness of 4 μm and dried at 100°C. Next, an intermediate layer with a thickness of 25 μm was formed by extrusion lamination of LDPE 1B. Next, coating solution 1B was applied on the intermediate layer by gravure coating and dried to a thickness of 0.5 μm to form a sealant layer. Cover tape was then manufactured.

[0279] <Example 2B> A cover tape was prepared under the same conditions as in Example 1B, except that coating solution 1B was changed to coating solution 2B.

[0280] <Example 3B> A cover tape was prepared under the same conditions as in Example 1B, except that PET1B was changed to PET2B, the resin of the intermediate layer was changed from LDPE1B to SEBS1B, the thickness of the intermediate layer was changed from 25 μm to 34 μm, and coating liquid 1B was changed to coating liquid 2B.

[0281] <Example 4B> A cover tape was prepared under the same conditions as in Example 1B, except that PET1B was changed to PET3B, the resin of the intermediate layer was changed from LDPE1B to SEBS1B, the thickness of the intermediate layer was changed from 25 μm to 38 μm, and coating solution 1B was changed to coating solution 2B.

[0282] <Comparative Example 1B> A cover tape was prepared under the same conditions as in Example 1B, except that the resin of the intermediate layer was changed from LDPE1B to LDPE1B / SEBS1B, and coating solution 1B was changed to coating solution 2B.

[0283] The physical properties of the cover tapes of Examples 1B to 4B and Comparative Example 1B were measured using the following method. Furthermore, the cover tapes of Examples 1B to 4B and Comparative Example 1B were evaluated using the following method. The results are shown in Table 2.

[0284] <Diffuse light transmittance and total light transmittance at 470 nm> The total light transmittance and parallel line transmittance at 470 nm were measured for the cover tapes of Examples 1B to 4B and Comparative Example 1B using a UV-Vis near-infrared spectrophotometer (V-650, manufactured by JASCO Corporation) at a wavelength of 470 nm. The diffuse light transmittance at 470 nm was then calculated by subtracting the parallel line transmittance at 470 nm from the total light transmittance at 470 nm.

[0285] <Total Light Transmittance> For the cover tapes of Examples 1B to 4B and Comparative Example 1B, the total light transmittance measured at light source D65 was measured using a haze meter (NDH 2000, manufactured by Nippon Denshoku Industries Co., Ltd.) in accordance with JIS K 7361-1:1997.

[0286] <Evaluation of Visibility During Camera Inspection Using Blue Light Illumination> Examples 1B to 4B and Comparative Example 1B each contain electronic component packaging equipped with cover tape, with each electronic component having a metal part on its surface and a scratch on the metal part. Next, the electronic components are inspected with a camera using blue LED illumination through the cover tape, and the visibility of the scratches on the metal part is evaluated based on the following criteria: A: Scratches are clearly visible B: Scratches are blurred but visible C: Scratches are difficult to see

[0287]

[0288] <<Examples 1C to 3C and Comparative Examples 1C to 2C>> The third embodiment of the present invention will be described in detail below with reference to Examples 1C to 3C and Comparative Examples 1C to 2C. However, the third embodiment of the present invention is not limited in any way to the descriptions in these examples.

[0289] The cover tapes for Examples 1C to 3C and Comparative Examples 1C to 2C were prepared by the following method.

[0290] First, the materials used for the cover tapes in Examples 1C to 3C and Comparative Examples 1C to 2C are shown. (Base layer) ・Antistatic polyethylene terephthalate film: E7415 (manufactured by Toyobo Co., Ltd., thickness 25 μm) (hereinafter also referred to as PET1C) ・Antistatic polyethylene terephthalate film: E7415 (manufactured by Toyobo Co., Ltd., thickness 16 μm) (hereinafter also referred to as PET2C) ・Antistatic polyethylene terephthalate film: E7415 (manufactured by Toyobo Co., Ltd., thickness 12 μm) (hereinafter also referred to as PET3C)

[0291] (Intermediate layer) - Low-density polyethylene (Sumikasen L705, manufactured by Sumitomo Chemical Co., Ltd.) (hereinafter also referred to as LDPE1C) - Styrene-ethylene-butylene-styrene block copolymer (ToughTec H1041, manufactured by Asahi Kasei Corporation) (hereinafter also referred to as SEBS1C) - A mixture of 75 parts by mass of LDPE1C and 25 parts by mass of SEBS1C (hereinafter also referred to as LDPE1C / SEBS1C)

[0292] (Sealant layer) ・Coating solution 1C Coating solution 1C was prepared by thoroughly dissolving 70 parts by mass of acrylic resin (B810, manufactured by Kusumoto Kasei Co., Ltd.) and 30 parts by mass of conductive polymer (polythiophene resin, CPA-24, manufactured by Kleva Co., Ltd.) in methyl ethyl ketone and adjusting the non-volatile component concentration to 12.5% ​​by mass. ・Coating solution 2C Coating solution 2C was prepared by thoroughly dissolving or dispersing 40 parts by mass of acrylic resin (B810, manufactured by Kusumoto Kasei Co., Ltd.) and 60 parts by mass of antimond-doped tin oxide (T-1, manufactured by Mitsubishi Materials Corporation) in methyl ethyl ketone and adjusting the non-volatile component concentration to 12.5% ​​by mass.

[0293] <Example 1C> Takelac A-3210 (manufactured by Mitsui Chemicals, Inc.) and Takenate A-3070 (manufactured by Mitsui Chemicals, Inc.) were mixed in a mass ratio of 3:1, and the resulting mixture was diluted with ethyl acetate to a mass ratio of 10 to prepare an anchor coating agent. Next, the anchor coating agent was applied to PET 1 by gravure coating to a wet film thickness of 4 μm and dried at 100°C. Next, an intermediate layer with a thickness of 25 μm was formed by extrusion lamination of LDPE 1C. Next, coating solution 1C was applied on the intermediate layer by gravure coating and dried to a thickness of 0.5 μm to form a sealant layer. Cover tape was then manufactured.

[0294] <Example 2C> A cover tape was prepared under the same conditions as in Example 1C, except that coating solution 1C was changed to coating solution 2C.

[0295] <Example 3C> A cover tape was prepared under the same conditions as in Example 1C, except that PET1C was changed to PET2C, the resin of the intermediate layer was changed from LDPE1C to SEBS1C, the thickness of the intermediate layer was changed from 25 μm to 34 μm, and coating liquid 1C was changed to coating liquid 2C.

[0296] <Comparative Example 1C> A cover tape was prepared under the same conditions as in Example 1C, except that the resin of the intermediate layer was changed from LDPE1C to LDPE1C / SEBS1C, and coating solution 1C was changed to coating solution 2C.

[0297] <Comparative Example 2C> A cover tape was prepared under the same conditions as in Example 1C, except that PET1C was changed to PET3C, the resin of the intermediate layer was changed from LDPE1C to SEBS1C, the thickness of the intermediate layer was changed from 25 μm to 38 μm, and coating solution 1C was changed to coating solution 2C.

[0298] The physical properties of the cover tapes of Examples 1C to 3C and Comparative Examples 1C to 2C were measured using the following method. Furthermore, the cover tapes of Examples 1C to 3C and Comparative Examples 1C to 2C were evaluated using the following method. The results are shown in Table 3.

[0299] <Diffuse light transmittance and total light transmittance at 375 nm> The total light transmittance and parallel line transmittance at 375 nm were measured for the cover tapes of Examples 1C to 3C and Comparative Examples 1C to 2C using a UV-Vis near-infrared spectrophotometer (V-650, manufactured by JASCO Corporation) at a wavelength of 375 nm. The diffuse light transmittance at 375 nm was then calculated by subtracting the parallel line transmittance at 375 nm from the total light transmittance at 375 nm.

[0300] <Total Light Transmittance> For the cover tapes of Examples 1C to 3C and Comparative Examples 1C to 2C, the total light transmittance measured at light source D65 was measured using a haze meter (NDH 2000, manufactured by Nippon Denshoku Industries Co., Ltd.) in accordance with JIS K 7361-1:1997.

[0301] <Evaluation of Visibility During Camera Inspection Using Ultraviolet Light> Electronic components printed with black light ink are placed inside electronic component packaging equipped with cover tape according to Examples 1C to 3C and Comparative Examples 1C to 2C. Next, the electronic components are inspected with a camera using ultraviolet light through the cover tape, and the visibility of the printing on the surface of the electronic components is evaluated based on the following criteria: A: Printing is clearly visible B: Printing is blurry but visible C: Printing is difficult to see

[0302]

[0303] <<Examples 1D to 4D and Comparative Example 1D>> The fourth embodiment of the present invention will be described in detail below with reference to Examples 1D to 4D and Comparative Example 1D. However, the fourth embodiment of the present invention is not limited in any way to the descriptions in these examples.

[0304] The cover tapes for Examples 1D to 4D and Comparative Example 1D were prepared by the following method.

[0305] First, the materials used for the cover tapes in Examples 1D to 4D and Comparative Example 1D are shown. (Base layer) ・Antistatic polyethylene terephthalate film: E7415 (manufactured by Toyobo Co., Ltd., thickness 25 μm) (hereinafter also referred to as PET1D) ・Antistatic polyethylene terephthalate film: E7415 (manufactured by Toyobo Co., Ltd., thickness 16 μm) (hereinafter also referred to as PET2D) ・Antistatic polyethylene terephthalate film: E7415 (manufactured by Toyobo Co., Ltd., thickness 12 μm) (hereinafter also referred to as PET3D)

[0306] (Intermediate layer) - Low-density polyethylene (Sumikasen L705, manufactured by Sumitomo Chemical Co., Ltd.) (hereinafter also referred to as LDPE1D) - Styrene-ethylene-butylene-styrene block copolymer (ToughTec H1041, manufactured by Asahi Kasei Corporation) (hereinafter also referred to as SEBS1D) - A mixture of 75 parts by mass of LDPE1D and 25 parts by mass of SEBS1D (hereinafter also referred to as LDPE1D / SEBS1D)

[0307] (Sealant layer) ・Coating solution 1D Coating solution 1D was prepared by thoroughly dissolving 70 parts by mass of acrylic resin (B810, manufactured by Kusumoto Kasei Co., Ltd.) and 30 parts by mass of conductive polymer (polythiophene resin, CPA-24, manufactured by Kleva Co., Ltd.) in methyl ethyl ketone and adjusting the non-volatile component concentration to 12.5% ​​by mass. ・Coating solution 2D Coating solution 2D was prepared by thoroughly dissolving or dispersing 40 parts by mass of acrylic resin (B810, manufactured by Kusumoto Kasei Co., Ltd.) and 60 parts by mass of antimond-doped tin oxide (T-1, manufactured by Mitsubishi Materials Corporation) in methyl ethyl ketone and adjusting the non-volatile component concentration to 12.5% ​​by mass.

[0308] <Example 1D> Takelac A-3210 (manufactured by Mitsui Chemicals, Inc.) and Takenate A-3070 (manufactured by Mitsui Chemicals, Inc.) were mixed in a mass ratio of 3:1, and the resulting mixture was diluted with ethyl acetate to a mass ratio of 10 to prepare an anchor coating agent. Next, the anchor coating agent was applied to PET 1D by gravure coating to a wet film thickness of 4 μm and dried at 100°C. Next, an intermediate layer with a thickness of 25 μm was formed by extrusion lamination of LDPE 1D. Next, coating solution 1D was applied on the intermediate layer by gravure coating and dried to a thickness of 0.5 μm to form a sealant layer. Cover tape was then manufactured.

[0309] <Example 2D> A cover tape was prepared under the same conditions as in Example 1D, except that coating solution 1D was changed to coating solution 2D.

[0310] <Example 3D> A cover tape was prepared under the same conditions as in Example 1D, except that PET1D was changed to PET2D, the resin of the intermediate layer was changed from LDPE1D to SEBS1D, the thickness of the intermediate layer was changed from 25 μm to 34 μm, and coating liquid 1D was changed to coating liquid 2D.

[0311] <Example 4D> A cover tape was prepared under the same conditions as in Example 1D, except that PET1D was changed to PET3D, the resin of the intermediate layer was changed from LDPE1D to SEBS1D, the thickness of the intermediate layer was changed from 25 μm to 38 μm, and coating solution 1D was changed to coating solution 2D.

[0312] <Comparative Example 1D> A cover tape was prepared under the same conditions as in Example 1D, except that the resin of the intermediate layer was changed from LDPE1D to LDPE1D / SEBS1D, and coating solution 1D was changed to coating solution 2D.

[0313] The physical properties of the cover tapes of Examples 1D to 4D and Comparative Example 1D were measured using the following method. Furthermore, the cover tapes of Examples 1D to 4D and Comparative Example 1D were evaluated using the following method. The results are shown in Table 4.

[0314] <Diffuse light transmittance and total light transmittance at 900 nm> The total light transmittance and parallel line transmittance at 900 nm were measured for the cover tapes of Examples 1D to 4D and Comparative Example 1D using a UV-Vis-Near Infrared Spectrophotometer (V-650, manufactured by JASCO Corporation) at a wavelength of 900 nm. The diffuse light transmittance at 900 nm was then calculated by subtracting the parallel line transmittance at 900 nm from the total light transmittance at 900 nm.

[0315] <Total Light Transmittance> For the cover tapes of Examples 1D to 4D and Comparative Example 1D, the total light transmittance measured at light source D65 was measured using a haze meter (NDH 2000, manufactured by Nippon Denshoku Industries Co., Ltd.) in accordance with JIS K 7361-1:1997.

[0316] <Evaluation of Visibility During Camera Inspection Using Infrared Illumination> Electronic components with internal electrodes are placed inside electronic component packaging equipped with cover tape, as in Examples 1D to 4D and Comparative Example 1D. Next, the electronic components are inspected with a camera using infrared illumination through the cover tape, and the visibility of the internal electrodes visible through the resin portion of the surface of the electronic components is evaluated based on the following criteria: A: Internal electrodes can be seen without any problems B: Internal electrodes are blurred but can be seen C: Internal electrodes are difficult to see

[0317]

[0318] This application claims priority based on Japanese Patent Applications No. 2025-050051, No. 2025-050211, No. 2025-050236, and No. 2025-050589, filed on 25 March 2025, and incorporates all of their disclosures herein.

[0319] 1. Base layer 2. Intermediate layer 3. Sealant layer 10. Cover tape for electronic component packaging 20. Carrier tape 21. Pocket 100. Electronic component packaging

Claims

1. A cover tape for packaging electronic components, comprising a base layer and a sealant layer, wherein the diffuse light transmittance at a wavelength of 630 nm is 35% or less, according to Method 1 below. (Method 1) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 630 nm of the cover tape for packaging electronic components are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 630 nm.

2. A cover tape for packaging electronic components, comprising a base layer and a sealant layer, wherein the diffuse light transmittance at a wavelength of 470 nm is 40% or less, according to Method 2 below. (Method 2) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 470 nm of the cover tape for packaging electronic components are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 470 nm.

3. A cover tape for packaging electronic components, comprising a base layer and a sealant layer, wherein the diffuse light transmittance at a wavelength of 375 nm is 35% or less, according to Method 3 below. (Method 3) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 375 nm of the cover tape for packaging electronic components are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 375 nm.

4. A cover tape for packaging electronic components, comprising a base layer and a sealant layer, wherein the diffuse light transmittance at a wavelength of 900 nm is 30% or less, according to Method 4 below. (Method 4) Using an ultraviolet-visible-near-infrared spectrophotometer, the total light transmittance and the parallel line transmittance at a wavelength of 900 nm of the cover tape for packaging electronic components are measured, respectively. Then, the value obtained by subtracting the parallel line transmittance from the total light transmittance is taken as the diffuse light transmittance at a wavelength of 900 nm.

5. The cover tape for packaging electronic components according to any one of claims 1 to 4, wherein the thickness of the sealant layer is 0.01 μm or more and 15 μm or less.

6. The cover tape for packaging electronic components according to any one of claims 1 to 5, wherein the sealant layer comprises one or more selected from the group consisting of styrene resin, (meth)acrylic resin, olefin resin, urethane resin, and ester resin.

7. The cover tape for packaging electronic components according to any one of claims 1 to 6, wherein the thickness of the base material layer is 5 μm or more and 50 μm or less.

8. The cover tape for packaging electronic components according to any one of claims 1 to 7, wherein the base layer comprises one or more resins selected from the group consisting of ester resins, amide resins, olefin resins, (meth)acrylic resins, imide resins, carbonate resins, and acrylonitrile-butadiene-styrene resins.

9. The cover tape for packaging electronic components according to any one of claims 1 to 8, further comprising an intermediate layer between the base material layer and the sealant layer.

10. The cover tape for packaging electronic components according to claim 9, wherein the intermediate layer comprises one or more selected from the group consisting of polyacrylic acid derivatives, polyacrylic acid ester derivatives, polyvinyl acetate derivatives, styrene resins, olefin resins, and cyclic olefin resins.

11. The cover tape for packaging electronic components according to claim 9 or 10, wherein the thickness of the intermediate layer is 10 μm or more and 60 μm or less.

12. A cover tape for packaging electronic components according to any one of claims 1 to 11, wherein the total light transmittance at a wavelength of 630 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more.

13. A cover tape for packaging electronic components according to any one of claims 1 to 12, wherein the total light transmittance at a wavelength of 470 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more.

14. A cover tape for packaging electronic components according to any one of claims 1 to 13, wherein the total light transmittance at a wavelength of 375 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more.

15. A cover tape for packaging electronic components according to any one of claims 1 to 14, wherein the total light transmittance at a wavelength of 900 nm, as measured using an ultraviolet-visible-near-infrared spectrophotometer, is 50% or more.

16. A cover tape for packaging electronic components according to any one of claims 1 to 15, wherein the total light transmittance measured with light source D65 in accordance with JIS K 7361-1:1997 is 50% or more.

17. An electronic component packaging comprising a carrier tape having a recess, an electronic component housed in the recess, and a cover tape for packaging electronic components according to any one of claims 1 to 16, wherein the sealant layer is adhered to the carrier tape to enclose the electronic component.

18. A method for manufacturing an electronic component package, comprising: an adhesion step of adhering an electronic component packaging cover tape according to any one of claims 1 to 16 to a carrier tape containing electronic components in recesses to obtain an electronic component package; and a camera inspection step of inspecting the electronic components in the electronic component package using red light illumination through the electronic component packaging cover tape.

19. A method for manufacturing an electronic component package, comprising: an adhesion step of adhering an electronic component packaging cover tape according to any one of claims 1 to 16 to a carrier tape containing electronic components in recesses to obtain an electronic component package; and a camera inspection step of inspecting the electronic components in the electronic component package using blue light illumination through the electronic component packaging cover tape.

20. A method for manufacturing an electronic component package, comprising: an adhesion step of adhering an electronic component packaging cover tape according to any one of claims 1 to 16 to a carrier tape containing electronic components in recesses to obtain an electronic component package; and a camera inspection step of inspecting the electronic components in the electronic component package using ultraviolet illumination through the electronic component packaging cover tape.

21. A method for manufacturing an electronic component package, comprising: an adhesion step of adhering an electronic component packaging cover tape according to any one of claims 1 to 16 to a carrier tape containing electronic components in recesses to obtain an electronic component package; and a camera inspection step of inspecting the electronic components in the electronic component package using infrared illumination through the electronic component packaging cover tape.

22. A method for inspecting an electronic component package, wherein the electronic component package comprises a carrier tape having a recess, an electronic component housed in the recess, and a cover tape for electronic component packaging according to any one of claims 1 to 16, the sealant layer being adhered to the carrier tape so as to enclose the electronic component, and the method further comprises a camera inspection step of inspecting the electronic component in the electronic component package through the cover tape for electronic component packaging using red light illumination.

23. A method for inspecting an electronic component package, wherein the electronic component package comprises a carrier tape having a recess, an electronic component housed in the recess, and a cover tape for electronic component packaging according to any one of claims 1 to 16, the sealant layer being adhered to the carrier tape so as to enclose the electronic component, and the method further comprises a camera inspection step of inspecting the electronic component in the electronic component package through the cover tape for electronic component packaging using blue light illumination.

24. A method for inspecting an electronic component package, wherein the electronic component package comprises a carrier tape having a recess, an electronic component housed in the recess, and a cover tape for electronic component packaging according to any one of claims 1 to 16, the sealant layer being adhered to the carrier tape so as to enclose the electronic component, and the method further comprises a camera inspection step of inspecting the electronic component in the electronic component package using ultraviolet illumination through the cover tape for electronic component packaging.

25. A method for inspecting an electronic component package, wherein the electronic component package comprises a carrier tape having a recess, an electronic component housed in the recess, and a cover tape for electronic component packaging according to any one of claims 1 to 16, the sealant layer being adhered to the carrier tape so as to enclose the electronic component, and the method further comprises a camera inspection step of inspecting the electronic component in the electronic component package using infrared illumination through the cover tape for electronic component packaging.

Images