Substrate processing system and substrate conveyance method

Abstract

A substrate processing system according to the present invention comprises: a conveyance module which includes a conveyance device for conveying a rectangular substrate; a container which is connected to the conveyance module and from which a loaded substrate is unloaded by the conveyance device; and a control unit which controls the operation of the conveyance device. The container and / or the conveyance module includes a plurality of detectors for detecting information pertaining to the positions of the four corners of the substrate. The control unit calculates a positional deviation status of the substrate with respect to a reference position in the container using the detection information obtained by the plurality of detectors, and corrects the operation of the conveyance device on the basis of the calculated positional deviation status of the substrate. The substrate processing system can thereby calculate the position of a rectangular substrate with high accuracy and satisfactorily convey the substrate.

Description

Substrate processing system and substrate conveying method

[0001] The present disclosure relates to a substrate processing system and a substrate conveying method.

[0002] Patent Document 1 discloses a teaching method for teaching a transfer position for transferring a substrate between a transfer device (transfer mechanism) and a mounting table. In this teaching method, three positions on the outer edge of a circular substrate are imaged by a camera, and the center position of the substrate is calculated based on the imaging information.

[0003] Japanese Unexamined Patent Publication No. 2019-102728

[0004] The present disclosure provides a technique capable of accurately calculating the position of a rectangular substrate and satisfactorily conveying the substrate.

[0005] According to one aspect of the present disclosure, there is provided a substrate processing system including: a transfer module having a transfer device that transfers a rectangular substrate; a container connected to the transfer module, from which the loaded substrate is unloaded by the transfer device; and a control unit that controls the operation of the transfer device, wherein the container and / or the transfer module includes a plurality of detectors that respectively detect information related to the positions of four corners of the substrate, and the control unit calculates a positional deviation state of the substrate relative to a reference position using detection information from the plurality of detectors, and corrects the operation of the transfer device based on the calculated positional deviation state of the substrate.

[0006] According to one aspect, the position of a rectangular substrate can be calculated with high accuracy, and the substrate can be satisfactorily conveyed.

[0007] This is a schematic plan view showing the configuration of a substrate processing system according to the first embodiment. This is a longitudinal cross-sectional view showing an example of a substrate processing apparatus. This is a plan cross-sectional view showing a load lock module according to the first embodiment. This is a side cross-sectional view of a load lock module according to the first embodiment. This is a diagram showing the detection state of the outer edge of the substrate by the detector. This is a diagram illustrating the electrical signals measured by the detector. This is the first explanatory diagram for explaining the procedure for calculating the position of the substrate. This is the second explanatory diagram for explaining the procedure for calculating the position of the substrate. This is the third explanatory diagram for explaining the procedure for calculating the position of the substrate. This is the fourth explanatory diagram for explaining the procedure for calculating the position of the substrate. This is a flowchart showing the processing flow of the substrate transport method. This is a flowchart showing the processing flow of the position calculation process. This is a plan view showing an example of a stage holding a substrate by a vacuum transport device. This is a plan view showing an example of a substrate being placed on the substrate mounting stage of a processing module by a vacuum transport device. This is a diagram for explaining the arrangement of detectors according to a modified example. This is a diagram showing a pattern when six detectors are installed on the stage. This is a diagram showing a pattern when five detectors are installed on the stage. This is a schematic plan view showing a substrate processing system according to another modified example. This is a schematic plan view showing a substrate processing system according to yet another modified example. This is a diagram for explaining the calculation of the amount of substrate displacement using three detectors. This is a plan cross-sectional view showing a load lock module according to the second embodiment. This is a diagram illustrating imaging information captured by the detector of the load lock module according to the second embodiment. This is a side cross-sectional view of a load lock module to which a camera-type detector is applied. This is a side cross-sectional view showing the form of the detector of a modified load lock module. This is a first explanatory diagram for explaining the calculation of the position of a substrate according to the second embodiment. This is a second explanatory diagram for explaining the calculation of the position of a substrate according to the second embodiment. This is a flowchart showing the processing flow of the substrate transport method according to the second embodiment. This is a flowchart showing the processing flow of the pre-alignment process. This is a diagram illustrating the state of the substrate during the pre-alignment process. This is a diagram illustrating the state of the substrate before the alignment process. This is a diagram showing imaging information obtained by capturing a notch in the substrate with the detector. This is a plan view showing a substrate processing system according to another modified example having a camera-type detector.

[0008] The following describes embodiments for implementing this disclosure with reference to the drawings. In each drawing, the same reference numerals are used for identical components, and redundant explanations may be omitted.

[0009] <Substrate Processing System 1> An example of the substrate processing system 1 according to the first embodiment will be described with reference to Figure 1. Figure 1 is a schematic plan view showing the configuration of the substrate processing system 1 according to the first embodiment. The substrate processing system 1 is a system that transports a rectangular (for example, rectangular) substrate G and performs substrate processing on the substrate G. This substrate processing system 1 includes a processing module PM, a vacuum transport module TM, a load lock module LLM, and a control unit 90. Although not shown in Figure 1, the substrate processing system 1 may also include an atmospheric transport module for transporting the substrate G in an atmospheric environment, a load port for loading the substrate G into the atmospheric transport module, etc. Furthermore, although the substrate processing system 1 in Figure 1 has a structure in which one processing module PM is connected to the vacuum transport module TM, it is not limited to this, and a cluster structure (multi-chamber type) system in which multiple processing modules PM are connected to the vacuum transport module TM is also possible.

[0010] In the substrate processing system 1, the substrate G subjected to processing is, for example, a flat panel display (FPD) or a printed circuit board. Examples of FPDs include liquid crystal displays (LCDs), electroluminescent displays (ELs), and plasma display panels (PDPs). Examples of printed circuit boards include package substrates and interposers. Glass is mainly used as the material for the substrate G. Depending on the application, transparent synthetic resins may also be used for the substrate G. Examples of substrate processing on the substrate G by the substrate processing apparatus 100 include etching and film deposition using the CVD (Chemical Vapor Deposition) method. The substrate G may have circuits patterned on its surface, or it may be a support substrate without patterning.

[0011] The substrate G for FPDs is formed in a rectangular shape when viewed from above. The planar dimensions of the substrate G have increased in size with each generation, and the planar dimensions of the substrate G processed by the substrate processing apparatus 100 include, for example, dimensions ranging from approximately 1500 mm x 1800 mm for the 6th generation to approximately 3000 mm x 3400 mm for the 10.5th generation. The thickness of the substrate G is approximately 0.2 mm to several mm. The substrate G may also be square in shape. Similarly, the substrate G for printed circuit boards is formed in a rectangular shape when viewed from above, and its planar dimensions are smaller than those of the 6th generation mentioned above, for example, dimensions of 300 mm x 300 mm or more and 1000 mm x 1200 mm or less.

[0012] The processing module PM of the substrate processing system 1 includes a processing container 10 and a mounting table 30 on which a substrate G can be placed inside the processing container 10. The processing container 10 is formed as a rectangular parallelepiped with a rectangular shape in plan view, and the substrate G can be accommodated in the space inside. The mounting table 30 has a mounting surface having dimensions and shape similar to that of the substrate G, and supports the substrate G during substrate processing inside the processing container 10. The mounting surface of the mounting table 30 may also be configured to allow annular rectangular frame members to be placed around the substrate G.

[0013] The processing module PM is connected to the vacuum transport module TM via a gate valve 211. When the gate valve 211 is opened, the processing module PM and the vacuum transport module TM are connected, allowing substrates G to be loaded into and unloaded from the processing module PM. When the gate valve 211 is closed, the pressure inside the processing container 10 of the processing module PM can be reduced. As described above, the substrate processing system 1 may also be configured by connecting multiple processing modules PM to the vacuum transport module TM.

[0014] The vacuum transport module TM connects the processing module PM and the load lock module LLM, and transports the substrate G from the load lock module LLM to the processing module PM, or from the processing module PM to the load lock module LLM. The vacuum transport module TM is connected to the processing module PM via the gate valve 211 as described above. The vacuum transport module TM is also connected to the load lock module LLM via the gate valve 212.

[0015] The vacuum transport module TM has a transport container 210 that can be reduced to a vacuum atmosphere by a suction device (not shown). The vacuum transport module TM also includes a vacuum transport device 220 for transporting substrates G inside the transport container 210.

[0016] The vacuum transfer device 220 moves the transfer container 210 to load and unload the substrate G to and from the processing module PM and / or the load lock module LLM. The operation of the vacuum transfer device 220 and the opening and closing of each gate valve 211, 212 are controlled by the control unit 90.

[0017] The vacuum conveying device 220 includes a base 221, a plurality of arms 222, a plurality of joints 223, and an end effector 224. The base 221 is fixed to the bottom of the conveying container 210 and supports the plurality of arms 222 so that they can rotate around a vertical axis. The base 221 may also be equipped with a moving mechanism (not shown) that moves horizontally (in the X-Y axis direction) inside the conveying container 210. The base 221 may also be equipped with a lifting mechanism (not shown) that raises and lowers the supported arms 222 vertically.

[0018] The multiple arms 222 constitute a SCARA-type articulated arm that moves the end effector 224 by the rotation of the multiple arms 222 relative to each other, with each joint 223 as the pivot point. Each arm 222 extends in a straight line and has joints 223 at both ends. Each joint 223 rotatably connects the ends of the vertically overlapping arms 222. In addition, the end arm 222 furthest from the base 221 is rotatably connected to the end effector 224 via a joint 223a.

[0019] The end effector 224 has a base portion 224a connected to the end arm 222, and a pair (two) claw portions 224b protruding from the base portion 224a. Each claw portion 224b extends parallel and linearly to each other and supports the substrate G on its upper surface. The spacing between each claw portion 224b should be set to an appropriate dimension that allows for stable support of the substrate G. Although the vacuum conveying device 220 shown in Figure 1 is configured with one end effector 224, the vacuum conveying device 220 may be equipped with multiple end effectors 224.

[0020] On the other hand, the load lock module LLM of the substrate processing system 1 is installed between the vacuum transport module TM and the atmospheric transport module, and can switch between an atmospheric atmosphere and a vacuum atmosphere by a pressure variable device (not shown). The load lock module LLM comprises a pressure variable container 310 capable of accommodating substrates G, and a stage 320 provided inside the pressure variable container 310 to support the substrates G. The load lock module LLM communicates with the vacuum transport module TM when the gate valve 212 is opened in a vacuum atmosphere. In addition, each load lock module LLM communicates with the atmospheric transport module when the door valve (not shown) is opened in an atmospheric atmosphere. The configuration of this load lock module LLM will be described in detail later.

[0021] The control unit 90 of the substrate processing system 1 is a computer having a processor 91, memory 92, and input / output interfaces, communication interfaces, etc. (not shown). The processor 91 is a combination of one or more of the following: CPU (Central Processing Unit), GPU (Graphics Processing Unit), ASIC (Application Specific Integrated Circuit), FPGA (Field-Programmable Gate Array), circuits made of multiple discrete semiconductors, etc. The memory 92 includes a main memory made of semiconductor memory, etc., and an auxiliary memory made of disks, semiconductor memory (flash memory), etc. The memory 92 may be configured by appropriately combining volatile memory and non-volatile memory (for example, compact disks, DVDs (Digital Versatile Discs), hard disks, flash memory, etc.).

[0022] Memory 92 stores a program for operating the board processing system 1 and a recipe for the board processing process conditions. The processor 91 controls each component of the board processing system 1 by reading and executing the program from memory 92. In other words, the control unit 90 is an electronic circuit having a CPU, GPU, ASIC, FPGA, etc., and performs the various control operations described in this specification by executing instruction codes stored in memory or by designing the circuit for special applications. The control unit 90 may be composed of a host computer or multiple client computers that communicate information via a network.

[0023] <Substrate Processing Device 100> Next, an example of a substrate processing device 100 that constitutes the processing module PM will be described with reference to Figure 2. Figure 2 is a longitudinal cross-sectional view showing an example of a substrate processing device 100.

[0024] The substrate processing apparatus 100 performs substrate processing on the substrate G, such as etching and film deposition. This substrate processing may also include temperature control, cleaning, and ashing. Furthermore, the substrate processing apparatus 100 shown in Figure 2 is an inductively coupled plasma (ICP) processing apparatus that applies plasma treatment to the substrate G.

[0025] The processing container 10 of the substrate processing apparatus 100 is divided into two spaces, upper and lower, by a metal window 40. The upper space, the antenna chamber A, is formed by the upper chamber 13 and the metal window 40, while the lower space, the processing space S, is formed by the lower chamber 17 and the metal window 40. In addition, the processing container 10 has a rectangular annular support frame 14 installed at the boundary between the upper chamber 13 and the lower chamber 17.

[0026] The upper chamber 13 forming the antenna room A comprises side walls 11 and a top plate 12. The upper chamber 13 is made of a metal such as aluminum or an aluminum alloy. The support frame 14 is also made of a metal such as aluminum or an aluminum alloy. The support frame 14 supports the upper chamber 13 on its upper surface and supports the outer periphery of the metal window 40 with its inner protruding portion.

[0027] The lower chamber 17, which has a processing space S inside, is formed in a concave shape by integrally molding the side wall 15 and the bottom plate 16. Alternatively, the side wall 15 and the bottom plate 16 may be manufactured separately and joined together to form the concave shape. The lower chamber 17 is made of a metal such as aluminum or an aluminum alloy, similar to the upper chamber 13. The lower chamber 17 is grounded via a grounding wire 21. Therefore, the entire processing container 10 is grounded.

[0028] A rectangular, annular (endless) seal groove 22 is formed at the upper end of the side wall 15 of the lower chamber 17. A sealing member 23, such as an O-ring, is fitted into the seal groove 22. The sealing member 23 contacts the contact surface of the support frame 14, sealing the lower chamber 17 and the support frame 14.

[0029] An opening 18 is formed in the side wall 15 of the lower chamber 17 for loading and unloading substrates G into and out of the lower chamber 17. The opening 18 is opened and closed by a gate valve 211. The lower chamber 17 is connected to a transport chamber (not shown) equipped with a transport mechanism. The substrate processing apparatus 100 enables the transport mechanism to load and unload substrates G by opening the opening 18 with the gate valve 211.

[0030] Furthermore, the lower chamber 17 is provided with a plurality of exhaust ports 19 on the bottom plate 16. A gas exhaust pipe 25 is connected to each exhaust port 19. An on-off valve 26 and an exhaust device 27 are installed on the gas exhaust pipe 25. The substrate processing apparatus 100 forms an exhaust system 28 with the gas exhaust pipe 25, the on-off valve 26 and the exhaust device 27. The exhaust device 27 has a vacuum pump such as a turbomolecular pump and evacuates the processing space S to a predetermined vacuum level during substrate processing. A pressure gauge (not shown) is installed in the lower chamber 17, and the detection information from this pressure gauge is transmitted to the control unit 90.

[0031] The mounting base 30 is installed inside the lower chamber 17. The mounting base 30 includes a base material 31 and an electrostatic chuck 32 laminated on the upper surface 31a of the base material 31. A base 33 made of insulating material and having a stepped portion on the inside is fixed on the bottom plate 16 of the lower chamber 17. The mounting base 30 is placed on the stepped portion of this base 33.

[0032] The base material 31 has a rectangular planar shape (planar view) and has planar dimensions similar to those of the substrate G placed on the mounting base 30. For example, the length of the long side of the base material 31 is approximately 1800 mm to 3400 mm, and the length of the short side of the base material 31 is approximately 1500 mm to 3000 mm. Alternatively, the length of the long side of the base material 31 may be approximately 300 mm to 1200 mm, and the length of the short side may be approximately 300 mm to 1000 mm. Also, for example, the thickness of the base material 31 is approximately 50 mm to 100 mm. The base material 31 is made of stainless steel, aluminum, aluminum alloy, etc.

[0033] The base material 31 has a meandering temperature-controlled medium flow path 36 that covers the entire area of ​​a rectangular plane. At both ends of the temperature-controlled medium flow path 36 are connected a supply pipe 37 that supplies the temperature-controlled medium to the temperature-controlled medium flow path 36 and a return pipe 38 that discharges the temperature-controlled medium that has flowed through the temperature-controlled medium flow path 36 and been heated. A chiller 73 is connected to the supply pipe 37 and the return pipe 38 via a supply path 71 and a return path 72. The chiller 73 has a main body that controls the temperature and discharge flow rate of the temperature-controlled medium and a pump that pressurizes and pumps the temperature-controlled medium. Examples of temperature-controlled mediums include refrigerants such as Garden (registered trademark) and Fluorinert (registered trademark). The temperature-controlled structure in the illustrated example is configured to circulate the temperature-controlled medium through the base material 31, but it may also be configured to control the temperature using a heater or a configuration that controls the temperature using both the temperature-controlled medium and a heater. The heater may be formed from, for example, tungsten, molybdenum, or a compound of any one of these metals with alumina or titanium. Furthermore, although the illustrated example shows a temperature-controlled medium channel 36 formed in the substrate 31, the electrostatic chuck 32 may also have a temperature-controlled structure.

[0034] Furthermore, a temperature sensor (not shown), such as a thermocouple, is installed on the substrate 31. The detection information detected by the temperature sensor is transmitted to the control unit 90. Based on the received detection information, the control unit 90 controls the temperature control structure to control the temperature of the substrate 31 and the substrate G. Specifically, the control unit 90 adjusts the temperature and flow rate of the temperature control medium supplied from the chiller 73 to the supply path 71. This temperature and flow rate-adjusted temperature control medium circulates in the temperature control medium flow path 36, thereby adjusting the temperature of the mounting table 30. The temperature sensor may also be installed in the electrostatic chuck 32.

[0035] The electrostatic chuck 32 is laminated on the upper surface 31a of the base material 31, and the substrate G is placed on it directly. The electrostatic chuck 32 includes a ceramic layer 34, which is a dielectric film formed by thermal spraying ceramics such as alumina, and a conductive layer 35 (electrode) embedded inside the ceramic layer 34 and having an electrostatic adsorption function.

[0036] The conductive layer 35 is connected to a DC power supply 85 via a power supply line 84. When the control unit 90 turns on the switch (not shown) of the power supply line 84, a DC voltage is applied to the conductive layer 35 from the DC power supply 85, generating a Coulomb force on the upper surface of the electrostatic chuck 32. Due to this Coulomb force, the substrate G is electrostatically attracted to the upper surface of the electrostatic chuck 32.

[0037] The outer circumference of the electrostatic chuck 32 and the base material 31, and the upper surface of the base 33 form a stepped portion on which a rectangular annular focus ring 39 is placed. The focus ring 39 is made of ceramics such as alumina or quartz. When the focus ring 39 is placed on the stepped portion, the upper surface of the focus ring 39 is set to be lower than the upper surface of the electrostatic chuck 32.

[0038] A power supply member 80 is connected to the lower surface of the substrate 31. A power supply line 81 is connected to the lower end of the power supply member 80. The power supply line 81 is connected to a high-frequency power supply 83, which is a bias power supply, via an impedance matching unit 82. The high-frequency power supply 83 supplies high-frequency power of, for example, 3.2 MHz to the mounting stage 30. As a result, the mounting stage 30 generates an RF bias and can attract ions constituting the plasma generated in the processing space S by the high-frequency power supply 55, which is a source for plasma generation, to the substrate G. Therefore, the substrate processing apparatus 100 can individually control and increase both the etching rate and the etching selectivity ratio in the etching process.

[0039] As described above, the mounting base 30 supports the substrate G and also forms bias electrodes that generate RF bias. At this time, the part of the chamber that is at ground potential functions as the counter electrode of the bias electrode, forming a return circuit for high-frequency power. The metal window 40 may also be configured as part of the return circuit for high-frequency power.

[0040] The metal window 40 includes a conductor plate 41 and a shower plate 42. The conductor plate 41 and the shower plate 42 are preferably made of a metal that is nonmagnetic, conductive, and corrosion-resistant, or a metal that has been treated with a corrosion-resistant surface finish. For example, the conductor plate 41 and the shower plate 42 can be made of aluminum, an aluminum alloy, stainless steel, etc. Examples of corrosion-resistant surface treatments include anodizing and ceramic spraying. In addition, the lower surface of the shower plate 42 facing the processing space S may be treated with a plasma-resistant coating by anodizing or ceramic spraying. The conductor plate 41 is grounded via a grounding wire (not shown), and the shower plate 42 is also grounded via the conductor plate 41.

[0041] A spacer (not shown) made of an insulating material is installed above the metal window 40, and the high-frequency antenna 50 is positioned away from the conductor plate 41 by this spacer. In other words, the high-frequency antenna 50 is supported by the metal window 40 via the spacer. The high-frequency antenna 50 is formed by winding an antenna wire made of a conductive metal such as copper in an annular or spiral shape.

[0042] Furthermore, a power supply member 53, located above the upper chamber 13, is connected to the high-frequency antenna 50. A power supply line 54 is connected to the upper end of the power supply member 53, and the power supply line 54 is connected to the high-frequency power supply 55 via an impedance matching unit 52. The high-frequency power supply 55, for example, supplies high-frequency power of 13.56 MHz to the high-frequency antenna 50, thereby forming an induced electric field in the lower chamber 17. This induced electric field causes the processing gas supplied from the shower plate 42 to the processing space S to be plasma-activated, generating an inductively coupled plasma, and ions in the plasma are supplied to the substrate G.

[0043] The high-frequency power supply 55 is a source for plasma generation, and the high-frequency power supply 83 connected to the mounting table 30 serves as a bias power supply that attracts generated ions and imparts kinetic energy thereto. As described above, the source generates plasma using inductive coupling, and the bias power supply, which is a separate power source, is connected to the mounting table 30 to control ion energy. Accordingly, the high-frequency power supply 55 can independently control plasma generation and ion energy, thereby increasing the degree of freedom of the process.

[0044] Further, the metal window 40 includes divided metal windows 43 that are divided regions divided into a plurality of sections. Each divided metal window 43 is insulated from the support frame 14 and adjacent divided metal windows 43 by providing an insulating member (not shown) formed of a fluororesin such as PTFE (Polytetrafluoroethylene). Each divided metal window 43 is suspended from the top plate 12 of the upper chamber 13 by a plurality of suspenders (not shown). Since the high-frequency antenna 50 for generating plasma is also supported by the metal window 40, it is indirectly suspended by the suspenders.

[0045] The conductor plate 41 has a recess on its lower surface (the surface facing the shower plate 42). The recess is formed in a planar shape corresponding to each divided metal window 43 constituted by the conductor plate 41, and forms a gas diffusion chamber 45 in a stacked state with the shower plate 42. Further, a through hole 41a that communicates the upper surface of the conductor plate 41 with the gas diffusion chamber 45 is provided in an upper portion of the conductor plate 41. A gas introduction pipe 46 is installed in the through hole 41a. Note that the recess forming the gas diffusion chamber 45 may be formed on the upper surface of the shower plate 42.

[0046] The respective gas introduction pipes 46 communicating with the gas diffusion chambers 45 of the respective divided metal windows 43 are gathered at one location in the antenna chamber A. The gas introduction pipes 46 gathered at one location pass through a supply port 12a formed in the top plate 12 of the upper chamber 13, and are connected to a processing gas supply source 64 via an airtightly connected gas supply pipe 61.

[0047] The gas supply pipe 61 is provided with an opening / closing valve 62 and a flow rate controller 63 such as a mass flow controller at an intermediate position. A processing gas supply unit 60 is formed by the gas supply pipe 61, the opening / closing valve 62, the flow rate controller 63, and a processing gas supply source 64. Note that the processing gas supply unit 60 may be configured to branch the gas supply pipe 61 halfway, and by providing an opening / closing valve, a flow rate controller, and a processing gas supply source for each branch pipe, can be configured to supply a plurality of types of processing gas.

[0048] In plasma processing, the processing gas supply unit 60 supplies processing gas from the processing gas supply source 64 to the gas diffusion chamber 45 of each divided metal window 43 via the gas supply pipe 61 and the gas introduction pipe 46. This processing gas is discharged from each gas diffusion chamber 45 into the processing space S via each gas discharge hole 44 of each shower plate 42.

[0049] Note that, without combining the gas introduction pipes 46 of the respective divided metal windows 43 into one, each may be configured to independently communicate with the processing gas supply unit 60 and supply processing gas to each divided metal window 43. Furthermore, each divided metal window 43 may have its own individual high-frequency antenna, and may be configured to individually apply high-frequency power to each high-frequency antenna.

[0050] Furthermore, the control unit 90 of the substrate processing system 1 transmits commands to a controller (not shown) of the substrate processing apparatus 100, thereby controlling each component of the substrate processing apparatus 100 to execute substrate processing. The controller is, for example, a computer including a processor, a memory, an input / output interface, a communication interface, and the like, and controls the operations of the chiller 73, the high-frequency power supplies 55 and 83, the processing gas supply unit 60, the exhaust system 28, and the like.

[0051] In the substrate processing system 1 described above, after the substrate G is loaded into the load lock module LLM by the atmospheric transport module, the load lock module LLM is depressurized to a vacuum atmosphere. Then, the substrate processing system 1 opens the gate valve 212 and allows the vacuum transport device 220 of the vacuum transport module TM to enter the load lock module LLM and receive the substrate G from the load lock module LLM. The vacuum transport device 220 then transports the substrate G from the load lock module LLM to the transport container 210 and further loads the substrate G into the processing module PM, which has its gate valve 211 opened. The substrate processing device 100 of the processing module PM performs substrate processing on this substrate G.

[0052] Here, the substrate processing system 1 needs to accurately place the substrate G on the mounting table 30 of the processing module PM. In conventional substrate processing systems, before placing the substrate G on the mounting table, the substrate G was brought into contact with a plurality of mechanical contact rollers (not shown) provided on the stage of the load lock module to align the substrate G. However, positioning the substrate G using each contact roller causes particles to be generated at the time of contact. Therefore, the substrate processing system 1 is configured to suppress misalignment of the substrate G placed on the mounting table 30 by correcting the position of the substrate G held by the vacuum transfer device 220 in the load lock module LLM in advance without contacting the substrate G.

[0053] <Load Lock Module LLM> Next, the configuration of the load lock module LLM will be described with reference to Figures 3A and 3B. Figure 3A is a plan cross-sectional view showing the load lock module LLM according to the first embodiment. Figure 3B is a side cross-sectional view of the load lock module LLM according to the first embodiment.

[0054] The load lock module LLM comprises a pressure variable container 310 and a stage 320 installed inside the pressure variable container 310. The load lock module LLM also includes a configuration for accurately calculating the position of the mounted substrate G.

[0055] The pressure-variable container 310 is formed in the shape of a rectangular parallelepiped to accommodate a rectangular substrate G. The pressure-variable container 310 has an internal space 310s which can be switched between an atmospheric atmosphere and a vacuum atmosphere by a pressure-variable device (not shown). Specifically, the pressure-variable container 310 includes a concave container body 311 with an openable top and a top plate 312 that covers the open portion of the container body 311. The container body 311 includes a bottom plate 311a that supports the stage 320 and side walls 311b that protrude vertically upward from the periphery of the bottom plate 311a.

[0056] The base plate 311a has sufficient thickness and rigidity to allow the stage 320 to be installed horizontally. The side wall 311b surrounds the rectangular base plate 311a and protrudes briefly in the vertical direction. A sealing member (not shown) is provided between the upper end of this side wall 311b and the lower surface of the top plate 312 to airtightly close the internal space 310s.

[0057] Furthermore, substrate transport openings 313 and 314 are provided on the side wall 311b. Substrate transport opening 313 is connected to a gate valve 212 (see Figure 1) on the vacuum transport module TM side. The outer opening of the substrate transport opening 313 is airtightly opened and closed by the valve body (not shown) of the gate valve 212. On the other hand, substrate transport opening 314 is connected to a door valve on the atmospheric transport module side.

[0058] The stage 320 is fixed to the base plate 311a and has a mounting surface 320a for the substrate G at a predetermined height position vertically above the base plate 311a. In plan view, the stage 320 is formed in a rectangular shape having a pair of long sides 321 and a pair of short sides 322. Each long side 321 has dimensions approximately the same as each long side of the substrate G, and each short side 322 has dimensions approximately the same as each short side of the substrate G.

[0059] Furthermore, the stage 320 according to the first embodiment is provided with a plurality of notches 323 that are recessed toward the inside of the stage 320, located near the four corners 324 where the long side 321 and the short side 322 intersect. Each notch 323 allows the detection of the outer edge of the substrate G by transmitting the detection light of the detector 330. Each notch 323 is formed on both the long side 321 and the short side 322 near each corner 324. For example, each notch 323 provided on the long side 321 is recessed in a direction perpendicular to the long side 321 at a position a certain distance away from each corner 324. Similarly, each notch 323 provided on the short side 322 is recessed in a direction perpendicular to the short side 322 at a position a certain distance away from each corner 324. However, the notches 323 are formed according to the installation of the detector 330, and there may be locations where notches are provided depending on the number and installation position of the detector 330.

[0060] Furthermore, the variable-pressure container 310 is provided with windows 315 that can transmit the detection light of the detector 330 to the bottom plate 311a and top plate 312 at positions corresponding to each notch 323. The windows 315 are formed of transparent glass or resin material. The windows 315 are fitted into the bottom plate 311a and top plate 312 by sealing members (not shown), thereby airtightly closing the internal space 310s.

[0061] The detector 330 is a transmissive optical sensor comprising a light-emitting unit 331 that emits detection light and a light-receiving unit 332 that receives the detection light from the light-emitting unit 331. The detector 330 has the light-emitting unit 331 and the light-receiving unit 332 installed outside the pressure variable container 310. The light-emitting unit 331 and the light-receiving unit 332 are arranged to sandwich the pressure variable container 310 in the vertical direction. The detector 330 may also be a reflective optical sensor that detects the substrate G by receiving the reflected light of the detection light that strikes the substrate G.

[0062] For example, the light-emitting unit 331 is held by a holder 333 on the vertically upper side of the top plate 312. The light-emitting unit 331 has a main body 331a that emits detection light and a power port 331b that supplies power to the main body 331a. Inside the main body 331a, there is an element that can emit detection light of a preset wavelength and light intensity based on the power supplied from the power port 331b. The main body 331a has an emission window that emits detection light at a position facing the window 315 of the variable pressure container 310. The holder 333 shields the surrounding area from light while holding the light-emitting unit 331 by surrounding the emission window.

[0063] Meanwhile, the light-receiving unit 332 is held by a holder 333 on the vertically lower side of the bottom plate 311a. The light-receiving unit 332 has a main body 332a that receives detection light, and a port 332b that supplies power to the main body 332a and outputs detection information based on the received detection light. The main body 332a of the light-receiving unit 332 has an inlet window positioned opposite the window 315 of the variable pressure container 310. The holder 333 surrounds the inlet window, holding the light-receiving unit 332 while shielding the surroundings from light. In addition, a signal processing circuit is provided inside the main body 332a that converts the received detection light into an electrical signal to generate detection information. The detector 330 may be configured by installing a light-emitting unit 331 on one of the top plate 312 and the bottom plate 311a, and a light-receiving unit 332 on the other. Alternatively, the light-receiving unit 332 may be provided on the top plate 312 and the light-emitting unit 331 on the bottom plate 311a.

[0064] Figure 4A shows the detection state of the outer edge of the substrate G by the detector 330. Figure 4B shows an example of the electrical signal detected by the detector 330. The main body 331a of the light-emitting unit 331 employs a line sensor that emits linear detection light L in the vertical downward direction by arranging a plurality of elements linearly inside. The light-receiving unit 332 is configured to receive this linear detection light L and output an electrical signal corresponding to the width of the detection light L.

[0065] For example, as shown in Figure 4A, the detector 330, which is a line sensor, irradiates detection light L so as to straddle the outer edge of the substrate G placed on the stage 320. When this detection light L is partially blocked by the substrate G, the light receiving unit 332 receives the detection light L on the line that is partially unblocked and not received, while other parts are blocked and not received. As a result, the light receiving unit 332 generates an electrical signal as shown in Figure 4B, and can recognize the blocked position where the light intensity changes significantly as the outer edge of the substrate G. The detector 330 transmits the coordinate information of the outer edge of the substrate G to the control unit 90 by referring to pre-stored position information.

[0066] As described above, the detector 330 emits detection light from the light-emitting unit 331 toward the vertically downward pressure variable container 310. As a result, the detection light passes through the window 315 of the top plate 312 and moves from top to bottom in the internal space 310s. The detection light then passes through the notch 323 of the stage 320 and through the window 315 of the bottom plate 311a and is received by the light-receiving unit 332. However, the positions of the light-emitting unit 331 and the light-receiving unit 332 are not particularly limited, and their vertical positions may be reversed.

[0067] Multiple detectors 330 are provided on the two sides (long side 321 and short side 322) that form the four corners of the stage 320. In other words, there are two detectors 330 near each corner, and a total of eight detectors 330 are provided at all four corners. Hereafter, the eight detectors 330 may be referred to as detectors 330A to 330H, as shown in Figure 3A, with reference numerals A to H. Specifically, detector 330A is located on the upper right side of the stage 320, on the short side 322. Detector 330B is located on the lower right side of the stage 320, on the short side 322. Detector 330C is located on the right side of the stage 320, on the long side 321. Detector 330D is located on the left side of the stage 320, on the long side 321. Detector 330E is located on the lower left side of the stage 320, on the short side 322. Detector 330F is located on the left side of the stage 320, on the short side 322 and on the upper side. Detector 330G is located on the upper side of the stage 320, on the long side 321 and on the left side. Detector 330H is located on the upper side of the stage 320, on the long side 321 and on the right side.

[0068] The control unit 90 (see Figure 1) can calculate the position of the substrate G placed on the stage 320 in the variable pressure container 310 by acquiring and processing detection information from each detector 330. Next, the position calculation process for calculating the position of the substrate G will be explained with reference to Figures 5A to 6B. Figure 5A is the first explanatory diagram for explaining the procedure for calculating the position of the substrate G. Figure 5B is the second explanatory diagram for explaining the procedure for calculating the position of the substrate G. Figure 6A is the third explanatory diagram for explaining the procedure for calculating the position of the substrate G. Figure 6B is the fourth explanatory diagram for explaining the procedure for calculating the position of the substrate G.

[0069] The control unit 90 uses the coordinate information of the outer edges of all eight detectors 330 to calculate the inclination angle Δθ of the substrate G relative to the design value of the stage 320, as shown in Figure 5A. The control unit 90 has in advance coordinate information of two detectors 330 (detector 330C, detector 330D) provided on one long side 321 as the design value of the stage 320. The same applies to the other long side 321 and the pair of short sides 322. The coordinate information between the two detectors 330C and detector 330D, which are arranged in a straight line, partially represents the edge of the stage 320. Based on the coordinate information of each outer edge of the substrate G that has been acquired, the control unit 90 can easily calculate the inclination angle Δθ relative to the edge represented by the design value.

[0070] Subsequently, as shown in Figure 5B, the control unit 90 calculates line segments connecting the acquired positional information of each edge of the substrate G, and generates virtual lines IL1 and IL2 by extending these line segments. Four line segments are formed in total between detectors 330A and 330B, between detectors 330C and 330D, between detectors 330E and 330F, and between detectors 330G and 330H. Virtual line IL1 is formed by two line segments corresponding to two line segments in the same direction as the pair of long sides 321. Virtual line IL2 is formed by two line segments corresponding to two line segments in the same direction as the pair of short sides 322. Each of these virtual lines IL1 and IL2 corresponds to the shape of each side of the substrate G estimated by the control unit 90 based on the detection information of the detectors 330. Furthermore, based on each of the virtual lines IL1 and IL2, the control unit 90 calculates the coordinate information of the four intersection points CP where the virtual lines IL1 and IL2 intersect. The coordinate information for each intersection point CP corresponds to the position of the four corners of the substrate G estimated by the control unit 90.

[0071] Furthermore, as shown in Figure 6A, the control unit 90 calculates the intersection of two diagonals by drawing two diagonals based on the coordinate information of each calculated intersection point CP. The intersection of the two diagonals corresponds to the center position GO of the substrate G estimated by the control unit 90.

[0072] Therefore, as shown in Figure 6B, the control unit 90 calculates the positional displacement state of the center position GO of the substrate G relative to the center position SO of the stage 320, which is held in advance. The center position SO of the stage 320 corresponds to the reference position for transporting the substrate G in the load lock module LLM. The positional displacement state of the substrate G includes the direction and amount of the positional displacement of the center position GO of the substrate G relative to the center position SO of the stage 320. For example, when the horizontal position is recognized in X-Y coordinates, the positional displacement state of the center position GO of the substrate G can be expressed as ΔX, which is the positional displacement amount in the X-axis direction, and ΔY, which is the positional displacement amount in the Y-axis direction. Note that the comparison target (reference position) for calculating the positional displacement state with respect to the substrate G is not limited to the stage 320, but may also be another substrate G' (see Figure 1) transported from the processing module PM to the load lock module LLM. In this case, the outer edge of another substrate G', which is offset inward or outward from the outer edge of the mounting surface of the mounting table 30 of the processing module PM, is aligned (positioned) on opposite sides in advance in a plan view, along with the offset direction from the outer edge of the mounting surface (i.e., inward or outward) and the offset distance. This makes it possible to align the center position of the other substrate G' with the mounting table 30 and eliminate the tilt angle. In this state, the other substrate G' is transported to the load lock module LLM and the position of the other substrate G' is measured, thereby indirectly measuring the position of the mounting table 30. In other words, the control unit 90 can obtain the tilt angle Δθ' between the substrate G' and the mounting table 30, the positional displacement in the X-axis direction ΔX', and the positional displacement in the Y-axis direction ΔY'.

[0073] As described above, the control unit 90 can accurately calculate the misalignment state of the substrate G based on the detection information of each detector 330. When the control unit 90 receives the substrate G from the vacuum transfer device 220, it corrects the operation of the vacuum transfer device 220 based on the misalignment state of the substrate G, thereby enabling the substrate G to be held with high accuracy.

[0074] The substrate processing system 1 according to the first embodiment is basically configured as described above, and its operation (substrate transport method) will be explained below with reference to Figures 7A and 7B. Figure 7A is a flowchart showing the processing flow of the substrate transport method. Figure 7B is a flowchart showing the processing flow of the position calculation process.

[0075] The control unit 90 controls each component of the substrate processing system 1 and sequentially executes steps S101 to S105 shown in Figure 7A.

[0076] Specifically, the substrate processing system 1 transports the substrate G using an air transport module and places the substrate G on the stage 320 of the load lock module LLM (step S101). The control unit 90 may, in controlling the air transport module, perform the transport of the substrate G based on a pre-programmed target position (reference position) of the stage 320.

[0077] Next, the load lock module LLM uses each of the installed detectors 330 to detect the outer edges near the four corners of the substrate G placed on the stage 320 (step S102: step (A)). The coordinate information of the outer edges of the substrate G detected by each detector 330 is transmitted to the control unit 90. Each detector 330 is positioned such that the center of the width W of the detection light of the detector 330 coincides with the substrate G placed at the reference position, for example, as shown in Figure 12. This allows each detector 330 to stably acquire coordinate information of the outer edges of the substrate G.

[0078] When the control unit 90 obtains coordinate information of the outer edge of the substrate G, it performs the position calculation process described above (step S103: step (B)).

[0079] In this position calculation process, the position of the substrate G, including the misalignment state, is calculated by internal processing of the control unit 90 according to the procedure shown in Figure 7B. Specifically, in the position calculation process, first, the tilt angle Δθ of the substrate G with respect to the stage 320 is calculated based on the detection information of each detector 330, for example, using the following equation (1) (step S1031: see also Figures 5A and 12). Δθ = ArcTan((XD2 - XD1) / L1) ... (1) Here, XD1 is the distance from the outer end of the detection light of detector 330U to one side of the substrate G. Also, XD2 is the distance from the outer end of the detection light of detector 330V to one side of the substrate G. L1 is the distance between detectors 330U and 330V that are aligned on the same side.

[0080] Next, the control unit 90 generates four virtual lines IL on the substrate G based on the detection information from each detector 330, and calculates four intersection points CP where each virtual line intersects (step S1032: see also Figure 5B).

[0081] Furthermore, the control unit 90 calculates the center position GO of the substrate G by drawing the diagonals of the four calculated intersection points CP (step S1033: see also Figure 6A).

[0082] Finally, the control unit 90 calculates the positional displacement state (direction of displacement, amount of displacement) of the substrate G based on the calculated center position GO of the substrate G and the center position SO of the stage 320 (step S1034: see also Figure 6B).

[0083] By performing the above position calculation process, the control unit 90 can efficiently and accurately recognize the misalignment state of the substrate G relative to the stage 320. Therefore, as shown in Figure 7A, after the position calculation process, the control unit 90 corrects the target position at which the vacuum transfer device 220 receives the substrate G in the load lock module LLM based on the calculated misalignment state (step S104: (C)).

[0084] Then, the vacuum transport device 220 of the vacuum transport module TM moves itself based on the corrected target position to hold the substrate G (step S105). As a result, the vacuum transport device 220 can accurately hold the substrate G and transport it.

[0085] Figure 8A is a plan view showing an example of the vacuum transfer device 220 holding the substrate G on the stage 320. Figure 8B is a plan view showing an example of the vacuum transfer device 220 placing the substrate G on the mounting table 30 of the processing module PM. As shown in Figure 8A, even if the substrate G is placed at an angle relative to the stage 320 of the load lock module LLM, the substrate processing system 1 can adjust the end effector 224 of the vacuum transfer device 220 to the appropriate orientation based on the detection information of each detector 330.

[0086] Specifically, the vacuum transfer device 220 uses the tilt angle Δθ calculated in the position calculation process to operate the joint portion 223a of the end arm 222 to adjust the rotation angle of the end effector 224. As a result, the end effector 224 tilts with respect to the X-axis direction of the stage 320 (the direction along the long side 321 of the stage 320) with respect to the joint portion 223a as the pivot point. For example, each claw portion 224b of the end effector 224 is adjusted to a position where it extends parallel to the long side of the tilted substrate G. As a result, it is possible to prevent each claw portion 224b from contacting areas on the substrate G where contact by the end effector 224 is undesirable (hereinafter referred to as the non-contact area NA) due to the formation of semiconductor devices. For example, each claw portion 224b is positioned to extend parallel to the non-contact area NA in between.

[0087] Furthermore, when the vacuum transfer device 220 holds the substrate G, it moves (advances and retracts) the end effector 224 based on the correction content (positional displacement state of the substrate G) calculated in the position calculation process. As a result, the end effector 224 can receive the substrate G from the stage 320 with the center position GO of the substrate G aligned with the center position of the end effector 224 which is scheduled to hold the substrate G.

[0088] As a result, as shown in Figure 8B, the vacuum transport device 220 can transport the rectangular substrate G so that it is parallel to the rectangular mounting table 30 of the processing module PM and place it on the mounting table 30. In other words, the vacuum transport device 220 can accurately transport the substrate G to the mounting table 30 of the processing module PM by holding the substrate G in a manner that eliminates any misalignment of the substrate G when holding it in the load lock module LLM.

[0089] Furthermore, since each detector 330 typically includes a lens to adjust the detection light, the detection accuracy decreases slightly as you move away from the center of the detection light's width. Therefore, the displacement of the substrate G can be accurately recognized by detecting it near the center of the detection light. The substrate processing system 1 may perform additional displacement correction using the vacuum transfer device 220 between steps S1032 and S1033 to improve the detection accuracy of each detector 330. For example, in the additional displacement correction, equation (2) is used for the X-axis direction and equation (3) is used for the Y-axis direction to move the substrate G to align with the corner of the reference position of the substrate G (see also Figure 12). Correction amount for the X-axis: ΔX = XD2 - W / 2 + (L2 × tanθ) ... (2) Correction amount for the Y-axis: ΔY = YD1 - W / 2 - L3 × tanθ ... (3) Here, YD1 is the distance from the outer edge of the detection light of the detector 330W to one side of the substrate G. Furthermore, L2 is the distance from detector 330V to the corner of substrate G at the reference position. L3 is the distance from detector 330W to the corner of substrate G at the reference position.

[0090] It should be noted that the substrate processing system 1 and substrate transport method according to this disclosure are not limited to the first embodiment described above, and various modifications are possible. For example, the substrate processing system 1 and substrate transport method may transport the substrate G based on the target position of the mounting table 30, which is indirectly represented by measuring the position of another substrate G' in advance within the load lock module LLM.

[0091] Figure 9A is a diagram illustrating the arrangement of the detectors 330 according to a modified example. Figure 9B is a diagram showing a pattern in which six detectors 330 are installed on the stage 320. Figure 9C is a diagram showing a pattern in which five detectors 330 are installed on the stage 320. As shown in Figures 9A to 9C, the number of detectors 330 that detect the outer edge near the corners of the substrate G may be fewer than eight relative to the container.

[0092] For example, when using six detectors 330, as shown in Figure 9B, each detector 330 is arranged to detect at least one edge of the substrate G at the four corners of the stage 320. Even in this case, the substrate processing system 1 can estimate the tilt angle Δθ of the substrate G and the shape of the four virtual lines IL based on the detection information of the six detectors 330, and thus can appropriately calculate the center position GO of the substrate G and its displacement state.

[0093] For example, even when there are five detectors 330, as shown in Figure 9C, each detector 330 can be arranged so as to detect at least one outer edge of the substrate G at the four corners of the stage 320. In this case as well, the substrate processing system 1 can estimate the tilt angle Δθ of the substrate G and the shape of the four virtual lines IL based on the detection information of the five detectors 330, and thus can appropriately calculate the center position GO of the substrate G and its displacement state.

[0094] Although not shown in Figure 9, it is of course possible to appropriately calculate the center position GO of the substrate G and its displacement even when there are seven detectors 330. Alternatively, although the accuracy of the substrate processing system 1 may be lower compared to using eight to five detectors 330, one detector 330 may be placed at each of the four corners of the stage 320 to calculate the center position GO of the substrate G and its displacement.

[0095] Figure 10 is a schematic plan view showing another modified substrate processing system 1A. As shown in Figure 10, the substrate processing system 1A is configured to transport a substrate G between two processing modules PM1 and PM2 to perform substrate processing. Note that the load lock module LLM, atmospheric transport module, etc., are not shown in Figure 10.

[0096] Thus, even when transporting the substrate G between two processing modules PM1 and PM2, for example, during substrate processing in processing module PM1, there is a possibility that the substrate G may tilt or deform relative to the mounting table 30. Therefore, the substrate processing system 1A is configured to recognize the misalignment of the substrate G by installing each detector 330 in the processing module PM at a position corresponding to each detector 330 of the load lock module LLM and detecting the position of the outer edge of the substrate G. In this case, the end effector 224 of the vacuum transport device 220 functions as a stage that holds the substrate G in a waiting position when each detector 330 detects something.

[0097] The control unit 90 controls the vacuum transport device 220 based on the misalignment state of the substrate G in the processing module PM1 detected by each detector 330. This allows the end effector 224 to accurately hold the substrate G when unloading it from the processing module PM1 and to load the substrate G into the processing module PM2. For example, during substrate processing in the processing module PM2, tilting or deformation of the substrate G relative to the mounting table 30 may occur. For this reason, the substrate processing system 1A may install each detector 330 in the processing module PM2 at a position corresponding to each detector 330 of the load lock module LLM, and recognize the misalignment state of the substrate G by detecting the position of the outer edge of the substrate G after substrate processing. The arrangement of each detector 330 in the load lock module LLM and the arrangement of each detector 330 in the processing modules PM1, PM2, etc. may be the same or different.

[0098] Figure 11 is a schematic plan view showing a substrate processing system 1B according to another modified example. As shown in Figure 11, the substrate processing system 1B differs from the substrate processing system 1A in that it is equipped with a plurality of detectors 330 in the atmospheric transport module ATM, and the atmospheric transport module ATM recognizes the positional displacement state of the substrate G.

[0099] For example, the atmospheric transport module (ATM) comprises a transport container 410 and an atmospheric transport device 420 capable of transporting a substrate G. The atmospheric transport device 420 is configured substantially the same as the vacuum transport device 220 described above. Each detector 330 is provided at an arbitrary position on the transport container 410 (for example, at one end) and is positioned according to the dimensions of the rectangular substrate G. The atmospheric transport module (ATM) can detect the outer edge of the substrate G while it is being held by the atmospheric transport device 420 by transporting the substrate G, which is being held by the atmospheric transport device 420, to a position facing each detector 330.

[0100] In this process, the atmospheric transport device 420 transports the substrate G to the central position 330o inside the enclosure of each detector 330 as the target position, and has the substrate G wait at that position, thereby enabling good detection of the substrate G by each detector 330. The control unit 90 can then recognize the misalignment state of the substrate G in the atmospheric transport module ATM based on the detection information from each detector 330. The substrate processing system 1B corrects the loading position (or tilt angle) of the substrate G when loading the substrate G into the load lock module LLM based on the recognized misalignment state of the substrate G. This enables the substrate processing system 1B to accurately place the substrate G into the load lock module LLM.

[0101] It should be noted that the configuration in which the atmospheric transport module ATM detects the substrate G using each detector 330 while the atmospheric transport device 420 is holding the substrate G can also be realized in the vacuum transport module TM and the vacuum transport device 220. Furthermore, the substrate processing system 1B may install a substrate standby module on the atmospheric transport module ATM or the vacuum transport module TM, on which the substrate G can be temporarily placed, and install each detector 330 on this substrate standby module. This allows the atmospheric transport device 420 or the vacuum transport device 220 to appropriately correct the position of the substrate G based on the misalignment state of the substrate G when receiving the substrate G from the substrate standby module.

[0102] Figure 13A is a plan cross-sectional view showing the load lock module LLM according to the second embodiment. Figure 13B is a diagram illustrating the imaging information PI captured by the detector 340 of the load lock module LLM according to the second embodiment. As shown in Figure 13A, the load lock module LLM according to the second embodiment differs from the load lock module LLM that uses the line sensor detector 330 described above in that it uses two or more (four in the second embodiment) camera detectors 340.

[0103] Specifically, one detector 340 is installed at each of the four corners of the stage 320 of the load lock module LLM. In the following, each detector 340 may be described as detector 340A, 340B, 340C, and 340D, in clockwise order from the upper right of Figure 13A. The stage 320 of the load lock module LLM has notches 324c, each of the four corners 324 (see Figure 3), which are cut out in a rectangular shape, in order to be imaged by each detector 340. Each detector 340 faces the corner of the substrate G placed on the stage 320 through these notches 324c, and can capture imaging information PI as shown in Figure 13B.

[0104] The imaging information PI captured by each detector 340 includes the corners Gc of the substrate G. In the illustrated example, the corners Gc of the substrate G are rounded. However, the shape of the corners Gc of the substrate G is not particularly limited and may be right-angled. The imaging information PI also includes a pair of sides of the substrate G that are continuous with the corners Gc. The control unit 90 can extract this pair of sides by image processing of the imaging information PI and generate virtual lines IL1 and IL2 that overlap (follow) each side. Therefore, even if the corners Gc are rounded, the coordinate position of the intersection point CP where the two virtual lines IL1 and IL2 intersect can be easily calculated by extending the two virtual lines IL1 and IL2.

[0105] Figure 14A is a side cross-sectional view of a load lock module LLM to which a camera-like detector 340 is applied. Figure 14B is a side cross-sectional view showing the configuration of the detector 340 of a modified load lock module LLM. As shown in Figure 14A, each detector 340 is installed on the bottom plate 311a and the top plate 312 of the pressure variable vessel 310.

[0106] Specifically, the detector 340 includes an illumination mechanism 341, which is a light-emitting unit that irradiates light into the variable-pressure container 310; an imaging mechanism 342, which is a light-receiving unit that images the inside of the variable-pressure container 310; and a holder 343 that holds the illumination mechanism 341 or the imaging mechanism 342. For example, the illumination mechanism 341 is installed on the top plate 312, while the imaging mechanism 342 is installed on the bottom plate 311a. Based on the control of the control unit 90, the illumination mechanism 341 irradiates the inside of the variable-pressure container 310 with an appropriate amount of light by passing it through a window 315 installed on the top plate 312. Based on the control of the control unit 90, the imaging mechanism 342 images the inside of the variable-pressure container 310, which has been irradiated by the illumination mechanism 341, through the window 315 installed on the bottom plate 311a. However, the installation positions of the illumination mechanism 341 and the imaging mechanism 342 are not limited to those described above. For example, the illumination mechanism 341 may be provided on the bottom plate 311a and the imaging mechanism 342 may be provided on the top plate 312.

[0107] The illumination mechanism 341 and imaging mechanism 342, installed in the pressure-variable container 310, overlap and face each other in the vertical direction. Therefore, light emitted from the illumination mechanism 341 enters the imaging mechanism 342 through the pressure-variable container 310. When the substrate G is placed on the stage 320, the imaging mechanism 342 can stably image the corners Gc of the substrate G.

[0108] Furthermore, the detector 340 is not limited to installing the illumination mechanism 341 and the imaging mechanism 342 separately; they may also be installed in the same direction (a configuration for so-called coaxial imaging). For example, in the example shown in Figure 14B, an imaging unit is formed by integrally installing the illumination mechanism 341 and the imaging mechanism 342 on the bottom plate 311a. In this case, the detector 340 fixes the housing case 344, which houses the illumination mechanism 341 and the imaging mechanism 342, to the bottom plate 311a.

[0109] For example, inside the housing case 344, an illumination mechanism 341 is provided at a position facing the window 315, while an imaging mechanism 342 is provided at a position perpendicular to the illumination mechanism 341. The detector 340 also includes a half-mirror 345 between the illumination mechanism 341 and the window 315. The half-mirror 345 transmits light from the illumination mechanism 341 while bending the reflected light from inside the pressure-variable container 310 and guiding it to the imaging mechanism 342. With this configuration, the detector 340 can accurately image the area around the corner Gc of the substrate G.

[0110] Furthermore, the installation position of the detector 340, which is the imaging unit, is not limited to the bottom plate 311a, but may also be on the top plate 312. By equipping the load lock module LLM with the detector 340 (illumination mechanism 341 and imaging mechanism 342) on the top plate 312, it is also possible to avoid forming a notch 324c in the stage 320.

[0111] Figure 15A is a first explanatory diagram illustrating the calculation of the position of the substrate G according to the second embodiment. Figure 15B is a second explanatory diagram illustrating the calculation of the position of the substrate G according to the second embodiment. As shown in Figure 15A, detectors 340A to 340D each have an imaging range AF along the notch 324c of the stage 320, and image the corners Gc (see Figure 13B) of the substrate G that fall within this range. If the corners Gc of the substrate G do not fall within the imaging range AF, it can be said that an abnormality has occurred in the transport of the substrate G. Therefore, if the corners Gc are not detected in the imaging information PI, the substrate processing system 1 should take out the substrate G and transport it again, or report a transport error.

[0112] As described above, the control unit 90 can obtain the intersection points CP of the four corners of the substrate G based on the imaging information PI captured after the substrate G is placed on the stage 320. Therefore, in calculating the displacement state of the substrate G relative to the stage 320, the control unit 90 calculates the intersection point of two diagonals by drawing two diagonals based on the coordinate information of each intersection point CP of the four corners. The intersection point of the two diagonals corresponds to the center position GO of the substrate G estimated by the control unit 90.

[0113] As shown in Figure 15B, the control unit 90 calculates the positional displacement state of the center position GO of the substrate G relative to the center position SO of the stage 320, which is held in advance. Similar to the first embodiment, the positional displacement state of the substrate G includes the direction and amount of the positional displacement of the center position GO of the substrate G relative to the center position SO of the stage 320. For example, when the horizontal position is recognized in X-Y coordinates, the positional displacement state of the center position GO of the substrate G can be expressed as ΔX, which is the positional displacement amount in the X-axis direction, and ΔY, which is the positional displacement amount in the Y-axis direction.

[0114] Furthermore, the tilt angle Δθ (tilt around the vertical axis) of the substrate G relative to the stage 320 can be easily obtained by calculating the coordinate position and direction of virtual lines IL1 and IL2 from the imaging information PI.

[0115] As described above, the control unit 90 can accurately calculate the misalignment state and tilt around the vertical axis of the substrate G even when the corners of the substrate G are imaged by each detector 340, which is a camera. When the control unit 90 receives the substrate G from the vacuum transport device 220, it corrects the operation of the vacuum transport device 220 based on the misalignment state and tilt around the vertical axis of the substrate G, thereby enabling the substrate G to be held with high accuracy.

[0116] The load lock module LLM according to the second embodiment is basically configured as described above, and its operation will be explained below with reference to Figures 16A and 16B. Figure 16A is a flowchart showing the processing flow of the substrate transport method according to the second embodiment. Figure 16B is a flowchart showing the processing flow of the pre-alignment process.

[0117] The control unit 90 controls each component of the substrate processing system 1 and sequentially executes steps S201 to S208 shown in Figure 16A.

[0118] Specifically, the substrate processing system 1 transports the substrate G using an air transport module and places the substrate G on the stage 320 of the load lock module LLM (step S201).

[0119] Next, the load lock module LLM detects each of the four corners Gc of the substrate G placed on the stage 320 using the installed detectors 340 (step S202). The imaging information PI of the substrate G detected by each detector 340 is transmitted to the control unit 90.

[0120] When the control unit 90 obtains coordinate information of the outer edge of the substrate G, it performs a pre-alignment process (step S203). The pre-alignment process is a process that roughly aligns (corrects positional misalignment) the substrate G when the amount of misalignment of the substrate G is large. On the other hand, the alignment process after the pre-alignment process is a process that precisely aligns the center position GO of the substrate G with the center position SO of the stage 320. Note that if the amount of misalignment of the substrate G is small, this pre-alignment process does not need to be performed. The control unit 90 may, for example, have a threshold corresponding to the amount of misalignment of the substrate G, and may perform the pre-alignment process if the amount of misalignment is greater than or equal to the threshold, and determine whether to omit the pre-alignment process if the amount of misalignment is less than the threshold.

[0121] Figure 17A illustrates the state of the substrate G after pre-alignment processing. Figure 17B illustrates the state of the substrate G after alignment processing. Before pre-alignment processing, the substrate G is significantly misaligned with the stage 320 and tilted around the vertical axis, as shown in the left diagram of Figure 17A. By performing pre-alignment processing, the control unit 90 can obtain correction amounts for the misalignment of the center position GO of the substrate G and for the tilt around the vertical axis. As a result, the control unit 90 can reposition the substrate G based on the correction amounts obtained from pre-alignment processing, bringing the center position GO of the substrate G closer to the center position SO of the stage 320, as shown in the right diagram of Figure 17A.

[0122] As a result, the substrate G after pre-alignment processing is almost completely misaligned with the stage 320, as shown in the left diagram of Figure 17B, and its tilt around the vertical axis is also suppressed. The control unit 90 performs alignment processing on this substrate G to obtain further small correction amounts for the misalignment of the center position GO of the substrate G and its tilt around the vertical axis. This allows the control unit 90 to sufficiently align the center position GO of the substrate G with the center position SO of the stage 320 when holding the substrate G with the vacuum transfer device 220 based on the correction amount from the alignment processing, as shown in the right diagram of Figure 17B.

[0123] In detail, during the pre-alignment process, the position of the substrate G, including the misalignment state, is calculated by internal processing of the control unit 90 according to the procedure shown in Figure 16B. First, the control unit 90 generates virtual lines IL1 and IL2 at each corner Gc of the substrate G based on the detection information of each detector 340 (step S2031: see also Figure 13B).

[0124] Next, the control unit 90 calculates the four intersection points CP where the virtual lines IL1 and IL2 of each generated corner Gc intersect (step S2032: see also Figure 15A). At this time, the control unit 90 also calculates the inclination of the substrate G around the vertical axis with respect to the stage 320 (reference position of the substrate G) based on each virtual line IL1 and IL2.

[0125] Furthermore, the control unit 90 calculates the center position GO of the substrate G by drawing the diagonals of the four calculated intersection points CP (step S2033).

[0126] Finally, the control unit 90 calculates the positional displacement state (direction of displacement, amount of displacement) of the substrate G based on the calculated center position GO of the substrate G and the center position SO of the stage 320 (step S2034: see also Figure 15B).

[0127] By performing the above pre-alignment processing flow, the control unit 90 can recognize the misalignment state of the substrate G relative to the stage 320. Therefore, as shown in Figure 17A, the control unit 90 controls the vacuum transport device 220 or the atmospheric transport device 420 based on the pre-alignment processing information to hold the substrate G and correct its position (step S204). The vacuum transport device 220 or the atmospheric transport device 420 then places the corrected substrate G back onto the stage 320. This allows the substrate processing system 1 to perform the substrate G alignment again.

[0128] In other words, the load lock module LLM detects the four corners of the substrate G placed on the stage 320 again using each detector 340 (step S205).

[0129] Then, the control unit 90 obtains the coordinate positions of the four corners of the substrate G and performs alignment processing (step S206). The internal processing of the control unit 90 in this alignment processing is the same as the pre-alignment processing described above, so a detailed description is omitted.

[0130] After the alignment process, the control unit 90 controls the vacuum transfer device 220 to move the end effector 224 based on the calculated (corrected) target position and hold the substrate G (step S207).

[0131] As a result, the vacuum transfer device 220 can accurately hold the substrate G, unload the substrate G from the load lock module LLM (stage 320), and accurately transport the substrate G to the target processing module PM (step S208: see also Figure 8A). That is, when holding the substrate G, the vacuum transfer device 220 moves (advances and retracts) the end effector 224 based on the correction content (positional displacement of the substrate G, inclination around the vertical axis) calculated in the alignment process. The vacuum transfer device 220 can then transport the substrate G so that the rectangular substrate G is parallel to the rectangular mounting table 30 of the processing module PM and place it on the mounting table 30.

[0132] As described above, the substrate processing system 1 and substrate transport method according to the second embodiment can also accurately eliminate misalignment of the rectangular substrate G. In particular, when a camera-based detector 340 is used, the number of detectors required can be reduced compared to line sensors, thus contributing to cost reduction. Furthermore, reducing the number of detectors 340 allows for greater flexibility in the layout of other components. Moreover, the substrate processing system 1 and substrate transport method can correct the misalignment of the substrate G with even greater precision by performing pre-alignment processing.

[0133] Furthermore, the substrate processing system 1 according to the second embodiment is not limited to the above embodiment and can take various modifications. For example, in the second embodiment, four detectors 340, which are cameras, are installed according to the four corners Gc of the rectangular substrate G. However, the number of detectors 340 installed is not limited to four; it may be two or three. However, when two detectors 340 are installed, one detector 340 is installed at each of the diagonally opposite corners of the stage 320. As a result, each of the two detectors 340 can detect the coordinate position of the corner Gc and the coordinate position and direction of a pair of sides (virtual lines IL1 and IL2) connected to this corner Gc. Therefore, it can be said that the control unit 90 can calculate the coordinate positions of the four intersection points CP by extending the virtual lines IL1 and IL2 based on the detection information of the two detectors 340. Also, when three detectors 340 are installed, there will always be two diagonally opposite detectors 340. For this reason, it is possible to calculate the coordinate positions of the four intersection points CP with greater accuracy using three detectors 340.

[0134] Figure 18 shows the imaging information PI obtained by the detector 340 by imaging the notch Gn of the substrate G. As shown in Figure 18, the substrate G has a notch Gn at at least one of its four corners. The notch Gn is formed to determine whether the orientation of the substrate G around the vertical axis is shifted by 90° or 180°, or whether the front and back surfaces of the substrate G are reversed.

[0135] The substrate processing system 1 obtains imaging information PI of the notch Gn by imaging the corner of the substrate G with the detector 340 of the load lock module LLM. Based on this notch Gn, the control unit 90 can determine whether the orientation of the substrate G is in a preset orientation. As a result, the substrate processing system 1 does not need to install a camera to obtain notch Gn information on the atmospheric transport module side (including the aligner device), for example, which further promotes cost reduction.

[0136] Furthermore, if there are two or three detectors 340 to be installed, the installation positions of the detectors 340 should be determined in advance based on the position where the notch Gn is located when the substrate G is placed on the stage 320, so that the detectors 340 face the notch Gn.

[0137] Figure 19 is a plan view showing another modified substrate processing system 1C having a detector 340 which is a camera. Similar to the substrate processing system 1A shown in Figure 10, this substrate processing system 1C is configured to transport the substrate G between two processing modules PM1 and PM2 for substrate processing. As described above, during substrate processing in processing module PM1, there is a possibility that the substrate G may be misaligned or deformed relative to the mounting table 30.

[0138] Therefore, the substrate processing system 1C is configured to recognize the misalignment of the substrate G by installing each detector 340 in the vacuum transport module TM at a position corresponding to each detector 340 in the load lock module LLM, and detecting each corner of the substrate G. In this case, the end effector 224 of the vacuum transport device 220 functions as a stage that places the substrate G in the transport container 210 when each detector 340 detects something.

[0139] The control unit 90 controls the vacuum transport device 220 based on the misalignment state of the substrate G of the processing module PM1 detected by each detector 340. Therefore, the end effector 224 can correct the misalignment of the substrate G when transporting the substrate G to the processing module PM2. The arrangement of each detector 340 in the load lock module LLM and the arrangement of each detector 340 in the vacuum transport module TM, etc., may be the same or different. Also, even when using camera-type detectors 340, the configuration may be the same as in Figure 10, with each detector 340 installed for the processing modules PM1 and PM2. Alternatively, even when using line sensor-type detectors 330, the configuration may be the same as in Figure 19, with each detector 330 installed for the vacuum transport module TM.

[0140] The substrate processing system 1 and substrate transport method according to the embodiments disclosed herein are illustrative and not restrictive in all respects. The embodiments can be modified and improved in various ways without departing from the scope and spirit of the appended claims. The matters described in the above embodiments can be otherwise configured and combined in a non-consistent manner.

[0141] This application claims priority to Japanese Patent Application No. 2025-051579, a basic application filed with the Japan Patent Office on March 26, 2025, and to Japanese Patent Application No. 2026-001940, a domestic priority application filed with the same office on January 8, 2026, the full contents of which are incorporated herein by reference.

[0142] 1. Substrate processing system 220. Vacuum transfer device 310. Variable pressure container 330. Detector 90. Control unit G. Substrate TM. Vacuum transfer module

Claims

A transport module having a transport device for transporting rectangular substrates, A container connected to the transport module, from which the transported substrate is unloaded by the transport device, A substrate processing system including a control unit that controls the operation of the transport device, The container and / or the transport module is equipped with a plurality of detectors that each detect information relating to the position of the four corners of the substrate, The control unit, The detection information from the plurality of detectors is used to calculate the misalignment state of the substrate relative to the reference position, and the operation of the transport device is corrected based on the calculated misalignment state of the substrate. PCB processing system. 　 The plurality of detectors are provided outside the container, The substrate of the container is detected through a window provided in the container. The substrate processing system according to claim 1. 　 The plurality of detectors are optical sensors having a light-emitting unit installed on one of the top plate and bottom plate of the container and a light-receiving unit installed on the other, and the detection light from the light-emitting unit is transmitted through the top and bottom of the container to detect the substrate. The substrate processing system according to claim 2. 　 The aforementioned plurality of detectors are line sensors that emit linear detection light to detect the light-shielding position by the outer edge of the substrate. The substrate processing system according to claim 3. 　 The plurality of detectors detect the sides of the substrate at positions away from the four corners. The substrate processing system according to claim 4. 　 The aforementioned plurality of detectors are cameras that detect the corners of the substrate by imaging. The substrate processing system according to claim 2. 　 The plurality of detectors each have a light-emitting unit installed on one of the top plate and bottom plate of the container and a light-receiving unit installed on the other, and the light from the light-emitting unit is transmitted through the top and bottom of the container and the light-receiving unit detects the substrate. The substrate processing system according to claim 6. 　 The plurality of detectors each have a light-emitting unit and a light-receiving unit installed on one of the top plate and bottom plate of the container, and the light emitted by the light-emitting unit is reflected off the substrate and the light-receiving unit detects the substrate. The substrate processing system according to claim 6. 　 The container comprises a stage on which the substrate is placed, The stage has a notch that allows light from the plurality of detectors to pass through, enabling detection of the substrate placed on the stage. A substrate processing system according to any one of claims 1 to 8. 　 The control unit, Based on the detection information from the multiple detectors, the positions of the four corners on the substrate are calculated. The center position of the substrate is calculated from the four calculated corners. The displacement amount and direction of the displacement of the center position of the substrate relative to the reference position of the container are calculated as the displacement state of the substrate. A substrate processing system according to any one of claims 1 to 8. 　 The control unit, Based on the detection information from the multiple detectors, the tilt angle of the substrate relative to the design value is calculated. When the transport device holds the substrate, the angle of the end effector of the transport device is tilted based on the inclination angle of the substrate. A substrate processing system according to any one of claims 1 to 8. 　 The transport device is a SCARA type device that moves the end effector by the rotation of multiple arms. The substrate processing system according to claim 11. 　 The aforementioned container is a load lock module capable of switching the internal space between an atmospheric and a vacuum atmosphere. A substrate processing system according to any one of claims 1 to 8. The transport module is connected to a processing module that places the substrate on a mounting table and performs substrate processing. The control unit, The process module positions another substrate on the aforementioned base, the transport device of the transport module transports the other substrate to the load lock module, and the plurality of detectors detects the other substrate to obtain the reference position. The substrate processing system according to claim 13. 　 The container is a processing module that performs substrate processing on the contained substrate. A substrate processing system according to any one of claims 1 to 8. 　 The transport module, which includes the aforementioned plurality of detectors, is an atmospheric transport module capable of transporting the substrate to a load lock module whose internal space can be switched between an atmospheric atmosphere and a vacuum atmosphere. A substrate processing system according to any one of claims 1 to 8. 　 Multiple containers having the detector are connected to the transport module. A substrate processing system according to any one of claims 1 to 8. 　 A transport module having a transport device for transporting rectangular substrates, A container connected to the transport module, from which the transported substrate is unloaded by the transport device, A substrate processing system including a control unit that controls the operation of the transport device, The container and / or the transport module is equipped with two or more detectors that detect the corners by imaging, facing at least diagonally opposite corners of the substrate. The control unit, The detection information from the two or more detectors is used to calculate the misalignment state of the substrate relative to the reference position, and the operation of the transport device is corrected based on the calculated misalignment state of the substrate. PCB processing system. 　 The two or more detectors are provided outside the container and detect the substrate of the container through a window provided in the container. Furthermore, the two or more detectors each have a light-emitting unit installed on one of the top plate and bottom plate of the container and a light-receiving unit installed on the other, and the light from the light-emitting unit is transmitted through the top and bottom of the container and the light-receiving unit detects the substrate. The substrate processing system according to claim 18. 　 The two or more detectors are provided outside the container and detect the substrate of the container through a window provided in the container. Furthermore, the two or more detectors each have a light-emitting unit and a light-receiving unit installed on one of the top plate and bottom plate of the container, and the light from the light-emitting unit is reflected off the substrate and the light-receiving unit detects the substrate. The substrate processing system according to claim 18. 　 The control unit, Based on the detection information from the two or more detectors, the positions of the four corners on the substrate are calculated. The center position of the substrate is calculated from the four calculated corners. The displacement amount and direction of the displacement of the center position of the substrate relative to the reference position of the container are calculated as the displacement state of the substrate. A substrate processing system according to any one of claims 18 to 20. 　 A transport module having a transport device for transporting rectangular substrates, A substrate transport method for a substrate processing system, comprising: a container connected to the transport module, from which the transported substrates are transported by the transport device, (A) A step of detecting information relating to the position of the four corners of the substrate using a plurality of detectors provided in the container and / or the transport module, (B) A step of calculating the positional displacement state of the substrate with respect to a reference position using the detection information of the plurality of detectors, (C) A step of correcting the operation of the transport device based on the calculated misalignment state of the substrate, A method for transporting circuit boards. 　 In step (B) above, Based on the detection information from the multiple detectors, the positions of the four corners on the substrate are calculated. The center position of the substrate is calculated from the four calculated corners. The displacement amount and direction of the displacement of the center position of the substrate relative to the reference position of the container are calculated as the displacement state of the substrate. The substrate transport method according to claim 22. 　 In step (B) above, the tilt angle of the substrate relative to the design value is calculated based on the detection information of the multiple detectors. In step (C) above, when the substrate is held by the transport device, the angle of the end effector of the transport device is tilted based on the inclination angle of the substrate. The substrate transport method according to claim 22. 　 Multiple containers having the detector are connected to the transport module. When transporting the substrate from one of the multiple containers to another, the steps of (A), (B), and (C) are performed. A substrate transport method according to any one of claims 22 to 24. 　 The container is a load lock module that can switch the internal space between an atmospheric atmosphere and a vacuum atmosphere. The transport module is connected to a processing module that places the substrate on a mounting table and performs substrate processing. Prior to step (A) above, another substrate is positioned on the aforementioned base of the processing module, the other substrate is transported to the load lock module by the transport device of the transport module, and the reference position is obtained by detecting the other substrate with the plurality of detectors. A substrate transport method according to any one of claims 22 to 24. 　 A transport module having a transport device for transporting rectangular substrates, A substrate transport method for a substrate processing system, comprising: a container connected to the transport module, from which the transported substrates are transported by the transport device, (A) A step of detecting a corner by imaging at least diagonally opposite corners of the opposing substrate using two or more detectors provided in the container and / or the transport module, (B) A step of calculating the positional displacement state of the substrate with respect to a reference position using the detection information of the two or more detectors, (C) A step of correcting the operation of the transport device based on the calculated misalignment state of the substrate, A method for transporting circuit boards. 　 In step (B) above, Based on the detection information from the two or more detectors, the positions of the four corners on the substrate are calculated. The center position of the substrate is calculated from the four calculated corners. The displacement amount and direction of the displacement of the center position of the substrate relative to the reference position of the container are calculated as the displacement state of the substrate. The substrate transport method according to claim 27.

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