Polishing pad creation system and polishing pad creation method

Abstract

The present invention precisely controls the positional relationship between an endpoint detection window and holes in a cushion layer.　This invention is equipped with: a first first reference position forming means for forming a plurality of first reference positions identifying the position of the window in a polishing layer resin sheet; a first second reference position forming means for forming second reference positions at positions matching the first reference positions; and a first through hole forming means for forming, on the basis of the second reference positions, a through hole which penetrates to the window at a position in a cushion layer resin sheet, and which is formed in a shape corresponding to the window of the polishing layer resin sheet.

Description

Polishing pad production system and polishing pad production method

[0001] The present invention relates to a polishing pad, and more particularly, to a polishing pad production system and a polishing pad production method for producing a polishing pad including: a polishing layer formed of a resin having a polishing surface for polishing an object to be polished; and an end point detection window formed of a light-transmissive block member (such as resin) provided on the polishing layer.

[0002] Conventionally, in the manufacturing process of semiconductor wafers, chemical mechanical polishing (CMP), which polishes the surface of a semiconductor wafer using a polishing pad and slurry, is performed for the purpose of planarizing after insulating film deposition and forming metal wiring. Here, since over-polishing or insufficient polishing of an object to be polished directly leads to product defects, it is necessary to strictly control the polishing amount. Accordingly, a transparent end point detection window is provided on the polishing pad, and light is transmitted through the end point detection window to detect the polishing end point (Patent Document 1).

[0003] The polishing pad provided with an end point detection window as described above is composed of a polishing layer on the side used for polishing, and a cushion layer attached to a surface of the polishing layer on a side different from the polishing surface, and a hole is drilled from the cushion layer toward the end point detection window. In this case, the resin sheet constituting the polishing layer is further fed in the direction of arrow F in FIG. 1 of Patent Document 2, the end point detection window and the hole are aligned, and the resin sheet and the adhesive surface of the adhesive sheet are bonded together. Based on information on the center position of the hole formed in the adhesive sheet and information on the center position of the end point detection window of the resin sheet, the movement distances of the resin sheet and the adhesive sheet are controlled so that these center positions overlap, and then the two are bonded together (Patent Document 2).

[0004] Japanese Patent Application Laid-Open No. 2022-152665 Japanese Patent Application Laid-Open No. 2022-149504

[0005] As described above, in polishing pads of the type in which holes are drilled from the cushion layer toward the endpoint detection window, it is necessary to precisely control the positional relationship between the endpoint detection window and the holes in the cushion layer, and for this purpose, an appropriate device and method are required. Therefore, an embodiment of the present invention provides a polishing pad manufacturing system and a polishing pad manufacturing method that can be expected to precisely control the positional relationship between the endpoint detection window and the holes in the cushion layer in polishing pads of the type in which holes are drilled from the cushion layer toward the endpoint detection window.

[0006] A polishing pad manufacturing system according to the first embodiment of the present invention includes: a first reference position forming means for forming a plurality of first reference positions that identify the position of an endpoint detection window on a polishing layer resin sheet, which is provided with an endpoint detection window composed of a light-transmitting block member; a first second reference position forming means for forming a second reference position at a position that coincides with the first reference position on the surface of a cushion layer resin sheet that is superimposed on the polishing layer resin sheet and faces the overlapping surface; and a through hole that penetrates to the window at a position in the cushion layer resin sheet in a shape corresponding to the window of the polishing layer resin sheet based on the second reference position. The device is characterized by comprising: a first through-hole forming means; a first two-layer bonding means that has a position regulating function to ensure that when the cushion layer resin sheet with the through-hole is placed on top of the polishing layer resin sheet, the first reference position and the second reference position coincide, the polishing layer resin sheet and the cushion layer resin sheet with the through-hole are bonded together when the first reference position and the second reference position coincide; and a control means for controlling the first first reference position forming means, the first second reference position forming means, the first through-hole forming means and the first two-layer bonding means.

[0007] A polishing pad manufacturing system according to a second embodiment of the present invention is characterized by comprising: a second two-layer bonding means for overlapping and bonding a polishing layer resin sheet and a cushion layer resin sheet, each having an endpoint detection window made of a light-transmitting block member; a second first reference position forming means for determining a plurality of first reference positions that specify the position of the window on the polishing layer resin sheet, and for forming the first reference positions toward the cushion layer resin sheet side of the overlapping and bonded polishing layer resin sheet and cushion layer resin sheet; a second through-hole forming means for obtaining the shape and position information of the polishing layer resin sheet corresponding to the window on the cushion layer resin sheet side based on the first reference positions revealed on the side of the cushion layer resin sheet that is overlapped and bonded with the polishing layer resin sheet, and for forming a through-hole that penetrates from the surface of the cushion layer resin sheet to the window based on this position information and shape; and a second control means for controlling the second two-layer bonding means, the second first reference position forming means, and the second through-hole forming means.

[0008] A polishing pad manufacturing method according to the first embodiment of the present invention is characterized by comprising: a first first reference position forming step of forming a plurality of first reference positions that specify the position of an endpoint detection window of a polishing layer resin sheet provided with an endpoint detection window composed of a light-transmitting block member; a first second reference position forming step of forming a second reference position at a position that coincides with the first reference position on the surface of a cushion layer resin sheet that is superimposed on the polishing layer resin sheet and faces the overlapping surface; a first through hole forming step of forming a through hole that penetrates to the window at a position in the cushion layer resin sheet corresponding to the window of the polishing layer resin sheet based on the second reference position; and a first two-layer bonding step of bonding the polishing layer resin sheet and the cushion layer resin sheet with the through hole when the cushion layer resin sheet with the through hole formed thereon is superimposed on the polishing layer resin sheet, using a position regulating function that ensures the first reference position and the second reference position coincide.

[0009] A polishing pad manufacturing method according to a second embodiment of the present invention is characterized by comprising: a second two-layer bonding step of overlapping and bonding a polishing layer resin sheet and a cushion layer resin sheet, each having an endpoint detection window made of a light-transmitting block member; a second first reference position forming step of determining a plurality of first reference positions to identify the position of the window on the polishing layer resin sheet, and forming the first reference positions toward the cushion layer resin sheet side of the overlapping and bonded polishing layer resin sheet and cushion layer resin sheet; and a second through-hole forming step of obtaining the shape and position information of the polishing layer resin sheet corresponding to the window on the cushion layer resin sheet side based on the first reference positions revealed on the side of the cushion layer resin sheet that is overlapped and bonded with the polishing layer resin sheet, and forming a through-hole that penetrates from the surface of the cushion layer resin sheet to the window based on this position information and shape.

[0010] According to the first embodiment of the present invention, when the cushion layer resin sheet with the through holes formed thereon is placed on top of the polishing layer resin sheet, a position regulating function is used to ensure that the first reference position and the second reference position coincide. This configuration adheres the polishing layer resin sheet and the cushion layer resin sheet with the through holes formed thereon when they are placed on top of each other, making it possible to create a polishing pad in which the positional relationship between the endpoint detection window and the holes in the cushion layer is precisely controlled to an appropriate state.

[0011] According to a second embodiment of the present invention, a polishing layer resin sheet and a cushion layer resin sheet are bonded together, with the polishing layer resin sheet having an endpoint detection window made of a light-transmitting block member. Multiple first reference positions are determined to identify the position of the window on the polishing layer resin sheet. The first reference positions are formed from the polishing layer resin sheet toward the cushion layer resin sheet. Based on the first reference positions revealed toward the cushion layer resin sheet, the shape and position information corresponding to the window on the polishing layer resin sheet are obtained. Based on this position information and shape, a through hole is formed that penetrates from the surface of the cushion layer resin sheet to the window. This configuration makes it possible to create a polishing pad in which the positional relationship between the endpoint detection window and the hole in the cushion layer is precisely controlled to an appropriate state.

[0012] A diagram showing the main components of a polishing pad manufacturing system according to the first embodiment of the present invention. A front view of a polishing layer resin sheet manufactured by the polishing pad manufacturing system according to the first embodiment of the present invention. A front view of the manufacturing process of a cushion layer resin sheet manufactured by the polishing pad manufacturing system according to the first embodiment of the present invention. A perspective view of a position regulating jig according to the first embodiment, which realizes a position regulating function and is used in the polishing pad manufacturing system according to the first embodiment of the present invention. A perspective view of the position regulating jig in use as shown in Figure 4. A perspective view of a two-layer bonding device used in the polishing pad manufacturing system according to the first embodiment of the present invention. An explanatory diagram of the unnecessary portion in the superimposed polishing layer resin sheet and cushion layer resin sheet manufactured by the polishing pad manufacturing system according to the first embodiment of the present invention. A diagram showing the configuration of a cutting device, which is a polishing pad forming means, used in the polishing pad manufacturing system according to the first embodiment of the present invention. A front view of a polishing pad manufactured by the polishing pad manufacturing system according to the first embodiment of the present invention. A perspective view of a position regulating jig according to a modified example of the first embodiment, which realizes a position regulating function and is used in the polishing pad manufacturing system according to the first embodiment of the present invention. A diagram showing the main components of a polishing pad manufacturing system according to the second embodiment of the present invention. Front view of the polishing layer resin sheet, cushion layer resin sheet, and the superimposed polishing layer resin sheet and cushion layer resin sheet used in the production of the polishing pad production system according to the second embodiment of the present invention. Perspective view of the two-layer bonding device used in the polishing pad production system according to the second embodiment of the present invention. Diagram showing a method for determining a plurality of first reference positions that identify the position of the window in the polishing layer resin sheet based on the position of the window in the polishing pad production system according to the second embodiment of the present invention. Front view of the state in which the first reference positions have been formed by a drilling machine using the polishing pad production system according to the second embodiment of the present invention. Front view from the cushion layer resin sheet side in the state in which a through hole penetrating to the window has been formed using the polishing pad production system according to the second embodiment of the present invention. Diagram illustrating the unnecessary portion in the superimposed polishing layer resin sheet and cushion layer resin sheet created using the polishing pad production system according to the second embodiment of the present invention.A diagram showing the configuration of a cutting device, which is a second polishing pad forming means, used in the polishing pad manufacturing system according to the second embodiment of the present invention. A front view of a polishing pad created by the polishing pad manufacturing system according to the second embodiment of the present invention. A front view of a composite of a polishing layer resin sheet and a cushion layer resin sheet, using a cushion layer resin sheet having a narrower planar shape than the polishing layer resin sheet, as used in the polishing pad manufacturing system according to the second embodiment of the present invention. A front view of the composite of a polishing layer resin sheet and a cushion layer resin sheet shown in Figure 20, when a first reference position is formed. A front view of the composite of a polishing layer resin sheet and a cushion layer resin sheet shown in Figure 21, when a through hole 303 penetrating to the window is formed. A front view of the polishing layer resin sheet in an example where protective tape is used when double-sided tape is used to bond the polishing layer resin sheet and the cushion layer resin sheet together in the polishing pad manufacturing system according to the second embodiment of the present invention. A front view from the cushion layer resin sheet side in an example where protective tape is used when double-sided tape is used to bond the polishing layer resin sheet and the cushion layer resin sheet together in the polishing pad manufacturing system according to the second embodiment of the present invention. A cross-sectional view showing the procedure for cutting through holes in an example where protective tape is used when double-sided tape is used to bond an abrasive layer resin sheet and a cushion layer resin sheet together in a polishing pad manufacturing system according to a second embodiment of the present invention.

[0013] The polishing pad manufacturing system and polishing pad manufacturing method according to the present invention will be described below with reference to the attached drawings. In each figure, the same components are denoted by the same reference numerals, and redundant explanations are omitted. Figure 1 shows a polishing pad manufacturing system according to the first embodiment, comprising a reference position forming device 100, a position regulating jig 350, and a two-layer bonding device 380, which constitute a first reference position forming means, a first second reference position forming means, a first through-hole forming means, and a first control means. Here, the resin sheet in the present invention is a sheet-like polishing pad member containing a polymer compound, and examples include a sheet-like polymer compound having closed cells, a sheet-like polymer compound having interconnected pores, and a sheet-like nonwoven fabric impregnated with a polymer compound. Furthermore, the cushion layer resin sheet includes a cushioning resin sheet, a sheet in which a cushioning resin sheet and double-sided tape are layered, a sheet in which multiple cushioning resin sheets and double-sided tape are layered, or a sheet consisting only of double-sided tape.

[0014] The reference position forming device 100 has a work unit 110 suspended from an information control unit 120, which moves in the three-dimensional directions of x, y, and z in the figure. The work unit 110 is equipped with a drilling machine 111, such as a laser drill or cutter knife, for punching out the reference position, and a camera 112 for position detection. The computer in the control unit 120 controls the device so that a predetermined point in the image captured by the camera 112 coincides with the position of the drilling machine 111.

[0015] A base 130 is provided below the work section 110, and the control unit 120 manages the position of the drilling machine 111 as it moves above the base 130 using position information in x, y, and z coordinates. The control unit 120 is provided with an input unit (not shown) for pre-setting and inputting areas where drilling positions (reference positions) should be formed. Multiple areas where multiple first reference positions should be formed, which identify the position of the window on the polishing layer resin sheet provided with the endpoint detection window, can be pre-inputted from this input unit.

[0016] For example, when a polishing layer resin sheet 200 of a predetermined size shown in Figure 1 is placed and fixed on a base 130, the control unit 120 controls the formation of multiple (in this case, two) first reference positions 201, 201 by the drilling machine 111, as shown in Figure 2. Thus, the drilling machine 111 is the first first reference position forming means, and the control unit 120 controls the first first reference position forming means as the first control means. In this first embodiment, the first reference positions 201, 201 are through holes made of round holes. The first reference positions 201, 201 are positions that identify the position of the window 202 of the polishing layer resin sheet 200. Conversely, the center of the window 202 can be identified from the center of the first reference positions 201, 201, and the position and shape of the outer circumference of the window 202 can be identified from the center of the window 202. In order to accurately identify the position of the window 202, it is preferable that there be at least two or more first reference positions 201. Furthermore, if a first reference position 201 is provided, it is preferable to set it at a position that is not symmetrical with respect to the polishing layer resin sheet. This makes it possible to prevent the polishing layer resin sheet from being mistakenly placed with the wrong side facing up.

[0017] Similar to the polishing layer resin sheet 200 shown in Figure 1, when a cushion layer resin sheet 300 of a predetermined size is placed and fixed on the base 130, the control unit 120 controls the formation of second reference positions 301, 301 by the drilling machine 111 at positions that coincide with the first reference positions 201, 201 on the surface of the cushion layer resin sheet 300 that is superimposed on the polishing layer resin sheet 200, as shown in Figure 3(a). Thus, the drilling machine 111 is the first second reference position forming means, and the control unit 120 controls the first second reference position forming means as the first control means.

[0018] In this first embodiment, the second reference positions 301, 301 are through-holes with the same shape as the first reference positions 201, 201. The second reference positions 301, 301 are used to identify the positions in the cushion layer resin sheet 300 that correspond to the windows 202 of the polishing layer resin sheet 200, and to identify the positions for forming through-holes with the shape corresponding to the windows 202. Conversely, the center of the corresponding position region 302 of the cushion layer resin sheet 300 that corresponds to the windows 202 can be identified from the center of the second reference positions 301, 301, and based on this center position, the position and shape of the outer periphery that corresponds to the position and shape of the outer periphery of the windows 202 can be identified (Figure 3(b)).

[0019] With the cushion layer resin sheet 300 placed and fixed on the base 130, and the second reference positions 301, 301 formed, the drilling machine 111, under the control of the control unit 120 based on the second reference positions, forms a through hole 303 in the corresponding position region 302 of the cushion layer resin sheet 300 that penetrates to the window 202, in a shape corresponding to the window of the polishing layer resin sheet (Figure 3(c)). Thus, the drilling machine 111 is the first through hole forming means, and the control unit 120 controls the first through hole forming means as the first control means.

[0020] Figure 4 shows a perspective view of a position regulating jig 350 according to a first embodiment that realizes a position regulating function. The position regulating jig 350 has a stud 352 that is erected vertically from the base 351 and penetrates the first reference position and the second reference position. The position regulating jig 350 is used to overlap the cushion layer resin sheet 300, which has the through-hole 303 formed therein, with the polishing layer resin sheet 200, as shown in Figure 5, when the first reference position and the second reference position coincide. At this time, an adhesive material such as double-sided adhesive tape is interposed between the polishing layer resin sheet 200 and the cushion layer resin sheet 300 to temporarily fix them together. The movement and setting of the polishing layer resin sheet 200 and the cushion layer resin sheet 300 from the reference position forming device 100 to the position regulating jig 350 may be performed by an operator, but it can also be done by a pickup device (not shown).

[0021] The two-layer bonding device 380, which constitutes the first two-layer bonding means, has a pressing mechanism 384 that presses the overlapping (temporarily fixed) abrasive layer resin sheet 200 and cushion layer resin sheet 300, which are placed on a base 381 as shown in Figure 6, from above with a pressing plate 383 under the control of a control unit (not shown). The abrasive layer resin sheet 200 and the cushion layer resin sheet 300, which has the through hole 303 formed therein, are pressed and bonded together when the first reference position and the second reference position coincide. Heat may be applied during the pressing process. In addition to the pressing mechanism 384 that presses with the pressing plate 383, a pressing mechanism that uses rollers may also be used. Figure 7 shows a front view of the abrasive layer resin sheet 200 and the cushion layer resin sheet 300 with the through hole formed therein, which have been bonded in this manner.

[0022] In the polishing layer resin sheet 200 and the cushion layer resin sheet 300 with the through holes 303 formed in this first embodiment, the regions where the first reference positions 201, 201 and the second reference positions 301, 301 are provided do not have the shape of a polishing pad used in the aforementioned apparatus for polishing the surface of a semiconductor wafer. That is, the portion outside the dashed circle CC in Figure 7 is an unnecessary portion.

[0023] The unnecessary portion can be cut away by a cutting device 600, which is a first polishing pad forming means having a cutter blade 610 as shown in Figure 8, to form the polishing pad 700 shown in Figure 9. This cutting device 600 can be positioned adjacent to the reference position forming device 100, position regulating jig 350, and two-layer bonding device 380 shown in Figure 1. The cutter blade 610 of the cutting device 600, in particular, operates under the control of a control unit 620.

[0024] Note that the position regulating jig is not limited to the position regulating jig shown in the figure. For example, the configuration of Figure 10 can be used. The polishing layer resin sheet 200 and the cushion layer resin sheet 300 with through holes 303 are made up of a rectangular pad whose planar shape and vertices coincide. The position regulating jig 350A that realizes the position regulating function of the first two-layer adhesive means can be realized by a frame 356 that aligns the first reference positions 201, 201 with the second reference positions 301, 301 by dropping the polishing layer resin sheet 200 and the cushion layer resin sheet 300 with through holes 303 into a flat plate shape onto the floor surface 355 in the direction of the arrow. In addition, the frame shown in Figure 10 does not need to surround all sides of the polishing layer resin sheet 200 and the cushioning layer resin sheet 300. The first reference positions 201, 201 and the second reference positions 301, 301 may be aligned by using an L-shaped or similar positioning jig to align at least one of the vertices of the polishing layer resin sheet 200 and the cushioning layer resin sheet 300. Furthermore, by arranging the first reference positions 201, 201 and the second reference positions 301, 301 parallel to the edges of the resin sheet, the positions of the first reference positions 201, 201 and the second reference positions 301, 301 are aligned. Then, by treating the first reference positions 201, 201 and the second reference positions 301, 301 as pins and the polishing layer resin sheet 200 and the cushioning layer resin sheet 300 as wings, and overlapping the polishing layer resin sheet 200 and the cushioning layer resin sheet 300 as if closing a hinge, it is possible to obtain an overlapped object in which the first reference positions 201, 201 and the second reference positions 301, 301 coincide.

[0025] Next, a polishing pad manufacturing system and polishing pad manufacturing method according to a second embodiment of the present invention will be described. Figure 11 shows a polishing pad manufacturing system according to a second embodiment, comprising a reference position forming device 100 and a two-layer bonding device 380 which constitute a second first reference position forming means, a second through-hole forming means, and a second control means.

[0026] The two-layer bonding device 380, which constitutes the second two-layer bonding means, bonds a polishing layer resin sheet 200 having a planar shape that is approximately square and has a window (endpoint detection window) 202 as shown in Figure 12(a), to a cushion layer resin sheet 300 having the same planar shape as the polishing layer resin sheet 200 as shown in Figure 12(b). Here, the resin sheet in the present invention is a sheet-shaped polishing pad member containing a polymer compound, and examples include a sheet-shaped polymer compound having closed cells, a sheet-shaped polymer compound having interconnected pores, and a sheet-shaped nonwoven fabric impregnated with a polymer compound. The cushion layer resin sheet includes a cushioning resin sheet, a sheet in which a cushioning resin sheet and double-sided tape are layered, a sheet in which multiple cushioning resin sheets and double-sided tape are layered, or a sheet consisting only of double-sided tape. The two-layer bonding apparatus 380 has a pressing mechanism 384 that presses the overlapping (temporarily fixed) polishing layer resin sheet 200 and cushion layer resin sheet 300, which are placed on a base 381 as shown in Figure 13, from above with a pressing plate 383 under the control of a control unit (not shown). Heat may be applied during the pressing process. In addition to the pressing mechanism 384 that presses with the pressing plate 383, a pressing mechanism using rollers may also be used. A front view of the polishing layer resin sheet 200 and cushion layer resin sheet 300 bonded in this manner is shown in Figure 12(c).

[0027] The reference position forming device 100 has a work unit 110 suspended from an information control unit 120, which moves in the three-dimensional directions of x, y, and z as shown in the figure. The work unit 110 is equipped with a drilling machine 111, such as a drill or cutter knife for punching out the reference position, and a camera 112 for position detection. The computer in the control unit 120 controls the device so that a predetermined point in the image captured by the camera 112 coincides with the position of the drilling machine 111.

[0028] A base 130 is provided below the work unit 110, and the control unit 120 manages the position of the drilling machine 111 as it moves above the base 130 using position information in x, y, and z coordinates. The control unit 120 is provided with an input unit (not shown) for inputting area settings for forming drilling positions (reference positions). Multiple areas for forming first reference positions, which identify the position of the window 202 on the polishing layer resin sheet 200, can be input from this input unit. Here, as shown in Figure 14(a), multiple (in this case, two) areas for forming first reference positions 201, 201 have been input in advance. Note that the number of windows 202 is not limited to one, but may be multiple. For example, as shown in Figure 14(b), if windows 202, 202, 202 are provided in three locations, the centroid G of windows 202, 202, 202 is determined, and based on the position of G, a plurality of first reference positions 201 are determined to identify the positions of the above windows 202, 202, 202 on the polishing layer resin sheet 200.

[0029] For example, in a state where a polishing layer resin sheet 200 of a predetermined size, as shown in Figure 11, is placed and fixed on a base 130, the control unit 120 controls the formation of multiple (in this case, two) first reference positions 201, 201 through the cushion layer resin sheet 300 by the drilling machine 111, as shown in Figure 15. Thus, the drilling machine 111 is a second first reference position forming means, and the control unit 120 controls the second first reference position forming means as a second control means. In this second embodiment, the first reference positions 201, 201 are through holes made of round holes. The first reference positions 201, 201 are positions that identify the position of the window 202 of the polishing layer resin sheet 200. Conversely, the center of the window 202 can be identified from the center of the first reference positions 201, 201, and the position and shape of the outer circumference of the window 202 can be identified from the center of the window 202. In order to accurately identify the position of the window 202, it is preferable that there be at least two or more first reference positions 201. Furthermore, if a first reference position 201 is provided, it is preferable to set it at a position that is not symmetrical with respect to the polishing layer resin sheet. This makes it possible to prevent the polishing layer resin sheet from being mistakenly placed with the wrong side facing up.

[0030] The first reference positions 201, 201 described above are formed by penetrating the polishing layer resin sheet 200 and the cushion layer resin sheet 300. Therefore, as shown in Figure 16, when viewed from the side of the cushion layer resin sheet 300, the first reference positions 201, 201 are exposed. The first reference positions 201 may be formed separately on the polishing layer resin sheet 200 and the cushion layer resin sheet 300. When the reference positions are formed separately on the polishing layer resin sheet 200 and the cushion layer resin sheet 300, the reference position on the polishing layer resin sheet 200 is the first reference position 201, and the reference position on the cushion layer resin sheet 300 is the second reference position 301. When forming the second reference position 301, multiple second reference positions 301 that coincide with the first reference position 201 are determined on the cushion layer resin sheet 300, and the second reference position is formed from the side opposite to the adhesive surface with the polishing layer resin sheet 200 to the adhesive surface. Furthermore, when the first reference position 201 and the second reference position 301 are formed separately, it is desirable that the second reference position 301 be a larger through-hole than the first reference position 201. This makes it possible to accurately identify the first reference position through the through-hole of the second reference position. From the centers of the first reference positions 201 (301), 201 (301) on the side of the cushion layer resin sheet 300, the center of the corresponding position region 302 and shape of the cushion layer resin sheet 300 corresponding to the window 202 can be identified, and based on this center position, the position and shape of the outer periphery of the through-hole 303 corresponding to the position and shape of the outer periphery of the window 202 can be identified (Figure 16).

[0031] With the cushion layer resin sheet 300 facing outwards, the pad, in which the polishing layer resin sheet 200 and the cushion layer resin sheet 300 are superimposed, is placed and fixed on the base 130, and with the first reference positions 201, 201 formed, the drilling machine 111, under the control of the control unit 120 based on the first reference positions, forms a through hole 303 in the corresponding position region 302 of the cushion layer resin sheet 300, in a shape corresponding to the window 202 of the polishing layer resin sheet 200, and penetrates to the back surface of the window 202 (Figure 16). Thus, the drilling machine 111 is the second through hole forming means, and the control unit 120 controls the second through hole forming means as the second control means.

[0032] In this second embodiment, the adhesive laminate of the polishing layer resin sheet 200 and the cushion layer resin sheet 300 with the through-holes 303 formed therein does not have the shape of a polishing pad used in the aforementioned apparatus for polishing the surface of a semiconductor wafer. That is, the area outside the dashed circle CC in Figure 17, which is the region where the first reference positions 201, 201 are provided, is an unnecessary portion.

[0033] The unnecessary portion can be cut away by a cutting device 600, which is a second polishing pad forming means having a cutter blade 610 as shown in Figure 18, to form the polishing pad 700 shown in Figure 19. This cutting device 600 can be positioned adjacent to the reference position forming device 100 and the two-layer bonding device 380 shown in Figure 11. The cutter blade 610 of the cutting device 600, in particular, operates under the control of a control unit 620. The unnecessary portion may be cut away by moving a flat blade cutter in a circular motion, or it may be cut out in one go with a circular cutter.

[0034] Next, we will describe an example of creating a polishing pad by layering and bonding a cushion layer resin sheet 300, which has a narrower planar shape than the polishing layer resin sheet 200, to a polishing layer resin sheet 200, which has a roughly square planar shape and a window (endpoint detection window) 202 as shown in Figure 20. In this example, a cushion layer resin sheet 300 with a narrower planar shape than the polishing layer resin sheet 200 is used.

[0035] The polishing layer resin sheet 200 and the cushion layer resin sheet 300 are pressed together (temporarily fixed) and bonded. Figure 20 shows the bonded back surface of the polishing layer resin sheet 200 and cushion layer resin sheet 300 bonded in this manner. Similar to the previous example, the first reference positions 201, 201 are formed from the surface side of the polishing layer resin sheet 200 using the hole punching machine 111, thereby bonding the polishing layer resin sheet 200 and the cushion layer resin sheet 300 as shown in Figure 21, and obtaining a product with the first reference positions 201, 201 formed. In this case, double-sided tape may remain in the area of ​​the back surface of the polishing layer resin sheet 200 that is exposed, including the portion of the first reference positions 201, 201 on the back surface of the polishing layer resin sheet 200, but it is preferable that no double-sided tape remains.

[0036] In the above state, based on the control of the control unit 120 based on the first reference position, the drilling machine 111 forms a through hole 303 in the corresponding position region 302 of the cushion layer resin sheet 300 that penetrates to the window 202 in the polishing layer resin sheet 200, in a shape corresponding to the window 202 (Figure 22). In this case as well, the unnecessary portion can be cut off by the cutting device 600, which is a second polishing pad forming means having a cutter blade 610 as shown in Figure 18, to form the polishing pad 700 shown in Figure 19.

[0037] When the polishing layer resin sheet 200 and the cushioning layer resin sheet 300 are bonded together using double-sided tape, if double-sided tape remains on the back side of the window 202, the light transmittance may decrease. In this second embodiment, protective tape is applied to the back side of the window 202 before bonding using double-sided tape, and the double-sided tape and protective tape are removed from the back side of the window when forming the through hole in the second through-hole forming process. When the polishing layer resin sheet 200 is viewed from the back side before bonding with double-sided tape, the back side of the window 202 is exposed as shown in Figure 23(a). As shown in Figure 23(b), a protective tape 210 with weak adhesive strength is prepared and applied to the back side of the window 202. As shown in Figure 24, the polishing layer resin sheet 200 and the cushioning layer resin sheet 300 are bonded together using double-sided tape.

[0038] When the polishing layer resin sheet 200 and the cushion layer resin sheet 300 are bonded together using double-sided tape 220, the cross-section of the window 202 is as shown in Figure 25(a), with the window 202, protective tape 210, double-sided tape 220, and cushion layer resin sheet 300 overlapping in that order. Next, as shown in Figure 25(b), a through hole 303 is formed that penetrates to the window 202. This allows the cut-out piece 330 to be removed, as shown in Figure 25(c). The cut-out piece 330 includes a cut-out piece 222 of double-sided tape with a shape corresponding to the window 202 of the polishing layer resin sheet 200. A portion of the double-sided tape 220 is bonded to the protective tape 210, and it is removed together with the cut-out piece 330 of the cushion layer resin sheet 300, so that no double-sided tape 220 remains on the back side of the window 202. The subsequent polishing pad creation procedure is as described using Figures 17, 18, and 19. Furthermore, the steps of cutting out the cushion layer resin sheet 300 and the double-sided tape 220, and the steps of cutting out the cushion layer resin sheet 300 and the protective tape 210 may be performed separately. Alternatively, a portion of the double-sided tape 220 attached to the polishing layer resin sheet 200 may be cut out in a shape corresponding to the position and shape of the window 202 of the polishing layer resin sheet 200, and then the through hole 303 of the cushion layer resin sheet 300 may be formed. Alternatively, without providing the cushion layer resin sheet 300, the double-sided tape 220 may be layered and adhered to the polishing layer resin sheet 200, and a cut piece 222 of the double-sided tape in a shape corresponding to the window 202 of the polishing layer resin sheet 200 may be cut out using the same means as in the second through hole forming step.

[0039] While several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents.

[0040] 100 Reference position forming device 110 Working section 111 Drilling machine 112 Camera 120 Control unit 130 Base 200 Polishing layer resin sheet 201 First reference position 202 Window 210 Protective tape 220 Double-sided tape 222 Cut piece 300 Cushion layer resin sheet 301 Second reference position 302 Corresponding position area 303 Through hole 330 Cut piece 350 Position regulating jig 350A Position regulating jig 351 Base 352 Stud 355 Floor surface 356 Frame 380 Two-layer bonding device 381 Base 383 Press plate 384 Press mechanism 600 Cutting device 610 Cutter blade 620 Control unit 700 Polishing pad

Claims

A first reference position forming means for forming a plurality of first reference positions that specify the position of the window of a polishing layer resin sheet, which is provided with an endpoint detection window made of a light-transmitting block member, A first second reference position forming means for forming a second reference position at a position that coincides with the first reference position on the surface of the cushion layer resin sheet that is superimposed on the abrasive layer resin sheet, which is facing the overlapping surface, A first through-hole forming means forms a through-hole that penetrates to the window at a position in the cushion layer resin sheet, in a shape corresponding to the window of the polishing layer resin sheet, based on the second reference position, When the cushion layer resin sheet with the through-holes is placed on top of the polishing layer resin sheet, the first two-layer adhesive means has a position-regulating function that ensures the first reference position and the second reference position coincide, and adheres the polishing layer resin sheet and the cushion layer resin sheet with the through-holes when they are placed on top of each other in the state where the first reference position and the second reference position coincide. The first control means for controlling the first reference position forming means, the first second reference position forming means, the first through-hole forming means, and the first two-layer bonding means, A polishing pad manufacturing system characterized by being equipped with the following. 　 The polishing pad manufacturing system according to claim 1, characterized in that the position regulating function of the first two-layer adhesive means is realized by a position regulating jig having studs that are erected vertically from the base and penetrate the first reference position and the second reference position. 　 The polishing pad manufacturing system according to claim 1, characterized in that the polishing layer resin sheet and the cushion layer resin sheet having through holes are rectangular resin sheets with matching planar shapes and vertices, and the position regulating function of the first two-layer bonding means is realized by a position regulating jig with a frame that aligns the first reference position and the second reference position by dropping the polishing layer resin sheet and the cushion layer resin sheet having through holes into a flat plate shape. 　 The polishing pad manufacturing system according to claim 1, comprising a first polishing pad forming means for forming the overlapping polishing layer resin sheet and the cushion layer resin sheet with the through-holes into a planar shape of a polishing pad when the first reference position and the second reference position coincide. 　 A second two-layer bonding means for bonding a polishing layer resin sheet and a cushion layer resin sheet, which are provided with an endpoint detection window made of light-transmitting block members, to each other. A second first reference position forming means determines a plurality of first reference positions that specify the position of the window in the polishing layer resin sheet, and forms the first reference positions toward the cushion layer resin sheet side of the polishing layer resin sheet and the cushion layer resin sheet that are bonded together on top of each other, A second through-hole forming means obtains the shape and position information of the abrasive layer resin sheet corresponding to the window, based on the first reference position revealed on the side of the cushion layer resin sheet which is superimposed and bonded with the abrasive layer resin sheet, and forms a through-hole that penetrates from the surface of the cushion layer resin sheet to the back surface of the window based on this position information and shape, A second control means for controlling the second two-layer bonding means, the second first reference position forming means, and the second through-hole forming means, A polishing pad manufacturing system characterized by being equipped with the following. 　 The polishing pad manufacturing system according to claim 5, characterized in that the cushion layer resin sheet is not present at the position where the first reference position is exposed. 　 The polishing pad manufacturing system according to claim 5, characterized in that, if there are multiple windows, the first reference position is determined based on the centroid positions of these multiple windows. 　 When the second two-layer adhesive means uses double-sided tape for adhesion, protective tape is applied to the back surface of the window before adhesion using double-sided tape. The polishing pad manufacturing system according to claim 5, characterized in that when forming the through hole by the second through hole forming means, the double-sided tape and protective tape on the back side of the window are removed. 　 The cushion layer resin sheet comprises a second second reference position forming means for determining a plurality of second reference positions that coincide with the first reference position, and forming the second reference positions from the surface opposite to the adhesive surface with the polishing layer resin sheet to the adhesive surface, The polishing pad manufacturing system according to claim 5, further comprising a second polishing pad forming means for forming the overlapping polishing layer resin sheet and the cushion layer resin sheet with the through-holes into a planar shape of a polishing pad when the first reference position and the second reference position coincide. 　 A first first reference position forming step, which involves forming a plurality of first reference positions that identify the position of the window of a polished layer resin sheet, which is provided with an endpoint detection window composed of a light-transmitting block member, A first second reference position forming step, in which a second reference position is formed at a position that coincides with the first reference position on the surface of the cushion layer resin sheet that is placed on top of the abrasive layer resin sheet, which is facing the overlapping surface, A first through-hole forming step is to form a through-hole that penetrates to the window at a position in the cushion layer resin sheet, in a shape corresponding to the window of the polishing layer resin sheet, based on the second reference position, A first two-layer bonding step involves using a position regulating function to bond the overlapping abrasive resin sheet and the cushion layer resin sheet with the through holes to the abrasive resin sheet when the first reference position and the second reference position are aligned, while the overlapping abrasive resin sheet and the cushion layer resin sheet with the through holes are aligned. A method for manufacturing an abrasive pad characterized by comprising the following: 　 The polishing pad manufacturing method according to claim 10, characterized in that the position regulating function of the first two-layer bonding step is realized by a position regulating jig having studs erected vertically from the base and penetrating the first reference position and the second reference position. 　 The polishing pad manufacturing method according to claim 10, characterized in that the polishing layer resin sheet and the cushion layer resin sheet having through holes are rectangular resin sheets whose planar shape and vertices coincide, and the position regulating function of the first two-layer bonding step is realized by a position regulating jig with a frame that aligns the first reference position and the second reference position by dropping the polishing layer resin sheet and the cushion layer resin sheet having through holes into a flat plate shape. 　 The method for manufacturing a polishing pad according to claim 10, comprising a polishing pad forming step of forming the polishing layer resin sheet and the cushion layer resin sheet with the through hole formed thereon, which are superimposed in a state in which the first reference position and the second reference position coincide, into a planar shape of a polishing pad. 　 A second two-layer bonding step involves overlapping and bonding a polishing layer resin sheet and a cushion layer resin sheet, each having a window for detecting the endpoint made of a light-transmitting block member, A second first reference position forming step involves determining a plurality of first reference positions that specify the position of the window in the polishing layer resin sheet, and forming the first reference positions toward the cushion layer resin sheet side of the polishing layer resin sheet and the cushion layer resin sheet that are bonded together on top of each other, Based on the first reference position revealed on the side of the cushion layer resin sheet which is superimposed and bonded with the abrasive layer resin sheet, the shape and position information corresponding to the window of the abrasive layer resin sheet are obtained, and a second through-hole forming step is performed to form a through-hole that penetrates from the surface of the cushion layer resin sheet to the window based on this position information and shape, A method for manufacturing an abrasive pad characterized by comprising the following: 　 The method for creating a polishing pad according to claim 14, characterized in that the cushion layer resin sheet is not present at the position where the first reference position is exposed. 　 The method for creating a polishing pad according to claim 14, characterized in that, if there are multiple windows, the first reference position is determined based on the centroid positions of these multiple windows. 　 In the second two-layer bonding step described above, when double-sided tape is used for bonding, protective tape is applied to the back surface of the window before bonding with double-sided tape. The method for creating a polishing pad according to claim 14, characterized in that, when forming the through hole in the second through hole forming step, the double-sided tape and protective tape on the back side of the window are removed. 　 After the second first reference position forming step and before the second through-hole forming step, a second second reference position forming step is performed in which a plurality of second reference positions that coincide with the first reference position are determined in the cushion layer resin sheet, and the second reference positions are formed from the surface opposite to the adhesive surface with the polishing layer resin sheet to the adhesive surface, The method for manufacturing a polishing pad according to claim 14, further comprising a second polishing pad forming step, after the second through-hole forming step, in which the polishing layer resin sheet and the cushion layer resin sheet with the through-hole formed thereon are superimposed in a state where the first reference position and the second reference position coincide, and are formed into a planar shape of a polishing pad.

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