Substrate processing device and method for assembling substrate processing device

Abstract

This substrate processing device comprises a first module, a second module provided below the first module, and an assembly base part supporting at least the first module. The assembly base part includes a module holding part for holding the first module, a frame to which the module holding part is attached, and a lifting / lowering mechanism capable of lifting / lowering the module holding part with respect to the frame.

Description

Substrate Processing Apparatus and Method for Assembling Substrate Processing Apparatus

[0001] The present disclosure relates to a substrate processing apparatus and a method for assembling a substrate processing apparatus.

[0002] Patent Document 1 discloses that an electrical component section is configured to be accommodated in an empty area of a housing, and that the electrical component section is moved to an upper portion of the housing for installation.

[0003] Japanese Unexamined Patent Publication No. 2005-101034

[0004] The technology according to the present disclosure provides a substrate processing apparatus in which modules are assembled in multiple stages.

[0005] One aspect of the present disclosure is a substrate processing apparatus, comprising: a first module; a second module provided below the first module; and an assembly base that supports at least the first module, wherein the assembly base includes a module holding section that holds the first module, a frame to which the module holding section is attached, and an elevating mechanism that enables the module holding section to move up and down relative to the frame.

[0006] According to the present disclosure, a substrate processing apparatus in which modules are assembled in multiple stages can be provided.

[0007] BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view schematically showing the configuration of a substrate processing apparatus according to an embodiment. FIG. 2 is a plan view schematically showing the configuration of a substrate processing apparatus according to an embodiment. FIG. 3 is a perspective view schematically showing the configuration of an assembly base according to an embodiment. FIGS. 4A and 4B are diagrams schematically showing a time series of an assembly method according to an embodiment.

[0008] Hereinafter, the configuration of the substrate processing apparatus according to the present embodiment will be described with reference to the drawings. In the present specification and the drawings, elements having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

[0009] <Substrate Processing Apparatus> Figures 1 and 2 are a perspective view and a top view, respectively, showing an outline of the configuration of the substrate processing apparatus 1 according to this embodiment. Figure 3 is a perspective view showing an outline of the configuration of the assembly base 4 according to this embodiment. In this embodiment, a case will be described in which the substrate processing apparatus 1 is equipped with a processing module for performing predetermined processing on a wafer W, which is an example of a substrate, such as etching, film deposition, or diffusion processing. In one embodiment, the processing on the wafer W is plasma processing. However, the type of processing module provided in the substrate processing apparatus 1 of this disclosure is not limited to this, and can be arbitrarily selected according to the type of substrate and the purpose of the processing.

[0010] As shown in Figure 1, the substrate processing apparatus 1 includes a lower floor 2, an upper floor 3 provided above the lower floor 2, and an assembly base 4 that supports at least one module included in the upper floor 3.

[0011] In this embodiment, the lower floor 2 and the upper floor 3 each have a configuration in which the atmospheric section 10 and the depressurization section 11 are integrally connected via a load lock module 20. The common configurations of the lower floor 2 and the upper floor 3 will be described below.

[0012] As shown in Figures 1 and 2, the atmospheric section 10 includes an atmospheric module for processing and transporting wafers W in an atmospheric environment. The reduced pressure section 11 includes a reduced pressure module (vacuum module) for processing and transporting wafers W in a reduced pressure (vacuum) atmosphere.

[0013] The load lock module 20 has multiple wafer transfer chambers 21, for example, two in this embodiment, along the loader module 30 described later. The wafer transfer chambers 21 are provided to communicate the internal space of the loader module 30, described later, which is the atmospheric section 10, and the internal space of the vacuum transfer module 40, described later, which is the reduced pressure section 11, via wafer transfer openings 22 and 23. The wafer transfer openings 22 and 23 are configured to be openable and closable by gate valves 24 and 25, respectively. The wafer transfer chambers 21 are configured to temporarily hold the wafer W. Furthermore, the wafer transfer chambers 21 are configured to be able to switch between an atmospheric atmosphere and a reduced pressure atmosphere (vacuum state). In other words, the load lock module 20 is configured to allow for the appropriate transfer of the wafer W between the atmospheric section 10 with an atmospheric atmosphere and the reduced pressure section 11 with a reduced pressure atmosphere.

[0014] The atmospheric section 10 includes a loader module 30 and a plurality of load ports 31, for example, four in this embodiment, on which a hoop F capable of storing a plurality of wafers W is mounted.

[0015] The loader module 30 consists of a rectangular enclosure, and the interior of the enclosure is maintained in an atmospheric environment. On one side of the loader module 30 that forms the long side in the negative Y-axis direction, multiple load ports 31, for example, five, are arranged in a row. On the other side of the loader module 30 that forms the long side in the positive Y-axis direction, the wafer transport chambers 21 of the load lock module 20 are arranged in a row. The loader module 30 may also be adjacent to an orienter module (not shown) for adjusting the horizontal orientation of the wafer W, and a storage module (not shown) for storing multiple wafers W.

[0016] Inside the loader module 30 is a wafer transport device (not shown) for transporting wafers W. In one embodiment, the wafer transport device includes a transport arm that holds and moves the wafer W, a turntable that rotatably supports the transport arm, and a rotating mounting base on which the turntable is mounted. In one embodiment, inside the loader module 30 is a guide rail (not shown) that extends in the longitudinal direction (X-axis direction) of the loader module 30. In this case, the rotating mounting base is provided on the guide rail, and the wafer transport device may be configured to move along the guide rail.

[0017] The depressurization unit 11 includes a vacuum transport module 40 that transports wafers W internally, and a processing module 50 that processes the wafers W transported from the vacuum transport module 40. The interiors of the vacuum transport module 40 and the processing module 50 are configured to be maintained in a reduced-pressure (vacuum) atmosphere. In this embodiment, multiple processing modules 50, for example, 10, are connected to one vacuum transport module 40. The number and arrangement of the processing modules 50 are not limited to this embodiment and can be set arbitrarily.

[0018] The vacuum transport module 40 is connected to the load lock module 20. The vacuum transport module 40 transports the wafer W from the wafer transport chamber 21 of the load lock module 20 to one or more processing modules 50. The vacuum transport module 40 also transports the wafer W processed in the processing module 50 from the processing module 50 back to the wafer transport chamber 21 of the load lock module 20.

[0019] Inside the vacuum transport module 40 is a wafer transport device (not shown) for transporting wafers W. In one embodiment, the wafer transport device includes a transport arm that holds and moves the wafer W, a turntable that rotatably supports the transport arm, and a rotating mounting base on which the turntable is mounted. In one embodiment, the rotating mounting base is fixed to the central part of the vacuum transport module 40.

[0020] In one embodiment, the vacuum transport module 40 is divided into two or more sections along its long side, and a wafer transport mechanism may be provided in each of the divided vacuum transport modules 40. A pass module may also be provided to connect the divided vacuum transport modules 40. Such a pass module may have a wafer transport mechanism for transporting a wafer W between one of the divided vacuum transport modules 40 and the other vacuum transport module 40.

[0021] The processing module 50 performs predetermined processing on the wafer W, such as etching, film deposition, or diffusion. The processing module 50 can be configured to allow selection of modules according to the purpose of the wafer processing. The processing module 50 communicates with the vacuum transport module 40 via a wafer transport port 41 formed on the side wall of the vacuum transport module 40, and the wafer transport port 41 is configured to be openable and closable using a gate valve 51. Inside the processing module 50, a mounting platform (not shown) is provided, which holds the wafer W by a means of choice corresponding to the processing being performed on the wafer W.

[0022] In one embodiment, the processing module 50 includes a plasma processing module that performs plasma processing on a wafer W. When the processing module 50 is a plasma processing module, a plasma processing chamber for processing the wafer W is arranged in the middle section of the housing of the processing module 50. The plasma processing chamber has a plasma processing space. A plasma source and a gas supply source (hereinafter sometimes referred to as "gas box, etc.") for generating plasma within the processing module 50 are arranged in the upper part of the housing. Electrical wires (hereinafter sometimes referred to as "electrical unit") connected to a power supply for generating plasma within the processing module 50 are arranged in the lower part of the housing.

[0023] One or more modules included in the upper floor 3 having the above configuration are supported by the assembly base 4. The modules included in the upper floor 3 to be supported by the assembly base 4 are not particularly limited. In one embodiment, the modules supported by the assembly base 4 include a loader module 30, a vacuum transport module 40, and a processing module 50, as shown in the example in Figure 1. In one embodiment, a load lock module 20 may be supported by the assembly base 4. In one embodiment, if an orienter module or storage module (not shown) is provided adjacent to the loader module 30, these orienter modules and storage modules may be supported by the assembly base 4.

[0024] In one embodiment, the lower section 2 and the upper section 3 each constitute a substrate processing unit capable of independently performing processing on the wafer W. In other words, the substrate processing apparatus 1 in one embodiment is provided with multiple stages of substrate processing units, each capable of independently performing processing on the wafer W by being equipped with the various modules described above.

[0025] In one embodiment, the substrate processing apparatus 1 includes ancillary equipment (not shown) related to the supply and exhaust of gas and power supply to each of the various modules. In this case, the ancillary equipment may be provided in multiple stages, supported by the assembly base 4 in the same way as the substrate processing apparatus 1.

[0026] In one embodiment, the height of the substrate processing apparatus 1 from the ground surface of the substrate processing apparatus 1 (hereinafter referred to as "ground level") to the highest point on the upper floor 3 (hereinafter referred to as "height of the substrate processing apparatus 1") may exceed the transport height limit described later. In one embodiment, the height of the substrate processing apparatus 1 may exceed 4 m.

[0027] In one embodiment, the various modules provided on the upper floor 3 are configured such that maintenance is required infrequently or not required at all. In another embodiment, the various modules provided on the upper floor 3 are configured such that automatic maintenance can be performed.

[0028] The substrate processing apparatus 1 described above is provided with at least one control unit 100, as shown in Figure 1. The control unit 100 processes computer-executable instructions that cause the substrate processing apparatus 1 to perform the various processes described herein. The control unit 100 may be configured to control each element of the substrate processing apparatus 1 to perform the various processes described herein. In one embodiment, part or all of the control unit 100 may be included in the substrate processing apparatus 1. The control unit 100 is implemented, for example, by a computer. The control unit 100 may be one or more circuits, and may be provided as a single unit or in parts. The control unit 100 may include a processing unit, a storage unit, and a communication interface. The functions realized by the processing units described in this disclosure may be implemented in circuits or processing circuits, including general-purpose processors, application-specific processors, integrated circuits, ASICs (Application Specific Integrated Circuits), CPUs (Central Processing Units), conventional circuits, and / or combinations thereof, programmed to realize the functions described. A processor is considered to be a circuit or processing circuit, including transistors and other circuits. A processor may be a programmed processor that executes a program stored in memory. This program (computer program product) may be stored in memory beforehand or may be retrieved via a medium when needed. The medium may be various computer-readable storage media, such as memory cards, optical discs, HDDs (Hard Disk Drives), or other removable storage media, and the program may be provided in a form stored on such storage media. Alternatively, the medium may be a communication line connected to a communication interface, and the program may be distributed by a remote server device or the like. The acquired program is stored in the storage unit and read from the storage unit and executed by the processing unit.The memory unit may include storage media such as RAM (Random Access Memory), ROM (Read Only Memory), EEPROM (Electrically Erasable Programmable Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or combinations thereof. The communication interface may communicate with the substrate processing device 1 via a communication line such as a LAN (Local Area Network). In this disclosure, circuits, units, and means are hardware programmed to realize or configured to perform the described functions. Such hardware may be any hardware described in this disclosure, or any hardware known to be programmed to realize or perform such functions. If the hardware is a processor that is considered to be a type of circuit, then the circuit, means, or unit is a combination of hardware and software used to constitute the hardware and / or processor.

[0029] The following describes an example of an assembly base 4 that supports a processing module 50. However, the basic configuration of the assembly base 4 is the same regardless of the type of module. As shown in Figure 3, the assembly base 4 comprises a base 101 as the module holding part of this disclosure and a frame 102 to which the base 101 is attached.

[0030] The base 101 is a flat plate that is approximately rectangular in plan view. The base 101 is attached to the frame 102 at multiple locations in plan view, and in this embodiment at the four corners. The attachment points between the base 101 and the frame 102 constitute a lifting mechanism that moves up and down in the Z-axis direction as shown by arrow AR1 in Figure 3. The specific configuration of the lifting mechanism of the base 101 and the frame 102 is not particularly limited. In one embodiment, the four corners of the base 101 may be fitted onto a rail (not shown) that extends in the Z-axis direction and is provided on the frame 102, so that the base 101 slides on the rail. Power from a motor 110, which will be described later, is connected to the lifting mechanism, and the lifting and lowering can be performed by the driving force generated by the motor 110.

[0031] The material, structure, and shape of the base 101, frame 102, and the lifting mechanism composed of them are not particularly limited, as long as they can withstand the load of the module being held. In other words, the assembly base 4 is not limited to a combination of the base 101 and frame 102, and any desired configuration that enables the lifting and support of the module to be assembled can be adopted.

[0032] In one embodiment, the assembly base 4 includes an offset mechanism in addition to the lifting mechanism, which offsets the base 101 in the X-axis or Y-axis direction as shown by arrows AR2 or AR3 in Figure 3. This offset mechanism makes it possible to move the module horizontally along with the base 101 relative to the connection position when connection to other modules is required during the assembly of one module, thereby facilitating such connections.

[0033] In Figure 3, four independent frames 102 are shown to be provided at the four corners of the base 101, but this is not limited to this. More frames 102 may be provided, and these four frames 102 may be connected to each other by a structure not shown, or they may be formed as a single unit.

[0034] Furthermore, while Figures 1 to 3 illustrate an example in which the substrate processing apparatus 1 is configured in two stages, a lower stage 2 and an upper stage 3, the apparatus is not limited to this configuration, and the substrate processing apparatus 1 may be configured in three or more stages. In this case, two or more bases 101 may be provided on the frame 102, and modules may be supported on each of the bases 101.

[0035] Furthermore, while Figures 1 to 3 illustrate an example where the number of stages of the loader module 30, vacuum transport module 40, and processing module 50 included in the lower floor 2 and upper floor 3 are equal, the system is not limited to this. For example, the loader module 30 may have only one stage instead of two, i.e., it may be provided only in the lower floor 2, and may be connected to both the load lock module 20 of the lower floor 2 and the load lock module 20 of the upper floor 3. In this case, a wafer transport device (not shown) provided inside the loader module may be configured to move the wafer W up and down in the Z-axis direction so that the wafer W can be transported to both the load lock modules 20 of the lower floor 2 and the upper floor 3. Thus, the number of stages of each type of module in the substrate processing apparatus 1 may differ depending on the type of module.

[0036] Furthermore, while Figures 1 to 3 illustrate an example in which one module is supported on one base 101, the design is not limited to this, and multiple modules may be supported on one base 101 in the horizontal direction (X-Y plane direction). For example, multiple processing modules 50 may be arranged horizontally and supported on one base 101.

[0037] Furthermore, the assembly base 4 may be configured to support modules included in the lower floor 2, in addition to the modules included in the upper floor 3. For example, the assembly base 4 may include a base 101 for supporting the vacuum transport module 40 included in the upper floor 3, a base 101 for supporting the vacuum transport module 40 included in the lower floor 2, and a frame 102 for supporting these two bases.

[0038] Next, an assembly method according to one embodiment for assembling a desired multi-stage module included in the substrate processing apparatus 1 having the above configuration will be described. Figure 4 is a time series of the assembly method when assembling the processing module 50 into upper and lower stages as an example of the assembly method.

[0039] First, as shown in Figure 4(a), the base 101 and frame 102 are installed to form the assembly base 4. At this time, the base 101 may be installed at a position close to the ground. Next, the motor 110 is connected to the lifting mechanism composed of the base 101 and frame 102. The motor 110 generates rotational power by power supply from a power source (not shown) and transmits this power to the lifting mechanism. The motor 110 may be configured to change the reduction ratio according to the characteristics of the module to be assembled, such as the weight. The motor 110 is an example of an external power source in this disclosure.

[0040] Furthermore, a processing module 50, which is to be included in the upper floor 3, is placed on the base 101 of the assembled base 4. The processing module 50 can be transported to the vicinity of the assembled base 4 by a trolley or the like (not shown) that is movable on the ground.

[0041] Next, as shown in Figure 4(b), the base 101 supporting the processing module 50 is raised by a lifting mechanism powered by the motor 110. As a result, as shown in Figure 4(c), the processing module 50 is positioned on the upper floor 3 and supported by the assembly base 4.

[0042] Next, as shown in Figure 4(c), the processing module 50 to be included in the lower floor 2 is placed below the processing module 50 located in the upper floor 3, that is, below the base 101. As a result, as shown in Figure 4(d), processing modules 50 are placed in the lower floor 2 and the upper floor 3, respectively.

[0043] Note that after the processing module 50 is placed on the upper floor 3 in Figure 4(c), the motor 110 may be removed from the lifting mechanism. This motor 110 can then be connected to the lifting mechanism and used when assembling other modules.

[0044] Next, an assembling method according to an embodiment for assembling the entire substrate processing apparatus 1 having the above configuration will be described. FIG. 5 is a diagram illustrating an example of an assembling method when assembling the entire substrate processing apparatus 1. In FIGS. 5(b) to 5(e), in order to facilitate understanding, modules described at each step are shown by solid lines, and modules already described in previous steps are shown by dotted lines.

[0045] First, a pedestal 101 and a frame 102 are installed at a position where the substrate processing apparatus 1 is to be assembled, and an assembling base 4 is formed. Further, a motor 110 is connected to the lifting mechanism. Next, the vacuum transfer module 40 to be included in the upper floor section 3 is placed on the pedestal 101 of the formed assembling base 4. Next, the pedestal 101 is raised by the lifting mechanism using the power of the motor 110. Thereby, as shown in FIG. 5(a), the vacuum transfer module 40 is supported by the assembling base 4 in a state of being arranged on the upper floor section 3. The placement and raising of the vacuum transfer module 40 are the same as the placement and raising of the processing module 50 according to FIG. 4 described above.

[0046] Next, the vacuum transfer module 40 to be included in the lower floor section 2 is placed below the vacuum transfer module 40 arranged on the upper floor section 3. Thereby, as shown in FIG. 4(b), the vacuum transfer modules 40 are respectively arranged in the lower floor section 2 and the upper floor section 3. Although the means for arranging the vacuum transfer module 40 in the lower floor section 2 is not particularly limited, the vacuum transfer module 40 may be arranged and supported on another pedestal (not shown), and raised by using the motor 110 and the lifting mechanism in the same manner as described above to be arranged. In that case, said another pedestal may constitute a part of the assembling base 4. After the vacuum transfer modules 40 are respectively arranged in the lower floor section 2 and the upper floor section 3, the motor 110 is removed from the lifting mechanism.

[0047] Next, at a position adjacent to the short side of the vacuum transfer module 40 installed above, the pedestal 101 and the frame 102 are installed to form another assembly base 4. Additionally, the motor 110 is connected to the lifting mechanism. Next, the loader module 30 to be included in the upper floor section 3 is placed on the pedestal 101 of the formed assembly base 4. Next, the pedestal 101 is raised by the lifting mechanism using the power of the motor 110. As a result, as shown in FIG. 5(c), the loader module 30 is supported by the assembly base 4 in a state of being arranged in the upper floor section 3. The placement and raising of the loader module 30 are the same as the placement and raising of the processing module 50 according to FIG. 4 described above.

[0048] Next, below the loader module 30 arranged in the upper floor section 3, the loader module 30 to be included in the lower floor section 2 is arranged. As a result, as shown in FIG. 5(d), the loader modules 30 are respectively arranged in the lower floor section 2 and the upper floor section 3.

[0049] In one embodiment, the load lock module 20 included in the upper floor section 3 is connected to either the loader module 30 or the vacuum transfer module 40 that are also included in the upper floor section 3 on the ground before assembly. In this case, after the loader module 30 and the vacuum transfer module 40 are assembled, in the state shown in FIG. 5(d), the one of the loader module 30 and the vacuum transfer module 40 that was not connected to the load lock module 20 on the ground is connected to the load lock module 20.

[0050] Next, a base 101 and a frame 102 are installed adjacent to the long side of the vacuum transport module 40 positioned as described above, forming another assembly base 4. A motor 110 is also connected to the lifting mechanism. Next, the processing module 50 to be included in the upper floor 3 is placed on the base 101 of the formed assembly base 4. Then, the base 101 is raised using the lifting mechanism powered by the motor 110. As a result, the processing module 50 is supported by the assembly base 4 in the state where it is positioned in the upper floor 3, as shown in Figure 5(c). The positioning and raising of the processing module 50 is the same as that of the processing module 50 shown in Figure 4. After the processing modules 50 are positioned in the lower floor 2 and the upper floor 3 respectively, the motor 110 is removed from the lifting mechanism.

[0051] With the processing module 50 positioned on the upper floor 3, the processing module 50 is connected to the wafer transport port 41 of the vacuum transport module 40 on the upper floor 3. In this connection, the processing module 50 supported on the base 101 may be moved horizontally using the offset mechanism provided on the assembly base 4 to adjust its position relative to the wafer transport port 41.

[0052] Next, as shown in Figure 5(e), the base 101 and frame 102 are installed adjacent to the assembly of processing modules 50 for the lower floor 2 and upper floor 3 that were assembled above, forming another assembly base 4. The motor 110 is then connected to the lifting mechanism. The other processing modules 50 for the lower floor 2 and upper floor 3 are then assembled in the same manner. By repeating this process, the substrate processing apparatus 1 can be assembled as shown in Figure 5(f).

[0053] In one embodiment, the substrate processing apparatus 1 can be disassembled by the reverse procedure described in Figures 5(a) to 5(f). After disassembly, the substrate processing apparatus 1 may be moved to another installation location using the assembly method according to this embodiment. Furthermore, only the assembly base 4 that supports modules requiring maintenance or replacement can be removed by the reverse procedure described in Figures 4(a) to 4(d).

[0054] The significance of the substrate processing apparatus 1 and assembly method according to the embodiment described above will be discussed below.

[0055] The various modules constituting the substrate processing apparatus 1 are transported by means of transport such as trucks or aircraft and brought in through the entrance of the cleanroom where the substrate processing apparatus 1 is installed. In this process, there are restrictions on the height to which the modules can be transported, especially when transported by air. In this disclosure, such restrictions are referred to as "transport height restrictions." For example, in one embodiment, the processing module 50 is modularized by connecting gas boxes and electrical units to the top and bottom of the chamber in which the wafer W is processed, and the total height of this module is designed not to exceed the transport height restrictions. On the other hand, from the viewpoint of not increasing the footprint of the substrate processing apparatus 1, the processing module 50 described above is designed so that its total height is close to the transport height restrictions.

[0056] Conventional cleanrooms in which the substrate processing apparatus 1 is installed are designed with ceiling heights that allow for the placement of processing modules 50 that are close to the transport height limit. Therefore, a substrate processing apparatus 1 that further incorporates multiple layers of processing modules 50 that are particularly close to the transport height limit is not known to date.

[0057] Furthermore, the various modules constituting the substrate processing apparatus 1 are extremely heavy. In particular, the plasma processing module, which has gas boxes and electrical units for plasma processing connected to the top and bottom of the chamber, is significantly heavier. When assembling such modules on the upper floor, it is conceivable to use heavy machinery such as cranes. However, deploying such heavy machinery within a cleanroom is time-consuming and could extend the time required for assembly. Moreover, the deployment of heavy machinery poses problems from the standpoint of maintaining the high cleanliness of the cleanroom. Therefore, in the substrate processing apparatus 1, there are challenges in further arranging the processing modules 50, which are particularly close to the height restrictions for air transport, etc.

[0058] In contrast, the technology of this disclosure makes it possible to assemble a substrate processing apparatus 1 in which more modules are assembled in multiple stages without increasing the footprint, thereby improving productivity.

[0059] Furthermore, the substrate processing device 1 can be assembled without using heavy machinery such as cranes. Therefore, the risk of the assembly period being extended due to the availability of heavy machinery can be avoided. In addition, by not using heavy machinery such as cranes, the cleanliness of the cleanroom can be maintained.

[0060] Furthermore, a substrate processing apparatus 1 that has multiple processing modules 50, each close to the transport height limit, can be assembled in a cleanroom or similar facility where the ceiling height is designed to accommodate equipment taller than the transport height limit. An example of equipment taller than the transport height limit is an exposure apparatus, such as a High-NA EUV apparatus.

[0061] The assembly base 4 used during assembly can be used as is as a support structure for the substrate processing apparatus 1. Therefore, compared to setting up temporary scaffolding for assembly and then dismantling it afterward, the cost of assembly can be reduced.

[0062] Furthermore, since the assembly base 4 equipped with a lifting mechanism and the motor 110 that drives the lifting mechanism are detachably provided, after the assembly of a module using one assembly base 4 is completed, the motor 110 can be used to assemble modules using other assembly bases 4. Therefore, there is no need to provide a motor 110 for each assembly base 4, which does not increase the footprint and reduces costs.

[0063] The embodiments disclosed herein should be considered in all respects as illustrative and not restrictive. The embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the constituent elements of the embodiments described above can be combined in any way. Such any combination will naturally yield the functions and effects of each constituent element in the combination, as well as other functions and effects that will be apparent to those skilled in the art from the description herein.

[0064] Furthermore, the effects described herein are merely descriptive or illustrative and not limiting. In other words, the technology relating to this disclosure may produce other effects that will be apparent to those skilled in the art from the description herein, in addition to or in lieu of the effects described herein.

[0065] 1. Substrate processing unit 2. Lower section 3. Upper section 4. Assembly base 30. Loader module 40. Vacuum transport module 50. Processing module 101. Base 102. Frame W. Wafer

Claims

1. A substrate processing apparatus comprising: a first module for transporting or processing a substrate; a second module for transporting or processing the substrate, provided below the first module; and an assembly base that supports at least the first module, wherein the assembly base comprises: a module holding portion for holding the first module; a frame to which the module holding portion is attached; and a lifting mechanism that allows the module holding portion to be raised and lowered relative to the frame.

2. The substrate processing apparatus according to claim 1, wherein the height of the first module and the second module is lower than the transport height limit, and the height of the substrate processing apparatus is higher than the transport height limit.

3. The substrate processing apparatus according to claim 1 or 2, wherein the lifting mechanism is configured such that an external power source for driving the lifting of the module holding portion is detachably connected to it.

4. The substrate processing apparatus according to claim 1 or 2, wherein the assembly base has an offset mechanism configured to allow the module holding portion to move relative to the frame in a direction different from the direction of lifting and lowering.

5. The substrate processing apparatus according to claim 1 or 2, comprising: a plurality of first modules; a plurality of second modules provided below each of the first modules; and a plurality of assembly bases each supporting at least a plurality of the first modules.

6. The substrate processing apparatus according to claim 5, comprising: a first substrate processing unit having a plurality of modules including the first module; and a second substrate processing unit having a plurality of modules including the second module, wherein the first substrate processing unit and the second substrate processing unit are configured to independently perform processing on a substrate.

7. A method for assembling a substrate processing apparatus, comprising: forming an assembly base having a module holding portion, a frame to which the module holding portion is attached, and a lifting mechanism capable of raising and lowering the module holding portion relative to the frame; placing a first module in the module holding portion; raising the module holding portion on which the first module is placed using the lifting mechanism; and placing a second module below the raised first module.

8. The method for assembling a substrate processing apparatus according to claim 7, wherein the height of the first module and the second module is lower than the transport height limit, and the height of the substrate processing apparatus is higher than the transport height limit.

9. A method for assembling a substrate processing apparatus according to claim 7 or 8, comprising: raising the module holding portion by connecting an external power source to the lifting mechanism and transmitting the power generated by the external power source to the lifting mechanism to raise the first module; and, after raising the first module, removing the external power source from the lifting mechanism.

10. The assembly base has an offset mechanism configured to allow the module holding portion to move relative to the frame in a direction different from the direction of raising and lowering, and the assembly method for a substrate processing apparatus according to claim 7 or 8, comprising raising the first module, moving the first module by the offset mechanism, and connecting the first module to other modules.

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