Anisotropic electrically conductive member and joined body

Abstract

Provided is an anisotropic electrically conductive member and a joined body that can be easily aligned. The joined body comprises: an anisotropic electrically conductive member that has an insulating film having electrically insulating properties, and a plurality of conductors that penetrate in the thickness direction of the insulating film and are provided in a state of being electrically insulated from each other; and a member to be joined that is joined to the anisotropic electrically conductive member. In the anisotropic electrically conductive member, a recess is provided on at least one surface side of the insulating film, the member to be joined has a protrusion that is provided at a position opposite to the recess of the anisotropic electrically conductive member, and the recess of the anisotropic electrically conductive member and the protrusion of the member to be joined are fitted to each other.

Description

Anisotropic conductive members and joints

[0001] The present invention relates to an anisotropic conductive member having a plurality of conductors that penetrate an insulating film in the thickness direction and are provided in a state of being electrically insulated from one another, and to a joint between the anisotropic conductive member and a member to be joined, and more particularly to an anisotropic conductive member and a joint in which at least one of a recess and a protrusion is provided on at least one side of the insulating film.

[0002] There is an anisotropic conductive member having multiple conductors that penetrate an insulating film in the thickness direction and are electrically insulated from one another. By inserting the anisotropic conductive member between an electronic component such as a semiconductor element and a circuit board and applying pressure, an electrical connection between the electronic component and the circuit board can be obtained. For this reason, the anisotropic conductive member is used as an electrical connection member to electrically connect electronic components such as semiconductor elements, and a specific example is shown in Patent Document 1, for example.

[0003] For example, Patent Document 1 describes a method for manufacturing a multilayer wiring board comprising an anisotropic conductive bonding member and a wiring board having a plurality of electrodes, wherein the anisotropic conductive bonding member has an insulating substrate made of an inorganic material and a plurality of conductive passages made of a conductive material that penetrate the insulating substrate in the thickness direction and are insulated from each other, the plurality of conductive passages have protruding portions that protrude from the surface of the insulating substrate, the height of the plurality of electrodes on the wiring board is 10 μm or less, and the method for manufacturing a multilayer wiring board comprises, in this order, a temporary bonding process in which the anisotropic conductive bonding member and the wiring board are bonded using a non-conductive thermosetting resin, and a final bonding process in which the conductive passages on the anisotropic conductive bonding member and the electrodes on the wiring board are electrically bonded by heating at a temperature below the curing temperature of the thermosetting resin.

[0004] Japanese Patent Publication No. 2018-037509

[0005] When joining an anisotropic conductive bonding member to a semiconductor element using the anisotropic conductive bonding member described in Patent Document 1 above as an electrical connecting member, alignment between the anisotropic conductive bonding member and the semiconductor element is important. For this reason, a mounting machine such as a chip mounter is used to acquire images of the alignment marks of the anisotropic conductive bonding member and the semiconductor element during joining and perform alignment. However, the positions of the anisotropic conductive bonding member and the semiconductor element may shift during joining, and the positional accuracy of the anisotropic conductive bonding member and the semiconductor element after joining is not always sufficient. It is desirable to easily achieve alignment in order to obtain positional accuracy. The object of the present invention is to provide an anisotropic conductive member and a bonded body that can be easily aligned.

[0006] The above objectives can be achieved by the following configurations. Invention [1] is an anisotropic conductive member having an insulating film having electrical insulating properties and a plurality of conductors that penetrate the insulating film in the thickness direction and are provided in a state where they are electrically insulated from one another, and at least one of recesses and protrusions is provided on at least one side of the insulating film. Invention [2] is the anisotropic conductive member according to Invention [1], wherein the recess is a region in which the thickness in the thickness direction of the insulating film is thinner with respect to the surface of the insulating film. Invention [3] is the anisotropic conductive member according to Invention [1] or [2], wherein the conductor has protrusions that protrude from at least one side of the insulating film, and the recess is a region in which the length of the protrusions is shorter than the average length of the plurality of protrusions from the surface of the insulating film. Invention [4] is the anisotropic conductive member according to any one of Inventions [1] to [3], wherein the protrusions are provided on the conductors. Invention [5] is the anisotropic conductive member according to any one of Inventions [1] to [4], wherein the protrusions are made of an insulating material having electrical insulating properties. Invention [6] is an anisotropic conductive member according to any one of Inventions [1] to [5], wherein the insulating film is an anodized film of aluminum.

[0007] Invention [7] is a joint comprising an anisotropic conductive member having an insulating film having electrical insulating properties and a plurality of conductors that penetrate the thickness direction of the insulating film and are provided in a state of being electrically insulated from each other, and a member to be joined to the anisotropic conductive member, wherein the anisotropic conductive member has a recess provided on at least one side of the insulating film, and the member to be joined has a protrusion provided at a position opposite to the recess of the anisotropic conductive member, and the recess of the anisotropic conductive member and the protrusion of the member to be joined fit together. Invention [8] is a joint comprising an anisotropic conductive member having an insulating film having electrical insulating properties and a plurality of conductors that penetrate the thickness direction of the insulating film and are provided in a state of being electrically insulated from each other, and a member to be joined to the anisotropic conductive member, wherein the anisotropic conductive member has a protrusion provided on at least one side of the insulating film, and the member to be joined has a recess provided at a position opposite to the protrusion of the anisotropic conductive member, and the protrusion of the anisotropic conductive member and the recess of the member to be joined fit together.

[0008] Invention [9] is the joint according to Invention [7], wherein the recess of the anisotropic conductive member is a region in which the thickness in the thickness direction of the insulating film is thinner with respect to the surface of the insulating film. Invention

[10] is the joint according to Invention [7], wherein the conductor of the anisotropic conductive member has a projection that protrudes from at least one surface of the insulating film, and the recess of the anisotropic conductive member is a region in which the length of the projection is shorter than the average length of the plurality of projections from the surface of the insulating film. Invention

[11] is the joint according to Invention [8], wherein the convex portion of the anisotropic conductive member is provided on the conductor. Invention

[12] is the joint according to any one of Inventions [7], [9], and

[10] , wherein the convex portion of the member to be joined is made of an insulating material having electrical insulating properties. Invention

[14] is a bonded body according to any one of Inventions [7] to

[13] , wherein the member to be joined has at least one electrode. Invention

[15] is a bonded body according to any one of Inventions [7] to

[13] , wherein the member to be joined has a plurality of electrodes and has recesses or protrusions between the electrodes. Invention

[16] is a bonded body according to any one of Inventions [7] to

[15] , wherein the insulating film is an anodized film of aluminum.

[0009] According to the present invention, it is possible to provide anisotropic conductive members and joints that are easy to align.

[0010] This is a schematic cross-sectional view showing a first example of a joint according to an embodiment of the present invention. This is a schematic cross-sectional view showing a first example of an anisotropic conductive member according to an embodiment of the present invention. This is a schematic cross-sectional view showing a modified example of the first example of an anisotropic conductive member according to an embodiment of the present invention. This is a schematic cross-sectional view showing a second example of a joint according to an embodiment of the present invention. This is a schematic cross-sectional view showing a second example of an anisotropic conductive member according to an embodiment of the present invention. This is a schematic cross-sectional view showing a third example of a joint according to an embodiment of the present invention. This is a schematic cross-sectional view showing a fourth example of a joint according to an embodiment of the present invention. This is a schematic cross-sectional view showing a fifth example of a joint according to an embodiment of the present invention. This is a schematic diagram showing a first example of the arrangement pattern of convex and concave portions of an anisotropic conductive member according to an embodiment of the present invention. This is a schematic diagram showing a second example of the arrangement pattern of convex and concave portions of an anisotropic conductive member according to an embodiment of the present invention. This is a schematic diagram showing a third example of the arrangement pattern of convex and concave portions of an anisotropic conductive member according to an embodiment of the present invention.

[0011] The anisotropic conductive member and joint of the present invention will be described in detail below based on preferred embodiments shown in the attached drawings. The figures described below are illustrative for illustrating the present invention and have been simplified or exaggerated for illustrative purposes. Therefore, the present invention is not limited to the figures shown below. In the following, the "~" indicating a numerical range includes the numerical values ​​indicated on both sides. For example, ε is the numerical value ε α ~ numerical value ε β The range of ε is the numerical value ε α and the numerical value ε α This range includes ε α ≦ε≦ε α The following describes anisotropic conductive members and joints in detail. Regarding parallelism and orthogonality, unless otherwise specified, the error ranges generally accepted in the relevant technical field are included. Regarding temperature, time, and pressure, unless otherwise specified, the error ranges generally accepted in the relevant technical field are included. Similarly, regarding "same," unless otherwise specified, the error ranges generally accepted in the relevant technical field are included.

[0012] [First Example of a Joined Body] Figure 1 is a schematic cross-sectional view showing a first example of a joined body according to an embodiment of the present invention. Figure 2 is a schematic cross-sectional view showing a first example of an anisotropic conductive member according to an embodiment of the present invention. The joined body 10 has a configuration in which an anisotropic conductive member 12 and a member to be joined 14 are laminated and joined. The direction in which the anisotropic conductive member 12 and the member to be joined 14 are laminated is the lamination direction Ds. It is preferable that the thickness direction Dt of the insulating film 50 of the anisotropic conductive member 12 and the lamination direction Ds are substantially parallel.

[0013] The anisotropic conductive member 12 will be described in detail later, but it has an insulating film 50 having electrical insulating properties and a plurality of conductors 52 that penetrate the insulating film 50 in the thickness direction Dt. The conductors 52 are columnar bodies and are provided within the insulating film 50 in a state where they are electrically insulated from each other. The plurality of conductors 52 each function as an electrical conduction path. The anisotropic conductive member 12 has anisotropic conductivity and, as described above, has conductivity in the thickness direction Dt, but its conductivity in the direction parallel to the surface 50a of the insulating film 50 is sufficiently low. The plurality of conductors 52 each have, for example, protrusions 52a, 52b that protrude from at least one surface of the insulating film 50. The conductors 52 are physically and electrically joined to the electrodes 22, 23, and 24 of the member to be joined 14. For this reason, it is preferable that the conductors 52 facing the electrodes 22, 23, and 24 have protrusions 52a, 52b. The surface 12a of the anisotropic conductive member 12 is the surface 50a of the insulating film 50. The back surface 12b of the anisotropic conductive member 12 is the back surface 50b of the insulating film 50. The front surface 12a and the back surface 12b of the anisotropic conductive member 12 are opposing surfaces in the thickness direction Dt of the insulating film 50. The anisotropic conductive member 12 is configured such that at least one of a recess and a protrusion is provided on at least one side of the insulating film 50. In the example of Figure 1, the anisotropic conductive member 12 has one recess 55 provided on the back surface 50b side of the insulating film 50.

[0014] As described above, the conductor 52 has a protrusion 52a that protrudes from the surface 50a of the insulating film 50 and a protrusion 52b that protrudes from the back surface 50b of the insulating film 50. As shown in Figure 2, the recess 55 is a region where the average protrusion length hs of the protrusions 52b from the back surface 50b of the insulating film 50 is shorter than the average protrusion length h of the multiple protrusions 52b from the back surface 50b of the insulating film 50. The average protrusion length h of the protrusions 52b from the back surface 50b of the insulating film 50 is the average length of the protrusions 52b before the recess 55 was formed. The average protrusion length hs of the protrusions 52b in the recess 55 from the back surface 50b of the insulating film 50 is the average length of the protrusions 52b in the corresponding region after the recess 55 was formed. When the protrusions 52b are removed up to the back surface 50b of the insulating film 50, that is, when there are no protrusions 52b, the length of the protrusions 52b becomes zero, but the recess 55 includes the state where the average protrusion length hs of the protrusions 52b is zero.

[0015] Here, the average protrusion length h of the protrusion portion 52a from the surface 50a of the insulating film 50 and the average protrusion length h of the protrusion portion 52b from the back surface 50b of the insulating film 50 are measured, for example, as follows. First, the insulating film 50 is cut in the thickness direction Dt using a focused ion beam (FIB) to expose the conductor, and then an image of the conductor including the protrusion is obtained using a scanning electron microscope. Based on the image of the conductor including the protrusion, 10 measurement points are arbitrarily set at locations corresponding to the protrusion on the surface side of the insulating film. The lengths of the 10 set points are measured, and the average value of the measured lengths of the 10 points is calculated. The average value of the lengths of the 10 points in the corresponding locations is the average protrusion length h of the protrusion portion 52a from the surface 50a of the insulating film 50. Also, based on the image of the conductor including the protrusion, 10 measurement points are arbitrarily set at locations corresponding to the protrusion on the back side of the insulating film. The lengths of the 10 set points are measured, and the average value of the measured lengths of the 10 points is calculated. The average length of the 10 points in the relevant location is the average protrusion length h of the protruding portion 52a from the back surface 50b of the insulating film 50. The average protrusion length hs of the protruding portion of the recess is measured, for example, as follows: First, as described above, the insulating film 50 is cut using a focused ion beam in the thickness direction Dt to expose the conductor, and then an image of the conductor including the protruding portion is obtained using a scanning electron microscope. Based on the image of the conductor including the protruding portion, 10 measurement points are arbitrarily set in the location corresponding to the protruding portion of the recess. The lengths of the 10 set points are measured, and the average value of the measured lengths of the 10 points is calculated. The average length of the 10 points in the relevant location is the average protrusion length hs of the protruding portion of the recess.

[0016] The member to be joined 14 shown in Figure 1 includes, for example, a substrate 20, electrodes 22, 23, and 24 provided on the surface 20a of the substrate 20, an insulating layer 25 that electrically insulates electrodes 23 and 24 from each other, and a protrusion 26 provided on the surface 20a of the substrate 20 between electrodes 22 and 23. The protrusion 26 is provided at a position opposite to a recess 55 of the anisotropic conductive member 12. The recess 55 of the anisotropic conductive member 12 and the protrusion 26 of the member to be joined 14 are used to align the anisotropic conductive member 12 and the member to be joined 14. The anisotropic conductive member 12 and the member to be joined 14 are positioned by fitting together the recess 55 of the anisotropic conductive member 12 and the protrusion 26 of the member to be joined 14. This suppresses misalignment of the anisotropic conductive member 12 and the member to be joined 14 during joining, and makes it easy to align the anisotropic conductive member 12 and the member to be joined 14 to obtain positional accuracy. Furthermore, the protrusions 26 are composed of, for example, an insulating material having electrical insulating properties, and also function as an insulating layer that electrically insulates electrodes 22 and 23 from each other. The insulating material having electrical insulating properties that constitutes the protrusions 26 of the member to be joined 14 is, for example, polyimide or polybenzoxazole (PBO). Polyimide and polybenzoxazole (PBO) are preferred because they have excellent electrical insulating properties. The protrusions 26 can also be composed of, for example, a resist film composed of a known photosensitive resin composition. The protrusions 26 can be formed, for example, by an inkjet method, a pattern coating method, or a photolithography method. The arrangement pattern of the protrusions 26 is not particularly limited. The insulating layer 25 is not particularly limited in its composition as long as it can prevent conductivity between electrodes, and for example, it can be composed of polyimide or polybenzoxazole (PBO), similar to the protrusions 26 of the member to be joined 14. The insulating layer 25 can also be composed of a resist film. Electrodes 22, 23, and 24 are composed of, for example, Cu, Au, Ag, Ni, or Al. Cu, Au, Ag, Ni, or Al may be individual metals or alloys thereof. An example of an alloy is an Al-Si alloy. Cu, Au, Ag, Ni, and Al, as well as their alloys, are preferred because they provide good bonding with the anisotropic conductive member.

[0017] The electrodes 22, 23, 24 and the insulating layer 25 are at the same height from the surface 20a of the substrate 20. That is, the electrodes 22, 23, 24 and the insulating layer 25 are at the same height. The protrusion 26 is at a greater height from the surface 20a of the substrate 20 than the surface 22a of the electrode 22, and protrudes toward the anisotropic conductive member 12 side than the surface 22a of the electrode 22. In the configuration of the bonded body 10 in Figure 1, the maximum amount of protrusion hp of the protrusion 26 from the surface 22a of the electrode 22 of the bonded member 14 is the distance from the surface 22a of the electrode 22 of the bonded member 14 to the surface of the insulating film 50 of the opposing anisotropic conductive member 12, which is the back surface 50b in Figure 1. The amount of protrusion hp of the protrusion 26 is based on the surface 22a of the electrode 22 of the bonded member 14. The minimum amount of protrusion hp of the protrusion 26 is 20% of the distance from the surface 22a of the electrode 22 of the bonded member 14 to the back surface 50b.

[0018] The amount of protrusion hp of the convex portion 26 from the surface 22a of the electrode 22 is the distance from the surface 22a of the electrode 22 to the furthest end of the convex portion 26. The amount of protrusion hp can be measured, for example, as follows: First, the bonded body 10 is cut in the stacking direction Ds using a microtome or the like to expose the cross-section, and then the cross-section of the convex portion 26 is photographed to obtain a cross-sectional image. In the cross-sectional image, the portion corresponding to the surface 22a of the electrode 22 and the portion corresponding to the end of the convex portion 26 are identified, and the amount of protrusion hp can be obtained by measuring the distance between the two identified portions. Alternatively, the amount of protrusion hp of the convex portion 26 can be measured from the side of the bonded member 14 facing the surface 22a of the electrode 22 using a three-dimensional measuring machine or a laser microscope.

[0019] The heights of electrodes 22, 23, 24 and the insulating layer 25 are measured, for example, as follows. First, as described above, the bonded body 10 is cut in the stacking direction Ds using a microtome or the like to expose the cross-section. Then, a cross-sectional image is obtained by photographing the cross-section of electrodes 22, 23, 24 and the insulating layer 25, including the surface 20a of the substrate 20. In the cross-sectional image, 10 measurement points are arbitrarily set at locations corresponding to the respective heights of electrodes 22, 23, 24 and the insulating layer 25 from the surface 20a of the substrate 20. The lengths of the 10 set points are measured, and the average value of the measured lengths of the 10 points is calculated. The average value of the lengths of the 10 points in the corresponding locations is the respective height of electrodes 22, 23, 24 and the insulating layer 25 from the surface 20a of the substrate 20. Since the heights of electrodes 22, 23, 24 and the insulating layer 25 are the same, it is sufficient to measure the height of electrode 22 among electrodes 22, 23, 24 and the insulating layer 25. As described above, in the joint 10, the anisotropic conductive member 12 is provided with a recess 55 and the member to be joined 14 is provided with a protrusion 26, which facilitates alignment. Furthermore, the anisotropic conductive member 12 can also be easily aligned with the member to be joined 14.

[0020] Here, Figure 3 is a schematic cross-sectional view showing a modified example of the first example of the anisotropic conductive member according to an embodiment of the present invention. Figure 3 shows an enlarged view of a part of the anisotropic conductive member 12. In Figure 3, the same reference numerals are used for components identical to the joint 10 shown in Figure 1 and the anisotropic conductive member 12 shown in Figure 2, and their detailed descriptions are omitted. The recess 55 of the anisotropic conductive member 12 is not particularly limited to the configurations shown in Figures 1 and 2. For example, as in the anisotropic conductive member 12 shown in Figure 3, the recess 56 may be a region where the thickness in the thickness direction Dt of the insulating film 50 is thinner than the surface of the insulating film 50, or in the configuration of Figure 1, the back surface 50b. The bottom surface 56b of the recess 56 is located on the surface 50a (see Figure 2) side of the back surface 50b of the insulating film 50. The depth δc of the recess 56 is based on the back surface 50b of the insulating film 50. If the recess 56 is provided on the surface 50a of the insulating film 50, the reference for the depth δc of the recess 56 is the surface 50a of the insulating film 50. The depth δc of the recess 56 extending from the back surface 50b to the bottom surface 56b of the insulating film 50 is appropriately determined by the amount of protrusion hp of the convex portion 26 that fits into the recess 56. By providing the recess 56, the amount of protrusion hp of the convex portion 26 can be increased compared to the recess 55 shown in Figures 1 and 2. In other words, the height of the convex portion 26 can be increased.

[0021] The recess 56 can be formed, for example, by pattern etching or dicing. The depth δc of the recess 56 is obtained by measuring the length of the portion corresponding to the depth δc of the recess 56 in a cross-sectional image of the insulating film 50. The cross-sectional image of the insulating film 50 is obtained, for example, by cutting the insulating film 50 in the thickness direction Dt using a focused ion beam as described above to expose the cross-section of the insulating film 50, and then photographing the cross-section of the insulating film 50. The upper limit of the depth δc of the recess 56 is, for example, 50% of the thickness of the insulating film 50. When the recess 56 is provided in the anisotropic conductive member 12, the amount of protrusion hp of the convex portion 26 from the surface 22a of the electrode 22 is at most the distance to the bottom surface 56b of the opposing recess 56. The minimum amount of protrusion hp of the convex portion 26 is 20% of the depth δc of the recess 56.

[0022] [Second Example of Joined Body] Figure 4 is a schematic cross-sectional view showing a second example of a joined body according to an embodiment of the present invention. Figure 5 is a schematic cross-sectional view showing a second example of an anisotropic conductive member according to an embodiment of the present invention. In Figures 4 and 5, the same reference numerals are used for components identical to those in the joined body 10 shown in Figure 1 and the anisotropic conductive member 12 shown in Figure 2, and their detailed descriptions are omitted. The joined body 10a shown in Figure 4 differs from the joined body 10 shown in Figure 1 in that the anisotropic conductive member 12 has a protrusion 57 and the member to be joined 14 has a recess 27, but the other configurations are the same as those of the joined body 10 shown in Figure 1. In the joined body 10a as well, it is preferable that the thickness direction Dt of the insulating film 50 of the anisotropic conductive member 12 and the lamination direction Ds are substantially parallel. In the joined body 10a, the recess 27 of the member to be joined 14 is provided at a position opposite to the protrusion 57 of the anisotropic conductive member 12. The protrusion 57 of the anisotropic conductive member 12 and the recess 27 of the member to be joined 14 are used for aligning the anisotropic conductive member 12 and the member to be joined 14. The anisotropic conductive member 12 and the member to be joined 14 are positioned by fitting together the protrusion 57 of the anisotropic conductive member 12 and the recess 27 of the member to be joined 14. This suppresses misalignment of the anisotropic conductive member 12 and the member to be joined 14 during joining, and makes it easy to align the anisotropic conductive member 12 and the member to be joined 14 to obtain positional accuracy. The recess 27 of the member to be joined 14 is, for example, the gap between electrode 22 and electrode 23, and nothing such as an insulating layer is provided in the gap between electrode 22 and electrode 23. The depth of the recess 27 is the height from the surface 20a of the substrate 20 to the surface 22a of electrode 22. The method for measuring the height of electrode 22 is as described above.

[0023] The protrusion 57 of the anisotropic conductive member 12 is provided, for example, on the conductor 52. The protrusion 57 spans across the protrusions 52b of multiple conductors 52 and protrudes toward the member to be joined 14. The protrusion 57 fits into the recess 27 between the electrode 22 and the electrode 23, thereby positioning and aligning the anisotropic conductive member 12 and the member to be joined 14.

[0024] The height hm of the protrusion 57 from the conductor 52 is, in the configuration of the joint 10a in Figure 4, at most the distance Lm from the surface 22a of the electrode 22 of the opposing member to be joined 14 to the surface 20a of the substrate 20. The above-mentioned distance Lm corresponds to the height of the electrode 22. The method for measuring the height of the electrode 22 is as described above. The height hm of the protrusion 57 is based on the position of the average protrusion length h of the protrusion 52b of the conductor 52. The minimum height hm of the protrusion 57 is 20% of the distance Lm from the surface 22a of the electrode 22 of the member to be joined 14 to the surface 20a of the substrate 20. The height hm of the protrusion 57 from the conductor 52 is the distance from the position of the average protrusion length h of the protrusion 52b of the conductor 52 to the end of the protrusion 57. The height hm of the protrusion 57 is obtained by acquiring a cross-sectional image of the bonded body 10a, identifying the location corresponding to the average protrusion length h of the protrusion 52b of the conductor 52 and the location corresponding to the end of the protrusion 57, and measuring the distance between the two identified locations. The above-mentioned cross-sectional image of the bonded body 10a is obtained by cutting the bonded body 10a in the stacking direction Ds using a microtome or the like to expose the cross-section and then taking a photograph. The method for measuring the average protrusion length h of the protrusion 52b of the conductor 52 is as described above. In addition, the height hm of the protrusion 57 of the anisotropic conductive member 12 can be measured from the back surface 50b side of the insulating film 50 using a three-dimensional measuring machine or laser microscope. The protrusion 57 is made of polyimide or polybenzoxazole (PBO), similar to the protrusion 26 of the bonded member 14 shown in Figure 1, and can also be made of a resist film. The protrusion 57 can be formed, for example, by an inkjet method, a pattern coating method, or a photolithography method. The arrangement pattern of the protrusion 57 is not particularly limited. As described above, in the joint 10a, the anisotropic conductive member 12 is provided with a protrusion 57 and the member to be joined 14 is provided with a recess 27, which facilitates alignment. Furthermore, the anisotropic conductive member 12 can also be easily aligned with the member to be joined 14.

[0025] [Third Example of Joint] Figure 6 is a schematic cross-sectional view showing a third example of a joint according to an embodiment of the present invention. In Figure 6, the same reference numerals are used for components identical to those in the joint 10 shown in Figure 1 and the anisotropic conductive member 12 shown in Figure 2, and their detailed descriptions are omitted. The joint 10b shown in Figure 6 differs from the joint 10 shown in Figure 1 in the position where the recess 55 of the anisotropic conductive member 12 is provided, the configuration of the member to be joined 14, and the position where the protrusion 28 of the member to be joined 14 is provided, but the other configurations are the same as those of the joint 10 shown in Figure 1. The member to be joined 14 has electrodes 22 and 23 provided on the surface 20a of the substrate 20. An insulating layer 25 is provided to electrically insulate electrodes 22 and 23 from each other. Also, a protrusion 28 is provided on the surface 20a of the substrate 20, away from electrodes 22 and 23. The anisotropic conductive member 12 has a recess 55 provided at a position opposite to the protrusion 28.

[0026] The electrodes 22 and 23 of the member to be joined 14 are at the same height from the surface 20a of the substrate 20. That is, electrodes 22 and 23 are at the same height. The protrusion 28, like the protrusion 26 shown in Figure 1, is at a greater height from the surface 20a of the substrate 20 than the surface 22a of the electrode 22, and protrudes toward the anisotropic conductive member 12 side from the surface 22a of the electrode 22. The maximum amount of protrusion hp of the protrusion 28 from the surface 22a of the electrode 22 in the configuration of the joined body 10b in Figure 6 is the distance from the surface 22a of the electrode 22 of the member to be joined 14 to the surface of the insulating film 50 of the opposing anisotropic conductive member 12, which is the back surface 50b in Figure 6. The minimum amount of protrusion hp of the protrusion 28 is 20% of the distance from the surface 22a of the electrode 22 of the member to be joined 14 to the back surface 50b. The amount of protrusion hp of the protrusion 28 from the surface 22a of the electrode 22 is the distance from the surface 22a of the electrode 22 to the furthest end of the protrusion 28. The amount of protrusion hp of the convex portion 28 is based on the surface 22a of the electrode 22 of the member to be joined 14. The amount of protrusion hp of the convex portion 28 is obtained by acquiring a cross-sectional image of the joined body 10b, identifying the location corresponding to the surface 22a of the electrode 22 and the location corresponding to the end of the convex portion 28, and measuring the distance between the two identified locations. The above-mentioned cross-sectional image of the joined body 10b is obtained by cutting the joined body 10b in the stacking direction Ds using a microtome or the like to expose the cross-section and then taking a photograph. Alternatively, the amount of protrusion hp of the convex portion 28 can be measured from the side of the surface 22a of the electrode 22 of the member to be joined 14 using a three-dimensional measuring machine or laser microscope.

[0027] The protrusions 28 of the member to be joined 14 are made of polyimide or polybenzoxazole (PBO), similar to the protrusions 26 of the member to be joined 14 shown in Figure 1, and can also be made of a resist film. The protrusions 28 can be formed by, for example, an inkjet method, a pattern coating method, or a photolithography method, similar to the protrusions 26 shown in Figure 1. The arrangement pattern of the protrusions 28 is not particularly limited. As described above, in the joined body 10b, the recesses 55 are provided in the anisotropic conductive member 12 and the protrusions 28 are provided in the member to be joined 14, making alignment easier. Furthermore, the anisotropic conductive member 12 can also be easily aligned with the member to be joined 14.

[0028] [Fourth Example of a Joint] Figure 7 is a schematic cross-sectional view showing a fourth example of a joint according to an embodiment of the present invention. In Figure 7, the same reference numerals are used for components identical to those in the joint 10 shown in Figure 1 and the anisotropic conductive member 12 shown in Figure 2, and their detailed descriptions are omitted. The joint 10c shown in Figure 7 differs from the joint 10 shown in Figure 1 in that the anisotropic conductive member 12 has a protrusion 57 and the member to be joined 14 has a recess 27, but the other configurations are the same as those of the joint 10 shown in Figure 1. The member to be joined 14 has electrodes 22 and 23 provided on the surface 20a of the substrate 20. An insulating layer 25 is provided to electrically insulate electrodes 22 and 23 from each other. In addition, an insulating layer 29 is provided on the surface 20a of the substrate 20 adjacent to the electrode 23. A recess 29a is provided in the insulating layer 29. The insulating layer 29 has the same composition as, for example, the insulating layer 25. The anisotropic conductive member 12 has a protrusion 57 provided at a position opposite the recess 29a. The protrusion 57 has the same configuration as the protrusion 57 of the anisotropic conductive member 12 shown in Figures 4 and 5, so a detailed explanation thereof is omitted.

[0029] The recess 29a of the member to be joined 14 is formed in the insulating layer 29 when the insulating layer 29 is formed, for example, by pattern formation. The reference for the depth δd of the recess 29a is the surface 22a of the electrode 22. The depth δd of the recess 29a is appropriately determined from the height hm of the protrusion 57 that fits with the recess 29a. The maximum depth δd of the recess 29a is the distance Lm from the surface 22a of the electrode 22 to the surface 20a of the substrate 20. The maximum height hm of the protrusion 57 is the above-mentioned distance Lm, and the minimum is 20% of the above-mentioned distance Lm. The depth δd of the recess 29a can be obtained, for example, by acquiring a cross-sectional image of the insulating layer 29 and measuring the length corresponding to the depth δd of the recess 29a in the cross-sectional image. The cross-sectional image of the insulating layer 29 is acquired by cutting the joined body 10c in the stacking direction Ds with a microtome or the like to expose the cross-section and then taking a photograph. The method for measuring the height hm of the protrusion 57 is as described above. As described above, in the joint 10c, the anisotropic conductive member 12 is provided with a protrusion 57 and the member to be joined 14 is provided with a recess 29a, which facilitates alignment. Furthermore, the anisotropic conductive member 12 can also be easily aligned with the member to be joined 14.

[0030] In the first to fourth examples of the bonded body described above, a configuration in which a protrusion or recess is provided on the back surface 50b side of the insulating film 50 of the anisotropic conductive member 12 was explained as an example, but the explanation is not limited to this. A configuration in which a protrusion or recess is provided on the front surface 50a side of the insulating film 50 of the anisotropic conductive member 12 is also possible. Furthermore, a configuration in which a protrusion or recess is provided on the back surface 50b side of the insulating film 50 of the anisotropic conductive member 12, and a protrusion or recess is provided on the front surface 50a side of the insulating film 50 is also possible.

[0031] [Fifth Example of a Joint] Figure 8 is a schematic cross-sectional view showing a fifth example of a joint according to an embodiment of the present invention. In Figure 8, the same reference numerals are used for components identical to those in the joint 10 shown in Figure 1 and the anisotropic conductive member 12 shown in Figure 2, and their detailed descriptions are omitted. The joint 11 shown in Figure 8 differs from the joint 10 shown in Figure 1 in that it has an anisotropic conductive member 12, a member to be joined 14, and a member to be joined 16, and the joint 11 has a three-layer structure with two members to be joined 14 and 16. Also, the configuration of the anisotropic conductive member 12, the member to be joined 14, and the member to be joined 16 differs from that of the joint 10 shown in Figure 1. The anisotropic conductive member 12 has a protrusion 57 on the back surface 50b side of the insulating film 50. The protrusion 57 is provided across the protrusions 52b of a plurality of conductors 52 and protrudes toward the member to be joined 14. The protrusions 57 of the anisotropic conductive member 12 have the same configuration as the protrusions 57 of the anisotropic conductive member 12 shown in Figures 4 and 5, so a detailed explanation is omitted. The anisotropic conductive member 12 has recesses 56 on the surface 50a of the insulating film 50. The configuration of the recesses 56 of the anisotropic conductive member 12 is the same configuration as the recesses 56 of the anisotropic conductive member 12 shown in Figure 3, so a detailed explanation is omitted.

[0032] The member to be joined 14 includes, for example, a substrate 20, electrodes 22 and 23 provided on the surface 20a of the substrate 20, a recess 27 between electrodes 22 and 23, and an insulating layer 30 provided on the surface 20a of the substrate 20 connected to electrodes 23. The electrodes 22 and 23 and the insulating layer 30 are at the same height from the surface 20a of the substrate 20. That is, the electrodes 22 and 23 and the insulating layer 30 are at the same height. The recess 27 is provided at a position opposite to the convex portion 57 of the anisotropic conductive member 12. The convex portion 57 of the anisotropic conductive member 12 and the recess 27 of the member to be joined 14 are used to align the anisotropic conductive member 12 and the member to be joined 14. The anisotropic conductive member 12 and the member to be joined 14 are positioned by fitting the convex portion 57 of the anisotropic conductive member 12 and the recess 27 of the member to be joined 14 together. This suppresses misalignment between the anisotropic conductive member 12 and the member to be joined 14 during joining, making it easier to align the anisotropic conductive member 12 and the member to be joined 14 to obtain positional accuracy. Note that the recess 27 of the member to be joined 14 has the same configuration as the recess 27 of the member to be joined 14 shown in Figure 4, so a detailed explanation thereof is omitted.

[0033] The member to be joined 16 includes, for example, a substrate 20, electrodes 32 and 34 provided on the surface 20a of the substrate 20, an insulating layer 33 that electrically insulates electrodes 32 and 34 from each other, an insulating layer 35 provided on the surface 20a of the substrate 20 connected to electrode 32, and an insulating layer 36 provided on the surface 20a of the substrate 20 connected to electrode 34. The insulating layer 36 has a protrusion 37 provided at a position opposite to the recess 56 of the anisotropic conductive member 12. The recess 56 of the anisotropic conductive member 12 and the protrusion 37 of the member to be joined 16 are used to align the anisotropic conductive member 12 and the member to be joined 14. The anisotropic conductive member 12 and the member to be joined 16 are positioned by fitting the recess 56 of the anisotropic conductive member 12 and the protrusion 37 of the member to be joined 16 together. This suppresses misalignment between the anisotropic conductive member 12 and the member to be joined 14 during joining, making it easier to align the anisotropic conductive member 12 and the member to be joined 14 to obtain positional accuracy. The height hm of the protrusion 57 from the conductor 52 and the distance Lm from the surface 22a of the electrode 22 to the surface 20a of the substrate 20 are the same as in the second example of the joined body described above, so a detailed explanation is omitted. The insulating layer 30 of the member to be joined 14 and the insulating layers 33, 35, and 36 of the member to be joined 16 have the same composition as, for example, the insulating layer 25 of the member to be joined 14 shown in Figure 1. Also, the electrodes 32 and 34 of the member to be joined 16 have the same composition as, for example, the electrodes 22 and 23 of the member to be joined 14.

[0034] The electrodes 32, 34 and the insulating layers 33, 35 are at the same height from the surface 20a of the substrate 20. That is, the electrodes 32, 34 and the insulating layers 33, 35 are at the same height. The protrusion 37 is at a greater height from the surface 20a of the substrate 20 than the surface 32a of the electrode 32, and protrudes toward the anisotropic conductive member 12 side than the surface 32a of the electrode 32. The heights of the electrodes 32, 34 and the insulating layers 33, 35 are measured in the same manner as the measurement method for the electrodes 22, 23, 24 and the insulating layer 25 described above. The recess 56 of the anisotropic conductive member 12 and the protrusion 37 of the member to be joined 16 are used for alignment between the anisotropic conductive member 12 and the member to be joined 14. The protrusion 37 is made of, for example, an insulating material having electrical insulating properties.

[0035] The amount of protrusion hp of the convex portion 37 from the surface 32a of the electrode 32 is, in the configuration of the joint 11 shown in Figure 8, the maximum distance to the bottom surface 56b of the opposing recess 56. The amount of protrusion hp of the convex portion 37 is based on the surface 32a of the electrode 32 of the member to be joined 16. The minimum amount of protrusion hp of the convex portion 37 is 20% of the depth δc of the recess 56. The amount of protrusion hp of the convex portion 37 from the surface 32a of the electrode 32 is the distance from the surface 32a of the electrode 32 to the furthest end of the convex portion 37. The amount of protrusion hp is obtained by acquiring a cross-sectional image of the joint 11, identifying the location corresponding to the surface 32a of the electrode 32 and the location corresponding to the end of the convex portion 37, and measuring the distance between the two identified locations. The above-mentioned cross-sectional image of the joint 11 is acquired by cutting the joint 11 in the stacking direction Ds using a microtome or the like to expose the cross-section and then taking a photograph. Furthermore, the protrusion amount hp of the convex portion 37 can be measured from the surface 32a side of the electrode 32 of the member to be joined 16 using a three-dimensional measuring instrument or a laser microscope. The convex portion 37 of the member to be joined 16 is made of polyimide or polybenzoxazole (PBO), similar to the convex portion 26 of the member to be joined 14 shown in Figure 1, and can also be made of a resist film. As described above, in the bonded body 11, the anisotropic conductive member 12 is provided with a recess 56 and a convex portion 57, the member to be joined 14 is provided with a recess 27, and the member to be joined 16 is provided with a convex portion 37, which facilitates alignment. In addition, the anisotropic conductive member 12 can also be easily aligned with the member to be joined 14 and the member to be joined 16.

[0036] Next, the arrangement pattern of the convex portions and concave portions of the anisotropic conductive member 12 will be described. FIG. 9 is a schematic diagram showing a first example of the arrangement pattern of the convex portions and concave portions of the anisotropic conductive member according to an embodiment of the present invention. FIG. 10 is a schematic diagram showing a second example of the arrangement pattern of the convex portions and concave portions of the anisotropic conductive member according to an embodiment of the present invention. FIG. 11 is a schematic diagram showing a third example of the arrangement pattern of the convex portions and concave portions of the anisotropic conductive member according to an embodiment of the present invention. FIGS. 9 to 11 are plan views showing the anisotropic conductive member 12 shown in FIG. 2 as viewed from the surface 50a side of the insulating film 50. In FIGS. 9 to 11, the same components as those of the bonded body 10 shown in FIG. 1 and the anisotropic conductive member 12 shown in FIG. 2 are denoted by the same reference numerals, and detailed description thereof will be omitted. The convex portions and concave portions of the anisotropic conductive member 12 described above are provided as an arrangement pattern in, for example, the linear pattern 40 shown in FIG. 9. The number of linear patterns 40 provided in the anisotropic conductive member 12 is not particularly limited to one; two may be provided, or three or more may be provided. When a plurality of linear patterns 40 are provided, the linear patterns 40 may be arranged parallel to each other, or may be arranged such that two linear patterns 40 are orthogonal to each other. In the case of the linear pattern 40, for example, the member to be bonded is provided with a convex portion or a concave portion that fits with the concave portion or the convex portion of the anisotropic conductive member, in the same linear pattern as the linear pattern 40.

[0037] The arrangement pattern of the convex portions and concave portions of the anisotropic conductive member 12 described above may be a circular pattern 42 shown in FIG. 10 or a quadrangular pattern 43. The number of circular patterns 42 or quadrangular patterns 43 provided in the anisotropic conductive member 12 is not particularly limited to one; two may be provided, or three or more may be provided. When a plurality of circular patterns 42 or quadrangular patterns 43 are provided, the arrangement of the circular patterns 42 or quadrangular patterns 43 is not particularly limited. In the case of the circular pattern 42 or the quadrangular pattern 43, for example, the member to be bonded is provided with a convex portion or a concave portion that fits with the concave portion or the convex portion of the anisotropic conductive member, in the same circular pattern or quadrangular pattern as the circular pattern 42 or the quadrangular pattern 43.

[0038] Furthermore, the arrangement pattern of the protrusions and recesses of the anisotropic conductive member 12 may also be the intersecting linear pattern 44 shown in Figure 11. In the intersecting linear pattern 44, a first linear pattern portion 44a and a second linear pattern portion 44b are connected orthogonally. The intersecting linear pattern 44 is not particularly limited to being provided as one on the anisotropic conductive member 12; there may be two, three or more, etc. When there are multiple intersecting linear patterns 44, the arrangement of the intersecting linear patterns 44 is not particularly limited. In the case of the intersecting linear pattern 44, for example, the member to be joined may be provided with protrusions or recesses that fit with the recesses or protrusions of the anisotropic conductive member, using the same intersecting linear pattern 44. The protrusions of the member to be joined 14 that fit into the recesses of the anisotropic conductive member 12 described above do not have to be arranged in the same pattern as the recesses of the anisotropic conductive member 12. For example, if the recesses have a linear pattern, the protrusions may have a linear pattern, a circular pattern, or a square pattern. Similarly, the protrusions of the anisotropic conductive member 12 that fit into the recesses of the member to be joined 14 described above do not have to be arranged in the same pattern as the recesses of the member to be joined 14. For example, if the recesses have a linear pattern, the protrusions may have a linear pattern, a circular pattern, or a square pattern. The recesses of the anisotropic conductive member are preferably 10 to 500 μm wide and 10 to 15 μm deep. The protrusions of the anisotropic conductive member are preferably 10 to 500 μm wide and 5 to 10 μm high. The recesses of the member to be joined are preferably 10 to 500 μm wide and 10 to 15 μm deep. The protrusions of the member to be joined are preferably 10 to 500 μm in width and 5 to 10 μm in height.

[0039] It is preferable that the area ratio of the convex portion of the member to be joined to the concave portion of the anisotropically conductive member is 40 to 60% in the case of the concave portion of the anisotropically conductive member and the convex portion of the member to be joined. When the convex area ratio is within the above range, it is preferable because the concave portion of the anisotropically conductive member and the convex portion of the member to be joined are fitted to each other, and the positioning accuracy for alignment is improved. Further, it is preferable that the area ratio of the convex portion of the anisotropically conductive member to the concave portion of the member to be joined is 40 to 60% in the case of the convex portion of the anisotropically conductive member and the concave portion of the member to be joined. When the convex area ratio is within the above range, it is preferable because the convex portion of the anisotropically conductive member and the concave portion of the member to be joined are fitted to each other, and the positioning accuracy for alignment is improved. The convex area ratio is calculated by the formula: convex area ratio = ((convex area) / (concave area)) × 100 (%). When the convex area ratio is 60%, if the concave portion and the convex portion have the same width, when the length of the concave portion is taken as 100, the length of the convex portion is 60. Hereinafter, the configuration of the anisotropically conductive member will be described more specifically.

[0040] [Configuration of Anisotropically Conductive Member] (Anisotropically Conductive Member) The anisotropically conductive member will be described with reference to FIG. 2 and FIG. 9. The anisotropically conductive member 12 shown in FIG. 2 includes an electrically insulating insulating film 50, and a plurality of conductors 52 provided penetrating through the insulating film 50 in a thickness direction Dt. The conductors 52 are provided in a state of being electrically insulated from each other in the insulating film 50. In the joined body 10 described above (see FIG. 1), the anisotropically conductive member 12 is laminated with a member to be joined such as the member to be joined 14 such that the thickness direction Dt of the insulating film 50 is substantially parallel to the lamination direction Ds of the joined body 10.

[0041] Multiple conductors 52 are provided in the insulating film 50 in a state where they are electrically insulated from each other. In this case, the insulating film 50 has multiple pores 51 that penetrate in the thickness direction Dt. Conductors 52 are provided in the multiple pores 51. Therefore, the shape of the conductor 52 will correspond to the internal shape of the pores 51. If the pores 51 are cylindrical, the conductor 52 will be a cylindrical columnar body. The conductor 52 is not particularly limited to being cylindrical. In an anisotropic conductive member, the conductor 52 may have a protrusion that protrudes from at least one surface of the insulating film 50, and it is sufficient to have either a protrusion 52a or a protrusion 52b, but as described above, it is preferable that the anisotropic conductive member 12 has a protrusion on the surface facing the electrode. The insulating film 50 is composed of, for example, an anodic oxide film. The anodic oxide film is formed by anodizing a valve metal, for example, and an aluminum anodic oxide film is an example. The surface 50a and the back surface 50b of the insulating film 50 are opposing surfaces in the thickness direction Dt of the insulating film 50.

[0042] As shown in Figure 9, the anisotropic conductive member 12 has, for example, a rectangular shape in plan view, with all interior angles being 90°. The external shape and size of the anisotropic conductive member 12 are determined as appropriate according to the application, etc. The external shape of the anisotropic conductive member 12 may also be circular. The anisotropic conductive member has, for example, the same configuration as the structure described in International Publication No. 2022 / 163260, and can be manufactured in the same manner as the above-described structure.

[0043] <Insulating Film> The insulating film 50 is made of a conductive material and electrically insulates a plurality of conductors 52 from each other. As described above, the insulating film 50 has electrical insulating properties. The insulating film 50 also has a plurality of pores 51 (see Figure 1) in which the conductors 52 are formed. The composition of the insulating film 50 will be described later. The length of the insulating film 50 in the thickness direction Dt, that is, the thickness ht of the insulating film 50, is preferably in the range of 1 to 1000 μm, more preferably in the range of 5 to 500 μm, and even more preferably in the range of 10 to 300 μm. When the thickness ht of the insulating film 50 is in this range, the handling of the insulating film 50 is good.

[0044] The thickness of the insulating film can be measured by cutting the insulating film 50 in the thickness direction Dt using a focused ion beam (FIB), and acquiring an image of the cross-section at a magnification of 50,000x using a scanning electron microscope (SEM). In the acquired image, the length of 10 points corresponding to the thickness of the insulating film is measured, and the average of the measured lengths of these 10 points is calculated. This average value is taken as the thickness of the insulating film.

[0045] <Average diameter of pores> The average diameter of the pores 51 is preferably 1 μm or less, more preferably 5 to 500 nm, even more preferably 20 to 400 nm, even more preferably 40 to 200 nm, and most preferably 50 to 100 nm. When the average diameter d of the pores 51 is 1 μm or less and within the above range, a conductor 52 having the above average diameter can be obtained. The average diameter of the pores 51 can be measured by taking a picture of the surface of the insulating film 50 from directly above at a magnification of 100 to 10000 using a scanning electron microscope and obtaining the captured image. In the captured image, at least 20 pores that are connected in an annular shape around the periphery are extracted, their diameters are measured and defined as the aperture diameter, and the average value of these aperture diameters is calculated as the average diameter of the pores. The magnification can be appropriately selected within the above range so as to obtain a captured image in which 20 or more pores can be extracted. The aperture diameter is determined by measuring the maximum distance between the ends of the pore portions. In other words, the shape of the pore opening is not limited to a roughly circular shape. If the shape of the opening is not circular, the maximum distance between the ends of the pore portion is taken as the opening diameter. Therefore, for example, even in the case of a pore that is formed by the integration of two or more pores, it is considered as a single pore, and the maximum distance between the ends of the pore portion is taken as the opening diameter.

[0046] <Conductor> The plurality of conductors 52 are columnar bodies as described above, and are provided in an insulating film 50, for example, an anodized film, in a state of being electrically insulated from each other. The plurality of conductors 52 have electrical conductivity and function as electrical conduction paths as described above. The conductor is formed of a conductive substance. The conductive substance is not particularly limited, and examples thereof include metals. Specific preferred examples of metals include gold (Au), silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), nickel (Ni), zinc (Zn), cobalt (Co), and the like. From the viewpoint of electrical conductivity, copper, gold, aluminum, nickel and cobalt are preferred, copper and gold are more preferred, and copper is most preferred. Metals are superior in ductility and the like compared to oxide conductors, and are easily deformed, and are also easily deformed by compression during bonding, so it is preferable that the conductor is formed of a metal.

[0047] <<Shape of Conductor>> As described above, the shape of the conductor 52 corresponds to the inner shape of the pore 51. If the pore 51 is cylindrical, the conductor 52 becomes a columnar columnar body. The average diameter of the pores 51 is substantially equal to the average diameter d of the conductors 52. The average diameter d of the conductors 52 is preferably 1 μm or less, more preferably 5 to 500 nm, still more preferably 20 to 400 nm, even more preferably 40 to 200 nm, and most preferably 50 to 100 nm. The density of the conductors 52 is 20,000 pieces / mm 2 or more is preferable, 2,000,000 pieces / mm 2 or more is more preferable, 10,000,000 pieces / mm 2 or more is still more preferable, 50,000,000 pieces / mm 2 or more is particularly preferable, and 100,000,000 pieces / mm 2 or more is most preferable. Furthermore, the center-to-center distance p between adjacent conductors 52 is preferably 20 nm to 500 nm, more preferably 40 nm to 200 nm, and still more preferably 50 nm to 140 nm.

[0048] The average diameter of the conductor is determined by taking an image of the insulating film surface from directly above using a scanning electron microscope at a magnification of 100 to 10,000 times. In the image, at least 20 conductors with a ring-shaped perimeter are extracted, their diameters are measured and defined as the aperture diameter, and the average of these aperture diameters is calculated as the average diameter of the conductor. The magnification can be appropriately selected within the above range to obtain an image in which 20 or more conductors can be extracted. If the shape of the opening is not circular, the maximum distance between the ends of the conductor portion is defined as the aperture diameter. Therefore, even in the case of a conductor with a shape in which two or more conductors are integrated, for example, it is considered as a single conductor, and the maximum distance between the ends of the conductor portion is defined as the aperture diameter. The average diameter d of the conductor 52 is the same as the average diameter of the protruding portion. The distance p between the centers of adjacent conductors 52 is determined by further identifying the center position (not shown) of the identified conductor in the image of the insulating film 50 obtained as described above. The distance between the center positions of adjacent conductors was determined at 10 locations. The average value of these distances was defined as the distance p between the centers of adjacent conductors 52. The center position is the center position of the region corresponding to conductor 52 in the captured image described above. A known image analysis method is used to calculate the center position of the region in the captured image. Furthermore, as described above, the average diameter of the pores 51 is approximately equal to the average diameter d of conductor 52. Therefore, if high precision is not required, the average diameter of the pores 51 may be used as the average diameter d of conductor 52.

[0049] <<Protruding parts>> The protruding parts are part of the conductor and are columnar in shape. The protruding parts are preferably cylindrical in shape so as to increase the contact area with the object to be joined. The average protrusion length h of the protruding part 52a from the surface 50a of the insulating film 50 and the average protrusion length h of the protruding part 52b from the back surface 50b of the insulating film 50 are preferably 500 nm to 5 μm, and more preferably 1 μm to 3 μm. If the above average protrusion length h is 500 nm to 5 μm, the bonding with the member to be joined will be good. The average protrusion length h is measured as described above. With respect to the conductor 52, the spacing between adjacent protruding parts is preferably 20 nm to 200 nm, and more preferably 40 nm to 100 nm. If the spacing between adjacent protruding parts is within the above range, the spacing of the conductor 52 can be maintained on the surface 50a or back surface 50b of the insulating film 50 of the conductor 52. This suppresses short circuits of the conductor 52 when joining with the object to be connected, such as a semiconductor device, and further increases the reliability of the joining.

[0050] <Member to be bonded> The member to be bonded is, for example, a power semiconductor device. Examples of power semiconductor devices include IGBTs (Insulated Gate Bipolar Transistors), SiC-MOSFETs (Metal Oxide Semiconductor Field Effect Transistors), and GaN-HEMTs (High Electron Mobility Transistors). When the member to be bonded is a power semiconductor device, the electrodes are, for example, a source electrode, a drain electrode, or a gate electrode.

[0051] Furthermore, the member to be joined has, for example, an electrode and an insulating layer as described above. Examples of members to be joined include electronic components having electrodes such as electrodes, terminals or wiring and an insulating layer, printed wiring boards, printed circuit boards, and TSVs (Through Silicon Vias). Examples of electronic components include semiconductor elements other than the power semiconductor elements described above.

[0052] The insulating layer is not particularly limited in its composition as long as it can prevent conductivity between electrodes, and can be made of known insulating layers used in semiconductor devices. For example, the insulating layer is a silicon oxide film (SiO ２ ), silicon nitride film (Si ３ N ４ The insulation layer is composed of a PSG (Phospho Silicate Glass) film, a BPSG (Boron Phospho Silicate Glass) film, or an SOG (Spin On Glass) film. The insulating layer may also be a resin layer with the following composition. The composition of the resin layer will be described below. For example, the resin layer contains a polymer material and may also contain an antioxidant material. Specific examples of resin materials constituting the resin layer include thermoplastic resins such as ethylene copolymers, polyamide resins, polyester resins, polyurethane resins, polyolefin resins, acrylic resins, acrylonitrile resins, and cellulose resins. Polyacrylonitrile can also be used as the resin material constituting the resin layer 54. In addition to the above, the resin layer may contain, for example, a main composition containing an acrylic polymer, an acrylic monomer, and a maleimide compound as described in International Publication No. 2022 / 163260.

[0053] Semiconductor devices include, for example, logic LSIs (Large Scale Integration), ASICs (Application Specific Integrated Circuits), FPGAs (Field Programmable Gate Arrays), and ASSPs (Application Specific Standard Products). Other examples include microprocessors such as CPUs (Central Processing Units) and GPUs (Graphics Processing Units). Furthermore, there are memory types such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), HMCs (Hybrid Memory Cubes), MRAMs (Magnetic RAM), PCMs (Phase-Change Memory), ReRAMs (Resistive RAM), FeRAMs (Ferroelectric RAM), and flash memory. Other examples include LEDs (Light Emitting Diodes), MEMS (Micro Electro Mechanical Systems), GPS (Global Positioning System), FM (Frequency Modulation), NFC (Nearfield Communication), RFEM (RF Expansion Module), MMIC (Monolithic Microwave Integrated Circuit), WLAN (Wireless Local Area Network), discrete components, BSI (Back Side Illumination), CIS (Contact Image Sensor), camera modules, passive devices, SAW (Surface Acoustic Wave) filters, RF (Radio Frequency) filters, RFIPD (Radio Frequency Integrated Passive Devices), etc. Examples of MEMS include sensors, actuators, and antennas.The sensors include, for example, various sensors such as acceleration, sound, pressure, and light sensors, as well as gyroscopes. The bonded member may be a semiconductor device in which multiple semiconductor elements described above are stacked and electrically connected. A semiconductor device is a collection of multiple semiconductor elements that perform a specific function, but it also includes those that only transmit electrical signals. A semiconductor device may be, for example, a logic device with a two-dimensional (2D), 2.5-dimensional (2.5D), or three-dimensional (3D) architecture. Furthermore, a semiconductor device may be, for example, a DRAM stack made by stacking multiple DRAMs, or a configuration in which a DRAM stack and a logic LSI are stacked.

[0054] The present invention is basically configured as described above. Although the anisotropic conductive member and joint of the present invention have been described in detail above, the present invention is not limited to the embodiments described above, and various improvements or modifications may be made without departing from the spirit of the present invention.

[0055] The features of the present invention will be described in more detail below with reference to examples. The materials, reagents, amounts and proportions of substances, and procedures shown in the following examples can be modified as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the following examples. In these examples, the joints of Examples 1 to 11 and the joint of Comparative Example 1 were prepared. The alignment of the joints of Examples 1 to 11 and the joint of Comparative Example 1 was evaluated. The results of the alignment evaluation are shown in Table 1 below. Next, the alignment will be described.

[0056] (Evaluation of alignment) For alignment, the alignment accuracy was evaluated by measuring the misalignment between the anisotropic conductive member and the electrode on bonded bodies bonded using a chip mounter at a temperature of 300°C, a pressure of 100 MPa, and a time of 5 minutes, using an infrared microscope. The amount of misalignment between the anisotropic conductive member and the electrode was evaluated according to the evaluation criteria shown below. The evaluation results are shown in the alignment results column of Table 1 below. Evaluation Criteria A: Misalignment between anisotropic conductive member and electrode is ±50 μm or less B: Misalignment between anisotropic conductive member and electrode is greater than ±50 μm and 75 μm or less C: Misalignment between anisotropic conductive member and electrode is greater than ±75 μm and within ±100 μm D: Misalignment between anisotropic conductive member and electrode is greater than ±100 μm The chip mounter used was the Toray Engineering Co., Ltd. Flip Chip Bonder FC3000. The infrared microscope used was the Olympus Corporation Semiconductor / FPD Inspection Microscope MX61 (product name). The lens used was the LMRLN5XIR objective lens (product name) manufactured by Olympus Corporation for near-infrared region (700 nm to 1300 nm) observation. The stage used was an automated XY stage for upright microscopes manufactured by Merzhäuser.

[0057] Examples 1 to 11 and Comparative Example 1 will be described below. (Example 1) The anisotropic conductive member of the joint in Example 1 will be described. In Example 1, an aluminum anodic oxide film was used as the insulating film.

[0058] [Anisotropic Conductive Material] <Preparation of Aluminum Substrate> A molten metal was prepared using an aluminum alloy containing Si: 0.06 mass%, Fe: 0.30 mass%, Cu: 0.005 mass%, Mn: 0.001 mass%, Mg: 0.001 mass%, Zn: 0.001 mass%, and Ti: 0.03 mass%, with the remainder being Al and unavoidable impurities. After molten metal treatment and filtration, an ingot with a thickness of 500 mm and a width of 1200 mm was produced by DC (Direct Chill) casting. Next, the surface was machined to an average thickness of 10 mm using a surface mill, and then it was heated to 550°C for about 5 hours. Once the temperature dropped to 400°C, it was rolled into a 2.7 mm thick sheet using a hot rolling mill. Furthermore, after heat treatment at 500°C using a continuous annealing machine, the material was cold-rolled to a thickness of 1.0 mm to obtain an aluminum substrate conforming to JIS (Japanese Industrial Standards) 1050. After widening this aluminum substrate to 1030 mm, the following treatments were performed.

[0059] <Electrolytic Polishing Treatment> The above-mentioned aluminum substrate was subjected to electrolytic polishing treatment using an electrolytic polishing solution with the following composition under the conditions of a voltage of 25V, a liquid temperature of 65°C, and a liquid flow rate of 3.0 m / min. A carbon electrode was used as the cathode, and a GP0110-30R (manufactured by Takasago Seisakusho Co., Ltd.) was used as the power supply. The flow rate of the electrolyte was measured using a vortex-type flow monitor FLM22-10PCW (manufactured by AS ONE Corporation).

[0060] (Electrolytic polishing solution composition) • 85% by mass phosphoric acid (reagent manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) 660 mL • Pure water 160 mL • Sulfuric acid 150 mL • Ethylene glycol 30 mL

[0061] <Anodizing Process> Next, the aluminum substrate after electropolishing was subjected to anodizing by a self-regulating method according to the procedure described in Japanese Patent Publication No. 2007-204802. The aluminum substrate after electropolishing was subjected to a pre-anodizing treatment for 5 hours with an electrolyte of 0.50 mol / L oxalic acid under the conditions of a voltage of 40 V, a liquid temperature of 16 °C, and a liquid flow rate of 3.0 m / min. After that, the aluminum substrate after pre-anodizing was subjected to a defilm removal treatment by immersing it in a mixed aqueous solution of 0.2 mol / L anhydrous chromic acid and 0.6 mol / L phosphoric acid (liquid temperature: 50 °C) for 12 hours. After that, a re-anodizing treatment was performed for 3 hours and 45 minutes with an electrolyte of 0.50 mol / L oxalic acid under the conditions of a voltage of 40 V, a liquid temperature of 16 °C, and a liquid flow rate of 3.0 m / min to obtain an anodic oxide film with a thickness of 30 μm. For both the pre-anodic oxidation and re-anodic oxidation processes, a stainless steel electrode was used as the cathode, and a GP0110-30R power supply (manufactured by Takasago Seisakusho Co., Ltd.) was used. A NeoCool BD36 (manufactured by Yamato Scientific Co., Ltd.) was used as the cooling device, and a Pair Stirrer PS-100 (manufactured by EYELA Tokyo Rikakikai Co., Ltd.) was used as the stirring and heating device. Furthermore, the electrolyte flow rate was measured using a vortex flow monitor FLM22-10PCW (manufactured by AS ONE Corporation).

[0062] <Barrier Layer Removal Process> Next, after the anodic oxidation process, an etching treatment was performed by immersing the substrate in an alkaline aqueous solution prepared by dissolving zinc oxide in a sodium hydroxide aqueous solution (50 g / l) at a concentration of 2000 ppm at 30°C for 150 seconds. This removed the barrier layer at the bottom of the micropores of the anodic oxide film and simultaneously deposited zinc on the surface of the exposed aluminum substrate. The average thickness of the anodic oxide film after the barrier layer removal process was 30 μm.

[0063] <Metal Filling Process> Next, electroplating was performed using an aluminum substrate as the cathode and platinum as the cathode. Specifically, a copper plating solution with the following composition was used, and constant current electrolysis was performed to create a metal-filled microstructure in which nickel was filled inside the micropores. Here, constant current electrolysis was performed using a plating device manufactured by Yamamoto Plating Testing Equipment Co., Ltd., with a power supply (HZ-3000) manufactured by Hokuto Denko Co., Ltd., and after confirming the deposition potential by performing cyclic voltammetry in the plating solution, the process was carried out under the following conditions. (Copper plating solution composition and conditions) ・Copper sulfate 100 g / L ・Sulfuric acid 50 g / L ・Hydrochloric acid 15 g / L ・Temperature 25℃ ・Current density 10 A / dm ２

[0064] The surface of the anodic oxide film after filling micropores with metal was observed using a scanning electron microscope, and the presence or absence of metal sealing in 1000 micropores was observed. The sealing rate (number of sealed micropores / 1000 micropores) was calculated to be 98%. Furthermore, the anodic oxide film after filling micropores with metal was machined in the thickness direction using a focused ion beam (FIB), and surface photographs (magnification 50,000x) of the cross-section were taken using a scanning electron microscope to examine the inside of the micropores. It was found that the inside of the sealed micropores was completely filled with metal.

[0065] <Substrate Removal Process> Next, the aluminum substrate was dissolved and removed by immersion in a mixed solution of copper chloride / hydrochloric acid to fabricate a metal-filled microstructure with an average thickness of 30 μm. The diameter of the conductors in the fabricated metal-filled microstructure was 60 nm, the pitch between conductors was 100 nm, and the density of conductors was 57.7 million conductors / mm². ２ That was the case.

[0066] <Protrusion Process> The metal-filled microstructure after the substrate removal process was immersed in an aqueous potassium hydroxide (KOH) solution (concentration: 0.01 mol / L), and the immersion time was adjusted so that the height of the protrusions was 1 μm, selectively dissolving the surface of the aluminum anodic oxide film. Then, it was washed with water and dried to protrude the copper cylinders, which are conductors. Similarly, copper cylinders, which are conductors, were also protruded from the back surface of the aluminum anodic oxide film so that the height of the protrusions was 1 μm.

[0067] Next, a metal-filled microstructure was processed to a size of 3 mm x 3 mm to produce a 3 mm x 3 mm anisotropic conductive member. Then, by dicing, a linear recess with a width of 50 μm, a depth of 15 μm, and a length of 3 mm was formed in the insulating film of the anisotropic conductive member. The member to be bonded was 3 mm x 3 mm in size. For the member to be bonded, a polyimide film with a thickness of 15 μm was formed on the surface of a Si substrate with a thickness of 500 μm. Regions for forming electrodes 22, 23, and 24 shown in Figure 1 were created in the polyimide film by ultrashort pulse laser processing. Next, a copper layer with a thickness of 15 μm was formed in the regions formed in the polyimide film by a plating method to obtain three electrodes 22, 23, and 24. The size of each electrode 22, 23, and 24 was 0.8 mm x 2.5 mm. The distance between electrode 22 and electrode 23, and between electrode 23 and electrode 24 was 40 μm. Next, in the member to be joined, a protrusion with a protrusion amount hp (see Figure 1) of 10 μm was formed between electrode 22 and electrode 23, opposite the recess of the anisotropic conductive member, in a linear shape with a width of 36 μm and a length of 2.5 mm. The linear protrusion with a protrusion amount of 10 μm was formed by extruding molten polyimide resin using an inkjet method. No protrusions were formed in the member to be joined except between the electrodes. The area ratio of the protrusion of the member to be joined was set to 60% of the area of ​​the protrusion of the member to be joined relative to the recess of the anisotropic conductive member. In this case, if the width of the recess of the anisotropic conductive member and the protrusion of the member to be joined are the same, then if the length of the recess of the anisotropic conductive member is 100, the length of the protrusion of the member to be joined is 60. As described above, the area ratio of the protrusion was calculated using the formula: Area ratio of protrusion = ((area of ​​protrusion) / (area of ​​recess)) × 100 (%).

[0068] (Example 2) Example 2 is the same as Example 1, except that the formation positions of the recesses in the anisotropic conductive member and the formation positions of the protrusions in the member to be joined are different. In Example 2, the formation position of the protrusions in the member to be joined is in a region other than the electrodes shown in Figure 6, and the recesses of the anisotropic conductive member are provided at a position opposite to the protrusions of the member to be joined.

[0069] (Example 3) Example 3 differs from Example 1 in that a protrusion was formed on the anisotropic conductive member and a recess was formed on the member to be joined; otherwise, it is the same as Example 1. In Example 3, molten polyimide resin was extruded by an inkjet method to form a protrusion on the conductor of the anisotropic conductive member with a height hm (see Figure 4) of 10 μm, a width of 36 μm, and a length of 2.5 mm in a straight line. The gap between the electrodes of the member to be joined was made into a recess. The recess was a straight line with a length of 3 mm, a width of 50 μm, and a depth of 15 μm. In Example 3, the area ratio of the protrusion on the anisotropic conductive member to the recess of the member to be joined was set to 60%. (Example 4) Example 4 differs from Example 1 in that a protrusion was formed on the anisotropic conductive member and a recess was formed on the member to be joined; otherwise, it is the same as Example 1. In Example 4, molten polyimide resin was extruded by an inkjet method to form a convex portion with a height hm (see Figure 4) of 10 μm on the conductor of the anisotropic conductive member, in a linear shape with a width of 36 μm and a length of 2.5 mm. A recess with a width of 50 μm and a depth of 15 μm was formed in the insulating layer outside the electrodes of the member to be bonded by dicing, in a linear shape with a length of 3 mm. In Example 4, the area ratio of the convex portion of the anisotropic conductive member to the recess of the member to be bonded was set to 60%.

[0070] (Example 5) Example 5 differs from Example 1 in that two recesses are provided in the insulating film portion of the anisotropic conductive member, and a protrusion is provided in the member to be bonded at a position opposite to the recess of the anisotropic conductive member. Otherwise, it is the same as Example 1. In Example 5, two protrusions are provided in the member to be bonded. The recess of the anisotropic conductive member was linear with a length of 3 mm, a width of 50 μm, and a depth of 15 μm. In the member to be bonded, of the two protrusions, one linear protrusion with a protrusion of 10 μm, a width of 36 μm, and a length of 2.5 mm was provided between electrode 22 and electrode 23, as in Example 1. Another linear protrusion with a protrusion of 10 μm, a width of 36 μm, and a length of 2.5 mm was provided in the area other than the electrodes shown in Figure 6, as in Example 2. In both cases, the area ratio of the protrusions to the recess of the anisotropic conductive member was 60%. (Example 6) Example 6 differs from Example 3 in that two protrusions of the anisotropic conductive member are provided on the conductor, and recesses are provided in the member to be joined at positions opposite to the protrusions of the anisotropic conductive member. Otherwise, it is the same as Example 3. In Example 6, two recesses are provided in the member to be joined. In the member to be joined, one of the two recesses is used as the gap between electrode 22 and electrode 23, as in Example 3. This recess is linear with a length of 3 mm, a width of 50 μm, and a depth of 15 μm. A linear recess with a width of 50 μm, a depth of 15 μm, and a length of 3 mm is provided in the area other than the electrodes shown in Figure 6, as in Example 4. The area ratio of the two protrusions of the anisotropic conductive member to the recesses of the member to be joined is 60%.

[0071] (Example 7) Example 7 differs from Example 1 in that it further provides a protrusion of the anisotropic conductive member on the conductor, resulting in one recess and one protrusion, and that the member to be joined has a recess opposite to the protrusion of the anisotropic conductive member. Other than these differences, it is the same as Example 1. In Example 7, the member to be joined has one protrusion and one recess. The recess of the member to be joined is the gap between electrode 22 and electrode 23, as in Example 3. This recess is a straight line with a length of 3 mm, a width of 50 μm, and a depth of 15 μm. A straight recess with a width of 50 μm, a depth of 15 μm, and a length of 3 mm is provided in the area other than the electrodes shown in Figure 6, as in Example 4. In Example 7, the area ratio of the protrusion of the anisotropic conductive member to the recess of the member to be joined is 60%. The area ratio of the protrusion of the member to the recess of the anisotropic conductive member is 60%. (Example 8) Example 8 differs from Example 1 in that the member to be joined was provided with intersecting linear patterns (see Figure 11) of protrusions, and the anisotropic conductive member was provided with intersecting linear patterns (see Figure 11) of recesses. Otherwise, it was the same as Example 1. In Example 8, by dicing, recesses with a width of 50 μm and a depth of 15 μm were formed in the insulating film of the anisotropic conductive member in the form of intersecting linear patterns (see Figure 11) with a length of 3 mm. By inkjet, molten polyimide resin was extruded to form protrusions with a protrusion amount of 10 μm between the electrodes of the member to be joined in the form of intersecting linear patterns (see Figure 11) with a width of 36 μm and a length of 2.5 mm. The area ratio of the protrusions of the member to be joined to the recesses of the anisotropic conductive member was set to 60%.

[0072] (Example 9) Example 9 differs from Example 1 in that a circular protrusion is provided on the member to be joined and a circular recess is provided on the anisotropic conductive member, but otherwise it is the same as Example 1. In Example 9, after cutting the anisotropic conductive member to a size of 3 mm x 3 mm, a circular recess with a diameter of 50 μm and a depth of 15 μm is formed in the insulating film by etching. A circular protrusion with a protrusion of 10 μm between electrodes and a diameter of 39 μm is formed on the member to be joined by extruding molten polyimide resin using an inkjet method. The area ratio of the protrusion on the member to the recess of the anisotropic conductive member was set to 60%. (Example 10) Example 10 differs from Example 1 in that the area ratio of the protrusion on the member to the recess of the anisotropic conductive member was set to 30%, but otherwise it is the same as Example 1. In Example 10, the length of the protrusion on the member to be joined was set to 1.25 mm. (Example 11) Example 11 differs from Example 1 in that the ratio of the area of ​​the protrusion of the member to be joined to the recess of the anisotropic conductive member is 30%, and the protrusion amount of the protrusion of the member to be joined is 3 μm. Other than these differences, it is the same as Example 1. In Example 11, the length of the protrusion of the member to be joined is 1.25 mm.

[0073] (Comparative Example 1) Comparative Example 1 differs from Example 1 in that the anisotropic conductive member does not have recesses and protrusions, and the member to be joined does not have recesses and protrusions. Other than these differences, it is the same as Example 1.

[0074]

[0075] As shown in Table 1, Examples 1 to 11 had higher alignment accuracy and made alignment easier compared to Comparative Example 1.

[0076] 10, 10a, 10b, 10c, 11 Joint 12 Anisotropic conductive member 12a, 20a, 22a, 32a, 50a Surface 12b, 50b Back surface 14, 16 Member to be joined 20 Substrate 22, 23, 24, 32, 34 Electrode 25, 29, 30, 33, 35, 36 Insulating layer 26, 28, 37, 57 Protrusion 27, 29a, 55, 56 Recess 40, 42, 43, 44 Pattern 44a First linear pattern 44b Second linear pattern 50 Insulating film 51 Pore 52 Conductor 52a, 52b Protrusion 56b Bottom surface Ds Lamination direction Dt Thickness direction Lm Distance hm Height hp Protrusion amount hs Average projection length ht, thickness p, center-to-center distance δc, δd, depth

Claims

1. An anisotropic conductive member having an insulating film having electrical insulating properties, and a plurality of conductors that penetrate the insulating film in the thickness direction and are provided in a state where they are electrically insulated from one another, wherein at least one of a recess and a protrusion is provided on at least one side of the insulating film.

2. The anisotropic conductive member according to claim 1, wherein the recess is a region in which the thickness of the insulating film in the thickness direction is thinner than the surface of the insulating film.

3. The anisotropic conductive member according to claim 1, wherein the conductor has protrusions that protrude from at least one surface of the insulating film, and the recess is a region in which the length of the protrusions is shorter than the average length of the plurality of protrusions from the surface of the insulating film.

4. The anisotropic conductive member according to claim 1, wherein the protrusion is provided on the conductor.

5. The anisotropic conductive member according to claim 1, wherein the protrusion is made of an insulating material having electrical insulating properties.

6. The anisotropic conductive member according to any one of claims 1 to 5, wherein the insulating film is an anodized film of aluminum.

7. A joint comprising: an anisotropic conductive member having an insulating film having electrical insulating properties and a plurality of conductors provided that penetrate the thickness direction of the insulating film and are electrically insulated from one another; and a member to be joined to the anisotropic conductive member, wherein the anisotropic conductive member has a recess provided on at least one side of the insulating film, and the member to be joined has a protrusion provided at a position opposite to the recess of the anisotropic conductive member, and the recess of the anisotropic conductive member and the protrusion of the member to be joined fit together.

8. A joint comprising: an anisotropic conductive member having an insulating film having electrical insulating properties and a plurality of conductors provided that penetrate the thickness direction of the insulating film and are electrically insulated from one another; and a member to be joined to the anisotropic conductive member, wherein the anisotropic conductive member has a protrusion on at least one side of the insulating film, and the member to be joined has a recess provided at a position opposite to the protrusion of the anisotropic conductive member, and the protrusion of the anisotropic conductive member and the recess of the member to be joined fit together.

9. The bonded body according to claim 7, wherein the recess of the anisotropic conductive member is a region in which the thickness of the insulating film in the thickness direction is thinner with respect to the surface of the insulating film.

10. The joint according to claim 7, wherein the conductor of the anisotropic conductive member has a projection that protrudes from at least one surface of the insulating film, and the recess of the anisotropic conductive member is a region in which the length of the projections is shorter than the average length of the plurality of projections from the surface of the insulating film.

11. The joint according to claim 8, wherein the protrusion of the anisotropic conductive member is provided on the conductor.

12. The joint according to claim 7, wherein the protrusion of the member to be joined is made of an insulating material having electrical insulating properties.

13. The joint according to claim 8, wherein the protrusion of the anisotropic conductive member is made of an insulating material having electrical insulating properties.

14. The joining body according to claim 7 or 8, wherein the member to be joined has at least one electrode.

15. The joining body according to claim 7 or 8, wherein the member to be joined has a plurality of electrodes, and the recess or protrusion is between the electrodes.

16. The bonded body according to any one of claims 7 to 13, wherein the insulating film is an anodized film of aluminum.

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